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Wet Etching PDF

The document describes various wet etching techniques and etchants for a variety of materials including zinc oxide, polymers, silicon dioxide, nickel, photoresist, titanium, and aluminum. Etch rates in microns or angstroms per minute are provided for different concentrations of acids like HCl, HNO3, and phosphoric acid used to etch each material. The techniques include both chemical etching and plasma etching methods.

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Atul Bisht
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186 views3 pages

Wet Etching PDF

The document describes various wet etching techniques and etchants for a variety of materials including zinc oxide, polymers, silicon dioxide, nickel, photoresist, titanium, and aluminum. Etch rates in microns or angstroms per minute are provided for different concentrations of acids like HCl, HNO3, and phosphoric acid used to etch each material. The techniques include both chemical etching and plasma etching methods.

Uploaded by

Atul Bisht
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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WET ETCHING

http://www.ee.byu.edu/cleanroom/wet_etch.phtml
Zinc Oxide
1. 1 : 60 HCl : H2O - 1.9 microns/min
2. 1 : 200 Hcl : H2O - 0.9 microns/min
3. 1 : 500 HCl : H2O - 0.4 microns/min
4. 1 : 900 HCl : H2O - 0.2 microns/min
5. 1 : 100 HNO3 : H2O - 0.9 microns/min
6. 1 : 7 BOE - .06 microns/min
7. 1 : 1 : 30 H3PO4 : C6H8O7 : H2O - 2.2 microns/min
8. 1 : 5 : 60 H3PO4 : C6H8O7 : H2O - 1.8 microns/min
9. 1 : 1 : 80 H3PO4 : C6H8O7 : H2O - 1.4 microns/min
10. 1 : 1 : 150 H3PO4 : C6H8O7 : H2O - 1 micron/min
11. 1 : 1 : 200 H3PO4 : C6H8O7 : H2O - 0.8 microns/min
12. 1 : 2 : 300 H3PO4 : C6H8O7 : H2O - 0.65 microns/min
Polymer
1. 5 : 1 - NH4OH : H2O2 120 C
1.
2.
3.
4.
5.

3 : 1 - H2SO4 : H2O2
1 : 1 - HF : H2O
1 : 1 - HF : HNO3
Sodium Carbonate boiling
HF conc

Silicon Dioxide / Quartz / Glass


1. BOE 1 : 5 : 5 HF : NH4HF : H2O 20 angstroms/s
2. HF : HNO3
3. 3 : 2 : 60 HF : HNO3 : H2O 2.5 angstroms/sec at RT
4. BHF 1 : 10, 1 : 100, 1 : 20 HF : NH4F(sat)
5. Secco etch 2 : 1 HF : 1.5M K2Cr2O7
6. 5 : 1 NH4.HF : NaF/L (in grams)
7. 1g : 1ml : 10ml : 10ml NH4F.HF : HF : H2O : glycerin
8. HF hot
9. 1 : 1 1 : 15, 1 : 100 HF : H2O
10. BOE HF : NH4F : H2O
11. 1 : 6 BOE : H2O
12. 5 : 43, 1 : 6 HF : NH4F(40%)
13. NaCO3 100 C 296 microns/h
14. 5% NaOH 100 C 3.8 mm/h
15. 5% HCl 95 C 12.7 microns/day
16. KOH see KOH etching of silicon dioxide and silicon nitride

Nickel
1. 1 : 1 : 1 - HNO3 : HAc : Acetone
2. 1 : 1 - HF : HNO3
3. 30% FeCl3
4. 3 : 1 : 5 : 1 - HNO3 : H2SO4 : HAc : H2O 85 C 10 microns/min
5. 3 : 7 - HNO3 : H2O
6. 1 : 1 - HNO3 : HAc
7. 10% g/ml Ce(NH4)2(NO3)6 : H2O
8. HF, concentrated slow etchant
9. H3PO4 slow etchants
10. HNO3 rapid etchant
11. HF : HNO3 etch rate determined by ratio, the greater the amount of HF the slower the reaction
12. 4 : 1 - HCl : HNO3 increase HNO3 concentration increases etch rate
13. 30% FeCl3
14. 5g : 1ml : 150ml - 2NH4NO3.Ce(NO3)3.4(H2O) : HNO3 : H2O decreasing HNO3 amount
increases the etch rate
15. 3 : 3 : 1 : 1 - H3PO4 : HNO3 : CH3COOH : H2O ~15min/micron @ RT with air exposure every 15
seconds
Photoresist (AZ type)
1.
2.
3.
4.
5.

General Polymer
5 : 1 - NH4OH : H2O2 120 C
5 : 1 - H2SO4 : H2O2
H2SO4 : (NH4)2S2O8
Acetone

Titanium
1. 50 : 1 : 1 H2O : HF : HNO3
2. 20 : 1 : 1 H2O : HF : H2O2
3. RCA-1 ~100 min/micron
4. x%Br2 : ethyl acetate - HOT
5. x%I2 : MeOH - HOT
6. HF : CuSO4
7. 1 : 2 NH4OH : H2O2
8. 1 : 2 : 7, 1 : 5 : 4, 1 : 4 : 5(18 microns/min), 1 : 1 : 50 HF : HNO3 : H2O
9. COOHCOOH : H2O any concentration
10. 1 : 1 : 20 HF : H2O2 : HNO3
11. 1 : 9 HF : H2O 12 A/MIN
12. HF : HCL : H2O
13. HCL conc
14. %KOH - conc
15. %NaOH- conc
16. 20% H2SO4 1 micron/min
17. CCl3COOC2H5
18. 25%HCOOH
19. 20%H3PO4
20. HF

Aluminum
Concentrations

Etchants

1:1

H2O : HF

1:1:1

HCl : HNO3 : H2O

dilute or
concentrated

HCl

Rate
(angstroms/sec)

Temperature/Other

H3PO4 : HNO3 : HAc


19 : 1 : 1 : 2

H3PO4 : HAc : HNO3 : H2O

40

3:1:3:1

H3PO4 : HAc : HNO3 : H2O

8.7 @ >RT

4:4:1:1

H3PO4 : HAc : HNO3 : H2O

5.6

15 : 0 : 1 : 1-4

H3PO4 : HAc : HNO3 : H2O

1500

40 C

8:1:1

H3PO4 : H2O2 : H2O

100

@ 35C

3:1:5

H3PO4 : H2O : glycerin

69 : 131

HClO4 : HAc

4:1:5

HCl : FeCle : H2O


FeCl3 : H2O

10%

K3Fe(CN)6

@ 40 C <4
min/micron

100 F
100

KOH : K3Fe(CN)6: K
2B4O7.4H2O
2 : 3 : 12

KMnO4 : NaOH : H2O

1:1:3

NH4OH : H2O2 : H2O

20%

NH4SO4

dilute or concetrated NaOH


8-10%
10%

KOH
CCl4

boiling

Br2 : MeOH

warm

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