Opa 237
Opa 237
SSOP−16
Single/Dual
OPA237
Quad
(Obsolete)
SOT−23−5
OPA2237
MSOP Dual
Single
OPA4237
SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007
+In 3 4 −In
SOT23−5
OPA4237
Out A 1 16 Out D
OPA237 OPA2237
−In A 2 15 −In D
A D
NC 1 8 NC Out A 1 8 V+ +In A 3 14 +In D
−In 2 7 V+ −In A 2
A
7 Out B V+ 4 13 V−
Out B 7 10 Out C
SO−8 SO−8, MSOP−8
NC 8 9 NC
SSOP−16
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicroAmplifier is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
Copyright 1996-2007, Texas Instruments Incorporated
! !
www.ti.com
"#$
""#$
%"#$ www.ti.com
SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007
PACKAGE/ORDERING INFORMATION(1)
PRODUCT PACKAGE−LEAD PACKAGE DRAWING PACKAGE MARKING
Single
SOT23-5 DBV A37A
OPA237NA
OPA237UA SO-8 D OPA237UA
Dual
MSOP-8 DGK B37A
OPA2237EA
OPA2237UA SO-8 D OPA2237UA
Quad(2)
SSOP-16 DBQ OPA4237UA
OPA4237UA
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website
at www.ti.com.
(2) Quad version is obsolete.
2
"#$
""#$
www.ti.com
%"#$
SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007
OPA237UA, NA
OPA2237UA, EA
OPA4237UA
PARAMETER CONDITIONS MIN TYP MAX UNITS
OFFSET VOLTAGE
Input Offset Voltage VCM = 2.5V ±250 ±750 µV
vs Temperature(1) Specified Temperature Range +2 +5 µV/°C
vs Power Supply (PSRR) VS = +2.7V to +36V 10 30 µV/V
Channel Separation (dual and quad) 0.5 µV/V
INPUT BIAS CURRENT
Input Bias Current(2) VCM = 2.5V −10 −40 nA
Input Offset Current VCM = 2.5V ±0.5 ±10 nA
NOISE
Input Voltage Noise, f = 0.1 to 10Hz 1 µVPP
Input Voltage Noise Density, f = 1kHz 28 nV/√Hz
Current Noise Density, f = 1kHz 60 fA/√Hz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range −0.2 (V+) −1.5 V
Common-Mode Rejection Ratio VCM = −0.2V to 3.5V 78 86 dB
INPUT IMPEDANCE
Differential 5 • 106 || 4 Ω || pF
Common-Mode 5 • 109 || 2 Ω || pF
OPEN-LOOP GAIN
Open-Loop Voltage Gain VO = 0.5V to 4V 80 88 dB
FREQUENCY RESPONSE
Gain-Bandwidth Product 1.4 MHz
Slew Rate G=1 0.5 V/µs
Settling Time, 0.1% G = −1, 3V Step, CL = 100pF 11 µs
0.01% G = −1, 3V Step, CL = 100pF 16 µs
OUTPUT
Voltage Output, Positive RL = 100kΩ to Ground (V+) −1 (V+) −0.75 V
Negative RL = 100kΩ to Ground 0.01 0.001 V
Positive RL = 100kΩ to 2.5V (V+) −1 (V+) −0.75 V
Negative RL = 100kΩ to 2.5V 0.12 0.04 V
Positive RL = 10kΩ to 2.5V (V+) −1 (V+) −0.75 V
Negative RL = 10kΩ to 2.5V 0.5 0.35 V
Short-Circuit Current −10/+4 mA
Capacitive Load Drive (stable operation) See Typical Characteristic Curves
POWER SUPPLY
Specified Operating Voltage +5 V
Operating Range +2.7 +36 V
Quiescent Current (per amplifier) 170 350 µA
TEMPERATURE RANGE
Specified Range −40 +85 °C
Operating Range −55 +125 °C
Storage Range −55 +125 °C
Thermal Resistance, qJA
SOT23-5 200 °C/W
MSOP-8 150 °C/W
SSOP-16 (Obsolete) 150 °C/W
SO-8 150 °C/W
(1) Specified by wafer-level test to 95% confidence.
(2) Positive conventional current flows into the input terminals.
3
"#$
""#$
%"#$ www.ti.com
SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007
OPA237UA, NA
OPA2237UA, EA
OPA4237UA
PARAMETER CONDITIONS MIN TYP MAX UNITS
OFFSET VOLTAGE
Input Offset Voltage VCM = 1V ±250 ±750 µV
vs Temperature(1) Specified Temperature Range +2 +5 µV/°C
vs Power Supply (PSRR) VS = +2.7V to +36V 10 30 µV/V
Channel Separation (dual and quad) 0.5 µV/V
INPUT BIAS CURRENT
Input Bias Current(2) VCM = 1V −10 −40 nA
Input Offset Current VCM = 1V ±0.5 ±10 nA
NOISE
Input Voltage Noise, f = 0.1 to 10Hz 1 µVPP
Input Voltage Noise Density, f = 1kHz 28 nV/√Hz
Current Noise Density, f = 1kHz 60 fA/√Hz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range −0.2 (V+) −1.5 V
Common-Mode Rejection Ratio VCM = −0.2V to 1.2V 75 85 dB
INPUT IMPEDANCE
Differential 5 • 106 || 4 Ω || pF
Common-Mode 5 • 109 || 2 Ω || pF
OPEN-LOOP GAIN
Open-Loop Voltage Gain VO = 0.5V to 1.7V 80 88 dB
FREQUENCY RESPONSE
Gain-Bandwidth Product 1.2 MHz
Slew Rate G=1 0.5 V/µs
Settling Time, 0.1% G = −1, 1V Step, CL = 100pF 5 µs
0.01% G = −1, 1V Step, CL = 100pF 8 µs
OUTPUT
Voltage Output, Positive RL = 100kΩ to Ground (V+) −1 (V+) −0.75 V
Negative RL = 100kΩ to Ground 0.01 0.001 V
Positive RL = 100kΩ to 1.35V (V+) −1 (V+) −0.75 V
Negative RL = 100kΩ to 1.35V 0.06 0.02 V
Positive RL = 10kΩ to 1.35V (V+) −1 (V+) −0.75 V
Negative RL = 10kΩ to 1.35V 0.3 0.2 V
Short-Circuit Current −5/+3.5 mA
Capacitive Load Drive (stable operation) See Typical Characteristic Curves
POWER SUPPLY
Specified Operating Voltage +2.7 V
Operating Range +2.7 +36 V
Quiescent Current (per amplifier) 160 350 µA
TEMPERATURE RANGE
Specified Range −40 +85 °C
Operating Range −55 +125 °C
Storage Range −55 +125 °C
Thermal Resistance, qJA
SOT23-5 200 °C/W
MSOP-8 150 °C/W
SSOP-16 (Obsolete) 150 °C/W
SO-8 150 °C/W
(1) Specified by wafer-level test to 95% confidence.
(2) Positive conventional current flows into the input terminals.
4
"#$
""#$
www.ti.com
%"#$
SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007
OPA237UA, NA
OPA2237UA, EA
OPA4237UA
PARAMETER CONDITIONS MIN TYP MAX UNITS
OFFSET VOLTAGE
Input Offset Voltage VCM = 0V ±350 ±950 µV
vs Temperature(1) Specified Temperature Range +2.5 +7 µV/°C
vs Power Supply (PSRR) VS = ±1.35V to ±18V 10 30 µV/V
Channel Separation (dual and quad) 0.5 µV/V
INPUT BIAS CURRENT
Input Bias Current(2) VCM = 0V −8.5 −40 nA
Input Offset Current VCM = 0V ±0.5 ±10 nA
NOISE
Input Voltage Noise, f = 0.1 to 10Hz 1 µVPP
Input Voltage Noise Density, f = 1kHz 28 nV/√Hz
Current Noise Density, f = 1kHz 60 fA/√Hz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range (V−)−0.2 (V+) −1.5 V
Common-Mode Rejection Ratio VCM = −15V to 13.5V 80 90 dB
INPUT IMPEDANCE
Differential 5 • 106 || 4 Ω || pF
Common-Mode 5 • 109 || 2 Ω || pF
OPEN-LOOP GAIN
Open-Loop Voltage Gain VO = −14V to 13.8V 80 88 dB
FREQUENCY RESPONSE
Gain-Bandwidth Product 1.5 MHz
Slew Rate G=1 0.5 V/µs
Settling Time, 0.1% G = −1, 10V Step, CL = 100pF 18 µs
0.01% G = −1, 10V Step, CL = 100pF 21 µs
OUTPUT
Voltage Output, Positive RL = 100kΩ (V+) −1.2 (V+) −0.9 V
Negative RL = 100kΩ (V−) +0.5 (V−) +0.3 V
Positive RL = 10kΩ (V+) −1.2 (V+) −0.9 V
Negative RL = 10kΩ (V−) +1 (V−) +0.85 V
Short-Circuit Current −8/+4.5 mA
Capacitive Load Drive (stable operation) See Typical Characteristic Curves
POWER SUPPLY
Specified Operating Range ±15 V
Operating Range ±1.35 ±18 V
Quiescent Current (per amplifier) ±200 ±475 µA
TEMPERATURE RANGE
Specified Range −40 +85 °C
Operating Range −55 +125 °C
Storage Range −55 +125 °C
Thermal Resistance, qJA
SOT23-5 200 °C/W
MSOP-8 150 °C/W
SSOP-16 (Obsolete) 150 °C/W
SO-8 150 °C/W
(1) Specified by wafer-level test to 95% confidence.
(2) Positive conventional current flows into the input terminals.
5
"#$
""#$
%"#$ www.ti.com
SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007
TYPICAL CHARACTERISTICS
At TA = +25°C and RL = 10kΩ, unless otherwise noted.
Phase (_)
VS = ±15V
40 −90
60
+PSR
20 −135 (VS = +2.7V)
40
120
Channel Separation (dB)
Voltage Noise (nV/√Hz)
Current Noise (fA/√Hz)
110
Current Noise
100
100 Dual and quad devices.
G = 1, all channels.
Quad measured channel
90 A to D or B to C other
combinations yield improved
Voltage Noise rejection.
80
10
10 100 1k 10k 100k
1 10 100 1k 10k 100k
Frequency (Hz)
Frequency (Hz)
12 −11
VS = +2.7V
Input Bias Current (nA)
−10
10
−9
8 VS = ±15V
VS = ±15V −8
6
−7
4 −6
−75 −50 −25 0 25 50 75 100 125 −15 −10 −5 0 5 10 15
Temperature (_ C)
Common−Mode Voltage (V)
6
"#$
""#$
www.ti.com
%"#$
SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007
0 0
−750
−650
−550
−450
−350
−250
−150
−50
−950
−850
−750
−650
−550
−450
−350
−250
−150
−50
50
150
250
350
450
550
650
750
50
150
250
350
450
550
650
750
850
950
Offset Voltage (µV) Offset Voltage (µV)
15 8
6
10
4
5 0.6% 0.2% 0.4%
0.2% 0.2% 2
0.2%
0 0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
6.5
7
7.5
8
0.5
1.5
2.5
3.5
4.5
5.5
6.5
7.5
8.5
9.5
10.5
11.5
6 90
4 80
VS = +2.7V, +5V VS = ±15V
0.4% 0.2% 70
2 0.4%
0 60
−75 −50 −25 0 25 50 75 100 125
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
6.5
7
7.5
8
Temperature (_C)
Offset Voltage Drift (µV/_ C)
7
"#$
""#$
%"#$ www.ti.com
SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007
20mV/div
1µs/div 2µs/div
10
1V/div
VS = +2.7V,
0.01%
1V Step
0.1%
1
−1 −10 −100
10µs/div Gain (V/V)
SMALL−SIGNAL OVERSHOOT
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
V+ vs LOAD CAPACITANCE
70
(V+) −0.5 G = +1, V S = +2.7V, +5V
Sourcing Current G = +1, V S = ±15V
(V+) −1 60
Output Voltage Swing (V)
30
(V−) +2 +125_ C
Sinking Current
(V−) +1.5 −55_ C 20
(V−) +1
+25_C
(V−) +0.5 10
+125_C
V−
0
0 1 2 3 4 5
10 100 1k 10k
Output Current (mA)
Load Capacitance (pF)
8
"#$
""#$
www.ti.com
%"#$
SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007
25 250 VS = ±15V
VS = ±15V
8
VS = ±15V VS = +2.7V
6
−
ISC
4
+
ISC
2
VS = ±15V VS = +2.7V VS = +5V
0
−75 −50 −25 0 25 50 75 100 125
Temperature (_C)
9
"#$
""#$
%"#$ www.ti.com
SBOS057A − OCTOBER 1996 − REVISED FEBRUARY 2007
OPERATING VOLTAGE
100k
OPA237 series op amps operate from single (+2.7V to OPERATION NOT
+36V) or dual (±1.35V to ±18V) supplies with excellent RECOMMENDED
performance. Most behavior remains unchanged 10k
RH
10Ω
To Load
R5
IH
383kΩ
R3 High−Side
R1 38.3kΩ Current Sense
V+
38.3kΩ
−In
A1 Out
VO = 10 • IH • RH
+In OPA237
R4 R2 V−
V+ for A1, A2 20kΩ 19.1kΩ
+
R8 R2 and R4 divide down the
2.7V to = ±15V common−mode input to A1.
100kΩ
V− for A1, A2
V+
−In
A2 Out
VO = 10 • IL • RL
+In OPA237
Low−Side
R6 R7 V− Current Sense Common−mode range of A2
10kΩ 9.09kΩ extends to V− for low−side sensing
RL Optional for IB Cancellation
10Ω (R7 = R6 II R8)
To Load
IL
10
PACKAGE OPTION ADDENDUM
www.ti.com 10-Jun-2014
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
OPA2237EA/250 ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAU | Level-3-260C-168 HR B37A
& no Sb/Br) CU NIPDAUAG
OPA2237EA/250G4 ACTIVE VSSOP DGK 8 250 Green (RoHS CU NIPDAU Level-3-260C-168 HR B37A
& no Sb/Br)
OPA2237EA/2K5 ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU | Level-3-260C-168 HR -40 to 85 B37A
& no Sb/Br) CU NIPDAUAG
OPA2237EA/2K5G4 ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 B37A
& no Sb/Br)
OPA2237UA ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR OPA
& no Sb/Br) 2237UA
OPA2237UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR OPA
& no Sb/Br) 2237UA
OPA2237UA/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR OPA
& no Sb/Br) 2237UA
OPA2237UAE4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR OPA
& no Sb/Br) 2237UA
OPA237NA/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR A37A
& no Sb/Br)
OPA237NA/250E4 ACTIVE SOT-23 DBV 5 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR A37A
& no Sb/Br)
OPA237NA/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR A37A
& no Sb/Br)
OPA237NA/3KE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR A37A
& no Sb/Br)
OPA237UA ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR OPA
& no Sb/Br) 237UA
OPA237UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR OPA
& no Sb/Br) 237UA
OPA237UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR OPA
& no Sb/Br) 237UA
OPA4237UA/250 OBSOLETE SSOP DBQ 16 TBD Call TI Call TI
OPA4237UA/2K5 OBSOLETE SSOP DBQ 16 TBD Call TI Call TI 0 to 70
(1)
The marketing status values are defined as follows:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Jun-2014
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Aug-2014
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Aug-2014
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated