Accelerating auto electronics reliability using physics of failure modeling PRessity no menrsctapoucts any to parlor spated nce ne custome! nvoert ovr he ssi ietneRelebity mus be degre Tnsiooemopete camps eiat Inthe auometva word ere as ompoed, Preitone te WICAOSKZ ITE ees rveateat intone” Pancrase torre to coin lc oe fait asurence stars Sard psn Phys of Pals a oon ‘he Prac of Falreappecch uses schnee pyc cnomety ee eeanare ventana tle mesons tna onlunton aati unt to Speraing condone. the autores sconce chatange Ie onset {fan 100 ian ind 0 you of sags inhoanenoentraneareene tet faire The harsh serena intemal cyl over chess ea Sian scvoragrelc nce vseen Shook tempore aah Somes thee oxreme ange are shown nae Frhermov.oucionas oe row agted mover age le oso ats Fur sate aro econ can bo our devoopmert press apoceh ios sores of Saige Sule een ate ilaciny growth events, Ts wes a tec gre Eppoath fo indo prosome, ay te tone Tanger uot ‘Automotive design and computer-aided engineering The nto ndsty hes repo substrtaloertts omit coneetes fied ergnoing (CAD too Thies hector aver ora ee teauatone tor teed ee ois Hrcomputa A the whe” aso’ fo component evs evan fee Sonpienty and wel alccohanios ake Bonpocarrchangeshespnpcmsne ings compete pronase conse Gnvestorato mprovebah coon a sroctreres Cringacarbinaton yaar vt! tesing secrets pote Sonooron trocete by erating say Genesee Schonland eataton or Sane Sconaton Pyne Sueed mod Pee't Teck euiote iy on now Seance Siete canto creied cpa Se rateengonyicuprtsopet Aa hess Simeaeing erases physeal tegen Soreonusd ty cpininve mer who fre ner at Conios teal on Srl be panel Released Al 2011, OM Solutions Shercc uarnes Buon arayos aon Ir mogrios doin ss ona tha prysbtad cnc 16 By JAMES McLEISH Senior Member of Technical Staff DIR Solutions Detroit, Michigan and CHERYL TULKOFF Senior Member of Technical Staff DIR Solutions Austin, Texas Product reliably. The four keys elements Sf a Sherlock POF Analysis are Design Capture~Provide industry standard inputs to the modeling software and calculation tools Life-Cycle Characterization —Define the reliability objectives and expected en- Viconmental and usage contions under nich the device is required to operat Load Transformation— Automated Calculations that translate and distribute the environmentaland operational loads across ‘2crcultboardto the nlvidual components: PoF Durability Simulation/Reliabiity Analysis and Risk Assossment~ Performs !adesign and appiication-spectie durabity Simulation to calculate ite expectattons, ‘eliabiity distributions, and priortze ike by applying PoF algorithms to the printed circuit board assembly (PCBA) mode PoF simulation rallabity fe curves are ‘generated for each failure mechanism to Produce alife curve for the entre module Interior 10-1000H2 3-4 Gems [ Temperature | ae see | naam Sas being analyzed. Detailed design and applcation-specific PoF fe curves. aro {ar more useful than a simple single-point ‘constant failure rate (MTBF) estimate, ‘The indvidual stops involved in actually running a modeling analysis ae: Design Capture; Dotine Relabilty Goals: Define Environments: Generate Inputs; Perform Analysis and intorprot Results, Design Capture involves importing standard PCB CAD/CAM design files such ‘88 Gerber or ODB++ toautomatcally create ® circuit board model, The PCB laminate and layers are also defined. Using this information, Sheriock ganerates the PCB thickness, density, CTEx-y, CTE, Modulus xy, and Modulus z from the’ material properties of each layer using the built laminate dataliorary- Sherock algo drecily Imports the bil of material (GOM) parts list. The software automatically recognizes ‘supplier partnumbere and standard industry JEDEC package type: Defining relabitty goals ie ertical. Two key metrics desired lifetime and product performance—must be identified and documented. Desired Metime is defined as time the customer is eatefed with and ‘should be actively used in he development ‘and qualification of the product. Product Performance can be defined as returns ‘during the warranty period, sunvivabilty over ete at a set confidence level, MTBF, oF ‘mean time to failure (MITA), oad Events: upto 20 Gs ability. Tuholl has worked throughout the electranies ‘manufacturing’ Ite. cyel ‘semiconductorandprintecrcuitboard ‘abrication and assembly processes, ‘through functional and reliability test- ‘ing, culminating In the analyst and ‘evaluation of fold returns. She has ‘also managed no-clean and RoHS: ‘compliant conversion programs and ‘has develoved and managed compre- hensive relabiity programs. Tutkott holds @ BSME degree trom Georgia Tech, Isa senior member of ASQ and IEEE, an ASQ certified rellaoity en ‘ginger. and a member of SMTA and MAPS. i Syatema and as OR MM 1 tnan 32 yours of automotive and mitay elececal Siero experancein design, doe! my snantrenaany onan ‘na ‘moo technaexpat arate. ‘mentposibonsinavtonetve eects Broduct development sacl systans ftograton productossorance vale. seaprictenghootGenecaenny aa ao rarer aan Gully, ity (ORO) ecrica spect at trysleandonerd Motor. MeL ‘olsthreepatertsinavtomotvecona! Soler and has anor tse Git Exe vation tot standards WIEST Engineering & Management, December/ January 2019-14The next step is to define the field environment. Several ciferent approaches ‘can be used. The frst approach is to Use Industry specifications such as SAE ‘St211. The advantages ofthis approachare that there are no addtional costs and ther is agreement throughout the industry. The man disadvantageot standardsisthat they Farelytulymatcn the actualuser conditions, Inthe fel ‘The second approach uses actual mea- ‘surements of similar products in similar ‘environments, Theuser determinesaverage andrealatieworst-cases. Forthis approach the user must be caretulto identify al falure- Inducing oade Forvalrelevantenvironments Including manufacturing, transportation, storage, anduse. Oftentimes, thetransport landstorage conditions aremore severe than Use conditions: and, they are frequently ‘overlooked. Within the software, the user has the ablity to comprehensively define thermal, Vibration, andshockstress profiles. Anauto tlectronics field environment examplemight ‘ode! the outside the engine compartment ‘vith minimal power dissipaten,anddiumal {Gally) temparature cycling providing the primary degradation-indueing load. The modeled conditions: Absolute worst-case Maximum temperature: $8°C, Minium temperature: -70°C Realistic worst-ca ‘Phoenix, arizona (USA) ONC added due to crect ‘exposure tothe sun Afterthermal cycling, theuser defines the dynamic fn element analysis (FEA) load ‘nth random vibration, harmonic vibration, and/or shock. ‘Once the reliabilty requirements and ‘environmenthave baen defined, the analysis anbegin. Thesoftwaremodeing curently has the fllowing analysis capabiliies: + CAF—Conductive Anodic Filament Formation + MTBF via MIL-HNDBK217, R332, or IEC-62380 Plated Through Hole Fatigue 1 Solder Joint Fatigue * In Circuit Test (CT) + Vibration + Shock ‘Sherlock can also pre-populate aDMFEA (Design Falure Mode ang Etfcts Analysis) Spreadsheet sing the netist Conductive Anodic Filament (CAF) Conductive Anodic Filament formation is the migration of copper filaments within a printed cireurt board under an applied bias Sheriock benchmarks the printed board esignandaualty processesto industry best practices, including wal-to-wall distance Between the plated through holes (PTHs) along the orinoganal axes, degree of overan, land the frequency and type of qualification Dartormedto assess CAF performance. The FIG. 1—Electranics in the modern auto. ee ee Failure rate ees Empirical reliability prediction is the and eventual failure of the solder joint. process of determining the reliability of ‘Thermo-mechanical solder joint fatigue establishment of governmentand commercial ~— geometry; solder joint material: printed handbooks (MILHDBK- 217, Telcordia TR-- board thickness; and printed board in-plane ‘specific component technology. A Mean time to failure using strain energy, which Time Between Failure (MTBF) value is requires determining the applied force, the: Of the various failure rates. to false from the derived strain energy Plated through-hole Mechanical shock analysis fatigue analysis Mechanical shock is the sudden appli= Plated Through Holes (PTH) are holes cation of single or multiple, but non~ dilled through mult-layer printed circuit periodic, physialloads dueto acceleration boards that are electrochemically plated or deceioration that results in signtioant ‘witha conductive metal (pally copper). aisplacement or deformation. The perfor- Because hese plated roles are metallurg- mance of a solder Joint when subjected to cece ronietepeed ackaeal woe pray eae by Sey dao aeen ima boars, tiey Te duchy of te sce andthe ragity aaa Sia aniconsran the FCB. The giveiteconnest. Te stongths of tase ae ee pane tne THis reso jensanitwanourto svecstararted Saat BO ceperences changes i other cutng te shook event stein Temperature Miebr tahoe cece, Do 1 quesiors Tee, prvnexputecetaiqueend Seow! damage svluion Gurng shock eae earetaekopagasay Pst Svs, Shurack flaws he PC aproech eae ce ecryakrtoa cloner fessecongtne tect merconect tures ep aertecnerare range end 6Tri This assessment is based on calcuang aes Sere lee atime to theboardehanorcurstror he shock See et caneracled nedel pusebsasdupentberatrarsqony std eee ibe'TR so" feura Foon Sead mode srape setemined by te publ gustan o( SralDuelet cemertarajasandeauafone eicpedby Patasstfrougn Holes fn Fontes Weng Stenoerg® fine svains ound toercaed aa een ctenterPtriseieced smesinumallowsbe sain taconperet hema Seingis ates sap pecan, Siorfed shaving an elisa ok PB otingie cues ealaten arae segs ‘ange cation, and an fea Met? nan, ye prt Douay ubected 0 : viormon' Grpstences global end focal ‘Solder fatigue analysis changes to the board shape anc curvature. So ser aes ecucestnemal, The Gegtee of bencng fa cron for anette Pree octons ‘oeiwees epecfe Components an the are of the a eae recenccnamaprrtescreut pred boa fo wnch tay ae ache slecronc corona we tonperure, {le beravor induces sain io he ae nd nar eead Sou expend cacondevel solder jt Win repeated a co acer amocis de to erponie, eanage sccumuaes,eedng cana Oy at ec Tremral(oereck propagevon and evetal ale SeeeetcTe, Medteerconeueaen ofthe sade ont Ce eeeegiseecket " Vatonindused oder ct etigue 2 > SEEEOT Engineering & Management, December/January 2019-14 7(continued) a —————————— influenced by hetype of vibration; theshape Giinewtatonspecrum:thesizoandshape [| Ome | Pecace | Par es ees ar tet | rot ics | Bo bth printed board printed board in-plane mi | ase [ resevon | € r3s3 [| a1 [00 ‘materal properties; support conditions: a | ana nesiston | co. sa | 5 | oe ‘component. design: component materia actor [Premamren| 208 Fiese eer fae properties; location thacomponent solder ne See Joint geometry; and solder joint material Sherlock calculates time to failure using a ns | ose | resevon | oo, rss3_[ 810 ‘modified Steinberg model that takes into fe | asia [resistor | €0 rasa | avo | 00 ‘2ccount board level strain. ar [asia [resesron | oo | cosmos | oss | ress | [oo ‘An automotive customer was evaluating io | sta [ nesston | cc. eas [masa _| evo | 00 ‘a potential design. To help accelerate tis ate eee rammarons (eS eo aml ae process, an analysis of the module design a eee ou | me 1_se {sing Sherlock was performed. Sherlock's s 5 intial evaluation predicted which parts _|ax2_[ nesiston | cc om | mas [a [oo \Woulstll under thedefined conditions. PoF mie [ asta [ resston | co | consarpe | oan | 7es0 [sx [001 yodeling identified the sk of component a pains cates emmaen (sae |e lacan [oe failures Before prototype anc the customer a Sess a ‘modified the design accordingly. This information alowed erica, time-sensitive s10_| 00) productdevelopmenttocontinueas orginally 310 | 20) planned, 2m 26. “The N50 fatigue Ife was calculated for ar | 26. ‘each of 705 components (68 unique part Saleen types)en the design, with sk color coding, proized risk listing, and life distribution 275 | 36 Blots based on known part type failure var_| 50 Eistributions. The analysis, chown in Table ao | 1908 | resistor | co. 137 | se Diand Figures 2 and 3, was performed io ao pee eames ee Se jess than 30 seconds ater the model was set ws eunen gies ‘08 _[_nesevon | cc: ro FRed = Significant portion of failure nz_| 1208 _{ nesiston | oc sa [a0 ‘letrbution within service life or test os | 1908 | resiston | co. duration. es [ 1208_[ resistor | co Yellow = Lesser portion of failure Gistrbution within senice Ife or test duration Green = Falure distribution well beyond service fe or test duration (rat shown) [N50 life = # of thermal cycles where fatigue of 50 percent of the parts are ‘Table 2— Automotive thermal cycling ‘APoF reliability riskassessment enabled vital ralabiity growth by identification fof specific relasiity/urabilty limits or Sefcencies, of specific paris in, specific applications, and enabled the design fe be revised with more suitable, robust parts that met reliability objectives. “The automotive manufacturer is now using Sheriock Automated Design Analy~ Sie fo evaluate additional electronic module te-dasigns, providing them with Fapid feedback on product design and ‘expected to fall TEST Reports (Contrued tem page 3) ‘outdoor stadium. The crowd noise at the game between the Kansas City Chiefs and the Oakland Raiders measured 137.5 decibels and broke the Guinness World Record for the loudest crowd noise at an outdoor stadium. ... Frequency Electronics, Inc., Mitchel Field, New York, has delivered the Master Oscillator Group (MOG) for the communications payloadon the U.S. Air Force's fourth Advanced Extremely High Frequency (AEHF) satolite. Evans Analytical Group (EAG), Santa Clara, California, has launched @ comprehensive electronics system failure ‘analysis service, focusingon the entire system fromelectron- Jes fo materials, down to failure mechanisms occurring at the IC transistorlevel. EAGIs an independent laboratory network thet offers analytical and testing services to @ wide variety of industries and end users. ‘Bruce Wilner, Program Manager for Meggitt Sensing Sys~ tems, Sunnyvale, California, has been presented by Sound ‘and Vibration Exchange (SAVE) with its first SAVE Lifetime Innovation Award. The award is based on exemplary contri- ‘butions to the state ofthe art or state of practice. Winer has been responsible forseveralimportant developments in the field ofaccelerometer design and holds severalpatentsinthe field... The Materials Research Society (MRS), Warrendale, Pennsylvania, has named David J. Srolovitz, University of Pennsylvania, as its recipiont of the Materials Theory Award forhis “decisive and highly influential contributions tothe theory and simulation of microstructure, morphological evolution, mechanical behavior, and the structure and dynamics of interfaces.” ... Curtiss-Wright Corporation, Parsippany, New Jersey, has announced the promotion of (Coninued on nage 21) 18 PROT Engineering & Management. December/January 2013-14FIG.2—Thermal cycle tatigue analysi enabling them to deliver more reliable products to market in shorter period time. than previousy Test plan development Product test plane—also known as ‘design verfcation, product qualiication land accelerated lite testing-are crtical to the successful launch of automotive Produets into the marketplace, ‘These test plans require sufficient stresses to bring ‘ut real design deticlencies or defects, but not excessive levels that induce non. representative product falur. Tests must Dberapid enough tomesttight schedules but ot so accelerated as to produce excessive Siresses, Every test must provide value land must demonstrate correlation to the {eventual use environment (whieh includes Screening, storage, ransportaton/shipping, instalation, and operation). Selecting the appropriate environment Conditions for design and test ie entice ‘The recommended approach is the com= bined use of industry stancards and phy. les of failure understanding. This results in an optimized test plan that ie aceeptab) toboth managementandeustomers., Sher. lock can also be Used to assist in the process, Typical industry standard testing falls short. it addresses. a limited degree of mechanism-approoriate testing by using ‘mechanism-specific coupons not real Gevices. Test data may be hidden or scrubbed before reaching the end-users, Conflicts and gaps also exist between and within various industry standards, For ‘example, JEDEC component test are often of limited duration (1000 hours), whieh hides wearout behavior. Use of simple PITT Re ed Turn to page 6 of this issue of TEST, where you'll find information about What we'll cover in TEST's 2014 issues— the form. EST Engineering & Manageme FIG. 3— Thermal cycle fatigue analysis after early failure arts replaced with more suitable, electrically seulvalert activation energy, with theincorrect ‘assumption that all mechanisms are thermally activated, can result in overestimation of failures in time (FT) By 100% oF more, Some critical components of test plane fare identiiad in Tablo 3. Summary oF modeling softwareraduces boththe complexity and needtoran expert when creating and running reliability models, It makes Por ‘analysis faster and cheaper than traditional Design-Builé-Test-and Fixrelabiity growthtests. Modeling ‘can help determine if a design Is capable of surviving the intended Table 3—Critical components of test plans. test and use environment conditions and is Validated with real testing Finally, software reliability madelingiscompietely compatibie With the way mogem automotive products fare designed and engineered today Printed WiringBoards, Saptamber 1988, PC, https://portal.ipe.org/Purehaes/Product Detalaspx?Product_code=d8854oc2.0586. db -ageb-005056875022, 4, Steinberg. David 8. 2000. vibration along with the *A2LA Accredited +MIL-STD-810 [i qualification form for a *Random *Sine +Shock & Drop a subscription *RCTA DO-160E +-40°F to+350°F [| to TEST—as well as , i Phone 414-643-3067 options for submitting 5101 W. Beloit Road, Milwaukee, WI 53214 References 1. “Driving Forwara— What Technologies Can You Expect To See in Next Generation Vehicles?” Presentationat Smart Technology \Werld201 1, Byron Shaw Managing Director, GM Advanced Technology, Silicon Valley Office General Motors, 2. IPC-TR-S78, Round Robin Reliability (of Small Diameter Piated-Through Hotes in ‘Analysis for Electronic Equiomert, Jahn Wiley & Sons ne. a For more information about DIR Solution’s Sheriock software, go to www.testmagazin« info.php/134)130 To continue this discussion with James MeLeish, go to www.testmagazine.biz/ info.php/13dj148 To continue this discussion with Cheryl Tulkot, go to wwwtestmagazine.biz/ info.php/13dj155 Ct Te Mee REL RD alee VIBRATION & ENVIRONMENTAI TESTING EXPERTS: \" READERS: lnk diracty to Rexnord through 1, Docomber/January 2019-14 WWwwAestmagazine.biz/info-php/13d)907 www.rexnord.com/InnovationCenter 19