Scribd
Upload
129 views

Setting of The Temperature Parameters For ACHI Series IR600 PDF

Uploaded by

Alberto J. Acevedo T.
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
129 views

Setting of The Temperature Parameters For ACHI Series IR600 PDF

Uploaded by

Alberto J. Acevedo T.
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 2

ACHI ®

Settings of parameter for ACHI® series BGA Rework Stations


1 First, we need to know the difference between lead ball(the melting point


is 183  ) and lead-free ball(217  ).secondly, please do the accurate

judgement on the ball you will rework.

2  Generally speaking, you’ll do the work of reballing after removed the

chips. Please chosse to use the temperature parameters of lead or lead free

depends on the balls you used.

3  It’s often the incomplete weld when there is problem of the BGA chips.


there is no need to remove the chips. to use repairing welding methods has

a high success rate about 85%. There is no need to remove the chips at first.

you could try as the following methods:


1. Use FLUX   liquid to scour clean the balls at bottom of BGA chip.

2. welding it.

4  How to set temperature curve which you need  this problem is very

simple  As we know the melting point of Lead ball is 183  and that of

Lead free is 217


  . When we debugging as with Lead-free soldering

rework  , we will temporarily ignore the temperature segments and curve !

First Set maximum temperature at 220  and then RUN, this is a very

critical time right now! when the upper temperature arise to about 200  . at

this time we should observe carefully liquefaction developing of the solder



balls from the side! you can use tweezers lightly touching chips. the chip

can be sliding. the chip will be downward collapse, when the balls was

fully liquefaction  at this time you need to see the temperature values and
 www.easyBGA.com
ACHI ®
time showed by the temperature controller or soft extend the time of this

temperature 10 -15 seconds longer after the solder ball became liquid now,

this temperature values and time is an ideal combination!

For example: we are reworking a Lead-free BGA chip, suppose the 160 
is the second last segments the temperature values   first we must

measurement the calefactive time from 160   to 220 suppose the time

is 40 sec. current the last segments of parameter is 


r1 1.00
  l4=220 d4=80 .

begin to run, the balls began to liquefaction when we saw at 220  and

lasted 15 Sec. So, we can draw a conclusion :

1 From 160
   to 220 the calefactive time is 40 sec.

2 At 220
  and need to lasted 15 Sec

3 40 sec
 15 sec +10 sec 65 sec

220  25 Sec

160  40 Sec

Finally, we will modification parameter of the last temperature segments 


r4 1.00
  l4 220 d4 65.

This is the temperature parameter you wanted


Thanks for your attention!

www.easyBGA.com

You might also like