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Vxibus

The document provides an overview of the VXIbus standard for modular instrumentation. It describes how VXIbus was developed to address needs for portable test stations and faster, more cost-effective test solutions. Key points covered include: - VXIbus incorporates features of GPIB instruments and high-throughput capability of VME devices. - The standard defines card sizes and connectors to integrate instruments while allowing shielding for high performance. - Specifications cover electrical interfaces, cooling, power, and communications to facilitate system integration. - VXIbus systems can be controlled via embedded or external computers, providing flexibility.

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0% found this document useful (0 votes)
39 views

Vxibus

The document provides an overview of the VXIbus standard for modular instrumentation. It describes how VXIbus was developed to address needs for portable test stations and faster, more cost-effective test solutions. Key points covered include: - VXIbus incorporates features of GPIB instruments and high-throughput capability of VME devices. - The standard defines card sizes and connectors to integrate instruments while allowing shielding for high performance. - Specifications cover electrical interfaces, cooling, power, and communications to facilitate system integration. - VXIbus systems can be controlled via embedded or external computers, providing flexibility.

Uploaded by

fatih_demir
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Technical Note

Introduction

VXIbus Basics

Prior to 1987 there existed only one major architecture


standard for instruments...the General Purpose Interface Bus
(GPIB). Although the GPIB was widely used, it did not address
the need for portable test stations, nor for the market demand
for faster, more cost-effective test solutions. In 1987, a
consortium of test and measurement companies introduced
VXIbus...a new standard instrument architecture. The VXIbus
(VMEbus eXtensions for Instrumentation) was developed to
meet the need for portable applications and to provide a
standard modular open architecture for integrating into the
traditional GPIB test system and for stand-alone applications.
It was designed to be an open architecture standard for
instruments on a card, allowing an instrument from any
manufacturer to operate in the same mainframe as another
manufacturer's instrument.

A VXIbus system or subsystem consists of a VXIbus


mainframe, VXIbus devices, a VXIbus slot 0 card, VXIbus
resource manager, and host controller. The slot 0 takes care
of backplane management and includes things such as clock
sources and arbitration for data movement across the
backplane. The module that goes into this slot must perform
these hardware functions in addition to its normal functions.
The resource manager configures the modules for proper
operation whenever the system is powered on or reset,
allowing the user to build the test system software from a
known starting point. The resource manager is not involved
with the VXIbus system once normal operation begins. The
VXIbus mainframe houses the VXIbus instruments and
contains the power and cooling mechanism for these
instruments, as well as the communication backplane.

Rather than design an entirely new architecture, the VXIbus


Consortium decided to enhance an existing standard that was
well accepted in the data acquisition and high-speed computer
markets...The VMEbus.

The VXIbus was not designed to replace any existing


standard, but instead as an additional tool to help in overall
test or data acquisition solutions. To this end several methods
of communicating with VXIbus devices were defined, enabling
VXIbus solutions to be integrated with VMEbus, GPIB or as
stand-alone portable solutions.

The VMEbus architecture, known for its excellent computer


backplane, high-speed data rates of 40 MB/s, along with the
necessary communication protocols, made it ideal for building
instrument systems for high throughputs. VXIbus
incorporates the ease-of-use features of intelligent GPIB
instruments (for example, ASCII-level programming) into its
message-based device, and also takes advantage of the high
throughput capability of VME devices, which are programmed
and communicate directly in binary (register-based devices).
Although VME is an excellent computer backplane, it is not
adequate for instrumentation without further standardization.
The VXIbus Consortium enhanced the VMEbus standard by
further defining parameters to allow users to easily configure
a workable system. Some of the enhancements added to the
VMEbus standard were:

Larger card options for higher performance


instruments and to add shielding.

Defining all signals on the backplane, avoiding


problems due to user-defined signals on the VMEbus.

Addition of EMC, cooling and power specifications to


further ease system integration.

Definition of communication protocols to ease


integration with existing test systems.

140

VXIbus Overview

Addition of voltages for high-performance


instruments.

Online at www.vxitech.com

Specification Overview
MECHANICAL
The VXIbus specification defines four module sizes. The two
smaller sizes, A and B, are the defined VMEbus module sizes
and are true VMEbus modules in every sense. The two larger
sizes, C and D, are for higher performance instrumentation.
Increased module spacing in the C- and D-size systems makes
it possible to fully shield sensitive circuits for high
performance measurements.
The C-size VXIbus footprint has become the most common
size today because it keeps systems to a smaller size than D,
and allows the performance of VXIbus to be utilized (A and B
being VMEbus devices). The only real D-size solutions found
today are in large functional testers that include instruments
or custom circuits that were developed on D-size because of
real estate advantages. B-size solutions are available, but
consist mainly of VMEbus type or low-performance
instruments, and do not utilize the benefits of the VXIbus
standard. Ninety percent of VXIbus products on the current
market conform to the C-size footprint.

ELECTRICAL
Additional power supply voltages for powering analog and
ECL circuits and instrumentation buses for measurement
synchronization and triggering were added to the existing
VMEbus signal, along with an analog sum-bus and a set of
local bus lines for private module-to-module communication.

949 955 1894

Technical Note

VXIbus Overview
Local Bus

Card Size

Card
Spacing

A
Size

10 x 16 cm
(3.9 x 3.9 in.)

2 cm
(0.8 in.)

B
Size

23.3 x 16 cm
(9.2 x 6.3 in.)

3 cm
(1.2 in.)

The local bus adds significant capability to VXIbus


measurement systems. It is a very flexible daisy-chain bus
structure. Every inner slot in a VXIbus mainframe has a set
of very short, 50 ohm transmission lines running between
adjacent slots on either side. The local bus is 12 lines wide
each direction through the P2 connector and an additional 24
lines wide through the P3 connector. This bus allows for
adjacent modules to perform private communication.
Table 1 shows the actual pin outs of P1 and P2 for reference.
P3 has not been shown, because of lack of use, but can be
found in the VXIbus specifications.

C
Size

D
Size

23.3 x 34 cm
(9.2 x 13.4 in.)

3 cm
(1.2 in.)

36.7 x 34 cm
(14.4 x 13.4 in.)

3 cm
(1.2 in.)

Figure 1
The VXIbus specifies three 96-pin DIN connectors called P1,
P2, and P3. The P1 connector, the only mandatory one in VME
or VXIbus, carries the data transfer bus (up to 24 bits
addressing and 16 bits data), the interrupt bus, and some
power.

P2
The optional P2 connector, available to all card sizes except Asize, expands the data transfer bus to its full 32-bit size. It also
adds four additional power supply voltages, the local bus, the
module identification bus (allows a VXIbus module's slot
number to be determined), and the analog summing bus (a
current summing bus that runs the length of the backplane).
Also, there are TTL and ECL trigger buses (running the length
of the backplane with four trigger protocols defined) and a 10
MHz differential ECL clock signal (buffered to each slot).

P3
The optional P3 connector, available only on D-size, expands
P2 resources for specialized applications. It provides 24 more
local bus lines, additional ECL trigger lines, and 100 MHz clock
and star trigger lines for precision synchronization.

Online at www.vxitech.com

EMC
The VXIbus specification stipulates radiated and conducted
EMC limits for both generation and susceptibility. The
importance of this part of the VXIbus specification cannot be
overstated. EMC limits ensure that modules containing
sensitive electronic circuits perform to expectations without
interference from any other module operating in the system.

POWER AND COOLING


In a typical IEEE-488 rack-and-stack or VMEbus system, the
system integrator must take a rigorous approach to ensure
an environment cool enough for proper operation. Each
instrument's power dissipation, airflow and placement in the
rack must be considered. The rack's cooling capability must
be factored in as well.
To ensure adequate cooling in a VXIbus system, the design
process is simpler. Every vendor's mainframe specification
sheet provides a cooling graph for the worst-case module
configuration. It is specified in terms of pressure across the
module versus the airflow delivered. Each instrumentation
manufacturer must also specify the airflow and back pressure
required by the instrument for proper operation (normally for
a 10C rise in temperature). The user would then plot the
point of the module's airflow and back pressure
specifications on the mainframe's cooling curve and, if
located within the boundaries of the curve, the module is
guaranteed to be compatible with the mainframe.
The power specification is another way the VXIbus makes the
system integrator's job easier. Each VXIbus mainframe is
specified for power delivered. Each power supply level has a
peak DC current delivery and peak-to-peak dynamic current
delivery. When selecting modules, voltage levels and current
requirements are compared to the mainframe's capability.
The VXIbus dynamic current specification ensures that the
selected modules will not induce more ripple noise on the
mainframe's power supply lines than any module is required
to withstand. (Figure 2)

949 955 1894

141

Technical Note

VXIbus Overview
independent, i.e., Windows, DOS, UNIX. If an external
computer is used, the interface to the VXIbus mainframe can
also be flexible, i.e., GPIB/VXI, MXI/VXI, RS-232/VXI,
Ethernet/VXI. Any approach used has its own set of
advantages and disadvantages dependent upon the overall
system requirements. Each VXIbus mainframe must have a
slot 0 card. Because of available real estate, the slot 0
functions are typically integrated with the interface to the
external controller or with the embedded controller.

1.5 litres/sec
0.2 mm H20
for 10rise

H20
(mm)

6
Per slot airflow: (Litres / sec)

Figure 2

COMMUNICATIONS
Communications is another area of VXIbus standardization.
VXIbus specifies several device types and protocols as well
as communication handshakes, however, it leaves things
flexible as far as how to control the VXIbus mainframe and
devices -- open architecture. A VXIbus system or sub-system
can be controlled using either an embedded or an external
computer that can be operating system or platform

VXIbus P1 Pin Definitions:


Slot 0-12
Pin
Number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32

Row A
Signal

Row B
Signal

D00
BBSY*
D01
BCLR*
D02
ACFAIL*
D03
BG0IN*
D04
BG0OUT*
D05
BG1IN*
D06
BG1OUT*
D07
BG2IN*
GND
BG2OUT*
SYSCLK
BG3IN*
BG3OUT*
GND
BR0*
DS1*
DSO*
BR1*
WRITE*
BR2*
GND
BR3*
DTACK*
AM0
GND
AM1
AS*
AM2
GND
AM3
IACK*
GND
IACKIN* SERCLK(1)
IACKOUT* SERDAT*(1)
GND
AM4
IRQ7*
A07
A06
IRQ6*
A05
IRQ5*
A04
IRQ4*
A03
IRQ3*
A02
IRQ2*
IRQ1*
A01
-12V
+5VSTDBY
+5V
+5V

There is one unique logical address (ULA) per VXIbus device


(numbered from 0 to 255) and up to 256 devices in a VXIbus
system. Typically a voltmeter, switch, or signal generator is a
single device. It is important, however, to understand that
ULAs or VXIbus instruments have no relationship to individual
VXIbus card slots. The VXIbus specification allows for several
devices per card slot for improved portability and integration,
or one instrument per several card slots for densely populated
instruments.VXI modules must have registers located at
specific addresses, as shown in Figure 3. The upper 16kB of
the 64kB A16 address space are reserved for VXIbus devices.
The two most common types of VXIbus devices are register
and message-based. A comparison is shown below.

VXIbus P2 Pin Definitions:


Slot 0

VXIbus P2 Pin Definitions:


Slot 1-12

Row C
Signal

Pin
Number

Row A
Signal

Row B
Signal

Row C
Signal

Pin
Number

Row A
Signal

Row B
Signal

Row C
Signal

D08
D09
D10
D11
D12
D13
D14
D15
GND
SYSFAIL*
BERR*
SYSRESET*
LWORD
AM5
A23
A22
A21
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A09
A08
+12V
+5V

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32

ECLTRG0
-2V
ECLTRG1
GND
MODID12
MODID11
-5.2V
MODID10
MODID09
GND
MODID08
MODID07
-5.2V
MODID06
MODID05
GND
MODID04
MODID03
-5.2V
MODID02
MODID01
GND
TTLTRG0*
TTLTRG2*
+5V
TTLTRG4*
TTLTRG6*
GND
RSV2
MODID00
GND
SUMBUS

+5V
GND
RSV1
A24
A25
A26
A27
A28
A29
A30
A31
GND
+5V
D16
D17
D18
D19
D20
D21
D22
D23
GND
D24
D25
D26
D27
D28
D29
D30
D31
GND
+5V

CLK10+
CLK10GND
-5.2V
LBUSC00
LBUSC01
GND
LBUSC02
LBUSC03
GND
LBUSC04
LBUSC05
-2V
LBUSC06
LBUSC07
GND
LBUSC08
LBUSC09
-5.2V
LBUSC10
LBUSC11
GND
TTLTRG1*
TTLTRG3*
GND
TTLTRG5*
TTLTRG7*
GND
RSV3
GND
+24V
-24V

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32

ECLTRG0
-2V
ECLTRG1
GND
LBUSA00
LBUSA01
-5.2V
LBUSA02
LBUSA03
GND
LBUSA04
LBUSA05
-5.2V
LBUSA06
LBUSA07
GND
LBUSA08
LBUSA09
-5.2V
LBUSA10
LBUSA11
GND
TTLTRG0*
TTLTRG2*
+5V
TTLTRG4*
TTLTRG6*
GND
RSV2
MODID
GND
SUMBUS

+5V
GND
RSV1
A24
A25
A26
A27
A28
A29
A30
A31
GND
+5V
D16
D17
D18
D19
D20
D21
D22
D23
GND
D24
D25
D26
D27
D28
D29
D30
D31
GND
+5V

CLK10+
CLK10GND
-5.2V
LBUSC00
LBUSC01
GND
LBUSC02
LBUSC03
GND
LBUSC04
LBUSC05
-2V
LBUSC06
LBUSC07
GND
LBUSC08
LBUSC09
-5.2V
LBUSC10
LBUSC11
GND
TTLTRG1*
TTLTRG3*
GND
TTLTRG5*
TTLTRG7*
GND
RSV3
GND
+24V
-24V

Table 1

142

Online at www.vxitech.com

949 955 1894

Technical Note

VXIbus Overview
3F

Device Dependent
Registers
20

VXI Configuration Space


Upper 16 kB of A16 space
reserved for VXI
configuration space
64 kB per device
8-bit logical address specifies
base address for each device
256 devices per VXI system

1E
1C
1A
18
16
14

Reserved
Reserved
Reserved
Reserved
Reserved
Reserved

12
10
0E
0C
0A
08

A32 Pointer
A24 Pointer
Data Low
Data High
Response/Data Extended
Protocol/Signal

06
04
02
00

Offset
Status/Control
Device Type
ID Register

Reserved by VXIbus
Specification

Communication Registers
Required for VXI
Message-based Devices

Configuration Registers
Required for all
VXI Devices

Figure 3

Technical Notes

Register-based Device
A register-based device is the simplest VXIbus device and most
often is used as the basis for simple modules. A register-based
device communicates only through register reads and writes.
Configuration is controlled by VXIbus-defined configuration
elements but programmed through device-dependent registers.

Message-based Device
A message-based device is typically the most intelligent device
of a VXIbus system. High-performance instruments are
typically available as message-based devices. Besides the
basic configuration registers supported by the register-based

Online at www.vxitech.com

device type, the message-based device has common


communication elements and a Word Serial Protocol to allow
ASCII-level communication with other message-based
modules. This allows easier multi-manufacturer support,
though at some sacrifice in speed to interpret the ASCII
messages. Typically, a message-based device uses a
microprocessor and is more costly than a register-based
device. Since the Word Serial Protocol mandates only a byte
transfer per transition, which then must be interpreted by the
on-board microprocessor, message-based devices are typically
limited to IEEE-488 speeds. However, optional register-based
access may be included on the module to bypass this
bottleneck, while allowing ease of instrument set-up through
word serial protocol.

949 955 1894

143

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