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Chap 13a - Testing (Wafer Sorting)

This document discusses semiconductor wafer testing and sorting. It begins by explaining that after wafer fabrication, each die must be electrically tested for functionality to assess yield, product performance, and quality assurance. It then describes how process control monitors (PCMs) are used to test parameters and detect defects like shorts and opens. The testing sequence involves first screening PCMs, then functional testing of each die using automated test equipment to measure results and identify failures. Wafer sorting involves marking defective dies and discarding them during separation.

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156 views

Chap 13a - Testing (Wafer Sorting)

This document discusses semiconductor wafer testing and sorting. It begins by explaining that after wafer fabrication, each die must be electrically tested for functionality to assess yield, product performance, and quality assurance. It then describes how process control monitors (PCMs) are used to test parameters and detect defects like shorts and opens. The testing sequence involves first screening PCMs, then functional testing of each die using automated test equipment to measure results and identify failures. Wafer sorting involves marking defective dies and discarding them during separation.

Uploaded by

soonvy
Copyright
© Attribution Non-Commercial (BY-NC)
Available Formats
Download as PDF, TXT or read online on Scribd
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10/7/2010

EBB 323 Semiconductor


Fabrication Technology
Testing (wafer sorting)

Dr. Pung Swee Yong


School of Materials & Mineral Resources Engineering
Universiti Sains Malaysia

Topics Outcome
 At the end of the lecture, student will be able:
 To explain the purposes of electrical testing
and test structures

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10/7/2010

Introduction

 After wafer fabrication, each of the


die need to be electrically tested for
functionality
functionality.

(i) Mechanism for assessing IC yield


(ii) Indicator of product performance
(iii) Quality Assurance – checked at
various stages of manufacturing
through in-line measurement on
test structures

After wafer fabrication,


 Special parametric test dies
are placed at a number of
sites on the wafer.
 Process Control Monitors
(PCMs)
 In product wafers
 In die sites or
 In the scribe lines between
dies.

Configuration of products and PCMs on a typical semiconductor wafer.

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10/7/2010

 PCMs can be
 Single transistors
 Single lines of conducting materials
 MOS capacitors
it
 Interconnect monitors
 Able to inferred by the presence of short circuits or open
circuits using simple resistance measurement.

Purpose of PCMs
To assess impact of the presence of defects on semiconductor wafer.

Configuration of products and PCMs on a typical


semiconductor wafer.

Meander structure Double-comb structure Comb-Meander-Comb


(detection of open circuits) (detection of short circuits) Structure
(shorts + opens circuits)

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10/7/2010

Testing sequence
 testing sequence:
(i) Screening test on process control module
(PCM)
(ii) Functional test on each die

Screening test
 DC tests are performed to verify that basic process
parameters fall within acceptable limits.
 Very fine needle probes are contacted with the pads on
the test die (PCM).
 If the device parameters are within specification,
functional testing of each die begins

 Functional testing (Final testing)


 To ensure all products perform to the specification for which
they were designed.
 Automated test equipment (ATE)
 Measure + record the results
 3 major functions:
 Input pattern generation
 Pattern application
 Output response detection
 Expression of test results
 Shmoo Plot
 Cell map.

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10/7/2010

Example of two-dimensional voltage shmoo plot for a bipolar IC.

Cell map showing example of failure patterns and defect types.

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10/7/2010

After wafer sorting,

 defective dies are marked with a drop of ink

 when the dies are separated from the wafer,


any die with an ink spot is discarded

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