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CE Analytics: Your Surface Analysis and Materials Properties Resource

CE Analytics is the industry's most complete resource and knowledge base for test, analysis and technology development. Our functional analysis includes: Adhesion Failures assembly and Solder Connection Contamination Corrosion Cosmetic Issues Solderability Failures Solder Connection Voiding Structural Integrity Thickness and Composition of Coatings CE Analytics is part of cookson electronics.

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216 views

CE Analytics: Your Surface Analysis and Materials Properties Resource

CE Analytics is the industry's most complete resource and knowledge base for test, analysis and technology development. Our functional analysis includes: Adhesion Failures assembly and Solder Connection Contamination Corrosion Cosmetic Issues Solderability Failures Solder Connection Voiding Structural Integrity Thickness and Composition of Coatings CE Analytics is part of cookson electronics.

Uploaded by

同道文档中心
Copyright
© Attribution Non-Commercial (BY-NC)
Available Formats
Download as PDF or read online on Scribd
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CE Analytics

Your Surface Analysis and Materials


Properties Resource

One Complete
Resource to Unlock
Unlimited Potential
In a shrinking universe of
resources, we offer a world CE Analytics
of analytical solutions.
The resource for diagnostics
Qualified analytical resources are solutions, analytical services
becoming harder to find. Yet your
and application expertise
analytical requirements are no less
complex. In-house services you used
to turn to may no longer be available.
And while merchant labs provide the
data, they don't offer the expertise to
analyze and solve your specific
problems. In this environment, it's
reassuring to know that there is one
resource with the experience and
capabilities to solve almost all of
your application challenges. CE
Analytics. While others are cutting
corners, we offer you a resource at the
cutting edge of technology, staffed by
the most experienced engineers and
analysts in their fields. More than data
alone, they give you the insight you
need to turn that data into a viable,
cost-effective solution.

Take a team of highly skilled scientists CE Analytics has the capabilities to Our functional analysis includes:
and application engineers. Give them analyze a wide range of devices,
the world’s most advanced analytical components and materials including: • Adhesion Failures
and diagnostic capabilities to perform • Assembly & Solder Connection
expert interpretive analysis. Add high • Circuit Assemblies • Contamination
performance chemicals and materials • Connectors • Corrosion
specified and approved by the world’s • Decorative Accessories • Cosmetic Issues
leading OEMs. Then put these capabilities • Functional Items • Failure Analysis
in one state-of-the-art-facility. This is CE • Leadframes • Interfacial Reactions/Intermetalic
Analytics. The industry’s most complete • Memory Disk Surfaces Compound (IMC) Formation
resource and knowledge base for test, • Printed Wiring Boards • Morphology
analysis and technology development. • Semiconductor Packages • Porosity
• Wafers • Solderability Failures
At CE Analytics, you’ll team with the • Wire • Solder Connection Voiding
industry’s top specialists. They’re ready • Structural Integrity
to work with you and your customers to • Surface Contaminants
develop the exact and logical solution • Thickness and Composition of
to your specific challenge. Coatings
CE Analytics is part of Cookson

Electronics. As a leading supplier of


For surface sensitive analysis on conductive and non-conductive substrates, CE Analytics
high performance assembly materials, relies on two advanced Auger Spectrometers, covering both SIMS (Secondary Ion Mass
semiconductor packaging, specialty Spectroscopy) and XPS (X-Ray Photoelectron Spectroscopy).

chemicals and coatings used in the

electronics and surface finishing

industries, we have a long history of

achievement in electroplating, material


reliability and diagnostics. Recognizing

the critical need for highly specialized

analytical services, Cookson Electronics

now offers this resource to our global

customers.

OUR COMPLETE SUPPORT • Advanced diagnostic equipment, All of this technology and expertise is
Scientists at CE Analytics are committed including: contained in one state-of-the-art
to working with you on an extensive research center.
range of material applications to address – Scanning Electron Microscopy with
the complex challenges posed by the EDS CAPABILITIES BEYOND TESTING
electronics and surface finishing industries. – Optical Microscopy In-depth expertise in product
To that end, we offer a unique combination – Metallographic Sample Preparation development, process engineering,
of resources: – Auger Electron Spectroscopy application engineering and technical
SIMS service makes CE Analytics far more
• People with vast experience in XPS (ESCA) than just a testing facility. Our ability to
electrochemistry, analytical chemistry, – X-ray Diffraction interpret data, not merely provide it,
materials science, process and – X-ray Fluorescence enables you to quickly determine the
application engineering. The CE – Mechanical Strength Testing direction of your product development,
Analytics team is highly skilled in the Coating Adhesion or a solution to a current problem.
specific disciplines of plating, reliability Die Shear Force
and failure-mode analysis. Tensile Stress/Strain Our team of engineers and scientists
– Wire Bonding Evaluations uses an extensive arsenal of analytical
• Leading edge assembly and electro- – Solderability Testing instrumentation. Techniques include:
plating technologies that are both user – FTIR Microscopy
friendly and customizable to your – Ion Chromatography • Elemental Analysis
exact needs. All with the hands-on – Gas Chromatography • Metallography
support of industry recognized, highly – AFM/STM • Microscopy
specialized technical personnel. – Acoustic Imaging • Spectroscopy
– Corrosion Testing • Surface Analysis
• Thermal Analysis
With the aid of this Fourier-Transform Infrared Microscope (FTIR), CE Analytics engineers
can obtain an infrared spectrum on a substrate or plated article.

A FULL RANGE OF SERVICES


Whether you require a simple elemental
analysis or comprehensive engineering
services, we put our full resources behind
you. We can test to your specifications.
Alternatively, we can evaluate your
requirements and propose a testing
program. Beyond conducting the
analysis, we also provide comprehensive
reports, including interpretation and a
recommended course of action. CE
Analytics stands ready to assist you in
the following areas:

Properties Surface Analysis Solder Analysis


Characterization We have expertise, resources and The movement to lead-free alloys
Analysis instrumentation to analyze surface world-wide will require more frequent
We have vast knowledge and experience films that may interfere with adhesion, sampling and better monitoring of solder
in electronics, electroplating and reliability solderability and wirebonding. In addition, pots to maintain process standards. CE
analysis of plated surfaces. This coupled we can determine composition versus Analytics offers expert solder analysis to
with state-of-the-art instrumentation, depth of thin films such as oxides and help meet today’s needs.
provides a unique combination of skills, vapor deposited coatings.
experience and capabilities for material Process & Application
as well as failure-mode analysis. Bulk Analysis Engineering Services
Our capabilities include metallurgical Putting technology to work is the goal
analysis to examine the structure and of our research and development
The scanning electron microscope is used for high failure of electrodeposited coatings and effort. Through the integration of skilled
magnification surface morphology examinations X-ray diffraction for stress and orientation scientists, state-of-the-art instrumentation,
and Energy Dispersive Spectroscopy (EDS) measurements. Our expertise also extends world-class scientific laboratories and
identification of surface elements. to hardness, ductility, colorimetrics and information systems we can meet any
gloss of finishes. technical challenge.

Performance Measurements At CE Analytics we understand how


We have the systems and scientists to vital confidentiality is to your project.
define performance characteristics for Our team will work together with you to
solderability, wire bonding, wire strength evaluate and customize a plan to meet
and corrosion/porosity. Our range of your objectives and proprietary needs.
services also includes the analysis of
tribological properties to determine
the wear characteristics of functional
and electronic coatings.

shared intelligence
www.cooksonelectronics.com

CE Analytics
600 Route 440
Jersey City, New Jersey 07304
Tel: 201-434-6778 ext: 2200
Toll Free: 800-367-5460

©2003 Cookson Electronics

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