International Journal of Engineering Trends and Technology- Volume4Issue3- 2013

A Unique Design based Processing Layer for Modular Architecture in Wireless Sensor Networks and its Applications
Guttikonda Chaitra Bharati#1, Akkela Ramakrishna *2, Chagamreddy Jhansi #3, K.Ajay Reddy$3
Electronics and Communications, KL University, Guntur, Andhra Pradesh, India Assistant Professor, Electronics and Computer, KL University, Guntur, Andhra Pradesh, India $ Electronics and Communications, Sri Sai Madhavi institute of science and technology, Andhra Pradesh, India
* #

Abstract The growth of sensor networks during the last years is a fact and within this field, wireless sensor networks are growing particularly as there are many applications that demand the use of many nodes(also called as mote), even hundreds or thousands. More and more applications are emerging to solve several problems in data acquisition and control in different environments, taking advantage of this technology. In this context, hardware design of the sensor network node becomes critical to satisfy the hard constraints imposed by wireless sensor networks, like low power consumption, low size and low cost. Moreover, these nodes must be capable of sensing, processing and communicating physical parameters, becoming true smart sensors in a network. With this goal in mind, we propose a modular architecture for the nodes, composed of four layers: communication, processing, power supply and sensing. The purpose is to minimize the redesign effort as well as to make the node flexible and adaptable to many different applications. In a first prototype of the node, we present a node with a mixed design based on a microcontroller and an FPGA for the processing layer and Bluetooth technology for communications.

where the central node acts as the master and the sensors/actuators as slaves.

Keywords Mote/node, Actuators/Sensors, Connectors

Modular

Architecture,

I. INTRODUCTION Measurement and control of all kind of parameters in several application scenarios raises some problems and design challenges for researchers. Wireless sensor networks appear as a solution, where hundreds or thousands of sensor nodes take measurements from the environment, process the information and communicate this data to the network and to the final user This field has grown enormously during the last years and it is expected that this trend continues in the future. These networks are composed of nodes with several constraints due to the nature of the wireless sensor network field, like very low power consumption or very low cost and reliability of the nodes. With sensor networks it is possible to improve the measurement procedure since human intervention is reduced almost totally. The centralized architecture for the system is

The master takes information from the slaves, processes it and acts consequently. This approach presents several drawbacks like bottlenecks in the central node and high dependence on the reliability of the master. On the other hand, a distributed architecture arises as another approach, in which each node processes locally the signals from sensors, and communicates them to the network. In this context, if a node fails the network continues working. Furthermore, the traffic of information is reduced, because each node can take decisions locally. As it has been said before, the wireless sensor networks field imposes several constraints to the researchers. Because of this, hardware design of the network nodes becomes critical. This is the point in which this paper is focused. Normally, each application fixes its requirements, and the engineers have to design the system from scratch. This makes redesigning hard and expensive both in terms of time and cost.

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Modularity is an important feature of the node. The purpose is to have a modular platform, flexible and adaptable to several applications and scenarios, and to be able to reuse and interchange between different layers when the application changes. Moreover, the architecture must satisfy several design requirements as it has been said before. To achieve this goal, a four layers modular architecture is proposed.

Fig: Master-Slave Architecture To solve this problem it is possible to divide the node in functional blocks or layers and so, the redesign effort concentrates in each layer separately. With this approach, it is possible to reuse layers and interchange between different solutions depending on the application requirements. Keeping this idea in mind, a modular architecture of four layers is proposed for the wireless sensor network. These four layers are: communication, processing, power supply and sensing/actuation. Each layer fulfils a specific functionality in the node, and the layers can change between different applications and moreover, it is possible to have an heterogeneous network with nodes composed of different layers. Layers are bonded through vertical connectors which are common to all the layers. As all the layers use the same connectors in the same position, reusability and interchangeability are much easier.

With a modular platform new advantages arise, like easy redesigning or the possibility of reusing and interchanging layers, which reduces cost and time. Furthermore, with this architecture new research possibilities can be tested easily due to the versatility and flexibility of the system. In fact, the node is intended for both research and as a demonstrator of new applications. The modularity is achieved thanks to the vertical connectors. These connectors fulfill the electrical and mechanical connection, and moreover, the logic connection, that is, the connections between the different devices of the architecture (C, FPGA, sensors, etc.). The connections are fixed in order to standardize the physical architecture of the node. So, it is possible to interchange between different layers, and design new layers in an easy way. Finally, the result is that to interchange between different layers (two sensing layers for example) the only thing to be done is to take out the old layer from the node, take the new layer and insert it in the node, using the vertical connectors.

Fig: Four Layers II. FOUR LAYER ARCHITECTURE

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Fig: Left and Right Connectors The use of vertical connectors is useful not only to make the mechanical and electrical connections, but to reduce node size, taking advantage of the vertical dimension. All these factors make the node very robust and compact. The signals are distributed following some conventions. Assuming that the C is in the left side and the FPGA is in the right side, the connectors will be called left and right connector. In this way, analog and simple digital sensor signals are connected to left connector pins, as they can be connected directly to the C. On the other hand, complex digital signals are bonded to the right connector in order to be connected to the FPGA that can easily handle several signals or protocols at the same time thanks to its concurrency (all the logic is executed simultaneously). Moreover, supply and ground signals have been placed in the corners of the connector, as can be seen in above figure. An example of modularity can be seen in below figure. There, two different processing layers are shown, one of them with a C and an FPGA and the other one only with a C. The first example is a processing layer which should be used in applications which need fast processing or with sensors with complex digital interfaces. The C deals with simple analog signals and with communications, and the FPGA releases the C from the tasks related to complex sensors, for example. The second example should be used in applications with analog sensors (the C has an integrated ADC), or perhaps simple digital sensors, where the C can face all the work without problems. required that the network works autonomously for a long time without human intervention. A mixed microcontroller/FPGA design is proposed in the first implementation in order to satisfy different requirements for several applications. Versatility is the aims of this selection, existing other possibilities are such as using the microcontroller only or the FPGA only. The Microcontroller: The C is an ADUC812 from Analog Devices. This device incorporates 8KB flash memory, 256 bytes of RAM, ADC, DAC, UART and SPI ports, four general I/O ports, and three timers among others peripherals. The C manages the communications, controlling the Bluetooth module directly through its UART port, and controls the signals from analog and simple digital sensors as well. The clock frequency in the first prototype is 12 MHz, extendable to 16 MHz The FPGA: The FPGA is a Spartan III from Xilinx, specifically an XC3S200 (which integrates 200k logic gates). This device gives the node a big freedom to adapt to new applications, and makes the system versatile in its processing capabilities. The main feature of FPGAs is concurrency. This allows the processing layer to manage complex digital sensors in a fast way, releasing the C of these tasks. In this context, the C deals with communication and simple sensors, and the FPGA processes the most complex signals. The FPGA needs three different power voltages, specifically 3.3, 2.5 and 1.2 V. These voltages come from the power supply layer; this point will be commented later on. B. SENSING LAYER This module includes sensors and/or actuators to interact with the environment. According to the use of the smart sensor network, multiple combinations are possible. Multiple kinds of sensors can be included in this level, and actuators may be incorporated as well in order to act according to parameters measured from the environment. In a first application, two different sensor layers have been designed and manufactured. The former is composed of analog and digital sensors, and the latter only includes digital. This is the first demonstration of modularity in the nodes. The digital version for sensor layer includes an accelerometer and three different temperature sensors. In this way, there are four different signal formats to be processed in the FPGA in order to explore the different interfaces characteristics. In the analog and digital version of sensor layer, sensors of temperature, humidity, infrared and illumination are included. This layer is controlled using both the C and the FPGA. On the other hand, communications are always managed by the C. C. COMMUNICATION LAYER In the communication layer a Bluetooth module has been chosen for the first prototype. This election was done because

A. PROCESSING LAYER This module provides the smart sensor with intelligence. Here, the signals from the sensors are converted into appropriate digital and processed signals. Moreover, the control of the communications is carried out in this module. Searching of neighbor nodes, setting and breaking links, and management of all the tasks related with the network are controlled here by generating commands to the Bluetooth module, and interpreting commands from the Bluetooth module and other network nodes. Power saving modes are managed here too in order to extend the battery life. This is an important matter in wireless sensor networks because it is

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Bluetooth has low power consumption, enough data rate for the intended applications; it is a widely used technology and works in the 2.4 GHz ISM free license frequency band. The module incorporated to the node is an OEMSPA13i from ConnectBlue. This module acts as a serial cable replacement. The C communicates with the Bluetooth module through its UART port. In this way, the module receives simple AT commands from the C, commands which make the module perform different tasks like search for other modules, establish or break connections, or commands to configure the module, for example. In order to achieve modularity, several communication layers will be considered. With the purpose of deal with the possible interfaces of each wireless module, the C integrates different interfaces like UART, SPI, and general I/O ports. Anyway, the FPGA can solve any problem related to interfacing with the communications layer because it is possible to virtually implement any circuit inside this device. Vertical connectors make this possible, because many signals pass through the communication layer to the processing layer. This point has been taken into account specially to ensure compatibility of the node with future versions of the different layers. Other technologies are being studied in order to adapt the module to other application scenarios and to reduce power consumption and network complexity, like ZigBee or a proprietary protocol. D. POWER SUPPLY LAYER This layer generates all the voltages that are needed by the different devices of the node. In the first prototype, the layer takes 5V from an external power supply. With linear regulators the layer supplies 3.3, 2.5 and 1.2 V to the node. These voltages supply the different devices of the node (the FPGA needs the three voltages to work). Inside this layer (see Figure 9) there are the largest capacitors of the node (10 F), in order to satisfy peak current demands coming from the processing layer. Because of the purpose of having autonomous nodes, different options are being studied in order to integrate new sources like coin cells or AA batteries. In that case, power consumption must be reduced as much as possible. III. APPLICATIONS A. ENVIRONMENTAL APPLICATIONS Nowadays sensor networks are also widely applied in habitat monitoring, agriculture research, fire detection and traffic control. Because there is no interruption to the environment, sensor networks in environmental area is not that strict as in battlefield. Bush Fire Response: A low cost distributed sensor network for environmental monitor and disaster response. An integrated network of sensors combining on the ground sensors monitoring local moisture levels, humidity, wind speed and direction, together with satellite imagery and longer term meteorological forecasting will enable the determination of fire risk levels in targeted regions as well as valuable information on probable fire direction. Such a network will provide valuable understanding of bushfire development and most importantly assist authorities in organizing a coordinated disaster response that will save lives and property by providing early warning for high risk areas. B. MILTARY APPLICATIONS Because most of the elemental knowledge of sensor networks is basic on the defense application at the beginning, especially two important programs the Distributed Sensor Networks (DSN) and the Sensor Information Technology (SenIT) form the Defense Advanced Research Project Agency (DARPA), sensor networks are applied very successfully in the military sensing. Now wireless sensor networks can be an integral part of military command, control, communications, computing, intelligence, surveillance, reconnaissance and targeting systems. In the battlefield context, rapid deployment, selforganization, fault tolerance security of the network should be required. The sensor devices or nodes should provide following services: Battlefield surveillance Reconnaissance of opposing forces Targeting Battle damage assessment Nuclear, biological and chemical attack detection reconnaissance

C. HEALTH APPLICATIONS Sensor networks are also widely used in health care area. In some modern hospital sensor networks are constructed to monitor patient physiological data, to control the drug administration track and monitor patients and doctors and inside a hospital. In spring 2004 some hospital in Taiwan even use RFID basic of above named applications to get the situation at first hand. Long-term nursing home this application is focus on nursing of old people. In the town farm cameras, pressure sensors, orientation sensors and sensors for detection of muscle activity construct a complex network. They support fall detection, unconsciousness detection, vital sign monitoring and dietary/exercise monitoring. These applications reduce personnel cost and rapid the reaction of emergence situation.

III. CONCLUSIONS Energy efficient routing in wireless sensor networks constitutes a challenging research area. More energy saving methods are being developed so that the applications of wireless sensor networks can be further extended to many fields. In the future, further development is envisaged that may lead to a commercially available product.

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ACKNOWLEDGMENTS We thank faculty Mr. Akkela Rama Krishna for his valuable contribution in preparing this paper and helping us out many a time when we needed guidance. We are indebted to the Department of Electronics and Communication Engineering of KL University for providing the software and support required. REFERENCES
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[3] Intel: Intel Research, Sensor Nets/RFID: Intel Mote, http://www.intel.com/research/exploratory/motes.htm

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