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0.... Fabrication of IC

The document discusses the process of integrated circuit fabrication, which involves design and mask creation, wafer fabrication through deposition and lithography, etching, device formation including insulation and transistors, metallization and interconnection layers, wafer inspection, and back-end processing including dicing, mounting, bonding, encapsulation and packaging before shipment.

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Vijaya Kumar Vadladi
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© Attribution Non-Commercial (BY-NC)
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13 views

0.... Fabrication of IC

The document discusses the process of integrated circuit fabrication, which involves design and mask creation, wafer fabrication through deposition and lithography, etching, device formation including insulation and transistors, metallization and interconnection layers, wafer inspection, and back-end processing including dicing, mounting, bonding, encapsulation and packaging before shipment.

Uploaded by

Vijaya Kumar Vadladi
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPT, PDF, TXT or read online on Scribd
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LOGIC

A 0 0 1 1 B 0 1 0 1 LIGHT OFF ON ON OFF

3/4/2013

IC FABRICATION
Design and Mask creation. Front end processing. Back end processing.

3/4/2013

IC FABRICATION
Design and mask creation.
logic circuit is drawn. simulations performed. Lay out pattern for devices and interconnects drawn. mask pattern drawn.

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IC FABRICATION
Photo mask
required to transcribe the design onto the wafer.

copy of the circuit pattern.


size of the photo-mask is usually magnified.

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IC FABRICATION
Wafer fabrication
Thin circular slice of material.
high-purity, single-crystal silicon. Ingot is sliced and polished.

3/4/2013

IC FABRICATION Deposition
Insulating layers like SiO2. Nitride and poly-silicon layers. Conductive Layers.

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IC FABRICATION
Photo-resist coating
a special resin similar in behavior to photography films that changes properties when exposed to light. wafer is rotated at high speed Lithography and exposure irradiates the wafer coated by resist past

a photo mask.

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IC FABRICATION
Development

Performed with an alkaline solution. Exposed photo-resist stripped. Resist pattern.


Mask

for etching.

Etching
Removal of oxide films and metallic films using chemical solution.

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IC FABRICATION
Device

Insulation formation.

Defines active area.


Transistor

NMOS formation.
Metallization

Contact holes drilled. Metallic layer by sputtering. Patterning and interconnection of layers.
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Nine-layer Copper Interconnect Architecture

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10

IC FABRICATION
Wafer

Inspection

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11

IC FABRICATION
Back

end processing
into individual ICs

Dicing
Cutting

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IC FABRICATION
Mounting

Connected to supporting base.


Bonding

Connected to the lead frames.


Encapsulation

and Decoupling

encapsulated with molding resin. the lead frames are cut apart into individual packages.
Printing

and Lead Finish Packing and Shipment

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