PIC18F1220/1320

Data Sheet
18/20/28-Pin High-Performance,
Enhanced Flash Microcontrollers
with 10-Bit A/D and nanoWatt Technology

© 2007 Microchip Technology Inc. DS39605F

Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
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Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
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Information contained in this publication regarding device Trademarks

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and may be superseded by updates. It is your responsibility to dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
ensure that your application meets with your specifications.
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© 2007, Microchip Technology Incorporated, Printed in the
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Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its PIC®
MCUs and dsPIC DSCs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.

DS39605F-page ii © 2007 Microchip Technology Inc.

 PIC18F1220/1320
18/20/28-Pin High-Performance, Enhanced Flash MCUs
with 10-bit A/D and nanoWatt Technology
Low-Power Features: Peripheral Highlights:
• Power Managed modes: • High current sink/source 25 mA/25 mA
- Run: CPU on, peripherals on • Three external interrupts
- Idle: CPU off, peripherals on • Enhanced Capture/Compare/PWM (ECCP) module:
- Sleep: CPU off, peripherals off - One, two or four PWM outputs
• Power Consumption modes: - Selectable polarity
- PRI_RUN: 150 μA, 1 MHz, 2V - Programmable dead time
- PRI_IDLE: 37 μA, 1 MHz, 2V - Auto-Shutdown and Auto-Restart
- SEC_RUN: 14 μA, 32 kHz, 2V - Capture is 16-bit, max resolution 6.25 ns (TCY/16)
- SEC_IDLE: 5.8 μA, 32 kHz, 2V - Compare is 16-bit, max resolution 100 ns (TCY)
- RC_RUN: 110 μA, 1 MHz, 2V • Compatible 10-bit, up to 13-channel Analog-to-
- RC_IDLE: 52 μA, 1 MHz, 2V Digital Converter module (A/D) with programmable
- Sleep: 0.1 μA, 1 MHz, 2V acquisition time
• Timer1 Oscillator: 1.1 μA, 32 kHz, 2V • Enhanced USART module:
• Watchdog Timer: 2.1 μA - Supports RS-485, RS-232 and LIN 1.2
• Two-Speed Oscillator Start-up - Auto-Wake-up on Start bit
- Auto-Baud Detect
Oscillators:
Special Microcontroller Features:
• Four Crystal modes:
- LP, XT, HS: up to 25 MHz • 100,000 erase/write cycle Enhanced Flash
- HSPLL: 4-10 MHz (16-40 MHz internal) program memory typical
• Two External RC modes, up to 4 MHz • 1,000,000 erase/write cycle Data EEPROM
memory typical
• Two External Clock modes, up to 40 MHz
• Flash/Data EEPROM Retention: > 40 years
• Internal oscillator block:
- 8 user-selectable frequencies: 31 kHz, 125 kHz, • Self-programmable under software control
250 kHz, 500 kHz, 1 MHz, 2 MHz, 4 MHz, 8 MHz • Priority levels for interrupts
- 125 kHz to 8 MHz calibrated to 1% • 8 x 8 Single-Cycle Hardware Multiplier
- Two modes select one or two I/O pins • Extended Watchdog Timer (WDT):
- OSCTUNE – Allows user to shift frequency - Programmable period from 41 ms to 131s
• Secondary oscillator using Timer1 @ 32 kHz - 2% stability over VDD and Temperature
• Fail-Safe Clock Monitor • Single-supply 5V In-Circuit Serial Programming™
- Allows for safe shutdown if peripheral clock stops (ICSP™) via two pins
• In-Circuit Debug (ICD) via two pins
• Wide operating voltage range: 2.0V to 5.5V

Program Memory Data Memory

10-bit ECCP Timers
Device Flash # Single-Word SRAM EEPROM I/O EUSART
A/D (ch) (PWM) 8/16-bit
(bytes) Instructions (bytes) (bytes)
PIC18F1220 4K 2048 256 256 16 7 1 Y 1/3
PIC18F1320 8K 4096 256 256 16 7 1 Y 1/3

© 2007 Microchip Technology Inc. DS39605F-page 1

PIC18F1220/1320
Pin Diagrams

18-Pin PDIP, SOIC 20-Pin SSOP

RA0/AN0 1 18 RB3/CCP1/P1A RA0/AN0 1 20 RB3/CCP1/P1A

RA1/AN1/LVDIN 2 17 RB2/P1B/INT2 RA1/AN1/LVDIN 2 19 RB2/P1B/INT2

RA4/T0CKI 3 16 OSC1/CLKI/RA7 RA4/T0CKI 3 18 OSC1/CLKI/RA7

PIC18F1X20
MCLR/VPP/RA5 MCLR/VPP/RA5 4 17 OSC2/CLKO/RA6

PIC18F1X20
4 15 OSC2/CLKO/RA6

VSS/AVSS VDD/AVDD VSS 5 16 VDD

5 14
RB7/PGD/T1OSI/ AVSS 6 15 AVDD
RA2/AN2/VREF- 6 13 P1D/KBI3
RB7/PGD/T1OSI/
RB6/PGC/T1OSO/ RA2/AN2/VREF- 7 14
RA3/AN3/VREF+ 7 12 P1D/KBI3
T13CKI/P1C/KBI2 RB6/PGC/T1OSO/
RB0/AN4/INT0 8 11 RB5/PGM/KBI1 RA3/AN3/VREF+ 8 13
T13CKI/P1C/KBI2
RB1/AN5/TX/ 9 10 RB4/AN6/RX/ RB0/AN4/INT0 9 12 RB5/PGM/KBI1
CK/INT1 DT/KBI0
RB1/AN5/TX/ RB4/AN6/RX/
10 11 DT/KBI0
CK/INT1
RA1/AN1/LVDIN

28-Pin QFN
RB3/CCP1/P1A
RB2/P1B/INT2
RA4/T0CKI

RA0/AN0

NC
NC
28
27
26
25
24
23
22

MCLR/VPP/RA5 1 21 OSC1/CLKI/RA7
NC 2 20 OSC2/CLKO/RA6
VSS 3 19 VDD
NC 4 PIC18F1X20 18 NC
AVSS 5 17 AVDD
NC 6 16 RB7/PGD/T1OSI/P1D/KBI3
RA2/AN2/VREF- 7 15 RB6/PGC/T1OSO/T13CKI/P1C/KBI2
10
11
12
13
14
8
9

RB5/PGM/KBI1
RA3/AN3/VREF+

NC
RB0/AN4/INT0
RB1/AN5/TX/CK/INT1

RB4/AN6/RX/DT/KBI0

NC

DS39605F-page 2 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 5
2.0 Oscillator Configurations ............................................................................................................................................................ 11
3.0 Power Managed Modes ............................................................................................................................................................. 19
4.0 Reset .......................................................................................................................................................................................... 33
5.0 Memory Organization ................................................................................................................................................................. 41
6.0 Flash Program Memory.............................................................................................................................................................. 57
7.0 Data EEPROM Memory ............................................................................................................................................................. 67
8.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 71
9.0 Interrupts .................................................................................................................................................................................... 73
10.0 I/O Ports ..................................................................................................................................................................................... 87
11.0 Timer0 Module ........................................................................................................................................................................... 99
12.0 Timer1 Module ......................................................................................................................................................................... 103
13.0 Timer2 Module ......................................................................................................................................................................... 109
14.0 Timer3 Module ......................................................................................................................................................................... 111
15.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 115
16.0 Enhanced Addressable Universal Synchronous Asynchronous Receiver Transmitter (EUSART) .......................................... 131
17.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 155
18.0 Low-Voltage Detect .................................................................................................................................................................. 165
19.0 Special Features of the CPU.................................................................................................................................................... 171
20.0 Instruction Set Summary .......................................................................................................................................................... 191
21.0 Development Support............................................................................................................................................................... 233
22.0 Electrical Characteristics .......................................................................................................................................................... 237
23.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 267
24.0 Packaging Information.............................................................................................................................................................. 285
Appendix A: Revision History............................................................................................................................................................. 291
Appendix B: Device Differences ........................................................................................................................................................ 291
Appendix C: Conversion Considerations ........................................................................................................................................... 292
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 292
Appendix E: Migration from Mid-Range to Enhanced Devices .......................................................................................................... 293
Appendix F: Migration from High-End to Enhanced Devices ............................................................................................................. 293
Index .................................................................................................................................................................................................. 295
The Microchip Web Site ..................................................................................................................................................................... 303
Customer Change Notification Service .............................................................................................................................................. 303
Customer Support .............................................................................................................................................................................. 303
Reader Response .............................................................................................................................................................................. 304
PIC18F1220/1320 Product Identification System .............................................................................................................................. 305

© 2007 Microchip Technology Inc. DS39605F-page 3

PIC18F1220/1320

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DS39605F-page 4 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
1.0 DEVICE OVERVIEW Besides its availability as a clock source, the internal
oscillator block provides a stable reference source that
This document contains device specific information for gives the family additional features for robust
the following devices: operation:
• PIC18F1220 • PIC18F1320 • Fail-Safe Clock Monitor: This option constantly
monitors the main clock source against a reference
This family offers the advantages of all PIC18 microcon- signal provided by the internal oscillator. If a clock fail-
trollers – namely, high computational performance at an ure occurs, the controller is switched to the internal
economical price – with the addition of high endurance oscillator block, allowing for continued low-speed
Enhanced Flash program memory. On top of these fea- operation, or a safe application shutdown.
tures, the PIC18F1220/1320 family introduces design • Two-Speed Start-up: This option allows the internal
enhancements that make these microcontrollers a logical oscillator to serve as the clock source from Power-
choice for many high-performance, power sensitive on Reset, or wake-up from Sleep mode, until the
applications. primary clock source is available. This allows for
code execution during what would otherwise be the
1.1 New Core Features clock start-up interval and can even allow an appli-
cation to perform routine background activities and
1.1.1 nanoWatt TECHNOLOGY return to Sleep without returning to full power
operation.
All of the devices in the PIC18F1220/1320 family incor-
porate a range of features that can significantly reduce
power consumption during operation. Key items include: 1.2 Other Special Features
• Alternate Run Modes: By clocking the controller • Memory Endurance: The Enhanced Flash cells for
from the Timer1 source or the internal oscillator both program memory and data EEPROM are rated
block, power consumption during code execution to last for many thousands of erase/write cycles –
can be reduced by as much as 90%. up to 100,000 for program memory and 1,000,000
• Multiple Idle Modes: The controller can also run for EEPROM. Data retention without refresh is
with its CPU core disabled, but the peripherals are conservatively estimated to be greater than
still active. In these states, power consumption can 40 years.
be reduced even further, to as little as 4% of normal • Self-programmability: These devices can write to
operation requirements. their own program memory spaces under internal
• On-the-fly Mode Switching: The power managed software control. By using a bootloader routine
modes are invoked by user code during operation, located in the protected Boot Block at the top of pro-
allowing the user to incorporate power-saving ideas gram memory, it becomes possible to create an
into their application’s software design. application that can update itself in the field.
• Lower Consumption in Key Modules: The power • Enhanced CCP module: In PWM mode, this
requirements for both Timer1 and the Watchdog module provides 1, 2 or 4 modulated outputs for
Timer have been reduced by up to 80%, with typical controlling half-bridge and full-bridge drivers. Other
values of 1.1 and 2.1 μA, respectively. features include auto-shutdown, for disabling PWM
outputs on interrupt or other select conditions and
1.1.2 MULTIPLE OSCILLATOR OPTIONS auto-restart, to reactivate outputs once the condition
AND FEATURES has cleared.
• Enhanced USART: This serial communication
All of the devices in the PIC18F1220/1320 family offer
module features automatic wake-up on Start bit and
nine different oscillator options, allowing users a wide
automatic baud rate detection and supports RS-232,
range of choices in developing application hardware.
RS-485 and LIN 1.2 protocols, making it ideally
These include:
suited for use in Local Interconnect Network (LIN)
• Four Crystal modes, using crystals or ceramic bus applications.
resonators. • 10-bit A/D Converter: This module incorporates
• Two External Clock modes, offering the option of programmable acquisition time, allowing for a
using two pins (oscillator input and a divide-by-4 channel to be selected and a conversion to be
clock output), or one pin (oscillator input, with the initiated without waiting for a sampling period and
second pin reassigned as general I/O). thus, reduce code overhead.
• Two External RC Oscillator modes, with the same • Extended Watchdog Timer (WDT): This enhanced
pin options as the External Clock modes. version incorporates a 16-bit prescaler, allowing a
• An internal oscillator block, which provides an time-out range from 4 ms to over 2 minutes that is
8 MHz clock (±2% accuracy) and an INTRC source stable across operating voltage and temperature.
(approximately 31 kHz, stable over temperature and
VDD), as well as a range of 6 user-selectable clock
frequencies (from 125 kHz to 4 MHz) for a total of
8 clock frequencies.

© 2007 Microchip Technology Inc. DS39605F-page 5

PIC18F1220/1320
1.3 Details on Individual Family A block diagram of the PIC18F1220/1320 device
Members architecture is provided in Figure 1-1. The pinouts for
this device family are listed in Table 1-2.
Devices in the PIC18F1220/1320 family are available
in 18-pin, 20-pin and 28-pin packages. A block diagram
for this device family is shown in Figure 1-1.
The devices are differentiated from each other only in
the amount of on-chip Flash program memory
(4 Kbytes for the PIC18F1220 device, 8 Kbytes for the
PIC18F1320 device). These and other features are
summarized in Table 1-1.

TABLE 1-1: DEVICE FEATURES

Features PIC18F1220 PIC18F1320

Operating Frequency DC – 40 MHz DC – 40 MHz

Program Memory (Bytes) 4096 8192
Program Memory (Instructions) 2048 4096
Data Memory (Bytes) 256 256
Data EEPROM Memory (Bytes) 256 256
Interrupt Sources 15 15
I/O Ports Ports A, B Ports A, B
Timers 4 4
Enhanced Capture/Compare/PWM Modules 1 1
Serial Communications Enhanced USART Enhanced USART
10-bit Analog-to-Digital Module 7 input channels 7 input channels
POR, BOR, POR, BOR,
RESET Instruction, Stack Full, RESET Instruction, Stack Full,
Resets (and Delays)
Stack Underflow (PWRT, OST), Stack Underflow (PWRT, OST),
MCLR (optional), WDT MCLR (optional), WDT
Programmable Low-Voltage Detect Yes Yes
Programmable Brown-out Reset Yes Yes
Instruction Set 75 Instructions 75 Instructions
18-pin SDIP 18-pin SDIP
18-pin SOIC 18-pin SOIC
Packages
20-pin SSOP 20-pin SSOP
28-pin QFN 28-pin QFN

DS39605F-page 6 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 1-1: PIC18F1220/1320 BLOCK DIAGRAM
Data Bus<8>

PORTA
21 Table Pointer <2> Data Latch
8 8 8 8
RA0/AN0
Data RAM
21 inc/dec logic RA1/AN1/LVDIN
21 Address Latch
RA2/AN2/VREF-
20 PCLATU PCLATH
Address Latch 12(2)
Program Memory Address<12> RA3/AN3/VREF+
(4 Kbytes) PCU PCH PCL
PIC18F1220 Program Counter 4 12 4 RA4/T0CKI
(8 Kbytes) BSR FSR0 Bank0, F
PIC18F1320 FSR1
31 Level Stack MCLR/VPP/RA5(1)
FSR2
Data Latch 12
OSC2/CLKO/RA6(2)
16 inc/dec
Decode logic OSC2/CLKI/RA7(2)
Table Latch

8
ROM Latch PORTB

RB0/AN4/INT0
Instruction
Register RB1/AN5/TX/CK/INT1

8
Instruction RB2/P1B/INT2
Decode &
Control PRODH PRODL RB3/CCP1/P1A
3
8 x 8 Multiply
8 RB4/AN6/RX/DT/KBI0

BIT OP WREG RB5/PGM/KBI1

OSC1(2) Power-up 8
8 8
Timing Timer
OSC2(2) RB6/PGC/T1OSO/
Generation Oscillator
8 T13CKI/P1C/KBI2
Start-up Timer
T1OSI INTRC RB7/PGD/T1OSI/
Oscillator Power-on ALU<8> P1D/KBI3
Reset
T1OSO
Watchdog 8
Timer
Precision
Low-Voltage Brown-out
Voltage
Programming Reset
MCLR(1) Reference
In-Circuit Fail-Safe
Debugger Clock Monitor
VDD, VSS

Timer0 Timer1 Timer2 Timer3 A/D Converter

Enhanced Enhanced
USART Data EEPROM
CCP

Note 1: RA5 is available only when the MCLR Reset is disabled.

2: OSC1, OSC2, CLKI and CLKO are only available in select oscillator modes and when these pins are not being used as digital
I/O. Refer to Section 2.0 “Oscillator Configurations” for additional information.

© 2007 Microchip Technology Inc. DS39605F-page 7

PIC18F1220/1320
TABLE 1-2: PIC18F1220/1320 PINOUT I/O DESCRIPTIONS
Pin Number
Pin Buffer
Pin Name PDIP/ Description
SSOP QFN Type Type
SOIC

MCLR/VPP/RA5 4 4 1 Master Clear (input) or programming voltage (input).

MCLR I ST Master Clear (Reset) input. This pin is an active-low
Reset to the device.
VPP P — Programming voltage input.
RA5 I ST Digital input.
OSC1/CLKI/RA7 16 18 21 Oscillator crystal or external clock input.
OSC1 I ST Oscillator crystal input or external clock source
input. ST buffer when configured in RC mode,
CMOS otherwise.
CLKI I CMOS External clock source input. Always associated with
pin function OSC1. (See related OSC1/CLKI,
OSC2/CLKO pins.)
RA7 I/O ST General purpose I/O pin.
OSC2/CLKO/RA6 15 17 20 Oscillator crystal or clock output.
OSC2 O — Oscillator crystal output. Connects to crystal or
resonator in Crystal Oscillator mode.
CLKO O — In RC, EC and INTRC modes, OSC2 pin outputs
CLKO, which has 1/4 the frequency of OSC1 and
denotes instruction cycle rate.
RA6 I/O ST General purpose I/O pin.
PORTA is a bidirectional I/O port.
RA0/AN0 1 1 26
RA0 I/O ST Digital I/O.
AN0 I Analog Analog input 0.
RA1/AN1/LVDIN 2 2 27
RA1 I/O ST Digital I/O.
AN1 I Analog Analog input 1.
LVDIN I Analog Low-Voltage Detect input.
RA2/AN2/VREF- 6 7 7
RA2 I/O ST Digital I/O.
AN2 I Analog Analog input 2.
VREF- I Analog A/D reference voltage (low) input.
RA3/AN3/VREF+ 7 8 8
RA3 I/O ST Digital I/O.
AN3 I Analog Analog input 3.
VREF+ I Analog A/D reference voltage (high) input.
RA4/T0CKI 3 3 28
RA4 I/O ST/OD Digital I/O. Open-drain when configured as output.
T0CKI I ST Timer0 external clock input.
RA5 See the MCLR/VPP/RA5 pin.
RA6 See the OSC2/CLKO/RA6 pin.
RA7 See the OSC1/CLKI/RA7 pin.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input
O = Output P = Power
OD = Open-drain (no P diode to VDD)

DS39605F-page 8 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
TABLE 1-2: PIC18F1220/1320 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin Buffer
Pin Name PDIP/ Description
SSOP QFN Type Type
SOIC
PORTB is a bidirectional I/O port. PORTB can be software
programmed for internal weak pull-ups on all inputs.
RB0/AN4/INT0 8 9 9
RB0 I/O TTL Digital I/O.
AN4 I Analog Analog input 4.
INT0 I ST External interrupt 0.
RB1/AN5/TX/CK/INT1 9 10 10
RB1 I/O TTL Digital I/O.
AN5 I Analog Analog input 5.
TX O — EUSART asynchronous transmit.
CK I/O ST EUSART synchronous clock (see related RX/DT).
INT1 I ST External interrupt 1.
RB2/P1B/INT2 17 19 23
RB2 I/O TTL Digital I/O.
P1B O — Enhanced CCP1/PWM output.
INT2 I ST External interrupt 2.
RB3/CCP1/P1A 18 20 24
RB3 I/O TTL Digital I/O.
CCP1 I/O ST Capture 1 input/Compare 1 output/PWM 1 output.
P1A O — Enhanced CCP1/PWM output.
RB4/AN6/RX/DT/KBI0 10 11 12
RB4 I/O TTL Digital I/O.
AN6 I Analog Analog input 6.
RX I ST EUSART asynchronous receive.
DT I/O ST EUSART synchronous data (see related TX/CK).
KBI0 I TTL Interrupt-on-change pin.
RB5/PGM/KBI1 11 12 13
RB5 I/O TTL Digital I/O.
PGM I/O ST Low-Voltage ICSP Programming enable pin.
KBI1 I TTL Interrupt-on-change pin.
RB6/PGC/T1OSO/ 12 13 15
T13CKI/P1C/KBI2
RB6 I/O TTL Digital I/O.
PGC I/O ST In-Circuit Debugger and ICSP programming clock pin.
T1OSO O — Timer1 oscillator output.
T13CKI I ST Timer1/Timer3 external clock output.
P1C O — Enhanced CCP1/PWM output.
KBI2 I TTL Interrupt-on-change pin.
RB7/PGD/T1OSI/ 13 14 16
P1D/KBI3
RB7 I/O TTL Digital I/O.
PGD I/O ST In-Circuit Debugger and ICSP programming data pin.
T1OSI I CMOS Timer1 oscillator input.
P1D O — Enhanced CCP1/PWM output.
KBI3 I TTL Interrupt-on-change pin.
VSS 5 5, 6 3, 5 P — Ground reference for logic and I/O pins.
VDD 14 15, 16 17, 19 P — Positive supply for logic and I/O pins.
NC — — 18 — — No connect.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input
O = Output P = Power
OD = Open-drain (no P diode to VDD)

© 2007 Microchip Technology Inc. DS39605F-page 9

PIC18F1220/1320
NOTES:

DS39605F-page 10 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
2.0 OSCILLATOR FIGURE 2-1: CRYSTAL/CERAMIC
CONFIGURATIONS RESONATOR OPERATION
(XT, LP, HS OR HSPLL
2.1 Oscillator Types CONFIGURATION)

The PIC18F1220 and PIC18F1320 devices can be C1(1) OSC1

operated in ten different oscillator modes. The user can To
program the configuration bits, FOSC3:FOSC0, in Internal
XTAL Logic
Configuration Register 1H to select one of these ten RF(3)
modes:
Sleep
1. LP Low-Power Crystal RS(2)
C2(1) PIC18FXXXX
2. XT Crystal/Resonator OSC2
3. HS High-Speed Crystal/Resonator
4. HSPLL High-Speed Crystal/Resonator Note 1: See Table 2-1 and Table 2-2 for initial
with PLL enabled values of C1 and C2.
5. RC External Resistor/Capacitor with 2: A series resistor (RS) may be required for
FOSC/4 output on RA6 AT strip cut crystals.
6. RCIO External Resistor/Capacitor with 3: RF varies with the oscillator mode chosen.
I/O on RA6
7. INTIO1 Internal Oscillator with FOSC/4
output on RA6 and I/O on RA7 TABLE 2-1: CAPACITOR SELECTION FOR
8. INTIO2 Internal Oscillator with I/O on RA6 CERAMIC RESONATORS
and RA7
9. EC External Clock with FOSC/4 output Typical Capacitor Values Used:
10. ECIO External Clock with I/O on RA6 Mode Freq OSC1 OSC2
XT 455 kHz 56 pF 56 pF
2.2 Crystal Oscillator/Ceramic 2.0 MHz 47 pF 47 pF
Resonators 4.0 MHz 33 pF 33 pF
In XT, LP, HS or HSPLL Oscillator modes, a crystal or HS 8.0 MHz 27 pF 27 pF
ceramic resonator is connected to the OSC1 and 16.0 MHz 22 pF 22 pF
OSC2 pins to establish oscillation. Figure 2-1 shows Capacitor values are for design guidance only.
the pin connections.
These capacitors were tested with the resonators
The oscillator design requires the use of a parallel cut listed below for basic start-up and operation. These
crystal. values are not optimized.
Note: Use of a series cut crystal may give a Different capacitor values may be required to produce
frequency out of the crystal manufacturer’s acceptable oscillator operation. The user should test
specifications. the performance of the oscillator over the expected
VDD and temperature range for the application.
See the notes following Table 2-2 for additional
information.
Resonators Used:
455 kHz 4.0 MHz
2.0 MHz 8.0 MHz
16.0 MHz

© 2007 Microchip Technology Inc. DS39605F-page 11

PIC18F1220/1320
TABLE 2-2: CAPACITOR SELECTION FOR An external clock source may also be connected to the
CRYSTAL OSCILLATOR OSC1 pin in the HS mode, as shown in Figure 2-2.
Typical Capacitor Values
Crystal FIGURE 2-2: EXTERNAL CLOCK INPUT
Osc Type Tested:
Freq OPERATION (HS OSC
C1 C2 CONFIGURATION)
LP 32 kHz 33 pF 33 pF
200 kHz 15 pF 15 pF Clock from OSC1
XT 1 MHz 33 pF 33 pF Ext. System PIC18FXXXX
(HS Mode)
4 MHz 27 pF 27 pF Open OSC2
HS 4 MHz 27 pF 27 pF
8 MHz 22 pF 22 pF
20 MHz 15 pF 15 pF 2.3 HSPLL
Capacitor values are for design guidance only. A Phase Locked Loop (PLL) circuit is provided as an
These capacitors were tested with the crystals listed option for users who wish to use a lower frequency
below for basic start-up and operation. These values crystal oscillator circuit, or to clock the device up to its
are not optimized. highest rated frequency from a crystal oscillator. This
may be useful for customers who are concerned with
Different capacitor values may be required to produce
EMI due to high-frequency crystals.
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected The HSPLL mode makes use of the HS mode oscillator
VDD and temperature range for the application. for frequencies up to 10 MHz. A PLL then multiplies the
oscillator output frequency by 4 to produce an internal
See the notes following this table for additional
clock frequency up to 40 MHz.
information.
The PLL is enabled only when the oscillator configura-
Crystals Used:
tion bits are programmed for HSPLL mode. If
32 kHz 4 MHz programmed for any other mode, the PLL is not
200 kHz 8 MHz enabled.
1 MHz 20 MHz
FIGURE 2-3: PLL BLOCK DIAGRAM

Note 1: Higher capacitance increases the stability HS Oscillator Enable

of oscillator, but also increases the start-up PLL Enable
time. (from Configuration Register 1H)

2: When operating below 3V VDD, or when

using certain ceramic resonators at any OSC2
Phase
voltage, it may be necessary to use the Crystal FIN Comparator
HS mode or switch to a crystal oscillator. OSC1 Osc FOUT
3: Since each resonator/crystal has its own
characteristics, the user should consult Loop
the resonator/crystal manufacturer for Filter
appropriate values of external
components.
4: RS may be required to avoid overdriving ÷4 VCO
SYSCLK
MUX

crystals with low drive level specification.

5: Always verify oscillator performance over
the VDD and temperature range that is
expected for the application.

DS39605F-page 12 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
2.4 External Clock Input 2.5 RC Oscillator
The EC and ECIO Oscillator modes require an external For timing insensitive applications, the “RC” and
clock source to be connected to the OSC1 pin. There is “RCIO” device options offer additional cost savings.
no oscillator start-up time required after a Power-on The RC oscillator frequency is a function of the supply
Reset, or after an exit from Sleep mode. voltage, the resistor (REXT) and capacitor (CEXT) val-
In the EC Oscillator mode, the oscillator frequency ues and the operating temperature. In addition to this,
divided by 4 is available on the OSC2 pin. This signal the oscillator frequency will vary from unit to unit due to
may be used for test purposes, or to synchronize other normal manufacturing variation. Furthermore, the dif-
logic. Figure 2-4 shows the pin connections for the EC ference in lead frame capacitance between package
Oscillator mode. types will also affect the oscillation frequency, espe-
cially for low CEXT values. The user also needs to take
into account variation, due to tolerance of external
FIGURE 2-4: EXTERNAL CLOCK INPUT
R and C components used. Figure 2-6 shows how the
OPERATION R/C combination is connected.
(EC CONFIGURATION)
In the RC Oscillator mode, the oscillator frequency
divided by 4 is available on the OSC2 pin. This signal
Clock from OSC1/CLKI may be used for test purposes, or to synchronize other
Ext. System PIC18FXXXX logic.
FOSC/4 OSC2/CLKO
FIGURE 2-6: RC OSCILLATOR MODE
VDD
The ECIO Oscillator mode functions like the EC mode,
except that the OSC2 pin becomes an additional gen- REXT
eral purpose I/O pin. The I/O pin becomes bit 6 of OSC1 Internal
PORTA (RA6). Figure 2-5 shows the pin connections Clock
for the ECIO Oscillator mode. CEXT
PIC18FXXXX
VSS
FIGURE 2-5: EXTERNAL CLOCK INPUT OSC2/CLKO
OPERATION FOSC/4
(ECIO CONFIGURATION) Recommended values: 3 kΩ ≤ REXT ≤ 100 kΩ
CEXT > 20 pF

Clock from OSC1/CLKI

Ext. System PIC18FXXXX The RCIO Oscillator mode (Figure 2-7) functions like
the RC mode, except that the OSC2 pin becomes an
RA6 I/O (OSC2)
additional general purpose I/O pin. The I/O pin
becomes bit 6 of PORTA (RA6).

FIGURE 2-7: RCIO OSCILLATOR MODE

VDD

REXT
Internal
OSC1
Clock

CEXT
PIC18FXXXX
VSS
RA6 I/O (OSC2)

Recommended values: 3 kΩ ≤ REXT ≤ 100 kΩ

CEXT > 20 pF

© 2007 Microchip Technology Inc. DS39605F-page 13

PIC18F1220/1320
2.6 Internal Oscillator Block 2.6.2 INTRC OUTPUT FREQUENCY
The PIC18F1220/1320 devices include an internal The internal oscillator block is calibrated at the factory
oscillator block, which generates two different clock to produce an INTOSC output frequency of 8.0 MHz
signals; either can be used as the system’s clock (see Table 22-6). This changes the frequency of the
source. This can eliminate the need for external INTRC source from its nominal 31.25 kHz. Peripherals
oscillator circuits on the OSC1 and/or OSC2 pins. and features that depend on the INTRC source will be
affected by this shift in frequency.
The main output (INTOSC) is an 8 MHz clock source,
which can be used to directly drive the system clock. It Once set during factory calibration, the INTRC
also drives a postscaler, which can provide a range of frequency will remain within ±2% as temperature and
clock frequencies from 125 kHz to 4 MHz. The VDD change across their full specified operating
INTOSC output is enabled when a system clock ranges.
frequency from 125 kHz to 8 MHz is selected.
2.6.3 OSCTUNE REGISTER
The other clock source is the internal RC oscillator
(INTRC), which provides a 31 kHz output. The INTRC The internal oscillator’s output has been calibrated at
oscillator is enabled by selecting the internal oscillator the factory, but can be adjusted in the user’s applica-
block as the system clock source, or when any of the tion. This is done by writing to the OSCTUNE register
following are enabled: (Register 2-1). The tuning sensitivity is constant
throughout the tuning range.
• Power-up Timer
When the OSCTUNE register is modified, the INTOSC
• Fail-Safe Clock Monitor
and INTRC frequencies will begin shifting to the new
• Watchdog Timer frequency. The INTRC clock will reach the new
• Two-Speed Start-up frequency within 8 clock cycles (approximately
These features are discussed in greater detail in 8 * 32 μs = 256 μs). The INTOSC clock will stabilize
Section 19.0 “Special Features of the CPU”. within 1 ms. Code execution continues during this shift.
There is no indication that the shift has occurred.
The clock source frequency (INTOSC direct, INTRC Operation of features that depend on the INTRC clock
direct or INTOSC postscaler) is selected by configuring source frequency, such as the WDT, Fail-Safe Clock
the IRCF bits of the OSCCON register (Register 2-2). Monitor and peripherals, will also be affected by the
change in frequency.
2.6.1 INTIO MODES
Using the internal oscillator as the clock source can
eliminate the need for up to two external oscillator pins,
which can then be used for digital I/O. Two distinct
configurations are available:
• In INTIO1 mode, the OSC2 pin outputs FOSC/4,
while OSC1 functions as RA7 for digital input and
output.
• In INTIO2 mode, OSC1 functions as RA7 and
OSC2 functions as RA6, both for digital input and
output.

DS39605F-page 14 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
REGISTER 2-1: OSCTUNE: OSCILLATOR TUNING REGISTER
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — TUN5 TUN4 TUN3 TUN2 TUN1 TUN0
bit 7 bit 0

bit 7-6 Unimplemented: Read as ‘0’

bit 5-0 TUN<5:0>: Frequency Tuning bits
011111 = Maximum frequency
• •
• •
000001
000000 = Center frequency. Oscillator module is running at the calibrated frequency.
111111
• •
• •
100000 = Minimum frequency

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

2.7 Clock Sources and Oscillator PIC18F1220/1320 devices offer only the Timer1
Switching oscillator as a secondary oscillator. This oscillator, in all
power managed modes, is often the time base for
Like previous PIC18 devices, the PIC18F1220/1320 functions such as a real-time clock.
devices include a feature that allows the system clock
Most often, a 32.768 kHz watch crystal is connected
source to be switched from the main oscillator to an
between the RB6/T1OSO and RB7/T1OSI pins. Like
alternate low-frequency clock source. PIC18F1220/
the LP mode oscillator circuit, loading capacitors are
1320 devices offer two alternate clock sources. When
also connected from each pin to ground. These pins
enabled, these give additional options for switching to
are also used during ICSP operations.
the various power managed operating modes.
The Timer1 oscillator is discussed in greater detail in
Essentially, there are three clock sources for these
Section 12.2 “Timer1 Oscillator”.
devices:
In addition to being a primary clock source, the internal
• Primary oscillators
oscillator block is available as a power managed
• Secondary oscillators mode clock source. The INTRC source is also used as
• Internal oscillator block the clock source for several special features, such as
The primary oscillators include the External Crystal the WDT and Fail-Safe Clock Monitor.
and Resonator modes, the External RC modes, the The clock sources for the PIC18F1220/1320 devices
External Clock modes and the internal oscillator block. are shown in Figure 2-8. See Section 12.0 “Timer1
The particular mode is defined on POR by the contents Module” for further details of the Timer1 oscillator. See
of Configuration Register 1H. The details of these Section 19.1 “Configuration Bits” for configuration
modes are covered earlier in this chapter. register details.
The secondary oscillators are those external sources
not connected to the OSC1 or OSC2 pins. These
sources may continue to operate even after the
controller is placed in a power managed mode.

© 2007 Microchip Technology Inc. DS39605F-page 15

PIC18F1220/1320
2.7.1 OSCILLATOR CONTROL REGISTER when the internal oscillator block has stabilized and is
providing the system clock in RC Clock modes or
The OSCCON register (Register 2-2) controls several
during Two-Speed Start-ups. The T1RUN bit
aspects of the system clock’s operation, both in full
(T1CON<6>) indicates when the Timer1 oscillator is
power operation and in power managed modes.
providing the system clock in Secondary Clock modes.
The System Clock Select bits, SCS1:SCS0, select the In power managed modes, only one of these three bits
clock source that is used when the device is operating in will be set at any time. If none of these bits are set, the
power managed modes. The available clock sources are INTRC is providing the system clock, or the internal
the primary clock (defined in Configuration Register 1H), oscillator block has just started and is not yet stable.
the secondary clock (Timer1 oscillator) and the internal
The IDLEN bit controls the selective shutdown of the
oscillator block. The clock selection has no effect until a
controller’s CPU in power managed modes. The uses
SLEEP instruction is executed and the device enters a
of these bits are discussed in more detail in
power managed mode of operation. The SCS bits are
Section 3.0 “Power Managed Modes”.
cleared on all forms of Reset.
The Internal Oscillator Select bits, IRCF2:IRCF0, select Note 1: The Timer1 oscillator must be enabled to
the frequency output of the internal oscillator block that select the secondary clock source. The
is used to drive the system clock. The choices are the Timer1 oscillator is enabled by setting the
INTRC source, the INTOSC source (8 MHz), or one of T1OSCEN bit in the Timer1 Control regis-
the six frequencies derived from the INTOSC ter (T1CON<3>). If the Timer1 oscillator
postscaler (125 kHz to 4 MHz). If the internal oscillator is not enabled, then any attempt to select
block is supplying the system clock, changing the a secondary clock source when
states of these bits will have an immediate change on executing a SLEEP instruction will be
the internal oscillator’s output. ignored.
The OSTS, IOFS and T1RUN bits indicate which clock 2: It is recommended that the Timer1 oscil-
source is currently providing the system clock. The lator be operating and stable before exe-
OSTS indicates that the Oscillator Start-up Timer has cuting the SLEEP instruction or a very
timed out and the primary clock is providing the system long delay may occur while the Timer1
clock in Primary Clock modes. The IOFS bit indicates oscillator starts.

FIGURE 2-8: PIC18F1220/1320 CLOCK DIAGRAM

PIC18F1220/1320 Clock
Primary Oscillator CONFIG1H <3:0> OSCCON<1:0>
Control
OSC2
HSPLL
4 x PLL
Sleep
LP, XT, HS, RC, EC
OSC1
Secondary Oscillator Peripherals
T1OSC
MUX

T1OSO
Clock Source Option
T1OSCEN
Enable for Other Modules
T1OSI Oscillator OSCCON<6:4> Internal Oscillator

OSCCON<6:4> 8 CPU
111
4 MHz
Internal 110
Oscillator 2 MHz IDLEN
101
Block
Postscaler

1 MHz
MUX

100
500 kHz
8 MHz 011
INTRC (INTOSC) 250 kHz
Source 010
125 kHz
001
31 kHz
000
WDT, FSCM

DS39605F-page 16 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
REGISTER 2-2: OSCCON REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R(1) R-0 R/W-0 R/W-0
IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0
bit 7 bit 0

bit 7 IDLEN: Idle Enable bits

1 = Idle mode enabled; CPU core is not clocked in power managed modes
0 = Run mode enabled; CPU core is clocked in Run modes, but not Sleep mode
bit 6-4 IRCF2:IRCF0: Internal Oscillator Frequency Select bits
111 = 8 MHz (8 MHz source drives clock directly)
110 = 4 MHz
101 = 2 MHz
100 = 1 MHz
011 = 500 kHz
010 = 250 kHz
001 = 125 kHz
000 = 31 kHz (INTRC source drives clock directly)
bit 3 OSTS: Oscillator Start-up Time-out Status bit
1 = Oscillator Start-up Timer time-out has expired; primary oscillator is running
0 = Oscillator Start-up Timer time-out is running; primary oscillator is not ready
bit 2 IOFS: INTOSC Frequency Stable bit
1 = INTOSC frequency is stable
0 = INTOSC frequency is not stable
bit 1-0 SCS1:SCS0: System Clock Select bits
1x = Internal oscillator block (RC modes)
01 = Timer1 oscillator (Secondary modes)
00 = Primary oscillator (Sleep and PRI_IDLE modes)
Note 1: Depends on state of the IESO bit in Configuration Register 1H.

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. DS39605F-page 17

PIC18F1220/1320
2.7.2 OSCILLATOR TRANSITIONS If the Sleep mode is selected, all clock sources are
stopped. Since all the transistor switching currents
The PIC18F1220/1320 devices contain circuitry to
have been stopped, Sleep mode achieves the lowest
prevent clocking “glitches” when switching between
current consumption of the device (only leakage
clock sources. A short pause in the system clock
currents).
occurs during the clock switch. The length of this pause
is between 8 and 9 clock periods of the new clock Enabling any on-chip feature that will operate during
source. This ensures that the new clock source is Sleep will increase the current consumed during Sleep.
stable and that its pulse width will not be less than the The INTRC is required to support WDT operation. The
shortest pulse width of the two clock sources. Timer1 oscillator may be operating to support a real-
time clock. Other features may be operating that do not
Clock transitions are discussed in greater detail in
require a system clock source (i.e., INTn pins, A/D
Section 3.1.2 “Entering Power Managed Modes”.
conversions and others).

2.8 Effects of Power Managed Modes

2.9 Power-up Delays
on the Various Clock Sources
Power-up delays are controlled by two timers, so that
When the device executes a SLEEP instruction, the no external Reset circuitry is required for most applica-
system is switched to one of the power managed tions. The delays ensure that the device is kept in
modes, depending on the state of the IDLEN and Reset until the device power supply is stable under nor-
SCS1:SCS0 bits of the OSCCON register. See mal circumstances and the primary clock is operating
Section 3.0 “Power Managed Modes” for details. and stable. For additional information on power-up
When PRI_IDLE mode is selected, the designated pri- delays, see Sections 4.1 through 4.5.
mary oscillator continues to run without interruption. The first timer is the Power-up Timer (PWRT), which
For all other power managed modes, the oscillator provides a fixed delay on power-up (parameter 33,
using the OSC1 pin is disabled. The OSC1 pin (and Table 22-8) if enabled in Configuration Register 2L.
OSC2 pin, if used by the oscillator) will stop oscillating. The second timer is the Oscillator Start-up Timer
In Secondary Clock modes (SEC_RUN and (OST), intended to keep the chip in Reset until the
SEC_IDLE), the Timer1 oscillator is operating and crystal oscillator is stable (LP, XT and HS modes). The
providing the system clock. The Timer1 oscillator may OST does this by counting 1024 oscillator cycles
also run in all power managed modes if required to before allowing the oscillator to clock the device.
clock Timer1 or Timer3. When the HSPLL Oscillator mode is selected, the
In Internal Oscillator modes (RC_RUN and RC_IDLE), device is kept in Reset for an additional 2 ms following
the internal oscillator block provides the system clock the HS mode OST delay, so the PLL can lock to the
source. The INTRC output can be used directly to incoming clock frequency.
provide the system clock and may be enabled to There is a delay of 5 to 10 μs following POR while the
support various special features, regardless of the controller becomes ready to execute instructions. This
power managed mode (see Section 19.2 “Watchdog delay runs concurrently with any other delays. This
Timer (WDT)” through Section 19.4 “Fail-Safe Clock may be the only delay that occurs when any of the EC,
Monitor”). The INTOSC output at 8 MHz may be used RC or INTIO modes are used as the primary clock
directly to clock the system, or may be divided down source.
first. The INTOSC output is disabled if the system clock
is provided directly from the INTRC output.

TABLE 2-3: OSC1 AND OSC2 PIN STATES IN SLEEP MODE

Oscillator Mode OSC1 Pin OSC2 Pin
RC, INTIO1 Floating, external resistor should pull high At logic low (clock/4 output)
RCIO, INTIO2 Floating, external resistor should pull high Configured as PORTA, bit 6
ECIO Floating, pulled by external clock Configured as PORTA, bit 6
EC Floating, pulled by external clock At logic low (clock/4 output)
LP, XT and HS Feedback inverter disabled at quiescent Feedback inverter disabled at quiescent
voltage level voltage level
Note: See Table 4-1 in Section 4.0 “Reset” for time-outs due to Sleep and MCLR Reset.

DS39605F-page 18 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
3.0 POWER MANAGED MODES For PIC18F1220/1320 devices, the power managed
modes are invoked by using the existing SLEEP
The PIC18F1220/1320 devices offer a total of six oper- instruction. All modes exit to PRI_RUN mode when trig-
ating modes for more efficient power management gered by an interrupt, a Reset or a WDT time-out
(see Table 3-1). These provide a variety of options for (PRI_RUN mode is the normal full power execution
selective power conservation in applications where mode; the CPU and peripherals are clocked by the pri-
resources may be limited (i.e., battery powered mary oscillator source). In addition, power managed
devices). Run modes may also exit to Sleep mode, or their
There are three categories of power managed modes: corresponding Idle mode.
• Sleep mode
3.1 Selecting Power Managed Modes
• Idle modes
• Run modes Selecting a power managed mode requires deciding if
the CPU is to be clocked or not and selecting a clock
These categories define which portions of the device
source. The IDLEN bit controls CPU clocking, while the
are clocked and sometimes, what speed. The Run and
SCS1:SCS0 bits select a clock source. The individual
Idle modes may use any of the three available clock
modes, bit settings, clock sources and affected
sources (primary, secondary or INTOSC multiplexer);
modules are summarized in Table 3-1.
the Sleep mode does not use a clock source.
The clock switching feature offered in other PIC18 3.1.1 CLOCK SOURCES
devices (i.e., using the Timer1 oscillator in place of the
The clock source is selected by setting the SCS bits of
primary oscillator) and the Sleep mode offered by all
the OSCCON register (Register 2-2). Three clock
PIC® devices (where all system clocks are stopped) are
sources are available for use in power managed Idle
both offered in the PIC18F1220/1320 devices
modes: the primary clock (as configured in Configuration
(SEC_RUN and Sleep modes, respectively). However,
Register 1H), the secondary clock (Timer1 oscillator)
additional power managed modes are available that
and the internal oscillator block. The secondary and
allow the user greater flexibility in determining what
internal oscillator block sources are available for the
portions of the device are operating. The power man-
power managed modes (PRI_RUN mode is the normal
aged modes are event driven; that is, some specific
full power execution mode; the CPU and peripherals are
event must occur for the device to enter or (more
clocked by the primary oscillator source).
particularly) exit these operating modes.

TABLE 3-1: POWER MANAGED MODES

OSCCON Bits Module Clocking
Mode IDLEN SCS1:SCS0 Available Clock and Oscillator Source
CPU Peripherals
<7> <1:0>
Sleep 0 00 Off Off None – All clocks are disabled
PRI_RUN 0 00 Clocked Clocked Primary – LP, XT, HS, HSPLL, RC, EC, INTRC(1)
This is the normal full power execution mode.
SEC_RUN 0 01 Clocked Clocked Secondary – Timer1 Oscillator
RC_RUN 0 1x Clocked Clocked Internal Oscillator Block(1)
PRI_IDLE 1 00 Off Clocked Primary – LP, XT, HS, HSPLL, RC, EC
SEC_IDLE 1 01 Off Clocked Secondary – Timer1 Oscillator
RC_IDLE 1 1x Off Clocked Internal Oscillator Block(1)
Note 1: Includes INTOSC and INTOSC postscaler, as well as the INTRC source.

© 2007 Microchip Technology Inc. DS39605F-page 19

PIC18F1220/1320
3.1.2 ENTERING POWER MANAGED
Note 1: Caution should be used when modifying a
MODES single IRCF bit. If VDD is less than 3V, it is
In general, entry, exit and switching between power possible to select a higher clock speed
managed clock sources requires clock source than is supported by the low VDD.
switching. In each case, the sequence of events is the Improper device operation may result if
same. the VDD/FOSC specifications are violated.
Any change in the power managed mode begins with 2: Executing a SLEEP instruction does not
loading the OSCCON register and executing a SLEEP necessarily place the device into Sleep
instruction. The SCS1:SCS0 bits select one of three mode; executing a SLEEP instruction is
power managed clock sources; the primary clock (as simply a trigger to place the controller into
defined in Configuration Register 1H), the secondary a power managed mode selected by the
clock (the Timer1 oscillator) and the internal oscillator OSCCON register, one of which is Sleep
block (used in RC modes). Modifying the SCS bits will mode.
have no effect until a SLEEP instruction is executed.
Entry to the power managed mode is triggered by the 3.1.3 MULTIPLE SLEEP COMMANDS
execution of a SLEEP instruction. The power managed mode that is invoked with the
Figure 3-5 shows how the system is clocked while SLEEP instruction is determined by the settings of the
switching from the primary clock to the Timer1 oscilla- IDLEN and SCS bits at the time the instruction is exe-
tor. When the SLEEP instruction is executed, clocks to cuted. If another SLEEP instruction is executed, the
the device are stopped at the beginning of the next device will enter the power managed mode specified by
instruction cycle. Eight clock cycles from the new clock these same bits at that time. If the bits have changed,
source are counted to synchronize with the new clock the device will enter the new power managed mode
source. After eight clock pulses from the new clock specified by the new bit settings.
source are counted, clocks from the new clock source
resume clocking the system. The actual length of the 3.1.4 COMPARISONS BETWEEN RUN
pause is between eight and nine clock periods from the AND IDLE MODES
new clock source. This ensures that the new clock Clock source selection for the Run modes is identical to
source is stable and that its pulse width will not be less the corresponding Idle modes. When a SLEEP instruc-
than the shortest pulse width of the two clock sources. tion is executed, the SCS bits in the OSCCON register
Three bits indicate the current clock source: OSTS and are used to switch to a different clock source. As a
IOFS in the OSCCON register and T1RUN in the result, if there is a change of clock source at the time a
T1CON register. Only one of these bits will be set while SLEEP instruction is executed, a clock switch will occur.
in a power managed mode. When the OSTS bit is set, In Idle modes, the CPU is not clocked and is not run-
the primary clock is providing the system clock. When ning. In Run modes, the CPU is clocked and executing
the IOFS bit is set, the INTOSC output is providing a code. This difference modifies the operation of the
stable 8 MHz clock source and is providing the system WDT when it times out. In Idle modes, a WDT time-out
clock. When the T1RUN bit is set, the Timer1 oscillator results in a wake from power managed modes. In Run
is providing the system clock. If none of these bits are modes, a WDT time-out results in a WDT Reset (see
set, then either the INTRC clock source is clocking the Table 3-2).
system, or the INTOSC source is not yet stable.
During a wake-up from an Idle mode, the CPU starts
If the internal oscillator block is configured as the pri- executing code by entering the corresponding Run
mary clock source in Configuration Register 1H, then mode until the primary clock becomes ready. When the
both the OSTS and IOFS bits may be set when in primary clock becomes ready, the clock source is auto-
PRI_RUN or PRI_IDLE modes. This indicates that the matically switched to the primary clock. The IDLEN and
primary clock (INTOSC output) is generating a stable SCS bits are unchanged during and after the wake-up.
8 MHz output. Entering an RC power managed mode
Figure 3-2 shows how the system is clocked during the
(same frequency) would clear the OSTS bit.
clock source switch. The example assumes the device
was in SEC_IDLE or SEC_RUN mode when a wake is
triggered (the primary clock was configured in HSPLL
mode).

DS39605F-page 20 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
TABLE 3-2: COMPARISON BETWEEN POWER MANAGED MODES
Power Clock during Wake-up
WDT Time-out Peripherals are
Managed CPU is Clocked by ... (while primary becomes
causes a ... Clocked by ...
Mode ready)
Sleep Not clocked (not running) Wake-up Not clocked None or INTOSC multiplexer
if Two-Speed Start-up or
Fail-Safe Clock Monitor are
enabled
Any Idle mode Not clocked (not running) Wake-up Primary, Secondary or Unchanged from Idle mode
INTOSC multiplexer (CPU operates as in
corresponding Run mode)
Any Run mode Primary or secondary Reset Primary or secondary Unchanged from Run mode
clocks or INTOSC clocks or INTOSC
multiplexer multiplexer

3.2 Sleep Mode If the Idle Enable bit, IDLEN (OSCCON<7>), is set to a
‘1’ when a SLEEP instruction is executed, the
The power managed Sleep mode in the PIC18F1220/ peripherals will be clocked from the clock source
1320 devices is identical to that offered in all other PIC selected using the SCS1:SCS0 bits; however, the CPU
microcontrollers. It is entered by clearing the IDLEN will not be clocked. Since the CPU is not executing
and SCS1:SCS0 bits (this is the Reset state) and instructions, the only exits from any of the Idle modes
executing the SLEEP instruction. This shuts down the are by interrupt, WDT time-out or a Reset.
primary oscillator and the OSTS bit is cleared (see
Figure 3-1). When a wake event occurs, CPU execution is delayed
approximately 10 μs while it becomes ready to execute
When a wake event occurs in Sleep mode (by interrupt, code. When the CPU begins executing code, it is
Reset or WDT time-out), the system will not be clocked clocked by the same clock source as was selected in
until the primary clock source becomes ready (see the power managed mode (i.e., when waking from
Figure 3-2), or it will be clocked from the internal RC_IDLE mode, the internal oscillator block will clock
oscillator block if either the Two-Speed Start-up or the the CPU and peripherals until the primary clock source
Fail-Safe Clock Monitor are enabled (see Section 19.0 becomes ready – this is essentially RC_RUN mode).
“Special Features of the CPU”). In either case, the This continues until the primary clock source becomes
OSTS bit is set when the primary clock is providing the ready. When the primary clock becomes ready, the
system clocks. The IDLEN and SCS bits are not OSTS bit is set and the system clock source is
affected by the wake-up. switched to the primary clock (see Figure 3-4). The
IDLEN and SCS bits are not affected by the wake-up.
3.3 Idle Modes While in any Idle mode or the Sleep mode, a WDT
The IDLEN bit allows the microcontroller’s CPU to be time-out will result in a WDT wake-up to full power
selectively shut down while the peripherals continue to operation.
operate. Clearing IDLEN allows the CPU to be clocked.
Setting IDLEN disables clocks to the CPU, effectively
stopping program execution (see Register 2-2). The
peripherals continue to be clocked regardless of the
setting of the IDLEN bit.
There is one exception to how the IDLEN bit functions.
When all the low-power OSCCON bits are cleared
(IDLEN:SCS1:SCS0 = 000), the device enters Sleep
mode upon the execution of the SLEEP instruction. This
is both the Reset state of the OSCCON register and the
setting that selects Sleep mode. This maintains
compatibility with other PIC devices that do not offer
power managed modes.

© 2007 Microchip Technology Inc. DS39605F-page 21

PIC18F1220/1320
FIGURE 3-1: TIMING TRANSITION FOR ENTRY TO SLEEP MODE

Q1 Q2 Q3 Q4 Q1

OSC1

CPU
Clock
Peripheral
Clock

Sleep

Program
Counter PC PC + 2

FIGURE 3-2: TRANSITION TIMING FOR WAKE FROM SLEEP (HSPLL)

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

OSC1
TOST(1) TPLL(1)
PLL Clock
Output

CPU Clock

Peripheral
Clock
Program PC PC + 2 PC + 4 PC + 6 PC + 8
Counter

Wake Event OSTS bit Set

Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.

DS39605F-page 22 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
3.3.1 PRI_IDLE MODE When a wake event occurs, the CPU is clocked from
the primary clock source. A delay of approximately
This mode is unique among the three Low-Power Idle
10 μs is required between the wake event and code
modes, in that it does not disable the primary system
execution starts. This is required to allow the CPU to
clock. For timing sensitive applications, this allows for
become ready to execute instructions. After the wake-
the fastest resumption of device operation with its more
up, the OSTS bit remains set. The IDLEN and SCS bits
accurate primary clock source, since the clock source
are not affected by the wake-up (see Figure 3-4).
does not have to “warm up” or transition from another
oscillator.
PRI_IDLE mode is entered by setting the IDLEN bit,
clearing the SCS bits and executing a SLEEP instruc-
tion. Although the CPU is disabled, the peripherals
continue to be clocked from the primary clock source
specified in Configuration Register 1H. The OSTS bit
remains set in PRI_IDLE mode (see Figure 3-3).

FIGURE 3-3: TRANSITION TIMING TO PRI_IDLE MODE

Q1 Q2 Q3 Q4 Q1

OSC1

CPU Clock

Peripheral
Clock

Program PC PC + 2
Counter

FIGURE 3-4: TRANSITION TIMING FOR WAKE FROM PRI_IDLE MODE

Q1 Q2 Q3 Q4

OSC1

CPU Start-up Delay

CPU Clock

Peripheral
Clock

Program PC PC + 2
Counter

Wake Event

© 2007 Microchip Technology Inc. DS39605F-page 23

PIC18F1220/1320
3.3.2 SEC_IDLE MODE When a wake event occurs, the peripherals continue to
be clocked from the Timer1 oscillator. After a 10 μs
In SEC_IDLE mode, the CPU is disabled, but the
delay following the wake event, the CPU begins exe-
peripherals continue to be clocked from the Timer1
cuting code, being clocked by the Timer1 oscillator. The
oscillator. This mode is entered by setting the Idle bit,
microcontroller operates in SEC_RUN mode until the
modifying bits, SCS1:SCS0 = 01 and executing a
primary clock becomes ready. When the primary clock
SLEEP instruction. When the clock source is switched
becomes ready, a clock switchback to the primary clock
(see Figure 3-5) to the Timer1 oscillator, the primary
occurs (see Figure 3-6). When the clock switch is com-
oscillator is shut down, the OSTS bit is cleared and the
plete, the T1RUN bit is cleared, the OSTS bit is set and
T1RUN bit is set.
the primary clock is providing the system clock. The
Note: The Timer1 oscillator should already be IDLEN and SCS bits are not affected by the wake-up.
running prior to entering SEC_IDLE mode. The Timer1 oscillator continues to run.
If the T1OSCEN bit is not set when the
SLEEP instruction is executed, the SLEEP
instruction will be ignored and entry to
SEC_IDLE mode will not occur. If the
Timer1 oscillator is enabled, but not yet
running, peripheral clocks will be delayed
until the oscillator has started; in such sit-
uations, initial oscillator operation is far
from stable and unpredictable operation
may result.

FIGURE 3-5: TIMING TRANSITION FOR ENTRY TO SEC_IDLE MODE

Q1 Q2 Q3 Q4 Q1

T1OSI 1 2 3 4 5 6 7 8
Clock Transition
OSC1

CPU
Clock
Peripheral
Clock
Program
Counter PC PC + 2

FIGURE 3-6: TIMING TRANSITION FOR WAKE FROM SEC_RUN MODE (HSPLL)
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3

T1OSI
OSC1
TOST(1) TPLL(1)
PLL Clock
Output 1 2 3 4 5 6 7 8
Clock Transition

CPU Clock

Peripheral
Clock

Program PC PC + 2 PC + 4 PC + 6
Counter

Wake from Interrupt Event OSTS bit Set

Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.

DS39605F-page 24 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
3.3.3 RC_IDLE MODE instruction was executed and the INTOSC source was
already stable, the IOFS bit will remain set. If the IRCF
In RC_IDLE mode, the CPU is disabled, but the periph-
bits are all clear, the INTOSC output is not enabled and
erals continue to be clocked from the internal oscillator
the IOFS bit will remain clear; there will be no indication
block using the INTOSC multiplexer. This mode allows
of the current clock source.
for controllable power conservation during Idle periods.
When a wake event occurs, the peripherals continue to
This mode is entered by setting the IDLEN bit, setting
be clocked from the INTOSC multiplexer. After a 10 μs
SCS1 (SCS0 is ignored) and executing a SLEEP
delay following the wake event, the CPU begins exe-
instruction. The INTOSC multiplexer may be used to
cuting code, being clocked by the INTOSC multiplexer.
select a higher clock frequency by modifying the IRCF
The microcontroller operates in RC_RUN mode until
bits before executing the SLEEP instruction. When the
the primary clock becomes ready. When the primary
clock source is switched to the INTOSC multiplexer
clock becomes ready, a clock switchback to the primary
(see Figure 3-7), the primary oscillator is shut down
clock occurs (see Figure 3-8). When the clock switch is
and the OSTS bit is cleared.
complete, the IOFS bit is cleared, the OSTS bit is set
If the IRCF bits are set to a non-zero value (thus, and the primary clock is providing the system clock.
enabling the INTOSC output), the IOFS bit becomes The IDLEN and SCS bits are not affected by the wake-
set after the INTOSC output becomes stable, in about up. The INTRC source will continue to run if either the
1 ms. Clocks to the peripherals continue while the WDT or the Fail-Safe Clock Monitor is enabled.
INTOSC source stabilizes. If the IRCF bits were
previously at a non-zero value before the SLEEP

FIGURE 3-7: TIMING TRANSITION TO RC_IDLE MODE

Q1 Q2 Q3 Q4 Q1

INTRC 1 2 3 4 5 6 7 8
Clock Transition
OSC1

CPU
Clock
Peripheral
Clock
Program
Counter PC PC + 2

FIGURE 3-8: TIMING TRANSITION FOR WAKE FROM RC_RUN MODE (RC_RUN TO PRI_RUN)
Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3

INTOSC
Multiplexer
OSC1
TOST(1) TPLL(1)
PLL Clock
Output 1 2 3 4 5 6 7 8
Clock Transition

CPU Clock

Peripheral
Clock

Program PC PC + 2 PC + 4 PC + 6
Counter

Wake from Interrupt Event OSTS bit Set

Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.

© 2007 Microchip Technology Inc. DS39605F-page 25

PIC18F1220/1320
3.4 Run Modes SEC_RUN mode is entered by clearing the IDLEN bit,
setting SCS1:SCS0 = 01 and executing a SLEEP
If the IDLEN bit is clear when a SLEEP instruction is instruction. The system clock source is switched to the
executed, the CPU and peripherals are both clocked Timer1 oscillator (see Figure 3-9), the primary oscilla-
from the source selected using the SCS1:SCS0 bits. tor is shut down, the T1RUN bit (T1CON<6>) is set and
While these operating modes may not afford the power the OSTS bit is cleared.
conservation of Idle or Sleep modes, they do allow the
device to continue executing instructions by using a Note: The Timer1 oscillator should already be
lower frequency clock source. RC_RUN mode also running prior to entering SEC_RUN mode.
offers the possibility of executing code at a frequency If the T1OSCEN bit is not set when the
greater than the primary clock. SLEEP instruction is executed, the SLEEP
Wake-up from a power managed Run mode can be instruction will be ignored and entry to
triggered by an interrupt, or any Reset, to return to full SEC_RUN mode will not occur. If the
power operation. As the CPU is executing code in Run Timer1 oscillator is enabled, but not yet
modes, several additional exits from Run modes are running, system clocks will be delayed
possible. They include exit to Sleep mode, exit to a cor- until the oscillator has started; in such
responding Idle mode and exit by executing a RESET situations, initial oscillator operation is far
instruction. While the device is in any of the power from stable and unpredictable operation
managed Run modes, a WDT time-out will result in a may result.
WDT Reset. When a wake event occurs, the peripherals and CPU
continue to be clocked from the Timer1 oscillator while
3.4.1 PRI_RUN MODE the primary clock is started. When the primary clock
The PRI_RUN mode is the normal full power execution becomes ready, a clock switchback to the primary clock
mode. If the SLEEP instruction is never executed, the occurs (see Figure 3-6). When the clock switch is com-
microcontroller operates in this mode (a SLEEP instruc- plete, the T1RUN bit is cleared, the OSTS bit is set and
tion is executed to enter all other power managed the primary clock is providing the system clock. The
modes). All other power managed modes exit to IDLEN and SCS bits are not affected by the wake-up.
PRI_RUN mode when an interrupt or WDT time-out The Timer1 oscillator continues to run.
occur. Firmware can force an exit from SEC_RUN mode. By
There is no entry to PRI_RUN mode. The OSTS bit is clearing the T1OSCEN bit (T1CON<3>), an exit from
set. The IOFS bit may be set if the internal oscillator SEC_RUN back to normal full power operation is trig-
block is the primary clock source (see Section 2.7.1 gered. The Timer1 oscillator will continue to run and
“Oscillator Control Register”). provide the system clock, even though the T1OSCEN
bit is cleared. The primary clock is started. When the
3.4.2 SEC_RUN MODE primary clock becomes ready, a clock switchback to the
The SEC_RUN mode is the compatible mode to the primary clock occurs (see Figure 3-6). When the clock
“clock switching” feature offered in other PIC18 switch is complete, the Timer1 oscillator is disabled, the
devices. In this mode, the CPU and peripherals are T1RUN bit is cleared, the OSTS bit is set and the pri-
clocked from the Timer1 oscillator. This gives users the mary clock is providing the system clock. The IDLEN
option of lower power consumption while still using a and SCS bits are not affected by the wake-up.
high accuracy clock source.

FIGURE 3-9: TIMING TRANSITION FOR ENTRY TO SEC_RUN MODE

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3

T1OSI 1 2 3 4 5 6 7 8
Clock Transition
OSC1

CPU
Clock
Peripheral
Clock
Program
Counter PC PC + 2 PC + 2

DS39605F-page 26 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
3.4.3 RC_RUN MODE
Note: Caution should be used when modifying a
In RC_RUN mode, the CPU and peripherals are single IRCF bit. If VDD is less than 3V, it is
clocked from the internal oscillator block using the possible to select a higher clock speed
INTOSC multiplexer and the primary clock is shut than is supported by the low VDD.
down. When using the INTRC source, this mode pro- Improper device operation may result if
vides the best power conservation of all the Run the VDD/FOSC specifications are violated.
modes, while still executing code. It works well for user If the IRCF bits are all clear, the INTOSC output is not
applications which are not highly timing sensitive, or do enabled and the IOFS bit will remain clear; there will be
not require high-speed clocks at all times. no indication of the current clock source. The INTRC
If the primary clock source is the internal oscillator source is providing the system clocks.
block (either of the INTIO1 or INTIO2 oscillators), there If the IRCF bits are changed from all clear (thus,
are no distinguishable differences between PRI_RUN enabling the INTOSC output), the IOFS bit becomes
and RC_RUN modes during execution. However, a set after the INTOSC output becomes stable. Clocks to
clock switch delay will occur during entry to and exit the system continue while the INTOSC source
from RC_RUN mode. Therefore, if the primary clock stabilizes, in approximately 1 ms.
source is the internal oscillator block, the use of
RC_RUN mode is not recommended. If the IRCF bits were previously at a non-zero value
before the SLEEP instruction was executed and the
This mode is entered by clearing the IDLEN bit, setting INTOSC source was already stable, the IOFS bit will
SCS1 (SCS0 is ignored) and executing a SLEEP remain set.
instruction. The IRCF bits may select the clock
frequency before the SLEEP instruction is executed. When a wake event occurs, the system continues to be
When the clock source is switched to the INTOSC clocked from the INTOSC multiplexer while the primary
multiplexer (see Figure 3-10), the primary oscillator is clock is started. When the primary clock becomes
shut down and the OSTS bit is cleared. ready, a clock switch to the primary clock occurs (see
Figure 3-8). When the clock switch is complete, the
The IRCF bits may be modified at any time to immedi- IOFS bit is cleared, the OSTS bit is set and the primary
ately change the system clock speed. Executing a clock is providing the system clock. The IDLEN and
SLEEP instruction is not required to select a new clock SCS bits are not affected by the wake-up. The INTRC
frequency from the INTOSC multiplexer. source will continue to run if either the WDT or the
Fail-Safe Clock Monitor is enabled.

FIGURE 3-10: TIMING TRANSITION TO RC_RUN MODE

Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3

INTRC 1 2 3 4 5 6 7 8
Clock Transition
OSC1

CPU
Clock
Peripheral
Clock
Program
Counter PC PC + 2 PC + 4

© 2007 Microchip Technology Inc. DS39605F-page 27

PIC18F1220/1320
3.4.4 EXIT TO IDLE MODE 3.5 Wake from Power Managed Modes
An exit from a power managed Run mode to its An exit from any of the power managed modes is trig-
corresponding Idle mode is executed by setting the gered by an interrupt, a Reset or a WDT time-out. This
IDLEN bit and executing a SLEEP instruction. The CPU section discusses the triggers that cause exits from
is halted at the beginning of the instruction following the power managed modes. The clocking subsystem
SLEEP instruction. There are no changes to any of the actions are discussed in each of the power managed
clock source status bits (OSTS, IOFS or T1RUN). modes (see Sections 3.2 through 3.4).
While the CPU is halted, the peripherals continue to be
clocked from the previously selected clock source. Note: If application code is timing sensitive, it
should wait for the OSTS bit to become set
3.4.5 EXIT TO SLEEP MODE before continuing. Use the interval during
the low-power exit sequence (before
An exit from a power managed Run mode to Sleep
OSTS is set) to perform timing insensitive
mode is executed by clearing the IDLEN and
“housekeeping” tasks.
SCS1:SCS0 bits and executing a SLEEP instruction.
The code is no different than the method used to invoke Device behavior during Low-Power mode exits is
Sleep mode from the normal operating (full power) summarized in Table 3-3.
mode.
3.5.1 EXIT BY INTERRUPT
The primary clock and internal oscillator block are
disabled. The INTRC will continue to operate if the Any of the available interrupt sources can cause the
WDT is enabled. The Timer1 oscillator will continue to device to exit a power managed mode and resume full
run, if enabled in the T1CON register (Register 12-1). power operation. To enable this functionality, an inter-
All clock source status bits are cleared (OSTS, IOFS rupt source must be enabled by setting its enable bit in
and T1RUN). one of the INTCON or PIE registers. The exit sequence
is initiated when the corresponding interrupt flag bit is
set. On all exits from Low-Power mode by interrupt,
code execution branches to the interrupt vector if the
GIE/GIEH bit (INTCON<7>) is set. Otherwise, code
execution continues or resumes without branching
(see Section 9.0 “Interrupts”).

DS39605F-page 28 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
TABLE 3-3: ACTIVITY AND EXIT DELAY ON WAKE FROM SLEEP MODE OR ANY IDLE MODE
(BY CLOCK SOURCES)
Power Activity during Wake-up from
Clock Ready
Clock in Power Primary System Managed Power Managed Mode
Status Bit
Managed Mode Clock Mode Exit
(OSCCON) Exit by Interrupt Exit by Reset
Delay
LP, XT, HS CPU and peripherals Not clocked or
Primary System OSTS clocked by primary Two-Speed Start-up
HSPLL
Clock (1) 5-10 μs(5) clock and executing (if enabled)(3).
(PRI_IDLE mode) EC, RC, INTRC —
instructions.
INTOSC (2)
IOFS
LP, XT, HS OST CPU and peripherals
OSTS clocked by selected
T1OSC or HSPLL OST + 2 ms
INTRC(1) power managed mode
EC, RC, INTRC(1) 5-10 μs(5) —
clock and executing
(2)
INTOSC 1 ms(4) IOFS instructions until
LP, XT, HS OST primary clock source
OSTS becomes ready.
HSPLL OST + 2 ms
INTOSC(2)
EC, RC, INTRC(1) 5-10 μs(5) —
(2)
INTOSC None IOFS
LP, XT, HS OST Not clocked or
OSTS Two-Speed Start-up (if
HSPLL OST + 2 ms
Sleep mode enabled) until primary
EC, RC, INTRC(1) 5-10 μs(5) —
clock source becomes
INTOSC(2) 1 ms(4) IOFS ready(3).
Note 1: In this instance, refers specifically to the INTRC clock source.
2: Includes both the INTOSC 8 MHz source and postscaler derived frequencies.
3: Two-Speed Start-up is covered in greater detail in Section 19.3 “Two-Speed Start-up”.
4: Execution continues during the INTOSC stabilization period.
5: Required delay when waking from Sleep and all Idle modes. This delay runs concurrently with any other
required delays (see Section 3.3 “Idle Modes”).

© 2007 Microchip Technology Inc. DS39605F-page 29

PIC18F1220/1320
3.5.2 EXIT BY RESET 3.5.4 EXIT WITHOUT AN OSCILLATOR
Normally, the device is held in Reset by the Oscillator START-UP DELAY
Start-up Timer (OST) until the primary clock (defined in Certain exits from power managed modes do not
Configuration Register 1H) becomes ready. At that invoke the OST at all. These are:
time, the OSTS bit is set and the device begins
executing code. • PRI_IDLE mode, where the primary clock source
is not stopped; or
Code execution can begin before the primary clock
becomes ready. If either the Two-Speed Start-up (see • the primary clock source is not any of LP, XT, HS
Section 19.3 “Two-Speed Start-up”) or Fail-Safe or HSPLL modes.
Clock Monitor (see Section 19.4 “Fail-Safe Clock In these cases, the primary clock source either does
Monitor”) are enabled in Configuration Register 1H, not require an oscillator start-up delay, since it is
the device may begin execution as soon as the Reset already running (PRI_IDLE), or normally does not
source has cleared. Execution is clocked by the require an oscillator start-up delay (RC, EC and INTIO
INTOSC multiplexer driven by the internal oscillator Oscillator modes).
block. Since the OSCCON register is cleared following
all Resets, the INTRC clock source is selected. A However, a fixed delay (approximately 10 μs) following
higher speed clock may be selected by modifying the the wake event is required when leaving Sleep and Idle
IRCF bits in the OSCCON register. Execution is modes. This delay is required for the CPU to prepare
clocked by the internal oscillator block until either the for execution. Instruction execution resumes on the first
primary clock becomes ready, or a power managed clock cycle following this delay.
mode is entered before the primary clock becomes
ready; the primary clock is then shut down. 3.6 INTOSC Frequency Drift
3.5.3 EXIT BY WDT TIME-OUT The factory calibrates the internal oscillator block
output (INTOSC) for 8 MHz (see Table 22-6). However,
A WDT time-out will cause different actions, depending
this frequency may drift as VDD or temperature
on which power managed mode the device is in when
changes, which can affect the controller operation in a
the time-out occurs.
variety of ways.
If the device is not executing code (all Idle modes and
It is possible to adjust the INTOSC frequency by
Sleep mode), the time-out will result in a wake from the
modifying the value in the OSCTUNE register
power managed mode (see Sections 3.2 through 3.4).
(Register 2-1). This has the side effect that the INTRC
If the device is executing code (all Run modes), the clock source frequency is also affected. However, the
time-out will result in a WDT Reset (see Section 19.2 features that use the INTRC source often do not require
“Watchdog Timer (WDT)”). an exact frequency. These features include the Fail-Safe
The WDT timer and postscaler are cleared by Clock Monitor, the Watchdog Timer and the RC_RUN/
executing a SLEEP or CLRWDT instruction, the loss of a RC_IDLE modes when the INTRC clock source is
currently selected clock source (if the Fail-Safe Clock selected.
Monitor is enabled) and modifying the IRCF bits in the Being able to adjust the INTOSC requires knowing
OSCCON register if the internal oscillator block is the when an adjustment is required, in which direction it
system clock source. should be made and in some cases, how large a
change is needed. Three examples follow but other
techniques may be used.

DS39605F-page 30 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
3.6.1 EXAMPLE – EUSART 3.6.3 EXAMPLE – CCP IN CAPTURE
An adjustment may be indicated when the EUSART MODE
begins to generate framing errors, or receives data with A CCP module can use free running Timer1 (or
errors while in Asynchronous mode. Framing errors Timer3), clocked by the internal oscillator block and an
indicate that the system clock frequency is too high – external event with a known period (i.e., AC power
try decrementing the value in the OSCTUNE register to frequency). The time of the first event is captured in the
reduce the system clock frequency. Errors in data may CCPRxH:CCPRxL registers and is recorded for use
suggest that the system clock speed is too low – later. When the second event causes a capture, the
increment OSCTUNE. time of the first event is subtracted from the time of the
second event. Since the period of the external event is
3.6.2 EXAMPLE – TIMERS known, the time difference between events can be
This technique compares system clock speed to some calculated.
reference clock. Two timers may be used; one timer is If the measured time is much greater than the
clocked by the peripheral clock, while the other is calculated time, the internal oscillator block is running
clocked by a fixed reference source, such as the too fast – decrement OSCTUNE. If the measured time
Timer1 oscillator. is much less than the calculated time, the internal
Both timers are cleared, but the timer clocked by the oscillator block is running too slow – increment
reference generates interrupts. When an interrupt OSCTUNE.
occurs, the internally clocked timer is read and both
timers are cleared. If the internally clocked timer value
is greater than expected, then the internal oscillator
block is running too fast – decrement OSCTUNE.

© 2007 Microchip Technology Inc. DS39605F-page 31

PIC18F1220/1320
NOTES:

DS39605F-page 32 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
4.0 RESET Most registers are not affected by a WDT wake-up,
since this is viewed as the resumption of normal
The PIC18F1220/1320 devices differentiate between operation. Status bits from the RCON register
various kinds of Reset: (Register 4-1), RI, TO, PD, POR and BOR, are set or
a) Power-on Reset (POR) cleared differently in different Reset situations, as
b) MCLR Reset during normal operation indicated in Table 4-2. These bits are used in software
to determine the nature of the Reset. See Table 4-3 for
c) MCLR Reset during Sleep
a full description of the Reset states of all registers.
d) Watchdog Timer (WDT) Reset (during
execution) A simplified block diagram of the On-Chip Reset Circuit
is shown in Figure 4-1.
e) Programmable Brown-out Reset (BOR)
f) RESET Instruction The Enhanced MCU devices have a MCLR noise filter
in the MCLR Reset path. The filter will detect and
g) Stack Full Reset
ignore small pulses.
h) Stack Underflow Reset
The MCLR pin is not driven low by any internal Resets,
Most registers are unaffected by a Reset. Their status including the WDT.
is unknown on POR and unchanged by all other
Resets. The other registers are forced to a “Reset The MCLR input provided by the MCLR pin can be
state”, depending on the type of Reset that occurred. disabled with the MCLRE bit in Configuration
Register 3H (CONFIG3H<7>).

FIGURE 4-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT

RESET
Instruction

Stack Stack Full/Underflow Reset

Pointer

External Reset

MCLRE
MCLR ( )_IDLE
Sleep

WDT
Time-out

VDD Rise POR Pulse

Detect
VDD
Brown-out
Reset
BOR S

OST/PWRT
OST 1024 Cycles
Chip_Reset
10-bit Ripple Counter R Q
OSC1

32 μs 65.5 ms
PWRT
INTRC(1) 11-bit Ripple Counter

Enable PWRT

Enable OST(2)

Note 1: This is a separate oscillator from the RC oscillator of the CLKI pin.
2: See Table 4-1 for time-out situations.

© 2007 Microchip Technology Inc. DS39605F-page 33

PIC18F1220/1320
4.1 Power-on Reset (POR) 4.3 Oscillator Start-up Timer (OST)
A Power-on Reset pulse is generated on-chip when The Oscillator Start-up Timer (OST) provides a 1024
VDD rise is detected. To take advantage of the POR oscillator cycle (from OSC1 input) delay after the
circuitry, just tie the MCLR pin through a resistor (1k to PWRT delay is over (parameter 33). This ensures that
10 kΩ) to VDD. This will eliminate external RC compo- the crystal oscillator or resonator has started and
nents usually needed to create a Power-on Reset stabilized.
delay. A minimum rise rate for VDD is specified The OST time-out is invoked only for XT, LP, HS and
(parameter D004). For a slow rise time, see Figure 4-2. HSPLL modes and only on Power-on Reset, or on exit
When the device starts normal operation (i.e., exits the from most low-power modes.
Reset condition), device operating parameters (volt-
age, frequency, temperature, etc.) must be met to 4.4 PLL Lock Time-out
ensure operation. If these conditions are not met, the
device must be held in Reset until the operating With the PLL enabled in its PLL mode, the time-out
conditions are met. sequence following a Power-on Reset is slightly
different from other oscillator modes. A portion of the
FIGURE 4-2: EXTERNAL POWER-ON Power-up Timer is used to provide a fixed time-out that
is sufficient for the PLL to lock to the main oscillator fre-
RESET CIRCUIT (FOR
quency. This PLL lock time-out (TPLL) is typically 2 ms
SLOW VDD POWER-UP)
and follows the Oscillator Start-up Time-out.

VDD VDD 4.5 Brown-out Reset (BOR)

D
A configuration bit, BOR, can disable (if clear/
R
programmed), or enable (if set) the Brown-out Reset
R1
MCLR circuitry. If VDD falls below VBOR (parameter D005) for
greater than TBOR (parameter 35), the brown-out situa-
C PIC18FXXXX
tion will reset the chip. A Reset may not occur if VDD
falls below VBOR for less than TBOR. The chip will
remain in Brown-out Reset until VDD rises above VBOR.
If the Power-up Timer is enabled, it will be invoked after
Note 1: External Power-on Reset circuit is required
only if the VDD power-up slope is too slow.
VDD rises above VBOR; it then will keep the chip in
The diode D helps discharge the capacitor Reset for an additional time delay, TPWRT
quickly when VDD powers down. (parameter 33). If VDD drops below VBOR while the
2: R < 40 kΩ is recommended to make sure that
Power-up Timer is running, the chip will go back into a
the voltage drop across R does not violate Brown-out Reset and the Power-up Timer will be initial-
the device’s electrical specification. ized. Once VDD rises above VBOR, the Power-up Timer
3: R1 ≥ 1 kΩ will limit any current flowing into
will execute the additional time delay. Enabling BOR
MCLR from external capacitor C, in the event Reset does not automatically enable the PWRT.
of MCLR/VPP pin breakdown due to Electro-
static Discharge (ESD) or Electrical 4.6 Time-out Sequence
Overstress (EOS).
On power-up, the time-out sequence is as follows:
First, after the POR pulse has cleared, PWRT time-out
4.2 Power-up Timer (PWRT) is invoked (if enabled). Then, the OST is activated. The
total time-out will vary based on oscillator configuration
The Power-up Timer (PWRT) of the PIC18F1220/1320 is and the status of the PWRT. For example, in RC mode
an 11-bit counter, which uses the INTRC source as the with the PWRT disabled, there will be no time-out at all.
clock input. This yields a count of 2048 x 32 μs = 65.6 ms. Figure 4-3, Figure 4-4, Figure 4-5, Figure 4-6 and
While the PWRT is counting, the device is held in Reset. Figure 4-7 depict time-out sequences on power-up.
The power-up time delay will vary from chip-to-chip due Since the time-outs occur from the POR pulse, if MCLR
to VDD, temperature and process variation. See DC is kept low long enough, all time-outs will expire. Bring-
parameter 33 for details. ing MCLR high will begin execution immediately
The PWRT is enabled by clearing configuration bit, (Figure 4-5). This is useful for testing purposes or to
PWRTEN. synchronize more than one PIC18FXXXX device
operating in parallel.
Table 4-2 shows the Reset conditions for some Special
Function Registers, while Table 4-3 shows the Reset
conditions for all the registers.

DS39605F-page 34 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
TABLE 4-1: TIME-OUT IN VARIOUS SITUATIONS

Oscillator Power-up(2) and Brown-out Exit from

Configuration PWRTEN = 0 PWRTEN = 1 Low-Power Mode

(1) (2)
HSPLL 66 ms + 1024 TOSC + 2 ms 1024 TOSC + 2 ms(2) 1024 TOSC + 2 ms(2)
HS, XT, LP 66 ms(1) + 1024 TOSC 1024 TOSC 1024 TOSC
EC, ECIO 66 ms(1) 5-10 μs(3) 5-10 μs(3)
RC, RCIO 66 ms(1) 5-10 μs(3) 5-10 μs(3)
INTIO1, INTIO2 66 ms(1) 5-10 μs(3) 5-10 μs(3)
Note 1: 66 ms (65.5 ms) is the nominal Power-up Timer (PWRT) delay.
2: 2 ms is the nominal time required for the 4x PLL to lock.
3: The program memory bias start-up time is always invoked on POR, wake-up from Sleep, or on any exit
from power managed mode that disables the CPU and instruction execution.

REGISTER 4-1: RCON REGISTER BITS AND POSITIONS

R/W-0 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
IPEN — — RI TO PD POR BOR
bit 7 bit 0
Note: Refer to Section 5.14 “RCON Register” for bit definitions.

TABLE 4-2: STATUS BITS, THEIR SIGNIFICANCE AND THE INITIALIZATION CONDITION FOR
RCON REGISTER
Program RCON
Condition RI TO PD POR BOR STKFUL STKUNF
Counter Register
Power-on Reset 0000h 0--1 1100 1 1 1 0 0 0 0
RESET Instruction 0000h 0--0 uuuu 0 u u u u u u
Brown-out 0000h 0--1 11u- 1 1 1 u 0 u u
MCLR during Power Managed 0000h 0--u 1uuu u 1 u u u u u
Run modes
MCLR during Power Managed 0000h 0--u 10uu u 1 0 u u u u
Idle modes and Sleep
WDT Time-out during Full 0000h 0--u 0uuu u 0 u u u u u
Power or Power Managed Run
MCLR during Full Power u u
Execution
Stack Full Reset (STVR = 1) 0000h 0--u uuuu u u u u u 1 u
Stack Underflow Reset u 1
(STVR = 1)
Stack Underflow Error (not an 0000h u--u uuuu u u u u u u 1
actual Reset, STVR = 0)
WDT Time-out during Power PC + 2 u--u 00uu u 0 0 u u u u
Managed Idle or Sleep
Interrupt Exit from Power PC + 2 u--u u0uu u u 0 u u u u
Managed modes
Legend: u = unchanged, x = unknown, – = unimplemented bit, read as ‘0’
Note 1: When the wake-up is due to an interrupt and the GIEH or GIEL bits are set, the PC is loaded with the
interrupt vector (0x000008h or 0x000018h).

© 2007 Microchip Technology Inc. DS39605F-page 35

PIC18F1220/1320
TABLE 4-3: INITIALIZATION CONDITIONS FOR ALL REGISTERS
MCLR Resets
Applicable Power-on Reset, WDT Reset Wake-up via WDT
Register
Devices Brown-out Reset RESET Instruction or Interrupt
Stack Resets

TOSU 1220 1320 ---0 0000 ---0 0000 ---0 uuuu(3)

TOSH 1220 1320 0000 0000 0000 0000 uuuu uuuu(3)
TOSL 1220 1320 0000 0000 0000 0000 uuuu uuuu(3)
STKPTR 1220 1320 00-0 0000 00-0 0000 uu-u uuuu(3)
PCLATU 1220 1320 ---0 0000 ---0 0000 ---u uuuu
PCLATH 1220 1320 0000 0000 0000 0000 uuuu uuuu
PCL 1220 1320 0000 0000 0000 0000 PC + 2(2)
TBLPTRU 1220 1320 --00 0000 --00 0000 --uu uuuu
TBLPTRH 1220 1320 0000 0000 0000 0000 uuuu uuuu
TBLPTRL 1220 1320 0000 0000 0000 0000 uuuu uuuu
TABLAT 1220 1320 0000 0000 0000 0000 uuuu uuuu
PRODH 1220 1320 xxxx xxxx uuuu uuuu uuuu uuuu
PRODL 1220 1320 xxxx xxxx uuuu uuuu uuuu uuuu
INTCON 1220 1320 0000 000x 0000 000u uuuu uuuu(1)
INTCON2 1220 1320 1111 -1-1 1111 -1-1 uuuu -u-u(1)
INTCON3 1220 1320 11-0 0-00 11-0 0-00 uu-u u-uu(1)
INDF0 1220 1320 N/A N/A N/A
POSTINC0 1220 1320 N/A N/A N/A
POSTDEC0 1220 1320 N/A N/A N/A
PREINC0 1220 1320 N/A N/A N/A
PLUSW0 1220 1320 N/A N/A N/A
FSR0H 1220 1320 ---- 0000 ---- 0000 ---- uuuu
FSR0L 1220 1320 xxxx xxxx uuuu uuuu uuuu uuuu
WREG 1220 1320 xxxx xxxx uuuu uuuu uuuu uuuu
INDF1 1220 1320 N/A N/A N/A
POSTINC1 1220 1320 N/A N/A N/A
POSTDEC1 1220 1320 N/A N/A N/A
PREINC1 1220 1320 N/A N/A N/A
PLUSW1 1220 1320 N/A N/A N/A
FSR1H 1220 1320 ---- 0000 ---- 0000 ---- uuuu
FSR1L 1220 1320 xxxx xxxx uuuu uuuu uuuu uuuu
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.
Shaded cells indicate conditions do not apply for the designated device.
Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).
2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the
interrupt vector (0008h or 0018h).
3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
updated with the current value of the PC. The STKPTR is modified to point to the next location in the
hardware stack.
4: See Table 4-2 for Reset value for specific condition.
5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the Oscillator mode selected. When
not enabled as PORTA pins, they are disabled and read ‘0’.
6: Bit 5 of PORTA is enabled if MCLR is disabled.

DS39605F-page 36 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
TABLE 4-3: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
MCLR Resets
Applicable Power-on Reset, WDT Reset Wake-up via WDT
Register
Devices Brown-out Reset RESET Instruction or Interrupt
Stack Resets
BSR 1220 1320 ---- 0000 ---- 0000 ---- uuuu
INDF2 1220 1320 N/A N/A N/A
POSTINC2 1220 1320 N/A N/A N/A
POSTDEC2 1220 1320 N/A N/A N/A
PREINC2 1220 1320 N/A N/A N/A
PLUSW2 1220 1320 N/A N/A N/A
FSR2H 1220 1320 ---- 0000 ---- 0000 ---- uuuu
FSR2L 1220 1320 xxxx xxxx uuuu uuuu uuuu uuuu
STATUS 1220 1320 ---x xxxx ---u uuuu ---u uuuu
TMR0H 1220 1320 0000 0000 0000 0000 uuuu uuuu
TMR0L 1220 1320 xxxx xxxx uuuu uuuu uuuu uuuu
T0CON 1220 1320 1111 1111 1111 1111 uuuu uuuu
OSCCON 1220 1320 0000 q000 0000 q000 uuuu qquu
LVDCON 1220 1320 --00 0101 --00 0101 --uu uuuu
WDTCON 1220 1320 ---- ---0 ---- ---0 ---- ---u
(4)
RCON 1220 1320 0--1 11q0 0--q qquu u--u qquu
TMR1H 1220 1320 xxxx xxxx uuuu uuuu uuuu uuuu
TMR1L 1220 1320 xxxx xxxx uuuu uuuu uuuu uuuu
T1CON 1220 1320 0000 0000 u0uu uuuu uuuu uuuu
TMR2 1220 1320 0000 0000 0000 0000 uuuu uuuu
PR2 1220 1320 1111 1111 1111 1111 1111 1111
T2CON 1220 1320 -000 0000 -000 0000 -uuu uuuu
ADRESH 1220 1320 xxxx xxxx uuuu uuuu uuuu uuuu
ADRESL 1220 1320 xxxx xxxx uuuu uuuu uuuu uuuu
ADCON0 1220 1320 00-0 0000 00-0 0000 uu-u uuuu
ADCON1 1220 1320 -000 0000 -000 0000 -uuu uuuu
ADCON2 1220 1320 0-00 0000 0-00 0000 u-uu uuuu
CCPR1H 1220 1320 xxxx xxxx uuuu uuuu uuuu uuuu
CCPR1L 1220 1320 xxxx xxxx uuuu uuuu uuuu uuuu
CCP1CON 1220 1320 0000 0000 0000 0000 uuuu uuuu
PWM1CON 1220 1320 0000 0000 0000 0000 uuuu uuuu
ECCPAS 1220 1320 0000 0000 0000 0000 uuuu uuuu
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.
Shaded cells indicate conditions do not apply for the designated device.
Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).
2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the
interrupt vector (0008h or 0018h).
3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
updated with the current value of the PC. The STKPTR is modified to point to the next location in the
hardware stack.
4: See Table 4-2 for Reset value for specific condition.
5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the Oscillator mode selected. When
not enabled as PORTA pins, they are disabled and read ‘0’.
6: Bit 5 of PORTA is enabled if MCLR is disabled.

© 2007 Microchip Technology Inc. DS39605F-page 37

PIC18F1220/1320
TABLE 4-3: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
MCLR Resets
Applicable Power-on Reset, WDT Reset Wake-up via WDT
Register
Devices Brown-out Reset RESET Instruction or Interrupt
Stack Resets
TMR3H 1220 1320 xxxx xxxx uuuu uuuu uuuu uuuu
TMR3L 1220 1320 xxxx xxxx uuuu uuuu uuuu uuuu
T3CON 1220 1320 0-00 0000 u-uu uuuu u-uu uuuu
SPBRGH 1220 1320 0000 0000 0000 0000 uuuu uuuu
SPBRG 1220 1320 0000 0000 0000 0000 uuuu uuuu
RCREG 1220 1320 0000 0000 0000 0000 uuuu uuuu
TXREG 1220 1320 0000 0000 0000 0000 uuuu uuuu
TXSTA 1220 1320 0000 0010 0000 0010 uuuu uuuu
RCSTA 1220 1320 0000 000x 0000 000x uuuu uuuu
BAUDCTL 1220 1320 -1-1 0-00 -1-1 0-00 -u-u u-uu
EEADR 1220 1320 0000 0000 0000 0000 uuuu uuuu
EEDATA 1220 1320 0000 0000 0000 0000 uuuu uuuu
EECON2 1220 1320 0000 0000 0000 0000 0000 0000
EECON1 1220 1320 xx-0 x000 uu-0 u000 uu-0 u000
IPR2 1220 1320 1--1 -11- 1--1 -11- u--u -uu-
PIR2 1220 1320 0--0 -00- 0--0 -00- u--u -uu-(1)
PIE2 1220 1320 0--0 -00- 0--0 -00- u--u -uu-
IPR1 1220 1320 -111 -111 -111 -111 -uuu -uuu
PIR1 1220 1320 -000 -000 -000 -000 -uuu -uuu(1)
PIE1 1220 1320 -000 -000 -000 -000 -uuu -uuu
OSCTUNE 1220 1320 --00 0000 --00 0000 --uu uuuu
TRISB 1220 1320 1111 1111 1111 1111 uuuu uuuu
TRISA(5) 1220 1320 11-1 1111(5) 11-1 1111(5) uu-u uuuu(5)
LATB 1220 1320 xxxx xxxx uuuu uuuu uuuu uuuu
LATA(5) 1220 1320 xx-x xxxx(5) uu-u uuuu(5) uu-u uuuu(5)
PORTB 1220 1320 xxxx xxxx uuuu uuuu uuuu uuuu
PORTA(5,6) 1220 1320 xx0x 0000(5,6) uu0u 0000(5,6) uuuu uuuu(5,6)
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.
Shaded cells indicate conditions do not apply for the designated device.
Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).
2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the
interrupt vector (0008h or 0018h).
3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
updated with the current value of the PC. The STKPTR is modified to point to the next location in the
hardware stack.
4: See Table 4-2 for Reset value for specific condition.
5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the Oscillator mode selected. When
not enabled as PORTA pins, they are disabled and read ‘0’.
6: Bit 5 of PORTA is enabled if MCLR is disabled.

DS39605F-page 38 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 4-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD, VDD RISE < TPWRT)

VDD

MCLR

INTERNAL POR

TPWRT

PWRT TIME-OUT TOST

OST TIME-OUT

INTERNAL RESET

FIGURE 4-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1

VDD

MCLR

INTERNAL POR
TPWRT

PWRT TIME-OUT TOST

OST TIME-OUT

INTERNAL RESET

FIGURE 4-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2

VDD

MCLR

INTERNAL POR
TPWRT

PWRT TIME-OUT TOST

OST TIME-OUT

INTERNAL RESET

© 2007 Microchip Technology Inc. DS39605F-page 39

PIC18F1220/1320
FIGURE 4-6: SLOW RISE TIME (MCLR TIED TO VDD, VDD RISE > TPWRT)
5V
VDD 0V 1V

MCLR

INTERNAL POR

TPWRT

PWRT TIME-OUT
TOST

OST TIME-OUT

INTERNAL RESET

FIGURE 4-7: TIME-OUT SEQUENCE ON POR W/PLL ENABLED (MCLR TIED TO VDD)

VDD

MCLR

INTERNAL POR
TPWRT

PWRT TIME-OUT TOST

OST TIME-OUT TPLL

PLL TIME-OUT

INTERNAL RESET

Note: TOST = 1024 clock cycles.

TPLL ≈ 2 ms max. First three stages of the PWRT timer.

DS39605F-page 40 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
5.0 MEMORY ORGANIZATION 5.1 Program Memory Organization
There are three memory types in Enhanced MCU A 21-bit program counter is capable of addressing the
devices. These memory types are: 2-Mbyte program memory space. Accessing a location
between the physically implemented memory and the
• Program Memory
2-Mbyte address will cause a read of all ‘0’s (a NOP
• Data RAM instruction).
• Data EEPROM
The PIC18F1220 has 4 Kbytes of Flash memory and
Data and program memory use separate busses, can store up to 2,048 single-word instructions.
which allows for concurrent access of these types.
The PIC18F1320 has 8 Kbytes of Flash memory and
Additional detailed information for Flash program mem- can store up to 4,096 single-word instructions.
ory and data EEPROM is provided in Section 6.0
The Reset vector address is at 0000h and the interrupt
“Flash Program Memory” and Section 7.0 “Data
vector addresses are at 0008h and 0018h.
EEPROM Memory”, respectively.
The program memory maps for the PIC18F1220 and
PIC18F1320 devices are shown in Figure 5-1 and
Figure 5-2, respectively.

FIGURE 5-1: PROGRAM MEMORY MAP FIGURE 5-2: PROGRAM MEMORY MAP
AND STACK FOR AND STACK FOR
PIC18F1220 PIC18F1320

PC<20:0> PC<20:0>
CALL,RCALL,RETURN 21 CALL,RCALL,RETURN 21
RETFIE,RETLW RETFIE,RETLW
Stack Level 1 Stack Level 1
• •
• •
• •

Stack Level 31 Stack Level 31

Reset Vector 0000h Reset Vector 0000h

High Priority Interrupt Vector 0008h High Priority Interrupt Vector 0008h

Low Priority Interrupt Vector 0018h Low Priority Interrupt Vector 0018h

On-Chip
Program Memory On-Chip
0FFFh
Program Memory
1000h

1FFFh

User Memory Space

User Memory Space

2000h

Read ‘0’ Read ‘0’

1FFFFFh 1FFFFFh
200000h 200000h

© 2007 Microchip Technology Inc. DS39605F-page 41

PIC18F1220/1320
5.2 Return Address Stack 5.2.2 RETURN STACK POINTER
(STKPTR)
The return address stack allows any combination of up
to 31 program calls and interrupts to occur. The PC The STKPTR register (Register 5-1) contains the stack
(Program Counter) is pushed onto the stack when a pointer value, the STKFUL (Stack Full) status bit and
CALL or RCALL instruction is executed, or an interrupt the STKUNF (Stack Underflow) status bits. The value
is Acknowledged. The PC value is pulled off the stack of the Stack Pointer can be 0 through 31. The Stack
on a RETURN, RETLW or a RETFIE instruction. PCLATU Pointer increments before values are pushed onto the
and PCLATH are not affected by any of the RETURN or stack and decrements after values are popped off the
CALL instructions. stack. At Reset, the Stack Pointer value will be zero.
The user may read and write the Stack Pointer value.
The stack operates as a 31-word by 21-bit RAM and a
This feature can be used by a Real-Time Operating
5-bit stack pointer, with the Stack Pointer initialized to
System for return stack maintenance.
00000B after all Resets. There is no RAM associated
with Stack Pointer, 00000B. This is only a Reset value. After the PC is pushed onto the stack 31 times (without
During a CALL type instruction, causing a push onto the popping any values off the stack), the STKFUL bit is
stack, the Stack Pointer is first incremented and the set. The STKFUL bit is cleared by software or by a
RAM location pointed to by the Stack Pointer POR.
(STKPTR) register is written with the contents of the PC The action that takes place when the stack becomes
(already pointing to the instruction following the CALL). full depends on the state of the STVR (Stack Overflow
During a RETURN type instruction, causing a pop from Reset Enable) configuration bit. (Refer to Section 19.1
the stack, the contents of the RAM location pointed to “Configuration Bits” for a description of the device
by the STKPTR are transferred to the PC and then the configuration bits.) If STVR is set (default), the 31st
Stack Pointer is decremented. push will push the (PC + 2) value onto the stack, set the
The stack space is not part of either program or data STKFUL bit and reset the device. The STKFUL bit will
space. The Stack Pointer is readable and writable and remain set and the Stack Pointer will be set to zero.
the address on the top of the stack is readable and If STVR is cleared, the STKFUL bit will be set on the
writable through the top-of-stack Special File 31st push and the Stack Pointer will increment to 31.
Registers. Data can also be pushed to or popped from Any additional pushes will not overwrite the 31st push
the stack using the top-of-stack SFRs. Status bits and STKPTR will remain at 31.
indicate if the stack is full, has overflowed or
When the stack has been popped enough times to
underflowed.
unload the stack, the next pop will return a value of zero
5.2.1 TOP-OF-STACK ACCESS to the PC and sets the STKUNF bit, while the Stack
Pointer remains at zero. The STKUNF bit will remain
The top of the stack is readable and writable. Three set until cleared by software or a POR occurs.
register locations, TOSU, TOSH and TOSL, hold the
contents of the stack location pointed to by the Note: Returning a value of zero to the PC on an
STKPTR register (Figure 5-3). This allows users to underflow has the effect of vectoring the
implement a software stack if necessary. After a CALL, program to the Reset vector, where the
RCALL or interrupt, the software can read the pushed stack conditions can be verified and
value by reading the TOSU, TOSH and TOSL registers. appropriate actions can be taken. This is
These values can be placed on a user defined software not the same as a Reset, as the contents
stack. At return time, the software can replace the of the SFRs are not affected.
TOSU, TOSH and TOSL and do a return.
The user must disable the global interrupt enable bits
while accessing the stack to prevent inadvertent stack
corruption.

FIGURE 5-3: RETURN ADDRESS STACK AND ASSOCIATED REGISTERS

Return Address Stack
11111
11110
11101
TOSU TOSH TOSL STKPTR<4:0>
00h 1Ah 34h 00010
00011
Top-of-Stack 001A34h 00010
000D58h 00001
00000

DS39605F-page 42 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
REGISTER 5-1: STKPTR REGISTER
R/C-0 R/C-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
STKFUL STKUNF — SP4 SP3 SP2 SP1 SP0
bit 7 bit 0

bit 7(1) STKFUL: Stack Full Flag bit

1 = Stack became full or overflowed
0 = Stack has not become full or overflowed
bit 6(1) STKUNF: Stack Underflow Flag bit
1 = Stack underflow occurred
0 = Stack underflow did not occur
bit 5 Unimplemented: Read as ‘0’
bit 4-0 SP4:SP0: Stack Pointer Location bits
Note 1: Bit 7 and bit 6 are cleared by user software or by a POR.

Legend:
R = Readable bit W = Writable bit U = Unimplemented C = Clearable only bit
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

5.2.3 PUSH AND POP INSTRUCTIONS 5.2.4 STACK FULL/UNDERFLOW RESETS

Since the Top-of-Stack (TOS) is readable and writable, These Resets are enabled by programming the STVR
the ability to push values onto the stack and pull values bit in Configuration Register 4L. When the STVR bit is
off the stack, without disturbing normal program execu- cleared, a full or underflow condition will set the appro-
tion, is a desirable option. To push the current PC value priate STKFUL or STKUNF bit, but not cause a device
onto the stack, a PUSH instruction can be executed. Reset. When the STVR bit is set, a full or underflow
This will increment the Stack Pointer and load the cur- condition will set the appropriate STKFUL or STKUNF
rent PC value onto the stack. TOSU, TOSH and TOSL bit and then cause a device Reset. The STKFUL or
can then be modified to place data or a return address STKUNF bits are cleared by the user software or a
on the stack. Power-on Reset.
The ability to pull the TOS value off of the stack and
replace it with the value that was previously pushed
onto the stack, without disturbing normal execution, is
achieved by using the POP instruction. The POP instruc-
tion discards the current TOS by decrementing the
Stack Pointer. The previous value pushed onto the
stack then becomes the TOS value.

© 2007 Microchip Technology Inc. DS39605F-page 43

PIC18F1220/1320
5.3 Fast Register Stack 5.4 PCL, PCLATH and PCLATU
A “fast return” option is available for interrupts. A fast The Program Counter (PC) specifies the address of the
register stack is provided for the Status, WREG and instruction to fetch for execution. The PC is 21-bits
BSR registers and is only one in depth. The stack is not wide. The low byte, known as the PCL register, is both
readable or writable and is loaded with the current readable and writable. The high byte, or PCH register,
value of the corresponding register when the processor contains the PC<15:8> bits and is not directly readable
vectors for an interrupt. The values in the registers are or writable. Updates to the PCH register may be per-
then loaded back into the working registers, if the formed through the PCLATH register. The upper byte is
RETFIE, FAST instruction is used to return from the called PCU. This register contains the PC<20:16> bits
interrupt. and is not directly readable or writable. Updates to the
All interrupt sources will push values into the stack PCU register may be performed through the PCLATU
registers. If both low and high priority interrupts are register.
enabled, the stack registers cannot be used reliably to The contents of PCLATH and PCLATU will be
return from low priority interrupts. If a high priority inter- transferred to the program counter by any operation
rupt occurs while servicing a low priority interrupt, the that writes PCL. Similarly, the upper two bytes of the
stack register values stored by the low priority interrupt program counter will be transferred to PCLATH and
will be overwritten. Users must save the key registers PCLATU by an operation that reads PCL. This is useful
in software during a low priority interrupt. for computed offsets to the PC (see Section 5.8.1
If interrupt priority is not used, all interrupts may use the “Computed GOTO”).
fast register stack for returns from interrupt. The PC addresses bytes in the program memory. To
If no interrupts are used, the fast register stack can be prevent the PC from becoming misaligned with word
used to restore the Status, WREG and BSR registers at instructions, the LSB of PCL is fixed to a value of ‘0’.
the end of a subroutine call. To use the fast register The PC increments by 2 to address sequential
stack for a subroutine call, a CALL LABEL, FAST instructions in the program memory.
instruction must be executed to save the Status, The CALL, RCALL, GOTO and program branch instruc-
WREG and BSR registers to the fast register stack. A tions write to the program counter directly. For these
RETURN, FAST instruction is then executed to restore instructions, the contents of PCLATH and PCLATU are
these registers from the fast register stack. not transferred to the program counter.
Example 5-1 shows a source code example that uses
the fast register stack during a subroutine call and
return.

EXAMPLE 5-1: FAST REGISTER STACK

CODE EXAMPLE
CALL SUB1, FAST ;STATUS, WREG, BSR
;SAVED IN FAST REGISTER
;STACK
•
•

SUB1 •
•
RETURN, FAST ;RESTORE VALUES SAVED
;IN FAST REGISTER STACK

DS39605F-page 44 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
5.5 Clocking Scheme/Instruction 5.6 Instruction Flow/Pipelining
Cycle An “Instruction Cycle” consists of four Q cycles (Q1,
The clock input (from OSC1) is internally divided by Q2, Q3 and Q4). The instruction fetch and execute are
four to generate four non-overlapping quadrature pipelined such that fetch takes one instruction cycle,
clocks, namely Q1, Q2, Q3 and Q4. Internally, the while decode and execute takes another instruction
Program Counter (PC) is incremented every Q1, the cycle. However, due to the pipelining, each instruction
instruction is fetched from the program memory and effectively executes in one cycle. If an instruction
latched into the instruction register in Q4. The instruc- causes the program counter to change (e.g., GOTO),
tion is decoded and executed during the following Q1 then two cycles are required to complete the instruction
through Q4. The clocks and instruction execution flow (Example 5-2).
are shown in Figure 5-4. A fetch cycle begins with the Program Counter (PC)
incrementing in Q1.
In the execution cycle, the fetched instruction is latched
into the “Instruction Register” (IR) in cycle Q1. This
instruction is then decoded and executed during the
Q2, Q3 and Q4 cycles. Data memory is read during Q2
(operand read) and written during Q4 (destination
write).

FIGURE 5-4: CLOCK/INSTRUCTION CYCLE

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
Q1
Q2 Internal
Phase
Q3 Clock
Q4
PC PC PC + 2 PC + 4
OSC2/CLKO
(RC Mode)
Execute INST (PC – 2)
Fetch INST (PC) Execute INST (PC)
Fetch INST (PC + 2) Execute INST (PC + 2)
Fetch INST (PC + 4)

EXAMPLE 5-2: INSTRUCTION PIPELINE FLOW

TCY0 TCY1 TCY2 TCY3 TCY4 TCY5

1. MOVLW 55h Fetch 1 Execute 1
2. MOVWF PORTB Fetch 2 Execute 2
3. BRA SUB_1 Fetch 3 Execute 3
4. BSF PORTA, BIT3 (Forced NOP) Fetch 4 Flush (NOP)
5. Instruction @ address SUB_1 Fetch SUB_1 Execute SUB_1

All instructions are single cycle, except for any program branches. These take two cycles, since the fetch instruction
is “flushed” from the pipeline, while the new instruction is being fetched and then executed.

© 2007 Microchip Technology Inc. DS39605F-page 45

PIC18F1220/1320
5.7 Instructions in Program Memory The CALL and GOTO instructions have the absolute
program memory address embedded into the instruc-
The program memory is addressed in bytes. Instruc- tion. Since instructions are always stored on word
tions are stored as two bytes or four bytes in program boundaries, the data contained in the instruction is a
memory. The Least Significant Byte of an instruction word address. The word address is written to
word is always stored in a program memory location PC<20:1>, which accesses the desired byte address in
with an even address (LSB = 0). Figure 5-5 shows an program memory. Instruction #2 in Figure 5-5 shows
example of how instruction words are stored in the pro- how the instruction ‘GOTO 000006h’ is encoded in the
gram memory. To maintain alignment with instruction program memory. Program branch instructions, which
boundaries, the PC increments in steps of 2 and the encode a relative address offset, operate in the same
LSB will always read ‘0’ (see Section 5.4 “PCL, manner. The offset value stored in a branch instruction
PCLATH and PCLATU”). represents the number of single-word instructions that
the PC will be offset by. Section 20.0 “Instruction Set
Summary” provides further details of the instruction
set.

FIGURE 5-5: INSTRUCTIONS IN PROGRAM MEMORY

Word Address
LSB = 1 LSB = 0 ↓
Program Memory 000000h
Byte Locations → 000002h
000004h
000006h
Instruction 1: MOVLW 055h 0Fh 55h 000008h
Instruction 2: GOTO 000006h EFh 03h 00000Ah
F0h 00h 00000Ch
Instruction 3: MOVFF 123h, 456h C1h 23h 00000Eh
F4h 56h 000010h
000012h
000014h

5.7.1 TWO-WORD INSTRUCTIONS instruction is executed by itself (first word was skipped),
it will execute as a NOP. This action is necessary when
PIC18F1220/1320 devices have four two-word
the two-word instruction is preceded by a conditional
instructions: MOVFF, CALL, GOTO and LFSR. The second
instruction that results in a skip operation. A program
word of these instructions has the 4 MSBs set to ‘1’s and
example that demonstrates this concept is shown in
is decoded as a NOP instruction. The lower 12 bits of the
Example 5-3. Refer to Section 20.0 “Instruction Set
second word contain data to be used by the instruction.
Summary” for further details of the instruction set.
If the first word of the instruction is executed, the data in
the second word is accessed. If the second word of the

EXAMPLE 5-3: TWO-WORD INSTRUCTIONS

CASE 1:
Object Code Source Code
0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0?
1100 0001 0010 0011 MOVFF REG1, REG2 ; No, skip this word
1111 0100 0101 0110 ; Execute this word as a NOP
0010 0100 0000 0000 ADDWF REG3 ; continue code

CASE 2:
Object Code Source Code
0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0?
1100 0001 0010 0011 MOVFF REG1, REG2 ; Yes, execute this word
1111 0100 0101 0110 ; 2nd word of instruction
0010 0100 0000 0000 ADDWF REG3 ; continue code

DS39605F-page 46 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
5.8 Look-up Tables 5.9 Data Memory Organization
Look-up tables are implemented two ways: The data memory is implemented as static RAM. Each
• Computed GOTO register in the data memory has a 12-bit address,
allowing up to 4096 bytes of data memory. Figure 5-6
• Table Reads
shows the data memory organization for the
PIC18F1220/1320 devices.
5.8.1 COMPUTED GOTO
The data memory map is divided into as many as
A computed GOTO is accomplished by adding an offset
16 banks that contain 256 bytes each. The lower 4 bits
to the program counter (see Example 5-4).
of the Bank Select Register (BSR<3:0>) select which
A look-up table can be formed with an ADDWF PCL bank will be accessed. The upper 4 bits for the BSR are
instruction and a group of RETLW 0xnn instructions. not implemented.
WREG is loaded with an offset into the table before
The data memory contains Special Function Registers
executing a call to that table. The first instruction of the
(SFR) and General Purpose Registers (GPR). The
called routine is the ADDWF PCL instruction. The next
SFRs are used for control and status of the controller
instruction executed will be one of the RETLW 0xnn
and peripheral functions, while GPRs are used for data
instructions, that returns the value 0xnn to the calling
storage and scratch pad operations in the user’s appli-
function.
cation. The SFRs start at the last location of Bank 15
The offset value (in WREG) specifies the number of (FFFh) and extend towards F80h. Any remaining space
bytes that the program counter should advance and beyond the SFRs in the Bank may be implemented as
should be multiples of 2 (LSB = 0). GPRs. GPRs start at the first location of Bank 0 and
In this method, only one data byte may be stored in grow upwards. Any read of an unimplemented location
each instruction location and room on the return will read as ‘0’s.
address stack is required. The entire data memory may be accessed directly or
indirectly. Direct addressing may require the use of the
EXAMPLE 5-4: COMPUTED GOTO USING BSR register. Indirect addressing requires the use of a
AN OFFSET VALUE File Select Register (FSRn) and a corresponding Indi-
MOVFW OFFSET
rect File Operand (INDFn). Each FSR holds a 12-bit
CALL TABLE address value that can be used to access any location
ORG 0xnn00 in the Data Memory map without banking. See
TABLE ADDWF PCL Section 5.12 “Indirect Addressing, INDF and FSR
RETLW 0xnn Registers” for indirect addressing details.
RETLW 0xnn
The instruction set and architecture allow operations
RETLW 0xnn
.
across all banks. This may be accomplished by indirect
. addressing or by the use of the MOVFF instruction. The
. MOVFF instruction is a two-word/two-cycle instruction
that moves a value from one register to another.
5.8.2 TABLE READS/TABLE WRITES To ensure that commonly used registers (SFRs and
select GPRs) can be accessed in a single cycle,
A better method of storing data in program memory regardless of the current BSR values, an Access Bank
allows two bytes of data to be stored in each instruction is implemented. A segment of Bank 0 and a segment of
location. Bank 15 comprise the Access RAM. Section 5.10
Look-up table data may be stored two bytes per pro- “Access Bank” provides a detailed description of the
gram word by using table reads and writes. The Table Access RAM.
Pointer (TBLPTR) register specifies the byte address
and the Table Latch (TABLAT) register contains the 5.9.1 GENERAL PURPOSE
data that is read from or written to program memory. REGISTER FILE
Data is transferred to/from program memory, one byte Enhanced MCU devices may have banked memory in
at a time. the GPR area. GPRs are not initialized by a Power-on
The table read/table write operation is discussed Reset and are unchanged on all other Resets.
further in Section 6.1 “Table Reads and Table Data RAM is available for use as GPR registers by all
Writes”. instructions. The second half of Bank 15 (F80h to
FFFh) contains SFRs. All other banks of data memory
contain GPRs, starting with Bank 0.

© 2007 Microchip Technology Inc. DS39605F-page 47

PIC18F1220/1320
FIGURE 5-6: DATA MEMORY MAP FOR PIC18F1220/1320 DEVICES

BSR<3:0> Data Memory Map

00h 000h
= 0000 Access RAM 07Fh
Bank 0 080h
FFh GPR
0FFh

Access Bank
00h
Access RAM Low
7Fh
= 0001 Access RAM High 80h
Bank 1 Unused
to (SFRs)
= 1110 Read ‘00h’ FFh
Bank 14

When a = 0,
The BSR is ignored and the
Access Bank is used.
The first 128 bytes are
General Purpose RAM
EFFh
F00h (from Bank 0).
00h Unused
= 1111 F7Fh
Bank 15 The second 128 bytes are
SFR F80h
FFh FFFh Special Function Registers
(from Bank 15).

When a = 1,
The BSR specifies the Bank
used by the instruction.

DS39605F-page 48 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
5.9.2 SPECIAL FUNCTION REGISTERS The SFRs can be classified into two sets: those asso-
ciated with the “core” function and those related to the
The Special Function Registers (SFRs) are registers
peripheral functions. Those registers related to the
used by the CPU and peripheral modules for controlling
“core” are described in this section, while those related
the desired operation of the device. These registers are
to the operation of the peripheral features are
implemented as static RAM. A list of these registers is
described in the section of that peripheral feature.
given in Table 5-1 and Table 5-2.
The SFRs are typically distributed among the peripherals
whose functions they control.
The unused SFR locations will be unimplemented and
read as ‘0’s.

TABLE 5-1: SPECIAL FUNCTION REGISTER MAP FOR PIC18F1220/1320 DEVICES

Address Name Address Name Address Name Address Name
FFFh TOSU FDFh INDF2(2) FBFh CCPR1H F9Fh IPR1
FFEh TOSH FDEh POSTINC2(2) FBEh CCPR1L F9Eh PIR1
(2)
FFDh TOSL FDDh POSTDEC2 FBDh CCP1CON F9Dh PIE1
FFCh STKPTR FDCh PREINC2(2) FBCh — F9Ch —
FFBh PCLATU FDBh PLUSW2(2) FBBh — F9Bh OSCTUNE
FFAh PCLATH FDAh FSR2H FBAh — F9Ah —
FF9h PCL FD9h FSR2L FB9h — F99h —
FF8h TBLPTRU FD8h STATUS FB8h — F98h —
FF7h TBLPTRH FD7h TMR0H FB7h PWM1CON F97h —
FF6h TBLPTRL FD6h TMR0L FB6h ECCPAS F96h —
FF5h TABLAT FD5h T0CON FB5h — F95h —
FF4h PRODH FD4h — FB4h — F94h —
FF3h PRODL FD3h OSCCON FB3h TMR3H F93h TRISB
FF2h INTCON FD2h LVDCON FB2h TMR3L F92h TRISA
FF1h INTCON2 FD1h WDTCON FB1h T3CON F91h —
FF0h INTCON3 FD0h RCON FB0h SPBRGH F90h —
(2)
FEFh INDF0 FCFh TMR1H FAFh SPBRG F8Fh —
FEEh POSTINC0(2) FCEh TMR1L FAEh RCREG F8Eh —
FEDh POSTDEC0(2) FCDh T1CON FADh TXREG F8Dh —
FECh PREINC0(2) FCCh TMR2 FACh TXSTA F8Ch —
FEBh PLUSW0(2) FCBh PR2 FABh RCSTA F8Bh —
FEAh FSR0H FCAh T2CON FAAh BAUDCTL F8Ah LATB
FE9h FSR0L FC9h — FA9h EEADR F89h LATA
FE8h WREG FC8h — FA8h EEDATA F88h —
(2)
FE7h INDF1 FC7h — FA7h EECON2 F87h —
FE6h POSTINC1(2) FC6h — FA6h EECON1 F86h —
(2)
FE5h POSTDEC1 FC5h — FA5h — F85h —
FE4h PREINC1(2) FC4h ADRESH FA4h — F84h —
FE3h PLUSW1(2) FC3h ADRESL FA3h — F83h —
FE2h FSR1H FC2h ADCON0 FA2h IPR2 F82h —
FE1h FSR1L FC1h ADCON1 FA1h PIR2 F81h PORTB
FE0h BSR FC0h ADCON2 FA0h PIE2 F80h PORTA

Note 1: Unimplemented registers are read as ‘0’.

2: This is not a physical register.

© 2007 Microchip Technology Inc. DS39605F-page 49

PIC18F1220/1320
TABLE 5-2: REGISTER FILE SUMMARY (PIC18F1220/1320)
Value on Details on
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
POR, BOR page:

TOSU — — — Top-of-Stack Upper Byte (TOS<20:16>) ---0 0000 36, 42

TOSH Top-of-Stack High Byte (TOS<15:8>) 0000 0000 36, 42
TOSL Top-of-Stack Low Byte (TOS<7:0>) 0000 0000 36, 42
STKPTR STKFUL STKUNF — Return Stack Pointer 00-0 0000 36, 43
PCLATU — — bit 21(3) Holding Register for PC<20:16> ---0 0000 36, 44
PCLATH Holding Register for PC<15:8> 0000 0000 36, 44
PCL PC Low Byte (PC<7:0>) 0000 0000 36, 44
TBLPTRU — — bit 21 Program Memory Table Pointer Upper Byte (TBLPTR<20:16>) --00 0000 36, 60
TBLPTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>) 0000 0000 36, 60
TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR<7:0>) 0000 0000 36, 60
TABLAT Program Memory Table Latch 0000 0000 36, 60
PRODH Product Register High Byte xxxx xxxx 36, 71
PRODL Product Register Low Byte xxxx xxxx 36, 71
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 36, 75
INTCON2 RBPU INTEDG0 INTEDG1 INTEDG2 — TMR0IP — RBIP 1111 -1-1 36, 76
INTCON3 INT2IP INT1IP — INT2IE INT1IE — INT2IF INT1IF 11-0 0-00 36, 77
INDF0 Uses contents of FSR0 to address data memory – value of FSR0 not changed (not a physical register) N/A 36, 53
POSTINC0 Uses contents of FSR0 to address data memory – value of FSR0 post-incremented (not a physical register) N/A 36, 53
POSTDEC0 Uses contents of FSR0 to address data memory– value of FSR0 post-decremented (not a physical register) N/A 36, 53
PREINC0 Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register) N/A 36, 53
PLUSW0 Uses contents of FSR0 to address data memory – value of FSR0 offset by W (not a physical register) N/A 36, 53
FSR0H — — — — Indirect Data Memory Address Pointer 0 High ---- 0000 36, 53
FSR0L Indirect Data Memory Address Pointer 0 Low Byte xxxx xxxx 36, 53
WREG Working Register xxxx xxxx 36
INDF1 Uses contents of FSR1 to address data memory – value of FSR1 not changed (not a physical register) N/A 36, 53
POSTINC1 Uses contents of FSR1 to address data memory – value of FSR1 post-incremented (not a physical register) N/A 36, 53
POSTDEC1 Uses contents of FSR1 to address data memory – value of FSR1 post-decremented (not a physical register) N/A 36, 53
PREINC1 Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) N/A 36, 53
PLUSW1 Uses contents of FSR1 to address data memory – value of FSR1 offset by W (not a physical register) N/A 36, 53
FSR1H — — — — Indirect Data Memory Address Pointer 1 High ---- 0000 36, 53
FSR1L Indirect Data Memory Address Pointer 1 Low Byte xxxx xxxx 36, 53
BSR — — — — Bank Select Register ---- 0000 37, 52
INDF2 Uses contents of FSR2 to address data memory – value of FSR2 not changed (not a physical register) N/A 37, 53
POSTINC2 Uses contents of FSR2 to address data memory – value of FSR2 post-incremented (not a physical register) N/A 37, 53
POSTDEC2 Uses contents of FSR2 to address data memory – value of FSR2 post-decremented (not a physical register) N/A 37, 53
PREINC2 Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) N/A 37, 53
PLUSW2 Uses contents of FSR2 to address data memory – value of FSR2 offset by W (not a physical register) N/A 37, 53
FSR2H — — — — Indirect Data Memory Address Pointer 2 High ---- 0000 37, 53
FSR2L Indirect Data Memory Address Pointer 2 Low Byte xxxx xxxx 37, 53
STATUS — — — N OV Z DC C ---x xxxx 37, 55
TMR0H Timer0 Register High Byte 0000 0000 37, 101
TMR0L Timer0 Register Low Byte xxxx xxxx 37, 101
T0CON TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0 1111 1111 37, 99
OSCCON IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0 0000 q000 37, 17
LVDCON — — IVRST LVDEN LVDL3 LVDL2 LVDL1 LVDL0 --00 0101 37, 167
WDTCON — — — — — — — SWDTEN --- ---0 37, 180
RCON IPEN — — RI TO PD POR BOR 0--1 11q0 35, 56, 84
Legend: x = unknown, u = unchanged, – = unimplemented, q = value depends on condition
Note 1: RA6 and associated bits are configured as port pins in RCIO, ECIO and INTIO2 (with port function on RA6) Oscillator mode only and read ‘0’
in all other oscillator modes.
2: RA7 and associated bits are configured as port pins in INTIO2 Oscillator mode only and read ‘0’ in all other modes.
3: Bit 21 of the PC is only available in Test mode and Serial Programming modes.
4: The RA5 port bit is only available when MCLRE fuse (CONFIG3H<7>) is programmed to ‘0’. Otherwise, RA5 reads ‘0’. This bit is read-only.

DS39605F-page 50 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
TABLE 5-2: REGISTER FILE SUMMARY (PIC18F1220/1320) (CONTINUED)
Value on Details on
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
POR, BOR page:

TMR1H Timer1 Register High Byte xxxx xxxx 37, 108

TMR1L Timer1 Register Low Byte xxxx xxxx 37, 108
T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 37, 103
TMR2 Timer2 Register 0000 0000 37, 109
PR2 Timer2 Period Register 1111 1111 37, 109
T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 37, 109
ADRESH A/D Result Register High Byte xxxx xxxx 37, 164
ADRESL A/D Result Register Low Byte xxxx xxxx 37, 164
ADCON0 VCFG1 VCFG0 — CHS2 CHS1 CHS0 GO/DONE ADON 00-0 0000 37, 155
ADCON1 — PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 -000 0000 37, 156
ADCON2 ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 0-00 0000 37, 157
CCPR1H Capture/Compare/PWM Register 1 High Byte xxxx xxxx 37. 116
CCPR1L Capture/Compare/PWM Register 1 Low Byte xxxx xxxx 37, 116
CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 37, 115
PWM1CON PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 0000 0000 37, 126
ECCPAS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 0000 0000 37, 127
TMR3H Timer3 Register High Byte xxxx xxxx 38, 113
TMR3L Timer3 Register Low Byte xxxx xxxx 38, 113
T3CON RD16 — T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 0-00 0000 38, 111
SPBRGH EUSART Baud Rate Generator High Byte 0000 0000 38
SPBRG EUSART Baud Rate Generator Low Byte 0000 0000 38, 135
RCREG EUSART Receive Register 0000 0000 38, 143,
142
TXREG EUSART Transmit Register 0000 0000 38, 140,
142
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 38, 132
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 38, 133
BAUDCTL — RCIDL — SCKP BRG16 — WUE ABDEN -1-1 0-00 38
EEADR EEPROM Address Register 0000 0000 38, 67
EEDATA EEPROM Data Register 0000 0000 38, 70
EECON2 EEPROM Control Register 2 (not a physical register) 0000 0000 38, 58, 67
EECON1 EEPGD CFGS — FREE WRERR WREN WR RD xx-0 x000 38, 59, 68
IPR2 OSCFIP — — EEIP — LVDIP TMR3IP — 1--1 -11- 38, 83
PIR2 OSCFIF — — EEIF — LVDIF TMR3IF — 0--0 -00- 38, 79
PIE2 OSCFIE — — EEIE — LVDIE TMR3IE — 0--0 -00- 38, 81
IPR1 — ADIP RCIP TXIP — CCP1IP TMR2IP TMR1IP -111 -111 38, 82
PIR1 — ADIF RCIF TXIF — CCP1IF TMR2IF TMR1IF -000 -000 38, 78
PIE1 — ADIE RCIE TXIE — CCP1IE TMR2IE TMR1IE -000 -000 38, 80
OSCTUNE — — TUN5 TUN4 TUN3 TUN2 TUN1 TUN0 --00 0000 38, 15
TRISB Data Direction Control Register for PORTB 1111 1111 38, 98
TRISA TRISA7(2) TRISA6(1) — Data Direction Control Register for PORTA 11-1 1111 38, 89
LATB Read/Write PORTB Data Latch xxxx xxxx 38, 98
LATA LATA<7>(2) LATA<6>(1) — Read/Write PORTA Data Latch xx-x xxxx 38, 89
PORTB Read PORTB pins, Write PORTB Data Latch xxxx xxxx 38, 98
PORTA RA7(2) RA6(1) RA5(4) Read PORTA pins, Write PORTA Data Latch xx0x 0000 38, 89
Legend: x = unknown, u = unchanged, – = unimplemented, q = value depends on condition
Note 1: RA6 and associated bits are configured as port pins in RCIO, ECIO and INTIO2 (with port function on RA6) Oscillator mode only and read ‘0’
in all other oscillator modes.
2: RA7 and associated bits are configured as port pins in INTIO2 Oscillator mode only and read ‘0’ in all other modes.
3: Bit 21 of the PC is only available in Test mode and Serial Programming modes.
4: The RA5 port bit is only available when MCLRE fuse (CONFIG3H<7>) is programmed to ‘0’. Otherwise, RA5 reads ‘0’. This bit is read-only.

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PIC18F1220/1320
5.10 Access Bank 5.11 Bank Select Register (BSR)
The Access Bank is an architectural enhancement The need for a large general purpose memory space
which is very useful for C compiler code optimization. dictates a RAM banking scheme. The data memory is
The techniques used by the C compiler may also be partitioned into as many as sixteen banks. When using
useful for programs written in assembly. direct addressing, the BSR should be configured for the
This data memory region can be used for: desired bank.

• Intermediate computational values BSR<3:0> holds the upper 4 bits of the 12-bit RAM
address. The BSR<7:4> bits will always read ‘0’s and
• Local variables of subroutines
writes will have no effect (see Figure 5-7).
• Faster context saving/switching of variables
A MOVLB instruction has been provided in the instruction
• Common variables
set to assist in selecting banks.
• Faster evaluation/control of SFRs (no banking)
If the currently selected bank is not implemented, any
The Access Bank is comprised of the last 128 bytes in read will return all ‘0’s and all writes are ignored. The
Bank 15 (SFRs) and the first 128 bytes in Bank 0. Status register bits will be set/cleared as appropriate for
These two sections will be referred to as Access RAM the instruction performed.
High and Access RAM Low, respectively. Figure 5-6
indicates the Access RAM areas. Each Bank extends up to FFh (256 bytes). All data
memory is implemented as static RAM.
A bit in the instruction word specifies if the operation is
to occur in the bank specified by the BSR register or in A MOVFF instruction ignores the BSR, since the 12-bit
the Access Bank. This bit is denoted as the ‘a’ bit (for addresses are embedded into the instruction word.
access bit). Section 5.12 “Indirect Addressing, INDF and FSR
When forced in the Access Bank (a = 0), the last Registers” provides a description of indirect address-
address in Access RAM Low is followed by the first ing, which allows linear addressing of the entire RAM
address in Access RAM High. Access RAM High maps space.
the Special Function Registers, so these registers can
be accessed without any software overhead. This is
useful for testing status flags and modifying control bits.

FIGURE 5-7: DIRECT ADDRESSING

Direct Addressing
BSR<7:4> BSR<3:0> 7 From Opcode(3) 0
0 0 0 0

Bank Select(2) Location Select(3)

00h 01h 0Eh 0Fh

000h 100h E00h F00h

Data
Memory(1)

0FFh 1FFh EFFh FFFh

Bank 0 Bank 1 Bank 14 Bank 15

Note 1: For register file map detail, see Table 5-1.

2: The access bit of the instruction can be used to force an override of the selected bank (BSR<3:0>) to the registers
of the Access Bank.
3: The MOVFF instruction embeds the entire 12-bit address in the instruction.

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 PIC18F1220/1320
5.12 Indirect Addressing, INDF and If INDF0, INDF1 or INDF2 are read indirectly via an
FSR Registers FSR, all ‘0’s are read (zero bit is set). Similarly, if
INDF0, INDF1 or INDF2 are written to indirectly, the
Indirect addressing is a mode of addressing data mem- operation will be equivalent to a NOP instruction and the
ory, where the data memory address in the instruction Status bits are not affected.
is not fixed. An FSR register is used as a pointer to the
data memory location that is to be read or written. Since 5.12.1 INDIRECT ADDRESSING
this pointer is in RAM, the contents can be modified by OPERATION
the program. This can be useful for data tables in the
Each FSR register has an INDF register associated with
data memory and for software stacks. Figure 5-8
it, plus four additional register addresses. Performing an
shows how the fetched instruction is modified prior to
operation using one of these five registers determines
being executed.
how the FSR will be modified during indirect addressing.
Indirect addressing is possible by using one of the
When data access is performed using one of the five
INDF registers. Any instruction, using the INDF regis-
INDFn locations, the address selected will configure
ter, actually accesses the register pointed to by the File
the FSRn register to:
Select Register, FSR. Reading the INDF register itself,
indirectly (FSR = 0), will read 00h. Writing to the INDF • Do nothing to FSRn after an indirect access (no
register indirectly, results in a no operation (NOP). The change) – INDFn
FSR register contains a 12-bit address, which is shown • Auto-decrement FSRn after an indirect access
in Figure 5-9. (post-decrement) – POSTDECn
The INDFn register is not a physical register. Address- • Auto-increment FSRn after an indirect access
ing INDFn actually addresses the register whose (post-increment) – POSTINCn
address is contained in the FSRn register (FSRn is a • Auto-increment FSRn before an indirect access
pointer). This is indirect addressing. (pre-increment) – PREINCn
Example 5-5 shows a simple use of indirect addressing • Use the value in the WREG register as an offset
to clear the RAM in Bank 1 (locations 100h-1FFh) in a to FSRn. Do not modify the value of the WREG or
minimum number of instructions. the FSRn register after an indirect access (no
change) – PLUSWn
EXAMPLE 5-5: HOW TO CLEAR RAM When using the auto-increment or auto-decrement
(BANK 1) USING features, the effect on the FSR is not reflected in the
INDIRECT ADDRESSING Status register. For example, if the indirect address
causes the FSR to equal ‘0’, the Z bit will not be set.
LFSR FSR0,0x100 ;
NEXT CLRF POSTINC0 ; Clear INDF Auto-incrementing or auto-decrementing an FSR affects
; register then all 12 bits. That is, when FSRnL overflows from an
; inc pointer increment, FSRnH will be incremented automatically.
BTFSS FSR0H, 1 ; All done with
; Bank1? Adding these features allows the FSRn to be used as a
GOTO NEXT ; NO, clear next stack pointer, in addition to its uses for table operations
CONTINUE ; YES, continue in data memory.
Each FSR has an address associated with it that
There are three indirect addressing registers. To performs an indexed indirect access. When a data
address the entire data memory space (4096 bytes), access to this INDFn location (PLUSWn) occurs, the
these registers are 12-bit wide. To store the 12 bits of FSRn is configured to add the signed value in the
addressing information, two 8-bit registers are required: WREG register and the value in FSR to form the
1. FSR0: composed of FSR0H:FSR0L address before an indirect access. The FSR value is
2. FSR1: composed of FSR1H:FSR1L not changed. The WREG offset range is -128 to +127.
3. FSR2: composed of FSR2H:FSR2L If an FSR register contains a value that points to one of
the INDFn, an indirect read will read 00h (zero bit is
In addition, there are registers INDF0, INDF1 and
set), while an indirect write will be equivalent to a NOP
INDF2, which are not physically implemented. Reading
(Status bits are not affected).
or writing to these registers activates indirect address-
ing, with the value in the corresponding FSR register If an indirect addressing write is performed when the tar-
being the address of the data. If an instruction writes a get address is an FSRnH or FSRnL register, the data is
value to INDF0, the value will be written to the address written to the FSR register, but no pre- or post-increment/
pointed to by FSR0H:FSR0L. A read from INDF1 reads decrement is performed.
the data from the address pointed to by
FSR1H:FSR1L. INDFn can be used in code anywhere
an operand can be used.

© 2007 Microchip Technology Inc. DS39605F-page 53

PIC18F1220/1320
FIGURE 5-8: INDIRECT ADDRESSING OPERATION

0h
RAM

Instruction
Executed
Opcode Address
FFFh

12

File Address = Access of an Indirect Addressing Register

BSR<3:0> 12 12
Instruction
4 8
Fetched
Opcode File FSR

FIGURE 5-9: INDIRECT ADDRESSING

Indirect Addressing
FSRnH:FSRnL
3 0 7 0

11 0

Location Select

0000h

Data
Memory(1)

0FFFh

Note 1: For register file map detail, see Table 5-1.

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 PIC18F1220/1320
5.13 Status Register It is recommended that only BCF, BSF, SWAPF, MOVFF
and MOVWF instructions are used to alter the Status reg-
The Status register, shown in Register 5-2, contains the ister, because these instructions do not affect the Z, C,
arithmetic status of the ALU. As with any other SFR, it DC, OV or N bits in the Status register.
can be the operand for any instruction.
For other instructions that do not affect Status bits, see
If the Status register is the destination for an instruction the instruction set summaries in Table 20-1.
that affects the Z, DC, C, OV or N bits, the results of the
instruction are not written; instead, the status is Note: The C and DC bits operate as the borrow
updated according to the instruction performed. There- and digit borrow bits, respectively, in
fore, the result of an instruction with the Status register subtraction.
as its destination may be different than intended. As an
example, CLRF STATUS will set the Z bit and leave the
remaining Status bits unchanged (‘000u u1uu’).

REGISTER 5-2: STATUS REGISTER

U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x
— — — N OV Z DC C
bit 7 bit 0

bit 7-5 Unimplemented: Read as ‘0’

bit 4 N: Negative bit
This bit is used for signed arithmetic (2’s complement). It indicates whether the result was
negative (ALU MSB = 1).
1 = Result was negative
0 = Result was positive
bit 3 OV: Overflow bit
This bit is used for signed arithmetic (2’s complement). It indicates an overflow of the
7-bit magnitude, which causes the sign bit (bit 7) to change state.
1 = Overflow occurred for signed arithmetic (in this arithmetic operation)
0 = No overflow occurred
bit 2 Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1 DC: Digit carry/borrow bit
For ADDWF, ADDLW, SUBLW and SUBWF instructions:
1 = A carry-out from the 4th low-order bit of the result occurred
0 = No carry-out from the 4th low-order bit of the result
Note: For borrow, the polarity is reversed. A subtraction is executed by adding the
2’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit
is loaded with either the bit 4 or bit 3 of the source register.
bit 0 C: Carry/borrow bit
For ADDWF, ADDLW, SUBLW and SUBWF instructions:
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note: For borrow, the polarity is reversed. A subtraction is executed by adding the
2’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit
is loaded with either the high or low-order bit of the source register.

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. DS39605F-page 55

PIC18F1220/1320
5.14 RCON Register Note 1: If the BOR configuration bit is set (Brown-
The Reset Control (RCON) register contains flag bits out Reset enabled), the BOR bit is ‘1’ on
that allow differentiation between the sources of a a Power-on Reset. After a Brown-out
device Reset. These flags include the TO, PD, POR, Reset has occurred, the BOR bit will be
BOR and RI bits. This register is readable and writable. cleared and must be set by firmware to
indicate the occurrence of the next
Brown-out Reset.
2: It is recommended that the POR bit be set
after a Power-on Reset has been
detected, so that subsequent Power-on
Resets may be detected.

REGISTER 5-3: RCON REGISTER

R/W-0 U-0 U-0 R/W-1 R-1 R-1 R/W-0 R/W-0
IPEN — — RI TO PD POR BOR
bit 7 bit 0

bit 7 IPEN: Interrupt Priority Enable bit

1 = Enable priority levels on interrupts
0 = Disable priority levels on interrupts (PIC16CXXX Compatibility mode)
bit 6-5 Unimplemented: Read as ‘0’
bit 4 RI: RESET Instruction Flag bit
1 = The RESET instruction was not executed (set by firmware only)
0 = The RESET instruction was executed causing a device Reset
(must be set in software after a Brown-out Reset occurs)
bit 3 TO: Watchdog Time-out Flag bit
1 = Set by power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT time-out occurred
bit 2 PD: Power-down Detection Flag bit
1 = Set by power-up or by the CLRWDT instruction
0 = Cleared by execution of the SLEEP instruction
bit 1 POR: Power-on Reset Status bit
1 = A Power-on Reset has not occurred (set by firmware only)
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0 BOR: Brown-out Reset Status bit
1 = A Brown-out Reset has not occurred (set by firmware only)
0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

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 PIC18F1220/1320
6.0 FLASH PROGRAM MEMORY The program memory space is 16 bits wide, while the
data RAM space is 8 bits wide. Table reads and table
The Flash program memory is readable, writable and writes move data between these two memory spaces
erasable during normal operation over the entire VDD through an 8-bit register (TABLAT).
range.
Table read operations retrieve data from program
A read from program memory is executed on one byte memory and place it into TABLAT in the data RAM
at a time. A write to program memory is executed on space. Figure 6-1 shows the operation of a table read
blocks of 8 bytes at a time. Program memory is erased with program memory and data RAM.
in blocks of 64 bytes at a time. A “Bulk Erase” operation
Table write operations store data from TABLAT in the
may not be issued from user code.
data memory space into holding registers in program
While writing or erasing program memory, instruction memory. The procedure to write the contents of the
fetches cease until the operation is complete. The holding registers into program memory is detailed in
program memory cannot be accessed during the write Section 6.5 “Writing to Flash Program Memory”.
or erase, therefore, code cannot execute. An internal Figure 6-2 shows the operation of a table write with
programming timer terminates program memory writes program memory and data RAM.
and erases.
Table operations work with byte entities. A table block
A value written to program memory does not need to be containing data, rather than program instructions, is not
a valid instruction. Executing a program memory required to be word aligned. Therefore, a table block
location that forms an invalid instruction results in a can start and end at any byte address. If a table write is
NOP. being used to write executable code into program
memory, program instructions will need to be word
6.1 Table Reads and Table Writes aligned (TBLPTRL<0> = 0).
In order to read and write program memory, there are The EEPROM on-chip timer controls the write and
two operations that allow the processor to move bytes erase times. The write and erase voltages are gener-
between the program memory space and the data ated by an on-chip charge pump rated to operate over
RAM: the voltage range of the device for byte or word
operations.
• Table Read (TBLRD)
• Table Write (TBLWT)

FIGURE 6-1: TABLE READ OPERATION

Instruction: TBLRD*

Program Memory
Table Pointer(1)
Table Latch (8-bit)
TBLPTRU TBLPTRH TBLPTRL
TABLAT

Program Memory
(TBLPTR)

Note 1: Table Pointer points to a byte in program memory.

© 2007 Microchip Technology Inc. DS39605F-page 57

PIC18F1220/1320
FIGURE 6-2: TABLE WRITE OPERATION
Instruction: TBLWT*

Program Memory
Holding Registers
Table Pointer(1) Table Latch (8-bit)
TBLPTRU TBLPTRH TBLPTRL TABLAT

Program Memory
(TBLPTR)

Note 1: Table Pointer actually points to one of eight holding registers, the address of which is determined by
TBLPTRL<2:0>. The process for physically writing data to the program memory array is discussed
in Section 6.5 “Writing to Flash Program Memory”.

6.2 Control Registers The WREN bit enables and disables erase and write
operations. When set, erase and write operations are
Several control registers are used in conjunction with allowed. When clear, erase and write operations are
the TBLRD and TBLWT instructions. These include the: disabled – the WR bit cannot be set while the WREN bit
• EECON1 register is clear. This process helps to prevent accidental writes
• EECON2 register to memory due to errant (unexpected) code execution.
• TABLAT register Firmware should keep the WREN bit clear at all times,
• TBLPTR registers except when starting erase or write operations. Once
firmware has set the WR bit, the WREN bit may be
6.2.1 EECON1 AND EECON2 REGISTERS cleared. Clearing the WREN bit will not affect the
operation in progress.
EECON1 is the control register for memory accesses.
The WRERR bit is set when a write operation is
EECON2 is not a physical register. Reading EECON2
interrupted by a Reset. In these situations, the user can
will read all ‘0’s. The EECON2 register is used
check the WRERR bit and rewrite the location. It will be
exclusively in the memory write and erase sequences.
necessary to reload the data and address registers
Control bit, EEPGD, determines if the access will be to (EEDATA and EEADR) as these registers have cleared
program or data EEPROM memory. When clear, as a result of the Reset.
operations will access the data EEPROM memory.
Control bits, RD and WR, start read and erase/write
When set, program memory is accessed.
operations, respectively. These bits are set by firmware
Control bit, CFGS, determines if the access will be to and cleared by hardware at the completion of the
the configuration registers, or to program memory/data operation.
EEPROM memory. When set, subsequent operations
The RD bit cannot be set when accessing program
access configuration registers. When CFGS is clear,
memory (EEPGD = 1). Program memory is read using
the EEPGD bit selects either program Flash or data
table read instructions. See Section 6.3 “Reading the
EEPROM memory.
Flash Program Memory” regarding table reads.
The FREE bit controls program memory erase opera-
tions. When the FREE bit is set, the erase operation is Note: Interrupt flag bit, EEIF in the PIR2 register,
initiated on the next WR command. When FREE is is set when the write is complete. It must
clear, only writes are enabled. be cleared in software.

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 PIC18F1220/1320
REGISTER 6-1: EECON1 REGISTER
R/W-x R/W-x U-0 R/W-0 R/W-x R/W-0 R/S-0 R/S-0
EEPGD CFGS — FREE WRERR WREN WR RD
bit 7 bit 0

bit 7 EEPGD: Flash Program or Data EEPROM Memory Select bit

1 = Access program Flash memory
0 = Access data EEPROM memory
bit 6 CFGS: Flash Program/Data EE or Configuration Select bit
1 = Access configuration registers
0 = Access program Flash or data EEPROM memory
bit 5 Unimplemented: Read as ‘0’
bit 4 FREE: Flash Row Erase Enable bit
1 = Erase the program memory row addressed by TBLPTR on the next WR command
(cleared by completion of erase operation – TBLPTR<5:0> are ignored)
0 = Perform write only
bit 3 WRERR: EEPROM Error Flag bit
1 = A write operation was prematurely terminated (any Reset during self-timed programming)
0 = The write operation completed normally
Note: When a WRERR occurs, the EEPGD and CFGS bits are not cleared. This allows
tracing of the error condition.
bit 2 WREN: Write Enable bit
1 = Allows erase or write cycles
0 = Inhibits erase or write cycles
bit 1 WR: Write Control bit
1 = Initiates a data EEPROM erase/write cycle or a program memory erase cycle or write cycle.
(The operation is self-timed and the bit is cleared by hardware once write is complete. The
WR bit can only be set (not cleared) in software.)
0 = Write cycle completed
bit 0 RD: Read Control bit
1 = Initiates a memory read
(Read takes one cycle. RD is cleared in hardware. The RD bit can only be set (not cleared)
in software. RD bit cannot be set when EEPGD = 1.)
0 = Read completed

Legend:
R = Readable bit S = Settable only U = Unimplemented bit, read as ‘0’
W = Writable bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared
x = Bit is unknown

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PIC18F1220/1320
6.2.2 TABLAT – TABLE LATCH REGISTER 6.2.4 TABLE POINTER BOUNDARIES
The Table Latch (TABLAT) is an 8-bit register mapped TBLPTR is used in reads, writes and erases of the
into the SFR space. The table latch is used to hold 8-bit Flash program memory.
data during data transfers between program memory When a TBLRD is executed, all 22 bits of the Table
and data RAM. Pointer determine which byte is read from program or
configuration memory into TABLAT.
6.2.3 TBLPTR – TABLE POINTER
REGISTER When a TBLWT is executed, the three LSbs of the Table
Pointer (TBLPTR<2:0>) determine which of the eight
The Table Pointer (TBLPTR) addresses a byte within program memory holding registers is written to. When
the program memory. The TBLPTR is comprised of the timed write to program memory (long write) begins,
three SFR registers: Table Pointer Upper Byte, Table the 19 MSbs of the Table Pointer (TBLPTR<21:3>) will
Pointer High Byte and Table Pointer Low Byte determine which program memory block of 8 bytes is
(TBLPTRU:TBLPTRH:TBLPTRL). These three regis- written to (TBLPTR<2:0> are ignored). For more detail,
ters join to form a 22-bit wide pointer. The low-order see Section 6.5 “Writing to Flash Program Memory”.
21 bits allow the device to address up to 2 Mbytes of
program memory space. Setting the 22nd bit allows When an erase of program memory is executed, the
access to the device ID, the user ID and the 16 MSbs of the Table Pointer (TBLPTR<21:6>) point to
configuration bits. the 64-byte block that will be erased. The Least
Significant bits (TBLPTR<5:0>) are ignored.
The Table Pointer (TBLPTR) register is used by the
TBLRD and TBLWT instructions. These instructions can Figure 6-3 describes the relevant boundaries of
update the TBLPTR in one of four ways based on the TBLPTR based on Flash program memory operations.
table operation. These operations are shown in
Table 6-1. These operations on the TBLPTR only affect
the low-order 21 bits.

TABLE 6-1: TABLE POINTER OPERATIONS WITH TBLRD AND TBLWT INSTRUCTIONS
Example Operation on Table Pointer
TBLRD*
TBLPTR is not modified
TBLWT*
TBLRD*+
TBLPTR is incremented after the read/write
TBLWT*+
TBLRD*-
TBLPTR is decremented after the read/write
TBLWT*-
TBLRD+*
TBLPTR is incremented before the read/write
TBLWT+*

FIGURE 6-3: TABLE POINTER BOUNDARIES BASED ON OPERATION

21 TBLPTRU 16 15 TBLPTRH 8 7 TBLPTRL 0

ERASE – TBLPTR<21:6>

LONG WRITE – TBLPTR<21:3>

READ or WRITE – TBLPTR<21:0>

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 PIC18F1220/1320
6.3 Reading the Flash Program The internal program memory is typically organized by
Memory words. The Least Significant bit of the address selects
between the high and low bytes of the word. Figure 6-4
The TBLRD instruction is used to retrieve data from shows the interface between the internal program
program memory and place it into data RAM. Table memory and the TABLAT.
reads from program memory are performed one byte at
a time.
TBLPTR points to a byte address in program space.
Executing a TBLRD instruction places the byte pointed
to into TABLAT. In addition, TBLPTR can be modified
automatically for the next table read operation.

FIGURE 6-4: READS FROM FLASH PROGRAM MEMORY

Program Memory

Odd (High) Byte Even (Low) Byte

TBLPTR TBLPTR
LSB = 1 LSB = 0

Instruction Register TABLAT

(IR) Read Register

EXAMPLE 6-1: READING A FLASH PROGRAM MEMORY WORD

MOVLW CODE_ADDR_UPPER ; Load TBLPTR with the base
MOVWF TBLPTRU ; address of the word
MOVLW CODE_ADDR_HIGH
MOVWF TBLPTRH
MOVLW CODE_ADDR_LOW
MOVWF TBLPTRL
READ_WORD
TBLRD*+ ; read into TABLAT and increment TBLPTR
MOVFW TABLAT ; get data
MOVWF WORD_EVEN
TBLRD*+ ; read into TABLAT and increment TBLPTR
MOVFW TABLAT ; get data
MOVWF WORD_ODD

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PIC18F1220/1320
6.4 Erasing Flash Program Memory 6.4.1 FLASH PROGRAM MEMORY
ERASE SEQUENCE
The minimum erase block size is 32 words or 64 bytes
under firmware control. Only through the use of an The sequence of events for erasing a block of internal
external programmer, or through ICSP control, can program memory location is:
larger blocks of program memory be bulk erased. Word 1. Load Table Pointer with address of row being
erase in Flash memory is not supported. erased.
When initiating an erase sequence from the micro- 2. Set the EECON1 register for the erase operation:
controller itself, a block of 64 bytes of program memory • set EEPGD bit to point to program memory;
is erased. The Most Significant 16 bits of the • clear the CFGS bit to access program
TBLPTR<21:6> point to the block being erased. memory;
TBLPTR<5:0> are ignored.
• set WREN bit to enable writes;
The EECON1 register commands the erase operation. • set FREE bit to enable the erase.
The EEPGD bit must be set to point to the Flash
3. Disable interrupts.
program memory. The CFGS bit must be clear to
access program Flash and data EEPROM memory. 4. Write 55h to EECON2.
The WREN bit must be set to enable write operations. 5. Write AAh to EECON2.
The FREE bit is set to select an erase operation. The 6. Set the WR bit. This will begin the row erase
WR bit is set as part of the required instruction cycle.
sequence (as shown in Example 6-2) and starts the 7. The CPU will stall for duration of the erase
actual erase operation. It is not necessary to load the (about 2 ms using internal timer).
TABLAT register with any data as it is ignored.
8. Execute a NOP.
For protection, the write initiate sequence using 9. Re-enable interrupts.
EECON2 must be used.
A long write is necessary for erasing the internal Flash.
Instruction execution is halted while in a long write
cycle. The long write will be terminated by the internal
programming timer.

EXAMPLE 6-2: ERASING A FLASH PROGRAM MEMORY ROW

MOVLW CODE_ADDR_UPPER ; load TBLPTR with the base
MOVWF TBLPTRU ; address of the memory block
MOVLW CODE_ADDR_HIGH
MOVWF TBLPTRH
MOVLW CODE_ADDR_LOW
MOVWF TBLPTRL
ERASE_ROW
BSF EECON1, EEPGD ; point to FLASH program memory
BSF EECON1, WREN ; enable write to memory
BSF EECON1, FREE ; enable Row Erase operation
BCF INTCON, GIE ; disable interrupts
MOVLW 55h
MOVWF EECON2 ; write 55H
Required MOVLW AAh
Sequence MOVWF EECON2 ; write AAH
BSF EECON1, WR ; start erase (CPU stall)
NOP
BSF INTCON, GIE ; re-enable interrupts

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 PIC18F1220/1320
6.5 Writing to Flash Program Memory Since the Table Latch (TABLAT) is only a single byte,
the TBLWT instruction must be executed 8 times for
The programming block size is 4 words or 8 bytes. each programming operation. All of the table write
Word or byte programming is not supported. operations will essentially be short writes, because only
Table writes are used internally to load the holding the holding registers are written. At the end of updating
registers needed to program the Flash memory. There 8 registers, the EECON1 register must be written to, to
are 8 holding registers used by the table writes for start the programming operation with a long write.
programming. The long write is necessary for programming the
internal Flash. Instruction execution is halted while in a
long write cycle. The long write will be terminated by
the internal programming timer.

FIGURE 6-5: TABLE WRITES TO FLASH PROGRAM MEMORY

TABLAT
Write Register

8 8 8 8

TBLPTR = xxxxx0 TBLPTR = xxxxx1 TBLPTR = xxxxx2 TBLPTR = xxxxx7

Holding Register Holding Register Holding Register Holding Register

Program Memory

6.5.1 FLASH PROGRAM MEMORY WRITE 8. Disable interrupts.

SEQUENCE 9. Write 55h to EECON2.
The sequence of events for programming an internal 10. Write AAh to EECON2.
program memory location should be: 11. Set the WR bit. This will begin the write cycle.
1. Read 64 bytes into RAM. 12. The CPU will stall for duration of the write (about
2. Update data values in RAM as necessary. 2 ms using internal timer).
3. Load Table Pointer with address being erased. 13. Execute a NOP.
4. Do the row erase procedure (see Section 6.4.1 14. Re-enable interrupts.
“Flash Program Memory Erase Sequence”). 15. Repeat steps 6-14 seven times to write
5. Load Table Pointer with address of first byte 64 bytes.
being written. 16. Verify the memory (table read).
6. Write the first 8 bytes into the holding registers This procedure will require about 18 ms to update one
with auto-increment. row of 64 bytes of memory. An example of the required
7. Set the EECON1 register for the write operation: code is given in Example 6-3.
• set EEPGD bit to point to program memory;
• clear the CFGS bit to access program
memory;
• set WREN bit to enable byte writes.

© 2007 Microchip Technology Inc. DS39605F-page 63

PIC18F1220/1320
EXAMPLE 6-3: WRITING TO FLASH PROGRAM MEMORY
MOVLW D'64 ; number of bytes in erase block
MOVWF COUNTER
MOVLW BUFFER_ADDR_HIGH ; point to buffer
MOVWF FSR0H
MOVLW BUFFER_ADDR_LOW
MOVWF FSR0L
MOVLW CODE_ADDR_UPPER ; Load TBLPTR with the base
MOVWF TBLPTRU ; address of the memory block
MOVLW CODE_ADDR_HIGH
MOVWF TBLPTRH
MOVLW CODE_ADDR_LOW ; 6 LSB = 0
MOVWF TBLPTRL
READ_BLOCK
TBLRD*+ ; read into TABLAT, and inc
MOVF TABLAT, W ; get data
MOVWF POSTINC0 ; store data and increment FSR0
DECFSZ COUNTER ; done?
GOTO READ_BLOCK ; repeat
MODIFY_WORD
MOVLW DATA_ADDR_HIGH ; point to buffer
MOVWF FSR0H
MOVLW DATA_ADDR_LOW
MOVWF FSR0L
MOVLW NEW_DATA_LOW ; update buffer word and increment FSR0
MOVWF POSTINC0
MOVLW NEW_DATA_HIGH ; update buffer word
MOVWF INDF0
ERASE_BLOCK
MOVLW CODE_ADDR_UPPER ; load TBLPTR with the base
MOVWF TBLPTRU ; address of the memory block
MOVLW CODE_ADDR_HIGH
MOVWF TBLPTRH
MOVLW CODE_ADDR_LOW ; 6 LSB = 0
MOVWF TBLPTRL
BCF EECON1, CFGS ; point to PROG/EEPROM memory
BSF EECON1, EEPGD ; point to FLASH program memory
BSF EECON1, WREN ; enable write to memory
BSF EECON1, FREE ; enable Row Erase operation
BCF INTCON, GIE ; disable interrupts
MOVLW 55h ; Required sequence
MOVWF EECON2 ; write 55H
MOVLW AAh
MOVWF EECON2 ; write AAH
BSF EECON1, WR ; start erase (CPU stall)
NOP
BSF INTCON, GIE ; re-enable interrupts
WRITE_BUFFER_BACK
MOVLW 8 ; number of write buffer groups of 8 bytes
MOVWF COUNTER_HI
MOVLW BUFFER_ADDR_HIGH ; point to buffer
MOVWF FSR0H
MOVLW BUFFER_ADDR_LOW
MOVWF FSR0L
PROGRAM_LOOP
MOVLW 8 ; number of bytes in holding register
MOVWF COUNTER

DS39605F-page 64 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
EXAMPLE 6-3: WRITING TO FLASH PROGRAM MEMORY (CONTINUED)
WRITE_WORD_TO_HREGS
MOVF POSTINC0, W ; get low byte of buffer data and increment FSR0
MOVWF TABLAT ; present data to table latch
TBLWT+* ; short write
; to internal TBLWT holding register, increment
TBLPTR
DECFSZ COUNTER ; loop until buffers are full
GOTO WRITE_WORD_TO_HREGS
PROGRAM_MEMORY
BCF INTCON, GIE ; disable interrupts
MOVLW 55h ; required sequence
MOVWF EECON2 ; write 55H
MOVLW AAh
MOVWF EECON2 ; write AAH
BSF EECON1, WR ; start program (CPU stall)
NOP
BSF INTCON, GIE ; re-enable interrupts
DECFSZ COUNTER_HI ; loop until done
GOTO PROGRAM_LOOP
BCF EECON1, WREN ; disable write to memory

6.5.2 WRITE VERIFY 6.6 Flash Program Operation During

Depending on the application, good programming Code Protection
practice may dictate that the value written to the mem-
See Section 19.0 “Special Features of the CPU” for
ory should be verified against the original value. This
details on code protection of Flash program memory.
should be used in applications where excessive writes
can stress bits near the specification limit.

6.5.3 UNEXPECTED TERMINATION OF

WRITE OPERATION
If a write is terminated by an unplanned event, such as
loss of power or an unexpected Reset, the memory
location just programmed should be verified and repro-
grammed if needed. The WRERR bit is set when a
write operation is interrupted by a MCLR Reset, or a
WDT Time-out Reset during normal operation. In these
situations, users can check the WRERR bit and rewrite
the location.

TABLE 6-2: REGISTERS ASSOCIATED WITH PROGRAM FLASH MEMORY

Value on
Value on:
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 all other
POR, BOR
Resets

TBLPTRU — — bit 21 Program Memory Table Pointer Upper Byte (TBLPTR<20:16>) --00 0000 --00 0000
TBPLTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>) 0000 0000 0000 0000
TBLPTRL Program Memory Table Pointer High Byte (TBLPTR<7:0>) 0000 0000 0000 0000
TABLAT Program Memory Table Latch 0000 0000 0000 0000
INTCON GIE/GIEH PEIE/GIEL TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 0000 000u
EECON2 EEPROM Control Register 2 (not a physical register) — —
EECON1 EEPGD CFGS — FREE WRERR WREN WR RD xx-0 x000 uu-0 u000
IPR2 OSCFIP — — EEIP — LVDIP TMR3IP — 1--1 -11- 1--1 -11-
PIR2 OSCFIF — — EEIF — LVDIF TMR3IF — 0--0 -00- 0--0 -00-
PIE2 OSCFIE — — EEIE — LVDIE TMR3IE — 0--0 -00- 0--0 -00-
Legend: x = unknown, u = unchanged, – = unimplemented, read as ‘0’.
Shaded cells are not used during Flash/EEPROM access.

© 2007 Microchip Technology Inc. DS39605F-page 65

PIC18F1220/1320
NOTES:

DS39605F-page 66 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
7.0 DATA EEPROM MEMORY Control bit, CFGS, determines if the access will be to
the configuration registers or to program memory/data
The data EEPROM is readable and writable during EEPROM memory. When set, subsequent operations
normal operation over the entire VDD range. The data access configuration registers. When CFGS is clear,
memory is not directly mapped in the register file the EEPGD bit selects either program Flash or data
space. Instead, it is indirectly addressed through the EEPROM memory.
Special Function Registers (SFR).
The WREN bit enables and disables erase and write
There are four SFRs used to read and write the operations. When set, erase and write operations are
program and data EEPROM memory. These registers allowed. When clear, erase and write operations are
are: disabled – the WR bit cannot be set while the WREN bit
• EECON1 is clear. This mechanism helps to prevent accidental
• EECON2 writes to memory due to errant (unexpected) code
execution.
• EEDATA
• EEADR Firmware should keep the WREN bit clear at all times,
except when starting erase or write operations. Once
The EEPROM data memory allows byte read and write. firmware has set the WR bit, the WREN bit may be
When interfacing to the data memory block, EEDATA cleared. Clearing the WREN bit will not affect the
holds the 8-bit data for read/write and EEADR holds the operation in progress.
address of the EEPROM location being accessed.
These devices have 256 bytes of data EEPROM with The WRERR bit is set when a write operation is
an address range from 00h to FFh. interrupted by a Reset. In these situations, the user can
check the WRERR bit and rewrite the location. It is
The EEPROM data memory is rated for high erase/ necessary to reload the data and address registers
write cycle endurance. A byte write automatically (EEDATA and EEADR), as these registers have
erases the location and writes the new data (erase- cleared as a result of the Reset.
before-write). The write time is controlled by an on-chip
timer. The write time will vary with voltage and Control bits, RD and WR, start read and erase/write
temperature, as well as from chip to chip. Please operations, respectively. These bits are set by firmware
refer to parameter D122 (Table 22-1 in Section 22.0 and cleared by hardware at the completion of the
“Electrical Characteristics”) for exact limits. operation.
The RD bit cannot be set when accessing program
7.1 EEADR memory (EEPGD = 1). Program memory is read using
table read instructions. See Section 6.1 “Table Reads
The address register can address 256 bytes of data and Table Writes” regarding table reads.
EEPROM.
Note: Interrupt flag bit, EEIF in the PIR2 register,
is set when write is complete. It must be
7.2 EECON1 and EECON2 Registers
cleared in software.
EECON1 is the control register for memory accesses.
EECON2 is not a physical register. Reading EECON2
will read all ‘0’s. The EECON2 register is used
exclusively in the memory write and erase sequences.
Control bit, EEPGD, determines if the access will be to
program or data EEPROM memory. When clear,
operations will access the data EEPROM memory.
When set, program memory is accessed.

© 2007 Microchip Technology Inc. DS39605F-page 67

PIC18F1220/1320
REGISTER 7-1: EECON1 REGISTER
R/W-x R/W-x U-0 R/W-0 R/W-x R/W-0 R/S-0 R/S-0
EEPGD CFGS — FREE WRERR WREN WR RD
bit 7 bit 0

bit 7 EEPGD: Flash Program or Data EEPROM Memory Select bit

1 = Access program Flash memory
0 = Access data EEPROM memory
bit 6 CFGS: Flash Program/Data EEPROM or Configuration Select bit
1 = Access configuration or calibration registers
0 = Access program Flash or data EEPROM memory
bit 5 Unimplemented: Read as ‘0’
bit 4 FREE: Flash Row Erase Enable bit
1 = Erase the program memory row addressed by TBLPTR on the next WR command
(cleared by completion of erase operation)
0 = Perform write only
bit 3 WRERR: EEPROM Error Flag bit
1 = A write operation was prematurely terminated
(MCLR or WDT Reset during self-timed erase or program operation)
0 = The write operation completed normally
Note: When a WRERR occurs, the EEPGD or FREE bits are not cleared. This allows
tracing of the error condition.
bit 2 WREN: Erase/Write Enable bit
1 = Allows erase/write cycles
0 = Inhibits erase/write cycles
bit 1 WR: Write Control bit
1 = Initiates a data EEPROM erase/write cycle, or a program memory erase cycle, or write cycle.
(The operation is self-timed and the bit is cleared by hardware once write is complete. The
WR bit can only be set (not cleared) in software.)
0 = Write cycle is completed
bit 0 RD: Read Control bit
1 = Initiates a memory read
(Read takes one cycle. RD is cleared in hardware. The RD bit can only be set (not cleared)
in software. RD bit cannot be set when EEPGD = 1.)
0 = Read completed

Legend:
R = Readable bit S = Settable only U = Unimplemented bit, read as ‘0’
W = Writable bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared
x = Bit is unknown

DS39605F-page 68 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
7.3 Reading the Data EEPROM After a write sequence has been initiated, EECON1,
Memory EEADR and EEDATA cannot be modified. The WR bit
will be inhibited from being set unless the WREN bit is
To read a data memory location, the user must write the set. The WREN bit must be set on a previous instruc-
address to the EEADR register, clear the EEPGD tion. Both WR and WREN cannot be set with the same
control bit (EECON1<7>) and then set control bit, RD instruction.
(EECON1<0>). The data is available for the very next
At the completion of the write cycle, the WR bit is
instruction cycle; therefore, the EEDATA register can
cleared in hardware and the EEPROM Interrupt Flag bit
be read by the next instruction. EEDATA will hold this
(EEIF) is set. The user may either enable this interrupt
value until another read operation, or until it is written to
or poll this bit. EEIF must be cleared by software.
by the user (during a write operation).

7.5 Write Verify

7.4 Writing to the Data EEPROM
Memory Depending on the application, good programming
practice may dictate that the value written to the
To write an EEPROM data location, the address must memory should be verified against the original value.
first be written to the EEADR register and the data This should be used in applications where excessive
written to the EEDATA register. The sequence in writes can stress bits near the specification limit.
Example 7-2 must be followed to initiate the write cycle.
The write will not begin if this sequence is not exactly 7.6 Protection Against Spurious Write
followed (write 55h to EECON2, write AAh to EECON2,
then set WR bit) for each byte. It is strongly recom- There are conditions when the device may not want to
mended that interrupts be disabled during this write to the data EEPROM memory. To protect against
code segment. spurious EEPROM writes, various mechanisms have
been built-in. On power-up, the WREN bit is cleared.
Additionally, the WREN bit in EECON1 must be set to Also, the Power-up Timer (72 ms duration) prevents
enable writes. This mechanism prevents accidental EEPROM write.
writes to data EEPROM due to unexpected code exe-
cution (i.e., runaway programs). The WREN bit should The write initiate sequence and the WREN bit together
be kept clear at all times, except when updating the help prevent an accidental write during brown-out,
EEPROM. The WREN bit is not cleared by hardware. power glitch or software malfunction.

EXAMPLE 7-1: DATA EEPROM READ

MOVLW DATA_EE_ADDR ;
MOVWF EEADR ; Data Memory Address to read
BCF EECON1, EEPGD ; Point to DATA memory
BSF EECON1, RD ; EEPROM Read
MOVF EEDATA, W ; W = EEDATA

EXAMPLE 7-2: DATA EEPROM WRITE

MOVLW DATA_EE_ADDR ;
MOVWF EEADR ; Data Memory Address to write
MOVLW DATA_EE_DATA ;
MOVWF EEDATA ; Data Memory Value to write
BCF EECON1, EEPGD ; Point to DATA memory
BSF EECON1, WREN ; Enable writes
BCF INTCON, GIE ; Disable Interrupts
MOVLW 55h ;
Required MOVWF EECON2 ; Write 55h
Sequence MOVLW AAh ;
MOVWF EECON2 ; Write AAh
BSF EECON1, WR ; Set WR bit to begin write
BSF INTCON, GIE ; Enable Interrupts

SLEEP ; Wait for interrupt to signal write complete

BCF EECON1, WREN ; Disable writes

© 2007 Microchip Technology Inc. DS39605F-page 69

PIC18F1220/1320
7.7 Operation During Code-Protect 7.8 Using the Data EEPROM
Data EEPROM memory has its own code-protect bits in The data EEPROM is a high endurance, byte address-
configuration words. External read and write able array that has been optimized for the storage of fre-
operations are disabled if either of these mechanisms quently changing information (e.g., program variables or
are enabled. other data that are updated often). Frequently changing
The microcontroller itself can both read and write to the values will typically be updated more often than specifi-
internal data EEPROM, regardless of the state of the cation D124. If this is not the case, an array refresh must
code-protect configuration bit. Refer to Section 19.0 be performed. For this reason, variables that change
“Special Features of the CPU” for additional infrequently (such as constants, IDs, calibration, etc.)
information. should be stored in Flash program memory.
A simple data EEPROM refresh routine is shown in
Example 7-3.
Note: If data EEPROM is only used to store
constants and/or data that changes rarely,
an array refresh is likely not required. See
specification D124.

EXAMPLE 7-3: DATA EEPROM REFRESH ROUTINE

CLRF EEADR ; Start at address 0
BCF EECON1, CFGS ; Set for memory
BCF EECON1, EEPGD ; Set for Data EEPROM
BCF INTCON, GIE ; Disable interrupts
BSF EECON1, WREN ; Enable writes
Loop ; Loop to refresh array
BSF EECON1, RD ; Read current address
MOVLW 55h ;
MOVWF EECON2 ; Write 55h
MOVLW AAh ;
MOVWF EECON2 ; Write AAh
BSF EECON1, WR ; Set WR bit to begin write
BTFSC EECON1, WR ; Wait for write to complete
BRA $-2
INCFSZ EEADR, F ; Increment address
BRA Loop ; Not zero, do it again

BCF EECON1, WREN ; Disable writes

BSF INTCON, GIE ; Enable interrupts

TABLE 7-1: REGISTERS ASSOCIATED WITH DATA EEPROM MEMORY

Value on
Value on:
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 all other
POR, BOR
Resets

INTCON GIE/GIEH PEIE/GIEL TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 0000 000u
EEADR EEPROM Address Register 0000 0000 0000 0000
EEDATA EEPROM Data Register 0000 0000 0000 0000
EECON2 EEPROM Control Register 2 (not a physical register) — —
EECON1 EEPGD CFGS — FREE WRERR WREN WR RD xx-0 x000 uu-0 u000
IPR2 OSCFIP — — EEIP — LVDIP TMR3IP — 1--1 -11- 1--1 -11-
PIR2 OSCFIF — — EEIF — LVDIF TMR3IF — 0--0 -00- 0--0 -00-
PIE2 OSCFIE — — EEIE — LVDIE TMR3IE — 0--0 -00- 0--0 -00-
Legend: x = unknown, u = unchanged, – = unimplemented, read as ‘0’. Shaded cells are not used during Flash/EEPROM access.

DS39605F-page 70 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
8.0 8 x 8 HARDWARE MULTIPLIER Making the 8 x 8 multiplier execute in a single cycle
gives the following advantages:
8.1 Introduction • Higher computational throughput
• Reduces code size requirements for multiply
An 8 x 8 hardware multiplier is included in the ALU of
algorithms
the PIC18F1220/1320 devices. By making the multiply
a hardware operation, it completes in a single instruc- The performance increase allows the device to be used
tion cycle. This is an unsigned multiply that gives a in applications previously reserved for Digital Signal
16-bit result. The result is stored into the 16-bit product Processors.
register pair (PRODH:PRODL). The multiplier does not Table 8-1 shows a performance comparison between
affect any flags in the Status register. Enhanced devices using the single-cycle hardware
multiply and performing the same function without the
hardware multiply.

TABLE 8-1: PERFORMANCE COMPARISON

Program Time
Cycles
Routine Multiply Method Memory
(Max) @ 40 MHz @ 10 MHz @ 4 MHz
(Words)
Without hardware multiply 13 69 6.9 μs 27.6 μs 69 μs
8 x 8 unsigned
Hardware multiply 1 1 100 ns 400 ns 1 μs
Without hardware multiply 33 91 9.1 μs 36.4 μs 91 μs
8 x 8 signed
Hardware multiply 6 6 600 ns 2.4 μs 6 μs
Without hardware multiply 21 242 24.2 μs 96.8 μs 242 μs
16 x 16 unsigned
Hardware multiply 28 28 2.8 μs 11.2 μs 28 μs
Without hardware multiply 52 254 25.4 μs 102.6 μs 254 μs
16 x 16 signed
Hardware multiply 35 40 4 μs 16 μs 40 μs

8.2 Operation EXAMPLE 8-2: 8 x 8 SIGNED MULTIPLY

ROUTINE
Example 8-1 shows the sequence to do an 8 x 8
unsigned multiply. Only one instruction is required MOVF ARG1, W
MULWF ARG2 ; ARG1 * ARG2 ->
when one argument of the multiply is already loaded in
; PRODH:PRODL
the WREG register. BTFSC ARG2, SB ; Test Sign Bit
Example 8-2 shows the sequence to do an 8 x 8 signed SUBWF PRODH, F ; PRODH = PRODH
multiply. To account for the sign bits of the arguments, ; - ARG1
each argument’s Most Significant bit (MSb) is tested MOVF ARG2, W
and the appropriate subtractions are done. BTFSC ARG1, SB ; Test Sign Bit
SUBWF PRODH, F ; PRODH = PRODH
; - ARG2
EXAMPLE 8-1: 8 x 8 UNSIGNED
MULTIPLY ROUTINE
MOVF ARG1, W ;
MULWF ARG2 ; ARG1 * ARG2 ->
; PRODH:PRODL

© 2007 Microchip Technology Inc. DS39605F-page 71

PIC18F1220/1320
Example 8-3 shows the sequence to do a 16 x 16 EQUATION 8-2: 16 x 16 SIGNED
unsigned multiply. Equation 8-1 shows the algorithm MULTIPLICATION
that is used. The 32-bit result is stored in four registers, ALGORITHM
RES3:RES0. RES3:RES0
= ARG1H:ARG1L • ARG2H:ARG2L
EQUATION 8-1: 16 x 16 UNSIGNED = (ARG1H • ARG2H • 216) +
MULTIPLICATION (ARG1H • ARG2L • 28) +
ALGORITHM (ARG1L • ARG2H • 28) +
(ARG1L • ARG2L) +
RES3:RES0 (-1 • ARG2H<7> • ARG1H:ARG1L • 216) +
= ARG1H:ARG1L • ARG2H:ARG2L (-1 • ARG1H<7> • ARG2H:ARG2L • 216)
= (ARG1H • ARG2H • 216) +
(ARG1H • ARG2L • 28) +
(ARG1L • ARG2H • 28) + EXAMPLE 8-4: 16 x 16 SIGNED
(ARG1L • ARG2L) MULTIPLY ROUTINE
MOVF ARG1L, W
EXAMPLE 8-3: 16 x 16 UNSIGNED MULWF ARG2L ; ARG1L * ARG2L ->
MULTIPLY ROUTINE ; PRODH:PRODL
MOVFF PRODH, RES1 ;
MOVF ARG1L, W
MOVFF PRODL, RES0 ;
MULWF ARG2L ; ARG1L * ARG2L ->
;
; PRODH:PRODL
MOVF ARG1H, W
MOVFF PRODH, RES1 ;
MULWF ARG2H ; ARG1H * ARG2H ->
MOVFF PRODL, RES0 ;
; PRODH:PRODL
;
MOVFF PRODH, RES3 ;
MOVF ARG1H, W
MOVFF PRODL, RES2 ;
MULWF ARG2H ; ARG1H * ARG2H ->
;
; PRODH:PRODL
MOVF ARG1L, W
MOVFF PRODH, RES3 ;
MULWF ARG2H ; ARG1L * ARG2H ->
MOVFF PRODL, RES2 ;
; PRODH:PRODL
;
MOVF PRODL, W ;
MOVF ARG1L, W
ADDWF RES1, F ; Add cross
MULWF ARG2H ; ARG1L * ARG2H ->
MOVF PRODH, W ; products
; PRODH:PRODL
ADDWFC RES2, F ;
MOVF PRODL, W ;
CLRF WREG ;
ADDWF RES1, F ; Add cross
ADDWFC RES3, F ;
MOVF PRODH, W ; products
;
ADDWFC RES2, F ;
MOVF ARG1H, W ;
CLRF WREG ;
MULWF ARG2L ; ARG1H * ARG2L ->
ADDWFC RES3,F ;
; PRODH:PRODL
;
MOVF PRODL, W ;
MOVF ARG1H, W ;
ADDWF RES1, F ; Add cross
MULWF ARG2L ; ARG1H * ARG2L ->
MOVF PRODH, W ; products
; PRODH:PRODL
ADDWFC RES2, F ;
MOVF PRODL, W ;
CLRF WREG ;
ADDWF RES1, F ; Add cross
ADDWFC RES3, F ;
MOVF PRODH, W ; products
;
ADDWFC RES2, F ;
BTFSS ARG2H, 7 ; ARG2H:ARG2L neg?
CLRF WREG ;
BRA SIGN_ARG1 ; no, check ARG1
ADDWFC RES3, F ;
MOVF ARG1L, W ;
Example 8-4 shows the sequence to do a 16 x 16 SUBWF RES2 ;
signed multiply. Equation 8-2 shows the algorithm MOVF ARG1H, W ;
SUBWFB RES3
used. The 32-bit result is stored in four registers,
;
RES3:RES0. To account for the sign bits of the argu- SIGN_ARG1
ments, each argument pairs’ Most Significant bit (MSb) BTFSS ARG1H, 7 ; ARG1H:ARG1L neg?
is tested and the appropriate subtractions are done. BRA CONT_CODE ; no, done
MOVF ARG2L, W ;
SUBWF RES2 ;
MOVF ARG2H, W ;
SUBWFB RES3
;
CONT_CODE
:

DS39605F-page 72 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
9.0 INTERRUPTS When the IPEN bit is cleared (default state), the
interrupt priority feature is disabled and interrupts are
The PIC18F1220/1320 devices have multiple interrupt compatible with PIC mid-range devices. In
sources and an interrupt priority feature that allows Compatibility mode, the interrupt priority bits for each
each interrupt source to be assigned a high priority source have no effect. INTCON<6> is the PEIE bit,
level or a low priority level. The high priority interrupt which enables/disables all peripheral interrupt sources.
vector is at 000008h and the low priority interrupt vector INTCON<7> is the GIE bit, which enables/disables all
is at 000018h. High priority interrupt events will interrupt sources. All interrupts branch to address
interrupt any low priority interrupts that may be in 000008h in Compatibility mode.
progress.
When an interrupt is responded to, the global interrupt
There are ten registers which are used to control enable bit is cleared to disable further interrupts. If the
interrupt operation. These registers are: IPEN bit is cleared, this is the GIE bit. If interrupt priority
• RCON levels are used, this will be either the GIEH or GIEL bit.
• INTCON High priority interrupt sources can interrupt a low
priority interrupt. Low priority interrupts are not
• INTCON2
processed while high priority interrupts are in progress.
• INTCON3
The return address is pushed onto the stack and the
• PIR1, PIR2
PC is loaded with the interrupt vector address
• PIE1, PIE2 (000008h or 000018h). Once in the Interrupt Service
• IPR1, IPR2 Routine, the source(s) of the interrupt can be deter-
It is recommended that the Microchip header files mined by polling the interrupt flag bits. The interrupt
supplied with MPLAB® IDE be used for the symbolic bit flag bits must be cleared in software before re-enabling
names in these registers. This allows the assembler/ interrupts to avoid recursive interrupts.
compiler to automatically take care of the placement of The “return from interrupt” instruction, RETFIE, exits
these bits within the specified register. the interrupt routine and sets the GIE bit (GIEH or
In general, each interrupt source has three bits to GIEL, if priority levels are used), which re-enables
control its operation. The functions of these bits are: interrupts.
• Flag bit to indicate that an interrupt event For external interrupt events, such as the INT pins or
occurred the PORTB input change interrupt, the interrupt latency
will be three to four instruction cycles. The exact
• Enable bit that allows program execution to
latency is the same for one or two-cycle instructions.
branch to the interrupt vector address when the
Individual interrupt flag bits are set, regardless of the
flag bit is set
status of their corresponding enable bit or the GIE bit.
• Priority bit to select high priority or low priority
(INT0 has no priority bit and is always high priority) Note: Do not use the MOVFF instruction to modify
any of the interrupt control registers while
The interrupt priority feature is enabled by setting the
any interrupt is enabled. Doing so may
IPEN bit (RCON<7>). When interrupt priority is
cause erratic microcontroller behavior.
enabled, there are two bits which enable interrupts
globally. Setting the GIEH bit (INTCON<7>) enables all
interrupts that have the priority bit set (high priority).
Setting the GIEL bit (INTCON<6>) enables all
interrupts that have the priority bit cleared (low priority).
When the interrupt flag, enable bit and appropriate
global interrupt enable bit are set, the interrupt will
vector immediately to address 000008h or 000018h,
depending on the priority bit setting. Individual
interrupts can be disabled through their corresponding
enable bits.

© 2007 Microchip Technology Inc. DS39605F-page 73

PIC18F1220/1320
FIGURE 9-1: INTERRUPT LOGIC

Wake-up if in Low-Power Mode

TMR0IF
TMR0IE
TMR0IP
RBIF
RBIE
RBIP
INT0IF
INT0IE
Interrupt to CPU
INT1IF Vector to Location
INT1IE
INT1IP 0008h
INT0IF
INT2IF
INT0IE INT2IE
INT2IP
GIEH/GIE
ADIF
ADIE
ADIP IPEN

RCIF IPEN
RCIE GIEL/PEIE
RCIP
IPEN
Additional Peripheral Interrupts
High Priority Interrupt Generation

Low Priority Interrupt Generation

INT0IF
INT0IE
Interrupt to CPU
TMR0IF Vector to Location
TMR0IE 0018h
ADIF TMR0IP
ADIE RBIF
ADIP RBIE
RBIP GIEL\PEIE
RCIF
RCIE GIE\GIEH
INT0IF
RCIP
INT0IE
INT1IF
Additional Peripheral Interrupts INT1IE
INT1IP
INT2IF
INT2IE
INT2IP

DS39605F-page 74 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
9.1 INTCON Registers Note: Interrupt flag bits are set when an interrupt
The INTCON registers are readable and writable condition occurs, regardless of the state of
registers, which contain various enable, priority and its corresponding enable bit or the global
flag bits. interrupt enable bit. User software should
ensure the appropriate interrupt flag bits
are clear prior to enabling an interrupt.
This feature allows for software polling.

REGISTER 9-1: INTCON REGISTER

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x
GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF
bit 7 bit 0

bit 7 GIE/GIEH: Global Interrupt Enable bit

When IPEN = 0:
1 = Enables all unmasked interrupts
0 = Disables all interrupts
When IPEN = 1:
1 = Enables all high priority interrupts
0 = Disables all interrupts
bit 6 PEIE/GIEL: Peripheral Interrupt Enable bit
When IPEN = 0:
1 = Enables all unmasked peripheral interrupts
0 = Disables all peripheral interrupts
When IPEN = 1:
1 = Enables all low priority peripheral interrupts
0 = Disables all low priority peripheral interrupts
bit 5 TMR0IE: TMR0 Overflow Interrupt Enable bit
1 = Enables the TMR0 overflow interrupt
0 = Disables the TMR0 overflow interrupt
bit 4 INT0IE: INT0 External Interrupt Enable bit
1 = Enables the INT0 external interrupt
0 = Disables the INT0 external interrupt
bit 3 RBIE: RB Port Change Interrupt Enable bit
1 = Enables the RB port change interrupt
0 = Disables the RB port change interrupt
bit 2 TMR0IF: TMR0 Overflow Interrupt Flag bit
1 = TMR0 register has overflowed (must be cleared in software)
0 = TMR0 register did not overflow
bit 1 INT0IF: INT0 External Interrupt Flag bit
1 = The INT0 external interrupt occurred (must be cleared in software)
0 = The INT0 external interrupt did not occur
bit 0 RBIF: RB Port Change Interrupt Flag bit
1 = At least one of the RB7:RB4 pins changed state (must be cleared in software)
0 = None of the RB7:RB4 pins have changed state
Note: A mismatch condition will continue to set this bit. Reading PORTB will end the
mismatch condition and allow the bit to be cleared.

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. DS39605F-page 75

PIC18F1220/1320
REGISTER 9-2: INTCON2 REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 U-0 R/W-1 U-0 R/W-1
RBPU INTEDG0 INTEDG1 INTEDG2 — TMR0IP — RBIP
bit 7 bit 0

bit 7 RBPU: PORTB Pull-up Enable bit

1 = All PORTB pull-ups are disabled
0 = PORTB pull-ups are enabled by individual port latch values
bit 6 INTEDG0: External Interrupt 0 Edge Select bit
1 = Interrupt on rising edge
0 = Interrupt on falling edge
bit 5 INTEDG1: External Interrupt 1 Edge Select bit
1 = Interrupt on rising edge
0 = Interrupt on falling edge
bit 4 INTEDG2: External Interrupt 2 Edge Select bit
1 = Interrupt on rising edge
0 = Interrupt on falling edge
bit 3 Unimplemented: Read as ‘0’
bit 2 TMR0IP: TMR0 Overflow Interrupt Priority bit
1 = High priority
0 = Low priority
bit 1 Unimplemented: Read as ‘0’
bit 0 RBIP: RB Port Change Interrupt Priority bit
1 = High priority
0 = Low priority

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state
of its corresponding enable bit or the global interrupt enable bit. User software
should ensure the appropriate interrupt flag bits are clear prior to enabling an
interrupt. This feature allows for software polling.

DS39605F-page 76 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
REGISTER 9-3: INTCON3 REGISTER
R/W-1 R/W-1 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0
INT2IP INT1IP — INT2IE INT1IE — INT2IF INT1IF
bit 7 bit 0

bit 7 INT2IP: INT2 External Interrupt Priority bit

1 = High priority
0 = Low priority
bit 6 INT1IP: INT1 External Interrupt Priority bit
1 = High priority
0 = Low priority
bit 5 Unimplemented: Read as ‘0’
bit 4 INT2IE: INT2 External Interrupt Enable bit
1 = Enables the INT2 external interrupt
0 = Disables the INT2 external interrupt
bit 3 INT1IE: INT1 External Interrupt Enable bit
1 = Enables the INT1 external interrupt
0 = Disables the INT1 external interrupt
bit 2 Unimplemented: Read as ‘0’
bit 1 INT2IF: INT2 External Interrupt Flag bit
1 = The INT2 external interrupt occurred (must be cleared in software)
0 = The INT2 external interrupt did not occur
bit 0 INT1IF: INT1 External Interrupt Flag bit
1 = The INT1 external interrupt occurred (must be cleared in software)
0 = The INT1 external interrupt did not occur

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state
of its corresponding enable bit or the global interrupt enable bit. User software
should ensure the appropriate interrupt flag bits are clear prior to enabling an
interrupt. This feature allows for software polling.

© 2007 Microchip Technology Inc. DS39605F-page 77

PIC18F1220/1320
9.2 PIR Registers Note 1: Interrupt flag bits are set when an interrupt
The PIR registers contain the individual flag bits for the condition occurs, regardless of the state of
peripheral interrupts. Due to the number of peripheral its corresponding enable bit or the Global
interrupt sources, there are two Peripheral Interrupt Interrupt Enable bit, GIE (INTCON<7>).
Request (Flag) registers (PIR1, PIR2). 2: User software should ensure the appropri-
ate interrupt flag bits are cleared prior to
enabling an interrupt and after servicing
that interrupt.

REGISTER 9-4: PIR1: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 1

U-0 R/W-0 R-0 R-0 U-0 R/W-0 R/W-0 R/W-0
— ADIF RCIF TXIF — CCP1IF TMR2IF TMR1IF
bit 7 bit 0

bit 7 Unimplemented: Read as ‘0’

bit 6 ADIF: A/D Converter Interrupt Flag bit
1 = An A/D conversion completed (must be cleared in software)
0 = The A/D conversion is not complete
bit 5 RCIF: EUSART Receive Interrupt Flag bit
1 = The EUSART receive buffer, RCREG, is full (cleared when RCREG is read)
0 = The EUSART receive buffer is empty
bit 4 TXIF: EUSART Transmit Interrupt Flag bit
1 = The EUSART transmit buffer, TXREG, is empty (cleared when TXREG is written)
0 = The EUSART transmit buffer is full
bit 3 Unimplemented: Read as ‘0’
bit 2 CCP1IF: CCP1 Interrupt Flag bit
Capture mode:
1 = A TMR1 register capture occurred (must be cleared in software)
0 = No TMR1 register capture occurred
Compare mode:
1 = A TMR1 register compare match occurred (must be cleared in software)
0 = No TMR1 register compare match occurred
PWM mode:
Unused in this mode.
bit 1 TMR2IF: TMR2 to PR2 Match Interrupt Flag bit
1 = TMR2 to PR2 match occurred (must be cleared in software)
0 = No TMR2 to PR2 match occurred
bit 0 TMR1IF: TMR1 Overflow Interrupt Flag bit
1 = TMR1 register overflowed (must be cleared in software)
0 = TMR1 register did not overflow

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

DS39605F-page 78 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
REGISTER 9-5: PIR2: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 2
R/W-0 U-0 U-0 R/W-0 U-0 R/W-0 R/W-0 U-0
OSCFIF — — EEIF — LVDIF TMR3IF —
bit 7 bit 0

bit 7 OSCFIF: Oscillator Fail Interrupt Flag bit

1 = System oscillator failed, clock input has changed to INTOSC (must be cleared in software)
0 = System clock operating
bit 6-5 Unimplemented: Read as ‘0’
bit 4 EEIF: Data EEPROM/Flash Write Operation Interrupt Flag bit
1 = The write operation is complete (must be cleared in software)
0 = The write operation is not complete or has not been started
bit 3 Unimplemented: Read as ‘0’
bit 2 LVDIF: Low-Voltage Detect Interrupt Flag bit
1 = A low-voltage condition occurred (must be cleared in software)
0 = The device voltage is above the Low-Voltage Detect trip point
bit 1 TMR3IF: TMR3 Overflow Interrupt Flag bit
1 = TMR3 register overflowed (must be cleared in software)
0 = TMR3 register did not overflow
bit 0 Unimplemented: Read as ‘0’

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. DS39605F-page 79

PIC18F1220/1320
9.3 PIE Registers
The PIE registers contain the individual enable bits for
the peripheral interrupts. Due to the number of
peripheral interrupt sources, there are two Peripheral
Interrupt Enable registers (PIE1, PIE2). When
IPEN = 0, the PEIE bit must be set to enable any of
these peripheral interrupts.

REGISTER 9-6: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1

U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0
— ADIE RCIE TXIE — CCP1IE TMR2IE TMR1IE
bit 7 bit 0

bit 7 Unimplemented: Read as ‘0’

bit 6 ADIE: A/D Converter Interrupt Enable bit
1 = Enables the A/D interrupt
0 = Disables the A/D interrupt
bit 5 RCIE: EUSART Receive Interrupt Enable bit
1 = Enables the EUSART receive interrupt
0 = Disables the EUSART receive interrupt
bit 4 TXIE: EUSART Transmit Interrupt Enable bit
1 = Enables the EUSART transmit interrupt
0 = Disables the EUSART transmit interrupt
bit 3 Unimplemented: Read as ‘0’
bit 2 CCP1IE: CCP1 Interrupt Enable bit
1 = Enables the CCP1 interrupt
0 = Disables the CCP1 interrupt
bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit
1 = Enables the TMR2 to PR2 match interrupt
0 = Disables the TMR2 to PR2 match interrupt
bit 0 TMR1IE: TMR1 Overflow Interrupt Enable bit
1 = Enables the TMR1 overflow interrupt
0 = Disables the TMR1 overflow interrupt

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

DS39605F-page 80 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
REGISTER 9-7: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2
R/W-0 U-0 U-0 R/W-0 U-0 R/W-0 R/W-0 U-0
OSCFIE — — EEIE — LVDIE TMR3IE —
bit 7 bit 0

bit 7 OSCFIE: Oscillator Fail Interrupt Enable bit

1 = Enabled
0 = Disabled
bit 6-5 Unimplemented: Read as ‘0’
bit 4 EEIE: Data EEPROM/Flash Write Operation Interrupt Enable bit
1 = Enabled
0 = Disabled
bit 3 Unimplemented: Read as ‘0’
bit 2 LVDIE: Low-Voltage Detect Interrupt Enable bit
1 = Enabled
0 = Disabled
bit 1 TMR3IE: TMR3 Overflow Interrupt Enable bit
1 = Enabled
0 = Disabled
bit 0 Unimplemented: Read as ‘0’

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. DS39605F-page 81

PIC18F1220/1320
9.4 IPR Registers
The IPR registers contain the individual priority bits for
the peripheral interrupts. Due to the number of
peripheral interrupt sources, there are two Peripheral
Interrupt Priority registers (IPR1, IPR2). Using the
priority bits requires that the Interrupt Priority Enable
(IPEN) bit be set.

REGISTER 9-8: IPR1: PERIPHERAL INTERRUPT PRIORITY REGISTER 1

U-0 R/W-1 R/W-1 R/W-1 U-0 R/W-1 R/W-1 R/W-1
— ADIP RCIP TXIP — CCP1IP TMR2IP TMR1IP
bit 7 bit 0

bit 7 Unimplemented: Read as ‘0’

bit 6 ADIP: A/D Converter Interrupt Priority bit
1 = High priority
0 = Low priority
bit 5 RCIP: EUSART Receive Interrupt Priority bit
1 = High priority
0 = Low priority
bit 4 TXIP: EUSART Transmit Interrupt Priority bit
1 = High priority
0 = Low priority
bit 3 Unimplemented: Read as ‘0’
bit 2 CCP1IP: CCP1 Interrupt Priority bit
1 = High priority
0 = Low priority
bit 1 TMR2IP: TMR2 to PR2 Match Interrupt Priority bit
1 = High priority
0 = Low priority
bit 0 TMR1IP: TMR1 Overflow Interrupt Priority bit
1 = High priority
0 = Low priority

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

DS39605F-page 82 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
REGISTER 9-9: IPR2: PERIPHERAL INTERRUPT PRIORITY REGISTER 2
R/W-1 U-0 U-0 R/W-1 U-0 R/W-1 R/W-1 U-0
OSCFIP — — EEIP — LVDIP TMR3IP —
bit 7 bit 0

bit 7 OSCFIP: Oscillator Fail Interrupt Priority bit

1 = High priority
0 = Low priority
bit 6-5 Unimplemented: Read as ‘0’
bit 4 EEIP: Data EEPROM/Flash Write Operation Interrupt Priority bit
1 = High priority
0 = Low priority
bit 3 Unimplemented: Read as ‘0’
bit 2 LVDIP: Low-Voltage Detect Interrupt Priority bit
1 = High priority
0 = Low priority
bit 1 TMR3IP: TMR3 Overflow Interrupt Priority bit
1 = High priority
0 = Low priority
bit 0 Unimplemented: Read as ‘0’

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. DS39605F-page 83

PIC18F1220/1320
9.5 RCON Register
The RCON register contains bits used to determine the
cause of the last Reset or wake-up from a low-power
mode. RCON also contains the bit that enables
interrupt priorities (IPEN).

REGISTER 9-10: RCON REGISTER

R/W-0 U-0 U-0 R/W-1 R-1 R-1 R/W-0 R/W-0
IPEN — — RI TO PD POR BOR
bit 7 bit 0

bit 7 IPEN: Interrupt Priority Enable bit

1 = Enable priority levels on interrupts
0 = Disable priority levels on interrupts (PIC16CXXX Compatibility mode)
bit 6-5 Unimplemented: Read as ‘0’
bit 4 RI: RESET Instruction Flag bit
For details of bit operation, see Register 5-3.
bit 3 TO: Watchdog Time-out Flag bit
For details of bit operation, see Register 5-3.
bit 2 PD: Power-down Detection Flag bit
For details of bit operation, see Register 5-3.
bit 1 POR: Power-on Reset Status bit
For details of bit operation, see Register 5-3.
bit 0 BOR: Brown-out Reset Status bit
For details of bit operation, see Register 5-3.

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

DS39605F-page 84 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
9.6 INTn Pin Interrupts 9.7 TMR0 Interrupt
External interrupts on the RB0/INT0, RB1/INT1 and In 8-bit mode (which is the default), an overflow
RB2/INT2 pins are edge-triggered: either rising if the (FFh → 00h) in the TMR0 register will set flag bit,
corresponding INTEDGx bit is set in the INTCON2 reg- TMR0IF. In 16-bit mode, an overflow (FFFFh → 0000h)
ister, or falling if the INTEDGx bit is clear. When a valid in the TMR0H:TMR0L registers will set flag bit,
edge appears on the RBx/INTx pin, the corresponding TMR0IF. The interrupt can be enabled/disabled by
flag bit, INTxF, is set. This interrupt can be disabled by setting/clearing enable bit, TMR0IE (INTCON<5>).
clearing the corresponding enable bit, INTxE. Flag bit, Interrupt priority for Timer0 is determined by the value
INTxF, must be cleared in software in the Interrupt contained in the interrupt priority bit, TMR0IP
Service Routine before re-enabling the interrupt. All (INTCON2<2>). See Section 11.0 “Timer0 Module”
external interrupts (INT0, INT1 and INT2) can wake-up for further details on the Timer0 module.
the processor from low-power modes if bit INTxE was
set prior to going into low-power modes. If the Global 9.8 PORTB Interrupt-on-Change
Interrupt Enable bit, GIE, is set, the processor will
branch to the interrupt vector following wake-up. An input change on PORTB<7:4> sets flag bit, RBIF
(INTCON<0>). The interrupt can be enabled/disabled
Interrupt priority for INT1 and INT2 is determined by the
by setting/clearing enable bit, RBIE (INTCON<3>).
value contained in the interrupt priority bits, INT1IP
Interrupt priority for PORTB interrupt-on-change is
(INTCON3<6>) and INT2IP (INTCON3<7>). There is
determined by the value contained in the interrupt
no priority bit associated with INT0. It is always a high
priority bit, RBIP (INTCON2<0>).
priority interrupt source.

9.9 Context Saving During Interrupts

During interrupts, the return PC address is saved on the
stack. Additionally, the WREG, Status and BSR registers
are saved on the fast return stack. If a fast return from
interrupt is not used (see Section 5.3 “Fast Register
Stack”), the user may need to save the WREG, Status
and BSR registers on entry to the Interrupt Service
Routine. Depending on the user’s application, other
registers may also need to be saved. Example 9-1
saves and restores the WREG, Status and BSR
registers during an Interrupt Service Routine.

EXAMPLE 9-1: SAVING STATUS, WREG AND BSR REGISTERS IN RAM

MOVWF W_TEMP ; W_TEMP is in virtual bank
MOVFF STATUS, STATUS_TEMP ; STATUS_TEMP located anywhere
MOVFF BSR, BSR_TEMP ; BSR_TMEP located anywhere
;
; USER ISR CODE
;
MOVFF BSR_TEMP, BSR ; Restore BSR
MOVF W_TEMP, W ; Restore WREG
MOVFF STATUS_TEMP, STATUS ; Restore STATUS

© 2007 Microchip Technology Inc. DS39605F-page 85

PIC18F1220/1320
NOTES:

DS39605F-page 86 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
10.0 I/O PORTS The Data Latch register (LATA) is also memory
mapped. Read-modify-write operations on the LATA
Depending on the device selected and features register read and write the latched output value for
enabled, there are up to five ports available. Some pins PORTA.
of the I/O ports are multiplexed with an alternate
The RA4 pin is multiplexed with the Timer0 module
function from the peripheral features on the device. In
clock input to become the RA4/T0CKI pin.
general, when a peripheral is enabled, that pin may not
be used as a general purpose I/O pin. The sixth pin of PORTA (MCLR/VPP/RA5) is an input
only pin. Its operation is controlled by the MCLRE
Each port has three registers for its operation. These
configuration bit in Configuration Register 3H
registers are:
(CONFIG3H<7>). When selected as a port pin
• TRIS register (data direction register) (MCLRE = 0), it functions as a digital input only pin; as
• PORT register (reads the levels on the pins of the such, it does not have TRIS or LAT bits associated with
device) its operation. Otherwise, it functions as the device’s
• LAT register (output latch) Master Clear input. In either configuration, RA5 also
functions as the programming voltage input during
The Data Latch (LATA) register is useful for read-
programming.
modify-write operations on the value that the I/O pins
are driving. Note: On a Power-on Reset, RA5 is enabled as a
A simplified model of a generic I/O port without the digital input only if Master Clear functionality
interfaces to other peripherals is shown in Figure 10-1. is disabled.
Pins RA6 and RA7 are multiplexed with the main oscil-
FIGURE 10-1: GENERIC I/O PORT lator pins; they are enabled as oscillator or I/O pins by
OPERATION the selection of the main oscillator in Configuration
Register 1H (see Section 19.1 “Configuration Bits”
for details). When they are not used as port pins, RA6
RD LAT
and RA7 and their associated TRIS and LAT bits are
Data read as ‘0’.
Bus D Q The other PORTA pins are multiplexed with analog
WR LAT I/O pin(1) inputs, the analog VREF+ and VREF- inputs and the LVD
or Port
CK input. The operation of pins RA3:RA0 as A/D converter
Data Latch inputs is selected by clearing/setting the control bits in
the ADCON1 register (A/D Control Register 1).
D Q
Note: On a Power-on Reset, RA3:RA0 are
WR TRIS
CK
configured as analog inputs and read as
‘0’. RA4 is always a digital pin.
TRIS Latch Input
Buffer The RA4/T0CKI pin is a Schmitt Trigger input and an
RD TRIS open-drain output. All other PORTA pins have TTL
input levels and full CMOS output drivers.
Q D
The TRISA register controls the direction of the RA
pins, even when they are being used as analog inputs.
ENEN
The user must ensure the bits in the TRISA register are
RD Port maintained set when using them as analog inputs.

Note 1: I/O pins have diode protection to VDD and VSS.

EXAMPLE 10-1: INITIALIZING PORTA
CLRF PORTA ; Initialize PORTA by
; clearing output
10.1 PORTA, TRISA and LATA ; data latches
Registers CLRF LATA ; Alternate method
; to clear output
PORTA is an 8-bit wide, bidirectional port. The corre- ; data latches
sponding data direction register is TRISA. Setting a MOVLW 0x7F ; Configure A/D
TRISA bit (= 1) will make the corresponding PORTA pin MOVWF ADCON1 ; for digital inputs
an input (i.e., put the corresponding output driver in a MOVLW 0xD0 ; Value used to
high-impedance mode). Clearing a TRISA bit (= 0) will ; initialize data
make the corresponding PORTA pin an output (i.e., put ; direction
the contents of the output latch on the selected pin). MOVWF TRISA ; Set RA<3:0> as outputs
; RA<7:4> as inputs
Reading the PORTA register reads the status of the
pins, whereas writing to it will write to the port latch.

© 2007 Microchip Technology Inc. DS39605F-page 87

PIC18F1220/1320
FIGURE 10-2: BLOCK DIAGRAM OF FIGURE 10-4: BLOCK DIAGRAM OF
RA3:RA0 PINS RA4/T0CKI PIN

RD LATA
RD LATA

Data Data
Bus Bus
D Q D Q
WR LATA VDD WR LATA
or or
PORTA PORTA
CK Q P CK Q I/O pin(1)
N
Data Latch Data Latch

N (1)
I/O pin D Q VSS
D Q

WR TRISA Schmitt
WR TRISA VSS CK Q
CK Q Trigger
Analog TRIS Latch
Input Input
TRIS Latch
Mode Buffer

RD TRISA

RD TRISA
Schmitt
Trigger Q D
Q D Input
Buffer
ENEN
EN
RD PORTA
RD PORTA
TMR0 Clock Input
To A/D Converter and LVD Modules
Note 1: I/O pins have protection diodes to VDD and VSS.
Note 1: I/O pins have protection diodes to VDD and VSS.

FIGURE 10-3: BLOCK DIAGRAM OF FIGURE 10-5: BLOCK DIAGRAM OF

OSC2/CLKO/RA6 PIN OSC1/CLKI/RA7 PIN
RA6 Enable RA7 Enable
To Oscillator
Data Data
Bus Bus

RD LATA RD LATA

D Q D Q
WR LATA VDD WR LATA VDD
or or
PORTA PORTA
CK Q P CK Q P

Data Latch Data Latch

N I/O pin (1) N I/O pin(1)

D Q D Q

WR WR
TRISA VSS TRISA CK Q VSS
CK Q
TRIS Latch TRIS Latch
Schmitt
Trigger
RD Input RD
TRISA Buffer TRISA Schmitt
ECIO or Trigger
RCIO RA7 Input
Enable Enable Buffer

Q D Q D

EN EN
RD PORTA
RD PORTA

Note 1: I/O pins have protection diodes to VDD and VSS. Note 1: I/O pins have protection diodes to VDD and VSS.

DS39605F-page 88 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 10-6: MCLR/VPP/RA5 PIN BLOCK DIAGRAM
MCLRE

Data Bus
MCLR/VPP/RA5
RD TRISA

Schmitt
Trigger
RD LATA
Latch
Q D

EN

RD PORTA

High-Voltage Detect
HV

Internal MCLR
Filter
Low-Level
MCLR Detect

TABLE 10-1: PORTA FUNCTIONS

Name Bit# Buffer Function
RA0/AN0 bit 0 ST Input/output port pin or analog input.
RA1/AN1/LVDIN bit 1 ST Input/output port pin, analog input or Low-Voltage Detect input.
RA2/AN2/VREF- bit 2 ST Input/output port pin, analog input or VREF-.
RA3/AN3/VREF+ bit 3 ST Input/output port pin, analog input or VREF+.
RA4/T0CKI bit 4 ST Input/output port pin or external clock input for Timer0.
Output is open-drain type.
MCLR/VPP/RA5 bit 5 ST Master Clear input or programming voltage input (if MCLR is enabled); input
only port pin or programming voltage input (if MCLR is disabled).
OSC2/CLKO/RA6 bit 6 ST OSC2, clock output or I/O pin.
OSC1/CLKI/RA7 bit 7 ST OSC1, clock input or I/O pin.
Legend: TTL = TTL input, ST = Schmitt Trigger input

TABLE 10-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA

Value on
Value on
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 all other
POR, BOR
Resets

PORTA RA7(1) RA6(1) RA5(2) RA4 RA3 RA2 RA1 RA0 xx0x 0000 uu0u 0000
(1) LATA6(1)
LATA LATA7 — LATA Data Output Register xx-x xxxx uu-u uuuu
TRISA TRISA7(1) TRISA6(1) — PORTA Data Direction Register 11-1 1111 11-1 1111
ADCON1 — PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 -000 0000 -000 0000
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA.
Note 1: RA7:RA6 and their associated latch and data direction bits are enabled as I/O pins based on oscillator
configuration; otherwise, they are read as ‘0’.
2: RA5 is an input only if MCLR is disabled.

© 2007 Microchip Technology Inc. DS39605F-page 89

PIC18F1220/1320
10.2 PORTB, TRISB and LATB This interrupt can wake the device from Sleep. The
Registers user, in the Interrupt Service Routine, can clear the
interrupt in the following manner:
PORTB is an 8-bit wide, bidirectional port. The corre-
a) Any read or write of PORTB (except with the
sponding data direction register is TRISB. Setting a
MOVFF instruction). This will end the mismatch
TRISB bit (= 1) will make the corresponding PORTB
condition.
pin an input (i.e., put the corresponding output driver in
a high-impedance mode). Clearing a TRISB bit (= 0) b) Clear flag bit, RBIF.
will make the corresponding PORTB pin an output (i.e., A mismatch condition will continue to set flag bit, RBIF.
put the contents of the output latch on the selected pin). Reading PORTB will end the mismatch condition and
The Data Latch register (LATB) is also memory allow flag bit, RBIF, to be cleared.
mapped. Read-modify-write operations on the LATB The interrupt-on-change feature is recommended for
register read and write the latched output value for wake-up on key depression operation and operations
PORTB. where PORTB is only used for the interrupt-on-change
feature. Polling of PORTB is not recommended while
EXAMPLE 10-2: INITIALIZING PORTB using the interrupt-on-change feature.
CLRF PORTB ; Initialize PORTB by
; clearing output FIGURE 10-7: BLOCK DIAGRAM OF
; data latches RB0/AN4/INT0 PIN
CLRF LATB ; Alternate method
VDD
; to clear output
RBPU(2)
; data latches Weak
P Pull-up
MOVLW 0x70 ; Set RB0, RB1, RB4 as Analog Input Mode
MOVWF ADCON1 ; digital I/O pins Data Bus D Q
MOVLW 0xCF ; Value used to
WR LATB I/O
; initialize data or PORTB pin(1)
CK
; direction
Data Latch
MOVWF TRISB ; Set RB<3:0> as inputs
; RB<5:4> as outputs D Q
; RB<7:6> as inputs
WR TRISB
CK
TTL
Pins RB0-RB2 are multiplexed with INT0-INT2; pins TRIS Latch Input
RB0, RB1 and RB4 are multiplexed with A/D inputs; Buffer
pins RB1 and RB4 are multiplexed with EUSART; and
RD TRISB
pins RB2, RB3, RB6 and RB7 are multiplexed with
ECCP. RD LATB
Each of the PORTB pins has a weak internal pull-up. A
Q D
single control bit can turn on all the pull-ups. This is
performed by clearing bit, RBPU (INTCON2<7>). The
ENEN
weak pull-up is automatically turned off when the port
RD PORTB
pin is configured as an output. The pull-ups are
disabled on a Power-on Reset. Schmitt Trigger
INTx Buffer
Note: On a Power-on Reset, RB4:RB0 are
To A/D Converter
configured as analog inputs by default and
read as ‘0’; RB7:RB5 are configured as
Note 1: I/O pins have diode protection to VDD and VSS.
digital inputs.
2: To enable weak pull-ups, set the appropriate TRIS
bit(s) and clear the RBPU bit (INTCON2<7>).
Four of the PORTB pins (RB7:RB4) have an interrupt-
on-change feature. Only pins configured as inputs can
cause this interrupt to occur (i.e., any RB7:RB4 pin
configured as an output is excluded from the interrupt-
on-change comparison). The input pins (of RB7:RB4)
are compared with the old value latched on the last
read of PORTB. The “mismatch” outputs of RB7:RB4
are OR’ed together to generate the RB Port Change
Interrupt with Flag bit, RBIF (INTCON<0>).

DS39605F-page 90 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 10-8: BLOCK DIAGRAM OF RB1/AN5/TX/CK/INT1 PIN

EUSART Enable

TX/CK Data 1

TX/CK TRIS

VDD
RBPU(2) Weak
Analog Input Mode P Pull-up
Data Latch
Data Bus
D Q

WR LATB RB1 pin(1)

CK
or
PORTB
TRIS Latch
D Q

WR TRISB
CK

TTL
RD TRISB Input
Buffer
RD LATB

Q D
RD PORTB
EN

RD PORTB
Schmitt
Trigger
Input
Buffer
INT1/CK Input

Analog Input
Mode
To A/D Converter

Note 1: I/O pins have diode protection to VDD and VSS.

2: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (INTCON2<7>).

© 2007 Microchip Technology Inc. DS39605F-page 91

PIC18F1220/1320
FIGURE 10-9: BLOCK DIAGRAM OF RB2/P1B/INT2 PIN

VDD
RBPU(2)
P Weak
Pull-up

P1B Enable

P1B Data
P1B/D Tri-State 1
Auto-Shutdown

Data Latch
Data Bus
D Q
WR LATB or RB2 pin(1)
PORTB
CK

TRIS Latch
D Q
TTL
WR TRISB Input
CK Buffer

RD TRISB

RD LATB

Q D
RD PORTB
EN

Schmitt
INT2 Input Trigger RD PORTB

Note 1: I/O pins have diode protection to VDD and VSS.

2: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (INTCON2<7>).

DS39605F-page 92 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 10-10: BLOCK DIAGRAM OF RB3/CCP1/P1A PIN

ECCP1(3) pin Output Enable

ECCP1(4) pin Input Enable VDD

RBPU(2) Weak
P Pull-up
P1A/C Tri-State Auto-Shutdown

ECCP1/P1A Data Out

1 VDD

P
0
RD LATB
Data Bus
D Q
WR LATB or
RB3 pin
PORTB Q
CK
Data Latch N
D Q
VSS
WR TRISB
CK Q

TRIS Latch TTL Input

Buffer

RD TRISB

Q D

EN
RD PORTB

ECCP1 Input
Schmitt
Trigger

Note 1: I/O pins have diode protection to VDD and VSS.

2: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (INTCON2<7>).
3: ECCP1 pin output enable active for any PWM mode and Compare mode, where CCP1M<3:0> = 1000 or 1001.
4: ECCP1 pin input enable active for Capture mode only.

© 2007 Microchip Technology Inc. DS39605F-page 93

PIC18F1220/1320
FIGURE 10-11: BLOCK DIAGRAM OF RB4/AN6/RX/DT/KBI0 PIN

EUSART Enabled
VDD
RBPU(2)
Analog Input Mode
P Weak
Pull-up
DT TRIS
DT Data
1

0
RD LATB
Data Bus D Q
WR LATB or RB4 pin
PORTB Q
CK

Data Latch

D Q
WR TRISB Q
CK

TRIS Latch

TTL
Input
RD TRISB Buffer

Q D

RD PORTB EN Q1
Set RBIF

From other Q D
RB7:RB4 pins RD PORTB
EN
Q3

Schmitt
Trigger
RX/DT Input

Analog Input
To A/D Converter Mode

Note 1: I/O pins have diode protection to VDD and VSS.

2: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (INTCON2<7>).

DS39605F-page 94 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 10-12: BLOCK DIAGRAM OF RB5/PGM/KBI1 PIN

VDD
RBPU(2) Weak
P Pull-up
Data Latch
Data Bus
D Q
WR LATB I/O pin(1)
or PORTB
CK
TRIS Latch
D Q

WR TRISB TTL
CK Input
Buffer ST
Buffer
RD TRISB

RD LATB
Latch
Q D
RD PORTB
EN Q1
Set RBIF

Q D
RD PORTB
From other
RB7:RB5 and EN
Q3
RB4 pins

RB7:RB5 in Serial Programming Mode

Note 1: I/O pins have diode protection to VDD and VSS.

2: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit
(INTCON2<7>).

© 2007 Microchip Technology Inc. DS39605F-page 95

PIC18F1220/1320
FIGURE 10-13: BLOCK DIAGRAM OF RB6/PGC/T1OSO/T13CKI/P1C/KBI2 PIN

ECCP1 P1C/D Enable

VDD
RBPU(2)
P Weak
Pull-up
P1B/D Tri-State Auto-Shutdown
P1C Data
1

0
RD LATB
Data Bus
D Q
WR LATB or
PORTB RB6 pin
CK Q

Data Latch

D Q
WR TRISB Q
CK Timer1
Oscillator
TRIS Latch

From RB7 pin

RD TRISB TTL Schmitt
T1OSCEN Buffer Trigger

Q D

RD PORTB EN Q1
Set RBIF

From other Q D
RB7:RB4 pins RD PORTB
EN
Q3

PGC

T13CKI

Note 1: I/O pins have diode protection to VDD and VSS.

2: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (INTCON2<7>).

DS39605F-page 96 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 10-14: BLOCK DIAGRAM OF RB7/PGD/T1OSI/P1D/KBI3 PIN

ECCP1 P1C/D Enable VDD

RBPU(2) Weak
P Pull-up
P1B/D Tri-State Auto-Shutdown

P1D Data
1 To RB6 pin

0
RD LATB
Data Bus
D Q
WR LATB or RB7 pin
PORTB Q
CK
Data Latch

D Q
WR TRISB Q
CK

TRIS Latch

TTL
T1OSCEN RD TRISB Input Schmitt
Buffer Trigger

Q D

RD PORTB EN Q1
Set RBIF

From other Q D
RB7:RB4 pins RD PORTB
EN
Q3
PGD

Note 1: I/O pins have diode protection to VDD and VSS.

2: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (INTCON2<7>).

© 2007 Microchip Technology Inc. DS39605F-page 97

PIC18F1220/1320
TABLE 10-3: PORTB FUNCTIONS
Name Bit# Buffer Function

RB0/AN4/INT0 bit 0 TTL(1)/ST(2) Input/output port pin, analog input or external interrupt
input 0.
RB1/AN5/TX/CK/INT1 bit 1 TTL(1)/ST(2) Input/output port pin, analog input, Enhanced USART
Asynchronous Transmit, Addressable USART
Synchronous Clock or external interrupt input 1.
RB2/P1B/INT2 bit 2 TTL(1)/ST(2) Input/output port pin or external interrupt input 2.
Internal software programmable weak pull-up.
RB3/CCP1/P1A bit 3 TTL(1)/ST(3) Input/output port pin or Capture1 input/Compare1 output/
PWM output. Internal software programmable weak pull-up.
RB4/AN6/RX/DT/KBI0 bit 4 TTL(1)/ST(4) Input/output port pin (with interrupt-on-change), analog input,
Enhanced USART Asynchronous Receive or Addressable
USART Synchronous Data.
RB5/PGM/KBI1 bit 5 TTL(1)/ST(5) Input/output port pin (with interrupt-on-change).
Internal software programmable weak pull-up.
Low-Voltage ICSP enable pin.
RB6/PGC/T1OSO/T13CKI/ bit 6 TTL(1)/ST(5,6) Input/output port pin (with interrupt-on-change), Timer1/
P1C/KBI2 Timer3 clock input or Timer1oscillator output.
Internal software programmable weak pull-up.
Serial programming clock.
RB7/PGD/T1OSI/P1D/KBI3 bit 7 TTL(1)/ST(5) Input/output port pin (with interrupt-on-change) or Timer1
oscillator input. Internal software programmable weak pull-up.
Serial programming data.
Legend: TTL = TTL input, ST = Schmitt Trigger input
Note 1: This buffer is a TTL input when configured as a port input pin.
2: This buffer is a Schmitt Trigger input when configured as the external interrupt.
3: This buffer is a Schmitt Trigger input when configured as the CCP1 input.
4: This buffer is a Schmitt Trigger input when used as EUSART receive input.
5: This buffer is a Schmitt Trigger input when used in Serial Programming mode.
6: This buffer is a TTL input when used as the T13CKI input.

TABLE 10-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB

Value on
Value on
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 all other
POR, BOR
Resets
PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxq qqqq uuuu uuuu
LATB LATB Data Output Register xxxx xxxx uuuu uuuu
TRISB PORTB Data Direction Register 1111 1111 1111 1111
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u
INTCON2 RBPU INTEDG0 INTEDG1 INTEDG2 — TMR0IP — RBIP 1111 -1-1 1111 -1-1
INTCON3 INT2IP INT1IP — INT2IE INT1IE — INT2IF INT1IF 11-0 0-00 11-0 0-00
ADCON1 — PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 -000 0000 -000 0000
Legend: x = unknown, u = unchanged, q = value depends on condition. Shaded cells are not used by PORTB.

DS39605F-page 98 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
11.0 TIMER0 MODULE Figure 11-1 shows a simplified block diagram of the
Timer0 module in 8-bit mode and Figure 11-2 shows a
The Timer0 module has the following features: simplified block diagram of the Timer0 module in 16-bit
• Software selectable as an 8-bit or 16-bit timer/ mode.
counter The T0CON register (Register 11-1) is a readable and
• Readable and writable writable register that controls all the aspects of Timer0,
• Dedicated 8-bit software programmable prescaler including the prescale selection.
• Clock source selectable to be external or internal
• Interrupt-on-overflow from FFh to 00h in 8-bit
mode and FFFFh to 0000h in 16-bit mode
• Edge select for external clock

REGISTER 11-1: T0CON: TIMER0 CONTROL REGISTER

R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0
bit 7 bit 0

bit 7 TMR0ON: Timer0 On/Off Control bit

1 = Enables Timer0
0 = Stops Timer0
bit 6 T08BIT: Timer0 8-bit/16-bit Control bit
1 = Timer0 is configured as an 8-bit timer/counter
0 = Timer0 is configured as a 16-bit timer/counter
bit 5 T0CS: Timer0 Clock Source Select bit
1 = Transition on T0CKI pin
0 = Internal instruction cycle clock (CLKO)
bit 4 T0SE: Timer0 Source Edge Select bit
1 = Increment on high-to-low transition on T0CKI pin
0 = Increment on low-to-high transition on T0CKI pin
bit 3 PSA: Timer0 Prescaler Assignment bit
1 = TImer0 prescaler is NOT assigned. Timer0 clock input bypasses prescaler.
0 = Timer0 prescaler is assigned. Timer0 clock input comes from prescaler output.
bit 2-0 T0PS2:T0PS0: Timer0 Prescaler Select bits
111 = 1:256 Prescale value
110 = 1:128 Prescale value
101 = 1:64 Prescale value
100 = 1:32 Prescale value
011 = 1:16 Prescale value
010 = 1:8 Prescale value
001 = 1:4 Prescale value
000 = 1:2 Prescale value

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. DS39605F-page 99

PIC18F1220/1320
FIGURE 11-1: TIMER0 BLOCK DIAGRAM IN 8-BIT MODE

Data Bus
RA4/T0CKI FOSC/4 0
pin 8
1
Sync with
1 Internal TMR0
Clocks
Programmable 0
Prescaler
T0SE (2 TCY Delay)
3 PSA
Set Interrupt
T0PS2, T0PS1, T0PS0 Flag bit TMR0IF
T0CS on Overflow

Note: Upon Reset, Timer0 is enabled in 8-bit mode with clock input from T0CKI maximum prescale.

FIGURE 11-2: TIMER0 BLOCK DIAGRAM IN 16-BIT MODE

RA4/T0CKI FOSC/4 0
pin
1 Sync with
TMR0 Set Interrupt
1 Internal TMR0L Flag bit TMR0IF
Clocks High Byte
Programmable 0 on Overflow
Prescaler 8
T0SE (2 TCY Delay)
3
Read TMR0L
T0PS2, T0PS1, T0PS0
T0CS Write TMR0L
PSA
8
8
TMR0H

Data Bus<7:0>

Note: Upon Reset, Timer0 is enabled in 8-bit mode with clock input from T0CKI maximum prescale.

DS39605F-page 100 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
11.1 Timer0 Operation 11.2.1 SWITCHING PRESCALER
ASSIGNMENT
Timer0 can operate as a timer or as a counter.
The prescaler assignment is fully under software
Timer mode is selected by clearing the T0CS bit. In
control (i.e., it can be changed “on-the-fly” during
Timer mode, the Timer0 module will increment every
program execution).
instruction cycle (without prescaler). If the TMR0 regis-
ter is written, the increment is inhibited for the following
two instruction cycles. The user can work around this 11.3 Timer0 Interrupt
by writing an adjusted value to the TMR0 register. The TMR0 interrupt is generated when the TMR0 reg-
Counter mode is selected by setting the T0CS bit. In ister overflows from FFh to 00h in 8-bit mode, or FFFFh
Counter mode, Timer0 will increment either on every to 0000h in 16-bit mode. This overflow sets the TMR0IF
rising or falling edge of pin RA4/T0CKI. The increment- bit. The interrupt can be masked by clearing the
ing edge is determined by the Timer0 Source Edge TMR0IE bit. The TMR0IF bit must be cleared in soft-
Select bit (T0SE). Clearing the T0SE bit selects the ware by the Timer0 module Interrupt Service Routine
rising edge. before re-enabling this interrupt. The TMR0 interrupt
cannot awaken the processor from Low-Power Sleep
When an external clock input is used for Timer0, it must
mode, since the timer requires clock cycles even when
meet certain requirements. The requirements ensure
T0CS is set.
the external clock can be synchronized with the internal
phase clock (TOSC). Also, there is a delay in the actual
incrementing of Timer0 after synchronization. 11.4 16-Bit Mode Timer Reads
and Writes
11.2 Prescaler TMR0H is not the high byte of the timer/counter in
An 8-bit counter is available as a prescaler for the Timer0 16-bit mode, but is actually a buffered version of the
module. The prescaler is not readable or writable. high byte of Timer0 (refer to Figure 11-2). The high byte
of the Timer0 counter/timer is not directly readable nor
The PSA and T0PS2:T0PS0 bits determine the writable. TMR0H is updated with the contents of the
prescaler assignment and prescale ratio. high byte of Timer0 during a read of TMR0L. This pro-
Clearing bit PSA will assign the prescaler to the Timer0 vides the ability to read all 16 bits of Timer0, without
module. When the prescaler is assigned to the Timer0 having to verify that the read of the high and low byte
module, prescale values of 1:2, 1:4, ..., 1:256 are were valid due to a rollover between successive reads
selectable. of the high and low byte.
When assigned to the Timer0 module, all instructions A write to the high byte of Timer0 must also take place
writing to the TMR0 register (e.g., CLRF TMR0, MOVWF through the TMR0H Buffer register. Timer0 high byte is
TMR0, BSF TMR0, x, ..., etc.) will clear the prescaler updated with the contents of TMR0H when a write
count. occurs to TMR0L. This allows all 16 bits of Timer0 to be
updated at once.
Note: Writing to TMR0 when the prescaler is
assigned to Timer0 will clear the prescaler
count, but will not change the prescaler
assignment.

TABLE 11-1: REGISTERS ASSOCIATED WITH TIMER0

Value on
Value on
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 all other
POR, BOR
Resets

TMR0L Timer0 Module Low Byte Register xxxx xxxx uuuu uuuu
TMR0H Timer0 Module High Byte Register 0000 0000 0000 0000
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u
T0CON TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0 1111 1111 1111 1111
TRISA RA7(1) RA6(1) — PORTA Data Direction Register 11-1 1111 11-1 1111
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by Timer0.
Note 1: RA6 and RA7 are enabled as I/O pins, depending on the oscillator mode selected in Configuration Word 1H.

© 2007 Microchip Technology Inc. DS39605F-page 101

PIC18F1220/1320
NOTES:

DS39605F-page 102 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
12.0 TIMER1 MODULE Register 12-1 details the Timer1 Control register. This
register controls the operating mode of the Timer1
The Timer1 module timer/counter has the following module and contains the Timer1 Oscillator Enable bit
features: (T1OSCEN). Timer1 can be enabled or disabled by
• 16-bit timer/counter setting or clearing control bit, TMR1ON (T1CON<0>).
(two 8-bit registers: TMR1H and TMR1L) The Timer1 oscillator can be used as a secondary clock
• Readable and writable (both registers) source in power managed modes. When the T1RUN bit
• Internal or external clock select is set, the Timer1 oscillator is providing the system
• Interrupt-on-overflow from FFFFh to 0000h clock. If the Fail-Safe Clock Monitor is enabled and the
Timer1 oscillator fails while providing the system clock,
• Reset from CCP module special event trigger
polling the T1RUN bit will indicate whether the clock is
• Status of system clock operation being provided by the Timer1 oscillator or another
Figure 12-1 is a simplified block diagram of the Timer1 source.
module. Timer1 can also be used to provide Real-Time Clock
(RTC) functionality to applications, with only a minimal
addition of external components and code overhead.

REGISTER 12-1: T1CON: TIMER1 CONTROL REGISTER

R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON
bit 7 bit 0

bit 7 RD16: 16-bit Read/Write Mode Enable bit

1 = Enables register read/write of TImer1 in one 16-bit operation
0 = Enables register read/write of Timer1 in two 8-bit operations
bit 6 T1RUN: Timer1 System Clock Status bit
1 = System clock is derived from Timer1 oscillator
0 = System clock is derived from another source
bit 5-4 T1CKPS1:T1CKPS0: Timer1 Input Clock Prescale Select bits
11 = 1:8 Prescale value
10 = 1:4 Prescale value
01 = 1:2 Prescale value
00 = 1:1 Prescale value
bit 3 T1OSCEN: Timer1 Oscillator Enable bit
1 = Timer1 oscillator is enabled
0 = Timer1 oscillator is shut off
The oscillator inverter and feedback resistor are turned off to eliminate power drain.
bit 2 T1SYNC: Timer1 External Clock Input Synchronization Select bit
When TMR1CS = 1:
1 = Do not synchronize external clock input
0 = Synchronize external clock input
When TMR1CS = 0:
This bit is ignored. Timer1 uses the internal clock when TMR1CS = 0.
bit 1 TMR1CS: Timer1 Clock Source Select bit
1 = External clock from pin RB6/PGC/T1OSO/T13CKI/P1C/KBI2 (on the rising edge)
0 = Internal clock (Fosc/4)
bit 0 TMR1ON: Timer1 On bit
1 = Enables Timer1
0 = Stops Timer1

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. DS39605F-page 103

PIC18F1220/1320
12.1 Timer1 Operation When TMR1CS = 0, Timer1 increments every instruc-
tion cycle. When TMR1CS = 1, Timer1 increments on
Timer1 can operate in one of these modes: every rising edge of the external clock input, or the
• As a timer Timer1 oscillator, if enabled.
• As a synchronous counter When the Timer1 oscillator is enabled (T1OSCEN is
• As an asynchronous counter set), the RB7/PGD/T1OSI/P1D/KBI3 and RB6/T1OSO/
T13CKI/P1C/KBI2 pins become inputs. That is, the
The operating mode is determined by the clock select
TRISB7:TRISB6 values are ignored and the pins read
bit, TMR1CS (T1CON<1>).
as ‘0’.
Timer1 also has an internal “Reset input”. This Reset
can be generated by the CCP module (see
Section 15.4.4 “Special Event Trigger”).

FIGURE 12-1: TIMER1 BLOCK DIAGRAM

TMR1IF CCP Special Event Trigger

Overflow Synchronized
Interrupt TMR1 0
Flag bit CLR Clock Input
TMR1H TMR1L
1
TMR1ON
On/Off T1SYNC
T1OSC
T13CKI/T1OSO 1
T1OSCEN Synchronize
Prescaler
T1OSI Enable FOSC/4 1, 2, 4, 8 det
Oscillator(1) Internal 0
Clock 2 Peripheral Clocks
T1CKPS1:T1CKPS0
TMR1CS

Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off. This eliminates
power drain.

FIGURE 12-2: TIMER1 BLOCK DIAGRAM: 16-BIT READ/WRITE MODE

Data Bus<7:0>
8

TMR1H
8
8
Write TMR1L
CCP Special Event Trigger
Read TMR1L

TMR1IF 8 TMR1 Synchronized

Overflow 0
CLR Clock Input
Interrupt Timer 1
Flag bit High Byte TMR1L
1
TMR1ON
on/off T1SYNC
T1OSC
T13CKI/T1OSO 1
Synchronize
Prescaler
T1OSCEN FOSC/4 1, 2, 4, 8 det
Enable Internal 0
T1OSI Oscillator(1) Clock 2
TMR1CS Peripheral Clocks
T1CKPS1:T1CKPS0

Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off. This eliminates power drain.

DS39605F-page 104 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
12.2 Timer1 Oscillator FIGURE 12-3: EXTERNAL
COMPONENTS FOR THE
A crystal oscillator circuit is built-in between pins T1OSI
TIMER1 LP OSCILLATOR
(input) and T1OSO (amplifier output). It is enabled by
setting control bit, T1OSCEN (T1CON<3>). The oscil- C1
PGD
PIC18FXXXX
lator is a low-power oscillator rated for 32 kHz crystals. 22 pF
It will continue to run during all power managed modes. PGD/T1OSI
The circuit for a typical LP oscillator is shown in
Figure 12-3. Table 12-1 shows the capacitor selection XTAL
for the Timer1 oscillator. 32.768 kHz

The user must provide a software time delay to ensure PGC/T1OSO

proper start-up of the Timer1 oscillator. C2 PGC
22 pF
Note: The Timer1 oscillator shares the T1OSI
and T1OSO pins with the PGD and PGC Note: See the Notes with Table 12-1 for additional
pins used for programming and information about capacitor selection.
debugging.
When using the Timer1 oscillator, In-Circuit TABLE 12-1: CAPACITOR SELECTION FOR
Serial Programming (ICSP) may not THE TIMER OSCILLATOR
function correctly (high voltage or low
voltage), or the In-Circuit Debugger (ICD) Osc Type Freq C1 C2
may not communicate with the controller. LP 32 kHz 22 pF(1) 22 pF(1)
As a result of using either ICSP or ICD, the
Timer1 crystal may be damaged. Note 1: Microchip suggests this value as a starting
If ICSP or ICD operations are required, the point in validating the oscillator circuit.
crystal should be disconnected from the Oscillator operation should then be tested
circuit (disconnect either lead), or installed to ensure expected performance under
after programming. The oscillator loading all expected conditions (VDD and
capacitors may remain in-circuit during temperature).
ICSP or ICD operation. 2: Higher capacitance increases the stability
of the oscillator, but also increases the
start-up time.
3: Since each resonator/crystal has its own
characteristics, the user should consult
the resonator/crystal manufacturer for
appropriate values of external
components.
4: Capacitor values are for design guidance
only.

© 2007 Microchip Technology Inc. DS39605F-page 105

PIC18F1220/1320
12.3 Timer1 Oscillator Layout 12.5 Resetting Timer1 Using a CCP
Considerations Trigger Output
The Timer1 oscillator circuit draws very little power If the CCP module is configured in Compare mode
during operation. Due to the low-power nature of the to generate a “special event trigger”
oscillator, it may also be sensitive to rapidly changing (CCP1M3:CCP1M0 = 1011), this signal will reset
signals in close proximity. Timer1 and start an A/D conversion, if the A/D mod-
The oscillator circuit, shown in Figure 12-3, should be ule is enabled (see Section 15.4.4 “Special Event
located as close as possible to the microcontroller. Trigger” for more information).
There should be no circuits passing within the oscillator Note: The special event triggers from the CCP1
circuit boundaries other than VSS or VDD. module will not set interrupt flag bit,
If a high-speed circuit must be located near the oscilla- TMR1IF (PIR1<0>).
tor (such as the CCP1 pin in output compare or PWM Timer1 must be configured for either Timer or Synchro-
mode, or the primary oscillator using the OSC2 pin), a nized Counter mode to take advantage of this feature.
grounded guard ring around the oscillator circuit, as If Timer1 is running in Asynchronous Counter mode,
shown in Figure 12-4, may be helpful when used on a this Reset operation may not work.
single sided PCB, or in addition to a ground plane.
In the event that a write to Timer1 coincides with a
special event trigger from CCP1, the write will take
FIGURE 12-4: OSCILLATOR CIRCUIT
precedence.
WITH GROUNDED
GUARD RING In this mode of operation, the CCPR1H:CCPR1L regis-
ter pair effectively becomes the period register for
RA1 RB2 Timer1.

RA4 C2
12.6 Timer1 16-Bit Read/Write Mode
OSC1
X1 Timer1 can be configured for 16-bit reads and writes
MCLR OSC2 C3
(see Figure 12-2). When the RD16 control bit
(T1CON<7>) is set, the address for TMR1H is mapped
to a buffer register for the high byte of Timer1. A read
VSS VDD C1
from TMR1L will load the contents of the high byte of
Timer1 into the Timer1 high byte buffer. This provides
the user with the ability to accurately read all 16 bits of
RA2 RB7 C4 Timer1 without having to determine whether a read of
X2
RA3 RB6 C5 the high byte, followed by a read of the low byte, is
valid, due to a rollover between reads.
A write to the high byte of Timer1 must also take place
RB0 RB5
through the TMR1H Buffer register. Timer1 high byte is
updated with the contents of TMR1H when a write
Note: Not drawn to scale. occurs to TMR1L. This allows a user to write all 16 bits
to both the high and low bytes of Timer1 at once.
The high byte of Timer1 is not directly readable or
12.4 Timer1 Interrupt writable in this mode. All reads and writes must take
The TMR1 register pair (TMR1H:TMR1L) increments place through the Timer1 High Byte Buffer register.
from 0000h to FFFFh and rolls over to 0000h. The Writes to TMR1H do not clear the Timer1 prescaler.
Timer1 interrupt, if enabled, is generated on overflow, The prescaler is only cleared on writes to TMR1L.
which is latched in interrupt flag bit, TMR1IF
(PIR1<0>). This interrupt can be enabled/disabled by
setting/clearing Timer1 Interrupt Enable bit, TMR1IE
(PIE1<0>).

DS39605F-page 106 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
12.7 Using Timer1 as a Since the register pair is 16 bits wide, counting up to
Real-Time Clock overflow the register directly from a 32.768 kHz clock
would take 2 seconds. To force the overflow at the
Adding an external LP oscillator to Timer1 (such as the required one-second intervals, it is necessary to pre-
one described in Section 12.2 “Timer1 Oscillator”, load it; the simplest method is to set the MSb of TMR1H
above), gives users the option to include RTC function- with a BSF instruction. Note that the TMR1L register is
ality to their applications. This is accomplished with an never preloaded or altered; doing so may introduce
inexpensive watch crystal to provide an accurate time cumulative error over many cycles.
base and several lines of application code to calculate
For this method to be accurate, Timer1 must operate in
the time. When operating in Sleep mode and using a
Asynchronous mode and the Timer1 overflow interrupt
battery or supercapacitor as a power source, it can
must be enabled (PIE1<0> = 1), as shown in the
completely eliminate the need for a separate RTC
routine, RTCinit. The Timer1 oscillator must also be
device and battery backup.
enabled and running at all times.
The application code routine, RTCisr, shown in
Example 12-1, demonstrates a simple method to
increment a counter at one-second intervals using an
Interrupt Service Routine. Incrementing the TMR1 reg-
ister pair to overflow, triggers the interrupt and calls the
routine, which increments the seconds counter by one;
additional counters for minutes and hours are
incremented as the previous counter overflow.

EXAMPLE 12-1: IMPLEMENTING A REAL-TIME CLOCK USING A TIMER1 INTERRUPT SERVICE

RTCinit
MOVLW 0x80 ; Preload TMR1 register pair
MOVWF TMR1H ; for 1 second overflow
CLRF TMR1L
MOVLW b’00001111’ ; Configure for external clock,
MOVWF T1OSC ; Asynchronous operation, external oscillator
CLRF secs ; Initialize timekeeping registers
CLRF mins ;
MOVLW .12
MOVWF hours
BSF PIE1, TMR1IE ; Enable Timer1 interrupt
RETURN
RTCisr
BSF TMR1H, 7 ; Preload for 1 sec overflow
BCF PIR1, TMR1IF ; Clear interrupt flag
INCF secs, F ; Increment seconds
MOVLW .59 ; 60 seconds elapsed?
CPFSGT secs
RETURN ; No, done
CLRF secs ; Clear seconds
INCF mins, F ; Increment minutes
MOVLW .59 ; 60 minutes elapsed?
CPFSGT mins
RETURN ; No, done
CLRF mins ; clear minutes
INCF hours, F ; Increment hours
MOVLW .23 ; 24 hours elapsed?
CPFSGT hours
RETURN ; No, done
MOVLW .01 ; Reset hours to 1
MOVWF hours
RETURN ; Done

© 2007 Microchip Technology Inc. DS39605F-page 107

PIC18F1220/1320
TABLE 12-2: REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER
Value on
Value on
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 all other
POR, BOR
Resets

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u
PIR1 — ADIF RCIF TXIF — CCP1IF TMR2IF TMR1IF -000 -000 -000 -000
PIE1 — ADIE RCIE TXIE — CCP1IE TMR2IE TMR1IE -000 -000 -000 -000
IPR1 — ADIP RCIP TXIP — CCP1IP TMR2IP TMR1IP -111 -111 -111 -111
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 u0uu uuuu
Legend: x = unknown, u = unchanged, – = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1 module.

DS39605F-page 108 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
13.0 TIMER2 MODULE 13.1 Timer2 Operation
The Timer2 module timer has the following features: Timer2 can be used as the PWM time base for the
PWM mode of the CCP module. The TMR2 register is
• 8-bit timer (TMR2 register)
readable and writable and is cleared on any device
• 8-bit period register (PR2) Reset. The input clock (FOSC/4) has a prescale option
• Readable and writable (both registers) of 1:1, 1:4 or 1:16, selected by control bits,
• Software programmable prescaler (1:1, 1:4, 1:16) T2CKPS1:T2CKPS0 (T2CON<1:0>). The match out-
• Software programmable postscaler (1:1 to 1:16) put of TMR2 goes through a 4-bit postscaler (which
• Interrupt on TMR2 match with PR2 gives a 1:1 to 1:16 scaling inclusive) to generate a
TMR2 interrupt (latched in flag bit, TMR2IF (PIR1<1>)).
Timer2 has a control register shown in Register 13-1.
TMR2 can be shut off by clearing control bit, TMR2ON The prescaler and postscaler counters are cleared
(T2CON<2>), to minimize power consumption. when any of the following occurs:
Figure 13-1 is a simplified block diagram of the Timer2 • A write to the TMR2 register
module. Register 13-1 shows the Timer2 Control • A write to the T2CON register
register. The prescaler and postscaler selection of • Any device Reset (Power-on Reset, MCLR Reset,
Timer2 are controlled by this register. Watchdog Timer Reset or Brown-out Reset)
TMR2 is not cleared when T2CON is written.

REGISTER 13-1: T2CON: TIMER2 CONTROL REGISTER

U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0
bit 7 bit 0

bit 7 Unimplemented: Read as ‘0’

bit 6-3 TOUTPS3:TOUTPS0: Timer2 Output Postscale Select bits
0000 = 1:1 Postscale
0001 = 1:2 Postscale
•
•
•
1111 = 1:16 Postscale
bit 2 TMR2ON: Timer2 On bit
1 = Timer2 is on
0 = Timer2 is off
bit 1-0 T2CKPS1:T2CKPS0: Timer2 Clock Prescale Select bits
00 = Prescaler is 1
01 = Prescaler is 4
1x = Prescaler is 16

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. DS39605F-page 109

PIC18F1220/1320
13.2 Timer2 Interrupt 13.3 Output of TMR2
The Timer2 module has an 8-bit period register, PR2. The output of TMR2 (before the postscaler) is fed to the
Timer2 increments from 00h until it matches PR2 and Synchronous Serial Port module, which optionally uses
then resets to 00h on the next increment cycle. PR2 is it to generate the shift clock.
a readable and writable register. The PR2 register is
initialized to FFh upon Reset.

FIGURE 13-1: TIMER2 BLOCK DIAGRAM

Sets Flag
TMR2
Output(1) bit TMR2IF

Prescaler Reset
FOSC/4 TMR2
1:1, 1:4, 1:16

2 Postscaler
Comparator
EQ 1:1 to 1:16
T2CKPS1:T2CKPS0
PR2 4

TOUTPS3:TOUTPS0

TABLE 13-1: REGISTERS ASSOCIATED WITH TIMER2 AS A TIMER/COUNTER

Value on
Value on
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 all other
POR, BOR
Resets
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u
PIR1 — ADIF RCIF TXIF — CCP1IF TMR2IF TMR1IF -000 -000 -000 -000
PIE1 — ADIE RCIE TXIE — CCP1IE TMR2IE TMR1IE -000 -000 -000 -000
IPR1 — ADIP RCIP TXIP — CCP1IP TMR2IP TMR1IP -111 -111 -111 -111
TMR2 Timer2 Module Register 0000 0000 0000 0000
T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
PR2 Timer2 Period Register 1111 1111 1111 1111
Legend: x = unknown, u = unchanged, – = unimplemented, read as ‘0’. Shaded cells are not used by the Timer2 module.

DS39605F-page 110 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
14.0 TIMER3 MODULE Figure 14-1 is a simplified block diagram of the Timer3
module.
The Timer3 module timer/counter has the following
Register 14-1 shows the Timer3 Control register. This
features:
register controls the operating mode of the Timer3
• 16-bit timer/counter module and sets the CCP clock source.
(two 8-bit registers; TMR3H and TMR3L)
Register 12-1 shows the Timer1 Control register. This
• Readable and writable (both registers) register controls the operating mode of the Timer1
• Internal or external clock select module, as well as contains the Timer1 Oscillator
• Interrupt-on-overflow from FFFFh to 0000h Enable bit (T1OSCEN), which can be a clock source for
• Reset from CCP module trigger Timer3.

REGISTER 14-1: T3CON: TIMER3 CONTROL REGISTER

R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
RD16 — T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON
bit 7 bit 0

bit 7 RD16: 16-bit Read/Write Mode Enable bit

1 = Enables register read/write of Timer3 in one 16-bit operation
0 = Enables register read/write of Timer3 in two 8-bit operations
bit 6 Unimplemented: Read as ‘0’
bit 5-4 T3CKPS1:T3CKPS0: Timer3 Input Clock Prescale Select bits
11 = 1:8 Prescale value
10 = 1:4 Prescale value
01 = 1:2 Prescale value
00 = 1:1 Prescale value
bit 3 T3CCP1: Timer3 and Timer1 to CCP1 Enable bits
1 = Timer3 is the clock source for compare/capture CCP module
0 = Timer1 is the clock source for compare/capture CCP module
bit 2 T3SYNC: Timer3 External Clock Input Synchronization Control bit
(Not usable if the system clock comes from Timer1/Timer3.)
When TMR3CS = 1:
1 = Do not synchronize external clock input
0 = Synchronize external clock input
When TMR3CS = 0:
This bit is ignored. Timer3 uses the internal clock when TMR3CS = 0.
bit 1 TMR3CS: Timer3 Clock Source Select bit
1 = External clock input from Timer1 oscillator or T13CKI
(on the rising edge after the first falling edge)
0 = Internal clock (FOSC/4)
bit 0 TMR3ON: Timer3 On bit
1 = Enables Timer3
0 = Stops Timer3

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. DS39605F-page 111

PIC18F1220/1320
14.1 Timer3 Operation When TMR3CS = 0, Timer3 increments every instruc-
tion cycle. When TMR3CS = 1, Timer3 increments on
Timer3 can operate in one of these modes: every rising edge of the Timer1 external clock input or
• As a timer the Timer1 oscillator, if enabled.
• As a synchronous counter When the Timer1 oscillator is enabled (T1OSCEN is
• As an asynchronous counter set), the RB7/PGD/T1OSI/P1D/KBI3 and RB6/PGC/
T1OSO/T13CKI/P1C/KBI2 pins become inputs. That
The operating mode is determined by the clock select
is, the TRISB7:TRISB6 value is ignored and the pins
bit, TMR3CS (T3CON<1>).
are read as ‘0’.
Timer3 also has an internal “Reset input”. This Reset
can be generated by the CCP module (see
Section 15.4.4 “Special Event Trigger”).

FIGURE 14-1: TIMER3 BLOCK DIAGRAM

CCP Special Event Trigger
TMR3IF
T3CCPx
Overflow
Interrupt Synchronized
0
Flag bit CLR Clock Input
TMR3H TMR3L
1
TMR3ON
On/Off T3SYNC

T1OSC
T1OSO/
T13CKI 1
Synchronize
Prescaler
T1OSCEN FOSC/4 1, 2, 4, 8 det
Enable Internal 0
T1OSI Oscillator(1) Clock 2
TMR3CS Peripheral Clocks
T3CKPS1:T3CKPS0
Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off. This eliminates power drain.

FIGURE 14-2: TIMER3 BLOCK DIAGRAM CONFIGURED IN 16-BIT READ/WRITE MODE

Data Bus<7:0>
8

TMR3H
8
8
Write TMR3L
Read TMR3L
CCP Special Event Trigger
8 T3CCPx Synchronized
Set TMR3IF Flag bit TMR3 0
on Overflow Timer3 CLR Clock Input
High Byte TMR3L
1
To Timer1 Clock Input TMR3ON
On/Off T3SYNC
T1OSC
T1OSO/
T13CKI 1
Synchronize
Prescaler
T1OSCEN FOSC/4 1, 2, 4, 8 det
Enable Internal 0
T1OSI Oscillator(1) Clock 2 Peripheral
T3CKPS1:T3CKPS0 Clocks
TMR3CS
Note 1: When the T1OSCEN bit is cleared, the inverter and feedback resistor are turned off. This eliminates power drain.

DS39605F-page 112 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
14.2 Timer1 Oscillator 14.4 Resetting Timer3 Using a CCP
The Timer1 oscillator may be used as the clock source
Trigger Output
for Timer3. The Timer1 oscillator is enabled by setting If the CCP module is configured in Compare mode
the T1OSCEN (T1CON<3>) bit. The oscillator is a low- to generate a “special event trigger”
power oscillator rated for 32 kHz crystals. See (CCP1M3:CCP1M0 = 1011), this signal will reset
Section 12.2 “Timer1 Oscillator” for further details. Timer3. See Section 15.4.4 “Special Event Trigger”
for more information.
14.3 Timer3 Interrupt
Note: The special event triggers from the CCP
The TMR3 register pair (TMR3H:TMR3L) increments module will not set interrupt flag bit,
from 0000h to FFFFh and rolls over to 0000h. The TMR3IF (PIR1<0>).
TMR3 interrupt, if enabled, is generated on overflow,
Timer3 must be configured for either Timer or Synchro-
which is latched in interrupt flag bit, TMR3IF
nized Counter mode to take advantage of this feature.
(PIR2<1>). This interrupt can be enabled/disabled by
If Timer3 is running in Asynchronous Counter mode,
setting/clearing TMR3 Interrupt Enable bit, TMR3IE
this Reset operation may not work. In the event that a
(PIE2<1>).
write to Timer3 coincides with a special event trigger
from CCP1, the write will take precedence. In this mode
of operation, the CCPR1H:CCPR1L register pair
effectively becomes the period register for Timer3.

TABLE 14-1: REGISTERS ASSOCIATED WITH TIMER3 AS A TIMER/COUNTER

Value on
Value on
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 all other
POR, BOR
Resets
INTCON GIE/ PEIE/ TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u
GIEH GIEL
PIR2 OSCFIF — — EEIF — LVDIF TMR3IF — 0--0 -00- 0--0 -00-
PIE2 OSCFIE — — EEIE — LVDIE TMR3IE — 0--0 -00- 0--0 -00-
IPR2 OSCFIP — — EEIP — LVDIP TMR3IP — 1--1 -11- 1--1 -11-
TMR3L Holding Register for the Least Significant Byte of the 16-bit TMR3 Register xxxx xxxx uuuu uuuu
TMR3H Holding Register for the Most Significant Byte of the 16-bit TMR3 Register xxxx xxxx uuuu uuuu
T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 u0uu uuuu
T3CON RD16 — T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 0-00 0000 u-uu uuuu
Legend: x = unknown, u = unchanged, – = unimplemented, read as ‘0’. Shaded cells are not used by the Timer3 module.

© 2007 Microchip Technology Inc. DS39605F-page 113

PIC18F1220/1320
NOTES:

DS39605F-page 114 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
15.0 ENHANCED CAPTURE/ The control register for CCP1 is shown in Register 15-1.
COMPARE/PWM (ECCP) In addition to the expanded functions of the CCP1CON
MODULE register, the ECCP module has two additional
registers associated with Enhanced PWM operation
The Enhanced CCP module is implemented as a and auto-shutdown features:
standard CCP module with Enhanced PWM • PWM1CON
capabilities. These capabilities allow for 2 or 4 output
• ECCPAS
channels, user-selectable polarity, dead-band control
and automatic shutdown and restart and are discussed
in detail in Section 15.5 “Enhanced PWM Mode”.

REGISTER 15-1: CCP1CON REGISTER FOR ENHANCED CCP OPERATION

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0
bit 7 bit 0

bit 7-6 P1M1:P1M0: PWM Output Configuration bits

If CCP1M<3:2> = 00, 01, 10:
xx = P1A assigned as Capture/Compare input; P1B, P1C, P1D assigned as port pins
If CCP1M<3:2> = 11:
00 = Single output; P1A modulated; P1B, P1C, P1D assigned as port pins
01 = Full-bridge output forward; P1D modulated; P1A active; P1B, P1C inactive
10 = Half-bridge output; P1A, P1B modulated with dead-band control; P1C, P1D assigned as
port pins
11 = Full-bridge output reverse; P1B modulated; P1C active; P1A, P1D inactive
bit 5-4 DC1B1:DC1B0: PWM Duty Cycle Least Significant bits
Capture mode:
Unused.
Compare mode:
Unused.
PWM mode:
These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPR1L.
bit 3-0 CCP1M3:CCP1M0: ECCP1 Mode Select bits
0000 = Capture/Compare/PWM off (resets ECCP module)
0001 = Unused (reserved)
0010 = Compare mode, toggle output on match (ECCP1IF bit is set)
0011 = Unused (reserved)
0100 = Capture mode, every falling edge
0101 = Capture mode, every rising edge
0110 = Capture mode, every 4th rising edge
0111 = Capture mode, every 16th rising edge
1000 = Compare mode, set output on match (ECCP1IF bit is set)
1001 = Compare mode, clear output on match (ECCP1IF bit is set)
1010 = Compare mode, generate software interrupt on match (ECCP1IF bit is set,
ECCP1 pin returns to port pin operation)
1011 = Compare mode, trigger special event (ECCP1IF bit is set; ECCP resets TMR1 or
TMR3 and starts an A/D conversion if the A/D module is enabled)
1100 = PWM mode; P1A, P1C active-high; P1B, P1D active-high
1101 = PWM mode; P1A, P1C active-high; P1B, P1D active-low
1110 = PWM mode; P1A, P1C active-low; P1B, P1D active-high
1111 = PWM mode; P1A, P1C active-low; P1B, P1D active-low

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. DS39605F-page 115

PIC18F1220/1320
15.1 ECCP Outputs To configure I/O pins as PWM outputs, the proper PWM
mode must be selected by setting the P1Mn and
The Enhanced CCP module may have up to four CCP1Mn bits (CCP1CON<7:6> and <3:0>,
outputs, depending on the selected operating mode. respectively). The appropriate TRISB direction bits for
These outputs, designated P1A through P1D, are the port pins must also be set as outputs.
multiplexed with I/O pins on PORTB. The pin
assignments are summarized in Table 15-1.

TABLE 15-1: PIN ASSIGNMENTS FOR VARIOUS ECCP MODES

CCP1CON
ECCP Mode RB3 RB2 RB6 RB7
Configuration

Compatible CCP 00xx 11xx CCP1 RB2/INT2 RB6/PGC/T1OSO/T13CKI/KBI2 RB7/PGD/T1OSI/KBI3

Dual PWM 10xx 11xx P1A P1B RB6/PGC/T1OSO/T13CKI/KBI2 RB7/PGD/T1OSI/KBI3
Quad PWM x1xx 11xx P1A P1B P1C P1D
Legend: x = Don’t care. Shaded cells indicate pin assignments not used by ECCP in a given mode.
Note 1: TRIS register values must be configured appropriately.

15.2 CCP Module 15.3.1 CCP PIN CONFIGURATION

Capture/Compare/PWM Register 1 (CCPR1) is com- In Capture mode, the RB3/CCP1/P1A pin should be
prised of two 8-bit registers: CCPR1L (low byte) and configured as an input by setting the TRISB<3> bit.
CCPR1H (high byte). The CCP1CON register controls Note: If the RB3/CCP1/P1A is configured as an
the operation of CCP1. All are readable and writable. output, a write to the port can cause a
capture condition.
TABLE 15-2: CCP MODE – TIMER
RESOURCE 15.3.2 TIMER1/TIMER3 MODE SELECTION
CCP Mode Timer Resource The timers that are to be used with the capture feature
(either Timer1 and/or Timer3) must be running in Timer
Capture Timer1 or Timer3
mode or Synchronized Counter mode. In Asynchro-
Compare Timer1 or Timer3
nous Counter mode, the capture operation may not
PWM Timer2
work. The timer to be used with the CCP module is
selected in the T3CON register.
15.3 Capture Mode
15.3.3 SOFTWARE INTERRUPT
In Capture mode, CCPR1H:CCPR1L captures the 16-bit
value of the TMR1 or TMR3 registers when an event When the Capture mode is changed, a false capture
occurs on pin RB3/CCP1/P1A. An event is defined as interrupt may be generated. The user should keep bit,
one of the following: CCP1IE (PIE1<2>), clear while changing capture
modes to avoid false interrupts and should clear the
• every falling edge
flag bit, CCP1IF, following any such change in
• every rising edge operating mode.
• every 4th rising edge
• every 16th rising edge
The event is selected by control bits, CCP1M3:CCP1M0
(CCP1CON<3:0>). When a capture is made, the inter-
rupt request flag bit, CCP1IF (PIR1<2>), is set; it must
be cleared in software. If another capture occurs before
the value in register CCPR1 is read, the old captured
value is overwritten by the new captured value.

DS39605F-page 116 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
15.3.4 CCP PRESCALER recommended method for switching between capture
prescalers. This example also clears the prescaler
There are four prescaler settings, specified by bits
counter and will not generate the “false” interrupt.
CCP1M3:CCP1M0. Whenever the CCP module is
turned off or the CCP module is not in Capture mode,
the prescaler counter is cleared. This means that any EXAMPLE 15-1: CHANGING BETWEEN
Reset will clear the prescaler counter. CAPTURE PRESCALERS
CLRF CCP1CON ; Turn CCP module off
Switching from one capture prescaler to another may
MOVLW NEW_CAPT_PS ; Load WREG with the
generate an interrupt. Also, the prescaler counter will ; new prescaler mode
not be cleared; therefore, the first capture may be from ; value and CCP ON
a non-zero prescaler. Example 15-1 shows the MOVWF CCP1CON ; Load CCP1CON with
; this value

FIGURE 15-1: CAPTURE MODE OPERATION BLOCK DIAGRAM

TMR3H TMR3L
Set Flag bit CCP1IF
T3CCP1 TMR3
Prescaler
Enable
÷ 1, 4, 16
CCP1 pin CCPR1H CCPR1L

TMR1
and T3CCP1 Enable
Edge Detect
TMR1H TMR1L
CCP1CON<3:0>
Q’s

15.4 Compare Mode 15.4.2 TIMER1/TIMER3 MODE SELECTION

In Compare mode, the 16-bit CCPR1 register value is Timer1 and/or Timer3 must be running in Timer mode
constantly compared against either the TMR1 register or Synchronized Counter mode if the CCP module is
pair value, or the TMR3 register pair value. When a using the compare feature. In Asynchronous Counter
match occurs, the RB3/CCP1/P1A pin: mode, the compare operation may not work.

• Is driven high 15.4.3 SOFTWARE INTERRUPT MODE

• Is driven low
When generate software interrupt is chosen, the RB3/
• Toggles output (high-to-low or low-to-high) CCP1/P1A pin is not affected. CCP1IF is set and an
• Remains unchanged (interrupt only) interrupt is generated (if enabled).
The action on the pin is based on the value of control
bits, CCP1M3:CCP1M0. At the same time, interrupt 15.4.4 SPECIAL EVENT TRIGGER
flag bit, CCP1IF, is set. In this mode, an internal hardware trigger is generated,
which may be used to initiate an action.
15.4.1 CCP PIN CONFIGURATION
The special event trigger output of CCP1 resets the
The user must configure the RB3/CCP1/P1A pin as an TMR1 register pair. This allows the CCPR1 register to
output by clearing the TRISB<3> bit. effectively be a 16-bit programmable period register for
Timer1.
Note: Clearing the CCP1CON register will force
the RB3/CCP1/P1A compare output latch The special event trigger also sets the GO/DONE bit
to the default low level. This is not the (ADCON0<1>). This starts a conversion of the
PORTB I/O data latch. currently selected A/D channel if the A/D is on.

© 2007 Microchip Technology Inc. DS39605F-page 117

PIC18F1220/1320
FIGURE 15-2: COMPARE MODE OPERATION BLOCK DIAGRAM

Special Event Trigger will:

Reset Timer1 or Timer3, but does not set Timer1 or Timer3 interrupt flag bit
and set bit GO/DONE (ADCON0<2>), which starts an A/D conversion.

Special Event Trigger

Set Flag bit CCP1IF

CCPR1H CCPR1L

Q S Output
Logic Comparator
RB3/CCP1/P1A pin R Match

TRISB<3>
Output Enable CCP1CON<3:0> T3CCP1 0 1
Mode Select

TMR1H TMR1L TMR3H TMR3L

TABLE 15-3: REGISTERS ASSOCIATED WITH CAPTURE, COMPARE, TIMER1 AND TIMER3
Value on
Value on
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 all other
POR, BOR
Resets
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u
PIR1 — ADIF RCIF TXIF — CCP1IF TMR2IF TMR1IF -000 -000 -000 -000
PIE1 — ADIE RCIE TXIE — CCP1IE TMR2IE TMR1IE -000 -000 -000 -000
IPR1 — ADIP RCIP TXIP — CCP1IP TMR2IP TMR1IP -111 -111 -111 -111
TRISB PORTB Data Direction Register 1111 1111 1111 1111
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 uuuu uuuu
CCPR1L Capture/Compare/PWM Register 1 (LSB) xxxx xxxx uuuu uuuu
CCPR1H Capture/Compare/PWM Register 1 (MSB) xxxx xxxx uuuu uuuu
CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 0000 0000
TMR3L Holding Register for the Least Significant Byte of the 16-bit TMR3 Register xxxx xxxx uuuu uuuu
TMR3H Holding Register for the Most Significant Byte of the 16-bit TMR3 Register xxxx xxxx uuuu uuuu
T3CON RD16 — T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 0-00 0000 u-uu uuuu
ADCON0 VCFG1 VCFG0 — CHS2 CHS1 CHS0 GO/DONE ADON 00-0 0000 00-0 0000
Legend: x = unknown, u = unchanged, – = unimplemented, read as ‘0’. Shaded cells are not used by Capture and Timer1.

DS39605F-page 118 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
15.5 Enhanced PWM Mode 15.5.2 PWM DUTY CYCLE
The Enhanced PWM Mode provides additional PWM The PWM duty cycle is specified by writing to the
output options for a broader range of control applica- CCPR1L register and to the CCP1CON<5:4> bits. Up
tions. The module is an upwardly compatible version of to 10-bit resolution is available. The CCPR1L contains
the standard CCP module and offers up to four outputs, the eight MSbs and the CCP1CON<5:4> contains the
designated P1A through P1D. Users are also able to two LSbs. This 10-bit value is represented by
select the polarity of the signal (either active-high or CCPR1L:CCP1CON<5:4>. The PWM duty cycle is
active-low). The module’s output mode and polarity are calculated by the equation:
configured by setting the P1M1:P1M0 and EQUATION 15-2: PWM DUTY CYCLE
CCP1M3CCP1M0 bits of the CCP1CON register
PWM Duty Cycle = (CCPR1L:CCP1CON<5:4>) •
(CCP1CON<7:6> and CCP1CON<3:0>, respectively).
TOSC • (TMR2 Prescale Value)
Figure 15-3 shows a simplified block diagram of PWM
operation. All control registers are double-buffered and CCPR1L and CCP1CON<5:4> can be written to at any
are loaded at the beginning of a new PWM cycle (the time, but the duty cycle value is not copied into
period boundary when Timer2 resets) in order to prevent CCPR1H until a match between PR2 and TMR2 occurs
glitches on any of the outputs. The exception is the PWM (i.e., the period is complete). In PWM mode, CCPR1H
Delay register, ECCP1DEL, which is loaded at either the is a read-only register.
duty cycle boundary or the boundary period (whichever The CCPR1H register and a 2-bit internal latch are
comes first). Because of the buffering, the module waits used to double-buffer the PWM duty cycle. This
until the assigned timer resets instead of starting imme- double-buffering is essential for glitchless PWM
diately. This means that Enhanced PWM waveforms do operation. When the CCPR1H and 2-bit latch match
not exactly match the standard PWM waveforms, but TMR2, concatenated with an internal 2-bit Q clock or
are instead offset by one full instruction cycle (4 TOSC). two bits of the TMR2 prescaler, the CCP1 pin is
As before, the user must manually configure the cleared. The maximum PWM resolution (bits) for a
appropriate TRIS bits for output. given PWM frequency is given by the equation:

15.5.1 PWM PERIOD EQUATION 15-3: PWM RESOLUTION

The PWM period is specified by writing to the PR2 log FOSC
( ) bits
FPWM
register. The PWM period can be calculated using the PWM Resolution (max) =
equation: log(2)

EQUATION 15-1: PWM PERIOD

Note: If the PWM duty cycle value is longer than
PWM Period = [(PR2) + 1] • 4 • TOSC •
the PWM period, the CCP1 pin will not be
(TMR2 Prescale Value)
cleared.
PWM frequency is defined as 1/[PWM period]. When
TMR2 is equal to PR2, the following three events occur
15.5.3 PWM OUTPUT CONFIGURATIONS
on the next increment cycle: The P1M1:P1M0 bits in the CCP1CON register allow
• TMR2 is cleared one of four configurations:
• The CCP1 pin is set (if PWM duty cycle = 0%, the • Single Output
CCP1 pin will not be set) • Half-Bridge Output
• The PWM duty cycle is copied from CCPR1L into • Full-Bridge Output, Forward mode
CCPR1H • Full-Bridge Output, Reverse mode
Note: The Timer2 postscaler (see Section 13.0 The Single Output mode is the Standard PWM mode
“Timer2 Module”) is not used in the discussed in Section 15.5 “Enhanced PWM Mode”.
determination of the PWM frequency. The The Half-Bridge and Full-Bridge Output modes are
postscaler could be used to have a servo covered in detail in the sections that follow.
update rate at a different frequency than The general relationship of the outputs in all
the PWM output. configurations is summarized in Figure 15-4.

TABLE 15-4: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 40 MHz

PWM Frequency 2.44 kHz 9.77 kHz 39.06 kHz 156.25 kHz 312.50 kHz 416.67 kHz
Timer Prescaler (1, 4, 16) 16 4 1 1 1 1
PR2 Value FFh FFh FFh 3Fh 1Fh 17h
Maximum Resolution (bits) 10 10 10 8 7 6.58

© 2007 Microchip Technology Inc. DS39605F-page 119

PIC18F1220/1320
FIGURE 15-3: SIMPLIFIED BLOCK DIAGRAM OF THE ENHANCED PWM MODULE

CCP1CON<5:4> P1M1<1:0> CCP1M<3:0>

Duty Cycle Registers
2 4
CCPR1L
CCP1/P1A RB3/CCP1/P1A

TRISB<3>

CCPR1H (Slave)
P1B RB2/P1B/INT2

Output TRISB<2>
Comparator R Q
Controller
RB6/PGC/T1OSO/T13CKI/
P1C
P1C/KBI2
TMR2 (Note 1)
S TRISB<6>

P1D RB7/PGD/T1OSI/P1D/KBI3
Comparator
Clear Timer, TRISB<7>
set CCP1 pin and
latch D.C.
PR2 CCP1DEL

Note: The 8-bit TMR2 register is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler to create the
10-bit time base.

FIGURE 15-4: PWM OUTPUT RELATIONSHIPS (ACTIVE-HIGH STATE)

0 PR2+1
SIGNAL Duty
CCP1CON<7:6>
Cycle
Period

00 (Single Output) P1A Modulated

Delay(1) Delay(1)
P1A Modulated

10 (Half-Bridge) P1B Modulated

P1A Active

(Full-Bridge, P1B Inactive

01 Forward)
P1C Inactive

P1D Modulated

P1A Inactive

(Full-Bridge, P1B Modulated

11
Reverse)
P1C Active

P1D Inactive

DS39605F-page 120 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 15-5: PWM OUTPUT RELATIONSHIPS (ACTIVE-LOW STATE)
0 PR2+1
SIGNAL Duty
CCP1CON<7:6>
Cycle
Period

00 (Single Output) P1A Modulated

P1A Modulated
Delay(1) Delay(1)
10 (Half-Bridge) P1B Modulated

P1A Active

(Full-Bridge, P1B Inactive

01 Forward)
P1C Inactive

P1D Modulated

P1A Inactive

(Full-Bridge, P1B Modulated

11
Reverse)
P1C Active

P1D Inactive

Relationships:
• Period = 4 * TOSC * (PR2 + 1) * (TMR2 Prescale Value)
• Duty Cycle = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value)
• Delay = 4 * TOSC * (PWM1CON<6:0>)
Note 1: Dead-band delay is programmed using the PWM1CON register (Section 15.5.6 “Programmable Dead-Band
Delay”).

© 2007 Microchip Technology Inc. DS39605F-page 121

PIC18F1220/1320
15.5.4 HALF-BRIDGE MODE The TRISB<3> and TRISB<2> bits must be cleared to
configure P1A and P1B as outputs.
In the Half-Bridge Output mode, two pins are used as
outputs to drive push-pull loads. The PWM output
signal is output on the RB3/CCP1/P1A pin, while the FIGURE 15-6: HALF-BRIDGE PWM
complementary PWM output signal is output on the OUTPUT (ACTIVE-HIGH)
RB2/P1B/INT2 pin (Figure 15-6). This mode can be Period Period
used for half-bridge applications, as shown in
Figure 15-7, or for full-bridge applications, where four Duty Cycle
power switches are being modulated with two PWM P1A
signals. td
In Half-Bridge Output mode, the programmable dead- td
band delay can be used to prevent shoot-through P1B
current in half-bridge power devices. The value of bits,
PDC6:PDC0 (PWM1CON<6:0>), sets the number of (1) (1) (1)
instruction cycles before the output is driven active. If the
value is greater than the duty cycle, the corresponding td = Dead-Band Delay
output remains inactive during the entire cycle. See
Section 15.5.6 “Programmable Dead-Band Delay” Note 1: At this time, the TMR2 register is equal to the
for more details of the dead-band delay operations. PR2 register.

FIGURE 15-7: EXAMPLES OF HALF-BRIDGE OUTPUT MODE APPLICATIONS

Standard Half-Bridge Circuit (“Push-Pull”)

PIC18F1220/1320 FET
Driver +
P1A V
-

Load
FET
Driver
+
P1B V
-

Half-Bridge Output Driving a Full-Bridge Circuit

V+

PIC18F1220/1320
FET FET
Driver Driver
P1A

Load
FET FET
Driver Driver
P1B

V-

DS39605F-page 122 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
15.5.5 FULL-BRIDGE MODE The TRISB<3:2> and TRISB<7:6> bits must be cleared
to make the P1A, P1B, P1C and P1D pins output.
In Full-Bridge Output mode, four pins are used as
outputs; however, only two outputs are active at a time.
In the Forward mode, pin RB3/CCP1/P1A is continu-
ously active and pin RB7/PGD/T1OSI/P1D/KBI3 is
modulated. In the Reverse mode, pin RB6/PGC/
T1OSO/T13CKI/P1C/KBI2 is continuously active and
pin RB2/P1B/INT2 is modulated. These are illustrated
in Figure 15-8.

FIGURE 15-8: FULL-BRIDGE PWM OUTPUT (ACTIVE-HIGH)

Forward Mode
Period

P1A
Duty Cycle

P1B

P1C

P1D

(1) (1)

Reverse Mode

Period
Duty Cycle

P1A

P1B

P1C

P1D
(1) (1)

Note 1: At this time, the TMR2 register is equal to the PR2 register.

© 2007 Microchip Technology Inc. DS39605F-page 123

PIC18F1220/1320
FIGURE 15-9: EXAMPLE OF FULL-BRIDGE APPLICATION
V+

PIC18F1220/1320 FET QA QC FET

Driver Driver
P1A

Load
P1B
FET FET
Driver Driver

P1C
QB QD

V-
P1D

15.5.5.1 Direction Change in Full-Bridge Mode Figure 15-11 shows an example where the PWM direc-
tion changes from forward to reverse, at a near 100%
In the Full-Bridge Output mode, the P1M1 bit in the
duty cycle. At time t1, the output P1A and P1D become
CCP1CON register allows the user to control the
inactive, while output P1C becomes active. In this
Forward/Reverse direction. When the application
example, since the turn-off time of the power devices is
firmware changes this direction control bit, the module
longer than the turn-on time, a shoot-through current
will assume the new direction on the next PWM cycle.
may flow through power devices QC and QD (see
Just before the end of the current PWM period, the Figure 15-9) for the duration of ‘t’. The same phenom-
modulated outputs (P1B and P1D) are placed in their enon will occur to power devices QA and QB for PWM
inactive state, while the unmodulated outputs (P1A and direction change from reverse to forward.
P1C) are switched to drive in the opposite direction.
If changing PWM direction at high duty cycle is required
This occurs in a time interval of (4 TOSC * (Timer2
for an application, one of the following requirements
Prescale Value) before the next PWM period begins.
must be met:
The Timer2 prescaler will be either 1,4 or 16, depend-
ing on the value of the T2CKPS bit (T2CON<1:0>). 1. Reduce PWM for a PWM period before
During the interval from the switch of the unmodulated changing directions.
outputs to the beginning of the next period, the 2. Use switch drivers that can drive the switches off
modulated outputs (P1B and P1D) remain inactive. faster than they can drive them on.
This relationship is shown in Figure 15-10.
Other options to prevent shoot-through current may
Note that in the Full-Bridge Output mode, the ECCP exist.
module does not provide any dead-band delay. In
general, since only one output is modulated at all times,
dead-band delay is not required. However, there is a
situation where a dead-band delay might be required.
This situation occurs when both of the following
conditions are true:
1. The direction of the PWM output changes when
the duty cycle of the output is at or near 100%.
2. The turn-off time of the power switch, including
the power device and driver circuit, is greater
than the turn-on time.

DS39605F-page 124 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 15-10: PWM DIRECTION CHANGE (ACTIVE-HIGH)

SIGNAL PWM Period(1) PWM Period

P1A

P1B
DC
P1C

One Timer2 Count(2)

P1D

DC

Note 1: The direction bit in the CCP1 Control register (CCP1CON<7>) is written any time during the PWM cycle.
2: When changing directions, the P1A and P1C toggle one Timer2 count before the end of the current PWM cycle.
The modulated P1B and P1D signals are inactive at this time.

FIGURE 15-11: PWM DIRECTION CHANGE AT NEAR 100% DUTY CYCLE (ACTIVE-HIGH)

Forward Period t1 Reverse Period

P1A

P1B DC

P1C

P1D DC
tON
External Switch C
tOFF

External Switch D

Potential t = tOFF – tON

Shoot-Through
Current

Note 1: tON is the turn-on delay of power switch QC and its driver.
2: tOFF is the turn-off delay of power switch QD and its driver.

© 2007 Microchip Technology Inc. DS39605F-page 125

PIC18F1220/1320
15.5.6 PROGRAMMABLE DEAD-BAND A shutdown event can be caused by the INT0, INT1 or
DELAY INT2 pins (or any combination of these three sources).
The auto-shutdown feature can be disabled by not
In half-bridge applications where all power switches are
selecting any auto-shutdown sources. The auto-
modulated at the PWM frequency at all times, the
shutdown sources to be used are selected using the
power switches normally require more time to turn off
ECCPAS2:ECCPAS0 bits (bits <6:4> of the ECCPAS
than to turn on. If both the upper and lower power
register).
switches are switched at the same time (one turned on
and the other turned off), both switches may be on for When a shutdown occurs, the output pins are
a short period of time until one switch completely turns asynchronously placed in their shutdown states, spec-
off. During this brief interval, a very high current (shoot- ified by the PSSAC1:PSSAC0 and PSSBD1:PSSBD0
through current) may flow through both power bits (ECCPAS<3:0>). Each pin pair (P1A/P1C and
switches, shorting the bridge supply. To avoid this P1B/P1D) may be set to drive high, drive low or be tri-
potentially destructive shoot-through current from flow- stated (not driving). The ECCPASE bit (ECCPAS<7>)
ing during switching, turning on either of the power is also set to hold the Enhanced PWM outputs in their
switches is normally delayed to allow the other switch shutdown states.
to completely turn off. The ECCPASE bit is set by hardware when a shutdown
In the Half-Bridge Output mode, a digitally programmable event occurs. If automatic restarts are not enabled, the
dead-band delay is available to avoid shoot-through ECCPASE bit is cleared by firmware when the cause of
current from destroying the bridge power switches. The the shutdown clears. If automatic restarts are enabled,
delay occurs at the signal transition from the non-active the ECCPASE bit is automatically cleared when the
state to the active state. See Figure 15-6 for an illustra- cause of the auto-shutdown has cleared.
tion. The lower seven bits of the PWM1CON register If the ECCPASE bit is set when a PWM period begins,
(Register 15-2) sets the delay period in terms of the PWM outputs remain in their shutdown state for that
microcontroller instruction cycles (TCY or 4 TOSC). entire PWM period. When the ECCPASE bit is cleared,
the PWM outputs will return to normal operation at the
15.5.7 ENHANCED PWM beginning of the next PWM period.
AUTO-SHUTDOWN
Note: Writing to the ECCPASE bit is disabled
When the ECCP is programmed for any of the while a shutdown condition is active.
Enhanced PWM modes, the active output pins may be
configured for auto-shutdown. Auto-shutdown immedi-
ately places the Enhanced PWM output pins into a
defined shutdown state when a shutdown event
occurs.

REGISTER 15-2: PWM1CON: PWM CONFIGURATION REGISTER

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0
bit 7 bit 0

bit 7 PRSEN: PWM Restart Enable bit

1 = Upon auto-shutdown, the ECCPASE bit clears automatically once the shutdown event
goes away; the PWM restarts automatically
0 = Upon auto-shutdown, ECCPASE must be cleared in software to restart the PWM
bit 6-0 PDC<6:0>: PWM Delay Count bits
Number of FOSC/4 (4 * TOSC) cycles between the scheduled time when a PWM signal should
transition active and the actual time it transitions active.

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

DS39605F-page 126 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
REGISTER 15-3: ECCPAS: ENHANCED CAPTURE/COMPARE/PWM/AUTO-SHUTDOWN
CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0
bit 7 bit 0

bit 7 ECCPASE: ECCP Auto-Shutdown Event Status bit

0 = ECCP outputs are operating
1 = A shutdown event has occurred; ECCP outputs are in shutdown state
bit 6 ECCPAS2: ECCP Auto-Shutdown bit 2
0 = INT0 pin has no effect
1 = INT0 pin low causes shutdown
bit 5 ECCPAS1: ECCP Auto-Shutdown bit 1
0 = INT2 pin has no effect
1 = INT2 pin low causes shutdown
bit 4 ECCPAS0: ECCP Auto-Shutdown bit 0
0 = INT1 pin has no effect
1 = INT1 pin low causes shutdown
bit 3-2 PSSACn: Pins A and C Shutdown State Control bits
00 = Drive Pins A and C to ‘0’
01 = Drive Pins A and C to ‘1’
1x = Pins A and C tri-state
bit 1-0 PSSBDn: Pins B and D Shutdown State Control bits
00 = Drive Pins B and D to ‘0’
01 = Drive Pins B and D to ‘1’
1x = Pins B and D tri-state

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. DS39605F-page 127

PIC18F1220/1320
15.5.7.1 Auto-Shutdown and 15.5.8 START-UP CONSIDERATIONS
Automatic Restart When the ECCP module is used in the PWM mode, the
The auto-shutdown feature can be configured to allow application hardware must use the proper external pull-
automatic restarts of the module, following a shutdown up and/or pull-down resistors on the PWM output pins.
event. This is enabled by setting the PRSEN bit of the When the microcontroller is released from Reset, all of
PWM1CON register (PWM1CON<7>). the I/O pins are in the high-impedance state. The
external circuits must keep the power switch devices in
In Shutdown mode with PRSEN = 1 (Figure 15-12), the
the off state, until the microcontroller drives the I/O pins
ECCPASE bit will remain set for as long as the cause
with the proper signal levels, or activates the PWM
of the shutdown continues. When the shutdown
output(s).
condition clears, the ECCPASE bit is automatically
cleared. If PRSEN = 0 (Figure 15-13), once a shutdown The CCP1M1:CCP1M0 bits (CCP1CON<1:0>) allow
condition occurs, the ECCPASE bit will remain set until the user to choose whether the PWM output signals are
it is cleared by firmware. Once ECCPASE is cleared, active-high or active-low for each pair of PWM output
the Enhanced PWM will resume at the beginning of the pins (P1A/P1C and P1B/P1D). The PWM output
next PWM period. polarities must be selected before the PWM pins are
configured as outputs. Changing the polarity configura-
Note: Writing to the ECCPASE bit is disabled tion while the PWM pins are configured as outputs is
while a shutdown condition is active. not recommended, since it may result in damage to the
Independent of the PRSEN bit setting, the ECCPASE application circuits.
bit cannot be cleared as long as the cause of the The P1A, P1B, P1C and P1D output latches may not be
shutdown persists. in the proper states when the PWM module is initialized.
The Auto-Shutdown mode can be forced by writing a ‘1’ Enabling the PWM pins for output at the same time as
to the ECCPASE bit. the ECCP module may cause damage to the application
circuit. The ECCP module must be enabled in the proper
output mode and complete a full PWM cycle, before con-
figuring the PWM pins as outputs. The completion of a
full PWM cycle is indicated by the TMR2IF bit being set
as the second PWM period begins.

FIGURE 15-12: PWM AUTO-SHUTDOWN (PRSEN = 1, AUTO-RESTART ENABLED)

PWM Period PWM Period PWM Period

PWM Activity
Dead Time Dead Time Dead Time

Duty Cycle Duty Cycle Duty Cycle

Shutdown Event

ECCPASE bit

FIGURE 15-13: PWM AUTO-SHUTDOWN (PRSEN = 0, AUTO-RESTART DISABLED)

PWM Period PWM Period PWM Period

PWM Activity
Dead Time Dead Time Dead Time

Duty Cycle Duty Cycle Duty Cycle

Shutdown Event

ECCPASE bit

ECCPASE
Cleared by Firmware

DS39605F-page 128 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
15.5.9 SETUP FOR PWM OPERATION 15.5.10 OPERATION IN LOW-POWER
The following steps should be taken when configuring MODES
the ECCP1 module for PWM operation: In the Low-Power Sleep mode, all clock sources are
1. Configure the PWM pins P1A and P1B (and disabled. Timer2 will not increment and the state of the
P1C and P1D, if used) as inputs by setting the module will not change. If the ECCP pin is driving a
corresponding TRISB bits. value, it will continue to drive that value. When the
device wakes up, it will continue from this state. If Two-
2. Set the PWM period by loading the PR2 register.
Speed Start-ups are enabled, the initial start-up
3. Configure the ECCP module for the desired frequency may not be stable if the INTOSC is being
PWM mode and configuration by loading the used.
CCP1CON register with the appropriate values:
In PRI_IDLE mode, the primary clock will continue to
• Select one of the available output
clock the ECCP module without change.
configurations and direction with the
P1M1:P1M0 bits. In all other low-power modes, the selected low-power
• Select the polarities of the PWM output mode clock will clock Timer2. Other low-power mode
signals with the CCP1M3:CCP1M0 bits. clocks will most likely be different than the primary
clock frequency.
4. Set the PWM duty cycle by loading the CCPR1L
register and CCP1CON<5:4> bits.
15.5.10.1 Operation with Fail-Safe
5. For Half-Bridge Output mode, set the dead- Clock Monitor
band delay by loading PWM1CON<6:0> with
the appropriate value. If the Fail-Safe Clock Monitor is enabled
(CONFIG1H<6> is programmed), a clock failure will
6. If auto-shutdown operation is required, load the
force the device into the Low-Power RC_RUN mode
ECCPAS register:
and the OSCFIF bit (PIR2<7>) will be set. The ECCP
• Select the auto-shutdown sources using the will then be clocked from the INTRC clock source,
ECCPAS<2:0> bits. which may have a different clock frequency than the
• Select the shutdown states of the PWM primary clock. By loading the IRCF2:IRCF0 bits on
output pins using PSSAC1:PSSAC0 and Resets, the user can enable the INTOSC at a high
PSSBD1:PSSBD0 bits. clock speed in the event of a clock failure.
• Set the ECCPASE bit (ECCPAS<7>). See the previous section for additional details.
7. If auto-restart operation is required, set the
PRSEN bit (PWM1CON<7>). 15.5.11 EFFECTS OF A RESET
8. Configure and start TMR2: Both power-on and subsequent Resets will force all
• Clear the TMR2 interrupt flag bit by clearing ports to input mode and the CCP registers to their
the TMR2IF bit (PIR1<1>). Reset states.
• Set the TMR2 prescale value by loading the This forces the Enhanced CCP module to reset to a
T2CKPS bits (T2CON<1:0>). state compatible with the standard CCP module.
• Enable Timer2 by setting the TMR2ON bit
(T2CON<2>).
9. Enable PWM outputs after a new PWM cycle
has started:
• Wait until TMR2 overflows (TMR2IF bit is set).
• Enable the CCP1/P1A, P1B, P1C and/or P1D
pin outputs by clearing the respective TRISB
bits.
• Clear the ECCPASE bit (ECCPAS<7>).

© 2007 Microchip Technology Inc. DS39605F-page 129

PIC18F1220/1320
TABLE 15-5: REGISTERS ASSOCIATED WITH ENHANCED PWM AND TIMER2
Value on
Value on
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 all other
POR, BOR
Resets
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u
RCON IPEN — — RI TO PD POR BOR 0--1 11qq 0--q qquu
PIR1 — ADIF RCIF TXIF — CCP1IF TMR2IF TMR1IF -000 -000 -000 -000
PIE1 — ADIE RCIE TXIE — CCP1IE TMR2IE TMR1IE -000 -000 -000 -000
IPR1 — ADIP RCIP TXIP — CCP1IP TMR2IP TMR1IP -111 -111 -111 -111
TMR2 Timer2 Module Register 0000 0000 0000 0000
PR2 Timer2 Module Period Register 1111 1111 1111 1111
T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
TRISB PORTB Data Direction Register 1111 1111 1111 1111
CCPR1H Enhanced Capture/Compare/PWM Register 1 High Byte xxxx xxxx uuuu uuuu
CCPR1L Enhanced Capture/Compare/PWM Register 1 Low Byte xxxx xxxx uuuu uuuu
CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 0000 0000
ECCPAS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 0000 0000 0000 0000
PWM1CON PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 0000 0000 uuuu uuuu
OSCCON IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0 0000 qq00 0000 qq00
Legend: x = unknown, u = unchanged, – = unimplemented, read as ‘0’.
Shaded cells are not used by the ECCP module in Enhanced PWM mode.

DS39605F-page 130 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
16.0 ENHANCED ADDRESSABLE 16.1 Asynchronous Operation in Power
UNIVERSAL SYNCHRONOUS Managed Modes
ASYNCHRONOUS RECEIVER The EUSART may operate in Asynchronous mode
TRANSMITTER (EUSART) while the peripheral clocks are being provided by the
internal oscillator block. This makes it possible to
The Enhanced Addressable Universal Synchronous remove the crystal or resonator that is commonly
Asynchronous Receiver Transmitter (EUSART) mod- connected as the primary clock on the OSC1 and
ule can be configured as a full-duplex asynchronous OSC2 pins.
system that can communicate with peripheral devices,
such as CRT terminals and personal computers. It can The factory calibrates the internal oscillator block out-
also be configured as a half-duplex synchronous put (INTOSC) for 8 MHz (see Table 22-6). However,
system that can communicate with peripheral devices, this frequency may drift as VDD or temperature
such as A/D or D/A integrated circuits, serial changes and this directly affects the asynchronous
EEPROMs, etc. baud rate. Two methods may be used to adjust the
baud rate clock, but both require a reference clock
The Enhanced Addressable USART module source of some kind.
implements additional features, including automatic
baud rate detection and calibration, automatic wake-up The first (preferred) method uses the OSCTUNE
on Sync Break reception and 12-bit Break character register to adjust the INTOSC output back to 8 MHz.
transmit. These features make it ideally suited for use Adjusting the value in the OSCTUNE register allows for
in Local Interconnect Network (LIN) bus systems. fine resolution changes to the system clock source (see
Section 3.6 “INTOSC Frequency Drift” for more
The EUSART can be configured in the following information).
modes:
The other method adjusts the value in the Baud Rate
• Asynchronous (full duplex) with: Generator (BRG). There may not be fine enough
- Auto-wake-up on character reception resolution when adjusting the Baud Rate Generator to
- Auto-baud calibration compensate for a gradual change in the peripheral
- 12-bit Break character transmission clock frequency.
• Synchronous – Master (half duplex) with
selectable clock polarity
• Synchronous – Slave (half duplex) with selectable
clock polarity
The RB1/AN5/TX/CK/INT1 and RB4/AN6/RX/DT/KBI0
pins must be configured as follows for use with the
Universal Synchronous Asynchronous Receiver
Transmitter:
• SPEN (RCSTA<7>) bit must be set ( = 1),
• PCFG6:PCFG5 (ADCON1<5:6>) must be set ( = 1),
• TRISB<4> bit must be set ( = 1) and
• TRISB<1> bit must be set ( = 1).
Note: The EUSART control will automatically
reconfigure the pin from input to output as
needed.
The operation of the Enhanced USART module is
controlled through three registers:
• Transmit Status and Control (TXSTA)
• Receive Status and Control (RCSTA)
• Baud Rate Control (BAUDCTL)
These are detailed in on the following pages in
Register 16-1, Register 16-2 and Register 16-3,
respectively.

© 2007 Microchip Technology Inc. DS39605F-page 131

PIC18F1220/1320
REGISTER 16-1: TXSTA: TRANSMIT STATUS AND CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R-1 R/W-0
CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D
bit 7 bit 0

bit 7 CSRC: Clock Source Select bit

Asynchronous mode:
Don’t care.
Synchronous mode:
1 = Master mode (clock generated internally from BRG)
0 = Slave mode (clock from external source)
bit 6 TX9: 9-bit Transmit Enable bit
1 = Selects 9-bit transmission
0 = Selects 8-bit transmission
bit 5 TXEN: Transmit Enable bit
1 = Transmit enabled
0 = Transmit disabled
Note: SREN/CREN overrides TXEN in Sync mode.
bit 4 SYNC: EUSART Mode Select bit
1 = Synchronous mode
0 = Asynchronous mode
bit 3 SENDB: Send Break Character bit
Asynchronous mode:
1 = Send Sync Break on next transmission (cleared by hardware upon completion)
0 = Sync Break transmission completed
Synchronous mode:
Don’t care.
bit 2 BRGH: High Baud Rate Select bit
Asynchronous mode:
1 = High speed
0 = Low speed
Synchronous mode:
Unused in this mode.
bit 1 TRMT: Transmit Shift Register Status bit
1 = TSR Idle
0 = TSR busy
bit 0 TX9D: 9th bit of Transmit Data
Can be address/data bit or a parity bit.

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

DS39605F-page 132 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
REGISTER 16-2: RCSTA: RECEIVE STATUS AND CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-x
SPEN RX9 SREN CREN ADDEN FERR OERR RX9D
bit 7 bit 0

bit 7 SPEN: Serial Port Enable bit

1 = Serial port enabled (configures RX/DT and TX/CK pins as serial port pins)
0 = Serial port disabled (held in Reset)
bit 6 RX9: 9-bit Receive Enable bit
1 = Selects 9-bit reception
0 = Selects 8-bit reception
bit 5 SREN: Single Receive Enable bit
Asynchronous mode:
Don’t care.
Synchronous mode – Master:
1 = Enables single receive
0 = Disables single receive
This bit is cleared after reception is complete.
Synchronous mode – Slave:
Don’t care.
bit 4 CREN: Continuous Receive Enable bit
Asynchronous mode:
1 = Enables receiver
0 = Disables receiver
Synchronous mode:
1 = Enables continuous receive until enable bit, CREN, is cleared (CREN overrides SREN)
0 = Disables continuous receive
bit 3 ADDEN: Address Detect Enable bit
Asynchronous mode 9-bit (RX9 = 1):
1 = Enables address detection, generates RCIF interrupt and loads RCREG when RX9D is set
0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit
Asynchronous mode 8-bit (RX9 = 0):
Don’t care.
bit 2 FERR: Framing Error bit
1 = Framing error (can be updated by reading RCREG register and receiving next valid byte)
0 = No framing error
bit 1 OERR: Overrun Error bit
1 = Overrun error (can be cleared by clearing bit CREN)
0 = No overrun error
bit 0 RX9D: 9th bit of Received Data
This can be address/data bit or a parity bit and must be calculated by user firmware.

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. DS39605F-page 133

PIC18F1220/1320
REGISTER 16-3: BAUDCTL: BAUD RATE CONTROL REGISTER
U-0 R-1 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0
— RCIDL — SCKP BRG16 — WUE ABDEN
bit 7 bit 0

bit 7 Unimplemented: Read as ‘0’

bit 6 RCIDL: Receive Operation Idle Status bit
1 = Receiver is Idle
0 = Receiver is busy
bit 5 Unimplemented: Read as ‘0’
bit 4 SCKP: Synchronous Clock Polarity Select bit
Asynchronous mode:
Unused in this mode.
Synchronous mode:
1 = Idle state for clock (CK) is a high level
0 = Idle state for clock (CK) is a low level
bit 3 BRG16: 16-bit Baud Rate Register Enable bit
1 = 16-bit Baud Rate Generator – SPBRGH and SPBRG
0 = 8-bit Baud Rate Generator – SPBRG only (Compatible mode), SPBRGH value ignored
bit 2 Unimplemented: Read as ‘0’
bit 1 WUE: Wake-up Enable bit
Asynchronous mode:
1 = EUSART will continue to sample the RX pin – interrupt generated on falling edge; bit
cleared in hardware on following rising edge
0 = RX pin not monitored or rising edge detected
Synchronous mode:
Unused in this mode.
bit 0 ABDEN: Auto-Baud Detect Enable bit
Asynchronous mode:
1 = Enable baud rate measurement on the next character – requires reception of a Sync byte
(55h); cleared in hardware upon completion
0 = Baud rate measurement disabled or completed
Synchronous mode:
Unused in this mode.

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

DS39605F-page 134 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
16.2 EUSART Baud Rate Generator 16.2.1 POWER MANAGED MODE
(BRG) OPERATION
The BRG is a dedicated 8-bit or 16-bit generator, that The system clock is used to generate the desired baud
supports both the Asynchronous and Synchronous rate; however, when a power managed mode is
modes of the EUSART. By default, the BRG operates entered, the clock source may be operating at a differ-
in 8-bit mode; setting the BRG16 bit (BAUDCTL<3>) ent frequency than in PRI_RUN mode. In Sleep mode,
selects 16-bit mode. no clocks are present and in PRI_IDLE mode, the
primary clock source continues to provide clocks to the
The SPBRGH:SPBRG register pair controls the period Baud Rate Generator; however, in other power
of a free running timer. In Asynchronous mode, bits managed modes, the clock frequency will probably
BRGH (TXSTA<2>) and BRG16 also control the baud change. This may require the value in SPBRG to be
rate. In Synchronous mode, bit BRGH is ignored. adjusted.
Table 16-1 shows the formula for computation of the
baud rate for different EUSART modes which only If the system clock is changed during an active receive
apply in Master mode (internally generated clock). operation, a receive error or data loss may result. To
avoid this problem, check the status of the RCIDL bit
Given the desired baud rate and FOSC, the nearest and make sure that the receive operation is Idle before
integer value for the SPBRGH:SPBRG registers can be changing the system clock.
calculated using the formulas in Table 16-1. From this,
the error in baud rate can be determined. An example 16.2.2 SAMPLING
calculation is shown in Example 16-1. Typical baud
The data on the RB4/AN6/RX/DT/KBI0 pin is sampled
rates and error values for the various asynchronous
three times by a majority detect circuit to determine if a
modes are shown in Table 16-2. It may be
high or a low level is present at the RX pin.
advantageous to use the high baud rate (BRGH = 1),
or the 16-bit BRG to reduce the baud rate error, or
achieve a slow baud rate for a fast oscillator frequency.
Writing a new value to the SPBRGH:SPBRG registers
causes the BRG timer to be reset (or cleared). This
ensures the BRG does not wait for a timer overflow
before outputting the new baud rate.

TABLE 16-1: BAUD RATE FORMULAS

Configuration Bits
BRG/EUSART Mode Baud Rate Formula
SYNC BRG16 BRGH
0 0 0 8-bit/Asynchronous FOSC/[64 (n + 1)]
0 0 1 8-bit/Asynchronous
FOSC/[16 (n + 1)]
0 1 0 16-bit/Asynchronous
0 1 1 16-bit/Asynchronous
1 0 x 8-bit/Synchronous FOSC/[4 (n + 1)]
1 1 x 16-bit/Synchronous
Legend: x = Don’t care, n = value of SPBRGH:SPBRG register pair

EXAMPLE 16-1: CALCULATING BAUD RATE ERROR

For a device with FOSC of 16 MHz, desired baud rate of 9600, Asynchronous mode, 8-bit BRG:
Desired Baud Rate = FOSC/(64 ([SPBRGH:SPBRG] + 1))
Solving for SPBRGH:SPBRG:
X = ((FOSC/Desired Baud Rate)/64) – 1
= ((16000000/9600)/64) – 1
= [25.042] = 25
Calculated Baud Rate = 16000000/(64 (25 + 1))
= 9615
Error = (Calculated Baud Rate – Desired Baud Rate)/Desired Baud Rate
= (9615 – 9600)/9600 = 0.16%

© 2007 Microchip Technology Inc. DS39605F-page 135

PIC18F1220/1320
TABLE 16-2: REGISTERS ASSOCIATED WITH BAUD RATE GENERATOR
Value on Value on all
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
POR, BOR other Resets
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 -010 0000 -010
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 -00x 0000 -00x
BAUDCTL — RCIDL — SCKP BRG16 — WUE ABDEN -1-1 0-00 -1-1 0-00
SPBRGH Baud Rate Generator Register High Byte 0000 0000 0000 0000
SPBRG Baud Rate Generator Register Low Byte 0000 0000 0000 0000
Legend: x = unknown, – = unimplemented, read as ‘0’. Shaded cells are not used by the BRG.

TABLE 16-3: BAUD RATES FOR ASYNCHRONOUS MODES

SYNC = 0, BRGH = 0, BRG16 = 0
BAUD
FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz
RATE
(K) Actual SPBRG Actual SPBRG Actual SPBRG Actual SPBRG
% % % %
Rate value Rate value Rate value Rate value
Error Error Error Error
(K) (decimal) (K) (decimal) (K) (decimal) (K) (decimal)

0.3 — — — — — — — — — — — —
1.2 — — — 1.221 1.73 255 1.202 0.16 129 1201 -0.16 103
2.4 2.441 1.73 255 2.404 0.16 129 2.404 0.16 64 2403 -0.16 51
9.6 9.615 0.16 64 9.766 1.73 31 9.766 1.73 15 9615 -0.16 12
19.2 19.531 1.73 31 19.531 1.73 15 19.531 1.73 7 — — —
57.6 56.818 -1.36 10 62.500 8.51 4 52.083 -9.58 2 — — —
115.2 125.000 8.51 4 104.167 -9.58 2 78.125 -32.18 1 — — —
SYNC = 0, BRGH = 0, BRG16 = 0
BAUD FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz
RATE
(K) Actual SPBRG Actual SPBRG Actual SPBRG
% % %
Rate value Rate value Rate value
Error Error Error
(K) (decimal) (K) (decimal) (K) (decimal)

0.3 0.300 0.16 207 300 -0.16 103 300 -0.16 51

1.2 1.202 0.16 51 1201 -0.16 25 1201 -0.16 12
2.4 2.404 0.16 25 2403 -0.16 12 — — —
9.6 8.929 -6.99 6 — — — — — —
19.2 20.833 8.51 2 — — — — — —
57.6 62.500 8.51 0 — — — — — —
115.2 62.500 -45.75 0 — — — — — —

DS39605F-page 136 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
TABLE 16-3: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)
SYNC = 0, BRGH = 1, BRG16 = 0
BAUD
FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz
RATE
(K) Actual SPBRG Actual SPBRG Actual SPBRG Actual SPBRG
% % % %
Rate value Rate value Rate value Rate value
Error Error Error Error
(K) (decimal) (K) (decimal) (K) (decimal) (K) (decimal)
2.4 — — — — — — 2.441 1.73 255 2403 -0.16 207
9.6 9.766 1.73 255 9.615 0.16 129 9.615 0.16 64 9615 -0.16 51
19.2 19.231 0.16 129 19.231 0.16 64 19.531 1.73 31 19230 -0.16 25
57.6 58.140 0.94 42 56.818 -1.36 21 56.818 -1.36 10 55555 3.55 8
115.2 113.636 -1.36 21 113.636 -1.36 10 125.000 8.51 4 — — —
SYNC = 0, BRGH = 1, BRG16 = 0
BAUD FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz
RATE
(K) Actual SPBRG Actual SPBRG Actual SPBRG
% % %
Rate value Rate value Rate value
Error Error Error
(K) (decimal) (K) (decimal) (K) (decimal)

0.3 — — — — — — 300 -0.16 207

1.2 1.202 0.16 207 1201 -0.16 103 1201 -0.16 51
2.4 2.404 0.16 103 2403 -0.16 51 2403 -0.16 25
9.6 9.615 0.16 25 9615 -0.16 12 — — —
19.2 19.231 0.16 12 — — — — — —
57.6 62.500 8.51 3 — — — — — —
115.2 125.000 8.51 1 — — — — — —

SYNC = 0, BRGH = 0, BRG16 = 1

BAUD
FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz
RATE
(K) Actual SPBRG Actual SPBRG Actual SPBRG Actual SPBRG
% % % %
Rate value Rate value Rate value Rate value
Error Error Error Error
(K) (decimal) (K) (decimal) (K) (decimal) (K) (decimal)

0.3 0.300 0.00 8332 0.300 0.02 4165 0.300 0.02 2082 300 -0.04 1665
1.2 1.200 0.02 2082 1.200 -0.03 1041 1.200 -0.03 520 1201 -0.16 415
2.4 2.402 0.06 1040 2.399 -0.03 520 2.404 0.16 259 2403 -0.16 207
9.6 9.615 0.16 259 9.615 0.16 129 9.615 0.16 64 9615 -0.16 51
19.2 19.231 0.16 129 19.231 0.16 64 19.531 1.73 31 19230 -0.16 25
57.6 58.140 0.94 42 56.818 -1.36 21 56.818 -1.36 10 55555 3.55 8
115.2 113.636 -1.36 21 113.636 -1.36 10 125.000 8.51 4 — — —
SYNC = 0, BRGH = 0, BRG16 = 1
BAUD FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz
RATE
(K) Actual SPBRG Actual SPBRG Actual SPBRG
% % %
Rate value Rate value Rate value
Error Error Error
(K) (decimal) (K) (decimal) (K) (decimal)

0.3 0.300 0.04 832 300 -0.16 415 300 -0.16 207
1.2 1.202 0.16 207 1201 -0.16 103 1201 -0.16 51
2.4 2.404 0.16 103 2403 -0.16 51 2403 -0.16 25
9.6 9.615 0.16 25 9615 -0.16 12 — — —
19.2 19.231 0.16 12 — — — — — —
57.6 62.500 8.51 3 — — — — — —
115.2 125.000 8.51 1 — — — — — —

© 2007 Microchip Technology Inc. DS39605F-page 137

PIC18F1220/1320
TABLE 16-3: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1
BAUD FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz
RATE
(K) Actual SPBRG Actual SPBRG Actual SPBRG Actual SPBRG
% % % %
Rate value Rate value Rate value Rate value
Error Error Error Error
(K) (decimal) (K) (decimal) (K) (decimal) (K) (decimal)

0.3 0.300 0.00 33332 0.300 0.00 16665 0.300 0.00 8332 300 -0.01 6665
1.2 1.200 0.00 8332 1.200 0.02 4165 1.200 0.02 2082 1200 -0.04 1665
2.4 2.400 0.02 4165 2.400 0.02 2082 2.402 0.06 1040 2400 -0.04 832
9.6 9.606 0.06 1040 9.596 -0.03 520 9.615 0.16 259 9615 -0.16 207
19.2 19.193 -0.03 520 19.231 0.16 259 19.231 0.16 129 19230 -0.16 103
57.6 57.803 0.35 172 57.471 -0.22 86 58.140 0.94 42 57142 0.79 34
115.2 114.943 -0.22 86 116.279 0.94 42 113.636 -1.36 21 117647 -2.12 16
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1
BAUD
FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz
RATE
(K) Actual SPBRG Actual SPBRG Actual SPBRG
% % %
Rate value Rate value Rate value
Error Error Error
(K) (decimal) (K) (decimal) (K) (decimal)

0.3 0.300 0.01 3332 300 -0.04 1665 300 -0.04 832
1.2 1.200 0.04 832 1201 -0.16 415 1201 -0.16 207
2.4 2.404 0.16 415 2403 -0.16 207 2403 -0.16 103
9.6 9.615 0.16 103 9615 -0.16 51 9615 -0.16 25
19.2 19.231 0.16 51 19230 -0.16 25 19230 -0.16 12
57.6 58.824 2.12 16 55555 3.55 8 — — —
115.2 111.111 -3.55 8 — — — — — —

DS39605F-page 138 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
16.2.3 AUTO-BAUD RATE DETECT
Note 1: It is up to the user to determine that the
The Enhanced USART module supports the automatic incoming character baud rate is within the
detection and calibration of baud rate. This feature is range of the selected BRG clock source.
active only in Asynchronous mode and while the WUE Some combinations of oscillator frequency
bit is clear. and EUSART baud rates are not possible
The automatic baud rate measurement sequence due to bit error rates. Overall system
(Figure 16-1) begins whenever a Start bit is received and timing and communication baud rates
the ABDEN bit is set. The calculation is self-averaging. must be taken into consideration when
using the Auto-Baud Rate Detection
In the Auto-Baud Rate Detect (ABD) mode, the clock to feature.
the BRG is reversed. Rather than the BRG clocking the
incoming RX signal, the RX signal is timing the BRG. In 16.2.4 RECEIVING A SYNC (AUTO-BAUD
ABD mode, the internal Baud Rate Generator is used RATE DETECT)
as a counter to time the bit period of the incoming serial
byte stream. To receive a Sync (Auto-Baud Rate Detect):

Once the ABDEN bit is set, the state machine will clear 1. Configure the EUSART for asynchronous receive.
the BRG and look for a Start bit. The Auto-Baud Detect TXEN should remain clear. SPBRGH:SPBRG
must receive a byte with the value 55h (ASCII “U”, may be left as is. The controller should operate in
which is also the LIN bus Sync character), in order to either PRI_RUN or PRI_IDLE.
calculate the proper bit rate. The measurement is taken 2. Enable RXIF interrupts. Set RCIE, PEIE, GIE.
over both a low and a high bit time in order to minimize 3. Enable Auto-Baud Rate Detect. Set ABDEN.
any effects caused by asymmetry of the incoming sig- 4. When the next RCIF interrupt occurs, the
nal. After a Start bit, the SPBRG begins counting up received baud rate has been measured. Read
using the preselected clock source on the first rising RCREG to clear RCIF and discard. Check
edge of RX. After eight bits on the RX pin, or the fifth SPBRGH:SPBRG for a valid value. The
rising edge, an accumulated value totalling the proper EUSART is ready for normal communications.
BRG period is left in the SPBRGH:SPBRG registers. Return from the interrupt. Allow the primary
Once the 5th edge is seen (should correspond to the clock to run (PRI_RUN or PRI_IDLE).
Stop bit), the ABDEN bit is automatically cleared. 5. Process subsequent RCIF interrupts normally
While calibrating the baud rate period, the BRG as in asynchronous reception. Remain in
registers are clocked at 1/8th the preconfigured clock PRI_RUN or PRI_IDLE until communications
rate. Note that the BRG clock will be configured by the are complete.
BRG16 and BRGH bits. Independent of the BRG16 bit
setting, both the SPBRG and SPBRGH will be used as TABLE 16-4: BRG COUNTER CLOCK
a 16-bit counter. This allows the user to verify that no RATES
carry occurred for 8-bit modes, by checking for 00h in
the SPBRGH register. Refer to Table 16-4 for counter BRG16 BRGH BRG Counter Clock
clock rates to the BRG. 0 0 FOSC/512
While the ABD sequence takes place, the EUSART 0 1 FOSC/128
state machine is held in Idle. The RCIF interrupt is set 1 0 FOSC/128
once the fifth rising edge on RX is detected. The value
in the RCREG needs to be read to clear the RCIF 1 1 FOSC/32
interrupt. RCREG content should be discarded. Note: During the ABD sequence, SPBRG and
SPBRGH are both used as a 16-bit counter,
independent of BRG16 setting.

© 2007 Microchip Technology Inc. DS39605F-page 139

PIC18F1220/1320
FIGURE 16-1: AUTOMATIC BAUD RATE CALCULATION

BRG Value XXXXh 0000h 001Ch

Edge #1 Edge #2 Edge #3 Edge #4 Edge #5

RX pin Start Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Stop Bit

BRG Clock

Set by User Auto-Cleared

ABDEN bit

RCIF bit
(Interrupt)

Read
RCREG

SPBRG XXXXh 1Ch

SPBRGH XXXXh 00h

Note 1: The ABD sequence requires the EUSART module to be configured in Asynchronous mode and WUE = 0.

16.3 EUSART Asynchronous Mode 16.3.1 EUSART ASYNCHRONOUS

TRANSMITTER
The Asynchronous mode of operation is selected by
clearing the SYNC bit (TXSTA<4>). In this mode, the The EUSART transmitter block diagram is shown in
EUSART uses standard Non-Return-to-Zero (NRZ) for- Figure 16-2. The heart of the transmitter is the Transmit
mat (one Start bit, eight or nine data bits and one Stop (Serial) Shift Register (TSR). The shift register obtains
bit). The most common data format is 8 bits. An on-chip its data from the Read/Write Transmit Buffer register,
dedicated 8-bit/16-bit Baud Rate Generator can be TXREG. The TXREG register is loaded with data in
used to derive standard baud rate frequencies from the software. The TSR register is not loaded until the Stop
oscillator. bit has been transmitted from the previous load. As
soon as the Stop bit is transmitted, the TSR is loaded
The EUSART transmits and receives the LSb first. The
with new data from the TXREG register (if available).
EUSART’s transmitter and receiver are functionally
independent, but use the same data format and baud Once the TXREG register transfers the data to the TSR
rate. The Baud Rate Generator produces a clock, either register (occurs in one TCY), the TXREG register is
x16 or x64 of the bit shift rate, depending on the BRGH empty and flag bit, TXIF (PIR1<4>), is set. This interrupt
and BRG16 bits (TXSTA<2> and BAUDCTL<3>). Parity can be enabled/disabled by setting/clearing enable bit,
is not supported by the hardware, but can be TXIE (PIE1<4>). Flag bit, TXIF, will be set, regardless of
implemented in software and stored as the 9th data bit. the state of enable bit, TXIE, and cannot be cleared in
software. Flag bit, TXIF, is not cleared immediately upon
Asynchronous mode is available in all low-power
loading the Transmit Buffer register, TXREG. TXIF
modes; it is available in Sleep mode only when auto-
becomes valid in the second instruction cycle following
wake-up on Sync Break is enabled. When in PRI_IDLE
the load instruction. Polling TXIF immediately following a
mode, no changes to the Baud Rate Generator values
load of TXREG will return invalid results.
are required; however, other low-power mode clocks
may operate at another frequency than the primary While flag bit, TXIF, indicates the status of the TXREG
clock. Therefore, the Baud Rate Generator values may register, another bit, TRMT (TXSTA<1>), shows the
need to be adjusted. status of the TSR register. Status bit, TRMT, is a read-
only bit, which is set when the TSR register is empty.
When operating in Asynchronous mode, the EUSART
No interrupt logic is tied to this bit, so the user has to
module consists of the following important elements:
poll this bit in order to determine if the TSR register is
• Baud Rate Generator empty.
• Sampling Circuit
Note 1: The TSR register is not mapped in data
• Asynchronous Transmitter memory, so it is not available to the user.
• Asynchronous Receiver
2: Flag bit, TXIF, is set when enable bit,
• Auto-Wake-up on Sync Break Character TXEN, is set.
• 12-bit Break Character Transmit
• Auto-Baud Rate Detection

DS39605F-page 140 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
To set up an Asynchronous Transmission: 5. Enable the transmission by setting bit TXEN,
1. Initialize the SPBRGH:SPBRG registers for the which will also set bit TXIF.
appropriate baud rate. Set or clear the BRGH 6. If 9-bit transmission is selected, the ninth bit
and BRG16 bits, as required, to achieve the should be loaded in bit TX9D.
desired baud rate. 7. Load data to the TXREG register (starts
2. Enable the asynchronous serial port by clearing transmission).
bit SYNC and setting bit SPEN. If using interrupts, ensure that the GIE and PEIE bits in
3. If interrupts are desired, set enable bit TXIE. the INTCON register (INTCON<7:6>) are set.
4. If 9-bit transmission is desired, set transmit bit
TX9. Can be used as address/data bit.

FIGURE 16-2: EUSART TRANSMIT BLOCK DIAGRAM

Data Bus

TXIF TXREG Register

TXIE
8
MSb LSb RB1/AN5/TX/CK/INT1 pin
(8) • • • 0 Pin Buffer
and Control
TSR Register
Interrupt

TXEN Baud Rate CLK

TRMT SPEN
BRG16 SPBRGH SPBRG

TX9
Baud Rate Generator
TX9D

FIGURE 16-3: ASYNCHRONOUS TRANSMISSION

Write to TXREG
Word 1
BRG Output
(Shift Clock)

RB1/AN5/TX/
CK/INT1 (pin) Start bit bit 0 bit 1 bit 7/8 Stop bit
Word 1
TXIF bit
(Transmit Buffer 1 TCY
Reg. Empty Flag)

Word 1
TRMT bit Transmit Shift Reg
(Transmit Shift
Reg. Empty Flag)

© 2007 Microchip Technology Inc. DS39605F-page 141

PIC18F1220/1320
FIGURE 16-4: ASYNCHRONOUS TRANSMISSION (BACK TO BACK)

Write to TXREG
Word 1 Word 2
BRG Output
(Shift Clock)
RB1/AN5/TX/
CK/INT1 (pin) Start bit bit 0 bit 1 bit 7/8 Stop bit Start bit bit 0
TXIF bit 1 TCY Word 1 Word 2
(Interrupt Reg. Flag)
1 TCY
TRMT bit Word 1 Word 2
(Transmit Shift Transmit Shift Reg.
Reg. Empty Flag) Transmit Shift Reg.

Note: This timing diagram shows two consecutive transmissions.

TABLE 16-5: REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION

Value on
Value on
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 all other
POR, BOR
Resets
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u
PIR1 — ADIF RCIF TXIF — CCP1IF TMR2IF TMR1IF -000 -000 -000 -000
PIE1 — ADIE RCIE TXIE — CCP1IE TMR2IE TMR1IE -000 -000 -000 -000
IPR1 — ADIP RCIP TXIP — CCP1IP TMR2IP TMR1IP -111 -111 -111 -111
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 -00x 0000 -00x
TXREG EUSART Transmit Register 0000 0000 0000 0000
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010
BAUDCTL — RCIDL — SCKP BRG16 — WUE ABDEN -1-1 0-00 -1-1 0-00
SPBRGH Baud Rate Generator Register High Byte 0000 0000 0000 0000
SPBRG Baud Rate Generator Register Low Byte 0000 0000 0000 0000
Legend: x = unknown, – = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous transmission.

DS39605F-page 142 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
16.3.2 EUSART ASYNCHRONOUS 16.3.3 SETTING UP 9-BIT MODE WITH
RECEIVER ADDRESS DETECT
The receiver block diagram is shown in Figure 16-5. This mode would typically be used in RS-485 systems.
The data is received on the RB4/AN6/RX/DT/KBI0 pin To set up an Asynchronous Reception with Address
and drives the data recovery block. The data recovery Detect Enable:
block is actually a high-speed shifter, operating at x16 1. Initialize the SPBRGH:SPBRG registers for the
times the baud rate, whereas the main receive serial appropriate baud rate. Set or clear the BRGH
shifter operates at the bit rate or at FOSC. This mode and BRG16 bits, as required, to achieve the
would typically be used in RS-232 systems. desired baud rate.
To set up an Asynchronous Reception: 2. Enable the asynchronous serial port by clearing
1. Initialize the SPBRGH:SPBRG registers for the the SYNC bit and setting the SPEN bit.
appropriate baud rate. Set or clear the BRGH 3. If interrupts are required, set the RCEN bit and
and BRG16 bits, as required, to achieve the select the desired priority level with the RCIP bit.
desired baud rate. 4. Set the RX9 bit to enable 9-bit reception.
2. Enable the asynchronous serial port by clearing 5. Set the ADDEN bit to enable address detect.
bit SYNC and setting bit SPEN. 6. Enable reception by setting the CREN bit.
3. If interrupts are desired, set enable bit RCIE. 7. The RCIF bit will be set when reception is
4. If 9-bit reception is desired, set bit RX9. complete. The interrupt will be Acknowledged if
5. Enable the reception by setting bit CREN. the RCIE and GIE bits are set.
6. Flag bit, RCIF, will be set when reception is 8. Read the RCSTA register to determine if any
complete and an interrupt will be generated if error occurred during reception, as well as read
enable bit RCIE was set. bit 9 of data (if applicable).
7. Read the RCSTA register to get the 9th bit (if 9. Read RCREG to determine if the device is being
enabled) and determine if any error occurred addressed.
during reception. 10. If any error occurred, clear the CREN bit.
8. Read the 8-bit received data by reading the 11. If the device has been addressed, clear the
RCREG register. ADDEN bit to allow all received data into the
9. If any error occurred, clear the error by clearing receive buffer and interrupt the CPU.
enable bit CREN.
10. If using interrupts, ensure that the GIE and PEIE
bits in the INTCON register (INTCON<7:6>) are
set.

FIGURE 16-5: EUSART RECEIVE BLOCK DIAGRAM

CREN OERR FERR

x64 Baud Rate CLK

÷ 64 MSb RSR Register LSb
BRG16 SPBRGH SPBRG or
÷ 16 Stop • • •
or (8) 7 1 0 Start
Baud Rate Generator ÷4

RX9
RB4/AN6/RX/DT/KBI0
Pin Buffer Data
and Control Recovery
RX9D RCREG Register
FIFO

SPEN
8

Interrupt RCIF Data Bus

RCIE

© 2007 Microchip Technology Inc. DS39605F-page 143

PIC18F1220/1320
To set up an Asynchronous Transmission: 5. Enable the transmission by setting bit TXEN,
1. Initialize the SPBRG register for the appropriate which will also set bit TXIF.
baud rate. If a high-speed baud rate is desired, 6. If 9-bit transmission is selected, the ninth bit
set bit BRGH (see Section 16.2 “EUSART should be loaded in bit TX9D.
Baud Rate Generator (BRG)”). 7. Load data to the TXREG register (starts
2. Enable the asynchronous serial port by clearing transmission).
bit SYNC and setting bit SPEN. If using interrupts, ensure that the GIE and PEIE bits in
3. If interrupts are desired, set enable bit TXIE. the INTCON register (INTCON<7:6>) are set.
4. If 9-bit transmission is desired, set transmit bit
TX9. Can be used as address/data bit.

FIGURE 16-6: ASYNCHRONOUS RECEPTION

Start Start Start
RX (pin) bit bit 0 bit 1 bit 7/8 Stop bit bit 0 bit 7/8 Stop bit bit 7/8 Stop
bit bit bit
Rcv Shift
Reg
Rcv Buffer Reg
Word 1 Word 2
RCREG RCREG
Read Rcv
Buffer Reg
RCREG

RCIF
(Interrupt Flag)

OERR bit
CREN

Note: This timing diagram shows three words appearing on the RX input. The RCREG (receive buffer) is read after
the third word, causing the OERR (overrun) bit to be set.

TABLE 16-6: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION

Value on
Value on
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 all other
POR, BOR
Resets
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u
PIR1 — ADIF RCIF TXIF — CCP1IF TMR2IF TMR1IF -000 -000 -000 -000
PIE1 — ADIE RCIE TXIE — CCP1IE TMR2IE TMR1IE -000 -000 -000 -000
IPR1 — ADIP RCIP TXIP — CCP1IP TMR2IP TMR1IP -111 -111 -111 -111
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x
RCREG EUSART Receive Register 0000 0000 0000 0000
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010
BAUDCTL — RCIDL — SCKP BRG16 — WUE ABDEN -1-1 0-00 -1-1 0-00
SPBRGH Baud Rate Generator Register High Byte 0000 0000 0000 0000
SPBRG Baud Rate Generator Register Low Byte 0000 0000 0000 0000
Legend: x = unknown, – = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous reception.

DS39605F-page 144 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
16.3.4 AUTO-WAKE-UP ON SYNC BREAK and cause data or framing errors. To work properly,
CHARACTER therefore, the initial character in the transmission must
be all ‘0’s. This can be 00h (8 bytes) for standard RS-232
During Sleep mode, all clocks to the EUSART are devices, or 000h (12 bits) for LIN bus.
suspended. Because of this, the Baud Rate Generator
is inactive and a proper byte reception cannot be per- Oscillator start-up time must also be considered,
formed. The auto-wake-up feature allows the controller especially in applications using oscillators with longer
to wake-up due to activity on the RX/DT line while the start-up intervals (i.e., LP, XT or HS/PLL mode). The
EUSART is operating in Asynchronous mode. Sync Break (or Wake-up Signal) character must be of
sufficient length and be followed by a sufficient period,
The auto-wake-up feature is enabled by setting the to allow enough time for the selected oscillator to start
WUE bit (BAUDCTL<1>). Once set, the typical receive and provide proper initialization of the EUSART.
sequence on RX/DT is disabled and the EUSART
remains in an Idle state, monitoring for a wake-up event 16.3.4.2 Special Considerations Using
independent of the CPU mode. A wake-up event con- the WUE Bit
sists of a high-to-low transition on the RX/DT line. (This
coincides with the start of a Sync Break or a Wake-up The timing of WUE and RCIF events may cause some
Signal character for the LIN protocol.) confusion when it comes to determining the validity of
received data. As noted, setting the WUE bit places the
Following a wake-up event, the module generates an
EUSART in an Idle mode. The wake-up event causes
RCIF interrupt. The interrupt is generated synchro-
a receive interrupt by setting the RCIF bit. The WUE bit
nously to the Q clocks in normal operating modes
is cleared after this when a rising edge is seen on RX/
(Figure 16-7) and asynchronously if the device is in
DT. The interrupt condition is then cleared by reading
Sleep mode (Figure 16-8). The interrupt condition is
the RCREG register. Ordinarily, the data in RCREG will
cleared by reading the RCREG register.
be dummy data and should be discarded.
The WUE bit is automatically cleared once a low-to-high
The fact that the WUE bit has been cleared (or is still
transition is observed on the RX line, following the wake-
set) and the RCIF flag is set should not be used as an
up event. At this point, the EUSART module is in Idle
indicator of the integrity of the data in RCREG. Users
mode and returns to normal operation. This signals to
should consider implementing a parallel method in
the user that the Sync Break event is over.
firmware to verify received data integrity.
16.3.4.1 Special Considerations Using To assure that no actual data is lost, check the RCIDL
Auto-Wake-up bit to verify that a receive operation is not in process. If
a receive operation is not occurring, the WUE bit may
Since auto-wake-up functions by sensing rising edge then be set just prior to entering the Sleep mode.
transitions on RX/DT, information with any state changes
before the Stop bit may signal a false end-of-character

FIGURE 16-7: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING NORMAL OPERATION

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
Bit Set by User Cleared by hardware
WUE bit

RX/DT Line

RCIF
Cleared due to User Read of RCREG

Note 1: The EUSART remains in Idle while the WUE bit is set.

FIGURE 16-8: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
Enters Sleep Cleared by hardware
Bit Set by User
WUE bit

RX/DT Line Note 1

RCIF
Cleared due to User Read of RCREG
Sleep Ends

Note 1: If the wake-up event requires a long oscillator warm-up time, the WUE bit may be cleared while the primary clock is still starting.
2: The EUSART remains in Idle while the WUE bit is set.

© 2007 Microchip Technology Inc. DS39605F-page 145

PIC18F1220/1320
16.3.5 BREAK CHARACTER SEQUENCE 4. If 9-bit transmission is desired, set transmit bit
TX9. Can be used as address/data bit.
The Enhanced USART module has the capability of
sending the special Break character sequences that 5. Enable the transmission by setting bit TXEN,
are required by the LIN bus standard. The Break char- which will also set bit TXIF.
acter transmit consists of a Start bit, followed by twelve 6. Set the SENDB bit.
‘0’ bits and a Stop bit. The Frame Break character is 7. Load a byte into TXREG. This triggers sending a
sent whenever the SENDB and TXEN bits (TXSTA<3> Break signal. The Break signal is complete
and TXSTA<5>) are set while the Transmit Shift when TRMT is set. SENDB will also be cleared.
register is loaded with data. Note that the value of data
See Figure 16-9 for the timing of the Break signal
written to TXREG will be ignored and all ‘0’s will be
sequence.
transmitted.
The SENDB bit is automatically reset by hardware after 16.3.6 RECEIVING A BREAK CHARACTER
the corresponding Stop bit is sent. This allows the user The Enhanced USART module can receive a Break
to preload the transmit FIFO with the next transmit byte character in two ways.
following the Break character (typically, the Sync
character in the LIN specification). The first method forces configuration of the baud rate
at a frequency of 9/13 the typical speed. This allows for
Note that the data value written to the TXREG for the the Stop bit transition to be at the correct sampling
Break character is ignored. The write simply serves the location (12 bits for Break versus Start bit and 8 data
purpose of initiating the proper sequence. bits for typical data).
The TRMT bit indicates when the transmit operation is The second method uses the auto-wake-up feature
active or Idle, just as it does during normal transmis- described in Section 16.3.4 “Auto-Wake-up on Sync
sion. See Figure 16-9 for the timing of the Break Break Character”. By enabling this feature, the
character sequence. EUSART will sample the next two transitions on RX/DT,
cause an RCIF interrupt and receive the next data byte
16.3.5.1 Transmitting A Break Signal
followed by another interrupt.
The Enhanced USART module has the capability of
Note that following a Break character, the user will
sending the Break signal that is required by the LIN bus
typically want to enable the Auto-Baud Rate Detect
standard. The Break signal consists of a Start bit,
feature. For both methods, the user can set the ABD bit
followed by twelve ‘0’ bits and a Stop bit. The Break sig-
before placing the EUSART in its Sleep mode.
nal is sent whenever the SENDB (TXSTA<3>) and
TXEN (TXSTA<5>) bits are set and TXREG is loaded 16.3.6.1 Transmitting a Break Sync
with data. The data written to TXREG will be ignored
and all ‘0’s will be transmitted. The following sequence will send a message frame
header made up of a Break, followed by an auto-baud
SENDB is automatically cleared by hardware when the Sync byte. This sequence is typical of a LIN bus master.
Break signal has been sent. This allows the user to
preload the transmit FIFO with the next transmit byte 1. Configure the EUSART for the desired mode.
following the Break character (typically, the Sync 2. Set the TXEN and SENDB bits to set up the
character in the LIN specification). Break character.
The TRMT bit indicates when the transmit operation is 3. Load the TXREG with a dummy character to
active or Idle, just as it does during normal initiate transmission (the value is ignored).
transmission. 4. Write ‘55h’ to TXREG to load the Sync character
into the transmit FIFO buffer.
To send a Break Signal:
5. After the Break has been sent, the SENDB bit is
1. Configure the EUSART for asynchronous trans- reset by hardware. The Sync character now
missions (steps 1-5). Initialize the SPBRG register transmits in the preconfigured mode. When the
for the appropriate baud rate. If a high-speed baud TXREG becomes empty, as indicated by the
rate is desired, set bit BRGH (see Section 16.2 TXIF, the next data byte can be written to TXREG.
“EUSART Baud Rate Generator (BRG)”).
2. Enable the asynchronous serial port by clearing
bit SYNC and setting bit SPEN.
3. If interrupts are desired, set enable bit TXIE.

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 PIC18F1220/1320
16.3.6.2 Receiving a Break Sync 7. Enable Auto-Baud Rate Detect. Set ABDEN.
To receive a Break Sync: 8. Return from the interrupt. Allow the primary
clock to start and stabilize (PRI_RUN or
1. Configure the EUSART for asynchronous PRI_IDLE).
transmit and receive. TXEN should remain
9. When the next RCIF interrupt occurs, the
clear. SPBRGH:SPBRG may be left as is.
received baud rate has been measured. Read
2. Enable auto-wake-up. Set WUE. RCREG to clear RCIF and discard. Check
3. Enable RXIF interrupts. Set RCIE, PEIE, GIE. SPBRGH:SPBRG for a valid value. The
4. The controller may be placed in any power EUSART is ready for normal communications.
managed mode. Return from the interrupt. Allow the primary
5. An RCIF will be generated at the beginning of clock to run (PRI_RUN or PRI_IDLE).
the Break signal. When the interrupt is received, 10. Process subsequent RCIF interrupts normally
read RCREG to clear RCIF and discard. Allow as in asynchronous reception. TXEN should
the controller to return to PRI_RUN mode. now be set if transmissions are needed. TXIF
6. Wait for the RX line to go high at the end of the and TXIE may be set if transmit interrupts are
Break signal. Wait for any of the following: WUE desired. Remain in PRI_RUN or PRI_IDLE until
to clear automatically (poll), RB4/RX to go high communications are complete. Clear TXEN and
(poll) or for RBIF to be set (poll or interrupt). If return to step 2.
RBIF is used, check to be sure that RB4/RX is
high before continuing.

FIGURE 16-9: SEND BREAK CHARACTER SEQUENCE

Write to TXREG
Dummy Write

BRG Output
(Shift Clock)

TX (pin) Start Bit Bit 0 Bit 1 Bit 11 Stop Bit

Break

TXIF bit

TRMT bit

SENDB

© 2007 Microchip Technology Inc. DS39605F-page 147

PIC18F1220/1320
16.4 EUSART Synchronous Master Once the TXREG register transfers the data to the TSR
Mode register (occurs in one TCYCLE), the TXREG is empty
and interrupt bit, TXIF (PIR1<4>), is set. The interrupt
The Synchronous Master mode is entered by setting can be enabled/disabled by setting/clearing enable bit,
the CSRC bit (TXSTA<7>). In this mode, the data is TXIE (PIE1<4>). Flag bit, TXIF, will be set, regardless
transmitted in a half-duplex manner (i.e., transmission of the state of enable bit, TXIE and cannot be cleared
and reception do not occur at the same time). When in software. It will reset only when new data is loaded
transmitting data, the reception is inhibited and vice into the TXREG register.
versa. Synchronous mode is entered by setting bit,
While flag bit, TXIF, indicates the status of the TXREG
SYNC (TXSTA<4>). In addition, enable bit, SPEN
register, another bit, TRMT (TXSTA<1>), shows the
(RCSTA<7>), is set in order to configure the RB1/AN5/
status of the TSR register. TRMT is a read-only bit,
TX/CK/INT1 and RB4/AN6/RX/DT/KBI0 I/O pins to CK
which is set when the TSR is empty. No interrupt logic is
(clock) and DT (data) lines, respectively.
tied to this bit, so the user has to poll this bit in order to
The Master mode indicates that the processor trans- determine if the TSR register is empty. The TSR is not
mits the master clock on the CK line. Clock polarity is mapped in data memory, so it is not available to the user.
selected with the SCKP bit (BAUDCTL<5>); setting
To set up a Synchronous Master Transmission:
SCKP sets the Idle state on CK as high, while clearing
the bit sets the Idle state as low. This option is provided 1. Initialize the SPBRGH:SPBRG registers for the
to support Microwire devices with this module. appropriate baud rate. Set or clear the BRGH
and BRG16 bits, as required, to achieve the
16.4.1 EUSART SYNCHRONOUS MASTER desired baud rate.
TRANSMISSION 2. Enable the synchronous master serial port by
The EUSART transmitter block diagram is shown in setting bits SYNC, SPEN and CSRC.
Figure 16-2. The heart of the transmitter is the Transmit 3. If interrupts are desired, set enable bit TXIE.
(Serial) Shift Register (TSR). The shift register obtains 4. If 9-bit transmission is desired, set bit TX9.
its data from the Read/Write Transmit Buffer register, 5. Enable the transmission by setting bit TXEN.
TXREG. The TXREG register is loaded with data in 6. If 9-bit transmission is selected, the ninth bit
software. The TSR register is not loaded until the last should be loaded in bit TX9D.
bit has been transmitted from the previous load. As
7. Start transmission by loading data to the TXREG
soon as the last bit is transmitted, the TSR is loaded
register.
with new data from the TXREG (if available).
8. If using interrupts, ensure that the GIE and PEIE
bits in the INTCON register (INTCON<7:6>) are
set.

FIGURE 16-10: SYNCHRONOUS TRANSMISSION

Q1 Q2 Q3Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

RB4/AN6/RX/
DT/KBI0 pin bit 0 bit 1 bit 2 bit 7 bit 0 bit 1 bit 7
Word 1 Word 2
RB1/AN5/TX/
CK/INT1 pin
(SCKP = 0)
RB1/AN5/TX/
CK/INT1 pin
(SCKP = 1)
Write to
TXREG Reg Write Word 1 Write Word 2
TXIF bit
(Interrupt Flag)

TRMT bit

‘1’ ‘1’
TXEN bit

Note: Sync Master mode, SPBRG = 0, continuous transmission of two 8-bit words.

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 PIC18F1220/1320
FIGURE 16-11: SYNCHRONOUS TRANSMISSION (THROUGH TXEN)

RB4/AN6/RX/DT/KBI0 pin bit 0 bit 1 bit 2 bit 6 bit 7

RB1/AN5/TX/CK/INT1 pin

Write to
TXREG reg

TXIF bit

TRMT bit

TXEN bit

TABLE 16-7: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION

Value on
Value on
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 all other
POR, BOR
Resets
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u
PIR1 — ADIF RCIF TXIF — CCP1IF TMR2IF TMR1IF -000 -000 -000 -000
PIE1 — ADIE RCIE TXIE — CCP1IE TMR2IE TMR1IE -000 -000 -000 -000
IPR1 — ADIP RCIP TXIP — CCP1IP TMR2IP TMR1IP -111 -111 -111 -111
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 -00x 0000 -00x
TXREG EUSART Transmit Register 0000 0000 0000 0000
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010
BAUDCTL — RCIDL — SCKP BRG16 — WUE ABDEN -1-1 0-00 -1-1 0-00
SPBRGH Baud Rate Generator Register High Byte 0000 0000 0000 0000
SPBRG Baud Rate Generator Register Low Byte 0000 0000 0000 0000
Legend: x = unknown, – = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master transmission.

© 2007 Microchip Technology Inc. DS39605F-page 149

PIC18F1220/1320
16.4.2 EUSART SYNCHRONOUS MASTER 3. Ensure bits CREN and SREN are clear.
RECEPTION 4. If interrupts are desired, set enable bit RCIE.
Once Synchronous mode is selected, reception is 5. If 9-bit reception is desired, set bit RX9.
enabled by setting either the Single Receive Enable bit, 6. If a single reception is required, set bit SREN.
SREN (RCSTA<5>), or the Continuous Receive For continuous reception, set bit CREN.
Enable bit, CREN (RCSTA<4>). Data is sampled on the 7. Interrupt flag bit, RCIF, will be set when reception
RB4/AN6/RX/DT/KBI0 pin on the falling edge of the is complete and an interrupt will be generated if
clock. the enable bit, RCIE, was set.
If enable bit, SREN, is set, only a single word is 8. Read the RCSTA register to get the 9th bit (if
received. If enable bit, CREN, is set, the reception is enabled) and determine if any error occurred
continuous until CREN is cleared. If both bits are set, during reception.
then CREN takes precedence. 9. Read the 8-bit received data by reading the
To set up a Synchronous Master Reception: RCREG register.
1. Initialize the SPBRGH:SPBRG registers for the 10. If any error occurred, clear the error by clearing
appropriate baud rate. Set or clear the BRGH bit CREN.
and BRG16 bits, as required, to achieve the 11. If using interrupts, ensure that the GIE and PEIE
desired baud rate. bits in the INTCON register (INTCON<7:6>) are
2. Enable the synchronous master serial port by set.
setting bits SYNC, SPEN and CSRC.

FIGURE 16-12: SYNCHRONOUS RECEPTION (MASTER MODE, SREN)

Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

RB4/AN6/RX/
DT/KBI0 pin bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7

RB1/AN5/TX/
CK/INT1 pin
(SCKP = 0)
RB1/AN5/TX/
CK/INT1 pin
(SCKP = 1)
Write to
bit SREN

SREN bit

CREN bit ‘0’ ‘0’

RCIF bit
(Interrupt)
Read
RXREG

Note: Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRGH = 0.

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 PIC18F1220/1320
TABLE 16-8: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION
Value on
Value on
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 all other
POR, BOR
Resets
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u
PIR1 — ADIF RCIF TXIF — CCP1IF TMR2IF TMR1IF -000 -000 -000 -000
PIE1 — ADIE RCIE TXIE — CCP1IE TMR2IE TMR1IE -000 -000 -000 -000
IPR1 — ADIP RCIP TXIP — CCP1IP TMR2IP TMR1IP -111 -111 -111 -111
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x
RCREG EUSART Receive Register 0000 0000 0000 0000
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010
BAUDCTL — RCIDL — SCKP BRG16 — WUE ABDEN -1-1 0-00 -1-1 0-00
SPBRGH Baud Rate Generator Register High Byte 0000 0000 0000 0000
SPBRG Baud Rate Generator Register Low Byte 0000 0000 0000 0000
Legend: x = unknown, – = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master reception.

© 2007 Microchip Technology Inc. DS39605F-page 151

PIC18F1220/1320
16.5 EUSART Synchronous To set up a Synchronous Slave Transmission:
Slave Mode 1. Enable the synchronous slave serial port by
setting bits SYNC and SPEN and clearing bit
Synchronous Slave mode is entered by clearing bit,
CSRC.
CSRC (TXSTA<7>). This mode differs from the
Synchronous Master mode in that the shift clock is 2. Clear bits CREN and SREN.
supplied externally at the RB1/AN5/TX/CK/INT1 pin 3. If interrupts are desired, set enable bit TXIE.
(instead of being supplied internally in Master mode). 4. If 9-bit transmission is desired, set bit TX9.
This allows the device to transfer or receive data while 5. Enable the transmission by setting enable bit
in any low-power mode. TXEN.
6. If 9-bit transmission is selected, the ninth bit
16.5.1 EUSART SYNCHRONOUS
should be loaded in bit TX9D.
SLAVE TRANSMIT
7. Start transmission by loading data to the TXREG
The operation of the Synchronous Master and Slave register.
modes are identical, except in the case of the Sleep 8. If using interrupts, ensure that the GIE and PEIE
mode. bits in the INTCON register (INTCON<7:6>) are
If two words are written to the TXREG and then the set.
SLEEP instruction is executed, the following will occur:
a) The first word will immediately transfer to the
TSR register and transmit.
b) The second word will remain in the TXREG
register.
c) Flag bit, TXIF, will not be set.
d) When the first word has been shifted out of TSR,
the TXREG register will transfer the second
word to the TSR and flag bit, TXIF, will now be
set.
e) If enable bit, TXIE, is set, the interrupt will wake
the chip from Sleep. If the global interrupt is
enabled, the program will branch to the interrupt
vector.

TABLE 16-9: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION

Value on
Value on
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 all other
POR, BOR
Resets
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u
PIR1 — ADIF RCIF TXIF — CCP1IF TMR2IF TMR1IF -000 -000 -000 -000
PIE1 — ADIE RCIE TXIE — CCP1IE TMR2IE TMR1IE -000 -000 -000 -000
IPR1 — ADIP RCIP TXIP — CCP1IP TMR2IP TMR1IP -111 -111 -111 -111
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x
TXREG EUSART Transmit Register 0000 0000 0000 0000
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010
BAUDCTL — RCIDL — SCKP BRG16 — WUE ABDEN -1-1 0-00 -1-1 0-00
SPBRGH Baud Rate Generator Register High Byte 0000 0000 0000 0000
SPBRG Baud Rate Generator Register Low Byte 0000 0000 0000 0000
Legend: x = unknown, – = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave transmission.

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 PIC18F1220/1320
16.5.2 EUSART SYNCHRONOUS SLAVE To set up a Synchronous Slave Reception:
RECEPTION 1. Enable the synchronous master serial port by
The operation of the Synchronous Master and Slave setting bits SYNC and SPEN and clearing bit
modes is identical, except in the case of Sleep, or any CSRC.
Idle mode and bit SREN, which is a “don’t care” in 2. If interrupts are desired, set enable bit RCIE.
Slave mode. 3. If 9-bit reception is desired, set bit RX9.
If receive is enabled by setting the CREN bit prior to 4. To enable reception, set enable bit CREN.
entering Sleep or any Idle mode, then a word may be 5. Flag bit, RCIF, will be set when reception is
received while in this low-power mode. Once the word complete. An interrupt will be generated if
is received, the RSR register will transfer the data to the enable bit, RCIE, was set.
RCREG register; if the RCIE enable bit is set, the inter- 6. Read the RCSTA register to get the 9th bit (if
rupt generated will wake the chip from low-power enabled) and determine if any error occurred
mode. If the global interrupt is enabled, the program will during reception.
branch to the interrupt vector. 7. Read the 8-bit received data by reading the
RCREG register.
8. If any error occurred, clear the error by clearing
bit CREN.
9. If using interrupts, ensure that the GIE and PEIE
bits in the INTCON register (INTCON<7:6>) are
set.

TABLE 16-10: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION

Value on
Value on
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 all other
POR, BOR
Resets
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u
PIR1 — ADIF RCIF TXIF — CCP1IF TMR2IF TMR1IF -000 -000 -000 -000
PIE1 — ADIE RCIE TXIE — CCP1IE TMR2IE TMR1IE -000 -000 -000 -000
IPR1 — ADIP RCIP TXIP — CCP1IP TMR2IP TMR1IP -111 -111 -111 -111
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x
RCREG EUSART Receive Register 0000 0000 0000 0000
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010
BAUDCTL — RCIDL — SCKP BRG16 — WUE ABDEN -1-1 0-00 -1-1 0-00
SPBRGH Baud Rate Generator Register High Byte 0000 0000 0000 0000
SPBRG Baud Rate Generator Register Low Byte 0000 0000 0000 0000
Legend: x = unknown, – = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave reception.

© 2007 Microchip Technology Inc. DS39605F-page 153

PIC18F1220/1320
NOTES:

DS39605F-page 154 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
17.0 10-BIT ANALOG-TO-DIGITAL The module has five registers:
CONVERTER (A/D) MODULE • A/D Result High Register (ADRESH)
• A/D Result Low Register (ADRESL)
The Analog-to-Digital (A/D) converter module has
seven inputs for the PIC18F1220/1320 devices. This • A/D Control Register 0 (ADCON0)
module allows conversion of an analog input signal to • A/D Control Register 1 (ADCON1)
a corresponding 10-bit digital number. • A/D Control Register 2 (ADCON2)
A new feature for the A/D converter is the addition of The ADCON0 register, shown in Register 17-1,
programmable acquisition time. This feature allows the controls the operation of the A/D module. The
user to select a new channel for conversion and to set ADCON1 register, shown in Register 17-2, configures
the GO/DONE bit immediately. When the GO/DONE bit the functions of the port pins. The ADCON2 register,
is set, the selected channel is sampled for the pro- shown in Register 17-3, configures the A/D clock
grammed acquisition time before a conversion is actu- source, programmed acquisition time and justification.
ally started. This removes the firmware overhead that
may have been required to allow for an acquisition
(sampling) period (see Register 17-3 and Section 17.3
“Selecting and Configuring Automatic Acquisition
Time”).

REGISTER 17-1: ADCON0: A/D CONTROL REGISTER 0

R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
VCFG1 VCFG0 — CHS2 CHS1 CHS0 GO/DONE ADON
bit 7 bit 0

bit 7-6 VCFG<1:0>: Voltage Reference Configuration bits

A/D VREF+ A/D VREF-

00 AVDD AVSS
01 External VREF+ AVSS
10 AVDD External VREF-
11 External VREF+ External VREF-

bit 5 Unimplemented: Read as ‘0’

bit 4-2 CHS2:CHS0: Analog Channel Select bits
000 = Channel 0 (AN0)
001 = Channel 1 (AN1)
010 = Channel 2 (AN2)
011 = Channel 3 (AN3)
100 = Channel 4 (AN4)
101 = Channel 5 (AN5)
110 = Channel 6 (AN6)
111 = Unimplemented(1)
bit 1 GO/DONE: A/D Conversion Status bit
When ADON = 1:
1 = A/D conversion in progress
0 = A/D Idle
bit 0 ADON: A/D On bit
1 = A/D converter module is enabled
0 = A/D converter module is disabled
Note 1: Performing a conversion on unimplemented channels returns full-scale results.

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. DS39605F-page 155

PIC18F1220/1320
REGISTER 17-2: ADCON1: A/D CONTROL REGISTER 1
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0
bit 7 bit 0

bit 7 Unimplemented: Read as ‘0’

bit 6 PCFG6: A/D Port Configuration bit – AN6
1 = Pin configured as a digital port
0 = Pin configured as an analog channel – digital input disabled and reads ‘0’
bit 5 PCFG5: A/D Port Configuration bit – AN5
1 = Pin configured as a digital port
0 = Pin configured as an analog channel – digital input disabled and reads ‘0’
bit 4 PCFG4: A/D Port Configuration bit – AN4
1 = Pin configured as a digital port
0 = Pin configured as an analog channel – digital input disabled and reads ‘0’
bit 3 PCFG3: A/D Port Configuration bit – AN3
1 = Pin configured as a digital port
0 = Pin configured as an analog channel – digital input disabled and reads ‘0’
bit 2 PCFG2: A/D Port Configuration bit – AN2
1 = Pin configured as a digital port
0 = Pin configured as an analog channel – digital input disabled and reads ‘0’
bit 1 PCFG1: A/D Port Configuration bit – AN1
1 = Pin configured as a digital port
0 = Pin configured as an analog channel – digital input disabled and reads ‘0’
bit 0 PCFG0: A/D Port Configuration bit – AN0
1 = Pin configured as a digital port
0 = Pin configured as an analog channel – digital input disabled and reads ‘0’

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

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 PIC18F1220/1320
REGISTER 17-3: ADCON2: A/D CONTROL REGISTER 2
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0
bit 7 bit 0

bit 7 ADFM: A/D Result Format Select bit

1 = Right justified
0 = Left justified
bit 6 Unimplemented: Read as ‘0’
bit 5-3 ACQT2:ACQT0: A/D Acquisition Time Select bits
000 = 0 TAD(1)
001 = 2 TAD
010 = 4 TAD
011 = 6 TAD
100 = 8 TAD
101 = 12 TAD
110 = 16 TAD
111 = 20 TAD
bit 2-0 ADCS2:ADCS0: A/D Conversion Clock Select bits
000 = FOSC/2
001 = FOSC/8
010 = FOSC/32
011 = FRC (clock derived from A/D RC oscillator)(1)
100 = FOSC/4
101 = FOSC/16
110 = FOSC/64
111 = FRC (clock derived from A/D RC oscillator)(1)
Note: If the A/D FRC clock source is selected, a delay of one TCY (instruction cycle) is
added before the A/D clock starts. This allows the SLEEP instruction to be executed
before starting a conversion.

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. DS39605F-page 157

PIC18F1220/1320
The analog reference voltage is software selectable to A device Reset forces all registers to their Reset state.
either the device’s positive and negative supply voltage This forces the A/D module to be turned off and any
(AVDD and AVSS), or the voltage level on the conversion in progress is aborted.
RA3/AN3/VREF+ and RA2/AN2/VREF- pins. Each port pin associated with the A/D converter can be
The A/D converter has a unique feature of being able configured as an analog input, or as a digital I/O. The
to operate while the device is in Sleep mode. To oper- ADRESH and ADRESL registers contain the result of
ate in Sleep, the A/D conversion clock must be derived the A/D conversion. When the A/D conversion is com-
from the A/D’s internal RC oscillator. plete, the result is loaded into the ADRESH/ADRESL
The output of the sample and hold is the input into the registers, the GO/DONE bit (ADCON0 register) is
converter, which generates the result via successive cleared and A/D Interrupt Flag bit, ADIF, is set. The block
approximation. diagram of the A/D module is shown in Figure 17-1.

FIGURE 17-1: A/D BLOCK DIAGRAM

AVDD
CHS2:CHS0

111

110
AN6(1)
101
AN5
100
AN4
VAIN
(Input Voltage) 011
10-bit AN3/VREF+
Converter
A/D 010
AN2/VREF-
001
VCFG1:VCFG0 AN1

AVDD 000
AN0
x0
VREFH x1
Reference 1x
Voltage VREFL 0x

AVSS

Note 1: I/O pins have diode protection to VDD and VSS.

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 PIC18F1220/1320
The value in the ADRESH/ADRESL registers is not To do an A/D Conversion:
modified for a Power-on Reset. The ADRESH/ADRESL 1. Configure the A/D module:
registers will contain unknown data after a Power-on
• Configure analog pins, voltage reference and
Reset.
digital I/O (ADCON1)
After the A/D module has been configured as desired, • Select A/D input channel (ADCON0)
the selected channel must be acquired before the con-
• Select A/D acquisition time (ADCON2)
version is started. The analog input channels must
have their corresponding TRIS bits selected as an • Select A/D conversion clock (ADCON2)
input. To determine acquisition time, see Section 17.1 • Turn on A/D module (ADCON0)
“A/D Acquisition Requirements”. After this acquisi- 2. Configure A/D interrupt (if desired):
tion time has elapsed, the A/D conversion can be • Clear ADIF bit
started. An acquisition time can be programmed to
• Set ADIE bit
occur between setting the GO/DONE bit and the actual
start of the conversion. • Set GIE bit
3. Wait the required acquisition time (if required).
4. Start conversion:
• Set GO/DONE bit (ADCON0 register)
5. Wait for A/D conversion to complete, by either:
• Polling for the GO/DONE bit to be cleared
OR
• Waiting for the A/D interrupt
6. Read A/D Result registers (ADRESH:ADRESL);
clear bit, ADIF, if required.
7. For the next conversion, go to step 1 or step 2,
as required. The A/D conversion time per bit is
defined as TAD. A minimum wait of 2 TAD is
required before the next acquisition starts.

FIGURE 17-2: ANALOG INPUT MODEL

VDD
Sampling
Switch
VT = 0.6V
Rs
ANx RIC ≤ 1k SS RSS

VAIN CPIN ILEAKAGE

VT = 0.6V CHOLD = 120 pF
5 pF ± 500 nA

VSS

Legend: CPIN = input capacitance

VT = threshold voltage 6V
ILEAKAGE = leakage current at the pin due to 5V
various junctions VDD 4V
RIC = interconnect resistance 3V
2V
SS = sampling switch
CHOLD = sample/hold capacitance (from DAC)
RSS = sampling switch resistance
5 6 7 8 9 10 11
Sampling Switch (kΩ)

© 2007 Microchip Technology Inc. DS39605F-page 159

PIC18F1220/1320
17.1 A/D Acquisition Requirements Example 17-1 shows the calculation of the minimum
required acquisition time, TACQ. This calculation is
For the A/D converter to meet its specified accuracy, based on the following application system
the charge holding capacitor (CHOLD) must be allowed assumptions:
to fully charge to the input channel voltage level. The
analog input model is shown in Figure 17-2. The CHOLD = 120 pF
source impedance (RS) and the internal sampling Rs = 2.5 kΩ
switch (RSS) impedance directly affect the time Conversion Error ≤ 1/2 LSb
required to charge the capacitor CHOLD. The sampling VDD = 5V → RSS = 7 kΩ
switch (RSS) impedance varies over the device voltage Temperature = 50°C (system max.)
(VDD). The source impedance affects the offset voltage VHOLD = 0V @ time = 0
at the analog input (due to pin leakage current). The
maximum recommended impedance for analog 17.2 A/D VREF+ and VREF- References
sources is 2.5 kΩ. After the analog input channel is
If external voltage references are used instead of the
selected (changed), the channel must be sampled for
internal AVDD and AVSS sources, the source imped-
at least the minimum acquisition time before starting a
ance of the VREF+ and VREF- voltage sources must be
conversion.
considered. During acquisition, currents supplied by
Note: When the conversion is started, the these sources are insignificant. However, during
holding capacitor is disconnected from the conversion, the A/D module sinks and sources current
input pin. through the reference sources.
To calculate the minimum acquisition time, In order to maintain the A/D accuracy, the voltage
Equation 17-1 may be used. This equation assumes reference source impedances should be kept low to
that 1/2 LSb error is used (1024 steps for the A/D). The reduce voltage changes. These voltage changes occur
1/2 LSb error is the maximum error allowed for the A/D as reference currents flow through the reference
to meet its specified resolution. source impedance. The maximum recommended
impedance of the VREF+ and VREF- external
reference voltage sources is 250Ω.

EQUATION 17-1: ACQUISITION TIME

TACQ = Amplifier Settling Time + Holding Capacitor Charging Time + Temperature Coefficient
= TAMP + TC + TCOFF

EQUATION 17-2: A/D MINIMUM CHARGING TIME

VHOLD = (ΔVREF – (ΔVREF/2048)) • (1 – e(-TC/CHOLD(RIC + RSS + RS)))
or
TC = -(CHOLD)(RIC + RSS + RS) ln(1/2048)

EXAMPLE 17-1: CALCULATING THE MINIMUM REQUIRED ACQUISITION TIME

TACQ = TAMP + TC + TCOFF
TAMP = 5 μs
TCOFF = (Temp – 25ºC)(0.05 μs/ºC)
(50ºC – 25ºC)(0.05 μs/ºC)
1.25 μs
Temperature coefficient is only required for temperatures > 25ºC. Below 25ºC, TCOFF = 0 μs.
TC = -(CHOLD)(RIC + RSS + RS) ln(1/2047) μs
-(120 pF) (1 kΩ + 7 kΩ + 2.5 kΩ) ln(0.0004883) μs
9.61 μs
TACQ = 5 μs + 1.25 μs + 9.61 μs
12.86 μs

DS39605F-page 160 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
17.3 Selecting and Configuring 17.4 Selecting the A/D Conversion
Automatic Acquisition Time Clock
The ADCON2 register allows the user to select an The A/D conversion time per bit is defined as TAD. The
acquisition time that occurs each time the GO/DONE A/D conversion requires 11 TAD per 10-bit conversion.
bit is set. The source of the A/D conversion clock is software
When the GO/DONE bit is set, sampling is stopped and selectable. There are seven possible options for TAD:
a conversion begins. The user is responsible for ensur- • 2 TOSC
ing the required acquisition time has passed between • 4 TOSC
selecting the desired input channel and setting the • 8 TOSC
GO/DONE bit. This occurs when the ACQT2:ACQT0
• 16 TOSC
bits (ADCON2<5:3>) remain in their Reset state (‘000’)
and is compatible with devices that do not offer • 32 TOSC
programmable acquisition times. • 64 TOSC
If desired, the ACQT bits can be set to select a • Internal RC oscillator
programmable acquisition time for the A/D module. For correct A/D conversions, the A/D conversion clock
When the GO/DONE bit is set, the A/D module contin- (TAD) must be as short as possible, but greater than the
ues to sample the input for the selected acquisition minimum TAD (approximately 2 μs, see parameter 130
time, then automatically begins a conversion. Since the for more information).
acquisition time is programmed, there may be no need
Table 17-1 shows the resultant TAD times derived from
to wait for an acquisition time between selecting a
the device operating frequencies and the A/D clock
channel and setting the GO/DONE bit.
source selected.
In either case, when the conversion is completed, the
GO/DONE bit is cleared, the ADIF flag is set and the
A/D begins sampling the currently selected channel
again. If an acquisition time is programmed, there is
nothing to indicate if the acquisition time has ended or
if the conversion has begun.

TABLE 17-1: TAD vs. DEVICE OPERATING FREQUENCIES

AD Clock Source (TAD) Maximum Device Frequency

Operation ADCS2:ADCS0 PIC18F1220/1320 PIC18LF1220/1320(4)

2 TOSC 000 1.25 MHz 666 kHz
4 TOSC 100 2.50 MHz 1.33 MHz
8 TOSC 001 5.00 MHz 2.66 MHz
16 TOSC 101 10.0 MHz 5.33 MHz
32 TOSC 010 20.0 MHz 10.65 MHz
64 TOSC 110 40.0 MHz 21.33 MHz
RC(3) x11 1.00 MHz(1) 1.00 MHz(2)
Note 1: The RC source has a typical TAD time of 4 μs.
2: The RC source has a typical TAD time of 6 μs.
3: For device frequencies above 1 MHz, the device must be in Sleep for the entire conversion or the A/D
accuracy may be out of specification.
4: Low-power devices only.

© 2007 Microchip Technology Inc. DS39605F-page 161

PIC18F1220/1320
17.5 Operation in Low-Power Modes 17.6 Configuring Analog Port Pins
The selection of the automatic acquisition time and the The ADCON1, TRISA and TRISB registers all configure
A/D conversion clock is determined, in part, by the low- the A/D port pins. The port pins needed as analog inputs
power mode clock source and frequency while in a must have their corresponding TRIS bits set (input). If
low-power mode. the TRIS bit is cleared (output), the digital output level
If the A/D is expected to operate while the device is (VOH or VOL) will be converted.
in a low-power mode, the ACQT2:ACQT0 and The A/D operation is independent of the state of the
ADCS2:ADCS0 bits in ADCON2 should be updated in CHS2:CHS0 bits and the TRIS bits.
accordance with the low-power mode clock that will be
used. After the low-power mode is entered (either of Note 1: When reading the Port register, all pins
the Run modes), an A/D acquisition or conversion may configured as analog input channels will
be started. Once an acquisition or conversion is read as cleared (a low level). Pins con-
started, the device should continue to be clocked by the figured as digital inputs will convert an
same low-power mode clock source until the conver- analog input. Analog levels on a digitally
sion has been completed. If desired, the device may be configured input will be accurately
placed into the corresponding low-power (ANY)_IDLE converted.
mode during the conversion. 2: Analog levels on any pin defined as a
If the low-power mode clock frequency is less than digital input may cause the digital input
1 MHz, the A/D RC clock source should be selected. buffer to consume current out of the
device’s specification limits.
Operation in the Low-Power Sleep mode requires the
A/D RC clock to be selected. If bits, ACQT2:ACQT0, are
set to ‘000’ and a conversion is started, the conversion
will be delayed one instruction cycle to allow execution
of the SLEEP instruction and entry to Low-Power Sleep
mode. The IDLEN and SCS bits in the OSCCON register
must have already been cleared prior to starting the
conversion.

DS39605F-page 162 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
17.7 A/D Conversions Clearing the GO/DONE bit during a conversion will
abort the current conversion. The A/D Result register
Figure 17-3 shows the operation of the A/D converter pair will NOT be updated with the partially completed
after the GO bit has been set and the ACQT2:ACQT0 A/D conversion sample. This means the
bits are cleared. A conversion is started after the follow- ADRESH:ADRESL registers will continue to contain
ing instruction to allow entry into Low-Power Sleep the value of the last completed conversion (or the last
mode before the conversion begins. value written to the ADRESH:ADRESL registers).
Figure 17-4 shows the operation of the A/D converter After the A/D conversion is completed or aborted, a
after the GO bit has been set and the ACQT2:ACQT0 2 TAD wait is required before the next acquisition can
bits are set to ‘010’ and selecting a 4 TAD acquisition be started. After this wait, acquisition on the selected
time before the conversion starts. channel is automatically started.
Note: The GO/DONE bit should NOT be set in
the same instruction that turns on the A/D.

FIGURE 17-3: A/D CONVERSION TAD CYCLES (ACQT<2:0> = 000, TACQ = 0)

TCY – TAD TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 TAD10 TAD11
b9 b8 b7 b6 b5 b4 b3 b2 b1 b0

Conversion Starts
Holding capacitor is disconnected from analog input (typically 100 ns)

Set GO bit

Next Q4: ADRESH/ADRESL is loaded, GO bit is cleared,

ADIF bit is set, holding capacitor is connected to analog input.

FIGURE 17-4: A/D CONVERSION TAD CYCLES (ACQT<2:0> = 010, TACQ = 4 TAD)

TACQT Cycles TAD Cycles

1 2 3 4 1 2 3 4 5 6 7 8 9 10 11
b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
Automatic
Acquisition Conversion Starts
Time (Holding capacitor is disconnected)

Set GO bit
(Holding capacitor continues
acquiring input) Next Q4: ADRESH:ADRESL is loaded, GO bit is cleared,
ADIF bit is set, holding capacitor is reconnected to analog input.

© 2007 Microchip Technology Inc. DS39605F-page 163

PIC18F1220/1320
17.8 Use of the CCP1 Trigger software overhead (moving ADRESH/ADRESL to the
desired location). The appropriate analog input
An A/D conversion can be started by the “special event channel must be selected and the minimum acquisition
trigger” of the CCP1 module. This requires that the period is either timed by the user, or an appropriate
CCP1M3:CCP1M0 bits (CCP1CON<3:0>) be pro- TACQ time selected before the “special event trigger”
grammed as ‘1011’ and that the A/D module is enabled sets the GO/DONE bit (starts a conversion).
(ADON bit is set). When the trigger occurs, the
GO/DONE bit will be set, starting the A/D acquisition If the A/D module is not enabled (ADON is cleared), the
and conversion and the Timer1 (or Timer3) counter will “special event trigger” will be ignored by the A/D
be reset to zero. Timer1 (or Timer3) is reset to auto- module, but will still reset the Timer1 (or Timer3)
matically repeat the A/D acquisition period with minimal counter.

TABLE 17-2: SUMMARY OF A/D REGISTERS

Value on
Value on
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 all other
POR, BOR
Resets
INTCON GIE/ PEIE/ TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 0000 0000 0000
GIEH GIEL
PIR1 — ADIF RCIF TXIF — CCP1IF TMR2IF TMR1IF -000 -000 -000 -000
PIE1 — ADIE RCIE TXIE — CCP1IE TMR2IE TMR1IE -000 -000 -000 -000
IPR1 — ADIP RCIP TXIP — CCP1IP TMR2IP TMR1IP -111 -111 -111 -111
PIR2 OSCFIF — — EEIF — LVDIF TMR3IF — 0--0 -00- 0--0 -00-
PIE2 OSCFIE — — EEIE — LVDIE TMR3IE — 0--0 -00- 0--0 -00-
IPR2 OSCFIP — — EEIP — LVDIP TMR3IP — 1--1 -11- 1--1 -11-
ADRESH A/D Result Register High Byte xxxx xxxx uuuu uuuu
ADRESL A/D Result Register Low Byte xxxx xxxx uuuu uuuu
ADCON0 VCFG1 VCFG0 — CHS2 CHS1 CHS0 GO/DONE ADON 00-0 0000 00-0 0000
ADCON1 — PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 -000 0000 -000 0000
ADCON2 ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 0-00 0000 0-00 0000
PORTA RA7(3) RA6(2) RA5(1) RA4 RA3 RA2 RA1 RA0 qq0x 0000 uu0u 0000
TRISA TRISA7(3) TRISA6(2) — PORTA Data Direction Register qq-1 1111 11-1 1111
PORTB Read PORTB pins, Write LATB Latch xxxx xxxx uuuu uuuu
TRISB PORTB Data Direction Register 1111 1111 1111 1111
LATB PORTB Output Data Latch xxxx xxxx uuuu uuuu
Legend: x = unknown, u = unchanged, q = depends on CONFIG1H<3:0>, – = unimplemented, read as ‘0’.
Shaded cells are not used for A/D conversion.
Note 1: RA5 port bit is available only as an input pin when the MCLRE bit in the configuration register is ‘0’.
2: RA6 and TRISA6 are available only when the primary oscillator mode selection offers RA6 as a port pin; otherwise, RA6
always reads ‘0’, TRISA6 always reads ‘1’ and writes to both are ignored (see CONFIG1H<3:0>).
3: RA7 and TRISA7 are available only when the internal RC oscillator is configured as the primary oscillator in
CONFIG1H<3:0>; otherwise, RA7 always reads ‘0’, TRISA7 always reads ‘1’ and writes to both are ignored.

DS39605F-page 164 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
18.0 LOW-VOLTAGE DETECT Figure 18-1 shows a possible application voltage curve
(typically for batteries). Over time, the device voltage
In many applications, the ability to determine if the decreases. When the device voltage equals voltage VA,
device voltage (VDD) is below a specified voltage level the LVD logic generates an interrupt. This occurs at
is a desirable feature. A window of operation for the time TA. The application software then has the time,
application can be created, where the application soft- until the device voltage is no longer in valid operating
ware can do “housekeeping tasks”, before the device range, to shut down the system. Voltage point VB is the
voltage exits the valid operating range. This can be minimum valid operating voltage specification. This
done using the Low-Voltage Detect module. occurs at time TB. The difference, TB – TA, is the total
This module is a software programmable circuitry, time for shutdown.
where a device voltage trip point can be specified. The block diagram for the LVD module is shown in
When the voltage of the device becomes lower then the Figure 18-2 (following page). A comparator uses an
specified point, an interrupt flag is set. If the interrupt is internally generated reference voltage as the set point.
enabled, the program execution will branch to the inter- When the selected tap output of the device voltage
rupt vector address and the software can then respond crosses the set point (is lower than), the LVDIF bit is set.
to that interrupt source.
Each node in the resistor divider represents a “trip
The Low-Voltage Detect circuitry is completely under point” voltage. The “trip point” voltage is the minimum
software control. This allows the circuitry to be turned supply voltage level at which the device can operate
off by the software, which minimizes the current before the LVD module asserts an interrupt. When the
consumption for the device. supply voltage is equal to the trip point, the voltage
tapped off of the resistor array is equal to the 1.2V
internal reference voltage generated by the voltage
reference module. The comparator then generates an
interrupt signal setting the LVDIF bit. This voltage is
software programmable to any one of 16 values (see
Figure 18-2). The trip point is selected by
programming the LVDL3:LVDL0 bits (LVDCON<3:0>).

FIGURE 18-1: TYPICAL LOW-VOLTAGE DETECT APPLICATION

VA
VB
Voltage

Legend: VA = LVD trip point

VB = Minimum valid device
operating voltage

TA TB
Time

© 2007 Microchip Technology Inc. DS39605F-page 165

PIC18F1220/1320
FIGURE 18-2: LOW-VOLTAGE DETECT (LVD) BLOCK DIAGRAM
VDD LVDIN
LVD Control
Register

16-to-1 MUX
LVDIF

LVDEN Internally Generated

Reference Voltage
1.2V

The LVD module has an additional feature that allows LVDIN (Figure 18-3). This gives users flexibility,
the user to supply the trip voltage to the module from because it allows them to configure the Low-Voltage
an external source. This mode is enabled when bits, Detect interrupt to occur at any voltage in the valid
LVDL3:LVDL0, are set to ‘1111’. In this state, the com- operating range.
parator input is multiplexed from the external input pin,

FIGURE 18-3: LOW-VOLTAGE DETECT (LVD) WITH EXTERNAL INPUT BLOCK DIAGRAM
VDD
VDD
LVD Control
Register
16-to-1 MUX

LVDIN LVDEN
Externally Generated
Trip Point
LVD

VxEN

BODEN

EN
BGAP

DS39605F-page 166 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
18.1 Control Register
The Low-Voltage Detect Control register controls the
operation of the Low-Voltage Detect circuitry.

REGISTER 18-1: LVDCON REGISTER

U-0 U-0 R-0 R/W-0 R/W-0 R/W-1 R/W-0 R/W-1
— — IRVST LVDEN LVDL3 LVDL2 LVDL1 LVDL0
bit 7 bit 0

bit 7-6 Unimplemented: Read as ‘0’

bit 5 IRVST: Internal Reference Voltage Stable Flag bit
1 = Indicates that the Low-Voltage Detect logic will generate the interrupt flag at the specified
voltage range
0 = Indicates that the Low-Voltage Detect logic will not generate the interrupt flag at the
specified voltage range and the LVD interrupt should not be enabled
bit 4 LVDEN: Low-Voltage Detect Power Enable bit
1 = Enables LVD, powers up LVD circuit
0 = Disables LVD, powers down LVD circuit
bit 3-0 LVDL3:LVDL0: Low-Voltage Detection Limit bits
1111 = External analog input is used (input comes from the LVDIN pin)
1110 = 4.04V-5.15V
1101 = 3.76V-4.79V
1100 = 3.58V-4.56V
1011 = 3.41V-4.34V
1010 = 3.23V-4.11V
1001 = 3.14V-4.00V
1000 = 2.96V-3.77V
0111 = 2.70V-3.43V
0110 = 2.53V-3.21V
0101 = 2.43V-3.10V
0100 = 2.25V-2.86V
0011 = 2.16V-2.75V
0010 = 1.99V-2.53V
0001 = Reserved
0000 = Reserved
Note: LVDL3:LVDL0 modes, which result in a trip point below the valid operating voltage
of the device, are not tested.

Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. DS39605F-page 167

PIC18F1220/1320
18.2 Operation The following steps are needed to set up the LVD
module:
Depending on the power source for the device voltage,
the voltage normally decreases relatively slowly. This 1. Write the value to the LVDL3:LVDL0 bits
means that the LVD module does not need to be (LVDCON register), which selects the desired
constantly operating. To decrease the current require- LVD trip point.
ments, the LVD circuitry only needs to be enabled for 2. Ensure that LVD interrupts are disabled (the
short periods, where the voltage is checked. After LVDIE bit is cleared or the GIE bit is cleared).
doing the check, the LVD module may be disabled. 3. Enable the LVD module (set the LVDEN bit in
Each time that the LVD module is enabled, the circuitry the LVDCON register).
requires some time to stabilize. After the circuitry has 4. Wait for the LVD module to stabilize (the IRVST
stabilized, all status flags may be cleared. The module bit to become set).
will then indicate the proper state of the system. 5. Clear the LVD interrupt flag, which may have
falsely become set, until the LVD module has
stabilized (clear the LVDIF bit).
6. Enable the LVD interrupt (set the LVDIE and the
GIE bits).
Figure 18-4 shows typical waveforms that the LVD
module may be used to detect.

FIGURE 18-4: LOW-VOLTAGE DETECT WAVEFORMS

CASE 1:
LVDIF may not be set.

VDD

VLVD

LVDIF

Enable LVD

Internally Generated TIVRST

Reference Stable
LVDIF cleared in software

CASE 2:

VDD
VLVD

LVDIF

Enable LVD

Internally Generated TIVRST

Reference Stable

LVDIF cleared in software

LVDIF cleared in software,

LVDIF remains set since LVD condition still exists

DS39605F-page 168 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
18.2.1 REFERENCE VOLTAGE SET POINT 18.3 Operation During Sleep
The internal reference voltage of the LVD module may When enabled, the LVD circuitry continues to operate
be used by other internal circuitry (the programmable during Sleep. If the device voltage crosses the trip
Brown-out Reset). If these circuits are disabled (lower point, the LVDIF bit will be set and the device will wake-
current consumption), the reference voltage circuit up from Sleep. Device execution will continue from the
requires a time to become stable before a low-voltage interrupt vector address if interrupts have been globally
condition can be reliably detected. This time is invariant enabled.
of system clock speed. This start-up time is specified in
electrical specification parameter 36. The low-voltage
18.4 Effects of a Reset
interrupt flag will not be enabled until a stable reference
voltage is reached. Refer to the waveform in Figure 18-4. A device Reset forces all registers to their Reset state.
This forces the LVD module to be turned off.
18.2.2 CURRENT CONSUMPTION
When the module is enabled, the LVD comparator and
voltage divider are enabled and will consume static cur-
rent. The voltage divider can be tapped from multiple
places in the resistor array. Total current consumption,
when enabled, is specified in electrical specification
parameter D022B.

© 2007 Microchip Technology Inc. DS39605F-page 169

PIC18F1220/1320
NOTES:

DS39605F-page 170 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
19.0 SPECIAL FEATURES OF The inclusion of an internal RC oscillator also provides
the additional benefits of a Fail-Safe Clock Monitor
THE CPU
(FSCM) and Two-Speed Start-up. FSCM provides for
PIC18F1220/1320 devices include several features background monitoring of the peripheral clock and
intended to maximize system reliability, minimize cost automatic switchover in the event of its failure. Two-
through elimination of external components and offer Speed Start-up enables code to be executed almost
code protection. These are: immediately on start-up, while the primary clock source
completes its start-up delays.
• Oscillator Selection
• Resets: All of these features are enabled and configured by
setting the appropriate configuration register bits.
- Power-on Reset (POR)
- Power-up Timer (PWRT)
19.1 Configuration Bits
- Oscillator Start-up Timer (OST)
- Brown-out Reset (BOR) The configuration bits can be programmed (read as
• Interrupts ‘0’), or left unprogrammed (read as ‘1’), to select vari-
ous device configurations. These bits are mapped
• Watchdog Timer (WDT)
starting at program memory location 300000h.
• Fail-Safe Clock Monitor
The user will note that address 300000h is beyond the
• Two-Speed Start-up
user program memory space. In fact, it belongs to the
• Code Protection configuration memory space (300000h-3FFFFFh),
• ID Locations which can only be accessed using table reads and
• In-Circuit Serial Programming table writes.
Several oscillator options are available to allow the part Programming the configuration registers is done in a
to fit the application. The RC oscillator option saves manner similar to programming the Flash memory. The
system cost, while the LP crystal option saves power. EECON1 register WR bit starts a self-timed write to the
These are discussed in detail in Section 2.0 “Oscillator configuration register. In normal operation mode, a
Configurations”. TBLWT instruction, with the TBLPTR pointing to the
configuration register, sets up the address and the data
A complete discussion of device Resets and interrupts
for the configuration register write. Setting the WR bit
is available in previous sections of this data sheet.
starts a long write to the configuration register. The con-
In addition to their Power-up and Oscillator Start-up figuration registers are written a byte at a time. To write
Timers provided for Resets, PIC18F1220/1320 devices or erase a configuration cell, a TBLWT instruction can
have a Watchdog Timer, which is either permanently write a ‘1’ or a ‘0’ into the cell. For additional details on
enabled via the configuration bits, or software Flash programming, refer to Section 6.5 “Writing to
controlled (if configured as disabled). Flash Program Memory”.

TABLE 19-1: CONFIGURATION BITS AND DEVICE IDS

Default/
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Unprogrammed
Value
300001h CONFIG1H IESO FSCM — — FOSC3 FOSC2 FOSC1 FOSC0 11-- 1111
300002h CONFIG2L — — — — BORV1 BORV0 BOR PWRTEN ---- 1111
300003h CONFIG2H — — — WDTPS3 WDTPS2 WDTPS1 WDTPS0 WDT ---1 1111
300005h CONFIG3H MCLRE — — — — — — — 1--- ----
300006h CONFIG4L DEBUG — — — — LVP — STVR 1--- -1-1
300008h CONFIG5L — — — — — — CP1 CP0 ---- --11
300009h CONFIG5H CPD CPB — — — — — — 11-- ----
30000Ah CONFIG6L — — — — — — WRT1 WRT0 ---- --11
30000Bh CONFIG6H WRTD WRTB WRTC — — — — — 111- ----
30000Ch CONFIG7L — — — — — — EBTR1 EBTR0 ---- --11
30000Dh CONFIG7H — EBTRB — — — — — — -1-- ----
3FFFFEh DEVID1(1) DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0 xxxx xxxx(1)
3FFFFFh DEVID2(1) DEV10 DEV9 DEV8 DEV7 DEV6 DEV5 DEV4 DEV3 0000 0111
Legend: x = unknown, u = unchanged, – = unimplemented. Shaded cells are unimplemented, read as ‘0’.
Note 1: See Register 19-14 for DEVID1 values. DEVID registers are read-only and cannot be programmed by the user.

© 2007 Microchip Technology Inc. DS39605F-page 171

PIC18F1220/1320
REGISTER 19-1: CONFIG1H: CONFIGURATION REGISTER 1 HIGH (BYTE ADDRESS 300001h)
R/P-1 R/P-1 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1
IESO FSCM — — FOSC3 FOSC2 FOSC1 FOSC0
bit 7 bit 0

bit 7 IESO: Internal External Switchover bit

1 = Internal External Switchover mode enabled
0 = Internal External Switchover mode disabled
bit 6 FSCM: Fail-Safe Clock Monitor Enable bit
1 = Fail-Safe Clock Monitor enabled
0 = Fail-Safe Clock Monitor disabled
bit 5-4 Unimplemented: Read as ‘0’
bit 3-0 FOSC<3:0>: Oscillator Selection bits
11xx = External RC oscillator, CLKO function on RA6
1001 = Internal RC oscillator, CLKO function on RA6 and port function on RA7
1000 = Internal RC oscillator, port function on RA6 and port function on RA7
0111 = External RC oscillator, port function on RA6
0110 = HS oscillator, PLL enabled (clock frequency = 4 x FOSC1)
0101 = EC oscillator, port function on RA6
0100 = EC oscillator, CLKO function on RA6
0010 = HS oscillator
0001 = XT oscillator
0000 = LP oscillator

Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed u = Unchanged from programmed state

DS39605F-page 172 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
REGISTER 19-2: CONFIG2L: CONFIGURATION REGISTER 2 LOW (BYTE ADDRESS 300002h)
U-0 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1
— — — — BORV1 BORV0 BOR PWRTEN
bit 7 bit 0

bit 7-4 Unimplemented: Read as ‘0’

bit 3-2 BORV1:BORV0: Brown-out Reset Voltage bits
11 = Reserved
10 = VBOR set to 2.7V
01 = VBOR set to 4.2V
00 = VBOR set to 4.5V
bit 1 BOR: Brown-out Reset Enable bit(1)
1 = Brown-out Reset enabled
0 = Brown-out Reset disabled
bit 0 PWRTEN: Power-up Timer Enable bit(1)
1 = PWRT disabled
0 = PWRT enabled
Note 1: The Power-up Timer is decoupled from Brown-out Reset, allowing these features to
be independently controlled.

Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed u = Unchanged from programmed state

© 2007 Microchip Technology Inc. DS39605F-page 173

PIC18F1220/1320
REGISTER 19-3: CONFIG2H: CONFIGURATION REGISTER 2 HIGH (BYTE ADDRESS 300003h)
U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1
— — — WDTPS3 WDTPS2 WDTPS1 WDTPS0 WDTEN
bit 7 bit 0

bit 7-5 Unimplemented: Read as ‘0’

bit 4-1 WDTPS<3:0>: Watchdog Timer Postscale Select bits
1111 = 1:32,768
1110 = 1:16,384
1101 = 1:8,192
1100 = 1:4,096
1011 = 1:2,048
1010 = 1:1,024
1001 = 1:512
1000 = 1:256
0111 = 1:128
0110 = 1:64
0101 = 1:32
0100 = 1:16
0011 = 1:8
0010 = 1:4
0001 = 1:2
0000 = 1:1
bit 0 WDT: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled (control is placed on the SWDTEN bit)

Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed u = Unchanged from programmed state

DS39605F-page 174 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
REGISTER 19-4: CONFIG3H: CONFIGURATION REGISTER 3 HIGH (BYTE ADDRESS 300005h)
R/P-1 U-0 U-0 U-0 U-0 U-0 U-0 U-0
MCLRE — — — — — — —
bit 7 bit 0

bit 7 MCLRE: MCLR Pin Enable bit

1 = MCLR pin enabled, RA5 input pin disabled
0 = RA5 input pin enabled, MCLR disabled
bit 6-0 Unimplemented: Read as ‘0’

Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed u = Unchanged from programmed state

REGISTER 19-5: CONFIG4L: CONFIGURATION REGISTER 4 LOW (BYTE ADDRESS 300006h)

R/P-1 U-0 U-0 U-0 U-0 R/P-1 U-0 R/P-1
DEBUG — — — — LVP — STVR
bit 7 bit 0

bit 7 DEBUG: Background Debugger Enable bit (see note)

1 = Background debugger disabled, RB6 and RB7 configured as general purpose I/O pins
0 = Background debugger enabled, RB6 and RB7 are dedicated to In-Circuit Debug
bit 6-3 Unimplemented: Read as ‘0’
bit 2 LVP: Low-Voltage ICSP Enable bit
1 = Low-Voltage ICSP enabled
0 = Low-Voltage ICSP disabled
bit 1 Unimplemented: Read as ‘0’
bit 0 STVR: Stack Full/Underflow Reset Enable bit
1 = Stack full/underflow will cause Reset
0 = Stack full/underflow will not cause Reset

Legend:
R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed u = Unchanged from programmed state

Note: The Timer1 oscillator shares the T1OSI and T1OSO pins with the PGD and PGC
pins used for programming and debugging.
When using the Timer1 oscillator, In-Circuit Serial Programming (ICSP) may not
function correctly (high voltage or low voltage), or the In-Circuit Debugger (ICD) may
not communicate with the controller. As a result of using either ICSP or ICD, the
Timer1 crystal may be damaged.
If ICSP or ICD operations are required, the crystal should be disconnected from the
circuit (disconnect either lead) or installed after programming. The oscillator loading
capacitors may remain in-circuit during ICSP or ICD operation.

© 2007 Microchip Technology Inc. DS39605F-page 175

PIC18F1220/1320
REGISTER 19-6: CONFIG5L: CONFIGURATION REGISTER 5 LOW (BYTE ADDRESS 300008h)
U-0 U-0 U-0 U-0 R/C-1 R/C-1 R/C-1 R/C-1
— — — — — — CP1 CP0
bit 7 bit 0

bit 7-2 Unimplemented: Read as ‘0’

bit 1 CP1: Code Protection bit (PIC18F1320)
1 = Block 1 (001000-001FFFh) not code-protected
0 = Block 1 (001000-001FFFh) code-protected
bit 0 CP0: Code Protection bit (PIC18F1320)
1 = Block 0 (00200-000FFFh) not code-protected
0 = Block 0 (00200-000FFFh) code-protected
bit 1 CP1: Code Protection bit (PIC18F1220)
1 = Block 1 (000800-000FFFh) not code-protected
0 = Block 1 (000800-000FFFh) code-protected
bit 0 CP0: Code Protection bit (PIC18F1220)
1 = Block 0 (000200-0007FFh) not code-protected
0 = Block 0 (000200-0007FFh) code-protected

Legend:
R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed u = Unchanged from programmed state

REGISTER 19-7: CONFIG5H: CONFIGURATION REGISTER 5 HIGH (BYTE ADDRESS 300009h)

R/C-1 R/C-1 U-0 U-0 U-0 U-0 U-0 U-0
CPD CPB — — — — — —
bit 7 bit 0

bit 7 CPD: Data EEPROM Code Protection bit

1 = Data EEPROM not code-protected
0 = Data EEPROM code-protected
bit 6 CPB: Boot Block Code Protection bit
1 = Boot Block (000000-0001FFh) not code-protected
0 = Boot Block (000000-0001FFh) code-protected
bit 5-0 Unimplemented: Read as ‘0’

Legend:
R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed u = Unchanged from programmed state

DS39605F-page 176 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
REGISTER 19-8: CONFIG6L: CONFIGURATION REGISTER 6 LOW (BYTE ADDRESS 30000Ah)
U-0 U-0 U-0 U-0 U-0 U-0 R/P-1 R/P-1
— — — — — — WRT1 WRT0
bit 7 bit 0

bit 7-2 Unimplemented: Read as ‘0’

bit 1 WRT1: Write Protection bit (PIC18F1320)
1 = Block 1 (001000-001FFFh) not write-protected
0 = Block 1 (001000-001FFFh) write-protected
bit 0 WRT0: Write Protection bit (PIC18F1320)
1 = Block 0 (00200-000FFFh) not write-protected
0 = Block 0 (00200-000FFFh) write-protected
bit 1 WRT1: Write Protection bit (PIC18F1220)
1 = Block 1 (000800-000FFFh) not write-protected
0 = Block 1 (000800-000FFFh) write-protected
bit 0 WRT0: Write Protection bit (PIC18F1220)
1 = Block 0 (000200-0007FFh) not write-protected
0 = Block 0 (000200-0007FFh) write-protected

Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed u = Unchanged from programmed state

REGISTER 19-9: CONFIG6H: CONFIGURATION REGISTER 6 HIGH (BYTE ADDRESS 30000Bh)

R/P-1 R/P-1 R-1 U-0 U-0 U-0 U-0 U-0
WRTD WRTB WRTC — — — — —
bit 7 bit 0

bit 7 WRTD: Data EEPROM Write Protection bit

1 = Data EEPROM not write-protected
0 = Data EEPROM write-protected
bit 6 WRTB: Boot Block Write Protection bit
1 = Boot Block (000000-0001FFh) not write-protected
0 = Boot Block (000000-0001FFh) write-protected
bit 5 WRTC: Configuration Register Write Protection bit
1 = Configuration registers (300000-3000FFh) not write-protected
0 = Configuration registers (300000-3000FFh) write-protected
Note: This bit is read-only in normal execution mode; it can be written only in Program mode.
bit 4-0 Unimplemented: Read as ‘0’

Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed u = Unchanged from programmed state

© 2007 Microchip Technology Inc. DS39605F-page 177

PIC18F1220/1320
REGISTER 19-10: CONFIG7L: CONFIGURATION REGISTER 7 LOW (BYTE ADDRESS 30000Ch)
U-0 U-0 U-0 U-0 U-0 U-0 R/P-1 R/P-1
— — — — — — EBTR1 EBTR0
bit 7 bit 0

bit 7-2 Unimplemented: Read as ‘0’

bit 1 EBTR1: Table Read Protection bit (PIC18F1320)
1 = Block 1 (001000-001FFFh) not protected from table reads executed in other blocks
0 = Block 1 (001000-001FFFh) protected from table reads executed in other blocks
bit 0 EBTR0: Table Read Protection bit (PIC18F1320)
1 = Block 0 (00200-000FFFh) not protected from table reads executed in other blocks
0 = Block 0 (00200-000FFFh) protected from table reads executed in other blocks
bit 1 EBTR1: Table Read Protection bit (PIC18F1220)
1 = Block 1 (000800-000FFFh) not protected from table reads executed in other blocks
0 = Block 1 (000800-000FFFh) protected from table reads executed in other blocks
bit 0 EBTR0: Table Read Protection bit (PIC18F1220)
1 = Block 0 (000200-0007FFh) not protected from table reads executed in other blocks
0 = Block 0 (000200-0007FFh) protected from table reads executed in other blocks

Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed u = Unchanged from programmed state

REGISTER 19-11: CONFIG7H: CONFIGURATION REGISTER 7 HIGH (BYTE ADDRESS 30000Dh)

U-0 R/P-1 U-0 U-0 U-0 U-0 U-0 U-0
— EBTRB — — — — — —
bit 7 bit 0

bit 7 Unimplemented: Read as ‘0’

bit 6 EBTRB: Boot Block Table Read Protection bit
1 = Boot Block (000000-0001FFh) not protected from table reads executed in other blocks
0 = Boot Block (000000-0001FFh) protected from table reads executed in other blocks
bit 5-0 Unimplemented: Read as ‘0’

Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed u = Unchanged from programmed state

DS39605F-page 178 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
REGISTER 19-12: DEVID1: DEVICE ID REGISTER 1 FOR PIC18F1220/1320 DEVICES
R R R R R R R R
DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0
bit 7 bit 0

bit 7-5 DEV2:DEV0: Device ID bits

111 = PIC18F1220
110 = PIC18F1320
bit 4-0 REV4:REV0: Revision ID bits
These bits are used to indicate the device revision.

Legend:
R = Read-only bit P = Programmable bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed u = Unchanged from programmed state

REGISTER 19-13: DEVID2: DEVICE ID REGISTER 2 FOR PIC18F1220/1320 DEVICES

R R R R R R R R
DEV10 DEV9 DEV8 DEV7 DEV6 DEV5 DEV4 DEV3
bit 7 bit 0

bit 7-0 DEV10:DEV3: Device ID bits

These bits are used with the DEV2:DEV0 bits in the Device ID Register 1 to identify the
part number.
0000 0111 = PIC18F1220/1320 devices
Note: These values for DEV10:DEV3 may be shared with other devices. The specific
device is always identified by using the entire DEV10:DEV0 bit sequence.

Legend:
R = Read-only bit P = Programmable bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed u = Unchanged from programmed state

© 2007 Microchip Technology Inc. DS39605F-page 179

PIC18F1220/1320
19.2 Watchdog Timer (WDT) Note 1: The CLRWDT and SLEEP instructions
For PIC18F1220/1320 devices, the WDT is driven by the clear the WDT and postscaler counts
INTRC source. When the WDT is enabled, the clock when executed.
source is also enabled. The nominal WDT period is 4 ms 2: Changing the setting of the IRCF bits
and has the same stability as the INTRC oscillator. (OSCCON<6:4>) clears the WDT and
The 4 ms period of the WDT is multiplied by a 16-bit postscaler counts.
postscaler. Any output of the WDT postscaler is selected 3: When a CLRWDT instruction is executed
by a multiplexer, controlled by bits in Configuration the postscaler count will be cleared.
Register 2H. Available periods range from 4 ms to
131.072 seconds (2.18 minutes). The WDT and 19.2.1 CONTROL REGISTER
postscaler are cleared when any of the following events
Register 19-14 shows the WDTCON register. This is a
occur: execute a SLEEP or CLRWDT instruction, the IRCF
readable and writable register, which contains a control
bits (OSCCON<6:4>) are changed or a clock failure has
bit that allows software to override the WDT enable
occurred.
configuration bit, only if the configuration bit has
Adjustments to the internal oscillator clock period using disabled the WDT.
the OSCTUNE register also affect the period of the
WDT by the same factor. For example, if the INTRC
period is increased by 3%, then the WDT period is
increased by 3%.

FIGURE 19-1: WDT BLOCK DIAGRAM

SWDTEN Enable WDT

INTRC Control
WDTEN
WDT Counter

INTRC Oscillator ÷125 Wake-up

(31 kHz) from Sleep

CLRWDT
Programmable Postscaler Reset WDT
All Device Reset
Resets 1:1 to 1:32,768
WDT
WDTPS<3:0> 4

Sleep

REGISTER 19-14: WDTCON REGISTER

U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0
— — — — — — — SWDTEN
bit 7 bit 0

bit 7-1 Unimplemented: Read as ‘0’

bit 0 SWDTEN: Software Controlled Watchdog Timer Enable bit
1 = Watchdog Timer is on
0 = Watchdog Timer is off
Note: This bit has no effect if the configuration bit, WDTEN (CONFIG2H<0>), is enabled.

Legend:
R = Readable bit W = Writable bit -n = Value at POR
U = Unimplemented bit, read as ‘0’

DS39605F-page 180 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
TABLE 19-2: SUMMARY OF WATCHDOG TIMER REGISTERS
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
CONFIG2H — — — WDTPS3 WDTPS2 WDTPS2 WDTPS0 WDTEN
RCON IPEN — — RI TO PD POR BOR
WDTCON — — — — — — — SWDTEN
Legend: Shaded cells are not used by the Watchdog Timer.

19.3 Two-Speed Start-up In all other power managed modes, Two-Speed Start-up
is not used. The device will be clocked by the currently
The Two-Speed Start-up feature helps to minimize the selected clock source until the primary clock source
latency period from oscillator start-up to code execution becomes available. The setting of the IESO bit is
by allowing the microcontroller to use the INTRC oscil- ignored.
lator as a clock source until the primary clock source is
available. It is enabled by setting the IESO bit in 19.3.1 SPECIAL CONSIDERATIONS FOR
Configuration Register 1H (CONFIG1H<7>). USING TWO-SPEED START-UP
Two-Speed Start-up is available only if the primary oscil- While using the INTRC oscillator in Two-Speed Start-
lator mode is LP, XT, HS or HSPLL (crystal-based up, the device still obeys the normal command
modes). Other sources do not require an OST start-up sequences for entering power managed modes, includ-
delay; for these, Two-Speed Start-up is disabled. ing serial SLEEP instructions (refer to Section 3.1.3
When enabled, Resets and wake-ups from Sleep mode “Multiple Sleep Commands”). In practice, this means
cause the device to configure itself to run from the that user code can change the SCS1:SCS0 bit settings
internal oscillator block as the clock source, following and issue SLEEP commands before the OST times out.
the time-out of the Power-up Timer after a Power-on This would allow an application to briefly wake-up, per-
Reset is enabled. This allows almost immediate code form routine “housekeeping” tasks and return to Sleep
execution while the primary oscillator starts and the before the device starts to operate from the primary
OST is running. Once the OST times out, the device oscillator.
automatically switches to PRI_RUN mode. User code can also check if the primary clock source is
Because the OSCCON register is cleared on Reset currently providing the system clocking by checking the
events, the INTOSC (or postscaler) clock source is not status of the OSTS bit (OSCCON<3>). If the bit is set,
initially available after a Reset event; the INTRC clock the primary oscillator is providing the system clock.
is used directly at its base frequency. To use a higher Otherwise, the internal oscillator block is providing the
clock speed on wake-up, the INTOSC or postscaler clock during wake-up from Reset or Sleep mode.
clock sources can be selected to provide a higher clock
speed by setting bits, IFRC2:IFRC0, immediately after
Reset. For wake-ups from Sleep, the INTOSC or
postscaler clock sources can be selected by setting
IFRC2:IFRC0 prior to entering Sleep mode.

FIGURE 19-2: TIMING TRANSITION FOR TWO-SPEED START-UP (INTOSC TO HSPLL)

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

INTOSC
Multiplexer
OSC1
TOST(1) TPLL(1)
PLL Clock
Output 1 2 3 4 5 6 7 8
Clock Transition

CPU Clock

Peripheral
Clock
Program PC PC + 2 PC + 4 PC + 6
Counter

Wake from Interrupt Event OSTS bit Set

Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.

© 2007 Microchip Technology Inc. DS39605F-page 181

PIC18F1220/1320
19.4 Fail-Safe Clock Monitor Since the postscaler frequency from the internal oscil-
lator block may not be sufficiently stable, it may be
The Fail-Safe Clock Monitor (FSCM) allows the micro- desirable to select another clock configuration and
controller to continue operation, in the event of an enter an alternate power managed mode (see
external oscillator failure, by automatically switching Section 19.3.1 “Special Considerations for Using
the system clock to the internal oscillator block. The Two-Speed Start-up” and Section 3.1.3 “Multiple
FSCM function is enabled by setting the Fail-Safe Sleep Commands” for more details). This can be
Clock Monitor Enable bit, FSCM (CONFIG1H<6>). done to attempt a partial recovery, or execute a
When FSCM is enabled, the INTRC oscillator runs at controlled shutdown.
all times to monitor clocks to peripherals and provide To use a higher clock speed on wake-up, the INTOSC
an instant backup clock in the event of a clock failure. or postscaler clock sources can be selected to provide
Clock monitoring (shown in Figure 19-3) is accom- a higher clock speed by setting bits, IFRC2:IFRC0,
plished by creating a sample clock signal, which is the immediately after Reset. For wake-ups from Sleep, the
INTRC output divided by 64. This allows ample time INTOSC or postscaler clock sources can be selected
between FSCM sample clocks for a peripheral clock by setting IFRC2:IFRC0 prior to entering Sleep mode.
edge to occur. The peripheral system clock and the
sample clock are presented as inputs to the Clock Adjustments to the internal oscillator block, using the
Monitor latch (CM). The CM is set on the falling edge of OSCTUNE register, also affect the period of the FSCM
the system clock source, but cleared on the rising edge by the same factor. This can usually be neglected, as
of the sample clock. the clock frequency being monitored is generally much
higher than the sample clock frequency.
FIGURE 19-3: FSCM BLOCK DIAGRAM The FSCM will detect failures of the primary or second-
ary clock sources only. If the internal oscillator block
Clock Monitor
Latch (CM)
fails, no failure would be detected, nor would any action
(edge-triggered) be possible.
Peripheral
S Q 19.4.1 FSCM AND THE WATCHDOG TIMER
Clock
Both the FSCM and the WDT are clocked by the
INTRC oscillator. Since the WDT operates with a
INTRC
÷ 64 C Q separate divider and counter, disabling the WDT has
Source
no effect on the operation of the INTRC oscillator when
(32 μs) 488 Hz the FSCM is enabled.
(2.048 ms) As already noted, the clock source is switched to the
INTOSC clock when a clock failure is detected.
Clock
Failure Depending on the frequency selected by the
Detected IRCF2:IRCF0 bits, this may mean a substantial change
in the speed of code execution. If the WDT is enabled
Clock failure is tested for on the falling edge of the sam- with a small prescale value, a decrease in clock speed
ple clock. If a sample clock falling edge occurs while allows a WDT time-out to occur and a subsequent
CM is still set, a clock failure has been detected device Reset. For this reason, Fail-Safe Clock events
(Figure 19-4). This causes the following: also reset the WDT and postscaler, allowing it to start
timing from when execution speed was changed and
• the FSCM generates an oscillator fail interrupt by
decreasing the likelihood of an erroneous time-out.
setting bit, OSCFIF (PIR2<7>);
• the system clock source is switched to the internal
oscillator block (OSCCON is not updated to show
the current clock source – this is the Fail-Safe
condition); and
• the WDT is reset.

DS39605F-page 182 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
19.4.2 EXITING FAIL-SAFE OPERATION 19.4.3 FSCM INTERRUPTS IN POWER
The Fail-Safe condition is terminated by either a device MANAGED MODES
Reset, or by entering a power managed mode. On As previously mentioned, entering a power managed
Reset, the controller starts the primary clock source mode clears the Fail-Safe condition. By entering a
specified in Configuration Register 1H (with any power managed mode, the clock multiplexer selects
required start-up delays that are required for the the clock source selected by the OSCCON register.
oscillator mode, such as OST or PLL timer). The Fail-Safe monitoring of the power managed clock
INTOSC multiplexer provides the system clock until the source resumes in the power managed mode.
primary clock source becomes ready (similar to a Two-
If an oscillator failure occurs during power managed
Speed Start-up). The clock system source is then
operation, the subsequent events depend on whether
switched to the primary clock (indicated by the OSTS
or not the oscillator failure interrupt is enabled. If
bit in the OSCCON register becoming set). The Fail-
enabled (OSCFIF = 1), code execution will be clocked
Safe Clock Monitor then resumes monitoring the
by the INTOSC multiplexer. An automatic transition
peripheral clock.
back to the failed clock source will not occur.
The primary clock source may never become ready
If the interrupt is disabled, the device will not exit the
during start-up. In this case, operation is clocked by the
power managed mode on oscillator failure. Instead, the
INTOSC multiplexer. The OSCCON register will remain
device will continue to operate as before, but clocked
in its Reset state until a power managed mode is
by the INTOSC multiplexer. While in Idle mode, subse-
entered.
quent interrupts will cause the CPU to begin executing
Entering a power managed mode by loading the instructions while being clocked by the INTOSC multi-
OSCCON register and executing a SLEEP instruction plexer. The device will not transition to a different clock
will clear the Fail-Safe condition. When the Fail-Safe source until the Fail-Safe condition is cleared.
condition is cleared, the clock monitor will resume
monitoring the peripheral clock.

FIGURE 19-4: FSCM TIMING DIAGRAM

Sample Clock

System Oscillator
Clock Failure
Output

CM Output
(Q)
Failure
Detected
OSCFIF

CM Test CM Test CM Test

Note: The system clock is normally at a much higher frequency than the sample clock. The relative frequencies in
this example have been chosen for clarity.

© 2007 Microchip Technology Inc. DS39605F-page 183

PIC18F1220/1320
19.4.4 POR OR WAKE FROM SLEEP
Note: The same logic that prevents false oscilla-
The FSCM is designed to detect oscillator failure at any tor failure interrupts on POR or wake from
point after the device has exited Power-on Reset Sleep will also prevent the detection of the
(POR) or Low-Power Sleep mode. When the primary oscillator’s failure to start at all following
system clock is EC, RC or INTRC modes, monitoring these events. This can be avoided by
can begin immediately following these events. monitoring the OSTS bit and using a
For oscillator modes involving a crystal or resonator timing routine to determine if the oscillator
(HS, HSPLL, LP or XT), the situation is somewhat dif- is taking too long to start. Even so, no
ferent. Since the oscillator may require a start-up time oscillator failure interrupt will be flagged.
considerably longer than the FCSM sample clock time, As noted in Section 19.3.1 “Special Considerations
a false clock failure may be detected. To prevent this, for Using Two-Speed Start-up”, it is also possible to
the internal oscillator block is automatically configured select another clock configuration and enter an alter-
as the system clock and functions until the primary nate power managed mode while waiting for the
clock is stable (the OST and PLL timers have timed primary system clock to become stable. When the new
out). This is identical to Two-Speed Start-up mode. powered managed mode is selected, the primary clock
Once the primary clock is stable, the INTRC returns to is disabled.
its role as the FSCM source

DS39605F-page 184 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
19.5 Program Verification and Each of the three blocks has three protection bits
Code Protection associated with them. They are:
• Code-Protect bit (CPn)
The overall structure of the code protection on the
PIC18 Flash devices differs significantly from other PIC • Write-Protect bit (WRTn)
devices. • External Block Table Read bit (EBTRn)
The user program memory is divided into three blocks. Figure 19-5 shows the program memory organization
One of these is a boot block of 512 bytes. The remain- for 4 and 8-Kbyte devices and the specific code protec-
der of the memory is divided into two blocks on binary tion bit associated with each block. The actual locations
boundaries. of the bits are summarized in Table 19-3.

FIGURE 19-5: CODE-PROTECTED PROGRAM MEMORY FOR PIC18F1220/1320

Block Code MEMORY SIZE/DEVICE Block Code

Protection Address 4 Kbytes 8 Kbytes Address Protection
Controlled By: Range (PIC18F1220) (PIC18F1320) Range Controlled By:

000000h 000000h
CPB, WRTB, EBTRB Boot Block Boot Block CPB, WRTB, EBTRB
0001FFh 0001FFh
000200h 000200h
CP0, WRT0, EBTR0 Block 0
0007FFh Block 0 CP0, WRT0, EBTR0
000800h
CP1, WRT1, EBTR1 Block 1
000FFFh 000FFFh
001000h 001000h

Block 1 CP1, WRT1, EBTR1

(Unimplemented Unimplemented
001FFFh
Memory Space) Read ‘0’s
002000h

Unimplemented (Unimplemented
Read ‘0’s Memory Space)

1FFFFFh 1FFFFFh

TABLE 19-3: SUMMARY OF CODE PROTECTION REGISTERS

File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
300008h CONFIG5L — — — — — — CP1 CP0
300009h CONFIG5H CPD CPB — — — — — —
30000Ah CONFIG6L — — — — — — WRT1 WRT0
30000Bh CONFIG6H WRTD WRTB WRTC — — — — —
30000Ch CONFIG7L — — — — — — EBTR1 EBTR0
30000Dh CONFIG7H — EBTRB — — — — — —
Legend: Shaded cells are unimplemented.

© 2007 Microchip Technology Inc. DS39605F-page 185

PIC18F1220/1320
19.5.1 PROGRAM MEMORY
Note: Code protection bits may only be written to
CODE PROTECTION a ‘0’ from a ‘1’ state. It is not possible to
The program memory may be read to, or written from, write a ‘1’ to a bit in the ‘0’ state. Code pro-
any location using the table read and table write tection bits are only set to ‘1’ by a full Chip
instructions. The device ID may be read with table Erase or Block Erase function. The full
reads. The configuration registers may be read and Chip Erase and Block Erase functions can
written with the table read and table write instructions. only be initiated via ICSP or an external
In normal execution mode, the CPn bits have no direct programmer.
effect. CPn bits inhibit external reads and writes. A
block of user memory may be protected from table
writes if the WRTn configuration bit is ‘0’. The EBTRn
bits control table reads. For a block of user memory
with the EBTRn bit set to ‘0’, a table read instruction
that executes from within that block is allowed to read.
A table read instruction that executes from a location
outside of that block is not allowed to read and will
result in reading ‘0’s. Figures 19-6 through 19-8
illustrate table write and table read protection.

FIGURE 19-6: TABLE WRITE (WRTn) DISALLOWED: PIC18F1320

Register Values Program Memory Configuration Bit Settings

000000h
WRTB, EBTRB = 11
0001FFh
000200h

TBLPTR = 0002FFh
WRT0, EBTR0 = 01

PC = 0007FEh TBLWT *

000FFFh
001000h
PC = 0017FEh TBLWT *

WRT1, EBTR1 = 11

001FFFh

Results: All table writes disabled to Blockn whenever WRTn = 0.

DS39605F-page 186 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 19-7: EXTERNAL BLOCK TABLE READ (EBTRn) DISALLOWED: PIC18F1320
Register Values Program Memory Configuration Bit Settings

000000h
WRTB, EBTRB = 11
0001FFh
000200h
TBLPTR = 0002FFh
WRT0, EBTR0 = 10

000FFFh
001000h

PC = 001FFEh TBLRD * WRT1, EBTR1 = 11

001FFFh

Results: All table reads from external blocks to Blockn are disabled whenever EBTRn = 0.
TABLAT register returns a value of ‘0’.

FIGURE 19-8: EXTERNAL BLOCK TABLE READ (EBTRn) ALLOWED: PIC18F1320

Register Values Program Memory Configuration Bit Settings
000000h
WRTB, EBTRB = 11
0001FFh
000200h

TBLPTR = 0002FFh WRT0, EBTR0 = 10

PC = 0007FEh TBLRD *

000FFFh
001000h

WRT1, EBTR1 = 11

001FFFh

Results: Table reads permitted within Blockn, even when EBTRBn = 0.

TABLAT register returns the value of the data at the location TBLPTR.

© 2007 Microchip Technology Inc. DS39605F-page 187

PIC18F1220/1320
19.5.2 DATA EEPROM TABLE 19-4: ICSP/ICD CONNECTIONS
CODE PROTECTION Signal Pin Notes
The entire data EEPROM is protected from external PGD RB7/PGD/T1OSI/ Shared with T1OSC – protect
reads and writes by two bits: CPD and WRTD. CPD P1D/KBI3 crystal
inhibits external reads and writes of data EEPROM.
PGC RB6/PGC/T1OSO/ Shared with T1OSC – protect
WRTD inhibits external writes to data EEPROM. The T13CKI/P1C/KBI2 crystal
CPU can continue to read and write data EEPROM,
regardless of the protection bit settings. MCLR MCLR/VPP/RA5
VDD VDD
19.5.3 CONFIGURATION REGISTER VSS VSS
PROTECTION PGM RB5/PGM/KBI1 Optional – pull RB5 low is
The configuration registers can be write-protected. The LVP enabled
WRTC bit controls protection of the configuration
registers. In normal execution mode, the WRTC bit is 19.8 In-Circuit Debugger
readable only. WRTC can only be written via ICSP or
When the DEBUG bit in configuration register,
an external programmer.
CONFIG4L, is programmed to a ‘0’, the In-Circuit
Debugger functionality is enabled. This function allows
19.6 ID Locations simple debugging functions when used with MPLAB®
Eight memory locations (200000h-200007h) are IDE. When the microcontroller has this feature
designated as ID locations, where the user can store enabled, some resources are not available for general
checksum or other code identification numbers. These use. Table 19-5 shows which resources are required by
locations are both readable and writable during normal the background debugger.
execution through the TBLRD and TBLWT instructions,
TABLE 19-5: DEBUGGER RESOURCES
or during program/verify. The ID locations can be read
when the device is code-protected. I/O pins: RB6, RB7
Stack: 2 levels
19.7 In-Circuit Serial Programming
Program Memory: 512 bytes
PIC18F1220/1320 microcontrollers can be serially Data Memory: 10 bytes
programmed while in the end application circuit. This is
simply done with two lines for clock and data and three To use the In-Circuit Debugger function of the
other lines for power, ground and the programming microcontroller, the design must implement In-Circuit
voltage. This allows customers to manufacture boards Serial Programming connections to MCLR/VPP, VDD,
with unprogrammed devices and then program the VSS, RB7 and RB6. This will interface to the In-Circuit
microcontroller just before shipping the product. This Debugger module available from Microchip, or one of the
also allows the most recent firmware or a custom third party development tool companies (see the note fol-
firmware to be programmed (see Table 19-4). lowing Section 19.7 “In-Circuit Serial Programming”
for more information).
Note: The Timer1 oscillator shares the T1OSI
and T1OSO pins with the PGD and PGC
pins used for programming and
debugging.
When using the Timer1 oscillator, In-Circuit
Serial Programming (ICSP) may not
function correctly (high voltage or low
voltage), or the In-Circuit Debugger (ICD)
may not communicate with the controller.
As a result of using either ICSP or ICD, the
Timer1 crystal may be damaged.
If ICSP or ICD operations are required, the
crystal should be disconnected from the
circuit (disconnect either lead), or installed
after programming. The oscillator loading
capacitors may remain in-circuit during
ICSP or ICD operation.

DS39605F-page 188 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
19.9 Low-Voltage ICSP Programming If Low-Voltage Programming mode will not be used, the
LVP bit can be cleared and RB5/PGM/KBI1 becomes
The LVP bit in configuration register, CONFIG4L, available as the digital I/O pin RB5. The LVP bit may be
enables Low-Voltage Programming (LVP). When LVP set or cleared only when using standard high-voltage
is enabled, the microcontroller can be programmed programming (VIHH applied to the MCLR/VPP/RA5 pin).
without requiring high voltage being applied to the Once LVP has been disabled, only the standard high-
MCLR/VPP/RA5 pin, but the RB5/PGM/KBI1 pin is then voltage programming is available and must be used to
dedicated to controlling Program mode entry and is not program the device.
available as a general purpose I/O pin.
Memory that is not code-protected can be erased,
LVP is enabled in erased devices. using either a Block Erase, or erased row by row, then
While programming using LVP, VDD is applied to the written at any specified VDD. If code-protected memory
MCLR/VPP/RA5 pin as in normal execution mode. To is to be erased, a Block Erase is required. If a Block
enter Programming mode, VDD is applied to the PGM Erase is to be performed when using Low-Voltage
pin. Programming, the device must be supplied with VDD of
4.5V to 5.5V.
Note 1: High-voltage programming is always
available, regardless of the state of the
LVP bit or the PGM pin, by applying VIHH
to the MCLR pin.
2: When Low-Voltage Programming is
enabled, the RB5 pin can no longer be
used as a general purpose I/O pin.
3: When LVP is enabled, externally pull the
PGM pin to VSS to allow normal program
execution.

© 2007 Microchip Technology Inc. DS39605F-page 189

PIC18F1220/1320
NOTES:

DS39605F-page 190 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
20.0 INSTRUCTION SET SUMMARY The control instructions may use some of the following
operands:
The PIC18 instruction set adds many enhancements to
• A program memory address (specified by ‘n’)
the previous PIC instruction sets, while maintaining an
easy migration from these PIC instruction sets. • The mode of the CALL or RETURN instructions
(specified by ‘s’)
Most instructions are a single program memory word
• The mode of the table read and table write
(16 bits), but there are three instructions that require
instructions (specified by ‘m’)
two program memory locations.
• No operand required
Each single-word instruction is a 16-bit word divided (specified by ‘—’)
into an opcode, which specifies the instruction type and
one or more operands, which further specify the All instructions are a single word, except for three
operation of the instruction. double-word instructions. These three instructions
were made double-word instructions so that all the
The instruction set is highly orthogonal and is grouped required information is available in these 32 bits. In the
into four basic categories: second word, the 4 MSbs are ‘1’s. If this second word
• Byte-oriented operations is executed as an instruction (by itself), it will execute
• Bit-oriented operations as a NOP.
• Literal operations All single-word instructions are executed in a single
• Control operations instruction cycle, unless a conditional test is true, or the
program counter is changed as a result of the instruc-
The PIC18 instruction set summary in Table 20-1 lists
tion. In these cases, the execution takes two instruction
byte-oriented, bit-oriented, literal and control
cycles, with the additional instruction cycle(s) executed
operations. Table 20-1 shows the opcode field
as a NOP.
descriptions.
The double-word instructions execute in two instruction
Most byte-oriented instructions have three operands:
cycles.
1. The file register (specified by ‘f’)
One instruction cycle consists of four oscillator periods.
2. The destination of the result Thus, for an oscillator frequency of 4 MHz, the normal
(specified by ‘d’) instruction execution time is 1 μs. If a conditional test is
3. The accessed memory true, or the program counter is changed as a result of
(specified by ‘a’) an instruction, the instruction execution time is 2 μs.
The file register designator ‘f’ specifies which file Two-word branch instructions (if true) would take 3 μs.
register is to be used by the instruction. Figure 20-1 shows the general formats that the
The destination designator ‘d’ specifies where the instructions can have.
result of the operation is to be placed. If ‘d’ is zero, the All examples use the format ‘nnh’ to represent a hexa-
result is placed in the WREG register. If ‘d’ is one, the decimal number, where ‘h’ signifies a hexadecimal
result is placed in the file register specified in the digit.
instruction.
The Instruction Set Summary, shown in Table 20-1,
All bit-oriented instructions have three operands: lists the instructions recognized by the Microchip
1. The file register (specified by ‘f’) Assembler (MPASMTM). Section 20.2 “Instruction
Set” provides a description of each instruction.
2. The bit in the file register
(specified by ‘b’)
20.1 Read-Modify-Write Operations
3. The accessed memory
(specified by ‘a’) Any instruction that specifies a file register as part of
the instruction performs a Read-Modify-Write (R-M-W)
The bit field designator ‘b’ selects the number of the bit
operation. The register is read, the data is modified and
affected by the operation, while the file register desig-
the result is stored according to either the instruction or
nator ‘f’ represents the number of the file in which the
the destination designator ‘d’. A read operation is
bit is located.
performed on a register even if the instruction writes to
The literal instructions may use some of the following that register.
operands:
For example, a “BCF PORTB,1” instruction will read
• A literal value to be loaded into a file register PORTB, clear bit 1 of the data, then write the result
(specified by ‘k’) back to PORTB. The read operation would have the
• The desired FSR register to load the literal value unintended result that any condition that sets the RBIF
into (specified by ‘f’) flag would be cleared. The R-M-W operation may also
• No operand required copy the level of an input pin to its corresponding output
(specified by ‘—’) latch.

© 2007 Microchip Technology Inc. DS39605F-page 191

PIC18F1220/1320
TABLE 20-1: OPCODE FIELD DESCRIPTIONS
Field Description
a RAM access bit
a = 0: RAM location in Access RAM (BSR register is ignored)
a = 1: RAM bank is specified by BSR register
bbb Bit address within an 8-bit file register (0 to 7).
BSR Bank Select Register. Used to select the current RAM bank.
d Destination select bit
d = 0: store result in WREG
d = 1: store result in file register f
dest Destination either the WREG register or the specified register file location.
f 8-bit register file address (0x00 to 0xFF).
fs 12-bit register file address (0x000 to 0xFFF). This is the source address.
fd 12-bit register file address (0x000 to 0xFFF). This is the destination address.
k Literal field, constant data or label (may be either an 8-bit, 12-bit or a 20-bit value).
label Label name.
mm The mode of the TBLPTR register for the table read and table write instructions.
Only used with table read and table write instructions:
* No change to register (such as TBLPTR with table reads and writes)
*+ Post-Increment register (such as TBLPTR with table reads and writes)
*- Post-Decrement register (such as TBLPTR with table reads and writes)
+* Pre-Increment register (such as TBLPTR with table reads and writes)
n The relative address (2’s complement number) for relative branch instructions, or the direct address for
call/branch and return instructions.
PRODH Product of Multiply High Byte.
PRODL Product of Multiply Low Byte.
s Fast Call/Return mode select bit
s = 0: do not update into/from shadow registers
s = 1: certain registers loaded into/from shadow registers (Fast mode)
u Unused or unchanged.
WREG Working register (accumulator).
x Don’t care (‘0’ or ‘1’).
The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all
Microchip software tools.
TBLPTR 21-bit Table Pointer (points to a program memory location).
TABLAT 8-bit Table Latch.
TOS Top-of-Stack.
PC Program Counter.
PCL Program Counter Low Byte.
PCH Program Counter High Byte.
PCLATH Program Counter High Byte Latch.
PCLATU Program Counter Upper Byte Latch.
GIE Global Interrupt Enable bit.
WDT Watchdog Timer.
TO Time-out bit.
PD Power-down bit.
C, DC, Z, OV, N ALU Status bits: Carry, Digit Carry, Zero, Overflow, Negative.
[ ] Optional.
( ) Contents.
→ Assigned to.
< > Register bit field.
∈ In the set of.
italics User defined term (font is Courier).

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 PIC18F1220/1320
FIGURE 20-1: GENERAL FORMAT FOR INSTRUCTIONS
Byte-oriented file register operations Example Instruction
15 10 9 8 7 0
OPCODE d a f (FILE #) ADDWF MYREG, W, B
d = 0 for result destination to be WREG register
d = 1 for result destination to be file register (f)
a = 0 to force Access Bank
a = 1 for BSR to select bank
f = 8-bit file register address

Byte to Byte move operations (2-word)

15 12 11 0
OPCODE f (Source FILE #) MOVFF MYREG1, MYREG2
15 12 11 0
1111 f (Destination FILE #)

f = 12-bit file register address

Bit-oriented file register operations

15 12 11 9 8 7 0
OPCODE b (BIT #) a f (FILE #) BSF MYREG, bit, B
b = 3-bit position of bit in file register (f)
a = 0 to force Access Bank
a = 1 for BSR to select bank
f = 8-bit file register address

Literal operations
15 8 7 0
OPCODE k (literal) MOVLW 0x7F
k = 8-bit immediate value

Control operations
CALL, GOTO and Branch operations
15 8 7 0
OPCODE n<7:0> (literal) GOTO Label
15 12 11 0
1111 n<19:8> (literal)

n = 20-bit immediate value

15 8 7 0
OPCODE S n<7:0> (literal) CALL MYFUNC
15 12 11 0
n<19:8> (literal)
S = Fast bit

15 11 10 0
OPCODE n<10:0> (literal) BRA MYFUNC

15 8 7 0
OPCODE n<7:0> (literal) BC MYFUNC

© 2007 Microchip Technology Inc. DS39605F-page 193

PIC18F1220/1320
TABLE 20-1: PIC18FXXXX INSTRUCTION SET
Mnemonic, 16-Bit Instruction Word Status
Description Cycles Notes
Operands MSb LSb Affected

BYTE-ORIENTED FILE REGISTER OPERATIONS

ADDWF f, d, a Add WREG and f 1 0010 01da ffff ffff C, DC, Z, OV, N 1, 2
ADDWFC f, d, a Add WREG and Carry bit to f 1 0010 00da ffff ffff C, DC, Z, OV, N 1, 2
ANDWF f, d, a AND WREG with f 1 0001 01da ffff ffff Z, N 1,2
CLRF f, a Clear f 1 0110 101a ffff ffff Z 2
COMF f, d, a Complement f 1 0001 11da ffff ffff Z, N 1, 2
CPFSEQ f, a Compare f with WREG, skip = 1 (2 or 3) 0110 001a ffff ffff None 4
CPFSGT f, a Compare f with WREG, skip > 1 (2 or 3) 0110 010a ffff ffff None 4
CPFSLT f, a Compare f with WREG, skip < 1 (2 or 3) 0110 000a ffff ffff None 1, 2
DECF f, d, a Decrement f 1 0000 01da ffff ffff C, DC, Z, OV, N 1, 2, 3, 4
DECFSZ f, d, a Decrement f, Skip if 0 1 (2 or 3) 0010 11da ffff ffff None 1, 2, 3, 4
DCFSNZ f, d, a Decrement f, Skip if Not 0 1 (2 or 3) 0100 11da ffff ffff None 1, 2
INCF f, d, a Increment f 1 0010 10da ffff ffff C, DC, Z, OV, N 1, 2, 3, 4
INCFSZ f, d, a Increment f, Skip if 0 1 (2 or 3) 0011 11da ffff ffff None 4
INFSNZ f, d, a Increment f, Skip if Not 0 1 (2 or 3) 0100 10da ffff ffff None 1, 2
IORWF f, d, a Inclusive OR WREG with f 1 0001 00da ffff ffff Z, N 1, 2
MOVF f, d, a Move f 1 0101 00da ffff ffff Z, N 1
MOVFF fs, fd Move fs (source) to 1st word 2 1100 ffff ffff ffff None
fd (destination) 2nd word 1111 ffff ffff ffff
MOVWF f, a Move WREG to f 1 0110 111a ffff ffff None
MULWF f, a Multiply WREG with f 1 0000 001a ffff ffff None
NEGF f, a Negate f 1 0110 110a ffff ffff C, DC, Z, OV, N 1, 2
RLCF f, d, a Rotate Left f through Carry 1 0011 01da ffff ffff C, Z, N
RLNCF f, d, a Rotate Left f (No Carry) 1 0100 01da ffff ffff Z, N 1, 2
RRCF f, d, a Rotate Right f through Carry 1 0011 00da ffff ffff C, Z, N
RRNCF f, d, a Rotate Right f (No Carry) 1 0100 00da ffff ffff Z, N
SETF f, a Set f 1 0110 100a ffff ffff None
SUBFWB f, d, a Subtract f from WREG with 1 0101 01da ffff ffff C, DC, Z, OV, N 1, 2
borrow
SUBWF f, d, a Subtract WREG from f 1 0101 11da ffff ffff C, DC, Z, OV, N
SUBWFB f, d, a Subtract WREG from f with 1 0101 10da ffff ffff C, DC, Z, OV, N 1, 2
borrow
SWAPF f, d, a Swap nibbles in f 1 0011 10da ffff ffff None 4
TSTFSZ f, a Test f, skip if 0 1 (2 or 3) 0110 011a ffff ffff None 1, 2
XORWF f, d, a Exclusive OR WREG with f 1 0001 10da ffff ffff Z, N
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF f, b, a Bit Clear f 1 1001 bbba ffff ffff None 1, 2
BSF f, b, a Bit Set f 1 1000 bbba ffff ffff None 1, 2
BTFSC f, b, a Bit Test f, Skip if Clear 1 (2 or 3) 1011 bbba ffff ffff None 3, 4
BTFSS f, b, a Bit Test f, Skip if Set 1 (2 or 3) 1010 bbba ffff ffff None 3, 4
BTG f, d, a Bit Toggle f 1 0111 bbba ffff ffff None 1, 2
Note 1: When a Port register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that
value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is
driven low by an external device, the data will be written back with a ‘0’.
2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared
if assigned.
3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second
cycle is executed as a NOP.
4: Some instructions are 2-word instructions. The second word of these instructions will be executed as a NOP,
unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all
program memory locations have a valid instruction.
5: If the table write starts the write cycle to internal memory, the write will continue until terminated.

DS39605F-page 194 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
TABLE 20-1: PIC18FXXXX INSTRUCTION SET (CONTINUED)
Mnemonic, 16-Bit Instruction Word Status
Description Cycles Notes
Operands MSb LSb Affected

CONTROL OPERATIONS
BC n Branch if Carry 1 (2) 1110 0010 nnnn nnnn None
BN n Branch if Negative 1 (2) 1110 0110 nnnn nnnn None
BNC n Branch if Not Carry 1 (2) 1110 0011 nnnn nnnn None
BNN n Branch if Not Negative 1 (2) 1110 0111 nnnn nnnn None
BNOV n Branch if Not Overflow 1 (2) 1110 0101 nnnn nnnn None
BNZ n Branch if Not Zero 1 (2) 1110 0001 nnnn nnnn None
BOV n Branch if Overflow 1 (2) 1110 0100 nnnn nnnn None
BRA n Branch Unconditionally 2 1101 0nnn nnnn nnnn None
BZ n Branch if Zero 1 (2) 1110 0000 nnnn nnnn None
CALL n, s Call subroutine 1st word 2 1110 110s kkkk kkkk None
2nd word 1111 kkkk kkkk kkkk
CLRWDT — Clear Watchdog Timer 1 0000 0000 0000 0100 TO, PD
DAW — Decimal Adjust WREG 1 0000 0000 0000 0111 C
GOTO n Go to address 1st word 2 1110 1111 kkkk kkkk None
2nd word 1111 kkkk kkkk kkkk
NOP — No Operation 1 0000 0000 0000 0000 None
NOP — No Operation 1 1111 xxxx xxxx xxxx None 4
POP — Pop top of return stack (TOS) 1 0000 0000 0000 0110 None
PUSH — Push top of return stack (TOS) 1 0000 0000 0000 0101 None
RCALL n Relative Call 2 1101 1nnn nnnn nnnn None
RESET Software device Reset 1 0000 0000 1111 1111 All
RETFIE s Return from interrupt enable 2 0000 0000 0001 000s GIE/GIEH,
PEIE/GIEL
RETLW k Return with literal in WREG 2 0000 1100 kkkk kkkk None
RETURN s Return from Subroutine 2 0000 0000 0001 001s None
SLEEP — Go into Standby mode 1 0000 0000 0000 0011 TO, PD
Note 1: When a Port register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that
value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is
driven low by an external device, the data will be written back with a ‘0’.
2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared
if assigned.
3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second
cycle is executed as a NOP.
4: Some instructions are 2-word instructions. The second word of these instructions will be executed as a NOP,
unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all
program memory locations have a valid instruction.
5: If the table write starts the write cycle to internal memory, the write will continue until terminated.

© 2007 Microchip Technology Inc. DS39605F-page 195

PIC18F1220/1320
TABLE 20-1: PIC18FXXXX INSTRUCTION SET (CONTINUED)
Mnemonic, 16-Bit Instruction Word Status
Description Cycles Notes
Operands MSb LSb Affected

LITERAL OPERATIONS
ADDLW k Add literal and WREG 1 0000 1111 kkkk kkkk C, DC, Z, OV, N
ANDLW k AND literal with WREG 1 0000 1011 kkkk kkkk Z, N
IORLW k Inclusive OR literal with WREG 1 0000 1001 kkkk kkkk Z, N
LFSR f, k Move literal (12-bit) 2nd word 2 1110 1110 00ff kkkk None
to FSRx 1st word 1111 0000 kkkk kkkk
MOVLB k Move literal to BSR<3:0> 1 0000 0001 0000 kkkk None
MOVLW k Move literal to WREG 1 0000 1110 kkkk kkkk None
MULLW k Multiply literal with WREG 1 0000 1101 kkkk kkkk None
RETLW k Return with literal in WREG 2 0000 1100 kkkk kkkk None
SUBLW k Subtract WREG from literal 1 0000 1000 kkkk kkkk C, DC, Z, OV, N
XORLW k Exclusive OR literal with WREG 1 0000 1010 kkkk kkkk Z, N
DATA MEMORY ↔ PROGRAM MEMORY OPERATIONS
TBLRD* Table read 2 0000 0000 0000 1000 None
TBLRD*+ Table read with post-increment 0000 0000 0000 1001 None
TBLRD*- Table read with post-decrement 0000 0000 0000 1010 None
TBLRD+* Table read with pre-increment 0000 0000 0000 1011 None
TBLWT* Table write 2 (5) 0000 0000 0000 1100 None
TBLWT*+ Table write with post-increment 0000 0000 0000 1101 None
TBLWT*- Table write with post-decrement 0000 0000 0000 1110 None
TBLWT+* Table write with pre-increment 0000 0000 0000 1111 None
Note 1: When a Port register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that
value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is
driven low by an external device, the data will be written back with a ‘0’.
2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared
if assigned.
3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second
cycle is executed as a NOP.
4: Some instructions are 2-word instructions. The second word of these instructions will be executed as a NOP,
unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all
program memory locations have a valid instruction.
5: If the table write starts the write cycle to internal memory, the write will continue until terminated.

DS39605F-page 196 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
20.2 Instruction Set
ADDLW ADD literal to W ADDWF ADD W to f
Syntax: [ label ] ADDLW k Syntax: [ label ] ADDWF f [,d [,a]]
Operands: 0 ≤ k ≤ 255 Operands: 0 ≤ f ≤ 255
Operation: (W) + k → W d ∈ [0,1]
a ∈ [0,1]
Status Affected: N, OV, C, DC, Z
Operation: (W) + (f) → dest
Encoding: 0000 1111 kkkk kkkk
Status Affected: N, OV, C, DC, Z
Description: The contents of W are added to the
8-bit literal ‘k’ and the result is Encoding: 0010 01da ffff ffff
placed in W. Description: Add W to register ‘f’. If ‘d’ is ‘0’, the
Words: 1 result is stored in W. If ‘d’ is ‘1’, the
result is stored back in register ‘f’
Cycles: 1 (default). If ‘a’ is ‘0’, the Access
Q Cycle Activity: Bank will be selected. If ‘a’ is ‘1’,
Q1 Q2 Q3 Q4 the BSR is used.
Decode Read Process Write to W Words: 1
literal ‘k’ Data
Cycles: 1

Example: ADDLW 0x15 Q Cycle Activity:

Q1 Q2 Q3 Q4
Before Instruction
Decode Read Process Write to
W = 0x10 register ‘f’ Data destination
After Instruction
W = 0x25 Example: ADDWF REG, W
Before Instruction
W = 0x17
REG = 0xC2
After Instruction
W = 0xD9
REG = 0xC2

© 2007 Microchip Technology Inc. DS39605F-page 197

PIC18F1220/1320

ADDWFC ADD W and Carry bit to f ANDLW AND literal with W

Syntax: [ label ] ADDWFC f [,d [,a]] Syntax: [ label ] ANDLW k
Operands: 0 ≤ f ≤ 255 Operands: 0 ≤ k ≤ 255
d ∈ [0,1] Operation: (W) .AND. k → W
a ∈ [0,1]
Status Affected: N, Z
Operation: (W) + (f) + (C) → dest
Encoding: 0000 1011 kkkk kkkk
Status Affected: N, OV, C, DC, Z
Description: The contents of W are AND’ed with
Encoding: 0010 00da ffff ffff
the 8-bit literal ‘k’. The result is
Description: Add W, the Carry flag and data placed in W.
memory location ‘f’. If ‘d’ is ‘0’, the Words: 1
result is placed in W. If ‘d’ is ‘1’, the
result is placed in data memory Cycles: 1
location ‘f’. If ‘a’ is ‘0’, the Access Q Cycle Activity:
Bank will be selected. If ‘a’ is ‘1’, the Q1 Q2 Q3 Q4
BSR will not be overridden. Decode Read literal Process Write to W
Words: 1 ‘k’ Data
Cycles: 1
Example: ANDLW 0x5F
Q Cycle Activity:
Q1 Q2 Q3 Q4 Before Instruction
Decode Read Process Write to W = 0xA3
register ‘f’ Data destination After Instruction
W = 0x03
Example: ADDWFC REG, W
Before Instruction
Carry bit = 1
REG = 0x02
W = 0x4D
After Instruction
Carry bit = 0
REG = 0x02
W = 0x50

DS39605F-page 198 © 2007 Microchip Technology Inc.

 PIC18F1220/1320

ANDWF AND W with f BC Branch if Carry

Syntax: [ label ] ANDWF f [,d [,a]] Syntax: [ label ] BC n
Operands: 0 ≤ f ≤ 255 Operands: -128 ≤ n ≤ 127
d ∈ [0,1] Operation: if Carry bit is ‘1’
a ∈ [0,1] (PC) + 2 + 2n → PC
Operation: (W) .AND. (f) → dest Status Affected: None
Status Affected: N, Z Encoding: 1110 0010 nnnn nnnn
Encoding: 0001 01da ffff ffff
Description: If the Carry bit is ‘1’, then the
Description: The contents of W are AND’ed with program will branch.
register ‘f’. If ‘d’ is ‘0’, the result is The 2’s complement number ‘2n’ is
stored in W. If ‘d’ is ‘1’, the result is added to the PC. Since the PC will
stored back in register ‘f’ (default). have incremented to fetch the next
If ‘a’ is ‘0’, the Access Bank will be instruction, the new address will be
selected. If ‘a’ is ‘1’, the BSR will PC + 2 + 2n. This instruction is then
not be overridden (default). a two-cycle instruction.
Words: 1 Words: 1
Cycles: 1 Cycles: 1(2)
Q Cycle Activity: Q Cycle Activity:
Q1 Q2 Q3 Q4 If Jump:
Decode Read Process Write to Q1 Q2 Q3 Q4
register ‘f’ Data destination Decode Read literal Process Write to PC
‘n’ Data
Example: ANDWF REG, W No No No No
operation operation operation operation
Before Instruction
If No Jump:
W = 0x17
REG = 0xC2
Q1 Q2 Q3 Q4
Decode Read literal Process No
After Instruction
‘n’ Data operation
W = 0x02
REG = 0xC2
Example: HERE BC JUMP
Before Instruction
PC = address (HERE)
After Instruction
If Carry = 1;
PC = address (JUMP)
If Carry = 0;
PC = address (HERE + 2)

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BCF Bit Clear f BN Branch if Negative

Syntax: [ label ] BCF f,b[,a] Syntax: [ label ] BN n
Operands: 0 ≤ f ≤ 255 Operands: -128 ≤ n ≤ 127
0≤b≤7 Operation: if Negative bit is ‘1’
a ∈ [0,1] (PC) + 2 + 2n → PC
Operation: 0 → f<b> Status Affected: None
Status Affected: None Encoding: 1110 0110 nnnn nnnn
Encoding: 1001 bbba ffff ffff
Description: If the Negative bit is ‘1’, then the
Description: Bit ‘b’ in register ‘f’ is cleared. If ‘a’ program will branch.
is ‘0’, the Access Bank will be The 2’s complement number ‘2n’ is
selected, overriding the BSR value. added to the PC. Since the PC will
If ‘a’ = 1, then the bank will be have incremented to fetch the next
selected as per the BSR value instruction, the new address will be
(default). PC + 2 + 2n. This instruction is then
Words: 1 a two-cycle instruction.

Cycles: 1 Words: 1

Q Cycle Activity: Cycles: 1(2)

Q1 Q2 Q3 Q4 Q Cycle Activity:
Decode Read Process Write If Jump:
register ‘f’ Data register ‘f’ Q1 Q2 Q3 Q4
Decode Read literal Process Write to PC
Example: BCF FLAG_REG, 7 ‘n’ Data
No No No No
Before Instruction operation operation operation operation
FLAG_REG = 0xC7
If No Jump:
After Instruction
FLAG_REG = 0x47
Q1 Q2 Q3 Q4
Decode Read literal Process No
‘n’ Data operation

Example: HERE BN Jump

Before Instruction
PC = address (HERE)
After Instruction
If Negative = 1;
PC = address (Jump)
If Negative = 0;
PC = address (HERE + 2)

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BNC Branch if Not Carry BNN Branch if Not Negative

Syntax: [ label ] BNC n Syntax: [ label ] BNN n
Operands: -128 ≤ n ≤ 127 Operands: -128 ≤ n ≤ 127
Operation: if Carry bit is ‘0’ Operation: if Negative bit is ‘0’
(PC) + 2 + 2n → PC (PC) + 2 + 2n → PC
Status Affected: None Status Affected: None
Encoding: 1110 0011 nnnn nnnn Encoding: 1110 0111 nnnn nnnn
Description: If the Carry bit is ‘0’, then the Description: If the Negative bit is ‘0’, then the
program will branch. program will branch.
The 2’s complement number ‘2n’ is The 2’s complement number ‘2n’ is
added to the PC. Since the PC will added to the PC. Since the PC will
have incremented to fetch the next have incremented to fetch the next
instruction, the new address will be instruction, the new address will be
PC + 2 + 2n. This instruction is then PC + 2 + 2n. This instruction is then
a two-cycle instruction. a two-cycle instruction.
Words: 1 Words: 1
Cycles: 1(2) Cycles: 1(2)
Q Cycle Activity: Q Cycle Activity:
If Jump: If Jump:
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Decode Read literal Process Write to PC Decode Read literal Process Write to PC
‘n’ Data ‘n’ Data
No No No No No No No No
operation operation operation operation operation operation operation operation
If No Jump: If No Jump:
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Decode Read literal Process No Decode Read literal Process No
‘n’ Data operation ‘n’ Data operation

Example: HERE BNC Jump Example: HERE BNN Jump

Before Instruction Before Instruction
PC = address (HERE) PC = address (HERE)
After Instruction After Instruction
If Carry = 0; If Negative = 0;
PC = address (Jump) PC = address (Jump)
If Carry = 1; If Negative = 1;
PC = address (HERE + 2) PC = address (HERE + 2)

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BNOV Branch if Not Overflow BNZ Branch if Not Zero

Syntax: [ label ] BNOV n Syntax: [ label ] BNZ n
Operands: -128 ≤ n ≤ 127 Operands: -128 ≤ n ≤ 127
Operation: if Overflow bit is ‘0’ Operation: if Zero bit is ‘0’
(PC) + 2 + 2n → PC (PC) + 2 + 2n → PC
Status Affected: None Status Affected: None
Encoding: 1110 0101 nnnn nnnn Encoding: 1110 0001 nnnn nnnn
Description: If the Overflow bit is ‘0’, then the Description: If the Zero bit is ‘0’, then the
program will branch. program will branch.
The 2’s complement number ‘2n’ is The 2’s complement number ‘2n’ is
added to the PC. Since the PC will added to the PC. Since the PC will
have incremented to fetch the next have incremented to fetch the next
instruction, the new address will be instruction, the new address will be
PC + 2 + 2n. This instruction is then PC + 2 + 2n. This instruction is then
a two-cycle instruction. a two-cycle instruction.
Words: 1 Words: 1
Cycles: 1(2) Cycles: 1(2)
Q Cycle Activity: Q Cycle Activity:
If Jump: If Jump:
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Decode Read literal Process Write to PC Decode Read literal Process Write to PC
‘n’ Data ‘n’ Data
No No No No No No No No
operation operation operation operation operation operation operation operation
If No Jump: If No Jump:
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Decode Read literal Process No Decode Read literal Process No
‘n’ Data operation ‘n’ Data operation

Example: HERE BNOV Jump Example: HERE BNZ Jump

Before Instruction Before Instruction
PC = address (HERE) PC = address (HERE)
After Instruction After Instruction
If Overflow = 0; If Zero = 0;
PC = address (Jump) PC = address (Jump)
If Overflow = 1; If Zero = 1;
PC = address (HERE + 2) PC = address (HERE + 2)

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BRA Unconditional Branch BSF Bit Set f

Syntax: [ label ] BRA n Syntax: [ label ] BSF f,b[,a]
Operands: -1024 ≤ n ≤ 1023 Operands: 0 ≤ f ≤ 255
Operation: (PC) + 2 + 2n → PC 0≤b≤7
a ∈ [0,1]
Status Affected: None
Operation: 1 → f<b>
Encoding: 1101 0nnn nnnn nnnn
Status Affected: None
Description: Add the 2’s complement number
‘2n’ to the PC. Since the PC will Encoding: 1000 bbba ffff ffff
have incremented to fetch the next Description: Bit ‘b’ in register ‘f’ is set. If ‘a’ is ‘0’,
instruction, the new address will be the Access Bank will be selected,
PC + 2 + 2n. This instruction is a overriding the BSR value. If ‘a’ = 1,
two-cycle instruction. then the bank will be selected as
Words: 1 per the BSR value.

Cycles: 2 Words: 1

Q Cycle Activity: Cycles: 1

Q1 Q2 Q3 Q4 Q Cycle Activity:
Decode Read literal Process Write to PC Q1 Q2 Q3 Q4
‘n’ Data Decode Read Process Write
No No No No register ‘f’ Data register ‘f’
operation operation operation operation
Example: BSF FLAG_REG, 7

Example: HERE BRA Jump Before Instruction

FLAG_REG = 0x0A
Before Instruction
PC = address (HERE) After Instruction
FLAG_REG = 0x8A
After Instruction
PC = address (Jump)

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BTFSC Bit Test File, Skip if Clear BTFSS Bit Test File, Skip if Set
Syntax: [ label ] BTFSC f,b[,a] Syntax: [ label ] BTFSS f,b[,a]
Operands: 0 ≤ f ≤ 255 Operands: 0 ≤ f ≤ 255
0≤b≤7 0≤b<7
a ∈ [0,1] a ∈ [0,1]
Operation: skip if (f<b>) = 0 Operation: skip if (f<b>) = 1
Status Affected: None Status Affected: None
Encoding: 1011 bbba ffff ffff Encoding: 1010 bbba ffff ffff
Description: If bit ‘b’ in register ‘f’ is ‘0’, then the Description: If bit ‘b’ in register ‘f’ is ‘1’, then the
next instruction is skipped. next instruction is skipped.
If bit ‘b’ is ‘0’, then the next If bit ‘b’ is ‘1’, then the next
instruction fetched during the current instruction fetched during the current
instruction execution is discarded instruction execution is discarded
and a NOP is executed instead, and a NOP is executed instead,
making this a two-cycle instruction. If making this a two-cycle instruction. If
‘a’ is ‘0’, the Access Bank will be ‘a’ is ‘0’, the Access Bank will be
selected, overriding the BSR value. If selected, overriding the BSR value. If
‘a’ = 1, then the bank will be selected ‘a’ = 1, then the bank will be selected
as per the BSR value (default). as per the BSR value (default).
Words: 1 Words: 1
Cycles: 1(2) Cycles: 1(2)
Note: 3 cycles if skip and followed Note: 3 cycles if skip and followed
by a 2-word instruction. by a 2-word instruction.
Q Cycle Activity: Q Cycle Activity:
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Decode Read Process No Decode Read Process No
register ‘f’ Data operation register ‘f’ Data operation
If skip: If skip:
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
No No No No No No No No
operation operation operation operation operation operation operation operation
If skip and followed by 2-word instruction: If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
No No No No No No No No
operation operation operation operation operation operation operation operation
No No No No No No No No
operation operation operation operation operation operation operation operation

Example: HERE BTFSC FLAG, 1 Example: HERE BTFSS FLAG, 1

FALSE : FALSE :
TRUE : TRUE :
Before Instruction Before Instruction
PC = address (HERE) PC = address (HERE)
After Instruction After Instruction
If FLAG<1> = 0; If FLAG<1> = 0;
PC = address (TRUE) PC = address (FALSE)
If FLAG<1> = 1; If FLAG<1> = 1;
PC = address (FALSE) PC = address (TRUE)

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BTG Bit Toggle f BOV Branch if Overflow

Syntax: [ label ] BTG f,b[,a] Syntax: [ label ] BOV n
Operands: 0 ≤ f ≤ 255 Operands: -128 ≤ n ≤ 127
0≤b<7 Operation: if Overflow bit is ‘1’
a ∈ [0,1] (PC) + 2 + 2n → PC
Operation: (f<b>) → f<b> Status Affected: None
Status Affected: None Encoding: 1110 0100 nnnn nnnn
Encoding: 0111 bbba ffff ffff
Description: If the Overflow bit is ‘1’, then the
Description: Bit ‘b’ in data memory location ‘f’ is program will branch.
inverted. If ‘a’ is ‘0’, the Access Bank The 2’s complement number ‘2n’ is
will be selected, overriding the BSR added to the PC. Since the PC will
value. If ‘a’ = 1, then the bank will be have incremented to fetch the next
selected as per the BSR value instruction, the new address will be
(default). PC + 2 + 2n. This instruction is then
Words: 1 a two-cycle instruction.

Cycles: 1 Words: 1

Q Cycle Activity: Cycles: 1(2)

Q1 Q2 Q3 Q4 Q Cycle Activity:
Decode Read Process Write If Jump:
register ‘f’ Data register ‘f’ Q1 Q2 Q3 Q4
Decode Read literal Process Write to PC
Example: BTG PORTB, 4 ‘n’ Data
No No No No
Before Instruction: operation operation operation operation
PORTB = 0111 0101 [0x75]
If No Jump:
After Instruction:
PORTB = 0110 0101 [0x65]
Q1 Q2 Q3 Q4
Decode Read literal Process No
‘n’ Data operation

Example: HERE BOV JUMP

Before Instruction
PC = address (HERE)
After Instruction
If Overflow = 1;
PC = address (JUMP)
If Overflow = 0;
PC = address (HERE + 2)

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BZ Branch if Zero CALL Subroutine Call

Syntax: [ label ] BZ n Syntax: [ label ] CALL k [,s]
Operands: -128 ≤ n ≤ 127 Operands: 0 ≤ k ≤ 1048575
Operation: if Zero bit is ‘1’ s ∈ [0,1]
(PC) + 2 + 2n → PC Operation: (PC) + 4 → TOS,
Status Affected: None k → PC<20:1>,
if s = 1
Encoding: 1110 0000 nnnn nnnn (W) → WS,
Description: If the Zero bit is ‘1’, then the (Status) → STATUSS,
program will branch. (BSR) → BSRS
The 2’s complement number ‘2n’ is Status Affected: None
added to the PC. Since the PC will
have incremented to fetch the next Encoding:
instruction, the new address will be 1st word (k<7:0>) 1110 110s k7kkk kkkk0
PC + 2 + 2n. This instruction is then 2nd word(k<19:8>) 1111 k19kkk kkkk kkkk8

a two-cycle instruction. Description: Subroutine call of entire 2-Mbyte

Words: 1 memory range. First, return
address (PC + 4) is pushed onto
Cycles: 1(2) the return stack. If ‘s’ = 1, the W,
Q Cycle Activity: Status and BSR registers are also
If Jump: pushed into their respective
Q1 Q2 Q3 Q4 shadow registers, WS, STATUSS
Decode Read literal Process Write to PC
and BSRS. If ‘s’ = 0, no update
‘n’ Data occurs (default). Then, the 20-bit
No No No No
value ‘k’ is loaded into PC<20:1>.
operation operation operation operation CALL is a two-cycle instruction.
If No Jump: Words: 2
Q1 Q2 Q3 Q4 Cycles: 2
Decode Read literal Process No Q Cycle Activity:
‘n’ Data operation
Q1 Q2 Q3 Q4
Decode Read literal Push PC to Read literal
Example: HERE BZ Jump
‘k’<7:0>, stack ‘k’<19:8>,
Before Instruction Write to PC
PC = address (HERE) No No No No
After Instruction operation operation operation operation
If Zero = 1;
PC = address (Jump)
If Zero = 0; Example: HERE CALL THERE, FAST
PC = address (HERE + 2) Before Instruction
PC = address (HERE)
After Instruction
PC = address (THERE)
TOS = address (HERE + 4)
WS = W
BSRS = BSR
STATUSS = Status

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CLRF Clear f CLRWDT Clear Watchdog Timer

Syntax: [ label ] CLRF f [,a] Syntax: [ label ] CLRWDT
Operands: 0 ≤ f ≤ 255 Operands: None
a ∈ [0,1] Operation: 000h → WDT,
Operation: 000h → f 000h → WDT postscaler,
1→Z 1 → TO,
Status Affected: Z 1 → PD

Encoding: 0110 101a ffff ffff Status Affected: TO, PD

Description: Clears the contents of the specified Encoding: 0000 0000 0000 0100
register. If ‘a’ is ‘0’, the Access Description: CLRWDT instruction resets the
Bank will be selected, overriding Watchdog Timer. It also resets the
the BSR value. If ‘a’ = 1, then the postscaler of the WDT. Status bits,
bank will be selected as per the TO and PD, are set.
BSR value (default). Words: 1
Words: 1 Cycles: 1
Cycles: 1 Q Cycle Activity:
Q Cycle Activity: Q1 Q2 Q3 Q4
Q1 Q2 Q3 Q4 Decode No Process No
Decode Read Process Write operation Data operation
register ‘f’ Data register ‘f’
Example: CLRWDT
Example: CLRF FLAG_REG
Before Instruction
Before Instruction WDT Counter = ?
FLAG_REG = 0x5A After Instruction
After Instruction WDT Counter = 0x00
FLAG_REG = 0x00 WDT Postscaler = 0
TO = 1
PD = 1

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PIC18F1220/1320

COMF Complement f CPFSEQ Compare f with W, skip if f = W

Syntax: [ label ] COMF f [,d [,a]] Syntax: [ label ] CPFSEQ f [,a]
Operands: 0 ≤ f ≤ 255 Operands: 0 ≤ f ≤ 255
d ∈ [0,1] a ∈ [0,1]
a ∈ [0,1] Operation: (f) – (W),
Operation: (f) → dest skip if (f) = (W)
Status Affected: N, Z (unsigned comparison)

Encoding: 0001 11da ffff ffff Status Affected: None

Description: The contents of register ‘f’ are Encoding: 0110 001a ffff ffff
complemented. If ‘d’ is ‘0’, the Description: Compares the contents of data
result is stored in W. If ‘d’ is ‘1’, the memory location ‘f’ to the contents
result is stored back in register ‘f’ of W by performing an unsigned
(default). If ‘a’ is ‘0’, the Access subtraction.
Bank will be selected, overriding If ‘f’ = W, then the fetched
the BSR value. If ‘a’ = 1, then the instruction is discarded and a NOP
bank will be selected as per the is executed instead, making this a
BSR value (default). two-cycle instruction. If ‘a’ is ‘0’, the
Words: 1 Access Bank will be selected,
overriding the BSR value. If ‘a’ = 1,
Cycles: 1 then the bank will be selected as
Q Cycle Activity: per the BSR value (default).
Q1 Q2 Q3 Q4 Words: 1
Decode Read Process Write to Cycles: 1(2)
register ‘f’ Data destination
Note: 3 cycles if skip and followed
Example: COMF REG, W by a 2-word instruction.
Before Instruction Q Cycle Activity:
REG = 0x13
Q1 Q2 Q3 Q4
After Instruction
Decode Read Process No
REG = 0x13
register ‘f’ Data operation
W = 0xEC
If skip:
Q1 Q2 Q3 Q4
No No No No
operation operation operation operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No No No No
operation operation operation operation
No No No No
operation operation operation operation

Example: HERE CPFSEQ REG

NEQUAL :
EQUAL :
Before Instruction
PC Address = HERE
W = ?
REG = ?
After Instruction
If REG = W;
PC = Address (EQUAL)
If REG ≠ W;
PC = Address (NEQUAL)

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CPFSGT Compare f with W, skip if f > W CPFSLT Compare f with W, skip if f < W
Syntax: [ label ] CPFSGT f [,a] Syntax: [ label ] CPFSLT f [,a]
Operands: 0 ≤ f ≤ 255 Operands: 0 ≤ f ≤ 255
a ∈ [0,1] a ∈ [0,1]
Operation: (f) – (W), Operation: (f) – (W),
skip if (f) > (W) skip if (f) < (W)
(unsigned comparison) (unsigned comparison)
Status Affected: None Status Affected: None
Encoding: 0110 010a ffff ffff Encoding: 0110 000a ffff ffff
Description: Compares the contents of data Description: Compares the contents of data
memory location ‘f’ to the contents memory location ‘f’ to the contents
of W by performing an unsigned of W by performing an unsigned
subtraction. subtraction.
If the contents of ‘f’ are greater than If the contents of ‘f’ are less than
the contents of WREG, then the the contents of W, then the fetched
fetched instruction is discarded and instruction is discarded and a NOP
a NOP is executed instead, making is executed instead, making this a
this a two-cycle instruction. If ‘a’ is two-cycle instruction. If ‘a’ is ‘0’, the
‘0’, the Access Bank will be Access Bank will be selected. If ‘a’
selected, overriding the BSR value. is ‘1’, the BSR will not be
If ‘a’ = 1, then the bank will be overridden (default).
selected as per the BSR value Words: 1
(default).
Cycles: 1(2)
Words: 1 Note: 3 cycles if skip and followed
Cycles: 1(2) by a 2-word instruction.
Note: 3 cycles if skip and followed Q Cycle Activity:
by a 2-word instruction.
Q1 Q2 Q3 Q4
Q Cycle Activity: Decode Read Process No
Q1 Q2 Q3 Q4 register ‘f’ Data operation
Decode Read Process No If skip:
register ‘f’ Data operation Q1 Q2 Q3 Q4
If skip: No No No No
Q1 Q2 Q3 Q4 operation operation operation operation
No No No No If skip and followed by 2-word instruction:
operation operation operation operation Q1 Q2 Q3 Q4
If skip and followed by 2-word instruction: No No No No
Q1 Q2 Q3 Q4 operation operation operation operation
No No No No No No No No
operation operation operation operation operation operation operation operation
No No No No
operation operation operation operation Example: HERE CPFSLT REG
NLESS :
Example: HERE CPFSGT REG LESS :
NGREATER : Before Instruction
GREATER : PC = Address (HERE)
Before Instruction W = ?
PC = Address (HERE) After Instruction
W = ? If REG < W;
After Instruction PC = Address (LESS)
If REG ≥ W;
If REG > W; PC = Address (NLESS)
PC = Address (GREATER)
If REG ≤ W;
PC = Address (NGREATER)

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PIC18F1220/1320

DAW Decimal Adjust W Register DECF Decrement f

Syntax: [ label ] DAW Syntax: [ label ] DECF f [,d [,a]]
Operands: None Operands: 0 ≤ f ≤ 255
Operation: If [W<3:0> > 9] or [DC = 1] then d ∈ [0,1]
(W<3:0>) + 6 → W<3:0>; a ∈ [0,1]
else Operation: (f) – 1 → dest
(W<3:0>) → W<3:0>; Status Affected: C, DC, N, OV, Z
If [W<7:4> > 9] or [C = 1] then Encoding: 0000 01da ffff ffff
(W<7:4>) + 6 → W<7:4>; Description: Decrement register ‘f’. If ‘d’ is ‘0’,
else the result is stored in W. If ‘d’ is ‘1’,
(W<7:4>) → W<7:4>; the result is stored back in register
Status Affected: C, DC ‘f’ (default). If ‘a’ is ‘0’, the Access
Bank will be selected, overriding
Encoding: 0000 0000 0000 0111
the BSR value. If ‘a’ = 1, then the
Description: DAW adjusts the eight-bit value in bank will be selected as per the
W, resulting from the earlier addi- BSR value (default).
tion of two variables (each in Words: 1
packed BCD format) and produces
a correct packed BCD result. The Cycles: 1
Carry bit may be set by DAW regard- Q Cycle Activity:
less of its setting prior to the DAW Q1 Q2 Q3 Q4
instruction. Decode Read Process Write to
Words: 1 register ‘f’ Data destination
Cycles: 1
Example: DECF CNT
Q Cycle Activity:
Q1 Q2 Q3 Q4 Before Instruction
CNT = 0x01
Decode Read Process Write Z = 0
register W Data W
After Instruction
Example 1: DAW
CNT = 0x00
Before Instruction Z = 1
W = 0xA5
C = 0
DC = 0
After Instruction
W = 0x05
C = 1
DC = 0
Example 2:
Before Instruction
W = 0xCE
C = 0
DC = 0
After Instruction
W = 0x34
C = 1
DC = 0

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DECFSZ Decrement f, skip if 0 DCFSNZ Decrement f, skip if not 0

Syntax: [ label ] DECFSZ f [,d [,a]] Syntax: [ label ] DCFSNZ f [,d [,a]]
Operands: 0 ≤ f ≤ 255 Operands: 0 ≤ f ≤ 255
d ∈ [0,1] d ∈ [0,1]
a ∈ [0,1] a ∈ [0,1]
Operation: (f) – 1 → dest, Operation: (f) – 1 → dest,
skip if result = 0 skip if result ≠ 0
Status Affected: None Status Affected: None
Encoding: 0010 11da ffff ffff Encoding: 0100 11da ffff ffff
Description: The contents of register ‘f’ are Description: The contents of register ‘f’ are
decremented. If ‘d’ is ‘0’, the result decremented. If ‘d’ is ‘0’, the result
is placed in W. If ‘d’ is ‘1’, the result is placed in W. If ‘d’ is ‘1’, the result
is placed back in register ‘f’ is placed back in register ‘f’
(default). (default).
If the result is ‘0’, the next instruc- If the result is not ‘0’, the next
tion, which is already fetched, is instruction, which is already
discarded and a NOP is executed fetched, is discarded and a NOP is
instead, making it a two-cycle executed instead, making it a two-
instruction. If ‘a’ is ‘0’, the Access cycle instruction. If ‘a’ is ‘0’, the
Bank will be selected, overriding Access Bank will be selected,
the BSR value. If ‘a’ = 1, then the overriding the BSR value. If ‘a’ = 1,
bank will be selected as per the then the bank will be selected as
BSR value (default). per the BSR value (default).
Words: 1 Words: 1
Cycles: 1(2) Cycles: 1(2)
Note: 3 cycles if skip and followed Note: 3 cycles if skip and followed
by a 2-word instruction. by a 2-word instruction.
Q Cycle Activity: Q Cycle Activity:
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Decode Read Process Write to Decode Read Process Write to
register ‘f’ Data destination register ‘f’ Data destination
If skip: If skip:
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
No No No No No No No No
operation operation operation operation operation operation operation operation
If skip and followed by 2-word instruction: If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
No No No No No No No No
operation operation operation operation operation operation operation operation
No No No No No No No No
operation operation operation operation operation operation operation operation

Example: HERE DECFSZ CNT Example: HERE DCFSNZ TEMP

GOTO LOOP ZERO :
CONTINUE NZERO :
Before Instruction Before Instruction
PC = Address (HERE) TEMP = ?
After Instruction After Instruction
CNT = CNT – 1 TEMP = TEMP – 1,
If CNT = 0; If TEMP = 0;
PC = Address (CONTINUE) PC = Address (ZERO)
If CNT ≠ 0; If TEMP ≠ 0;
PC = Address (HERE + 2) PC = Address (NZERO)

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GOTO Unconditional Branch INCF Increment f

Syntax: [ label ] GOTO k Syntax: [ label ] INCF f [,d [,a]]
Operands: 0 ≤ k ≤ 1048575 Operands: 0 ≤ f ≤ 255
Operation: k → PC<20:1> d ∈ [0,1]
a ∈ [0,1]
Status Affected: None
Operation: (f) + 1 → dest
Encoding:
1st word (k<7:0>) 1110 1111 k7kkk kkkk0 Status Affected: C, DC, N, OV, Z
2nd word(k<19:8>) 1111 k19kkk kkkk kkkk8 Encoding: 0010 10da ffff ffff
Description: GOTO allows an unconditional Description: The contents of register ‘f’ are
branch anywhere within the entire incremented. If ‘d’ is ‘0’, the result
2-Mbyte memory range. The 20-bit is placed in W. If ‘d’ is ‘1’, the result
value ‘k’ is loaded into PC<20:1>. is placed back in register ‘f’
GOTO is always a two-cycle (default). If ‘a’ is ‘0’, the Access
instruction. Bank will be selected, overriding
Words: 2 the BSR value. If ‘a’ = 1, then the
bank will be selected as per the
Cycles: 2 BSR value (default).
Q Cycle Activity: Words: 1
Q1 Q2 Q3 Q4
Cycles: 1
Decode Read literal No Read literal
‘k’<7:0>, operation ‘k’<19:8>, Q Cycle Activity:
Write to PC Q1 Q2 Q3 Q4
No No No No Decode Read Process Write to
operation operation operation operation register ‘f’ Data destination

Example: GOTO THERE Example: INCF CNT

After Instruction Before Instruction
PC = Address (THERE) CNT = 0xFF
Z = 0
C = ?
DC = ?
After Instruction
CNT = 0x00
Z = 1
C = 1
DC = 1

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 PIC18F1220/1320

INCFSZ Increment f, skip if 0 INFSNZ Increment f, skip if not 0

Syntax: [ label ] INCFSZ f [,d [,a]] Syntax: [ label ] INFSNZ f [,d [,a]]
Operands: 0 ≤ f ≤ 255 Operands: 0 ≤ f ≤ 255
d ∈ [0,1] d ∈ [0,1]
a ∈ [0,1] a ∈ [0,1]
Operation: (f) + 1 → dest, Operation: (f) + 1 → dest,
skip if result = 0 skip if result ≠ 0
Status Affected: None Status Affected: None
Encoding: 0011 11da ffff ffff Encoding: 0100 10da ffff ffff
Description: The contents of register ‘f’ are Description: The contents of register ‘f’ are
incremented. If ‘d’ is ‘0’, the result incremented. If ‘d’ is ‘0’, the result
is placed in W. If ‘d’ is ‘1’, the result is placed in W. If ‘d’ is ‘1’, the result
is placed back in register ‘f’ is placed back in register ‘f’
(default). (default).
If the result is ‘0’, the next instruc- If the result is not ‘0’, the next
tion, which is already fetched, is instruction, which is already
discarded and a NOP is executed fetched, is discarded and a NOP is
instead, making it a two-cycle executed instead, making it a
instruction. If ‘a’ is ‘0’, the Access two-cycle instruction. If ‘a’ is ‘0’, the
Bank will be selected, overriding Access Bank will be selected, over-
the BSR value. If ‘a’ = 1, then the riding the BSR value. If ‘a’ = 1, then
bank will be selected as per the the bank will be selected as per the
BSR value (default). BSR value (default).
Words: 1 Words: 1
Cycles: 1(2) Cycles: 1(2)
Note: 3 cycles if skip and followed Note: 3 cycles if skip and followed
by a 2-word instruction. by a 2-word instruction.
Q Cycle Activity: Q Cycle Activity:
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Decode Read Process Write to Decode Read Process Write to
register ‘f’ Data destination register ‘f’ Data destination
If skip: If skip:
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
No No No No No No No No
operation operation operation operation operation operation operation operation
If skip and followed by 2-word instruction: If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
No No No No No No No No
operation operation operation operation operation operation operation operation
No No No No No No No No
operation operation operation operation operation operation operation operation

Example: HERE INCFSZ CNT Example: HERE INFSNZ REG

NZERO : ZERO
ZERO : NZERO
Before Instruction Before Instruction
PC = Address (HERE) PC = Address (HERE)
After Instruction After Instruction
CNT = CNT + 1 REG = REG + 1
If CNT = 0; If REG ≠ 0;
PC = Address (ZERO) PC = Address (NZERO)
If CNT ≠ 0; If REG = 0;
PC = Address (NZERO) PC = Address (ZERO)

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PIC18F1220/1320

IORLW Inclusive OR literal with W IORWF Inclusive OR W with f

Syntax: [ label ] IORLW k Syntax: [ label ] IORWF f [,d [,a]]
Operands: 0 ≤ k ≤ 255 Operands: 0 ≤ f ≤ 255
Operation: (W) .OR. k → W d ∈ [0,1]
a ∈ [0,1]
Status Affected: N, Z
Operation: (W) .OR. (f) → dest
Encoding: 0000 1001 kkkk kkkk
Status Affected: N, Z
Description: The contents of W are OR’ed with
the eight-bit literal ‘k’. The result is Encoding: 0001 00da ffff ffff
placed in W. Description: Inclusive OR W with register ‘f’. If
Words: 1 ‘d’ is ‘0’, the result is placed in W. If
‘d’ is ‘1’, the result is placed back in
Cycles: 1 register ‘f’ (default). If ‘a’ is ‘0’, the
Q Cycle Activity: Access Bank will be selected, over-
Q1 Q2 Q3 Q4 riding the BSR value. If ‘a’ = 1, then
Decode Read Process Write to W
the bank will be selected as per the
literal ‘k’ Data BSR value (default).
Words: 1
Example: IORLW 0x35 Cycles: 1
Before Instruction Q Cycle Activity:
W = 0x9A Q1 Q2 Q3 Q4
After Instruction Decode Read Process Write to
W = 0xBF register ‘f’ Data destination

Example: IORWF RESULT, W

Before Instruction
RESULT = 0x13
W = 0x91
After Instruction
RESULT = 0x13
W = 0x93

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 PIC18F1220/1320

LFSR Load FSR MOVF Move f

Syntax: [ label ] LFSR f,k Syntax: [ label ] MOVF f [,d [,a]]
Operands: 0≤f≤2 Operands: 0 ≤ f ≤ 255
0 ≤ k ≤ 4095 d ∈ [0,1]
Operation: k → FSRf a ∈ [0,1]

Status Affected: None Operation: f → dest

Encoding: 1110 1110 00ff k11kkk Status Affected: N, Z

1111 0000 k7kkk kkkk Encoding: 0101 00da ffff ffff
Description: The 12-bit literal ‘k’ is loaded into Description: The contents of register ‘f’ are
the file select register pointed to moved to a destination dependent
by ‘f’. upon the status of ‘d’. If ‘d’ is ‘f’, the
Words: 2 result is placed in W. If ‘d’ is ‘f’, the
result is placed back in register ‘f’
Cycles: 2
(default). Location ‘f’ can be any-
Q Cycle Activity: where in the 256-byte bank. If ‘a’ is
Q1 Q2 Q3 Q4 ‘0’, the Access Bank will be
Decode Read literal Process Write literal selected, overriding the BSR value.
‘k’ MSB Data ‘k’ MSB to If ‘a’ = 1, then the bank will be
FSRfH selected as per the BSR value
Decode Read literal Process Write literal (default).
‘k’ LSB Data ‘k’ to FSRfL Words: 1
Cycles: 1
Example: LFSR 2, 0x3AB
Q Cycle Activity:
After Instruction
FSR2H = 0x03
Q1 Q2 Q3 Q4
FSR2L = 0xAB Decode Read Process Write W
register ‘f’ Data

Example: MOVF REG, W

Before Instruction
REG = 0x22
W = 0xFF
After Instruction
REG = 0x22
W = 0x22

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PIC18F1220/1320

MOVFF Move f to f MOVLB Move literal to low nibble in BSR

Syntax: [ label ] MOVFF fs,fd Syntax: [ label ] MOVLB k
Operands: 0 ≤ fs ≤ 4095 Operands: 0 ≤ k ≤ 255
0 ≤ fd ≤ 4095 Operation: k → BSR
Operation: (fs) → fd Status Affected: None
Status Affected: None Encoding: 0000 0001 kkkk kkkk
Encoding: Description: The 8-bit literal ‘k’ is loaded into
1st word (source) 1100 ffff ffff ffffs
the Bank Select Register (BSR).
2nd word (destin.) 1111 ffff ffff ffffd
Words: 1
Description: The contents of source register ‘fs’
are moved to destination register Cycles: 1
‘fd’. Location of source ‘fs’ can be Q Cycle Activity:
anywhere in the 4096-byte data Q1 Q2 Q3 Q4
space (000h to FFFh) and location Decode Read literal Process Write
of destination ‘fd’ can also be ‘k’ Data literal ‘k’ to
anywhere from 000h to FFFh. BSR
Either source or destination can be
W (a useful special situation).
Example: MOVLB 5
MOVFF is particularly useful for
transferring a data memory location Before Instruction
to a peripheral register (such as the BSR register = 0x02
transmit buffer or an I/O port). After Instruction
The MOVFF instruction cannot use BSR register = 0x05
the PCL, TOSU, TOSH or TOSL as
the destination register.
The MOVFF instruction should not
be used to modify interrupt settings
while any interrupt is enabled (see
page 73).
Words: 2
Cycles: 2 (3)
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read Process No
register ‘f’ Data operation
(src)
Decode No No Write
operation operation register ‘f’
No dummy (dest)
read

Example: MOVFF REG1, REG2

Before Instruction
REG1 = 0x33
REG2 = 0x11
After Instruction
REG1 = 0x33,
REG2 = 0x33

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 PIC18F1220/1320

MOVLW Move literal to W MOVWF Move W to f

Syntax: [ label ] MOVLW k Syntax: [ label ] MOVWF f [,a]
Operands: 0 ≤ k ≤ 255 Operands: 0 ≤ f ≤ 255
Operation: k→W a ∈ [0,1]

Status Affected: None Operation: (W) → f

Encoding: 0000 1110 kkkk kkkk Status Affected: None

Description: The eight-bit literal ‘k’ is loaded Encoding: 0110 111a ffff ffff
into W. Description: Move data from W to register ‘f’.
Words: 1 Location ‘f’ can be anywhere in the
256-byte bank. If ‘a’ is ‘0’, the
Cycles: 1 Access Bank will be selected, over-
Q Cycle Activity: riding the BSR value. If ‘a’ = 1, then
Q1 Q2 Q3 Q4 the bank will be selected as per the
Decode Read Process Write to W
BSR value (default).
literal ‘k’ Data Words: 1
Cycles: 1
Example: MOVLW 0x5A
Q Cycle Activity:
After Instruction Q1 Q2 Q3 Q4
W = 0x5A Decode Read Process Write
register ‘f’ Data register ‘f’

Example: MOVWF REG

Before Instruction
W = 0x4F
REG = 0xFF
After Instruction
W = 0x4F
REG = 0x4F

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PIC18F1220/1320

MULLW Multiply Literal with W MULWF Multiply W with f

Syntax: [ label ] MULLW k Syntax: [ label ] MULWF f [,a]
Operands: 0 ≤ k ≤ 255 Operands: 0 ≤ f ≤ 255
Operation: (W) x k → PRODH:PRODL a ∈ [0,1]

Status Affected: None Operation: (W) x (f) → PRODH:PRODL

Encoding: 0000 1101 kkkk kkkk Status Affected: None

Description: An unsigned multiplication is Encoding: 0000 001a ffff ffff

carried out between the contents Description: An unsigned multiplication is
of W and the 8-bit literal ‘k’. The carried out between the contents
16-bit result is placed in the of W and the register file location
PRODH:PRODL register pair. ‘f’. The 16-bit result is stored in
PRODH contains the high byte. the PRODH:PRODL register
W is unchanged. pair. PRODH contains the high
None of the Status flags are byte.
affected. Both W and ‘f’ are unchanged.
Note that neither Overflow nor None of the Status flags are
Carry is possible in this opera- affected.
tion. A Zero result is possible but Note that neither Overflow nor
not detected. Carry is possible in this opera-
Words: 1 tion. A Zero result is possible,
but not detected. If ‘a’ is ‘0’, the
Cycles: 1 Access Bank will be selected,
Q Cycle Activity: overriding the BSR value. If
Q1 Q2 Q3 Q4 ‘a’ = 1, then the bank will be
Decode Read Process Write
selected as per the BSR value
literal ‘k’ Data registers (default).
PRODH: Words: 1
PRODL
Cycles: 1

Example: MULLW 0xC4 Q Cycle Activity:

Q1 Q2 Q3 Q4
Before Instruction
W = 0xE2 Decode Read Process Write
PRODH = ? register ‘f’ Data registers
PRODL = ? PRODH:
After Instruction PRODL
W = 0xE2
PRODH = 0xAD
PRODL = 0x08 Example: MULWF REG
Before Instruction
W = 0xC4
REG = 0xB5
PRODH = ?
PRODL = ?
After Instruction
W = 0xC4
REG = 0xB5
PRODH = 0x8A
PRODL = 0x94

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 PIC18F1220/1320

NEGF Negate f NOP No Operation

Syntax: [ label ] NEGF f [,a] Syntax: [ label ] NOP
Operands: 0 ≤ f ≤ 255 Operands: None
a ∈ [0,1] Operation: No operation
Operation: (f) + 1 → f Status Affected: None
Status Affected: N, OV, C, DC, Z Encoding: 0000 0000 0000 0000
Encoding: 0110 110a ffff ffff 1111 xxxx xxxx xxxx

Description: Location ‘f’ is negated using two’s Description: No operation.

complement. The result is placed in Words: 1
the data memory location ‘f’. If ‘a’ is
Cycles: 1
‘0’, the Access Bank will be
selected, overriding the BSR value. Q Cycle Activity:
If ‘a’ = 1, then the bank will be Q1 Q2 Q3 Q4
selected as per the BSR value. Decode No No No
Words: 1 operation operation operation

Cycles: 1
Example:
Q Cycle Activity:
None.
Q1 Q2 Q3 Q4
Decode Read Process Write
register ‘f’ Data register ‘f’

Example: NEGF REG, 1

Before Instruction
REG = 0011 1010 [0x3A]
After Instruction
REG = 1100 0110 [0xC6]

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PIC18F1220/1320

POP Pop Top of Return Stack PUSH Push Top of Return Stack
Syntax: [ label ] POP Syntax: [ label ] PUSH
Operands: None Operands: None
Operation: (TOS) → bit bucket Operation: (PC + 2) → TOS
Status Affected: None Status Affected: None
Encoding: 0000 0000 0000 0110 Encoding: 0000 0000 0000 0101
Description: The TOS value is pulled off the Description: The PC + 2 is pushed onto the top
return stack and is discarded. The of the return stack. The previous
TOS value then becomes the TOS value is pushed down on the
previous value that was pushed stack.
onto the return stack. This instruction allows implement-
This instruction is provided to ing a software stack by modifying
enable the user to properly manage TOS and then pushing it onto the
the return stack to incorporate a return stack.
software stack. Words: 1
Words: 1 Cycles: 1
Cycles: 1 Q Cycle Activity:
Q Cycle Activity: Q1 Q2 Q3 Q4
Q1 Q2 Q3 Q4 Decode Push No No
Decode No Pop TOS No PC + 2 onto operation operation
operation value operation return stack

Example: POP Example: PUSH

GOTO NEW
Before Instruction
Before Instruction TOS = 0x00345A
TOS = 0x0031A2 PC = 0x000124
Stack (1 level down) = 0x014332
After Instruction
After Instruction PC = 0x000126
TOS = 0x014332 TOS = 0x000126
PC = NEW Stack (1 level down) = 0x00345A

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 PIC18F1220/1320

RCALL Relative Call RESET Reset

Syntax: [ label ] RCALL n Syntax: [ label ] RESET
Operands: -1024 ≤ n ≤ 1023 Operands: None
Operation: (PC) + 2 → TOS, Operation: Reset all registers and flags that
(PC) + 2 + 2n → PC are affected by a MCLR Reset.
Status Affected: None Status Affected: All
Encoding: 1101 1nnn nnnn nnnn Encoding: 0000 0000 1111 1111
Description: Subroutine call with a jump up to 1K Description: This instruction provides a way to
from the current location. First, execute a MCLR Reset in software.
return address (PC + 2) is pushed Words: 1
onto the stack. Then, add the 2’s
complement number ‘2n’ to the PC. Cycles: 1
Since the PC will have incremented Q Cycle Activity:
to fetch the next instruction, the new Q1 Q2 Q3 Q4
address will be PC + 2 + 2n. This Decode Start No No
instruction is a two-cycle instruction. Reset operation operation
Words: 1
Cycles: 2 Example: RESET

Q Cycle Activity: After Instruction

Q1 Q2 Q3 Q4 Registers = Reset Value
Flags* = Reset Value
Decode Read literal Process Write to PC
‘n’ Data
Push PC to
stack
No No No No
operation operation operation operation

Example: HERE RCALL Jump

Before Instruction
PC = Address (HERE)
After Instruction
PC = Address (Jump)
TOS = Address (HERE + 2)

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PIC18F1220/1320

RETFIE Return from Interrupt RETLW Return Literal to W

Syntax: [ label ] RETFIE [s] Syntax: [ label ] RETLW k
Operands: s ∈ [0,1] Operands: 0 ≤ k ≤ 255
Operation: (TOS) → PC, Operation: k → W,
1 → GIE/GIEH or PEIE/GIEL, (TOS) → PC,
if s = 1 PCLATU, PCLATH are unchanged
(WS) → W, Status Affected: None
(STATUSS) → Status,
(BSRS) → BSR, Encoding: 0000 1100 kkkk kkkk
PCLATU, PCLATH are unchanged. Description: W is loaded with the eight-bit literal
Status Affected: GIE/GIEH, PEIE/GIEL. ‘k’. The program counter is loaded
from the top of the stack (the return
Encoding: 0000 0000 0001 000s
address). The high address latch
Description: Return from interrupt. Stack is (PCLATH) remains unchanged.
popped and Top-of-Stack (TOS) is Words: 1
loaded into the PC. Interrupts are
enabled by setting either the high Cycles: 2
or low priority global interrupt Q Cycle Activity:
enable bit. If ‘s’ = 1, the contents of Q1 Q2 Q3 Q4
the shadow registers, WS, Decode Read Process Pop PC
STATUSS and BSRS, are loaded literal ‘k’ Data from stack,
into their corresponding registers, Write to W
W, Status and BSR. If ‘s’ = 0, no No No No No
update of these registers occurs operation operation operation operation
(default).
Words: 1 Example:
Cycles: 2
CALL TABLE ; W contains table
Q Cycle Activity: ; offset value
Q1 Q2 Q3 Q4 ; W now has
Decode No No Pop PC ; table value
operation operation from stack :
TABLE
Set GIEH or
ADDWF PCL ; W = offset
GIEL
RETLW k0 ; Begin table
No No No No
RETLW k1 ;
operation operation operation operation
:
:
Example: RETFIE 1 RETLW kn ; End of table

After Interrupt
PC = TOS Before Instruction
W = WS W = 0x07
BSR = BSRS
Status = STATUSS After Instruction
GIE/GIEH, PEIE/GIEL = 1
W = value of kn

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 PIC18F1220/1320

RETURN Return from Subroutine RLCF Rotate Left f through Carry

Syntax: [ label ] RETURN [s] Syntax: [ label ] RLCF f [,d [,a]]
Operands: s ∈ [0,1] Operands: 0 ≤ f ≤ 255
Operation: (TOS) → PC, d ∈ [0,1]
if s = 1 a ∈ [0,1]
(WS) → W, Operation: (f<n>) → dest<n + 1>,
(STATUSS) → Status, (f<7>) → C,
(BSRS) → BSR, (C) → dest<0>
PCLATU, PCLATH are unchanged Status Affected: C, N, Z
Status Affected: None Encoding: 0011 01da ffff ffff
Encoding: 0000 0000 0001 001s
Description: The contents of register ‘f’ are
Description: Return from subroutine. The stack rotated one bit to the left through
is popped and the top of the stack the Carry flag. If ‘d’ is ‘0’, the result
is loaded into the program counter. is placed in W. If ‘d’ is ‘1’, the result
If ‘s’= 1, the contents of the shadow is stored back in register ‘f’
registers, WS, STATUSS and (default). If ‘a’ is ‘0’, the Access
BSRS, are loaded into their corre- Bank will be selected, overriding
sponding registers, W, Status and the BSR value. If ‘a’ = 1, then the
BSR. If ‘s’ = 0, no update of these bank will be selected as per the
registers occurs (default). BSR value (default).
Words: 1 C register f
Cycles: 2
Words: 1
Q Cycle Activity:
Cycles: 1
Q1 Q2 Q3 Q4
Decode No Process Pop PC Q Cycle Activity:
operation Data from stack Q1 Q2 Q3 Q4
No No No No Decode Read Process Write to
operation operation operation operation register ‘f’ Data destination

Example: RLCF REG, W

Example: RETURN Before Instruction
After Interrupt REG = 1110 0110
C = 0
PC = TOS
After Instruction
REG = 1110 0110
W = 1100 1100
C = 1

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PIC18F1220/1320

RLNCF Rotate Left f (no carry) RRCF Rotate Right f through Carry
Syntax: [ label ] RLNCF f [,d [,a]] Syntax: [ label ] RRCF f [,d [,a]]
Operands: 0 ≤ f ≤ 255 Operands: 0 ≤ f ≤ 255
d ∈ [0,1] d ∈ [0,1]
a ∈ [0,1] a ∈ [0,1]
Operation: (f<n>) → dest<n + 1>, Operation: (f<n>) → dest<n – 1>,
(f<7>) → dest<0> (f<0>) → C,
Status Affected: N, Z (C) → dest<7>

Encoding: 0100 01da ffff ffff Status Affected: C, N, Z

Description: The contents of register ‘f’ are Encoding: 0011 00da ffff ffff
rotated one bit to the left. If ‘d’ is ‘0’, Description: The contents of register ‘f’ are
the result is placed in W. If ‘d’ is ‘1’, rotated one bit to the right through
the result is stored back in register the Carry flag. If ‘d’ is ‘0’, the result
‘f’ (default). If ‘a’ is ‘0’, the Access is placed in W. If ‘d’ is ‘1’, the result
Bank will be selected, overriding is placed back in register ‘f’
the BSR value. If ‘a’ is ‘1’, then the (default). If ‘a’ is ‘0’, the Access
bank will be selected as per the Bank will be selected, overriding
BSR value (default). the BSR value. If ‘a’ is ‘1’, then the
register f
bank will be selected as per the
BSR value (default).
Words: 1 C register f
Cycles: 1
Words: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4 Cycles: 1
Decode Read Process Write to Q Cycle Activity:
register ‘f’ Data destination Q1 Q2 Q3 Q4
Decode Read Process Write to
Example: RLNCF REG register ‘f’ Data destination

Before Instruction
REG = 1010 1011 Example: RRCF REG, W
After Instruction Before Instruction
REG = 0101 0111 REG = 1110 0110
C = 0
After Instruction
REG = 1110 0110
W = 0111 0011
C = 0

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 PIC18F1220/1320

RRNCF Rotate Right f (no carry) SETF Set f

Syntax: [ label ] RRNCF f [,d [,a]] Syntax: [ label ] SETF f [,a]
Operands: 0 ≤ f ≤ 255 Operands: 0 ≤ f ≤ 255
d ∈ [0,1] a ∈ [0,1]
a ∈ [0,1] Operation: FFh → f
Operation: (f<n>) → dest<n – 1>, Status Affected: None
(f<0>) → dest<7>
Encoding: 0110 100a ffff ffff
Status Affected: N, Z
Description: The contents of the specified
Encoding: 0100 00da ffff ffff
register are set to FFh. If ‘a’ is ‘0’,
Description: The contents of register ‘f’ are the Access Bank will be selected,
rotated one bit to the right. If ‘d’ is overriding the BSR value. If ‘a’ is
‘0’, the result is placed in W. If ‘d’ is ‘1’, then the bank will be selected
‘1’, the result is placed back in as per the BSR value (default).
register ‘f’ (default). If ‘a’ is ‘0’, the Words: 1
Access Bank will be selected,
overriding the BSR value. If ‘a’ is Cycles: 1
‘1’, then the bank will be selected Q Cycle Activity:
as per the BSR value (default). Q1 Q2 Q3 Q4
register f Decode Read Process Write
register ‘f’ Data register ‘f’
Words: 1
Cycles: 1 Example: SETF REG

Q Cycle Activity: Before Instruction

REG = 0x5A
Q1 Q2 Q3 Q4
Decode Read Process Write to
After Instruction
REG = 0xFF
register ‘f’ Data destination

Example 1: RRNCF REG, 1, 0

Before Instruction
REG = 1101 0111
After Instruction
REG = 1110 1011
Example 2: RRNCF REG, W
Before Instruction
W = ?
REG = 1101 0111
After Instruction
W = 1110 1011
REG = 1101 0111

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PIC18F1220/1320

SLEEP Enter Sleep mode SUBFWB Subtract f from W with borrow

Syntax: [ label ] SLEEP Syntax: [ label ] SUBFWB f [,d [,a]]
Operands: None Operands: 0 ≤ f ≤ 255
Operation: 00h → WDT, d ∈ [0,1]
0 → WDT postscaler, a ∈ [0,1]
1 → TO, Operation: (W) – (f) – (C) → dest
0 → PD Status Affected: N, OV, C, DC, Z
Status Affected: TO, PD Encoding: 0101 01da ffff ffff
Encoding: 0000 0000 0000 0011
Description: Subtract register ‘f’ and Carry flag
Description: The Power-down status bit (PD) is (borrow) from W (2’s complement
cleared. The Time-out status bit method). If ‘d’ is ‘0’, the result is
(TO) is set. The Watchdog Timer stored in W. If ‘d’ is ‘1’, the result is
and its postscaler are cleared. stored in register ‘f’ (default). If ‘a’ is
The processor is put into Sleep ‘0’, the Access Bank will be
mode with the oscillator stopped. selected, overriding the BSR value.
Words: 1 If ‘a’ is ‘1’, then the bank will be
selected as per the BSR value
Cycles: 1 (default).
Q Cycle Activity: Words: 1
Q1 Q2 Q3 Q4
Cycles: 1
Decode No Process Go to
operation Data Sleep Q Cycle Activity:
Q1 Q2 Q3 Q4
Example: SLEEP Decode Read Process Write to
register ‘f’ Data destination
Before Instruction
TO = ? Example 1: SUBFWB REG
PD = ?
Before Instruction
After Instruction REG = 0x03
TO = 1† W = 0x02
PD = 0 C = 0x01
After Instruction
† If WDT causes wake-up, this bit is cleared. REG = 0xFF
W = 0x02
C = 0x00
Z = 0x00
N = 0x01 ; result is negative
Example 2: SUBFWB REG, 0, 0
Before Instruction
REG = 2
W = 5
C = 1
After Instruction
REG = 2
W = 3
C = 1
Z = 0
N = 0 ; result is positive
Example 3: SUBFWB REG, 1, 0
Before Instruction
REG = 1
W = 2
C = 0
After Instruction
REG = 0
W = 2
C = 1
Z = 1 ; result is zero
N = 0

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 PIC18F1220/1320

SUBLW Subtract W from literal SUBWF Subtract W from f

Syntax: [ label ] SUBLW k Syntax: [ label ] SUBWF f [,d [,a]]

Operands: 0 ≤ k ≤ 255 Operands: 0 ≤ f ≤ 255
d ∈ [0,1]
Operation: k – (W) → W
a ∈ [0,1]
Status Affected: N, OV, C, DC, Z
Operation: (f) – (W) → dest
Encoding: 0000 1000 kkkk kkkk
Status Affected: N, OV, C, DC, Z
Description: W is subtracted from the eight-bit
Encoding: 0101 11da ffff ffff
literal ‘k’. The result is placed
in W. Description: Subtract W from register ‘f’ (2’s
complement method). If ‘d’ is ‘0’,
Words: 1
the result is stored in W. If ‘d’ is
Cycles: 1 ‘1’, the result is stored back in
Q Cycle Activity: register ‘f’ (default). If ‘a’ is ‘0’, the
Access Bank will be selected,
Q1 Q2 Q3 Q4
overriding the BSR value. If ‘a’ is
Decode Read Process Write to W
‘1’, then the bank will be selected
literal ‘k’ Data
as per the BSR value (default).
Example 1: SUBLW 0x02 Words: 1
Before Instruction Cycles: 1
W = 1
C = ? Q Cycle Activity:
After Instruction Q1 Q2 Q3 Q4
W = 1 Decode Read Process Write to
C = 1 ; result is positive register ‘f’ Data destination
Z = 0
N = 0
Example 1: SUBWF REG
Example 2: SUBLW 0x02
Before Instruction
Before Instruction REG = 3
W = 2 W = 2
C = ? C = ?
After Instruction After Instruction
W = 0 REG = 1
C = 1 ; result is zero W = 2
Z = 1 C = 1 ; result is positive
N = 0 Z = 0
N = 0
Example 3: SUBLW 0x02
Example 2: SUBWF REG, W
Before Instruction
Before Instruction
W = 3
C = ? REG = 2
W = 2
After Instruction C = ?
W = FF ; (2’s complement) After Instruction
C = 0 ; result is negative REG = 2
Z = 0 W = 0
N = 1 C = 1 ; result is zero
Z = 1
N = 0
Example 3: SUBWF REG
Before Instruction
REG = 0x01
W = 0x02
C = ?
After Instruction
REG = 0xFFh ;(2’s complement)
W = 0x02
C = 0x00 ;result is negative
Z = 0x00
N = 0x01

© 2007 Microchip Technology Inc. DS39605F-page 227

PIC18F1220/1320

SUBWFB Subtract W from f with Borrow SWAPF Swap f

Syntax: [ label ] SUBWFB f [,d [,a]] Syntax: [ label ] SWAPF f [,d [,a]]
Operands: 0 ≤ f ≤ 255 Operands: 0 ≤ f ≤ 255
d ∈ [0,1] d ∈ [0,1]
a ∈ [0,1] a ∈ [0,1]
Operation: (f) – (W) – (C) → dest Operation: (f<3:0>) → dest<7:4>,
Status Affected: N, OV, C, DC, Z (f<7:4>) → dest<3:0>

Encoding: 0101 10da ffff ffff Status Affected: None

Description: Subtract W and the Carry flag Encoding: 0011 10da ffff ffff
(borrow) from register ‘f’ (2’s comple- Description: The upper and lower nibbles of
ment method). If ‘d’ is ‘0’, the result is register ‘f’ are exchanged. If ‘d’ is
stored in W. If ‘d’ is ‘1’, the result is ‘0’, the result is placed in W. If ‘d’ is
stored back in register ‘f’ (default). If ‘1’, the result is placed in register ‘f’
‘a’ is ‘0’, the Access Bank will be (default). If ‘a’ is ‘0’, the Access
selected, overriding the BSR value. If Bank will be selected, overriding
‘a’ is ‘1’, then the bank will be the BSR value. If ‘a’ is ‘1’, then the
selected as per the BSR value bank will be selected as per the
(default). BSR value (default).
Words: 1 Words: 1
Cycles: 1 Cycles: 1
Q Cycle Activity: Q Cycle Activity:
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Decode Read Process Write to Decode Read Process Write to
register ‘f’ Data destination register ‘f’ Data destination
Example 1: SUBWFB REG, 1, 0 Example: SWAPF REG
Before Instruction Before Instruction
REG = 0x19 (0001 1001) REG = 0x53
W = 0x0D (0000 1101)
C = 0x01 After Instruction
After Instruction REG = 0x35
REG = 0x0C (0000 1011)
W = 0x0D (0000 1101)
C = 0x01
Z = 0x00
N = 0x00 ; result is positive
Example 2: SUBWFB REG, 0, 0
Before Instruction
REG = 0x1B (0001 1011)
W = 0x1A (0001 1010)
C = 0x00
After Instruction
REG = 0x1B (0001 1011)
W = 0x00
C = 0x01
Z = 0x01 ; result is zero
N = 0x00
Example 3: SUBWFB REG, 1, 0
Before Instruction
REG = 0x03 (0000 0011)
W = 0x0E (0000 1101)
C = 0x01
After Instruction
REG = 0xF5 (1111 0100)
; [2’s comp]
W = 0x0E (0000 1101)
C = 0x00
Z = 0x00
N = 0x01 ; result is negative

DS39605F-page 228 © 2007 Microchip Technology Inc.

 PIC18F1220/1320

TBLRD Table Read TBLRD Table Read (Continued)

Syntax: [ label ] TBLRD ( *; *+; *-; +*) Example 1: TBLRD *+ ;
Operands: None Before Instruction
TABLAT = 0x55
Operation: if TBLRD *, TBLPTR = 0x00A356
(Prog Mem (TBLPTR)) → TABLAT; MEMORY(0x00A356) = 0x34
TBLPTR – No Change; After Instruction
if TBLRD *+, TABLAT = 0x34
(Prog Mem (TBLPTR)) → TABLAT; TBLPTR = 0x00A357
(TBLPTR) + 1 → TBLPTR;
if TBLRD *-, Example 2: TBLRD +* ;
(Prog Mem (TBLPTR)) → TABLAT; Before Instruction
(TBLPTR) – 1 → TBLPTR; TABLAT = 0xAA
if TBLRD +*, TBLPTR = 0x01A357
(TBLPTR) + 1 → TBLPTR; MEMORY(0x01A357) = 0x12
(Prog Mem (TBLPTR)) → TABLAT; MEMORY(0x01A358) = 0x34
After Instruction
Status Affected: None TABLAT = 0x34
Encoding: 0000 0000 0000 10nn TBLPTR = 0x01A358
nn = 0*
= 1*+
= 2*-
= 3+*
Description: This instruction is used to read the
contents of Program Memory (P.M.). To
address the program memory, a pointer
called Table Pointer (TBLPTR) is used.
The TBLPTR (a 21-bit pointer) points
to each byte in the program memory.
TBLPTR has a 2-Mbyte address
range.
TBLPTR[0] = 0: Least Significant
Byte of Program
Memory Word
TBLPTR[0] = 1: Most Significant
Byte of Program
Memory Word
The TBLRD instruction can modify the
value of TBLPTR as follows:
• no change
• post-increment
• post-decrement
• pre-increment
Words: 1
Cycles: 2
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode No No No
operation operation operation
No No operation No No operation
operation (Read Program operation (Write
Memory) TABLAT)

© 2007 Microchip Technology Inc. DS39605F-page 229

PIC18F1220/1320

TBLWT Table Write TBLWT Table Write (Continued)

Syntax: [ label ] TBLWT ( *; *+; *-; +*) Words: 1
Operands: None Cycles: 2
Operation: if TBLWT*, Q Cycle Activity:
(TABLAT) → Holding Register;
Q1 Q2 Q3 Q4
TBLPTR – No Change;
if TBLWT*+, Decode No No No
(TABLAT) → Holding Register; operation operation operation
(TBLPTR) + 1 → TBLPTR; No No No No
if TBLWT*-, operation operation operation operation
(TABLAT) → Holding Register; (Read (Write to
(TBLPTR) – 1 → TBLPTR; TABLAT) Holding
if TBLWT+*, Register)
(TBLPTR) + 1 → TBLPTR;
(TABLAT) → Holding Register; Example 1: TBLWT *+;
Status Affected: None Before Instruction
TABLAT = 0x55
Encoding: 0000 0000 0000 11nn TBLPTR = 0x00A356
nn = 0* HOLDING REGISTER
= 1*+ (0x00A356) = 0xFF
= 2*- After Instructions (table write completion)
= 3+* TABLAT = 0x55
TBLPTR = 0x00A357
Description: This instruction uses the 3 LSBs of HOLDING REGISTER
TBLPTR to determine which of the (0x00A356) = 0x55
8 holding registers the TABLAT is Example 2: TBLWT +*;
written to. The holding registers are
used to program the contents of Before Instruction
TABLAT = 0x34
Program Memory (P.M.). (Refer TBLPTR = 0x01389A
to Section 6.0 “Flash Program HOLDING REGISTER
Memory” for additional details on (0x01389A) = 0xFF
HOLDING REGISTER
programming Flash memory.) (0x01389B) = 0xFF
The TBLPTR (a 21-bit pointer) points After Instruction (table write completion)
to each byte in the program memory. TABLAT = 0x34
TBLPTR has a 2-Mbyte address TBLPTR = 0x01389B
range. The LSb of the TBLPTR HOLDING REGISTER
(0x01389A) = 0xFF
selects which byte of the program HOLDING REGISTER
memory location to access. (0x01389B) = 0x34
TBLPTR[0] = 0:Least Significant
Byte of Program
Memory Word
TBLPTR[0] = 1:Most Significant
Byte of Program
Memory Word
The TBLWT instruction can modify the
value of TBLPTR as follows:
• no change
• post-increment
• post-decrement
• pre-increment

DS39605F-page 230 © 2007 Microchip Technology Inc.

 PIC18F1220/1320

TSTFSZ Test f, skip if 0 XORLW Exclusive OR literal with W

Syntax: [ label ] TSTFSZ f [,a] Syntax: [ label ] XORLW k
Operands: 0 ≤ f ≤ 255 Operands: 0 ≤ k ≤ 255
a ∈ [0,1]
Operation: (W) .XOR. k → W
Operation: skip if f = 0
Status Affected: N, Z
Status Affected: None
Encoding: 0000 1010 kkkk kkkk
Encoding: 0110 011a ffff ffff
Description: The contents of W are XOR’ed
Description: If ‘f’ = 0, the next instruction, with the 8-bit literal ‘k’. The result
fetched during the current is placed in W.
instruction execution is discarded
Words: 1
and a NOP is executed, making this
a two-cycle instruction. If ‘a’ is ‘0’, Cycles: 1
the Access Bank will be selected, Q Cycle Activity:
overriding the BSR value. If ‘a’ is
Q1 Q2 Q3 Q4
‘1’, then the bank will be selected
Decode Read Process Write to W
as per the BSR value (default).
literal ‘k’ Data
Words: 1
Cycles: 1(2) Example: XORLW 0xAF
Note: 3 cycles if skip and followed
Before Instruction
by a 2-word instruction.
W = 0xB5
Q Cycle Activity:
After Instruction
Q1 Q2 Q3 Q4
W = 0x1A
Decode Read Process No
register ‘f’ Data operation
If skip:
Q1 Q2 Q3 Q4
No No No No
operation operation operation operation
If skip and followed by 2-word instruction:
Q1 Q2 Q3 Q4
No No No No
operation operation operation operation
No No No No
operation operation operation operation

Example: HERE TSTFSZ CNT

NZERO :
ZERO :
Before Instruction
PC = Address (HERE)
After Instruction
If CNT = 0x00,
PC = Address (ZERO)
If CNT ≠ 0x00,
PC = Address (NZERO)

© 2007 Microchip Technology Inc. DS39605F-page 231

PIC18F1220/1320

XORWF Exclusive OR W with f

Syntax: [ label ] XORWF f [,d [,a]]
Operands: 0 ≤ f ≤ 255
d ∈ [0,1]
a ∈ [0,1]
Operation: (W) .XOR. (f) → dest
Status Affected: N, Z
Encoding: 0001 10da ffff ffff
Description: Exclusive OR the contents of W
with register ‘f’. If ‘d’ is ‘0’, the result
is stored in W. If ‘d’ is ‘1’, the result
is stored back in the register ‘f’
(default). If ‘a’ is ‘0’, the Access
Bank will be selected, overriding
the BSR value. If ‘a’ is ‘1’, then the
bank will be selected as per the
BSR value (default).
Words: 1
Cycles: 1
Q Cycle Activity:
Q1 Q2 Q3 Q4
Decode Read Process Write to
register ‘f’ Data destination

Example: XORWF REG

Before Instruction
REG = 0xAF
W = 0xB5
After Instruction
REG = 0x1A
W = 0xB5

DS39605F-page 232 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
21.0 DEVELOPMENT SUPPORT 21.1 MPLAB Integrated Development
Environment Software
The PIC® microcontrollers are supported with a full
range of hardware and software development tools: The MPLAB IDE software brings an ease of software
• Integrated Development Environment development previously unseen in the 8/16-bit micro-
controller market. The MPLAB IDE is a Windows®
- MPLAB® IDE Software
operating system-based application that contains:
• Assemblers/Compilers/Linkers
• A single graphical interface to all debugging tools
- MPASMTM Assembler
- Simulator
- MPLAB C18 and MPLAB C30 C Compilers
- Programmer (sold separately)
- MPLINKTM Object Linker/
MPLIBTM Object Librarian - Emulator (sold separately)
- MPLAB ASM30 Assembler/Linker/Library - In-Circuit Debugger (sold separately)
• Simulators • A full-featured editor with color-coded context
- MPLAB SIM Software Simulator • A multiple project manager
• Emulators • Customizable data windows with direct edit of
contents
- MPLAB ICE 2000 In-Circuit Emulator
• High-level source code debugging
- MPLAB REAL ICE™ In-Circuit Emulator
• Visual device initializer for easy register
• In-Circuit Debugger
initialization
- MPLAB ICD 2
• Mouse over variable inspection
• Device Programmers
• Drag and drop variables from source to watch
- PICSTART® Plus Development Programmer windows
- MPLAB PM3 Device Programmer • Extensive on-line help
- PICkit™ 2 Development Programmer • Integration of select third party tools, such as
• Low-Cost Demonstration and Development HI-TECH Software C Compilers and IAR
Boards and Evaluation Kits C Compilers
The MPLAB IDE allows you to:
• Edit your source files (either assembly or C)
• One touch assemble (or compile) and download
to PIC MCU emulator and simulator tools
(automatically updates all project information)
• Debug using:
- Source files (assembly or C)
- Mixed assembly and C
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.

© 2007 Microchip Technology Inc. DS39605F-page 233

PIC18F1220/1320
21.2 MPASM Assembler 21.5 MPLAB ASM30 Assembler, Linker
The MPASM Assembler is a full-featured, universal
and Librarian
macro assembler for all PIC MCUs. MPLAB ASM30 Assembler produces relocatable
The MPASM Assembler generates relocatable object machine code from symbolic assembly language for
files for the MPLINK Object Linker, Intel® standard HEX dsPIC30F devices. MPLAB C30 C Compiler uses the
files, MAP files to detail memory usage and symbol assembler to produce its object file. The assembler
reference, absolute LST files that contain source lines generates relocatable object files that can then be
and generated machine code and COFF files for archived or linked with other relocatable object files and
debugging. archives to create an executable file. Notable features
of the assembler include:
The MPASM Assembler features include:
• Support for the entire dsPIC30F instruction set
• Integration into MPLAB IDE projects
• Support for fixed-point and floating-point data
• User-defined macros to streamline
assembly code • Command line interface
• Conditional assembly for multi-purpose • Rich directive set
source files • Flexible macro language
• Directives that allow complete control over the • MPLAB IDE compatibility
assembly process
21.6 MPLAB SIM Software Simulator
21.3 MPLAB C18 and MPLAB C30 The MPLAB SIM Software Simulator allows code
C Compilers development in a PC-hosted environment by simulat-
The MPLAB C18 and MPLAB C30 Code Development ing the PIC MCUs and dsPIC® DSCs on an instruction
Systems are complete ANSI C compilers for level. On any given instruction, the data areas can be
Microchip’s PIC18 family of microcontrollers and the examined or modified and stimuli can be applied from
dsPIC30, dsPIC33 and PIC24 family of digital signal a comprehensive stimulus controller. Registers can be
controllers. These compilers provide powerful integra- logged to files for further run-time analysis. The trace
tion capabilities, superior code optimization and ease buffer and logic analyzer display extend the power of
of use not found with other compilers. the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE The MPLAB SIM Software Simulator fully supports
debugger. symbolic debugging using the MPLAB C18 and
MPLAB C30 C Compilers, and the MPASM and
MPLAB ASM30 Assemblers. The software simulator
21.4 MPLINK Object Linker/ offers the flexibility to develop and debug code outside
MPLIB Object Librarian of the hardware laboratory environment, making it an
The MPLINK Object Linker combines relocatable excellent, economical software development tool.
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction

DS39605F-page 234 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
21.7 MPLAB ICE 2000 21.9 MPLAB ICD 2 In-Circuit Debugger
High-Performance Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a
In-Circuit Emulator powerful, low-cost, run-time development tool,
The MPLAB ICE 2000 In-Circuit Emulator is intended connecting to the host PC via an RS-232 or high-speed
to provide the product development engineer with a USB interface. This tool is based on the Flash PIC
complete microcontroller design tool set for PIC MCUs and can be used to develop for these and other
microcontrollers. Software control of the MPLAB ICE PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes
2000 In-Circuit Emulator is advanced by the MPLAB the in-circuit debugging capability built into the Flash
Integrated Development Environment, which allows devices. This feature, along with Microchip’s In-Circuit
editing, building, downloading and source debugging Serial ProgrammingTM (ICSPTM) protocol, offers cost-
from a single environment. effective, in-circuit Flash debugging from the graphical
user interface of the MPLAB Integrated Development
The MPLAB ICE 2000 is a full-featured emulator Environment. This enables a designer to develop and
system with enhanced trace, trigger and data monitor- debug source code by setting breakpoints, single step-
ing features. Interchangeable processor modules allow ping and watching variables, and CPU status and
the system to be easily reconfigured for emulation of peripheral registers. Running at full speed enables
different processors. The architecture of the MPLAB testing hardware and applications in real time. MPLAB
ICE 2000 In-Circuit Emulator allows expansion to ICD 2 also serves as a development programmer for
support new PIC microcontrollers. selected PIC devices.
The MPLAB ICE 2000 In-Circuit Emulator system has
been designed as a real-time emulation system with 21.10 MPLAB PM3 Device Programmer
advanced features that are typically found on more
expensive development tools. The PC platform and The MPLAB PM3 Device Programmer is a universal,
Microsoft® Windows® 32-bit operating system were CE compliant device programmer with programmable
chosen to best make these features available in a voltage verification at VDDMIN and VDDMAX for
simple, unified application. maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages and a modu-
lar, detachable socket assembly to support various
21.8 MPLAB REAL ICE In-Circuit
package types. The ICSP™ cable assembly is included
Emulator System as a standard item. In Stand-Alone mode, the MPLAB
MPLAB REAL ICE In-Circuit Emulator System is PM3 Device Programmer can read, verify and program
Microchip’s next generation high-speed emulator for PIC devices without a PC connection. It can also set
Microchip Flash DSC® and MCU devices. It debugs and code protection in this mode. The MPLAB PM3
programs PIC® and dsPIC® Flash microcontrollers with connects to the host PC via an RS-232 or USB cable.
the easy-to-use, powerful graphical user interface of the The MPLAB PM3 has high-speed communications and
MPLAB Integrated Development Environment (IDE), optimized algorithms for quick programming of large
included with each kit. memory devices and incorporates an SD/MMC card for
file storage and secure data applications.
The MPLAB REAL ICE probe is connected to the design
engineer’s PC using a high-speed USB 2.0 interface and
is connected to the target with either a connector
compatible with the popular MPLAB ICD 2 system
(RJ11) or with the new high speed, noise tolerant, low-
voltage differential signal (LVDS) interconnection
(CAT5).
MPLAB REAL ICE is field upgradeable through future
firmware downloads in MPLAB IDE. In upcoming
releases of MPLAB IDE, new devices will be supported,
and new features will be added, such as software break-
points and assembly code trace. MPLAB REAL ICE
offers significant advantages over competitive emulators
including low-cost, full-speed emulation, real-time
variable watches, trace analysis, complex breakpoints, a
ruggedized probe interface and long (up to three meters)
interconnection cables.

© 2007 Microchip Technology Inc. DS39605F-page 235

PIC18F1220/1320
21.11 PICSTART Plus Development 21.13 Demonstration, Development and
Programmer Evaluation Boards
The PICSTART Plus Development Programmer is an A wide variety of demonstration, development and
easy-to-use, low-cost, prototype programmer. It evaluation boards for various PIC MCUs and dsPIC
connects to the PC via a COM (RS-232) port. MPLAB DSCs allows quick application development on fully func-
Integrated Development Environment software makes tional systems. Most boards include prototyping areas for
using the programmer simple and efficient. The adding custom circuitry and provide application firmware
PICSTART Plus Development Programmer supports and source code for examination and modification.
most PIC devices in DIP packages up to 40 pins. The boards support a variety of features, including LEDs,
Larger pin count devices, such as the PIC16C92X and temperature sensors, switches, speakers, RS-232
PIC17C76X, may be supported with an adapter socket. interfaces, LCD displays, potentiometers and additional
The PICSTART Plus Development Programmer is CE EEPROM memory.
compliant.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
21.12 PICkit 2 Development Programmer
circuits and for learning about various microcontroller
The PICkit™ 2 Development Programmer is a low-cost applications.
programmer and selected Flash device debugger with In addition to the PICDEM™ and dsPICDEM™ demon-
an easy-to-use interface for programming many of stration/development board series of circuits, Microchip
Microchip’s baseline, mid-range and PIC18F families of has a line of evaluation kits and demonstration software
Flash memory microcontrollers. The PICkit 2 Starter Kit for analog filter design, KEELOQ® security ICs, CAN,
includes a prototyping development board, twelve IrDA®, PowerSmart® battery management, SEEVAL®
sequential lessons, software and HI-TECH’s PICC™ evaluation system, Sigma-Delta ADC, flow rate
Lite C compiler, and is designed to help get up to speed sensing, plus many more.
quickly using PIC® microcontrollers. The kit provides
everything needed to program, evaluate and develop Check the Microchip web page (www.microchip.com)
applications using Microchip’s powerful, mid-range and the latest “Product Selector Guide” (DS00148) for
Flash memory family of microcontrollers. the complete list of demonstration, development and
evaluation kits.

DS39605F-page 236 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
22.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings(†)

Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD, MCLR and RA4) .......................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V
Voltage on MCLR with respect to VSS (Note 2) ......................................................................................... 0V to +13.25V
Voltage on RA4 with respect to Vss ............................................................................................................... 0V to +8.5V
Total power dissipation (Note 1) ...............................................................................................................................1.0W
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin ..............................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD)...................................................................................................................... ±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) .............................................................................................................. ±20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports ..................................................................................................................200 mA

Note 1: Power dissipation is calculated as follows:

Pdis = VDD x {IDD – ∑ IOH} + ∑ {(VDD – VOH) x IOH} + ∑(VOL x IOL)
2: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latch-up.
Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/VPP pin, rather
than pulling this pin directly to VSS.

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.

© 2007 Microchip Technology Inc. DS39605F-page 237

PIC18F1220/1320
FIGURE 22-1: PIC18F1220/1320 VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)

6.0V
5.5V
5.0V PIC18F1X20
4.5V
Voltage

4.2V
4.0V
3.5V
3.0V
2.5V
2.0V

40 MHz
Frequency

FIGURE 22-2: PIC18LF1220/1320 VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)

6.0V
5.5V
5.0V PIC18LF1X20
4.5V
Voltage

4.2V
4.0V
3.5V
3.0V
2.5V
2.0V

4 MHz 40 MHz
Frequency
FMAX = (16.36 MHz/V) (VDDAPPMIN – 2.0V) + 4 MHz
Note: VDDAPPMIN is the minimum voltage of the PIC® device in the application.

DS39605F-page 238 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 22-3: PIC18F1220/1320 VOLTAGE-FREQUENCY GRAPH (EXTENDED)

6.0V
5.5V
5.0V PIC18F1X20-E
4.5V
Voltage
4.2V
4.0V
3.5V
3.0V
2.5V
2.0V

25 MHz
Frequency

© 2007 Microchip Technology Inc. DS39605F-page 239

PIC18F1220/1320
22.1 DC Characteristics: Supply Voltage
PIC18F1220/1320 (Industrial)
PIC18LF1220/1320 (Industrial)
PIC18LF1220/1320 Standard Operating Conditions (unless otherwise stated)
(Industrial) Operating temperature -40°C ≤ TA ≤ +85°C for industrial

Standard Operating Conditions (unless otherwise stated)

PIC18F1220/1320
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
(Industrial, Extended)
-40°C ≤ TA ≤ +125°C for extended

Param
Symbol Characteristic Min Typ Max Units Conditions
No.
VDD Supply Voltage
D001 PIC18LF1220/1320 2.0 — 5.5 V HS, XT, RC and LP Oscillator mode
PIC18F1220/1320 4.2 — 5.5 V
D002 VDR RAM Data Retention 1.5 — — V
Voltage(1)
D003 VPOR VDD Start Voltage to ensure — — 0.7 V See Section 4.1 “Power-on Reset (POR)”
internal Power-on Reset signal for details.
D004 SVDD VDD Rise Rate to ensure 0.05 — — V/ms See Section 4.1 “Power-on Reset (POR)”
internal Power-on Reset signal for details.
VBOR Brown-out Reset Voltage
D005D PIC18LF1220/1320 Industrial Low Voltage (-10°C to +85°C)
BORV1:BORV0 = 11 N/A N/A N/A V Reserved
BORV1:BORV0 = 10 2.50 2.72 2.94 V
BORV1:BORV0 = 01 3.88 4.22 4.56 V (Note 2)
BORV1:BORV0 = 00 4.18 4.54 4.90 V (Note 2)
D005F PIC18LF1220/1320 Industrial Low Voltage (-40°C to -10°C)
BORV1:BORV0 = 11 N/A N/A N/A V Reserved
BORV1:BORV0 = 10 2.34 2.72 3.10 V
BORV1:BORV0 = 01 3.63 4.22 4.81 V (Note 2)
BORV1:BORV0 = 00 3.90 4.54 5.18 V (Note 2)
D005G PIC18F1220/1320 Industrial (-10°C to +85°C)
BORV1:BORV0 = 1x N/A N/A N/A V Reserved
BORV1:BORV0 = 01 3.88 4.22 4.56 V (Note 2)
BORV1:BORV0 = 00 4.18 4.54 4.90 V (Note 2)
D005H PIC18F1220/1320 Industrial (-40°C to -10°C)
BORV1:BORV0 = 1x N/A N/A N/A V Reserved
BORV1:BORV0 = 01 N/A N/A N/A V Reserved
BORV1:BORV0 = 00 3.90 4.54 5.18 V (Note 2)
D005J PIC18F1220/1320 Extended (-10°C to +85°C)
BORV1:BORV0 = 1x N/A N/A N/A V Reserved
BORV1:BORV0 = 01 3.88 4.22 4.56 V (Note 3)
BORV1:BORV0 = 00 4.18 4.54 4.90 V (Note 3)
D005K PIC18F1220/1320 Extended (-40°C to -10°C, +85°C to +125°C)
BORV1:BORV0 = 1x N/A N/A N/A V Reserved
BORV1:BORV0 = 01 N/A N/A N/A V Reserved
BORV1:BORV0 = 00 3.90 4.54 5.18 V (Note 3)
Legend: Shading of rows is to assist in readability of the table.
Note 1: This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM data.
2: When BOR is on and BORV<1:0> = 0x, the device will operate correctly at 40 MHz for any VDD at which the BOR allows
execution (low-voltage and industrial devices only).
3: When BOR is on and BORV<1:0> = 0x, the device will operate correctly at 25 MHz for any VDD at which the BOR allows
execution (extended devices only).

DS39605F-page 240 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
22.2 DC Characteristics: Power-Down and Supply Current
PIC18F1220/1320 (Industrial)
PIC18LF1220/1320 (Industrial)
PIC18LF1220/1320 Standard Operating Conditions (unless otherwise stated)
(Industrial) Operating temperature -40°C ≤ TA ≤ +85°C for industrial

Standard Operating Conditions (unless otherwise stated)

PIC18F1220/1320
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
(Industrial, Extended)
-40°C ≤ TA ≤ +125°C for extended

Param
Device Typ Max Units Conditions
No.

Power-Down Current (IPD)(1)

PIC18LF1220/1320 0.1 0.5 μA -40°C
VDD = 2.0V,
0.1 0.5 μA +25°C
(Sleep mode)
0.2 1.9 μA +85°C
PIC18LF1220/1320 0.1 0.5 μA -40°C
VDD = 3.0V,
0.1 0.5 μA + 25°C
(Sleep mode)
0.3 1.9 μA +85°C
All devices 0.1 2.0 μA -40°C
0.1 2.0 μA +25°C VDD = 5.0V,
0.4 6.5 μA +85°C (Sleep mode)
Extended devices 11.2 50 μA +125°C
(2,3)
Supply Current (IDD)
PIC18LF1220/1320 8 40 μA -40°C
9 40 μA +25°C VDD = 2.0V
11 40 μA +85°C
PIC18LF1220/1320 25 68 μA -40°C
25 68 μA +25°C VDD = 3.0V FOSC = 31 kHz
(RC_RUN mode,
20 68 μA +85°C Internal oscillator source)
All devices 55 80 μA -40°C
55 80 μA +25°C
VDD = 5.0V
50 80 μA +85°C
Extended devices 50 80 μA +125°C
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.
4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.

© 2007 Microchip Technology Inc. DS39605F-page 241

PIC18F1220/1320
22.2 DC Characteristics: Power-Down and Supply Current
PIC18F1220/1320 (Industrial)
PIC18LF1220/1320 (Industrial) (Continued)
PIC18LF1220/1320 Standard Operating Conditions (unless otherwise stated)
(Industrial) Operating temperature -40°C ≤ TA ≤ +85°C for industrial

Standard Operating Conditions (unless otherwise stated)

PIC18F1220/1320
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
(Industrial, Extended)
-40°C ≤ TA ≤ +125°C for extended

Param
Device Typ Max Units Conditions
No.

Supply Current (IDD)(2,3)

PIC18LF1220/1320 140 220 μA -40°C
145 220 μA +25°C VDD = 2.0V
155 220 μA +85°C
PIC18LF1220/1320 215 330 μA -40°C
225 330 μA +25°C VDD = 3.0V FOSC = 1 MHz
(RC_RUN mode,
235 330 μA +85°C Internal oscillator source)
All devices 385 550 μA -40°C
390 550 μA +25°C
VDD = 5.0V
405 550 μA +85°C
Extended devices 410 650 μA +125°C
PIC18LF1220/1320 410 600 μA -40°C
425 600 μA +25°C VDD = 2.0V
435 600 μA +85°C
PIC18LF1220/1320 650 900 μA -40°C
670 900 μA +25°C VDD = 3.0V FOSC = 4 MHz
(RC_RUN mode,
680 900 μA +85°C Internal oscillator source)
All devices 1.2 1.8 mA -40°C
1.2 1.8 mA +25°C
VDD = 5.0V
1.2 1.8 mA +85°C
Extended devices 1.2 1.8 mA +125°C
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.
4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.

DS39605F-page 242 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
22.2 DC Characteristics: Power-Down and Supply Current
PIC18F1220/1320 (Industrial)
PIC18LF1220/1320 (Industrial) (Continued)
PIC18LF1220/1320 Standard Operating Conditions (unless otherwise stated)
(Industrial) Operating temperature -40°C ≤ TA ≤ +85°C for industrial

Standard Operating Conditions (unless otherwise stated)

PIC18F1220/1320
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
(Industrial, Extended)
-40°C ≤ TA ≤ +125°C for extended

Param
Device Typ Max Units Conditions
No.

Supply Current (IDD)(2,3)

PIC18LF1220/1320 4.7 8 μA -40°C
5.0 8 μA +25°C VDD = 2.0V
5.8 11 μA +85°C
PIC18LF1220/1320 7.0 11 μA -40°C
7.8 11 μA +25°C VDD = 3.0V FOSC = 31 kHz
(RC_IDLE mode,
8.7 15 μA +85°C Internal oscillator source)
All devices 12 16 μA -40°C
14 16 μA +25°C
VDD = 5.0V
14 22 μA +85°C
Extended devices 25 75 μA +125°C
PIC18LF1220/1320 75 150 μA -40°C
85 150 μA +25°C VDD = 2.0V
95 150 μA +85°C
PIC18LF1220/1320 110 180 μA -40°C
125 180 μA +25°C VDD = 3.0V FOSC = 1 MHz
(RC_IDLE mode,
135 180 μA +85°C Internal oscillator source)
All devices 180 380 μA -40°C
195 380 μA +25°C
VDD = 5.0V
200 380 μA +85°C
Extended devices 350 435 μA +125°C
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.
4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.

© 2007 Microchip Technology Inc. DS39605F-page 243

PIC18F1220/1320
22.2 DC Characteristics: Power-Down and Supply Current
PIC18F1220/1320 (Industrial)
PIC18LF1220/1320 (Industrial) (Continued)
PIC18LF1220/1320 Standard Operating Conditions (unless otherwise stated)
(Industrial) Operating temperature -40°C ≤ TA ≤ +85°C for industrial

Standard Operating Conditions (unless otherwise stated)

PIC18F1220/1320
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
(Industrial, Extended)
-40°C ≤ TA ≤ +125°C for extended

Param
Device Typ Max Units Conditions
No.

Supply Current (IDD)(2,3)

PIC18LF1220/1320 140 275 μA -40°C
140 275 μA +25°C VDD = 2.0V
150 275 μA +85°C
PIC18LF1220/1320 220 375 μA -40°C
220 375 μA +25°C VDD = 3.0V FOSC = 4 MHz
(RC_IDLE mode,
220 375 μA +85°C Internal oscillator source)
All devices 390 800 μA -40°C
400 800 μA +25°C
VDD = 5.0V
380 800 μA +85°C
Extended devices 410 800 μA +125°C
PIC18LF1220/1320 150 250 μA -40°C
150 250 μA +25°C VDD = 2.0V
160 250 μA +85°C
PIC18LF1220/1320 340 350 μA -40°C
300 350 μA +25°C VDD = 3.0V FOSC = 1 MHZ
(PRI_RUN mode,
280 350 μA +85°C EC oscillator)
All devices 0.72 1.0 mA -40°C
0.63 1.0 mA +25°C
VDD = 5.0V
0.58 1.0 mA +85°C
Extended devices 0.53 1.0 mA +125°C
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.
4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.

DS39605F-page 244 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
22.2 DC Characteristics: Power-Down and Supply Current
PIC18F1220/1320 (Industrial)
PIC18LF1220/1320 (Industrial) (Continued)
PIC18LF1220/1320 Standard Operating Conditions (unless otherwise stated)
(Industrial) Operating temperature -40°C ≤ TA ≤ +85°C for industrial

Standard Operating Conditions (unless otherwise stated)

PIC18F1220/1320
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
(Industrial, Extended)
-40°C ≤ TA ≤ +125°C for extended

Param
Device Typ Max Units Conditions
No.

Supply Current (IDD)(2,3)

PIC18LF1220/1320 415 600 μA -40°C
425 600 μA +25°C VDD = 2.0V
435 600 μA +85°C
PIC18LF1220/1320 0.87 1.0 mA -40°C
0.75 1.0 mA +25°C VDD = 3.0V FOSC = 4 MHz
(PRI_RUN mode,
0.75 1.0 mA +85°C EC oscillator)
All devices 1.6 2.0 mA -40°C
1.6 2.0 mA +25°C
VDD = 5.0V
1.5 2.0 mA +85°C
Extended devices 1.5 2.0 mA +125°C
Extended devices 6.3 9.0 mA +125°C VDD = 4.2V FOSC = 25 MHz
9.7 10.0 mA +125°C VDD = 5.0V (PRI_RUN mode,
EC oscillator)
All devices 9.4 12 mA -40°C
9.5 12 mA +25°C VDD = 4.2V
9.6 12 mA +85°C FOSC = 40 MHZ
(PRI_RUN mode,
All devices 11.9 15 mA -40°C EC oscillator)
12.1 15 mA +25°C VDD = 5.0V
12.2 15 mA +85°C
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.
4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.

© 2007 Microchip Technology Inc. DS39605F-page 245

PIC18F1220/1320
22.2 DC Characteristics: Power-Down and Supply Current
PIC18F1220/1320 (Industrial)
PIC18LF1220/1320 (Industrial) (Continued)
PIC18LF1220/1320 Standard Operating Conditions (unless otherwise stated)
(Industrial) Operating temperature -40°C ≤ TA ≤ +85°C for industrial

Standard Operating Conditions (unless otherwise stated)

PIC18F1220/1320
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
(Industrial, Extended)
-40°C ≤ TA ≤ +125°C for extended

Param
Device Typ Max Units Conditions
No.

Supply Current (IDD)(2,3)

PIC18LF1220/1320 35 50 μA -40°C
35 50 μA +25°C VDD = 2.0V
35 60 μA +85°C
PIC18LF1220/1320 55 80 μA -40°C
50 80 μA +25°C VDD = 3.0V FOSC = 1 MHz
(PRI_IDLE mode,
60 100 μA +85°C EC oscillator)
All devices 105 150 μA -40°C
110 150 μA +25°C
VDD = 5.0V
115 150 μA +85°C
Extended devices 125 300 μA +125°C
PIC18LF1220/1320 135 180 μA -40°C
140 180 μA +25°C VDD = 2.0V
140 180 μA +85°C
PIC18LF1220/1320 215 280 μA -40°C
225 280 μA +25°C VDD = 3.0V FOSC = 4 MHz
(PRI_IDLE mode,
230 280 μA +85°C EC oscillator)
All devices 410 525 μA -40°C
420 525 μA +25°C
VDD = 5.0V
430 525 μA +85°C
Extended devices 450 800 μA +125°C
Extended devices 2.2 3.0 mA +125°C VDD = 4.2V FOSC = 25 MHz
2.7 3.5 mA +125°C VDD = 5.0V (PRI_IDLE mode,
EC oscillator)
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.
4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.

DS39605F-page 246 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
22.2 DC Characteristics: Power-Down and Supply Current
PIC18F1220/1320 (Industrial)
PIC18LF1220/1320 (Industrial) (Continued)
PIC18LF1220/1320 Standard Operating Conditions (unless otherwise stated)
(Industrial) Operating temperature -40°C ≤ TA ≤ +85°C for industrial

Standard Operating Conditions (unless otherwise stated)

PIC18F1220/1320
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
(Industrial, Extended)
-40°C ≤ TA ≤ +125°C for extended

Param
Device Typ Max Units Conditions
No.

Supply Current (IDD)(2,3)

All devices 3.2 4.1 mA -40°C
3.2 4.1 mA +25°C VDD = 4.2 V
3.3 4.1 mA +85°C FOSC = 40 MHz
(PRI_IDLE mode,
All devices 4.0 5.1 mA -40°C EC oscillator)
4.1 5.1 mA +25°C VDD = 5.0V
4.1 5.1 mA +85°C
PIC18LF1220/1320 5.1 9 μA -10°C
5.8 9 μA +25°C VDD = 2.0V
7.9 11 μA +70°C
PIC18LF1220/1320 7.9 12 μA -10°C FOSC = 32 kHz(4)
8.9 12 μA +25°C VDD = 3.0V (SEC_RUN mode,
10.5 14 μA +70°C Timer1 as clock)

All devices 12.5 20 μA -10°C

16.3 20 μA +25°C VDD = 5.0V
18.4 25 μA +70°C
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.
4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.

© 2007 Microchip Technology Inc. DS39605F-page 247

PIC18F1220/1320
22.2 DC Characteristics: Power-Down and Supply Current
PIC18F1220/1320 (Industrial)
PIC18LF1220/1320 (Industrial) (Continued)
PIC18LF1220/1320 Standard Operating Conditions (unless otherwise stated)
(Industrial) Operating temperature -40°C ≤ TA ≤ +85°C for industrial

Standard Operating Conditions (unless otherwise stated)

PIC18F1220/1320
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
(Industrial, Extended)
-40°C ≤ TA ≤ +125°C for extended

Param
Device Typ Max Units Conditions
No.

Supply Current (IDD)(2,3)

PIC18LF1220/1320 9.2 15 μA -10°C
9.6 15 μA +25°C VDD = 2.0V
12.7 18 μA +70°C
PIC18LF1220/1320 22 30 μA -10°C FOSC = 32 kHz(4)
21 30 μA +25°C VDD = 3.0V (SEC_IDLE mode,
20 35 μA +70°C Timer1 as clock)

All devices 50 80 μA -10°C

45 80 μA +25°C VDD = 5.0V
45 80 μA +70°C
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.
4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.

DS39605F-page 248 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
22.2 DC Characteristics: Power-Down and Supply Current
PIC18F1220/1320 (Industrial)
PIC18LF1220/1320 (Industrial) (Continued)
PIC18LF1220/1320 Standard Operating Conditions (unless otherwise stated)
(Industrial) Operating temperature -40°C ≤ TA ≤ +85°C for industrial

Standard Operating Conditions (unless otherwise stated)

PIC18F1220/1320
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
(Industrial, Extended)
-40°C ≤ TA ≤ +125°C for extended

Param
Device Typ Max Units Conditions
No.

Module Differential Currents (ΔIWDT, ΔIBOR, ΔILVD, ΔIOSCB, ΔIAD)

D022 Watchdog Timer 1.5 4.0 μA -40°C
(ΔIWDT) 2.2 4.0 μA +25°C VDD = 2.0V
3.1 5.0 μA +85°C
2.5 6.0 μA -40°C
3.3 6.0 μA +25°C VDD = 3.0V
4.7 7.0 μA +85°C
3.7 10.0 μA -40°C
4.5 10.0 μA +25°C VDD = 5.0V
6.1 13.0 μA +85°C
D022A Brown-out Reset 19 35.0 μA -40°C to +85°C VDD = 3.0V
(ΔIBOR)
24 45.0 μA -40°C to +85°C VDD = 5.0V
D022B Low-Voltage Detect 8.5 25.0 μA -40°C to +85°C VDD = 2.0V
(ΔILVD)
16 35.0 μA -40°C to +85°C VDD = 3.0V
20 45.0 μA -40°C to +85°C VDD = 5.0V
D025 Timer1 Oscillator 1.7 3.5 μA -40°C
(ΔIOSCB) 1.8 3.5 μA +25°C VDD = 2.0V 32 kHz on Timer1(4)
2.1 4.5 μA +85°C
2.2 4.5 μA -40°C
2.6 4.5 μA +25°C VDD = 3.0V 32 kHz on Timer1(4)
2.8 5.5 μA +85°C
3.0 6.0 μA -40°C
3.3 6.0 μA +25°C VDD = 5.0V 32 kHz on Timer1(4)
3.6 7.0 μA +85°C
D026 A/D Converter 1.0 3.0 μA -40°C to +85°C VDD = 2.0V
(ΔIAD) 1.0 4.0 μA -40°C to +85°C VDD = 3.0V
A/D on, not converting
2.0 10.0 μA -40°C to +85°C VDD = 5.0V
1.0 8.0 μA -40°C to +125°C VDD = 5.0V
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.
4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.

© 2007 Microchip Technology Inc. DS39605F-page 249

PIC18F1220/1320
22.3 DC Characteristics: PIC18F1220/1320 (Industrial)
PIC18LF1220/1320 (Industrial)
Standard Operating Conditions (unless otherwise stated)
DC CHARACTERISTICS Operating temperature -40°C ≤ TA ≤ +85°C for industrial
-40°C ≤ TA ≤ +125°C for extended
Param
Symbol Characteristic Min Max Units Conditions
No.
VIL Input Low Voltage
I/O ports:
D030 with TTL buffer VSS 0.15 VDD V VDD < 4.5V
D030A — 0.8 V 4.5V ≤ VDD ≤ 5.5V
D031 with Schmitt Trigger buffer VSS 0.2 VDD V
D032 MCLR VSS 0.2 VDD V
D032A OSC1 (in XT, HS and LP modes) VSS 0.3 VDD V
and T1OSI
D033 OSC1 (in RC and EC mode)(1) VSS 0.2 VDD V
VIH Input High Voltage
I/O ports:
D040 with TTL buffer 0.25 VDD + 0.8V VDD V VDD < 4.5V
D040A 2.0 VDD V 4.5V ≤ VDD ≤ 5.5V

D041 with Schmitt Trigger buffer 0.8 VDD VDD V

D042 MCLR, OSC1 (EC mode) 0.8 VDD VDD V
D042A OSC1 (in XT, HS and LP modes) 1.6 VDD VDD V
and T1OSI
D043 OSC1 (RC mode)(1) 0.9 VDD VDD V
IIL Input Leakage Current(2,3)
D060 I/O ports — ±1 μA VSS ≤ VPIN ≤ VDD,
Pin at high-impedance
D061 MCLR — ±5 μA VSS ≤ VPIN ≤ VDD
D063 OSC1 — ±5 μA VSS ≤ VPIN ≤ VDD
IPU Weak Pull-up Current
D070 IPURB PORTB weak pull-up current 50 400 μA VDD = 5V, VPIN = VSS
Note 1: In RC oscillator configuration, the OSC1/CLKI pin is a Schmitt Trigger input. It is not recommended that the
PIC® device be driven with an external clock while in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
3: Negative current is defined as current sourced by the pin.
4: Parameter is characterized but not tested.

DS39605F-page 250 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
22.3 DC Characteristics: PIC18F1220/1320 (Industrial)
PIC18LF1220/1320 (Industrial) (Continued)
Standard Operating Conditions (unless otherwise stated)
DC CHARACTERISTICS Operating temperature -40°C ≤ TA ≤ +85°C for industrial
-40°C ≤ TA ≤ +125°C for extended

Param
Symbol Characteristic Min Max Units Conditions
No.
VOL Output Low Voltage
D080 I/O ports — 0.6 V IOL = 8.5 mA, VDD = 4.5V,
-40°C to +85°C
D083 OSC2/CLKO — 0.6 V IOL = 1.6 mA, VDD = 4.5V,
(RC mode) -40°C to +85°C
VOH Output High Voltage(3)
D090 I/O ports VDD – 0.7 — V IOH = -3.0 mA, VDD = 4.5V,
-40°C to +85°C
D092 OSC2/CLKO VDD – 0.7 — V IOH = -1.3 mA, VDD = 4.5V,
(RC mode) -40°C to +85°C
D150 VOD Open-Drain High Voltage — 8.5 V RA4 pin
Capacitive Loading Specs
on Output Pins
D100(4) COSC2 OSC2 pin — 15 pF In XT, HS and LP modes
when external clock is
used to drive OSC1
D101 CIO All I/O pins and OSC2 — 50 pF To meet the AC timing
(in RC mode) specifications
D102 CB SCL, SDA — 400 pF In I2C mode
Note 1: In RC oscillator configuration, the OSC1/CLKI pin is a Schmitt Trigger input. It is not recommended that the
PIC® device be driven with an external clock while in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
3: Negative current is defined as current sourced by the pin.
4: Parameter is characterized but not tested.

© 2007 Microchip Technology Inc. DS39605F-page 251

PIC18F1220/1320
TABLE 22-1: MEMORY PROGRAMMING REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
DC CHARACTERISTICS
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
Param
Sym Characteristic Min Typ† Max Units Conditions
No.
Internal Program Memory
Programming Specifications(1)
D110 VPP Voltage on MCLR/VPP pin 9.00 — 13.25 V (Note 2)
D112 IPP Current into MCLR/VPP pin — — 5 μA
D113 IDDP Supply Current during — — 10 mA
Programming
Data EEPROM Memory
D120 ED Byte Endurance 100K 1M — E/W -40°C to +85°C
D121 VDRW VDD for Read/Write VMIN — 5.5 V Using EECON to read/write
VMIN = Minimum operating
voltage
D122 TDEW Erase/Write Cycle Time — 4 — ms
D123 TRETD Characteristic Retention 40 — — Year Provided no other
specifications are violated
D124 TREF Number of Total Erase/Write 1M 10M — E/W -40°C to +85°C
Cycles before Refresh(3)
Program Flash Memory
D130 EP Cell Endurance 10K 100K — E/W -40°C to +85°C
D131 VPR VDD for Read VMIN — 5.5 V VMIN = Minimum operating
voltage
D132 VIE VDD for Block Erase 4.5 — 5.5 V Using ICSP port
D132A VIW VDD for Externally Timed Erase 4.5 — 5.5 V Using ICSP port
or Write
D132B VPEW VDD for Self-Timed Write VMIN — 5.5 V VMIN = Minimum operating
voltage
D133 TIE ICSP™ Block Erase Cycle Time — 4 — ms VDD > 4.5V
D133A TIW ICSP Erase or Write Cycle Time 1 — — ms VDD > 4.5V
(externally timed)
D133A TIW Self-Timed Write Cycle Time — 2 — ms
D134 TRETD Characteristic Retention 40 — — Year Provided no other
specifications are violated
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: These specifications are for programming the on-chip program memory through the use of table write
instructions.
2: The pin may be kept in this range at times other than programming, but it is not recommended.
3: Refer to Section 7.8 “Using the Data EEPROM” for a more detailed discussion on data EEPROM
endurance.

DS39605F-page 252 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 22-4: LOW-VOLTAGE DETECT CHARACTERISTICS
VDD

(LVDIF can be
VLVD cleared in software)
(LVDIF set by hardware)

LVDIF

TABLE 22-2: LOW-VOLTAGE DETECT CHARACTERISTICS

PIC18LF1220/1320 Standard Operating Conditions (unless otherwise stated)
(Industrial) Operating temperature -40°C ≤ TA ≤ +85°C for industrial

Standard Operating Conditions (unless otherwise stated)

PIC18F1220/1320
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
(Industrial, Extended)
-40°C ≤ TA ≤ +125°C for extended

Param
Symbol Characteristic Min Typ† Max Units Conditions
No.

D420D LVD Voltage on VDD Transition High-to-Low Industrial Low Voltage (-10°C to +85°C)
PIC18LF1220/1320 LVDL<3:0> = 0000 N/A N/A N/A V Reserved
LVDL<3:0> = 0001 N/A N/A N/A V Reserved
LVDL<3:0> = 0010 2.08 2.26 2.44 V
LVDL<3:0> = 0011 2.26 2.45 2.65 V
LVDL<3:0> = 0100 2.35 2.55 2.76 V
LVDL<3:0> = 0101 2.55 2.77 2.99 V
LVDL<3:0> = 0110 2.64 2.87 3.10 V
LVDL<3:0> = 0111 2.82 3.07 3.31 V
LVDL<3:0> = 1000 3.09 3.36 3.63 V
LVDL<3:0> = 1001 3.29 3.57 3.86 V
LVDL<3:0> = 1010 3.38 3.67 3.96 V
LVDL<3:0> = 1011 3.56 3.87 4.18 V
LVDL<3:0> = 1100 3.75 4.07 4.40 V
LVDL<3:0> = 1101 3.93 4.28 4.62 V
LVDL<3:0> = 1110 4.23 4.60 4.96 V
Legend: Shading of rows is to assist in readability of the table.
† Production tested at TAMB = 25°C. Specifications over temperature limits ensured by characterization.

© 2007 Microchip Technology Inc. DS39605F-page 253

PIC18F1220/1320
TABLE 22-2: LOW-VOLTAGE DETECT CHARACTERISTICS (CONTINUED)
PIC18LF1220/1320 Standard Operating Conditions (unless otherwise stated)
(Industrial) Operating temperature -40°C ≤ TA ≤ +85°C for industrial

Standard Operating Conditions (unless otherwise stated)

PIC18F1220/1320
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
(Industrial, Extended)
-40°C ≤ TA ≤ +125°C for extended

Param
Symbol Characteristic Min Typ† Max Units Conditions
No.
D420F LVD Voltage on VDD Transition High-to-Low Industrial Low Voltage (-40°C to -10°C)
PIC18LF1220/1320 LVDL<3:0> = 0000 N/A N/A N/A V Reserved
LVDL<3:0> = 0001 N/A N/A N/A V Reserved
LVDL<3:0> = 0010 1.99 2.26 2.53 V
LVDL<3:0> = 0011 2.16 2.45 2.75 V
LVDL<3:0> = 0100 2.25 2.55 2.86 V
LVDL<3:0> = 0101 2.43 2.77 3.10 V
LVDL<3:0> = 0110 2.53 2.87 3.21 V
LVDL<3:0> = 0111 2.70 3.07 3.43 V
LVDL<3:0> = 1000 2.96 3.36 3.77 V
LVDL<3:0> = 1001 3.14 3.57 4.00 V
LVDL<3:0> = 1010 3.23 3.67 4.11 V
LVDL<3:0> = 1011 3.41 3.87 4.34 V
LVDL<3:0> = 1100 3.58 4.07 4.56 V
LVDL<3:0> = 1101 3.76 4.28 4.79 V
LVDL<3:0> = 1110 4.04 4.60 5.15 V
LVD Voltage on VDD Transition High-to-Low Industrial (-10°C to +85°C)
D420G PIC18F1220/1320 LVDL<3:0> = 1101 3.93 4.28 4.62 V
LVDL<3:0> = 1110 4.23 4.60 4.96 V
LVD Voltage on VDD Transition High-to-Low Industrial (-40°C to -10°C)
D420H PIC18F1220/1320 LVDL<3:0> = 1101 3.76 4.28 4.79 V
LVDL<3:0> = 1110 4.04 4.60 5.15 V
LVD Voltage on VDD Transition High-to-Low Extended (-10°C to +85°C)
D420J PIC18F1220/1320 LVDL<3:0> = 1101 3.94 4.28 4.62 V
LVDL<3:0> = 1110 4.23 4.60 4.96 V
LVD Voltage on VDD Transition High-to-Low Extended (-40°C to -10°C, +85°C to +125°C)
D420K PIC18F1220/1320 LVDL<3:0> = 1101 3.77 4.28 4.79 V
LVDL<3:0> = 1110 4.05 4.60 5.15 V
Legend: Shading of rows is to assist in readability of the table.
† Production tested at TAMB = 25°C. Specifications over temperature limits ensured by characterization.

DS39605F-page 254 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
22.4 AC (Timing) Characteristics
22.4.1 TIMING PARAMETER SYMBOLOGY
The timing parameter symbols have been created
following one of the following formats:

1. TppS2ppS 3. TCC:ST (I2C specifications only)

2. TppS 4. Ts (I2C specifications only)
T
F Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKO rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O port t1 T13CKI
mc MCLR wr WR
Uppercase letters and their meanings:
S
F Fall P Period
H High R Rise
I Invalid (High-Impedance) V Valid
L Low Z High-Impedance
I2C only
AA output access High High
BUF Bus free Low Low
TCC:ST (I2C specifications only)
CC
HD Hold SU Setup
ST
DAT DATA input hold STO Stop condition
STA Start condition

© 2007 Microchip Technology Inc. DS39605F-page 255

PIC18F1220/1320
22.4.2 TIMING CONDITIONS
The temperature and voltages specified in Table 22-3
apply to all timing specifications unless otherwise
noted. Figure 22-5 specifies the load conditions for the
timing specifications.

TABLE 22-3: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC

Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
-40°C ≤ TA ≤ +125°C for extended
AC CHARACTERISTICS
Operating voltage VDD range as described in DC spec Section 22.1 and
Section 22.3.
LF parts operate for industrial temperatures only.

FIGURE 22-5: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS

Load Condition 1 Load Condition 2

VDD/2

RL Pin CL

VSS
CL
pin
RL = 464Ω
VSS CL = 50 pF for all pins except OSC2/CLKO

DS39605F-page 256 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
22.4.3 TIMING DIAGRAMS AND SPECIFICATIONS

FIGURE 22-6: EXTERNAL CLOCK TIMING (ALL MODES EXCEPT PLL)

Q4 Q1 Q2 Q3 Q4 Q1

OSC1
1 3 3 4 4
2
CLKO

TABLE 22-4: EXTERNAL CLOCK TIMING REQUIREMENTS

Param.
Symbol Characteristic Min Max Units Conditions
No.

1A FOSC External CLKI Frequency(1) DC 40 MHz EC, ECIO (LF and Industrial)
DC 25 MHz EC, ECIO (Extended)
Oscillator Frequency(1) DC 4 MHz RC oscillator
DC 1 MHz XT oscillator
DC 25 MHz HS oscillator
1 10 MHz HS + PLL oscillator
DC 33 kHz LP Oscillator mode
1 TOSC External CLKI Period(1) 25 — ns EC, ECIO (LF and Industrial)
40 — ns EC, ECIO (Extended)
Oscillator Period(1) 250 — ns RC oscillator
1000 — ns XT oscillator
25 — ns HS oscillator
100 1000 ns HS + PLL oscillator
30 — μs LP oscillator
2 TCY Instruction Cycle Time(1) 100 — ns TCY = 4/FOSC
3 TosL, External Clock in (OSC1) 30 — ns XT oscillator
TosH High or Low Time 2.5 — μs LP oscillator
10 — ns HS oscillator
4 TosR, External Clock in (OSC1) — 20 ns XT oscillator
TosF Rise or Fall Time — 50 ns LP oscillator
— 7.5 ns HS oscillator
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period for all configurations
except PLL. All specified values are based on characterization data for that particular oscillator type under
standard operating conditions, with the device executing code. Exceeding these specified limits may result
in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested
to operate at “min.” values with an external clock applied to the OSC1/CLKI pin. When an external clock
input is used, the “max.” cycle time limit is “DC” (no clock) for all devices.

© 2007 Microchip Technology Inc. DS39605F-page 257

PIC18F1220/1320
TABLE 22-5: PLL CLOCK TIMING SPECIFICATIONS, HS/HSPLL MODE (VDD = 4.2V TO 5.5V)
Param
Sym Characteristic Min Typ† Max Units Conditions
No.
F10 FOSC Oscillator Frequency Range 4 — 10 MHz HS and HSPLL mode only
F11 FSYS On-Chip VCO System Frequency 16 — 40 MHz HSPLL mode only
F12 TPLL PLL Start-up Time (Lock Time) — — 2 ms HSPLL mode only
F13 ΔCLK CLKO Stability (Jitter) -2 — +2 % HSPLL mode only
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.

TABLE 22-6: INTERNAL RC ACCURACY: PIC18F1220/1320 (INDUSTRIAL)

PIC18LF1220/1320 (INDUSTRIAL)
PIC18LF1220/1320 Standard Operating Conditions (unless otherwise stated)
(Industrial) Operating temperature -40°C ≤ TA ≤ +85°C for industrial

Standard Operating Conditions (unless otherwise stated)

PIC18F1220/1320
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
(Industrial)
-40°C ≤ TA ≤ +125°C for extended

Param
Device Min Typ Max Units Conditions
No.

INTOSC Accuracy @ Freq = 8 MHz, 4 MHz, 2 MHz, 1 MHz, 500 kHz, 250 kHz, 125 kHz(1)
PIC18LF1220/1320 -2 +/-1 2 % +25°C VDD = 2.7-3.3V
-5 — 5 % -10°C to +85°C VDD = 2.7-3.3V
-10 — 10 % -40°C to +85°C VDD = 2.7-3.3V
PIC18F1220/1320PIC18F -2 +/-1 2 % +25°C VDD = 4.5-5.5V
1220/1320 -5 — 5 % -10°C to +85°C VDD = 4.5-5.5V
-10 — 10 % -40°C to +85°C VDD = 4.5-5.5V
INTRC Accuracy @ Freq = 31 kHz(2)
PIC18LF1220/1320 26.562 — 35.938 kHz -40°C to +85°C VDD = 2.7-3.3V
PIC18F1220/1320PIC18F 26.562 — 35.938 kHz -40°C to +85°C VDD = 4.5-5.5V
1220/1320
Legend: Shading of rows is to assist in readability of the table.
Note 1: Frequency calibrated at 25°C. OSCTUNE register can be used to compensate for temperature and VDD drift.
2: INTRC frequency after calibration.
3: Change of INTRC frequency as VDD changes.

DS39605F-page 258 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 22-7: CLKO AND I/O TIMING

Q4 Q1 Q2 Q3

OSC1

10 11

CLKO

13 12
14 19 18
16

I/O pin
(Input)

17 15

I/O pin Old Value New Value

(Output)

20, 21

Note: Refer to Figure 22-5 for load conditions.

TABLE 22-7: CLKO AND I/O TIMING REQUIREMENTS

Param.
Symbol Characteristic Min Typ Max Units Conditions
No.

10 TosH2ckL OSC1↑ to CLKO↓ — 75 200 ns (Note 1)

11 TosH2ckH OSC1↑ to CLKO↑ — 75 200 ns (Note 1)
12 TckR CLKO Rise Time — 35 100 ns (Note 1)
13 TckF CLKO Fall Time — 35 100 ns (Note 1)
14 TckL2ioV CLKO↓ to Port Out Valid — — 0.5 TCY + 20 ns (Note 1)
15 TioV2ckH Port In Valid before CLKO↑ 0.25 TCY + 25 — — ns (Note 1)
16 TckH2ioI Port In Hold after CLKO↑ 0 — — ns (Note 1)
17 TosH2ioV OSC1↑ (Q1 cycle) to Port Out Valid — 50 150 ns
18 TosH2ioI OSC1↑ (Q2 cycle) to Port PIC18F1X20 100 — — ns
18A Input Invalid (I/O in hold time) PIC18LF1X20 200 — — ns
19 TioV2osH Port Input Valid to OSC1↑ 0 — — ns
(I/O in setup time)
20 TioR Port Output Rise Time PIC18F1X20 — 10 25 ns
20A PIC18LF1X20 — — 60 ns
21 TioF Port Output Fall Time PIC18F1X20 — 10 25 ns
21A PIC18LF1X20 — — 60 ns
Note 1: Measurements are taken in RC mode, where CLKO output is 4 x TOSC.

© 2007 Microchip Technology Inc. DS39605F-page 259

PIC18F1220/1320
FIGURE 22-8: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND
POWER-UP TIMER TIMING

VDD

MCLR

30
Internal
POR

33
PWRT
Time-out 32

OSC
Time-out

Internal
Reset

Watchdog
Timer
Reset
31
34 34

I/O pins

Note: Refer to Figure 22-5 for load conditions.

FIGURE 22-9: BROWN-OUT RESET TIMING

BVDD
VDD
35
VBGAP = 1.2V

VIRVST

Enable Internal
Reference Voltage
Internal Reference 36
Voltage Stable

DS39605F-page 260 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
TABLE 22-8: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET REQUIREMENTS
Param.
Symbol Characteristic Min Typ Max Units Conditions
No.

30 TmcL MCLR Pulse Width (low) 2 — — μs

31 TWDT Watchdog Timer Time-out Period 3.48 4.00 4.71 ms
(No postscaler)
32 TOST Oscillation Start-up Timer Period 1024 TOSC — 1024 TOSC — TOSC = OSC1 period
33 TPWRT Power-up Timer Period — 65.5 132 ms
34 TIOZ I/O High-Impedance from MCLR — 2 — μs
Low or Watchdog Timer Reset
35 TBOR Brown-out Reset Pulse Width 200 — — μs VDD ≤ BVDD (see D005)
36 TIVRST Time for Internal Reference — 20 50 μs
Voltage to become stable
37 TLVD Low-Voltage Detect Pulse Width 200 — — μs VDD ≤ VLVD

FIGURE 22-10: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS

T0CKI

40 41

42

T1OSO/T13CKI

45 46

47 48

TMR0 or
TMR1

Note: Refer to Figure 22-5 for load conditions.

© 2007 Microchip Technology Inc. DS39605F-page 261

PIC18F1220/1320
TABLE 22-9: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Param
Symbol Characteristic Min Max Units Conditions
No.
40 Tt0H T0CKI High Pulse Width No prescaler 0.5 TCY + 20 — ns
With prescaler 10 — ns
41 Tt0L T0CKI Low Pulse Width No prescaler 0.5 TCY + 20 — ns
With prescaler 10 — ns
42 Tt0P T0CKI Period No prescaler TCY + 10 — ns
With prescaler Greater of: — ns N = prescale
20 ns or TCY + 40 value
N (1, 2, 4,..., 256)
45 Tt1H T13CKI High Time Synchronous, no prescaler 0.5 TCY + 20 — ns
Synchronous, PIC18F1X20 10 — ns
with prescaler PIC18LF1X20 25 — ns
Asynchronous PIC18F1X20 30 — ns
PIC18LF1X20 50 — ns
46 Tt1L T13CKI Low Time Synchronous, no prescaler 0.5 TCY + 5 — ns
Synchronous, PIC18F1X20 10 — ns
with prescaler PIC18LF1X20 25 — ns
Asynchronous PIC18F1X20 30 — ns
PIC18LF1X20 50 — ns
47 Tt1P T13CKI Input Synchronous Greater of: — ns N = prescale
Period 20 ns or TCY + 40 value
N (1, 2, 4, 8)
Asynchronous 60 — ns
Ft1 T13CKI Oscillator Input Frequency Range DC 50 kHz
48 Tcke2tmrI Delay from External T13CKI Clock Edge to 2 TOSC 7 TOSC —
Timer Increment

FIGURE 22-11: CAPTURE/COMPARE/PWM TIMINGS (ALL CCP MODULES)

CCPx
(Capture Mode)

50 51

52

CCPx
(Compare or PWM Mode)
53 54

Note: Refer to Figure 22-5 for load conditions.

DS39605F-page 262 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
TABLE 22-10: CAPTURE/COMPARE/PWM REQUIREMENTS (ALL CCP MODULES)
Param.
Symbol Characteristic Min Max Units Conditions
No.
50 TccL CCPx Input Low No prescaler 0.5 TCY + 20 — ns
Time With prescaler PIC18F1X20 10 — ns
PIC18LF1X20 20 — ns
51 TccH CCPx Input High No prescaler 0.5 TCY + 20 — ns
Time With prescaler PIC18F1X20 10 — ns
PIC18LF1X20 20 — ns
52 TccP CCPx Input Period 3 TCY + 40 — ns N = prescale
N value (1, 4 or 16)
53 TccR CCPx Output Fall Time PIC18F1X20 — 25 ns
PIC18LF1X20 — 45 ns
54 TccF CCPx Output Fall Time PIC18F1X20 — 25 ns
PIC18LF1X20 — 45 ns

FIGURE 22-12: EUSART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING

RB1/AN5/TX/
CK/INT1 pin
121 121
RB4/AN6/RX/
DT/KBI0 pin

120
122

Note: Refer to Figure 22-5 for load conditions.

TABLE 22-11: EUSART SYNCHRONOUS TRANSMISSION REQUIREMENTS

Param.
Symbol Characteristic Min Max Units Conditions
No.
120 TckH2dtV SYNC XMIT (MASTER & SLAVE)
Clock High to Data Out Valid PIC18F1X20 — 40 ns
PIC18LF1X20 — 100 ns
121 Tckrf Clock Out Rise Time and Fall Time PIC18F1X20 — 20 ns
(Master mode) PIC18LF1X20 — 50 ns
122 Tdtrf Data Out Rise Time and Fall Time PIC18F1X20 — 20 ns
PIC18LF1X20 — 50 ns

© 2007 Microchip Technology Inc. DS39605F-page 263

PIC18F1220/1320
FIGURE 22-13: EUSART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING

RB1/AN5/TX/
CK/INT1 pin 125
RB4/AN6/RX/
DT/KBI0 pin

126

Note: Refer to Figure 22-5 for load conditions.

TABLE 22-12: EUSART SYNCHRONOUS RECEIVE REQUIREMENTS

Param.
Symbol Characteristic Min Max Units Conditions
No.
125 TdtV2ckl SYNC RCV (MASTER & SLAVE)
Data Hold before CK↓ (DT hold time) 10 — ns
126 TckL2dtl Data Hold after CK↓ (DT hold time) 15 — ns

TABLE 22-13: A/D CONVERTER CHARACTERISTICS: PIC18F1220/1320 (INDUSTRIAL)

PIC18LF1220/1320 (INDUSTRIAL)
Param
Symbol Characteristic Min Typ Max Units Conditions
No.
A01 NR Resolution — — 10 bit ΔVREF ≥ 3.0V
A03 EIL Integral Linearity Error — — <±1 LSb ΔVREF ≥ 3.0V
A04 EDL Differential Linearity Error — — <±1 LSb ΔVREF ≥ 3.0V
A06 EOFF Offset Error — — <±1 LSb ΔVREF ≥ 3.0V
A07 EGN Gain Error — — <±1 LSb ΔVREF ≥ 3.0V
A10 — Monotonicity guaranteed(2) —
A20 ΔVREF Reference Voltage Range 3 — AVDD – AVSS V For 10-bit resolution
(VREFH – VREFL)
A21 VREFH Reference Voltage High AVSS + 3.0V — AVDD + 0.3V V For 10-bit resolution
A22 VREFL Reference Voltage Low AVSS – 0.3V — AVDD – 3.0V V For 10-bit resolution
A25 VAIN Analog Input Voltage VREFL — VREFH V
A28 AVDD Analog Supply Voltage VDD – 0.3 — VDD + 0.3 V
A29 AVSS Analog Supply Voltage VSS – 0.3 — VSS + 0.3 V
A30 ZAIN Recommended Impedance of — — 2.5 kΩ
Analog Voltage Source
A40 IAD A/D Conversion PIC18F1X20 — 180 — μA Average current
Current (VDD) PIC18LF1X20 — 90 — μA consumption when
A/D is on (Note 1)
A50 IREF VREF Input Current (Note 3) — — ±5 μA During VAIN acquisition.
— — ±150 μA During A/D conversion
cycle.
Note 1: When A/D is off, it will not consume any current other than minor leakage current. The power-down current
specification includes any such leakage from the A/D module.
2: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes.
3: VREFH current is from RA3/AN3/VREF+ pin or AVDD, whichever is selected as the VREFH source.
VREFL current is from RA2/AN2/VREF- pin or AVSS, whichever is selected as the VREFL source.

DS39605F-page 264 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 22-14: A/D CONVERSION TIMING

BSF ADCON0, GO
(Note 2)
131
Q4
130
A/D CLK(1) 132

A/D DATA 9 8 7 ... ... 2 1 0

ADRES OLD_DATA NEW_DATA

TCY
ADIF

GO DONE

Sampling Stopped
SAMPLE

Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts.
This allows the SLEEP instruction to be executed.
2: This is a minimal RC delay (typically 100 ns), which also disconnects the holding capacitor from the analog input.

TABLE 22-14: A/D CONVERSION REQUIREMENTS

Param
Symbol Characteristic Min Max Units Conditions
No.

130 TAD A/D Clock Period PIC18F1X20 1.6 20(5) μs TOSC based, VREF ≥ 3.0V
PIC18LF1X20 3.0 20(5) μs TOSC based, VREF full range
PIC18F1X20 2.0 6.0 μs A/D RC mode
PIC18LF1X20 3.0 9.0 μs A/D RC mode
131 TCNV Conversion Time 11 12 TAD
(not including acquisition time) (Note 1)
132 TACQ Acquisition Time (Note 3) 15 — μs -40°C ≤ Temp ≤ +125°C
10 — μs 0°C ≤ Temp ≤ +125°C
135 TSWC Switching Time from Convert → Sample — (Note 4)
136 TAMP Amplifier Settling Time (Note 2) 1 — μs This may be used if the
“new” input voltage has not
changed by more than 1 LSb
(i.e., 5 mV @ 5.12V) from the
last sampled voltage (as
stated on CHOLD).
Note 1: ADRES register may be read on the following TCY cycle.
2: See Section 17.0 “10-Bit Analog-to-Digital Converter (A/D) Module” for minimum conditions when input
voltage has changed more than 1 LSb.
3: The time for the holding capacitor to acquire the “New” input voltage, when the voltage changes full scale after
the conversion (AVDD to AVSS, or AVSS to AVDD). The source impedance (RS) on the input channels is 50Ω.
4: On the next Q4 cycle of the device clock.
5: The time of the A/D clock period is dependent on the device frequency and the TAD clock divider.

© 2007 Microchip Technology Inc. DS39605F-page 265

PIC18F1220/1320
NOTES:

DS39605F-page 266 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
23.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore, outside the warranted range.
“Typical” represents the mean of the distribution at 25°C. “Maximum” or “minimum” represents (mean + 3σ) or (mean – 3σ)
respectively, where σ is a standard deviation, over the whole temperature range.

FIGURE 23-1: TYPICAL IDD vs. FOSC OVER VDD PRI_RUN, EC MODE, +25°C
0.5

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)
0.4 Minimum: mean – 3σ (-40°C to +125°C)
5.5V

5.0V

0.3
4.5V
IDD (mA)

4.0V

0.2
3.5V

3.0V

0.1 2.5V

2.0V

0.0
0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20
FOSC (MHz)

FIGURE 23-2: MAXIMUM IDD vs. FOSC OVER VDD PRI_RUN, EC MODE, -40°C TO +85°C
0.7

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)
0.6 Minimum: mean – 3σ (-40°C to +125°C)
5.5V

5.0V
0.5

4.5V
0.4
IDD (mA)

4.0V

0.3
3.5V

3.0V
0.2

2.5V

0.1
2.0V

0.0
0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20
FOSC (MHz)

© 2007 Microchip Technology Inc. DS39605F-page 267

PIC18F1220/1320
FIGURE 23-3: MAXIMUM IDD vs. FOSC OVER VDD PRI_RUN, EC MODE, -40°C TO +125°C
0.7

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C)
0.6
5.5V

5.0V
0.5

4.5V
0.4
IDD (mA)

4.0V

0.3
3.5V

3.0V
0.2

2.5V

0.1
2.0V

0.0
0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20
FOSC (MHz)

FIGURE 23-4: TYPICAL IDD vs. FOSC OVER VDD PRI_RUN, EC MODE, +25°C
2.0

Typical: statistical mean @ 25°C

1.8 Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C)

1.6

5.5V
1.4
5.0V

1.2
4.5V
IDD (mA)

1.0
4.0V

0.8 3.5V

3.0V
0.6
2.5V
0.4 2.0V

0.2

0.0
1.0 1.5 2.0 2.5 3.0 3.5 4.0
FOSC (MHz)

DS39605F-page 268 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 23-5: MAXIMUM IDD vs. FOSC OVER VDD PRI_RUN, EC MODE, -40°C TO +125°C
2.5

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C)
2.0

5.5V

5.0V
1.5
IDD (mA)

4.5V

4.0V

1.0
3.5V

3.0V

2.5V
0.5
2.0V

0.0
1.0 1.5 2.0 2.5 3.0 3.5 4.0
FOSC (MHz)

FIGURE 23-6: TYPICAL IDD vs. FOSC OVER VDD PRI_RUN, EC MODE, +25°C
16

Typical: statistical mean @ 25°C

14 Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C)

5.5V
12

5.0V
10
4.5V
IDD (mA)

8
4.0V

3.5V

3.0V
2
2.5V
2.0V
0
4 8 12 16 20 24 28 32 36 40
FOSC (MHz)

© 2007 Microchip Technology Inc. DS39605F-page 269

PIC18F1220/1320
FIGURE 23-7: MAXIMUM IDD vs. FOSC OVER VDD PRI_RUN, EC MODE, -40°C TO +125°C
16

14 Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C) 5.5V
Minimum: mean – 3σ (-40°C to +125°C)
5.0V
12

4.0V
10
4.5V
IDD (mA)

3.5V
6

4
3.0V

2
2.5V
2.0V
0
4 8 12 16 20 24 28 32 36 40
FOSC (MHz)

FIGURE 23-8: TYPICAL IDD vs. FOSC OVER VDD PRI_IDLE, EC MODE, +25°C
0.035

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C) 5.5V
0.030 Minimum: mean – 3σ (-40°C to +125°C)

5.0V
0.025
4.5V

0.020
4.0V
IDD (mA)

3.5V
0.015
3.0V

2.5V
0.010
2.0V

0.005

0.000
0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20
FOSC (MHz)

DS39605F-page 270 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 23-9: MAXIMUM IDD vs. FOSC OVER VDD PRI_IDLE, EC MODE, -40°C TO +85°C
0.045

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)
0.040 Minimum: mean – 3σ (-40°C to +125°C)
5.5V

0.035

5.0V
0.030
4.5V

0.025
IDD (mA)

4.0V

0.020
3.5V

3.0V
0.015

2.5V
0.010 2.0V

0.005

0.000
0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20
FOSC (MHz)

FIGURE 23-10: MAXIMUM IDD vs. FOSC OVER VDD PRI_IDLE, EC MODE, -40°C TO +125°C
0.100

Typical: statistical mean @ 25°C

0.090
Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C) 5.5V
0.080

0.070 5.0V

0.060
4.5V
IDD (mA)

0.050 4.0V

3.5V
0.040

3.0V
0.030
2.5V

0.020 2.0V

0.010

0.000
0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20
FOSC (MHz)

© 2007 Microchip Technology Inc. DS39605F-page 271

PIC18F1220/1320
FIGURE 23-11: TYPICAL IDD vs.
Typical I F F OVER
OSC
vs over VVDD PRI_IDLE,
PRI_IDLE, EC MODE,
EC mode, +25°C +25°C

600

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)
500 Minimum: mean – 3σ (-40°C to +125°C)

5.5V

5.0V
400

4.5V
IDD (μA)

4.0V
300

3.5V

3.0V
200
2.5V

2.0V
100

0
1.0 1.5 2.0 2.5 3.0 3.5 4.0
FOSC (MHz)

FIGURE 23-12: MAXIMUM IDD vs. FOSC OVER VDD PRI_IDLE, EC MODE, -40°C TO +125°C
600

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C) 5.5V
500 Minimum: mean – 3σ (-40°C to +125°C)

5.0V

400
4.5V

4.0V
IDD (μA)

300
3.5V

3.0V
200
2.5V

2.0V

100

0
1.0 1.5 2.0 2.5 3.0 3.5 4.0
FOSC (MHz)

DS39605F-page 272 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 23-13: TYPICAL IDD vs. FOSC OVER VDD PRI_IDLE, EC MODE, +25°C
6.0

5.5 Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C)
5.0

4.5
5.5V
4.0
5.0V

3.5
4.5V
IDD (mA)

3.0
4.0V
2.5

2.0
3.5V

1.5

3.0V
1.0

0.5 2.5V

2.0V
0.0
4 8 12 16 20 24 28 32 36 40
FOSC (MHz)

FIGURE 23-14: MAXIMUM IDD vs. FOSC OVER VDD PRI_IDLE, EC MODE, -40°C TO +125°C
6.0

5.5
Typical: statistical mean @ 25°C
5.0 Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C) 5.5V
4.5 5.0V

4.0 4.5V

3.5
4.0V
IDD (mA)

3.0

2.5
3.5V
2.0

1.5
3.0V

1.0

2.5V
0.5
2.0V
0.0
4 8 12 16 20 24 28 32 36 40
FOSC (MHz)

© 2007 Microchip Technology Inc. DS39605F-page 273

PIC18F1220/1320
FIGURE 23-15: TYPICAL IPD vs. VDD (+25°C), 125 kHz TO 8 MHz RC_RUN MODE,
ALL PERIPHERALS DISABLED
3000

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C)
2500 8 MHz

250 kHz and 500 kHz curves are

bounded by 125 kHz and 1 MHz
curves.
2000
IPD (μA)

1500

4 MHz

1000

2 MHz

500
1 MHz

125 kHz

0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)

FIGURE 23-16: MAXIMUM IPD vs. VDD (-40°C TO +125°C), 125 kHz TO 8 MHz RC_RUN MODE,
ALL PERIPHERALS DISABLED
3500

8 MHz
3000
250 kHz and 500 kHz curves are
bounded by 125 kHz and 1 MHz
curves.
2500
Typical: statistical mean @ 25°C
Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C)
2000
IPD (μA)

4 MHz
1500

1000
2 MHz

500 1 MHz

125 kHz

0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)

DS39605F-page 274 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 23-17: TYPICAL AND MAXIMUM IPD vs. VDD (-40°C TO +125°C), 31.25 kHz RC_RUN MODE,
ALL PERIPHERALS DISABLED
100

Max (+125°C)

Max (+85°C)

Typ (+25°C)
IPD (μA)

10

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C)

1
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)

FIGURE 23-18: TYPICAL IPD vs. VDD (+25°C), 125 kHz TO 8 MHz RC_IDLE MODE,
ALL PERIPHERALS DISABLED
800

750

250 kHz and 500 kHz curves are

700
bounded by 125 kHz and 1 MHz
curves.
650 8 MHz
Typical: statistical mean @ 25°C
600 Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C)
550 4 MHz

500
2 MHz
IPD (μA)

1 MHz
450
125 kHz
400

350

300

250

200

150

100
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)

© 2007 Microchip Technology Inc. DS39605F-page 275

PIC18F1220/1320
FIGURE 23-19: MAXIMUM IPD vs. VDD (-40°C TO +125°C), 125 kHz TO 8 MHz RC_IDLE MODE,
ALL PERIPHERALS DISABLED
800
8 MHz
750
250 kHz and 500 kHz curves are
700
bounded by 125 kHz and 1 MHz
curves. 4 MHz
650
2 MHz
600 1 MHz
125 kHz
550

500
IPD (μA)

450

400

350

300
Typical: statistical mean @ 25°C
250
Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C)
200

150

100
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)

FIGURE 23-20: TYPICAL AND MAXIMUM IPD vs. VDD (-40°C TO +125°C), 31.25 kHz RC_IDLE MODE,
ALL PERIPHERALS DISABLED
100

Max (+125°C)

Max (+85°C)
IPD (μA)

10
Typ (+25°C)

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C)

1
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)

DS39605F-page 276 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 23-21: IPD SEC_RUN MODE, -10°C TO +70°C, 32.768 kHz XTAL, 2 x 22 pF,
ALL PERIPHERALS DISABLED
80

Typical: statistical mean @ 25°C

70 Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C)

60

Max (+70°C)
50
IPD (μA)

40
Typ (+25°C)

30

20

10

0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)

FIGURE 23-22: IPD SEC_IDLE MODE, -10°C TO +70°C, 32.768 kHz, 2 x 22 pF,
ALL PERIPHERALS DISABLED
20

Typical: statistical mean @ 25°C

18 Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C)

16

14
Max (+70°C)
12
IPD (μA)

10
Typ (+25°C)

0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)

© 2007 Microchip Technology Inc. DS39605F-page 277

PIC18F1220/1320
FIGURE 23-23: TOTAL IPD, -40°C TO +125°C SLEEP MODE, ALL PERIPHERALS DISABLED

100
Max (+125°C)

10
Max (+85°C)

1
IPD (μA)

0.1

Typ (+25°C)

0.01
Typical: statistical mean @ 25°C
Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C)

0.001
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)

FIGURE 23-24: VOH vs. IOH OVER TEMPERATURE (-40°C TO +125°C), VDD = 3.0V
3.0

2.5

2.0

Max (+125°C)
VOH (V)

1.5
Typ (+25°C)
Min (+125°C)

1.0

0.5

0.0
0 5 10 15 20 25
IOH (-mA)

DS39605F-page 278 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 23-25: VOH vs. IOH OVER TEMPERATURE (-40°C TO +125°C), VDD = 5.0V
5.0

4.5
Max (+125°C)
4.0

Typ (+25°C)
3.5

3.0
VOH (V)

2.5
Min (+125°C)

2.0

1.5

1.0

0.5

0.0
0 5 10 15 20 25
IOH (-mA)

FIGURE 23-26: VOL vs. IOLV OVER

vs I TEMPERATURE
over Temp (-40°C to(-40°C
+125°C)TO
V +125°C),
= 3.0V VDD = 3.0V
3.0

Max (+125°C)

2.5

Max (+85°C)
2.0
VOL (V)

1.5

Typ (+25°C)
1.0

0.5

Min (+125°C)

0.0
0 5 10 15 20 25
IOL (-mA)

© 2007 Microchip Technology Inc. DS39605F-page 279

PIC18F1220/1320
FIGURE 23-27: VOL vs. IOL OVER TEMPERATURE (-40°C TO +125°C), VDD = 5.0V
1.0

0.9
Max (+125°C)
0.8

0.7

0.6
Max (+85°C)
VOL (V)

0.5

0.4
Typ (+25°C)
0.3

0.2
Min (+125°C)

0.1

0.0
0 5 10 15 20 25
IOL (-mA)

FIGURE 23-28: ΔIPD TIMER1 OSCILLATOR, -10°C TO +70°C SLEEP MODE,

TMR1 COUNTER
IPD Timer1 DISABLED
Oscillator, -10°C to +70°C SLEEP mode, TMR1 counter disabled

5.0

4.5

Max (-10°C to +70°C)

4.0

3.5

3.0
Typ (+25°C)
IPD (μA)

2.5

2.0

1.5

Typical: statistical mean @ 25°C

1.0 Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C)

0.5

0.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)

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 PIC18F1220/1320
FIGURE 23-29: ΔIPD FSCM vs. VDD OVER TEMPERATURE PRI_IDLE MODE,
EC OSCILLATOR AT 32 kHz, -40°C TO +125°C
4.5

4.0

Max (-40°C)
3.5

3.0

2.5
ΔIPD (μA)

Typ (+25°C)

2.0

1.5

Typical: statistical mean @ 25°C

1.0 Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C)

0.5

0.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)

FIGURE 23-30: ΔIPD WDT, -40°C TO +125°C SLEEP MODE, ALL PERIPHERALS DISABLED
14

Typical: statistical mean @ 25°C

12 Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C)

10
Max (+125°C)

8
ΔIPD (μA)

Max (+85°C)

4
Typ (+25°C)

0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)

© 2007 Microchip Technology Inc. DS39605F-page 281

PIC18F1220/1320
FIGURE 23-31: ΔIPD LVD vs. VDD SLEEP MODE, LVDL3:LVDL0 = 0001 (2V)
50

45
Typical: statistical mean @ 25°C
Maximum: mean + 3σ (-40°C to +125°C)
40 Minimum: mean – 3σ (-40°C to +125°C)
Max (+125°C)

35

Max (+85°C)
30
IPD (μA)

Typ (+25°C)
25

20

15

10
Low-Voltage Detection Range
5

Normal Operating Range

0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)

FIGURE 23-32: ΔIPD BOR vs. VDD, -40°C TO +125°C SLEEP MODE,
BORV1:BORV0 = 11 (2V)
40

Typical: statistical mean @ 25°C

35 Maximum: mean + 3σ (-40°C to +125°C)
Minimum: mean – 3σ (-40°C to +125°C) Max (+125°C)

30

25
Typ (+25°C)
IPD (μA)

20

15

10

Device may be in Reset

5
Device is Operating

0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)

DS39605F-page 282 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
FIGURE 23-33: ΔIPD A/D, -40°C TO +125°C SLEEP MODE, A/D ENABLED (NOT CONVERTING)

10

Max (+125°C)

1
IPD (μA)

Max (+85°C)
0.1

0.01
Typical: statistical mean @ 25°C
Maximum: mean + 3σ (-40°C to +125°C)
Typ (+25°C)
Minimum: mean – 3σ (-40°C to +125°C)

0.001
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)

FIGURE 23-34: AVERAGE FOSC vs. VDD FOR VARIOUS R’s EXTERNAL RC MODE,
C = 20 pF, TEMPERATURE = +25°C
5.0

Operation above 4 MHz is not recomended

4.5

4.0
5.1K

3.5

3.0
Freq (MHz)

2.5

10K
2.0

1.5

1.0

33K
0.5
100K
0.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)

© 2007 Microchip Technology Inc. DS39605F-page 283

PIC18F1220/1320
FIGURE 23-35: AVERAGE FOSC vs. VDD FOR VARIOUS R’s EXTERNAL RC MODE,
C = 100 pF, TEMPERATURE = +25°C
2.0

1.8

1.6
5.1K

1.4

1.2
Freq (MHz)

1.0

10K
0.8

0.6

0.4

33K
0.2

100K
0.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)

FIGURE 23-36: AVERAGE FOSC vs. VDD FOR VARIOUS R’s EXTERNAL RC MODE,
C = 300 pF, TEMPERATURE = +25°C
0.8

0.7

0.6

0.5
5.1K
Freq (MHz)

0.4

0.3

10K

0.2

0.1
33K

100K
0.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)

DS39605F-page 284 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
24.0 PACKAGING INFORMATION

24.1 Package Marking Information

18-Lead PDIP Example

XXXXXXXXXXXXXXXXX PIC18F1320-I/P e3
XXXXXXXXXXXXXXXXX 0710017
YYWWNNN

18-Lead SOIC Example

XXXXXXXXXXXX PIC18F1220-
XXXXXXXXXXXX E/SO e3
XXXXXXXXXXXX 0710017
YYWWNNN

20-Lead SSOP Example

XXXXXXXXXXX PIC18F1220-
XXXXXXXXXXX E/SS e3
YYWWNNN 0710017

28-Lead QFN Example

XXXXXXXX 18F1320
XXXXXXXX -I/ML e3
YYWWNNN 0710017

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
e3 Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

© 2007 Microchip Technology Inc. DS39605F-page 285

PIC18F1220/1320
24.2 Package Details
The following sections give the technical details of the packages.

18-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

NOTE 1
E1

1 2 3
D

A A2

L c
A1
b1

b e eB

Units INCHES
Dimension Limits MIN NOM MAX
Number of Pins N 18
Pitch e .100 BSC
Top to Seating Plane A – – .210
Molded Package Thickness A2 .115 .130 .195
Base to Seating Plane A1 .015 – –
Shoulder to Shoulder Width E .300 .310 .325
Molded Package Width E1 .240 .250 .280
Overall Length D .880 .900 .920
Tip to Seating Plane L .115 .130 .150
Lead Thickness c .008 .010 .014
Upper Lead Width b1 .045 .060 .070
Lower Lead Width b .014 .018 .022
Overall Row Spacing § eB – – .430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-007B

DS39605F-page 286 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

E
E1

NOTE 1

1 2 3
e
b
α
h
h

c
φ
A A2

β
A1 L
L1

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 18
Pitch e 1.27 BSC
Overall Height A – – 2.65
Molded Package Thickness A2 2.05 – –
Standoff § A1 0.10 – 0.30
Overall Width E 10.30 BSC
Molded Package Width E1 7.50 BSC
Overall Length D 11.55 BSC
Chamfer (optional) h 0.25 – 0.75
Foot Length L 0.40 – 1.27
Footprint L1 1.40 REF
Foot Angle φ 0° – 8°
Lead Thickness c 0.20 – 0.33
Lead Width b 0.31 – 0.51
Mold Draft Angle Top α 5° – 15°
Mold Draft Angle Bottom β 5° – 15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-051B

© 2007 Microchip Technology Inc. DS39605F-page 287

PIC18F1220/1320
20-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

D
N

E1

NOTE 1

1 2
e
b

c
A A2

φ
A1
L1 L

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 20
Pitch e 0.65 BSC
Overall Height A – – 2.00
Molded Package Thickness A2 1.65 1.75 1.85
Standoff A1 0.05 – –
Overall Width E 7.40 7.80 8.20
Molded Package Width E1 5.00 5.30 5.60
Overall Length D 6.90 7.20 7.50
Foot Length L 0.55 0.75 0.95
Footprint L1 1.25 REF
Lead Thickness c 0.09 – 0.25
Foot Angle φ 0° 4° 8°
Lead Width b 0.22 – 0.38
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-072B

DS39605F-page 288 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

D D2
EXPOSED
PAD

E
b
E2

2 2
1 1 K

N N
NOTE 1 L
TOP VIEW BOTTOM VIEW

A3 A1

Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 28
Pitch e 0.65 BSC
Overall Height A 0.80 0.90 1.00
Standoff A1 0.00 0.02 0.05
Contact Thickness A3 0.20 REF
Overall Width E 6.00 BSC
Exposed Pad Width E2 3.65 3.70 4.20
Overall Length D 6.00 BSC
Exposed Pad Length D2 3.65 3.70 4.20
Contact Width b 0.23 0.30 0.35
Contact Length L 0.50 0.55 0.70
Contact-to-Exposed Pad K 0.20 – –
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-105B

© 2007 Microchip Technology Inc. DS39605F-page 289

PIC18F1220/1320
NOTES:

DS39605F-page 290 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
APPENDIX A: REVISION HISTORY Revision F (February 2007)
This revision includes updates to the packaging
Revision A (August 2002) diagrams.
Original data sheet for PIC18F1220/1320 devices.
APPENDIX B: DEVICE
Revision B (November 2002)
DIFFERENCES
This revision includes significant changes to
Section 2.0, Section 3.0 and Section 19.0, as well as The differences between the devices listed in this data
updates to the Electrical Specifications in Section 22.0 sheet are shown in Table B-1.
and includes minor corrections to the data sheet text.

Revision C (May 2004)

This revision includes updates to the Electrical Specifi-
cations in Section 22.0, the DC and AC Characteristics
Graphs and Tables in Section 23.0 and includes minor
corrections to the data sheet text.

Revision D (October 2006)

This revision includes updates to the packaging
diagrams.

Revision E (January 2007)

This revision includes updates to the packaging
diagrams.

TABLE B-1: DEVICE DIFFERENCES

Features PIC18F1220 PIC18F1320
Program Memory (Bytes) 4096 8192
Program Memory (Instructions) 2048 4096
Interrupt Sources 15 15
I/O Ports Ports A, B Ports A, B
Enhanced Capture/Compare/PWM Modules 1 1
10-bit Analog-to-Digital Module 7 input channels 7 input channels
18-pin SDIP 18-pin SDIP
18-pin SOIC 18-pin SOIC
Packages
20-pin SSOP 20-pin SSOP
28-pin QFN 28-pin QFN

© 2007 Microchip Technology Inc. DS39605F-page 291

PIC18F1220/1320
APPENDIX C: CONVERSION APPENDIX D: MIGRATION FROM
CONSIDERATIONS BASELINE TO
This appendix discusses the considerations for con- ENHANCED DEVICES
verting from previous versions of a device to the ones This section discusses how to migrate from a baseline
listed in this data sheet. Typically, these changes are device (i.e., PIC16C5X) to an enhanced MCU device
due to the differences in the process technology used. (i.e., PIC18FXXX).
An example of this type of conversion is from a
PIC16C74A to a PIC16C74B. The following are the list of modifications over the
PIC16C5X microcontroller family:
Not Applicable
Not Currently Available

DS39605F-page 292 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
APPENDIX E: MIGRATION FROM APPENDIX F: MIGRATION FROM
MID-RANGE TO HIGH-END TO
ENHANCED DEVICES ENHANCED DEVICES
A detailed discussion of the differences between the A detailed discussion of the migration pathway and
mid-range MCU devices (i.e., PIC16CXXX) and the differences between the high-end MCU devices (i.e.,
enhanced devices (i.e., PIC18FXXX) is provided in PIC17CXXX) and the enhanced devices (i.e.,
AN716, “Migrating Designs from PIC16C74A/74B to PIC18FXXX) is provided in AN726, “PIC17CXXX to
PIC18C442”. The changes discussed, while device PIC18CXXX Migration”.
specific, are generally applicable to all mid-range to This Application Note is available as Literature Number
enhanced device migrations. DS00726.
This Application Note is available as Literature Number
DS00716.

© 2007 Microchip Technology Inc. DS39605F-page 293

PIC18F1220/1320
NOTES:

DS39605F-page 294 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
INDEX
A Generic I/O Port Operation ........................................ 87
Low-Voltage Detect (LVD) ....................................... 166
A/D ................................................................................... 155
A/D Converter Interrupt, Configuring ....................... 159 Low-Voltage Detect (LVD) with External Input ........ 166
Acquisition Requirements ........................................ 160 MCLR/VPP/RA5 Pin ................................................... 89
On-Chip Reset Circuit ................................................ 33
ADCON0 Register .................................................... 155
OSC1/CLKI/RA7 Pin .................................................. 88
ADCON1 Register .................................................... 155
OSC2/CLKO/RA6 Pin ................................................ 88
ADCON2 Register .................................................... 155
PIC18F1220/1320 ....................................................... 7
ADRESH Register .................................................... 155
PLL ............................................................................ 12
ADRESH/ADRESL Registers .................................. 158
RA3:RA0 Pins ............................................................ 88
ADRESL Register .................................................... 155
RA4/T0CKI Pin .......................................................... 88
Analog Port Pins, Configuring .................................. 162
RB0/AN4/INT0 Pin ..................................................... 90
Associated Registers ............................................... 164
RB1/AN5/TX/CK/INT1 Pin ......................................... 91
Configuring the Module ............................................ 159
RB2/P1B/INT2 Pin ..................................................... 92
Conversion Clock (Tad) ........................................... 161
RB3/CCP1/P1A Pin ................................................... 93
Conversion Requirements ....................................... 265
RB4/AN6/RX/DT/KBI0 Pin ......................................... 94
Conversion Status (GO/DONE Bit) .......................... 158
RB5/PGM/KBI1 Pin .................................................... 95
Conversions ............................................................. 163
Converter Characteristics ........................................ 264 RB6/PGC/T1OSO/T13CKI/P1C/KBI2 Pin .................. 96
Operation in Low-Power Modes ............................... 162 RB7/PGD/T1OSI/P1D/KBI3 Pin ................................. 97
Reads from Flash Program Memory .......................... 61
Selecting, Configuring Automatic
Acquisition Time ............................................... 161 System Clock ............................................................. 16
Special Event Trigger (CCP) .................................... 117 Table Read Operation ............................................... 57
Table Write Operation ................................................ 58
Special Event Trigger (CCP1) .................................. 164
Use of the CCP1 Trigger .......................................... 164 Table Writes to Flash Program Memory .................... 63
Vref+ and Vref- References ..................................... 160 Timer0 in 16-Bit Mode ............................................. 100
Timer0 in 8-Bit Mode ............................................... 100
Absolute Maximum Ratings ............................................. 237
AC (Timing) Characteristics ............................................. 255 Timer1 ..................................................................... 104
Conditions ................................................................ 256 Timer1 (16-Bit Read/Write Mode) ............................ 104
Timer2 ..................................................................... 110
Load Conditions for Device
Timing Specifications ....................................... 256 Timer3 ..................................................................... 112
Parameter Symbology ............................................. 255 Timer3 (16-bit Read/Write Mode) ............................ 112
WDT ........................................................................ 180
Temperature and Voltage Specifications ................. 256
ADCON0 Register ............................................................ 155 BN .................................................................................... 200
GO/DONE Bit ........................................................... 158 BNC ................................................................................. 201
BNN ................................................................................. 201
ADCON1 Register ............................................................ 155
ADCON2 Register ............................................................ 155 BNOV ............................................................................... 202
ADDLW ............................................................................ 197 BNZ .................................................................................. 202
BOR. See Brown-out Reset.
ADDWF ............................................................................ 197
BOV ................................................................................. 205
ADDWFC ......................................................................... 198
BRA ................................................................................. 203
ADRESH Register ............................................................ 155
Break Character (12-bit) Transmit and Receive .............. 146
ADRESH/ADRESL Registers ........................................... 158
Brown-out Reset (BOR) ..............................................34, 171
ADRESL Register ............................................................ 155
BSF .................................................................................. 203
Analog-to-Digital Converter. See A/D.
BTFSC ............................................................................. 204
ANDLW ............................................................................ 198
BTFSS ............................................................................. 204
ANDWF ............................................................................ 199
BTG ................................................................................. 205
Assembler
BZ .................................................................................... 206
MPASM Assembler .................................................. 234
Auto-Wake-up on Sync Break Character ......................... 145 C
B C Compilers
MPLAB C18 ............................................................. 234
BC .................................................................................... 199
MPLAB C30 ............................................................. 234
BCF .................................................................................. 200
CALL ................................................................................ 206
Block Diagrams
Capture (CCP Module) .................................................... 116
A/D ........................................................................... 158
CCP Pin Configuration ............................................. 116
Analog Input Model .................................................. 159
CCPR1H:CCPR1L Registers ................................... 116
Capture Mode Operation ......................................... 117
Software Interrupt .................................................... 116
Compare Mode Operation ....................................... 118
Timer1/Timer3 Mode Selection ................................ 116
Enhanced PWM ....................................................... 120
Capture, Compare, Timer1 and Timer3
EUSART Receive .................................................... 143
Associated Registers ............................................... 118
EUSART Transmit ................................................... 141
Fail-Safe Clock Monitor ............................................ 182

© 2007 Microchip Technology Inc. DS39605F-page 295

PIC18F1220/1320
Capture/Compare/PWM (CCP) Data Memory ..................................................................... 47
Capture Mode. See Capture. General Purpose Registers ....................................... 47
CCP1 ........................................................................ 116 Map for PIC18F1220/1320 Devices ........................... 48
CCPR1H Register ............................................ 116 Special Function Registers ........................................ 49
CCPR1L Register ............................................ 116 DAW ................................................................................ 210
Compare Mode. See Compare. DC and AC Characteristics
Timer Resources ...................................................... 116 Graphs and Tables .................................................. 267
Clock Sources .................................................................... 15 DC Characteristics ........................................................... 250
Selection Using OSCCON Register ........................... 16 Power-Down and Supply Current ............................ 241
Clocking Scheme ............................................................... 45 Supply Voltage ......................................................... 240
CLRF ................................................................................ 207 DCFSNZ .......................................................................... 211
CLRWDT .......................................................................... 207 DECF ............................................................................... 210
Code Examples DECFSZ .......................................................................... 211
16 x 16 Signed Multiply Routine ................................. 72 Details on Individual Family Members ................................. 6
16 x 16 Unsigned Multiply Routine ............................. 72 Development Support ...................................................... 233
8 x 8 Signed Multiply Routine ..................................... 71 Device Differences ........................................................... 291
8 x 8 Unsigned Multiply Routine ................................. 71 Direct Addressing ............................................................... 54
Changing Between Capture Prescalers ................... 117
Computed GOTO Using an Offset Value ................... 47 E
Data EEPROM Read ................................................. 69 Effects of Power Managed Modes on
Data EEPROM Refresh Routine ................................ 70 Various Clock Sources .............................................. 18
Data EEPROM Write .................................................. 69 Electrical Characteristics .................................................. 237
Erasing a Flash Program Memory Row ..................... 62 Enhanced Capture/Compare/PWM (ECCP) .................... 115
Fast Register Stack .................................................... 44 Outputs .................................................................... 116
How to Clear RAM (Bank 1) Using PWM Mode. See PWM (ECCP Module).
Indirect Addressing ............................................ 53 Enhanced PWM Mode. See PWM (ECCP Module). ........ 119
Implementing a Real-Time Clock Using a Enhanced Universal Synchronous Asynchronous
Timer1 Interrupt Service .................................. 107 Receiver Transmitter (EUSART) ............................. 131
Initializing PORTA ...................................................... 87 Equations
Initializing PORTB ...................................................... 90 16 x 16 Signed Multiplication Algorithm ..................... 72
Reading a Flash Program Memory Word ................... 61 16 x 16 Unsigned Multiplication Algorithm ................. 72
Saving Status, WREG and A/D Minimum Charging Time ................................... 160
BSR Registers in RAM ....................................... 85 Acquisition Time ...................................................... 160
Writing to Flash Program Memory ....................... 64–65 Errata ................................................................................... 4
Code Protection ............................................................... 171 EUSART
COMF ............................................................................... 208 Asynchronous Mode ................................................ 140
Compare (CCP Module) ................................................... 117 12-bit Break Transmit and Receive ................. 146
CCP Pin Configuration ............................................. 117 Associated Registers, Receive ........................ 144
CCPR1 Register ....................................................... 117 Associated Registers, Transmit ....................... 142
Software Interrupt ..................................................... 117 Auto-Wake-up on Sync Break ......................... 145
Special Event Trigger ....................................... 113, 117 Receiver .......................................................... 143
Timer1/Timer3 Mode Selection ................................ 117 Setting up 9-bit Mode with
Compare (CCP1 Module) Address Detect ........................................ 143
Special Event Trigger ............................................... 164 Transmitter ....................................................... 140
Computed GOTO ............................................................... 47 Baud Rate Generator (BRG) ................................... 135
Configuration Bits ............................................................. 171 Associated Registers ....................................... 136
Context Saving During Interrupts ....................................... 85 Auto-Baud Rate Detect .................................... 139
Conversion Considerations .............................................. 292 Baud Rate Error, Calculating ........................... 135
CPFSEQ .......................................................................... 208 Baud Rates, Asynchronous Modes ................. 136
CPFSGT ........................................................................... 209 High Baud Rate Select (BRGH Bit) ................. 135
CPFSLT ........................................................................... 209 Power Managed Mode Operation .................... 135
Customer Change Notification Service ............................ 302 Sampling .......................................................... 135
Customer Notification Service .......................................... 302 Serial Port Enable (SPEN Bit) ................................. 131
Customer Support ............................................................ 302 Synchronous Master Mode ...................................... 148
Associated Registers, Reception ..................... 151
D Associated Registers, Transmit ....................... 149
Data EEPROM Memory ..................................................... 67 Reception ........................................................ 150
Associated Registers ................................................. 70 Transmission ................................................... 148
EEADR Register ........................................................ 67 Synchronous Slave Mode ........................................ 152
EECON1 Register ...................................................... 67 Associated Registers, Receive ........................ 153
EECON2 Register ...................................................... 67 Associated Registers, Transmit ....................... 152
Operation During Code-Protect .................................. 70 Reception ........................................................ 153
Protection Against Spurious Write ............................. 69 Transmission ................................................... 152
Reading ...................................................................... 69
Using .......................................................................... 70
Write Verify ................................................................. 69
Writing ........................................................................ 69

DS39605F-page 296 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
F BRA ......................................................................... 203
Fail-Safe Clock Monitor .................................................... 171 BSF .......................................................................... 203
Exiting Operation ..................................................... 183 BTFSC ..................................................................... 204
BTFSS ..................................................................... 204
Interrupts in Power Managed Modes ....................... 183
BTG ......................................................................... 205
POR or Wake from Sleep ........................................ 184
BZ ............................................................................ 206
WDT During Oscillator Failure ................................. 182
CALL ........................................................................ 206
Fail-Safe Clock Monitor (FSCM) ...................................... 182
CLRF ....................................................................... 207
Fast Register Stack ............................................................ 44
CLRWDT ................................................................. 207
Firmware Instructions ....................................................... 191
COMF ...................................................................... 208
Flash Program Memory ...................................................... 57
CPFSEQ .................................................................. 208
Associated Registers ................................................. 65
CPFSGT .................................................................. 209
Control Registers ....................................................... 58
CPFSLT ................................................................... 209
Erase Sequence ........................................................ 62
DAW ........................................................................ 210
Erasing ....................................................................... 62
DCFSNZ .................................................................. 211
Operation During Code-Protect ................................. 65
DECF ....................................................................... 210
Reading ...................................................................... 61
DECFSZ .................................................................. 211
Table Latch ................................................................ 60
General Format ........................................................ 193
Table Pointer .............................................................. 60
GOTO ...................................................................... 212
Boundaries Based on Operation ........................ 60
INCF ........................................................................ 212
Table Pointer Boundaries .......................................... 60
INCFSZ .................................................................... 213
Table Reads and Table Writes .................................. 57
INFSNZ .................................................................... 213
Write Sequence ......................................................... 63
IORLW ..................................................................... 214
Writing to .................................................................... 63
IORWF ..................................................................... 214
Unexpected Termination .................................... 65
LFSR ....................................................................... 215
Write Verify ........................................................ 65
MOVF ...................................................................... 215
G MOVFF .................................................................... 216
GOTO ............................................................................... 212 MOVLB .................................................................... 216
MOVLW ................................................................... 217
H MOVWF ................................................................... 217
Hardware Multiplier ............................................................ 71 MULLW .................................................................... 218
Introduction ................................................................ 71 MULWF .................................................................... 218
Operation ................................................................... 71 NEGF ....................................................................... 219
Performance Comparison .......................................... 71 NOP ......................................................................... 219
POP ......................................................................... 220
I PUSH ....................................................................... 220
I/O Ports ............................................................................. 87 RCALL ..................................................................... 221
ID Locations ............................................................. 171, 188 RESET ..................................................................... 221
INCF ................................................................................. 212 RETFIE .................................................................... 222
INCFSZ ............................................................................ 213 RETLW .................................................................... 222
In-Circuit Debugger .......................................................... 188 RETURN .................................................................. 223
In-Circuit Serial Programming (ICSP) ...................... 171, 188 RLCF ....................................................................... 223
Indirect Addressing ............................................................ 54 RLNCF ..................................................................... 224
INDF and FSR Registers ........................................... 53 RRCF ....................................................................... 224
Operation ................................................................... 53 RRNCF .................................................................... 225
Indirect Addressing Operation ............................................ 54 SETF ....................................................................... 225
Indirect File Operand .......................................................... 47 SLEEP ..................................................................... 226
INFSNZ ............................................................................ 213 SUBFWB ................................................................. 226
Initialization Conditions for All Registers ...................... 36–38 SUBLW .................................................................... 227
Instruction Cycle ................................................................. 45 SUBWF .................................................................... 227
Instruction Flow/Pipelining ................................................. 45 SUBWFB ................................................................. 228
Instruction Set .................................................................. 191 SWAPF .................................................................... 228
ADDLW .................................................................... 197 TBLRD ..................................................................... 229
ADDWF .................................................................... 197 TBLWT .................................................................... 230
ADDWFC ................................................................. 198 TSTFSZ ................................................................... 231
ANDLW .................................................................... 198 XORLW ................................................................... 231
ANDWF .................................................................... 199 XORWF ................................................................... 232
BC ............................................................................ 199 Summary Table ....................................................... 194
BCF .......................................................................... 200 INTCON Register
BN ............................................................................ 200 RBIF Bit ..................................................................... 90
BNC ......................................................................... 201 INTCON Registers ............................................................. 75
BNN ......................................................................... 201
BNOV ....................................................................... 202
BNZ .......................................................................... 202
BOV ......................................................................... 205

© 2007 Microchip Technology Inc. DS39605F-page 297

PIC18F1220/1320
Internal Oscillator Block ..................................................... 14 MPLAB PM3 Device Programmer ................................... 235
Adjustment ................................................................. 14 MPLAB REAL ICE In-Circuit Emulator System ................ 235
INTIO Modes .............................................................. 14 MPLINK Object Linker/MPLIB Object Librarian ............... 234
INTRC Output Frequency .......................................... 14 MULLW ............................................................................ 218
OSCTUNE Register ................................................... 14 MULWF ............................................................................ 218
Internal RC Oscillator
Use with WDT .......................................................... 180 N
Internet Address ............................................................... 302 NEGF ............................................................................... 219
Interrupt Sources .............................................................. 171 New Core Features
A/D Conversion Complete ........................................ 159 Multiple Oscillator Options and Features ..................... 5
Capture Complete (CCP) ......................................... 116 nanoWatt Technology .................................................. 5
Compare Complete (CCP) ....................................... 117 NOP ................................................................................. 219
Interrupt-on-Change (RB7:RB4) ................................ 90
INTn Pin ..................................................................... 85
O
PORTB, Interrupt-on-Change .................................... 85 Opcode Field Descriptions ............................................... 192
TMR0 ......................................................................... 85 OPTION_REG Register
TMR0 Overflow ........................................................ 101 PSA Bit .................................................................... 101
TMR1 Overflow ........................................................ 103 T0CS Bit .................................................................. 101
TMR2 to PR2 Match ................................................. 110 T0PS2:T0PS0 Bits ................................................... 101
TMR2 to PR2 Match (PWM) ............................ 109, 119 T0SE Bit ................................................................... 101
TMR3 Overflow ................................................ 111, 113 Oscillator Configuration ...................................................... 11
Interrupts ............................................................................ 73 Crystal/Ceramic Resonator ........................................ 11
Enable Bits EC .............................................................................. 11
(CCP1IE Bit) .................................................... 116 ECIO .......................................................................... 11
Flag Bits External Clock Input ................................................... 13
CCP1 Flag (CCP1IF Bit) .................................. 116 HS .............................................................................. 11
CCP1IF Flag (CCP1IF Bit) ............................... 117 HSPLL ..................................................................11, 12
Interrupt-on-Change (RB7:RB4) INTIO1 ....................................................................... 11
Flag (RBIF Bit) ........................................... 90 INTIO2 ....................................................................... 11
Logic ........................................................................... 74 LP .............................................................................. 11
INTOSC Frequency Drift .................................................... 30 RC .........................................................................11, 13
IORLW ............................................................................. 214 RCIO .......................................................................... 11
IORWF ............................................................................. 214 XT .............................................................................. 11
IPR Registers ..................................................................... 82 Oscillator Selection .......................................................... 171
Oscillator Start-up Timer (OST) ............................18, 34, 171
L Oscillator Switching ............................................................ 15
LFSR ................................................................................ 215 Oscillator Transitions ......................................................... 18
Low-Voltage Detect .......................................................... 165 Oscillator, Timer1 ......................................................103, 113
Characteristics ......................................................... 253 Oscillator, Timer3 ............................................................. 111
Effects of a Reset ..................................................... 169 Other Special Features ........................................................ 5
Operation ................................................................. 168
Current Consumption ....................................... 169
P
Reference Voltage Set Point ............................ 169 Packaging ........................................................................ 285
Operation During Sleep ............................................ 169 Details ...................................................................... 286
LVD. See Low-Voltage Detect. ........................................ 165 Marking Information ................................................. 285
PICSTART Plus Development Programmer .................... 236
M PIE Registers ..................................................................... 80
Memory Organization ......................................................... 41 Pin Functions
Data Memory .............................................................. 47 MCLR/Vpp/RA5 ........................................................... 8
Program Memory ....................................................... 41 OSC1/CLKI/RA7 .......................................................... 8
Memory Programming Requirements .............................. 252 OSC2/CLKO/RA6 ........................................................ 8
Microchip Internet Web Site ............................................. 302 RA0/AN0 ...................................................................... 8
Migration from Baseline to Enhanced Devices ................ 292 RA1/AN1/LVDIN .......................................................... 8
Migration from High-End to Enhanced Devices ............... 293 RA2/AN2/Vref- ............................................................. 8
Migration from Mid-Range to Enhanced Devices ............. 293 RA3/AN3/VREF+ ........................................................... 8
MOVF ............................................................................... 215 RA4/T0CKI ................................................................... 8
MOVFF ............................................................................. 216 RB0/AN4/INT0 ............................................................. 9
MOVLB ............................................................................. 216 RB1/AN5/TX/CK/INT1 ................................................. 9
MOVLW ............................................................................ 217 RB2/P1B/INT2 ............................................................. 9
MOVWF ........................................................................... 217 RB3/CCP1/P1A ........................................................... 9
MPLAB ASM30 Assembler, Linker, Librarian .................. 234 RB4/AN6/RX/DT/KBI0 ................................................. 9
MPLAB ICD 2 In-Circuit Debugger ................................... 235 RB5/PGM/KBI1 ............................................................ 9
MPLAB ICE 2000 High-Performance RB6/PGC/T1OSO/T13CKI/P1C/KBI2 .......................... 9
Universal In-Circuit Emulator ................................... 235 RB7/PGD/T1OSI/P1D/KBI3 ......................................... 9
MPLAB Integrated Development Vdd .............................................................................. 9
Environment Software .............................................. 233 Vss ............................................................................... 9

DS39605F-page 298 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
Pinout I/O Descriptions Duty Cycle ............................................................... 119
PIC18F1220/1320 ........................................................ 8 Example Frequencies/Resolutions .......................... 119
PIR Registers ..................................................................... 78 Period ...................................................................... 119
PLL Lock Time-out ............................................................. 34 TMR2 to PR2 Match .........................................109, 119
Pointer, FSR ....................................................................... 53 PWM (ECCP Module) ...................................................... 119
POP .................................................................................. 220 Associated Registers ............................................... 130
POR. See Power-on Reset. Direction Change in Full-Bridge Output Mode ......... 124
PORTA Effects of a Reset .................................................... 129
Associated Registers ................................................. 89 Enhanced PWM Auto-Shutdown ............................. 126
Functions ................................................................... 89 Full-Bridge Application Example .............................. 124
LATA Register ............................................................ 87 Full-Bridge PWM Output (Active-High) Diagram ..... 123
PORTA Register ........................................................ 87 Half-Bridge Output (Active-High) Diagram ............... 122
TRISA Register .......................................................... 87 Half-Bridge Output Mode Applications Example ...... 122
PORTB Operation in Low-Power Modes .............................. 129
Associated Registers ................................................. 98 Output Configurations .............................................. 119
Functions ................................................................... 98 Output Relationships (Active-High) .......................... 120
LATB Register ............................................................ 90 Output Relationships (Active-Low) .......................... 121
PORTB Register ........................................................ 90 Programmable Dead-Band Delay ............................ 126
RB7:RB4 Interrupt-on-Change Flag PWM Direction Change (Active-High) Diagram ....... 125
(RBIF Bit) ........................................................... 90 PWM Direction Change at Near
TRISB Register .......................................................... 90 100% Duty Cycle (Active-High) Diagram ......... 125
Postscaler Setup for PWM Operation ........................................ 129
Timer2 ...................................................................... 109 Start-up Considerations ........................................... 128
WDT
Assignment (PSA Bit) ...................................... 101 Q
Rate Select (T0PS2:T0PS0 Bits) ..................... 101 Q Clock ............................................................................ 119
Power Managed Modes ..................................................... 19
Comparison between Run and Idle Modes ................ 20
R
Entering ...................................................................... 20 RAM. See Data Memory.
Idle Modes ................................................................. 21 RCALL ............................................................................. 221
Multiple Sleep Commands ......................................... 20 RCIO Oscillator .................................................................. 13
Run Modes ................................................................. 26 RCON Register
Selecting .................................................................... 19 Bit Status During Initialization .................................... 35
Sleep Mode ................................................................ 21 RCSTA Register
Summary (table) ........................................................ 19 SPEN Bit .................................................................. 131
Wake from .................................................................. 28 Reader Response ............................................................ 303
Power-on Reset (POR) .............................................. 34, 171 Register File ....................................................................... 47
Power-up Delays ................................................................ 18 Register File Summary .................................................50–51
Power-up Timer (PWRT) .......................................18, 34, 171 Registers
Prescaler ADCON0 (A/D Control 0) ......................................... 155
Capture .................................................................... 117 ADCON1 (A/D Control 1) ......................................... 156
Timer0 ...................................................................... 101 ADCON2 (A/D Control 2) ......................................... 157
Assignment (PSA Bit) ...................................... 101 BAUDCTL (Baud Rate Control) ............................... 134
Rate Select (T0PS2:T0PS0 Bits) ..................... 101 CCP1CON (Enhanced CCP1 Control) .................... 115
Timer2 ...................................................................... 119 CONFIG1H (Configuration 1 High) .......................... 172
Product Identification System ........................................... 304 CONFIG2H (Configuration 2 High) .......................... 174
Program Counter CONFIG2L (Configuration 2 Low) ........................... 173
PCL Register .............................................................. 44 CONFIG3H (Configuration 3 High) .......................... 175
PCLATH Register ...................................................... 44 CONFIG4L (Configuration 4 Low) ........................... 175
PCLATU Register ...................................................... 44 CONFIG5H (Configuration 5 High) .......................... 176
Program Memory CONFIG5L (Configuration 5 Low) ........................... 176
Instructions in ............................................................. 46 CONFIG6H (Configuration 6 High) .......................... 177
Interrupt Vector .......................................................... 41 CONFIG6L (Configuration 6 Low) ........................... 177
Map and Stack for PIC18F1220 ................................. 41 CONFIG7H (Configuration 7 High) .......................... 178
Map and Stack for PIC18F1320 ................................. 41 CONFIG7L (Configuration 7 Low) ........................... 178
Reset Vector .............................................................. 41 DEVID1 (Device ID 1) .............................................. 179
Program Verification and Code Protection ....................... 185 DEVID2 (Device ID 2) .............................................. 179
Associated Registers ............................................... 185 ECCPAS (ECCP Auto-Shutdown Control) .............. 127
Configuration Register ............................................. 188 EECON1 (Data EEPROM Control 1) ....................59, 68
Data EEPROM ......................................................... 188 INTCON (Interrupt Control) ........................................ 75
Program Memory ..................................................... 186 INTCON2 (Interrupt Control 2) ................................... 76
Programming, Device Instructions ................................... 191 INTCON3 (Interrupt Control 3) ................................... 77
PUSH ............................................................................... 220 IPR1 (Peripheral Interrupt Priority 1) ......................... 82
PUSH and POP Instructions .............................................. 43 IPR2 (Peripheral Interrupt Priority 2) ......................... 83
PWM (CCP Module) LVDCON (LVD Control) ........................................... 167
CCPR1H:CCPR1L Registers ................................... 119 OSCCON (Oscillator Control) .................................... 17

© 2007 Microchip Technology Inc. DS39605F-page 299

PIC18F1220/1320
OSCTUNE (Oscillator Tuning) ................................... 15 Timer1 .............................................................................. 103
PIE1 (Peripheral Interrupt Enable 1) .......................... 80 16-Bit Read/Write Mode .......................................... 106
PIE2 (Peripheral Interrupt Enable 2) .......................... 81 Associated Registers ............................................... 108
PIR1 (Peripheral Interrupt Request (Flag) 1) ............. 78 Interrupt ................................................................... 106
PIR2 (Peripheral Interrupt Request (Flag) 2) ............. 79 Operation ................................................................. 104
PWM1CON (PWM Configuration) ............................ 126 Oscillator ...........................................................103, 105
RCON (Reset Control) ......................................... 56, 84 Layout Considerations ..................................... 106
RCSTA (Receive Status and Control) ...................... 133 Overflow Interrupt .................................................... 103
Status ......................................................................... 55 Resetting, Using a Special Event Trigger
STKPTR (Stack Pointer) ............................................ 43 Output (CCP) ................................................... 106
T0CON (Timer0 Control) ............................................ 99 Special Event Trigger (CCP) ................................... 117
T1CON (Timer 1 Control) ......................................... 103 TMR1H Register ...................................................... 103
T2CON (Timer 2 Control) ......................................... 109 TMR1L Register ....................................................... 103
T3CON (Timer3 Control) .......................................... 111 Use as a Real-Time Clock ....................................... 107
TXSTA (Transmit Status and Control) ..................... 132 Timer2 .............................................................................. 109
WDTCON (Watchdog Timer Control) ....................... 180 Associated Registers ............................................... 110
RESET ............................................................................. 221 Operation ................................................................. 109
Reset .......................................................................... 33, 171 Output ...................................................................... 110
RETFIE ............................................................................ 222 Postscaler. See Postscaler, Timer2.
RETLW ............................................................................. 222 PR2 Register ....................................................109, 119
RETURN .......................................................................... 223 Prescaler. See Prescaler, Timer2.
Return Address Stack ........................................................ 42 TMR2 Register ......................................................... 109
and Associated Registers .......................................... 42 TMR2 to PR2 Match Interrupt ...................109, 110, 119
Return Stack Pointer (STKPTR) ........................................ 42 Timer3 .............................................................................. 111
Revision History ............................................................... 291 Associated Registers ............................................... 113
RLCF ................................................................................ 223 Operation ................................................................. 112
RLNCF ............................................................................. 224 Oscillator ...........................................................111, 113
RRCF ............................................................................... 224 Overflow Interrupt .............................................111, 113
RRNCF ............................................................................. 225 Special Event Trigger (CCP) ................................... 113
TMR3H Register ...................................................... 111
S TMR3L Register ....................................................... 111
SETF ................................................................................ 225 Timing Diagrams
SLEEP .............................................................................. 226 A/D Conversion ........................................................ 265
Sleep Asynchronous Reception ......................................... 144
OSC1 and OSC2 Pin States ...................................... 18 Asynchronous Transmission .................................... 141
Software Simulator (MPLAB SIM) .................................... 234 Asynchronous Transmission (Back to Back) ........... 142
Special Event Trigger. See Compare Auto-Wake-up Bit (WUE) During
Special Features of the CPU ............................................ 171 Normal Operation ............................................ 145
Configuration Registers .................................... 172–178 Auto-Wake-up Bit (WUE) During Sleep ................... 145
Special Function Registers ................................................ 49 Brown-out Reset (BOR) ........................................... 260
Map ............................................................................ 49 Capture/Compare/PWM (All CCP Modules) ............ 262
Stack Full/Underflow Resets .............................................. 43 CLKO and I/O .......................................................... 259
SUBFWB .......................................................................... 226 Clock/Instruction Cycle .............................................. 45
SUBLW ............................................................................ 227 EUSART Synchronous Receive
SUBWF ............................................................................ 227 (Master/Slave) ................................................. 264
SUBWFB .......................................................................... 228 EUSART SynchronousTransmission
SWAPF ............................................................................ 228 (Master/Slave) ................................................. 263
External Clock (All Modes Except PLL) ................... 257
T Fail-Safe Clock Monitor ........................................... 183
TABLAT Register ............................................................... 60 Low-Voltage Detect ................................................. 168
Table Pointer Operations (table) ........................................ 60 Low-Voltage Detect Characteristics ......................... 253
TBLPTR Register ............................................................... 60 PWM Auto-Shutdown (PRSEN = 0,
TBLRD ............................................................................. 229 Auto-Restart Disabled) .................................... 128
TBLWT ............................................................................. 230 PWM Auto-Shutdown (PRSEN = 1,
Time-out Sequence ............................................................ 34 Auto-Restart Enabled) ..................................... 128
Timer0 ................................................................................ 99 Reset, Watchdog Timer (WDT), Oscillator Start-up
16-Bit Mode Timer Reads and Writes ...................... 101 Timer (OST) and Power-up Timer (PWRT) ..... 260
Associated Registers ............................................... 101 Send Break Character Sequence ............................ 147
Clock Source Edge Select (T0SE Bit) ...................... 101 Slow Rise Time (MCLR Tied to VDD,
Clock Source Select (T0CS Bit) ............................... 101 VDD Rise > TPWRT) ............................................ 40
Operation ................................................................. 101 Synchronous Reception
Overflow Interrupt ..................................................... 101 (Master Mode, SREN) ..................................... 150
Prescaler. See Prescaler, Timer0. Synchronous Transmission ..................................... 148
Switching Prescaler Assignment .............................. 101 Synchronous Transmission (Through TXEN) .......... 149

DS39605F-page 300 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
Time-out Sequence on POR w/PLL Enabled Top-of-Stack Access .......................................................... 42
(MCLR Tied to VDD) ........................................... 40 TSTFSZ ........................................................................... 231
Time-out Sequence on Power-up Two-Speed Start-up ..................................................171, 181
(MCLR Not Tied to Vdd), Case 1 ....................... 39 Two-Word Instructions ....................................................... 46
Time-out Sequence on Power-up Example Cases .......................................................... 46
(MCLR Not Tied to Vdd), Case 2 ....................... 39 TXSTA Register
Time-out Sequence on Power-up BRGH Bit ................................................................. 135
(MCLR Tied to Vdd, Vdd Rise pwrt) ................... 39
Timer0 and Timer1 External Clock .......................... 261 W
Transition for Entry to SEC_IDLE Mode .................... 24 Watchdog Timer (WDT) ............................................171, 180
Transition for Entry to SEC_RUN Mode .................... 26 Associated Registers ............................................... 181
Transition for Entry to Sleep Mode ............................ 22 Control Register ....................................................... 180
Transition for Two-Speed Start-up During Oscillator Failure .......................................... 182
(INTOSC to HSPLL) ......................................... 181 Programming Considerations .................................. 180
Transition for Wake from PRI_IDLE Mode ................. 23 WWW Address ................................................................ 302
Transition for Wake from RC_RUN Mode WWW, On-Line Support ...................................................... 4
(RC_RUN to PRI_RUN) ..................................... 25
Transition for Wake from SEC_RUN Mode
X
(HSPLL) ............................................................. 24 XORLW ............................................................................ 231
Transition for Wake from Sleep (HSPLL) ................... 22 XORWF ........................................................................... 232
Transition to PRI_IDLE Mode .................................... 23
Transition to RC_IDLE Mode ..................................... 25
Transition to RC_RUN Mode ..................................... 27
Timing Diagrams and Specifications ................................ 257
Capture/Compare/PWM Requirements
(All CCP Modules) ........................................... 263
CLKO and I/O Requirements ................................... 259
EUSART Synchronous Receive Requirements ....... 264
EUSART Synchronous
Transmission Requirements ............................ 263
External Clock Requirements .................................. 257
Internal RC Accuracy ............................................... 258
PLL Clock, HS/HSPLL Mode
(VDD = 4.2V to 5.5V) ........................................ 258
Reset, Watchdog Timer, Oscillator
Start-up Timer, Power-up Timer and
Brown-out Reset Requirements ....................... 261
Timer0 and Timer1 External Clock
Requirements ................................................... 262

© 2007 Microchip Technology Inc. DS39605F-page 301

PIC18F1220/1320
NOTES:

DS39605F-page 302 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
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© 2007 Microchip Technology Inc. DS39605F-page 303

PIC18F1220/1320
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
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Device: PIC18F1220/1320 Literature Number: DS39605F

Questions:

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7. How would you improve this document?

DS39605F-page 304 © 2007 Microchip Technology Inc.

 PIC18F1220/1320
PIC18F1220/1320 PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. − X /XX XXX
Examples:
Device Temperature Package Pattern a) PIC18LF1320-I/P 301 = Industrial
Range
temp., PDIP package, Extended
VDD limits, QTP pattern #301.
Device PIC18F1220/1320(1), b) PIC18LF1220-I/SO = Industrial
PIC18F1220/1320T(2); temp., SOIC package, Extended
VDD range 4.2V to 5.5V VDD limits.

PIC18LF1220/1320(1),
PIC18LF1220/1320T(2);
VDD range 2.5V to 5.5V

Temperature I = -40°C to +85°C (Industrial) Note 1: F = Standard Voltage range

Range E = -40°C to +125°C (Extended) LF = Wide Voltage Range
2: T = in tape and reel – SOIC
Package SO = SOIC SS = SSOP package only
P = PDIP ML = QFN

Pattern QTP, SQTP, Code or Special Requirements

(blank otherwise)

© 2007 Microchip Technology Inc. DS39605F-page 305

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