SANYO ApplicationofWorkSamplingandECRS FINAL2
SANYO ApplicationofWorkSamplingandECRS FINAL2
APPLICATION of WORK SAMPLING and ECRS (Eliminate, Combine, Re-lay out and Simplify)
PRINCIPLES of IMPROVEMENT at TO1 ASSEMBLY
Fritzie Ann A. Miranda
Manufacturing Department /Cleanroom, Section 1
SANYO Semiconductor Manufacturing Philippines Corporation (SSMP)
(An ON Semiconductor Company)
LIP-SEPZ, San Miguel, Tarlac City
Fritzie_ann_miranda @ sanyo.com
ABSTRACT
To continuously improve productivity, Improvement
Cycle was developed, starting from the process and work
content analysis down to the execution of process
improvement using various IE methodologies.
1.0 INTRODUCTION
STK
WB016
UTC-50
TO7H
WB123
UTC-50
7H, 5H
DB023
STC-40
7H
WB141
UTC-50
7H, 5H
WB086
UTC-50
7H, 5H
STC-40
TO220
500 MIL
UTC-50
7H, 5H
WB042
STK
UTC-50
7H, 5H
WB016
DB026
STC-5
7H
PS01
2
DB035
DB019
STC-40
7H
EDP
STC-40
7H
DB016
WB086
UTC-50
7H, 5H
DB020
STC-40
TO220
500 MIL
WB140
UTC-50
7H, 5H
WB042
UTC-50
7H, 5H
TOTAL NO.
OF MAN FOR
3 SHIFTS
Die bonding
operator
Die bonding
on-line
Wire bonding
operator
Wire bonding
on-line
TOTAL
12
UTC-50
7H
UTC-50
7H, 5H
UTC-50
7H, 5H
NO. OF
MAN PER
SHIFT
WB142
WB041
WB141
STC-40
SMP5, 5H, 7H
WB079
UTC-345
7H. SMP5,
5H
DB037
STC-40
7H, 5H
STC-5
7H
DB037
STC-40
7H, 5H
WB033
UTC-345
7H, SMP5,
5H
WB122
UTC-50
7H. SMP5,
5H
DB025
STC-5
7H
STC-40
TO5H/7H
UTC-345
7H. SMP5,
5H
Machine B
WB033
WB122
UTC-50
7H. SMP5,
5H
DB025
STC-5
7H
STC-40
TO5H/7H
WB079
UTC-345
7H. SMP5,
5H
WB077
DB019
STC-40
SMP5, 5H, 7H
UTC-345
7H, SMP5,
5H
-8
DB026
UTC-50
7H
WB077
FUNCTION
DB023
WB142
UTC-50
7H, 5H
WB140
UTC-50
7H, 5H
STC-40
7H
DB016
DB020
WB123
PS01
2
DB035
WB041
UTC-50
TO7H
Machine A
UTC-345
7H. SMP5,
5H
21st ASEMEP
2.2 PROCEDURE
A.1 Establish the Purpose of the studythe objective of the study should be established.
A.2 Identify the Subjectsthe people performing the task must be identified
N =
40
NX ) (X)
(X)
2
5% Precision
N =
20
NX ) (X)
(X)
2
A.4 Establish a Time PeriodStarting and stopping points for the study must be defined
as well.
10% Precision
Where:
N= actual number of observations of the element
X= each stop- watch reading or individual observation
= sum of individual readings
A.5 Define the Activitiesactivities that are performed by the people under study
must be define.
21st ASEMEP
Out of Area
( Assigned)
2%
NonProductive
Work
11%
Direct
Productive
Work
37%
Indirect
Productive
Work
43%
21st ASEMEP
150%
450
130%
400
BEFORE
110%
90%
300
250
70%
200
50%
150
Symbol
%cumulative
frequency
350
30%
100
10%
50
-10%
Filling up of checksheet
Inspection
Loading of leadframes
Load and unload magazine
Product info and qty check
Machine cleaning/5S
Wait for Machine to Finish
Unknown
Speak Unnecessary
Printing of lot b cards
Get lot can and plate numbers
Error Resetting
EDP input
Setting up the machine
Get wafer lot
Get leadframe and validate
Unloading wafer lot
Minor machine adjustment
Filling up of lot card
Walk Empty
Silver paste preparation
Marking of defective units
Getting of indication board
Scheduled
Personal
Change/cleaning collet
Change paste
Assigned
Speak necessary
Cleaning dispense nozzle
Arrange stocks
Transportation
Process Turnover
Work elements
Bond 1 pellet
Machine monitor /microscope inspect ion
Bond 1 leadframe
Microscope inspection using machine
Normal sampling inspection using machine
BEFORE
operator
Is it possible to change
the timing?
B.COMBINE:
The operation and inspection function were merged.
Operators assigned at Transistor Package (TO) assembly
were cross trained to on-line inspection. Also same
inspection items were combined.
.
ReRe-lay out
-Operation
-Inspection
Is it possible to
Eliminate a specific
work?
Bond 5 leadframes
Summary:
82%
18%
Eliminate
AVERAGE
UTILIZATION RATE
OF OPERATORS
IDLE
Bond 1 leadframe
AFTER
WORKING
Symbol
Work elements
Bond 1 pellet
inspector
AFTER
Operator
& inspector
C.RELAY OUT:
An efficient lay out is vital to achieved a smooth
production flow. Transistor package assembly was
subjected to major lay out from a scattered type (mixed
machines) to Clustered type (machines grouped per
process).The main objective of machine re-lay out is to be
able to reduced walk time of operators and to reduce the
man machine assignment.
Combine
Is it possible to integrate
or separate?
Simplify
STK
Before
After
WB016
UTC-50
T O7H
WB123
UTC-50
7H, 5H
DB023
ST C-40
7H
PS01
2
DB035
STC-40
7H
WB142
UTC-50
7H
WB041
UTC-50
7H, 5H
DB016
WB141
UTC-50
7H, 5H
WB086
UTC-50
7H, 5H
DB020
ST C-40
TO220
500 MIL
WB140
UTC-50
7H, 5H
WB042
UTC-50
7H, 5H
DB026
STC-5
7H
STC-40
SMP5, 5H, 7H
WB079
UT C-345
7H. SMP5,
5H
Wire
bonding
Die
bonding
DB037
STC-40
7H, 5H
WB033
UTC-345
7H, SMP5,
5H
WB122
UTC-50
7H. SMP5,
5H
Die
bonding
Wire
bonding
DB025
STC-5
7H
WB077
DB019
EDP
ST C-40
TO5H/7H
UTC-345
7H. SMP5,
5H
Scattered type
lay out
Clustered type
lay out
21st ASEMEP
D.SIMPLIFY
To lessen the load of operators the following items were
done:
D.1 Machines with manual loading of frames and wafers
were replaced to automatic machines.
Number of
machines
Operator 1
8
Operator 2
6
Operator 3
6
D.2 Since it was found out that most of the time the
operator spends on check sheets filling up, automation
of daily production record was implemented.
Manual
Automation
x
2.2.3 MAN AND MACHINE COMPUTATION
From the determined standard time and after the
implementation of improvements, man machine
requirement was computed. See figure below:
Table 2: Man requirement:
Funct ion
Die b on d in g
op erato r
Die b on d in g o n lin e
Wi re b on d in g
op erato r
Wi re b on d in g
on -lin e
T OT AL
0 .9 5
0.0 5
0 .6 3
0.3 7
0 .5 8
0.4 3
0 .8 5
0.1 5
3 .0 1
Before
After
Analysis:
Computation shows that there is a difference of 1 man
from the actual manpower deployed.
21st ASEMEP
Die
bonding
.
Loading of leadframes
Loading of wafer
Average
Wire
bonding
BEFORE
(Manual)
AFTER
(Automatic)
SAVINGS
(mins)
100%
100%
100%
80%
79%
80%
20%
21%
21%
80% Decreased in
assist time/lot
STK
Manpower assignment
12
9
Php 1,091,988 Php 1,455,955
Manpower cost
WB016
UTC-50
TO7H
WB123
UTC-50
7H, 5H
DB023
STC-40
7H
AFTER
PS01
2
DB035
STC-40
7H
UTC-50
7H
WB041
UTC-50
7H, 5H
DB016
WB141
UTC-50
7H, 5H
WB086
UTC-50
7H, 5H
DB020
STC-40
TO220
500 MIL
WB140
UTC-50
7H, 5H
WB042
UTC-50
7H, 5H
DB026
WB079
63%
100%
SAVINGS
/year
27%
DB037
STC-40
7H, 5H
WB033
UTC-345
7H, SMP5,
5H
WB122
UTC-50
7H. SMP5,
5H
DB025
STC-5
7H
EDP
3.4 OTHERS
After proving the effectiveness of Work Sampling and
ECRS principle of improvement, this methodology was
implemented to other companys production process. The
implementation contributes a good result on the attainment
of companys goal.
UTC-345
7H. SMP5,
5H
Before
After
Table 3.
Function
Die bonding
operator
Die bonding onWire bonding
operator
Wire bonding onAverage
AFTER
UTC-345
7H. SMP5,
5H
WB077
STC-40
TO5H/7H
BEFORE
STC-40
SMP5, 5H, 7H
STC-5
7H
DB019
SAVINGS
/year
3
2.69
BEFORE
AFTER
100%
57%
SAVINGS
(mins)
43%
100%
100%
69%
61%
31%
39%
100%
61%
39%
100%
62%
38%
4.0 CONCLUSION
The application of ECRS Principle is therefore effective to
increase man efficiency thereby reducing manpower cost.
62% Decreased
in walk time/lot
21st ASEMEP
5.0 RECOMMENDATIONS
The use of IE methodology such as Work sampling and
ECRS fundamentals are best recommended to any
manufacturing work stations to improve productivity and
cost.
`
6.0 ACKNOWLEDGMENT
This project shall not be realized without the help of the
following who shared their expertise, time and ideas
unreservedly. Thus, my sincere thanks to all of them!