Features: SN761683B TV Tuner Ic
Features: SN761683B TV Tuner Ic
TV TUNER IC
www.ti.com SLES180 – MAY 2006
FEATURES
TSSOP PACKAGE
• Single-Chip Mixer/Oscillator and (TOP VIEW)
Phase-Locked Loop (PLL) Synthesizer
• Three-Band Local Oscillator and Mixer VLO OSC B 1 32 UHF RF IN2
• Inter-Integrated Circuit (I2C) Bus Protocol VLO OSC C 2 31 UHF RF IN1
(Bidirectional Data Transmission) OSC GND 3 30 VHF RF IN2
VHI OSC B 4 29 VHF RF IN1
• 30-V Tuning-Voltage Output
VHI OSC C 5 28 RF GND
• Four NPN-Type Band-Switch (BS) Drivers UHF OSC B1 6 27 MIX OUT2
• Programmable Reference Divider Ratio UHF OSC C1 7 26 MIX OUT1
(512, 640, or 1024) UHF OSC C2 8 25 BS4
• 5-V Power Supply UHF OSC B2 9 24 BS3
• 32-Pin Thin Shrink Small-Outline Package IF GND 10 23 BS2
(TSSOP) IF OUT1 11 22 BS1
IF OUT2 12 21 NC
APPLICATIONS VCC 13 20 ADC
• TVs CP 14 19 AS
• VCR/DVD Recorders VTU 15 18 SDA
• Set-Top Boxes XTAL 16 17 SCL
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN761683B
TV TUNER IC www.ti.com
SLES180 – MAY 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the bipolar device.
UHF OSC B1
UHF OSC C1
UHF OSC C2
UHF OSC B2
VLO OSC B
VLO OSC C
VHI OSC B
VHI OSC C
MIX OUT1
MIX OUT2
OSC GND
VCC
VHF-L VHF-H UHF
Oscillator Oscillator Oscillator
IF
Amplifier
IF OUT1
IF OUT2
IF GND
VHF RF IN1 VHF UHF
VHF RF IN2 Mixer Mixer
UHF RF IN1
UHF RF IN2
CP
1/8 1/32, 1/33 15-Bit
Prescaler Prescaler Counter
AS
5-Level
ADC
BS4
ADC
BS1
BS2
BS3
B0089-02
TERMINAL FUNCTIONS
TERMINAL
DESCRIPTION SCHEMATIC
NAME NO.
ADC 20 ADC input Figure 1
AS 19 Address selection input Figure 2
BS1 22 Band-switch 1 output (NPN emitter follower) Figure 3
BS2 23 Band-switch 2 output (NPN emitter follower) Figure 3
BS3 24 Band-switch 3 output (NPN emitter follower) Figure 3
BS4 25 Band-switch 4 output (NPN emitter follower) Figure 3
CP 14 Charge-pump output Figure 4
IF GND 10 IF ground
IF OUT1 11 IF output 1 Figure 5
IF OUT2 12 IF output 2 Figure 5
MIX OUT1 26 Mixer output 1 Figure 6
MIX OUT2 27 Mixer output 2 Figure 6
NC 21 No connection
OSC GND 3 Oscillator ground
RF GND 28 RF ground
SCL 17 Serial clock input Figure 7
SDA 18 Serial data input/output Figure 8
UHF OSC B1 6 UHF oscillator base 1 Figure 9
UHF OSC B2 9 UHF oscillator base 2 Figure 9
UHF OSC C1 7 UHF oscillator collector 1 Figure 9
UHF OSC C2 8 UHF oscillator collector 2 Figure 9
UHF RF IN1 31 UHF RF input 1 Figure 10
UHF RF IN2 32 UHF RF input 2 Figure 10
VCC 13 Supply voltage for mixer/oscillator/PLL: 5 V
VHF RF IN1 29 VHF RF input 1 Figure 11
VHF RF IN2 30 VHF RF input 2 Figure 11
VHI OSC B 4 VHF HIGH oscillator base Figure 12
VHI OSC C 5 VHF HIGH oscillator collector Figure 12
VLO OSC B 1 VHF LOW oscillator base Figure 13
VLO OSC C 2 VHF LOW oscillator collector Figure 13
VTU 15 Tuning voltage amplifier output Figure 14
XTAL 16 4-MHz crystal oscillator input Figure 15
150 kW
20 19
50 kW
S0159-01
S0133-03
Figure 1. Figure 2.
22
23
24
14
50 kW 25
S0138-02
S0156-01
Figure 3. Figure 4.
26
27
11
12
S0160-01
S0155-01
Figure 5. Figure 6.
17 18
S0136-03
S0133-02
Figure 7. Figure 8.
31 32
8 7
9 6
3 kW 3 kW
S0142-05
S0130-01
5
29 30
3 kΩ
4
3 kW 3 kW
S0142-04
S0129-01
15
2
3 kW 3 kW
S0129-02
S0157-01
16
S0158-01
Figure 15.
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Voltage values are with respect to IF GND.
(3) Derating factor is 8.33 mW/°C for TA ≥ 25°C.
FUNCTIONAL DESCRIPTION
(1) Acknowledge
(1)
Table 4. Test Bits
T2 T1 T0 DEVICE OPERATION NOTE
0 0 0 Normal operation
0 0 1 Normal operation Default
0 1 X Charge pump is off.
1 1 0 Charge pump is sink.
1 1 1 Charge pump is source.
1 0 X Test mode ADC not available
Telegram Examples
Abbreviations
(1) Acknowledge
t(High)
tr
t(Low)
SCL
thd(STA)
tsu(DAT)
tf
thd(DAT ) tsu(STO)
tsu(STA)
SDA
t(BUF)
T0101-01
APPLICATION INFORMATION
C21 R1
C50
L3 C7 L10 C31
6 UHFOSCB1 MIXOUT2 27
R22
U1
C33
C11
VC3
7 UHFOSCC1 MIXOUT1 26
C8 L9
L4
R5 C9
8 UHFOSCC2 BS4 25 UB
C12
R33 R23
9 UHFOSCB2 BS3 24 FMB
C10
10 IF GND BS2 23 HB
R32 C13
11 IFOUT1 BS1 22 LB
IFOUT2 C16
12 IFOUT2 21 R21
NC
C14
R19
13 VCC ADC 20 ADC
R8
C65 C17 R18
C18
14 CP AS 19 AS
R7
C20 R17
15 VTU SDA 18 SDA
R9 C24 X1 R16
C22 16 XTAL SCL 17 SCL
C39
VTU VCC
NOTE: This application information is advisory, and a performance check is required for actual application circuits. TI
assumes no responsibility for the consequences of use of this circuit, such as an infringement of intellectual property
rights or other rights, including patents, of third parties.
TEST CIRCUITS
SG DUT Spectrum
VOUT Diff Analyzer
RF IN1 IF OUT1 Gc = 20log(VOUT Diff/VIN)
50 W = 20log(VOUT/VIN) + 6
VIN VOUT 50 W
50 W RF IN2 IF OUT2
50 W
S0145-01
NF
Meter
Noise
DUT
Source
B0090-01
Signal
Generator
fdes: P = 80 dBmV
Mix Modulation
Pad DUT
Analyzer
fdes ±6 MHz
AM 30%, 1 kHz
Signal
Generator
B0091-01
TYPICAL CHARACTERISTICS
5
VCC = 5.5 V
S-Parameter
50MHz
400MHz
900MHz 300MHz
60MHz
30MHz
www.ti.com 26-Mar-2014
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 26-Mar-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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