Data Sheet 1
Data Sheet 1
STW6N120K3
N-channel 1200 V, 1.95 typ., 6 A SuperMESH3
Power MOSFET in TO-3PF, TO-220 and TO-247 packages
Datasheet production data
Features
Order codes
VDSS
RDS(on)
max
ID
Ptot
STFW6N120K3
1200 V
< 2.4
6A
63 W
STP6N120K3
1200 V
< 2.4
6A
150 W
STW6N120K3
1200 V
< 2.4
6A
150 W
Zener-protected
TAB
3
1
Figure 1.
TO-247
TO-220
Applications
TO-3PF
Switching applications
D(2,TAB)
Description
These SuperMESH3 Power MOSFETs are the
result of improvements applied to
STMicroelectronics SuperMESH technology,
combined with a new optimized vertical structure.
These devices boast an extremely low onresistance, superior dynamic performance and
high avalanche capability, rendering them suitable
for the most demanding applications.
G(1)
S(3)
AM01476v1
Table 1.
Device summary
Order codes
Marking
Package
STFW6N120K3
STP6N120K3
TO-3PF
6N120K3
STW6N120K3
November 2012
This is information on a product in full production.
Packaging
TO-220
Tube
TO-247
1/17
www.st.com
17
Contents
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
........................... 6
Test circuits
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2/17
.............................................. 9
Electrical ratings
Electrical ratings
Table 2.
Symbol
Parameter
Unit
TO-3PF
VGS
TO-220
TO-247
30
ID
ID
3.8
20
IDM
(1)
PTOT
Power dissipation at TC = 25 C
IAR
EAS
ESD
VISO
Tstg
Storage temperature
TJ
63
150
150
180
mJ
kV
3500
-55 to 150
Table 3.
Thermal data
Value
Symbol
Parameter
Rthj-case
Rthj-amb
TJ
Unit
TO-3PF
TO-220 TO-247
1.98
0.83
50
62.5
300
C/W
50
C/W
C
3/17
Electrical characteristics
Electrical characteristics
(TC = 25 C unless otherwise specified)
Table 4.
Symbol
V(BR)DSS
On / off states
Parameter
Drain-source
breakdown voltage
Test conditions
ID = 1 mA, VGS = 0
Min.
Typ.
Max.
Unit
1200
IDSS
VDS = 1200 V
Zero gate voltage
drain current (VGS = 0) VDS = 1200 V, TJ = 125 C
1
50
A
A
IGSS
Gate-body leakage
current (VDS = 0)
10
VGS = 20 V
VGS(th)
RDS(on)
1.95
2.4
Min.
Typ.
Max.
Unit
Table 5.
Symbol
Dynamic
Parameter
Test conditions
Input capacitance
Output capacitance
Reverse transfer
capacitance
1050
90
1
pF
pF
pF
Co(tr) (1)
Equivalent
capacitance time
related
40
pF
Co(er) (2)
Equivalent
capacitance energy
related
25
pF
RG
Intrinsic gate
resistance
Qg
Qgs
Qgd
39
7.7
23.5
nC
nC
nC
Ciss
Coss
Crss
1. Coss eq. time related is defined as a constant equivalent capacitance giving the same charging time as
Coss when VDS increases from 0 to 80% VDSS.
2. Coss eq. energy related is defined as a constant equivalent capacitance giving the same stored energy as
Coss when VDS increases from 0 to 80% VDSS.
4/17
Table 6.
Symbol
td(on)
tr
td(off)
tf
Table 7.
Electrical characteristics
Test conditions
Min.
30
12
58
32
Min.
Typ.
6
20
A
A
ns
ns
ns
ns
Symbol
Parameter
ISD
ISDM (1)
Source-drain current
Source-drain current (pulsed)
VSD (2)
Forward on voltage
ISD = 5 A, VGS = 0
--
1.6
580
7
25
ns
C
A
840
9
22
ns
C
A
Min.
Typ.
trr
Qrr
IRRM
trr
Qrr
IRRM
Test conditions
Max. Unit
Table 8.
Symbol
V(BR)GSO
Test conditions
Gate-source breakdown
voltage
IGS = 1 mA (ID=0)
30
Max. Unit
-
The built-in back-to-back Zener diodes have specifically been designed to enhance not only
the devices ESD capability, but also to make them safely absorb possible voltage transients
that may occasionally be applied from gate to source. In this respect the Zener voltage is
appropriate to achieve an efficient and cost-effective intervention to protect the devices
integrity. These integrated Zener diodes thus avoid the usage of external components.
5/17
Electrical characteristics
2.1
Figure 2.
Figure 3.
!-V
)$
!
TO3PF
K
=0.5
0.2
O
N
$3
PE
RA
ITE TION
D IN
BY