How To Interpret Injection Moulding Simulation Results
How To Interpret Injection Moulding Simulation Results
Introduction of Filling
Filling Pattern
During the filling process, polymer
melt is propelled into the mold cavity
by pressure.
The pressure source comes from the
sprue where the pressure is the
highest.
Melt Front
Radial Flow
Melt Front
Introduction of Filling
High
pressure
Filling Pattern
The highest pressure is
from gate
Pressure reduces due to
flow friction
The melt front propagates
due to pressure gradient
The coarse melt front time
isocurves imply smooth
filling
The dense melt front time
isocurves imply high flow
resistance
Thin area is
difficult to flow
Introduction of Filling
Filling Pattern
Normally, the flow towards
areas of the cavity with
minimum resistance.
If the flow is faster, it
indicates the area has a
lower resistive force against
the flow.
On the other hand, a very
slow advancement of melt
front represents an area
having a large resistive
force.
Introduction of Filling
Introduction of Filling
Introduction of Filling
Introduction of Filling
Fountain flow
The flow front is of a spreading
or smearing nature, which is
generally referred as fountain
flow due to the no-slip flow
characteristics on the mold
surface.
Introduction of Filling
Weld lines
Introduction of Filling
Hot welding
Weld lines are formed by inserts
splitting the flow of the polymer
at high temperature areas.
It often occurs during the filling
process. The melt temperature
is sufficiently high to prevent
poor weld line strength.
Introduction of Filling
Cold welding
It occurs under low temperature.
It is commonly seen at the end
of filling and at the intersection
of different melt front.
The melt temperature is usually
low at the end of filling, so the
weld line strength is poor.
Gate
Gate
Gate
Weld lines due to cold welding
Introduction of Filling
Introduction of Filling
Molecular orientation
The behavior of molecular
orientation is caused by the
difference in the external forces
on the macromolecule. i.e.,
velocity difference.
Introduction of Filling
Introduction of Filling
Hesitation
The area having a
hesitation is prone to
freeze the plastic flow
faster than expected,
which generally leads to
incomplete fill.
To avoid hesitation, the
gate should be located far
from the thin areas as
much as possible.
Hesitation
Introduction of Filling
Racetrack
The race track phenomenon
is due to different flow
resistance within filling
process.
Racetrack tends to form
defects like internal welding
line, burnt mark and
incomplete filling.
Racetrack due to
different wall thickness
Possible internal
weld line
Introduction of Filling
Air trap
Inspect the melt front
advancement for any airtrap problem.
Moldex3D can identify air
traps automatically.
Air traps usually result in
burn marks
Air trap
Introduction of Filling
Flow mark
Dominant gate
Unbalanced runner system
Introduction of Filling
Introduction of Filling
Material
ABS
50,000
PP
100,000
PS
40,000
HIPS
40,000
PA6
60,000
PA66
60,000
PBT
50,000
PET
50,000
PC
40,000
PC/ABS
40,000
PMMA
40,000
POM
40,000
PPS
50,000
LCP
60,000
Introduction of Filling
Material
ABS
0.30
PP
0.25
PS
0.25
HIPS
0.30
PA6
0.50
PA66
0.50
PBT
0.40
PET
0.50
PC
0.50
PC/ABS
0.40
PMMA
0.40
POM
0.45
PPS
0.50
LCP
0.50
Introduction of Filling
Pressure history
Pm: Pressure profile in the
metering zone of the injection
screw.
Pn: Pressure profile at the
injection nozzle.
Pg: Gate pressure profile at
the end of runner, that is the
pressure profile at the inlet of
the cavity.
Pc: Pressure profile at cavity
end. Internal cavity pressure is
lower than gate pressure due
to the loss of pressure inside
the cavity.
Introduction of Filling
Filling stage
tf-tf1: Flow control stage.
Polymer starts filling the
empty cavity; maintaining a
steady flow and the cavity
pressure increases gradually
tf1-tp: Pressure control stage.
During the solidification of
molten polymers, cavity
pressure increase quickly
and plastic flow begin to
reduce its volume. Mold
filling pressure is transferred
to the end of the cavity.
Introduction of Filling
Flow mark
Dominant gate
higher effective
pressure due to
lower pressure
drop runner
Introduction of Filling
P1
P2
P1>P2>P3
P3
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