Syllabus B.tech & M.tech
Syllabus B.tech & M.tech
Programme of Study
&
Syllabus of Courses
Offered by
School of Electronics & Communication
Engineering
First Year
Course Title
Engineering Graphics
Computer Fundamentals & Information Technology
Calculus & Linear Algebra
Thermodynamics
Modern Physics
Basic Electrical Engineering
L-T-P
1-0-3
3-0-0
3-1-0
3-1-0
3-1-0
3-1-0
0-0-2
0-0-2
0-0-3
Credit
2.5
3
4
4
4
4
1
1
1.5
0-0-2
16-4-12
1
26
First Year
Course Code
SPHL 101B
PLNL 101B
EECL 102B
ECSL 102B
SMTL 104B
Course Title
Electrodynamics
Communication Skills
Basic Electronics
Introduction to Programming with C
Differential Equations & Vector Calculus
L-T-P
3-1-0
3-0-0
3-1-0
3-0-0
3-1-0
Credit
4
3
4
3
4
EMEP 101B
SPHP 101B
ECSP 102B
EECP 102B
Workshop Practice
Electrodynamics Lab
Programming Lab
Basic Electronics Lab
0-0-3
0-0-3
0-0-2
0-0-2
1.5
1.5
1
1
Total Credits
15-3-10
23
Semester III
Second Year
Course Code
PPCL 201B
EECL 202B
Course Title
Introduction to Logic
Electronic Circuits & Simulation
EECL 206B
EECL 212B
EECL 214B
EECL 215B
EECP 201B
Digital Electronics
Network Analysis & Synthesis
Power Electronics & Machines
Electromagnetic Field Theory
Circuits & Simulation Lab
EECP 204B
EECP 208B
EECP 214B
Electronics Workshop
Total Credits
L-T-P
3-0-0
Credit
3
3-1-0
3-1-0
3-1-0
4
4
4
4-0-0
3-1-0
0-0-2
4
4
1
0-0-2
0-0-2
0-0-2
19-4-8
1
1
1
27
Year
Course Code
EECL 204B
Course Title
Linear Integrated Circuits & Applications
L-T-P
3-1-0
Credit
4
EECL 205B
3-1-0
EECL 209B
EECL 309B
3-1-0
3-1-0
4
4
MENL 351B
3-0-0
EECP 203B
0-0-2
EECP 205B
0-0-2
EECP 209B
0-0-3
1.5
EECP 310B
VHDL Lab
0-0-2
15-4-9
23.5
Total Credits
S
emester
IV
Second
Semester V
Third Year
Course Code
EECL 203B
Course Title
Antenna & Wave Propagation
L-T-P
3-1-0
Credit
4
EECL 301B
EECL 307B
Control Systems
3-1-0
3-1-0
4
4
EECL 313B
3-1-0
EECL 316B
ECSL 309B
3-0-0
3-0-0
3
3
EECP 302B
0-0-2
EECP 312B
0-0-3
1.5
EECD 301B
0-0-2
18-4-7
25.5
Total Credits
Semester VI
Third Year
Course Code
EECL 306B
Course Title
Electronic Measurement & Instrumentation
L-T-P
3-0-0
Credit
3
EECL 314B
3-1-0
EECL 315B
4-0-0
EECL 402B
Microwave Engineering
EECL 42Y
Elective I (COHSS)
3-1-0
3-0-0
4
3
EECP 304B
0-0-2
EECP 306B
0-0-2
EECP 314B
VLSI Lab
0-0-2
EECP 402B
0-0-2
EECD 303B
0-0-4
16-2-12
24
Total Credits
Note: Practical Training to be performed in the summer vacation following the sixth semester
Semester VII
Course Code
Fourth Year
Course Title
L-T-P
Credit
EECC 401B
EECL 308B
EECL 407B
EECL 4XXB
EECL 4XXB
Colloquium
Optical Fiber Communication
Advanced Communication Systems
Elective II (Open Elective)
Elective-III (Departmental)
0-3-0
3-0-0
3-0-0
3-0-0
3-0-0
3
3
3
3
3
EECP 406B
EECD 401B
0-0-2
0-0-8
1
4
12-3-10
20
Total Credits
Semester VIII
Fourth Year
Course Code
EECL 43X
Course Title
Elective IV (Departmental)
L-T-P
3-0-0
Credit
3
EECL 43Y
EECD 402B
Elective V (Departmental)
Major Project Phase-II
3-0-0
0-0-20
3
10
6-0-18
16
Total Credits
Total Credits
= 185 credits
List of Electives
EECE
EECE
EECE
EECE
EECE
EECE
EECE
EECE
EECE
EECE
EECE
EECE
EECE
PLNE
404B
406B
407B
408B
409B
410B
411B
425B
434B
439B
442B
444B
445B
Meaning of Life
Foundation of Cognitive Science
Introduction to Human Rights
Introduction to Indian Philosophy
Science, Technology and Society
Morality in Indian Traditions
EECL 103B
310=4
UNIT - I
Introduction to Electrical Engineering: Essence of electricity, Conductors, semiconductors and insulators
(elementary treatment only); Electric field; electric current, potential and potential difference, electromotive
force, electric power, ohms law, basic circuit components, electromagnetism related laws, Magnetic field due
to electric current flow ,force on a current carrying conductor placed in a magnetic field, Faradays laws of
electromagnetic induction. Types of induced EMFs, Kirchhoffs laws. Simple problems.
UNIT-II
Network Analysis : Basic definitions, types of elements , types of sources, resistive networks, inductive
networks, capacitive networks, series parallel circuits, star delta and delta star transformation , Network
theorems- Superposition , Theveninss, Maximum power transfer theorems, Norton theorem and simple
problems.
UNIT-III
Alternating Quantities : Principle of ac voltages , waveforms and basic definitions, relationship between
frequency, speed and number of poles, root mean square and average values of alternating currents and
voltage, form factor and peak factor, phasor representation of alternating quantities, the J operator and phasor
algebra, analysis of ac circuits with single basic network element, single phase series circuits, single phase
parallel circuits, single phase series parallel circuits, power in ac circuits. Fundamentals of AC- Average value,
RMS value, form factor, crest factor, AC power and power factor, phasor representation of sinusoidal
quantities. Simple series, parallel & series-parallel circuits containing R-L, R-C, R-L-C parameters. Active,
Apparent & Reactive power, Resonance in series & parallel circuits.
UNIT-IV
Transformers : Principles of operation, Constructional Details, Ideal Transformer and Practical Transformer,
Losses, Transformer Test, Efficiency and Regulation Calculations.
Reference Books:
Basic Electronics
3-10=4
EECL 202B
310=4
Bias stability: - Operating point, Q point variation due to changes in & temperature, Stability factor,
stability factor analysis (variation of Ico, Vbe )
Small signal Analysis:-BJT small signal analysis, h parameters, FET small signal analysis, small signal high
frequency model ( model), Millers theorem.
Large Signal Amplifiers: Classification of power amplifiers (Class A, B, C & D), push pull amplifier,
Multistage Amplifier:-General cascade system, configuration of RC coupled, transformer coupled, direct
couple multistage amplifier, General frequency consideration, Effect of cascading on the bandwidth of an
amplifier.
Electronics Circuits,
Schilling & Belove, McGraw Hill
Introduction to PSpice using OrCad for Circuits & Electronics, Rashid, Pearson Education
EECL 206B
Digital Electronics
310=4
Basic concepts of Boolean Algebra: Review of number systems - Binary, Hexadecimal, conversion from one
to another, complement arithmatic, Signed and unsigned numbers and their arithmetic operations. BCD,
Excess-3, Gray and Alphanumeric codes. Review of Boolean algebra, De-Morgan's Theorems, Standard Forms
of Boolean Expressions, Minimization-Techniques: K-MAPS, VEM Technique, Q-M (Tabulation) method.
Logic Gates & families: Logic Families: TTL, MOS, CMOS, Bi-CMOS; Performance parameters of IC families:
input and output loading, fan-in, fan-out, tri-state, current drive, voltage levels, noise margins, power-speed
tradeoff; Unused inputs; Interfacing between logic families.
Combinational Logic Circuits: Problem formulation and design of Basic Combinational Logic Circuits,
Combinational Logic Using Universal Gates. Basic Adders, ALU, Parity-Checkers and Generators, Comparators,
Decoders, Encoders, Code Converters, Multiplexer (Data Selector), De-multiplexers
Sequential Circuits: Latches, Flip-flops (SR, JK, T, D, Master/Slave FF, ) Edge-Triggered Flip-Flops, Flip-Flop
Operating Characteristics, Basic Flip-Flop Applications, Asynchronous Counter Operation, Synchronous Counter
Operation, Up/Down Synchronous Counters.
Shift registers & Memories
Shift Register Functions, Serial In - Serial Out Shift Registers, Serial In - Parallel Out Shift Registers, Parallel In
- Serial Out Shift Registers, Parallel In - Parallel Out Shift Registers, Bidirectional Shift Registers,Basics of
Semiconductor Memories, Random-Access Memories (ROM), Read Only Memories (ROMs), Programmable
ROM's (PROMs and EPROM's), PAL, PLA.
A/D and D/A convertor
Characteristics of ADC, Types of ADC- SAR, Dual Slope, Flash ADC. Characteristics of DAC, R-2R Ladder,
Weighted Resistance Type
Circuit and electrical interfacing considerations
Transmission line effect, reflection, crosstalk, Noise sources, shielding and decoupling
Textbooks & Reference Books:
Digital Systems - Principles and Applications by Tocci, R. J. and Widner, Prentice Hall, 2001
Digital Logic Circuit Analysis & Design, by Victor P. Nelson, H. Troy Nagle, Bill D. Carroll and J. David
Irwin, Prentice Hall, 1995.
Digital Experiments Emphasizing Systems and Design, by David Buchla, Prentice Hall, Inc, 4th Edition
1997.
EECL 207B
310=4
Operational Amplifier: Basic building blocks, Op-amp as inverting and non-inverting amplifier, op-amp as
adder, op-amp as subtractor, op-amp as integrator, op-amp as differentiator, op-amp as comparator, op-amp
as level detector, op-amp as zero-crossing detector.
Logic gates: Transfer characteristics, propagation delays, power consumption, fan-in, fan-out. TTL, ECL and
MOS logic circuits.
Number systems and codes: Signed and unsigned numbers and their arithmetic operations. BCD, Excess-3,
Gray and Alphanumeric codes
Boolean Algebra: SOP, POS, Min-term & Max-term, Minimization of Boolean equations using Boolean algebra
& K-maps
Combinational and Arithmetic circuits: Multiplexers, De-multiplexers, decoders, encoders, parity checkers,
half and full adders.
Sequential circuits: Flip-flops- RS, JK, D-type and master-slave flip-flops. Flip-Flop specifications. Counters
Binary, ripple, synchronous, Mod-K and decade counters and their design, Shift registrars and multi-vibrators.
Semiconductor memories: ROM, PROM, EPROM, Static and dynamic RAM, memory addressing
DAC and ADC: Weighted resistance DAC, R-2R ladder network, flash ADC, single and dual slope ADC,
successive approximation ADC.
Textbooks & Reference Books:
310=4
300=3
DC Circuits, KCL, KVL, Network theorems, step response and transients. RC, RL and RLC circuits. Phasor
diagram, Solution of AC circuits, power in one and three phase AC circuit. Two port networks. Operational
amplifiers: model and applications. Magnetic circuits, transformers: modeling and analysis. Energy in magnetic
field. Production of field and EMF. Electromechanical energy conversion. Principles of measurements. Electrical
and electronic materials.
Experiments based on above topics.
Reference Books:
400=4
AC AC converters: Single phase AC voltage controller for R & R-L loads, Three phase AC voltage controller for
R load.
Unit IV: DC Power Converters
DC - DC converters: DC Chopper: - Working principle of step down chopper and step up chopper, choppers for
R-L load, DC- AC converters: Inverter: - Working principle of single phase, Bridge inverter for R & R-L load
Unit V: DC & AC Rotating Machines
Principle of Electromechanical energy conversion
DC machines: Construction, Induced emf & torque equations, Characteristics of shunt and series machines and
Speed Control
Three phase induction motors: Construction, Working and Characteristics.
Synchronous machine: Construction, Working and Voltage/Speed Regulation
Unit VI: Transformers
Single Phase and Three phase Transformers: Construction, Working Principle, Equivalent circuit, Phasor
Diagaram, Open/Short Circuit Tests, Voltage Regulation
Text Books:
1. M. D. Singh & K B Khanchandani, Power Electronics, TMH, New Delhi.
2. Guru, Hiziroglu, Electric Machinery & Transformer
Reference Books:
1. M. H. Rashid, Power Electronics circuits devices and applications, PHI 3rd edition, 2004 edition, New Delhi.
2. P.C. Sen, Modern Power Electronics, S Chand & Co New Delhi.
3. Ned Mohan, T. Undeland & W. Robbins, Power Electronics Converters applications and design 2nd edition,
John Willey & sons, Singapore.
4. H. Cotton, Electrical Technology, CBS.
5. Nagrath Kothari, Electrical Machines, TMH.
EECL 215B
310=4
Unit I: Introduction
Vector Analysis, Coordinate System, Gradient, Divergence, Curl, Laplaceian in rectilinear, Cyllindrical, Spherical
Coordinate System, Line, surface and volume integrals, Divergence Theorem, Stoke's theorem
Unit II: Time varying fields and Maxwell's equations
Introduction, The Equation of Continuity For Time-Varying Fields, Inconsistency Of Ampere's Law, Maxwell's
Equation in Integral and differential form, Physical Significance of Maxwell Equation, Boundary conditions.
ELECTROMAGNETIC WAVES
Solution For Free-Space Conditions, Uniform Plane Waves & Propagation, The Wave Equations For A
Conducting Medium, Sinusoidal Time Variations, Conductors And Dielectrics, Polarization, Reflection By A
Perfect Conductor Normal Incidence & Oblique Incidence, Reflection By A Perfect Dielectric Normal Incidence
& Oblique Incidence, Reflection At The Surface Of A Conductive Medium.
RADIATION
Potential Functions And Electromagnetic Field, Potential Functions For Sinusoidal Oscillations, Alternating
Current Element, Power Radiated By Current Element, Application To Short Antennas, Radiation From A
Monopole Or Dipole.
Transmission Line
Circuit theory analysis of Transmission Line, Loss less and Lossy transmission lines, Reflection coefficient,
Transmission Coefficient, VSWR, Input Impedance, Matching of Transmission Line, pulse excitation. Group
Velocity and Phase velocity.
Reference Books:
1. Fields & Wave Electromagnetics , DK Cheng
2. Electromagnetic Waves and Radiating Systems, Jordan & Balmin
3. Elements of Electromagnetics, Sadiku
4. Engineering Electromagnetics: W H Hayt & J A Buck
5. Advanced Engineering Electromagnetics: C A Balanis
EECL 204B
310=4
Differential Amplifiers
Basics of Differential Amplifier, Transistorized Differential Amplifier, Configurations of Differential Amplifier,
Analysis of Dual Input Balanced Output Differential Amplifier, Constant Current Bias, Current Mirror Circuit,
Cascading of Differential Amplifiers.
Introduction to Operational Amplifiers
The Ideal Op-Amp, Block diagram Representation of Op-Amp, Voltage Transfer Curve of Op-Amp, Integrated
Circuit: Package Types, Pin Identification and Temperature- Ranges, Interpretation of Data sheets and
Characteristics of an Op-Amp, Inverting and Non-Inverting Configuration, Ideal Open-Loop and Closed-Loop
Operation of Op-Amp, Block diagram Representation of Feedback Configurations, Voltage-Series Feedback
Amplifier, Voltage-Shunt Feedback Amplifier, Differential Amplifiers with One & Two Op-Amps.
Frequency Response of an Op-Amp
EECL 205B
Analog Communication
310=4
310=4
Introduction to 8085 Microprocessor: Functional block diagram Registers, ALU, Bus systems, Memory &
Instruction cycles Timing diagrams, Address Decoding techniques, Addressing modes, Instruction Set,
Assembly Language Programming, Interrupts-Types & handling, ISR, Stack architecture
Memory and Peripheral interfacing: Basic interfacing concepts - Memory space partitioning - Buffering of
buses Timing constraints - Memory control signals - Read and write cycles, Interfacing RAM, ROM, 8255PPI,
Interfacing applications using 8255. Need for direct memory access - DMA transfer types
Intel 16 bit Microprocessor: Register organization of 8086 Architecture - Physical Memory organization I/O addressing capability, Addressing modes of 8086 - Instruction set of 8086 - Assembler directives and
operators, Assembly language programming, Interrupt Architecture
Freescale 32 bit ColdFire Processor:-Introduction to ColdFire Core, Comparison with 8085 & 8086
Architecture, Introduction to MCF5223X Microprocessor Architecture & Functional Blocks, concept of User and
Supervisor Programming Model
TEXT BOOK
1. Gaonkar R. S, Microprocessor Architecture: Programming and Applications with the 8085/8086A, New
Age International (P) Ltd., 1995.
2. K. Ray, K. M. Bhurchandi Advanced Microprocessors and Peripherals Architecture, Programming and
Interface Tata McGraw Hill 2000- sixteenth reprint
3. ColdFire Microprocessors & Microcontrollers Munir Bannoura, Rudan Bettelheim and Richard Soja, AMT
Publishing.
REFERENCES
1. Douglas V. Hall, Microprocessors and Interfacing Programming and Hardware, Tata McGraw Hill, 1995.
2. Daniel Tabak, Advanced Microprocessors, McGraw Hill,1995.
3. David A. Patterson, John.L.Hennessey Computer organization and design-the hardware/software
Interface- Elsevier-Morgan Kaufmann Publishers-2005-Third Edition. Unit IV and V.
Digital System Design using VHDL
EECL 309B
310=3
Review: Review of concepts of combinational and Sequential logic circuit design, design of digital systems with
help of state machine charts and their realization through Gates, Multiplexers and other discrete digital ICs.
Synchronous and Asynchronous Sequential circuits
Sequential Circuits: Synchronous sequential circuits and finite state machines (FSM); Mealy machine; Moore
machine; State table; State diagram; Synchronous Sequential circuit analysis; System design; State
minimization; State assignment; ROM implementation; Asynchronous sequential circuits, Threshold functions ,
Hazards, Pulse Mode Circuits.
Introduction to VHDL: Basic language elements & behavioral modeling, Data flow modeling structural,
Generics and configurations - Subprogram and overloading Packages and Libraries Model simulation.
Design of Hardware using VHDL as examples code converters, multiplexer, de-multiplexer, binary adders and
multipliers, counters. Design of sequential circuits using VHDL, counters, shift registers
Basics of FPGA, CPLD and programmable devices in general. FPGA programming, design and implementation of
digital system, ASIC design using CAD tools. Overview of ASMs realization through PLDs and design of FSM /
simple microprocessor through Algorithmic State Machine concept.
Text & Reference books:
Daniel Gajski: Principles of Digital Design
Bhasker: A VHDL Primer 3/e
Pedroni: Circuit Design with VHDL
Perry: VHDL: Programming by examples
Palnitkar: Verilog HDL, 2/e
Antenna & Wave Propagation
EECL 203B
3 1 0 =4
EECL 301B
Digital Communication
310=4
Base band pulse transmission: Introduction, matched filter, error rate due to noise, inter symbol
interference, Nyquists criterion for distortion less base band binary transmission, correlative level coding.
Digital pass-band transmission: Introduction, pass band transmission model, Gram Schmidt
orthogonalization procedure, geometric representation of signals, response of bank of correlators, to noisy
input, coherent detection of signals in noise, probability of error, correlation receiver, detection of signals with
unknown phase, hierarchy of digital modulation techniques, coherent binary PSK, coherent binary FSK,
coherent QPSK, coherent minimum shift keying, differential phase shift keying, comparison of binary &
quaternary modulation schemes, M-ary modulation techniques, power spectra, bandwidth efficiency,
synchronization.
Source coding: Mathematical models of information sources, a logarithmic measure of information, source
coding theorem, source coding algorithms- the Huffman source coding algorithm & the LEMEPel-Ziv source
coding.
Channel capacity & coding: Modeling of communication channels, channel capacity, bounds on
communication, coding for reliable communication, linear block codes, cyclic codes, convolutional codes.
Reference Books:
Control Systems
310=4
310=4
Convolution, Impulse response and superposition integral or sum for linear, time-invariant (LTI) systems. LTI
systems characterized by differential or difference equations using time & transform methods, frequency
response of LTI Systems.
Structures For Discrete-time Systems: Block diagram representation of linear constant coefficient
difference equations - their interconnection schemes; direct form-I, direct form-II, cascade form and parallel
form structures. Finite word-length effect-number representation, analysis of effect of coefficient quantization
and rounding of noise; zero input limit cycles in fixed-point realizations of IIR digital filters.
Fourier Transform (Discrete): DTFT & DFT and properties of DFT; circular convolution; linear convolution
using DFT.
Text & Reference Books:
Signals and Systems, S. Haykin and B. Van Veen, New York: John Wiley and Sons, 1999.
Fundamentals of Signals and Systems using MATLAB, E. W. Kamen and B. S. Heck, Prentice-Hall
Signal Processing and Linear Systems, B. P. Lathi, Berkeley Cambridge Press, ISBN 0-941413-35-7, 1998.
EECL 316B
300=3
Introduction: Introduction to Embedded Computing, Issues and Challenges in Embedded System Design,
Trends: SoC, custom designed chips, configurable processors and multi-core processors.
Embedded Processor Architecture (Intel 8051 Platform-8 bit): Harvard Architecture, RISC v/s CISC,
Processor v/s Controller, CPU Architecture and instruction sets : Hardware architecture- program memory
consideration register file structure and addressing modes CPU Register instruction set Port
architecture, Timer/Counter Block Configuration & Interrupts, Serial Port Configuration & Interrupts, External
interrupts
Embedded Processor Architecture (Freescale S12X Platform-16 bit):Introduction to the S12 and S12X
Microcontroller, Core Architecture, Clock Generation & Resets, Port Architecture, Timer functions, Serial
Communication Interface (SCI), Serial Peripheral Interface (SPI), Inter-Integrated Circuit (I2C) Interface,
Interrupts, Analog-to-Digital Converter, Controller Area Network (CAN), Internal Memory Configuration and
External Memory Expansion
Development tools and Programming: Hardware and Software Development Tools, C Language
Programming, Kiel Vision IDE & Simulator, CodeWarrior tools Project IDE, Compiler, Assembler and
debugger, JTAG and hardware debuggers, Code optimization.
Embedded Applications & Interfacing: Embedded System Applications using Keyboards, display, Relays,
Motors, Sensor Interface, ADC, DAC, SCI, SPI, RTC, I 2C, Interrupts with 8051 & S12X
Text Books
1. Mazidi, 8051 Microcontrollers & Embedded systems, Pearson
2. John B Peatman, Design with PIC Microcontrollers, Pearson Education Asia, Low price edition 2002
3. The HCS12/9S12, An Introduction to Hardware and Software Interfacing By Han-Way Huang
Reference Books
1. A.K. Ray, K.M. Bhurchandi, Advanced Microprocessors and Peripherals Architecture, Programming and
Interface, Tata McGrawHill- 2000 16th reprint.
2. Myke Predko, Programming and Customizing the 8051 Microcontroller, Tata McGrawHill- 2000.
3. Micro chip / PIC Microcontroller Data Books
4. Assembly and C Programming for the Freescale HCS12 Microcontroller Second Edition by Fredrick M. Cady
5. Embedded Microcomputer Systems: Real Time Interfacing 2nd Edition by Jonathan W. Valvano
EECL 306B
300=3
Signal Processing
310=4
Fundamentals of Signals and Systems using MATLAB, E. W. Kamen and B. S. Heck, Prentice-Hall
Real Time Digital Signal Processing
EECL 314B
310=4
Efficient Computation of DFT: Computational complexity; FFT algorithms - the decimation-in-time and
decimation-in-frequency; signal flow graph-Butterfly computations, in-place computations; analysis of
computational complexity.
Filter Design Techniques: Characteristics of practical frequency selective filter; design of FIR filters by
windowing. Characteristics of Butterworth & Chebyshev filters-frequency transformation; design of IIR filters
from continuous-time filters-Impulse invariance & bilinear transformation methods.
Introduction of DSP Processors: Review of need for DSP Processors, MAC, Modified Bus Structures, Memory
access schemes, Harvard, VLIW architecture, On-chip peripherals, Addressing modes, Concept of Pipelining.
Issues of Real Time DSP applications, Fixed point and Floating point Processors.
Introduction to TMS320C55x Fixed point DSP Processor: TMS320C55x Architecture, Interrupts and
Interrupt Vector, TMS320C55x Peripherals, External Memory Interface, Direct Memory Access, Multi-Channel
Buffered Serial Ports, Clock Generator and Timers, General Purpose Input/output Port, TMS320C55x
Addressing Modes, Direct Addressing Modes, Pipeline, Instruction Set, Assembly Language Programming,
Assembly Code Generation by C Compiler, Mixed C-and-Assembly Language Programming, Phase-Locked Loop
and Timers, Direct Memory Access.
Introduction to Freescale DSP563xx fixed point DSP Processor: Introduction to Freescale DSP563xx
family processors, Architecture of Freescale DSP5637, MAC, AGU, PCU, On-chip Memory, Internal Buses,
Direct Memory Access, Comparison of features of DSP56300 family processors.
Real Time Applications of DSP: Filtering, Modulation, Audio and Image Processing.
Reference Books:
EECL 315B
400=4
Introduction: Overview of the VLSI technologies and ASIC Design Flow, VLSI Circuits and Analog IC Design
Fundamentals.Detailed Design flow .
Fundamentals of Semiconductor Fabrication: Cleanroom technology - Clean room concept Growth of
single crystal Si, surface contamination, cleaning & etching. Oxidation Growth mechanism and kinetic
oxidation, oxidation techniques and systems, oxide properties, oxide induced defects, charactrisation of oxide
films, Use of thermal oxide and CVD oxide; growth and properties of dry and wet oxide, dopant distribution,
oxide quality. Solid State Diffusion Fick's equation, atomic diffusion mechanisms, measurement techniques,
diffusion in polysilicon and silicon di-oxide diffusion systems. Ion implantation Range theory, Equipments,
annealing, shallow junction, high energy implementation. Lithography Optical lithography, Some Advanced
lithographic techniques. Physical Vapour Deposition APCVD, Plasma CVD, MOCVD. Metallisation - Different
types of metallisation, uses & desired properties.
CMOS: Introduction to CMOS, CMOS Capabilities and Limitations and CMOS Transistors and Logic . VLSI
Circuits Design Theory. Process overview. Transistor device model, Circuit characterization. Technology
libraries Overview. Pre-layout parasitics estimation. Post layout simulation techniques. VLSI Circuit Schematics
and Simulation EDA Tool Flow.
Reference Books:
1. May G S and Sze S M, Fundamentals of Semiconductor Fabrication, John Wiley & Sons, India.(2004)
2. Sze S M, VLSI Technology, 2nd Ed., McGraw Hill International Edition (1988)
3. Ghandhi S K, VLSI fabrication Principles, John Wiley Inc., New York (1983).
4. Streetman BG, Solid State Electronics Devices, Prentice Hall of India, New Delhi, (1995).
5. Chang C Y and Sze S (Ed),ULSI Technology, McGraw-Hill Companies Inc. (1996).
6. Allen, Phillip E. & Holberg, Douglas R. CMOS Analog Circuit Design Oxford University Press
(2002).
7. J. Baker CMOS: Circuit Design, Layout, and Simulation 2nd Edition,Wiley IEEE Press (2007)
8. Neil H. E. Weste, Kamran Eshraghian Principles of CMOS VLSI Design 2nd edition , Pearson
Education India, (1999).
9. Kang S.M, Leblebici Y,"CMOS Digital Integrated Circuits : Analysis and Design" Tata McGraw
Hill, 3rd ed. 2006.
EECL 402B
Microwave Engineering
310=4
Unit I: Introduction
Microwave Frequency Range, Characteristics features of microwaves, Microwave Systems.
Unit II: Transmission line and Waveguides
General solution for TEM, TE and TM waves, Rectangular waveguides, Circular Wave guides, Evanescent
modes, Dominant modes, Power flow and energy storage in a waveguide, Planar transmission lines, Microstrip,
Strip line, slot line, Smith Chart and its applications.
Unit III: Microwave Network and Passive Components
S- Parameters, Scattering Matrices for Some Typical Networks, Microwave cavities, Microwave Hybrid circuits,
Waveguide Junctions, Magic Tee, Rat Race Circuits, Directional Couplers, Waveguide bends, Matched Loads,
Coupling, Attenuators, Phase shifters.
Unit-IV: Microwave Solid State Devices and Application
Tunnel Diodes, Gunn Effect Diodes, Read Diodes, IMPATT Diodes, TRAPATT Diodes, PIN Diodes.
Unit-IV: Microwave Vacuum Tube Devices
Klystron, Reflex Klystron, Magnetron, TWT
Unit-V: Microwave Measurements
Slotted line arrangement and VSWR meter, Measurement of wave-guide impedance at load port by slotted line,
Microwave power measurement, Microwave frequency measurement techniques.
Reference Books :
1. Liao Y.S. Microwave Devices, PHI
2. Collins R.E. Microwave Engine, McGraw Hill.
3. Reich J.H. -Microwave Principles, East West Press
4. Pozar, D M -Microwave Engineering John Wiley & Sons
5. Gupta, K.C- Microwave Engg: New Age Pub.
6. M.L Sisodia and Vijaya Laxmi Gupta- Microwave : Introduction to circuits, devices and antennas , New Age
publication
7. P. A. Rizzy- Microwave Engineering: Passive Circuits: Prentice Hall Int.
Optical Fiber Communication
EECL 308B
3-0-0 = 3
Introduction
Introduction to Telecommunications and Fiber Optics, The Evolution of Fiber Optic Systems, Basic Optical Laws
and Definitions, Propagation of light inside fiber, Critical-Angle, Numerical-Aperture, Acceptance-Angle ,Cut-off
wavelength , V-Number, Mode Field Diameter, Leaky Modes , Single and Multi-Mode Fibers, Fiber Types,
Waveguide Equations, Step-Index Fiber Structure, Graded-Index Fiber Structure, Splicing Techniques and
Connectors, Elements of an Optical Fiber Transmission Link. Merits and Demerits of Fiber Optics over
conventional copper wire systems
Losses and Dispersion
Attenuation, Absorption Losses, Scattering Losses, Bending Losses, Core and Cladding Losses, Total combined
Losses.
Dispersion, Group-Delay, Material Dispersion, Waveguide Dispersion, Intermodal Distortion.
Optical Sources and Detectors
Light-Emitting Diodes (LEDs), LED Structures, Characteristics of LEDs, Laser Diodes, Laser Diode Modes and
Threshold Conditions, Laser Diode Structures, Characteristics of Laser Diodes, Comparison between LED and
Laser Diode. Physical Principles of Photodiodes, PIN Photodetector, Avalanche Photodiodes (APD),
Photodetector-Noise, Noise-Sources, Signal-to-Noise Ratio, Comparison of Photodetectors. Optical Receiver.
Optical Fiber Network and its Components
Point-to-Point Links, System Considerations, Link Power Budget, Rise-Time Budget. Single and Multi-Hop
Networks, SOA, EDFA, WDM-MUX/DEMUX, Optical-Switches, Couplers, Splitters, Photonic Switching.
Economics and Potential Applications of Optical Fiber Communication Systems
Economics with Optical Fiber Communication Systems, Prospects for Optical Fiber Communication, Fiber-Optic
Applications, Applications of Integrated Optics.
Text & Reference Books:
John M Senior, Optical Fiber Communication-Principles and Practice ", Prentice Hall
M K Liu, "Principles and applications of optical communication ", Tata Mc Graw Hill
EECL 407B
International
300=3
EECP 103B
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
00-2=1
EECP102B
00-2=1
1.
2.
3.
4.
5.
002=1
EECP 204B
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
002=1
Study of PIN diagram of various ICs & to test the logic gates and verify their truth table.
Implementation of Half adder, Full adder & Half subtracter using NAND gates only.
Implementation of Boolean functions of three and four variables using 74153 (4:1) Mux.
Implementation of De-multiplexer, decoder and encoder.
To add two 4 bit binary numbers using 7483.
To compare two 4 bit binary number using 7485 (magnitude comparator).
To verify the operation of different modes of shift Register using 7495.
To design an asynchronous counter of any modulus using JK FFs (7473).
To design a synchronous counter of any arbitrary count using 7473.
Design of BCD to seven-segment display using logical gates ICs.
To study and verification by truth tables of SR, JK, MSJK, D & T flip flops.
To design and test non-sequential counter and study of shift registers.
EECP 208B
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
002=1
EECP 213B
002=1
DC Circuits, KCL, KVL, Network theorems, step response and transients. RC, RL and RLC circuits. Phasor
diagram, Solution of AC circuits, power in one and three phase AC circuit. Two port networks. Operational
amplifiers: model and applications. Magnetic circuits, transformers: modeling and analysis. Energy in magnetic
field. Production of field and EMF. Electromechanical energy conversion. Principles of measurements. Electrical
and electronic materials.
Experiments based on above topics.
Electronics Workshop
EECP 214B
002=1
1.
2.
3.
Identification of Components
Using Multi-meter for tracing existing circuits
Soldering & De-soldering of Components
4.
Design, Simulation, PCB Design & Fabrication, Component Soldering & Testing of DC Regulated Power
Supply circuit or Similar
EECP 203B
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
0 0 2 = 1
EECP 206B
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
002=1
To study and verify the op-amp parameters including Offset voltage, CMRR & Slew-Rate
To study and verify the Op-amp as an Inverting & Non-Inverting amplifier.
To study and verify the application of an Op-amp as a Differentiator & Integrator.
To study and verify the application of an Op-amp as a Comparator, Schmitt Trigger, Peak Detector, Zero
crossing detector.
To study and verify the application of an Op-amp as a Clipper & Clamper.
To study and verify the application of an Op-amp as a Precision Rectifier.
To study and verify the application of an Op-amp as a Voltage-to-Current / Current-to-Voltage Converter.
To study and verify the application of an Op-amp as an Astable Multivibrator / Monostable Multivibrator
using IC 555 timer.
To study and verify Phased Lock Loop(PLL)
To study the performance of a 3 pin fixed voltage regulator and a 3 pin variable Voltage regulator.
To study the working of Op-amp based filters.
To study and verify the application of op-amp as Wave-form generator
To study and verify the application of op-amp as log / anti-log amplifier.
To study and verify the application of op-amp as A/D & D/A convertor
EECP 205B
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
002=1
EECP 209B
0 0 3 = 1
25-30 Programs in 8085 & 8086 Assembly Language including Interfacing problems(using 8255PPI) to
interface to LEDs, Switches, ADC, Stepper Motor, LDR etc.
EECP 310B
0 0 2 = 1
Design of Simple combinational logic circuits like Adders, Subtractors, Multiplexers, De-multiplexers, Encoders,
Decoders, Latches, Comparators,
Design of Flip-Flops, Counters, Registers, Shift Registers,
Design of ALU
Design of State Diagrams for Digital System Design
Design of 7 segment Driver circuit, Motor Drive, Traffic Light Control, Vending Machine
Implementation of Circuits on Spartan 3E/ Virtex-II boards
EECP 312B
0 0 3 = 1.5
At least 25 practical based on the 8051 Microcontroller & S12X (Assembly Language, Embedded C, Interface of
Keys, LED Matrix, ADC, DAC, Stepper Motor, SPI Protocol based interface)
EECP 302B
1.
2.
3.
4.
5.
6.
7.
8.
002=1
EECP 304B
002=1
002=1
Using MATLAB
1. Representation of time-series; computation of convolution
2. Response of a difference equation to initial conditions; stability
3. DFT computation
4. Computational experiments with digital filtering
Using DSP processor
5. Sampling & Waveform generation
6. FIR & IIR Filters Implementation
7. Fast Fourier transforms
8. Quantization Noise
9. Adaptive Filters
10. Multirate Signal Processing
EECP 314B
VLSI Laboratory
0 0 2 = 1
To
To
To
To
To
To
To
To
To
To
To
To
To
EECP 403B
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
002=2
0-0-2 = 1
EECD 401B
0 0 8 = 4
Team formation for designing and fabrication of a selected product / project using project management
procedures. Need identification, assessment of alternative designs, selection of design for development,
defining design and performance specification, and testing procedure. A detailed time-line is to be provided
which is to be updated regularly.
Detailed design of the product to be made keeping in view the
manufacturability of the design. A complete bill of materials is to be prepared. A demonstration of the proof of
concept to be provided by the end of the semester.
EECD 402B
0 0 20 = 10
The same student team continues working as per work plan of Phase-I. Design of PCB, procurement of
components is to be carried out. Acceptance tests for hardware and software are to be carried out vis--vis
specifications from Phase-I. Functioning product is displayed at an Open House. Professional quality
documentation of all designs, data, drawings, and results, change history, overall assessment, etc. is
mandatory, along with a final presentation.
EECE 404B
300=3
Unit-I
MOS Inverter: Introduction to resistive - load inverter, inverter with n-type MOSFET load, CMOS inverter
Switching Characteristics and Interconnects Effects: Introduction, Delay time definitions, Calculation of
delay
times, Inverter design with delay constraints, MOS Inverters: Switching Characteristics & Interconnect Effects.
Estimation of interconnect parasitic.
Unit-II
Sequential MOS Logic Circuits: Introduction, SR latch circuits, Clocked latch and Flip-flop circuits, CMOS Dlatch and edge -triggered flip-flop. Dynamic MOS Logic Circuit
Unit-III
Semiconductor Memories: Introduction, Dynamic random access memory (DRAM), Static random acces
memory(SRAM),Non-volatile memory.
Low Power CMOS Logic Circuits: Introduction, Overview of power consumption, Switching power dissipation
o
CMOS inverter, Estimation and optimization of switching activity.
Reference Books:
1. Rabaey J.M, Chandrakasan A, Nikolic B , Digital Integrated Circuits- A Design Perspective, 2nd Ed, Prentice
Hall
2. S M Kang and Y Lebici,CMOS Digital Integrated Circuits-analysis and design, 3rd ed,McGraw Hill.
3. Pucknell D A and Eshraghian K, Basic VLSI Design, Prentice Hall India, New Delhi, (2003).
4. Glaser L and Dobberpuhl D, The Design and Analysis of VLSI Circuits, Addison Wesley, (1985).
5. Weste N and Eshranghian K, Principles of CMOS VLSI Design, Pearson Education Asia, (2001).
EECE 406B
300=3
Unit 1: Review of Computer Networks & Data Communication, Wireless LANs: IEEE 802.11 WLANs - protocol
architecture, Physical layer, MAC layer, analysis, deployment of 802.11 infrastructures.
Unit 2: WPANs: IEEE 802.15.4, Bluetooth, ZigBee. Protocol architecture, Physical layer, MAC layer, analysis,
deployment of 802.15.4 infrastructure.
Unit 3: Introduction to MANETS; MAC Protocols, Routing Protocols, performance comparison; Quality of
Service.
Unit 4: Wireless Sensor Networks (WSNs): Overview/Architectures; Data Dissemination/Data Gathering;
Routing Protocol, Security, Power control; Cross layer design; Localization.
References
1.
Rappaport, Wireless Communications Principles & Practices, PHI, Latest Edition
2.
C. Siva Ram Murthy and B. S. Manoj, Ad Hoc Wireless Networks: Architectures and Protocols,
Pearson Education, Inc., 2005.
3.
Holger Karl and Andreas Willig, Protocols and Architectures for Wireless Sensor Networks, John
Wiley & Sons, 2005.
4.
Charles E Perkins, Ad Hoc Networking, Addison Wesley, 2001.
5.
Jochen Schiller, Mobile Communications, Addison Wesley, 2000.
6.
Ramjee Prasad and Luis Munoz, WLANs and WPANs towards 4G wireless, Artech House,
7.
Selected papers from IEEE & ACM to be provided by Faculty
EECE 407B
Speech Processing
300=3
300=3
This is a basic undergraduate-level class that covers fundamentals image processing, computer vision, and
Multimedia computing. The students will be exposed to dealing with image and video data through
programming assignments using Java and Matlab.
1. Introduction to Multidimensional Signal Processing
Historical overview, multimedia representations, software tools, authoring tools. Multidimensional
Fourier Transform, sampling and Filtering (including decimation and interpolation), Introduction to
wavelet transformation
2. Human Visual Perception
Human Visual System, visual masking, noise visibility, color vision
3. Image Scanning and Display
Acquisition and Display of images (camera, digitizers, Film, printers); sampling and quantization
issues
4.
5.
6.
7.
Text Books
1. R. Gonzalez and R. Woods, Digital Image Processing, 2nd Ed., Prentice-Hall 2002
2. A. K. Jain, Fundamentals of Digital Image Processing, Prentice Hall, 1989.
3. W. K. Pratt, Digital Image Processing, Wiley, 1991
4. A. M. Tekalp, Digital Video Processing, Prentice{Hall, 1995
5. M. Ghanbari, Video Coding - an introduction to standard codecs, IEE Telecommunica-tions Series,
1999W. Burger & M. BurgeDigital Image Processing: An algorithmic introduction using Java,
Springer 978-1-84628-379-6
6. Z. Li and M. S. Drew, Fundamentals of Multimedia, Prentice Hall 0-13-061872-1
EECE 409B
Multimedia Communication
300=3
EECE 410B
300=3
Module 01
Introduction to MEMS , MEMS and VLSI design , MEMS examples , overview of MEMS fabrication , Special
MEMS materials and their properties . Potential of MEMS in Industry.
Module 02
Bulk Micromachining : Isotropic Etching and Anisotropic Etching, Wafer Bonding, High Aspect-Ratio Processes
(LIGA)
Module 03
Surface Micromaching: Surface micromachining techniques, Polysilicon surface micromachining,
Characterisation of MEMS devices.
Module 04
Introduction to Smart MEMS sensors, Sensor Principles and Examples , Microactuators and examples .
Mechanical design of microactuators,
Module 05
Design of MEMS Pressure sensors , Design of silicon accelerometers , Examples of MEMS actuators
Text Books: .
1. MEMS and Microsytems Design and Manufacture, Tai- Ran Hsu, Tata McGraw Hill
2. MEMS, Nitaigour Mahalik, Tata McGraw Hill
Reference Books:
1. Stephen D. Senturia, Microsystem Design, Kluwer Academic Publishers,
2.M-H. Bao, Elsevier, Micromechanical Transducers: Pressure sensors, accelerometers, and gyroscopes, New
York, 2000
EECE 411B
Optoelectronic Devices
300=3
Unit-I
Introduction: Semiconductor materials; Crystal lattices; Bulk Crystal growth, epitaxial growth.
Energy bands and Charge carriers in Semiconductors: direct and indirect semiconductors; variation of
Energy bands with alloy composition. Charge carriers in semi-conductors-electrons, holes, effective mass;
intrinsic and extrinsic materials. Drift of carriers in electric and magnetic fields.
Unit-II
Excess carries in Semiconductors: Optical absorption; luminescence - photoluminescence,
electroluminescence ,electroluminescence. Carrier lifetime and photoconductivity, diffusion of carriers.
P-N Junction Diode: Current-Voltage Characteristics; hetrojunctions.
Unit-III
Optoelectronic Devices: Principle of operation and characteristics; Light emitting diodes, lasers, photo
detectors, solar cells.
Relevance of III-V and IV-VI material-systems in optoelectronic devices.
Integrated Optics: Optical waveguides-passive, electro-optical; optical modulators and switches; optical
storage devices.
Reference Books:
1. Pallab Bhattacharya, Semiconductor Optoelectronic Devices, 2nd Edition
2. Street B G and Banerjee S, Solid State Electronic Devices, PHI New Delhi, (2004)
3. Sze S M, Physics of Semiconductors Devices, Wiley Eastern Limited, New Delhi.
4. Wilson and Hawkes, Optoelectronics; An Introduction, 2nd Ed., PHI
5. Hummel R E, Electronic Properties of Materials, Narosa Publishing House, New Delhi.
EECE 425B
300=3
EECE 434B
2-0-2 = 3
Embedded Architecture: Embedded systems Overview, Design Challenge Optimizing design metrics,
Processor Technology, Embedded system design process- Requirements, Specification, Architectural Design,
3-0-0 = 3
Triangulation. Issues involved in Tracking of moving targets, Collaborative signal processing, its need &
challenges. Distributed estimation in sensor networks using Kalman Algorithm.
Reference Books:
5. Fundamentals of Mobile & Pervasive Computing, Gupta, TMH
EECE 444B
300=3
Introduction:
Historical background, Radar terminology, Radar band designations, Basic Radar, Radar block diagram, Radar
frequencies, Radar-clutter, Information from radar signals, propagation of Radar waves, Applications of Radar.
Radar Equation
Detection of signals in noise, receiver noise and signal to noise ratio, Radar cross-section of targets,
transmitter power, PRF, Antenna parameters, other Radar equation considerations.
MTI and Pulse Doppler Radar
FM and CW-Radar, Doppler and MTI Radar, Delay-line cancelers, Digital MTI processing, moving target
detector, Pulse Doppler Radar,
Tracking Radar
Tracking with Radar, Mono-pulse Radar, Conical and Sequential Lobing and ADT.
Detection of Signals in Noise
Detection, Matched filter receiver, Detectors, automatic detection, signal management.
Radar Antenna
Antenna parameters, Phased Array Radars ESPAA, MSPAA and Radiation pattern synthesis.
Radar Transmitters and Receiver
Linear beam power tubes, CFA, solid-state RF-power sources, Radar receiver.
Displays: A-scope, B-scope, PPI, modern displays.
Radio Navigation:
Radio direction finding, LORAN Radio ranges, Distance measuring equipments, Instrument and landing systems
(ILS), MLS.
Textbooks:
1. Introduction to Radar Systems 2nd ed- M.I. Skolnik- McGraw Hill
2. Radar Principles- N. Levanon- Wiley
3. Principles of Modern Radar- J.L. Eaves, and E.K. Reedy- Chapman & Hall
4. Elements of Electronic Navigation - N.S. Nagaraja ( TMH publication)
Virtual Instrumentation using LabView
EECE 445B
300=3
Review of virtual Instrumentation: Historical perspective, advantages, block diagram and architecture of a
virtual instrument, data-flow techniques, graphical programming in data flow, comparison with conventional
programming.
VI Programming Techniques: VIS and sub-VIS, loops and charts, arrays, clusters and graphs, case and
sequence structures, formula nodes, local and global variables, string and file I/O.
Data Acquisition Basics: ADC, DAC, DIO, counters & timers, PC Hardware structure, timing, interrupts, DMA,
software and hardware installation.
Common Instrument Interfaces: Current loop, RS 232C/ RS485, GPIB, System buses, interface buses:
USB, PCMCIA, VXI, SCXI, PXI, etc., networking basics for office & Industrial applications, VISA and
IVI, image acquisition and processing. Motion control.
Use of Analysis Tools: Fourier transforms, power spectrum, correlation methods, windowing & filtering. VI
applications in various fields.
Lab work will include practical based on learning & Utilizing LabView Software
Text Books:
1. Gary Johnson - Labview Graphical Programming, Second edition, McGraw Hill, Newyork, 1997.
2. Lisa K. wells & Jeffrey Travis - Labview for everyone, Prentice Hall, New Jersey, 1997.
Reference Books:
3. Sokoloff - Basic concepts of Labview 4, Prentice Hall, New Jersey, 1998.
4. S.Gupta, J.P. Gupta - PC interfacing for Data Acquisition & Process Control, Second edition, Instrument
Society of America, 1994.
5. LabView users manual.
6. National instruments Product catalog.
7. Virtual Instrumentation Using LabView, Gupta S., Tata McGraw Hill Publishing Company Limited.
First Year
Course Title
Wireless Networks & Protocols
Advanced Digital Communications
Advanced DSP & Applications
Image & Video Processing
Integrated Circuit Design
Wireless Networks Lab
Signal Processing Lab
VLSI Lab
Semester II
Course Code
EECL 104P
EECL 108P
EECL 105P
EECL 201P
EECE 1XXP
EECP 202P
EECP 108P
EECP 104P
Total Credits
Course Title
Microwave Circuit Design
Optical Switching & Networks
Synthesis & Optimization of Digital Circuits
Embedded System Design
Elective-I
Embedded Systems Lab
Optical Networks Lab
Microwave Lab
L-T-P
3-0-0
3-0-0
3-0-0
3-0-0
3-0-0
0-0-2
0-0-3
0-0-3
(15-0-12)
Credits
3
3
3
3
3
1
1.5
1.5
19
Second Year
Course Title
Elective-II
Elective-III
Seminar
Thesis (Phase-I)
L-T-P
3-0-0
3-0-0
6-0-0
Semester IV
Course Code
EECD 202P
Total Credits
Credit`s
3
3
3
3
3
1
1.5
1.5
19
First Year
Semester III
Course Code
EECE 2XXP
EECE 2XXP
EECC 102P
EECC 205P
Total Credits
L-T-P
3-0-0
3-0-0
3-0-0
3-0-0
3-0-0
0-0-2
0-0-3
0-0-3
15-0-8
Credits
3
3
2
10
18
Second Year
Course Title
Thesis (Phase-II)
L-T-P
24 Weeks
Credits
24
24
List of Electives
Elective I
EECE 101P Audio & Video Processing
EECE 102P Wireless Sensor Networks &
Applications.
EECE 103P Advanced Wireless
Communications
EECE 104P Pattern Recognition
EECE
EECE
EECE
EECE
EECE
EECE
EECE
105P
106P
107P
108P
109P
110P
111P
EECL101P
3-0-0=3
Unit 1
Introduction to Fundamentals of Wireless Communication, Channel Diversity & Fading, Multiple Access
Techniques, Wireless LANs: IEEE 802.11 WLANs - protocol architecture, physical layer, MAC layer, analysis,
deployment of 802.11 infrastructure
Unit 2
WPANs: IEEE 802.15.4, Bluetooth, ZigBee, UWB. protocol architecture, physical layer, MAC layer, analysis,
deployment of 802.15.4 infrastructure
Unit 3
Mobile Ad-Hoc Networks (MANETS): Introduction; MAC Protocols - classification, comparative analysis; Routing
- reactive and proactive routing, power-aware routing, performance comparison; Quality of Service
Unit 4
Wireless Sensor Networks (WSNs): Overview/Architectures; Data Dissemination/Data Gathering; MAC
Protocols; Routing Protocol, Security, Power control; Cross layer design; Localization
Lab Work: Simulation of Various Wireless Networks using Qualnet Simulation Software
References
1. Rappaport, Wireless Communications Principles & Practices, PHI, Latest Edition
2. C. Siva Ram Murthy and B. S. Manoj, Ad Hoc Wireless Networks: Architectures and Protocols,
Pearson Education, Inc., 2005.
3. Holger Karl and Andreas Willig, Protocols and Architectures for Wireless Sensor Networks, John
Wiley & Sons, 2005.
4. Charles E Perkins, Ad Hoc Networking, Addison Wesley, 2001.
5. Jochen Schiller, Mobile Communications, Addison Wesley, 2000.
6. Ramjee Prasad and Luis Munoz, WLANs and WPANs towards 4G wireless, Artech House, 2003.
7. Selected papers from IEEE & ACM to be provided by Faculty
EECL102P
3-0-0=3
Unit I: Introduction
Digital communication system (description of different modules of the block diagram), Complex baseband
representation of signals, Gram-Schmidt orthogonalization procedure. M-ary orthogonal signals, bi-orthogonal
signals, simplex signal waveforms.
Unit II: Modulation
Pulse amplitude modulation (binary and M-ary, QAM), Pulse position modulation (binary and M-ary), Carrier
modulation (M-array ASK, PSK, FSK, DPSK), Continuous phase modulation (QPSK and variants, MSK, GMSK).
Unit III: Receiver in additive white Gaussian noise channels
Coherent and non-coherent demodulation: Matched filter, Correlator demodulator, square-law, and envelope
detection; Detector: Optimum rule for ML and MAP detection Performance: Bit-error-rate, symbol error rate for
coherent and non-coherent schemes.
Unit IV: Band-limited channels
Pulse shape design for channels with ISI: Nyquist pulse, Partial response signaling (duobinary and modified
duobinary pulses), demodulation; Channel with distortion: Design of transmitting and receiving filters for a
known channel and for time varying channel (equalization); Performance: Symbol by symbol detection and
BER, symbol and sequence detection, Viterbi algorithm.
Unit V: Synchronization
Different synchronization techniques (Early-Late Gate, MMSE, ML and spectral line methods)
Unit VI: Communication over fading channels
Characteristics of fading channels, Rayleigh and Rician channels, receiver performance-average SNR, outage
probability, amount of fading and average bit/symbol error rate.
EECL111P
3-0-0=3
Chapter I: Multirate Digital Signal Processing: The basic sample rate alteration time domain
characterization, frequency domain characterization: Cascade equivalences, filters in sampling rate alteration
systems, estimations of spectra from finite duration observation of signals.
Chapter II: Linear Prediction and Optimum Liner Filters: forward and backward linear prediction, AR
Lattice and ARMA lattice ladder filters, Wieners filters for filtering on prediction.
Chapter III: Adaptive Filters: Adaptive Direct form FIR Filters LMS and RLS Algorithm.
Chapter IV: Power Spectrum Estimation: Spectrum Estimation, Estimation using autocorrelation.
Periodogram Method. Non-Parametric Methods, Parametric Methods.
Chapter V: Applications of DSP: In Radar, Sonar, Biomedical, Communications, Speech and Image
Processing
Text Book:
1. Digital Signal Processing. Principles, algorithms, and applications by John G. Proakis and Dimitris G.
Manolakis,
Suggested Books:
1. Theory and applications of digital signal processing by Lawrence R. Rabiner and Bernard Gold, PHI.
2. Digital Signal Processing, A Computer Based approach, by Sanjit K. Mitra, Tata Mc Graw- Hill, 1998
EECL113P
3-0-0=3
UNIT-I:
Image processing: Fundamentals of digital image: Digital image representation and visual perception, image
sampling and quantization. Image enhancement: Histogram processing; Median filtering; Low-pass filtering;
High-pass filtering; Image coding and compression techniques: Entropy coding; Transform image coding;
Wavelet coding. Image analysis and segmentation: Feature extraction; Histogram; Edge detection;
Thresholding.
UNIT-II
Video processing: Fundamentals of digital video, Digital video formats. Basic digital video processing
techniques: Motion estimation and compensation; Interframe filtering; Motion-compensated filtering; Error
concealment.
UNIT-III
Video compression standards: H.261. H.263.PI.323, MPEG 1, MPEG 2, Other coding formats for text, speech,
image and video.
Detailed study of MPEG 4: coding of audiovisual objects, MPEG 4 systems. MPEG 4 audio and video, profile
and levels. MPEG 7 standardization process of multimedia content description, MPEG 21 multimedia framework,
Significant features of JPEG 2000, MPEG 4 transport across the internet
UNIT -IV
Synchronization: notion of synchronization, presentation requirements, reference model for synchronization,
Brief Introduction to SMIL: Multimedia operating System, Resource management and process management
techniques.
UNIT-V
Multimedia communication across networks: Multipoint data conferencing: T.120 Layered video coding, error
relevant video coding techniques, multimedia transport across IP networks and relevant products such as
RSVP, RTP, RTCP, DVMRP, multimedia in mobile networks, multimedia broadcast networks, and content based
retrieval in digital libraries Multicast, Multimedia over ATM
Textbook:
1. Alistair Mo_at and Andrew Turpin, Compression and Coding Algorithms, Kluwer Academic Publishers, Boston,
2002.
2. K.R. Rao & J.J. Hwang, Techniques & Standards for Image, Video & Audio Coding, Prentice Hall, 1996.
EECL115P
3-0-0=3
Unit I:
IC components - their characterization and design. Analysis and design of basic logic circuits. Linear ICs. Large
Scale Integration.
Unit II:
Basics of MOSFET ,Introduction to digital IC design, MOS inverter-Resistive load ,Depletion load, CMOS
inverter, Switching Characteristics of MOS inverter, design of combinational logic gates in CMOS- static and
dynamic CMOS -design, CMOS Transmission gates, Power consumption in CMOS gates, Low power CMOS logic
ckts ,MOS memory circuits, Bi-CMOS Logic ckts, Design of sequential logic circuits, Set up time, Hold time
requirements.
Unit III:
Low power design:
Need for low power VLSI chips, Sources of power dissipation on Digital Integrated circuits. Emerging Low
power approaches. Physics of power dissipation in CMOS devices.
Device & Technology Impact on Low Power Dynamic dissipation in CMOS, Transistor sizing & gate oxide
thickness, Impact of technology Scaling, Technology & Device innovation.
Power estimation, Simulation Power analysis: SPICE circuit simulators, gate level logic simulation, capacitive
power estimation, static state power, gate level capacitance estimation, architecture level analysis, data
correlation analysis in DSP systems.
Text Book & References :
1. R.S. Muller and T.I. Kamins, Device Electronics for Integrated Circuits, Wiley, 1986
2. DA. And Eshrachian K, Basic VLSI design systems & circuits, PHI, 1988
3. Geigar BR, Allen PE & Strader ME, VLSI design techniques for analog & digital circuit,Mc Graw
Hill, 1990
4. Carver Mead and Lynn Conway, Introduction to VLSI Systems, BS Publications, Indian Reprint
2003
5. Neil H. E. Weste & Kamran Eshraghian, Principles of CMOS VLSI Design, Pearson education asia,
2/e.
6. Gary K. Yeap, Practical Low Power Digital VLSI Design, KAP, 2002
7. Rabaey, Pedram, Low power design methodologies Kluwer Academic, 1997
8. Kaushik Roy, Sharat Prasad, Low-Power CMOS VLSI Circuit Design Wiley, 2000.
9.
EECL104P
3-0-0=3
Unit -1
Introduction
Importance of RF Design, RF Behavior of Passive Components: High Frequency Resistors, High-Frequency
Capacitors, High-Frequency Inductors. Chip Components and Circuit Board Considerations: Chip Resistors, Chip
Capacitors, Surface-Mounted Inductors.
Unit -2
An Overview of RF Filter Design I
Basic Resonator and Filter Configurations: Filter Type and Parameters, Low-Pass Filter, High Pass Filter,
Bandpass and Bandstop Filters, Insertion Loss, Special Filter Realizations: Butterworth Type, Chebyshev and
De-normalization of Standard Low-Pass Design.
Unit -3
An Overview of RF Filter Design II
Filter Implementations: Unit Elements, Kurodas Identities and Examples of Microstrip Filter Design. Coupled
Filter: Odd and Even Mode Excitation, Bandpass Filter Section, Cascading Bandpass Filter Elements, Design
Examples.
Unit -4
Matching and Biasing Network
Impedance Matching using Discrete Components: Two Component Matching Networks, Forbidden regions,
Frequency Response and Quality Factor, Microstrip Line Matching Networks: From Discrete Components to
Microstrip Lines, Single-Stub Matching Networks, Double-Stub Matching Networks, Amplifier Classes of
Operation and Biasing Network: Classes of Operation and Efficiency of Amplifiers, Bipolar Transistor Biasing
Networks, Field Effect Transistor Biasing Networks.
Unit -5
RF Transistor Amplifier Design I
Characteristics of Amplifiers, Amplifier Power Relations: RF source, Transducer Power Gain, Additional Power
Relations, Stability Considerations: Satbility Circles, Unconditional Stability, Stabilization Methods.
Unit -6
RF Transistor Amplifier Design II
Constant Gain: Unilateral Design, Unilateral Figure of Merit, Bilateral Design, Operating and Available Power
Gain Circles. Noise Figure Circles, Constant VSWR Circles. Broadband, High Power and Multistage Amplifiers.
Unit -7
RF Oscillators and Mixers:
Basic Oscillator Model: Negative Resistance Oscillator, Feedback Oscillator Design, Design Steps, Quartz
Oscillators. High Frequency Oscillator Configuration: Fixed Frequency Oscillators, Dielectric Resonator
Oscillators, YIG-Tuned Oscillators, Voltage Controlled Oscillators, Gunn Element Oscillator. Basic Characteristics
of Mixers: Basic Concepts, Frequency Domain Considerations, Single-Balanced Mixer Double-Balanced Mixer.
Text Book :
1. RF Circuit Design Theory and Application, Reinhold Ludwig and Pavel Bretchko, Ed. 2004, Pearson
Education
Reference Book:
1. Radio Frequency & Microwave Electronics Illustrated, Radmanesh, Pearson, 2001.
EECL108P
3-0-0=3
and routing protocols for OBS networks, contention resolution in OPS networks, multicasting, implementation
and application. MEMs based switching, switching with SOAs.
Unit V: Optical Access Network
Introduction to access network, PON, EPON and WDN EPON: overview, principal of operation, architecture;
dynamic wavelength allocation, STARGATE: overview, need, architecture, operation and application, gigabit
Ethernet, radio over fiber network.
Unit VI: Optical Multicasting and traffic grooming
Introduction to multicasting, Multicast capable switch architecture, unicast, broadcast and multicast traffic,
multicast tree protection, traffic grooming overview, static and dynamic traffic grooming.
EECL105P
3-0-0=3
Unit-I
Introductions: Models for systems, characteristics of a signal processing system.
Unit-II
Design Space Exploration: Introduction to the fundamental architectural synthesis problems: scheduling,
allocation, binding, estimation, and control-unit synthesis
Unit-III
Optimization: Introduction to graph theory and combinatorial optimization, optimization of digital signal
processing systems, graph representation and annotation, mapping techniques, Optimizing timing/area.
Unit-IV
Scheduling: Various scheduling techniques, scheduling algorithms, as-soon-as-possible and as-late-aspossible, list scheduling, integer linear programming.
Unit-V
Binding and resource allocation: Resource sharing algorithms, interval graphs, graph colouring, integer
linear program models, register sharing, Retiming, function approximation.
Unit-VI
Technology Mapping and logic optimization: Technology mapping, technology libraries, cost models, graph
covers, Two-level, multilevel factorization, CAD tools.
Textbook:
1.
Synthesis and Optimization of Digital Circuits Giovanni De Micheli, McGraw Hill International edition,
1994
2.
3.
Logic synthesis and verification, S. Hassoun and T. Sasao, Kluwer Academic Publishers, 2002.
Logic Synthsis, Srinivas Devadas et al, McGraw Hill, 1994
EECL201P
3-0-0=3
Unit I: Introduction of Embedded Systems: Hardware/software systems and codesign, Hardware Software
synthesis, Hardware Software Interface
Unit II: Modeling: Models of computation for embedded systems, Behavioral design, Requirement
Specifications, System Architecture
Unit II: Architectural Aspects: Architecture selection, Hardware software partitioning, scheduling, and
communication, resource allocation and binding. Optimization techniques.
Unit IV: Design: Implementation, Simulation, synthesis, and verification, Hardware/software implementation.
System level low power and high performance techniques.
Unit V: Methodologies: Design methodologies and tools, Performance analysis and optimization.
Unit VI: Examples: Design examples and case studies
Textbook :
1. Embedded System Design by Peter Marwedel, Springer, 2006
Reference Books:
1. Computers as Components by Wayne Wolf, Morgan Kaufmann, 2001
2. Readings in Hardware/Software Co-Design by G. De Micheli, Rolf Ernst, and Wayne Wolf, eds. Morgan
Kaufmann, Systems-on-Silicon Series
3. Embedded System Design: A Unified Hardware/Software Introduction by Frank Vahid and Tony D.
Givargis, Addison Wesley, 2002.
4. Programming Embedded Systems in C and C++ by Michael Barr, O'Reilly, 1999.
5. An Embedded Software Primer by David E. Simon, Addison Wesley, 1999.
6. The Art of Designing Embedded Systems by Jack Ganssle, Newnes, 2000.
Lab Courses
EECP 103P
0-0-2=1
EECP 111P
0 - 0 - 3 = 1.5
EECP 115P
VLSI Lab
0 - 0 - 3 = 1.5
Description of Analog & Digital Design flow. Circuit level simulation, pre-layout simulation, Layout , Design
Rule Check, parasitic extraction, post layout simulation , generation of GDS-II format.
Digital Design implementation on EDA Tools.
Project covering detailed flows both and analog and digital need to submitted by students for evaluation
EECP 202P
0-0-2=1
EECP 108P
0 - 0 - 3 = 1.5
EECP 104P
0 - 0 - 3 = 1.5
3-0-0=3
UNIT-I
Speech processing: Physiology of speech generation: characteristic of speech sounds; glottal excitation;
speech production models: discrete time speech production model; discrete time filter model for speech
production; source excitation model.
Linear prediction analysis: All-pole models; least-squares estimation; spectral matching; spectral envelopes;
applications of LP analysis.
Speech coding: Coder's attributes; waveform coding; vocoders; analysis-by-synthesis coding; code-excited
linear predictive vocoder; regular pulse-excited LPC.
UNIT-II
Image processing: Fundamentals of digital image: Digital image representation and visual perception, image
sampling and quantization.
Image enhancement: Histogram processing; Median filtering; Low-pass filtering; High-pass filtering; Spatial
filtering; Linear interpolation, Zooming.
Image coding and compression techniques: Scalar and vector quantizations; Codeword assignment; Entropy
coding; Transform image coding; Wavelet coding; Codec examples
Image analysis and segmentation: Feature extraction; Histogram; Edge detection; Thresholding.
Image representation and description: Boundary descriptor; Chaincode; Fourier descriptor; Skeletonizing;
Texture descriptor; Moments.
UNIT-III
Audio processing: Fundamentals of digital audio: Sampling; Dithering; Quantization; psychoacoustic model.
Basic digital audio processing techniques: Anti-aliasing filtering; Oversampling; Analog-to-digital conversion;
Dithering; Noise shaping; Digital-to-analog Conversion; Equalisation.
Digital Audio compression: Critical bands; threshold of hearing; Amplitude masking; Temporal masking;
Waveform coding; Perceptual coding; Coding techniques: Subband coding and Transform coding; Codec
examples.
UNIT-IV
Video processing: Fundamentals of digital video: Basics of digital video; Digital video formats.
Basic digital video processing techniques: Motion estimation; Interframe filtering; Motion-compensated
filtering; Error concealment.
UNIT-V
Video coding techniques: Temporal redundancy; Spatial redundancy; Block-based motion estimation and
compensation; Coding techniques: Model-based coding, Motion-compensated waveform coding; Codec
examples.
Textbook:
1. Alistair Mo_at and Andrew Turpin, Compression and Coding Algorithms, Kluwer Academic Publishers,
Boston, 2002.
2. K.R. Rao & J.J. Hwang, Techniques & Standards for Image, Video & Audio Coding, Prentice Hall, 1996.
EECE 102P
3-0-0 = 3
Unit 1: Introduction to Pervasive Computing, Characteristics & features of Pervasive Computing Systems,
Potential applications of Pervasive computing systems, Context, Context aware applications, Relationship
between sensors and context, Personal Area Network as defined by IEEE 802.15.4, Introduction to Sensors,
Need for Wireless Sensor Networks, Scope & Limitations of Wireless sensor Networks, Adhoc Networks v/s
Sensor Networks,
Unit 2: Routing Algorithms: Need for routing mechanism, requirements & characteristics of routing
algorithms, Traditional routing algorithms AODV, DSR, LMR. Concept of Network Lifetime, Categorisation of
Routing algorithms Flat, Hierarchical, Cluster based, Single-hop, Multi-hop & Energy Aware.
Unit 3: MAC Layer in Sensor Networks: Importance of Media Access Control (MAC) Protocols in Sensor
Networks, Issues in designing MAC protocols , Classifications of MAC protocols, Popular MAC protocols
Unit 4: Localization: Need for localization, requirements,- hardware & software, Localization techniques
based on Distance, Angle Measurements. Different localization algorithms Triangulation, MDS, Probabilistic
localization. Tracking of moving objects
Unit 5: Applications of Wireless Sensor Networks: Potential Application Areas of Wireless Sensor
Networks, Data Acquisition Systems using WSN, Target Tracking, HVAC Applications using WSN, Intrusion
Detection using WSN
Lab Work: Programming of Crossbow Motes, Creation of Wireless Sensor Network Testbed, Data
Acquisition using WSN, Localization techniques using test bed
References
1.Adelstein, Sandeep Gupta Fundamentals of Mobile & Pervasive Computing, Tata McGraw Hill 2005
2.C. Siva Ram Murthy and B. S. Manoj, Ad Hoc Wireless Networks: Architectures and Protocols, Pearson
Education, Inc., 2005.
3.Selected papers from IEEE & ACM to be provided by Faculty
EECE 103P
3-0-0=3
UWB Definition and Features, UWB Wireless Channels, UWB Data Modulation, Uniform Pulse Train, BitError
Rate Performance of UWB
Unit VI: 3G and 4G Wireless Standards
GSM, GPRS, WCDMA, LTE, WiMAX
EECE 104P
Pattern Recognition
3-0-0=3
3-0-0=3
Review of random process, problem formulation and objective of signal detection and signal parameter
estimation; Hypothesis testing: Neyman-Pearson, minimax, and Bayesian detection criteria; Randomized
decision; Compound hypothesis testing; Locally and universally most powerful tests, generalized likelihoodratio test; Chernoff bound, asymptotic relative efficiency; Sequential detection; Nonparametric detection, sign
test, rank test. Parameter estimation: sufficient statistics, minimum statistics, complete statistics; Minimum
variance unbiased estimation, Fisher information matrix, Cramer-Rao bound, Bhattacharya bound; Linear
models; Best linear unbiased estimation; Maximum likelihood estimation, invariance principle; Estimation
efficiency; Least squares, weighted least squares; Bayesian estimation: philosophy, nuisance parameters, risk
functions, minimum mean square error estimation, maximum a posteriori estimation.
Text
H. V. Poor, An Introduction to Signal Detection and Estimation, 2nd edition, Springer, 1994.
S. M. Kay, Fundamentals of Statistical Signal Processing: Detection Theory, Prentice Hall PTR, 1998.
S. M. Kay, Fundamentals of Statistical Signal Processing: Estimation Theory, Prentice Hall PTR, 1993.
Reference Books:
H. L. Van Trees, Detection, Estimation and Modulation Theory, Part I, John Wiley, 1968.
D. L. Melsa and J. L. Cohn, Detection and Estimation Theory, McGraw Hill, 1978.
L. L. Scharf, Statistical Signal Processing: Detection, Estimation, and Time Series Analysis, Addison-Wesley,
1990.
V. K. Rohatgi and A. K. M. E. Saleh, An Introduction to Probability and Statistics, 2nd edition, Wiley, 2000.
EECE 106P
Audio Engineering
3-0-0=3
3-0-0=3
Chapter 3: Network Layer: Routing and Routed Protocols, Best Effort Service, Distance Vector and Bellman
Ford Algorithms, Routing Loops, OSPF, RIP and IP: Packet Structure, Fragmentation and Routing Tables
Chapter 4: Transport Layer: Connectionless and Connection oriented transports, Reliable and Unreliable
Transports, Error Control, Flow Control, Congestion Control, Sliding Window and Handshaking, UDP & TCP and
their implementations
Chapter 5: Other Protocols: ICMP, SNMP, IGMP, Multicasting and Broadcasting, DoS
EECE 108P
3-0-0 = 3
M.J.S .Smith, - " Application - Specific Integrated Circuits " - Addison Wesley Longman Inc., 1997
John F. Wakherly, Digital Design: Principles and Practices, 2nd Edn 1994, Prentice Hall International
Edn
EECE 109P
3-0-0 = 3
MEMS Design
3-0-0 = 3
Module 01: Historical Background: Silicon Pressure sensors, Micromachining, MicroElectro Mechanical
Systems. Micro fabrication and Micromachining: Integrated Circuit Processes. Potential of MEMS in industry.
Module 02: Bulk Micromachining: Isotropic Etching and Anisotropic Etching, Wafer Bonding, High AspectRatio Processes (LIGA)
Module 03: Physical Micro sensors: Classification of physical sensors, Integrated, Intelligent, or Smart
sensors, Sensor Principles and Examples: Thermal sensors, Electrical Sensors, Mechanical Sensors, Chemical
and Biosensors.
Microactuators: Electromagnetic and Thermal microactuation, Mechanical design of microactuators,
Microactuator examples, microvalves, micropumps, micromotors Microactuator systems: Success Stories, InkJet printer heads, Micro-mirror TV Projector.
Module 04: Microstereolithography (MSL) for 3D fabrication, Two photon MSL, Dynamic mask MSL, scanning
systems, Optomechatronics system for MSL. Ceramic and Metal Microstereolithography.
Module 05: Ceramic and Metal Microstereolithography. Scattering of light by small particles. Effect of particle
properties on accuracy and resolution of component in Ceramic and Metal MSL. Monte carlo ray tracing
method. Nanolithography.
Module 06:
Surface Micromaching: One or two sacrificial layer processes, Surface micromachining
requirements, Polysilicon surface micromachining, Other compatible materials, Silicon Dioxide, Silicon,
Micromotors, Gear trains, Mechanisms. Characterisation of MEMS devices.
Text Books: .
1. MEMS, Vijay Vardan, Wiley Publication
2. MEMS and Microsytems Design and Manufacture, Tai- Ran Hsu, Tata McGraw Hill
3. MEMS, Nitaigour Mahalik, Tata McGraw Hill
4. MEMS and MOEMS Technology and Applications, Rai Chaoudhary, PHI Learning
Reference Books:
1. Stephen D. Senturia, Microsystem Design, Kluwer Academic Publishers,
2. Marc Madou, Fundamentals of Microfabrication, CRC Press
3. Kovacs, Micromachined Transducers Sourcebook, WCB McGraw-Hill, Boston
4.M-H. Bao, Elsevier, Micromechanical Transducers: Pressure sensors, accelerometers, and gyroscopes, New
York, 2000
EECE 111P
300=3
Chapter 1
History of Calculation and Computer Architecture, Influence of Technology and Software on Instruction Sets:
Up to the dawn of IBM 360, Complex Instruction Set Evolution in the Sixties: Stack and GPR Architectures,
Microprogramming, Simple Instruction Pipelining, Pipeline Hazards
Chapter 2
Multilevel Memories Technology, Cache (Memory) Performance Optimization, Virtual Memory Basics, Virtual
Memory
Chapter 3
Complex Pipelining, Out of Order Execution and Register Renaming, Branch Prediction and Speculative
Execution, Advanced Superscalar Architectures, Microprocessor Evolution
Chapter 4
Synchronization and Sequential Consistency, Cache Coherence, Cache Coherence (Implementation), Snoopy
Protocols, Relaxed Memory Models
Chapter 5
VLIW/EPIC: Statically Scheduled, Vector Computers, Multithreaded Processors, Reliable Architectures, Virtual
Machines
EECE 201P
Artificial Material
300=3
Unit I Introduction
Definition of Metamaterials (MTMs) and Left-Handed (LH) MTMs, Theoretical Speculation by Viktor Veselago,
Experimental Demonstration of Left-Handedness, Further Numerical and Experimental Confirmations, Backward
Waves and Novelty of LH MTMs, Terminology, Transmission Line (TL) Approach, Composite Right/Left-Handed
(CRLH) MTMs, MTMs and Photonic Band-Gap (PBG) Structures
Unit II Fundamentals of LH MTMs
Left-Handedness from Maxwells Equations, Entropy Conditions in Dispersive Media, Boundary Conditions,
Reversal of Doppler Effect, Reversal of Vavilov- Cerenkov Radiation, Reversal of Snells Law: Negative
Refraction, Focusing by a Flat LH Lens, Fresnel Coefficients, Reversal of Goos-Hanchen Effect, Reversal of
Convergence and Divergence in Convex and Concave Lenses, Sub-wavelength diffraction.
Unit III TL Theory of MTMs
Ideal Homogeneous CRLH TLs, LC Network Implementation, Real Distributed 1D CRLH Structures,
Experimental Transmission Characteristics, Conversion from Transmission Line to Constitutive Parameters.
Unit IV Two-Dimensional MTMs
Eigenvalue Problem, Transmission Line Matrix (TLM) Modeling Method, Negative Refractive Index (NRI) Effects,
Distributed 2D Structures.
Unit V Application
Guided wave application: Power divider, couplers, Resonators, Filters, Radiated wave Application: Fundamental
Aspects of Leaky-Wave Structures, Leaky wave antenna, meta interfaces.
Reference Books:
300=3
Chapter 1
Real-Time Scenarios, Computer as Real-Time Component, Embedded Processors in Real-Time Systems, Role of
RISC technology, ARM and MIPS: Architecture, Versions, Instruction Sets
Chapter 2
Simultaneous Multitasking, Real-Time Constraints, Task Scheduling Policies (Rate Monotonic, Earliest Deadline
First etc.), Preemption, Context Switching
Chapter 3
Real Time Operating Systems, flavors and the design approach, Linux as Real-Time OS, OS for Sensor
Networks
Chapter 4
Simulation of Real Time Systems using TIME tool, Build Tools for Real-Time Embedded Systems, IDEs,
Compilers, Debugger
EECE 203P
300=3
Introduction: Basic objectives of cryptography, secret-key and public-key cryptography, one-way and
trapdoor one-way functions, cryptanalysis, attack models, classical cryptography.
Block ciphers: Modes of operation, DES and its variants, RCS, IDEA, SAFER, FEAL, BlowFish, AES, linear and
differential cryptanalysis.
Stream ciphers: Stream ciphers based on linear feedback shift registers, SEAL, unconditional security.
Message digest: Properties of hash functions, MD2, MD5 and SHA-1, keyed hash functions, attacks on hash
functions.
Public-key parameters: Modular arithmetic, gcd, primality testing, Chinese remainder theorem, modular
square roots, finite fields.
Intractable problems: Integer factorization problem, RSA problem, modular square root problem, discrete
logarithm problem, Diffie-Hellman problem, known algorithms for solving the intractable problems.
Public-key encryption: RSA, Rabin and EIGamal schemes, side channel attacks.
Key exchange: Diffie-Hellman and MQV.
Digital signatures: RSA, DSA and NR signature schemes, blind and undeniable signatures.
Entity authentication: Passwords, challenge-response algorithms, zero-knowledge protocols.
Standards: IEEE, RSA and ISO standards.
Network security: Certification, public-key infra-structure (PKI), secure socket layer (SSL), Kerberos.
Advanced topics: Elliptic and hyper-elliptic curve cryptography, number field sieve, lattices and their
applications in cryptography, hidden monomial cryptosystems, cryptographically secure random number
generators.
References
1. Alfred J. Menezes, Paul C. van Oorschot and Scott A. Vanstone, Handbook of Applied Cryptography,
CRC Press.
2. William Stallings, Cryptography and Network Security: Principles and Practice, Prentice Hall of India.
3. Neal Koblitz, A course in number theory and cryptography, Springer.
4. Johannes A. Buchmann, Introduction to Cryptography, Undergraduate Text in Mathematics, Springer.
5. Doug Stinson, Cryptography Theory and Practice, CRC Press.
6. A. Das and C. E. Veni Madhavan, Public-Key Cryptography: Theory and Practice, Pearson Education
Asia.
EECE 204P
300=3
TMS320C6x Architecture: CPU Operation Pipelined CPU- VelociTI C6x DSP- Software tools: EVM DSK
Target C6x board Assembly file Memory management- Compiler utility- Code initialization Code composer
studio Interrupt data processing.
Freescale DSP56XXX Architecture and Programming: Introduction, Core Architecture Overview, Data
Arithmetic Logic Unit, Address Generation Unit, Program Control Unit, PLL and Clock Generator, Debugging
Support, Instruction Cache, External Memory Interface, DMA Controller, Operating Modes and Memory Spaces,
Instruction Set, Benchmark Programs.
FFT and Filter Implementation using DSP Processors: Implementation of FFT: Radix- 2 fast Fourier
transforms Block floating point scaling Optimized radix- 2 DIT FFT, Filtering, Modulation, Audio and Image
Processing.
Code optimization: Word wide optimization Mixing C and assembly- software pipelining C64x
improvements - Real time filtering Circular buffering- Adaptive filtering.
Text Books:
1. Sen M Kuo, Bob H Lee, Wenshun Tian Real-Time Digital Signal Processing Implementations and
Applications 2nd edition , John Wiley.
2. User manuals of TI TMS320C55X from www.ti.com
3. User manuals of DSP 56371 from www.freescale.com
Refrences:
1. TMS320C55x DSP CPU Reference Guide
2. TMS320C55x DSP Mnemonic Instruction Set Reference Guide
3. Digital Signal Processing Applications With Motorola's DSP56002 Processor by Mohammed ElSharkawy
4. Motorola Dsp Assembler Reference Manual
Microwave Antenna Design
EECE 205P
300=3
Unit I
Antenna Fundamentals and Definitions: Radiation mechanism - over view, Electromagnetic Fundamentals,
Solution of Maxwell's Equations for Radiation Problems, Ideal Dipole, Radiation Patterns, Directivity and Gain,
Antenna Impedance, Radiation Efficiency. Antenna Polarization
Unit II
Resonant Antennas: Wires and Patches, Dipole Antennas, wide band antennas, Helix antenna, Lens Antenna,
Microstrip Antenna.
Unit III
Arrays: Array factor for linear arrays, uniformly excited, equally spaced Linear arrays, pattern multiplication,
directivity of linear arrays, non- uniformly excited -equally spaced linear arrays, Mutual coupling,
multidimensional arrays, phased arrays, feeding techniques.
Unit IV
Aperture Antennas: Techniques for evaluating Gain, reflector antennas - Parabolic reflector antenna principles,
Axi-symmetric parabolic reflector antenna, offset parabolic reflectors, dual reflector antennas, Gain calculations
for reflector antennas, feed antennas for reflectors, field representations, matching the feed to the reflector,
general feed model, feed antennas used in practice.
Unit V
Antenna Synthesis: Formulation of the synthesis problem, synthesis principles, line sources shaped beam
synthesis, linear array shaped beam synthesis Fourier Series, Woodward Lawson sampling method,
comparison of shaped beam synthesis methods, low side lobe narrow main beam synthesis methods Dolph
Chebyshev linear array, Taylor line source method.
Reference Books:
1. Stutzman and Thiele, "Antenna Theory and Design", John Wiley and Sons Inc.
2. C. A. Balanis: "Antenna Theory Analysis and Design", John Wiley and Sons Inc.
3. Kraus, "Antennas", McGraw Hill, TMH, .
4. Kraus and R.J. Marhefka:, "Antennas", McGraw Hil1.
5. V. F. Fusco, Foundations of Antenna Theory and Techniques, Pearson Education Limited
EECE 206P
NEMS Design
300=3
UNIT I :
Nanoscale I/V: Quantum wells, Q wires and dots, density of states, electrical transport properties in
semiconductor nanostructures, quantization of conductance, coulomb blockade, Kondo effect, ballistic
transport, non relativistic dirac fermions (massless electrons) & their conductance, Quantum Hall effect,
fractional Q Hall effect
UNIT II :
Nanofluid mechanics; flow of nanofluid, electrophoresis dielectrophoresis: Size selective sepration of dielectric
nano particles, nano and micro fluid channels, low reynold number fluid dynamics, optical tweezer.
Unit-III
Nanosensors: Gas sensors, Pollution sensor, Photo sensor, Temperature sensor, IR detector, Biosensor,
nanomaterial gas discharge devices, CNT based fluid velocity sensor. Turbo and ultra high vacuum, Clean room
technology, class 1000,100,10 clean rooms.
Unit-IV
Nature of carbon bonds, Different allotropes of carbon, structure and properties of C60, Graphene, Carbon
nanotubes and its types, Laser vaporization techniques, arc discharge method and chemical vapor deposition
techniques for CNT preparation, purification techniques. Properties of Carbon Nanotubes and Graphene:
Optical, Electrical and electronic properties, Mechanical, Thermal and vibrational properties. C NT
nanoelectronics, FETs, SETs
Unit V:
Fundamentals of carrier transport in quantum structures, temperature effects, Resonant tunneling diodes,
single electron transistor, modulation-doped field effect transistor MODFETs, and Heterojunction Bipolar
Transistors (HBTs),
References Books:
M. Madou, Fundamentals of Microfabrication, CRC Press, 1997
Stephen D. Senturia, Microsystem Design, Kluwer Academic Publishers
G. Kovacs, Micromachined Transducers, McGraw-Hill, 1998
Terahertz Electronics
300=3
Unit I Introduction
Terahertz Terminology, Terahertz Applications and Opportunities, Terahertz components,
Unit II Terahertz Sources
Vacuum electronics, Semiconductor, Direct THz lasers, Photonic sources of THz radiation
Unit III Terahertz and Infrared Quantum Photodetectors
Detector Principles, Terahertz and Infrared Quantum Cascade Detectors, Terahertz Quantum Well
Photodetector, Quantum Dots THZ-IR Photodetector, Terahertz and Infrared Photodetector based on
Electromagnetically Induced Transparency
Unit IV Terahertz and Infrared Quantum Cascade Lasers
Quantum Cascade Laser Principles, Analysis of Transport Properties of THz QCLs, Dual-Wavelength Generation
Based on Monolithic THz-IR QCL
Unit V Terahertz in communication
Broadband communication, Defense systems, High speed digital communication systems.
Reference Books
(a) A. Rostami, H. Rasooli, and H. Baghban, Terahertz Technology fundamentals and applications, Springer.
(b) D. Mittleman, Sensing with terahertz radiation, Springer.
(c) Terry Edwards, Gigahertz and Terahertz Technologies for Broadband Communications, Artech House.
(d) Yun-Shik Lee, Principles of Terahertz Science and Technology, Springer.
EECE 208P
300=3
Unit-I
MOS Inverter: Introduction to resistive - load inverter, inverter with n-type MOSFET load, CMOS inverter
Switching Characteristics and Interconnects Effects: Introduction, Delay time definitions, Calculation of
delay
times, Inverter design with delay constraints, MOS Inverters: Switching Characteristics & Interconnect Effects.
Estimation of interconnect parasitic.
Unit-II
Sequential MOS Logic Circuits: Introduction, SR latch circuits, Clocked latch and Flip-flop circuits, CMOS Dlatch and edge -triggered flip-flop. Dynamic MOS Logic Circuit
Unit-III
Semiconductor Memories: Introduction, Dynamic random access memory (DRAM), Static random acces
memory(SRAM),Non-volatile memory.
Low Power CMOS Logic Circuits: Introduction, Overview of power consumption, Switching power dissipation
o
CMOS inverter, Estimation and optimization of switching activity.
Reference Books:
1. Rabaey J.M, Chandrakasan A, Nikolic B , Digital Integrated Circuits- A Design Perspective, Second Edition,
Prentice Hall
2. S M Kang and Y Lebici,CMOS Digital Integrated Circuits-analysis and design, 3rd ed, McGraw Hill.
3. Pucknell D A and Eshraghian K, Basic VLSI Design, Prentice Hall India, New Delhi (2003).
4. Glaser L and Dobberpuhl D, The Design and Analysis of VLSI Circuits, Addison Wesley (1985).
5. Weste N and Eshranghian K, Principles of CMOS VLSI Design, Pearson Education Asia (2001).
EECE 209P
RFIC Design.
3-0-0 = 3
Unit I: Introduction
Need of RFIC, Introduction to MOS, Models and History of BJT systems. RF systems basic architectures.
Unit II: Transmission media and reflections Maximum power transfer. Parallel RLC tank, Qfactor, Series RLC
networks, matching: Pi match, T match. Interconnects and skin effect Resistors, capacitors.
Unit III: MOS device review, Introduction to MOS, Transmission lines, reflection coefficient, The wave
equation, examples, Lossy transmission lines, Smith charts plotting gamma. Bandwidth estimation using
open-circuit time constants. Risetime, delay and bandwidth, Zeros to enhance bandwidth, Shunt-series
amplifiers, tuned amplifiers, Cascaded amplifiers.
Unit IV:
Thermal noise, flicker noise review, Noise figure, Noise figure, Intrinsic MOS noise parametes,
Power match versus noise match.
Unit V:
Large signal performance, design examples & Multiplier based mixers. Subsampling mixers Class A, AB, B, C
amplifiers, Class D, E, F amplifiers, RF Power amplifier design examples, Resonators, Negative resistance
oscillators, Linearized PLL models, Phase detectors, charge pumps, Loop filters, PLL design examples, GSM
radio architectures CDMA, UMTS radio architectures.
REFERENCES
1. The Design of CMOS Radio-Frequency Integrated Circuits by Thomas H. Lee. Cambridge University
Press, 2004.
2. RF Microelectronics by Behzad Razavi. Prentice Hall, 1997.
EECE 211P
3-0-0 = 3
Unit 1
Introduction: Overview of the architectures and principles of optical systems and networks; Access Network;
LAN, WANS & MANS; SONET, SDH, ATM
Unit II
Components of Optical Networks: Fused fiber device such as couplers, WDMs, and WFC; Fabry perot
etalons and Bragg grating; Optical Isolators, Integrated optic modulators and switches; Wavelength
converters, Dispersion Compensating Techniques.
Unit III
Optical Amplifiers (EDFA and SOAs): Principles of operation; Gain characteristics; Wavelength
characteristics; Cross talk and wavelength conversation; Noise characteristics and Noise figure; characteristics
of amplifiers cascades; System performance analysis and power budget analysis for BER 10-9 for optically
amplified links.
Unit IV Photonics and Switching Networks: Switching Network, Switch, Non-Blocking Switch,Connection
States, Switching Cell, Two-State Switches, Interconnection Network, Unique-Routing Network, Nonblocking
Network, Alternate-Routing Network,
Nonblocking Properties of Alternate-Routing Networks, Strictly
Nonblocking, Wide-Sense Nonblocking, Multi-Stage Networks, Banyan Networks, Baseline Networks, Omega
Networks , Divide-and-conquer Networks, Recursive Application, Central Control
EECE 215P
3-0-0 = 3
Unit 1: Security Issues in Senor Networks: Security requirement, issues and goals. Security threats, types
of attacks on sensor networks and countermeasures. Routing attacks and challenges. Security support for Innetwork processing. Symmetric key, public-key, Hash function algorithms, Key distribution and certification,
Key distribution center (KDC), Network wide shared key, Pair-wise key using PKI, Preconfigured pair-wise
shared key.
Unit 2: Unit 3: Data Fusion & Aggregation: Need for Data aggregation, Address Centric Model (AC), Data
Centric Model (DC), Different types of data aggregation, Comparative analysis between AC & DC, Compression
v/s aggregation, Aggregation algorithms. Need for Sensor Data fusion, impact on bandwidth and inter-node
communication, impact on network lifetime & power control Assumptions ,
Unit 3: Wireless Sensor & Actuator Networks: Requirement of Actuation Action in Sensor Networks,
Characteristics of Actuator Nodes, preferred topologies for WSAN, Model for Inter-Communication between
Actuators & Nodes and for Communication between Actuators, Fault Tolerance in WSAN
Unit-IV: Signal Processing in WSNs: Concept of Distributed Digital Signal Processing in Wireless Sensor
Networks, Coherent & non- coherent processing. Collaborative signal processing, its need & challenges.
Estimation Technqiues in sensor networks Wiener filter, Kalman filter in WSN Environment
Reference Books:
1. Holger Karl and Andreas Willig Protocols and Architectures for Wireless Sensor Networks WILEY (ISBN: 0470-09510-5)
2. Ad Hoc Wireless Networks: Architectures and Protocols by C. Siva Ram Murthy and B. S. Manoj (Prentice
Hall, 2004)
3. Wireless Sensor Networks: An Information Processing Approach by Feng Zhao and Leonidas J. Guibas
(Morgan Kaufmann, 2004)
4. Selected papers from IEEE & ACM to be provided by Faculty
EECE 217P
3-0-0 = 3
Model-based analog and mixed-signal test: analog fault models, levels of abstraction, analog fault
simulation, analog ATPG. Analog test bus standard: analog circuit DFT, analog test bus, IEEE 1149.4 standard
.
References
1.M. L. Bushnell and V. D. Agrawal, Essentials of Electronic Testing, Kluwer Academic Publishers.
2.A. Osseiran, Analog and mixed-signal boundary scan: a guide to the IEEE 1149.4 test standard, Kluwer
Academic Publishers.
3.A. Krstic and K-T. Cheng, Delay fault testing for VLSI circuits, Kluwer Academic Publishers
.4.S. Chakravarty and P. J. Thadikaran, Introduction to IDDQ testing, Kluwer Academic Publishers
EECE 218P
3-0-0 = 3
Design methodologies: VLSI Design flow, Design Hierarchy, Regularity, Modularity and Locality, VLSI design
styles, Design quality, Packaging technology.MOS device design equations , Second order effects, the
complementary
CMOS
Inverter
DC
characteristics.
Circuit Characterization and Performance Estimation: Parasitic effect in Integrated Circuits ,Resistance
estimation, capacitance estimation, Inductance. Switching characteristics, CMOS - Gate transistor sizing, Power
dissipation,
CMOS
Logic
Structures,
Clocking
Strategies.
CMOS Process Enhancement & Layout Considerations: Interconnect, circuit elements, Stick diagram,
Layout design rules, Latchup, latchup triggering, latchup prevention, Technology related CAD issues.
Subsystem Design: Structured design of combinational logic-parity generator, Multiplexer, code converters.
Clocked sequential circuits-two phase clocking, charge storage, dynamic register element, dynamic shift
register. Subsystem design process, Design of ALU subsystem, Adders, Multipliers. Commonly used storage/
memory
elements.
TEXT / REFERENCE BOOKS:
1. D.A. Pucknell, K. Eshraghian, Basic VLSI Design, PHI, 3rd Ed.
2. John P. Uyemura, Introduction to VLSI Circuits and Systems, John Wiley & Sons.
3. Niel H.E. Weste, K. Eshraghian,, Principles of CMOS VLSI Design, Person, 2nd Ed.
4. Mead and L. Conway, Introduction to VLSI Systems, Addison-Wesley.
EECC 205P
Project Synopsis
0 - 10 - 0 = 10
The project seminar is required to evaluate the problem statement of the project. Students must have
completed their problem definition and are required to submit a synopsis of their work. The students will be
called up for an oral examination or viva voce, the stress is placed on an academically sound, stylistically
acceptable and error-free piece of work.
Project Mid Semester Review
The project seminar is required to evaluate the problem statement of the project. Students must have come up
with progress report and will be required to discuss the status of the project. The students are required to
present and demonstrate their work. The design or model must have been completed for review. The students
will be called up for an oral examination or viva voce, the stress is placed on an academically sound,
stylistically acceptable and error-free piece of work.
EECD 202P
Dissertation
0 - 24 - 0 = 24
A Master's dissertation is an advanced research project of defined scope and length (120 pp., one and a half
spacing, A4 paper). The criteria are: Technical competence, evidence of scholarly research, critical ability,
understanding of relevant theoretical issues, lucidity and coherence. A dissertation should have a theme or
thesis, usually stated in the title, and the success with which MTech candidates sustain that theme, thereby
presenting a unified, cumulative argument, is an important consideration.
A dissertation can be an original contribution to knowledge. It is given a mark and the degree can be awarded
based on the quality of the thesis/dissertation