Power Consumption and Thermal

Management 3:
Thermal Management
Pablo Ituero and Rubn San Segundo
Bibliography
Heat Transfer: Thermal Management of Electronics.
Younes Shabany. CRC Press. 2009.
Thermal management. Frode Strisland.
FYS4260/FYS9260: Microsystems and Electronics
Packaging and Interconnect. University of Oslo.
Own material

2
Lecture outline
11 Heat Transfer Mechanisms
11.1 Conduction
11.2 Convection
11.3 Radiation
12 Thermal Resistance
13 Power-Derating Curve
14 Improving Power Dissipation
15 Thermal Capacitance

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11. Heat Transfer Mechanisms

4
Heat transfer mechanisms

5
Heat transfer mechanisms

6
11.1 Conduction

Thermal
conductivity

Fouriers law of heat conduction

7
Conduction

8
Conduction: exercise 17

9
Conduction: exercise18

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11.2 Convection

11
Convection

Convection heat
transfer coefficient

Natural convection: generated by a density difference

Forced convection: generated by a fan, a pump or wind.

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Geometry is important in natural
convection Relative heat
transfer
coefficients:
Flat plate heat flow

Top surface hot

Bottom surface hot

13
Laminar vs Turbulent Forced
Convection

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 Convection: exercise 19
Consider a 400 mm 600 mm printed circuit board that is exposed to air with a
velocity of 2 m/s and temperature of 25C. The electronics on this board dissipate
150 W and the board with those electronics will be approximated as a flat plate
with uniform temperature. Calculate the board temperature if (a) the airflow is
laminar and along the 400 mm side, (b) the airflow is laminar and along the 600
mm side, (c) the air flow is turbulent and along the 400 mm side, and (d) the airflow
is turbulent and along the 600 mm side.

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 Convection: exercise 19
Consider a 400 mm 600 mm printed circuit board that is exposed to air with a
velocity of 2 m/s and temperature of 25C. The electronics on this board dissipate
150 W and the board with those electronics will be approximated as a flat plate
with uniform temperature. Calculate the board temperature if (a) the airflow is
laminar and along the 400 mm side, (b) the airflow is laminar and along the 600
mm side, (c) the air flow is turbulent and along the 400 mm side, and (d) the airflow
is turbulent and along the 600 mm side.

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11.3 Radiation

17
Radiation

Area Kelvin (K=273+C)

Stefan-Boltzmann
Surface constant = 5.67x10-4
emissivity W/m2.K4

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Radiation

19
Radiation

Radiation heat transfer coefficient

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12. Thermal Resistance

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Thermal Resistance
Based on Fouriers law, we define Q as the heat flow normal
to the cross-sectional area, and the corresponding power P:

Inserting this into Fourier's law and rearranging:

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 Simplified Model: Thermal
resistance

Nomenclature: Thermal resistance between the junction (chips silicon surface) and the
exterior at ambient temperature: (in some texts is also referred to as )

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Using the Model
Knowing the power dissipation of a circuit, its RJA and the
ambient temperature: What is the temperature of the
circuit?
Knowing the maximum allowable temperature of the circuit,
RJA and the ambient temperature: What is the maximum
allowable power consumption?
Knowing the maximum allowable power consumption of the
circuit at a given ambient temperature and the maximum
allowable temperature of the circuit: What is RJA?
Two chips with the same package consume the same power,
one is bigger that the other. Which one is hotter?

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Thermal resistance example

Find:

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Thermal Resistance
Decomposition
RJA can be broken down into a pair of series resistances:
RJA RJC RCA
RJC = thermal resistance between junction and case (fixed)
RCA = thermal resistance between case and ambience.

RCA can be lowered by increasing the surface area of the transistor

case, i.e. by adding a heat-sink. RCA RCS RSA

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Simplified Model: SoC model

Die: silicon die, the electronic chip

TIM: Thermal interface material

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Simplified Model: SoC model

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Simplified Model: SoC model

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Simplified Model: SoC model

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Example 21: SoC model

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Example 21: SoC model

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Examples
Film
Screw Nut

Device

Sink

37
Examples: 2 devices in the
same sink

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Examples: 2 devices in the
same sink

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13. Power-Derating Curve

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Power-Derating Curve
Junction temperature must not exceed Tjmax. Also, power dissipation must not
exceed PD0. Combining these limitations gives the power derating curve.
PDmax

PD0
TJ max TA
PD max
JA

0
TA0 TA TJmax TA

= -1/Slope

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Power-Derating Curve with respect
to Case Temp
Maximum allowable power dissipation
Versus transistor/chip case temperature.

PDmax

Pdmax(TCO)

TJ max TC
PD max
RJC

0
TC0 TC TJmax TC

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Using the Power Derating Curve

PDmax [W]

1.6
TA 25 PD max 2 W
TA 50 PD max 1.6 W

0
25 50 150 TA [C]

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Power Limitation

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Power Limitation

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14. Improving Power Dissipation

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 Improving Power Dissipation
The only fixed point on the power-derating curve is TJmax.
To increase power dissipation, slope of power-derating curve
must be steeper.
Thermal resistance must be lowered.
PDmax [W] PDmax [W]

5.2

2
1.6

0 0
25 50 150 25 50 150 TA [C]
TA [C]

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Reducing the Thermal Resistance

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Reducing the Thermal Resistance
Methods to increase the area
Heat Sinks
Fins
Methods to increase the convection transfer
mechanism
Fans
Pumps

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Fins and Heat Sink: longitudinal
fins

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Fins and Heat Sink: simulation
Elliott Sound Products (www.sound.au.com)

Heatsink Details (Negative=inches)

Fin Depth 75,00 mm (inch) 2,952756 Heatsink Calculator
Fin Height 50,00 mm (inch) 1,968504 Fill in the data for the blue sections (all are required, width is optional)
No. Fins 20 Flat fins are assumed, ribbed fins will have better performance than
Length 200,00 mm (inch) 7,874016 shown. Refer to drawings for definitions of depth, width & height.
Width 0,00 mm (inch) 2,952756
Thermal Ratings
Temperature (maximum) Per Fin 15,6278 deg C / Watt
Heatsink 40,00 deg C H/S Body 3,9069 deg C / W
Ambient 25,00 deg C Total 0,6512 deg C / Watt
Emissivity 0,85 (From below)

Surface Treatment Emissivity (typical) Coefficients:

Min Max Convection 0,000514 W/sq cm 0,0033 W/sq in
Polished aluminium 0,05 Radiation 0,000552 W/sq cm 0,0036 W/sq in
Polished copper 0,07
Rolled sheet steel 0,66 Note that the calculations made by this program are only
Oxidised copper 0,70 approximate, and no guarantees are made or implied as to
Black anodised Al 0,70 0,90 the suitability of the results for your application.
Black enamel 0,85 0,91
Dark varnish 0,89 0,93 Some comparisons with manufacturer data indicate that the
Black oil paint 0,92 0,96 results may be a little pessimistic (or perhaps realistic).

Version 1.0 2000 Rod Elliott ([email protected])

08 Apr 2000

59
Advanced Cooling Strategies:
heat pipes

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Advanced Cooling Strategies:
heat pipes

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Advanced Cooling Strategies:
heat pipes

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Advanced Cooling Strategies:
heat pipes

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Advanced Cooling Strategies:
heat pipes

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Advanced Cooling Strategies:
Liquid cooling

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15. Thermal Capacitance

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Simplified Model: Thermal
resistance

PD: Power dissipated by the device

Tj: T in the device
Ta: ambient T
Rth: thermal resistance (C/W)
Cth: thermal capacitance

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Simplified Model: Thermal
resistance

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More exercises
Heat Transfer: Thermal Management of Electronics.
Younes Shabany. CRC Press. 2009.
Chapter 5 and 6 with solutions

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