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Contents
1. Introduction ....................................................................................................... 5
1.1 Notification ................................................................................................................................ 5
2. Introduction of Samsung eMMC ...................................................................... 6
2.1 Signal Group .............................................................................................................................. 6
2.2 Clock Group .............................................................................................................................. 6
2.3 Terminal Group .......................................................................................................................... 6
2.4 Supply Group ............................................................................................................................. 6
3. General PCB Design Procedure ........................................................................ 7
3.1 Determine PCB Stack-Up .......................................................................................................... 7
3.2 Determine the Placement of Devices ......................................................................................... 7
3.3 Determine PWR Sub-Planes and Link PWR/GND ................................................................... 7
3.4 Route Signals ............................................................................................................................. 7
3.5 Shape PWR Sub-Planes ............................................................................................................. 8
3.6 Connect PWR/GND to Passive Devices .................................................................................... 8
3.7 Tune Traces and Add GND Shield Fence .................................................................................. 8
3.8 Complete to connect GND ......................................................................................................... 8
3.9 Verify ......................................................................................................................................... 8
4. Major Design Guide for PCB Layout ............................................................... 9
4.1 Component Placement: Samsung eMMC (embedded Multimedia Card) ................................. 9
4.2 Schematic of Samsung eMMC .................................................................................................. 9
4.3 Signal Routing ......................................................................................................................... 12
4.3.1 Additional special guide for eMMC 400Mbps operation .............................................. 13
4.4 eMMC Driver Strength Setting ............................................................................................... 13
4.5 Power Delivery Network (PDN).............................................................................................. 13
4.6 Decoupling Capacitance .......................................................................................................... 14
4.7 Recommended Configuration of Passives ............................................................................... 14
5. Mechanical Guide: Buried Via ........................................................................ 17
6. Conclusion ...................................................................................................... 18
Technical Support................................................................................................ 18
洪蛋蛋2023-07-26这个文件中提到的设计方案具有很强的可行性，看起来非常实用。
张景淇2023-07-26这个文件提供了很多关于三星EMMC的宝贵信息，让人对其设计有了更全面的了解。
kdbshi2023-07-26这个参考设计文件的内容非常实用，对于我们来说是非常有帮助的资源。
那你干哈2023-07-26这份参考设计文件为我们提供了一个很好的参考，可以帮助我们更高效地设计和开发EMMC产品。
王向庄2023-07-26阅读这个文件后，我对三星EMMC的性能和可靠性有了更深入的认识，让我对选择这个产品更有信心。
