Data Sheet: AFBR-5803AQZ and AFBR-5803ATQZ
Data Sheet: AFBR-5803AQZ and AFBR-5803ATQZ
FDDI, 100 Mb/s ATM, and Fast Ethernet Transceivers in Low Cost 1 x 9 Package Style
Data Sheet
Description
The AFBR-5800Z family of transceivers from Avago Technologies provide the system designer with products to implement a range of Fast Ethernet, FDDI and ATM (Asynchronous Transfer Mode) designs at the 100 Mb/s125 MBd rate. The transceivers are all supplied in the industry standard 1 x 9 SIP package style with either a duplex SC or a duplex ST* connector interface.
Features
Full compliance with the optical performance requirements of the FDDI PMD standard Full compliance with the FDDI LCF-PMD standard Full compliance with the optical performance requirements of the ATM 100 Mb/s physical layer Full compliance with the optical performance requirements of 100 Base-FX version of IEEE 802.3u Multisourced 1 x 9 package style with choice of duplex SC or duplex ST* receptacle Wave solder and aqueous wash process compatible Single +3.3 V or +5 V power supply RoHS Compliance Industrial range -40 to 85C
Applications
Multimode ber backbone links Multimode ber wiring closet to desktop links Very low cost multimode ber links from wiring closet to desktop Multimode ber media converters
*ST is a registered trademark of AT&T Lightguide Cable Connectors.
Transmitter Sections
The transmitter section of the AFBR-5803AQZ and AFBR5805Z series utilize 1300 nm Surface Emitting InGaAsP LEDs. These LEDs are packaged in the optical subassembly portion of the transmitter section. They are driven by a custom silicon IC which converts di erential PECL logic signals, ECL referenced (shifted) to a +3.3 V or +5 V supply, into an analog LED drive current.
of the 1 x 9 SIP. The low pro le of the Avago Technologies transceiver design complies with the maximum height allowed for the duplex SC connector over the entire length of the package. The optical subassemblies utilize a high volume assembly process together with low cost lens elements which result in a cost e ective building block. The electrical subassembly consists of a high volume multilayer printed circuit board on which the IC chips and various surface-mounted passive circuit elements are attached. The package includes internal shields for the electrical and optical subassemblies to ensure low EMI emissions and high immunity to external EMI elds. The outer housing including the duplex SC connector receptacle or the duplex ST ports is molded of lled nonconductive plastic to provide mechanical strength and electrical isolation. The solder posts of the Avago Technologies design are isolated from the circuit design of the transceiver and do not require connection to a ground plane on the circuit board. The transceiver is attached to a printed circuit board with the nine signal pins and the two solder posts which exit the bottom of the housing. The two solder posts provide the primary mechanical strength to withstand the loads imposed on the transceiver by mating with duplex or simplex SC or ST connectored ber cables.
Receiver Sections
The receiver sections of the AFBR-5803AQZ and AFBR5805Z series utilize InGaAs PIN photodiodes coupled to a custom silicon transimpedance preampli er IC. These are packaged in the optical subassembly portion of the receiver. These PIN/preampli er combinations are coupled to a custom quantizer IC which provides the nal pulse shaping for the logic output and the Signal Detect function. The data output is di erential. The signal detect output is single-ended. Both data and signal detect outputs are PECL compatible, ECL referenced (shifted) to a +3.3 V or +5 V power supply.
Package
The overall package concept for the Avago Technologies transceivers consists of the following basic elements; two optical subassemblies, an electrical subassembly and the housing as illustrated in Figure 1 and Figure 1a. The package outline drawings and pin out are shown in Figures 2, 2a and 3. The details of this package outline and pin out are compliant with the multisource de nition
ELECTRICAL SUBASSEMBLY DIFFERENTIAL DATA OUT SINGLE-ENDED SIGNAL DETECT OUT QUANTIZER IC PREAMP IC
OPTICAL SUBASSEMBLIES
LED
TOP VIEW
ELECTRICAL SUBASSEMBLY DIFFERENTIAL DATA OUT SINGLE-ENDED SIGNAL DETECT OUT QUANTIZER IC PREAMP IC
OPTICAL SUBASSEMBLIES
LED
TOP VIEW
12.70 (0.500)
6.35 (0.250)
12.70 (0.500)
AFBR-5803AQZ DATE CODE (YYWW) SINGAPORE + 0.08 0.75 0.05 2.6 0.4 + 0.003 ) (0.030 (0.102 0.016) 0.002 AVAGO
23.55 (0.927)
16.70 (0.657)
23.32 (0.918)
23.24 (0.915)
15.88 (0.625)
Phosphor bronze is the base material for the posts & pins. For lead-free soldering, the solder posts have Tin Copper over Nickel plating, and the electrical pins have pure Tin over Nickel plating.
12.7 (0.500)
12.0 MAX. (0.471) 2.6 0.4 (0.102 0.016) 0.46 (0.018) NOTE 1
20.32
0.38 ( 0.015)
3.3 0.38 (0.130 0.015) + 0.25 - 0.05 (0.050) + 0.010 ( - 0.002 ) 1.27 20.32 (0.800)
2.6 (0.102)
22.86 (0.900)
17.4 (0.685)
1.3 (0.051)
23.38 (0.921)
18.62 (0.733)
Note 1:
Phosphor bronze is the base material for the posts & pins. For lead-free soldering, the solder posts have Tin Copper over Nickel plating, and the electrical pins have pure Tin over Nickel plating.
N/C Rx
Application Information
The Applications Engineering group in the Avago Technologies Fiber Optics Communication Division is available to assist you with the technical understanding and design trade-o s associated with these transceivers. You can contact them through your Avago Technologies sales representative. The following information is provided to answer some of the most common questions about the use of these parts.
optic link model containing the current industry conventions for ber cable speci cations and the FDDI PMD and LCF-PMD optical parameters. These parameters are re ected in the guaranteed performance of the transceiver speci cations in this data sheet. This same model has been used extensively in the ANSI and IEEE committees, including the ANSI X3T9.5 committee, to establish the optical performance requirements for various ber optic interface standards. The cable parameters used come from the ISO/IEC JTC1/SC 25/WG3 Generic Cabling for Customer Premises per DIS 11801 document and the EIA/TIA-568-A Commercial Building Telecommunications Cabling Standard per SP-2840.
12 10
AFBR-5803, 62.5/125 m
8 6 4 2 0
AFBR-5803 50/125 m
CONDITIONS: 1. PRBS 27-1 2. DATA SAMPLED AT CENTER OF DATA SYMBOL. 3. BER = 10-6 4. TA = +25 C 5. VCC = 3.3 V to 5 V dc 6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
0.3 0.5
1.0
1.5
2.0
2.5
25
50
75
100
125
150
175 200
Figure 4. Optical Power Budget at BOL versus Fiber Optic Cable Length.
Figure 5. Transceiver Relative Optical Power Budget at Constant BER vs. Signaling Rate.
1 x 10
-2
-3 -4 -5 -6
AFBR-5803 SERIES
CENTER OF SYMBOL
CONDITIONS: 1. 155 MBd 2. PRBS 2 7 -1 3. CENTER OF SYMBOL SAMPLING 4. TA = +25C 5. VCC = 3.3 V to 5 V dc 6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
Figure 6. Bit Error Rate vs. Relative Receiver Input Optical Power.
Rx
Tx
NO INTERNAL CONNECTION
NO INTERNAL CONNECTION
Rx VEE 1
RD 2
RD 3
SD 4
Rx VCC 5
Tx VCC 6
TD 7
TD 8
Tx VEE 9
C1
C2 VCC
L1 VCC R5 R7 C6
L2
R2 R1
R3 R4
R6
R8
C5
RD
RD
SD
VCC
TD
TD
NOTES: THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED. R1 = R4 = R6 = R8 = R10 = 130 OHMS FOR +5.0 V OPERATION, 82 OHMS FOR +3.3 V OPERATION. R2 = R3 = R5 = R7 = R9 = 82 OHMS FOR +5.0 V OPERATION, 130 OHMS FOR +3.3 V OPERATION. C1 = C2 = C3 = C5 = C6 = 0.1 F. C4 = 10 F. L1 = L2 = 1 H COIL OR FERRITE INDUCTOR.
It is important to take care in the layout of your circuit board to achieve optimum performance from these transceivers. Figure 7 provides a good example of a schematic for a power supply decoupling circuit that works well with these parts. It is further recommended that a contiguous ground plane be provided in the circuit board directly under the transceiver to provide a low inductance ground for signal return current. This recommendation is in keeping with good high frequency board layout practices.
Shipping Container
The transceiver is packaged in a shipping container designed to protect it from mechanical and ESD damage during shipment or storage.
20.32 (0.800)
20.32 (0.800)
2.54 (0.100)
TOP VIEW
42.0
12.0 0.51
9.53 (NOTE 1)
24.8
12.09
25.4
11.1 0.75
39.12 6.79
25.4
Figure 8a. Recommended Common Mechanical Layout for SC and ST 1 x 9 Connectored Transceivers.
Regulatory Compliance
These transceiver products are intended to enable commercial system designers to develop equipment that complies with the various international regulations governing certi cation of Information Technology Equipment. See the Regulatory Compliance Table for details. Additional information is available from your Avago Technologies sales representative.
The rst case is during handling of the transceiver prior to mounting it on the circuit board. It is important to use normal ESD handling precautions for ESD sensitive devices. These precautions include using grounded wrist straps, work benches, and oor mats in ESD controlled areas. The second case to consider is static discharges to the exterior of the equipment chassis containing the transceiver parts. To the extent that the duplex SC connector is exposed to the outside of the equipment chassis it may be subject to whatever ESD system level test criteria that the equipment is intended to meet.
Test Method
MIL-STD-883 Method 3015.4 Variation of IEC 801-2 FCC Class B CENELEC CEN55022 Class B (CISPR 22B) VCCI Class 2 Variation of IEC 61000-4-3
Performance
Meets Class 1 (<1999 Volts) Withstand up to 1500 V applied between electrical pins. Typically withstand at least 25 kV without damage when the Duplex SC Connector Receptacle is contacted by a Human Body Model probe. Transceivers typically provide a 13 dB margin (with duplex SC receptacle) or a 9 dB margin (with duplex ST receptacles ) to the noted standard limits. However, it should be noted that nal margin depends on the customers board and chassis design. Typically show no measurable e ect from a 10 V/m eld swept from 10 to 450 MHz applied to the transceiver when mounted to a circuit card without a chassis enclosure.
Immunity
For additional information regarding EMI, susceptibility, ESD and conducted noise testing procedures and results on the 1 x 9 Transceiver family, please refer to Applications Note 1075, Testing and Measuring Electromagnetic Compatibility Performance of the AFBR-510X/520X Fiber Optic Transceivers.
Immunity
Equipment utilizing these transceivers will be subject to radio-frequency electromagnetic elds in some environments. These transceivers have a high immunity to such elds.
Avago Technologies recommends the use of Duplex Push-Pull connectored cable for the most repeatable optical power coupling performance.
140 2.5 120 100 3.0 3.5 1200 1300 tr/f TRANSMITTER OUTPUT OPTICAL RISE/FALL TIMES ns 1320 1340 1360 1380
Figure 9. Transmitter Output Optical Spectral Width (FWHM) vs. Transmitter Output Optical Center Wavelength and Rise/Fall Times.
1.25
0.075
0.50
0.725
40 0.7
0.725
0.075 5.6 1.525 0.525 4.850 80 500 ppm TIME ns THE AFBR-5103Z OUTPUT OPTICAL PULSE SHAPE SHALL FIT WITHIN THE BOUNDARIES OF THE PULSE ENVELOPE FOR RISE AND FALL TIME MEASUREMENTS. 1.975 4.40
Figure 11. Relative Input Optical Power vs. Eye Sampling Time Position.
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OPTICAL POWER
PO = MAX (PS OR -45.0 dBm) (PS = INPUT POWER FOR BER < 102) INPUT OPTICAL POWER (> 4.0 dB STEP DECREASE)
INPUT OPTICAL POWER (> 1.5 dB STEP INCREASE) -45.0 dBm AS MAX
ANS MAX
TIME AS MAX MAXIMUM ACQUISITION TIME (SIGNAL). AS MAX IS THE MAXIMUM SIGNAL DETECT ASSERTION TIME FOR THE STATION. AS MAX SHALL NOT EXCEED 100.0 s. THE DEFAULT VALUE OF AS MAX IS 100.0 s. ANS MAX MAXIMUM ACQUISITION TIME (NO SIGNAL). ANS MAX IS THE MAXIMUM SIGNAL DETECT DEASSERTION TIME FOR THE STATION. ANS MAX SHALL NOT EXCEED 350 s. THE DEFAULT VALUE OF AS MAX IS 350 s.
Figure 12. Signal Detect Thresholds and Timing.
11
Parameter
Storage Temperature Lead Soldering Temperature Lead Soldering Time Supply Voltage Data Input Voltage Di erential Input Voltage Output Current
Symbol
TS TSOLD tSOLD VCC VI VD IO
Min.
-40
Typ.
Max.
+100 +260 10
Unit
C C sec. V V V mA
Reference
-0.5 -0.5
Note 1
Symbol
TA VCCVCC VIL - VCC VIH - VCC RL
Min.
-40 3.1354.75 -1.810 -1.165
Typ.
Max.
+85 3.55.25 -1.475 -0.880
Unit
C VV V V
Reference
Note A
50
Note 2
Notes: A. Ambient Operating Temperature corresponds to transceiver case temperature of -40 C mininum to +100 C maximum with necessary air ow applied. Recommended case temperature measurement point can be found in Figure 2.
Min.
Typ.
133 0.45 0.76 -2 18
Max.
175 0.6 0.97 350
Unit
mA W W A A
Reference
Note 3
12
Min.
Typ.
87 0.15 0.3
Max.
120 0.25 0.5 -1.55 -0.88 2.2 2.2 -1.55 -0.88 2.2 2.2
Unit
mA W W V V ns ns V V ns ns
Reference
Note 4 Note 5 Note 5 Note 6 Note 6 Note 7 Note 7 Note 6 Note 6 Note 7 Note 7
Data Output Voltage - Low Data Output Voltage - High Data Output Rise Time Data Output Fall Time Signal Detect Output Voltage - Low Signal Detect Output Voltage - High Signal Detect Output Rise Time Signal Detect Output Fall Time
Min.
-19 -20 -22.5 -23.5
Typ.
Max.
-14 -14 10 -10
Unit
dBm avg. dBm avg. % dB dBm avg. nm nm
Reference
Note 11 Note 11 Note 12 Note 13 Note 14 Note 14 Figure 9 Note 14, 15 Figure 9, 10 Note 14, 15 Figure 9, 10 Note 16 Note 17 Note 18
Output Optical Power at Logic 0 State Center Wavelength Spectral Width - FWHMSpectral Width - nm RMS Optical Rise Time Optical Fall Time Duty Cycle Distortion Contributed by the Transmitter Data Dependent Jitter Contributed by the Transmitter Random Jitter Contributed by the Transmitter
PO (0)
C
tr tf DCD DDJ RJ
0.6 0.6
1.9 1.6
13
Symbol
PIN Min. (W) PIN Min. (C) PIN Max.
Min.
Typ.
-33.9 -35.2
Max.
-31 -31.8
Unit
dBm avg. dBm avg. dBm avg.
Reference
Note 19 Figure 11 Note 20 Figure 11 Note 19 Note 8 Note 9 Note 10 Note 21, 22 Figure 12 Note 23, 24 Figure 12 Figure 12 Note 21, 22 Figure 12 Note 23, 24 Figure 12
Notes: 1. This is the maximum voltage that can be applied across the Di erential Transmitter Data Inputs to prevent damage to the input ESD protection circuit. 2. The outputs are terminated with 50 connected to VCC -2 V. 3. The power supply current needed to operate the transmitter is provided to di erential ECL circuitry. This circuitry maintains a nearly constant current ow from the power supply. Constant current operation helps to prevent unwanted electrical noise from being generated and conducted or emitted to neighboring circuitry. 4. This value is measured with the outputs terminated into 50 W connected to VCC - 2 V and an Input Optical Power level of -14 dBm average. 5. The power dissipation value is the power dissipated in the receiver itself. Power dissipation is calculated as the sum of the products of supply voltage and currents, minus the sum of the products of the output voltages and currents. 6. This value is measured with respect to VCC with the output terminated into 50 connected to VCC - 2 V. 7. The output rise and fall times are measured between 20% and 80% levels with the output connected to VCC -2 V through 50 . 8. Duty Cycle Distortion contributed by the receiver is measured at the 50% threshold using an IDLE Line State, 125 MBd (62.5 MHz square-wave), input signal. The input optical power level is -20 dBm average. See Application Information - Transceiver Jitter Section for further information. 9. Data Dependent Jitter contributed by the receiver is speci ed with the FDDI DDJ test pattern described in the FDDI PMD Annex A.5. The input optical power level is -20 dBm average. See Application Information - Transceiver Jitter Section for further information. 10. Random Jitter contributed by the receiver is speci ed with an IDLE Line State, 125 MBd (62.5 MHz square-wave), input signal. The input optical power level is at maximum PIN Min. (W). See Application Information - Transceiver Jitter Section for further information. 11. These optical power values are measured with the following conditions: The Beginning of Life (BOL) to the End of Life (EOL) optical power degradation is typically 1.5 dB per the industry convention for long wavelength LEDs. The actual degradation observed in Avago Technologies 1300 nm LED products is < 1 dB, as speci ed in this data sheet. Over the speci ed operating voltage and temperature ranges. With HALT Line State, (12.5 MHz square-wave), input signal. At the end of one meter of noted optical ber with cladding modes removed. The average power value can be converted to a peak power value by adding 3 dB. Higher output optical power transmitters are available on special request.
14
12. The Extinction Ratio is a measure of the modulation depth of the optical signal. The data 0 output optical power is compared to the data 1 peak output optical power and expressed as a percentage. With the transmitter driven by a HALT Line State (12.5 MHz square-wave) signal, the average optical power is measured. The data 1 peak power is then calculated by adding 3 dB to the measured average optical power. The data 0 output optical power is found by measuring the optical power when the transmitter is driven by a logic 0 input. The extinction ratio is the ratio of the optical power at the 0 level compared to the optical power at the 1 level expressed as a percentage or in decibels. 13. The transmitter provides compliance with the need for Transmit_Disable commands from the FDDI SMT layer by providing an Output Optical Power level of < -45 dBm average in response to a logic 0 input. This speci cation applies to either 62.5/125 m or 50/125 m ber cables. 14. This parameter complies with the FDDI PMD requirements for the trade-o s between center wavelength, spectral width, and rise/fall times shown in Figure 9. 15. This parameter complies with the optical pulse envelope from the FDDI PMD shown in Figure 10. The optical rise and fall times are measured from 10% to 90% when the transmitter is driven by the FDDI HALT Line State (12.5 MHz square-wave) input signal. 16. Duty Cycle Distortion contributed by the transmitter is measured at a 50% threshold using an IDLE Line State, 125 MBd (62.5 MHz square-wave), input signal. See Application Information - Transceiver Jitter Performance Section of this data sheet for further details. 17. Data Dependent Jitter contributed by the transmitter is speci ed with the FDDI test pattern described in FDDI PMD Annex A.5. See Application Information - Transceiver Jitter Performance Section of this data sheet for further details. 18. Random Jitter contributed by the transmitter is speci ed with an IDLE Line State, 125 MBd (62.5 MHz square-wave), input signal. See Application Information - Transceiver Jitter Performance Section of this data sheet for further details. 19. This speci cation is intended to indicate the performance of the receiver section of the transceiver when Input Optical Power signal characteristics are present per the following de nitions. The Input Optical Power dynamic range from the minimum level (with a window timewidth) to the maximum level is the range over which the receiver is guaranteed to provide output data with a Bit Error Ratio (BER) better than or equal to 2.5 x 10-10. At the Beginning of Life (BOL) Over the speci ed operating temperature and voltage ranges Input symbol pattern is the FDDI test pattern de ned in FDDI PMD Annex A.5 with 4B/5B NRZI encoded data that contains a duty cycle base-line wander e ect of 50 kHz. This sequence causes a near worst case condition for inter-symbol interference. Receiver data window time-width is 2.13 ns or greater and centered at mid-symbol. This worst case window time-width is the minimum allowed eye-opening presented to the FDDI PHY PM._Data indication input (PHY input) per the example in FDDI PMD Annex E. This minimum window time-width of 2.13 ns is based upon the worst case FDDI PMD Active Input Interface optical conditions for peak-to-peak DCD (1.0 ns), DDJ (1.2 ns) and RJ (0.76 ns) presented to the receiver. To test a receiver with the worst case FDDI PMD Active Input jitter condition requires exacting control over DCD, DDJ and RJ jitter components that is di cult to implement with production test equipment. The receiver can be equivalently tested to the worst case FDDI PMD input jitter conditions and meet the minimum output data window time-width of 2.13 ns. This is accomplished by using a nearly ideal input optical signal (no DCD, insigni cant DDJ and RJ) and measuring for a wider window time-width of 4.6 ns. This is possible due to the cumulative e ect of jitter components through their superposition (DCD and DDJ are directly additive and RJ components are rms additive). Speci cally, when a nearly ideal input optical test signal is used and the maximum receiver peak-to-peak jitter contributions of DCD (0.4 ns), DDJ (1.0 ns), and RJ (2.14 ns) exist, the minimum window time-width becomes 8.0 ns -0.4 ns - 1.0 ns - 2.14 ns = 4.46 ns, or conservatively 4.6 ns. This wider window time-width of 4.6 ns guarantees the FDDI PMD Annex E minimum window time-width of 2.13 ns under worst case input jitter conditions to the Avago Technologies receiver. Transmitter operating with an IDLE Line State pattern, 125 MBd (62.5 MHz square-wave), input signal to simulate any cross-talk present between the transmitter and receiver sections of the transceiver. 20. All conditions of Note 19 apply except that the measurement is made at the center of the symbol with no window time-width. 21. This value is measured during the transition from low to high levels of input optical power. 22. The Signal Detect output shall be asserted within 100 s after a step increase of the Input Optical Power. The step will be from a low Input Optical Power, -45 dBm, into the range between greater than PA, and -14 dBm. The BER of the receiver output will be 10-2 or better during the time, LS_Max (15 s) after Signal Detect has been asserted. See Figure 12 for more information. 23. This value is measured during the transition from high to low levels of input optical power. The maximum value will occur when the input optical power is either -45 dBm average or when the input optical power yields a BER of 10-2 or larger, whichever power is higher. 24. Signal detect output shall be de-asserted within 350 s after a step decrease in the Input Optical Power from a level which is the lower of; -31 dBm or PD + 4 dB (PD is the power level at which signal detect was de-asserted), to a power level of -45 dBm or less. This step decrease will have occurred in less than 8 ns. The receiver output will have a BER of 10-2 or better for a period of 12 s or until signal detect is de-asserted. The input data stream is the Quiet Line State. Also, signal detect will be de-asserted within a maximum of 350 s after the BER of the receiver output degrades above 10-2 for an input optical data stream that decays with a negative ramp function instead of a step function. See Figure 12 for more information.
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Ordering Information
The 5803AQZ/5803ATQZ 1300 nm products are available for production orders through the Avago Technologies Component Field Sales O ces and Authorized Distributors world wide.
-40 C TO +85 C
AFBR-5803AQZ/5803ATQZ
Note: The T in the product numbers indicates a transceiver with a duplex ST connector receptacle. Product numbers without a T indicate transceivers with a duplex SC connector receptacle.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright 2005-2008 Avago Technologies. All rights reserved. AV02-0253EN - August 27, 2008