ARPIT PATEL

UTKARSH SHAH
 Background

CVD involves the dissociation and/or chemical reactions of gaseous

reactants in an activated (heat, light, plasma) environment followed by the
formation of a stable solid product.
The formation of soot due to incomplete oxidation of firewood since prehistoric
times is probably the oldest example of deposition using CVD.
Patent literature by de Lodyguine in 1893 on the deposition of W onto carbon
lamp filaments through the reduction of WCl 6 by H 2 lead to the industrial
exploitation of CVD.

2
 What is CVD?
Chemical vapor deposition (CVD) is a process whereby a solid
material is deposited from a vapor by a chemical reaction
occurring on or in the vicinity of a normally heated substrate
surface.
The solid material is obtained as a coating, a powder, or as single
crystals.
By varying the experimental conditions—substrate material,
substrate temperature, composition of the reaction gas mixture,
total pressure gas flows, etc.—materials with different properties
can be grown.
CVD is an example for Solid-Vapor Reaction.
3
 Main Components of CVD Equipment

1. Chemical vapour precursor supply system

 The role of this component is to generate vapour precursors and

then deliver to the reactor.
 The design of the CVD reactor depends on whether the starting
material is solid, liquid or gas.
 The sublimation of a solid precursor depends on surface area of the
solid and contact time.
 Liquid sources often use a bubbler to vaporise the reactants, and a
carrier gas (reactive gases such as H2 or inert gases such as Ar) to
transport the vaporised reactants into the reactor.
4
2. CVD reactors
Hot-wall reactor:

 In this the substrate (wafer) and the walls of the reactor are heated, i.e. a
homogeneous temperature is maintained inside the reaction chamber.

Disadvantage of hot-wall reactor

Contamination

Cold-wall reactor:

 This reactors uses heating systems that minimize the heating up of the reactor
walls while the wafer is being heated up. The temperature is not homogeneous
inside the reaction chamber.

Disadvantage of cold-wall reactor

It is difficult to get a uniform layer of the film. 5

3. The effluent gas handling system

This component consists of a neutralizing part for the exhaust

gases, and/or a vacuum system to provide the required reduced
pressure for the CVD process that performs at low pressure or high
vacuum during deposition.
The unreacted precursors and corrosive by-products such as HCl
are neutralised or trapped using a liquid nitrogen trap.
Inflammable gases such as hydrogen are burned off.
Unreacted expensive precursors may be collected at the outlet and
recycled.
6
 CVD Equipment

 In a typical CVD process, the substrate is exposed to one or more

volatile precursors which react and decompose on the substrate
surface to produce the desired deposit.
 During this process, volatile by-products are also produced,
which are removed by gas flow through the reaction chamber.
7
 Steps Involved

Transport of Transport of Chemical

reactants by reactants by Adsorption of decomposition
forced diffusion from reactants in and other
convection to the main gas the substrate surface
the deposition stream to the (wafer) reactions take
region. substrate surface. place.
surface.

Transport of
by-products by Desorption of
Transport of
forced by-products
by-products by
convection from the
diffusion.
away from the surface.
deposition
region.

8
 Mechanism

Main Gas Flow

Gas Phase Reaction

Desorption of
Precursor
Desorption of
Volatile Surface
Transport to Reaction Products
Surface

Surface Diffusion Step Growth

Adsorption of Film Precursor Nucleation and Island Growth 9
 Types
Low Pressure CVD

LPCVD

Atmospheric Metal Organic

Pressure CVD APCVD MOCVD CVD

CVD

Plasma Photon (Laser)

Enhanced CVD PECVD PHCVD Induced CVD

13
 Atmospheric pressure chemical vapour deposition (APCVD)

 It works at atmospheric pressure.

 It is used to deposit a layer of material typically several
micrometers thick onto a wafer or other type of substrate.
 It is also used as a surface finishing process for items such as tools
and turbine blades to improve lifetime and performance.
 Since a vacuum system is not required, APCVD systems have a
relatively low operating cost.
 APCVD has inherently poor utilization.
 APCVD is extremely susceptible to oxidation due to the greater
gas density and residence times.
14
 Low pressure chemical vapour deposition (LPCVD)

 LPCVD coatings exhibit excellent uniformity, high purity, and

good step coverage.
 It works at sub-atmospheric pressures. Reduced pressures tend
to reduce unwanted gas-phase reactions and improve film
uniformity across the wafer.
 The lower pressure increases the precursor diffusion through the
gas and the mass transfer rate of the gaseous reactants becomes
higher than the surface-reaction rate.
 The pressure for LPCVD is usually around 10-1000 Pa while
standard atmospheric pressure is 101,325 Pa.
15
 Metal-organic chemical vapour deposition (MOCVD)

 Metal-organic compounds are used as molecular precursors to

deposit, a wide variety of thin film materials for new industrial
applications.
 The great advantage of MOCVD precursors are their high
volatility at moderate to low temperatures, therefore reaction
temperatures are lower (750 to 1100 K) than conventional CVD.
 The main disadvantages are the precursors tend to be very
expensive and are very volatile. When reactive liquids are used
they require accurate pressure control and are difficult to purify.

16
 Laser chemical vapour deposition (LCVD)

 LCVD uses a focussed laser beam to heat the substrate.

 It also has the ability to locally heat a part of the substrate while
passing the reactant gas, thereby inducing film deposition by
locally driving the CVD reaction at the surface.
 It is used to deposit microscale solid patterns or three
dimensional structures on the surface of a substrate by a
localized, single step process.

17
 Plasma-enhanced chemical vapour deposition (PECVD)

 PECVD is used to deposit SiO2, Si3N4 (SixNy), SixOyNz and

amorphous Si films.
 Plasma can be used to decompose a molecule that will not
decompose at a reasonable elevated temperature.
 It can be used to decompose a thermally unstable molecule but
at a much lower temperature.
 In plasma CVD substrates that cannot tolerate high temperatures,
such as polymers, can be used, where substrate temperatures
range from 100 to 500°C.

18
 Advantages
 CVD films are generally quite conformal, i.e., the ability of a film
to uniformly coat a topographically complex substrate.

 Versatile –any element or compound can be deposited.

 High purity can be obtained.

 High density – nearly 100% of theoretical value.

 CVD films are harder than similar materials produced using

conventional ceramic fabrication processes.

 Material formation well below the melting point.

 Economical in production, since many parts can be coated at the
same time. 20
 Disadvantages
o Chemical and safety hazards caused by the use of toxic,
corrosive, flammable and/or explosive precursor. Therefore extra
steps have to be taken in the handling of the precursors and in
the treatment of the reactor exhaust.

o High deposition temperatures (often greater than 600 °C) are

often unsuitable for structures already fabricated on substrates.

o Restrictions on the kind of substrates that can be coated.

o It leads to stresses in films deposited on materials with different
thermal expansion coefficients, which can cause mechanical
instabilities in the deposited films.
21
 Applications

 Coatings – Coatings for a variety of applications such as wear

resistance, corrosion resistance, high temperature protection.

 Semiconductors and related devices – Integrated circuits, sensors

and optoelectronic devices.

 Fiber optics – for telecommunication.

 Used in the microelectronics industry to make films serving as
dielectrics, conductors, passivation layers, oxidation barriers, and
epitaxial layers.

22
23