www.osram-os.

com
Produktdatenblatt | Version 1.1
LA G6SP.01
 

LA G6SP.01
Advanced Power TOPLED ®
Latest version of Advanced Power TOPLED with
increased brightness and improved thermal manage-
ment.

Applications
——Signalling

Features:
——Package: white SMT package, colorless clear silicone resin
——Chip technology: Thinfilm
——Typ. Radiation: 120° (Lambertian emitter)
——Color: λdom = 617 nm (● amber)
——Corrosion Robustness Class: 3B
——Qualifications: The product qualification test plan is based on the guidelines of IEC60810, Lamps for
road vehicles – Performance requirements – Requirements and test conditions for LED packages.
——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)




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Ordering Information 
Type Luminous Intensity 1) Ordering Code
IF = 140 mA
Iv

LA G6SP.01-8D6F-24-G3R3 6.3 ... 14.0 cd Q65112A5628




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Maximum Ratings
Parameter Symbol Values

Operating Temperature Top min. -40 °C

max. 125 °C
Storage Temperature Tstg min. -40 °C
max. 125 °C
Junction Temperature 2) Tj max. 135 °C
Junction Temperature for short time applications* Tj max. 150 °C
Forward current IF min. 5 mA
TS = 25 °C max. 200 mA
Surge Current IFS max. 1000 mA
t ≤ 10 µs; D = 0.005 ; TS = 25 °C
Reverse voltage 3) VR max. 12 V
TS = 25 °C
ESD withstand voltage VESD 2 kV
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

*The median lifetime (L70/B50) for Tj =150°C is 100h.




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Characteristics
IF = 140 mA; TS = 25 °C
Parameter Symbol Values

Peak Wavelength λpeak typ. 624 nm

Dominant Wavelength 4) λdom min. 612 nm
IF = 140 mA typ. 617 nm
max. 624 nm
Spectral Bandwidth at 50% Irel,max ∆λ typ. 18 nm
Viewing angle at 50 % IV 2φ typ. 120 °
Forward Voltage 5) VF min. 1.90 V
IF = 140 mA typ. 2.20 V
max. 2.50 V
Reverse current 3) IR typ. 0.01 µA
VR = 12 V max. 10 µA
Real thermal resistance junction/solderpoint 6) RthJS real typ. 35 K / W
max. 50 K / W
Electrical thermal resistance junction/solderpoint 6) RthJS elec. typ. 22 K / W
with efficiency ηe = 37 % max. 32 K / W




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Brightness Groups 
Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7)
IF = 140 mA IF = 140 mA IF = 140 mA
min. max. typ.
Iv Iv ΦV

8D 6.3 cd 7.1 cd 20.1 lm

5E 7.1 cd 8.0 cd 22.7 lm
6E 8.0 cd 9.0 cd 25.5 lm
7E 9.0 cd 10.0 cd 28.5 lm
8E 10.0 cd 11.2 cd 31.8 lm
5F 11.2 cd 12.5 cd 35.6 lm
6F 12.5 cd 14.0 cd 39.8 lm

Forward Voltage Groups 

Group Forward Voltage 5) Forward Voltage 5)
IF = 140 mA IF = 140 mA
min. max.
VF VF

G3 1.90 V 2.05 V
K3 2.05 V 2.20 V
N3 2.20 V 2.35 V
R3 2.35 V 2.50 V

Wavelength Groups 

Group Dominant Wavelength 4) Dominant Wavelength 4)
IF = 140 mA IF = 140 mA
min. max.
λdom λdom

2 612 nm 616 nm
3 616 nm 620 nm
4 620 nm 624 nm


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Group Name on Label 

Example: 5E-2-G3
Brightness Wavelength Forward Voltage

5E 2 G3




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Relative Spectral Emission 7)

Irel = f (λ); IF = 140 mA; TS = 25 °C

LA G6SP.01
1,0
Irel
: Vλ
:

0,8

0,6

0,4

0,2

0,0
350 400 450 500 550 600 650 700 750 800
λ [nm]

Radiation Characteristics 7)

Irel = f (ϕ); TS = 25 °C
LA G6SP.01

ϕ [°]
-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°
-20° 1,0
Irel
-30°

-50°

-40° 0,8

0,6
-60°

0,4
-70°

-80° 0,2

-90° 0,0

-100°


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Forward current 7), 8)

Relative Luminous Intensity 7), 8)

IF = f(VF); TS = 25 °C Iv/Iv(140 mA) = f(IF); TS = 25 °C

LA G6SP.01
200
LA G6SP.01 IV
IF [mA]
IV(140mA) 1,4
180

1,2
160

140 1,0

120
0,8

100
0,6
80

60 0,4

40
0,2

20
0,0
5

20

40
60
80

0
0

0
5
1,7 1,8 2,0 2,2 2,4 2,5

10
12

16

20
VF [V] IF [mA]




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Forward Voltage 7)
Relative Luminous Intensity 7)

∆VF = VF - VF(25 °C) = f(Tj); IF = 140 mA Iv/Iv(25 °C) = f(Tj); IF = 140 mA

LA G6SP.01 LA G6SP.01
0,3 Iv 1,4
∆VF [V]
Iv(25°C)
1,2
0,2

1,0
0,1

0,8

0,0

0,6

-0,1
0,4

-0,2
0,2

-0,3 0,0
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Tj [°C] Tj [°C]

Dominant Wavelength 7)

∆λdom = λdom - λdom(25 °C) = f(Tj); IF = 140 mA
LA G6SP.01
10
∆λ dom [nm]

5

0

-5

-10
-40 -20 0 20 40 60 80 100 120
Tj [°C]


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Max. Permissible Forward Current

IF = f(T)

LA G6SP.01
220
IF [mA]
200

180

160

140

120
: Ts
100

80

60

40

20

0
0 20 40 60 80 100 120
Ts [°C]

Permissible Pulse Handling Capability Permissible Pulse Handling Capability

IF = f(tp); D: Duty cycle IF = f(tp); D: Duty cycle
LA G6SP.01 LA G6SP.01

TS = 0°C ... 116°C TS = 125°C

IF [A] 1,2 IF [A] 1,2

1,0  1,0

: D = 1.0 : D = 1.0
: D = 0.5 0,8 : D = 0.5
0,8 : D = 0.2 : D = 0.2
: D = 0.1 : D = 0.1
: D = 0.05 : D = 0.05
: D = 0.02 0,6 : D = 0.02
0,6 : D = 0.01 : D = 0.01
: D = 0.005 : D = 0.005

0,4
0,4

0,2

0,2
10-6 10-5 10-4 10-3 0,01 0,1 1 10 10-6 10-5 10-4 10-3 0,01 0,1 1 10
Pulse time [s] Pulse time [s]


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Dimensional Drawing 9)

Approximate Weight: 40.0 mg

Package marking: Cathode

Corrosion test: Class: 3B


Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC
60068-2-43)


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Recommended Solder Pad 9)

0.8 (0.031)
min 9 mm 2 per anode pad for 0.8 (0.031)
improved heat dissipation

A A

1.4 (0.055)
4.7 (0.185)

A C A
Package
marking

0.35 (0.014)
0.35 (0.014) Package
marking
0.6 (0.024)

Lötstopplack
Solder resist OHLPY925

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not
suitable for ultra sonic cleaning.




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Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
240 ˚C Tp 245 ˚C
217 ˚C tP
200
tL

150
tS

100

50
25 ˚C
0
0 50 100 150 200 250 s 300
t

Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit

Minimum Recommendation Maximum
Ramp-up rate to preheat*) 2 3 K/s
25 °C to 150 °C
Time tS tS 60 100 120 s
TSmin to TSmax
Ramp-up rate to peak*)
TSmax to TP  2 3 K/s

Liquidus temperature TL 217 °C

Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peak tP 10 20 30 s
temperature TP - 5 K
Ramp-down rate* 3 6 K/s
TP to 100 °C
Time 480 s
25 °C to TP

All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range


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Taping 9)




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Tape and Reel 10)

Reel dimensions [mm]

A W Nmin W1 W2 max Pieces per PU

180 mm 12 + 0.3 / - 0.1 60 12.4 + 2 18.4 1000




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Barcode-Product-Label (BPL)

Dry Packing Process and Materials 9)

Moisture-sensitive label or print

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inf pa
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OS

Humidity indicator
Barcode label
Do not eat.
Avoid metal contact.
Discard if circles overrun.
bag opening.
Please check the HIC immidiately after

check dot WET

Comparator

bake units
examine units, if necessary 15%
If wet,

bake units
examine units, if necessary 10%
If wet,

change desiccant
parts still adequately dry. 5%
If wet,

MIL-I-8835
Humidity Indicator

Desiccant
AM
OSR

OHA00539

Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.


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Transportation Packing and Materials 9)

Barcode label Barcode label

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Packing
Sealing label OHA02044

Dimensions of transportation box in mm

Width Length Height

195 ± 5 mm 195 ± 5 mm 30 ± 5 mm




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Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this
data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding effect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this LED contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize LED exposure to aggressive substances during storage, pro-
duction, and use. LEDs that showed visible discoloration when tested using the described tests above did
show no performance deviations within failure limits during the stated test duration. Respective failure limits
are described in the IEC60810.
For further application related informations please visit www.osram-os.com/appnotes




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Disclaimer
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language word-
ings.

Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on the OSRAM OS webside.

Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For
packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to
invoice you for any costs incurred.

Product safety devices/applications or medical devices/applications

OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.

In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-
nate the customer-specific request between OSRAM OS and Buyer and/or Customer.




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Glossary
1)
Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of
k = 3).
2)
Package discoloration: The LED chip exhibits excellent performance but slight package discoloration
occurs at highest temperatures.
3)
Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-
tion is not allowed.
4)
Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-
ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k =
3).
5)
Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an
internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage
factor of k = 3).
6)
Thermal Resistance: Rth max is based on statistic values (6σ).
7)
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data
or calculated correlations of technical parameters can only reflect statistical figures. These do not nec-
essarily correspond to the actual parameters of each single product, which could differ from the typical
data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical
improvements, these typ. data will be changed without any further notice.
8)
Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-
ences between single LEDs within one packing unit.
9)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
10)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.




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Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.


21 Version 1.0 | 2018-07-06