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SIM7000 _Hardware Design_V1.05

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 Smart Machine Smart Decision

Document Title SIM7000 _Hardware Design

Version 1.05

Date 2018-12-24

Status Released

Document Control ID SIM7000 _ Hardware Design_V1.05

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General Notes
SIMCom offers this information as a service to its customers to support the application and
engineering efforts that use the products designed by SIMCom. The information provided is based

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on the requirements specifically from the customers. SIMCom has not undertaken any independent
search for additional relevant information, including any information that may be in the customer’s
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possession. Furthermore, the system validation of the product designed by SIMCom within a larger
electronic system remains the responsibility of the customer or the customer’s system integrator.
All specifications supplied herein are subject to change without notice.
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Copyright
This document contains the proprietary technical information which is the property of SIMCom
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Limited, copying of this document, giving it to others, the using or communication of the contents
thereof are forbidden without the official authority by SIMCom. Offenders are liable to the
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payment of the damages. All rights are reserved in the event of grant of a patent or the registration
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of a utility model or design. All specifications supplied herein are subject to change without notice

Copyright © SIMCom Wireless Solutions Co., Ltd. 2018

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Contents

Contents ............................................................................................................................................. 3

Table Index ........................................................................................................................................ 5

Figure Index ...................................................................................................................................... 7

Revision History ................................................................................................................................ 8

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1 Introduction ................................................................................................................................ 9
1.1 Product Outline ................................................................................................................... 10
1.2 Hardware Interface Overview ............................................................................................. 12

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1.3 Hardware Block Diagram.................................................................................................... 13
1.4 Functional Overview ........................................................................................................... 14

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2 Package Information ............................................................................................................... 16
2.1 Pin Assignment Overview ................................................................................................... 16
2.2 Pin Description .................................................................................................................... 18

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2.3 Mechanical Information ...................................................................................................... 21
2.4 Footprint Recommendation ................................................................................................. 22
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3 Interface Application ............................................................................................................... 23
3.1 Power Supply ...................................................................................................................... 23
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3.1.1 Power Supply Design Guide ........................................................................................ 24
3.1.2 Recommended Power Supply Circuit .......................................................................... 24
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3.1.3 Voltage Monitor ............................................................................................................ 25

3.2 Power on/Power off/Reset Function.................................................................................... 26
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3.2.1 Power on....................................................................................................................... 26

3.2.2 Power off ...................................................................................................................... 27
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3.2.3 Reset Function .............................................................................................................. 29

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3.3 UART Interface ................................................................................................................... 30

3.3.1 UART Design Guide .................................................................................................... 30
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3.3.2 RI and DTR Behavior................................................................................................... 31

3.4 USB Interface ...................................................................................................................... 32
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3.5 SIM Interface ...................................................................................................................... 33

3.5.1 SIM Application Guide ................................................................................................ 34
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3.6 PCM Interface ..................................................................................................................... 35

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3.6.1 PCM timing .................................................................................................................. 35

3.6.2 PCM Application Guide ............................................................................................... 37
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3.7 I2C Interface ....................................................................................................................... 37

3.8 Network status..................................................................................................................... 38
3.9 Other interface ..................................................................................................................... 39
3.9.1 ADC ............................................................................................................................. 39
3.9.2 LDO.............................................................................................................................. 39

4 RF Specifications ...................................................................................................................... 40
4.1 GSM/LTE RF Specifications............................................................................................... 40
4.2 GSM/LTE Antenna Design Guide ....................................................................................... 43
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4.3 GNSS .................................................................................................................................. 44
4.3.1 GNSS Technical specification ...................................................................................... 44
4.3.2 GNSS Application Guide ............................................................................................. 44
4.4 RF traces note...................................................................................................................... 46
4.4.1 RF traces layout ................................................................................................................ 46
4.4.2 LTE ANT and other system ANT decoupling ................................................................... 47

5 Electrical Specifications ........................................................................................................... 48

5.1 Absolute maximum ratings ................................................................................................. 48

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5.2 Operating conditions ........................................................................................................... 49
5.3 Operating Mode .................................................................................................................. 50
5.3.1 Operating Mode Definition .......................................................................................... 50

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5.3.2 Sleep mode ................................................................................................................... 51
5.3.3 Minimum functionality mode and Flight mode............................................................ 51

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5.3.4 Power Saving Mode (PSM) .......................................................................................... 51
5.4 Current Consumption .......................................................................................................... 53
5.5 ESD Notes ........................................................................................................................... 55

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6 SMT Production Guide ........................................................................................................... 56
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6.1 Top and Bottom View of SIM7000 ..................................................................................... 56
6.2 Label Information................................................................................................................ 57
6.3 Typical SMT Reflow Profile ............................................................................................... 58
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6.4 Moisture Sensitivity Level (MSL) ...................................................................................... 59
6.5 Baking ................................................................................................................................. 60
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6.6 Stencil Foil Design Recommendation ................................................................................. 61

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7 Packaging .................................................................................................................................. 62
7.1 Tray packaging .................................................................................................................... 62
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Appendix .......................................................................................................................................... 65
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A. Reference Design...................................................................................................................... 65
B. Design check list ....................................................................................................................... 65
C. Coding Schemes and Maximum Net Data Rates over Air Interface.........................................68
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D. Related Documents ................................................................................................................... 69

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E. Terms and Abbreviations .......................................................................................................... 71

F. Safety Caution ........................................................................................................................... 73
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Table Index
Table 1: SIM7000 frequency bands and air interface ......................................................................................... 10
Table 2: General features ................................................................................................................................... 14
Table 3: Pin definition ........................................................................................................................................ 17
Table 4: IO parameters definition....................................................................................................................... 18
Table 5: Pin description...................................................................................................................................... 18
Table 6: VBAT pins electronic characteristic ..................................................................................................... 23

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Table 7: Recommended TVS diode list .............................................................................................................. 24
Table 8: Power on timing and electronic characteristic ...................................................................................... 26
Table 9: Power off timing and electronic characteristic ..................................................................................... 28

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Table 10: RESET pin electronic characteristic ................................................................................................... 29
Table 11: UART electronic characteristic .......................................................................................................... 31

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Table 12: SIM electronic characteristic in 1.8V mode (SIM_VDD=1.8V) ........................................................ 33
Table 13: SIM electronic characteristic 3.0V mode (SIM_VDD=2.95V) .......................................................... 33
Table 14: PCM format ....................................................................................................................................... 35

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Table 15: PCM timing parameters ..................................................................................................................... 36
Table 16: NETLIGHT pin status ........................................................................................................................ 38
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Table 17: ADC electronic characteristics ........................................................................................................... 39
Table 18: Electronic characteristic ..................................................................................................................... 39
Table 19: Conducted transmission power .......................................................................................................... 40
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Table 20: Maximum Power Reduction (MPR) for UE category NB1 Power Class 3 ........................................ 40
Table 21: Operating frequencies ........................................................................................................................ 41
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Table 22: E-UTRA operating bands ................................................................................................................... 41

Table 23: Conducted receive sensitivity ............................................................................................................. 41
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Table 24: CAT-M1 Reference sensitivity (QPSK).............................................................................................. 42

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Table 25: CAT-NB1 Reference sensitivity (QPSK)............................................................................................ 42

Table 26: Trace loss ........................................................................................................................................... 43
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Table 27: Recommended TVS ........................................................................................................................... 43

Table 28: Absolute maximum ratings................................................................................................................. 48
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Table 29: Recommended operating ratings ........................................................................................................ 49

Table 30: 1.8V Digital I/O characteristics* ........................................................................................................ 49
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Table 31: Operating temperature ........................................................................................................................ 49

Table 32: Operating mode Definition................................................................................................................. 50
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Table 33: Current consumption on VBAT Pins (VBAT=3.8V) .......................................................................... 53

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Table 34: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%.) ............................ 55
Table 35: The description of label information .................................................................................................. 57
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Table 36: Moisture Sensitivity Level and Floor Life ......................................................................................... 59

Table 37: Baking conditions............................................................................................................................... 60
Table 38: Tray size ............................................................................................................................................. 63
Table 39: Small Carton size ............................................................................................................................... 63
Table 40: Big Carton size ................................................................................................................................... 64
Table 41: Schematic Check List ......................................................................................................................... 65
Table 42: PCB Layout Check List...................................................................................................................... 66
Table 43: Coding Schemes and Maximum Net Data Rates over Air Interface ................................................... 68

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Table 44: Related Documents ............................................................................................................................ 69
Table 45: Terms and Abbreviations .................................................................................................................... 71
Table 46: Safety Caution .................................................................................................................................... 73

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Figure Index
Figure 1: SIM7000 block diagram ..................................................................................................................... 13
Figure 2: Pin assignment overview .................................................................................................................... 16
Figure 3: Dimensions (Unit: mm) ...................................................................................................................... 21
Figure 4: Footprint recommendation (Unit: mm) ............................................................................................... 22
Figure 5: VBAT voltage drop during burst emission (EDGE/GPRS) ................................................................ 23
Figure 6: Power supply application circuit......................................................................................................... 24

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Figure 7: Linear regulator reference circuit ....................................................................................................... 25
Figure 8: power supply reference circuit (NB only) .......................................................................................... 25
Figure 9: Reference power on/off circuit ........................................................................................................... 26

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Figure 10: Power on timing sequence ................................................................................................................ 26
Figure 11: Power off timing sequence................................................................................................................ 28

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Figure 12: Reference reset circuit ...................................................................................................................... 29
Figure 13: UART full modem ............................................................................................................................ 30
Figure 14: UART null modem ........................................................................................................................... 31

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Figure 15: Reference circuit of level shift .......................................................................................................... 31
Figure 16: RI behaviour（SMS and URC report） ........................................................................................... 31
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Figure 17: USB reference circuit ....................................................................................................................... 32
Figure 18: SIM interface reference circuit ......................................................................................................... 34
Figure 19: PCM_SYNC timing.......................................................................................................................... 35
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Figure 20: External codec to module timing ...................................................................................................... 35
Figure 21: Module to external codec timing ...................................................................................................... 36
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Figure 22: Audio codec reference circuit ........................................................................................................... 37

Figure 23: I2C reference circuit ......................................................................................................................... 37
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Figure 24: NETLIGHT reference circuit............................................................................................................ 38

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Figure 25：Power on sequence of the VDD_EXT ............................................................................................ 39

Figure 26: Antenna matching circuit (MAIN_ANT).......................................................................................... 43
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Figure 27: Active antenna circuit ....................................................................................................................... 44

Figure 28: Passive antenna circuit (Default) ...................................................................................................... 45
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Figure 29: RF trace should be far away from other high speed signal lines ....................................................... 46
Figure 30: The distance between GND to the inner conductor of SMA............................................................. 47
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Figure 31: e-DRX diagrammatic sketch................................................................................ 错误!未定义书签。

Figure 32: Top and bottom view of SIM7000 .................................................................................................... 56
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Figure 33: Label information ............................................................................................................................. 57

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Figure 34: The ramp-soak-spike reflow profile of SIM7000 ............................................................................. 58

Figure 33: stencil recommendation (Unit: mm) ................................................................................................. 61
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Figure 35: packaging diagram............................................................................................................................ 62

Figure 36: Tray drawing..................................................................................................................................... 62
Figure 37: Small carton drawing ........................................................................................................................ 63
Figure 38: Big carton drawing ........................................................................................................................... 63
Figure 39: Reference design .............................................................................................................................. 65

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Revision History

Data Version Description of change Author

Tu Hongjun
2017-05-23 1.00 Original
Li Ya

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1. Update the data of Table 1, Table 23 and Table 24
2017-07-13 1.01 Li Ya
2. Update figure 3 and figure 4

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1. Update the description of RI and DTR.
2. Update the description of voltage monitor.
3. Update the description of power off function.

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4. Update the description of the remarks of some
nonsupport function in existing software, such as PCM,
2017-08-29 1.02 I2C, SIM_DET. Tu Hongjun
5. Update the mechanical information.

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6. Update the data of Table 1.
7. Update the data of Table 32.
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8. Add ESD testing condition.

2017-09-18 1.03 Update the data of Table 32. Tu Hongjun

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1. Change the description GSM to GPRS and EDGE.

2. Update the table related documents.
3. Update the picture block diagram.
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4. Update the picture Pin assignment overview.

5. Add comment for Galileo. Tu Hongjun
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2018-1-31 V1.04
6. Delete the recommended type of SIM card socket. Li ya
7. Update the baking information.
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8. Add the PSM and e-DRX information.

9. Add the design check list information.
10. Add the table 41and table 42
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Tu Hongjun
2018-12-24 V1.05 e-DRX Update
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SIM7000 _Hardware Design _V1.05 2018-12-24

 1 Introduction

This document describes the electronic specifications, RF specifications, interfaces, mechanical

characteristics and testing results of the SIMCom SIM7000 series module. With the help of this
document and other SIM7000 series software application notes/user guides, users can understand
and use SIM7000 series module to design and develop applications quickly.

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1.1 Product Outline

The SIM7000 series modules support LTE CAT-M1、 LTE CAT-NB1、GPRS and EDGE.
The physical dimension of SIM7000 is 24 × 24 × 2.6mm mm. And the physical dimension is
compatible with the packaging of SIM900, SIM800 and SIM800F.

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Table 1: SIM7000 frequency bands and air interface

Variants

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Standard Frequency SIM7000 SIM7000 SIM7000 SIM7000 SIM7000 SIM7000 SIM7000
A C E JC C-N E-N G

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GSM850MHz 
EGSM900MHz   
GPRS
DCS1800MHz

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  
PCS1900MHz EN 
LTE-FDD B1    
LTE-FDD B2  
LTE-FDD B3      
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LTE-FDD B4  
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LTE-FDD B5    
LTE-FDD B8      
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LTE-FDD B12  
LTE-FDD
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LTE-FDD B13  
HD-FDD
LTE-FDD B18  
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LTE-FDD B19  
LTE-FDD B20   
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LTE-FDD B25 
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LTE-FDD B26  
LTE-FDD B28   
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LTE-FDD B39 
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Category LTE-M1     
Category LTE-NB1      
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GPS     
GLONASS     
GNSS
BeiDou    
Galileo *
*Note: Galileo is default closed in software. But users can open it via AT command
“AT+CGNSMOD”. For more information about these AT commands, please refer to
Document [1]

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1.2 Hardware Interface Overview

The interfaces are described in detail in the next chapters include:

● Power Supply
● USB Interface
● UART Interface

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● SIM Interface
● ADC
● LDO Power Output

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● PCM Interface
● I2C Interface

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● GPIOs
● Antenna Interface

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1.3 Hardware Block Diagram

The block diagram of the SIM7000 module is shown in the figure below.

GNSS
ANT

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GNSS GPIO(s)
RC
aain

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ANT PCM
GPRS/LTE receive

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RC SWITCI I2C

RC Wireless

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transmit
Transceiver Base- band
Processor UART

GPRS/LTE
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RC PA (U) SIM Card
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USB
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26aIz
aemory
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PWRKEY VDD_EXT
SIa_VDD
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NRESET
Power aanagement Unit USB_ VBUS
VBAT( Supply)
ADC
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Figure 1: SIM7000 block diagram

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1.4 Functional Overview

Table 2: General features

Feature Implementation
Power supply Power supply voltage 3.0～4.3V.
Current in sleep mode: 1.2mA (@DRX=2.56s).
Power saving
Current in PSM mode: 9uA.

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Radio frequency bands Please refer to the table 1
GPRS power class:
--EGSM900: 4 (2W).

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--DCS1800: 1 (1W).
Transmitting power EDGE power class:

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--EGSM900: E2 (0.5W).
--DCS1800: E1 (0.4W).
LTE power class: 3 (0.25W).

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GPRS multi-slot class 12.
EDGE multi-slot class 12.
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Data Transmission LTE CAT M1: 300Kbps (DL).
Throughput LTE CAT M1: 375Kbps (UL).
LTE CAT NB1: 34Kbps (DL).
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LTE CAT NB1: 66Kbps (UL).
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GPRS/EDGE/LTE main antenna.

Antenna
GNSS antenna.
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GNSS engine (GPS, GLONASS, BD and Galileo).

GNSS
Protocol: NMEA.
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MT, MO, CB, Text and PDU mode.

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SMS
SMS storage: SIM card or ME (default).
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SIM interface Support identity card: 1.8V/ 3V.

Support SAT class 3, GSM 11.14 Release 98.
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SIM application toolkit

Support USAT.
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Support PCM interface.

Audio feature Only support PCM master mode and short frame sync, 16-bit linear data
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formats.
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A full modem serial port by default.

Baud rate: 300bps to 3686400bps. Default rate is 0bps (auto baud rate).
Support auto baud rate, but only limited to 9600, 19200, 38400, 57600
UART interface
and 115200 bps.
Can be used as the AT commands or data stream channel.
Support RTS/CTS hardware handshake.
USB USB 2.0 high speed interface.

Firmware upgrade Firmware upgrade over USB interface

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Size:24 × 24 × 2.6mm
Physical characteristics
Weight:3g
Normal operation temperature: -30°C to + 80°C
Temperature range Extended operation temperature: -40°C to + 85°C*
Storage temperature -45°C to + 90°C
*Note: Module is able to make and receive voice calls, data calls, SMS and make
GPRS/EDGE/LTE traffic in -40℃ ~ +85℃. The performance will be reduced slightly from the
3GPP specifications if the temperature is outside the normal operating temperature range and

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still within the extreme operating temperature range.

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2 Package Information

2.1 Pin Assignment Overview

All functions of the SIM7000 will be provided through 68 pads that will be connected to the
customers’ platform. The following Figure is the pin assignment of the SIM7000.

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Figure 2: Pin assignment overview

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Table 3: Pin definition

Pin No. Pin Name Pin No. Pin Name

1 PWRKEY 2 GND
3 DTR 4 RI
5 DCD 6 BOOT_CFG
7 CTS 8 RTS
9 TXD 10 RXD

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11 PCM_CLK 12 PCM_SYNC
13 PCM_DIN 14 PCM_DOUT

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15 VDD_EXT 16 NRESET
17 GND 18 GND

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19 NC 20 NC
21 NC 22 NC

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23 MDM_LOG_TX 24 USB_VBUS
25 ADC EN26 NC
27 USB_DP 28 USB_DM
29 GND 30 SIM_VDD
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31 SIM_DATA 32 SIM_CLK
33 SIM_RST 34 SIM_DET
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35 NC 36 NC
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37 I2C_SDA 38 I2C_SCL
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39 GND 40 NC
41 NC 42 NC
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43 NC 44 NC
45 GND 46 GND
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47 NC 48 GPIO4
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49 GPIO1/UART3_RXD 50 GPIO0/UART3_TXD
51 NC 52 NETLIGHT
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53 GNSS_ANT 54 GND
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55 VBAT 56 VBAT
57 VBAT 58 GND
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59 GND 60 RF_ANT
61 GND 62 GND
63 GND 64 GND
65 GND 66 STATUS
67 GPIO2 68 GPIO3
NOTE: Before the normal power up, BOOT_CFG cannot be pulled up.

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2.2 Pin Description

Table 4: IO parameters definition

Pin type Description

PI Power input
PO Power output
AI Analog input

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AIO Analog input/output
I/O Bidirectional input /output

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DI Digital input
DO Digital output

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DOH Digital output with high level
DOL Digital output with low level
PU Pull up

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PD Pull down
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Table 5: Pin description
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Default
Pin name Pin No. Description Comment
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status
Power supply
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55、56、 Power supply, voltage range:

VBAT PI
57 3.0～4.3V.
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This power supple

only use for external
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LDO power output 1.8V for

GPIO pulling up or
VDD_EXT 15 PO other external circuits with Max
level shift circuit.
50mA current output.
If unused, keep it
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open.
2、17、
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18、29、
39、45、
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46、54、
GND Ground
58、59、
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61、62、
63、64、
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65
System Control

System power on/off control The level is 0.8V when

PWRKEY 1 DI,PU input, active low. The efficient
input level must be below 0.5V. this PIN is floating;

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NRESET has been

System reset control input, pulled up to 1.8V via
NRESET 16 DI, PU
active low. 40Kohm resistor
internally.
SIM interface

SIM Card data I/O, which has

been pulled up via a 10KR
SIM_DATA 31 I/O,PU resistor to SIM_VDD
internally. Do not pull it up or

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down externally.
SIM_RST 33 DO SIM Reset All lines of SIM

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interface should be
SIM_CLK 32 DO SIM clock
protected against ESD.

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Power output for SIM card, its
output Voltage depends on SIM
SIM_VDD 30 PO
card type automatically. Its
output current is up to 50mA.

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EN If used, keep a 10kΩ
SIM_DET 34 DI SIM card detecting input. resistor pulling up to
the VDD_EXT
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USB*
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Valid USB detection input with

USB_VBUS 24 DI,PD
3.5~5.25V detection voltage
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Positive line of the differential, Software download

USB_DP 27 I/O
bi-directional USB signal. interface.
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Negative line of the differential,

USB_DM 28 I/O
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bi-directional USB signal.

UART interface
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DTR 3 DI,PU DTE get ready

RI 4 DOH Ring Indicator
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DCD 5 DOH Carrier detects

If unused, keep them
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CTS 7 DOL Clear to Send

open.
RTS 8 DI,PD Request to send
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TXD 9 DOH Transmit Data

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RXD 10 DI,PD Receive Data

I2C interface
If unused, keep open,
I2C_SDA 37 I/O I2C clock output
or else pull them up
via 2.2KΩ resistors to
I2C_SCL 38 DO I2C data input/output the VDD_EXT.
PCM interface
PCM_CLK 11 DOH PCM data bit clock. If unused, please keep
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PCM_SYNC 12 DO PCM data frame sync signal. them open.
PCM_DIN 13 DI PCM data input.
PCM_DOUT 14 DO PCM data output.
GPIO
LED control output as network
NETLIGHT 52 DO
status indication.
Operating status output.
High level: Power on and
STATUS 66 DOH
firmware ready

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Low level: Power off
Default: GPIO
GPIO0 50 IO Optional: UART3_TXD in
If unused, keep them

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DAM application
open.
Default: GPIO
GPIO1 49 IO Optional: UART3_RXD in

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DAM application
GPIO2 67 IO GPIO

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GPIO3 68 DOH GPIO
GPIO4 48 DOH GPIOEN
RF interface
GNSS_ANT 53 AI GNSS antenna soldering pad
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RF_ANT 60 AIO MAIN antenna soldering pad
Other interface
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If it needs to enter into forced

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USB download mode, it must

Reserve a test points
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be pulling up this pin to for it. Keep it open.

BOOT_CFG 6 DI,PD VDD_EXT before press the DO NOT PULL UP
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DURING NORMAL
PWRKEY. POWER UP!
If it needs to boot up normally,
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please keep this pin open.

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MDM_LOG_T Module log output for SW Reserve a test point for

23 DO
X debug. (only used for platform) it.
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Analog-digital converter input. If unused, keep them

ADC 25 AI
voltage range: 0～VBAT. open.
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19、20、
21、 22、
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26、35、
NC 36、40、 No connection. Keep it open
41、 42、
43、 44、
47、 51、
Note: Please reserve a test point for BOOT_CFG, VDD_EXT and MDM_LOG_TX. If
there is no USB connector, please also reserve a test point for USB_VBUS, USB_DP,
and USB_DM for Firmware upgrade.

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The following figure shows the package outline drawing of SIM7000.

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Figure 3: Dimensions (Unit: mm)

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2.4 Footprint Recommendation

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Figure 4: Footprint recommendation (Unit: mm)

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C
M
SI

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3 Interface Application

3.1 Power Supply

Pin 55, pin 56 and pin 57 are VBAT power input.

On VBAT pads, when module works on CAT-M1 or NB-IoT mode, the ripple current is up to 0.6A

LE
typically. For steady voltage, the power supply capability must be up to 0.6A.

FI
On VBAT pads, when module works on EDGE or GPRS mode, he ripple current is up to 2A
typically. For steady voltage, the power supply capability must be up to 2A.

AL
in order to avoid the voltage dropped down more than 300mV, the load capacitor on VBAT pads
must be up to 300uF.

IT
The following figure shows the VBAT voltage ripple wave at the maximum power transmit phase
in EDGE/GPRS emission mode.
EN
577us 4.615ms
D
IVBAT Burst:2A
FI

VBAT
N

Max:300mV
O
C

Figure 5: VBAT voltage drop during burst emission (EDGE/GPRS)

M

Note: The test condition: The voltage of power supply for VBAT is 3.8V, Ca=100 µF tantalum
capacitor (ESR=0.7Ω) and Ce =100nF (Please refer to Figure 6—Application circuit).
O

Table 6: VBAT pins electronic characteristic

C
M

Symbol Description Min. Typ. Max. Unit

VBAT Module power voltage 3.0 3.8 4.3 V
SI

Module power peak current in GSM and EDGE emission

- 2 - A
mode.
IVBAT(peak)
Module power peak current in CAT-M1 and NB-IoT
- 0.6 - A
emission mode.
IVBAT(average) Module power average current in normal mode
Please refer to the chapter 5.4
IVBAT(sleep) Power supply current in sleep mode
IVBAT(power-off) Module power current in power off mode. - - 7 uA

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3.1.1 Power Supply Design Guide

Make sure that the voltage on the VBAT pins will never drop below 3.0V, even during a transmit
burst when current consumption may rise up to 2A. If the voltage drops below 3.0V, module will be
shutdown.
Note: If the power supply for VBAT pins can support up to 2A, using a total of more than 300uF
capacitors is recommended, or else users must using a total of 1000uF capacitors typically, in
order to avoid the voltage drop is more than 300mV.

LE
Some multi-layer ceramic chip (MLCC) capacitors (0.1uF, 1uF) with low ESR in high frequency
band can be used for EMC.

FI
These capacitors should be put as close as possible to VBAT pads. Also, users should keep VBAT
trace on circuit board wider than 2 mm to minimize PCB trace impedance. The following figure
shows the recommended circuit.

AL
FB 101
VBAT VBAT
Ce Cd Cc Cb Ca
VBAT TVS

IT
100nF 1uF
100uC 100uF 100uF
VBAT
MODULE EN
GND

GND
D
FI

Figure 6: Power supply application circuit

In addition, for ESD protection, it is suggested to add a TVS diode near the VBAT PINs.
N
O

Table 7: Recommended TVS diode list

C

No. Manufacturer Part Number Package

1 Prisemi PESDHC2FD4V5B DFN1006
M

2 Prisemi PESDHC3D3V3U SOD323

3 WILLsemi ESD5651N-2/TR DFN1006
O
C
M
SI

3.1.2 Recommended Power Supply Circuit

It is recommended that a switching mode power supply or a linear regulator power supply is used.
It is important to make sure that all the components used in the power supply circuit can resist a
peak current up to 2A when used GPRS/EDGE.

The following figure shows the linear regulator reference circuit with 5V input and 3.8V output.
But this linear regulator has a minimum load current, and it is even bigger than 7mA. So if users

SIM7000 _Hardware Design _V1.05 2018-12-24

 Smart Machine Smart Decision
care the system power consumption very much, it is not recommended to use.

Figure 7: Linear regulator reference circuit

LE
FI
If users used LTE mode only and never used EDGE/GPRS mode, switching mode power supply is
recommended to use. And the maximum output current must be meeting the requirement. The
following figure shows the switching mode power supply reference circuit.

AL
IT
EN
D
FI

Figure 8: power supply reference circuit (NB only)

N
O

3.1.3 Voltage Monitor

C

To monitor the VBAT voltage, the AT command “AT+CBC” can be used.

M

AT command “AT+CBATCHK=1” can be used to enable the overvoltage warning function and the
O

under-voltage warning function. The default value of the overvoltage warning function in the
software is 4.3V, and the default value of the under-voltage warning function is 3.1V. If the power
C

supply for VBAT pins is up 4.3V or under 3.1V, module will be warning.
M

The AT command “AT+CBATCHK=1” also can be used to enable the overvoltage power-off
SI

function and the under-voltage power-off function. The default value of the overvoltage power-off
function is 4.4V, and the default value of the under-voltage power-off function is 2.9V. If the VBAT
voltage is up 4.4V or under 2.9V, module will be power off.

Note: Under-voltage warning function and under-voltage power-off function are disabled by
default. For more information about these AT commands, please refer to Document [1].

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3.2 Power on/Power off/Reset Function

3.2.1 Power on

SIM7000 can be powered on by pulling the PWRKEY pin to ground.

The PWRKEY pin has been pulled up with a diode to 1.8V internally, so it does not need to be
pulled up externally. It is strongly recommended to put a 100nF capacitor and an ESD protection
diode close to the PWRKEY pin, as it would strongly enhance the ESD performance of PWRKEY

LE
pin. Please refer to the following figure for the recommended reference circuit.

FI
The high voltage of PWRKEY is 0.8V
Vdd

Power

AL
Turn on / off 0.8v
PWRKEY 1K Ω
0v
impulse On/off logic
4.7K
100nF

IT
47K
MODULE
EN
Figure 9: Reference power on/off circuit
D
The power-on scenarios are illustrated in the following figure.
FI
N

VBAT Ton
O

PWRKEY
( Input)
C

Ton( VDD)

VDD_ EXT
( Output)
M

Ton(status)
STATUS
( Output)
O

Ton( uart)
C

UART Port Undefined active

M

USB Port Ton( usb)

SI

Undefined active

Figure 10: Power on timing sequence

Table 8: Power on timing and electronic characteristic

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 Smart Machine Smart Decision
Symbol Parameter Min. Typ. Max. Unit
The time of active low level impulse of PWRKEY
Ton 1 - - s
pin to power on module
The time from power-on issue to VDD_EXT pin
Ton(Vdd) 64 ms
output high level.
The time from power-on issue to STATUS pin
Ton(status) 4.5 - - s
output high level(indicating power up ready )
Ton(uart) The time from power-on issue to UART port ready 4.5 - - s

LE
Ton(usb) The time from power-on issue to USB port ready 4.5 - - s
VIH Input high level voltage on PWRKEY pin 0.6 0.8 1.8 V

FI
VIL Input low level voltage on PWRKEY pin -0.3 0 0.5 V

AL
3.2.2 Power off

IT
The following methods can be used to power off SIM7000.
EN
● Method 1: Power off SIM7000 by pulling the PWRKEY pin to ground.
● Method 2: Power off SIM7000 by AT command “AT+CPOWD=1”.
● Method 3: over-voltage or under-voltage automatic power off. The function can be enabled by
D
AT command “AT+CBATCHK=1”. Default is disabled.
FI

Note: For details about “AT+CPOWD” and “AT+CBATCHK”, please refer to Document [1].
N

These procedures will make modules disconnect from the network and allow the software to enter a
O

safe state, and save data before module be powered off completely.
C

The power off scenario by pulling down the PWRKEY pin is illustrated in the following figure.
M
O
C
M
SI

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Toff- on
Toff Ton
PWRKER
( Input)

VDD_ EXT
( Output)
Toff(vdd)

LE
STATUS
( Output)
Toff( status)

FI
Toff( uart)

AL
UARTPort active Undefined

Toff( usb)

IT
USB Port active Undefined
EN
Figure 11: Power off timing sequence
D
FI

Table 9: Power off timing and electronic characteristic

N

Time value
O

Symbol Parameter Unit

Min. Typ. Max.
C

The active low level time pulse on PWRKEY pin to

Toff 1.2 - - s
power off module
M

The time from power-off issue to VDD_EXT pin output

Toff(vdd) 1.8 - 6.9 s
low level
O

The time from power-off issue to STATUS pin output low

Toff(status) 1.8 - 6.9 s
level(indicating power off )*
C

Toff(uart) The time from power-off issue to UART port off 1.8 - 6.9 s
M

Toff(usb) The time from power-off issue to USB port off 1.8 - 6.9 s
Toff-on The buffer time from power-off issue to power-on issue 2 - - s
SI

*Note: The STATUS pin can be used to detect whether module is powered on or not. When
module has been powered on and firmware goes ready, STATUS will be high level, or else
STATUS will still low level.

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3.2.3 Reset Function

SIM7000 can be reset by pulling the RESET pin to ground.

Note: This function is only used as an emergency reset. The RESET pin will be ineffectiveness
in the power off mode.
The RESET pin has been pulled up to 1.8V with a 40KΩ resistor internally. So it does not need to
be pulled up externally. It is strongly recommended to put a100nF capacitor and an ESD protection
diode close to the RESET pin. Please refer to the following figure for the recommended reference

LE
circuit.

FI
AL
IT
EN
Figure 12: Reference reset circuit
D
FI
N

Table 10: RESET pin electronic characteristic

O

Symbol Description Min. Typ. Max. Unit

C

The active low level time impulse on RESET pin

Treset 252 ms
to reset module
M

VIH Input high level voltage 1.2 1.8 2.1 V

VIL Input low level voltage -0.3 0 0.8 V
O
C
M
SI

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3.3 UART Interface

SIM7000 provides a 7-wire UART (universal asynchronous serial transmission) interface as DCE
(Data Communication Equipment). AT commands and data transmission can be performed through
this UART interface.

LE
In DAM (Downloadable Application Module) application, SIM7000 provides a UART interface to
use. This UART multiplexed from GPIO. The GPIO0 multiplex as TXD and the GPIO1 multiplex
as RXD. This UART interface can’t use as AT port or data transmission. It is only used as UART in

FI
DAM application when secondary development.

AL
SIM7000 support high speed UART, the baud rate is up to 4Mbps. The communication baud rates
include:0,300,600,1200,2400,4800,9600,19200,38400,57600,115200,230400,921600,2000000,300
0000,3200000,3686400 bps. The rate 0bps mark auto baud rate. And it supports auto baud rate, but

IT
the rate only supported on 9600, 19200, 38400, 57600, 115200. If users need to change to other baud
rate, it needs to switch via manual operation.
EN
3.3.1 UART Design Guide
D

The following figures show the reference design.

FI

MODULE( DCE) CUSTOMER (DTE)

N

Serial port Serial port

TXD TXD
O

RXD RXD
RTS RTS
C

CTS CTS
UART _ DTR DTR
DCD
M

UART _ DCD

UART1_RI RING
O
C

Figure 13: UART full modem

M

MODULE ( DCE) HOST ( DTE)

SI

TXD TXD
RXD RXD
RTS RTS
UART CTS CTS UART
DTR DTR
DCD DCD
Wake up host
RI RING
Interrupt

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Figure 14: UART null modem

Table 11: UART electronic characteristic

Symbol Description Min. Typ. Max. Unit

VIH UART input high level voltage 1.17 1.8 2.1 V
VIL UART input low level voltage -0.3 0 0.63 V
VOH UART output high level voltage 1.35 1.8 1.8 V

LE
VOL UART output low level voltage 0 0 0.45 V

The SIM7000 UART is 1.8V voltage interface. If user’s UART application circuit is 3.3V voltage

FI
interface, the level shifter circuits should be used for voltage matching. The following figure shows
the voltage matching reference design.

AL
VDD_ EXT 3.3V
TXB0108 RGYR
MODULE 100nF 100nF

IT
VCCA VCCB
OE GND
TXD EN A1 B1 TXD_3.3V
RXD A2 B2 RXD_3.3V
UART RTS A3 B3 RTS_3.3V
CTS A4 B4 CTS_3.3V
DTR A5 B5 DTR_3.3V
D
DCD A6 B6 DCD_3.3V
RI A7 B7 RI_3.3V
47K 47K
FI

A8 B8
N

Figure 15: Reference circuit of level shift

O

Note: When it uses the level shifter IC, the pull up resistance on TXD_3.3V, RTS_3.3V,
C

DCD_3.3V and RI_3.3V should not be less than 47KΩ.

M

3.3.2 RI and DTR Behavior

O

The RI pin description:

C

The RI pin can be used to interrupt output signal to inform the host controller such as application
CPU. Before that, users must use AT command “AT+CFGRI=1” to enable this function.
M

Normally RI will keep high level until certain conditions such as receiving SMS, or a URC report
coming, then it will output a low level pulse 120ms, in the end, it will become high level.
SI

RI 120ms
Idle
HIGH
Receiving SMS and any URC
report coming
LOW

Figure 16: RI behaviour（SMS and URC report）

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The DTR pin description:

After setting the AT command “AT+CSCLK=1”, and then pulling up the DTR pin, SIM7000 will
enter sleep mode when module is in idle mode. In sleep mode, the UART is unavailable. When
SIM7000 enters sleep mode, pulling down DTR can wake up module.

After setting the AT command “AT+CSCLK=0”, SIM7000 will do nothing when the DTR pin is
pulling up.

LE
Note: For more details of AT commands about UART, please refer to document [1] and [20].

FI
AL
3.4 USB Interface

IT
The SIM7000 contains a USB interface compliant with the USB2.0 specification as a peripheral,
but the USB charging function is not supported.
EN
USB_VBUS is the detecting signal for USB inserting. The input voltage range on the USB_VBUS
pin is from 3.5V to 5.25V. If there is out of this range, it may be due to USB function
unidentifiable, even damaging the module.
D
FI

The reference circuit refers to the following figure.

MODULE HOST
N

0Ω
USB_ VBUS VBUS
O

USB_DM D-
USB USB
USB_DP D+
GND GND
C

USB_ID D3 D1 D2
M

Figure 17: USB reference circuit

O

Because of the high speed on USB bus, more attention should be paid to the influence of the
C

junction capacitance of the ESD component on USB data lines. Typically, the capacitance of the D1
M

and D2 should be less than 1pF.

D3 is suggested to select the diode with anti-ESD and voltage surge function, or customer could
SI

add a ZENER diode for surge clamping.

Note ： The USB_DM and USB_DP nets must be traced by 90Ohm+/-10% differential
impedance.

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3.5 SIM Interface

SIM7000 supports both 1.8V and 3.0V SIM Cards.

Table 12: SIM electronic characteristic in 1.8V mode (SIM_VDD=1.8V)

LE
Symbol Parameter Min. Typ. Max. Unit

SIM_V
LDO power output voltage 1.75 1.8 1.95 V
DD

FI
VIH High-level input voltage 0.65*SIM_VDD - SIM_VDD +0.3 V

AL
VIL Low-level input voltage -0.3 0 0.35*SIM_VDD V

VOH High-level output voltage SIM_VDD -0.45 - SIM_VDD V

IT
VOL Low-level output voltage 0 0 0.45 V
EN
Table 13: SIM electronic characteristic 3.0V mode (SIM_VDD=2.95V)

Symbol Parameter Min. Typ. Max. Unit

D
SIM_V
LDO power output voltage 2.75 2.95 3.05 V
FI

DD

VIH High-level input voltage 0.65*SIM_VDD - SIM_VDD +0.3 V

N

VIL Low-level input voltage -0.3 0 0.25*SIM_VDD V

O

VOH High-level output voltage SIM_VDD -0.45 - SIM_VDD V

C

VOL Low-level output voltage 0 0 0.45 V

M
O
C
M
SI

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3.5.1 SIM Application Guide

It is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST

(www.st.com ) or SMF15C produced by ON SEMI (www.onsemi.com ). Note that the SIM
peripheral circuit should be close to the SIM card socket. The following figure shows the 6-pin

LE
SIM card holder reference circuit.

SIM_ DET 100nF

FI
SIM Socket
SIM_ VDD
VCC GND
SIM_ RST 22 Ω
RST VPP
MODULE SIM_ CLK 22 Ω CLK I /O

AL
C707 10M 006 512
SIM_ DATA 22 Ω
NC NC NC

TVS

IT
EN
Figure 18: SIM interface reference circuit

SIM_DATA has been pulled up with a 10KΩ resistor to SIM_VDD in module, so it no need
D
pulled up resistor anymore.
FI

SIM_VDD is need a 100nF capacitor close to SIM socket.

SIM_CLK is very important signal, the rise time and fall time of SIM_CLK should be less
N

than 40ns. So the junction capacity of the TVS need to less 50pF.
SIM_DET is the detecting signal for SIM card to insert and pull out. There is no pull up
O

resistor in module, so a 10KΩ resistor is necessary to pulling up to the power VDD_EXT. This
C

function is disabled default by software. Users can enable it by AT comment “AT+CSDT”. And the
Interruption direction can be set by AT comment “AT+CSPOL”.
M

Note：For more details of AT commands about “AT+CSDT” and “AT+CSPOL”, please refer to
O

document [1]
C
M
SI

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 3.6 PCM Interface

SIM7000 provides a PCM interface for external codec, which can be used in master mode with
short sync and 16 bits linear format.

Table 14: PCM format

LE
Characteristics Specification

FI
Line Interface Format Linear(Fixed)
Data length 16bits(Fixed)
PCM Clock/Sync Source Master Mode(Fixed)

AL
PCM Clock Rate 2048 KHz (Fixed)
PCM Sync Format Short sync(Fixed)

IT
Data Ordering MSB
Note: For more details about PCM AT commands, please refer to document [1].
EN
3.6.1 PCM timing
D

SIM7000 supports 2.048 MHz PCM data and sync timing for 16 bits linear format codec.
FI
N
O
C

Figure 19: PCM_SYNC timing

M
O
C
M
SI

Figure 20: External codec to module timing

 Smart Machine Smart Decision

LE
Figure 21: Module to external codec timing

FI
Table 15: PCM timing parameters

AL
Parameter Description Min. Typ. Max. Unit
T(sync) PCM_SYNC cycle time – 125 – μs

IT
T(synch) PCM_SYNC high level time – 488 – ns
T(syncl) PCM_SYNC low level time EN – 124.5 – μs
T(clk) PCM_CLK cycle time – 488 – ns
T(clkh) PCM_CLK high level time – 244 – ns
T(clkl) PCM_CLK low level time – 244 – ns
D
PCM_SYNC setup time high before falling edge
T(susync) – 122 – ns
FI

of PCM_CLK
PCM_SYNC hold time after falling edge of
N

T(hsync) – 366 – ns
PCM_CLK
O

PCM_IN setup time before falling edge of

T(sudin) 60 – – ns
PCM_CLK
C

PCM_IN hold time after falling edge of

T(hdin) 60 – – ns
PCM_CLK
M

T(pdout) Delay from PCM_CLK rising to PCM_OUT valid – – 60 ns

Delay from PCM_CLK falling to PCM_OUT
O

T(zdout) – – 60 ns
HIGH-Z
C
M
SI

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3.6.2 PCM Application Guide

The following figure shows the external codec reference design.

VDD_ EXT 3.3V 3.8V VDD_ EXT

VDDA
2.2K 2.2K VDDSPK

LE
VDDD
PCM_ IN 2.2K
ADCOUT
PCM_ OUT MICBIAS
DACIN
PCM_ SYNC FS 1uF
MIC+

FI
PCM_ CLK BCLK MIC- 1uF
MODULE MIC
MCLK 2.2K
47uF
I2C_ SCL MOUT
SCLK 47uF
I2C_ SDA

AL
SDIO
NAU88C10 SPK
33pF

IT
Figure 22: Audio codec reference circuit
EN
D
3.7 I2C Interface
FI

SIM7000 provides an I2C interface compatible with I2C specification, version 5.0, with clock rate
N

up to 400 kbps. Its operation voltage is 1.8V.

O

The following figure shows the I2C bus reference design.

C

VDD_EXT
M

2.2K 2.2K
O

I2C_SCL SCL

I2C_SDA SDA
C

GND GND
M

MODULE DEVICE
SI

Figure 23: I2C reference circuit

The I2C signal has no pull-up resistors in module. So the pulling up resistors 2.2KΩ to
VDD_EXT are necessary in application circuit.

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3.8 Network status

The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the
following figure.

VBAT

LE
FI
R
Module

AL
4.7K
NETLIGHT

IT
47K

EN
D
Figure 24: NETLIGHT reference circuit
FI

Note: The value of the resistor named “R” depends on the LED characteristic.
N
O

Table 16: NETLIGHT pin status

C

NETLIGHT pin status Module status

M

64ms ON, 800ms OFF No registered network

64ms ON, 3000ms OFF Registered network (PS domain registration success)
O

Data transmit (PPP dial-up state and use of data services such as
64ms ON, 300ms OFF
internal TCP/FTP/HTTP)
C

OFF Power off or PSM mode

Note: NETLIGHT output low level as “OFF” and high level as “ON”.
M
SI

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3.9 Other interface

3.9.1 ADC

SIM7000 has a dedicated ADC pin. It is available for digitizing analog signals such as battery
voltage and so on. Its input voltage range is from 0V to VBAT. That is the maximum measurement

LE
range of ADC cannot exceed the input voltage of VBAT (3V~4.3V). When the voltage of the
VBAT is reduced during use, the range of ADC will also be reduced. If the input voltage of ADC

FI
PIN exceeds its range, it is necessary to implement the resistance partial pressure on the hardware
The electronic specifications are shown in the following table.

AL
Table 17: ADC electronic characteristics

Characteristics Min. Typ. Max. Unit

IT
Resolution – – 15 Bits
Input Range EN 0 VBAT V
Input serial resistance 1 – – MΩ
Note: “AT+CADC” can be used to read the voltage of the ADC pin, for more details, please refer
to document [1].
D
FI

3.9.2 LDO
N

SIM7000 has a LDO power output named VDD_EXT. The output voltage is 1.8V. This voltage can
O

only be pulled up for the external GPIO or power supply for the level conversion circuit.
C

VBAT 64ms
M

PWRKEY
( Input)
O

VDD_EXT
C

( Output)
M

Figure 25：Power on sequence of the VDD_EXT

SI

Table 18: Electronic characteristic

Symbol Description Min. Typ. Max. Unit

VVDD_EXT Output voltage 1.7 1.8 1.9 V
IO Output current - - 50 mA
Note：The VDD_EXT is used to the IO power in the module. The Output voltage is not
supported to adjust.

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4 RF Specifications

4.1 GSM/LTE RF Specifications

Table 19: Conducted transmission power

Frequency Power Min.

LE
EGSM900 33dBm ±2dB 5dBm ± 5dB
DCS1800 30dBm ±2dB 0dBm ± 5dB
LTE-FDD B1 23dBm +/-2.7dB <-40dBm

FI
LTE-FDD B2 23dBm +/-2.7dB <-40dBm
LTE-FDD B3 23dBm +/-2.7dB <-40dBm
LTE-FDD B4 23dBm +/-2.7dB <-40dBm

AL
LTE-FDD B5 23dBm +/-2.7dB <-40dBm
LTE-FDD B6 23dBm +/-2.7dB <-40dBm
LTE-FDD B8 23dBm +/-2.7dB <-40dBm

IT
LTE-FDD B12 23dBm +/-2.7dB <-40dBm
LTE-FDD B13 23dBm +/-2.7dB <-40dBm
LTE-FDD B18
EN
23dBm +/-2.7dB <-40dBm
LTE-FDD B19 23dBm +/-2.7dB <-40dBm
LTE-FDD B20 23dBm +/-2.7dB <-40dBm
D
LTE-FDD B26 23dBm +/-2.7dB <-40dBm
LTE-FDD B28 23dBm +/-2.7dB <-40dBm
FI

LTE-FDD B39 23dBm +/-2.7dB <-40dBm

* Note：The max power is tested result for 1RB in CAT-M1 and single-tone in CAT-NB1. MPR
N

for CAT-M1 please refer to 6.2.3EA.5 part for 3GPP. Multi-tone test results please refer to part
O

6.2.3F.3 for CAT-NB1.

C

Table 20: Maximum Power Reduction (MPR) for UE category NB1 Power Class 3
M

Modulation QPSK
Tone positions for 3
0-2 3-5 and 6-8 9-11
Tones allocation
O

MPR ≤ 0.5 dB 0 dB ≤ 0.5 dB

C

Tone positions for 6

0-5 and 6-11
Tones allocation
M

MPR ≤ 1 dB ≤ 1 dB
Tone positions for 12
SI

0-11
Tones allocation
MPR ≤ 2 dB

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Table 21: Operating frequencies

Frequency Receiving Transmission

EGSM900 925～960MHz 880～915 MHz
GSM850 869~894MHz 824~849 MHz
DCS1800 1805～1880 MHz 1710～1785 MHz
PCS1900 1844.9~1879.9MHz 1749.9~1784.9MHz

LE
GPS L1 BAND 1574.4 ～1576.44 MHz -
GLONASS 1598 ～1606 MHz -

FI
BD 1559 ～1563 MHz
LTE BAND Refers to Table 22

AL
Table 22: E-UTRA operating bands

IT
E-UTRA UL Freq. EN DL Freq. Duplex Mode
1 1920 ~1980 MHz 2110 ~2170 MHz HD-FDD
3 1710 ~1785 MHz 1805 ~1880 MHz HD-FDD
D
5 824 ~849 MHz 869 ~894 MHz HD-FDD
6 830 ~840 MHz 875 ~885 MHz HD-FDD
FI

8 880 ~915 MHz 925 ~960 MHz HD-FDD

12 699 ~716 MHz 729 ~746 MHz HD-FDD
N

13 777 ~787 MHz 746 ~756 MHz HD-FDD

O

18 815 ~830 MHz 860 ~875 MHz HD-FDD

C

19 830 ~845 MHz 875 ~890 MHz HD-FDD

20 832 ~862 MHz 791 ~821 MHz HD-FDD
M

26 814 ~849 MHz 859 ~894 MHz HD-FDD

28 703 ~748 MHz 758 ~803 MHz HD-FDD
O

39 1880 ~1920 MHz 1880 ~1920 MHz TDD

C
M

Table 23: Conducted receive sensitivity

SI

Frequency Receive sensitivity(Typical) Receive sensitivity(MAX)

EGSM900 < -109dBm 3GPP
GSM850 < -109dBm 3GPP
DCS1800 < -109dBm 3GPP
PCS1900 < -109dBm 3GPP
LTE FDD/TDD Refers to Table 24

SIM7000 _Hardware Design _V1.05 2018-12-24

 Smart Machine Smart Decision
Table 24: CAT-M1 Reference sensitivity (QPSK)

REFSENS MAX(dBm) REFSENS

E-UTRA Band Duplex Mode
3GPP Typical (dBm)
1 -102.2 -102.2 HD-FDD
2 -100.2 -100.2 HD-FDD
3 -99.2 -99.2 HD-FDD
4 -102.2 -102.2 HD-FDD

LE
5 -100.7 -100.7 HD-FDD
8 -99.7 -99.7 HD-FDD
12 -99.2 -99.2 HD-FDD

FI
13 -98.7 -98.7 HD-FDD
18 -102.2 -102.2 HD-FDD

AL
19 -102.2 -102.2 HD-FDD
20 -99.7 -99.7 HD-FDD
26 -100.2 -100.2 HD-FDD

IT
28 -100.7 -100.7 HD-FDD
39 -103.7 EN -103.7 TDD
D
Table 25: CAT-NB1 Reference sensitivity (QPSK)
FI

REFSENS REFSENS REFSENS Typical

Operating band (dBm) 3GPP Typical(dBm) Repeated 7/128
N

Request [EPRE dBm/15KHz]

O

1, 2, 3, 4,5, 8, 12, 13, 17, 18, 19, 20, 26, 28 -108.2 -114 -145
C
M
O
C
M
SI

SIM7000 _Hardware Design _V1.05 2018-12-24

 Smart Machine Smart Decision

4.2 GSM/LTE Antenna Design Guide

Users should connect antennas to SIM7000’s antenna pads through micro-strip line or other types
of RF trace and the trace impedance must be controlled in 50Ω. SIMCom recommends that the
total insertion loss between the antenna pads and antennas should meet the following requirements:

Table 26: Trace loss

LE
Frequency Loss
700MHz-960MHz <0.5dB

FI
1710MHz-2170MHz <0.9dB
2300MHz-2650MHz <1.2dB

AL
To facilitate the antenna tuning and certification test, a RF connector and an antenna matching
circuit should be added. The following figure is the recommended circuit.

IT
EN
RF connector
Matching circuit
MAIN_ANT 60
R1 R2
D
GND 61 D1
C1 C2
TVS
FI

模块
N
O

Figure 26: Antenna matching circuit (MAIN_ANT)

C

In above figure, the components R1, C1, C2 and R2 are used for antenna matching, the values of
M

components can only be achieved after the antenna tuning and usually provided by antenna vendor.
By default, the R1, R2 are 0Ω resistors, and the C1, C2 are reserved for tuning. The component
O

D1 is a TVS for ESD protection, and it is optional for users according to application environment.
C

The RF test connector is used for the conducted RF performance test, and should be placed as close
as to the module’s MAIN_ANT pin. The traces impedance between SIM7000 and antenna must be
M

controlled in 50Ω.
Two TVS are recommended in the table below.
SI

Table 27: Recommended TVS

Package Part Number Vender

0201 LXES03AAA1-154 Murata
0402 LXES15AAA1-153 Murata

SIM7000 _Hardware Design _V1.05 2018-12-24

 Smart Machine Smart Decision

4.3 GNSS

SIM7000 merges GNSS (GPS/GLONASS/BD) satellite and network information to provide a

high-availability solution that offers industry-leading accuracy and performance. This solution
performs well, even in very challenging environmental conditions where conventional GNSS
receivers fail, and provides a platform to enable wireless operators to address both location-based
services and emergency mandates.

LE
4.3.1 GNSS Technical specification

FI
 Tracking sensitivity: -162 dBm（GPS）/-157 dBm（GLONASS）/TBD (BD)
 Cold-start sensitivity: -148 dBm
 Accuracy (Open Sky): 2.5m (CEP50)

AL
 TTFF (Open Sky) : Hot start <1s, Cold start<35s
 Receiver Type: 16-channel, C/A Code
 GPS L1 Frequency: 1575.42±1.023MHz

IT
 GLONASS: 1597.5~1605.8 MHz
 BD: 1559.05~1563.14 MHz
 Update rate: Default 1 Hz
EN
 GNSS data format: NMEA-0183
 GNSS Current consumption : 30mA (GSM/LTE Sleep, in total on VBAT pins)
D
 GNSS antenna: Passive/Active antenna
FI

Note: If the antenna is active type, the power should be given by main board because there is no
power supply on the GPS antenna pad. If the antenna is passive, it is suggested that the external
N

LNA should be used.

O

4.3.2 GNSS Application Guide

C

Users can adopt an active antenna or a passive antenna to SIM7000. If using a passive antenna, an
M

external LNA is a must to get better performance. The following figures are the reference circuits.
O

VDD

10 ohm GNSS Active ANT

C

47nH
M

GND 54 Matching circuit

SI

C1 C2 33pF
GNSS_ANT 53

GND L1 L2

MODULE

Figure 27: Active antenna circuit

SIM7000 _Hardware Design _V1.05 2018-12-24

 Smart Machine Smart Decision
RF Antenna GNSS Antenna

TVS
LXES15AAA1-153
R 101 0R
60 RF_ ANT 53
GNSS_ ANT
NC C 108
NC L 101 L 102
33pF
C 106 C 107 61 GND NC NC

62 GND GND 54
63 GND

LED
R 109
Power supply VBAT
55 VBAT
510R Power supply
VBAT 56 VBAT 52
R 108 4. 7 K
C 101 C 102 C 103 C 104 NETLIGHT
57 GND
100uF 100uF 1 uF
100uF
58 GND R 107 47K

GND
59

POWERKEY LED
1 R 111

VBAT
R 102 4. 7 K Power supply

SIM7000
510R
R 110 4. 7K
STATUS 66
Turn on C off impulse
R 103 47K
R 112 47K

16 NRESET

R 105 4. 7 K VDD_ EXT

2.2 KR
R115

2.2 KR
R114
Turn on C off impulse
R 106 47K
38
I 2 C_ SCL I 2 C_ SCL
37
I 2 C_ SDA I 2 C_ SDA

UART _ TXD 9 TXD

10 RXD 25
UART _ RXD ADC ADC
UART _ CTS 7 CTS Input range : 0. 1~1. 7 V
UART_ RTS 8 RTS
UART_ RI 4 RI
USB_VBUS 24 USB_ VBUS
UART_ DCD 5 DCD
USB _ DN 28
3 DTR USB_ DN
UART_ DTR 27
USB _ DP USB_ DP

31 USIM _ DATA
SIM _DATA SIM _ CLK 32 USIM _ CLK
SIM_RST
33 13
SIM _VDD
USIM _ RST PCM _DIN
30 PCM _ SYNC 12
USIM_ VDD Audio CODEC
C 109
PCM _DOUT 14
220 nF 34 USIM _DET or
TVS PCM _CLK 11
ESDA 6 V1 W5
DSP

Test toint 50
GPIO 0C UART3_ TXD
VDD
_ EXT 15 VDD_ EXT 49
GPIO 1C UART3_RXD
LDO Output : 1. 8 V GPIO2 68

GPIO3 67
Test Point 6 BOOT _ CCD
GPIO4 48
Test toint 23 MDM _ LOG_ TX
NC 19
NC 20
2 NC 21
GND 22
17 GND NC
18 NC 26
GND 35
29 GND NC
39 NC 36
GND 40
45 GND NC
41
46 GND NC
NC 42
64 GND 43
65 GND NC
44
NC 47
NC
51
NC

LE
Figure 28: Passive antenna circuit (Default)

FI
In above figures, the components C1, L1 and L2 are used for antenna matching. Usually, the values
of the components can only be achieved after antenna tuning and usually provided by antenna
vendor. C2 is used for DC blocking. L3 is the matching component of the external LNA, and the

AL
value of L3 is determined by the LNA characteristic and PCB layout. Both VDD of active antenna
and V_LNA need external power supplies which should be considered according to active antenna
and LNA characteristic. LDO/DCDC is recommended to get lower current consuming by shutting

IT
down active antennas and LNA when GNSS is not working.
GNSS can be tested by NMEA port. NMEA sentences can be obtained through UART or USB
automatically. NMEA sentences include GSV, GGA, RMC, GSA, and VTG. Before using GNSS,
EN
user should configure SIM7000 in proper operating mode by AT command. Please refer to related
documents for details. SIM7000 can also get position location information through AT directly.
D
Note:
FI

1. GNSS is closed by default and can be started by “AT+CGNSPWR=1”. The AT command has
two parameters, the first is on/off, and the second is GNSS mode. Default mode is standalone
N

mode.
AGPS mode needs more support from the mobile telecommunication network. Please refer to
O

document [21] for more details.

C

2. If the passive antenna is used, put the LNA close to the antenna.
3. Make sure there are no noise signals around GNSS antenna.
M
O
C
M
SI

SIM7000 _Hardware Design _V1.05 2018-12-24

 Smart Machine Smart Decision

4.4 RF traces note

4.4.1 RF traces layout

 Keep the RF trace from module ant pin to antenna as short as possible
 RF trace should be 50 Ω either on the top layer or in the inner layer

LE
 RF trace should be avoided right angle and sharp angle.
 Put enough GND vias around RF traces.
 RF trace should be far away from other high speed signal lines.

FI
AL
IT
EN
D
FI

Figure 29: RF trace should be far away from other high speed signal lines
N

 Avoiding the paroling rout of other system antennas nearly.

 There should be some distance from The GND to the inner conductor of the SMA connector. It
O

is better to keep out all the layers from inner to the outer conductor.
C
M
O
C
M
SI

SIM7000 _Hardware Design _V1.05 2018-12-24

 Smart Machine Smart Decision
Figure 30: The distance between GND to the inner conductor of SMA

 GND pads around the ANT pad should not be hot pad to keep the GND complete.

4.4.2 LTE ANT and other system ANT decoupling

 Make sure the efficiency of LTE main ANT more than 40%
 Keep the decoupling of LTE main ANT to WLAN ANT more than 15dB

LE
 Keep the decoupling of LTE main ANT to GNSS ANT more than 30dB

Note: The decoupling value can be provided by ANT adventure. More details can refer to the

FI
document [22].

AL
IT
EN
D
FI
N
O
C
M
O
C
M
SI

SIM7000 _Hardware Design _V1.05 2018-12-24

 Smart Machine Smart Decision

5 Electrical Specifications

5.1 Absolute maximum ratings

Absolute maximum rating for digital and analog pins of SIM7000 are listed in the following table:

Table 28: Absolute maximum ratings

LE
Parameter Min. Typ. Max. Unit
Voltage on VBAT -0.3 - 5.5 V

FI
Voltage on USB_VBUS -0.3 - 5.8 V
Voltage at digital pins
-0.3 - 2.1 V
(RESET,GPIO,I2C,UART,PCM)

AL
Voltage at PWRKEY -0.3 - 3.4 V
ADC -0.3 - VBAT V

IT
The absolute parameter is tested when VBAT has the power but the PWRKEY has no pulled down.
EN
If it is over the range, the module will be damage. If the power supply on VBAT pin had been shut
down, and the other pin should not have the voltage. Otherwise, it may lead to abnormally boot up
or damage the module.
D
FI
N
O
C
M
O
C
M
SI

SIM7000 _Hardware Design _V1.05 2018-12-24

 5.2 Operating conditions

Table 29: Recommended operating ratings

Parameter Min. Typ. Max. Unit

Voltage at VBAT 3.0 3.8 4.3 V
Voltage at USB_VBUS 3.5 5.0 5.25 V

LE
Make sure that the voltage on the VBAT pins will never drop below 3.0V, even during a transmit
burst when current consumption may rise up to 2A. If the voltage drops below 3.0V, module will be
power down.

FI
Table 30: 1.8V Digital I/O characteristics*

AL
Parameter Description Min. Typ. Max. Unit
VIH High-level input voltage 1.17 1.8 2.1 V

IT
VIL Low-level input voltage -0.3 0 0.63 V

VOH High-level output voltage

EN 1.35 - 1.8 V

VOL Low-level output voltage 0 - 0.45 V

D
High-level output current(no
IOH - 2 - mA
pull down resistor)
FI

Low-level output current(no pull

IOL - -2 - mA
up resistor)
N

Input high leakage current (no

IIH - - 1 uA
O

pull down resistor)

Input low leakage current(no

C

IIL -1 - - uA
pull up resistor)
*Note: These parameters are for digital interface pins, such as GPIOs (including NETLIGHT,
M

STATUS, SIM_DET), I2C, UART, PCM, MDM_LOG_TX and BOOT_CFG.

O

The operating temperature of SIM7000 is listed in the following table.

C

Table 31: Operating temperature

M

Parameter Min. Typ. Max. Unit

SI

Normal operation temperature -30 25 80 ℃

Extended operation temperature* -40 25 85 ℃
Storage temperature -45 25 +90 ℃
*Note: Module is able to make and receive voice calls, data calls, SMS and make GPRS/LTE
traffic in -40℃ ~ +85℃. The performance will be reduced slightly from the 3GPP specifications
if the temperature is outside the normal operating temperature range and still within the extreme
operating temperature range.
 5.3 Operating Mode

5.3.1 Operating Mode Definition

The table below summarizes the various operating modes of SIM7000 product.

Table 32: Operating mode Definition

LE
Mode Function
In this case, the current consumption of module will be reduced to the

FI
GPRS/EDGE /LTE
minimal level and the module can still receive paging message and
Sleep
SMS.

AL
GPRS/EDGE /LTE Software is active. Module is registered to the network, and the
Idle module is ready to communicate.
Normal operation

IT
Connection between two subscribers is in progress. In this case, the
LTE Cat-M1 Talk power consumption depends on network settings such as DTX off/on,
EN
FR/EFR/HR, hopping sequences, and antenna.
Module is ready for data transmission, but no data is currently sent or
GPRS/EDGE/LTE
received. In this case, power consumption depends on network
Standby
D
settings.
There is data transmission in progress. In this case, power
FI

GPRS/EDGE/LTE
consumption is related to network settings (e.g. power control level);
Data transmission
uplink/downlink data rates, etc.
N

AT command “AT+CFUN=0” and “AT+CSCLK=1” can be used to

O

set the module to a minimum functionality mode without removing

Minimum functionality the power supply. In this mode, the RF part of the module will not
C

mode work and the SIM card will not be accessible, but the serial port and
USB port are still accessible. The power consumption in this mode is
M

lower than normal mode.

AT command “AT+CFUN=4” can be used to set the module to flight
O

mode without removing the power supply. In this mode, the RF part
C

Flight mode of the module will not work, but the serial port and USB port are still
accessible. The power consumption in this mode is lower than normal
M

mode.
SI

Setting AT command” AT+CPSMS=1” can be enable the PSM mode.

In this mode, The mode is similar to power-off. But the module
remains registered on the network and there is no need to re-attach or
Power Saving Mode (PSM)
re-establish the network connections. And all of the functions will be
unavailable except the RTC function. PWRKEY and timer expires
can wake up the module.
In idle or sleep mode, module and the network may negotiate over
Extended Mode DRX
non-access stratum signaling the use of extended mode DRX for
(e-DRX)
reducing power consumption.
 Smart Machine Smart Decision

5.3.2 Sleep mode

Module can enter into sleep mode for reducing its power consumption in idle module. In sleep
mode, the current consumption of module will be reduced to very small level, and module can still
receive paging message and SMS.

Several hardware and software conditions must be satisfied together in order to let SIM7000 enter

LE
sleep mode:
 USB condition: Connected USB can’t enter into sleep mode. So if module wants to enter into

FI
sleep mode, it must disconnect the power supply for USB_VBUS first.
 Software condition: If module wants to enter into sleep mode, AT comment “AT+CSCLK=1”
must be set to close some clock in the module. If the value “AT+CSCLK” is “0”, module will

AL
never enter into sleep mode.
 UART condition: If module wants to enter into sleep mode, AT comment “AT+CSCLK=1”
must be set to close some clock in the module. If the value “AT+CSCLK” is “0”, module will

IT
never enter into sleep mode.
If it meets all the conditions at the same time, module will enter into sleep mode. In sleep mode, the
EN
UART is unavailable. If the host need to communicate with module, it need to pull down DTR can
wake up module.
D
FI

5.3.3 Minimum functionality mode and Flight mode

N

Minimum functionality mode ceases a majority function of the module, thus minimizing the power
consumption. This mode is set by the AT command which provides a choice of the functionality
O

levels.
C

 AT+CFUN=0: Minimum functionality

AT+CFUN=1: Full functionality (Default)
M


 AT+CFUN=4: Flight mode
O

If SIM7000 has been set to minimum functionality mode, the RF function and SIM card function
C

will be closed. In this case, the serial port and USB are still accessible, but RF function and SIM
card will be unavailable.
M

If SIM7000 has been set to flight mode, the RF function will be closed. In this case, the serial port
SI

and USB are still accessible, but RF function will be unavailable.

When SIM7000 is in minimum functionality or flight mode, it can return to full functionality by the
AT command “AT+CFUN=1”.

5.3.4 Power Saving Mode (PSM)

SIM7000 module can enter into PSM for reducing its power consumption. The mode is similar to
SIM7000 _Hardware Design _V1.05 2018-12-24
 Smart Machine Smart Decision
power-off, but the module remains registered on the network and there is no need to re-attach or
re-establish the network connections. So in PSM all the functions will be unavailable except the
RTC function, module cannot immediately respond users’ requests.

When the module wants to use the PSM, it can be enabled via “AT+CPSMS=1” command. The
command takes effect after module reboot. If the network supports PSM and accepts that the
module uses PSM, the network confirms usage of PSM by allocating an Active Time value to the
module. Module will be into PSM according to the command from network.

LE
Either of the following methods will wake up the module from PSM:
 Pulling PWRKEY pin to low level will wake up the module.

FI
 When the timer expires, the module will be automatically woken up.

AL
IT
EN
D
FI
N
O
C
M
O
C
M
SI

SIM7000 _Hardware Design _V1.05 2018-12-24

 5.4 Current Consumption

The current consumption is listed in the table below.

Table 33: Current consumption on VBAT Pins (VBAT=3.8V)

GNSS

LE
GNSS supply current Tracking, typical: 30mA
(AT+CFUN=0,without USB connection) In DPO mode, typical: 6mA
GSM sleep/idle mode

FI
GSM supply current Sleep mode@ BS_PA_MFRMS=2 Typical: 1.7mA
(GNSS off，without USB connection) Idle mode@ BS_PA_MFRMS=2 Typical: 11.4mA

AL
LTE sleep/idle mode
LTE supply current Sleep mode Typical: 1.2mA
(GNSS off，without USB connection) Idle mode Typical: 11mA

IT
Power Saving Mode
PSM supply current ENPSM mode Typical: 9uA
LTE Cat-M1 Talk
TBD TBD
TBD TBD
D
GPRS
FI

EGSM900( 2 Rx,4 Tx ) @power level #5 Typical: 422mA

DCS1800( 2 Rx,4 Tx ) @power level #0 Typical: 345mA
N

EGSM900( 3Rx, 2 Tx ) @power level #5 Typical: 321mA

DCS1800( 3Rx, 2 Tx ) @power level #0 Typical: 249mA
O

EDGE
EGSM900( 2 Rx,4 Tx ) @power level #8 Typical: 426mA
C

DCS1800( 2 Rx,4 Tx ) @power level #2 Typical: 327mA

EGSM900( 3Rx, 2 Tx ) @power level #8 Typical: 263mA
M

DCS1800( 3Rx, 2 Tx ) @power level #2 Typical: 200mA

LTE Cat-M
O

@23dbm Typical: 161mA

LTE-FDD B1 @10dbm Typical: 111mA
C

@0dbm Typical: 98mA

@23dbm Typical: 160mA
M

LTE-FDD B2 @10dbm Typical: 116mA

@0dbm Typical: 102mA
SI

@23dbm Typical: 150mA

LTE-FDD B3 @10dbm Typical: 110mA
@0dbm Typical: 102 mA
@23dbm Typical: 150mA
LTE-FDD B4 @10dbm Typica : 114mA
@0dbm Typical: 102mA
@23dbm Typical: 168mA
LTE-FDD B5 @10dbm Typical: 117mA
@0dbm Typical: 113mA
@23dbm Typical: 165mA
LTE-FDD B8
@10dbm Typical: 110mA
 Smart Machine Smart Decision
@0dbm Typical: 98mA
@23dbm Typical: 167mA
LTE-FDD B12 @10dbm Typical: 109mA
@0dbm Typical: 96mA
@23dbm Typical: 168mA
LTE-FDD B13 @10dbm Typical: 114mA
@0dbm Typical: 97mA
@23dbm Typical: 167mA
LTE-FDD B18 @10dbm Typical: 109mA
@0dbm Typical: 98mA

LE
@23dbm Typical: 171mA
LTE-FDD B19 @10dbm Typical: 110mA
@0dbm Typical: 99mA

FI
@23dbm Typical: 167mA
LTE-FDD B20 @10dbm Typical: 110mA
@0dbm Typical: 98mA

AL
@23dbm Typical: 168mA
LTE-FDD B26 @10dbm Typical: 109mA
@0dbm Typical: 98mA

IT
@23dbm Typical: 195mA
LTE-FDD B28 @10dbm Typical: 135mA
@0dbm Typical: 115mA
EN
LTE Cat-NB data transmission
B5 UL mac padding _15KHZ_1RU_1 subcarrier_0dbm 59.94 mA
D
UL mac padding _15KHZ_1RU_1 subcarrier_10dbm 68.48 mA
UL mac padding _15KHZ_1RU_1 subcarrier_23dbm 143.22 mA
FI

UL mac padding _3.75KHZ_1RU_1 subcarrier_0dbm 83.60 mA

UL mac padding _3.75KHZ_1RU_1 subcarrier_10dbm 100.03 mA
N

UL mac padding _3.75KHZ_1RU_1 subcarrier_23dbm 244.96 mA

O

UL mac padding _15KHZ_12subcarrier_23dbm 92mA

DL mac padding _15KHZ_12subcarrier_23dbm 66.42mA
C

B8 UL mac padding _15KHZ_1RU_1 subcarrier_0dbm 60.42 mA

UL mac padding _15KHZ_1RU_1 subcarrier_10dbm 69.54 mA
M

UL mac padding _15KHZ_1RU_1 subcarrier_23dbm 144.60 mA

UL mac padding _3.75KHZ_1RU_1 subcarrier_0dbm 83.84 mA
O

UL mac padding _3.75KHZ_1RU_1 subcarrier_10dbm 101.37 mA

UL mac padding _3.75KHZ_1RU_1 subcarrier_23dbm 248.67 mA
C

UL mac padding _15KHZ_12subcarrier_23dbm 93mA

M

DL mac padding _15KHZ_12subcarrier_23dbm 68.4mA

SI

SIM7000 _Hardware Design _V1.05 2018-12-24

 5.5 ESD Notes

SIM7000 is sensitive to ESD in the process of storage, transporting, and assembling. When
SIM7000 is mounted on the users’ mother board, the ESD components should be placed beside the
connectors which human body may touch, such as SIM card holder, audio jacks, switches, keys, etc.
The following table shows the SIM7000 ESD measurement performance without any external ESD
component.

LE
Table 34: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%.)

FI
Part Contact discharge Air discharge
VBAT,GND +/-6K +/-12K

AL
Antenna port +/-5K +/-10K
Other PADs +/-1K +/-3K

IT
EN
D
FI
N
O
C
M
O
C
M
SI
 Smart Machine Smart Decision

6 SMT Production Guide

6.1 Top and Bottom View of SIM7000

LE
FI
AL
IT
EN
D
FI
N
O

Figure 31: Top and bottom view of SIM7000

C
M
O
C
M
SI

SIM7000 _Hardware Design _V1.05 2018-12-24

 Smart Machine Smart Decision

6.2 Label Information

LE
FI
AL
IT
EN
Figure 32: Label information
D
FI

Table 35: The description of label information

N
O

No. Description
A LOGO
C

B No.1 Pin
M

C Project name
O

D Product code

E Serial number
C

F International mobile equipment identity

M

G QR code
SI

SIM7000 _Hardware Design _V1.05 2018-12-24

 Smart Machine Smart Decision

6.3 Typical SMT Reflow Profile

SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only
a generic recommendation and should be adjusted to the specific application and manufacturing
constraints.

LE
FI
AL
IT
EN
D
FI

Figure 33: The ramp-soak-spike reflow profile of SIM7000

N

Note: For more details about secondary SMT, please refer to the document [19].
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SIM7000 _Hardware Design _V1.05 2018-12-24

 6.4 Moisture Sensitivity Level (MSL)

SIM7000 is qualified to Moisture Sensitivity Level (MSL) 4 in accordance with JEDEC

J-STD-033.

The following table shows the features of Moisture Sensitivity Level (MSL). After seal off, storage
conditions must meet the following table. If the storage time was expired, module must be baking

LE
before SMT.

Table 36: Moisture Sensitivity Level and Floor Life

FI
Moisture Sensitivity Level Floor Life (out of bag) at factory ambient≤30°C/60% RH or as

AL
(MSL) stated
1 Unlimited at ≦30℃/85% RH
2 1 year at ≦30℃/60% RH

IT
2a 4 weeks at ≦30℃/60% RH
3
EN
168 hours at ≦30℃/60% RH
4 72 hours at ≦30℃/60% RH
5 48 hours at ≦30℃/60% RH
D
5a 24 hours at ≦30℃/60% RH
FI

6 Mandatory bake before use. After bake, it must be reflowed within the
time limit specified on the label.
N
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 6.5 Baking

In order to get better yield, the module need to bake before SMT.
 If the packaging is in perfect condition, the module which date of production is within six
months has no use for baking. If the date of production is more than six months, the module must
be baking.
 If the packaging had been opened or damaged, the module must be baking.

LE
Table 37: Baking conditions

FI
conditions parameters
Baking temperature 120℃

AL
Baking time 8 hours

NOTE: IPC / JEDEC J-STD-033 standard must be followed for production and storage.

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EN
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 6.6 Stencil Foil Design Recommendation

The recommended thickness of stencil foil is 0.15mm.

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Figure 34: stencil recommendation (Unit: mm)

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 Smart Machine Smart Decision

7 Packaging

7.1 Tray packaging

SIM7000 module support tray packaging .

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EN
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Figure 35: packaging diagram

N

Module tray drawing：

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Figure 36: Tray drawing

SIM7000 _Hardware Design _V1.05 2018-12-24

 Smart Machine Smart Decision

Table 38: Tray size

Length（±3mm） Width（±3mm） Module number

242.0 161.0 20

Small carton drawing：

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FI
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EN
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Figure 37: Small carton drawing
FI

Table 39: Small Carton size

N

Length（±10mm） Width（±10mm） Height（±10mm） Module number

270 180 120 20*20=400
O

Big carton drawing：

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Figure 38: Big carton drawing

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 Smart Machine Smart Decision

Table 40: Big Carton size

Length（±10mm） Width（±10mm） Height（±10mm） Module number

380 280 280 400*4=1600

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SIM7000 _Hardware Design _V1.05 2018-12-24

 Appendix

A. Reference Design

Refer to < SIM7000 Reference Design V1.01> for the details.

RF Antenna GNSS Antenna

LE
TVS
LXES15 AAA1-153
R 101 0R
60 RF_ ANT 53
GNSS_ ANT
NC NC
NC 33pF
C 106 C 107 61 GND NC

62 GND GND 54

FI
63 GND

LED
R 109
Power supply VBAT
55 VBAT
510R Power supply
VBAT 56 VBAT 52
R 108 4.7 K
C 101 C 102 C 103 C 104 NETLIGHT

AL
57 GND
100uF 100uF 1 uF
100uF
58 GND R 107 47K

GND
59

POWERKEY LED
1 R 111

VBAT

IT
R 102 4. 7K Power supply

SIM7000
510R
R 110 4.7K
STATUS 66
Turn on C off impulse
R 103 47K
R 112 47K

R 105 4. 7K
16 NRESET
EN VDD_ EXT

2.2 KR
R115

2.2 KR
R114
Turn onC off impulse
R 106 47K
38 I2C_ SCL
I2C_ SCL
D
37
I2C_ SDA I2C_ SDA

UART_TXD 9 TXD
RXD
FI

UART_RXD 10 ADC 25 ADC

UART_CTS 7 CTS
UART_RTS 8 RTS
UART_RI 4 RI
USB_ VBUS 24 USB_ VBUS
UART_DCD 5 DCD
N

USB_ DN 28
3 DTR USB_ DN
UART_DTR 27
USB_ DP USB_ DP
O

31 USIM_ DATA
SIM_ DATA SIM_ CLK 32 USIM_ CLK
SIM_RST
33 13
SIM_ VDD
USIM_ RST PCM_DIN
30 PCM_ SYNC 12
USIM_ VDD Audio CODEC
C

C 109
PCM_ DOUT 14
220nF 34 USIM_DET or
TVS PCM_ CLK 11
ESDA6V1 W5
DSP

Test toint 50
GPIO0C UART3_ TXD
M

VDD_EXT 15 VDD_ EXT 49

GPIO1C UART3_ RXD
LDO Output: 1.8V 68
GPIO3
GPIO2 67
Test Point 6 BOOT_ CCD
O

GPIO4 48
Test toint 23 MDM_ LOG_ TX
NC 19
NC 20
21
C

2 GND NC
17 NC 22
GND 26
18 GND NC
29 35
GND NC
36
M

39 GND NC
40
45 GND NC
NC 41
46 GND
NC 42
64 GND 43
65 NC
GND 44
SI

NC 47
NC
51
NC

Figure 39: Reference design

B. Design check list

Table 41: Schematic Check List

NO. Items
 Smart Machine Smart Decision
1 Insure the supply voltage for VBAT is within the range of 3V~4.3V.
Insure the maximum supply current for VBAT is above its consumption when it is maximum
2 power emission. The maximum current is 2A during GPRS/EDGE emission maximum power, and
it 0.6A during LTE emission maximum power.
Insure the capacitor for VBAT is meet its request, in order to avoid the voltage drop exceed
3
300mV. And the voltage never dropped below 3V.
Insure the input signal for PWRKEY pin meet its electrical level match. It recommended use BJT
4
to shift its level.
5 Insure the input signal for NRESET pin meet its electrical level match.
Insure the net connections of UART be correctness according to signal direction. Insure the signal

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6 for UART pins meet its electrical level match. It recommended use BJT or level shift IC to shift
its level.
Insure USB port had used TVS to protect signal. And the junction capacity of TVS for DP/DM

FI
7
must be less than 1pf.
Insure SIM card signal had used TVS to protect. And the junction capacity of TVS must be less
8
than 50pf.

AL
9 Insure SIM_DET had used resistor 10Kohm pull up to VDD_EXT if used this signal.
10 Insure I2C signal had used resistors 2.2Kohm pull up to VDD_EXT if used.

IT
The electrical level of all GPIOs is 1.8V. Insure the signal for GPIO pins meet its electrical level
11
match.
12
EN
The input range of ADC is 0V~VBAT. Insure the input signal never exceed its range.
User must pull up DTR when module enters into sleep mode. Insure DTR can be controlled by
13
host.
Suggesting to reserve test ports for VDD_EXT and BOOT_CFG. BOOT_CFG should keep open
14
D
before boot up.
FI

15 The power supply of the active antenna should be controlled and closed.

16 LTE main ANT should have a PI type matching to debug antenna

N

LTE main ANT should Keep TVS to prevent ESD destroyed. And the TVS should be Low
17
O

junction capacitance.
C

Table 42: PCB Layout Check List

M

NO. Items
1 Insure the capacitor placement for VBAT be near module pin.
O

Insure VBAT trace width be greater than 2mm. If NB only, insure VBAT trace width be greater
2
than 0.6mm. And the VIA number must be enough for getting through the current.
C

Insure the return path GND of the power supply is good. Insure the connectivity between module
3
GND and mother board GND is good.
M

Insure PCM trance is protected by GND, and keep it far from interference source, such as power
4
supply trace, USB trace, RF trace and so on.
SI

Insure USB trance is protected by GND, and keep it far from interference source, such as power
5 supply trace, RF trace and so on. Insure DM/DP trace is differential routing, and differential
impedance is 90 ohm.
6 Insure ADC trance is protected by GND.
Insure SIM card signal trance is protected by GND. Especially SIM_CLK must be protected
7
alone. And avoid signal trace branched Routing.
8 Insure I2C trance is protected by GND.
9 Insure TVS avoid bypass. The trace must go through TVS pad first, and then arrived module pad.
10 There should be enough ground around the RF line. RF lines Routing prohibit right angles and

SIM7000 _Hardware Design _V1.05 2018-12-24

 Smart Machine Smart Decision
sharp angles, trying to trace circular or obtuse angle line.
11 The RF line reference GND should be complete. And avoid high speed lines crossing below it.
12 the GND side of the RF output pin should be non hot welding disk
The routing which is RF output PIN to antenna should be isolated from other high-speed lines.
13
And the routing should be 50Ωimpedance control.

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SIM7000 _Hardware Design _V1.05 2018-12-24

 C. Coding Schemes and Maximum Net Data Rates over Air Interface

Table 43: Coding Schemes and Maximum Net Data Rates over Air Interface

Multi slot definition(GPRS/EDGE)

Slot class DL slot number UL slot number Active slot number
1 1 1 2

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2 2 1 3
3 2 2 3
4 3 1 4

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5 2 2 4
6 3 2 4

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7 3 3 4
8 4 1 5
9 3 2 5

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10 4 2 5
11 4 EN 3 5
12 4 4 5
GPRS coding scheme Max data rata（4 slots） Modulation type
CS 1 = 9.05 kb/s / time slot 36.2 kb/s GMSK
D
CS 2 = 13.4 kb/s / time slot 53.6 kb/s GMSK
CS 3 = 15.6 kb/s / time slot 62.4 kb/s GMSK
FI

CS 4 = 21.4 kb/s / time slot 85.6 kb/s GMSK

EDGE coding scheme Max data rata（4 slots） Modulation type
N

MCS 1 = 8.8 kb/s/ time slot 35.2 kb/s GMSK

MCS 2 = 11.2 kb/s/ time slot 44.8 kb/s GMSK
O

MCS 3 = 14.8 kb/s/ time slot 59.2 kb/s GMSK

MCS 4 = 17.6 kb/s/ time slot 70.4 kb/s GMSK
C

MCS 5 = 22.4 kb/s/ time slot 89.6 kb/s 8PSK

MCS 6 = 29.6 kb/s/ time slot 118.4 kb/s 8PSK
M

MCS 7 = 44.8 kb/s/ time slot 179.2 kb/s 8PSK

MCS 8 = 54.4 kb/s/ time slot 217.6 kb/s 8PSK
O

MCS 9 = 59.2 kb/s/ time slot 236.8 kb/s 8PSK

LTE-FDD device category
C

Max data rate（peak） Modulation type

(Downlink)
M

Category M1 1Mbps QPSK/16QAM

LTE-FDD device category
SI

Max data rate（peak） Modulation type

(Uplink)
Category M1 375kbps QPSK/16QAM
 Smart Machine Smart Decision

D. Related Documents

Table 44: Related Documents

NO. Title Description

[1] SIM7000 Series AT Command AT Command Manual
Manual V1.xx
[2] GSM 07.07 Digital cellular telecommunications (Phase 2+); AT command
set for GSM Mobile Equipment (ME)

LE
[3] GSM 07.10 Support GSM 07.10 multiplexing protocol
[4] GSM 07.05 Digital cellular telecommunications (Phase 2+); Use of Data
Terminal Equipment – Data Circuit terminating Equipment

FI
(DTE – DCE) interface for Short Message Service (SMS)
and Cell Broadcast Service (CBS)
[5] GSM 11.14 Digital cellular telecommunications system (Phase 2+);

AL
Specification of the SIM Application Toolkit for the
Subscriber Identity Module – Mobile Equipment (SIM – ME)
interface

IT
[6] GSM 11.11 Digital cellular telecommunications system (Phase 2+);
Specification of the Subscriber Identity Module – Mobile
Equipment (SIM – ME) interface
[7] GSM 03.38
EN
Digital cellular telecommunications system (Phase 2+);
Alphabets and language-specific information
[8] GSM 11.10 Digital cellular telecommunications system (Phase 2)；
D
Mobile Station (MS) conformance specification； Part 1:
Conformance specification
FI

[9] 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5);

Mobile Station (MS) conformance specification
N

[10] 3GPP TS 34.124 Electromagnetic Compatibility (EMC) for mobile terminals

and ancillary equipment.
O

[11] 3GPP TS 34.121 Electromagnetic Compatibility (EMC) for mobile terminals

and ancillary equipment.
C

[12] 3GPP TS 34.123-1 Technical Specification Group Radio Access Network;

Terminal conformance specification; Radio transmission and
reception (FDD)
M

[13] 3GPP TS 34.123-3 User Equipment (UE) conformance specification; Part 3:

Abstract Test Suites.
O

[14] EN 301 908-02 V2.2.1 Electromagnetic compatibility and Radio spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for
C

IMT-2000. Third Generation cellular networks; Part 2:

Harmonized EN for IMT-2000, CDMA Direct Spread
M

(UTRA FDD) (UE) covering essential requirements of article

3.2 of the R&TTE Directive
SI

[15] EN 301 489-24 V1.2.1 Electromagnetic compatibility and Radio Spectrum Matters
(ERM); Electromagnetic Compatibility (EMC) standard for
radio equipment and services; Part 24: Specific conditions for
IMT-2000 CDMA Direct Spread (UTRA) for Mobile and
portable (UE) radio and ancillary equipment
[16] IEC/EN60950-1(2001) Safety of information technology equipment (2000)
[17] 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5);
Mobile Station (MS) conformance specification
[18] 2002/95/EC Directive of the European Parliament and of the Council of
27 January 2003 on the restriction of the use of certain
SIM7000 _Hardware Design _V1.05 2018-12-24
 Smart Machine Smart Decision
hazardous substances in electrical and electronic equipment
(RoHS)
[19] Module secondary-SMT-UGD Module secondary SMT Guidelines
V1.xx
[20] SIM7000 Series UART This document describes how to use UART interface of
Application Note_V1.xx SIMCom modules.
[21] ETSI EN 301 908-13 IMT cellular networks; Harmonized EN covering the
(ETSI TS 136521-1 R13.4.0) essential requirements of article 3.2 of the R&TTE
Directive; Part 13
[22] ANTENNA DESIGN

LE
Design notice for multi-antenna.
GUIDELINES FOR
MULTI-ANTENNA SYSTEM
V1 01

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 Smart Machine Smart Decision

E. Terms and Abbreviations

Table 45: Terms and Abbreviations

Abbreviation Description
ADC Analog-to-Digital Converter
ARP Antenna Reference Point
BER Bit Error Rate

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BD BeiDou
BTS Base Transceiver Station
CS Coding Scheme

FI
CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter

AL
DSP Digital Signal Processor
DTE Data Terminal Equipment (typically computer, terminal, printer)
DTR Data Terminal Ready

IT
DTX Discontinuous Transmission
DAM Downloadable Application Module
EN
DPO Dynamic Power Optimization
EFR Enhanced Full Rate
EGSM Enhanced GSM
D
EMC Electromagnetic Compatibility
ESD Electrostatic Discharge
FI

ETS European Telecommunication Standard

FCC Federal Communications Commission (U.S.)
N

FD SIM fix dialing phonebook

FDMA Frequency Division Multiple Access
O

FR Full Rate
GMSK Gaussian Minimum Shift Keying
C

GNSS Global Navigation Satellite System

GPRS General Packet Radio Service
M

GPS Global Positioning System

GSM Global Standard for Mobile Communications
O

HR Half Rate
I2C Inter-Integrated Circuit
C

IMEI International Mobile Equipment Identity

M

LTE Long Term Evolution

MO Mobile Originated
SI

MS Mobile Station (GSM engine), also referred to as TE

MT Mobile Terminated
NMEA National Marine Electronics Association
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCS Personal Communication System, also referred to as GSM 1900
RF Radio Frequency
RMS Root Mean Square (value)

SIM7000 _Hardware Design _V1.05 2018-12-24

 Smart Machine Smart Decision
RTC Real Time Clock
SIM Subscriber Identification Module
SMS Short Message Service
SMPS Switched-mode power supply
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
TX Transmit Direction
UART Universal Asynchronous Receiver & Transmitter
VSWR Voltage Standing Wave Ratio

LE
SM SIM phonebook
NC Not connect
EDGE Enhanced data rates for GSM evolution

FI
ZIF Zero intermediate frequency
WCDMA Wideband Code Division Multiple Access
VCTCXO Voltage control temperature-compensated crystal oscillator

AL
SIM Universal subscriber identity module
UMTS Universal mobile telecommunications system
UART Universal asynchronous receiver transmitter

IT
PSM Power saving mode
FD SIM fix dialing phonebook
EN
LD SIM last dialing phonebook (list of numbers most recently dialed)
MC Mobile Equipment list of unanswered MT calls (missed calls)
D
ON SIM (or ME) own numbers (MSISDNs) list
RC Mobile Equipment list of received calls
FI

SM SIM phonebook
N

NC Not connect
O
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SIM7000 _Hardware Design _V1.05 2018-12-24

 Smart Machine Smart Decision

F. Safety Caution

Table 46: Safety Caution

Marks Requirements
When in a hospital or other health care facility, observe the restrictions about the use
of mobiles. Switch the cellular terminal or mobile off, medical equipment may be
sensitive and not operate normally due to RF energy interference.

LE
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden to

FI
prevent interference with communication systems. Forgetting to think much of these
instructions may impact the flight safety, or offend local legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or

AL
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any

IT
electrical equipment in potentially explosive atmospheres can constitute a safety
hazard. EN
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. RF interference can occur if it is used close to TV sets, radios,
computers or other electric equipment.
D
Road safety comes first! Do not use a hand-held cellular terminal or mobile when
driving a vehicle, unless it is securely mounted in a holder for hands free operation.
FI

Before making a call with a hand-held terminal or mobile, park the vehicle.
N

GSM cellular terminals or mobiles operate over radio frequency signals and cellular
networks and cannot be guaranteed to connect in all conditions, especially with a
O

mobile fee or an invalid SIM card. While you are in this condition and need emergent
help, please remember to use emergency calls. In order to make or receive calls, the
C

cellular terminal or mobile must be switched on and in a service area with adequate
cellular signal strength.
M

Some networks do not allow for emergency call if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may have to
O

deactivate those features before you can make an emergency call.

C

Also, some networks require that a valid SIM card be properly inserted in the cellular
terminal or mobile.
M
SI

SIM7000 _Hardware Design _V1.05 2018-12-24

 Smart Machine Smart Decision
Contact us:
Shanghai SIMCom Wireless Solutions Ltd.
Add: SIM Technology Building, No.633, Jinzhong Road, Changning District, Shanghai P.R. China
200335
Tel：+86 21 3157 5100 \ +86 21 3157 5200
URL：www.simcom.com

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