Proper PCB layout techniques maximize power module performance

Understand how board layout affects actual power subsystem results

Don Rhodes and Marc Davis-Marsh, National Semiconductor Corp.
A new class of easy-to-use power modules offers an alternative to complex power designs
and the printed circuit board (PCB) layout issues typically related to DC-DC converters.
Nonetheless, there is still some engineering to be done when designing with and laying out
these power modules, which integrate an inductor and a monolithic synchronous regulator
within one power package. This article describes the best PCB layout methods, practices
and techniques to maximize the SIMPLE SWITCHER power modules performance.
When planning a power-converter layout, the first thing to consider is the physical loop
area of the two switched current loops. Even though these are primarily hidden from view
in a power module, its important that we understand the current paths in each of the two
loops since they do extend beyond the module. In Loop 1, shown in Figure 1, current flow
originates at the energized input bypass capacitor (Cin1) and then continues through the
internal high-side MOSFET during its on-time, followed by the internal inductor and the
output bypass capacitor (CO1) finally returning to the input bypass capacitor.

Figure 1

Figure 2

Loop 2 is formed during the off-time of the internal high-side MOSFET and the on-time of
the low-side MOSFET. The energy stored in the internal inductor flows through the output
bypass capacitor and the low-side MOSFET returning to GND as shown. The area where
these two loops dont overlap, including the boundary between the loops, is a high di/dt
current area. The input bypass capacitor (Cin1) plays a critical role in supplying highfrequency currents to the converter and returning them to their source.
The output-bypass capacitor (Co1) does not supply large ac current, but does act as a highfrequency filter for switching noise. For these reasons, the input and output capacitors
should be placed as close as possible to their respective VIN and VOUT pins on the module.
As shown in Figure 2, make the traces between the bypass capacitors and their respective

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VIN and VOUT pins as short and wide as possible, thereby minimizing the inductance of
these connections.
There are two primary benefits in minimizing the inductance of the layout. The first benefit
is improving the part's performance, by enhancing the transfer of energy to-and-from Cin1
and CO1, respectively. This will make sure the module has good high-frequency bypassing
to minimize inductive voltage spikes from the high di/dt currents. This minimizes noise and
voltage stress to the device, ensuring proper operation. The second benefit is minimized
EMI.
A capacitor connected with less parasitic inductance will exhibit low impedance to much
higher frequencies, and consequently reduce conducted emissions. Ceramic (X7R or X5R)
or other low ESR-type capacitors are recommended. Adding more input capacitance is only
effective if additional caps are placed close to GND and VIN. The SIMPLE SWITCHER
power modules have inherently lower radiated and conducted EMI as a result of their
design. However, maximum performance will be achieved by following the layout
guidelines discussed in this article.
The routing of return currents are often overlooked, and yet they play an essential role in
the optimization of any power design. Again, ground traces from Cin1 and CO1 should be
kept as short and wide as possible, with a direct connection of the exposed pad. This is
especially important for the ground connection of the input cap (Cin1), which carries large
ac currents.
The ground-connected pins of the module (including the exposed pad), input and output
capacitors, soft-start cap and feedback resistor should all be connected to a return plane on
your PCB. This return plane serves as a very low inductance current return path and a heat
spreader as discussed in the following section.
The feedback resistors should also be placed as close as possible to the modules FB
(feedback) pin. Keeping the trace between the FB pin and the center tap of the feedback
resistors as short as possible is important in minimizing potential noise pick-up on this
high-impedance node. The compensation components or feed forward capacitor, as
applicable, should be placed as close as possible to the upper feedback resistor. See the
PCB layout diagrams in the respective module datasheets for examples. (See AN-2024
available at www.national.com for a layout example of the LMZ14203.
Thermal Design Recommendations
The electrical benefit derived from the compact layout of a module finds its tradeoff in
thermal design. The same amount of power needs to be dissipated, but from a smaller space.
With this in mind, the SIMPLE SWITCHER power modules were designed with a single,
large, exposed pad on the back of the package that is electrically connected to ground. This
pad provides very low thermal impedance from the internal MOSFETs (where most of the
heat is generated) to the PCB.

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JC, the thermal impedance from the junction of the semiconductor to the case for these
devices is 1.9 C/W. An industry leading JC is great, but if the thermal impedance from the
case to the ambient air (CA) is too large, then a low JC means nothing! The heat becomes
trapped at the exposed pad when no low resistance thermal path is offered to the ambient
air.
And what determines CA? The thermal resistance from the exposed pad to the ambient air
is completely controlled by the design of the PCB and any associated heat sinks.

Figure 3
Lets quickly look at how to do a simple thermal design with a PCB and no heat-sink.
Figure 3 illustrates the module and the PCB as thermal resistances. Due to the relatively
high thermal impedance between the junction and the case top, compared to the thermal
impedance from the junction to the exposed die attach pad, the JT thermal path can be
ignored for our first pass estimate of the thermal resistance from the junction to the ambient
air, JA.
The first step in a thermal design is to determine how much power we need to dissipate.
The power dissipated by a module (PD) can be easily calculated from the efficiency graphs
() published in the datasheet.

We then use our designs temperature constraints, the maximum TAmbient and the rated
junction temperature TJunction, (125C) to determine the required thermal resistance of the
module mounted on a PCB.

Finally, we can use a greatly simplified approximation for the convective heat transfer from
the PCBs surface (which has unbroken one-ounce copper heat-sinking on both the top and
bottom layers, and infinite thermal vias) to determine the board area required for heat
sinking:

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This approximation of required PCB board area does not include the effect of thermal vias,
which are used to transfer heat from the top layer metal (where the package connects to the
PCB) to the bottom layer metal. The bottom layer is used as a second surface where
convection can transfer heat away from the board. For the board area approximation to be
effective, use at least 8-10 thermal vias. The thermal resistance for vias is approximated by
this equation:

This approximation is for a typical 12 mil diameter through-hole via with a 0.5 ounce
copper sidewall. Use as many vias as will fit underneath the exposed pad, using 1 mm to
1.5 mm spacing to form an array. (See application notes AN-2020 and AN-2026 available
at www.national.com for further information.)
Conclusion
The SIMPLE SWITCHER power modules offer an alternative to complex power designs
and the PCB layout issues typically related to DC-DC converters. While the layout
headaches have been eliminated, there is still some engineering to be done to maximize the
performance of the modules through good bypassing and thermal design.
About the Authors
Don Rhodes is a field applications engineer with National Semiconductor Corp., and
is based in Tigard, Oregon. He received his BSE degree from Chapman University.
Marc Davis-Marsh is an applications engineer with National Semiconductor Corp.,
Santa Clara, Calif. He holds an MSEE and BSEE from Wright State University,
Dayton, Ohio.

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