Mosfets Prod Guide
Mosfets Prod Guide
PRODUCT GUIDE
MOSFETs
SEMICONDUCTOR http://www.semicon.toshiba.co.jp/eng
C O N T E N T S
1 Features and Structures ....................................................................... 3
2 Toshiba’s MOSFET Product Lines and Part Numbering Schemes ........ 4
2-1 MOSFET Product Lines ................................................................................... 4
2-2 Part Numbering Schemes ................................................................................ 5
3 Selection Guide (By Absolute Maximum Ratings) ............................. 6
4 Low-VDSS MOSFETs (in Small SMD Packages) ................................. 16
4-1 Packaging Options ......................................................................................... 16
• SSM Series
• TPC Series
4-2 Application Examples and Block Diagrams .................................................... 17
• Cell Phone (Power Supply Circuit)
• Notebook PC (Power Supply Circuit)
• Lithium-Ion Secondary Battery (Battery Protection Circuits)
• Motor Driver (Power Driver Circuit)
4-3 Low-VDSS MOSFET Roadmaps ..................................................................... 19
Toshiba’s MOSFET devices • Roadmap for Trench MOSFETs
• Package Options
meet the needs of a wide range 4-4 Low-VDSS, High-Speed MOSFETs ................................................................. 21
• Synchronous Rectification DC-DC Converters
of ultra-high-density applications. – Block Diagram, Timing Chart and Power Loss Factors
– Summary Results of Power Loss Simulation and Key Parameters for MOSFETs
– Efficiency Improvement by Thermally Enhanced Package and New Process Technology
– MOSBD (MOSFET with SBD)
• High-Speed MOSFET Offerings
4-5 Low-VDSS, Low-RDS(ON) MOSFETs (for Lithium-Ion Battery Protection) ......... 26
• Lithium-Ion Battery Protection Circuit Trend
• MOSFET Roadmap
• Low-ON-resistance N-Channel Power MOSFETs
• Low-ON-resistance P-Channel Power MOSFETs
4-6 Semi-Power MOSFET Offerings .................................................................... 28
• Semi-Power P-Channel Single MOSFETs
• Semi-Power N-Channel Single MOSFETs
• Semi-Power Dual MOSFETs
• MOSFET with a Schottky Barrier Diode
• VS-6 Series … [Part Number: TPC6xxx]
• VS-8 Series … [Part Number: TPCF8xxx]
• PS-8 Series … [Part Number: TPCP8xxx]
• Chip LGA Series ... [Part Number: TPCL4xxx]
• STP2 Series ... [Part Number: TPCT4xxx]
• TSON Advance Series … [Part Number: TPCC8xxx]
• TSSOP Advance Series … [Part Number: TPCM8xxx]
• SOP-8 Series … [Part Number: TPC8xxx]
• SOP Advance Series … [Part Number: TPCA8xxx]
• DPAK Series ... [Part Number: TKxxPxxxM1]
4-7 Standard MOSFET Series (ID < 500 mA)....................................................... 36
• Single MOSFETs
• Dual MOSFETs
5 Low-VDSS, High-Qg MOSFETs ............................................................. 37
5-1 TO-220SM(W) Series ..................................................................................... 37
5-2 U-MOS (Trench Type) Series ......................................................................... 38
5-3 U-MOS Series for Synchronous Rectification (VDSS = 60 V to 150 V) ............ 39
6 Mid- and High-VDSS MOSFETs .............................................................40
6-1 π-MOSVII Series (VDSS = 450 V to 650 V) ..................................................... 40
6-2 Super-Junction DTMOS Series (VDSS = 600 V, 650 V) ................................... 41
6-3 High-speed π-MOS Series (VDSS = 450 V to 600 V)....................................... 42
6-4 π-MOS Series................................................................................................. 43
7 MOSFET Part Numbers ........................................................................ 46
7-1 Alphanumeric Index of Part Numbers ............................................................ 46
8 Product Obsolescence ........................................................................ 53
8-1 End-of-Life Products ...................................................................................... 53
9 Packaging ............................................................................................. 55
9-1 Compact Surface-Mount Packages ................................................................ 55
9-2 Through-Hole Packages................................................................................. 66
2
1 Features and Structures
Double-Diffusion Structure
Source Gate
● π-MOS
n+
n + Toshiba Power MOSFETs use a double-diffusion MOS (D-MOS) structure, which
P P produces high-withstand voltage, to form channels. This structure is especially well
n–
suited to high-withstand voltage and high-current devices.
A high level of integration yields a high-performance Power MOSFET with low
n+ ON-resistance and low power loss.
Drain
Trench Structure
Source Gate
● U-MOS
n+ n+
Higher channel density is achieved by connecting channels vertically to form a
P P
U-groove at the gate region, a structure that yields a lower ON-resistance than
n– other MOSFET structures.
n+
Drain
Super-Junction Structure
Source Gate
● DTMOS
n+ n+
The super-junction structure, which has P-type pillar layers as shown left,
P P
realizes high withstand voltage and ON-resistance lower than the conventional
n
theoretical limit of silicon.
n+
Drain
3
2 Toshiba’s MOSFET Product Lines and Part Numbering
4
Schemes
SSM 3 K 101 TU
Package
Serial number of the products <3-pin> <4-pin> <6-pin>
F: S-Mini CT: CST4 FU: US6
Polarity and internal configuration FU: USM FE: ES6
K: N-channel, single FS: SSM TU: UF6
<5-pin>
J: P-channel, single FV: VESM CTD: CST6D
T: TSM F: SMV
N: N-channel, dual
TU: UFM FU: USV
P: P-channel, dual FE: ESV
CT: CST3
L: N-channel and P-channel (dual) TU: UFV
CTB: CST3B
E: N-channel and P-channel
(pre-wired as a load switch)
H: N-channel and SBD
G: P-channel and SBD
Pin count
Small-Signal MOSFET
TPCM8 0 01 -H TK 55 A 10 J 1 2SK ✽ ✽ ✽ ✽
H: High-speed type Additional information N-channel MOS
None: Low-ON-resistance type 1: Low-capacitance type
3: Low-ON-resistance type
Serial number of the products
0: N-channel, single 4: N-channel and P-channel, dual
5: Fast body diode type 2SJ ✽ ✽ ✽ ✽
1: P-channel, single A: N-channel and SBD P-channel MOS
2: N-channel, dual B: P-channel and SBD Series
3: P-channel, dual J: P-channel and NPN C: π-MOSVI K: U-MOSIV
D: π-MOSVII T: DTMOSI
TPC6: VS-6 Series J: U-MOSIII U: DTMOSII
TPCF8: VS-8 Series M: U-MOSVI
TPCP8: PS-8 Series
TPCC8: TSON Advance Series
Voltage: 10% of the VDSS
TPCS8: TSSOP-8 Series
TPCM8: TSSOP Advance Series Package
TPC8: SOP-8 Series A: TO-220SIS
TPCA8: SOP Advance Series D: TO-220(W)
TPCT4: STP Series F: TO-220SM(W)
TPCL4: Chip LGA J: TO-3P(N)
X: TFP
P: DPAK
Q: New PW-Mold2
Current rating
TK: N-channel
TJ: P-channel
5
3 Selection Guide (By Absolute Maximum Ratings)
SSM3K7002BF(3.3)➅ SSM6N7002BFU(3.3)➅
SSM3K7002BFS(3.3)➅ SSM6N7002FU(3.3)➂
2SJ305(4)➀
SSM3J05FU(4)➂ SSM3K7002F(3.3)➂ SSM6N7002AFU(3.3)➁
2SK2009(2)➀
0.2 SSM6P05FU(4)➂
SSM3J09FU(4.2)➂
SSM3K7002AF(3.3)➁ 2SJ168(2)➀ 0.2
SSM5P05FU(4)➂ SSM3K7002FU(3.3)➂ 2SK1062(1)➀
SSM6P09FU(4.2)➂
SSM3K7002AFU(3.3)➁
SSM6N7002BFE(3.3)➅
SSM6L05FU(1.2)➂
SSM6L09FU(1.2)➂
SSM6N05FU(1.2)➂
0.4 SSM3K05FU(1.2)➂
SSM6N09FU(1.2)➂ 0.4
SSM3K09FU(1.2)➂
SSM5N05FU(1.2)➂
SSM4K27CT(0.205)➅
SSM6L10TU(0.145)➅
SSM6L11TU(0.145)➅
SSM6L12TU(0.145)➅
SSM6N25TU(0.145)➅
SSM6N36TU(1.52)➅
SSM6P25TU(0.26)➅
SSM6P26TU(0.23)➅ 2SK2998 (20)➁
SSM6N24TU(0.145)➅
0.5 SSM6J25FE(0.26)➅
SSM6K24FE(0.145)➅
2SK3302 (18)➁ 0.5
SSM6J26FE(0.23)➅ 2SK3471 (18)➁
SSM6K25FE(0.145)➅
SSM6L36TU(1.52)➅
SSM3K36FS(1.52)➅
SSM3K36MFV(1.52)➅
SSM3K36TU(1.52)➅
SSM6N36FE(1.52)➅
SSM6L36FE(1.52)➅
SSM6N43FU(1.52)➅
SSM3K43FS(1.52)➅
Legend Notes:
Product series ➀ : π-MOSIII ➁ : π-MOSV ➂ : π-MOSVI Package PW-Mini VS-8 VS-6 ♠ PS-8 STP TO-92MOD PW-Mold New PW-Mold TSON Advance New PW-Mold2 DP TPS TSSOP Advance TSSOP-8 SOP-8 ( ) = RDS(ON) max ✽ = 1.8-V drive P = P-ch NS = N-ch + SBD PD = P-ch + Driver
PS = P-ch + SBD (load switch)
➃ : L2-π-MOSV ➄ : L2-π-MOSVI ➅ : U-MOS ➆ : π-MOSVII SOP-8 Lead Clamp SOP Advance TO-220NIS TO-220SIS TO-220AB TO-220(W) TFP TO-220FL/SM TO-220SM(W) TO-3P(N) TO-3P(N)IS TO-3P(L) Chip LGA $ = 10-V drive
# = 2.5-V drive
= High-speed diode
N = N-ch
CN = Complementary N-ch
CP = Complementary P-ch [ ] = Under development
➇ : π-MOSIV ➈ : DTMOSI ➉ : DTMOSII S-Mini TSM USM UFM SSM VESM CST3 CST3B CST4 SMV US6 UF6 ES6 CST6D USV UFV ESV
6 7
3 Selection Guide (By Absolute Maximum Ratings)
Notes:
Legend Product series ➀ : π-MOSIII ➁ : π-MOSV ➂ : π-MOSVI Package PW-Mini VS-8 VS-6 ♠ PS-8 STP TO-92MOD PW-Mold New PW-Mold TSON Advance New PW-Mold2 DP TPS TSSOP Advance TSSOP-8 SOP-8 ( ) = RDS(ON) max ✽ = 1.8-V drive P = P-ch NS = N-ch + SBD PD = P-ch + Driver
PS = P-ch + SBD (load switch)
➃ : L2-π-MOSV ➄ : L2-π-MOSVI ➅ : U-MOS ➆ : π-MOSVII SOP-8 Lead Clamp SOP Advance TO-220NIS TO-220SIS TO-220AB TO-220(W) TFP TO-220FL/SM TO-220SM(W) TO-3P(N) TO-3P(N)IS TO-3P(L) Chip LGA $ = 10-V drive
# = 2.5-V drive
= High-speed diode
N = N-ch
CN = Complementary N-ch
CP = Complementary P-ch [ ] = Under development
➇ : π-MOSIV ➈ : DTMOSI ➉ : DTMOSII S-Mini TSM USM UFM SSM VESM CST3 CST3B CST4 SMV US6 UF6 ES6 CST6D USV UFV ESV
8 9
3 Selection Guide (By Absolute Maximum Ratings)
Legend Notes:
Product series ➀ : π-MOSIII ➁ : π-MOSV ➂ : π-MOSVI Package PW-Mini VS-8 VS-6 ♠ PS-8 STP TO-92MOD PW-Mold New PW-Mold TSON Advance New PW-Mold2 DP TPS TSSOP Advance TSSOP-8 SOP-8 ( ) = RDS(ON) max ✽ = 1.8-V drive P = P-ch NS = N-ch + SBD PD = P-ch + Driver
PS = P-ch + SBD (load switch)
➃ : L2-π-MOSV ➄ : L2-π-MOSVI ➅ : U-MOS ➆ : π-MOSVII SOP-8 Lead Clamp SOP Advance TO-220NIS TO-220SIS TO-220AB TO-220(W) TFP TO-220FL/SM TO-220SM(W) TO-3P(N) TO-3P(N)IS TO-3P(L) Chip LGA $ = 10-V drive
# = 2.5-V drive
= High-speed diode
N = N-ch
CN = Complementary N-ch
CP = Complementary P-ch [ ] = Under development
➇ : π-MOSIV ➈ : DTMOSI ➉ : DTMOSII S-Mini TSM USM UFM SSM VESM CST3 CST3B CST4 SMV US6 UF6 ES6 CST6D USV UFV ESV
10 11
3 Selection Guide (By Absolute Maximum Ratings)
N TPC8037-H (0.0114)➅ N TPC8052-H (0.0115)➅ 2SJ201 (0.625) 2SK3068 (0.52)➁ TK12A53D (0.58)➆ TK12J55D (0.57)➆ 2SK2699 (0.65)➁ 1000V: 2SK1489 (1.0)
2SJ380 (0.21)➃
N TPC8038-H (0.0114)➅ 2SK1530 (0.625) 2SK3398 (0.52)➁ TK12X53D (0.58)➆ TK12A60U (0.4)➉
12 NS TPC8A06-H (0.0101)➅ TK12A50D (0.52)➆ TK12D60U (0.4)➉ 12
2SK3313 (0.62)➁ TK12J60U (0.4)➉
TK12A60D (0.55)➆
12.5 TK13A50DA (0.47)➆ 12.5
N TPC8041 (0.007)➅ N TPC8049-H (0.0107)➅ N TPC8051-H (0.0097)➅ 2SK2508 (0.25)➁ 2SK3743 (0.4)➁ TK13A50D (0.4)➆ TK13A60D (0.43)➆ 900V: 2SK4207 (0.95)
N TPC8026 (0.0066)➅ 2SK2598 (0.25)➁ 2SK3403 (0.4)➁ 2SK4016 (0.5)➂
P TPC8107 (0.007)➅ 2SK3544 (0.4)➁
13 P TPC8112 (0.006)➅ TK13A45D (0.46)➆ 13
P TPC8118 (0.007)
N TPCC8003-H (0.0169)➅
N TPC8040-H (0.0097)➅
2SJ304 (0.12) 2SK2916 (0.4)➁ TK14A55D (0.37)➆ 2SK3903 (0.44)➂
14 2SJ312 (0.12)
14
N TPC8032-H (0.0065)➅ TPCA8053-H (0.0223)➅ 2SK2382 (0.18)➁ TK15A50D (0.3)➆ 2SK2953 (0.4)➁
P TPCC8102 (0.0189)➅ 2SK2401 (0.18)➁ 2SK3314 (0.49)➁ TK15A60U (0.3)➉
TK15J50D (0.4)➆
15 TK15D60U (0.3)➉ 15
TK15J60U (0.3)➉
TK15A60D (0.37)➆
NS TPC8A02-H (0.0056)➅ N TPC8047-H (0.0076)➅ N TPC8048-H (0.0069)➅ 2SJ412 (0.21)➃ TK16J55D (0.37)➆
16 2SJ619 (0.21)➃
16
N TPC8033-H (0.0053)➅ 2SK3935 (0.25)➂ 2SK3905 (0.31)➂
17 NS TPC8A03-H (0.0056)➅ 17
N TPC8039-H (0.006)➅
P TPC8114 (0.0045)➅ N TPC8045-H (0.0039)➅ 2SJ464 (0.12)➃ 2SK2882 (0.12)➁ 2SK2917 (0.27)➁
N TPC8027 (0.0027)➅ N TPC8046-H (0.0057)➅ 2SJ620 (0.09)➃ 2SK3387 (0.12)➃ TK18A50D (0.27)➆
N TPC8028 (0.0043)➅
N TPC8029 (0.0038)➅ TPCA8006-H (0.067)
N TPC8034-H (0.0035)➅
N TPC8042 (0.0034)➅
18 P TPC8117 (0.0039)➅ 18
N TPC8036-H (0.0045)➅
NS TPC8A04-H (0.0036)➅
P TPC8120 (0.0032)➅
P TPCC8103 (0.012)➅
N TPC8035-H (0.0032)➅
N TPC8060-H (0.0037)➅
19 2SK3904 (0.26)➂ 19
NS TPCM8A05-H (0.0129)➅ N TPCA8052-H (0.0115)➅ 2SK2614 (0.046)➃ 2SJ349 (0.045)➃ 2SK2391 (0.085)➃ 2SK2993 (0.105)➁ TK20J50D (0.27)➆ 2SK3911 (0.32)➂
NS TPCA8A05-H (0.0129)➅ 2SJ401 (0.045)➃ TJ20A10M3 (0.090)➅ 2SK3445 (0.105)➁ TK20A60U (0.19)➉
20 N TPCM8001-H (0.0095)➅ 2SK2782 (0.055)➃ TK20D60U (0.19)➉ 20
2SK3994 (0.105)➁
TK20J60U (0.19)➉
2SK3906 (0.33)➂
N TPCM8003-H (0.0129)➅
21 21
NS TPCC8A01-H (0.0099)➅
N TPCC8001-H (0.0083)➅
22 N TPCC8002-H (0.0083)➅ TPCA8022-H (0.026)➅ 22
N TPCC8006-H (0.008)➅
Legend Notes:
Product series ➀ : π-MOSIII ➁ : π-MOSV ➂ : π-MOSVI Package PW-Mini VS-8 VS-6 ♠ PS-8 STP TO-92MOD PW-Mold New PW-Mold TSON Advance New PW-Mold2 DP TPS TSSOP Advance TSSOP-8 SOP-8 ( ) = RDS(ON) max ✽ = 1.8-V drive P = P-ch NS = N-ch + SBD PD = P-ch + Driver
PS = P-ch + SBD (load switch)
➃ : L2-π-MOSV ➄ : L2-π-MOSVI ➅ : U-MOS ➆ : π-MOSVII SOP-8 Lead Clamp SOP Advance TO-220NIS TO-220SIS TO-220AB TO-220(W) TFP TO-220FL/SM TO-220SM(W) TO-3P(N) TO-3P(N)IS TO-3P(L) Chip LGA $ = 10-V drive
# = 2.5-V drive
= High-speed diode
N = N-ch
CN = Complementary N-ch
CP = Complementary P-ch [ ] = Under development
➇ : π-MOSIV ➈ : DTMOSI ➉ : DTMOSII S-Mini TSM USM UFM SSM VESM CST3 CST3B CST4 SMV US6 UF6 ES6 CST6D USV UFV ESV
12 13
3 Selection Guide (By Absolute Maximum Ratings)
44 NS TPCA8A04-H (0.0032)➅ 44
$ 2SK3506 (0.02) $ 2SK2550 (0.03)➃ 2SK2233 (0.03)➃
N TPCA8019-H (0.0031)➅ 2SK2886 (0.02)➃ 2SK2266 (0.03)➃
45 N TPCA8026 (0.0022)➅ $ 2SK2744 (0.02)➃ 2SK2376 (0.017)➃ 45
N TPCA8042 (0.0033)➅ $ 2SK3051 (0.03)➃ $ 2SK2398 (0.03)➃
N TPCA8060-H (0.0034)➅ 2SK3844 (0.0058)➅
46 N TPCA8045-H (0.0036)➅ 46
N TPCA8028-H (0.0028)➅ N TK50P04M1 (0.0087)➅ $ 2SK2551 (0.011)➃ 2SK2173 (0.017)➃ 2SK1381 (0.032) TK50X15J1 (0.03)➅ 2SK3132 (0.09)➁
50 2SK3131 (0.11)➁ 50
N TK50P03M1 (0.0075)➅ 2SK2745 (0.0095)➃ $ 2SK2445 (0.018)➁ TK50F15J1 (0.03)➅
TK55D10J1 (0.0105)➅
55 TK55A10J1 (0.0105)➅
55
2SK2267 (0.011)➃ TK60D08J1 (0.0078)➅ 2SK1382 (0.020)
60 2SK2313 (0.011)➃ TK60A08J1 (0.0078)➅
60
TK70J04J3 (0.0038)➅ 2SK3845 (0.0058)➅
TK70X04K3 (0.0056)➅ TK70D06J1 (0.0064)➅
70 TK70X04K3L (0.0056)➅ TK70A06J1 (0.0064)➅ 70
TJ70A06J3 (0.008)➅
TK70X06K3 (0.008)➅
Notes:
Legend Product series ➀ : π-MOSIII ➁ : π-MOSV ➂ : π-MOSVI Package PW-Mini VS-8 VS-6 ♠ PS-8 STP TO-92MOD PW-Mold New PW-Mold TSON Advance New PW-Mold2 DP TPS TSSOP Advance TSSOP-8 SOP-8 ( ) = RDS(ON) max ✽ = 1.8-V drive P = P-ch NS = N-ch + SBD PD = P-ch + Driver
PS = P-ch + SBD (load switch)
➃ : L2-π-MOSV ➄ : L2-π-MOSVI ➅ : U-MOS ➆ : π-MOSVII SOP-8 Lead Clamp SOP Advance TO-220NIS TO-220SIS TO-220AB TO-220(W) TFP TO-220FL/SM TO-220SM(W) TO-3P(N) TO-3P(N)IS TO-3P(L) Chip LGA $ = 10-V drive
# = 2.5-V drive
= High-speed diode
N = N-ch
CN = Complementary N-ch
CP = Complementary P-ch [ ] = Under development
➇ : π-MOSIV ➈ : DTMOSI ➉ : DTMOSII S-Mini TSM USM UFM SSM VESM CST3 CST3B CST4 SMV US6 UF6 ES6 CST6D USV UFV ESV DPAK
14 15
4 Low-VDSS MOSFETs (in Small SMD Packages)
SSM Series
The SSM Series comes in small, thin packages suitable for portable devices. Chip-scale packages (1006 size) help reduce system size.
8
45
3
0.
35
1.
0.
1.
0.
1.2 2.1
25
1.6
15
22
0.
0.
3
0.
0.
0.
UFM S-Mini (SOT-346)(SC-59) TSM CST4 ESV (SOT-553)
Ultra-super-Mini Flat lead Super-Mini Thin Super-Mini Chip-Scale Package, Transfer Molded, 4-Pin Extreme Super-mini, 5-pin
Typical product: SSM3J130TU Typical product: SSM3K15F Typical product: SSM3J304T Typical product: SSM4K27CT Typical product: SSM5N15FE
1.5 1.6
1.7 1.2
2.0 Thickness: 2.9 Thickness: 2.9 Thickness: Thickness: Thickness:
0.7 typ. 1.1 typ. 0.7 typ. 0.8 1.2 0.38 typ. 1.6 0.55 typ.
9
9
1.
1.
5
3
0.
1.
5
0.
2.1 2.5 2.8 1.6
2
0.
Unit: mm Unit: mm Unit: mm Unit: mm Unit: mm
2
4
3
0.
0.
0.
0.
35
5
0.
3
0.
0.
0.
1.
1.6
15
2
Unit: mm Unit: mm Unit: mm Unit: mm Unit: mm
0.
0.
3
0.
1.2 1.7
5 Thickness: 2.0 Thickness:
2.0 0.9 typ. 0.7 typ.
65
65
0.
0.
2.1 2.1
2
0.
Unit: mm Unit: mm
3
0.
TPC Series
The TPC Series comes in small, thin packages suitable for portable devices. The latest TSON Advance package allows the maximum permissible
power dissipation equivalent to SOP-8, but occupies 64% less board space.
65
65
9
0.
0.
0.
2.8
3
33
3
Unit: mm Unit: mm
3
0.
0.
0.
0.
7
8
2
1.
6.4
0.
0.
1.
65
5
25
0.
3
4
25
0.
0.
0.
16
4-2 Application Examples and Block Diagrams
DC-DC converters
HS: SSM5G10TU
(P-ch + Schottky Barrier Diode)
LS: SSM5H12TU
(N-ch + Schottky Barrier Diode)
HS: TPC8037-H
LS: TPC8037-H
DDR TPC8A03-H
Charger LDO
HS: TPCP8005-H
LS: TPCP8005-H HS: TPC8037-H
Dual: TPC8216-H LS: TPC8037-H
3.3 V/5 V
CMS16
HS: TPC8037-H LDO
LS: TPC8037-H
1.8V
Battery 1
HS: TPC8037-H
LS: TPC8037-H
1.5 V
Battery 2
HS: TPC8037-H
LS: TPC8037-H
1.05 V
17
4 Low-VDSS MOSFETs (in Small SMD Packages)
Notebook PCs
Cell Phones (Example using P-channel MOSFETs)
P+ P- P- P+
Control IC
Control IC
Microcontroller
Motors
Power driver circuit
M
Controller
Interface
Pre-driver
Protection
circuit
18
4-3 Low-VDSS MOSFET Roadmaps
30 30
N-ch, VDSS = 30 V
25 U-MOSIV
Pch
U-MOSV
Ron*A (mOhm*mm2)
10 20
U-MOSIII
U-MOSVI
Qsw (nC)
15 Nch
U-MOSIV
3 10
U-MOSVI
U- 5
U- M
O
M SI
U- O I
M SV I-H
U- O
1 M SV -H
O
SV I-H 0 2005 2006 2007 2008 2009 2010
1 5 10 II-
RDS(ON) (mΩ) H
Package Options
100
SOP Advance
TSSOP Advance
TSON Advance
SOP-8
PS-8
10
VS-8
UF6 VS-6
Drain Current (A)
ES6 S-Mini
SMV
CST3B
UFV
US6
CST6D
19
4 Low-VDSS MOSFETs (in Small SMD Packages)
■ Ultra-Small Packages
S-Mini USM SSM VESM CST3 US6 USV ESV CST6D
2.5 mm 1.6 mm 1.2 mm 0.6 mm 1.6 mm 0.9 mm
2.1 mm 2.1 mm 2.1 mm
1.6 mm
2.0 mm
2.0 mm
2.0 mm
1.6 mm
2.9 mm
1.2 mm
1.0 mm
1.0 mm
0.425 mm 0.4 mm 0.2 mm 0.425 mm 0.425 mm 0.2 mm
0.5 mm
Footprint
7.3 mm2 4.2 mm2 2.6 mm2 1.4 mm2 0.6 mm2 4.2 mm2 4.2 mm2 2.6 mm2 0.9 mm2
Area
Permissible Power
Dissipation 0.2 W 0.2 W 0.1 W 0.15 W 0.1 W 0.2 W 0.2 W 0.15 W 0.14 W
(Note)
Height
(MAX)
1.4 mm 1.1 mm 0.9 mm 0.55 mm 0.4 mm 1.1 mm 1.1 mm 0.6 mm 0.4 mm
2.9 mm
1.2 mm
1.2 mm
2.0 mm
2.0 mm
2.0 mm
1.6 mm
0.2 mm 0.2 mm 0.2 mm 0.2 mm
0.6 mm 0.6 mm
Footprint
8.1 mm2 4.2 mm2 8.1 mm2 4.2 mm2 4.2 mm2 2.6 mm2 1.0 mm2 1.0 mm2
Area
Permissible Power
Dissipation 0.7 W 0.5 W 0.75 W 0.5 W 0.5 W 0.5 W 1.0 W 0.4 W
(Note)
Height
(MAX)
0.85 mm 0.75 mm 1.4 mm 0.75 mm 0.75 mm 0.6 mm 0.5 mm 0.4 mm
3.3 mm
6 mm
6 mm
2.8 mm
2.8 mm
1.59 mm
1.9 mm
0.65 mm
3.3 mm 0.95 mm 0.65 mm
3.5 mm
5 mm 5 mm
Footprint 16.3 mm2 10.9 mm2 Footprint 5.5 mm2 2.56 mm2
Area 30 mm2 30 mm2 Area 8.1 mm2 8.1 mm2
(−46%) (−64%) (–32%) (–68%)
20
4-4 Low-VDSS, High-Speed MOSFETs
Synchronous Rectification DC-DC Converters – Block Diagram, Timing Chart and Power Loss Factors
■ Block Diagram ■ Timing Chart
Control IC-side Synchronous-side T
(switch and high-side) (low-side)
MOSFETs MOSFET
ton(High)
L
D S
Vin Vout
G
D
VGS(High)
Control Load
IC C ton(Low)
Vcc G S
VGS(Low)
VDS(High)
High-side MOSFET: Conducting loss
IDS(Low)
Low-side MOSFET: Self-turn-on loss
ISBD(SBD)
VDS
(Low+SBD)
Dead time: Diode loss
Synchronous Rectification DC-DC Converters – Summary Results of Power Loss Simulation and Key Parameters for MOSFETs
8.00
Key Parameters to Improve Efficiency
Conditions Efficiency
7.00
• Input Voltage: 19 V 82.49% Synchronous-side MOSFET
• Output Voltage: 1.5 V
• Frequency: 1 MHz Others (drive loss, etc.) Very low RDS (ON)
6.00
Reduction of the self-turn-on losses
(low-side) MOSFET
Synchronous-side
Low Qrr
Power Dissipation (W)
Conducting loss
5.00
Low Cgd, Cgd/Cgs
Dead time loss (off) Low rg
4.00
Optimized Vth
Efficiency Self-turn-on loss
85.13% Dead time loss (on)
Shoot-through current control
3.00
Low Qg
Efficiency
(high-side) MOSFET
Turn-on loss
83.20% Switch-side MOSFET
Switch-side
2.00
Conducting loss
High-speed switching
Turn-on loss Low Qsw
1.00
Low rg
0.00 Low RDS (ON)
5 10 20
Output Current (A)
21
4 Low-VDSS MOSFETs (in Small SMD Packages)
Synchronous Rectification DC-DC Converters – Efficiency Improvement by Thermally Enhanced Package and New Process Technology
■ Thermally Enhanced Package
Toshiba has developed the SOP Advance package with the same footprint area as the standard SOP-8 package. With an external
heatsink on the bottom, the SOP Advance package offers enhanced thermal characteristics, realizing a high power dissipation and
thus high-current capability.
Unit: mm
6.0
6.0
5.0 5.0
1.9 Max
1.0 Max
SOP-8 SOP Advance Features of the SOP Advance
Footprint Area (mm2) 30 30 Same footprint area as the SOP-8
Total height (max) (mm) 1.9 1.0 Low profile, Thinner by 0.9 mm
Rth(ch-a) (t = 10 s) (Note 1) (˚C / W) 65.8 44.6 High power dissipation
Current rating (A) 18 40 High current-carrying capacity
Package resistance (Note 2) (mΩ) 1.6 0.5 Low package resistance
Note 1: When mounted on a glass-epoxy board (25.4 mm x 25.4 mm x 0.8 mm) Note 2: Without chip resistance
Efficiency Characteristics
f = 300 kHz, VIN = 19.5 V, VOUT = 1.1 V
90 90
Two low-side MOSFETs One low-side MOSFET
88 88
86 86
84 84
Efficiency (%)
Efficiency (%)
82 82
80 80
22
Synchronous Rectification DC-DC Converters – MOSBD (MOSFET with SBD)
■ External SBD
LS LS
LA LA
Large lrr
When an SBD is added externally, the SBD can’t function fully 1: Increase in the conducting loss of the body diode.
due to the influence of wire inductances (Ls and LA); thus a body 2: Increase in the reverse recovery loss due to high di/dt.
diode current during the dead time becomes larger and causes 3: Induces a self-turn-on phenomenon.
the following penalties.
● Current Waveform Simulation Using External SBD MOSFET with SBD (MOSBD)
20 20
MOSFET channel current MOSFET channel current
0.0 0.0
SBD current
Body diode current
-10 -10
-20 -20
691.01μ 691.04μ 691.07μ 691.10μ 691.01μ 691.04μ 691.07μ 691.10μ
time (s) time (s)
LS = LA = 0.5 nH LS = LA = 0.01 nH
Efficiency Characteristics
f = 300 kHz, VIN = 19.5 V, VOUT = 1.1 V
90 90
Two low-side MOSFETs One low-side MOSFET
88 88
86 86
84 84
Efficiency (%)
Efficiency (%)
82 82
80 80
23
4 Low-VDSS MOSFETs (in Small SMD Packages)
24
Absolute Maximum Ratings RDS(ON) Max (mΩ) Qsw Typ.(nC)
Circuit
Part Number Configuration Package @VDS = Series
VDSS (V) VGSS (V) ID (A) 4.5 V 10 V VDSS x 0.8
TPC8218-H ✩ 3.8 64 57 2.6 U-MOSVI-H
N-ch Dual
TPC8213-H 5 56 50 2.9 U-MOSIII-H
TPC8053-H ✩ 9 24.2 22.5 6.7 U-MOSVI-H
SOP-8
TPC8050-H ✩ 11 15.6 14.5 9.2 U-MOSVI-H
TPC8049-H ✩ 13 11.5 10.7 13 U-MOSVI-H
TPC8048-H ✩ 60 16 7.4 6.9 17 U-MOSVI-H
TPCA8053-H ✩ 15 24 22.3 6.9 U-MOSVI-H
TPCA8050-H ✩ 24 15.3 14.2 10 U-MOSVI-H
N-ch Single
TPCA8016-H 25 SOP Advance 26 21 6.6 U-MOSIII-H
TPCA8049-H ✩ 28 11.2 10.4 13 U-MOSVI-H
TPCA8048-H ✩ 35 7.1 6.6 19 U-MOSVI-H
TPC8051-H ✩ 13 SOP-8 10.1 9.7 16 U-MOSVI-H
80
TPCA8051-H ✩ 28 SOP Advance 9.8 9.4 18 U-MOSVI-H
TPCP8003-H 2.2 PS-8 190 180 2.0 U-MOSIII-H
TPC8214-H 100 2.2 N-ch Dual SOP-8 190 180 2.0 U-MOSIII-H
TPCA8022-H 22 SOP Advance — 26 14 U-MOSIII-H
TPCA8009-H 150 7 SOP Advance — 350 3.7 π-MOSV
N-ch Single
TPCA8010-H 200 ±20 5.5 SOP Advance — 450 3.7 π-MOSV
TPCA8008-H 250 4 SOP Advance — 580 3.7 π-MOSV
TPCP8A05-H ✩ 8 PS-8 21.9 17.5 2.7 U-MOSV-H
TPCC8A01-H ✩ 21 TSON Advance 12.6 9.9 4.1 U-MOSV-H
TPCM8A05-H ✩ 20 TSSOP Advance 17.2 12.9 3.7 U-MOSV-H
TPC8A05-H ✩ 10 17.6 13.3 3.7 U-MOSV-H
TPC8A06-H ✩ 12 12.9 10.1 4.5 U-MOSV-H
SOP-8
TPC8A03-H ✩ 30 17 MOSBD 7.0 5.6 8.4 U-MOSV-H
TPC8A04-H ✩ 18 4.5 3.6 13.4 U-MOSV-H
TPCA8A05-H ✩ 20 17.2 12.9 3.7 U-MOSV-H
TPCA8A02-H ✩ 34 6.7 5.3 8.6 U-MOSV-H
SOP Advance
TPCA8A08-H ✩ 38 5.1 3.9 11 U-MOSV-H
TPCA8A04-H ✩ 44 4.1 3.2 13.4 U-MOSV-H
TPCP8103-H –4.8 PS-8 54 40 6.5 U-MOSIII-H
TPC8116-H –40 –7.5 P-ch Single SOP-8 37 30 9.7 U-MOSIII-H
TPCA8107-H –7.5 SOP Advance 37 30 9.7 U-MOSIII-H
40 6.5 35 27 3.5 U-MOSIII-H
TPC8406-H N-ch/P-ch Dual SOP-8
–40 –6.5 37 30 9.7 U-MOSIII-H
✩: No protection Zener diode between gate and source
25
4 Low-VDSS MOSFETs (in Small SMD Packages)
Lithium-Ion Secondary
Battery Protection TSSOP-8 (6.4 mm x 3.3 mm x 0.9 mm)
2003 4.0-
PCM 3.5 mm
Control IC
MOSFET Roadmap
2003 2004 2005 2006 2007 2008 2009 2010
TSSOP Advance
SOP Advance
For Laptop PCs
SOP-8
TSON Advance
PS-8
STP
STP2
TSSOP-8
and PVC
Chip LGA
MOSFET + Control IC
26
Low-ON-resistance N-Channel Power MOSFETs
Absolute Maximum Ratings RDS(ON) Max (mΩ)
Circuit
Part Number Package Series
VDSS (V) VGSS (V) ID (A) Configuration 2.5 V 4V 4.5 V 10 V
TPCT4203 ✩ 20 ±12 6 49 32 — — U-MOSIV
STP2
TPCT4204 ✩ 30 ±12 6 52 39 — — U-MOSIV
TPCL4201 ✩ 20 ±12 6 N-ch Dual 52 — 31 — U-MOSV
TPCL4203 ✩✽ 24 ±12 6 Chip LGA 55 — 36 — U-MOSV
TPCL4202 ✩✽ 30 ±12 6 64 — 40 — U-MOSV
TPCP8006 ✩ 20 ±12 9.1 13.7 — 10 — U-MOSIV
N-ch Single
TPCP8004 ✩ 30 ±20 8.3 PS-8 — — 14 8.5 U-MOSIV
TPCP8202 30 ±12 5.5 N-ch Dual 39 24 23 — U-MOSIV
TPCC8007 ✩✽ 20 ±12 27 (8.7) — (4.6) — U-MOSIV
TSON Advance
TPCC8008✩ 30 ±25 25 — — 12.8 6.8 U-MOSIV
TPC8025 ✩ 30 ±20 11 — — 14.5 9 U-MOSIV
TPC8030 ✩ 30 ±25 11 — — 17 9 U-MOSIV
TPC8041 ✩ 30 ±20 13 — — 13.5 7 U-MOSIV
N-ch Single
TPC8026 ✩ 30 ±20 13 — — 10 6.6 U-MOSIV
TPC8028 ✩ 30 ±20 18 — — 8 4.3 U-MOSIV
TPC8029 ✩ 30 ±20 18 — — 7 3.8 U-MOSIV
SOP-8
TPC8042 ✩ 30 ±20 18 — — 6.5 3.4 U-MOSIV
TPC8027 ✩ 30 ±20 18 — — 5.5 2.7 U-MOSIV
TPC8208 20 ±12 5 70 50 — — U-MOSIII
TPC8207 20 ±12 6 30 20 — — U-MOSIII
N-ch Dual
TPC8211 30 ±20 5.5 — — 44 36 U-MOSIII
TPC8210 30 ±20 8 — — 20 15 U-MOSIII
TPCA8024 ✩ 30 ±20 35 — — 7.8 4.3 U-MOSIV
TPCA8025 ✩ 30 ±20 40 — — 6.0 3.5 U-MOSIV
SOP Advance N-ch Single
TPCA8042 ✩ 30 ±20 45 — — 5.7 3.3 U-MOSIV
TPCA8026 ✩ 30 ±20 45 — — 4.5 2.2 U-MOSIV
✩: No protection Zener diode between gate and source ✽: Under development
27
4 Low-VDSS MOSFETs (in Small SMD Packages)
0.25 0.65
D
0.65
1.2
0.45
ES6 SSM6J53FE –20 ±8 –1.8 364 204 136 — 568 U-MOSIV 0.3
(SOT-563) SSM6J206FE –20 ±8 –2.0 — 320 186 130 335 U-MOSIII
1.0
SSM6J205FE –20 ±8 –0.8 — 460 306 234 250 U-MOSIII
1.35
0.5 0.5
1.6
0.8
SSM3J109TU –20 ±8 –2.0 — 300 172 130 335 U-MOSIII
2.1
1.9
SSM3J114TU –20 ±8 –1.8 526 321 199 149 331 U-MOSIV
2.0 0.7
SSM3J108TU –20 ±8 –1.8 — 363 230 158 250 U-MOSIII 0.65 0.65
SSM3J113TU –20 ±12 –1.7 — — 249 169 370 U-MOSIII
SSM3J111TU –20 ±12 –1.0 — — 680 480 160 U-MOSIII
SSM3J117TU –30 ±20 –2.0 — — — 225 280 U-MOSII
SSM3J118TU –30 ±20 –1.4 — — — 480 137 U-MOSII
SSM3J112TU –30 ±20 –1.1 — — — 790 86 U-MOSII
SSM6J409TU –20 ±8 –9.5 72.3 46.3 30.2 22.1(@4.5V) 1100 U-MOSV
UF6
SSM6J51TU –12 ±8 –4.0 150 85 54 — 1700 U-MOSIV
SSM6J50TU –20 ±10 –2.5 — 205 (@2.0V) 100 64 (@4.5V) 800 U-MOSIV 0.45
2.1
0.8
SSM6J401TU –30 ±20 –2.5 — — — 145 730 U-MOSIII
2.0 0.7
1.9
SSM6J402TU –30 ±20 –2.0 — — — 225 280 U-MOSIII
US6(SOT-363) SSM6J08FU –20 ±12 –1.3 — 460 (@2.0V) 260 180 370 U-MOSII 0.65 0.65
2.1
2.4
2.4
28
Semi-Power N-Channel Single MOSFETs Unit: mm
RDS(ON) Max (mΩ)
VDSS VGSS ID Ciss *Internal Land Pattern
Package Part Number VGS = VGS = VGS = VGS = Series
(V) (V) (A) (pF) Connections Example
l 1.5 V l l 1.8 V l l 2.5 V l l 4.0 V l
CST4 D D 0.5
0.75
1.2
0.3
G S
0.8 0.38 0.2
TOP VIEW
0.45
SSM6K204FE 20 ±10 2.0 307 214 164 126 195 U-MOSIII 0.3
(SOT-563)
SSM6K208FE 30 ±12 1.9 — 296 177 133 123 U-MOSIII
1.0
1.35
SSM6K25FE 20 ±12 0.5 — 395 190 145 268 U-MOSIII
1.6
0.5 0.5
SSM6K24FE 30 ±12 0.5 — — 180 145 245 U-MOSIII
1.6 0.55
SSM6K22FE 20 ±12 1.4 — — 230 170 125 U-MOSIII
SSM6K210FE 30 ±20 1.4 — — — 371 57 U-MOSIII
SSM6K30FE 20 ±20 1.2 — — — 420 60 π-MOSVII
SSM6K31FE 20 ±20 1.2 — — — 540 36 π-MOSVII
SSM3K123TU 20 ±10 4.2 66 43 32 28 1010 U-MOSIII
SSM3K121TU 20 ±10 3.2 140 93 63 48 400 U-MOSIII
SSM3K104TU 20 ±12 3.0 — 110 74 56 320 U-MOSIII
SSM3K119TU 30 ±12 2.5 — 134 90 74 270 U-MOSIII
SSM3K102TU 20 ±12 2.6 — 154 99 71 268 U-MOSIII
UFM SSM3K122TU 20 ±10 2.0 304 211 161 123 195 U-MOSIII 0.5
0.8
2.1
1.9
SSM3K116TU 30 ±12 2.2 — — 135 100 245 U-MOSIII
2.0 0.7
SSM3K131TU 30 ±20 6.0 — — — 41.5(@4.5 V) 450 U-MOSIV 0.65 0.65
0.45
SSM6K406TU 30 ±20 4.4 — — — 38.5 (@4.5 V) 490 U-MOSIV
0.8
2.0 0.9
SSM6K07FU 30 ±20 1.5 — — — 220 102 π-MOSVI
SSM3K310T 20 ±10 5.0 66 43 32 28 1120 U-MOSIII
SSM3K309T 20 ±12 4.7 — 47 35 31 1020 U-MOSIII
29
4 Low-VDSS MOSFETs (in Small SMD Packages)
Q1
260
0.45
ES6 N-ch x 2 SSM6N42FE✽ 20 ±10 0.77 630 460 340 95 U-MOSIII 0.3
(@4.5 V)
(SOT-563) Q2
1.0
1.35
1.6
0.5 0.5
Q1
300
1.6 0.55 P-ch x 2 SSM6P41FE –20 ±8 –0.72 1040 670 440 110 U-MOSV
(@4.5 V) Q2
0.8
–20 ±8 –0.8 — 460 306 234 250 U-MOSIII
2.1
1.9
20 ±12 0.5 — 395 190 145 268 U-MOSIII
SSM6L10TU Q1
2.0 0.7
–20 ±8 –0.5 — 980 330 230 250 U-MOSIII
N-ch + P-ch 0.65 0.65
20 ±12 0.5 — 395 190 145 268 U-MOSIII Q2
SSM6L11TU
–20 ±12 –0.5 — — 430 260 218 U-MOSIII
30 ±12 0.5 — — 180 145 245 U-MOSIII
SSM6L12TU
–20 ±12 –0.5 — — 430 260 218 U-MOSIII
30 ±20 1.6 — — — 182 180 U-MOSIII
SSM6L40TU
–30 ±20 –1.4 — — — 403 120 U-MOSIII
20 10 0.05 — — 10 Ω — 11 π-MOSVI Q2
P-ch + N-ch
(Load Switch) –20 ±8 –1.8 364 204 136 — 568 U-MOSIV
SSM6E02TU
20 ±10 0.1 15 Ω — 4Ω 3Ω 9.3 π-MOSVI Q1
Q2
–20 ±8 –1.8 — 335 180 144 335 U-MOSIII
SSM6E03TU
20 ±10 0.1 15 Ω — 4Ω 3Ω 9.3 π-MOSVI
✽: Under development * The internal connection diagrams only show the general configurations of the circuits.
SSM5H10TU 20 ±10 1.6 247 190 139 119 260 U-MOSIII 20 0.7 0.39 0.5
2.1
1.9
SSM5H12TU 30 ±12 1.9 — 296 177 133 123 U-MOSIII 30 0.7 0.41 0.5
2.0 0.7 SSM5H05TU 20 ±12 1.5 — — 220 160 125 U-MOSIII 12 0.5 0.43 0.5
N-ch+ 0.65 0.65
SSM5H08TU 20 ±12 1.5 — — 220 160 125 U-MOSIII 20 0.5 0.45 0.3
SBD
SSM5H03TU 12 ±12 1.4 — — — 300 125 U-MOSII 12 0.5 0.43 0.5
SSM5H11TU 30 ±20 1.6 — — — 182 180 U-MOSIII 30 0.7 0.41 0.5
SSM5H01TU 30 ±20 1.4 — — — 450 106 U-MOSII 20 0.5 0.45 0.3
SSM5H07TU 20 ±20 1.2 — — — 540 36 π-MOSVII 12 0.5 0.43 0.5
* The internal connection diagrams only show the general configurations of the circuits.
30
MOSFET with a Schottky Barrier Diode Unit: mm
MOSFET SBD
RDS(ON) Max (mΩ) VF Max (V) *Internal Land Pattern
Package Polarity Part Number VDSS VGSS ID Ciss VR IO
Series @IF Connections Example
(V) (V) (A) VGS = VGS = VGS = VGS = (pF) (V) (A)
l 1.5 V l l 1.8 V l l 2.5 V l l 4.0 V l (A)
0.95 0.95
SMV
N-ch+
2.8
2.4
30 ±12 3.0 — 138 94 78 270 U-MOSIII 45 0.1 0.6 0.1
SBD SSM5H14F
1.0
2.9 1.1 0.8 0.6 0.8
* The internal connection diagrams only show the general configurations of the circuits.
■ Product Offerings
Absolute Maximum Ratings Circuit RDS(ON) Max (mΩ) Qg Typ. Ciss Typ.
Part Number Configuration Marking Series
VDSS (V) VGSS (V) ID (A) 10 V 4.5 V 2.5 V 2.0 V 1.8 V (nC) (pF)
TPC6004 20 ±12 6 — 24 32 37 — 17 1400 S2C U-MOSIII
TPC6011 ✩✽ 30 ±20 6 20 32 — — — 14 640 S2L U-MOSIV
N-ch
TPC6005 30 ±12 6 Single — 28 35 41 — 19 1420 S2E U-MOSIII
TPC6007-H 30 ±20 5 54 79 — — — 2.8 240 S2G U-MOSIII-H
TPC6006-H 40 ±20 3.9 75 100 — — — 2.4 251 S2F U-MOSIII-H
TPC6103 –12 ±8 –5.5 — 35 55 — 90 20 1520 S3C U-MOSIII
TPC6105 –20 ±8 –2.7 — 110 160 — 300 6 470 S3E U-MOSIII
TPC6107 –20 ±12 –4.5 P-ch — 55 100 180 — 9.8 680 S3G U-MOSIV
Single
TPC6111 –20 ±8 –5.5 — 40 57 — 80 10 700 S3L U-MOSV
TPC6108 –30 ±20 –4.5 60 100 — — — 13 570 S3H U-MOSIV
TPC6109-H –30 ±20 –5 59 83 — — — 7.2 471 S3J U-MOSIII-H
✩: No protection Zener diode between gate and source ✽: Under development
31
4 Low-VDSS MOSFETs (in Small SMD Packages)
32
TSON Advance Series … [Part Number: TPCC8xxx]
■ Features
• The small thermally enhanced package gives a 64% reduction in mounting area compared with
SOP-8, yet an equivalent maximum permissible power dissipation.
■ Product Offerings
Absolute Maximum Ratings Circuit RDS(ON) Max (mΩ) Qg Typ. Ciss Typ.
Part Number Configuration (nC) (pF) Series
VDSS (V) VGSS (V) ID (A) 10 V 4.5 V 4V 2.5 V
TPCC8007 ✩✽ 20 ±12 27 — (4.6) — (8.7) TBD TBD U-MOSIV
TPCC8008 ✩ 30 ±25 25 6.8 12.8 — — 30 1600 U-MOSIV
TPCC8003-H ✩ 30 ±20 13 16.9 19.3 — — 8.6 990 U-MOSVI-H
N-ch Single
TPCC8001-H ✩ 30 ±20 22 8.3 10.6 — — 14.3 1900 U-MOSV-H
U-MOSV-H,
TPCC8002-H ✩ 30 ±20 22 8.3 10.6 — — 14.3 1900
rg=3.2Ω(Typ.)
TPCC8A01-H ✩ 30 ±20 21 MOSBD 9.9 12.6 — — 10.1 1430 U-MOSV-H
TPCC8006-H ✩ 30 ±20 22 8.0 9.3 — — 15.0 1700 U-MOSVI-H
N-ch Single
TPCC8005-H ✩ 30 ±20 26 6.4 7.4 — — 19.0 2200 U-MOSVI-H
TPCC8102 ✩ –30 ±20 –15 18.9 — 33.2 — 26 1200 U-MOSV
P-ch Single
TPCC8103 ✩ –30 ±20 –18 12 — 22 — 38 1600 U-MOSV
✩: No protection Zener diode between gate and source ✽: Under development
■ Product Offerings
Absolute Maximum Ratings Circuit RDS(ON) Max (mΩ) Qg Typ. Ciss Typ.
Part Number Configuration Series
VDSS (V) VGSS (V) ID (A) 10 V 4.5 V 4V (nC) (pF)
TPCM8001-H 30 ±20 20 9.5 14 — 19 1130 U-MOSIII-H
TPCM8003-H ✩ 30 ±20 21 12.9 15.7 — 11 1433 U-MOSV-H
TPCM8004-H ✩ 30 ±20 24 N-ch Single 11 13.4 — 11 1433 U-MOSV-H
TPCM8006 30 ±20 25 7.0 13.5 — 26 1270 U-MOSIV
TPCM8002-H ✩ 30 ±20 30 6.2 8.2 — 18 2270 U-MOSV-H
TPCM8A05-H ✩ 30 ±20 20 MOSBD 12.9 17.2 — 7.4 1300 U-MOSV-H
TPCM8102 –30 ±20 –25 P-ch Single 7.7 — 16 60 2450 U-MOSV
✩: No protection Zener diode between gate and source
33
4 Low-VDSS MOSFETs (in Small SMD Packages)
■ Product Offerings
Absolute Maximum Ratings Circuit RDS(ON) Max (mΩ) Qg Typ. Ciss Typ.
Part Number Series
VDSS (V) VGSS (V) ID (A) Configuration 10 V 4.5 V 4V 2.5 V (nC) (pF)
TPC8028 ✩ 30 ±20 18 4.3 8 — — 45 1800 U-MOSIV
TPC8029 ✩ 30 ±20 18 3.8 7 — — 49 2200 U-MOSIV
TPC8036-H ✩ 30 ±20 18 4.5 5.1 — — 26 3500 U-MOSVI-H
TPC8034-H ✩ 30 ±20 18 3.5 4.5 — — 35 4614 U-MOSV-H
TPC8035-H ✩ 30 ±20 18 3.2 3.6 — — 44 6000 U-MOSVI-H
TPC8042 ✩ 30 ±20 18 3.4 6.5 — — 56 2900 U-MOSIV
TPC8027 ✩ 30 ±20 18 2.7 5.5 — — 113 4200 U-MOSIV
TPC8022-H 40 ±20 7.5 27 35 — — 11 650 U-MOSIII-H
TPC8052-H ✩ 40 ±20 12 N-ch 11.5 13.3 — — 13 1620 U-MOSVI-H
TPC8047-H ✩ 40 ±20 16 Single 7.6 8.8 — — 23 2590 U-MOSVI-H
TPC8046-H ✩ 40 ±20 18 5.7 6.6 — — 31 3545 U-MOSVI-H
TPC8045-H ✩ 40 ±20 18 3.9 4.4 — — 48 5800 U-MOSVI-H
TPC8053-H ✩ 60 ±20 9 22.5 24.2 — — 13 1620 U-MOSVI-H
TPC8050-H ✩ 60 ±20 11 14.5 15.6 — — 21 2590 U-MOSVI-H
TPC8049-H ✩ 60 ±20 13 10.7 11.5 — — 29 3545 U-MOSVI-H
TPC8048-H ✩ 60 ±20 16 6.9 7.4 — — 46 5800 U-MOSVI-H
TPC8051-H ✩ 80 ±20 13 9.7 10.1 — — 43 5800 U-MOSVI-H
TPC8012-H 200 ±20 1.8 400 — — — 11 440 π-MOSV
TPC8208 20 ±12 5 — — 50 70 9.5 780 U-MOSIII
TPC8207 20 ±12 6 — — 20 30 22 2010 U-MOSIII
TPC8211 30 ±20 5.5 36 44 — — 25 1250 U-MOSIII
TPC8212-H 30 ±20 6 21 27 — — 16 840 U-MOSIII-H
N-ch
TPC8216-H ✩ 30 ±20 6.4 20 23 — — 7.6 900 U-MOSVI-H
Dual
TPC8210 30 ±20 8 15 20 — — 75 3530 U-MOSIII
TPC8218-H✩ 60 ±20 3.8 57 64 — — 5.7 640 U-MOSVI-H
TPC8213-H 60 ±20 5 50 56 — — 6 625 U-MOSIII-H
TPC8214-H 100 ±20 2.2 180 190 — — 4.5 360 U-MOSIII-H
TPC8115 –20 ±8 –10 — 10 — 14 115 9130 U-MOSIV
TPC8119 ✩ –30 ±20 –10 13 — 28 — 40 1560 U-MOSV
TPC8121 ✩ –30 ±20 –11 12 — 24 — 42 1770 U-MOSV
TPC8111 –30 ±20 –11 12 — 18 — 107 5710 U-MOSIV
TPC8113 –30 ±20 –11 10 — 18 — 107 4500 U-MOSIV
TPC8123 ✩ –30 –25/+20 –11 9 12.5 — — 68 2940 U-MOSVI
TPC8122 ✩ –30 ±20 –12 P-ch 8 — 16.5 — 62 2450 U-MOSV
TPC8118 ✩ –30 ±20 –13 Single 7 — 15 — 65 2700 U-MOSV
TPC8114 –30 ±20 –18 4.5 — 6.8 — 180 7480 U-MOSIV
TPC8117 ✩ –30 ±20 –18 3.9 — 7.9 — 130 4600 U-MOSV
TPC8120 ✩ –30 –25/+20 –18 3.2 4.2 — — 180 7420 U-MOSVI
TPC8116-H –40 ±20 –7.5 30 37 — — 27 1190 U-MOSIII-H
TPC8110 –40 ±20 –8 25 — 35 — 48 2180 U-MOSIII
30 ±20 6 26 33 — — 27 1240 U-MOSIII
TPC8405
–30 ±20 –4.5 33 42 — — 40 1540 U-MOSIV
40 ±20 6.5 N-ch/P-ch 27 35 — — 11 650 U-MOSIII-H
TPC8406-H Dual
–40 ±20 –6.5 30 37 — — 27 1190 U-MOSIII-H
250 ±20 1.1 1.7 — — — 10 267 π-MOSV
TPC8404
–250 ±20 –0.9 2.55 — — — 12 381 π-MOSV
30 ±20 6 N-ch/ 25 30 — — 17 940 U-MOSIII
TPC8A01 N-ch + SBD
30 ±20 8.5/1 18 21 — — 49 2295 U-MOSIII
TPC8A05-H ✩ 30 ±20 10/1 13.3 17.6 — — 7.4 1300 U-MOSV-H
TPC8A06-H ✩ 30 ±20 12/1 10.1 12.9 — — 9.6 1400 U-MOSV-H
MOSBD
TPC8A03-H ✩ 30 ±20 17/1 5.6 7 — — 19 2640 U-MOSV-H
TPC8A04-H ✩ 30 ±20 18/1 3.6 4.5 — — 29 4400 U-MOSV-H
✩: No protection Zener diode between gate and source
34
SOP Advance Series … [Part Number: TPCA8xxx]
■ Features
• Low ON-resistance and high-speed-switching series are available.
Low ON-resistance series: UMOSIV/V
High-speed-switching series: U-MOSIII-H, U-MOSV-H and U-MOSVI-H
• High-current, thin and thermally enhanced package
■ Product Offerings
Absolute Maximum Ratings Circuit RDS(ON) Max (mΩ) Qg Typ. Ciss Typ.
Part Number Series
VDSS (V) VGSS (V) ID (A) Configuration 10 V 4.5 V 4V 2.5 V 1.8 V (nC) (pF)
TPCA8011-H 20 ±12 40 — 3.5 — 7.5 — 32 2900 U-MOSIII-H
TPCA8040-H ✩ 30 ±20 23 9.4 10.8 — — — 11.7 1700 U-MOSVI-H
TPCA8030-H ✩ 30 ±20 24 11.0 13.4 — — — 83 1433 U-MOSV-H
TPCA8031-H ✩ 30 ±20 24 11.0 13.4 — — — 83 1433 U-MOSV-H
TPCA8018-H ✩ 30 ±20 30 6.2 8.2 — — — 18 2270 U-MOSV-H
TPCA8039-H ✩ 30 ±20 34 5.7 6.6 — — — 19 2600 U-MOSVI-H
TPCA8024 ✩ 30 ±20 35 4.3 7.8 — — — 45 1800 U-MOSIV
TPCA8036-H ✩ 30 ±20 38 4.2 4.8 — — — 26 3500 U-MOSVI-H
TPCA8012-H ✩ 30 ±20 40 4.9 6.8 — — — 22 2900 U-MOSV-H
TPCA8025 ✩ 30 ±20 40 3.5 6.0 — — — 49 2200 U-MOSIV
TPCA8060-H ✩ 30 ±20 45 3.4 3.9 — — — 34 4600 U-MOSVI-H
TPCA8042 ✩ 30 ±20 45 3.3 5.7 — — — 56 2900 U-MOSIV
TPCA8019-H ✩ 30 ±20 45 3.1 4.1 — — — 34 4614 U-MOSV-H
TPCA8026 ✩ 30 ±20 45 2.2 4.5 — — — 113 4200 U-MOSIV
TPCA8028-H ✩ 30 ±20 50 2.8 3.2 — — — 46 6000 U-MOSVI-H
TPCA8020-H 40 ±20 7.5 27 35 — — — 11 650 U-MOSIII-H
TPCA8052-H ✩ 40 ±20 20 11.3 13.1 — — — 13 1620 U-MOSVI-H
N-ch
TPCA8014-H 40 ±20 30
Single
9 14 — — — 22 1365 U-MOSIII-H
TPCA8027-H 40 ±20 30 10 — — — — 23 1430 U-MOSIII-H
TPCA8047-H ✩ 40 ±20 32 7.3 8.5 — — — 23 2590 U-MOSVI-H
TPCA8015-H 40 ±20 35 5.4 7.9 — — — 37 2155 U-MOSIII-H
TPCA8046-H ✩ 40 ±20 38 5.4 6.3 — — — 29 3545 U-MOSVI-H
TPCA8045-H ✩ 40 ±20 46 3.6 4.1 — — — 47 5800 U-MOSVI-H
TPCA8053-H ✩ 60 ±20 15 22.3 24 — — — 13 1620 U-MOSVI-H
TPCA8050-H ✩ 60 ±20 24 14.2 15.3 — — — 21 2590 U-MOSVI-H
TPCA8016-H 60 ±20 25 21 26 — — — 22 1375 U-MOSIII-H
TPCA8049-H ✩ 60 ±20 28 10.4 11.2 — — — 29 3545 U-MOSVI-H
TPCA8048-H ✩ 60 ±20 35 6.6 7.1 — — — 46 5800 U-MOSVI-H
TPCA8051-H ✩ 80 ±20 28 9.4 9.8 — — — 47 5800 U-MOSVI-H
TPCA8006-H 100 ±20 18 67 — — — — 12 780 π-MOSVII
TPCA8022-H 100 ±20 22 26 — — — — 38 2330 U-MOSIII-H
TPCA8009-H 150 ±20 7 350 — — — — 10 600 π-MOSV MACHII
TPCA8010-H 200 ±20 5.5 450 — — — — 10 600 π-MOSV MACHII
TPCA8008-H 250 ±20 4 580 — — — — 10 600 π-MOSV MACHII
TPCA8105 –12 ±8 –6 — 33 — 51 92 18 1600 U-MOSIV
TPCA8103 –30 ±20 –40 4.2 — 6.8 — — 184 7880 U-MOSIV
TPCA8106 ✩ –30 ±20 –40 P-ch 3.7 — 7.8 — — 120 4600 U-MOSV
TPCA8107-H –40 ±20 –7.5 Single 30 37 — — — 27 1190 U-MOSIII-H
TPCA8108 –40 ±20 –40 9.5 — — — — 100 4820 U-MOSIII
TPCA8104 –60 ±20 –40 16 — 24 — — 90 4300 U-MOSIII
TPCA8A05-H ✩ 30 ±20 10 12.9 17.2 — — — 7.4 1300 U-MOSV-H
TPCA8A02-H ✩ 30 ±20 34 5.3 6.7 — — — 19 2640 U-MOSV-H
MOSBD
TPCA8A08-H ✩ 30 ±20 38 4.2 5.3 — — — 24 3500 U-MOSV-H
TPCA8A04-H ✽✩ 30 ±20 42 3.2 4.1 — — — 30 4400 U-MOSV-H
✩: No protection Zener diode between gate and source ✽: Under development
■ Product Offerings
Absolute Maximum Ratings Circuit RDS(ON) Max (mΩ) Qg Typ. Ciss Typ.
Part Number Configuration Series
VDSS (V) VGSS (V) ID (A) 10 V 4.5 V (nC) (pF)
TK40P03M1✩ 30 ±20 40 10.8 14.4 9.4 1150 U-MOSVI-H
TK50P03M1✩ 30 ±20 50 N-ch 7.5 9.8 13.3 1700 U-MOSVI-H
TK40P04M1✩ 40 ±20 40 Single 10.3 13.4 29 1920 U-MOSVI-H
TK50P04M1✩ 40 ±20 50 8.7 10.2 38 2600 U-MOSVI-H
✩: No protection Zener diode between gate and source
35
4 Low-VDSS MOSFETs (in Small SMD Packages)
Single MOSFETs
Absolute Maximum Ratings Package
S-Mini USM UFM SSM VSEM CST3
(SOT-346) (SOT-323) (SOT-416) (SOT-723) RDS(ON)
2925 size, 3-pin 2021 size, 3-pin 2021 size, 3-pin 1616 size, 3-pin 1212 size, 3-pin 1006 size, 3-pin Vth Typ. VGS
Polarity VDSS VGSS ID (Max)
(V) (V)
(V) (V) (mA) (Ω)
Dual MOSFETs
Absolute Maximum Ratings Package
US6 UF6 USV ES6 ESV CST6D RDS(ON)
(SOT-363) (SOT-353) (SOT-563) (SOT-553) Vth Typ. VGS Constituent
Polarity VDSS VGSS ID 2021 size, 6-pin 2021 size, 6-pin 2021 size, 5-pin 1616 size, 6-pin 1616 size, 5-pin 1009 size, 6-pin (Max)
(V) (V) Devices
(V) (V) (mA)
(Ω)
36
5 Low-VDSS, High-Qg MOSFETs
The TO-220SM(W) package, which uses Cu connectors and a wide source terminal, realizes low ON-resistance and a
high current-carrying capability.
■ Features
• Achieves low ON-resistance, low package inductance and low thermal resistance due to the use of Cu connectors.
• Achieves a high current-carrying capability due to the use of a wide source terminal (ID (DC) = 150 A max)
• AEC-Q101-qualified at a channel temperature (Tch) of 175˚C
• Thin package: 3.7-mm (max) thick, much thinner than the previous TO-220SM package with a thickness of 4.7 mm (max)
■ Characteristics of the WARP Series
<TO-220SM> <TO-220SM(W)>
Low ON-resistance
Cu connectors
Low package inductance
Low thermal resistance
<Previous>TO-220SM <New>TO-220SM(W)
200
Approx. twofold
current drive
150 capability
Predecessors
100
50
TO-220SM(W)
0
0 20 40 60 80 100 120 140 160
■ Product Offerings
Absolute Maximum Ratings RDS(ON) Max (mΩ) Ciss Typ. Qg Typ.
Part Number Series
VDSS (V) VGSS (V) ID (A) VGS = 10 V VGS = 6 V (pF) (nC)
TJ120F06J3 –60 ±20 –120 8 — 11500 258 U-MOSIII
TK100F04K3 40 ±20 100 3 — 4500 102 U-MOSIV
TK100F04K3L 40 ±20 100 3 4.5 4980 105 U-MOSIV
TK150F04K3 40 ±20 150 2.1 — 7500 166 U-MOSIV
TK150F04K3L 40 ±20 150 2.1 3.2 9400 190 U-MOSIV
TK100F06K3 60 ±20 100 5 — 4500 98 U-MOSIV
TK130F06K3 60 ±20 130 3.4 — 8400 170 U-MOSIV
TK50F15J1 150 ±20 50 30 — 4300 75 U-MOSIII
37
5 Low-VDSS, High-Qg MOSFETs
Fabricated using a trench structure, the U-MOS Series ultra-high integration density and thus
Poly Si
N N N N Poly Si
P P P N+ N+ N+ N+
P P P
N
N
N+ N+
Drain Drain
■ Features
• High density through the use of submicron technology
• 60% reduction in RDS (ON) by per unit area (as compared with the maximum RDS (ON) of L2-π-MOSV)
• Guaranteed avalanche capability and improved di/dt rate
■ Product Offerings
Part Absolute Maximum Ratings RDS(ON) Max (mΩ) Qg Typ.
Applications Package Series
Number VDSS (V) VGSS (V) ID (A) PD (W) 10 V 6V 4.5 V 4V (nC)
2SJ668 –60 ±20 –5 20 PW-Mold 170 — — 250 15
motor drive 2SJ681 –60 ±20 –5 20 New PW-Mold2 170 — — 250 15
Solenoids 2SJ669 –60 ±20 –5 1.2 TPS 170 — — 250 15
U-MOSIII
Lamp drivers TPCA8104 –60 ±20 –40 45 SOP Advance 16 — — 24 90
DC-DC converters TJ70A06J3 –60 ±20 –70 54 TO-220SIS 8.0 — 10 — 246
TJ120F06J3 –60 ±20 –120 300 TO-220SM(W) 8.0 — — — 258
LCD backlight inverter TJ20A10M3 ✩ –100 ±20 –20 35 TO-220SIS 90 — — — 120 U-MOSVI
2SK3754 30 ±20 5 25 TO-220NIS 89 — 99 — 2.5
2SK3846 40 ±20 26 25 TO-220NIS 16 — 28 — 40
U-MOSIII
2SK3847 40 ±20 32 30 TO-220SM 16 — 28 — 40
TK70J04J3 40 ±20 70 150 TO-3P(N) 3.8 — 8.3 — 210
TK70X04K3 ✩ 40 ±20 70 80 TFP 5.6 — — — 62
U-MOSIV
TK70X04K3Z 40 ±20 70 80 TFP 5.6 — — — 62
2SK3843 40 ±20 75 125 TFP 3.5 — 8.0 — 210 U-MOSIII
TK80X04K3 ✩ 40 ±20 80 125 TFP 3.5 — — — 100
TK100F04K3 ✩ 40 ±20 100 200 TO-220SM(W) 3.0 — — — 102
TK100F04K3L 40 ±20 100 200 TO-220SM(W) 3.0 4.5 — — 105 U-MOSIV
TK150F04K3 ✩ 40 ±20 150 300 TO-220SM(W) 2.1 — — — 166
motor drive TK150F04K3L 40 ±20 150 300 TO-220SM(W) 2.1 3.2 — — 190
Solenoids 2SK4017 60 ±20 5 20 New PW-Mold2 100 — — 150 15
Lamp drivers 2SK4033 60 ±20 5 20 New PW-Mold 100 — — 150 15
DC-DC converters TK30A06J3A 60 ±20 30 25 TO-220SIS 26 — 35 — 36 U-MOSIII
2SK3662 60 ±20 35 35 TO-220NIS 12.5 — — 19 91
2SK3844 60 ±20 45 45 TO-220NIS 5.8 — — — 196
TK70X06K3 ✩ 60 ±20 70 80 TFP 8.0 — — — 62 U-MOSIV
2SK3845 60 ±20 70 125 TO-3P(N) 5.8 — — — 196
2SK3842 60 ±20 75 125 TFP 5.8 — — — 196 U-MOSIII
2SK4034 60 ±20 75 125 TFP 5.8 — 10 — 196
2SK3940 75 ±20 70 150 TO-3P(N) 7.0 — — — 200 U-MOSIII
TK25A10K3 ✩ 100 ±20 25 25 TO-220SIS 40 — — — 34 U-MOSIV
LCD backlight inverter TK40X10J1 100 ±20 40 125 TFP 20 — — — 59
U-MOSIII
TK50F15J1 150 ±20 50 300 TO-220SM(W) 30 — — — 75
✩: No protection Zener diode between gate and source
38
5-3 U-MOS Series for Synchronous Rectification (VDSS = 60 V to 150 V)
■ Features
• Low ON-resistance achieved by high density through the use of submicron technology
• Guaranteed avalanche capability
• High power dissipation achieved by having the series housed in the TO-220(W) package with an
exposed heatsink on the bottom of the package
■ Comparisons Between Synchronous Rectification MOSFETs
TK80A08K3 TK60A08J1
Characteristic Symbol Test Conditions Min Typ. Max Min Typ. Max Unit
+IGSS VGS condition*, VDS = 0 V — — 1 — — 10 μA
Gate leakage current
-IGSS VGS condition*, VDS = 0 V — — –1 — — –10 μA
Drain cut-off current IDSS VDS = 75 V, VGS = 0 V — — 10 — — 10 μA
Drain-source V (BR) DSS ID = 10 mA, VGS = 0 V 75 — — 75 — — V
breakdown voltage V (BR) DSX ID = 10 mA, VGS = –20 V 50 — — 60 — — V
Gate threshold voltage Vth VDS = 10 V, ID = 1 mA 2.0 — 4.0 1.1 — 2.3 V
Drain-source
RDS (ON) VGS = 10 V, ID = 40 A — 3.6 4.5 — 6.2 7.8 mΩ
ON-resistance
Input capacitance Ciss — 8200 — — 5450 — pF
VDS = 10 V, VGS = 0 V
Reverse transfer f = 1 MHz
Crss — 770 — — 320 — pF
capacitance
Forward voltage VDSF IDR = 80 A, VGS = 0 V — –0.9 –1.2 — –0.9 –1.2 V
*: Test conditions: TK80A08K3: VGS = ± 20 V, TK60A08J1: VGS = ±16 V
+
– VOUT 89.5
+ PFC + 89.0
VIN – – MAIN
TK60A08J1 88.5
vs
TK80A08K3 88.0
0 1 2 3 4 5 6 7
Pout (W)
39
6 Mid- and High-VDSS MOSFETs
The latest addition to the π-MOS portfolio, the π-MOSVII Series offers reduced capacitances due to optimized chip
design and is available with a greatly wider range of electrical characteristics.
■ Features
• 40% reduction in Qg from π-MOSVI due to optimized chip design
• Available in 50-V steps of VDSS and in finer steps of RDS(ON).
• Rated avalanche and reverse recovery current capabilities
■ Performance Comparisons Between Series π-MOSVII π-MOSVI
π-MOSVII and π-MOSVI Devices (600 V/10 A) Part Number TK10A60D 2SK3569
Ratings 600 V/10 A 600 V/10 A
Package TO-220SIS TO-220SIS
Characteristic Symbol Test Conditions Min Typ. Max Min Typ. Max Unit
Gate leakage current ± IGSS VGS condition*, VDS = 0 V — — ±1 — — ± 10 μA
Drain cut-off current IDSS VDS = 600 V, VGS = 0 V — — 100 — — 100 μA
Drain-source breakdown voltage V(BR)DSS ID = +10 mA, VGS = 0 V 600 — — 600 — — V
Gate threshold voltage Vth VDS = 10 V, ID = 1 mA 2.0 — 4.0 2.0 4.0 V
Drain-source ON-resistance RDS(ON) VGS = 10 V, ID = 5 A — — 0.75 — — 0.75 Ω
Total gate charge Qg VDD = 400 V, VGS = 10 V, ID = 10 A — 25 — — 42 — nC
Diode forward voltage VDSF IDR =10 A, VGS = 0 V — — –1.7 — — –1.7 V
*: Test conditions: TK10A60D: VGS = ± 30 V, 2SK3569: VGS = ± 25 V
+
84% Rg = 47 Ω
– VOUT
Rg = 47 Ω
82%
+ PFC + 80%
VIN – – MAIN
2SK3569 2SK3569
78% TK10A60D
vs
76%
TK10A60D 0 20 40 60 80 100 120 140
Pout (W)
■ Product Offerings
Absolute Maximum R DS(ON) (Ω) Equivalent Absolute Maximum R DS(ON) (Ω) Equivalent
Part Number Ratings π-MOSVI Package Part Number Ratings π-MOSVI Package
VDSS (V) ID (A) VGS = 10 V Part VDSS (V) ID (A) VGS = 10 V Part
TK13A45D 450 13 0.46 2SK3743 TO-220SIS TK8A55DA 7.5 1.07 — TO-220SIS
TK4A50D 4 2.0 — TO-220SIS TK9A55DA 8.5 0.86 — TO-220SIS
TK5A50D 5 1.5 2SK3563 TO-220SIS TK11A55D 11 0.63 — TO-220SIS
TK6A50D 6 1.4 — TO-220SIS TK12A55D 12 0.57 — TO-220SIS
TK7A50D 7 1.2 — TO-220SIS TK12J55D 550 12 0.57 — TO-3P(N)
TK8A50DA 7.5 1.0 — TO-220SIS TK13A55DA 12.5 0.48 — TO-220SIS
TK8A50D 8 0.85 2SK3561 TO-220SIS TK14A55D 14 0.37 — TO-220SIS
TK10A50D 10 0.72 — TO-220SIS TK16A55D ✽ 16 0.33 — TO-220SIS
TK11A50D 500 11 0.6 — TO-220SIS TK16J55D 16 0.37 — TO-3P(N)
TK12A50D 12 0.52 2SK3568 TO-220SIS TK2Q60D 2 5.0 2SK4002 New PW-Mold 2
TK13A50DA 12.5 0.47 — TO-220SIS TK3A60DA 2.5 2.8 — TO-220SIS
TK13A50D 13 0.4 2SK4012 TO-220SIS TK4A60DA 3.5 2.2 2SK3567 TO-220SIS
TK15J50D 15 0.4 2SK4107 TO-3P(N) TK4A60DB 3.7 2 — TO-220SIS
TK15A50D 15 0.3 2SK3934 TO-220SIS TK4A60D 4 1.7 — TO-220SIS
TK18A50D 18 0.27 — TO-220SIS TK6A60D 6 1.25 2SK3562 TO-220SIS
600
TK20J50D 20 0.27 2SK4108 TO-3P(N) TK8A60DA 7.5 1 2SK3667 TO-220SIS
TK4A53D 4 1.7 — TO-220SIS TK10A60D 10 0.75 2SK3569 TO-220SIS
TK5A53D 5 1.5 2SK3563 TO-220SIS TK11A60D 11 0.65 — TO-220SIS
TK6A53D 6 1.3 — TO-220SIS TK12A60D 12 0.55 — TO-220SIS
525
TK6P53D 6 1.3 — D-PAK TK13A60D 13 0.43 2SK3797 TO-220SIS
TK12A53D 12 0.58 — TO-220SIS TK15A60D 15 0.37 — TO-220SIS
TK12X53D 12 0.58 2SK3398 TFP TK5A65D 5 1.43 — TO-220SIS
TK4A55DA 3.5 2.45 — TO-220SIS TK6A65D 6 1.11 — TO-220SIS
650
TK4A55D 4 1.9 — TO-220SIS TK8A65D 8 0.84 — TO-220SIS
550
TK5A55D 5 1.7 — TO-220SIS TK12A65D ✽ 12 0.50 — TO-220SIS
TK6A55DA 5.5 1.48 — TO-220SIS ✽: Under development
40
6-2 Super-Junction DTMOS Series (VDSS = 600 V, 650 V)
The DTMOS devices employ a new super-junction structure that enables an ultra-low ON-resistance with the maximum
VDSS rating of 600 V. The DTMOS Series helps reduce the power consumption and size of electronic equipment.
■ Features
• Low ON-resistance TK40J60T: 80 mΩ (max) @VGS = 10 V, ID = 20 A
• Low gate charge TK20A60U: Qg = 27 nC typ., 600 V / 20 A
• The rugged internal drain-source diode is not damaged at di/dt = 500 A/μs (@VDS = 400 V, 150˚C).
■ Product Offerings
Absolute Maximum Ratings R DS(ON) Max (Ω) Qg Typ. Ciss Typ.
Part Number Package Series
VDSS (V) ID (A) VGS = 10 V (nC) (pF)
TK12A60U TO-220SIS
TK12D60U 12 0.4 14 720 TO-220(W) DTMOSII
TK12J60U TO-3P(N)
TK15J60T 15 0.3 21 1200 TO-3P(N) DTMOSI
TK15A60U TO-220SIS
TK15D60U 15 0.3 17 950 TO-220(W) DTMOSII
TK15J60U TO-3P(N)
TK20A60T 600 TO-220SIS
TK20D60T 20 0.19 30 1580 TO-220(W) DTMOSI
TK20J60T TO-3P(N)
TK20A60U TO-220SIS
TK20D60U 20 0.19 27 1470 TO-220(W) DTMOSII
TK20J60U TO-3P(N)
TK40J60T 40 0.08 67 3900 TO-3P(N) DTMOSI
TK50J60U ✽ 50 0.065 70 4300 TO-3P(N) DTMOSII
TK13A65U 650 13 0.38 17 950 TO-220SIS DTMOSII
✽: Under development
■ Performance Comparisons Between the New DTMOS and Conventional ■ Figure-of-Merit (FOM) Comparison
MOSFET (π-MOSVI) Devices (600 V/20 A) Ron x Qg, the product of ON-resistance
and total gate charge, is reduced by 62%,
Series DTMOSII π-MOSVI compared with the conventional MOSFETs
Part Number TK20J60U 2SK3911 with the same chip size.
Ratings 600 V/20 A 600 V/20 A *Ron x Qg is a figure-of-merit index for the switching speed
of MOSFETs.
Characteristic Symbol Test Conditions Min Typ. Max Min Typ. Max Unit
Gate leakage current ± IGSS VGS condition*, VDS = 0 V — — ±1 — — ± 10 μA 14
Drain cut-off current 62%
IDSS VDS = 600 V, VGS = 0 V — — 100 — — 100 μA reduction
12
Drain-source 15%
V(BR)DSS ID = 10 mA, VGS = 0 V 600 — — 600 — — V
Ron x Qg (Ω·nC)
41
6 Mid- and High-VDSS MOSFETs
To support the development of high-efficiency equipment, Toshiba has developed two series of high-speed power
MOSFETs: a high-speed switching series for AC adapters and switching power supplies; and a high-speed diode series for
motor controllers and inverter circuits.
• MACH Series: Achieves a higher switching speed than the existing π-MOS Series, which is currently well established in the market.
• High-Speed Diode Series: Achieves a higher internal diode speed by using lifetime control.
■ Product Offerings
• MACH Series
Absolute Maximum Ratings RDS(ON) Qg
Applications Part Number Package Max VGS ID Typ. Standard Type Series
VDSS (V) ID (A) PD (W) (Ω) (V) (A) (nC)
2SK3310 450 10 40 TO-220NIS 0.65 10 5 23 2SK3126
2SK3309 450 10 65 TO-220FL/SM 0.65 10 5 23 —
2SK3743 450 13 40 TO-220NIS 0.4 10 6 34 —
AC adapters 2SK3403 450 13 100 TO-220FL/SM 0.4 10 6 34 — MACH-I
Switching power 2SK3312 600 6 65 TO-220FL/SM 1.25 10 3 25 2SK2777
supplies 2SK3437 600 10 80 TO-220FL/SM 1 10 5 28 2SK2996
2SK3399 600 10 100 TO-220FL/SM 0.75 10 5 35 2SK2866
2SK3907 500 23 150 TO-3P(N) 0.23 10 11.5 60 —
MACH-II
2SK3911 600 20 150 TO-3P(N) 0.32 10 10 60 —
ID = 10 A/div
Qg = 56 nC 0
VDS: 100 V/div
VGS: 2 V/div
10 nC/div
200 ns/div
40% Qg
reduction Higher Speed
Standard Series 2SK2842 (Standard Series)
ID = 10 A/div
Qg = 92 nC
0
VDS: 100 V/div
VGS: 2 V/div
10 nC/div
200 ns/div
42
6-4 π-MOS Series
43
6 Mid- and High-VDSS MOSFETs
44
■ π-MOSV Series (VDSS = 400 V to 700 V)
Absolute Maximum Ratings RDS(ON) Qg
Applications Part Number VDSS ID PD Package (Ω) Typ.
VGS ID
(V) (A) (W) Typ. Max (V) (A) (nC)
2SK3498 400 1 20 PW-Mold 4.2 5.5 10 0.5 5.7
2SK2838 400 5.5 40 TO-220FL/SM 0.84 1.2 10 3 17
2SK2679 400 5.5 35 TO-220NIS 0.84 1.2 10 3 17
2SK2952 400 8.5 40 TO-220NIS 0.4 0.55 10 5 34
2SK2841 400 10 80 TO-220AB 0.4 0.55 10 5 34
2SK2949 400 10 80 TO-220FL/SM 0.4 0.55 10 5 34
2SK3499 400 10 80 TFP 0.4 0.55 10 5 34
2SK3472 450 1 20 New PW-Mold 4.0 4.6 10 0.5 5
2SK3374 450 1 20 TPS 3.7 4.6 10 5 5
2SK4023 450 1 20 New PW-Mold2 4.0 4.6 10 0.5 5
2SK3544 450 13 100 TFP 0.29 0.4 10 6 34
2SK2998 500 0.5 0.9 LSTM 10 18 10 0.25 3.8
2SK3302 500 0.5 1.3 TPS 10 18 10 0.25 3.8
2SK3471 500 0.5 0.5 PW-Mini 10 18 10 0.25 3.8
2SK2599 500 2 1.3 TPS 2.9 3.2 10 1 9
2SK3373 500 2 20 New PW-Mold 2.9 3.2 10 1 9
2SK2862 500 3 25 TO-220NIS 2.9 3.2 10 1 9
2SK2991 500 5 50 TO-220FL/SM 1.35 1.5 10 2.5 17
2SK3466 500 5 50 TO-220FL/SM 1.35 1.5 10 2.5 17
2SK2542 500 8 80 TO-220AB 0.75 0.85 10 4 30
2SK2776 500 8 65 TO-220FL/SM 0.75 0.85 10 4 30
2SK3538 500 8 65 TFP 0.75 0.85 10 4 30
115-Vac
switching power supplies
2SK2601 500 10 125 TO-3P(N) 0.56 1.0 10 5 30
Ballast inverters
2SK3068 500 12 100 TO-220FL/SM 0.4 0.52 10 6 45
Motor controllers 2SK3398 500 12 100 TFP 0.4 0.52 10 6 45
2SK2916 500 14 80 TO-3P(N)IS 0.35 0.4 10 7 58
2SK2917 500 18 90 TO-3P(N)IS 0.21 0.27 10 10 80
2SK3132 500 50 250 TO-3P(L) 0.07 0.095 10 25 280
2SK3371 600 1 20 New PW-Mold 6.4 9.0 10 0.5 9
2SK4026 600 1 20 New PW-Mold2 6.4 9 10 0.5 9
2SK2846 600 2 1.3 TPS 4.2 5.0 10 1 9
2SK2865 600 2 20 New PW-Mold 4.2 5.0 10 1 9
2SK4002 600 2 20 New PW-Mold2 4.2 5 10 1 9
2SK4003 600 3 20 New PW-Mold2 1.7 2.2 10 1.5 20
2SK3975 600 3 20 New PW-Mold 1.7 2.2 10 1.5 20
2SK3085 600 3.5 75 TO-220AB 1.7 2.2 10 1.8 20
2SK3130 600 6 40 TO-220NIS 1.26 1.55 10 3 30
2SK2777 600 6 65 TO-220FL/SM 0.9 1.25 10 3 30
2SK2602 600 6 125 TO-3P(N) 0.9 1.25 10 3 30
2SK3312 600 6 65 TO-220FL/SM 0.95 1.25 10 3 22
2SK3438 600 10 80 TFP 0.78 1.0 10 5 28
2SK2889 600 10 100 TO-220FL/SM 0.54 0.75 10 5 45
2SK2866 600 10 125 TO-220AB 0.54 0.75 10 5 45
2SK2699 600 10 150 TO-3P(N) 0.5 0.65 10 6 58
2SK2953 600 12 90 TO-3P(N)IS 0.31 0.4 10 8 80
2SK3265 700 10 45 TO-220NIS 0.72 1.0 10 5 53
2SK3453 700 10 80 TO-3P(N)IS 0.72 1.0 10 5 53
45
7 MOSFET Part Numbers
46
Main Characteristics Main Characteristics
Part Number Series Package VDSS ID RDS(ON) Page Part Number Series Package VDSS ID RDS(ON) Page
Max Max
(V) (A) (Ω) (V) (A) (Ω)
2SK2835 π-MOSV TPS 200 5 0.8 44 2SK3388 π-MOSV TFP 250 20 0.105 44
2SK2838 π-MOSV TO-220FL/SM 400 5.5 1.2 45 2SK3398 π-MOSV TFP 500 12 0.52 45
2SK2841 π-MOSV TO-220AB 400 10 0.55 45 2SK3399 MACH TO-220FL/SM 600 10 0.75 42
2SK2845 π-MOSIII DP 900 1 9 45 2SK3403 MACH TO-220FL/SM 450 13 0.4 42
2SK2846 π-MOSV TPS 600 2 5 45 2SK3417 π-MOSV(HSD) TO-220FL/SM 500 5 1.8 42
2SK2847 π-MOSIII TO-3P (N)IS 900 8 1.4 45 2SK3437 MACH TO-220FL/SM 600 10 1 42
2SK2862 π-MOSV TO-220NIS 500 3 3.2 45 2SK3438 π-MOSV TFP 600 10 1 45
2SK2865 π-MOSV New PW-Mold 600 2 5 45 2SK3444 π-MOSV TFP 200 25 0.082 44
2SK2866 π-MOSV TO-220AB 600 10 0.75 42,45 2SK3445 π-MOSV TFP 250 20 0.105 44
2SK2882 π-MOSV TO-220NIS 150 18 0.12 44 2SK3453 π-MOSIV TO-3P (N)IS 700 10 1 45
2SK2883 π-MOSIII TO-220FL/SM 800 3 3.6 45 2SK3462 π-MOSV New PW-Mold 250 3 1.7 44
2SK2884 π-MOSIII TO-220FL/SM 800 5 2.2 45 2SK3466 π-MOSV TFP 500 5 1.5 45
2SK2886 L2-π-MOSV TO-220NIS 50 45 0.02 43 2SK3471 π-MOSV PW-Mini 500 0.5 18 45
2SK2889 π-MOSV TO-220FL/SM 600 10 0.75 45 2SK3472 π-MOSV PW-Mold 450 1 4.6 45
2SK2914 π-MOSV TO-220AB 250 7.5 0.5 44 2SK3473 π-MOSIV TO-3P (N) 900 9 1.6 43
2SK2916 π-MOSV TO-3P (N)IS 500 14 0.4 45 2SK3497 π-MOSV TO-3P (N) 180 10 0.15 44
2SK2917 π-MOSV TO-3P (N)IS 500 18 0.27 45 2SK3498 π-MOSV PW-Mold 400 1 5.5 45
2SK2920 π-MOSV New PW-Mold 200 5 0.8 44 2SK3499 π-MOSV TFP 400 10 0.55 45
2SK2949 π-MOSV TO-220FL/SM 400 10 0.55 45 2SK3506 π-MOSVI TO-3P (N) 30 45 0.02 43
2SK2952 π-MOSV TO-220NIS 400 8.5 0.55 45 2SK3538 π-MOSV TFP 500 8 0.85 45
2SK2953 π-MOSV TO-3P (N)IS 600 15 0.4 45 2SK3544 π-MOSV TFP 450 13 0.4 45
2SK2961 L2-π-MOSV LSTM 60 2 0.27 44 2SK3561 π-MOSVI TO-220SIS 500 8 0.85 40,42,43
2SK2962 L2-π-MOSV LSTM 100 1 0.7 44 2SK3562 π-MOSVI TO-220SIS 600 6 1.25 40,42,43
2SK2963 L2-π-MOSV PW-Mini 100 1 0.7 44 2SK3563 π-MOSVI TO-220SIS 500 5 1.5 40,42,43
2SK2965 π-MOSV TO-220NIS 200 11 0.26 44 2SK3564 π-MOSIV TO-220SIS 900 3 4.3 43
2SK2967 π-MOSV TO-3P (N) 250 30 0.068 44 2SK3565 π-MOSIV TO-220SIS 900 5 2.5 43
2SK2968 π-MOSIII TO-3P (N) 900 10 1.25 45 2SK3566 π-MOSIV TO-220SIS 900 2.5 6.4 43
2SK2989 L2-π-MOSV LSTM 50 5 0.15 43 2SK3567 π-MOSVI TO-220SIS 600 3.5 2.2 40,43
2SK2991 π-MOSV TO-220FL/SM 500 5 1.5 42,45 2SK3568 π-MOSVI TO-220SIS 500 12 0.52 40,43
2SK2992 π-MOSV PW-Mini 200 1 3.5 44 2SK3569 π-MOSVI TO-220SIS 600 10 0.75 40,42,43
2SK2993 π-MOSV TO-220FL/SM 250 20 0.105 44 2SK3625 π-MOSV TO-220FL/SM 200 25 0.082 44
2SK2995 π-MOSV TO-3P (N)IS 250 30 0.068 44 2SK3633 π-MOSIV TO-3P (N) 800 7 1.7 43
2SK2998 π-MOSV LSTM 500 0.5 18 45 2SK3662 U-MOSIII TO-220NIS 60 35 0.0125 38
2SK3017 π-MOSIII TO-3P (N)IS 900 8.5 1.25 45 2SK3667 π-MOSVI TO-220SIS 600 7.5 1 40,43
2SK3051 L2-π-MOSV TO-220FL/SM 50 45 0.03 43 2SK3669 π-MOSVII New PW-Mold 100 10 0.125 –
2SK3068 π-MOSV TO-220FL/SM 500 12 0.52 45 2SK3670 π-MOSV LSTM 150 0.67 1.7 44
2SK3085 π-MOSV TO-220AB 600 3.5 2.2 45 2SK3700 π-MOSIV TO-3P (N) 900 5 2.5 43
2SK3130 π-MOSV TO-220NIS 600 6 1.55 45 2SK3742 π-MOSIV TO-220SIS 900 5 2.5 43
2SK3131 π-MOSV(HSD) TO-3P (L) 500 50 0.11 42 2SK3743 MACH TO-220NIS 450 13 0.6 40,42
2SK3132 π-MOSV TO-3P (L) 500 50 0.095 42,45 2SK3754 U-MOSIII TO-220NIS 30 5 0.089 38
2SK3176 π-MOSV TO-3P (N) 200 30 0.052 44 2SK3757 π-MOSVI TO-220SIS 450 2 2.45 43
2SK3205 π-MOSV PW-Mold 150 5 0.5 44 2SK3766 π-MOSVI TO-220SIS 450 2 2.45 43
2SK3265 π-MOSV TO-220NIS 700 10 1 45 2SK3767 π-MOSVI TO-220SIS 600 2 4.5 43
2SK3301 π-MOSIII PW-Mold 900 1 20 45 2SK3797 π-MOSVI TO-220SIS 600 13 0.43 40,42,43
2SK3302 π-MOSV TPS 500 0.5 18 45 2SK3798 π-MOSIV TO-220SIS 900 4 3.5 43
2SK3309 MACH TO-220FL/SM 450 10 0.65 42 2SK3799 π-MOSIV TO-220SIS 900 8 1.3 43
2SK3310 MACH TO-220NIS 450 10 0.65 42 2SK3842 U-MOSIII TFP 60 75 0.0058 38
2SK3312 π-MOSV TO-220FL/SM 600 6 1.25 42,45 2SK3843 U-MOSIII TFP 40 75 0.0035 38
2SK3313 π-MOSV(HSD) TO-220NIS 500 12 0.62 42 2SK3844 U-MOSIII TO-220NIS 60 45 0.0058 38
2SK3314 π-MOSV(HSD) TO-3P (N) 500 15 0.49 42 2SK3845 U-MOSIII TO-3P (N) 60 70 0.0058 38
2SK3342 π-MOSV New PW-Mold 250 4.5 1 44 2SK3846 U-MOSIII TO-220NIS 40 26 0.018 38
2SK3371 π-MOSV New PW-Mold 600 1 9 45 2SK3847 U-MOSIII TO-220SM 40 32 0.016 38
2SK3373 π-MOSV New PW-Mold 500 2 3.2 45 2SK3863 π-MOSVI DP 500 5 1.5 43
2SK3374 π-MOSV TPS 450 1 4.6 45 2SK3868 π-MOSVI (HSD) TO-220SIS 500 5 1.7 42
2SK3387 L2-π-MOSV TFP 150 18 0.12 44 2SK3869 π-MOSVI TO-220SIS 450 10 0.68 43
47
7 MOSFET Part Numbers
48
Main Characteristics Main Characteristics
Part Number Series Package VDSS ID RDS(ON) Page Part Number Series Package VDSS ID RDS(ON) Page
Max Max
(V) (A) (Ω) (V) (A) (Ω)
SSM3K12T π-MOSVII TSM 30 3 0.175 29 SSM5N15FE π-MOSVI ES6 30 0.1 7 36
SSM3K131TU U-MOSIV UFM 30 6.0 0.0415 29 SSM5N15FU π-MOSVI US6 30 0.1 7 36
SSM3K14T U-MOSII TSM 30 4 0.067 29 SSM5N16FE π-MOSVI ES6 20 0.1 15 36
SSM3K15CT π-MOSVI CST3 30 0.1 7 36 SSM5N16FU π-MOSVI US6 20 0.1 15 36
SSM3K15F π-MOSVI S-MINI 30 0.1 7 36 SSM5P05FU π-MOSVI US6 –20 –0.2 4 36
SSM3K15FS π-MOSVI SSM 30 0.1 7 36 SSM5P15FE π-MOSVI ES6 –30 –0.1 32 36
SSM3K15FU π-MOSVI USM 30 0.1 7 36 SSM5P15FU π-MOSVI US6 –30 –0.1 32 36
SSM3K15FV π-MOSVI VESM 30 0.1 7 36 SSM5P16FE π-MOSVI ES6 –20 –0.1 45 36
SSM3K16CT π-MOSVI CST3 20 0.1 15 36 SSM5P16FU π-MOSVI US6 –20 –0.1 45 36
SSM3K16FS π-MOSVI SSM 20 0.1 15 36 SSM6E01TU U-MOSIII UF6 –12 –1 0.16 30
SSM3K16FU π-MOSVI USM 20 0.1 15 36 SSM6E02TU U-MOSIV UF6 –20 –1.8 0.136 30
SSM3K16FV π-MOSVI VESM 20 0.1 15 36 SSM6E03TU U-MOSIII UF6 –20 –1.8 0.144 30
SSM3K17FU π-MOSV USM 50 0.1 40 36 SSM6J06FU π-MOSVI US6 –20 –0.65 0.5 28
SSM3K301T U-MOSIII TSM 20 3.5 0.056 29 SSM6J07FU π-MOSVI US6 –30 –0.8 0.8 28
SSM3K303T π-MOSVII TSM 30 2.9 0.12 29 SSM6J08FU U-MOSII US6 –20 –1.3 0.18 28
SSM3K309T U-MOSIII TSM 20 4.7 0.031 29 SSM6J205FE U-MOSIII ES6 –20 –0.8 0.234 28
SSM3K310T U-MOSIII TSM 20 5 0.028 29 SSM6J206FE U-MOSIII ES6 –20 –2 0.13 28
SSM3K315T U-MOSIV TSM 30 6 0.0415 29 SSM6J207FE U-MOSII ES6 –30 –1.3 0.491 28
SSM3K316T U-MOSIII TSM 30 4 0.065 29 SSM6J21TU U-MOSIII UF6 –12 –3 0.05 28
SSM3K318T U-MOSIV TSM 60 2.5 0.145 29 SSM6J212FE U-MOSVI ES6 –20 –3.3 0.0434 28
SSM3K320T U-MOSIV TSM 30 4.2 0.077 29 SSM6J23FE U-MOSIII ES6 –12 –1.2 0.16 28
SSM3K35CT π-MOSVI CST3 20 0.18 20 36 SSM6J25FE U-MOSIII ES6 –20 –0.5 0.26 28
SSM3K35FS π-MOSVI SSM 20 0.18 20 36 SSM6J26FE U-MOSIII ES6 –20 –0.5 0.23 28
SSM3K35MFV π-MOSVI VESM 20 0.18 20 36 SSM6J401TU U-MOSIII UF6 –30 –2.5 0.145 28
SSM3K36FS U-MOSIII SSM 20 0.5 1.52 36 SSM6J402TU U-MOSIII UF6 –30 –2 0.225 28
SSM3K36MFV U-MOSIII VESM 20 0.5 1.52 36 SSM6J409TU U-MOSV UF6 –20 –9.5 0.0221 28
SSM3K36TU U-MOSIII UFM 20 0.5 1.52 36 SSM6J50TU U-MOSIV UF6 –20 –2.5 0.064 28
SSM3K43FS U-MOSIII SSM 20 0.5 1.52 36 SSM6J51TU U-MOSIV UF6 –12 –4 0.054 28
SSM3K44FS π-MOSVI SSM 30 0.1 7 36 SSM6J53FE U-MOSIV ES6 –20 –1.8 0.136 28
SSM3K44MFV π-MOSVI VESM 30 0.1 7 36 SSM6K06FU π-MOSVI US6 20 1.1 0.16 29
SSM3K7002AF π-MOSV S-MINI 60 0.2 3.3 36 SSM6K07FU π-MOSVI US6 30 1.5 0.22 29
SSM3K7002AFU π-MOSV USM 60 0.2 3.3 36 SSM6K08FU U-MOSII US6 20 1.6 0.105 29
SSM3K7002BF U-MOSIV S-MINI 60 0.2 3.3 36 SSM6K18TU U-MOSIII UF6 20 4 0.04 29
SSM3K7002BFS U-MOSIV SSM 60 0.2 3.3 36 SSM6K202FE U-MOSIII ES6 30 2.3 0.085 29
SSM3K7002BFU U-MOSIV USM 60 0.2 3.3 36 SSM6K203FE U-MOSIII ES6 20 2.8 0.061 29
SSM3K7002F π-MOSVI S-MINI 60 0.2 3.3 36 SSM6K204FE U-MOSIII ES6 20 2 0.126 29
SSM3K7002FU π-MOSVI USM 60 0.2 3.3 36 SSM6K208FE U-MOSIII ES6 30 1.9 0.133 29
SSM4K27CT U-MOSIII CST4 20 0.5 0.205 29 SSM6K210FE U-MOSIII ES6 30 1.4 0.371 29
SSM5G01TU U-MOSII UFV –30 –1 0.8 30 SSM6K211FE U-MOSIII ES6 20 3.2 0.047 29
SSM5G02TU U-MOSII UFV –12 –1 0.16 30 SSM6K22FE U-MOSIII ES6 20 1.4 0.17 29
SSM5G04TU U-MOSII UFV –12 –1 0.24 30 SSM6K24FE U-MOSIII ES6 30 0.5 0.145 29
SSM5G09TU U-MOSII UFV –12 –1.5 0.13 30 SSM6K25FE U-MOSIII ES6 20 0.5 0.145 29
SSM5G10TU U-MOSIII UFV –20 –1.5 0.213 30 SSM6K30FE π-MOSVII ES6 20 1.2 0.42 29
SSM5G11TU U-MOSIII-H UFV –30 –1.4 0.403 30 SSM6K31FE π-MOSVII ES6 20 1.2 0.54 29
SSM5H01TU U-MOSII UFV 30 1.4 0.45 30 SSM6K32TU π-MOSV UF6 60 2 0.44 29
SSM5H03TU U-MOSII UFV 12 1.4 0.3 30 SSM6K34TU U-MOSIII UF6 30 3 0.077 29
SSM5H05TU U-MOSIII UFV 20 1.5 0.16 30 SSM6K403TU U-MOSIII UF6 20 4.2 0.028 29
SSM5H07TU π-MOSVII UFV 20 1.2 0.54 30 SSM6K404TU U-MOSIII UF6 20 3 0.055 29
SSM5H08TU U-MOSIII UFV 20 1.5 0.16 30 SSM6K405TU U-MOSIII UF6 20 2 0.126 29
SSM5H10TU U-MOSIII UFV 20 1.6 0.119 30 SSM6K406TU U-MOSIV UF6 30 4.4 0.0385 29
SSM5H11TU U-MOSIII UFV 30 1.6 0.182 30 SSM6K407TU π-MOSV UF6 60 2 0.44 29
SSM5H12TU U-MOSIII UFV 30 1.9 0.133 30 SSM6L05FU π-MOSVI US6 20 0.4 1.2 36
SSM5H14F U-MOSIII SMV 30 3 0.078 31 SSM6L09FU π-MOSVI US6 30 0.4 1.2 36
SSM5N03FE π-MOSVI ES6 20 0.1 12 36 SSM6L10TU U-MOSIII UF6 20 0.5 0.145 30
SSM5N05FU π-MOSVI US6 20 0.4 1.2 36 SSM6L11TU U-MOSIII UF6 20 0.5 0.145 30
49
7 MOSFET Part Numbers
50
Main Characteristics Main Characteristics
Part Number Series Package VDSS ID RDS(ON) Page Part Number Series Package VDSS ID RDS(ON) Page
Max Max
(V) (A) (Ω) (V) (A) (Ω)
TK4A53D π-MOSVII TO-220SIS 525 4 1.7 40 TPC8018-H U-MOSIII-H SOP-8 30 18 0.0046 –
TK4A55D π-MOSVII TO-220SIS 550 4 1.9 40 TPC8020-H U-MOSIII-H SOP-8 30 13 0.009 –
TK4A55DA π-MOSVII TO-220SIS 550 3.5 2.45 40 TPC8021-H U-MOSIII-H SOP-8 30 11 0.017 24,33
TK4A60D π-MOSVII TO-220SIS 600 4 1.7 40 TPC8022-H U-MOSIII-H SOP-8 40 7.5 0.027 24,34
TK4A60DA π-MOSVII TO-220SIS 600 3.5 2.2 40 TPC8025 U-MOSIV SOP-8 30 11 0.009 27,33
TK4A60DB π-MOSVII TO-220SIS 600 3.7 2 40 TPC8026 U-MOSIV SOP-8 30 13 0.0066 27,33
TK50F15J1 U-MOSIII TO-220SM(W) 150 50 0.03 37,38 TPC8027 U-MOSIV SOP-8 30 18 0.0027 27,34
TK50P03M1 U-MOSVI-H DPAK 30 50 0.0075 35 TPC8028 U-MOSIV SOP-8 30 18 0.0043 27,34
TK50P04M1 U-MOSVI-H DPAK 40 50 0.0087 35 TPC8029 U-MOSIV SOP-8 30 18 0.0038 27,34
TK50X15J1 U-MOSIII-H TFP 150 50 0.03 39 TPC8030 U-MOSIV SOP-8 30 11 0.0095 27,33
TK55A10J1 U-MOSIII-H TO-220SIS 100 55 0.0105 39 TPC8031-H U-MOSV-H SOP-8 30 11 0.0133 24
TK55D10J1 U-MOSIII-H TO-220(W) 100 55 0.0105 39 TPC8032-H U-MOSV-H SOP-8 30 15 0.0065 24,33
TK5A50D π-MOSVII TO-220SIS 500 5 1.5 40 TPC8033-H U-MOSV-H SOP-8 30 17 0.0053 24,33
TK5A53D π-MOSVII TO-220SIS 525 5 1.5 40 TPC8034-H U-MOSV-H SOP-8 30 18 0.0035 24,34
TK5A55D π-MOSVII TO-220SIS 550 5 1.88 40 TPC8035-H U-MOSVI-H SOP-8 30 18 0.0032 24,34
TK5A65D π-MOSVII TO-220SIS 650 5 1.45 40 TPC8036-H U-MOSVI-H SOP-8 30 18 0.0045 24,34
TK60A08J1 U-MOSIII-H TO-220SIS 75 60 0.0078 39 TPC8037-H U-MOSV-H SOP-8 30 12 0.0114 24,33
TK60D08J1 U-MOSIII-H TO-220(W) 75 60 0.0078 39 TPC8038-H U-MOSV-H SOP-8 30 12 0.0114 24,33
TK6A50D π-MOSVII TO-220(W) 500 6 1.4 40 TPC8039-H U-MOSVI-H SOP-8 30 17 0.006 24,33
TK6A53D π-MOSVII TO-220SIS 525 6 1.3 40 TPC8040-H U-MOSVI-H SOP-8 30 13 0.0097 24,33
TK6A55DA π-MOSVII TO-220SIS 550 5.5 1.48 40 TPC8045-H U-MOSVI-H SOP-8 40 18 0.0039 24,34
TK6A60D π-MOSVII TO-220SIS 600 6 1.25 40 TPC8046-H U-MOSVI-H SOP-8 40 18 0.0057 24,34
TK6A65D π-MOSVII TO-220SIS 650 6 1.11 40 TPC8047-H U-MOSVI-H SOP-8 40 16 0.0076 24,34
TK6P53D π-MOSVII DPAK 525 6 1.3 40 TPC8048-H U-MOSVI-H SOP-8 60 16 0.0069 25,34
TK70A06J1 U-MOSIII-H TO-220SIS 60 70 0.0064 39 TPC8049-H U-MOSVI-H SOP-8 60 13 0.0107 25,34
TK70D06J1 U-MOSIII-H TO-220(W) 60 70 0.0064 39 TPC8050-H U-MOSVI-H SOP-8 60 11 0.0145 25,34
TK70J04J3 U-MOSIII TO-3P(N) 40 70 0.0038 38 TPC8051-H U-MOSVI-H SOP-8 80 13 0.0097 25,34
TK70X04K3 U-MOSIV TFP 40 70 0.0056 38 TPC8052-H U-MOSVI-H SOP-8 40 12 0.0115 24,34
TK70X04K3L U-MOSIV TFP 40 70 0.0056 – TPC8053-H U-MOSVI-H SOP-8 60 9 0.0225 25,34
TK70X04K3Z U-MOSIV TFP 40 70 0.0056 38 TPC8107 U-MOSIII SOP-8 –30 –13 0.007 –
TK70X06K3 U-MOSIV TFP 60 70 0.008 38 TPC8109 U-MOSIII SOP-8 –30 –10 0.02 –
TK7A50D π-MOSVII TO-220SIS 500 7 1.22 40 TPC8110 U-MOSIII SOP-8 –40 –8 0.025 34
TK80A08K3 U-MOSIV TO-220SIS 75 80 0.0045 39 TPC8111 U-MOSIV SOP-8 –30 –11 0.012 34
TK80D08K3 U-MOSIV TO-220(W) 75 80 0.0045 39 TPC8112 U-MOSIII SOP-8 –30 –13 0.006 –
TK80X04K3 U-MOSIV TFP 40 80 0.0035 38 TPC8113 U-MOSIV SOP-8 –30 –11 0.01 27,34
TK8A50D π-MOSVII TO-220SIS 500 8 0.85 40 TPC8114 U-MOSIV SOP-8 –30 –18 0.0045 27,34
TK8A50DA π-MOSVII TO-220SIS 500 7.5 1.0 40 TPC8115 U-MOSIV SOP-8 –20 –10 0.01 27,34
TK8A55DA π-MOSVII TO-220SIS 550 7.5 1.07 40 TPC8116-H U-MOSIII-H SOP-8 –40 –7.5 0.03 25,34
TK8A60DA π-MOSVII TO-220SIS 600 7.5 1 40 TPC8117 U-MOSV SOP-8 –30 –18 0.0039 27,34
TK8A65D π-MOSVII TO-220SIS 650 8 0.84 40 TPC8118 U-MOSV SOP-8 30 13 0.007 27,34
TK9A55DA π-MOSVII TO-220SIS 550 8.5 0.86 40 TPC8120 U-MOSVI SOP-8 –30 –18 0.0032 27,34
TPC6004 U-MOSIII VS-6 20 6 0.024 31 TPC8122 U-MOSV SOP-8 –30 –11 0.008 27,34
TPC6005 U-MOSIII VS-6 30 6 0.028 31 TPC8123 U-MOSVI SOP-8 –30 –11 0.0095 27,34
TPC6006-H U-MOSIII-H VS-6 40 3.9 0.075 24,31 TPC8207 U-MOSIII SOP-8 20 6 0.02 27,34
TPC6007-H U-MOSIII-H VS-6 30 5 0.054 24,31 TPC8208 U-MOSIII SOP-8 20 5 0.05 27,34
TPC6011 U-MOSIV VS-6 30 6 0.020 31 TPC8210 U-MOSIII SOP-8 30 8 0.015 27,34
TPC6103 U-MOSIII VS-6 –12 –5.5 0.035 31 TPC8211 U-MOSIII SOP-8 30 5.5 0.036 27,34
TPC6105 U-MOSIII VS-6 –20 –2.7 0.11 31 TPC8212-H U-MOSIII-H SOP-8 30 6 0.021 34
TPC6107 U-MOSIV VS-6 –20 –4.5 0.055 31 TPC8213-H U-MOSIII-H SOP-8 60 5 0.05 25,34
TPC6108 U-MOSIV VS-6 –30 –4.5 0.06 31 TPC8214-H U-MOSIII-H SOP-8 100 2.2 0.18 25,34
TPC6109-H U-MOSIII-H VS-6 –30 –5 0.059 24,31 TPC8218-H U-MOSVI-H SOP-8 60 3.8 0.057 25,34
TPC6111 U-MOSV VS-6 –20 –5.5 0.04 31 TPC8404 π-MOSV/π-MOSV SOP-8 –250/250 1.1/–0.9 1.7/2.55 34
TPC6201 U-MOSII VS-6 30 2.5 0.095 – TPC8405 U-MOSIV/U-MOSIII SOP-8 –30/30 –4.5/6 0.027 27,34
TPC8012-H π-MOSV SOP-8 200 1.8 0.4 34 TPC8406-H U-MOSIII-H SOP-8 40 6.5 0.03 25,34
TPC8014 U-MOSIII SOP-8 30 11 0.014 27 TPC8406-H U-MOSIII-H SOP-8 –40 –6.5 0.025 25,34
TPC8017-H U-MOSIII-H SOP-8 30 15 0.0066 – TPC8A01 High-speed U-MOSIII SOP-8 30 6 0.018 34
51
7 MOSFET Part Numbers
52
8 Product Obsolescence
53
8 Product Obsolescence
54
9 Packaging
ES6 S-Mini
SMV
CST3B
UFV
US6
CST6D
■ CST3 Unit: mm
Package dimensions Typical PCB land pad dimensions Tape dimensions 2.0 ±0.05 4.0 ±0.1 0.2
φ1.5 ±0.1 Y
Y
1.75
3.5 ±0.05
φ0.5
0.6 0.05
8.0
0.25 0.03 0.25 0.03
1.1
0.5 0.03
X X’
0.6
1.0 0.05
0.65 0.02
Y’
Y’ 0.47
0.7
0.35 0.3 0.35
0.38
Cross section: X-X’ 11.4
0.05 0.03
5.0 9.0
0.15 0.03
0.35 0.02 Reel dimensions
0.05 0.03 Bottom View
0.16 0.22
+0.02
0.38 –0.03
φ180
φ60
■ CST3B Unit: mm
0.8 ± 0.05
3.5 ±0.05
0.70 ± 0.03
0.04 M A B
8.0
B B’
3
1.36
1.3
0.65 ± 0.03
0.2 ± 0.02
0.7
0.05 ± 0.03
1.2 ± 0.05
A’ φ0.5 0.6
0.65
0.25 ± 0.03
2.0 ±0.05 A’
0.25 0.2 0.65
B B’
Tape feeding direction 11.4
0.65
0.04 M A B
2 1 Reel dimensions
0.05 ± 0.03
0.25 ± 0.03 Bottom View 0.25
0.1
0.45
φ180
φ60
0.45
- 0.03
0.48 + 0.02
55
9 Packaging
1.75
3.5 ±0.05
φ0.5
8.0
1.35
0.22 ± 0.05
X X’
1.2 ± 0.05 0.5
Y’
0.8 ± 0.05 Y’ 0.63
0.45
1.3 Tape feeding direction Cross section: Y-Y’
0.32 ± 0.05
1.2 ± 0.05
0.8 ± 0.05
0.4 0.4
1 X X’
1.15
2 0.4 Cross section: X-X’ 11.4
3 5.0
Reel dimensions 9.0
0.13 ± 0.05
0.45
0.5 ± 0.05
0.4 0.4
φ180
φ60
Packing quantity 8000 pcs/reel
1.75
3.5 ±0.05
φ0.5
8.0
1.8
1.6 ± 0.2 0.6 X X’
0.2 - 0.05
0.8 ± 0.1 Y’
+ 0.1
Y’ 0.95
1.75
Tape feeding direction Cross section: Y-Y’
1.6 ± 0.2
1.0 ± 0.1
0.6
0.5 0.5
1 X X’
1.4
5.0
Reel dimensions 9.0
0.7 ± 0.1
0.55
φ180
φ60
φ1.05
8.0
2.1 ± 0.1
2.3
Y’
Y’
0.3
1.25
0.65 0.65
2.0 ± 0.2
1.3 ± 0.1
X X’
2 3
Cross section: X-X’ 11.4
1.9
5.0
Reel dimensions 9.0
0.15 - 0.05
+ 0.1
0.90 ± 0.1
0.7
0.65 0.65
φ180
φ60
0 to 0.1
56
■ UFM Unit: mm
Package dimensions Typical PCB land pad dimensions Tape dimensions 2.0 ±0.05 4.0 ±0.1 0.2
φ1.5 ±0.1 Y
Y
1.75
3.5 ±0.05
φ1.1
8.0
2.3
0.65 ± 0.05
2.1 ± 0.1 0.5 X X’
Y’
1.7± 0.1 Y’ 0.85
Tape feeding direction Cross section: Y-Y’
0.8
2.2
- 0.05
0.3 + 0.1
2.0 ± 0.1
1 X X’
2 3
1.9
Cross section: X-X’
0.166 ± 0.05 11.4
5.0 9.0
Reel dimensions
0.7 ± 0.05
0.65 0.65
φ180
φ60
Packing quantity 3000 pcs/reel
φ1.5 ±0.1 Y
Y
1.75
3.5 ±0.05
φ1.1
8.0
3.3
+ 0.5
2.5 X X’
- 0.3
+ 0.25 0.8 Y’
1.5
- 0.05
- 0.15
+ 0.1
Y’ 1.35
Tape feeding direction Cross section: Y-Y’
3.25
0.4
1.0
0.95 0.95
2.9 ± 0.2
1 X X’
1.9
2 3
2.4
5.0
+ 0.1
0.3
9.0
Reel dimensions
+ 0.2
- 0.1
0.16
0.95 0.95
1.1
0 to 0.1
φ180
φ60
■ TSM Unit: mm
Package dimensions Typical PCB land pad dimensions Tape dimensions 2.0 ±0.05 4.0 ±0.1 0.25
φ1.5 ±0.1 Y
Y
1.75
3.5 ±0.05
φ1.1
8.0
+ 0.2
3.1
2.8 - 0.3
X X’
+ 0.2 0.8
1.6 - 0.1 Y’
0.4 ± 0.1
Y’ 0.9
Tape feeding direction Cross section: Y-Y’
3.15
1.0
0.95 0.95
2.9 ± 0.2
1.9 ± 0.2
1
X X’
2 3
2.4
5.0 9.0
Reel dimensions
0.15
0.7 ± 0.05
0.95 0.95
0 to 0.1
φ180
φ60
57
9 Packaging
■ CST4 Unit: mm
Package dimensions Typical PCB land pad dimensions Tape dimensions 2.0 ±0.05 4.0 ±0.05 0.2
φ1.5 ±0.1 Y
Y
1.75
3.5 ±0.05
φ0.5
8.0
1.35
0.8 ± 0.05
X X’
0.5 0.5
0.05 ± 0.04 0.2 ± 0.02
0.3 ± 0.02
Y’
Y’ 0.5
1.2 ± 0.05
0.075 ± 0.04
0.95
0.75
X X’
0.75
Cross section: X-X’ 11.4
5.0 9.0
Bottom View Reel dimensions
0.3
- 0.03
0.38 + 0.02
0.2
φ180
φ60
Packing quantity 10000 pcs/reel
Package dimensions Typical PCB land pad dimensions Tape dimensions 2.0 ±0.05 4.0 ±0.1 0.18
φ1.5 ±0.1 Y
Y
1.75
3.5 ±0.05
φ0.5
8.0
1.75
X X’
1.6 ± 0.05 Y’
1.2 ± 0.05 0.3 Y’ 0.65
0.2 ± 0.05
1 X X’
0.5 0.5
2 1.0
Cross section: X-X’ 11.4
3
1.35
5.0 9.0
4 0.5 0.5 Reel dimensions
0.12 ± 0.05
0.55 ± 0.05
φ180
φ60
Package dimensions Typical PCB land pad dimensions Tape dimensions 0.25
2.0 ±0.05 4.0 ±0.1
φ1.5 ±0.1 Y
Y
1.75
3.5 ±0.05
φ1.1
8.0
2.1 ± 0.1
2.3
1.25 ± 0.1
0.4 X X’
Y’
0.2 - 0.05
Y’ 1.2
+ 0.1
0.65 0.65
2.0 ± 0.2
0.8
1.3 ± 0.1
2 X X’
1.9
11.4
3 4 5.0 9.0
Reel dimensions
0.15 - 0.05
+ 0.1
0.9 ± 0.1
0.65 0.65
φ180
φ60
0 to 0.1
58
■ UFV Unit: mm
Package dimensions Typical PCB land pad dimensions Tape dimensions 2.0 ±0.05 4.0 ±0.05 0.18
φ1.5 ±0.1 Y
Y
1.75
3.5 ±0.05
φ1.1
8.0
2.3
2.1 ± 0.1 X X’
0.45
1.7 ± 0.1 Y’
Y’ 0.85
0.3 -0.05
5
+0.1
1
0.8
2.2 Tape feeding direction Cross section: Y-Y’
0.65 0.65
1.3 ± 0.1
2.0 ± 0.1
2 X X’
1.9
3 Cross section: X-X’
4 11.4
5.0 9.0
Reel dimensions
+0.06
0.16 -0.05
0.7 ± 0.05
0.65 0.65
φ180
φ60
Packing quantity 3000 pcs/reel
Package dimensions Typical PCB land pad dimensions Tape dimensions 2.0 ±0.05 4.0 ±0.1 0.25
φ1.5 ±0.1 Y
Y
1.75
3.5 ±0.05
φ1.1
8.0
+ 0.2
2.8
3.23
- 0.3
+ 0.2 X X’
1.6 - 0.1 0.95 0.95
Y’
Y’ 1.3
0.4 ± 0.1
0.95
3.2
X X’
0.95
2.4
2
4
11.4
5.0 9.0
3 Reel dimensions
1.0
- 0.06
+ 0.1
+ 0.2
- 0.1
0.16
φ180
φ60
0 to 0.1
■ CST6D Unit: mm
0.2 ±0.05
4.0 ±0.05 φ1.5 +0.1/-0 B
B
0.05 ± 0.03
1.0 ± 0.05
3.5 ±0.05
0.15 ± 0.03
8.0 ±0.1
0.98 ±0.05
1.13
0.35
± 0.03 ± 0.03
A A’
0.9 ± 0.05
0.6 ± 0.02
0.4
B’
1.13 φ0.5 ±0.05
B’
0.45
2.0 ±0.05
A A’ 0.48 ±0.05
0.2
1.08 ±0.05
0.25 0.15
0.2 0.15
- 0.03
0.38 + 0.02
φ180
φ60
59
9 Packaging
Package dimensions Typical PCB land pad dimensions Tape dimensions 2.0 ±0.05 4.0 ±0.1 0.18
φ1.5 ±0.1 Y
Y
1.75
3.5 ±0.05
φ0.5
8.0
1.75
0.2 ± 0.05
X X’
1.2 ± 0.05 0.3
Y’
Y’ 0.65
1.75
1 6
0.5 0.5
X X’
2 5
1.0
1.35
Cross section: X-X’ 11.4
3 4 0.5 0.5
0.12 ± 0.05
5.0 9.0
Reel dimensions
0.55 ± 0.05
1.6 ± 0.05
φ180
φ60
Packing quantity 4000 pcs/reel
Package dimensions Typical PCB land pad dimensions Tape dimensions 2.0 ±0.05 4.0 ±0.1 0.25
φ1.5 ±0.1 Y
Y
1.75
3.5 ±0.05
φ1.1
8.0
2.3
2.1 ± 0.1 X X’
0.4
1.25 ± 0.1
Y’
Y’
- 0.05
1.2
+ 0.1
0.65 0.65
0.8
2.0 ± 0.2
1 6 2.2
0.2
2 5 X X’
1.9
3 4 11.4
0.15 ± 0.05
5.0 9.0
Reel dimensions
0.9 ± 0.1
0.65 0.65
0 to 0.1
φ180
φ60
■ UF6 Unit: mm
Package dimensions Typical PCB land pad dimensions Tape dimensions 2.0 ±0.05 4.0 ±0.05 0.18
φ1.5 ±0.1 Y
Y
1.75
3.5 ±0.05
φ1.1
8.0
2.3
2.1 ± 0.1
0.45 X X’
1.7 ± 0.1
Y’
Y’ 0.85
6
0.3 -0.05
+0.1
1
0.8
2.0 ± 0.1
2
5 X X’
1.9
3 11.4
4
5.0 9.0
Reel dimensions
+0.06
0.16 -0.05
0.7 ± 0.05
0.65 0.65
φ180
φ60
60
■ VS-6 Unit: mm
1.75
φ1.1
6 4
3.5
8.0
B
0.8 0.6 0.8 B'
3.3
5.2
2.75
-0.3
2.8+0.2
-0.1
1.6+0.2
2.0
1.0
A'
A' 1.4
4.0
B 1.55
B'
0.95 1 3 0.3±0.1
2.4
3.05
0.16±0.05
2.9±0.2 11.4
5.0 9.0
0.7±0.05
Reel dimensions
0.05±0.05
0.05 0.25+0.25
-0.15 0.95 0.95
φ180
φ60
Packing quantity 3000 pcs/reel
■ VS-8 Unit: mm
1.75
φ1.5 A
2.0
2.9±0.1 A 0.2
0.3+0.1/ –0.05
B B
3.5
0.025 M A
8.0
0.65 (8X)
2.1
2.2
8
2.75
1.5±0.1
1.9±0.1
A
4.0 A 0.95
φ1.1
B B
1 4 3.1
0.65
1.50
0.8±0.05
11.4
5.0 9.0
Reel dimensions
S 0.05 S
0.40 (8X)
A
+0.04
0.71–0.16
0.65 (6X)
φ180
φ60
0.24+0.10
–0.09
+0.04
0.71–0.16
0.475
■ PS-8 Unit: mm
4.0
0.65 (8X)
0.33±0.05
φ1.1
8.0
0.05 M A 5
3.1
5.5
8
2.75
2.4±0.1
2.8±0.1
2.0 0.95
4.0 1.15
–0.11
0.28 +0.10
1
0.33±0.05 4 B 0.17±0.02
0.475 3.1
–0.12
1.12 +0.13
0.05 M B
2.4
11.4
0.65 5.0 9.0
2.9±0.1
A Reel dimensions
0.8±0.05
–0.12
1.12 +0.13
–0.11
S 0.025 S
φ180
0.40 (8X)
0.28+0.10
φ60
0.65 (6X)
61
9 Packaging
■ TSON Unit: mm
0.1 ± 0.05
0.3 ± 0.05
1.75
4 2.0 φ1.5
0.25
0.65 0.05 M A
8 5
3.3 ± 0.3
3.1 ± 0.1
5.5
12
2.65
3.46
1 4 0.65 0.4
(4.75)
0.6 0.4
0.575
φ1.1 1.05
0.85 ± 0.05
0.17 ± 0.03
A
18.5
3.1 ± 0.1
Reel dimensions 120° 13.5
2.2
R135
0.3
R10
S 0.05 M S
0.7± 0.1
4
0.4
φ100
φ330
30
1 4 φ13
2.0
0.25 ± 0.1
2.1 ± 0.1
2.49 ± 0.2
■ STP2 Unit: mm
1.75
2.0
3.8±0.1
1
5.5
0.375 4
12.0
4.0
1.6±0.1
0.375 3
0.42
2
0.025 M B
B 4.0
2.2 0.8
0.6±0.05 φ1.0
L Type R Type
0.75
13
φ180
0.46
0.35+0.06 *1
–0.1
φ60
0.4+0.1 18
–0.06 4 *2
φ76
13
1
0.2±0.05 3
1.93±0.1
1.25±0.1
*1: 2
*2: 4 1.2 1.2
0.5
3.5
φ0.7
8.0
1.80
φ0.30 A A
0.25 ± 0.05
φ0.50 4.0
B 0.3
0.65
A
0.65
φ0.7 1.75
11.4
0.001
Reel dimensions 5.0 9.0
0.01 S S
φ0.3
1 2 0.65
0.025 M A B
φ180
φ60
0.65
62
■ TSSOP Advance Unit: mm
0.5 ± 0.1
0.25 ± 0.05
1.75
0.8 4.0
0.05 M A 0.3
8 5 2.0 2.0 φ1.55
4.65 ± 0.3
3.65 ± 0.2 +0 5.23
5.05
5.5
0.2 -0.2
1.1
12.0
4.28
9.3
4.1
0.55 0.55
(4.75)
1 4 0.55
0.75 ± 0.05
3.5
2.95 1.0
0.166 ± 0.05
A φ1.7
8.0
0.775
3.5 ± 0.2
1.1 0.85
18.5
Reel dimensions 120 13.5
S 0.05 S
1.05 ± 0.2
R135
R10
0.8 0.55
4.0
1 4
φ100
φ330
30
φ13
0.6 ± 0.1
2.0
2.2 ± 0.2
2.75 ± 0.2
8 5 0.8 ± 0.1
Packing quantity 3000 pcs/reel
■ TSSOP-8 Unit: mm
1.75
4.0 2.0
φ1.55
5.5
12.0
8 5 0.40 (8X)
3.5
3.7
(4.75)
4.4 ± 0.1
6.4 ± 0.3
1.3 (8X)
0.16 +0.04
0.65
-0.02
18.5
3.3 max
Reel dimensions
120˚ 13.5
3.0 ± 0.1
R135
0.05 ± 0.05
φ100
φ330
30
φ13
2.0
■ SOP-8 Unit: mm
0.3
2.0 2.0 φ1.55
8 5
9.3
12.0
5.3
5.6
1.0 (8X)
(4.75)
0.5
6.8
1 4
0.25 M
1.27
18.5
5.5 max Reel dimensions 120˚ 13.5
5.0 ± 0.2
0.15-0.05
+0.1
0.1 -0.05 1.5 ± 0.2
R135
R10
4.0
1.27 (6X)
+0.1
φ100
φ330
30
63
9 Packaging
1.75
2.0 2.0 φ1.55
0.5±0.1
1.27 0.4±0.1
0.05 M A
8 5 6.6
6.4
5.5
6.0±0.3
5.0±0.2
12.0
9.3
5.6
5.8
0.15±0.05 1.0
(4.75)
0.75
0.5
0.75
1.2
1 4 0.595 8.0 φ1.7
4.75
4.56
0.95±0.05
0.166±0.05
A
5.0±0.2
Reel dimensions
1.3
18.5
120˚ 13.5
1.15 1.0
S 0.05 S
R135
1.1±0.2
R10
4.0
1 4
1.27 0.75
φ100
φ330
30
0.6±0.1
φ13
3.5±0.2
2.0
4.25±0.2
8 5 0.8±0.1
■ PW-Mini Unit: mm
Tape dimensions
4.0 0.3
1.5
ø1.5
2.0 2.0
5.1
5.65
4.6 max 1.6 max
12.0
9.5
1.7 max 0.4 ± 0.05
4.5
4.7
4.85
0.5
2.3
0.8 min 2.5 ± 0.1
4.9
4.2 max
0.9
8.0 1.65
1.8
+0.08
0.45-0.05 Reel dimensions 13
5.0
+0.08
0.4 -0.05 +0.08
0.4 -0.05
1.5 ± 0.1 1.5 ± 0.1
ø180
1 2 3 ø60
1.2
1. Gate 1.2
2. Drain (Heatsink)
3. Source Packing quantity 1000 pcs/reel
■ DP Unit: mm
Tape dimensions
1.7 ± 0.2
4.0
1.75
10.1
5.5 ± 0.2
1.5 ± 0.2
6.75
9.6 ± 0.3
6.8
2.7
8.0
0.6 ± 0.15
0.95 max
Reel dimensions 40° 17.5
0.6 ± 0.15
0.6 max 120°
R5
2.5 max
2 ± 0.5
2.3 2.3
R120
2
ø330
ø80
ø13
1 2 3
3 0.5
10
1.1 ± 0.2
0.1 ± 0.1
64
■ New PW-Mold Unit: mm
6.5 ± 0.2
Tape dimensions
1.5 ± 0.2
4.0
1.75
5.2 ± 0.2 0.6 max ø3.0
2.0 ø1.5 0.3
7.5
16.0
9.5 ± 0.3
5.5 ± 0.2
10.1
1.2 max
6.75
1.1 ± 0.2 6.8
2.7
8.0
ø330
ø80
ø13
3
10
■ DPAK Unit: mm
1.75
φ1.5 min 2.7
5.34 ± 0.13 0.58 max
1.7
0.6
1.6
7.5
16.0
10.5
6.1 ± 0.12
2.0
+ 0.4
– 0.6
1.0 max
0.3 ± 0.05
10.0
6.9
2.5
8.0
15.9-19.4
Reel dimensions
1.14 max
2.29 22.4 max
+ 0.25
– 0.12
0.76 ± 0.12
2.3 ± 0.1
332 max
1.52
0.07 ± 0.07
16.4
1. Gate 1 2 3
2. Drain (Heatsink)
3. Source Packing quantity 2000 pcs/reel
■ TO-220SM Unit: mm
Tape dimensions
1.75
4.0 0.4
ø1.5 ø2.0
10.3 max 2.0
1.32
11.5
24.0
21.5
13.9
10.6 max
10.75
9.1
0.1
10.8 5.2
1.5
12.0
3 ± 0.2
1.5
0.76 40°
Reel dimensions 24.4
0.6
4.7 max
1.32
4.0
2.6
10
0.1
1. Gate 2 2
2. Drain (Heatsink)
3. Source Packing quantity 1000 pcs/reel
65
9 Packaging
■ TO-220SM(W) Unit: mm
4.0
1.75
ø1.5 ø2.0 0.4
10.0 ± 0.3 Tape dimensions 2.0
11.5
24.0
21.5
13.9
10.0 ± 0.3
10.75
9.0
10.8 5.2
1.1 12.0
1.6
Reel dimensions 40° 24.4
3 ± 0.2
120°
0.76 ± 0.1 R8
2
1.4 ± 0.1 2.35 ± 0.1 R120
2
ø330
ø100
2.54 ± 0.25 2.34 ± 0.25 0.4 ± 0.1
ø13
4.0
0.05 ± 0.05
1 2 3 10
3.5 ± 0.2
1. Gate 2.76
2. Drain (Heatsink) 2 2
■ TFP Unit: mm
0.8 max
1.75
4.0 12.0 2.0 ø1.5 0.30
0.4 ± 0.1
7.0 ± 0.2
1
11.5
24.0
21.5
10.5
9.2 max
9.5
3.0
ø2.0
120°
25.5
Reel dimensions
R135
0.7 max
0.5
R10 60°
.0±
2.0 1.5 2.0 2.5
44.0
ø330
ø80
2 3 4
3.0 max
ø13
1. Drain (Heatsink)
2. Gate
0.4 ± 0.1
6.8 max
5.1 max 0.6 max
5.2 ± 0.2
8.2 max
2.2 max
5.5 ± 0.2
0.75 max
1.0 max
1.0
0.8 max
10.5 min
0.6 max
12.0 min
1.27 1.27
1.1 ± 0.2
1. Source 1 2 3
1. Gate
0.6 max
2.3 2.3
2.54
3. Gate 3. Source 1 2 3
6.5 ± 0.2
1.7 ± 0.2
6.8 max
5.2 ± 0.2 0.6 max
5.2 ± 0.2 0.6 max
5.5 ± 0.2
5.5 ± 0.2
1.6
5.7
0.6 max
0.6 ± 0.15
2.3 2.3
2.3 ± 0.2
1 2 3
2.5 max
66
■ TPS ■ TO-220AB Unit: mm
8.0 ± 0.2 10.3 max ø3.6 ± 0.2
3.0
6.7 max
7.0 ± 0.2
15.7 max
0.5
2.5 max
1.5
0.5
1.4 ± 0.1
1.05 ± 0.1
13.5 min
12.6 min
0.5 + 0.15 1.6 max
- 0.05
0.76
4.7 max
0.5 + 0.15 2.54 ± 0.25
2.5 ± 0.5 2.5 ± 0.5 - 0.05
2.6
1. Source 1. Gate
1.32
0.5
3.5 ± 0.2
2. Drain 2. Drain (Heatsink)
3. Gate 1 2 3
3. Source 1 2 3
1.3
■ TO-220(W) ■ TO-220NIS
10.0 ± 0.3
A ø 3.65 ± 0.2 10 ± 0.3 ø 3.2 ± 0.2 2.7 ± 0.2
9.5 ± 0.2 0.6 ± 0.1
3.0
3.9
3.2 2.8
15 ± 0.3
15.0 ± 0.3
5.6 max
9.0
1.1
1.1
1.1 ± 0.15
13.0 min
0.75 ± 0.25
2.8 max
12.8 ± 0.5
0.75 ± 0.15
0.62 ± 0.15
ø 0.2 M A
+0.25 2.54 ± 0.25 2.54 ± 0.25
0.57 –0.10
4.5 ± 0.2
2.53 ± 0.2
1. Drain 1. Gate
2.6
2.54 2.54
0.75 ± 0.15
4.5 ± 0.2
2. Source 2. Drain
3. Gate 1 2 3 3. Source 1 2 3
■ TO-220SIS ■ TO-220FL
10 ± 0.3 2.7 ± 0.2 10.3 max
ø 3.2 ± 0.2 A 1.32
3.0
3.9
10.6 max
15 ± 0.3
9.1
2.5 max
1.14 ± 0.15
2.8 max
1.6 max
13 ± 0.5
12.6 min
0.76
0.69 ± 0.15
ø 0.2 M A
2.54 2.54
2.54 ± 0.25 2.54 ± 0.25
1. Gate 1. Gate
2.6 ± 0.1
0.5
0.64 ± 0.15
4.7 max
1.32
4.5 ± 0.2
2.6
3. Source 1 2 3 3. Source 1 2 3
■ TO-3P(N) ■ TO-3P(N)IS
15.9 max ø 3.2 ± 0.2 15.8 ± 0.5 ø 3.6 ± 0.2 3.5
2.0
1.0
4.5
5.5
21.0 ± 0.5
20.0 ± 0.3
3.6 max
15.5
3.3 max
9.0
2.0
2.0
19.4 max
20.5 ± 0.5
2.0 ± 0.3
1.0 + 0.25
- 0.15
+ 0.3
1.0 - 0.25
1.0
- 0.1
- 0.15
0.6 + 0.25
2.8
1 2 3
2. Drain (Heatsink) 2. Drain
5.0 ± 0.3
4.8 max
3. Source 1 2 3 3. Source
■ TO-3P(L)
20.5 max ø 3.3 ± 0.2
6.0
26.0 ± 0.5
4.0
2.50
11.0
2.0
2.5
20.0 ± 0.6
3.0
+ 0.3
1.0
- 0.25
5.2 max
1. Gate
2.8
0.6
2. Drain (Heatsink)
3. Source 1 2 3
67
OVERSEAS SUBSIDIARIES AND AFFILIATES (As of April 01, 2009)
2009-9
Toshiba America Toshiba Electronics Europe GmbH Toshiba Electronics Asia, Ltd.
Electronic Components, Inc. • Düsseldorf Head Office • Hong Kong Head Office
• Headquarters-Irvine, CA Tel: (0211)5296-0 Fax: (0211)5296-400 Tel: 2375-6111 Fax: 2375-0969 BCE0082B
Tel: (949)623-2900 Fax: (949)474-1330 • France Branch • Beijing Office
• Buffalo Grove (Chicago) Tel: (1)48-12-48-12 Fax: (1)48-94-51-15 Tel: (010)6590-8796 Fax: (010)6590-8791
Tel: (847)484-2400 Fax: (847)541-7287 • Italy Branch • Chengdu Office
• Duluth, GA (Atlanta) Tel: (039)68701 Fax: (039)6870205 Tel: (028)8675-1773 Fax: (028)8675-1065
Tel: (770)931-3363 Fax: (770)931-7602 • Spain Branch • Qingdao Office
• San Jose Engineering Center, CA Tel: (91)660-6798 Fax:(91)660-6799 Tel: (532)8579-3328 Fax: (532)8579-3329
Tel: (408)526-2400 Fax:(408)526-2410 • U.K. Branch Toshiba Electronics Shenzhen Co., Ltd.
• Wixom (Detroit) Tel: (0870)060-2370 Fax: (01252)53-0250 Tel: (0755)2399-6897 Fax: (0755)2399-5573
Tel: (248)347-2607 Fax: (248)347-2602 • Sweden Branch Toshiba Electronics (Shanghai) Co., Ltd.
Toshiba Electronics do Brasil Ltda. Tel: (08)704-0900 Fax: (08)80-8459 • Shanghai Head Office
Tel: (011)2539-6681 Fax: (011)2539-6675 Toshiba Electronics Asia (Singapore) Pte. Ltd. Tel: (021)6841-0666 Fax: (021)6841-5002
Toshiba India Private Ltd. Tel: (6278)5252 Fax: (6271)5155 • Hangzhou Office
Tel: (011)2331-8422 Fax: (011)2371-4603 Toshiba Electronics Service (Thailand) Co., Ltd. Tel: (0571)8717-5004 Fax: (0571)8717-5013
Tel: (02)501-1635 Fax: (02)501-1638 • Nanjing Office
Toshiba Electronics Trading (Malaysia) Sdn. Bhd. Tel: (025)8689-0070 Fax: (025)8689-0125
• Kuala Lumpur Head Office Toshiba Electronics (Dalian) Co., Ltd.
Tel: (03)5631-6311 Fax: (03)5631-6307 Tel: (0411)8368-6882 Fax: (0411)8369-0822
• Penang Office Tsurong Xiamen Xiangyu Trading Co., Ltd.
Tel: (04)226-8523 Fax: (04)226-8515 Tel: (0592)226-1398 Fax: (0592)226-1399
Toshiba Electronics Philippines, Inc. Toshiba Electronics Korea Corporation
Tel: (02)750-5510 Fax: (02)750-5511 • Seoul Head Office
Tel: (02)3484-4334 Fax: (02)3484-4302
• Daegu Office
Tel: (053)428-7610 Fax: (053)428-7617
Toshiba Electronics Taiwan Corporation
MOSFETs
• Taipei Head Office
Tel: (02)2508-9988 Fax: (02)2508-9999
• Kaohsiung Office
Tel: (07)237-0826 Fax: (07)236-0046
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware,
software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is
permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and
for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could
cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and
comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used
with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use
of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs,
algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES
NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics
appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily
high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact
(“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment
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Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual
property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by
estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM
EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR
INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA,
AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING
WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use,
stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology
may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related
software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all
applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for
damages or losses occurring as a result of noncompliance with applicable laws and regulations.
2009
Previous edition: BCE0082A
2009-9(1k)SO-DQ
Semiconductor Company
Website: http://www.semicon.toshiba.co.jp/eng