MultiSIM BLUE PCB Layout

Basics on designing a Printed Circuit Board (PCB)

Introduction
This document serves as an overview of the major steps involved when designing a circuit for a
printed circuit board (PCB) for the designer using MultiSIM BLUE. This document discusses the major
steps in the PCB design flow from basic terminology that will be encountered to the primary steps
required to move an example design through the schematic, layout and manufacturing stages.
Understanding the Terminology
MultiSIM BLUE A circuit design platform from Mouser Electronics in partnership with National
Instruments. The schematic program allows the user to draw a document representing the electrical
component symbols and the interconnections between them. Before generating a PCB, the symbols
are mapped to component footprints and the symbol interconnections are converted to a netlist that
specifies the connections between the component footprints in the layout process. MultiSIM BLUE
also allows the user to do interactive circuit simulation with the same schematic circuit
representation used for layout which can be useful for both initial design analysis and testing the
design (i.e. verification testing and troubleshooting) once complete. The PCB layout program also
known as Ultiboard, is used to generate the mechanical and wiring connection structure of the PCB
from the netlist. The layout program allows the wiring connection structure to be placed on multiple
layers and once complete allows the user to generate the CAD (computer aided design) files needed
to manufacture a PCB.
Gerber Files The CAD files needed to send to a PCB manufacturer so they can build the PCB layer
structure. The RS-274X is the most commonly supported Gerber file format.
NC Drill Files The numerically controlled (NC) drill files indicate the size and position of holes used
for unplated holes, plated through-holes or holes for vias. Some quick-turn PCB manufacturers have
only select hole sizes available.
Printed Circuit Board (PCB) A wafer board defining the mechanical and copper wire structure of the
circuit (sometimes called a PWB for Printed Wiring Board).
Printed Circuit Board Structure and Details
a. A PCB can be considered a layered structure, usually with multiple copper and insulating layers.
The main portion is a non-conductive (insulative) material (substrate) usually made from fiber
glass & epoxy.
b. The substrate material used to separate layers comes in different thicknesses, from 0.005 to
0.038.

c. Conducting layers consist of copper (Cu) foils that are etched away in specific areas where the
user does NOT want connections to occur.
d. A single layer PCB has the substrate with one layer of copper foil on the top.

A double layer PCB has two layers of copper foil (one on the top and one on the bottom).

e. If more than two layers are required due to increased complexity of the PCB, other layers of
copper can be built-up or added to the ones shown above (usually in pairs). For example, a 4
layer PCB can be made up of two double-layered PCBs laminated (sandwiched) together with a
core material in between. This core layer is called a prepreg (pre-impregnated) and it insulates
and supports the other layer structures and is made out of epoxy/fiber. It is common for
modestly complex boards to have 6, 8 or 10 layers (with increased manufacturing cost). Some
highly complex PCBs have up to 32 layers or more of traces and copper planes.

Note: The height of the substrate is usually the thickness of one or multiple sheets of laminate
material and is usually much smaller than the height of the core prepreg material layer.
Multilayer PCB A PCB with more than one copper foil layer. The layers can be renamed in to unique
names (such as Power or Ground) as desired by the user.

Layer Stack Up The copper organization of multiple layer PCBs with the intent of having specific
signal and ground planes on certain layers for routing convenience and electromagnetic shielding
purpose. A four layer board will typically have the following layer structure, where the top and
bottom layers are reserved for signal routing and the inner layers are reserved for ground and power
planes:
Copper Top
Inner 1
Inner 2
Copper Bottom
Finished PCB Height - Standard finished PCB thicknesses are commonly found as shown this
thickness includes all copper, substrate and prepeg layers:
.031 (also .039" is common)
.062" (mostly commonly used size)
.093"
.125"
Shown here is a more realistic layer stackup of a four layer PCB showing the various thicknesses of
the layer structures from a typical PCB manufacturer yielding the common 0.062 finished PCB
height.

Bare PCB A finished PCB without electrical parts and other components (unpopulated or
unassembled).
Assembly Drawing A mechanical and schematic drawing with engineering notations specifying how
and in what order the PCB needs to be assembled and packaged. For automated assembly the
assembly drawing also contains information about solder paste and other information for component
population and other board manufacturing purposes. Some basic mechanical assembly information
can be completed within the PCB layout environment; however any complex mechanical assembly
information typically needs to be completed in an external CAD package.

Trace A portion of the copper foil that is remaining on the PCB after the etching process for a signal
connection (net) from point A to point B. Traces for nets can have various widths which need to be
sized by maximum current expected to run through the trace.
Plane A large portion of the copper foil that is remaining on the PCB for a signal connection that
attaches to many components. This is a layer where little copper is etched away. Power and ground
signals are typically connected to a plane, since the power and grounds need to route to many
components on the PCB. Since a plane has a lot of copper and the plane covers a large area, traces
can be routed to the plane with an effective lower resistance and inductance from a connection point
to the plane. This will create smaller voltage drops (versus placing discrete traces) when the
components conduct power and ground current and thus will create a design with lower power
dissipation. Also circuits with power and ground planes will be less likely to radiate electromagnetic
(EM) energy, as well as being less susceptible to EM energy (such as 50/60 Hz AC line noise). Below is
an example of a 4-layer PCB with power & ground planes:

Substrate The non-conductive material (substrate) is usually a fiberglass epoxy. A flame retardant
material called FR-4 is the most common PCB material used in North America. For specialized
applications, other materials can be used (such as G10) but these other materials will typically exhibit
lower flammability resistance. Other substrate materials (with favorable dielectric properties) are
available and sometimes available materials vary by geographic region.
Copper thickness (weight in ounces) The copper foil thickness is measured not in linear dimensions,
but with the weight of the copper if poured onto a 1 square foot sheet. For instance, a common
copper thickness (weight) is 1 oz. This means 1 oz. of copper per square foot. A 2 oz. weight would
indicate 2 oz. per square foot. Some common copper weights are as follows:

oz (not common since it is so thin it can vaporize with a soldering iron)

oz (common), Copper will be 0.7 mils thick.
1 oz (most common), Copper will be 1.35 to 1.37 mils thick.
2 oz (very common for higher current boards)

3 oz (not common except for high current applications as it acts as a heat sink, also
difficult to solder to since it drains the heat from the soldering iron)

The copper weight and width needs to be considered when designing a PCB. Consider the current in
the traces versus the added cost for higher copper weight when deciding on the copper oz. weight to
use. For application specific information, the user can look up quantitative design criteria by referring
to the tables in IPC-2221, Generic Standard on Printed Board Design.
PCB Styles Most modern PCBs typically have a combination of surface mount and through-hole
parts, however PCBs can generally be organized into two categories:

Plated Through Hole (PTH or also indicated as TH) In this type of PCB, the majority of
components will have wire leads that extend from the part that are inserted into the
holes of the PCB which are copper plated for soldering.
Shown below is a cross section of a two layer board with four PTHs. Also shown are two
copper traces on the board; the one shown on the bottom is connecting two PTHs
together.

Surface Mount Technology (SMT) In this type of PCB, the majority of parts have no
leads that go through the PCB. These parts will typically have pads or leads that get
soldered to the surface of the board. These components are referred to as Surface
Mount Devices (SMDs).
Below is a Surface Mount Technology PCB with four SMT pads. A resistor is shown
soldered to the board. With SMT, the designer has the option to place parts on the

bottom of the board since there are no PTHs located near the SMDs to obstruct the
placement of the SMD. SMDs can typically be manufactured smaller than their throughhole equivalents, thus the use of SMT can usually lead to significant increases in the
parts density within a PCB.

Note: When considering PTH or SMT technology for the PCB, be careful on selecting the correct
technology and components for the application. Prototyping will generally work better with PTH or
larger SMD style components, however the larger technology may not meet final size or density
constraints on a final production design. Conversely SMT style PCBs can be packed very tightly
together and can typically yield lower manufacturing costs (per board in larger volumes) through
automated assembly. However hand soldering small SMD components or components with ball grid
array (BGA) technology can be very tricky for all but those with very experienced soldering skills.
Consider these important tradeoffs when selecting components and designing the PCB. Some
components will be available in both through-hole and SMD styles, whereas others will be available in
only one style.
Solder Mask This is a shielding or insulating layer (this is also what makes common PCBs green)
installed over the top and bottom layer to cover copper traces. The layer usually is not installed over
the top of pads since this exposes the copper area to be soldered. This layer protects these covered
conductors so that solder will not inadvertently adhere to them (creating shorts) when connecting
nearby parts to pads or through-hole connections.
Silkscreen (also called Screen Print) - This is the final layer applied over the top solder mask and also
over the bottom solder mask (if required) to display part outline and reference designator
information on the board. Besides displaying part outline and reference designator information, the
silkscreen can display orientation information (such as anode/cathode direction) and any other
symbol or textual information the user wants to be displayed on the board (such as internal board
model numbering, logos, PCB revision numbering and other manufacturing or standards marking).
Footprint The mechanical and electrical pattern of the part. The information included in the part
typically includes the copper land pattern, mechanical outline and any important dimensional
information of the component such as the body information, height and size. The footprint for a
component will typically include a silkscreen layer displaying part outline and orientation information
and the copper pads or holes (land pattern) that are associated with the parts. As in the case of
connectors, the footprint of the part may extend beyond the board outline, so the detail in the

footprint should give the designer adequate information for part placement, orientation and copper
connections.
Land pattern This is the pattern of pads or holes on the circuit board, sometimes including the part
body information. A standards body known as IPC is often used to accurately specify the required
copper size and shape required to ensure the proper bonding and adhering of the components pads
or wires to the PCB. The land pattern can include non-electrical pad information such as thermal
relief pads or heat sink patterns that may be required.
Overview of Steps Involved Example Design Flow
Schematic drawing and footprint selection
The first step in successfully creating a PCB is the proper creation of an appropriate schematic
drawing of the circuit with MultiSIM BLUE. It will be necessary that all of the components selected in
the schematic have correctly assigned packages associated with them so that the generated part list
and netlist representing required connections will be correct. The following MultiSIM BLUE
schematic will be used to highlight the basic steps to go from schematic to final PCB generation:

In the example, notice that the resistor, R4, has a black symbol whereas other components have blue
symbols. In MultiSIM BLUE this indicates that R4 does not have an associated footprint. In MultiSIM
BLUE, all parts that intend to be part of the PCB design need to have footprints associated with them
for the design to be properly sent to the layout stage. Notice here that power (
VDD) and ground
symbols (
and ) are considered virtual parts that connect into a single net and these symbols

are treated specially in MultiSIM BLUE. Since these are net connections only and do not connect to a
footprint for layout purposes, it is appropriate to have them show up as a black color.
An effective way to check the whole schematic for valid footprints is to view the Bill of Materials
report by selecting from the menu (Reports Bill of Materials) and then clicking on the Vir button to
show virtual components. The displayed report will indicate any parts that do not have footprints
associated with them. It will also list power and ground symbols but as discussed previously it is fine
to have these displayed as virtual components.
When a schematic still has virtual components when transferred for PCB layout, a message similar to
the following will be displayed:

A footprint can be added several ways.

1. By double clicking on the component and selecting Value Edit Footprint.
2. By appending a new footprint from the Database Manager (requires same footprint mapping
if one already exists).
3. By saving the component as a new component (right-click and select the Save component to
database... option) and then attaching a new footprint with a new symbol-footprint mapping
from within the Database Manager (preferred method over #2 since new manufacturer part
number or vendor information will apply). You will need to replace component with new
component.
After adding a footprint to the resistor, the schematic will now look like this:

Once satisfied with the schematic (and functionality or performance through the use of simulation), it
is time to prepare the schematic for transfer into Ultiboard.
Preparation Steps before Transferring
In the example schematic, both an analog ground ( ) and a digital ground ( ) are used. For layout
purposes, MultiSIM BLUE will need to specify whether the analog and digital grounds should be
considered one ground signal (i.e. connected together) or be kept separated for the purpose of
routing two separate ground connections. To configure the ground connections in MultiSIM BLUE,
select the PCB properties from the menu. (Options Sheet Properties PCB)
PCB Properties Settings
Check the box to select that the analog and digital grounds be connected together (if desired). In this
example it is necessary to have this option checked or C2 would not have the same common return
path as the rest of the circuit. As shown in the schematic that the digital ground shows a net name of
GND and the analog ground has a net name of 0. When the grounds are connected, the netlist
transferred to Ultiboard will use the net name GND for both analog and digital ground net names.
Set the export settings (mils, mm, etc) that will be used for clearance and trace width. Mils (0.001
inch) are the most common units in North America, whereas Millimeter (mm) is preferred common in
other regions.

Set the number of layers. If the circuit is relatively simple and electromagnetic compatibility is not an
issue, a cost-effective single layer PCB design may be able to be used. If power or ground planes are
required or the circuit is slightly more complex, two, four or more layers can be selected. When
planning for the board design, the cost impacts will need to be considered as layers are added to the
board.
Note: Layers can always be added or subtracted during the layout process (usually in pairs). However,
it is more difficult to remove layers once copper has been placed on specific layers.
For this circuit example, four layers will be selected so that the design can utilize a power and ground
plane.
Transferring design to Ultiboard
Once the final preparation steps are complete in MultiSIM BLUE it is now possible to start transferring
the schematic design into Ultiboard for layout.
To transfer your design to Ultiboard select the appropriate item from the menu. (Transfer Transfer
to Ultiboard Transfer to Ultiboard Component Evaluator 13)
MultiSIM BLUE will save a copy of the component footprint list and netlist to a single file (it will
default to the same folder in which the schematic resides). The default file name will have the same
name as the schematic but with a .ewnet file extension. Keep the default location or navigate to a
new folder location and rename as desired. Clicking on the Save button will also cause Ultiboard to
launch if it is not already opened.
Note: The .ewnet file is a footprint and
netlist file only and is different than the
.ewprj file. The .ewprj file is the project
generated by Ultiboard that will contain
actual mechanical and electrical CAD data
the PCB board layout.

file
the
for

A popup window will be displayed showing all of the components and nets that are being transferred
from the MultiSIM BLUE netlist file into Ultiboard. Leave all items selected and click OK.

This will then cause the default layout screen to display showing a default board outline and the
footprints associated with each component in the schematic. From the example design, the
footprint shapes shown are now the layout representations of the footprint-symbol associations that
were selected in MultiSIM BLUE.
Board Outline Selection

As shown, a generic board outline will be initially created. At this point, a custom board outline
shape will need to be created to match package dimensions or other specifications. To start, select
the layer called Board Outline. You can do this by double clicking on the layer desired on the Design
Toolbox to the left of the workspace.

The selection filter Enable selecting other objects ( ) needs to be selected (depressed as shown in
the green circle). This will allow the board outline to be selected in order to change it.

The default rectangular board outline can be repositioned or resized or one of the following methods
can be used to customize the shape of the board outline. With any of these techniques, the existing
board outline will first need to be selected and deleted and a new shaped created.
1. Place a polygon on the Board Outline layer to define a custom or complex shape.

2. Import a board outline shape via DXF file (File Import DXF).

Component Verification
When the parts are now placed within the project, it is always a good idea to double check the
datasheet for your parts and adhere to any recommended pad sizing or thermal pad adjustments
prior to routing.
Also if you plan on manually soldering components for your project, you can visualize pad size and
spacing to confirm part selections are adequate for manual soldering.
You can also confirm part, pad and object sizes easily using the Dimensioning tools. To use or place a
dimension on the board, simply click on one of the mechanical layers, go to Place Dimension from
the menu and measure the desired object.
CAUTION: Although attempts are made to ensure part accuracy (mapping, sizing, and footprint
information), the user has ultimate responsibility in verifying the design and component information
versus the datasheet and other technical information. Datasheet and other design information from
the manufacturer is readily available from the attached component links in the Mouser Database.
Among the component data a PCB designer should be checking is:
Footprint, land pattern (pad) shape
Hole sizing (finished hole diameter size)
Thermal requirements (adjusting pad size)
Height and other clearance requirements
Component Placement Tips and Strategies
To begin part placement, make sure the Copper Top layer is active and also make sure that only the
Enable selecting parts filter (

) is active as shown below.

There are several lines that will be displayed on the screen connecting the parts together and the
parts to the boards.
The most important lines are the brighter yellow lines called the Ratsnest lines indicating the specific
net connections between component pins within the design (these are the connections you made in
the schematic within MultiSIM BLUE).
In general it is a good practice to group parts together in a way that is consistent with the
arrangement of the schematic design (such as the parts for a front end filter, digital section, power
supply, etc) to keep the ratsnest and thus the copper connections between parts short. By
minimizing the length of the ratsnest, the physical trace length will be minimized allowing for an
easier routing process. Attempt to minimize the crossing of the ratsnest lines by rotating parts
<Ctrl+R> and moving associated components closer together as shown below.

Before
arrangement

After
arrangement

Also keep in mind that with multiple layer boards, components can also be placed on the backside of
the board (check component height clearances) which may help minimize trace length and trace
crossings.
In the example design below, the DB-9 connector and the 8 pin DIP are manually placed into the
design. Typically connectors and other parts that have specific physical placement locations or
restrictions are done first.

An automated approach for part placement is available by using the Autoplacement feature
Before performing an autoplacement step on remaining parts, any manually placed parts will first
need to be locked down prior to autoplacement. To lock a component, highlight the component,
click the right mouse button and select the Lock menu item. As shown locked parts will have an
orange outline around them indicating they are fixed and will not move during the autoplacement
process.
After checking to make sure any critically located parts are locked start autoplacement from the
menu (Autoroute Autoplace parts).

In this example design, all of the parts are now placed. The autoplacement algorithm made sure to
adhere to any design rules when placing the components. At this time, you can simply make any
manual adjustments (move, rotate) to the component placement as desired.
Layer Management
Before placing any planes or signal routes, it is recommended to first verify and check initial net-layer
assignments. Additional layers can be added at this time or anytime throughout the design
process. Remember it is easier to add or remove layers before a design is started rather than trying
to delete copper and remove unwanted layers after routing begins.
Note: Incorrect net-layer assignments are the most typical DRC errors created. If any DRCs are
created due to incorrect net-layer assignments they should be corrected prior to performing
additional routing as shown below. Once the net-layer assignments are corrected, any DRC errors
should automatically be cleared or a manual DRC check may have to be performed from the menu
(Design DRC and netlist check).
To start specifying the net-layer assignments select the Spreadsheet View from the menu and
navigate to the Nets tab as shown (View Spreadsheet View Nets).

For simplicity in this example design, all nets will be allowed routing on all layers. The net-layer
assignments will vary from design to design and it is usually a good practice to consider separating
the signal routing layers with those intended for ground and power planes if possible.
To enable all net-layer assignments, start by highlight all the rows in the Nets tab by selecting the top
row, then hold the <Shift> key down and selecting the bottom row.
Click on one of the highlighted rows in the Routing layers column and then select Check all as shown
below to complete the net-layer assignments.

Once the layers are properly configured, routing traces can be started. If a ground or power plane is
desired, it is typically best to create this first before routing any signal traces. If a ground or power
connection is made first, a through-hole part will automatically connect to the plane if one of the pins
is assigned to ground or power. When using a SMD part, vias can easily be dropped near ground or
power pins to the required planes.
Ground and Power Plane Creation

In this example design, the power plane will be placed on Inner Layer 1. From the menu select the
power plane option (Place Power plane) and set the layer and net as shown:

In the next example, the ground plane will be placed on Inner Layer 2. From the menu select the
power plane option (Place Power plane) and set the layer and net as shown:

Note: Users may optionally want to consider placing the ground plane on the Inner Layer 1 and
power on the Inner Layer 2. The stackup is important to consider for EM shielding purposes and
when placing matched pair traces (microstrip or differential pairs) on the PCB.

Tip: If you prefer the copper plain to appear in the background, you can simply assign the layer a
darker color within the Layer/visibility settings. Darker colors will usually appear in the background.
Routing Signal Traces
Once the ground and power plane is complete, the remaining traces can be routed. There are
several methods for signal routing, of which four will be discussed here.
In general it is recommended that you plan a strategy for routing in the following way:
Manually route any critical signals first. Critical signals that need to be routed in specific
routing paths need to be prioritized first (examples include traces for low voltage or sensitive
signals, high speed signals, differential pairs etc).

(Optional) Autorouting can be used for any remaining signals.

Manually place or adjust any remaining traces as needed.

Here are the steps required to create traces using the three standard manual routing methods and
the autorouting method. The bus routing method (used for routing digital bus lines and differential
pairs) is not discussed here.
Follow-Me ( ) <Ctrl+T>
This method is semi-automatic and is the standard way of manually routing most traces. This mode
interactively suggests trace routes or trace segments while including DRC error checking in-process
with the routing. To complete a trace using the Follow-Me method, follow these steps:

From the Design Toolbox, select the layer in which to begin the trace.
Select the Follow Me icon ( ) or use the shortcut <Ctrl+T)>.
Place the mouse over the component pad (through-hole or surface mount) where the trace is
to be started. Anchor the trace by left-clicking; the display will show an X over the pad to
indicating it is selected for creating a trace.
Move the mouse away from the starting pad location and an outline of the trace will follow
the mouse cursor from the starting point and a ghosted trace will precede the cursor to show
a possible completion path.
Move the mouse around holes, pads, traces or parts and both the trace outline and the
ghosted trace will change its path automatically following any design constraints that are set.
Complete a trace segment by left-clicking to anchor a corner in an open space.
Continue routing in this way or double-click at any time to finish placement of the ghosted
portion of the trace. Any additional nets can be routed while the Follow-Me routing mode is
still active.

Press <ESC> to exit the Follow-Me mode return to the selection mode (

).

Line Style ( ) <Ctrl+Shift+L>

Line style routing is a fully manual method of placing traces and will allow design rule checking errors
to be overridden while routing (so be cautious when using this mode). Once a routing segment is
complete, the DRC errors will be indicated if real-time checking is enabled. This mode is acceptable
for routing any trace lengths requiring routing in very specific paths.
To complete a Line style trace follow this procedure:

From the Design Toolbox, select the layer in which to begin the trace.
Select Line icon ( ) or use the shortcut < Ctrl+Shift+L >.
Place the mouse over the component pad (through-hole or surface mount) where the trace is
to be started. Anchor the trace by left-clicking; the display will show an X over the pad to
indicating it is selected for creating a trace.
Move the mouse away from the starting pad location and an outline of the trace will follow
the mouse cursor.
Trace segments can be created by left-clicking to anchor a corner in an open space.
Continue routing in this way and double-click on the terminating pad to complete the trace.
Additional routing can be daisy-chained from the terminating pad by simply continuing the
routing from this location.
Press <ESC> once to terminate routing the assigned trace. Any additional nets can be routed
while the Line routing mode is still active.
Press <ESC> again to exit the Line mode and return to the selection mode (

).

Connection Machine ( )
This method is also semi-automatic but it allows a trace to be automatically constructed from a
ratsnest line. This method suggests a full trace route but allows some selectivity on how the route is
place. This method allows trace construction in fewer steps and also combines automatic DRC error
avoidance while creating traces. In this mode, since the ratsnest line is required, the ratsnest layer
needs to be set to visible ( ) for this routing technique to work. Follow these steps to complete a
trace route using the Connection Machine method:

From the Design Toolbox, select the layer in which to begin the trace.
Select the Connection Machine icon ( ) to begin.
Place the mouse cursor over a selected ratsnest connection.
Left-click the mouse and the display will show a recommended completed trace.
Move the mouse cursor around and Ultiboard will automatically avoid other objects but leave
the terminating points of the trace connected.

Once the trace is satisfactorily positioned, right-click to fix the trace placement. Additional
nets can be routed from the ratsnest lines while the Connection Machine routing mode is still
active.

Press <ESC> to exit the Connection Machine mode return to the selection mode (

).

Autorouting ( )
The Autorouter is a fully automatic method for routing traces and can be an effective way of entirely
routing a PCB or completing the routing on a PCB that was partially routed using manual methods.
The successful completion of the autorouter depends on the PCB settings and the overall design
constraints in addition to the autorouter settings. In the MultiSIM BLUE, you can autoroute up to 4
layers at a time.
Follow these steps to complete autorouting:

Fix any manually routed traces that should not be removed or shoved. Traces can be locked (
) using the same technique as used for locking components.
From the menu configure the autorouter settings (Autoroute Autoroute/place options).
Consult the help for suggestions on what selections to make.
Start the autorouter from the menu (Autoroute Start/resume autorouter) or with the
shortcut icon ( ).
Upon completion check the results within the Spreadsheet View.
If some routes are not completed, manually route remaining traces or reconfigure autorouter
settings and retry.
Clean up traces by shoving them as needed in the selection mode (
the board.

) to completely route

In the circuit example, the autoroute method was used to complete the PCB routing. As shown, the
Spreadsheet View can be checked to verify what percentage of the board the autorouter completed.
In this example, the autorouter completed 100% of the trace routing automatically.

Via Creation
(Navigating between layers while drawing a trace)

It is common (especially with PCBs utilizing Surface Mount Technology components) to route signals
from one layer to another using vias (sometimes called feedthroughs). For example, a signal may
need to be routed from the top layer to the bottom layer; a via allows the signal trace to be
redirected from the top trace to the bottom trace (or an inner layer) with a via component.
Vias are holes that are drilled into the board and then plated to create an electrical contact between
traces or planes on various layers. Here are some details on via specifications:

Board manufactures will have limits to the dimensions of vias due to reliability issues and
resource constraints (such as hole tolerances drill sizes).
A finished via considers the hole and plating size. Any minimum (or maximum) via size is based
on the finished hole size.
Drill Diameter is the diameter of the hole prior to plating. Some quick-turn PCB
manufacturers have hole size requirements of 15 mils or more. Full service manufacturers
typically will have a minimum hole size between 3-5 mils (sometimes smaller at increased
cost), depending on the weight of copper that is requested.
The Annular Ring is the portion of conductive material surrounding the via-hole. It is the
doughnut shaped material around the hole to which traces and solder can adhere. It is
related to the pad diameter. For instance, if the setting for the drill diameter is 15 mils, and
the via pad diameter is 25 mils, then the width of annular ring is 10 mils. Any specifications
for the annular ring size may apply for via holes as well as plated through holes, however
check the board manufacturers specified minimum dimensions for each as they can
sometimes be different.
The default via size can be set from the Pads/Vias tab from within the PCB Properties (Options
PCB Properties).
A commonly used size for vias is a hole size (Drill Diameter) of 10 mils and an annular ring (Pad
Diameter) of 20 mils, however hole size for quick-turn PCB manufacturers may be 15 mils or
more. Try to use the smallest sized hole possible to accommodate flexibility in placement and
trace constraints.

Vias can be created manually from the menu or from the Via icon ( ) and then assigned a net from
its properties. However the easiest way to create vias is by placing a connecting via in-line with trace
routing.
To route a trace, create a via and then continue routing on another layer follow these steps:

Select manual Line style routing mode (

)
Start a route from a pin connection and while routing hit <Q> to switch between a paired
layer (the previous layer you selected) or <F2> to swap opposite layers.
Optionally while routing you can simply select a new copper layer from the layer control and

the trace routing will jump to the new layer and a via will be formed (
This action will create an automatic via to the new layer at a previously set corner.

).

Continue routing on the selected layer.

It is also common to route a via to a ground plane. Follow these steps to create a via to a ground or
power plane:

Select manual Line style routing mode (

).
Start routing a trace that has an associated plane connection (such as ground (net 0) or VCC)
and hit <Q> or <F2> to swap layers to the plane layer or select a new layer from the layer
control (
).
This will create via. Continue to wire away from the via using a small trace segment
and hit <ESC> to stop.
The via will automatically connect to the plane with the selected connection
styles (as show in inset).

Adjusting Placed Traces (

Once traces have been routed, it is common for the user to want to
nudge traces around on the board for various reasons (such as
sensitive analog signal away from a potentially noisy clock or power
To perform an adjustment on a trace, choose the Select tool ( )
top menu or press <Ctrl+Shift+S> to enable the selection mode.

move or
moving a
signal).
from the
Also

confirm that the selection tool Enable selecting traces (

) is
For desired trace (or trace segment), choose the layer in which the
positioned. Click on the midpoint of the trace segment you plan to
highlight the trace segment. The segment will highlight with three
boxes (2 solid boxes indicating the endpoint of the trace segment
open box to indicate the midpoint).

activated.
trace is
move to
blue
and an

Use the mouse to grab the selected trace segment and move the trace into a new position. The other
attached trace segments should move accordingly into new positions. Note that currently the tool
does not support jumping an existing trace over another object (such as a placed component or hole)
but you can move the segments into a variety of new positions. Also other traces that are parallel to
the segment can also be nudged slightly to accommodate repositioning of the selected trace.
In cases where you need to jump over a placed component or hole, simply select and delete the
appropriate trace segment and manually reroute around the object using one of the previously
described routing techniques.
Other Routing Finishing Steps to Consider

There are other things to consider before considering the routing process complete. Corner Mitering
can add finishing steps to the routing to ensure the integrity of the pin to trace connections and the
overall structural soundness of the trace itself.
Corner Mitering is a process to reduce or remove sharp angles for placed traces by creating 135
angles in their place. Sharp angles within traces can be susceptible to voiding in the PCB
manufacturing process. Also reflections can be caused in transmission lines if traces contain any
sharp corners. To process corner mitering on the traces select the Corner Mitering from the menu
(Design Corner Mitering).
Final Checks and Visual Board Inspection
After completing the routing process, final checks can be done on the board to do final verification on
both the correct placement and routing of the PCB.
First, a DRC and Connectivity check should be done to ensure that all design constraints were met and
that the board is fully routed. From the menu select and perform a DRC check noting and correcting
any warnings or errors given (Design DRC and netlist check). A Connectivity check on all nets will
verify all required routing is complete (Design Connectivity check).
Next a visual inspection on each layer should be done to verify correct power, ground and other
signals are going to the required locations.
To view the layers independently of each other, select the Layers tab on the bottom of the Design
Toolbox. For thoroughness, it is suggested that each net be analyzed to make sure there are no
visible gaps in the trace connections and that critical signals are not placed in close proximity to areas
of the board prone to noise (such as clock signals or switch mode power supplies).
A useful tool for visualizing a single net is the Net Preview allowing the user to visualize the entire
path of an individual net. It can be found on the right hand side of the Spreadsheet View when a net
is selected under the Net tab.
By clicking the Highlight selected nets box ( ) in the Nets tab from the Spreadsheet View, the
specific net(s) that you selected will be highlighted in white. Select individual nets by clicking on each
row and then use the preview window to follow the path of the trace on all layers.

Another visual inspection technique is to use the 3-D rendering capability. The component footprints
include 3-D modeling data allowing the dimensional height and relative component positions to be
viewed. Select the 3-D preview from the menu to visualize a rendering of the final populated PCB
(View 3D Preview). Any custom created parts will need to include 3-D modeling data (contained
on the 3D Info Layer) before these parts can be viewed with this tool.

Note: The mechanical dimensioning (such as height and width) may vary by manufacturer even
though the same footprint shape may be used. It is always advised to check final component
dimensions before generating the final PCB files.

Tip: Use the print screen key (<Prnt Scrn> or sometimes <Fn+Prnt Scrn>) on the computer to capture
a screen image to the virtual clipboard. The image can be pasted <Ctrl+V> into a report or email as a
way of documenting the project. Consultants can use this 3D rendering as part of the communication
process to ensure the design matches initial conceptual ideas.
Tip: Test fitting the parts onto a paper copy of the board is not always needed, but for smaller boards,
it sometimes is worth the effort as a means to thoroughly performing final size verification of the PCB
land patterns. To perform a test fit, print the top and bottom layers as 100% size to show the land
patterns for the board. You can even place the components onto the printout to be sure they will fit.
Common errors can be found during this process (such as selecting a wide SOIC versus a narrow body
SOIC). Some planning ahead to purchase the parts from Mouser.com is required when using this
technique, but the extra effort (plus the cost of an extra sheet of paper) will be much less than the
time and money lost to produce a corrected copy of the PCB.
PCB File Generation
After verifying all components and completing the final PCB checks, the Gerber files will need to be
generated (these should be inspected as well) and emailed or uploaded to the board manufacturers
web page.
To begin generating the PCB files, the configuration for each of the various file types will need to be
set. The first files needed are the Gerber files which allow the manufacturer to create the basic
artwork for each of the layers. From the menu launch the Export setup window from the menu (File
Export). Use the Gerber RS-274X format as this standard is widely used and automatically assigns
the D-code aperture drawing tool sizes automatically.
In the middle of the Export window, select the required Exported layers items and use the check
boxes to select which are exported.
Among the layers that may be required include the board outline, copper layers, solder mask layers
(will cover top and bottom traces), silkscreen layers (if screen print is used) and the drill and drill
symbols layer (sometimes optional).

Finally the all of the Gerber files and NC Drill files will need to be generated. The NC Drill files are
reports indicating the hole sizes and locations for all drilled holes to be included in the PCB design.
Select the Gerber RS-274X and NC Drill items by selecting the checkbox on the left to activate both
export items. Press the Export button and a simple DRC check will be done and then a progress bar
will allow you to see the progress of the export process. When complete, each layer will generate a
file with a .gbr extension and the NC drill export will generate two files with a .drl and .rep
extensions.
Once the save operation is completed, reorganize the files as required by the board manufacturer.
Some manufacturers require the files to be zipped into a folder with a simple format with just the
layer names for each file type. In some cases the exported file PeakDetect - Copper Top.gbr will need
to be changed to Copper Top.gbr before sending. Send the files to the PCB manufacturer for
quotation.
After getting a quote on the requested PCBs and placing the order, make preparation steps to order
BOM components, keeping in mind any longer lead components that may be required.
From within the MultiSIM BLUE application, you can quickly verify cost and lead time information
from mouser.com using the BOM Management tool. Before receiving the PCBs prepare a plan to
populate and assemble the board when the ordered items arrive.

Optionally, PCB manufactures can sometimes provide assembly services or make recommendations
on third-party companies that provide assembly services.