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TD If 9009lt

IF 9009lt is an activated, noclean solder paste that shows good wetting on strongly oxidized surface finishes and surfaces with poor wettability. The solder paste does not contain any rosin resulting in less harmful fumes and less oven maintenance. The residues after reflow are clear, they are easy to penetrate by flying probeand ICT-test pins.

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90 views

TD If 9009lt

IF 9009lt is an activated, noclean solder paste that shows good wetting on strongly oxidized surface finishes and surfaces with poor wettability. The solder paste does not contain any rosin resulting in less harmful fumes and less oven maintenance. The residues after reflow are clear, they are easy to penetrate by flying probeand ICT-test pins.

Uploaded by

behzad
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Solder paste IF 9009LT

INTERFLUX ELECTRONICS N.V.


Technical data IF 9009LT
latest version on www.interflux.com

Ver: 2.1 07-03-13

Page 1

Activated, lead-free no-clean solder paste


Description: IF 9009lt is an activated noclean solder paste that shows good wetting on strongly oxidized surface finishes and surfaces with poor wettability. IF 9009lt has good tackiness and print definition. It keeps its rheology characteristics during printing, resulting in a stable printing process. The solder paste does not contain any rosin resulting in less harmful fumes and less oven maintenance. The residues after reflow are clear, they are easy to be penetrated by flying probeand ICT-test pins. The residues can be cleaned off IF 9009lt is hydrophobic and gives no solder balling after reflow. IF 9009lt is low in halogens and is classified as RE/L1 according to IPC J-STD-004A. More information:
Reflow profile 2

Profile recommenda- 2 tions Product handling Test results 3 3

Operating parameter 4 recommendations

Key advantages: Excellent wetting on surfaces with poor wettability Excellent wetting on strongly oxidized board finishes Clear residues after reflow

Availability
alloy
Sn95,5Ag4Cu0,5 Sn96,5Ag3Cu0,5 Sn96,5Ag3,5

metal content
printing: 88%

powder size
Standard type 3 (25 45) other sizes upon request 500g jar

packaging
500g in 6Oz. Cartridge 1kg1,2kg1,3kg in 12 Oz. cartridge 51030cc syringes ProFlow cassettes

(On request some SnPb(Ag) alloys are available)

N.V. INTERFLUX ELECTRONICS S.A. - Eddastraat 51BE-9042 Gent tel.: +32-9-251.49.59 fax.: +32-9-251.49.70

www.interflux.com

Technical data IF 9009


Reflow profile general
General description In general a soak profile is advised and may be used when temperature differences across a board, due to a high mix of components or large board sizes, need to be levelled out. Or when the number of voids, if present because of material combination, need to be decreased. When soldering an assembly in a leadfree soldering process, care must be taken not to overheat components especially when using air con-

LT

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vection or IR ovens. It is very important to know the temperature limitations of the components used on the board. To get a good thermal mapping of the board it is advised to use thermocouples and a thermal measuring tool. Measure on

small outline, big outline and temperature sensitive components. Measure on the board side near the conveyor chain, in the middle of the board and close to, or on heat sinks.

Profile recommendations
Preheat From room temperature until about 200C at a rate of 1-3C/ seconds. Higher heating rates could result in component cracking due to absorbed moisture. Soak From 180C to about 200C at a rate of 0-1 C/seconds. In some cases a temperature holding soak zone is used to level out differences on a board. It is often used on high mix boards or to reduce voids in certain lead-free processes. A 30-90 sec soak between 180C and 200C is often used for this purpose. Reflow Peak temperature used is related to component specifications. In general between 235C and 250C. The time in liquidus (over melting point of the alloy used) could be between 45 seconds and 90 seconds. Cooling Cooling rate around 4C/ second because of differences in thermal expansion of different materials

Min : 30sec Max : 120sec Max : 245C Max : +4C/sec Min : 230C Min: +0,5C/sec Min : +1C/sec

Max : +3C/sec

Max : +1C/sec

Max : +6C/sec

Min : +2C/sec

Min : +1C/sec

preheat

soak

reflow

cooling

N.V. INTERFLUX ELECTRONICS S.A. - Eddastraat 51BE-9042 Gent tel.: +32-9-251.49.59 fax.: +32-9-251.49.70

www.interflux.com

Technical data IF 9009

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Handling
Storage Store the solder paste in the original packaging, tightly sealed at a preferred temperature of 3 to 7C Handling Let the solder paste reach room temperature prior to opening the packaging. Stir well before use. Maintenance Set an under stencil clean interval which provides continuous printing quality. ISC8020 is recomPrinting Apply enough solder paste to the stencil to allow smooth rolling during printing. Regular replenish fresh solder paste. mended as cleaning agent in pre saturated wipes and USC liquid. Reuse Do not mix used and fresh paste. Do not put packages back into refrigeration when already opened. Store used paste in a separate jar at room temperature.

Test results
conform EN 61190-1-2(2002) and IPC J-STD-004A/J-STD-005
Property Chemical qualitative copper mirror qualitative halide silver chromate (Cl, Br) Environmental SIR test Property Mechanical solder ball test after 15min after 4h wetting test slump test spread test
after 15min at 25C after 10min at 150C

Result

Method

pass pass pass Result

J-STD-004A IPC-TM-650 2.3.32

J-STD-004A IPC-TM-650 2.3.33 J-STD-004A IPC-TM-650 2.6.3.3

Method

preferred acceptable pass pass pass 137,89 mm


2

J-STD-005 IPC-TM-650 2.4.43 J-STD-005 IPC-TM-650 2.4.43 J-STD-005 IPC-TM-650 2.4.45 J-STD-005 IPC-TM-650 2.4.35 J-STD-005 IPC-TM-650 2.4.35 J-STD-004 IPC-TM-650, 2.4.46

N.V. INTERFLUX ELECTRONICS S.A. - Eddastraat 51BE-9042 Gent tel.: +32-9-251.49.59 fax.: +32-9-251.49.70

www.interflux.com

Technical data IF 9009

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Page 4

Operating parameter recommendations


Printing speed: squeegee pressure: U.S.C. interval: temperature range: Mounting tack time: Reflow reflow profile: heating type: I.C.T flying probe testable pin-bed testable 2070mm/sec 250g / cm length every 10 boards 15C to 25C Cleaning Cleaning of the paste from stencils and tools is recommended with Interflux ISC 8020. The residues after refllow of IF9009LT are very reliable and dont need to be cleaned, however they can be cleaned if desired. A compatibility list between Interflux products and Zestron cleaning products is available at Interflux.

> 4 hours

linear and soak convection, vapour phase, etc

Trade name : IF 9009lt No-Clean, Lead Free Solder Paste

Because we cannot anticipate or control the many different conditions under which this information and our products may be u sed, we do not guarantee the applicability or the accuracy of this information or the suitability of our products in any given situation. Users of our products should make their own test to determine the suitability of each such product for their particular purposes. The product discussed is sold without such warranty, either express or implied.

Product information in other European languages can be obtained at Interflux Electronics NV, 9042 Gent.

Copyright: INTERFLUX ELECTRONICS

For the latest version of this document please consult:

www.interflux.com

N.V. INTERFLUX ELECTRONICS S.A. - Eddastraat 51BE-9042 Gent tel.: +32-9-251.49.59 fax.: +32-9-251.49.70

www.interflux.com

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