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Lecture 22 - Electronics Cooling Mechanisms

The document discusses various cooling mechanisms for electronic components and devices, including natural convection cooling, forced convection cooling using fans, liquid cooling, immersion cooling, heat pipes, and thermoelectric cooling. It provides examples and diagrams of each type of cooling mechanism and important design considerations for each. Key equations for modeling natural and forced convection are also presented.

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Sridhar Rao
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284 views

Lecture 22 - Electronics Cooling Mechanisms

The document discusses various cooling mechanisms for electronic components and devices, including natural convection cooling, forced convection cooling using fans, liquid cooling, immersion cooling, heat pipes, and thermoelectric cooling. It provides examples and diagrams of each type of cooling mechanism and important design considerations for each. Key equations for modeling natural and forced convection are also presented.

Uploaded by

Sridhar Rao
Copyright
© Attribution Non-Commercial (BY-NC)
Available Formats
Download as PPT, PDF, TXT or read online on Scribd
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CHE/ME 109 Heat Transfer in Electronics

LECTURE 22 ELECTRONICS COOLING MECHANISMS

COOLING MECHANISMS FOR ELECTRONIC COMPONENTS AND DEVICES

NATURAL CONVECTION COOLING RELIABLE NATURAL CONVECTION EMPLOYS NO MOVING PARTS COOLING MEDIA IS READILY AVAILABLE MODELS FOR CONVECTION BASIC EQUATION IS

MODELS FOR CONVECTION

FOR AIR AT AMBIENT CONDITIONS, THERE ARE SIMPLIFIED CORRELATIONS AVAILABLE FOR LAMINAR FLOW CONDITIONS OF THE FORM:

AS PER TABLE 15-1 WHERE:

L IS A CHARACTERISTIC DISTANCE SUCH AS A VERTICAL RUN, DIAMETER, OR A/p n IS 0.25 K IS DEPENDENT ON SYSTEM GEOMETRY AND INCLUDES THE EQUIVALENT Ra NUMBER AT NEAR AMBIENT CONDITIONS

MODELS FOR NATURAL CONVECTION

FOR A SUMMARY OF THIS METHOD, GO TO: http://electronicscooling.com/articles/2001/2001_aug_calccorner.php Simons, R.E., Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate, ElectronicsCooling, Vol. 7, No. 3, August 2001, pp 12-13. CORRELATIONS CAN BE ADJUSTED FOR PRESSURE USING

CORRELATIONS ASSUME UNRESTRICTED FREE FLOW PASSED THE SURFACE RADIATION COOLING IS ALSO PRESENT FOR THESE SYSTEMS AND SHOULD BE INCLUDED FOR THE OVERALL HEAT BALANCE

FORCED CONVECTION

BASED ON THE HEAT BALANCE:

USE HYDRAULIC DIAMETER FOR THE MORE COMPLEX SHAPES (NOT PLATES, CYLINDERS OR SPHERES) HEAT TRANSFER CORRELATIONS SEE TABLE 15-2 FOR EXTERNAL FLOWS SEE TABLE 15-3 FOR INTERNAL FLOWS

PARALLEL MECHANISMS

NATURAL CONVECTION IS NORMALLY PRESENT SIGNIFICANT IF

CAN INCREASE OR DECREASE FORCED CONVECTION, DEPENDING UPON THE FLOW DIRECTION AND SURFACE CONFIGURATION NATURAL CONVECTION WILL REDUCE COOLING WHEN FORCED AIR FLOWS DOWN A HOT VERTICAL SURFACE NATURAL CONVECTION WILL INCREASE COOLING WHEN FORCE AIR FLOWS UP A HOT SURFACE

AIR CIRCULATION PATTERNS

AN EFFECTIVE SYSTEM NEEDS A CLEAR OPENING FOR AIR FLOW TO AND FROM THE OUTSIDE OF THE CASE THIS CAN BE FROM THE SIDES IF THE BOTTOM OF THE CASE IS NOT CLEAR THE EXHAUST IS TYPICALLY AT THE TOP OF THE CASE

AIR CIRCULATION PATTERNS

ASSURANCE OF ADEQUATE HEAT TRANSFER COEFFICIENTS AT THE SURFACE OF EACH DEVICE FLOW DIVERSION CAN SEND A BALANCED FLOW TO ALL MAJOR HEAT GENERATING COMPONENTS

FORCED AIR CONVECTION WITH FANS


CAN BE SINGLE FANS CAN BE DUAL FANS (PUSH - PULL) METHOD TO MAINTAIN VELOCITIES AND OVERCOME PRESSURE DROP LOCAL COOLING MAY ALSO BE REQUIRED CPU FANS POWER SUPPLIES CASE FANS OTHER COOLING COMPONENTS HEAT SINKS LIQUID COOLING DEVICES CAN BE IN THE FORM OF RADIATORS TO COOL CIRCULATING AIR COOLANT FLOW CAN ALSO BE DIRECTED TO MODIFIED HEAT SINKS TO INCREASE LOCAL CONDUCTION COOLING

http://www.binbin.net/compare/AkasaIntegral-P2-AK-ENP2USB-BK.htm

LIQUID COOLING EXAMPLE

http://www.tweaknews.net/reviews/bigwater735/img/2.jpg

LIQUID COOLING DESIGN SPECIFICS

ADVANTAGES OF LIQUID COOLING INCLUDE REDUCED NOISE IF THE FAN IS REDUCED IN POWER OR SIZE COOLANT CAN BE REFRIGERANT OR CIRCULATING WATER SYSTEM HIGHEST EFFICIENCY WHEN PHASE CHANGE HEAT TRANSFER IS USED

COOLING PLATE SPECS

http://www.wakefield.co m/PDF/liquid_cold_plat es.pdf

COOLING PLATE SPECS

http://www.wakefield.com/ PDF/liquid_cold_plates.pdf

IMMERSION COOLING

IS OBTAINED BY PUTTING THE COMPONENTS IN A CONTAINER CONTAINING A DIELECTRIC FLUID TYPICAL DESIGNS ARE BASED ON THOSE USED FOR POWER TRANSFORMERS

http://www.ecplaza.net/tradeleads/seller/63 19102/supply_transformers.html#none

IMMERSION COOLING CONFIGURATION

OTHER COOLING DEVICES

HEAT PIPES HEAT PIPES ARE FILLED SYSTEMS THAT USE CHANGE OF PHASE HEAT TRANSFER THE HEAT VAPORIZES THE CHEMICAL IN THE SYSTEM AT THE HEATING END OF THE PIPE THE VAPOR IS CONDENSED AT THE COOLING END OF THE PIPE

HEAT PIPE DESIGN

http://electronicscooling.com/article s/1996/sep/sep96_ 02.php

HEAT PIPE CONFIGURATION

http://media.photobucket.c om/image/heat%20pipes% 20for%20electronics/tiesum /vinnen.jpg

THERMOELECTRIC COOLERS

TAKE ADVANTAGE OF THE PELTIER EFFECT TO COOL IN WHICH CONDUCTING A DC CURRENT ACROSS TWO DISSIMILAR MATERIALS CAUSES A TEMPERATURE CHANGE

http://www.peltier-info.com/info.html

THERMOELECTRIC COOLING

http://www.melcor.com/images/cut away.jpg

http://www.sureelectronics.net/DC,IC%20chips /DC-CL001-1.jpg

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