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Data Sheet: AFBR-5803AQZ and AFBR-5803ATQZ

The AFBR-5800Z family of transceivers from. Avago Technologies provide the system designer with products to implement a range of. Fast Ethernet, FDDI and ATM designs at the 100 Mb / s125 MBd rate.

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0% found this document useful (0 votes)
77 views16 pages

Data Sheet: AFBR-5803AQZ and AFBR-5803ATQZ

The AFBR-5800Z family of transceivers from. Avago Technologies provide the system designer with products to implement a range of. Fast Ethernet, FDDI and ATM designs at the 100 Mb / s125 MBd rate.

Uploaded by

jonwang
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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AFBR-5803AQZ and AFBR-5803ATQZ

FDDI, 100 Mb/s ATM, and Fast Ethernet Transceivers in Low Cost 1 x 9 Package Style

Data Sheet

Description
The AFBR-5800Z family of transceivers from Avago Technologies provide the system designer with products to implement a range of Fast Ethernet, FDDI and ATM (Asynchronous Transfer Mode) designs at the 100 Mb/s125 MBd rate. The transceivers are all supplied in the industry standard 1 x 9 SIP package style with either a duplex SC or a duplex ST* connector interface.

Features
Full compliance with the optical performance requirements of the FDDI PMD standard Full compliance with the FDDI LCF-PMD standard Full compliance with the optical performance requirements of the ATM 100 Mb/s physical layer Full compliance with the optical performance requirements of 100 Base-FX version of IEEE 802.3u Multisourced 1 x 9 package style with choice of duplex SC or duplex ST* receptacle Wave solder and aqueous wash process compatible Single +3.3 V or +5 V power supply RoHS Compliance Industrial range -40 to 85C

FDDI PMD, ATM and Fast Ethernet 2 km Backbone Links


The AFBR-5803AQZ/ATQZ are 1300 nm products with optical performance compliant with the FDDI PMD standard. The FDDI PMD standard is ISO/IEC 9314-3: 1990 and ANSI X3.166 - 1990. These transceivers for 2 km multimode ber backbones are supplied in the small 1 x 9 duplex SC or ST package style. The AFBR-5803AQZ/ATQZ is useful for both ATM 100 Mb/s interfaces and Fast Ethernet 100 Base-FX interfaces. The ATM Forum User-Network Interface (UNI) Standard, Version 3.0, de nes the Physical Layer for 100 Mb/s Multimode Fiber Interface for ATM in Section 2.3 to be the FDDI PMD Standard. Likewise, the Fast Ethernet Alliance de nes the Physical Layer for 100 Base-FX for Fast Ethernet to be the FDDI PMD Standard. ATM applications for physical layers other than 100 Mb/s Multimode Fiber Interface are supported by Avago Technologies. Products are available for both the single mode and the multimode ber SONET OC-3c (STS-3c) ATM interfaces and the 155 Mb/s-194 MBd multimode ber ATM interface as speci ed in the ATM Forum UNI. Contact your Avago Technologies sales representative for information on these alternative Fast Ethernet, FDDI and ATM products.

Applications
Multimode ber backbone links Multimode ber wiring closet to desktop links Very low cost multimode ber links from wiring closet to desktop Multimode ber media converters
*ST is a registered trademark of AT&T Lightguide Cable Connectors.

Transmitter Sections
The transmitter section of the AFBR-5803AQZ and AFBR5805Z series utilize 1300 nm Surface Emitting InGaAsP LEDs. These LEDs are packaged in the optical subassembly portion of the transmitter section. They are driven by a custom silicon IC which converts di erential PECL logic signals, ECL referenced (shifted) to a +3.3 V or +5 V supply, into an analog LED drive current.

of the 1 x 9 SIP. The low pro le of the Avago Technologies transceiver design complies with the maximum height allowed for the duplex SC connector over the entire length of the package. The optical subassemblies utilize a high volume assembly process together with low cost lens elements which result in a cost e ective building block. The electrical subassembly consists of a high volume multilayer printed circuit board on which the IC chips and various surface-mounted passive circuit elements are attached. The package includes internal shields for the electrical and optical subassemblies to ensure low EMI emissions and high immunity to external EMI elds. The outer housing including the duplex SC connector receptacle or the duplex ST ports is molded of lled nonconductive plastic to provide mechanical strength and electrical isolation. The solder posts of the Avago Technologies design are isolated from the circuit design of the transceiver and do not require connection to a ground plane on the circuit board. The transceiver is attached to a printed circuit board with the nine signal pins and the two solder posts which exit the bottom of the housing. The two solder posts provide the primary mechanical strength to withstand the loads imposed on the transceiver by mating with duplex or simplex SC or ST connectored ber cables.

Receiver Sections
The receiver sections of the AFBR-5803AQZ and AFBR5805Z series utilize InGaAs PIN photodiodes coupled to a custom silicon transimpedance preampli er IC. These are packaged in the optical subassembly portion of the receiver. These PIN/preampli er combinations are coupled to a custom quantizer IC which provides the nal pulse shaping for the logic output and the Signal Detect function. The data output is di erential. The signal detect output is single-ended. Both data and signal detect outputs are PECL compatible, ECL referenced (shifted) to a +3.3 V or +5 V power supply.

Package
The overall package concept for the Avago Technologies transceivers consists of the following basic elements; two optical subassemblies, an electrical subassembly and the housing as illustrated in Figure 1 and Figure 1a. The package outline drawings and pin out are shown in Figures 2, 2a and 3. The details of this package outline and pin out are compliant with the multisource de nition

ELECTRICAL SUBASSEMBLY DIFFERENTIAL DATA OUT SINGLE-ENDED SIGNAL DETECT OUT QUANTIZER IC PREAMP IC

DUPLEX SC RECEPTACLE PIN PHOTODIODE

OPTICAL SUBASSEMBLIES

DIFFERENTIAL DATA IN DRIVER IC

LED

TOP VIEW

Figure 1. SC Connector Block Diagram.

ELECTRICAL SUBASSEMBLY DIFFERENTIAL DATA OUT SINGLE-ENDED SIGNAL DETECT OUT QUANTIZER IC PREAMP IC

DUPLEX ST RECEPTACLE PIN PHOTODIODE

OPTICAL SUBASSEMBLIES

DIFFERENTIAL DATA IN DRIVER IC

LED

TOP VIEW

Figure 1a. ST Connector Block Diagram.


Case Temperature Measurement Point

39.12 MAX. (1.540)

12.70 (0.500)

6.35 (0.250)

25.40 MAX. (1.000)

AREA RESERVED FOR PROCESS PLUG

12.70 (0.500)

AFBR-5803AQZ DATE CODE (YYWW) SINGAPORE + 0.08 0.75 0.05 2.6 0.4 + 0.003 ) (0.030 (0.102 0.016) 0.002 AVAGO

5.93 0.1 (0.233 0.004) 3.30 0.38 (0.130 0.015)

10.35 MAX. (0.407)

2.92 (0.115) 0.46 (9x) (0.018) NOTE 1

18.52 (0.729) 4.14 (0.163

1.27 + 0.25 0.05 + 0.010 (0.050 ) 0.002 NOTE 1

23.55 (0.927)

20.32 [8x(2.54/.100)] (0.800)

16.70 (0.657)

17.32 20.32 (0.682 (0.800)

23.32 (0.918)

0.87 (0.034) Note 1:

23.24 (0.915)

15.88 (0.625)

Phosphor bronze is the base material for the posts & pins. For lead-free soldering, the solder posts have Tin Copper over Nickel plating, and the electrical pins have pure Tin over Nickel plating.

DIMENSIONS ARE IN MILLIMETERS (INCHES).

Figure 2. SC Connector Package Outline Drawing with standard height.

42 MAX. (1.654) 24.8 (0.976) 5.99 (0.236)

25.4 MAX. (1.000)

12.7 (0.500)

AFBR-5803AQZ DATE CODE (YYWW) SINGAPORE

Case Temperature Measurement Point

12.0 MAX. (0.471) 2.6 0.4 (0.102 0.016) 0.46 (0.018) NOTE 1

20.32

0.38 ( 0.015)

3.3 0.38 (0.130 0.015) + 0.25 - 0.05 (0.050) + 0.010 ( - 0.002 ) 1.27 20.32 (0.800)

2.6 (0.102)

22.86 (0.900)

20.32 [(8x (2.54/0.100)] (0.800) 21.4 (0.843) 3.6 (0.142)

17.4 (0.685)

1.3 (0.051)

23.38 (0.921)

18.62 (0.733)

Note 1:

Phosphor bronze is the base material for the posts & pins. For lead-free soldering, the solder posts have Tin Copper over Nickel plating, and the electrical pins have pure Tin over Nickel plating.

DIMENSIONS IN MILLIMETERS (INCHES).

Figure 2a. ST Connector Package Outline Drawing with standard height.

1 = VEE 2 = RD 3 = RD 4 = SD 5 = VCC 6 = VCC 7 = TD 8 = TD 9 = VEE

N/C Rx

Tx N/C TOP VIEW

Figure 3. Pin Out Diagram.

+ 0.08 0.5 - 0.05 (0.020) + 0.003 ( - 0.002

Application Information
The Applications Engineering group in the Avago Technologies Fiber Optics Communication Division is available to assist you with the technical understanding and design trade-o s associated with these transceivers. You can contact them through your Avago Technologies sales representative. The following information is provided to answer some of the most common questions about the use of these parts.

Transceiver Optical Power Budget versus Link Length


Optical Power Budget (OPB) is the available optical power for a ber optic link to accommodate ber cable losses plus losses due to in-line connectors, splices, optical switches, and to provide margin for link aging and unplanned losses due to cable plant recon guration or repair. Figure 4 illustrates the predicted OPB associated with the transceiver series speci ed in this data sheet at the Beginning of Life (BOL). These curves represent the attenuation and chromatic plus modal dispersion losses associated with the 62.5/125 m and 50/125 m ber cables only. The area under the curves represents the remaining OPB at any link length, which is available for overcoming non- ber cable related losses. Avago Technologies LED technology has produced 1300 nm LED devices with lower aging characteristics than normally associated with these technologies in the industry. The industry convention is 1.5 dB aging for 1300 nm LEDs. The Avago Technologies 1300 nm LEDs will experience less than 1 dB of aging over normal commercial equipment mission life periods. Contact your Avago Technologies sales representative for additional details. Figure 4 was generated with a Avago Technologies ber

optic link model containing the current industry conventions for ber cable speci cations and the FDDI PMD and LCF-PMD optical parameters. These parameters are re ected in the guaranteed performance of the transceiver speci cations in this data sheet. This same model has been used extensively in the ANSI and IEEE committees, including the ANSI X3T9.5 committee, to establish the optical performance requirements for various ber optic interface standards. The cable parameters used come from the ISO/IEC JTC1/SC 25/WG3 Generic Cabling for Customer Premises per DIS 11801 document and the EIA/TIA-568-A Commercial Building Telecommunications Cabling Standard per SP-2840.

Transceiver Signaling Operating Rate Range and BER Performance


For purposes of de nition, the symbol (Baud) rate, also called signaling rate, is the reciprocal of the shortest symbol time. Data rate (bits/sec) is the symbol rate divided by the encoding factor used to encode the data (symbols/bit). When used in Fast Ethernet, FDDI and ATM 100 Mb/s applications the performance of the 1300 nm transceivers is guaranteed over the signaling rate of 10 MBd to 125 MBd to the full conditions listed in individual product speci cation tables. The transceivers may be used for other applications at signaling rates outside of the 10 MBd to 125 MBd range with some penalty in the link optical power budget primarily caused by a reduction of receiver sensitivity. Figure 5 gives an indication of the typical performance of these 1300 nm products at di erent rates. These transceivers can also be used for applications which require di erent Bit Error Rate (BER) performance. Figure 6 illustrates the typical trade-o between link BER and the receivers input optical power level.

12 10
AFBR-5803, 62.5/125 m

TRANSCEIVER RELATIVE OPTICAL POWER BUDGET AT CONSTANT BER (dB)

2.5 2.0 1.5 1.0 0.5 0 0.5

OPTICAL POWER BUDGET (dB)

8 6 4 2 0
AFBR-5803 50/125 m

CONDITIONS: 1. PRBS 27-1 2. DATA SAMPLED AT CENTER OF DATA SYMBOL. 3. BER = 10-6 4. TA = +25 C 5. VCC = 3.3 V to 5 V dc 6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.

0.3 0.5

1.0

1.5

2.0

2.5

25

50

75

100

125

150

175 200

FIBER OPTIC CABLE LENGTH (km)

SIGNAL RATE (MBd)

Figure 4. Optical Power Budget at BOL versus Fiber Optic Cable Length.

Figure 5. Transceiver Relative Optical Power Budget at Constant BER vs. Signaling Rate.

1 x 10

-2

Transceiver Jitter Performance


The Avago Technologies 1300 nm transceivers are designed to operate per the system jitter allocations stated in Tables E1 of Annexes E of the FDDI PMD and LCF-PMD standards. The Avago Technologies 1300 nm transmitters will tolerate the worst case input electrical jitter allowed in these tables without violating the worst case output jitter requirements of Sections 8.1 Active Output Interface of the FDDI PMD and LCF-PMD standards. The Avago Technologies 1300 nm receivers will tolerate the worst case input optical jitter allowed in Sections 8.2 Active Input Interface of the FDDI PMD and LCF-PMD standards without violating the worst case output electrical jitter allowed in the Tables E1 of the Annexes E. The jitter speci cations stated in the following 1300 nm transceiver speci cation tables are derived from the values in Tables E1 of Annexes E. They represent the worst case jitter contribution that the transceivers are allowed to make to the overall system jitter without violating the Annex E allocation example. In practice the typical contribution of the Avago Technologies transceivers is well below these maximum allowed amounts.

1 x 10 BIT ERROR RATE 1 x 10 1 x 10

-3 -4 -5 -6

AFBR-5803 SERIES

1 x 10 -7 1 x 10-8 1 x 10-9 1 x 10 1 x 10 -10 1 x 10 -11 1 x 10 -12 -6

CENTER OF SYMBOL

-4 -2 0 2 RELATIVE INPUT OPTICAL POWER - dB

CONDITIONS: 1. 155 MBd 2. PRBS 2 7 -1 3. CENTER OF SYMBOL SAMPLING 4. TA = +25C 5. VCC = 3.3 V to 5 V dc 6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.

Figure 6. Bit Error Rate vs. Relative Receiver Input Optical Power.

Rx

Tx

NO INTERNAL CONNECTION

NO INTERNAL CONNECTION

AFBR-5803 TOP VIEW

Rx VEE 1

RD 2

RD 3

SD 4

Rx VCC 5

Tx VCC 6

TD 7

TD 8

Tx VEE 9

C1

C2 VCC

TERMINATION AT PHY DEVICE INPUTS

L1 VCC R5 R7 C6

L2

R2 R1

R3 R4

R6

R8

C3 C4 VCC FILTER AT VCC PINS TRANSCEIVER R9 R10

C5

TERMINATION AT TRANSCEIVER INPUTS

RD

RD

SD

VCC

TD

TD

NOTES: THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED. R1 = R4 = R6 = R8 = R10 = 130 OHMS FOR +5.0 V OPERATION, 82 OHMS FOR +3.3 V OPERATION. R2 = R3 = R5 = R7 = R9 = 82 OHMS FOR +5.0 V OPERATION, 130 OHMS FOR +3.3 V OPERATION. C1 = C2 = C3 = C5 = C6 = 0.1 F. C4 = 10 F. L1 = L2 = 1 H COIL OR FERRITE INDUCTOR.

Figure 7. Recommended Decoupling and Termination Circuits

Recommended Handling Precautions


Avago Technologies recommends that normal static precautions be taken in the handling and assembly of these transceivers to prevent damage which may be induced by electrostatic discharge (ESD). The AFBR-5800 series of transceivers meet MIL-STD-883C Method 3015.4 Class 2 products. Care should be used to avoid shorting the receiver data or signal detect outputs directly to ground without proper current limiting impedance.

It is important to take care in the layout of your circuit board to achieve optimum performance from these transceivers. Figure 7 provides a good example of a schematic for a power supply decoupling circuit that works well with these parts. It is further recommended that a contiguous ground plane be provided in the circuit board directly under the transceiver to provide a low inductance ground for signal return current. This recommendation is in keeping with good high frequency board layout practices.

Solder and Wash Process Compatibility


The transceivers are delivered with protective process plugs inserted into the duplex SC or duplex ST connector receptacle. This process plug protects the optical subassemblies during wave solder and aqueous wash processing and acts as a dust cover during shipping. These transceivers are compatible with either industry standard wave or hand solder processes.

Board Layout - Hole Pattern


The Avago Technologies transceiver complies with the circuit board Common Transceiver Footprint hole pattern de ned in the original multisource announcement which de ned the 1 x 9 package style. This drawing is reproduced in Figure 8 with the addition of ANSI Y14.5M compliant dimensioning to be used as a guide in the mechanical layout of your circuit board.

Board Layout - Mechanical


For applications providing a choice of either a duplex SC or a duplex ST connector interface, while utilizing the same pinout on the printed circuit board, the ST port needs to protrude from the chassis panel a minimum of 9.53 mm for su cient clearance to install the ST connector. Please refer to Figure 8a for a mechanical layout detailing the recommended location of the duplex SC and duplex ST transceiver packages in relation to the chassis panel.

Shipping Container
The transceiver is packaged in a shipping container designed to protect it from mechanical and ESD damage during shipment or storage.

Board Layout - Decoupling Circuit and Ground Planes

20.32 (0.800)

2 x 1.9 0.1 (0.075 0.004)

20.32 (0.800)

9 x 0.8 0.1 (0.032 0.004)

2.54 (0.100)

TOP VIEW

DIMENSIONS ARE IN MILLIMETERS (INCHES)

Figure 8. Recommended Board Layout Hole Pattern

42.0

12.0 0.51

9.53 (NOTE 1)

24.8

12.09

25.4

11.1 0.75

39.12 6.79

25.4

NOTE 1: MINIMUM DISTANCE FROM FRONT OF CONNECTOR TO THE PANEL FACE.

Figure 8a. Recommended Common Mechanical Layout for SC and ST 1 x 9 Connectored Transceivers.

Regulatory Compliance
These transceiver products are intended to enable commercial system designers to develop equipment that complies with the various international regulations governing certi cation of Information Technology Equipment. See the Regulatory Compliance Table for details. Additional information is available from your Avago Technologies sales representative.

The rst case is during handling of the transceiver prior to mounting it on the circuit board. It is important to use normal ESD handling precautions for ESD sensitive devices. These precautions include using grounded wrist straps, work benches, and oor mats in ESD controlled areas. The second case to consider is static discharges to the exterior of the equipment chassis containing the transceiver parts. To the extent that the duplex SC connector is exposed to the outside of the equipment chassis it may be subject to whatever ESD system level test criteria that the equipment is intended to meet.

Electrostatic Discharge (ESD)


There are two design cases in which immunity to ESD damage is important.

Regulatory Compliance Table


Feature
Electrostatic Discharge (ESD) to the Electrical Pins Electrostatic Discharge (ESD) to the Duplex SC Receptacle Electromagnetic Interference (EMI)

Test Method
MIL-STD-883 Method 3015.4 Variation of IEC 801-2 FCC Class B CENELEC CEN55022 Class B (CISPR 22B) VCCI Class 2 Variation of IEC 61000-4-3

Performance
Meets Class 1 (<1999 Volts) Withstand up to 1500 V applied between electrical pins. Typically withstand at least 25 kV without damage when the Duplex SC Connector Receptacle is contacted by a Human Body Model probe. Transceivers typically provide a 13 dB margin (with duplex SC receptacle) or a 9 dB margin (with duplex ST receptacles ) to the noted standard limits. However, it should be noted that nal margin depends on the customers board and chassis design. Typically show no measurable e ect from a 10 V/m eld swept from 10 to 450 MHz applied to the transceiver when mounted to a circuit card without a chassis enclosure.

Immunity

Electromagnetic Interference (EMI)


Most equipment designs utilizing these high speed transceivers from Avago Technologies will be required to meet the requirements of FCC in the United States, CENELEC EN55022 (CISPR 22) in Europe and VCCI in Japan. In all well-designed chassis, two 0.5 holes for ST connectors to protrude through will provide 4.6 dB more shielding than one 1.2 duplex SC rectangular cutout. Thus, in a well-designed chassis, the duplex ST 1 x 9 transceiver emissions will be identical to the duplex SC 1 x 9 transceiver emissions.

For additional information regarding EMI, susceptibility, ESD and conducted noise testing procedures and results on the 1 x 9 Transceiver family, please refer to Applications Note 1075, Testing and Measuring Electromagnetic Compatibility Performance of the AFBR-510X/520X Fiber Optic Transceivers.

Transceiver Reliability and Performance Quali cation Data


The 1 x 9 transceivers have passed Avago Technologies reliability and performance quali cation testing and are undergoing ongoing quality monitoring. Details are available from your Avago Technologies sales representative.

Immunity
Equipment utilizing these transceivers will be subject to radio-frequency electromagnetic elds in some environments. These transceivers have a high immunity to such elds.

Accessory Duplex SC Connectored Cable Assemblies


Avago Technologies recommends for optimal coupling the use of exible-body duplex SC connectored cable.

Accessory Duplex ST Connectored Cable Assemblies


200 TRANSMITTER OUTPUT OPTICAL SPECTRAL WIDTH (FWHM) nm 180 160 3.0 1.5 2.0 3.5
AFBR-5103 FDDI TRANSMITTER TEST RESULTS OF C, AND tr/f ARE CORRELATED AND COMPLY WITH THE ALLOWED SPECTRAL WIDTH AS A FUNCTION OF CENTER WAVELENGTH FOR VARIOUS RISE AND FALL TIMES.

Avago Technologies recommends the use of Duplex Push-Pull connectored cable for the most repeatable optical power coupling performance.

140 2.5 120 100 3.0 3.5 1200 1300 tr/f TRANSMITTER OUTPUT OPTICAL RISE/FALL TIMES ns 1320 1340 1360 1380

C TRANSMITTER OUTPUT OPTICAL CENTER WAVELENGTH nm

Figure 9. Transmitter Output Optical Spectral Width (FWHM) vs. Transmitter Output Optical Center Wavelength and Rise/Fall Times.

1.25

4.40 1.975 4.850 10.0 5.6 1.525 0.525

1.025 1.00 0.975 0.90 RELATIVE AMPLITUDE

0.075

100% TIME INTERVAL

0.50

0.725

40 0.7

0.725

0% TIME INTERVAL 0.10 0.025 0.0 -0.025 -0.05 10.0

0.075 5.6 1.525 0.525 4.850 80 500 ppm TIME ns THE AFBR-5103Z OUTPUT OPTICAL PULSE SHAPE SHALL FIT WITHIN THE BOUNDARIES OF THE PULSE ENVELOPE FOR RISE AND FALL TIME MEASUREMENTS. 1.975 4.40

Figure 10. Output Optical Pulse Envelope.


RELATIVE INPUT OPTICAL POWER (dB)

5 4 3 2 1.0 x 10-12 BER 1 0 -4 -3 -2 -1 0 1 2 3 4 AFBR-5103/-5104/-5105 SERIES

2.5 x 10-10 BER

EYE SAMPLING TIME POSITION (ns)


CONDITIONS: 1.TA = 25 C 2. VCC = 5 Vdc 3. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns. 4. INPUT OPTICAL POWER IS NORMALIZED TO CENTER OF DATA SYMBOL. 5. NOTE 20 AND 21 APPLY.

Figure 11. Relative Input Optical Power vs. Eye Sampling Time Position.

10

-31.0 dBm MIN (PO + 4.0 dB OR -31.0 dBm)

OPTICAL POWER

PA(PO + 1.5 dB < PA < -31.0 dBm)

PO = MAX (PS OR -45.0 dBm) (PS = INPUT POWER FOR BER < 102) INPUT OPTICAL POWER (> 4.0 dB STEP DECREASE)

INPUT OPTICAL POWER (> 1.5 dB STEP INCREASE) -45.0 dBm AS MAX

SIGNAL DETECT OUTPUT

SIGNAL DETECT (ON) SIGNAL DETECT (OFF)

ANS MAX

TIME AS MAX MAXIMUM ACQUISITION TIME (SIGNAL). AS MAX IS THE MAXIMUM SIGNAL DETECT ASSERTION TIME FOR THE STATION. AS MAX SHALL NOT EXCEED 100.0 s. THE DEFAULT VALUE OF AS MAX IS 100.0 s. ANS MAX MAXIMUM ACQUISITION TIME (NO SIGNAL). ANS MAX IS THE MAXIMUM SIGNAL DETECT DEASSERTION TIME FOR THE STATION. ANS MAX SHALL NOT EXCEED 350 s. THE DEFAULT VALUE OF AS MAX IS 350 s.
Figure 12. Signal Detect Thresholds and Timing.

11

Absolute Maximum Ratings


Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting values of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for extended periods can adversely a ect device reliability.

Parameter
Storage Temperature Lead Soldering Temperature Lead Soldering Time Supply Voltage Data Input Voltage Di erential Input Voltage Output Current

Symbol
TS TSOLD tSOLD VCC VI VD IO

Min.
-40

Typ.

Max.
+100 +260 10

Unit
C C sec. V V V mA

Reference

-0.5 -0.5

7.0 VCC 1.4 50

Note 1

Recommended Operating Conditions


Parameter
Ambient Operating Temperature AFBR-5803AQZ/5803ATQZ Supply Voltage Data Input Voltage - Low Data Input Voltage - High Data and Signal Detect Output Load

Symbol
TA VCCVCC VIL - VCC VIH - VCC RL

Min.
-40 3.1354.75 -1.810 -1.165

Typ.

Max.
+85 3.55.25 -1.475 -0.880

Unit
C VV V V

Reference
Note A

50

Note 2

Notes: A. Ambient Operating Temperature corresponds to transceiver case temperature of -40 C mininum to +100 C maximum with necessary air ow applied. Recommended case temperature measurement point can be found in Figure 2.

Transmitter Electrical Characteristics


Parameter
Supply Current Power Dissipation at VCC = 3.3 V at VCC = 5.0 V

(AFBR-5803AQZ/AFBR-5803ATQZ: TA = -40C to +85C, VCC = 3.135 V to 3.5 V or 4.75 V to 5.25 V) Symbol


ICC PDISS PDISS IIL IIH -350

Min.

Typ.
133 0.45 0.76 -2 18

Max.
175 0.6 0.97 350

Unit
mA W W A A

Reference
Note 3

Data Input Current - Low Data Input Current - High

12

Receiver Electrical Characteristics


Parameter
Supply Current Power Dissipation at VCC = 3.3 V at VCC = 5.0 V

(AFBR-5803AQZ/AFBR-5803ATQZ: TA = -40C to +85C, VCC = 3.135 V to 3.5 V or 4.75 V to 5.25 V) Symbol


ICC PDISS PDISS VOL - VCC VOH - VCC tr tf VOL - VCC VOH - VCC tr tf -1.83 -1.085 0.35 0.35 -1.83 -1.085 0.35 0.35

Min.

Typ.
87 0.15 0.3

Max.
120 0.25 0.5 -1.55 -0.88 2.2 2.2 -1.55 -0.88 2.2 2.2

Unit
mA W W V V ns ns V V ns ns

Reference
Note 4 Note 5 Note 5 Note 6 Note 6 Note 7 Note 7 Note 6 Note 6 Note 7 Note 7

Data Output Voltage - Low Data Output Voltage - High Data Output Rise Time Data Output Fall Time Signal Detect Output Voltage - Low Signal Detect Output Voltage - High Signal Detect Output Rise Time Signal Detect Output Fall Time

Transmitter Optical Characteristics


Parameter
Output Optical Power 62.5/125 m, NA = 0.275 Fiber Output Optical Power 50/125 m, NA = 0.20 Fiber Optical Extinction Ratio

(AFBR-5803AQZ/AFBR-5803ATQZ: TA = -40C to +85C, VCC = 3.135 V to 3.5 V or 4.75 V to 5.25 V) Symbol


BOL EOL BOL EOL PO PO

Min.
-19 -20 -22.5 -23.5

Typ.

Max.
-14 -14 10 -10

Unit
dBm avg. dBm avg. % dB dBm avg. nm nm

Reference
Note 11 Note 11 Note 12 Note 13 Note 14 Note 14 Figure 9 Note 14, 15 Figure 9, 10 Note 14, 15 Figure 9, 10 Note 16 Note 17 Note 18

Output Optical Power at Logic 0 State Center Wavelength Spectral Width - FWHMSpectral Width - nm RMS Optical Rise Time Optical Fall Time Duty Cycle Distortion Contributed by the Transmitter Data Dependent Jitter Contributed by the Transmitter Random Jitter Contributed by the Transmitter

PO (0)
C

-45 1270 1308 147 63 1380

tr tf DCD DDJ RJ

0.6 0.6

1.9 1.6

3.0 3.0 0.6 0.6 0.69

ns ns ns p-p ns p-p ns p-p

13

Receiver Optical and Electrical Characteristics


(AFBR-5803AQZ/AFBR-5803ATQZ: TA = -40C to +85C, VCC = 3.135 V to 3.5 V or 4.75 V to 5.25 V) Parameter
Input Optical Power Minimum at Window Edge Input Optical Power Minimum at Eye Center Input Optical Power Maximum Operating Wavelength Duty Cycle Distortion Contributed by the Receiver Data Dependent Jitter Contributed by the Receiver Random Jitter Contributed by the Receiver Signal Detect - Asserted Signal Detect - Deasserted Signal Detect - Hysteresis Signal Detect Assert Time (o to on) Signal Detect Deassert Time (on to o ) DCD DDJ RJ PA PD PA - PD AS_Max ANS_Max PD + 1.5 dB -45 1.5 0 0 2 8 100 350

Symbol
PIN Min. (W) PIN Min. (C) PIN Max.

Min.

Typ.
-33.9 -35.2

Max.
-31 -31.8

Unit
dBm avg. dBm avg. dBm avg.

Reference
Note 19 Figure 11 Note 20 Figure 11 Note 19 Note 8 Note 9 Note 10 Note 21, 22 Figure 12 Note 23, 24 Figure 12 Figure 12 Note 21, 22 Figure 12 Note 23, 24 Figure 12

-14 1270 1380 0.4 1.0 2.14 -33

nm ns p-p ns p-p ns p-p dBm avg. dBm avg. dB s s

Notes: 1. This is the maximum voltage that can be applied across the Di erential Transmitter Data Inputs to prevent damage to the input ESD protection circuit. 2. The outputs are terminated with 50 connected to VCC -2 V. 3. The power supply current needed to operate the transmitter is provided to di erential ECL circuitry. This circuitry maintains a nearly constant current ow from the power supply. Constant current operation helps to prevent unwanted electrical noise from being generated and conducted or emitted to neighboring circuitry. 4. This value is measured with the outputs terminated into 50 W connected to VCC - 2 V and an Input Optical Power level of -14 dBm average. 5. The power dissipation value is the power dissipated in the receiver itself. Power dissipation is calculated as the sum of the products of supply voltage and currents, minus the sum of the products of the output voltages and currents. 6. This value is measured with respect to VCC with the output terminated into 50 connected to VCC - 2 V. 7. The output rise and fall times are measured between 20% and 80% levels with the output connected to VCC -2 V through 50 . 8. Duty Cycle Distortion contributed by the receiver is measured at the 50% threshold using an IDLE Line State, 125 MBd (62.5 MHz square-wave), input signal. The input optical power level is -20 dBm average. See Application Information - Transceiver Jitter Section for further information. 9. Data Dependent Jitter contributed by the receiver is speci ed with the FDDI DDJ test pattern described in the FDDI PMD Annex A.5. The input optical power level is -20 dBm average. See Application Information - Transceiver Jitter Section for further information. 10. Random Jitter contributed by the receiver is speci ed with an IDLE Line State, 125 MBd (62.5 MHz square-wave), input signal. The input optical power level is at maximum PIN Min. (W). See Application Information - Transceiver Jitter Section for further information. 11. These optical power values are measured with the following conditions: The Beginning of Life (BOL) to the End of Life (EOL) optical power degradation is typically 1.5 dB per the industry convention for long wavelength LEDs. The actual degradation observed in Avago Technologies 1300 nm LED products is < 1 dB, as speci ed in this data sheet. Over the speci ed operating voltage and temperature ranges. With HALT Line State, (12.5 MHz square-wave), input signal. At the end of one meter of noted optical ber with cladding modes removed. The average power value can be converted to a peak power value by adding 3 dB. Higher output optical power transmitters are available on special request.

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12. The Extinction Ratio is a measure of the modulation depth of the optical signal. The data 0 output optical power is compared to the data 1 peak output optical power and expressed as a percentage. With the transmitter driven by a HALT Line State (12.5 MHz square-wave) signal, the average optical power is measured. The data 1 peak power is then calculated by adding 3 dB to the measured average optical power. The data 0 output optical power is found by measuring the optical power when the transmitter is driven by a logic 0 input. The extinction ratio is the ratio of the optical power at the 0 level compared to the optical power at the 1 level expressed as a percentage or in decibels. 13. The transmitter provides compliance with the need for Transmit_Disable commands from the FDDI SMT layer by providing an Output Optical Power level of < -45 dBm average in response to a logic 0 input. This speci cation applies to either 62.5/125 m or 50/125 m ber cables. 14. This parameter complies with the FDDI PMD requirements for the trade-o s between center wavelength, spectral width, and rise/fall times shown in Figure 9. 15. This parameter complies with the optical pulse envelope from the FDDI PMD shown in Figure 10. The optical rise and fall times are measured from 10% to 90% when the transmitter is driven by the FDDI HALT Line State (12.5 MHz square-wave) input signal. 16. Duty Cycle Distortion contributed by the transmitter is measured at a 50% threshold using an IDLE Line State, 125 MBd (62.5 MHz square-wave), input signal. See Application Information - Transceiver Jitter Performance Section of this data sheet for further details. 17. Data Dependent Jitter contributed by the transmitter is speci ed with the FDDI test pattern described in FDDI PMD Annex A.5. See Application Information - Transceiver Jitter Performance Section of this data sheet for further details. 18. Random Jitter contributed by the transmitter is speci ed with an IDLE Line State, 125 MBd (62.5 MHz square-wave), input signal. See Application Information - Transceiver Jitter Performance Section of this data sheet for further details. 19. This speci cation is intended to indicate the performance of the receiver section of the transceiver when Input Optical Power signal characteristics are present per the following de nitions. The Input Optical Power dynamic range from the minimum level (with a window timewidth) to the maximum level is the range over which the receiver is guaranteed to provide output data with a Bit Error Ratio (BER) better than or equal to 2.5 x 10-10. At the Beginning of Life (BOL) Over the speci ed operating temperature and voltage ranges Input symbol pattern is the FDDI test pattern de ned in FDDI PMD Annex A.5 with 4B/5B NRZI encoded data that contains a duty cycle base-line wander e ect of 50 kHz. This sequence causes a near worst case condition for inter-symbol interference. Receiver data window time-width is 2.13 ns or greater and centered at mid-symbol. This worst case window time-width is the minimum allowed eye-opening presented to the FDDI PHY PM._Data indication input (PHY input) per the example in FDDI PMD Annex E. This minimum window time-width of 2.13 ns is based upon the worst case FDDI PMD Active Input Interface optical conditions for peak-to-peak DCD (1.0 ns), DDJ (1.2 ns) and RJ (0.76 ns) presented to the receiver. To test a receiver with the worst case FDDI PMD Active Input jitter condition requires exacting control over DCD, DDJ and RJ jitter components that is di cult to implement with production test equipment. The receiver can be equivalently tested to the worst case FDDI PMD input jitter conditions and meet the minimum output data window time-width of 2.13 ns. This is accomplished by using a nearly ideal input optical signal (no DCD, insigni cant DDJ and RJ) and measuring for a wider window time-width of 4.6 ns. This is possible due to the cumulative e ect of jitter components through their superposition (DCD and DDJ are directly additive and RJ components are rms additive). Speci cally, when a nearly ideal input optical test signal is used and the maximum receiver peak-to-peak jitter contributions of DCD (0.4 ns), DDJ (1.0 ns), and RJ (2.14 ns) exist, the minimum window time-width becomes 8.0 ns -0.4 ns - 1.0 ns - 2.14 ns = 4.46 ns, or conservatively 4.6 ns. This wider window time-width of 4.6 ns guarantees the FDDI PMD Annex E minimum window time-width of 2.13 ns under worst case input jitter conditions to the Avago Technologies receiver. Transmitter operating with an IDLE Line State pattern, 125 MBd (62.5 MHz square-wave), input signal to simulate any cross-talk present between the transmitter and receiver sections of the transceiver. 20. All conditions of Note 19 apply except that the measurement is made at the center of the symbol with no window time-width. 21. This value is measured during the transition from low to high levels of input optical power. 22. The Signal Detect output shall be asserted within 100 s after a step increase of the Input Optical Power. The step will be from a low Input Optical Power, -45 dBm, into the range between greater than PA, and -14 dBm. The BER of the receiver output will be 10-2 or better during the time, LS_Max (15 s) after Signal Detect has been asserted. See Figure 12 for more information. 23. This value is measured during the transition from high to low levels of input optical power. The maximum value will occur when the input optical power is either -45 dBm average or when the input optical power yields a BER of 10-2 or larger, whichever power is higher. 24. Signal detect output shall be de-asserted within 350 s after a step decrease in the Input Optical Power from a level which is the lower of; -31 dBm or PD + 4 dB (PD is the power level at which signal detect was de-asserted), to a power level of -45 dBm or less. This step decrease will have occurred in less than 8 ns. The receiver output will have a BER of 10-2 or better for a period of 12 s or until signal detect is de-asserted. The input data stream is the Quiet Line State. Also, signal detect will be de-asserted within a maximum of 350 s after the BER of the receiver output degrades above 10-2 for an input optical data stream that decays with a negative ramp function instead of a step function. See Figure 12 for more information.

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Ordering Information
The 5803AQZ/5803ATQZ 1300 nm products are available for production orders through the Avago Technologies Component Field Sales O ces and Authorized Distributors world wide.

-40 C TO +85 C
AFBR-5803AQZ/5803ATQZ
Note: The T in the product numbers indicates a transceiver with a duplex ST connector receptacle. Product numbers without a T indicate transceivers with a duplex SC connector receptacle.

For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright 2005-2008 Avago Technologies. All rights reserved. AV02-0253EN - August 27, 2008

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