EMC

SEMINAR 2012

Speaker:
Lorandt Fölkel
[email protected]
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Agenda

• EMC- basics

• Magnetic field basics

• Filter & Signals

• Insertion loss calculation

• Filter topologies

• Simulation

• Live measuring with spectrum analyzer

• AC/DC how to pass Conducted Emission

• ESD & Layout tipps

Lorandt Fölkel © Würth Elektronik eiSos 2012

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EMC - basics

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EMC - Definition

„Electro-Magnetic Compatibility“

Ability of electronic equipment and systems to operate in proximity of electromechanical

devices, without causing or suffering unacceptable degradation in output or
performance.

HF/RF-
LF-area area

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EMC Directive 2004/108/EC

Main goals:
- To ensure that the electromagnetic disturbances produced by
equipment does not affect the correct functioning of other apparatus as
well as radio and telecommunications networks, related equipment and
electricity distribution networks.

- To ensure that equipment has an adequate level of intrinsic immunity to

electromagnetic disturbances to enable them to operate as intended.

Obviously, the goal of the essential requirements is not to guarantee

absolute protection of equipment (e.g. zero emission level or total immunity). These
requirements accommodate both physical facts and practical reasons. To ensure that
this process remains open to future technical developments, the EMC Directive only
describes the essential requirements along general lines.
In the “new” Directive essential requirements includes both protection
requirements for equipment as well as specific requirements for
installations.

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EMC - Definition

„Transmitter / Receiver“

• Apparatus which operate with other machinery in same electromagnetic environment.

Source / Transmitter <=>(in fact)

Load / Receiver

- Mobile base station - Receivers (TV, Radio, …)

- Electro engine - White & Braun goods
- Hi power electronic - Computer systems
- Mobile device (Laptop, PDA, Mobile phones - Measuring, regulating systems (e.g. sensors)
etc.)
- Medicine electronics (e.g. Heart pace maker)
- Discharge of static capacity
 ESD (Electro Static Discharge – „Person“)
 LEMP (Lighting Electro Magnetic Pulse)

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EMC - requirement

Beginning from definition

• an basic requirement to apparatus:

1) avoid
Emission
2) prevent

3) attenuated Interference

Effective protection TO AND AGAINST other electronic devices

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EMC – requirement directive 2004/108/EC

Electromagnetic Compatibility

Emission Immunity

Conducted Radiated Conducted Radiated

Emission Emission Suscept. Suscept.

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EMC - Affect

Economical point of view:

• Depends when you will start to design EMC conform

Cost

Pre-design Prototype Production Time

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EMC - Coupling

…some time as intra system perturbation occurred

• Possibilities to avoid such EMC situations can be done at noise source, coupling way or at
coupled load
 Primary procedure
…to aim at source a low noise
 Secondary procedure
… eliminate the noise thru interrupting the coupling way
 Tertiary procedure
… increase the noise immunity at load

Noise source Load

Coupling way

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Basics

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Whas is frequency?

• lat. Frequentia = occurrence

• …describe the numbers of incidents in a defined time

• all signal forms can be deducted from standard base oscillations (sin., cos.)
 Fourier transformation

• if you overlay those base oscillation you will become new signal forms (vector addition)
 Triangle, right angle, ...

• the unwanted interfering generate our disturbance signal

 e.g. noise ( a accidental signal with “constant” amplitude)

• the aim of EMC: reduce / filter those disturbances

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What is frequency? What is spectrum?

• Fourier transformation

Transformation from
time domain into spectrum

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What is frequency?

• Dependence of wave length -frequency

 m c c0
0,03  
0,05 f f   
0,1

0,3
Example: for WLAN 2,4GHz

1 3 108  m  s

3 2,4 109  s

10   0,125m
30

100
 / 4  3,125cm
300 f MHz
1 3 10 30 100 300 1000 3000 10000
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What is an Inductor ? What is a coil?

…technical aspect:
 a piece of wire wrapped on something

As a function:
• a Filter
• an energy-storage-part (for short-time)

What is the difference between Coil and Inductor?

Coil = Inductor
(many shapes) (just inductance)

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What is an EMC ferrite?

……technical aspect:
 Sintered ferrite material applied to a wire
As a function
• RF-Absorber
• frequency dependant filter
Shapes:
Split ferrite
Toroid / sleeve ferrite
flat cores
ferrite plates
chip bead ferrite
multi hole ferrite
ferrite beads
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The magnetic field

Each electric powered wire generate a magnetic field

Field model
current I

Magnetic field H

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The magnetic field

Field model
Magnetic field H

N
S
O
O
R
U
T
T
H
H

Current I
Magnetic field H

Current I

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The magnetic field

The magnetic field strength is

depending from:
Straight wire I
H • Geometries
2   R • No. of turns
R
• Current

N I
Toroidal H but
R 2   R
NOT ON MATERIAL

N I
solenoid
H
l
l
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The magnetic field

Raverage
Raverage

Current I
H1
H2


I
H1  H 2  H  B1 ? B2
2    Raverage

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The magnetic field

Air Rod core ferrite Ring core ferrite

(Ceramic)

N S N S
N S
O O O O
O O
R U R U
R U
T T T T
T T
H H H H
H H

Induction in air: Induction in a ferrite:

B  0  H B  0  r  H
linear function, because µr = 1 = constant!

material-
frequency-
The relative permeability is a: temperature- -dependant parameter
current-
pressure-
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What is permeability?

Relative permeability
1 B
• describe the capacity of concentration of the r 
magnetic flux in the material. 0 H
• it is a energy factor to magnetize the material
Ferrite material Permanent magnet

• un ordered (random position) • ordered

• soft magnetic • hard magnetic
Typical permeability µr : • Iron power / Superflux : 50 ~ 150
• Nickel Zink (NiZn): 40 ~ 1500
• Manganese Zink (MnZn): 300 ~ 20000
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Permeability – Core material parameter

Temperature influnce
- The magnetization depends from the temperature
Alignment of elementary
T therm. movement Alignment magnets
µr

Ferromagnetic change
1000
to Paramagnetic

+15 %
770 Point reached at
670
-20 %
540
500 Curie-temperature

µr = ? 1

-50 -40°C 23°C 50 85°C 150 250 T / °C

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Permeability – complex permeability

XL(NiZn)
R(NiZn)

=1 turn

Core material-Parameter
Replacement circuit


2 2 R
Z R X_
_ L Z
X L

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|
    j
Permeability – complex permeability ||

10000

Z  jL0   j  R  jX | ||

µr=350

1000

µ`

X LS  L0  |
100
 L0  ||
RSReihe1
Inductance reactance µ`` Frequency dependent
(Magnetize ability)
core losses (hysteresis loss)

10

1 f/MHz
1 10 100 1000 10000

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Core material – Inductors (Storage)

100%

90%

80%

70%
Impedance

60%
XL(Fe) XL(MnZn) XL(NiZn)
50%

40%

30%
„0“-400kHz „0“-10MHz „0“-40MHz
20%

10%

0% f/MHz
0,01 0,1 1 10 100 1000

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Core material – Choke (Filter)

100%

90%

80%

70%
Impedance

60%
R (Fe) R (MnZn) R (NiZn)
50%

40%

30%
200kHz-4MHz 3-60MHz 20-2000MHz
20%

10%

0% f/MHz
0,01 0,1 1 10 100 1000

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Core material – Inductor / EMC-Ferrite

1. Application: Storage inductor

Request: - lowest possible core losses at switching frequency

2. Application: Signal filter for RF-stage

Request: - low losses to signal=> high Q

3. Application: Absorber / Filter

Request – highest possible core losses at application frequency

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Core materials – Application

Filter Storage inductor

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FILTER & SIGNAL

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Filter - basics

The energy can not disappear it will be just transformed into other energy form
energy conservation law

• e.g. electrical energy transformed into  thermal energy

• the core losses from ferrite transform the noise energy into heat

MAIN AIM:
Noise energy should not occur at all!

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Filter - basics

What means filtering?

• useful to reduce coupling of noise from device A to device B

• reduce noise emission

• increase noise immunity

• the signal should be not affected

Complexity?

 Filtering can be very difficult if signal and noise frequency are close to each other

 if signal and noise frequency are far away from each other, then is a filter design
very easy

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Structured interference suppression

 Recognize the coupling mode:

• common mode noise
• differential mode noise

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How can we find out what interference we have?

Common mode or differential mode?

Take a Snap Ferrite and fix it on the cable
(both lines e.g. VCC and GND)

if noise is reduced or
noise immunity increase

e.g. Common mode

you have Common Mode Interference choke

If not

you have Differential Mode Interference e.g. chip bead ferrite

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Common Mode Filter – Signal theories

Less noise
• From device to outside environment
• From outside environment to inside
device

Conclusion:
• “almost” no affect the signal  Differential mode
• high attenuation to the noise  Common mode
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Common mode choke - construction

bifilar sectional

< ? Advantage ? >

Lleak ~ 0,01 … 0,1 % * LR Lleak ~ 0,5 … 2% * LR

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Common mode choke - construction

WE-SL2 744227 WE-SL2 744227S

bifilar winding sectional winding

10000

1000

100

10

1 f/MHz
1 10 100 1000

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Common mode choke - construction

WE-Star TEC split ferrite –> Is that an CMC?

• Yes, CMC with one winding
e.g. 74271712 Comparable with bifilar winding CMC

• Both absorbs Common Mode Interferences

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Common mode choke: ferrite core

Increase the no. of turns means:

12 1
2000 10 2 turns
23 100

1800

1600

1400
Star FIX LFS Star TEC
1200

1000

800

600

400

200

0 f/MHz
1 10 100 1000
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Snap ferrite Star FIX-LFS using MnZn core

Impedance influence by increasing the no. of turns

74272733

10000

1000
Z in Ohm

100

10

1
1 10 100 1000
f in MHz

1ts 2ts 3ts 4ts

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Common Mode Chokes – line card 56

CMC produced by Würth Elektronik eiSos

For mains power For signal and low voltage

250VAC / max. 35A Umax. = 80VDC / up to 5A

Wire wound with sectional

THT SMD sectional bifilar
winding

SMD THT WE-SLx series WE-SLx WE-SLx series

WE-MLS WE-CNSW Serie WE-CNSW
6-hole-Ferrite WE-CMS WE-SCC
WE-CMB WE-UKW WE-SCC
WE-LF SMD WE-LF
WE-FC
Würth Elektronik eiSos GmbH © 2012 Lorandt Fölkel
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Common mode chokes – line card

Insertion loss (common mode) WE-CMB XS: MnZn <=> NiZn

CMB MnZn CMB NiZn
70
14 µH

30 µH
60
47 µH

100 µH
50
1 mH

5 mH
attenuation [dB]

40 10 mH

20 mH

30 39 mH

20

10

0
0,1 1 10 100 1000
frequency [MHz]

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INSERTION LOSS

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Insertion loss - Definition

Mathematic definition

ZA ZF

U0 U1 U2 ZB

Source Coupling way Load

• System attenuation

Z A  ZF  ZB
A  20  log in (dB)
Z A  ZB
• Impedance
 20A 
Z F  10  Z A  Z B   Z A  Z B  in ()
 
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Insertion loss - Definition

The real world replacement circuit

Inductor

Source

Capacitor

Source Coupling way Load

• Practical values for source and load impedance

 Grounding planes 1…2Ω
 Vcc distribution 10 … 20 Ω
 Video- /Clock- /Data line 50 … 90 Ω
 long data lines 90 … >150 Ω

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Insertion loss - example

 Application: power supply

 20dB @ 200 MHz
60

1 Ohm
50 10 Ohm
50 Ohm
40

 20A 
Damping [dB]

Z F  10  Z A  Z B   Z A  Z B 
30

20  
10

100 1000
0
es Ferrites [? ]
Impedance of Ferrite [Ω] 180Ω
1 10 100 1000

• System impedance = 10 Ω

Catalog: WE-CBF 742 792 61

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Insertion loss - example

CH1 |Z|
WE-CBF 742 792 61 CH2 XL
typischer Impedanzverlauf /
CH3 R typical Impedance curve
1000

Impedanz / impedance [Ohm]

200Ω 100

10

1
1 10 100 1000 10000
Frequenz / frequency [MHz]
IF BW 10kHz POWER 0 dBm
200MHz SWP134,5 msec
START 1 MHz STOP 1,8 GHz
Z XL R

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Insertion loss - example

• Check the results

 Measuring the emission and compare with the solution
Level [dBµV/m]

60

50

40

30

20

10

0
30M 40M 50M 70M 100M 200M 300M 400M 600M 1G

Frequency [Hz]

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Insertion loss - example

• Possibility 1: to high attenuation?

60

1 Ohm
50 10 Ohm
50 Ohm
40dB 40
Dämpfung [dB]

30

20

10

100 1000
0
es Ferrites [? ]
1 10 100 1000
Impedanz des Ferrites [Ω]

 Could be because of wrong system impedance

 reduce the impedance of ferrite

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Insertion loss - example

• Possibility 2: to low attenuation

60

1 Ohm
50 10 Ohm
50 Ohm
40
Dämpfung [dB]

30

20

8dB 10

100 1000
0
es Ferrites [? ]
1 10 100 1000
Impedanz des Ferrites [Ω]

 Could be because of wrong system impedance

 increase the impedance of ferrite (ZF~1000Ω)

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Insertion loss - example

• Dependency of system impedance (Source/Load) vs. Damping

 High system impedance generate low attenuation
40

system imp. increase

30
Damping [dB]

10Ω
20

50Ω

10
200Ω

1kΩ
0 f [MHz]
0,1 1 10 100 1000
 Filtering just to a certain system impedance possible
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FILTER TOPOLOGIES

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Insertion loss – recommended filter topology

Source Impedance Load Impedance

low high  small C = higher SRF

high
C high

high or high or
unknown C L C unknown
Choose ferrite bead or
low L inductors L which
low
= build no resonance with C
= wideband filter
L L
low or low or
unknown unknown Pay attention to:
C
SRF of used components
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Filter topologies

50 Ohm Ref. Line

3xC Capacitance Filter

„L“Filter with SMD
Ferrite

„L-C“ Filter with SMD

Ferrite & Capacitor

„PI“ Filter

„T“ Filter

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LTspice - FREEWARE

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LTspice - Simulation

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L Filter SMD-Ferrite WE-CBF

• Using the core losses R=f(f)

• Transform differential noise energy into heat

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Simulation – LED driver LTC3490

• Filtering the reflected switching power

• First solution capacity to GND
• Second/third solutions
•  L-Filter & PI-Filter
Frequenz in MHz
0,00
0 10 20 30 40 50 60 70 80 90 100

basic_wave
-10,00
1µF_inputKond
0,1µF_inputKond
-20,00 1,5µH_inputChoke
1µF_1,5µH_inputChoke
1µF_1,5µH_0,1µF_inputChoke
-30,00
1µF_3,3µH_0,1µF_inputChoke

-40,00
in dBm

-50,00

-60,00

-70,00

-80,00

-90,00

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SIMULATION

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Simulation – LTSpice IV

• http://ltspice.linear.com/software/LTspiceIV.exe FREEWARE

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Simulation – LTSpice IV

• SMD-Ferrite Impedance vs. DC Bias Z(I)

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Simulation - LTSpice

• CommonMode-Chokes

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AC/DC CONVERTER EMI

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Transformers for EMC – What to choose?

111
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Transformers for EMC – No Antennas please!

Enough Said!

Flying Leads Make Great Antennas.

112
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113
Transformers for EMC – No external gaps

 Center leg gap only

– Windings shield
 No gaps in outer legs
– Nothing to shield

No Gaps here

Gap here
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114
Transformers for EMC – No drum cores

 Drum core style

 Very large gap
 Much radiation

Not a good solution!

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115
Transformers for EMC – No rod cores

 Rod core style

 Huge gap – much radiation
 This is an AM antenna

So where is the gap?

Not a good solution!
What is this?
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Transformers for EMC – No EI core

 EI core style
 Mylar or tape used for gap
 Three unshielded gaps

Not a good solution!

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Transformers for EMC – Gap

 Gap must be perpendicular to flux lines

– Here only one side is gapped
 Uneven gaps are inefficient. => Why?
– Core saturates at minimum gap.
– Requires a larger gap
 Also larger gap – More potential EMI
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Transformers for EMC – Internal shields

 Shield both conducted and radiated noise

 Copper foil or wound magnet wire?
 Copper foil shields – Expensive, => Why?
– Must build shield
– Must be covered with tape
– Winding machine stopped to apply
 All shields take away from winding area

Internal
shield

118
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Transformers for EMC – External shields

 How do external shields differ from

internal shields?
 Shield radiate noise only!
 As expensive as internal shields

119
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Transformers for EMC – Y-Cap termination

 Noise couples through the transformer via Cww

What Can We Do?
• Noise seeks path to primary circuit
• Without path, noise may become conducted emissions
 Y-Cap across transformer reduces noise Decrease Cww?
• Tune the capacitor for optimum loss vs. noise reduction
• Capacitor usually in the 470pF to 4.7nF range What Else Can We Do?
• Y-Caps to transformer terminals not on switch nor on diode
• Close to transformer as possible
120
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Transformers for EMC – Reducing Cww

 High Cww causes conducted emissions

 May reduce Cww, but what happens?
 Leakage inductance increases
 LLKG can be controlled by Snubber but efficiency and cost suffer
 Balance between Cww and Llkg

121
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122

Transformers for EMC – No varnish or potting

Radiated Emissions

With
Without
potting
Potting
material
fails
Material
at three
Passes
different
at
frequencies
All Frequencies
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Transformers for EMC - Small designs

Why build smaller designs?

 Build smaller more compact transformers

 Smaller transformers have less parasitic
– Less capacitance
– Smaller leads (e.g. smaller antennas)
– Smaller gaps
– Less leakage inductance
 Less conducted and less radiated noise

123
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124

Transformers for EMC – Power Supply

Current Compensated Y-Cap

Snubber
Choke WE-FC Transformer

Output filter
WE-TI

Switch IC
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126

Transformers for EMC – Example 1

• Without common mode

choke
• With adjusted Snubber
• Without adjusted Y-Cap

QPeak
Avg.
Peak

Avg.

EMC- Test Failed

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Transformers for EMC – Example 2

• With common mode

choke
• With adjusted Snubber
• Without adjusted Y-Cap

QPeak
Avg.
Peak

Avg.

EMC- Test Failed

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Transformers for EMC – Example 3

• With common mode

choke
• With adjusted Snubber
•With adjusted Y-Cap

QPeak
Avg.
Peak

Avg.

EMC- Passed
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129

Transformers for EMC – Example 4

• With common mode choke

• Without adjusted Snubber
• With adjusted Y-Cap

QPeak
Avg.
Peak

Avg.

EMC- Passed
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Transformer for EMC – Conclusion for this power supply

 Necessary to pass EMI:

– Current compensated
Choke (CMC)
– Y-Caps
 Not necessary to pass EMI
– Optimized Snubber

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LAYOUT DESIGN

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Layout design – set absolute reference for GND

• Common Impedance Coupling

IC IC

G G
N IGND N IGND
D D
IC2a IC2a

Via to GND
C2a C2a

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Layout design – set absolute reference for GND

• GND reference plane

 create an low impedance GND point

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Layout design – set absolute reference for GND

• Layer design

undesirable desired

GND Signal layer 1

FR4 FR4
GND-layer
Vcc-layer

Vcc-layer Signal layer 2

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Layout design – set absolute reference for GND

• GND design for digital devices

WRONG RIGHT

GND

GND
GND

GND

GND

GND
IC1

IC1
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ESD

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Surge protection

over voltage from fast transients Over voltage from high energy

Components:

ignition

Gas discharger
(Trisil) ignition

Varistor explosion
?

Diode
(Suppressor, Transil)
like a Zener-Diode with Short circuit
higher current

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Where to place the varistors

Wrong Right

VDR

Connection PCB Connection PCB

VDR

Main PCB Main PCB

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Where to place the varistors

Perfect
Shielding

VDR

Connection PCB

Main PCB

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Layout design

undesired good better

VDD

6 5 4

824 015
1 2 3

GND

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Layout design suggestion for varistors

PCB tracks

To connector VDR GND PCB

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USB – 2 Port solution (ESD-EMI solution)

824015

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USB 2.0 Flow-Thru Design (ESD-EMI solution)

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LAN ESD-solution

Ethernet 100MBit Ethernet 1GBit

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Ethernet EMI solution

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Ethernet EMI solution: WE-RJ45 HPLE

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Where are the losses?

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Magnetic leakage shielded vs. unshielded

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Magnetic leakage shielded vs. unshielded

unshielded shielded

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Application demo boards

P/N:
EP-CBF-0805  SMD Ferrite 0805
EP-CBF-1206  SMD Ferrite 1206
EP-STROKO  WE-SLxy… Series SMD common mode chokes
VPE 12 pcs.  Price 20,- € inclusive P&P

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USB 2.0:
P/N:829999

USB 3.0:
P/N:829993

Würth Elektronik eiSos GmbH © 2012 Lorandt Fölkel

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More information online: www.we-online.com

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Lorandt Fölkel © Würth Elektronik eiSos 2012

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You can reach us:

Tel:+49 (0)7942-945-0
Fax:+49 (0)7942-945-5000
[email protected]
www.we-online.com

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Globally available. Locally present!

Headquarter in Germany

WE offices

Distribution
Production plants
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WE does not mean Wireless Earthing !

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Sourse: Kontakt Chemie

Würth Elektronik eiSos GmbH © 2012 Lorandt Fölkel