Tic 108
Tic 108
TIC108A, TIC108B, TIC108C, TIC108D, TIC108E, TIC108M, TIC108N, TIC108S P-N-P-N SILICON REVERSE-BLOCKING TRIODE THYRISTORS
5 A Continuous On-State Current 20 A Surge-Current Glass Passivated Wafer 100 V to 800 V Off-State Voltage Max IGT of 1 mA Compliance to ROHS
Ratings
Repetitive peak off-state voltage (see Note1) Repetitive peak reverse voltage Continuous on-state current at (or below) 80C case temperature ( see note2) Average on-state current (180 conduction angle) at(or below) 80C case temperature (see Note3) Surge on-state current (see Note4) Peak positive gate current (pulse width 300 s) Peak power dissipation (pulse width 300 s) Average gate power dissipation (see Note5) Operating case temperature range Storage temperature range Lead temperature 1.6 mm from case for 10 seconds
Value A B C D E M S N
Unit
V V A A A A W W C C C
100 200 300 400 500 600 700 800 100 200 300 400 500 600 700 800 5 3.2 20 0.2 1.3 0.3 -40 to +110 -40 to +125 230
02/10/2012
COMSET SEMICONDUCTORS
1|3
SEMICONDUCTORS
Ratings
Gate-controlled VAA = 30 V, RL = 6 Turn-on time RGK(eff) = 5 k, Vin = 50 V Circuit-communicated VAA = 30 V, RL = 6 Turn-off time IRM 8 A Junction to case thermal resistance Junction to free air thermal resistance
Value
2.9
Unit
ELECTRICAL CHARACTERISTICS
TC=25C unless otherwise noted
Symbol
IDRM IRRM IGT
Ratings
Repetitive peak off-state current Repetitive peak reverse current Gate trigger current
Test Condition(s)
VD = Rated VDRM RGK = 1 k, TC = 110C VR = Rated VRRM, IG = 0 TC = 110C VAA = 6 V, RL = 100 tp(g) 20s VAA = 6 V, RL = 100 RGK = 1 k, tp(g) 20s TC = -40C VAA = 6 V, RL = 100 RGK = 1 k, tp(g) 20s VAA = 6 V, RL = 100 RGK = 1 k, tp(g) 20s TC = 110C VAA = 6 V, RGK = 1 k initiating IT = 20 mA VAA = 6 V, RGK = 1 k initiating IT = 20 mA TC = -40C ITM = 5A (see Note6) VD = Rated VD, RGK = 1 k TC = 110C
Min
0.2 0.4 0.2 -
Typ
0.6 80
Max
400 1 200 1.2 1 10
Unit
A mA A
VGT
IH
Holding current
mA 15 1.7 V V/s
VTM dv/dt
02/10/2012
COMSET SEMICONDUCTORS
2|3
SEMICONDUCTORS
6.
This parameters must be measured using pulse techniques, tW = 300s, duty cycle 2 %, voltagesensing contacts, separate from the courrent-carrying contacts, are located within 3.2mm (1/8 inch) from de device body.
02/10/2012
COMSET SEMICONDUCTORS
3|3
SEMICONDUCTORS
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02/10/2012 COMSET SEMICONDUCTORS