Preliminary Information

AMD Athlon XP Processor Model 6 Data Sheet

TM

Publication # 24309 Rev: E Issue Date: March 2002

Preliminary Information

20002002 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (AMD) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in AMDs Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMDs products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMDs product could create a situation where personal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice.

Trademarks AMD, the AMD Arrow logo, AMD Athlon, AMD Duron, and combinations thereof, 3DNow!, and QuantiSpeed are trademarks of Advanced Micro Devices, Inc. HyperTransport is a trademark of the HyperTransport Technology Consortium. MMX is a trademark of Intel Corporation. Windows is a trademark of Microsoft Corporation. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

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Contents
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi 1 2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 2.1 2.2 2.3 2.4 QuantiSpeed Architecture Summary . . . . . . . . . . . . . . . . . . 2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Signaling Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Push-Pull (PP) Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 AMD Athlon System Bus Signals . . . . . . . . . . . . . . . . . . . . . . 6

Interface Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3 4

Logic Symbol Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4.1 Power Management States . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Working State. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Halt State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Stop Grant States. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Probe State. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Connect and Disconnect Protocol . . . . . . . . . . . . . . . . . . . . . . 13 Connect Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Connect State Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Clock Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

4.2

4.3

5 6 7

CPUID Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Thermal Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Electrical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 7.13 7.14 7.15 Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Interface Signal Groupings . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Voltage Identification (VID[4:0]) . . . . . . . . . . . . . . . . . . . . . . 26 Frequency Identification (FID[3:0]) . . . . . . . . . . . . . . . . . . . . 27 VCCA AC and DC Characteristics . . . . . . . . . . . . . . . . . . . . . 27 Decoupling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 VCC_CORE Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Absolute Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 VCC_CORE Voltage and Current . . . . . . . . . . . . . . . . . . . . . . 31 SYSCLK and SYSCLK# AC and DC Characteristics . . . . . . 32 AMD Athlon System Bus AC and DC Characteristics . . . . . 34 General AC and DC Characteristics . . . . . . . . . . . . . . . . . . . . 36 Open Drain Test Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Thermal Diode Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 39 APIC Pins AC and DC Characteristics . . . . . . . . . . . . . . . . . . 41

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Signal and Power-Up Requirements . . . . . . . . . . . . . . . . . . . . 43

8.1 Power-Up Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Signal Sequence and Timing Description . . . . . . . . . . . . . 43 Clock Multiplier Selection (FID[3:0]) . . . . . . . . . . . . . . . . 46 Processor Warm Reset Requirements . . . . . . . . . . . . . . . . . . 46 Northbridge Reset Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Die Loading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 OPGA Package Description . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Pin Diagram and Pin Name Abbreviations . . . . . . . . . . . . . . 51 Pin List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Detailed Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 A20M# Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 AMD Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 AMD Athlon System Bus Pins . . . . . . . . . . . . . . . . . . . . . . 68 Analog Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 APIC Pins, PICCLK, PICD[1:0]# . . . . . . . . . . . . . . . . . . . . 68 CLKFWDRST Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 CLKIN, RSTCLK (SYSCLK) Pins. . . . . . . . . . . . . . . . . . . . 68 CONNECT Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 COREFB and COREFB# Pins . . . . . . . . . . . . . . . . . . . . . . . 69 CPU_PRESENCE# Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 DBRDY and DBREQ# Pins . . . . . . . . . . . . . . . . . . . . . . . . . 69 FERR Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 FID[3:0] Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 FLUSH# Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 IGNNE# Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 INIT# Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 INTR Pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 JTAG Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 K7CLKOUT and K7CLKOUT# Pins . . . . . . . . . . . . . . . . . . 71 Key Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 NC Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 NMI Pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 PGA Orientation Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 PLL Bypass and Test Pins . . . . . . . . . . . . . . . . . . . . . . . . . . 72 PWROK Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 SADDIN[1:0]# and SADDOUT[1:0]# Pins . . . . . . . . . . . . . 72 Scan Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 SMI# Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 STPCLK# Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 SYSCLK and SYSCLK#. . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 THERMDA and THERMDC Pins . . . . . . . . . . . . . . . . . . . . 73

8.2

Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
9.1 9.2 9.3

10

Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
10.1 10.2 10.3

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VCCA Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 VID[4:0] Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 VREFSYS Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 ZN and ZP Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

11

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Standard AMD Athlon XP Processor Model 6 Products . . . . . . . . . . 75

Appendix A Conventions and Abbreviations . . . . . . . . . . . . . . . . . . 77

Signals and Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Data Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Abbreviations and Acronyms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

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List of Figures
Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Typical AMD Athlon XP Processor Model 6 System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Logic Symbol Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 AMD Athlon XP Processor Model 6 Power Management States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 AMD Athlon System Bus Disconnect Sequence in the Stop Grant State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Exiting the Stop Grant State and Bus Connect Sequence . . . . 16 Northbridge Connect State Diagram . . . . . . . . . . . . . . . . . . . . . 17 Processor Connect State Diagram . . . . . . . . . . . . . . . . . . . . . . . 18 VCC_CORE Voltage Waveform . . . . . . . . . . . . . . . . . . . . . . . . . 29 SYSCLK and SYSCLK# Differential Clock Signals . . . . . . . . . 32

Figure 10. SYSCLK Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Figure 11. General ATE Open Drain Test Circuit. . . . . . . . . . . . . . . . . . . . 38 Figure 12. Signal Relationship Requirements During Power-Up Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Figure 13. AMD Athlon XP Processor Model 6 OPGA Package . . . . . . . . 49 Figure 14. AMD Athlon XP Processor Model 6 Pin Diagram Topside View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Figure 15. AMD Athlon XP Processor Model 6 Pin Diagram Bottomside View. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Figure 16. OPN Example for the AMD Athlon XP Processor Model 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

List of Figures

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List of Tables
Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Thermal Design Power. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Interface Signal Groupings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 VID[4:0] DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 FID[3:0] DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 VCCA AC and DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . 27 VCC_CORE AC and DC Characteristics . . . . . . . . . . . . . . . . . . 28 Absolute Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 VCC_CORE Voltage and Current. . . . . . . . . . . . . . . . . . . . . . . . 31 SYSCLK and SYSCLK# DC Characteristics . . . . . . . . . . . . . . . 32 SYSCLK and SYSCLK# AC Characteristics . . . . . . . . . . . . . . . 33 AMD Athlon System Bus DC Characteristics . . . . . . . . . . . . 34 AMD Athlon System Bus AC Characteristics . . . . . . . . . . . . . . 35 General AC and DC Characteristics . . . . . . . . . . . . . . . . . . . . . . 36 Thermal Diode Electrical Characteristics . . . . . . . . . . . . . . . . . 39 Guidelines for Platform Thermal Protection of the Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 APIC Pin AC and DC Characteristics. . . . . . . . . . . . . . . . . . . . . 41 Mechanical Loading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Dimensions for the AMD Athlon XP Processor Model 6 OPGA Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Pin Name Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Cross-Reference by Pin Location . . . . . . . . . . . . . . . . . . . . . . . . 60 FID[3:0] Clock Multiplier Encodings . . . . . . . . . . . . . . . . . . . . . 70 VID[4:0] Code to Voltage Definition . . . . . . . . . . . . . . . . . . . . . 74 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Acronyms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

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List of Tables

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Revision History
Date Rev Description Revisions to the AMD Athlon XP Processor Model 6 Data Sheet since January 2002 include the following:

March 2002

In Chapter 6, revised Table 1, Thermal Design Power, on page 23 In Chapter 7, revised Table 8, VCC_CORE Voltage and Current, on page 31 In Chapter 10, revised Table , FID[3:0] Pins, on page 70 In Chapter 11, revised Figure 16, OPN Example for the AMD Athlon XP Processor Model 6 on page 75

Revisions to the AMD Athlon XP Processor Model 6 Data Sheet since November 2001 include the following: January 2002 D

In Chapter 6, revised Table 1, Thermal Design Power, on page 23 In Chapter 7, revised Table 8, VCC_CORE Voltage and Current, on page 31 In Chapter 11, revised Figure 16, OPN Example for the AMD Athlon XP Processor Model 6 on page 75

Revisions to the AMD Athlon XP Processor Model 6 Data Sheet since October 2001 include the following:

November 2001

In Chapter 6, revised Table 1, Thermal Design Power, on page 23 In Chapter 7, revised Table 6, VCC_CORE AC and DC Characteristics, on page 28, Table 8, VCC_CORE Voltage and Current, on page 31, revised Table 13, General AC and DC Characteristics, on page 36, added new section, Open Drain Test Circuit on page 38, added Figure 11, General ATE Open Drain Test Circuit on page 38, added new section, Thermal Protection Characterization on page 40 , and added Table 15, Guidelines for Platform Thermal Protection of the Processor, on page 41 In Chapter 11, revised Figure 16, OPN Example for the AMD Athlon XP Processor Model 6 on page 75

October 2001

Initial release of the AMD Athlon XP Processor Model 6 Data Sheet

Revision History

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Overview
The AMD Athlon XP processor model 6 with QuantiSpeed architecture powers the next generation in computing platforms, delivering extreme performance for Windows XP.
The AMD Athlon XP processor model 6 is the latest member of the AMD Athlon family of processors designed to meet the computation-intensive requirements of cutting-edge software applications running on high-performance desktop systems. Delivered in an OPGA package, the AMD Athlon XP processor model 6 delivers the integer, floating-point, and 3D multimedia performance needed for highly demanding applications running on x86 system platforms. The AMD Athlon XP processor model 6 delivers compelling performance for cutting-edge software applications that include high-speed Internet capability, digital content creation, digital photo editing, digital video, image compression, video encoding for streaming over the Internet, soft DVD, commercial 3D modeling, workstation-class Computer-Aided Design (CAD), commercial desktop publishing, and speech recognition. The AMD Athlon XP processor model 6 also offers the scalability and reliability that IT managers and business users require for enterprise computing. The AMD Athlon XP processor model 6 features a seventh-generation microarchitecture with an integrated, exclusive L2 cache, which supports the growing processor and system bandwidth requirements of emerging software, graphics, I/O, and memory technologies. The high-speed execution core of the AMD Athlon XP processor model 6 includes multiple x86 instruction decoders, a dual-ported 128-Kbyte split level-one (L1) cache, an exclusive 256-Kbyte L2 cache, three independent integer pipelines, three address calculation pipelines, and a superscalar, fully pipelined, out-of-order, three-way floating-point engine. The floating-point engine is capable of delivering outstanding performance on numerically complex applications. The features of the AMD Athlon XP processor model 6 are QuantiSpeed architecture, a high-performance full-speed cache, a 266-MHz, 2.1-Gigabyte per second system bus, and 3DNow! Professional technology. The AMD Athlon system bus combines the latest technological advances, such as point-to-point topology, source-synchronous packet-based transfers, and low-voltage signaling to provide an extremely powerful, scalable bus for an x86 processor.

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The AMD Athlon XP processor model 6 is binary-compatible with existing x86 software and backwards compatible with applications optimized for MMX, SSE, and 3DNow! technology. Using a data format and Single-Instruction Multiple-Data (SIMD) operations based on the MMX instruction model, the AMD Athlon XP processor model 6 can produce as many as four, 32-bit, single-precision floating-point results per clock cycle. The 3DNow! Professional technology implemented in the AMD Athlon XP processor model 6 includes new integer multimedia instructions and software-directed data movement instructions for optimizing such applications as digital content creation and streaming video for the internet, as well as new instructions for Digital Signal Processing (DSP)/communications applications.

1.1

QuantiSpeed Architecture Summary

The following features summarize the AMD Athlon XP processor model 6 QuantiSpeed architecture:

An advanced nine-issue, superpipelined, superscalar x86 processor microarchitecture designed for increased Instructions Per Cycle (IPC) and high clock frequencies Fully pipelined floating-point unit that executes all x87 (floating-point), MMX, SSE and 3DNow! instructions Hardware data pre-fetch that increases and optimizes performance on high-end software applications utilizing high-bandwidth system capabilities Advanced two-level Translation Look-aside Buffer (TLB) structures for both enhanced data and instruction address translation. The AMD Athlon XP processor model 6 with QuantiSpeed architecture incorporates three TLB optimizations: the L1 DTLB increases from 32 to 40 entries, the L2 ITLB and L2 DTLB both use exclusive architecture, and the TLB entries can be speculatively loaded.

The AMD Athlon XP processor model 6 delivers excellent system performance in a cost-effective, industry-standard form factor. The AMD Athlon processor model 6 is compatible with motherboards based on Socket A. Figure 1 on page 3 shows a typical AMD Athlon processor system block diagram.

Overview

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Thermal Monitor

AMD Athlon XP Processor Model 6

AMD Athlon System Bus AGP Bus System Controller (Northbridge) Memory Bus SDRAM or DDR
AGP

PCI Bus

Peripheral Bus Controller (Southbridge)

LAN

SCSI

Modem / Audio LPC Bus USB Dual EIDE BIOS

Figure 1. Typical AMD Athlon XP Processor Model 6 System Block Diagram

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Overview

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Overview

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2
2.1

Interface Signals
Overview
The AMD Athlon system bus architecture is designed to delive r excellent da ta movement bandwidth for nextgeneration x86 platforms as well as the high-performance required by enterprise-class application software. The system bus architecture consists of three high-speed channels (a unidirectional processor request channel, a unidirectional probe channel, and a 64-bit bidirectional data channel), source-synchronous clocking, and a packet-based protocol. In addition, the system bus supports several control, clock, and legacy signals. The interface signals use an impedance controlled push-pull, low-voltage, swing-signaling technology contained within the Socket A socket. For more information, see AMD Athlon System Bus Signals on page 6, Chapter 10, Pin Descriptions on page 51, and the AMD Athlon and AMD Duron System Bus Specification , order# 21902.

2.2

Signaling Technology
The AMD Athlon system bus uses a low-voltage, swing-signaling technology, that has been enhanced to provide larger noise margins, reduced ringing, and variable voltage levels. The signals are push-pull and impedance compensated. The signal inputs use differential receivers that require a reference voltage (VREF). The reference signal is used by the receivers to determine if a signal is asserted or deasserted by the source. Termination resistors are not needed because the driver is impedance-matched to the motherboard and a high impedance reflection is used at the receiver to bring the signal past the input threshold. For more information about pins and signals, see Chapter 10, Pin Descriptions on page 51.

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2.3

Push-Pull (PP) Drivers

The AMD Athlon XP processor model 6 supports Push-Pull (PP) drivers. The system logic configures the processor with the configuration parameter called SysPushPull (1=PP). The impedance of the PP drivers is set to match the impedance of the motherboard by two external resistors connected to the ZN and ZP pins. See ZN and ZP Pins on page 74 for more information.

2.4

AMD Athlon System Bus Signals

The AMD Athlon system bus is a clock-forwarded, point-topoint interface with the following three point-to-point channels:

A 13-bit unidirectional output address/command channel A 13-bit unidirectional input address/command channel A 72-bit bidirectional data channel

For more information, see Chapter 7, Electrical Data on page 25 and the AMD Athlon and AMD Duron System Bus Specification, order# 21902.

Interface Signals

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Logic Symbol Diagram

Figure 2 is the logic symbol diagram of the processor. This diagram shows the logical grouping of the input and output signals.

Clock

SYSCLK SDATA[63:0]# SDATAINCLK[3:0]# SDATAOUTCLK[3:0]# SDATAINVALID# SDATAOUTVALID# SFILLVALID#

SYSCLK# VID[4:0] COREFB COREFB# PWROK FID[3:0]

Voltage Control

Data

Frequency Control

Probe/SysCMD Request

SADDIN[14:2]# SADDINCLK# SADDOUT[14:2]# SADDOUTCLK# PROCRDY CLKFWDRST CONNECT STPCLK# RESET#

AMD Athlon XP Processor Model 6

Power Management and Initialization

FERR IGNNE# INIT# INTR NMI A20M# SMI# FLUSH# THERMDA THERMDC PICCLK PICD[1:0]

Legacy

Thermal Diode APIC

Figure 2. Logic Symbol Diagram

Chapter 3

Logic Symbol Diagram

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Logic Symbol Diagram

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AMD Athlon XP Processor Model 6 Data Sheet

Power Management
This chapter describes the power management control system of the AMD Athlon XP processor model 6. The power management features of the processor are compliant with the ACPI 1.0b and ACPI 2.0 specifications.

4.1

Power Management States

The AMD Athlon XP processor model 6 supports low-power Halt and Stop Grant states. These states are used by Advanced Configuration and Power Interface (ACPI) enabled operating systems for processor power management. Figure 3 shows the power management states of the processor. The figure includes the ACPI Cx naming convention for these states.

C1 Halt

Execute HLT SMI#, INTR, NMI, INIT#, RESET#

C0 Working4

(Read PLVL2 register or throttling)

STPCLK# deasserted

STPCLK# asserted

PC LK #d ST ea PC sse LK rte #a d3 sse rte d2

ST

ST ST

Incoming Probe

Probe State1

Note:

The AMD AthlonTM System Bus is connected during the following states: 1) The Probe state 2) During transitions between the Halt state and the C2 Stop Grant state 3) During transitions between the C2 Stop Grant state and the Halt state 4) C0 Working state

Figure 3. AMD Athlon XP Processor Model 6 Power Management States Chapter 4 Power Management 9

Probe Serviced

PC LK # ass e

PC LK #

de ass ert rte d

ed

Incoming Probe Probe Serviced

C2 Stop Grant Cache Snoopable

S1 Stop Grant Cache Not Snoopable Sleep

Legend Hardware transitions Software transitions

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The following sections provide an overview of the power m a n a g e m e n t s t a t e s . Fo r m o re d e t a i l s , re f e r t o t h e AMD Athlon and AMD Duron System Bus Specification, order# 21902. Note: In all power management states that the processor is powered, the system must not stop the system clock (SYSCLK/SYSCLK#) to the processor. Working State Halt State The Working state is the state in which the processor is executing instructions. When the processor executes the HLT instruction, the processor enters the Halt state and issues a Halt special cycle to the AMD Athlon system bus. The processor only enters the low power state dictated by the CLK_Ctl MSR if the system controller (Northbridge) disconnects the AMD Athlon system bus in response to the Halt special cycle. If STPCLK# is asserted, the processor will exit the Halt state and enter the Stop Grant state. The processor will initiate a system bus connect, if it is disconnected, then issue a Stop Grant special cycle. When STPCLK# is deasserted, the processor will exit the Stop Grant state and re-enter the Halt state. The processor will issue a Halt special cycle when re-entering the Halt state. The Halt state is exited when the processor detects the assertion of INIT#, RESET#, SMI#, or an interrupt via the INTR or NMI pins, or via a local APIC interrupt message. When the Halt state is exited, the processor will initiate an AMD Athlon system bus connect if it is disconnected.

Stop Grant States

The processor enters the Stop Grant state upon recognition of assertion of STPCLK# input. After entering the Stop Grant state, the processor issues a Stop Grant special bus cycle on the AMD Athlon system bus. The processor is not in a low-power state at this time, because the AMD Athlon system bus is still connected. After the Northbridge disconnects the AMD Athlon system bus in response to the Stop Grant special bus cycle, the processor enters a low-power state dictated by the CLK_Ctl MSR. If the Northbridge needs to probe the processor during the Stop Grant state while the system bus is disconnected, it must first connect the system bus. Connecting the system bus Power Management Chapter 4

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places the processor into the higher power probe state. After the Northbridge has completed all probes of the processor, the Northbridge must disconnect the AMD Athlon system bus again so that the processor can return to the low-power state. During the Stop Grant states, the processor latches INIT#, INTR, NMI, SMI#, or a local APIC interrupt message, if they are asserted. The Stop Grant state is exited upon the deassertion of STPCLK# or the assertion of RESET#. When STPCLK# is d e a s s e r t e d , t h e p ro c e s s o r i n i t i a t e s a c o n n e c t o f t h e AMD Athlon system bus if it is disconnected. After the processor enters the Working state, any pending interrupts are recognized and serviced and the processor resumes execution at the instruction boundary where STPCLK# was initially recognized. If RESET# is sampled asserted during the Stop Grant state, the processor exits the Stop Grant state and the reset process begins. There are two mechanisms for asserting STPCLK#hardware and software. The Southbridge can force STPCLK# assertion for throttling to protect the processor from exceeding its maximum case temperature. This is accomplished by asserting the THERM# input to the Southbridge. Throttling asserts STPCLK# for a percentage of a predefined throttling period: STPCLK# is repetitively asserted and deasserted until THERM# is deasserted. Software can force the processor into the Stop Grant state by accessing ACPI-defined registers typically located in the Southbridge. The operating system places the processor into the C2 Stop Grant state by reading the P_LVL2 register in the Southbridge. If an ACPI Thermal Zone is defined for the processor, the operating system can initiate throttling with STPCLK# using the ACPI defined P_CNT register in the Southbridge. The Northbridge connects the AMD Athlon system bus, and the processor enters the Probe state to service cache snoops during Stop Grant for C2 or throttling. In C2, probes are allowed, as shown in Figure 3 on page 9 Chapter 4 Power Management 11

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The Stop Grant state is also entered for the S1, Powered On Suspend, system sleep state based on a write to the SLP_TYP and SLP_EN fields in the ACPI-defined Power Management 1 control register in the Southbridge. During the S1 Sleep state, system software ensures no bus master or probe activity occurs. The Southbridge deasserts STPCLK# and brings the processor out of the S1 Stop Grant state when any enabled resume event occurs. Probe State The Probe state is entered when the Northbridge connects the AMD Athlon system bus to probe the processor (for example, to snoop the processor caches) when the processor is in the Halt or Stop Grant state. When in the Probe state, the processor responds to a probe cycle in the same manner as when it is in the Working state. When the probe has been serviced, the processor returns to the same state as when it entered the Probe state (Halt or Stop Grant state). When probe activity is completed the processor only returns to a low-power state after the Northbridge disconnects the AMD Athlon system bus again.

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4.2

Connect and Disconnect Protocol

Significant power savings of the processor only occur if the proc essor is disconnected from the system bus by the Northbridge while in the Halt or Stop Grant state. The Northbridge can optionally initiate a bus disconnect upon the receipt of a Halt or Stop Grant special cycle. The option of disconnecting is controlled by an enable bit in the Northbridge. If the Northbridge requires the processor to service a probe after the system bus has been disconnected, it must first initiate a system bus connect.

Connect Protocol

In addition to the legacy STPCLK# signal and the Halt and Stop Grant special cycles, the AMD Athlon system bus connect protocol includes the CONNECT, PROCRDY, and CLKFWDRST signals and a Connect special cycle. AMD Athlon system bus disconnects are initiated by the Northbridge in response to the receipt of a Halt or Stop Grant. Reconnect is initiated by the processor in response to an interrupt for Halt or STPCLK# deassertion. Reconnect is initiated by the Northbridge to probe the processor. The Northbridge contains BIOS programmable registers to enable the system bus disconnect in response to Halt and Stop Grant special cycles. When the Northbridge receives the Halt or Stop Grant special cycle from the processor and, if there are no outstanding probes or data movements, the Northbridge deasserts CONNECT a minimum of eight SYSCLK periods after the last command sent to the processor. The processor detects the deassertion of CONNECT on a rising edge of SYSCLK and deasserts PROCRDY to the Northbridge. In return, the Northbridge asserts CLKFWDRST in anticipation of reestablishing a connection at some later point. Note: The Northbridge must disconnect the processor from the AMD Athlon system bus before issuing the Stop Grant special cycle to the PCI bus or passing the Stop Grant special cycle to the Southbridge for systems that connect to the Southbridge with HyperTransport technology. This note applies to current chipset implementation alternate chipset implementations that do not require this are possible.

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Note: In response to Halt special cycles, the Northbridge passes the Halt special cycle to the PCI bus or Southbridge immediately. The processor can receive an interrupt after it sends a Halt special cycle, or STPCLK# deassertion after it sends a Stop Grant special cycle to the Northbridge but before the disconnect actually occurs. In this case, the processor sends the Connect special cycle to the Northbridge, rather than continuing with the disconnect sequence. In response to the Connect special cycle, the Northbridge cancels the disconnect request. The system is required to assert the CONNECT signal before returning the C-bit for the connect special cycle (assuming CONNECT has been deasserted). For more information, see the AMD Athlon and AMD Duron System Bus Specification, order# 21902 for the definition of the C-bit and the Connect special cycle.

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Figure 4 shows STPCLK# assertion resulting in the processor in the St op Gra nt st ate and the A MD A thlon syst em bus disconnected.
STPCLK# AMD Athlon

System Bus
CONNECT PROCRDY CLKFWDRST PCI Bus

Stop Grant

Stop Grant

Figure 4. AMD Athlon System Bus Disconnect Sequence in the Stop Grant State

An example of the AMD Athlon system bus disconnect sequence is as follows: 1. The peripheral controller (Southbridge) asserts STPCLK# to place the processor in the Stop Grant state. 2. When the processor recognizes STPCLK# asserted, it enters the Stop Grant state and then issues a Stop Grant special cycle. 3. When the special cycle is received by the Northbridge, it deasserts CONNECT, assuming no probes are pending, initiating a bus disconnect to the processor. 4. The processor responds to the Northbridge by deasserting PROCRDY. 5. The Northbridge asserts CLKFWDRST to complete the bus disconnect sequence. 6. After the processor is disconnected from the bus, the processor enters a low-power state. The Northbridge passes the Stop Grant special cycle along to the Southbridge.

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Figure 5 shows the signal sequence of events that takes the processor out of the Stop Grant state, connects the processor to the AMD Athlon system bus, and puts the processor into the Working state.
STPCLK# PROCRDY CONNECT CLKFWDRST

Figure 5. Exiting the Stop Grant State and Bus Connect Sequence The following sequence of events removes the processor from the Stop Grant state and connects it to the system bus: 1. The Southbridge deasserts processor of a wake event. STPCLK#, informing the

2. When the processor recognizes STPCLK# deassertion, it exits the low-power state and asserts PROCRDY, notifying the Northbridge to connect to the bus. 3. The Northbridge asserts CONNECT. 4. The Northbridge deasserts CLKFWDRST, synchronizing the forwarded clocks between the processor and the Northbridge. 5. The processor issues a Connect special cycle on the system bus and resumes operating system and application code execution.

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Connect State Diagram

Figure 6 below and Figure 7 on page 18 show the Northbridge and processor connect state diagrams, respectively.
4/A

2/A Disconnect Pending 3/C 5/B 8 Connect

1 Disconnect Requested 3 8

Disconnect 7/D,C

Reconnect Pending

Probe Pending 2

6/C

Probe Pending 1

7/D

Condition 1 A disconnect is requested and probes are still pending. 2 A disconnect is requested and no probes are pending. 3 A Connect special cycle from the processor. 4 No probes are pending. 5 PROCRDY is deasserted. 6 A probe needs service. 7 PROCRDY is asserted. Three SYSCLK periods after CLKFWDRST is deasserted. Although reconnected to the system interface, the 8 Northbridge must not issue any non-NOP SysDC commands for a minimum of four SYSCLK periods after deasserting CLKFWDRST. A

Action Deassert CONNECT eight SYSCLK periods after last SysDC sent.

B Assert CLKFWDRST. C Assert CONNECT. D Deassert CLKFWDRST.

Figure 6. Northbridge Connect State Diagram Chapter 4 Power Management 17

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Connect 6/B 1 2/B Connect Pending 2 5 Connect Pending 1 3/A Disconnect 4/C

Disconnect Pending

Condition 1 2 CONNECT is deasserted by the Northbridge (for a previously sent Halt or Stop Grant special cycle). Processor receives a wake-up event and must cancel the disconnect request.

Action A CLKFWDRST is asserted by the Northbridge. B Issue a Connect special cycle.* C Return internal clocks to full speed and assert PROCRDY.
The Connect special cycle is only issued after a processor wake-up event (interrupt or STPCLK# deassertion) occurs. If the AMD Athlon system bus is connected so the Northbridge can probe the processor, a Connect special cycle is not issued at that time (it is only issued after a subsequent processor wake-up event).

3 Deassert PROCRDY and slow down internal clocks. Processor wake-up event or CONNECT asserted by 4 Northbridge. 5 CLKFWDRST is deasserted by the Northbridge. 6 Forward clocks start three SYSCLK periods after CLKFWDRST is deasserted.

Note: *

Figure 7. Processor Connect State Diagram

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4.3

Clock Control
The processor implements a Clock Control (CLK_Ctl) MSR (address C001_001Bh) that determines the internal clock divisor when the AMD Athlon system bus is disconnected. Refer to the AMD Athlon and AMD Duron Processors BIOS, Software, and Debug Developers Guide, order# 21656, for more details on the CLK_Ctl register.

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AMD Athlon XP Processor Model 6 Data Sheet

CPUID Support
AMD Athlon XP processor model 6 version and feature set recognition can be performed through the use of the CPUID instruction, that provides complete information about the processorvendor, type, name, etc., and its capabilities. Software can make use of this information to accurately tune the system for maximum performance and benefit to users. For information on the use of the CPUID instruction see the following documents:

AMD Processor Recognition Application Note, order# 20734 AMD Athlon and AMD Duron Processors Recognition Application Note Addendum, order# 21922 AMD Athlon and AMD Duron Processors BIOS, Software, and Debug Developers Guide, order# 21656

Chapter 5

CPUID Support

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CPUID Support

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AMD Athlon XP Processor Model 6 Data Sheet

Thermal Design
The AMD Athlon XP processor model 6 provides a diode that can be used in conjunction with an external temperature sensor to determine the die temperature of the processor. The diode anode (THERMDA) and cathode (THERMDC) are available as pins on the processor. Refer to THERMDA and THERMDC Pins on page 73 for more details. For information about thermal design for the AMD Athlon XP processor model 6, including layout and airflow considerations, see the AMD Athlon Processor Thermal, Mechanical, and Chassis Cooling Design Guide, order# 23794, and the cooling guidelines on http://www.amd.com. Table 1 shows the thermal design power specifications for the AMD Athlon XP processor model 6.

Table 1.

Thermal Design Power

Frequency (MHz) 1333 1400 1467 1533 1600 1667 1733 1.75 V Nominal Voltage Maximum Thermal Power* 60.0 W 62.8 W 64.0 W 66.0 W 68.0 W 70.0 W 72.0 W Typical Thermal Power 53.8 W 56.3 W 57.4 W 59.2 W 60.7 W 62.5 W 64.3 W 90C Maximum Die Temperature

Model Number 1500+ 1600+ 1700+ 1800+ 1900+ 2000+ 2100+

Note:

Thermal design power represents the maximum sustained power dissipated while executing publicly-available software or instruction sequences under normal system operation at nominal VCC_CORE. Thermal solutions must monitor the temperature of the processor to prevent the processor from exceeding its maximum die temperature.

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Thermal Design

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7
7.1

Electrical Data
Conventions
The conventions used in this chapter are as follows:

Current specified as being sourced by the processor is negative. Current specified as being sunk by the processor is positive.

7.2

Interface Signal Groupings

The electrical data in this chapter is presented separately for each signal group. Table 2 defines each group and the signals contained in each group.

Table 2.

Interface Signal Groupings

Signals Notes See Absolute Ratings on page 30, Voltage Identification (VID[4:0]) on page 26, VID[4:0] Pins on page 73, on page 27,VCCA Pin on page 73, and COREFB and COREFB# Pins on page 69. See Frequency Identification (FID[3:0]) on page 27 and FID[3:0] Pins on page 70. See Table 9, SYSCLK and SYSCLK# DC Characteristics, on page 32, Table 10, SYSCLK and SYSCLK# AC Characteristics, on page 33, SYSCLK and SYSCLK# on page 73, and PLL Bypass and Test Pins on page 72.

Signal Group

Power

VID[4:0], VCCA, VCC_CORE, COREFB, COREFB#

Frequency

FID[3:0]

System Clocks

SYSCLK, SYSCLK# (Tied to CLKIN/CLKIN# and RSTCLK/RSTCLK#), PLLBYPASSCLK#, PLLBYPASSCLK

SADDIN[14:2]#, SADDOUT[14:2]#, SADDINCLK#, SADDOUTCLK#, See AMD Athlon System Bus AC AMD Athlon SFILLVAL#, SDATAINVAL#, SDATAOUTVAL#, SDATA[63:0]#, and DC Characteristics on page 34, System Bus SDATAINCLK[3:0]#, SDATAOUTCLK[3:0]#, CLKFWDRST, PROCRDY, and CLKFWDRST Pin on page 68. CONNECT

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Table 2.

Interface Signal Groupings (continued)

Signals Notes See General AC and DC Characteristics on page 36, INTR Pin on page 71, NMI Pin on page 72, SMI# Pin on page 72, INIT# Pin on page 71, A20M# Pin on page 68, FERR Pin on page 69,IGNNE# Pin on page 71, SYSCLK and SYSCLK# on page 73, and FLUSH# Pin on page 71. See General AC and DC Characteristics on page 36. See General AC and DC Characteristics on page 36, PLL Bypass and Test Pins on page 72, Scan Pins on page 72, Analog Pin on page 68. See General AC and DC Characteristics on page 36, DBRDY and DBREQ# Pins on page 69, PWROK Pin on page 72. See APIC Pins AC and DC Characteristics on page 41, and APIC Pins, PICCLK, PICD[1:0]# on page 68. Table 14, Thermal Diode Electrical Characteristics, on page 39, and THERMDA and THERMDC Pins on page 73

Signal Group

Southbridge

RESET#, INTR, NMI, SMI#, INIT#, A20M#, FERR, IGNNE#, STPCLK#, FLUSH#

JTAG

TMS, TCK, TRST#, TDI, TDO

Test

PLLBYPASS#, PLLTEST#, PLLMON1, PLLMON2, SCANCLK1, SCANCLK2, SCANSHIFTEN, SCANINTEVAL, ANALOG

Miscellaneous DBREQ#, DBRDY, PWROK

APIC

PICD[1:0]#, PICCLK

Thermal

THERMDA, THERMDC

7.3

Voltage Identification (VID[4:0])

Table 3 shows the VID[4:0] DC characteristics. For more information on VID[4:0] DC characteristics, see VID[4:0] Pins on page 73. Table 3.
Parameter IOL VOH
Note:

VID[4:0] DC Characteristics
Description Output Current Low Output High Voltage Min 16 mA 2.625 V* Max

The VID pins must not be pulled above this voltage by an external pullup resistor.

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7.4

Frequency Identification (FID[3:0])

Table 4 shows the FID[3:0] DC characteristics. For more information, see FID[3:0] Pins on page 70. Table 4.
Parameter IOL VOH
Note:

FID[3:0] DC Characteristics
Description Output Current Low Output High Voltage Min 16 mA 2.625 V * Max

The FID pins must not be pulled above this voltage by an external pullup resistor.

7.5

VCCA AC and DC Characteristics

Table 5 shows the AC and DC characteristics for VCCA. For more information, see VCCA Pin on page 73.

Table 5.
Symbol VVCCA IVCCA
Notes:

VCCA AC and DC Characteristics

Parameter VCCA Pin Voltage VCCA Pin Current Min 2.25 0 Nominal 2.5 Max 2.75 50 Units V mA/GHz Notes 1 2

1. Minimum and Maximum voltages are absolute. No transients below minimum nor above maximum voltages are permitted. 2. Measured at 2.5 V.

7.6

Decoupling
See the AMD Athlon Processor-Based Motherboard Design Guide , order# 24363, or contact your local AMD office for information about the decoupling required on the motherboard for use with the AMD Athlon XP processor model 6.

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7.7

VCC_CORE Characteristics
Table 6 shows the AC and DC characteristics for VCC_CORE. Th e V C C _ C O R E n o m i n a l va l u e i s s h ow n i n Ta b l e 8 , VCC_CORE Voltage and Current, on page 31. For more information, see Figure 8 on page 29.

Table 6.

VCC_CORE AC and DC Characteristics

Parameter Limit in Working State 50 50 150 100 10 5 Units mV mV mV mV

Symbol

VCC_CORE_DC_MAX Maximum static voltage above VCC_CORE_NOM* VCC_CORE_DC_MIN Maximum static voltage below VCC_CORE_NOM* VCC_CORE_AC_MAX Maximum excursion above VCC_CORE_NOM* VCC_CORE_AC_MIN Maximum excursion below VCC_CORE_NOM* tMAX_AC tMIN_AC
Note:
*All voltage measurements are taken differentially

Maximum excursion time for AC transients Negative excursion time for AC transients
at the COREFB/COREFB# pins.

s s

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Figure 8 shows the processor core voltage (VCC_CORE) waveform response to perturbation. The tMIN_AC (negative AC transient excursion time) and tMAX_AC (positive AC transient excursion time) represent the maximum allowable time below or above the DC tolerance thresholds.
tmax_AC VCC_CORE_MAX_AC

VCC_CORE_MAX_DC

VCC_CORE_NOM

VCC_CORE_MIN_DC

VCC_CORE_MIN_AC tmin_AC

ICORE_MAX dI /dt ICORE_MIN

Figure 8. VCC_CORE Voltage Waveform

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7.8

Absolute Ratings
The AMD Athlon XP processor model 6 should not be subjected to conditions exceeding the absolute ratings, as such conditions can adversely affect long-term reliability or result in functional damage. Table 7 lists the maximum absolute ratings of operation for the AMD Athlon XP processor model 6.

Table 7.
VCC_CORE VCCA VPIN TSTORAGE

Absolute Ratings
Description AMD Athlon XP processor model 6 core supply AMD Athlon XP processor model 6 PLL supply Voltage on any signal pin Storage temperature of processor Min 0.5 V 0.5 V 0.5 V 40C Max VCC_CORE Max + 0.5 V VCCA Max + 0.5 V VCC_CORE Max + 0.5 V 100C

Parameter

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7.9

VCC_CORE Voltage and Current

Table 8 shows the voltage and current for the AMD Athlon XP processor model 6 during normal and reduced power states.

Table 8.

VCC_CORE Voltage and Current

Frequency (MHz) Nominal Voltage Die Temperature 1333 1400 1467 1533 1600 1667 1733 1.30 V 50C 1.75 90C ICC (Processor Current) Maximum Typical 30.8 A 32.2 A 32.8 A 33.8 A 34.7 A 35.7 A 36.7 A 0.66 A

Model Number 1500+ 1600+ 1700+ 1800+ 1900+ 2000+ 2100+

34.3 A 35.9 A 36.6 A 37.7 A 38.9 A 40.0 A 41.1 A 1.54 A

Stop Grant S1 or Sleep State1, 2, 3, 4, 5

Notes:

1. The cooling fan can be turned off during the Sleep state, but customers should test their systems in Sleep state to ensure that the system, when using typical parts, has adequate cooling (without the fan during the Sleep state) to meet the temperature specification of the product. 2. See Figure 3, "AMD Athlon XP Processor Model 6 Power Management States" on page 9. 3. The maximum Stop Grant currents are absolute worst case currents for parts that may yield from the worst case corner of the process and are not representative of the typical Stop Grant current that is currently about one-third of the maximum specified current. 4. These currents occur when the AMD Athlon system bus is disconnected and a low power ratio of 1/64 is applied to the core clock grid of the processor as dictated by a value of 6003_D22Fh programmed into the Clock Control (CLK_Ctl) MSR. 5. The Stop Grant current consumption is characterized and not tested.

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7.10

SYSCLK and SYSCLK# AC and DC Characteristics

Table 9 shows the DC characteristics of the SYSCLK and SYSCLK# differential clocks. The SYSCLK signal represents CLKIN and RSTCLK tied together while the SYSCLK# signal represents CLKIN# and RSTCLK# tied together.

Table 9.
Symbol

SYSCLK and SYSCLK# DC Characteristics

Description Min 400 450 250 250 VCC_CORE/2 100 4 12 Max Units mV mV A A mV pF

VThreshold-DC Crossing before transition is detected (DC) VThreshold-AC Crossing before transition is detected (AC) ILEAK_P ILEAK_N VCROSS CPIN
Note:

Leakage current through P-channel pullup to VCC_CORE Leakage current through N-channel pulldown to VSS (Ground) Differential signal crossover Capacitance *

The following processor inputs have twice the listed capacitance because they connect to two input padsSYSCLK and SYSCLK#. SYSCLK connects to CLKIN/RSTCLK. SYSCLK# connects to CLKIN#/RSTCLK#.

Figure 9 shows the DC characteristics of the SYSCLK and SYSCLK# signals.

VCROSS

VThreshold-DC = 400mV

VThreshold-AC = 450mV

Figure 9. SYSCLK and SYSCLK# Differential Clock Signals

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Table 10 shows the SYSCLK/SYSCLK# differential clock AC characteristics of the AMD Athlon XP processor model 6.

Table 10. SYSCLK and SYSCLK# AC Characteristics

Symbol Parameter Description Clock Frequency Duty Cycle t1 t2 t3 t4 t5
Notes:

Minimum 50 30% 7.5 1.05 1.05

Maximum 133 70%

Units MHz

Notes

Period High Time Low Time Fall Time Rise Time Period Stability

ns ns ns 2 2 ns ns ps

1, 2

300

1. Circuitry driving the AMD Athlon system bus clock inputs must exhibit a suitably low closed-loop jitter bandwidth to allow the PLL to track the jitter. The 20dB attenuation point, as measured into a 10- or 20-pF load must be less than 500 kHz. 2. Circuitry driving the AMD Athlon system bus clock inputs may purposely alter the AMD Athlon system bus clock frequency (spread spectrum clock generators). In no cases can the AMD Athlon system bus period violate the minimum specification above. AMD Athlon system bus clock inputs can vary from 100% of the specified frequency to 99% of the specified frequency at a maximum rate of 100 kHz.

Figure 10 shows a sample waveform of the SYSCLK signal.

t2

VCROSS

VThreshold-AC

t3

t5 t1

t4

Figure 10. SYSCLK Waveform

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7.11

AMD Athlon System Bus AC and DC Characteristics

Table 11 shows the DC characteristics of the AMD Athlon system bus used by the AMD Athlon XP processor model 6.

Table 11. AMD Athlon System Bus DC Characteristics

Symbol VREF Parameter DC Input Reference Voltage VIN = VREF Nominal VIN = VREF Nominal VREF + 200 500 IOUT = 200 A IOUT = 1 mA VIN = VSS (Ground) VIN = VCC_CORE Nominal 4 0.85 VCC_CORE 500 1 1 12 Condition Min Max Units Notes mV 1 (0.5*VCC_CORE) (0.5*VCC_CORE) 50 +50 100 100 VCC_CORE + 500 VREF 200 VCC_CORE+500 400

IVREF_LEAK_P VREF Tristate Leakage Pullup IVREF_LEAK_N VREF Tristate Leakage Pulldown VIH VIL VOH VOL ILEAK_P ILEAK_N CIN
Notes:

A A
mV mV mV mV mA mA pF 2 2

Input High Voltage Input Low Voltage Output High Voltage Output Low Voltage Tristate Leakage Pullup Tristate Leakage Pulldown Input Pin Capacitance

1. VREF is nominally set to 50% of VCC_CORE with actual values that are specific to motherboard design implementation. VREF must be created with a sufficiently accurate DC source and a sufficiently quiet AC response to adhere to the 50 mV specification listed above. 2. Specified at the T DI E an d V C C _ C O R E s pe ci f i ca ti o ns i n t hi s do cu m e n t.

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The AC characteristics of the AMD Athlon system bus are shown in Table 12. The parameters are grouped based on the source or destination of the signals involved. Table 12. AMD Athlon System Bus AC Characteristics
Group All Signals TRISE TFALL TSKEW-SAMEEDGE TSKEW-DIFFEDGE Forward Clocks TSU THD CIN COUT TVAL Sync
Notes:

Symbol

Parameter Output Rise Slew Rate Output Fall Slew Rate Output skew with respect to the same clock edge Output skew with respect to a different clock edge Input Data Setup Time Input Data Hold Time Capacitance on input Clocks Capacitance on output Clocks RSTCLK to Output Valid Setup to RSTCLK Hold from RSTCLK

Min 1 1 300 300 4 4 250 500 1000

Max 3 3 385 770

Units V/ns V/ns ps ps ps ps

Notes 1 1 2 2 3 3

12 12 2000

pF pF ps ps ps 4, 5 4, 6 4, 6

TSU THD

1. Rise and fall time ranges are guidelines over which the I/O has been characterized. 2. TSKEW-SAMEEDGE is the maximum skew within a clock forwarded group between any two signals or between any signal and its forward clock, as measured at the package, with respect to the same clock edge. TSKEW-DIFFEDGE is the maximum skew within a clock forwarded group between any two signals or between any signal and its forward clock, as measured at the package, with respect to different clock edges. 3. Input SU and HD times are with respect to the appropriate Clock Forward Group input clock. 4. The synchronous signals include PROCRDY, CONNECT, and CLKFWDRST. 5. T VAL is RSTCLK rising edge to output valid for PROCRDY. Test Load is 25 pF. 6. TSU is setup of CONNECT/CLKFWDRST to rising edge of RSTCLK. THD is hold of CONNECT/CLKFWDRST from rising edge of RSTCLK.

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7.12

General AC and DC Characteristics

Table 13 shows the AMD Athlon XP processor model 6 AC and DC characteristics of the Southbridge, JTAG, test, and miscellaneous pins.

Table 13. General AC and DC Characteristics

Symbol VIH VIL VOH VOL ILEAK_P ILEAK_N IOH IOL TSU THD TDELAY
Notes:

Parameter Description Input High Voltage Input Low Voltage Output High Voltage Output Low Voltage Tristate Leakage Pullup Tristate Leakage Pulldown Output High Current Output Low Current Sync Input Setup Time Sync Input Hold Time Output Delay with respect to RSTCLK

Condition

Min (VCC_CORE/2) + 200 mV 300 VCC_CORE 400 300

Max VCC_CORE + 300 mV 350 VCC_CORE + 300 400

Units V mV mV mV mA

Notes 1, 2 1, 2

VIN = VSS (Ground) VIN = VCC_CORE Nominal

1 600 16 16 2.0 0.0 0.0 6.1

A
mA mA ns ps ns 3 3 4, 5 4, 5 5

Characterized across DC supply voltage range. Values specified at nominal VCC_CORE. Scale parameters between VCC_CORE minimum and VCC_CORE maximum. IOL and IOH are measured at VOL max and VOH min, respectively. Synchronous inputs/outputs are specified with respect to RSTCLK and RSTCK# at the pins. These are aggregate numbers. Edge rates indicate the range over which inputs were characterized. In asynchronous operation, the signal must persist for this time to enable capture. This value assumes RSTCLK period is 10 ns ==> TBIT = 2*fRST. The approximate value for standard case in normal mode operation. This value is dependent on RSTCLK frequency, divisors, Low Power mode, and core frequency. Reassertions of the signal within this time are not guaranteed to be seen by the core. This value assumes that the skew between RSTCLK and K7CLKOUT is much less than one phase. This value assumes RSTCLK and K7CLKOUT are running at the same frequency, though the processor is capable of other configurations. 14. Time to valid is for any open drain pins. See requirements 7 and 8 in Chapter 8, Power-Up Timing Requirements, for more information.

1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13.

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AMD Athlon XP Processor Model 6 Data Sheet

Table 13. General AC and DC Characteristics (continued)

Symbol TBIT TRPT TRISE TFALL CPIN T VALID
Notes:

Parameter Description Input Time to Acquire Input Time to Reacquire Signal Rise Time Signal Fall Time Pin Capacitance Time to data valid

Condition

Min 20.0 40.0 1.0 1.0 4

Max

Units ns ns

Notes 7, 8 913 6 6

3.0 3.0 12 100

V/ns V/ns pF ns

14

Characterized across DC supply voltage range. Values specified at nominal VCC_CORE. Scale parameters between VCC_CORE minimum and VCC_CORE maximum. IOL and IOH are measured at VOL max and VOH min, respectively. Synchronous inputs/outputs are specified with respect to RSTCLK and RSTCK# at the pins. These are aggregate numbers. Edge rates indicate the range over which inputs were characterized. In asynchronous operation, the signal must persist for this time to enable capture. This value assumes RSTCLK period is 10 ns ==> TBIT = 2*fRST. The approximate value for standard case in normal mode operation. This value is dependent on RSTCLK frequency, divisors, Low Power mode, and core frequency. Reassertions of the signal within this time are not guaranteed to be seen by the core. This value assumes that the skew between RSTCLK and K7CLKOUT is much less than one phase. This value assumes RSTCLK and K7CLKOUT are running at the same frequency, though the processor is capable of other configurations. 14. Time to valid is for any open drain pins. See requirements 7 and 8 in Chapter 8, Power-Up Timing Requirements, for more information.

1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13.

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7.13

Open Drain Test Circuit

Figure 11 is a test circuit that may be used on Automated Test Equipment (ATE) to test for validity on open drain pins. Refer to Table 13, General AC and DC Characteristics, on page 36 for timing requirements.

VTermination1 50 3% Open Drain Pin IOL = Output Current2

Notes: 1. VTermination = 1.2 V for VID and FID pins VTermination = 1.0 V for APIC pins 2. IOL = 16 mA for VID and FID pins IOL = 12 mA for APIC pins Figure 11. General ATE Open Drain Test Circuit

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AMD Athlon XP Processor Model 6 Data Sheet

7.14

Thermal Diode Characteristics

Thermal Diode Electrical Characteristics. Table 14 shows the AMD Athlon XP processor model 6 electrical characteristics of the on-die thermal diode. Table 14. Thermal Diode Electrical Characteristics
Symbol Ifw n
Notes:

Parameter Description Forward bias current Diode ideality factor

Min 5 1.002

Nom 1.008

Max 300 1.016

Units A

Notes 1 2, 3, 4, 5

1. 2. 3. 4.

The sourcing current should always be used in forward bias only. Characterized at 95C with a forward bias current pair of 10 A and 100 A. Not 100% tested. Specified by design and limited characterization. The diode ideality factor, n, is a correction factor to the ideal diode equation. For the following equations, use the following variables and constants: n Diode ideality factor k Boltzmann constant q Electron charge constant T Diode temperature (Kelvin) VBE Voltage from base to emitter Collector current IC Saturation current IS N Ratio of collector currents The equation for VBE is:
I C nkT - ln ---V BE = ------- IS q

By sourcing two currents and using the above equation, a difference in base emitter voltage can be found that leads to the following equation for temperature:
V BE T = ---------------------------k n ln ( N ) -q

5. If a different sourcing current pair is used other than 10 A and 100 A, the following equation should be used to correct the temperature. Subtract this offset from the temperature measured by the temperature sensor. For the following equations, use the following variables and constants: Ihigh High sourcing current Ilow Low sourcing current Toffset (in C) can be found using the following equation:
( I high I low ) 4 - 2.34 T offset = ( 6.0 10 ) ------------------------------I high ---------ln I low

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Preliminary Information AMD Athlon XP Processor Model 6 Data Sheet

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Thermal Protection Characterization. The following section describes parameters relating to thermal protection. The implementation of thermal control circuitry to control processor temperature is left to the manufacturer to determine how to implement. Thermal limits in motherboard design are necessary to protect the processor from thermal damage. T S HU TD OW N is the temperature for thermal protection circuitry to initiate shutdown of the processor. T SD_DELAY is the maximum time allowed from the detection of the over-temperature condition to processor shutdown to prevent thermal damage to the processor. Systems that do not implement thermal protection circuitry or that do not react within the time specified by TSD_DELAY can cause thermal damage to the processor during the unlikely events of fan failure or powering up the processor without a heat-sink. The processor relies on thermal circuitry on the motherboard to turn off the regulated core voltage to the processor in response to a thermal shutdown event. Thermal protection circuitry reference designs and thermal solution guidelines are found in the following documents:

AMD Athlon Processor-Based Motherboard Design Guide, order# 24363 Thermal Diode Monitoring Circuits, order# 25658 AMD Thermal, Mechanical, and Chassis Cooling Design Guide, order# 23794 http://www1.amd.com/products/athlon/thermals

Table 15 on page 41 shows the T SHUTDOWN and T SD_DELAY specifications for circuitry in motherboard design necessary for thermal protection of the processor.

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AMD Athlon XP Processor Model 6 Data Sheet

Table 15. Guidelines for Platform Thermal Protection of the Processor

Symbol TSD_DELAY
Notes:

Parameter Description Maximum allowed time from TSHUTDOWN detection to processor shutdown

Max 125 500

Units

Notes 1, 2, 3 1, 3

TSHUTDOWN Thermal diode shutdown temperature for processor protection

C
ms

1. The thermal diode is not 100% tested, it is specified by design and limited characterization. 2. The thermal diode is capable of responding to thermal events of 40C/s or faster. 3. The AMD Athlon XP processor model 6 provides a thermal diode for measuring die temperature of the processor. The processor relies on thermal circuitry on the motherboard to turn off the regulated core voltage to the processor in response to a thermal shutdown event. Refer to Thermal Diode Monitoring Circuits, order# 25658, for thermal protection circuitry designs.

7.15

APIC Pins AC and DC Characteristics

Table 16 shows the AMD Athlon XP processor model 6 AC and DC characteristics of the APIC pins.

Table 16. APIC Pin AC and DC Characteristics

Symbol VIH VIL VOH VOL ILEAK_P ILEAK_N IOL TRISE TFALL CPIN
Notes:

Parameter Description Input High Voltage Input Low Voltage Output High Voltage Output Low Voltage Tristate Leakage Pullup Tristate Leakage Pulldown Output Low Current Signal Rise Time Signal Fall Time Pin Capacitance

Condition

Min 1.7 300

Max 2.625 700 2.625

Units V mV V mV mA

Notes 1, 2 1 2

300 VIN = VSS (Ground) VIN = 2.5 V VOL Max 12 1.0 1.0 4 1

400

mA mA

3.0 3.0 12

V/ns V/ns pF

3 3

1. Characterized across DC supply voltage range. 2. The 2.625 V value is equal to 2.5 V plus a maximum of five percent. 3. Edge rates indicate the range for characterizing the inputs.

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Preliminary Information AMD Athlon XP Processor Model 6 Data Sheet

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AMD Athlon XP Processor Model 6 Data Sheet

Signal and Power-Up Requirements

The AMD Athlon XP processor model 6 is designed to provide functional operation if the voltage and temperature parameters are within the limits of normal operating ranges.

8.1

Power-Up Requirements
Figure 12 shows the relationship between key signals in the system during a power-up sequence. This figure details the requirements of the processor.

Signal Sequence and Timing Description

3.3 V Supply VCCA (2.5 V) (for PLL) VCC_CORE (Processor Core) RESET# 1 2 Warm reset condition

NB_RESET#

5 PWROK FID[3:0] 3 System Clock 7 8

Figure 12. Signal Relationship Requirements During Power-Up Sequence Note: 1. Figure 12 represents several signals generically by using names not necessarily consistent with any pin lists or schematics.

2. Requirements 18 in Figure 12 are described in Power-Up Timing Requirements on page 44.

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Preliminary Information AMD Athlon XP Processor Model 6 Data Sheet

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Power-Up Timing Requirements. The signal timing requirements are as follows: 1. RESET# must be asserted before PWROK is asserted. The AMD Athlon XP processor model 6 does not set the correct clock multiplier if PWROK is asserted prior to a RESET# assertion. It is recommended that RESET# be asserted at least 10 nanoseconds prior to the assertion of PWROK. In practice, a Southbridge asserts RESET# milliseconds before PWROK is asserted. 2. All motherboard voltage planes must be within specification before PWROK is asserted. PWROK is an output of the voltage regulation circuit on the motherboard. PWROK indicates that VCC_CORE and all other voltage planes in the system are within specification. The motherboard is required to delay PWROK assertion for a minimum of three milliseconds from the 3.3 V supply being within specification. This delay ensures that the system clock (SYSCLK/SYSCLK#) is operating within specification when PWROK is asserted. The processor core voltage, VCC_CORE, must be within specification as dictated by the VID[4:0] pins driven by the processor before PWROK is asserted. Before PWROK assertion, the AMD Athlon processor is clocked by a ring oscillator. The processor PLL is powered by VCCA. The processor PLL does not lock if VCCA is not high enough for the processor logic to switch for some period before PWROK is asserted. VCCA must be within specification at least five microseconds before PWROK is asserted. In practice VCCA, VCC_CORE, and all other voltage planes must be within specification for several milliseconds before PWROK is asserted. After PWROK is asserted, the processor PLL locks to its operational frequency. 3. The system clock (SYSCLK/SYSCLK#) must be running before PWROK is asserted. When PWROK is asserted, the processor switches from driving the internal processor clock grid from the ring oscillator to driving from the PLL. The reference system 44 Signal and Power-Up Requirements Chapter 8

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24309EMarch 2002

AMD Athlon XP Processor Model 6 Data Sheet

clock must be valid at this time. The system clocks are designed to be running after 3.3 V has been within specification for three milliseconds. 4. PWROK assertion to deassertion of RESET# The duration of RESET# assertion during cold boots is intended to satisfy the time it takes for the PLL to lock with a less than 1 ns phase error. The processor PLL begins to run after PWROK is asserted and the internal clock grid is switched from the ring oscillator to the PLL. The PLL lock time may take from hundreds of nanoseconds to tens of microseconds. It is recommended that the minimum time between PWROK assertion to the deassertion of RESET# be at least 1.0 milliseconds. Southbridges enforce a delay of 1.5 to 2.0 milliseconds between PWRGD (Southbridge version of PWROK) assertion and NB_RESET# deassertion. 5. PWROK must be monotonic and meet the timing requirements as defined in Table 13, General AC and DC Characteristics, on page 36. The processor should not switch between the ring oscillator and the PLL after the initial assertion of PWROK. 6. NB_RESET# must be asserted (causing CONNECT to also assert) before RESET# is deasserted. In practice all Southbridges enforce this requirement. If NB_RESET# does not assert until after RESET# has deasserted, the processor misinterprets the CONNECT assertion (due to NB_RESET# being asserted) as the beginning of the SIP transfer. There must be sufficient overlap in the resets to ensure that CONNECT is sampled asserted by the processor before RESET# is deasserted. 7. The FID[3:0] signals are valid within 100 ns after PWROK is asserted. The chipset must not sample the FID[3:0] signals until they become valid. Refer to the AMD Athlon Processor-Based Motherboard Design Guide, order# 24363, for the specific implementation and additional circuitry required. 8. The FID[3:0] signals become valid within 100 ns after RESET# is asserted. Refer to the AMD Athlon ProcessorBased Motherboard Design Guide, order# 24363, for the specific implementation and additional circuitry required.

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Clock Multiplier Selection (FID[3:0])

The chipset samples the FID[3:0] signals in a chipset-specific manner from the processor and uses this information to determine the correct Serial Initialization Packet (SIP). The chipset then sends the SIP information to the processor for configuration of the AMD Athlon system bus for the clock multiplier that determines the processor frequency indicated by the FID[3:0] code. The SIP is sent to the processor using the SIP protocol. This protocol uses the PROCRDY, CONNECT, and CLKFWDRST signals, that are synchronous to SYSCLK. For more information about FID[3:0], see FID[3:0] Pins on page 70. Serial Initialization Packet (SIP) Protocol. Refer to AMD Athlon and AMD Duron System Bus Specification, order# 21902 for details of the SIP protocol.

8.2

Processor Warm Reset Requirements

RESET# cannot be asserted to the processor without also being asserted to the Northbridge. RESET# to the Northbridge is the same as PCI RESET#. The minimum assertion for PCI RESET# is one millisecond. Southbridges enforce a minimum assertion of RESET# for the processor, Northbridge, and PCI of 1.5 to 2.0 milliseconds.

Northbridge Reset Pins

46

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AMD Athlon XP Processor Model 6 Data Sheet

9
9.1

Mechanical Data
Introduction
The AMD Athlon XP processor model 6 connects to the motherboard through a Pin Grid Array (PGA) socket named Socket A. This processor utilizes the Organic Pin Grid Array ( O P G A ) p a ck a g e t y p e d e s c r i b e d i n O P G A Pa ck a g e Description on page 48. For more information, see the AMD Athlon Processor-Based Motherboard Design Guide, order# 24363.

9.2

Die Loading
The processor die on the OPGA package is exposed at the top of the package. This feature facilitates heat transfer from the die to an approved heat sink. It is critical that the mechanical loading of the heat sink does not exceed the limits shown in Table 17. Any heat sink design should avoid loads on corners and edges of die. The OPGA package has compliant pads that serve to bring surfaces in planar contact. Tool-assisted zero insertion force sockets should be designed so that no load is placed on the ceramic substrate of the package. Table 17 shows the mechanical loading specifications for the processor die. Table 17. Mechanical Loading
Location Die Surface Die Edge
Notes:

Dynamic (MAX) 100 10

Static (MAX) 30 10

Units lbf lbf

Note 1 2

1. Load specified for coplanar contact to die surface. 2. Load defined for a surface at no more than a two degree angle of inclination to die surface.

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9.3

OPGA Package Description

Figure 13 on page 49 shows a diagram and notes for the AMD Athlon XP processor model 6 OPGA package. Table 18 provides the dimensions in millimeters assigned to the letters and symbols shown in the Figure 13 diagram. Table 18. Dimensions for the AMD Athlon XP Processor Model 6 OPGA Package
Letter or Symbol D/E D1/E1 D2 D3 D4 D5 D6 D7 D8 E2 E3 E4 E5 E8 E9
Note:

Minimum Maximum Dimension* Dimension* 49.27 49.78 45.72 BSC 11.698 REF 3.30 6.40 6.40 3.35 7.48 3.05 11.01 REF 2.35 7.90 3.29 7.94 1.66 2.65 8.45 3.84 8.49 1.96 3.60 6.95 6.95 3.90 8.03 3.35

Letter or Symbol G/H A A1 A2 A3 A4

Minimum Maximum Dimension* Dimension* 1.942 REF 1.00 0.80 0.116 0.43 1.40 REF 1.435 3.05 37 453 1.27 BSC 2.54 BSC 2.375 3.31 1.20 0.88 1.90 6.60 0.50 4.50

P b b1
S L M N e e1

*Dimensions are given in millimeters.

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AMD Athlon XP Processor Model 6 Data Sheet

Figure 13. AMD Athlon XP Processor Model 6 OPGA Package

Chapter 9

Mechanical Data

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Preliminary Information AMD Athlon XP Processor Model 6 Data Sheet

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50

Mechanical Data

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AMD Athlon XP Processor Model 6 Data Sheet

10
10.1

Pin Descriptions
Pin Diagram and Pin Name Abbreviations
Figure 14 on page 52 shows the staggered Pin Grid Array (PGA) for the AMD Athlon XP processor model 6. Because some of the pin names are too long t o fit in the g rid, they are abbreviated. Figure 15 on page 53 shows the bottomside view of the array. Table 19 on page 54 lists all the pins in alphabetical order by pin name, along with the abbreviation where necessary.

Chapter 10

Pin Descriptions

51

52
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37

A
SAO#3 VCC SAO#2 VCC SAO#6 NC KEY NC VID[4] NC VID[3] VCC KEY VSS KEY VCC THDA VSS THDC VCC NC VSS KEY VCC KEY VSS NC NC NC NC KEY NC NC NC NC NC NC
6 7 8 9 10 11

SAO#12 VSS SD#54 VSS SD#52 VSS KEY NC NC NC NC VSS NC VCC NC VSS NC VCC NC VSS NC VCC NC VSS NC VCC NC NC NC NC KEY VCC NC VCC NC VCC NC NC
12

SAO#5 VCC SDOC#3 VCC SD#50 VCC NC NC SD#19 VCC SD#26 VSS SD#25 VCC SD#24 VSS SD#7 VCC SD#5 VSS SDIC#0 VCC NC VSS SD#8 VCC SD#10 VSS SAI#5 VCC KEY VSS NC VCC PLMN2 VSS PLMN1
13 14

SD#55 VSS NC VSS SD#49 VSS NC VCC VSS VCC VSS VCC VSS VCC VSS NC NC NC VSS SDIC#1 VCC NC VSS SD#27 VCC SD#17 VSS SD#15 VCC SD#4 VSS SD#2 VCC SD#3 VSS SD#0 VCC SD#14 VSS SDOC#0 VSS NC VCC NC VSS PLBYC# VCC PLBYC
15 16

SD#61 VCC SD#51 VCC SDIC#3 VCC KEY KEY NC NC KEY KEY NC NC NC SD#20 VSS VCC VSS VCC VSS VCC NC VCC VCC SD#23 VSS SD#29 VCC SD#28 VSS SD#18 VCC SD#16 VSS SD#6 VCC NC VSS SD#1 VCC SD#12 VSS SD#13 VCC SD#11 VSS SD#9 VCC NC VSS NC VCC CLKIN# VSS CLKIN
17 18

SD#53 VSS SD#60 VSS SD#48 SD#58 SD#36 SD#46 NC SDIC#2 SD#33 SD#32 NC SD#31 VCC SD#21 VCC VSS VCC VSS VCC VSS VCC VSS VSS SD#22 SD#59 SD#56 SD#37 SD#47 SD#38 SD#45 SD#43 SD#42 SD#41 SDOC#1 VCC VSS VCC VSS VCC VSS VCC VSS VCC

SD#63

SD#62

NC

SD#57

SD#39

SD#35

SD#34

SD#44

NC

SDOC#2

SD#40

SD#30

A B C D E F G H J K L M N P Q R S T U V W X Y Z AA AB AC AD AE

VSS

VCC

VSS

SAO#7

SAO#9

SAO#8

VCC

VCC

VSS

SAO#11

SAOC#

SAO#4

VSS

VSS

VSS

SAO#10

SAO#14

SAO#13

VCC

VCC

SAO#0

SAO#1

NC

VSS

VSS

VSS

VID[0]

VID[1]

VID[2]

VCC

VCC

VCC

PICCLK

PICD#0

PICD#1

VSS

VSS

VSS

TCK

TMS

SCNSN

VCC

VCC

VCC

AMD Athlon XP Processor Model 6 Data Sheet

SCNCK1

SCNINV

SCNCK2

VSS

VSS

VSS

TDI

TRST#

TDO

VCC

VCC

VCC

FID[0]

FID[1]

VREF_S

AMD Athlon XP Processor Model 6 Topside View

Preliminary Information

Pin Descriptions
NC COREFB VSS NC VSS NC ANLOG VCC COREFB# KEY VSS VCC VSS VSS NC VCC CLKFR VSS RCLK# VCC RCLK
19 20

VSS

VSS

VSS

FID[2]

FID[3]

NC

VCC

VCC

VCC

AA

DBRDY

DBREQ#

NC

AB

VSS

VSS

VSS

AC

STPC#

PLTST#

ZN

AD

VCC

VCC

VCC

AE

A20M#

PWROK

ZP

AF

VSS

VSS

VCC NC VSS VCCA VCC K7CO VSS K7CO#

21 22

NC KEY VCC PLBYP# VSS CNNCT VCC PRCRDY

23 24

NC KEY VSS NC VCC NC VSS NC

25 26

NC NC NC SAI#0 VSS NC VCC NC

27 28

VCC SAI#2 VSS SFILLV# VCC SAI#1 VSS SAI#12

29 30

VCC SAI#11 VSS SAIC# VSS SDOV# VCC SAI#14

31 32

AF
SAI#7 VSS SAI#6 VCC SAI#8 VSS SDINV#
33 34

AG

FERR

RESET#

NC

AG AH
SAI#3 VCC SAI#4 VCC SAI#13
35 36

AH

VCC

VCC

AMD

AJ

IGNNE#

INIT#

VCC

AJ AK
SAI#10 VSS SAI#9
37

AK

VSS

VSS

CPR#

AL

INTR

FLUSH#

VCC

AL AM AN

AM

VCC

VSS

VSS

AN

NMI

SMI#

24309EMarch 2002

Chapter 10

Figure 14. AMD Athlon XP Processor Model 6 Pin DiagramTopside View

AA

AB

AC

AD

AE

AF

AG

AH

AJ

AK

AL

AM

AN

1
SAO#10 VCC SAO#14 VCC SAO#13 NC KEY NC KEY NC NC VCC NC VSS KEY VCC KEY VSS NC VCC NC VSS KEY VCC KEY VSS NC NC NC NC NC NC SD#20 VSS SD#23 VSS SD#21
G H J K L M

SAO#7 VSS SAO#1 VSS NC VSS VID[4] NC KEY NC COREFB VSS COREFB# VCC KEY VSS KEY VCC NC VSS NC VCC NC VSS NC VCC KEY NC KEY NC NC VCC SD#19 VCC SDIC#1 VCC SD#29 SD#28 VSS SD#18
N P

SAO#11 VCC VID[1] VCC VID[2] VCC VID[3] VCC NC VCC NC VSS ANLOG VCC NC VSS NC VCC NC VSS CLKFR VCC VCCA VSS PLBYP# VCC NC VSS SAI#0 VSS NC VCC SD#7 VSS SD#17 VCC SD#16
Q R

SAO#0 VSS PICD#0 VSS PICD#1 VSS KEY VSS VCC VSS VCC VSS VCC VSS NC NC NC NC NC VCC NC VSS PLMN2 VCC PLBYC# VSS CLKIN# VCC RCLK# VSS K7CO VCC CNNCT VSS NC VCC NC VSS SAI#1 VCC NC VSS SD#5 VCC SD#15 VSS SD#6
S T

VID[0] VCC TMS VCC SCNSN VCC KEY THDA THDC NC KEY KEY NC NC KEY NC VSS VCC VSS VCC VSS VCC NC AMD CPR# NC NC NC VCC NC VSS PLMN1 VCC PLBYC VSS CLKIN VCC RCLK VSS K7CO# VCC PRCRDY VSS NC VCC NC VSS SAI#12 VSS NC VCC SDIC#0 VSS SD#4 VCC NC
U V

PICCLK VSS SCNINV VSS SCNCK2 TDO VREF_S NC NC ZN ZP NC VCC VCC VSS NC VCC VSS VCC VSS VCC VSS VCC VSS VSS SMI# TRST# FID[1] FID[3] DBREQ# PLTST# PWROK RESET# INIT# FLUSH# NMI VCC VSS VCC VSS VCC VSS VCC VSS VCC

TCK

SCNCK1

TDI

FID[0]

FID[2]

DBRDY

STPC#

A20M#

FERR

IGNNE#

INTR

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29

VSS

VCC

VSS

Chapter 10

SAO#12

SAO#9

SAOC#

VCC

VCC

VSS

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SAO#5

SAO#8

SAO#4

VSS

VSS

VSS

SAO#3

SAO#2

SAO#6

VCC

VCC

NC

SD#55

SD#54

SD#52

10

VSS

VSS

VSS

11

SD#61

SDOC#3

SD#50

12

VCC

VCC

VCC

13

SD#53

NC

SD#49

14

VSS

VSS

VSS

15

SD#63

SD#51

SDIC#3

16

VCC

VCC

VCC

17

SD#62

SD#60

SD#48

18

VSS

VSS

VSS

19

NC

SD#59

SD#58

20

VCC

VCC

VCC

21

SD#57

SD#56

SD#36

AMD Athlon XP Processor Model 6 Bottomside View

Preliminary Information

Pin Descriptions
VSS NC VSS SD#26 VSS NC SD#27 VCC SD#25 SD#24 VCC VSS NC NC NC VCC VSS VCC VCC NC VSS NC VCC SD#2 VSS SD#1
W X

22

VSS

VSS

VSS

23

SD#39

SD#37

SD#46

24

VCC

VCC

VCC

25

SD#35

SD#47

NC

26

VSS

VSS

VSS

27

SD#34

SD#38

SDIC#2

28

VCC

VCC

VCC

29

SD#44

SD#45

SD#33

30

VSS

VSS

NC

NC NC VCC SD#8 VSS SD#3 VCC SD#12

Y Z

NC NC VSS SD#10 VCC SD#0 VSS SD#13

AA AB

NC NC NC SAI#5 VSS SD#14 VCC SD#11

AC AD

VCC SFILLV# VSS SAI#2 VCC SDOC#0 VSS SD#9

AE AF

VCC SDOV# VSS SAIC# VSS SAI#11 VCC SAI#7

AG AH

30
SAI#14 VSS SAI#8 VCC SAI#6 VSS SAI#3
AJ AK

31

NC

SD#43

SD#32

31 32
SDINV# VCC SAI#4 VCC SAI#10
AL AM

32

VCC

VCC

VCC

33

SDOC#2

SD#42

NC

33 34
SAI#13 VSS SAI#9
AN

34

VSS

VSS

VCC

35

SD#40

SD#41

SD#31

35 36 37

36

VCC

VSS

VCC

37

SD#30

SDOC#1

SD#22

AMD Athlon XP Processor Model 6 Data Sheet

53

Figure 15. AMD Athlon XP Processor Model 6 Pin DiagramBottomside View

Preliminary Information AMD Athlon XP Processor Model 6 Data Sheet

24309EMarch 2002

Table 19. Pin Name Abbreviations

Abbreviation Full Name A20M# AMD ANALOG CLKFWDRST CLKIN CLKIN# CONNECT COREFB COREFB# CPU_PRESENCE# DBRDY DBREQ# FERR FID[0] FID[1] FID[2] FID[3] FLUSH# IGNNE# INIT# INTR K7CLKOUT K7CLKOUT# KEY KEY KEY KEY KEY KEY KEY KEY KEY KEY KEY KEY KEY KEY KEY KEY Pin AE1 AH6 AJ13 AJ21 AN17 AL17 AL23 AG11 AG13 AK6 AA1 AA3 AG1 W1 W3 Y1 Y3 AL3 AJ1 AJ3 AL1 AL21 AN21 G7 G9 G15 G17 G23 G25 N7 Q7 Y7 AA7 AG7 AG9 AG15 AG17 AG27 AG29

Table 19. Pin Name Abbreviations (continued)

Abbreviation NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC Full Name Pin A19 A31 C13 E25 E33 F8 F30 G11 G13 G19 G21 G27 G29 G31 H6 H8 H10 H28 H30 H32 J5 J31 K8 K30 L31 L35 N31 Q31 S31 U31 U37 W7 W31 Y5 Y31 Y33 AA5 AA31 AC7

ANLOG CLKFR

CNNCT

CPR#

K7CO K7CO#

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Table 19. Pin Name Abbreviations (continued)

Abbreviation NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NMI Full Name Pin AC31 AD8 AD30 AE7 AE31 AF6 AF8 AF10 AF28 AF30 AF32 AG5 AG19 AG21 AG23 AG25 AG31 AH8 AH30 AJ7 AJ9 AJ11 AJ15 AJ17 AJ19 AJ27 AK8 AL7 AL9 AL11 AL25 AL27 AM8 AN7 AN9 AN11 AN25 AN27 AN3

Table 19. Pin Name Abbreviations (continued)

Abbreviation PICD#0 PICD#1 PLBYP# PLBYC PLBYC# PLMN1 PLMN2 PLTST# PRCRDY Full Name PICCLK PICD[0]# PICD[1]# PLLBYPASS# PLLBYPASSCLK PLLBYPASSCLK# PLLMON1 PLLMON2 PLLTEST# PROCREADY PWROK RESET# RSTCLK RSTCLK# SADDIN[0]# SADDIN[1]# SADDIN[2]# SADDIN[3]# SADDIN[4]# SADDIN[5]# SADDIN[6]# SADDIN[7]# SADDIN[8]# SADDIN[9]# SADDIN[10]# SADDIN[11]# SADDIN[12]# SADDIN[13]# SADDIN[14]# SADDINCLK# SADDOUT[0]# SADDOUT[1]# SADDOUT[2]# SADDOUT[3]# SADDOUT[4]# SADDOUT[5]# SADDOUT[6]# SADDOUT[7]# SADDOUT[8]# Pin N1 N3 N5 AJ25 AN15 AL15 AN13 AL13 AC3 AN23 AE3 AG3 AN19 AL19 AJ29 AL29 AG33 AJ37 AL35 AE33 AJ35 AG37 AL33 AN37 AL37 AG35 AN29 AN35 AN31 AJ33 J1 J3 C7 A7 E5 A5 E7 C1 C5

RCLK RCLK# SAI#0 SAI#1 SAI#2 SAI#3 SAI#4 SAI#5 SAI#6 SAI#7 SAI#8 SAI#9 SAI#10 SAI#11 SAI#12 SAI#13 SAI#14 SAIC# SAO#0 SAO#1 SAO#2 SAO#3 SAO#4 SAO#5 SAO#6 SAO#7 SAO#8

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Table 19. Pin Name Abbreviations (continued)

Abbreviation SAO#9 SAO#10 SAO#11 SAO#12 SAO#13 SAO#14 SAOC# SCNCK1 SCNCK2 SCNINV SCNSN SD#0 SD#1 SD#2 SD#3 SD#4 SD#5 SD#6 SD#7 SD#8 SD#9 SD#10 SD#11 SD#12 SD#13 SD#14 SD#15 SD#16 SD#17 SD#18 SD#19 SD#20 SD#21 SD#22 SD#23 SD#24 SD#25 SD#26 SD#27 Full Name SADDOUT[9]# SADDOUT[10]# SADDOUT[11]# SADDOUT[12]# SADDOUT[13]# SADDOUT[14]# SADDOUTCLK# SCANCLK1 SCANCLK2 SCANINTEVAL SCANSHIFTEN SDATA[0]# SDATA[1]# SDATA[2]# SDATA[3]# SDATA[4]# SDATA[5]# SDATA[6]# SDATA[7]# SDATA[8]# SDATA[9]# SDATA[10]# SDATA[11]# SDATA[12]# SDATA[13]# SDATA[14]# SDATA[15]# SDATA[16]# SDATA[17]# SDATA[18]# SDATA[19]# SDATA[20]# SDATA[21]# SDATA[22]# SDATA[23]# SDATA[24]# SDATA[25]# SDATA[26]# SDATA[27]# Pin C3 G1 E1 A3 G5 G3 E3 S1 S5 S3 Q5 AA35 W37 W35 Y35 U35 U33 S37 S33 AA33 AE37 AC33 AC37 Y37 AA37 AC35 S35 Q37 Q35 N37 J33 G33 G37 E37 G35 Q33 N33 L33 N35

Table 19. Pin Name Abbreviations (continued)

Abbreviation SD#28 SD#29 SD#30 SD#31 SD#32 SD#33 SD#34 SD#35 SD#36 SD#37 SD#38 SD#39 SD#40 SD#41 SD#42 SD#43 SD#44 SD#45 SD#46 SD#47 SD#48 SD#49 SD#50 SD#51 SD#52 SD#53 SD#54 SD#55 SD#56 SD#57 SD#58 SD#59 SD#60 SD#61 SD#62 SD#63 SDIC#0 SDIC#1 SDIC#2 Full Name SDATA[28]# SDATA[29]# SDATA[30]# SDATA[31]# SDATA[32]# SDATA[33]# SDATA[34]# SDATA[35]# SDATA[36]# SDATA[37]# SDATA[38]# SDATA[39]# SDATA[40]# SDATA[41]# SDATA[42]# SDATA[43]# SDATA[44]# SDATA[45]# SDATA[46]# SDATA[47]# SDATA[48]# SDATA[49]# SDATA[50]# SDATA[51]# SDATA[52]# SDATA[53]# SDATA[54]# SDATA[55]# SDATA[56]# SDATA[57]# SDATA[58]# SDATA[59]# SDATA[60]# SDATA[61]# SDATA[62]# SDATA[63]# SDATAINCLK[0]# SDATAINCLK[1]# SDATAINCLK[2]# Pin L37 J37 A37 E35 E31 E29 A27 A25 E21 C23 C27 A23 A35 C35 C33 C31 A29 C29 E23 C25 E17 E13 E11 C15 E9 A13 C9 A9 C21 A21 E19 C19 C17 A11 A17 A15 W33 J35 E27

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Table 19. Pin Name Abbreviations (continued)

Abbreviation SDIC#3 SDINV# SDOC#0 SDOC#1 SDOC#2 SDOC#3 SDOV# SFILLV# STPC# Full Name SDATAINCLK[3]# SDATAINVALID# SDATAOUTCLK[0]# SDATAOUTCLK[1]# SDATAOUTCLK[2]# SDATAOUTCLK[3]# SDATAOUTVALID# SFILLVALID# SMI# STPCLK# TCK TDI TDO THERMDA THERMDC TMS TRST# VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE Pin E15 AN33 AE35 C37 A33 C11 AL31 AJ31 AN5 AC1 Q1 U1 U5 S7 U7 Q3 U3 B4 B8 B12 B16 B20 B24 B28 B32 B36 D2 D4 D8 D12 D16 D20 D24 D28 D32 F12 F16 F20 F24

Table 19. Pin Name Abbreviations (continued)

Abbreviation VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC Full Name VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE Pin F28 F32 F34 F36 H2 H4 H12 H16 H20 H24 K32 K34 K36 M2 M4 M6 M8 P30 P32 P34 P36 R2 R4 R6 R8 T30 T32 T34 T36 V2 V4 V6 V8 X30 X32 X34 X36 Z2 Z4

THDA THDC

VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC

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Table 19. Pin Name Abbreviations (continued)

Abbreviation VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC Full Name VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE VCC_CORE Pin Z6 Z8 AB30 AB32 AB34 AB36 AD2 AD4 AD6 AF14 AF18 AF22 AF26 AF34 AF36 AH2 AH4 AH10 AH14 AH18 AH22 AH26 AK10 AK14 AK18 AK22 AK26 AK30 AK34 AK36 AJ5 AL5 AM2 AM10 AM14 AM18 AM22 AM26 AM22

Table 19. Pin Name Abbreviations (continued)

Abbreviation VCC VCC VCC Full Name VCC_CORE VCC_CORE VCC_CORE VCCA VID[0] VID[1] VID[2] VID[3] VID[4] VREF_SYS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Pin AM26 AM30 AM34 AJ23 L1 L3 L5 L7 J7 W5 B2 B6 B10 B14 B18 B22 B26 B30 B34 D6 D10 D14 D18 D22 D26 D30 D34 D36 F2 F4 F6 F10 F14 F18 F22 F26 H14 H18 H22

VREF_S

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Table 19. Pin Name Abbreviations (continued)

Abbreviation VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Full Name Pin H26 H34 H36 K2 K4 K6 M30 M32 M34 M36 P2 P4 P6 P8 R30 R32 R34 R36 T2 T4 T6 T8 V30 V32 V34 V36 X2 X4 X6 X8 Z30 Z32 Z34 Z36 AB2 AB8 AB4 AB6 AD32

Table 19. Pin Name Abbreviations (continued)

Abbreviation VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS ZN ZP Full Name Pin AD34 AD36 AF2 AF4 AF12 AF16 AH12 AH16 AH20 AH24 AH28 AH32 AH34 AH36 AK2 AK4 AK12 AK16 AK20 AK24 AK28 AK32 AM4 AM6 AM12 AM16 AM20 AM24 AM28 AM32 AM36 AC5 AE5

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10.2

Pin List
Table 20 cross-references Socket A pin location to signal name. The L (Level) column shows the electrical specification for this pin. P indicates a push-pull mode driven by a single source. O indicates open-drain mode that allows devices to share the pin. Note: The AMD Athlon processor supports push-pull drivers. For more information, see Push-Pull (PP) Drivers on page 6. The P (Port) column indicates if this signal is an input (I), output (O), or bidirectional (B) signal. The R (Reference) column indicates if this signal should be referenced to VSS (G) or VCC_CORE (P) planes for the purpose of signal routing with respect to the current return paths.

Table 20. Cross-Reference by Pin Location

Pin A1 A3 A5 A7 A9 A11 A13 A15 A17 A19 A21 A23 A25 A27 A29 A31 A33 A35 A37 No Pin SADDOUT[12]# SADDOUT[5]# SADDOUT[3]# SDATA[55]# SDATA[61]# SDATA[53]# SDATA[63]# SDATA[62]# NC Pin SDATA[57]# SDATA[39]# SDATA[35]# SDATA[34]# SDATA[44]# NC Pin SDATAOUTCLK[2]# SDATA[40]# SDATA[30]# page 72 page 72 Name Description page 72 L P P P P P P P P P P P P P P P P P O O O B B B B B B B B B B O B B R G G G P P G G G G G P P G P G P

Table 20. Cross-Reference by Pin Location

Pin B2 B4 B6 B8 B10 B12 B14 B16 B18 B20 B22 B24 B26 B28 B30 B32 B34 B36 C1 VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE SADDOUT[7]# Name Description L P P O R G

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Table 20. Cross-Reference by Pin Location (continued) Table 20. Cross-Reference by Pin Location
Pin C3 C5 C7 C9 C11 C13 C15 C17 C19 C21 C23 C25 C27 C29 C31 C33 C35 C37 D2 D4 D6 D8 D10 D12 D14 D16 D18 D20 D22 D24 D26 D28 D30 D32 Name SADDOUT[9]# SADDOUT[8]# SADDOUT[2]# SDATA[54]# SDATAOUTCLK[3]# NC Pin SDATA[51]# SDATA[60]# SDATA[59]# SDATA[56]# SDATA[37]# SDATA[47]# SDATA[38]# SDATA[45]# SDATA[43]# SDATA[42]# SDATA[41]# SDATAOUTCLK[1]# VCC_CORE VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE page 72 Description L P P P P P P P P P P P P P P P P P P O O O B O B B B B B B B B B B B O R G G G P G P G G G P G G G G G G G Pin D34 D36 E1 E3 E5 E7 E9 E11 E13 E15 E17 E19 E21 E23 E25 E27 E29 E31 E33 E35 E37 F2 F4 F6 F8 F10 F12 F14 F16 F18 F20 F22 F24 F26 VSS VSS SADDOUT[11]# SADDOUTCLK# SADDOUT[4]# SADDOUT[6]# SDATA[52]# SDATA[50]# SDATA[49]# SDATAINCLK[3]# SDATA[48]# SDATA[58]# SDATA[36]# SDATA[46]# NC Pin SDATAINCLK[2]# SDATA[33]# SDATA[32]# NC Pin SDATA[31]# SDATA[22]# VSS VSS VSS NC Pin VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS page 72 page 72 page 72 Name Description L P P P P P P P P P P P P P P P P P P O O O O B B B I B B B B I B B B B R P G P G P P G G P G P P G P P P G -

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Table 20. Cross-Reference by Pin Location (continued) Table 20. Cross-Reference by Pin Location
Pin F28 F30 F32 F34 F36 G1 G3 G5 G7 G9 G11 G13 G15 G17 G19 G21 G23 G25 G27 G29 G31 G33 G35 G37 H2 H4 H6 H8 H10 H12 H14 H16 H18 H20 NC Pin VCC_CORE VCC_CORE VCC_CORE SADDOUT[10]# SADDOUT[14]# SADDOUT[13]# Key Pin Key Pin NC Pin NC Pin Key Pin Key Pin NC Pin NC Pin Key Pin Key Pin NC Pin NC Pin NC Pin SDATA[20]# SDATA[23]# SDATA[21]# VCC_CORE VCC_CORE NC Pin NC Pin NC Pin VCC_CORE VSS VCC_CORE VSS VCC_CORE page 72 page 72 page 72 page 71 page 71 page 72 page 72 page 71 page 71 page 72 page 72 page 71 page 71 page 72 page 72 page 72 Name VCC_CORE page 72 Description L P P P P P P P O O O B B B R P G G G G G Pin H22 H24 H26 H28 H30 H32 H34 H36 J1 J3 J5 J7 J31 J33 J35 J37 K2 K4 K6 K8 K30 K32 K34 K36 L1 L3 L5 L7 L31 L33 L35 L37 M2 M4 VSS VCC_CORE VSS NC Pin NC Pin NC Pin VSS VSS SADDOUT[0]# SADDOUT[1]# NC Pin VID[4] NC Pin SDATA[19]# SDATAINCLK[1]# SDATA[29]# VSS VSS VSS NC Pin NC Pin VCC_CORE VCC_CORE VCC_CORE VID[0] VID[1] VID[2] VID[3] NC Pin SDATA[26]# NC Pin SDATA[28]# VCC_CORE VCC_CORE page 72 page 73 page 73 page 73 page 73 page 72 page 72 page 72 page 72 page 72 page 72 page 73 page 72 page 72 page 72 page 72 Name Description L P P O P P P O O O O P P P O O O B I B O O O O B B R G P P P P -

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Table 20. Cross-Reference by Pin Location (continued) Table 20. Cross-Reference by Pin Location
Pin M6 M8 M30 M32 M34 M36 N1 N3 N5 N7 N31 N33 N35 N37 P2 P4 P6 P8 P30 P32 P34 P36 Q1 Q3 Q5 Q7 Q31 Q33 Q35 Q37 R2 R4 R6 R8 Name VCC_CORE VCC_CORE VSS VSS VSS VSS PICCLK PICD#[0] PICD#[1] Key Pin NC Pin SDATA[25]# SDATA[27]# SDATA[18]# VSS VSS VSS VSS VCC_CORE VCC_CORE VCC_CORE VCC_CORE TCK TMS SCANSHIFTEN Key Pin NC Pin SDATA[24]# SDATA[17]# SDATA[16]# VCC_CORE VCC_CORE VCC_CORE VCC_CORE page 71 page 71 page 72 page 71 page 72 page 68 page 68 page 68 page 71 page 72 Description L O O O P P P P P P P P P P I B B B B B I I I B B B R P P G P G G Pin R30 R32 R34 R36 S1 S3 S5 S7 S31 S33 S35 S37 T2 T4 T6 T8 T30 T32 T34 T36 U1 U3 U5 U7 U31 U33 U35 U37 V2 V4 V6 V8 V30 V32 VSS VSS VSS VSS SCANCLK1 SCANINTEVAL SCANCLK2 THERMDA NC Pin SDATA[7]# SDATA[15]# SDATA[6]# VSS VSS VSS VSS VCC_CORE VCC_CORE VCC_CORE VCC_CORE TDI TRST# TDO THERMDC NC Pin SDATA[5]# SDATA[4]# NC Pin VCC_CORE VCC_CORE VCC_CORE VCC_CORE VSS VSS page 72 page 71 page 71 page 71 page 73 page 72 page 72 page 72 page 72 page 73 page 72 Name Description L P P P P P P P P P P P P I I I B B B I I O B B R G P G G G -

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Table 20. Cross-Reference by Pin Location (continued) Table 20. Cross-Reference by Pin Location
Pin V34 V36 W1 W3 W5 W7 W31 W33 W35 W37 X2 X4 X6 X8 X30 X32 X34 X36 Y1 Y3 Y5 Y7 Y31 Y33 Y35 Y37 Z2 Z4 Z6 Z8 Z30 Z32 Z34 Z36 VSS VSS FID[0] FID[1] VREFSYS NC Pin NC Pin SDATAINCLK[0]# SDATA[2]# SDATA[1]# VSS VSS VSS VSS VCC_CORE VCC_CORE VCC_CORE VCC_CORE FID[2] FID[3] NC Pin Key Pin NC Pin NC Pin SDATA[3]# SDATA[12]# VCC_CORE VCC_CORE VCC_CORE VCC_CORE VSS VSS VSS VSS page 70 page 70 page 72 page 71 page 72 page 72 page 70 page 70 page 74 page 72 page 72 Name Description L O O P P P P O O P P P O O I B B O O B B R G G P G P Pin AA1 AA3 AA5 AA7 AA31 AA33 AA35 AA37 AB2 AB4 AB6 AB8 AB30 AB32 AB34 AB36 AC1 AC3 AC5 AC7 AC31 AC33 AC35 AC37 AD2 AD4 AD6 AD8 AD30 AD32 AD34 AD36 AE1 AE3 Name DBRDY DBREQ# NC Key Pin NC Pin SDATA[8]# SDATA[0]# SDATA[13]# VSS VSS VSS VSS VCC_CORE VCC_CORE VCC_CORE VCC_CORE STPCLK# PLLTEST# ZN NC NC Pin SDATA[10]# SDATA[14]# SDATA[11]# VCC_CORE VCC_CORE VCC_CORE NC Pin NC Pin VSS VSS VSS A20M# PWROK page 72 page 72 page 72 page 73 page 72 page 74 page 71 page 72 Description page 69 page 69 L P P P P P P P P P P P P P P O I B B B I I B B B I I R P G G P G G -

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Table 20. Cross-Reference by Pin Location (continued) Table 20. Cross-Reference by Pin Location
Pin AE5 AE7 AE31 AE33 AE35 AE37 AF2 AF4 AF6 AF8 AF10 AF12 AF14 AF16 AF18 AF20 AF22 AF24 AF26 AF28 AF30 AF32 AF34 AF36 AG1 AG3 AG5 AG7 AG9 AG11 AG13 AG15 AG17 AG19 ZP NC NC Pin SADDIN[5]# SDATAOUTCLK[0]# SDATA[9]# VSS VSS NC Pin NC Pin NC Pin VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE NC Pin NC Pin NC Pin VCC_CORE VCC_CORE FERR RESET# NC Pin Key Pin Key Pin COREFB COREFB# Key Pin Key Pin NC Pin page 72 page 71 page 71 page 69 page 69 page 71 page 71 page 72 page 69 page 72 page 72 page 72 page 72 page 72 page 72 page 72 Name Description page 74 L P P P P P P I O B O I R G P G Pin AG21 AG23 AG25 AG27 AG29 AG31 AG33 AG35 AG37 AH2 AH4 AH6 AH8 AH10 AH12 AH14 AH16 AH18 AH20 AH22 AH24 AH26 AH28 AH30 AH32 AH34 AH36 AJ1 AJ3 AJ5 AJ7 AJ9 AJ11 AJ13 NC Pin NC Pin NC Pin Key Pin Key Pin NC Pin SADDIN[2]# SADDIN[11]# SADDIN[7]# VCC_CORE VCC_CORE AMD Pin NC Pin VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS NC Pin VSS VSS VSS IGNNE# INIT# VCC_CORE NC Pin NC Pin NC Pin Analog page 72 page 72 page 72 page 68 page 71 page 71 page 72 page 68 page 72 Name Description page 72 page 72 page 72 page 71 page 71 page 72 L P P P P P P I I I I I R G G P -

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Table 20. Cross-Reference by Pin Location (continued) Table 20. Cross-Reference by Pin Location
Pin AJ15 AJ17 AJ19 AJ21 AJ23 AJ25 AJ27 AJ29 AJ31 AJ33 AJ35 AJ37 AK2 AK4 AK6 AK8 AK10 AK12 AK14 AK16 AK18 AK20 AK22 AK24 AK26 AK28 AK30 AK32 AK34 AK36 AL1 AL3 AL5 AL7 NC Pin NC Pin NC Pin CLKFWDRST VCCA PLLBYPASS# NC Pin SADDIN[0]# SFILLVALID# SADDINCLK# SADDIN[6]# SADDIN[3]# VSS VSS CPU_PRESENCE# NC Pin VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VCC_CORE INTR FLUSH# VCC_CORE NC Pin page 72 page 71 page 71 page 69 page 72 Name Description page 72 page 72 page 72 page 68 page 73 page 72 page 72 page 72 L P P P P P P P P P P I I I I I I I I I R P G G P G Pin AL9 AL11 AL13 AL15 AL17 AL19 AL21 AL23 AL25 AL27 AL29 AL31 AL33 AL35 AL37 AM2 AM4 AM6 AM8 AM10 AM12 AM14 AM16 AM18 AM20 AM22 AM24 AM26 AM28 AM30 AM32 AM34 AM36 AN1 NC Pin NC Pin PLLMON2 PLLBYPASSCLK# CLKIN# RSTCLK# K7CLKOUT CONNECT NC Pin NC Pin SADDIN[1]# SDATAOUTVALID# SADDIN[8]# SADDIN[4]# SADDIN[10]# VCC_CORE VSS VSS NC Pin VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS VCC_CORE VSS No Pin page 72 page 72 Name Description page 72 page 72 page 72 page 72 page 68 page 68 page 71 page 69 page 72 page 72 page 72 L O P P P P P P P P P P P O I I I O I I O I I I R P P P P P G G -

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Table 20. Cross-Reference by Pin Location (continued)

Pin AN3 AN5 AN7 AN9 AN11 AN13 AN15 AN17 AN19 AN21 AN23 AN25 AN27 AN29 AN31 AN33 AN35 AN37 NMI SMI# NC Pin NC Pin NC Pin PLLMON1 PLLBYPASSCLK CLKIN RSTCLK K7CLKOUT# PROCRDY NC Pin NC Pin SADDIN[12]# SADDIN[14]# SDATAINVALID# SADDIN[13]# SADDIN[9]# page 72 page 72 page 72 page 72 page 72 page 72 page 72 page 68 page 68 page 71 Name Description L P P O P P P P P P P P P P P I I B I I I O O I I I I I R P P P G G P G G

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10.3

Detailed Pin Descriptions

The information in this section pertains to Table 20 on page 60.

A20M# Pin AMD Pin

A20M# is an input from the system used to simulate address wrap-around in the 20-bit 8086. AMD Socket A processors do not implement a pin at location AH6. All Socket A designs must have a top plate or cover that blocks this pin location. When the cover plate blocks this location, a non-AMD part (e.g., PGA370) does not fit into the socket. However, socket manufacturers are allowed to have a contact loaded in the AH6 position. Therefore, motherboard socket design should account for the possibility that a contact could be loaded in this position. See the AMD Athlon and AMD Duron System Bus Specification, order# 21902 for information about the system bus pins PROCRDY, PWROK, RESET#, SADDIN[14:2]#, SADDINCLK#, SADDOUT[14:2]#, SADDOUTCLK#, SDATA[63:0]#, SDATAINCLK[3:0]#, SDATAINVALID#, SDATAOUTCLK[3:0]#, SDATAOUTVALID#, SFILLVALID#. Treat this pin as a NC. The Advanced Programmable Interrupt Controller (APIC) is a feature that provides a flexible and expandable means of delivering interrupts in a system using an AMD processor. The pins, PICD[1:0], are the bi-directional message-passing signals used for the APIC and are driven to the Southbridge or a dedicated I/O APIC. The pin, PICCLK, must be driven with a valid clock input. For more information, see Table 16, APIC Pin AC and DC Characteristics, on page 41.

AMD Athlon System Bus Pins

Analog Pin APIC Pins, PICCLK, PICD[1:0]#

CLKFWDRST Pin CLKIN, RSTCLK (SYSCLK) Pins

CLKFWDRST resets clock-forward circuitry for both the system and processor. Connect CLKIN with RSTCLK and name it SYSCLK. Connect CLKIN# with RSTCLK# and name it SYSCLK#. Length match the clocks from the clock generator to the Northbridge and processor.

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See SYSCLK and SYSCLK# on page 73 for more information. CONNECT Pin COREFB and COREFB# Pins CPU_PRESENCE# Pin CONNECT is an input from the system used for power management and clock-forward initialization at reset. COREFB and COREFB# are outputs to the system that provide processor core voltage feedback to the system. CPU_PRESENCE# is connected to VSS on the processor package. If pulled-up on the motherboard, CPU_PRESENCE# may be used to detect the presence or absence of a processor in the Socket A-style socket. DBRDY and DBREQ# are routed to the debug connector. DBREQ# is tied to VCC_CORE with a pullup resistor. FERR is an output to the system that is asserted for any unmasked numerical exception independent of the NE bit in CR0. FERR is a push-pull active High signal that must be inverted and level shifted to an active Low signal. For more information about FERR and FERR#, see the Required Circuits chapter of the AMD Athlon Processor-Based Motherboard Design Guide, order# 24363.

DBRDY and DBREQ# Pins FERR Pin

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FID[3:0] Pins

FID[3] (Y3), FID[2] (Y1), FID[1] (W3), and FID[0] (W1) are the 4-bit processor clock-to-SYSCLK ratio. Table 21 describes the encodings of the clock multipliers on FID[3:0]. Table 21. FID[3:0] Clock Multiplier Encodings
FID[3:0]2 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111
Notes:

Processor Clock to SYSCLK Frequency Ratio 11 11.5 12

12.51 5 5.5 6 6.5 7 7.5 8 8.5 9 9.5 10 10.5

1. All ratios greater than or equal to 12.5x have the same FID[3:0] code of 0011, which causes the SIP configuration for all ratios of 12.5x or greater to be the same. 2. BIOS initializes the CLK_Ctl MSR to 6003_D22Fh during the POST routine. This CLK_Ctl setting is used with all FID combinations and selects a Halt disconnect divisor of 64 and a Stop Grant disconnect divisor of 64. For more information, refer to the AMD Athlon and AMD Duron Processors BIOS, Software, and Debug Developers Guide, order# 21656.

The FID[3:0] signals are open drain processor outputs that are pulled High on the motherboard and sampled by the chipset to determine the SIP (Serialization Initialization Packet) that is sent to the processor. The FID[3:0] signals are valid after PWROK is asserted. The FID[3:0]signals must not be sampled u n t i l t h ey b e c o m e va l i d . S e e t h e A M D A t h l o n a n d AMD Duron System Bus Specification, order# 21902 for more information about Serialization Initialization Packets and SIP protocol.

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The processor FID[3:0] outputs are open drain and 2.5 V tolerant. To prevent damage to the processor, if these signals are pulled High to above 2.5 V, they must be electrically isolated from the processor. For information about the FID[3:0] isolation circuit, see the AMD Athlon Processor-Based Motherboard Design Guide, order# 24363. See Frequency Identification (FID[3:0]) on page 27 for the DC characteristics for FID[3:0]. FLUSH# Pin FLUSH# must be tied to VCC_CORE with a pullup resistor. If a debug connector is implemented, FLUSH# is routed to the debug connector. IGNNE# is an input from the system that tells the processor to ignore numeric errors. INIT# is an input from the system that resets the integer registers without affecting the floating-point registers or the internal caches. Execution starts at 0_FFFF_FFF0h. INTR is an input from the system that causes the processor to start an interrupt acknowledge transaction that fetches the 8-bit interrupt vector and starts execution at that location. TCK, TMS, TDI, TRST#, and TDO are the JTAG interface. Connect these pins directly to the motherboard debug connector. Pull TDI, TCK, TMS, and TRST# up to VCC_CORE with pullup resistors. K7CLKOUT and K7CLKOUT# are each run for two to three inches and then terminated with a resistor pair: 100 ohms to VCC_CORE and 100 ohms to VSS. The effective termination resistance and voltage are 50 ohms and VCC_CORE/2. These 16 locations are for processor type keying for forwards and backwards compatibility (G7, G9, G15, G17, G23, G25, N7, Q7, Y7, AA7, AG7, AG9, AG15, AG17, AG27, and AG29). Motherboard designers should treat key pins like NC (No Connect) pins. A socket designer has the option of creating a top mold piece that allows PGA key pins only where designated. However, sockets that populate all 16 key pins must be allowed, so the motherboard must always provide for pins at all key pin locations.

IGNNE# Pin INIT# Pin

INTR Pin

JTAG Pins

K7CLKOUT and K7CLKOUT# Pins

Key Pins

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See NC Pins for more information. NC Pins NMI Pin PGA Orientation Pins The motherboard should provide a plated hole for an NC pin. The pin hole should not be electrically connected to anything. NMI is an input from the system that causes a non-maskable interrupt. No pin is present at pin locations A1 and AN1. Motherboard designers should not allow for a PGA socket pin at these locations. For more information, see the AMD Athlon Processor-Based Motherboard Design Guide, order# 24363. PLL Bypass and Test Pins P L LT E S T # , P L L B Y PA S S # , P L L M O N 1 , P L L M O N 2 , PLLBYPASSCLK, and PLLBYPASSCLK# are the PLL bypass and test interface. This interface is tied disabled on the motherboard. All six pin signals are routed to the debug connector. All four processor inputs (PLLTEST#, PLLBYPASS#, PLLMON1, and PLLMON2) are tied to VCC_CORE with pullup resistors. The PWROK input to the processor must not be asserted until all voltage planes in the system are within specification and all system clocks are running within specification. For more information, Chapter 8, Signal and Power-Up Requirements on page 43. SADDIN[1:0]# and SADDOUT[1:0]# Pins The AMD Athlon XP processor model 6 does not support SADDIN[1:0]# or SADDOUT[1:0]#. SADDIN[1]# is tied to VCC with pullup resistors, if this bit is not supported by the Northbridge (future models can support SADDIN[1]#). SADDOUT[1:0]# are tied to VCC with pullup resistors if these pins are supported by the Northbridge. For more information, see the AMD Athlon and AMD Duron System Bus Specification, order# 21902. SCANSHIFTEN, SCANCLK1, SCANINTEVAL, and SCANCLK2 are the scan interface. This interface is AMD internal and is tied disabled with pulldown resistors to ground on the motherboard.

PWROK Pin

Scan Pins

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SMI# Pin STPCLK# Pin SYSCLK and SYSCLK#

SMI# is an input that causes the processor to enter the system management mode. STPCLK# is an input that causes the processor to enter a lower power mode and issue a Stop Grant special cycle. SYSCLK and SYSCLK# are differential input clock signals provided to the PLL of the processor from a system-clock generator. See CLKIN, RSTCLK (SYSCLK) Pins on page 68 for more information.

THERMDA and THERMDC Pins

Thermal Diode anode and cathode pins are used to monitor the actual temperature of the processor die, providing more accurate temperature control to the system. See Table 14, Thermal Diode Electrical Characteristics, on page 39 for more information.

VCCA Pin

VCCA is the processor PLL supply. For information about the VCCA pin, see Table 5, VCCA AC and DC Characteristics, on page 27 and the AMD Athlon Processor-Based Motherboard Design Guide, order# 24363. The VID[4:0] (Voltage Identification) outputs are used to dictate the VCC_CORE voltage level. The VID[4:0] pins are strapped to ground or left unconnected on the processor package. The VID[4:0] pins are pulled-up on the motherboard and used by the VCC_CORE DC/DC converter. For more information, see Table 22, VID[4:0] Code to Voltage Definition, on page 74.

VID[4:0] Pins

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Table 22. VID[4:0] Code to Voltage Definition

VID[4:0] 00000 00001 00010 00011 00100 00101 00111 01000 01001 01010 01011 01100 01101 01110 01111 VCC_CORE (V) 1.850 1.825 1.800 1.775 1.750 1.725 1.675 1.650 1.625 1.600 1.575 1.550 1.525 1.500 1.475 VID[4:0] 10000 10001 10010 10011 10100 10101 10111 11000 11001 11010 11011 11100 11101 11110 11111 VCC_CORE (V) 1.450 1.425 1.400 1.375 1.350 1.325 1.275 1.250 1.225 1.200 1.175 1.150 1.125 1.100 No CPU

For more information, see the Required Circuits chapter of the AMD Athlon Processor-Based Motherboard Design Guide, order# 24363. VREFSYS Pin VREFSYS (W5) drives the threshold voltage for the system bus input receivers. The value of VREFSYS is system specific. In addition, to minimize VCC_CORE noise rejection from V R E F S Y S , i n c l u d e d e c o u p l i n g c a p a c i t o rs . Fo r m o re information, see the AMD Athlon Processor-Based Motherboard Design Guide, order# 24363. ZN (AC5) and ZP (AE5) are the push-pull compensation circuit pins. In Push-Pull mode (selected by the SIP parameter SysPushPull asserted), ZN is tied to VCC_CORE with a resistor that has a resistance matching the impedance Z 0 of the transmission line. ZP is tied to VSS with a resistor that has a resistance matching the impedance Z0 of the transmission line.

ZN and ZP Pins

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11

Ordering Information

Standard AMD Athlon XP Processor Model 6 Products

AMD standard products are available in several operating ranges. The ordering part numbers (OPN) are formed by a combination of the elements, as shown in Figure 16.

OPN
A X 2100 D M T 3 C
Max FSB: C = 266 MHz Size of L2 Cache: 3 = 256 Kbytes Die Temperature: T = 90C Operating Voltage: M = 1.75 V Package Type: D = OPGA Model Number: 1500 operates at 1333 MHz, 1600 at 1400 MHz, 1700 at 1467 MHz, 1800 at 1533 MHz, 1900 at 1600 MHz, 2000 at 1667 MHz , 2100 at 1733 MHz Generation: X = High-Performance Desktop Processor Family/Architecture: A = AMD Athlon XP Processor Model 6 Architecture
Note: Spaces are added to the number shown above for viewing clarity only.

Figure 16. OPN Example for the AMD Athlon XP Processor Model 6

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Appendix A
Conventions and Abbreviations

This section contains information about the conventions and abbreviations used in this document.

Signals and Bits

Active-Low SignalsSignal names containing a pound sign, such as SFILL#, indicate active-Low signals. They are asserted in their Low-voltage state and negated in their High-voltage state. When used in this context, High and Low are written with an initial upper case letter. Signal RangesIn a range of signals, the highest and lowest signal numbers are contained in brackets and separated by a colon (for example, D[63:0]). Reserved Bits and SignalsSignals or bus bits marked reserved must be driven inactive or left unconnected, as indicated in the signal descriptions. These bits and signals are reserved by AMD for future implementations. When software reads registers with reserved bits, the reserved bits must be masked. When software writes such registers, it must first read the register and change only the non-reserved bits before writing back to the register. Three-StateIn timing diagrams, signal ranges that are high impedance are shown as a straight horizontal line half-way between the high and low levels.

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Invalid and Dont-CareIn timing diagrams, signal ranges that are invalid or don't-care are filled with a screen pattern.

Data Terminology
The following list defines data terminology:

Quantities A word is two bytes (16 bits) A doubleword is four bytes (32 bits) A quadword is eight bytes (64 bits) AddressingMemory is addressed as a series of bytes on eight-byte (64-bit) boundaries in which each byte can be separately enabled. AbbreviationsThe following notation is used for bits and bytes: Kilo (K, as in 4-Kbyte page) Mega (M, as in 4 Mbits/sec) Giga (G, as in 4 Gbytes of memory space) See Table 23 on page 79 for more abbreviations. Little-Endian ConventionThe byte with the address xx...xx00 is in the least-significant byte position (little end). In byte diagrams, bit positions are numbered from right to leftthe little end is on the right and the big end is on the left. Data structure diagrams in memory show low addresses at the bottom and high addresses at the top. When data items are aligned, bit notation on a 64-bit data bus maps directly to bit notation in 64-bit-wide memory. Because byte addresses increase from right to left, strings appear in reverse order when illustrated. Bit RangesIn text, bit ranges are shown with a dash (for example, bits 91). When accompanied by a signal or bus name, the highest and lowest bit numbers are contained in brackets and separated by a colon (for example, AD[31:0]). Bit ValuesBits can either be set to 1 or cleared to 0. Hexadecimal and Binary NumbersUnless the context makes interpretation clear, hexadecimal numbers are followed by an h and binary numbers are followed by a b.

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Abbreviations and Acronyms

Table 23 contains the definitions of abbreviations used in this document. Table 23. Abbreviations
Abbreviation A F G Gbit Gbyte H h K Kbyte M Mbit Mbyte MHz m ms mW Meaning Ampere Farad Giga Gigabit Gigabyte Henry Hexadecimal Kilo Kilobyte Mega Megabit Megabyte Megahertz Milli Millisecond Milliwatt Micro Microampere Microfarad Microhenry Microsecond Microvolt nano nanoampere nanofarad nanohenry nanosecond Ohm pico picoampere

A F H s V
n nA nF nH ns ohm p pA

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Table 23. Abbreviations (continued)

Abbreviation pF pH ps s V W Meaning picofarad picohenry picosecond Second Volt Watt

Table 24 contains the definitions of acronyms used in this document. Table 24. Acronyms
Abbreviation ACPI AGP APCI API APIC BIOS BIST BIU CPGA DDR DIMM DMA DRAM EIDE EISA EPROM FIFO GART HSTL IDE IPC ISA JEDEC Meaning Advanced Configuration and Power Interface Accelerated Graphics Port AGP Peripheral Component Interconnect Application Programming Interface Advanced Programmable Interrupt Controller Basic Input/Output System Built-In Self-Test Bus Interface Unit Ceramic Pin Grid Array Double-Data Rate Dual Inline Memory Module Direct Memory Access Direct Random Access Memory Enhanced Integrated Device Electronics Extended Industry Standard Architecture Enhanced Programmable Read Only Memory First In, First Out Graphics Address Remapping Table High-Speed Transistor Logic Integrated Device Electronics Instructions Per Cycle Industry Standard Architecture Joint Electron Device Engineering Council

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Table 24. Acronyms (continued)

Abbreviation JTAG LAN LRU LVTTL MSB MTRR MUX NMI OD OPGA PBGA PA PCI PDE PDT PGA PLL PMSM POS POST RAM ROM RXA SCSI SDI SDRAM SIMD SIP SMbus SPD SRAM SROM TLB TOM Meaning Joint Test Action Group Large Area Network Least-Recently Used Low Voltage Transistor Transistor Logic Most Significant Bit Memory Type and Range Registers Multiplexer Non-Maskable Interrupt Open-Drain Organic Pin Grid Array Plastic Ball Grid Array Physical Address Peripheral Component Interconnect Page Directory Entry Page Directory Table Pin Grid Array Phase Locked Loop Power Management State Machine Power-On Suspend Power-On Self-Test Random Access Memory Read Only Memory Read Acknowledge Queue Small Computer System Interface System DRAM Interface Synchronous Direct Random Access Memory Single Instruction Multiple Data Serial Initialization Packet System Management Bus Serial Presence Detect Synchronous Random Access Memory Serial Read Only Memory Translation Lookaside Buffer Top of Memory

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Table 24. Acronyms (continued)

Abbreviation TTL VAS VPA VGA USB ZDB Meaning Transistor Transistor Logic Virtual Address Space Virtual Page Address Video Graphics Adapter Universal Serial Bus Zero Delay Buffer

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