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ISI Reballing September 2012

Reballing

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Gonçalo Romão
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© © All Rights Reserved
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63 views

ISI Reballing September 2012

Reballing

Uploaded by

Gonçalo Romão
Copyright
© © All Rights Reserved
Available Formats
Download as PDF, TXT or read online on Scribd
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ISI BGA Reballing Process

September 2012

www.isipkg.com

ISI Company Overview


Founded in 1987
Advanced electronic design and manufacturing
facility in the U.S.
200 full-time employees, including 70 with
engineering degrees, and 9 technicians
25+ patents
Broad and diversified manufacturing capabilities
Thousands of solutions designed
Millions of products shipped each year
Subsidiaries: Nallatech and Innovative Integration
Delivering Next Level Integration

Pioneered Next Level Integration by blending high density packaging


with advanced interconnect technologies to quickly deliver
optimized modular solutions
Multi-discipline approach improves performance, reduces size and cost,
and accelerates time-to-market

The Need for Reballing Components

Lead-free is not compatible with a tin-lead assembly


process; likewise tin-lead is not compatible with a
lead-free assembly process
Industry is predominantly supplying lead-free
packages
Customers need to reball components to alloy that is
compatible with the rest of its assembly process

ISI Solution: Reballing


ISI has an advanced process for removing and reballing solder spheres that
is compatible to the assembly process criteria, whether it requires:
Tin-lead (Sn63Pb37 eutectic)
Lead-free
Or any specialty alloys

Qualified by leading commercial, military and aerospace companies


Processes are tailored to each part. Specific control parameters are clearly
defined and indicated for:

Handling
Production
Controls for temperature
Humidity
ESD protection
Ball size/position tolerance specifications
Automation
Cleanliness
Inspection
Repackaging

ISI Certification and Statement Of Work

All processes done in


accordance with IPC/JEDEC
J-STD sensitivity levels.

The component
temperature exposure is
minimized during the ball
removal process.

ISI Reball
Certification
All parts are reballed using
a custom temperature
profile in a nitrogen
environment.

Parts are 100% optically


inspected to ensure the
device meets the
specifications for flatness
and co-planarity.
5

ISI Certification and Statement Of Work

Reballing Process Flow


Incoming inspection procedures per Quality Assurance Procedures (QAP)
Moisture Sensitivity Level (MSL) requirements are observed and followed
Deballing process is specified based on the component
Reballing utilizes high accuracy assembly tooling for ball placement
Reflow solder profiles customized for each component
Post ball attach cleaning procedures are monitored and measured using an Ionograph
Part marking available per customer specifications on request
True position, co-planarity and flatness are measured using Nikon Nexis or RVSI model LS6000
Final inspection per QAP
Packaging: either customer supplied, JEDEC trays or tape and reel per EIA-481 with nitrogen purged dry pack
bags
7

Reballing Flux Dispense

Ekra Screen Printer

Reballing
Ball Placement

Reflow Ovens Integrated Electronic Assembly

Heller Reflow Ovens

Sikama Conduction Convection Oven

10

Inspection and Test

Nikon Automated Optical Inspection

Ionograph Cleanliness Testing

11

Automated Optical Inspection

RVSI 100% Automated Optical Inspection

12

Operations and Quality

ISO9001:2008 certified by Perry


Johnson Registrars

IPC Class III compliant soldering


Certified IPC Specialist inspectors
and key operators
In-house Certified IPC Trainer

ITAR registered
North American
facilities

ISO 9001:2008 certified


ISO certified since July 2000
ITAR Registered
Comprehensive Quality and Process Controls
Material traceability
In-process controls
Automated test, measurement, and inspection systems
All work is performed at the ISI facilities in Camarillo, CA

13

The ISI Difference


ISIs reballing process has been audited and
approved for production by several Tier 1 defense
suppliers
ISI process is designed and optimized to minimize
stress on IC
100% automated optical assembly of reballed
components
ISI has reballed over 1,000,000 components
Any pitch, any package, any quantity
Fast turn-around conversion of any alloy to any alloy
including Pb-free to Sn/Pb
Get a reballing quote in less than 24 hours
14

Thank you!
For more information, please visit www.isipkg.com

Copyright 2012 Interconnect Systems, Inc. All rights reserved.

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