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Ic Technology Course

This course covers the fabrication process of integrated circuits including bipolar and MOS transistors, with modules focusing on steps like thermal oxidation, photolithography, diffusion, etching, and deposition, with the goal of building knowledge of IC technology to prepare students for courses in VLSI design and analog CMOS IC design. The course is taught through theory and assesses students with a mid-term exam, seminar, homework, attendance, and an end-term examination.

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Tara Gonzales
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135 views

Ic Technology Course

This course covers the fabrication process of integrated circuits including bipolar and MOS transistors, with modules focusing on steps like thermal oxidation, photolithography, diffusion, etching, and deposition, with the goal of building knowledge of IC technology to prepare students for courses in VLSI design and analog CMOS IC design. The course is taught through theory and assesses students with a mid-term exam, seminar, homework, attendance, and an end-term examination.

Uploaded by

Tara Gonzales
Copyright
© © All Rights Reserved
Available Formats
Download as PDF, TXT or read online on Scribd
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L T P/ SW/F TOTAL

Course Title: IC Technology S W CREDIT


Course Code: ECE431 UNITS
Credit Units: 3
Level: UG 3 0 0 0 3

Course Objectives: This course builds for knowledge of about the fabrication of BJT and MOSFET transistors. Fabrication steps to understand VLSI design
Process & Technology. This course builds a foundation for courses on VLSI design and analog CMOS IC Design to expose students to the complexities and
design methodologies of current and advanced IC design technologies for Post-graduation courses.
Prerequisites: NIL
Course Contents / Syllabus:
Module I 30% Weightage
 Introduction to Monolithic Integrated circuit technology
 Bipolar & MOS IC
 CMOS fabrication, the p-well process, n-well process.
 Silicon wafer preparation & characteristics
 Thermal oxidation, Oxidation system
 Photolithography
Module II 40% Weightage
 Diffusion of dopants, Dopant profiles
 Ion implantation
 Epitaxy, Epitaxial growth of Si
 Etching, Properties of etch processing.
 Dielectric and Polysilicon Film Deposition, Deposition process
 Future Trends
Module III 30% Weightage
 MOS Structure, MOS system under external bias
 Structure & operation of MOSFET, Enhancement mode & Depletion mode devices
 I-V characteristics
 MOSFET scaling
 CMOS technology, BICMOS technology.
Pedagogy for Course Delivery:
The class will be taught using theory only. There is no lab related to this course as it is a open elective course. The instructor will cover all the steps of how an
IC is fabricated.
Student Learning Outcomes:
 Describe the importance of integrated circuits and apply their applications in modern society
 Describe the wafer fabrication process
 Describe the structure and operation of MOSFETs

Assessment/ Examination Scheme:


Theory L/T (%) Lab/Practical/Studio (%) End Term Examination

100% NA 100%

Theory Assessment (L&T):


Continuous Assessment/Internal Assessment End Term
Examination
Components
(Drop down)
Mid-Term Seminar/Viva/Quiz Home Attendance
Exam Assignment

Weightage (%) 10% 8% 7% 5% 70%

Text:
 Basic VLSI Design ,D.A Pucknell & Eshraghain , PHI, ISBN: 9780130909961
 Introduction to VLSI Design and technology by J. N. Roy & D. N. Bose ( New Age International ( P) Limited, ISBN: 9788122430646
 VLSI technology, S. M. Sze ( E d.) ,M. Hill.1988, ISBN: 0070582912
 VLSI Design techniques for Analog and Digital Circuits, Randall L. Geiger, Phillip E. Allen, Noel R Strader, McGraw-Hill Publishing
company, ISBN 0-07-023253-1

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