optris PI400 / PI450 - Infrared camera with high resolution

optris PI400 / PI450 Themal imager with 382 x 288 pixels

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Important Features
Detector with 382 x 288 pixels Fast real-time thermal imager with up to 80 Hz Very high thermal sensitivity with 80 mK (PI400) and 40 mK (PI450) Smallest camera in its class (46 x 56 x 90 mm3) Lightweight (320 g incl. optics) Exchangeable lenses & industrial accessories

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Smallest camera in its class

High temperature resolution of 40 mK

The optris PI450 offering a resolution of 40 mK is used to detect tiny temperature differences, for example in product quality inspections or medical prophylaxis.
40 mK (PI450)

80 mK (PI400)

Size in mm

Due to tiny temperature resolution the PI450 detects even veins under the skin

80 Hz data capturing with high resolution

SMD part as measurement object: Size of part: 32 mm x 24 mm, pixel size: 0.08 mm
382 pixels

The camera displays and stores thermal images with high resolution (382 x 288 px) at full frame rate of 80 Hz (80 images per second).

10 x 10 pixels = 40 mm2
288 pixels

Thermal image of preforms used in PET bottle production

Basis model Type

PI400 IR

PI450 IR
40 mK

Scope of supply

USB camera incl. 1 lens, USB cable (1 m), table tripod, PIF cable incl. terminal block (1 m), software package optris PI Connect, aluminum case FPA, uncooled (25 m x 25 m) 382 x 288 pixel 7.5 - 13 m -20C...100C, 0C...250C, 150C...900C additional range: 200C...1500C (option) 80 Hz 38 x 29 FOV / f = 15 mm or 62 x 49 FOV / f = 8 mm or 13 x 10 FOV / f = 41 mm 0.08 K with 38 x 29 FOV / F = 0.8 0.08 K with 62 x 49 FOV / F = 0.8 0.1 K with 13 x 10 FOV / F = 1.0 -

USB camera incl. 1 lens, USB cable (1 m), table tripod, PIF cable incl. terminal block (1 m), software package optris PI Connect, aluminum case FPA, uncooled (25 m x 25 m) 382 x 288 pixel 7.5 - 13 m -20C...100C, 0C...250C, 150C...900C 80 Hz 38 x 29 FOV / f = 15 mm or 62 x 49 FOV / f = 8 mm or 13 x 10 FOV / f = 41 mm 0.04 K with 38 x 29 FOV / F = 0.8 0.04 K with 62 x 49 FOV / F = 0.8 0.06 K with 13 x 10 FOV / F = 1.0 -

Detector Optical resolution Spectral range Temperature ranges Frame rate Optics (FOV)

Thermal sensitivity (NETD)

Option for visual camera (only for BI-SPECTRAL camera) Accuracy PC interface Process interface (PIF) Ambient temperature (TAmb) Storage temperature Relative humidity Enclosure (size / rating) Weight Shock / vibration Tripod mount Power supply

2C or 2% USB 2.0 0 - 10 V input, digital input, 0 - 10 V output 0C...50C -40C...70C 20 - 80%, non condensing 46 mm x 56 mm x 90 mm / IP 67 (NEMA 4) 320 g, incl. lens 25G, IEC 68-2-29 / 2G, IEC 68-2-6 1/4-20 UNC USB powered

2C or 2% USB 2.0 0 - 10 V input, digital input, 0 - 10 V output 0C...70C -40C...85C 20 - 80%, non condensing 46 mm x 56 mm x 90 mm / IP 67 (NEMA 4) 320 g, incl. lens 25G, IEC 68-2-29 / 2G, IEC 68-2-6 1/4-20 UNC USB powered

Accessory for optris PI thermal imagers

Cooling housing and mounting angle, adjustable in two axes*

Mounting flange, for cooling housing*

High temperature USB cable

Mounting base for camera and protective housing (stainless steel), adjustable in two axes

Angular connector

* Not for PI200 / PI230 (BI-SPECTRAL camera versions)

Software optris PI Connect

Extensive infrared camera software No additional costs No restrictions in licencing Modern software with intuitive user interface Remote control of camera via software Display of multiple camera images in different windows Compatible with Windows XP, Vista and 7, Linux (ubuntu) and LabVIEW*

1.

6. Temperature data analysis and documentation Triggered data collection Radiometric video sequences (*.ravi) Radiometric snapshots (*.jpg,*.tiff) Text files including complete temperature information for analysis in Excel (*.csv, *.dat) Data with color information for standard programs such as Photoshop or Windows Media Player (*.avi, *.jpg, *.tiff) Data transfer in real time to other software programmes via LabVIEW, DLL or Comport interfaces

Automatic process and quality control Individual setup of alarm levels depending on the process BI-SPECTRAL process monitoring (IR and VIS) for easy orientation at point of measurement Definition of visual or acoustic alarms and analog data output via the process interface Analog and digital signal input (process parameter) External communication of software via Comports, DLL and LabVIEW driver 5. Adjustment of thermal image via reference values

High level of individualization for customer 2. specific display Different layout options for an individual setup (arrangement of windows, toolbar) Temperature display in C or F Various language options including a translation tool Range of individual measurement parameter fitting for each application Adaption of thermal image (mirror, rotate) Individual start options (full screen, hidden, etc.)

3. Video recording and snapshot function (IR or BI-SPECTRAL) Recording of video sequences and detailled frames for further analysis or documentation BI-SPECTRAL video analysis (IR and VIS) in order to highlight critical temperatures Adjustment of recording frequency to reduce data volume Display of snapshot history for immediate analysis

Extensive online and offline data analysis Analysis supported by measurement fields, automatic hot and cold spot searching Real time temperature information within main window as digital or graphic display Logic operation of temperature information (measurement fields and image substraction) Slow motion repeat of radiometric files and analysis without camera being connected Editing of sequences such as cutting and saving of individual images Various color palettes to highlight thermal contrasts

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Example pictures: String soldering at solar cells *Windows is a registered trademark of Microsoft Corporation. LabVIEW is a registered trademark of National Instruments.

Optical specification

The variety of different lenses offers the possibility to precisely measure objects in different distances. We offer lenses for close, standard distances and large distances. Different parameters are important if using infrared cameras. They display the connection between the distance of the measured object and the size of the pixel. When choosing a lens, the following data should be considered:
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HFOV: Horizontal enlargement of the total measuring field at object level VFOV: Vertical enlargement of the total measuring field at object level IFOV: Size of the single pixel at object level DFOV: Diagonal dimension of the total measuring field at the object level MFOV: Recommended, smallest measured object size of 3 x 3 pixel
Measurement field of the optris PI representing the 23 x 17 lens

Measurement field sizes for any distances can be calculated online http://www.optris.com/optics-calculator.

PI400/450
382 x 288 px O38 Standard lens

Focal length
15 mm

Angle
38 29 49 1.81 mrad 13 10 17 0.61 mrad 62 49 74 3.14 mrad

Minimum distance*
0.2 m HFOV [m] VFOV [m] DFOV [m] IFOV [mm] HFOV [m] VFOV [m] DFOV [m] IFOV [mm] HFOV [m] VFOV [m] DFOV [m] IFOV [mm]

Distance to object [m]

0.02
0.014 0.010 0.018 0.1

0.1
0.07 0.05 0.09 0.2

0.2
0.14 0.10 0.18 0.4

0.3
0.21 0.15 0.28 0.5

0.5
0.35 0.25 0.46 0.9 0.12 0.09 0.15 0.3

1
0.69 0.51 0.92 1.8 0.23 0.17 0.29 0.6 1.20 0.90 1.50 3.1

2
1.39 1.02 1.84 3.6 0.47 0.35 0.58 1.2 2.40 1.80 3.00 6.3

4
2.77 2.03 3.68 7.3 0.94 0.70 1.17 2.5 4.80 3.60 6.00 12.6

6
4.16 3.05 5.52 10.9 1.40 1.05 1.75 3.7 7.20 5.41 8.99 18.8

10
6.9 5.1 9.2 18.1 2.3 1.7 2.9 6.1 12.0 9.0 15.0 31.4

30
20.8 15.2 27.6 54.4 7.0 5.2 8.8 18.4 36.0 27.0 45.0 94.2

100
69.3 50.8 92.0 181.3 23.4 17.5 29.2 61.2 119.9 90.1 149.9 314.0

O13 Tele lens

41 mm

0.5 m

O62 Wide angle lens

8 mm

0.5 m

0.024 0.018 0.030 0.1

0.12 0.09 0.15 0.3

0.24 0.18 0.30 0.6

0.36 0.27 0.45 0.9

0.60 0.45 0.75 1.6

Table with examples showing what spot sizes and pixel sizes will be reached in which distance. For individual configuration there are different lenses available. Wide angle lenses have a radial distortion due to their large opening angle; the software PIConnect contains an algorithm which corrects this distortion. *Note: The accuracy of measurement can be outside of the specifications for distances below the defined minimum distance.