Intel® RealSenseTM

D400 Series Product Family

Datasheet
Intel® RealSense™ Vision Processor D4, Intel® RealSense™ Vision
Processor D4 Board, Intel® RealSense™ Depth Module D400, Intel®
RealSense™ Depth Module D410, Intel® RealSense™ Depth Module D415,
Intel® RealSense™ Depth Camera D415, Intel® RealSense™ Depth Module
D420, Intel® RealSense™ Depth Module D430, Intel® RealSense™ Depth
Camera D435, Intel® RealSense™ Depth Camera D435i

Revision 005

January 2019

Document Number: 337029-005

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© 2019 Intel Corporation. All rights reserved.

2 337029-005
Description and Features

Contents
1 Description and Features .................................................................................. 11
2 Introduction .................................................................................................... 12
2.1 Purpose and Scope of this Document ....................................................... 12
2.2 Terminology ......................................................................................... 12
2.3 Stereo Vision Depth Technology Overview................................................ 13
2.4 Camera System Block Diagram ............................................................... 15
2.5 Intel® RealSense™ Depth Module D400 series Product SKUs ...................... 16
2.6 Intel® RealSense™ Depth Camera D400 series Product SKUs ..................... 17

3 Component Specification .................................................................................. 18

3.1 Vision Processor D4 Camera System Components ..................................... 18
3.2 Host Processor ..................................................................................... 18
3.3 Intel® RealSense™ Vision Processor D4 ................................................... 18
3.3.1 Vision Processor D4 Features .................................................... 18
3.3.2 Vision Processor D4 Signal Description ....................................... 19
3.3.3 Vision Processor D4 Package Mechanical Attributes ...................... 24
3.3.4 Vision Processor D4 Power Requirements.................................... 30
3.3.5 Vision Processor D4 Power Sequencing ....................................... 30
3.3.6 Vision Processor D4 Spec Code .................................................. 31
3.3.7 Vision Processor D4 Storage and Operating Conditions ................. 31
3.3.8 Vision Processor D4 Thermals ................................................... 32
3.4 Clock ................................................................................................... 32
3.5 Serial (SPI) Flash Memory ...................................................................... 32
3.6 Stereo Depth Module ............................................................................. 32
3.6.1 Left and Right Imagers ............................................................. 34
3.6.2 Infrared Projector .................................................................... 35
3.6.3 Color Sensor ........................................................................... 36
3.6.4 Depth Module Connector .......................................................... 37
3.6.5 Stereo Depth Module Label ....................................................... 37
3.6.6 Stiffener ................................................................................. 38
3.6.7 Temperature Sensor ................................................................ 38
3.6.8 Other Stereo Depth Module Components .................................... 38
3.6.9 Mechanical Dimensions............................................................. 39
3.6.10 Stereo Depth Module Power Sequence........................................ 40
3.6.11 Stereo Depth Module Storage and Operating Conditions ............... 40
3.7 Intel® RealSense™ Vision Processor D4 Board .......................................... 41
3.7.1 Mechanical Dimensions............................................................. 42
3.7.2 Depth Module Receptacle .......................................................... 42
3.7.3 Flex and Rigid Interposer Interconnect ....................................... 42
3.7.4 External Sensor Sync Connector ................................................ 47
3.7.5 USB Peripheral Connector – Type-C ........................................... 47
3.7.6 Color Image Signal Processor (ISP) ............................................ 49
3.7.7 Vision Processor D4 Board Power Requirements .......................... 49
3.7.8 Vision Processor D4 Board Thermals .......................................... 49
3.7.9 Vision Processor D4 Board Storage and Operating Conditions ........ 50
3.7.10 Intel® RealSense™ Vision Processor D4 Board Product Identifier and
Material Code .......................................................................... 50
3.8 Intel® RealSense™ Depth Camera D400 Series ......................................... 50

337029-005 3
 3.8.1 Depth Camera D400 Series Mechanical Dimensions ..................... 51
3.8.2 Depth Camera D400 Series Thermals ......................................... 52
3.8.3 Depth Camera D400 Series Storage and Operating Conditions ...... 52
(1) Controlled conditions should be used for long term storage of product. (2)
Short exposure represents temporary max limits acceptable for
transportation conditions. ......................................................... 53
3.8.4 Depth Camera D400 Series Product Identifier and Material Code ... 53
3.8.5 Camera Lens Cleaning Procedure ............................................... 53
4 Functional Specification .................................................................................... 54
4.1 Vendor Identification (VID) and Device Identification (DID) ........................ 54
4.2 Vision Processor D4 Data Streams .......................................................... 54
4.3 Depth Field of View (FOV) ...................................................................... 57
4.4 Depth Field of View at Distance (Z) ......................................................... 57
4.5 Invalid Depth Band ............................................................................... 58
4.6 Minimum-Z Depth ................................................................................. 60
4.7 Depth Quality Specification .................................................................... 60
4.8 Measured Power ................................................................................... 62
4.9 Depth Start Point (Ground Zero Reference) .............................................. 63
4.9.1 Depth Origin X-Y Coordinates .................................................... 65
4.10 Depth Camera Functions ........................................................................ 66
4.11 Color Camera Functions ......................................................................... 67
4.12 IMU Specifications................................................................................. 68

5 Firmware ........................................................................................................ 69
5.1 Update ................................................................................................ 69
5.1.1 Update Limits .......................................................................... 69
5.2 Recovery ............................................................................................. 69

6 Software......................................................................................................... 70
6.1 Intel® RealSense™ Software Development Kit 2.0 ..................................... 70

7 System Integration .......................................................................................... 71

7.1 System Level Block Diagram .................................................................. 71
7.2 Vision Processor D4 System Integration ................................................... 71
7.2.1 Vision Processor D4 Board ........................................................ 71
7.2.2 Vision Processor D4 on Motherboard .......................................... 72
7.3 D4 Camera System Power Delivery ......................................................... 73
7.4 Vision Processor D4 Board for Integrated Peripheral .................................. 74
7.4.1 USB 3.1 Gen 1 Receptacle ........................................................ 74
7.4.2 USB 3.1 Gen 1 High Speed Cable Assembly ................................ 74
7.4.3 Transmit to Receive Crossover .................................................. 75
7.4.4 Motherboard Receptacle ........................................................... 76
7.4.5 Vision Processor D4 Board for Integrated Peripheral Power
Requirements.......................................................................... 76
7.5 Thermals ............................................................................................. 76
7.6 Stereo Depth Module Flex ...................................................................... 78
7.7 Stereo Depth Module Mounting Guidance ................................................. 78
7.7.1 Screw Mount ........................................................................... 78
7.7.2 Bracket Mount ......................................................................... 79
7.7.3 Stereo Depth Module Air gap..................................................... 81
7.8 Thermal Interface Material ..................................................................... 81
7.9 Heat Sink ............................................................................................. 81

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Description and Features

7.10 Cover Design and Material Guidance ....................................................... 81

7.11 Gaskets ............................................................................................... 82
7.11.1 Optical Isolation ...................................................................... 83
7.11.2 Dust Protection ....................................................................... 84
7.12 Firmware Recovery ............................................................................... 84
7.13 Calibration Support ............................................................................... 85
7.14 Multi-Camera Hardware Sync ................................................................. 85
7.15 Handling Conditions .............................................................................. 86
8 Platform Design Guidelines ............................................................................... 87
8.1 Vision Processor D4 on Motherboard ....................................................... 87
8.2 Kaby Lake U and Kaby Lake Y platforms .................................................. 88
8.2.1 Kaby Lake Platform Introduction ................................................ 88
8.2.2 Supported PCB Stack-Up and Routing Geometries ....................... 88
8.2.3 Vision Processor D4 on Motherboard with USB Host Interface ........ 89
8.2.4 Vision Processor D4 on Motherboard with MIPI Host Interface ....... 90
8.2.5 Vision Processor D4 Board for Integrated Peripheral (USB 3.1 Gen 1
Host to Vision Processor D4 Routing) ......................................... 92
8.2.6 USB2.0 Design Guidelines (USB2 Host to Vision Processor D4
Routing) ................................................................................. 93
8.3 Cherry Trail T4 Platform......................................................................... 94
8.3.1 Cherry Trail T4 Platform Introduction ......................................... 94
8.3.2 Vision Processor D4 Platform Design Guidelines ........................... 94

9 Regulatory Compliance ..................................................................................... 95

9.1 System Laser Compliance ...................................................................... 95
9.1.1 Certification Statement............................................................. 95
9.1.2 Explanatory Label .................................................................... 95
9.1.3 Cautionary Statements ............................................................. 95
9.1.4 Manufacturer’s Information ....................................................... 96
9.1.5 US FDA Accession Number ........................................................ 96
9.1.6 NRTL Statement ...................................................................... 96
9.2 Ecology Compliance .............................................................................. 97
9.2.1 China RoHS Declaration ............................................................ 97
9.2.2 Waste Electrical and Electronic Equipment (WEEE) ....................... 98

10 Mechanical Drawings ........................................................................................ 99

11 Connector Drawings ........................................................................................ 107

12 Appendix A – Vision Processor D4 on Motherboard Schematic Checklist ................. 109

12.1 Power Delivery .................................................................................... 116

13 Appendix B- Cover Material .............................................................................. 119

Figures
Figure 2-1. Active Infrared (IR) Stereo Vision Technology ......................................................... 14
Figure 2-2. Depth Measurement (Z) versus Range (R) .............................................................. 14
Figure 2-3. Vision Processor D4 Camera System Block Diagram ................................................ 15
Figure 3-1. Vision Processor D4 Package Drawing .................................................................... 26
Figure 3-2. Vision Processor D4 Ball-out ................................................................................. 27

337029-005 5
Figure 3-3. Vision Processor D4 Power Sequencing .................................................................. 31
Figure 3-4. Stereo Depth Module (Intel® RealSense™ Depth Module D410)................................. 33
Figure 3-5. Stereo Depth Module (Intel® RealSense™ Depth Module D430)................................. 33
Figure 3-6. Stereo Depth Module Power Sequence ................................................................... 40
Figure 3-7. Vision Processor D4 Board (USB Peripheral Type-C)................................................. 41
Figure 3-8. Flex Interposer (Illustration) ................................................................................. 43
Figure 3-9. Rigid Interposer (Illustration) ............................................................................... 43
Figure 3-10. Depth Module Receptacle and Plug Connector Pin Position ...................................... 44
Figure 3-11. Depth Module Connector Orientation and Pin Position............................................. 46
Figure 3-12. USB Type-C Receptacle Pin Map .......................................................................... 48
Figure 3-13. Intel® RealSenseTM Depth Camera D415 ............................................................... 50
Figure 3-14. Intel® RealSense™ Depth Camera D435/D435i ..................................................... 51
Figure 4-1. Depth Field of View to Depth Map illustration .......................................................... 58
Figure 4-2. Left Invalid Depth Band ....................................................................................... 59
Figure 4-3. Depth Module Depth Start Point Reference ............................................................. 63
Figure 4-4. Depth Camera Depth Start Point Reference ............................................................ 64
Figure 4-5. Depth Module X-Y Depth Origin Reference .............................................................. 65
Figure 4-6. Depth Camera X-Y Depth Origin Reference ............................................................. 66
Figure 7-1. System Block Diagram ......................................................................................... 71
Figure 7-2. Intel® RealSense™ Vision Processor D4 Board ........................................................ 72
Figure 7-3. Vision Processor D4 on Motherboard (Illustration) ................................................... 72
Figure 7-4. D4 Camera System Power Scheme ........................................................................ 73
Figure 7-5. Host Motherboard USB 3.1 Gen 1 Routing .............................................................. 75
Figure 7-6. Receptacle Ground Bar Motherboard Connections .................................................... 76
Figure 7-7. Bottom Stiffener Depth Module D410 ..................................................................... 78
Figure 7-8. Bottom Stiffener Depth Module D430 ..................................................................... 78
Figure 7-9. Stereo Depth Module Screw Mount ........................................................................ 79
Figure 7-10. Stereo Depth Module Bracket .............................................................................. 79
Figure 7-11. Stereo Depth Module Bracket Mount .................................................................... 80
Figure 7-12. Stereo Depth Module Bracket Install .................................................................... 80
Figure 7-13. Stereo Depth Module Air Gap .............................................................................. 81
Figure 7-14. Illustration of Gasket Placement and Cover Material ............................................... 83
Figure 7-15. Example of Light Leakage Effects......................................................................... 84
Figure 7-16. Firmware Recovery Sequence ............................................................................. 85
Figure 7-17. External Sensor Sync Connector Location on D4 Vision Processor D4 Board .............. 85
Figure 7-18. External Sensor Sync Connector Location on Depth Camera D435/D435i .................. 86
Figure 8-1. Vision Processor D4 with USB Host Interface .......................................................... 87
Figure 8-2. Vision Processor D4 with MIPI Host Interface .......................................................... 87
Figure 8-3. Vision Processor D4 on Board for USB Integrated Peripheral ..................................... 88
Figure 8-4. Host Processor - Vision Processor D4 ..................................................................... 89
Figure 8-5. Vision Processor D4 Transmit - Host Receive ......................................................... 90
Figure 8-6. Stereo Depth Transmit - Vision Processor D4 Receive .............................................. 91
Figure 8-7. Flex Interposer PCB Stack-Up ............................................................................... 92
Figure 8-8. USB 3.1 Gen 1 Host to Vision Processor D4 Topology ............................................... 92
Figure 8-9. USB2.0 Host to Vision Processor D4....................................................................... 93
Figure 9-1. NRTL Certifications .............................................................................................. 97
Figure 10-1. Intel® RealSense™ Depth Module D400 ................................................................ 99
Figure 10-2. Intel® RealSense™ Depth Module D410 ............................................................... 100
Figure 10-3. Intel® RealSense™ Depth Module D415 ............................................................... 101
Figure 10-4. Intel® RealSense™ Depth Module D420 ............................................................... 102
Figure 10-5. Intel® RealSense™ Depth Module D430 ............................................................... 103
Figure 10-6. Vision Processor D4 Board USB Type-C (Intel® RealSense™ Vision Processor D4
Board)........................................................................................................... 104
Figure 10-7. Intel® RealSense™ Depth Camera D415 .............................................................. 105
Figure 10-8. Intel® RealSense™ Depth Camera D435/D435i .................................................... 106

6 337029-005
Description and Features

Figure 11-1. Receptacle Mechanical Drawing (50 Pin Depth Module Receptacle).......................... 107
Figure 11-2. Plug Mechanical Drawing (50 pin Depth Module Plug) ............................................ 108
Figure 12-1. Vision Processor D4 Laser PWM Reference Platform Schematic ............................... 116
Figure 12-2. Vision Processor D4 24MHz Crystal Clock Reference Platform Schematic .................. 116
Figure 12-3. DC-DC Reference Platform Schematic (3.3V, 1.8V, 0.9V) ....................................... 117
Figure 12-4. Vision Processor D4 VDD_PG and AVDD Reference Platform Schematic ................... 118

Tables
Table 2-1. Depth Module Product SKU Descriptions .................................................................. 16
Table 2-2. Depth Camera Product SKU Descriptions ................................................................. 17
Table 3-1. Component Descriptions ........................................................................................ 18
Table 3-2. Vision Processor D4 Signal Descriptions .................................................................. 19
Table 3-3. Hardware Straps .................................................................................................. 24
Table 3-4. Vision Processor D4 Package Mechanical Attributes ................................................... 25
Table 3-5. Vision Processor D4 Ball-out by Signal Name ........................................................... 27
Table 3-6. Vision Processor D4 Power Requirements ................................................................ 30
Table 3-7. Vision Processor D4 Power Sequencing Timing Parameters ........................................ 30
Table 3-8. Vision Processor D4 SPEC Code .............................................................................. 31
Table 3-9. Vision Processor D4 Storage and Operating Conditions .............................................. 31
Table 3-10. Stereo Depth Module........................................................................................... 32
Table 3-11. Stereo Depth Module SKU Properties ..................................................................... 33
Table 3-12. Standard Left and Right Imager Properties ............................................................ 34
Table 3-13. Wide Left and Right Imager Properties .................................................................. 34
Table 3-14. Standard Infrared Projector Parameters ................................................................ 35
Table 3-15. Wide Infrared Projector Parameters ...................................................................... 35
Table 3-16. Color Sensor Properties ....................................................................................... 36
Table 3-17. Depth Module 50-pin Connector Plug Details .......................................................... 37
Table 3-18. Stereo Depth Module Product Labeling .................................................................. 37
Table 3-19. Stereo Depth Module Label Fields ......................................................................... 37
Table 3-20. Intel® RealSense™ Depth Module D400 Series Product Identifier Code and Product
Material Code .................................................................................................. 38
Table 3-21. Other Stereo Depth Module Components ............................................................... 38
Table 3-22. Intel® RealSense™ Depth Module D400 Mechanical Dimensions ............................... 39
Table 3-23. Intel® RealSense™ Depth Module D410 Mechanical Dimensions ............................... 39
Table 3-24. Intel® RealSense™ Depth Module D415 Mechanical Dimensions ............................... 39
Table 3-25. Intel® RealSense™ Depth Module D420 Mechanical Dimensions ............................... 39
Table 3-26. Intel® RealSense™ Depth Module D430 Mechanical Dimensions ............................... 40
Table 3-27. Stereo Depth Module Storage and Operating Conditions .......................................... 40
Table 3-28. Vision Processor D4 Board .................................................................................. 41
Table 3-29. Vision Processor D4 Board Components ................................................................. 41
Table 3-30. Vision Processor D4 USB Type-C Board Mechanical Dimensions ................................ 42
Table 3-31. Depth Module Receptacle Details .......................................................................... 42
Table 3-32. Interposer Interconnect Signal Description............................................................ 44
Table 3-33. Custom Flex Interposer Ordering Logistics ............................................................. 46
Table 3-34. External Sensor Connector Details ........................................................................ 47
Table 3-35. External Sensor Sync Connector Pin List ................................................................ 47
Table 3-36. USB Peripheral Connector Pin List ......................................................................... 48
Table 3-37. Custom USB Type C cable Assemblies Ordering Logistics ......................................... 49
Table 3-38. ISP Properties .................................................................................................... 49
Table 3-39. Vision Processor D4 Board Power Requirements ..................................................... 49
Table 3-40. Vision Processor D4 Board Storage and Operating Conditions ................................... 50
Table 3-41. Vision Processor D4 Board Product Identifier and Material Code ................................ 50

337029-005 7
Table 3-42. Depth Camera SKU properties .............................................................................. 51
Table 3-43. Intel® RealSense™ Depth Camera D415 Mechanical Dimensions ............................... 51
Table 3-44. Intel® RealSense™ Depth Camera D435, D435i Mechanical Dimensions .................... 52
Table 3-45. Max Skin Temperature ........................................................................................ 52
Table 3-46. Depth Camera D400 Series Storage and Operating Conditions ................................. 52
Table 3-47. Depth Camera D400 Series Product Identifier and Material Code .............................. 53
Table 4-1. Vendor ID and Device ID Table .............................................................................. 54
Table 4-2. Image Formats (USB 3.1 Gen1) ............................................................................. 54
Table 4-3. Image Formats (USB 2.0) ...................................................................................... 55
Table 4-4. Simultaneous Image Streams (USB 3.1 Gen1 & USB2.0) ........................................... 56
Table 4-5. Depth Field of View ............................................................................................... 57
Table 4-6. Minimum-Z Depth ................................................................................................ 60
Table 4-7: Depth Quality Metric ............................................................................................. 60
Table 4-8: Depth Quality Metric Illustration ............................................................................. 61
Table 4-9. Depth Quality Specification .................................................................................... 61
Table 4-10. Power- Ubuntu 16.04 .......................................................................................... 62
Table 4-11. Power – Windows 10 (RS4) .................................................................................. 62
Table 4-12. Depth Module Depth Start Point .......................................................................... 63
Table 4-13. Depth Cameras Depth Start Point ........................................................................ 64
Table 4-14. Depth Module X-Y Depth Origin Coordinates.......................................................... 65
Table 4-15. Depth Camera X-Y Depth Origin Coordinates ......................................................... 66
Table 4-16. Depth Camera Controls ....................................................................................... 66
Table 4-17. RGB Exposed Controls ......................................................................................... 67
Table 4-18. IMU Specifications .............................................................................................. 68
Table 7-1. USB 3.1 Gen 1 Receptacle Characteristics................................................................ 74
Table 7-2. USB 3.1 Gen 1 Receptacle Pin Out .......................................................................... 74
Table 7-3. USB 3.1 Gen 1 Plug Characteristics ......................................................................... 74
Table 7-4. Cable Assembly Specification ................................................................................. 75
Table 7-5. Motherboard Receptacle Properties ......................................................................... 76
Table 7-6. Vision Processor D4 Board as Embedded Peripheral Power Requirements .................... 76
Table 7-7. Vision Processor D4 Board – Component Power and TDP at Max Operating Mode(1) ....... 77
Table 7-8. Stereo Depth Module (Standard) – Component Power and TDP at Max Operating
Mode(1) ........................................................................................................... 77
Table 7-9. Stereo Depth Module (Wide) – Component Power and TDP at Max Operating Mode(1) .... 77
Table 7-10. Vision Processor D4 Board Components – Case Temperature Limits (Still Air) ............ 77
Table 7-11. Bracket Ordering Logistics ................................................................................... 80
Table 7-12. Component Transmission ..................................................................................... 82
Table 7-13. Electrostatic Discharge Caution ............................................................................ 86
Table 8-1. Host Transmit – Vision Processor D4 Receive Routing Guidelines ................................ 89
Table 8-2. Vision Processor D4 Transmit - Host Receive Routing Guidelines ................................ 89
Table 8-3. Vision Processor D4 Transmit – Host Receive Routing Guidelines ................................ 90
Table 8-4. Stereo Depth Module Transmit - Vision Processor D4 Receive Routing Guidelines ........ 91
Table 8-5. USB 3.1 Gen 1 Host to Vision Processor D4 Routing Guidelines ................................. 93
Table 9-1. U.S. FDA Accession Number................................................................................... 96
Table 12-1. Vision Processor D4 on Motherboard Schematic Checklist ....................................... 109
Table 12-2. Vision Processor D4 Decoupling and Filter Requirements ........................................ 118
Table 13-1. Example: Cover Material Parameters .................................................................... 119

8 337029-005
Description and Features

Revision History

Document Number Revision Number Description Revision Date

337029 001 Initial release January 2018

002 Tracking Module 1 removal, NRTL March 2018

certification, 7.2.2.1 Firmware Update

003  Added USB2.0 support July 2018

 Removed VBUS0 from Table 3 6.Vision
Processor D4 Power Requirements
 Table 3 12. Standard Left and Right
Imager Properties
 Table 3 13. Wide Left and Right
Imager Properties
 Table 3 9. Vision Processor D4 Storage
and Operating Conditions
 Table 3 27 Stereo Depth Module
Storage and Operating Conditions
 Table 3 38. Vision Processor D4 Board
Storage and Operating Conditions
 Table 3 44. Depth Camera D400 Series
Storage and Operating Conditions
 Table 4 3. Image Formats (USB 2.0)
 Table 4 5. Simultaneous Image
Streams (USB3.1 Gen1, USB 2.0)
 4.7 Depth Origin Point (Ground Truth
Zero)
 7.14 Multi-Camera hardware sync for
multi-camera configuration

337029-005 9
 Document Number Revision Number Description Revision Date

004  Description and Features November 2018

 Terminology
 Table 2-2. Depth Camera Product SKU
Descriptions
 Table 3-11. Stereo Depth Module SKU
Properties
 Table 3-33. Custom Flex Interposer
Ordering Logistics
 Table 3-35. External Sensor Sync
Connector Pin List
 Table 3-42. Depth Camera SKU
properties
 Table 3-47. Depth Camera D400 Series
Product Identifier and Material
Code
 Table 4-1. Vendor ID and Device ID
Table
 Table 4-2. Image Formats (USB 3.1
Gen1)
 Table 4-3. Image Formats (USB 2.0)
 Table 4-9. Depth Quality Specification
 Section 4-12 IMU Specification

005  Table 3-11. Stereo Depth Module SKU January 2019

Properties
 Table 3-42. Depth Camera SKU
Properties
 Table 4-4. Simultaneous Image
Streams (USB 3.1 Gen 1 & USB
2.0)
 Table 4-18. IMU Specifications

§§

10 337029-005
 Description and Features

1 Description and Features

Description Usages/Markets

The Intel® RealSenseTM D400 series is a stereo  Drones

vision depth camera system. The subsystem  Robots
assembly contains stereo depth module and vision  Home and Surveillance
processor with USB 2.0/USB 3.1 Gen 1 or MIPI1
 Virtual Reality
connection to host processor.
 PC Peripherals
The small size and ease of integration of the
camera sub system provides system integrators Minimum System Requirements
flexibility to design into a wide range of products.
USB 2.0/USB 3.1 Gen 1
The Intel® RealSenseTM D400 series also offers Ubuntu*16.xx/Windows*10
complete depth cameras integrating vision
processor, stereo depth module, RGB sensor with
color image signal processing and Inertial Intel® RealSense™ Depth Camera D415
Measurement Unit2 (IMU). The depth cameras are Features
designed for easy setup and portability making  Intel® RealSense™ Vision Processor D4
them ideal for makers, educators, hardware
prototypes and software development.  Up to 1280x720 active stereo depth resolution
 Up to 1920x1080 RGB resolution
The Intel® RealSenseTM D400 series is supported  Depth Diagonal Field of View over 70°
with cross-platform and open source Intel®
 Dual rolling shutter sensors for up to 90 FPS
RealSense™ SDK 2.0
depth streaming
 Range 0.3m to over 10m (Varies with lighting
Features conditions)
 2nd Generation Stereo Depth Camera System
 2nd Generation dedicated Intel® RealSense™ Intel® RealSense™ Depth Camera
Vision Processor D4 with advanced algorithms D435/D435i Features
 Infrared (IR) Laser Projector System (Class 1)  Intel® RealSense™ Vision Processor D4
 Full HD resolution Image sensors  Up to 1280x720 active stereo depth resolution
 Active Power Management  Up to 1920x1080 RGB resolution
 Selection of Stereo Depth Module options to  Depth Diagonal Field of View over 90°
meet your usage requirements  Dual global shutter sensors for up to 90 FPS
depth streaming
1. MIPI is not currently supported. Please  Range 0.2m to over 10m (Varies with lighting
contact your Intel representative on MIPI conditions)
enablement timelines.  Intel® RealSense™ Depth Camera D435i
2. Camera SKU dependent includes Inertial Measurement Unit (IMU) for 6
degrees of freedom (6DoF) data

§§

Datasheet 11
 Introduction

2 Introduction

2.1 Purpose and Scope of this Document

This document captures the specifications and the design–in details for the Intel®
RealSense™ D400 series family of products. This document provides information
necessary to understand and implement an Intel® RealSense™ D400 series based
camera system.

Note: Intel® RealSense™ D400 series is alternately referred as “D4 Camera System”
in this document. Intel® RealSense™ Vision Processor D4 is alternately referred as
“D4” in this document.

2.2 Terminology
Term Description

6DOF Six degrees of freedom (6DoF) refers to the freedom of movement of a rigid
body in three-dimensional space. Forward/back, up/down, left/right, pitch,
yaw, roll

Stereo Depth The distance between the center of the left and right imagers in a stereo
Baseline camera

MIPI CSI-2 The Camera Serial Interface (CSI) is a specification of the Mobile Industry
Processor Interface (MIPI) Alliance and CSI-2 is the 2nd generation
specification defining the interface between a camera and a host processor

Depth Depth video streams are like color video streams except each pixel has a
value representing the distance away from the camera instead of color
information

D4 (DS5) If the term D4 is used alone, it refers to the entire D4 camera system
consisting of various modules and components.
If the term D4 is used with an appropriate qualifier (i.e. D4 Vision Processor,
D4 Vision Processor Board), it refers to the specific module or component
within the D4 camera system.

FOV Field Of View (FOV) describes the angular extent of a given scene that is
imaged by a camera. A camera's FOV can be measured horizontally,
vertically, or diagonally

Host System Computer or SOC connected to D4 camera

I2C I²C (Inter-Integrated Circuit), pronounced I-squared-C, is a multi-master,

multi-slave, single-ended, serial computer bus invented by Philips
Semiconductor (now NXP Semiconductors). It is typically used to allow easy
control and data communication between components.

IR Projector This refers to the source of infrared (IR) light used for illuminating a scene,
object, or person to collect depth data.

12 337029-005
Introduction

Term Description

Imagers Depth camera system uses a pair of cameras referred as imagers to calculate
depth. They are identical cameras configured with identical settings.

Image Signal Image processing functions to enhance color image quality

Processor (ISP)

Left imager From the perspective of the stereo camera looking out at the world, the left
imager is on the left side of the camera module. Thus, when the user is
facing the D4 camera, the left imager is actually on the right side of the
camera module.

Lens This refers to the optical component of an imager in the D4 camera. Its
purpose is to focus the incoming light rays onto the CMOS chip in the imager.

MIPI MIPI (Mobile Industry Processor Interface) is a global, open membership

organization that develops interface specifications for the mobile ecosystem

Platform This refers to the two-dimensional (2D) color camera on platform

camera

System On Integrated circuit (IC) that integrates all components of a computer

Chip (SoC)

Stereo Depth This refers to a stiffened module containing at least two imagers. The
Module distance between the imagers, which is referred to as the baseline or
intraocular spacing, is typically in the range of 20 mm to 70 mm.

Stereo camera This refers to a pair of imagers looking at the same subject from slightly
different perspectives. The difference in the perspectives is used to generate
a depth map by calculating a numeric value for the distance from the imagers
to every point in the scene.

SKU Stock Keeping Unit (SKU) is a unique identifier for distinct products. It is
often used in the scope of naming different versions of a device

TBD To Be Determined. In the context of this document, information will be

available in a later revision.

2.3 Stereo Vision Depth Technology Overview

The Intel® RealSense™ D400 series depth camera uses stereo vision to calculate
depth. The stereo vision implementation consists of a left imager, right imager, and an
optional infrared projector. The infrared projector projects non-visible static IR pattern
to improve depth accuracy in scenes with low texture. The left and right imagers
capture the scene and sends imager data to the depth imaging (vision) processor,
which calculates depth values for each pixel in the image by correlating points on the
left image to the right image and via shift between a point on the Left image and the
Right image. The depth pixel values are processed to generate a depth frame.
Subsequent depth frames create a depth video stream.

337029-005 13
 Introduction

Figure 2-1. Active Infrared (IR) Stereo Vision Technology

1) Capture 2) Search

3) Depth

Image
IR Projector
Sensors

The depth pixel value is a measurement from the parallel plane of the imagers and not
the absolute range as illustrated.

Figure 2-2. Depth Measurement (Z) versus Range (R)

14 337029-005
Introduction

2.4 Camera System Block Diagram

The camera system has two main components, Vision processor D4 and Depth
module. The Vision processor D4 is either on the host processor motherboard or on a
discrete board with either USB2.0/USB 3.1 Gen1 or MIPI connection to the host
processor. The Depth module incorporates left and right imagers for stereo vision with
the optional IR projector and RGB color sensor. The RGB color sensor data is sent to
vision processor D4 via the color Image Signal Processor (ISP) on Host Processor
motherboard or D4 Board.

Figure 2-3. Vision Processor D4 Camera System Block Diagram

337029-005 15
 Introduction

2.5 Intel® RealSense™ Depth Module D400 series

Product SKUs
Table below describes main components that make up the different depth module
SKUs

Table 2-1. Depth Module Product SKU Descriptions

Component Subcomponent D400 D410 D415 D420 D430

Intel® RealSense™
- √ √ √ √ √
Vision Processor D4

Standard Stereo Imagers √ √ √ X X

Wide Stereo Imagers X X X √ √

Intel® RealSense™ Standard Infrared

X √ √ X X
Depth Module Projector

Wide Infrared Projector X X X X √

RGB color sensor X X √ X X

D400 - Intel® RealSense™ Depth Module D400

D410 - Intel® RealSenseTM Depth Module D410
D415 - Intel® RealSenseTM Depth Module D415
D420 - Intel® RealSenseTM Depth Module D420
D430 - Intel® RealSenseTM Depth Module D430

16 337029-005
Introduction

2.6 Intel® RealSense™ Depth Camera D400 series

Product SKUs
Table below describes main components that make up the different camera SKUs:

Table 2-2. Depth Camera Product SKU Descriptions

Component Subcomponent Intel® Intel® Intel®

RealSenseTM RealSenseTM RealSenseTM
Depth Camera Depth Camera Depth Camera
D415 D435 D435i

Intel®
RealSense™
- √ √ √
Vision
Processor D4

Standard Stereo
√ X X
Imagers

Wide Stereo Imagers X √ √

Intel
®
Standard Infrared
RealSense™ √ X X
Projector
Depth Module
Wide Infrared
X √ √
Projector

RGB color sensor √ √ √

Inertial
Measurement X X √
Unit (IMU)

§§

337029-005 17
 Component Specification

3 Component Specification

3.1 Vision Processor D4 Camera System Components

Table 3-1. Component Descriptions

Component Description

Host Processor Host Processor that receives Depth and other data streams from Vision
Processor D4

Vision Depth Imaging Processor with USB 2.0/USB 3.1 Gen 1 or MIPI interface
Processor D4 connection to Host Processor
(DS5 ASIC)

Clock 24MHz clock source for Vision Processor D4

Serial Flash SPI 16Mb Serial Flash memory for firmware storage
Memory

Stereo Depth Camera module with left and Right Imager, Color Sensor†, IR projector†
Module enclosed in a stiffener

Power Delivery Circuitry on motherboard/Vision processor D4 Board to deliver and manage

power to Vision Processor D4 and Stereo Depth Module.

Stereo Depth 50 pin connector on motherboard/Vision Processor D4 Board and Stereo

Connector and Depth module with interposer for connection
Interposer

(†) SKU dependent

3.2 Host Processor

The host processor interface to Vision Processor D4 is either USB 2.0/USB 3.1 Gen 1
or MIPI. To ensure the best of quality of service, the Vision Processor D4 must be
connected to a dedicated USB 3.1 Gen 1 root port within the host processor system.

3.3 Intel® RealSense™ Vision Processor D4

The primary function of Vision Processor D4 is to perform depth stereo vision
processing. The Vision Processor D4 on Host Processor motherboard or on Vision
Processor D4 Board communicates to the host processor through USB2.0/USB 3.1 Gen
1 or MIPI and receives sensor data from stereo depth module. The Vision Processor
D4 supports MIPI CSI-2 channels for connection to image sensors.

3.3.1 Vision Processor D4 Features

 28nm Process Technology.

18 337029-005
Component Specification

 5 MIPI camera ports with each MIPI lane capable of handling data transfers of up
to 750 Mbps.
 USB2.0/USB 3.1 Gen 1 or MIPI interface to host system.
 Image rectification for camera optics and alignment compensation
 IR Projector (Laser) controls
 Serial Peripheral Interface for fast data transfer with external SPI flash.
 Integrated I2C ports
 General purpose Input Output pins
 Active power gating

3.3.2 Vision Processor D4 Signal Description

Table 3-2. Vision Processor D4 Signal Descriptions

RESERVED – Signal reserved for future usage

IO Type- Input Output Buffer type

A – Analog

I – Input

O - Output
IO After
Signal Name Description Type RESET

Host MIPI

H_DATAP0
Host MIPI Data Lane 0 Differential Pair A I
H_DATAN0

H_DATAP1
Host MIPI Data Lane 1 Differential Pair A I
H_DATAN1

H_DATAP2
Host MIPI Data Lane 2 Differential Pair A I
H_DATAN2

H_DATAP3
Host MIPI Data Lane 3 Differential Pair A I
H_DATAN3

H_CLKP
Host MIPI Clock Differential Transmit Pair A I
H_CLKN

H_SDA
Host I2C Bus Data and Clock I/O IO
H_SCL

Host MIPI External Reference 6.04K 1% resistor pull down

H_REXT A I
to ground)

Imager A MIPI

A_DATAP0
Imager A MIPI Data Lane 0 Differential Receive Pair A I
A_DATAN0

A_DATAP1
Imager A MIPI Data Lane 1 Differential Receive Pair A I
A_DATAN1

337029-005 19
 Component Specification

Signal Name Description IO After

Type RESET

A_CLKP
Imager A MIPI Clock Differential Receive Pair A I
A_CKLN

A_SDA
Imager A I2C Bus Data and Clock I/O IO
A_SCL

A_RCLK Imager A Reference Clock I/O O

A_PDOWN (RESERVED) Imager A Power Down Signal I/O O

A_VSYNC Imager A Vertical/Frame Sync I/O I

A_RESETN Imager A Reset I/O O

Imager A MIPI External Reference (6.04K 1% resistor pull

A_REXT A I
down to ground)

Imager B MIPI

(RESERVED) Imager B MIPI Data Lane 0 Differential

B_DATAP0
Receive Pair A I
B_DATAN0

B_DATAP1 (RESERVED) Imager B MIPI Data Lane 1 Differential

A I
B_DATAN1 Receive Pair

B_CLKP
(RESERVED) Imager B MIPI Clock Differential Receive Pair A I
B_CKLN

B_SDA
(RESERVED) Imager B I2C Bus Data and Clock I/O IO
B_SCL

B_RCLK (RESERVED) Imager B Reference Clock I/O O

B_PDOWN (RESERVED) Imager B Power Down I/O O

B_VSYNC (RESERVED) Imager B Vertical/Frame Sync I/O I

B_RESETN (RESERVED) Imager B Reset I/O O

Imager B MIPI External Reference (6.04K 1% resistor pull

B_REXT A I
down to ground)

Imager M MIPI

M_DATAP0
Imager M MIPI Data Lane 0 Differential Receive Pair A I
M_DATAN0

M_DATAP1
Imager M MIPI Data Lane 1 Differential Receive Pair A I
M_DATAN1

M_CLKP
Imager M MIPI Clock Differential Receive Pair A I
M_CKLN

M_SDA
Imager M I2C Bus Data and Clock I/O IO
M_SCL

M_RCLK Imager M Reference Clock I/O O

M_PDOWN (RESERVED) Imager M Power Down I/O O

M_VSYNC Imager M Vertical/Frame Sync I/O I

20 337029-005
Component Specification

Signal Name Description IO After

Type RESET

M_RESETN Imager M Reset I/O O

Imager M MIPI External Reference (6.04K 1% resistor pull

M_REXT A I
down to ground)

Imager Y MIPI

Y_DATAP0
Imager Y MIPI Data Lane 0 Differential Receive Pair A I
Y_DATAN0

Y_DATAP1
Imager Y MIPI Data Lane 1 Differential Receive Pair A I
Y_DATAN1

Y_CLKP
Imager Y MIPI Clock Differential Receive Pair A I
Y_CKLN

Y_SDA
Imager Y I2C Bus Data and Clock I/O IO
Y_SCL

Y_RCLK Imager Y Reference Clock I/O O

Y_PDOWN (RESERVED) Imager Y Power Down I/O O

Y_VSYNC Imager Y Vertical/Frame Sync I/O I

Y_RESETN Imager Y Reset I/O O

Imager Y MIPI External Reference (6.04K 1% resistor pull

Y_REXT A I
down to ground)

Imager Z MIPI

Z_DATAP0 (RESERVED) Imager Z MIPI Data Lane 0 Differential

A I
Z_DATAN0 Receive Pair

Z_DATAP1 (RESERVED) Imager Z MIPI Data Lane 1 Differential

A I
Z_DATAN1 Receive Pair

Z_CLKP
(RESERVED) Imager Z MIPI Clock differential Receive Pair A I
Z_CKLN

Z_SDA
(RESERVED) Imager Z I2C Bus Data and Clock I/O IO
Z_SCL

Z_RCLK (RESERVED) Imager Z Reference Clock I/O O

Z_PDOWN (RESERVED) Imager Z Power Down I/O O

Z_VSYNC Depth Vertical/Frame Sync I/O O

Z_RESETN (RESERVED) Imager Z Reset I/O O

Imager Z MIPI External Reference (6.04K 1% resistor pull

Z_REXT A I
down to ground)

Serial Peripheral Interconnect (SPI)

SPI_DI SPI Data Input I/O I

SPI_DO SPI Data Output I/O O

SPI_CLK SPI Clock O O

337029-005 21
 Component Specification

Signal Name Description IO After

Type RESET

SPI_CS SPI Chip Select O O

SPI_WP Flash Write Protect O O

General Purpose Input Output (GPIO)

GPIO[0] (RESERVED) Not Defined I/O I

GPIO[1] (RESERVED) Not Defined I/O I

Laser PWM – Controls Laser Power for IR projector on I/O O

GPIO[2]
Stereo Module

GPIO[3] (RESERVED) Not Defined I/O I

GPIO[4] (RESERVED) Not Defined I/O I

GPIO[5] (RESERVED) Not Defined I/O I

GPIO[6] (RESERVED) Not Defined I/O I

GPIO[7] (RESERVED) Not Defined I/O I/O

EGPIO[0] (RESERVED) Not Defined I/O I/O

EGPIO[1] (RESERVED) Not Defined I/O I/O

EGPIO[2] (RESERVED) Not Defined I/O I/O

EGPIO[3] Laser_PWRDN - IR projector Power Down Signal I/O O

EGPIO[4] (RESERVED) Not Defined I/O I/O

EGPIO[5] FLAGB – IR Projector Fault Detect I/O I

EGPIO[6] (RESERVED) Not Defined I/O I/O

EGPIO[7] (RESERVED) Not Defined I/O I/O

EGPIO[8] ISP_FCS (Color ISP) I/O O

EGPIO[9] (RESERVED) Not Defined I/O I/O

EGPIO[10] (RESERVED) Not Defined I/O I/O

EGPIO[11] (RESERVED) Not Defined I/O I/O

EGPIO[12] (RESERVED) Not Defined I/O I/O

EGPIO[13] (RESERVED) - For Intel test purpose only I/O I/O

Miscellaneous

LD_ON_OUT_XX (RESERVED) Laser Enable O O

MODSTROB (RESERVED) Modulation current strobe O O

MODSIGN (RESERVED) Modulation current sign O O

LD_ERR Laser Error (Active High) I I

CLKXI 24MHz XTAL I I

CLKXO 24MHz XTAL I I

PRSTN D4 Reset I I

CW_CSR_PRSTn Hardware reset without debug port reset I/O I

22 337029-005
Component Specification

Signal Name Description IO After

Type RESET

PMU_PWR_EN Switchable domain (VDD_PG) power control signal I/O O

DFU Dynamic FW update, used for FW recovery I/O I

ISP_SCL
I2C Bus Data and Clock I/O IO
ISP_SDA

VQPSQ (RESERVED) – For Intel test purpose only O O

VQPSM (RESERVED) – For Intel test purpose only O O

REFPADCLKP (RESERVED) – For Intel test purpose only I I

REFPADCLKM (RESERVED) – For Intel test purpose only I I

JTAG

TDI Test Data Input I/O I

TDO Test Data Output I/O O

TCLK Test Clock Input I/O I

TMS Test Mode Select I/O I

TRSTN Test Reset I/O I

USB

USB_RXP USB 3.1 Gen 1 receive, positive side A I

USB_RXN USB 3.1 Gen 1 receive, negative side A I

USB_TXP USB 3.1 Gen 1 Transmit, positive side A O

USB_TXN USB 3.1 Gen 1 Transmit, negative side A O

USB_DP USB 2.0 D+ line A IO

USB_DN USB 2.0 D- line A IO

USB_ID Mini-receptacle identifier and test point

USB_RESREF Reference Resistor input. 200 Ohm 1% A I

Power and Ground

VDD 0.9V (Core Voltage) Power

VDD_PG 0.9V (Switched Core Voltage) Power

USB_DVDD 0.9V (USB Core Voltage) Power

VPTX0 0.9V (USB Core Voltage) Power

VP 0.9V (USB Core Voltage) Power

*_AVDD 1.8V (MIPI Core and IO Voltage) Power

VDDPLL 0.9V (PLL Voltage) Power

VDDTS 1.8V (Temperature Sensor Voltage) Power

VDDPST18 1.8V (IO Voltage) Power

USB_VDD330 3.3V (USB Core Voltage) Power

337029-005 23
 Component Specification

Signal Name Description IO After

Type RESET

VBUS0 3.3V (VBUS power monitor) Power

VSS Ground GND

*_AGND Ground GND

Table 3-3. Hardware Straps

Boot
Pin Load HW/FW Description

EPGPIO0 No FW USB connection type:

0: Peripheral (default)
1: Integrated

EGPIO4 Yes HW SPI Interface:

0: SPI on “Z”
1: SPI connected (default)
EPGPIO7 Yes FW Flash
00: 64Mbit
01: 8Mbit
EPGPIO8 10: 16 Mbit (default)
11: 32 Mbit

EPGPIO9 No FW Host interface:

0: USB (default)
1: MIPI

EPGPIO10 No FW Board version [0] (default: 0)

EPGPIO11 No FW Board version [1] (default: 0)

EPGPIO12 No FW Board version [2] (default: 0)

DFU Yes HW Go to DFU

0: Disabled (default)
1: Go to DFU mode (Recovery)

NOTES:
 Boot Load – Read during Boot
 Hardware (HW) Strap – External hardware pin state directly configures D4 functionality
 Firmware (FW) Strap – External hardware pin state is read by firmware and firmware
configures D4 functionality

3.3.3 Vision Processor D4 Package Mechanical Attributes

Table below provides an overview of the mechanical attributes of the package.

24 337029-005
Component Specification

Table 3-4. Vision Processor D4 Package Mechanical Attributes

Pin Boot Load HW/FW

Package Technology Package Type FlipChip CSP (Chip Scale Package)

Interconnect Ball Grid Array (BGA) Ball

Lead Free Yes

Halogenated Flame Retardant Free Yes

Package Configuration Solder Ball Composition SAC125Ni

Ball/Pin Count 225 solder balls

Grid Array Pattern 15 x 15

Package Dimensions Nominal Package Size (mm) 6.40 x 6.40

Min Ball/Pin pitch (mm) 0.42

Weight ~1 gm

337029-005 25
 Component Specification

Figure 3-1. Vision Processor D4 Package Drawing

26 337029-005
Component Specification

Figure 3-2. Vision Processor D4 Ball-out

A B C D E F G H J K L M N P R

15 VSS Y_DATAN0 Y_REXT Y_SCL GPIO_0 GPIO_1 GPIO_5 GPIO_6 MODSTROB TMS TRSTN SPI_WPN SPI_MISO CW_CSR_RSTN VSS 15

14 Y_CLKN Y_CLKP Y_DATAP0 Y_RCLK Y_SDA Y_RESETN GPIO_2 GPIO_3 MODSIGN TCLK TDO SPI_CLK SPI_MOSI Z_RESETN Z_VSYNC 14

13 Y_DATAN1 Y_DATAP1 VSS VSS Y_PDOWN Y_VSYNC GPIO_4 GPIO_7 LD_ERR LD_ON_OUT_XX TDI SPI_CS Z_SDA Z_DATAP0 Z_RCLK 13

12 B_DATAN0 B_SCL B_SDA Y_AVDD VSS VSS VDDPST18_LEFT VSS VSS VDDPST18_LEFT VSS VSS Z_SCL Z_CLKP Z_DATAN0 12

11 B_CLKN B_DATAP0 B_REXT VSS VSS VSS VDD VDD VDD VSS VSS Z_AVDD Z_PDOWN Z_DATAP1 Z_CLKN 11

10 B_DATAN1 B_CLKP B_RESETN B_AVDD VDD_PG VDD_PG VDD_PG VDD VDD VDD_PG VDD_PG ISP_SCL Z_REXT M_DATAP1 Z_DATAN1 10

9 H_DATAN3 B_DATAP1 B_PDOWN VSS VDD_PG VDD_PG VDD_PG VSS VSS VDD_PG VDD_PG VSS ISP_SDA M_CLKP M_DATAN1 9

8 H_DATAN2 H_DATAP3 B_VSYNC VSS VSS VDD_PG VDD_PG VSS VSS VSS VSS VSS VSS M_DATAP0 M_CLKN 8

7 H_CLKN H_DATAP2 B_RCLK H_AVDD VSS VSS VSS VSS VSS VDD_PG VDD_PG M_AVDD M_RESETN M_PDOWN M_DATAN0 7

6 H_DATAN1 H_CLKP H_AVDD REFPADCLKP REFPADCLKM VSS VDD VDD VSS VDD_PG VDD_PG M_REXT M_VSYNC M_SDA M_RCLK 6

5 H_DATAN0 H_DATAP1 H_REXT VP USB_ID VDD VDD VDD VSS VSS VSS VSS VSS A_DATAP1 M_SCL 5

4 H_SCL H_DATAP0 USB_VDD330 VPTX0 USB_RESREF USB_DVDD VSS VSS VDDPST18_RIGHT VSS VSS A_AVDD A_REXT A_CLKP A_DATAN1 4

3 USB_RXN H_SDA PRSTN USB_DP EGPIO_1 EGPIO_11 VDDTS VSSTS VDDPST18_RIGHT PMU_PWR_EN VQPSQ VQPSM A_PDOWN A_DATAP0 A_CLKN 3

2 USB_TXN USB_RXP DFU USB_DN EGPIO_9 EGPIO_13 VDDPLL VSSPLL EGPIO_5 EGPIO_12 EGPIO_3 EGPIO_4 A_SCL A_RCLK A_DATAN0 2

1 VSS USB_TXP VBUS0 EGPIO_6 EGPIO_7 EGPIO_8 CLK_XIN CLK_XOUT EGPIO_10 EGPIO_2 EGPIO_0 A_VSYNC A_SDA A_RESETN VSS 1

A B C D E F G H J K L M N P R

Table 3-5. Vision Processor D4 Ball-out by Signal Name

Ball Name Ball Name Ball Name

A01 H_AGND B01 USB_TXP C01 VBUS0

A02 USB_TXN B02 USB_RXP C02 DFU

A03 USB_RXN B03 H_SDA C03 PRSTN

A04 H_SCL B04 H_DATAP0 C04 USB_VDD330

A05 H_DATAN0 B05 H_DATAP1 C05 H_REXT

A06 H_DATAN1 B06 H_CLKP C06 H_AVDD

A07 H_CLKN B07 H_DATAP2 C07 B_RCLK

337029-005 27
 Component Specification

Ball Name Ball Name Ball Name

A08 H_DATAN2 B08 H_DATAP3 C08 B_VSYNC

A09 H_DATAN3 B09 B_DATAP1 C09 B_PDOWN

A10 B_DATAN1 B10 B_CLKP C10 B_RESETN

A11 B_CLKN B11 B_DATAP0 C11 B_REXT

A12 B_DATAN0 B12 B_SCL C12 B_SDA

A13 Y_DATAN1 B13 Y_DATAP1 C13 Y_AGND

A14 Y_CLKN B14 Y_CLKP C14 Y_DATAP0

A15 Y_AGND B15 Y_DATAN0 C15 Y_REXT

D01 EGPIO_6 E01 EGPIO_7 F01 EGPIO_8

D02 USB_DN E02 EGPIO_9 F02 EGPIO_13

D03 USB_DP E03 EGPIO_1 F03 EGPIO_11

D04 VPTX0 E04 USB_RESREF F04 USB_DVDD

D05 VP E05 USB_ID F05 VDD

D06 REFPADCLKP E06 REFPADCLKM F06 VSS

D07 H_AVDD E07 H_AGND F07 VSS

D08 B_AGND E08 VSS F08 VDD_PG

D09 B_AGND E09 VDD_PG F09 VDD_PG

D10 B_AVDD E10 VDD_PG F10 VDD_PG

D11 VSS E11 VSS F11 VSS

D12 Y_AVDD E12 VSS F12 VSS

D13 VSS E13 Y_PDOWN F13 Y_VSYNC

D14 Y_RCLK E14 Y_SDA F14 Y_RESETN

D15 Y_SCL E15 GPIO_0 F15 GPIO_1

G01 CLK_XIN H01 CLK_XOUT J01 EGPIO_10

G02 VDDPLL H02 VSSPLL J02 EGPIO_5

G03 VDDTS H03 VSSTS J03 VDDPST18_RIGHT

G04 VSS H04 VSS J04 VDDPST18_RIGHT

G05 VDD H05 VDD J05 VSS

G06 VDD H06 VDD J06 VSS

G07 VSS H07 VSS J07 VSS

G08 VDD_PG H08 VSS J08 VSS

G09 VDD_PG H09 VSS J09 VSS

G10 VDD_PG H10 VDD J10 VDD

G11 VDD H11 VDD J11 VDD

G12 VDDPST18_LEFT H12 VSS J12 VSS

28 337029-005
Component Specification

Ball Name Ball Name Ball Name

G13 GPIO_4 H13 GPIO_7 J13 LD_ERR

G14 GPIO_2 H14 GPIO_3 J14 MODSIGN

G15 GPIO_5 H15 GPIO_6 J15 MODSTROB

K01 EGPIO_2 L01 EGPIO_0 M01 A_VSYNC

K02 EGPIO_12 L02 EGPIO_3 M02 EGPIO_4

K03 PMU_PWR_EN L03 VQPSQ M03 VQPSM

K04 VSS L04 VSS M04 A_AVDD

K05 VSS L05 VSS M05 VSS

K06 VDD_PG L06 VDD_PG M06 M_REXT

K07 VDD_PG L07 VDD_PG M07 M_AVDD

K08 VSS L08 VSS M08 M_AGND

K09 VDD_PG L09 VDD_PG M09 M_AGND

K10 VDD_PG L10 VDD_PG M10 ISP_SCL

K11 VSS L11 VSS M11 Z_AVDD

K12 VDDPST18_LEFT L12 VSS M12 VSS

K13 LD_ON_OUT_XX L13 TDI M13 SPI_CS

K14 TCLK L14 TDO M14 SPI_CLK

K15 TMS L15 TRSTN M15 SPI_WPN

N01 A_SDA P01 A_RESETN R01 A_AGND

N02 A_SCL P02 A_RCLK R02 A_DATAN0

N03 A_PDOWN P03 A_DATAP0 R03 A_CLKN

N04 A_REXT P04 A_CLKP R04 A_DATAN1

N05 A_AGND P05 A_DATAP1 R05 M_SCL

N06 M_VSYNC P06 M_SDA R06 M_RCLK

N07 M_RESETN P07 M_PDOWN R07 M_DATAN0

N08 VSS P08 M_DATAP0 R08 M_CLKN

N09 ISP_SDA P09 M_CLKP R09 M_DATAN1

N10 Z_REXT P10 M_DATAP1 R10 Z_DATAN1

N11 Z_PDOWN P11 Z_DATAP1 R11 Z_CLKN

N12 Z_SCL P12 Z_CLKP R12 Z_DATAN0

N13 Z_SDA P13 Z_DATAP0 R13 Z_RCLK

N14 SPI_MOSI P14 Z_RESETN R14 Z_VSYNC

N15 SPI_MISO P15 CW_CSR_RSTN R15 Z_AGND

337029-005 29
 Component Specification

3.3.4 Vision Processor D4 Power Requirements

The Vision Processor D4 requires the following power supplies for operation.

Table 3-6. Vision Processor D4 Power Requirements

Voltage Ball Name Min. Nominal Max. Peak Current

(V) (V) (V) (Icc)

VDD 0.85 0.9 0.95 0.4A

VDD_PG 0.85 0.9 0.95 1.6A

USB_DVDD 0.81 0.9 0.99 0.2A

VPTX0 0.81 0.9 0.99 0.2A

VP 0.81 0.9 0.99 0.2A

*AVDD 1.71 1.8 1.89 0.2A

VDDPLL 0.85 0.9 0.95 0.2A

VDDTS 1.71 1.8 1.89 0.2A

VDDPST18 (Left and

1.71 1.8 1.89 0.2A
Right)

USB_VDD330 3.13 3.3 3.46 0.2A

3.3.5 Vision Processor D4 Power Sequencing

The timing requirement for power sequencing is listed below and shown in the
following figure.
 Hold Vision Processor D4 in reset
 Ramp up power in the 3.3V
 Ramp up power in the 0.9V
 Ramp up power in the 1.8V
 Release Vision Processor D4 Reset

Table 3-7. Vision Processor D4 Power Sequencing Timing Parameters

Parameter Value Units Label

0.9V stable to 3.3V stable >=50 us T1

PMU_PWR_EN to 0.9V Stable >=50 us T2
1.8V stable to 0.9V Stable >=50 us T3
PRSTN (D4 RESET) assertion to 1.8V stable 15 us T4

30 337029-005
Component Specification

Figure 3-3. Vision Processor D4 Power Sequencing

Note: Vision Processor D4 has no specific power down sequence requirement.

3.3.6 Vision Processor D4 Spec Code

The spec code is an identification mark printed on Vision Processor D4.

Table 3-8. Vision Processor D4 SPEC Code

Vision Processor D4 SPEC CODE

Production (Shipped in Tape and Reel) SLLY5

Production (Shipped in Tray) SLM6B

3.3.7 Vision Processor D4 Storage and Operating Conditions

Table 3-9. Vision Processor D4 Storage and Operating Conditions

Condition Description Min Max Unit

Storage (Still Air), Not Temperature (Sustained, oC

0 40
Operating Controlled)(1)

337029-005 31
 Component Specification

Temperature (Short oC
-40 70
Exposure)(2)

Humidity Temperature/ RH: 40oC / 90%

Component Case oC
Temperature 0 110
Temperature(3)

NOTE:
(1) Controlled conditions should be used for long term storage of product.
(2) Short exposure represents temporary max limits acceptable for transportation conditions.
(3) Component case temperature limits must be met for all operating temperatures.

3.3.8 Vision Processor D4 Thermals

The thermal design should be such that Vision Processor D4 does not exceed
component case temperature limit. Care must also be taken to make sure that the
Vision Processor D4 heat is not transferred to other components of the imaging
system or stereo depth module. It will be best to thermally isolate Vision Processor D4
from the stereo depth module.

3.4 Clock
Vision Processor D4 requires a single 24 MHz clock oscillator. All clocks required by
stereo depth module are generated by Vision Processor D4.

3.5 Serial (SPI) Flash Memory

Vision Processor D4 requires 16Mbit Serial Flash Memory for its firmware storage. The
recommended part number is IS25WP016 (www.issi.com) or equivalent

3.6 Stereo Depth Module

The stereo depth module components are described in Table 3-10. The stereo depth
printed circuit board and components are encapsulated in a common metal stiffener.

Table 3-10. Stereo Depth Module

Component Description

Left and Right Imagers 2 HD image sensors

Infrared (IR) Projector Class 1 laser compliant (optional)

Color Sensor 1080p RGB image sensor (optional)

Depth Module Connector 50 pin connector plug

Privacy LED Indicator when stereo module is streaming data (optional)

Stiffener Reinforcement housing to keep imagers aligned

Label Manufacture and product identifier information

32 337029-005
Component Specification

Other Components Laser Driver, EEPROM, Voltage Regulators, etc.

Figure 3-4. Stereo Depth Module (Intel® RealSense™ Depth Module D410)

Right Module IR Camera Left

Imager Label Projector Connector Imager

Figure 3-5. Stereo Depth Module (Intel® RealSense™ Depth Module D430)

Module Label

Camera
Right Imager IR Projector Connector Left Imager

Table 3-11. Stereo Depth Module SKU Properties

Intel® Intel® Intel® Intel® Intel®

RealSense™
Stereo Module Depth RealSense™ RealSense™ RealSense™ RealSense™
Module Depth Module Depth Module Depth Module Depth Module
D400 D410 D415 D420 D430

Baseline 55mm 55mm 55mm 50mm 50mm

Left/Right
Standard Standard Standard Wide Wide
Imagers Type

H:65±2 / H:65±2 / H:65±2 / H:87±3 / H:87±3 /

Depth FOV HD
V:40±1 / V:40±1 / V:40±1 / V:58±1 / V:58±1 /
(degrees)
D:72±2 D:72±2 D:72±2 D:95±3 D:95±3

H:50±2 / H:50±2 / H:50±2 / H:75±3 / H:75±3 /

Depth FOV VGA
V:40±1 / V:40±1 / V:40±1 / V:62±1 / V:62±1 /
(degrees)
D:61±2 D:61±2 D:61±2 D:89±3 D:89±3

IR Projector - Standard Standard - Wide

H:67 / V:41 / H:67 / V:41 / H:90 / V:63 /

IR Projector FOV - -
D:75 D:75 D:99

Color Sensor - - OV2740 - -

H:69±1/
Color Camera
- - V:42±1 / - -
FOV
D:77±1

337029-005 33
 Component Specification

Module X=74.7mm X=74.7mm X=83.7mm X=70.7mm X=70.7mm

Dimensions Y=10mm Y=10mm Y=10mm Y=14mm Y=14mm
(mm) Z=4.7mm Z=4.7mm Z=4.7mm Z=10.53mm Z=10.53mm

NOTE:
 H – Horizontal FOV, V – Vertical FOV, D – Diagonal FOV, X – Length, Y – Breadth, Z –
Thickness
 Depth FOV specified at 2 meters
 Due to mechanical tolerances of +/-5%, Max and Min FOV values can vary from lens to
lens and module to module by ~ +/- 3 degrees.

3.6.1 Left and Right Imagers

The stereo depth module has two camera sensors referred here as imagers, they are
identical parts and are configured with identical settings. The imagers are labeled
“left” and “right” from the perspective of the camera module looking outward. The
stereo imager pairs are referred as Standard or Wide based on imager field of view.

Table 3-12. Standard Left and Right Imager Properties

Parameter Camera Sensor Properties

Image Sensor OmniVision OV2740

Active Pixels 1920 × 1080

Sensor Aspect Ratio 16:9

Format 10-bit RAW

F Number f/2.0

Focal Length 1.88mm

Filter Type IR Cut – D400, None – D410, D415, Camera D415

Focus Fixed

Shutter Type Rolling Shutter

Signal Interface MIPI CSI-2, 2X Lanes

Horizontal Field of View 69.4o

Vertical Field of View 42.5o

Diagonal Field of View 77o

Distortion <=1.5%

Table 3-13. Wide Left and Right Imager Properties

Parameter Camera Sensor Properties

Image Sensor OmniVision OV9282

Active Pixels 1280 X 800

Sensor Aspect Ratio 8:5

34 337029-005
Component Specification

Parameter Camera Sensor Properties

Format 10-bit RAW

F Number f/2.0

Focal Length 1.93mm

Filter Type IR Cut – D420, None – D430, D435/D435i

Focus Fixed

Shutter Type Global Shutter

Signal Interface MIPI CSI-2, 2X Lanes

Horizontal Field of View 91.2o

Vertical Field of View 65.5o

Diagonal Field of View 100.6o

Distortion <=1.5%

3.6.2 Infrared Projector

The infrared projector improves the ability of the stereo camera system to determine
depth by projecting a static infrared pattern on the scene to increase texture on low
texture scenes. The infrared projector meets class 1 laser safety under normal
operation. The power delivery and laser safety circuits are on the stereo depth
module. The infrared projector is referred as Standard or Wide based on field of
projection.

Table 3-14. Standard Infrared Projector Parameters

Parameter Properties

Projector Infrared

Pattern Type Static

Illuminating Component Vertical-cavity surface-emitting laser (VCSEL) + Optics

Laser Controller PWM

Optical Power 360mW average, 440mW peak

Laser Wavelength 850nm ± 10 nm nominal @ 20°C

Laser Compliance Class 1, IEC 60825-1:2007 Edition 2, IEC 60825-1:2014

Edition 3

Horizontal Field of Projection 64°±3°

Vertical Field of Projection 41°±3°

Diagonal Field of Projection 72°±3°

Table 3-15. Wide Infrared Projector Parameters

Parameter Properties

Projector Infrared

337029-005 35
 Component Specification

Parameter Properties

Pattern Type Static

Illuminating Component Vertical-cavity surface-emitting laser (VCSEL) + optics

Laser Controller PWM

Optical Power 360mW average, 4.25W peak

Laser Wavelength 850nm ± 10 nm nominal @ 20°C

Laser Compliance Class 1, IEC 60825-1:2007 Edition 2, IEC 60825-1:2014

Edition 3

Horizontal Field of Projection 86°±3°

Vertical Field of Projection 57°±3°

Diagonal Field of Projection 94°±3°

3.6.3 Color Sensor

The color sensor on the stereo depth module in addition to color image provides
texture information. Usages for the texture information include overlay on a depth
image to create a color point cloud and overlay on a 3d model for reconstruction.

Table 3-16. Color Sensor Properties

Parameter Camera Sensor Properties

Image Sensor OmniVision OV2740

Color Image Signal Processor Discrete

Active Pixels 1920 X 1080

Sensor Aspect Ratio 16:9

Format 10-bit RAW RGB

F Number f/2.0

Focal Length 1.88mm

Filter Type IR Cut Filter

Focus Fixed

Shutter Type Rolling Shutter

Signal Interface MIPI CSI-2, 1 Lane

Horizontal Field of View 69.4o

Vertical Field of View 42.5o

Diagonal Field of View 77o

Distortion <=1.5%

36 337029-005
Component Specification

3.6.4 Depth Module Connector

The depth module connector provides signal and power interface to the stereo depth
module. The connector on stereo depth module is a 50-pin connector plug.

Table 3-17. Depth Module 50-pin Connector Plug Details

Parmeter Description Diagram

Number of Contacts 50

NOVASTACK 35-P
Product Name
Plug Assembly

Part Number 20708-050E

Manufacturer Website www.i-pex.com

3.6.5 Stereo Depth Module Label

Table 3-18. Stereo Depth Module Product Labeling

Dimension Value Unit

A Label Width 17 mm

B Label Height 6.9 mm

C Scan Code Width 5 mm

D Scan Code mm
5
Height
For illustration purpose only, subject to
change
Scan Code Format
XXXXXXXXXXXXOOOOOOXXXXXX-XXX

Table 3-19. Stereo Depth Module Label Fields

Group Field Description Type

Company Intel Manufacturer Static

Model Number RealSenseTM Camera Static

Camera Model Number
4XX

Product Assembly XXXXXX Product Identifier Code Static

Number
Manufacture Configuration Dynamic
-XXX
Code

OOOOOO Product Material Code Static

Serial Number XXXXXXXXXXXX Manufacture Unit Code Dynamic

337029-005 37
 Component Specification

Table 3-20. Intel® RealSense™ Depth Module D400 Series Product Identifier Code and
Product Material Code

Production Product Identifier Code- Product Material Code

Manufacture Configuration Code

Depth Module D400 J32082-100 951934

Depth Module D410 J32106-100 951913

Depth Module D415 J32114-100 952000

Depth Module D420 J51355-100 956826

Depth Module D430 J42086-100 954010

3.6.6 Stiffener
The stiffener maintains the precise alignment of the camera sensors and assists in
subassembly rigidity. The stiffener consists of a bottom and a top plate. The stiffener
is of stainless steel grade AISI 304.

3.6.7 Temperature Sensor

The stereo depth module is equipped with a thermal sensor that is used for laser
safety control (IR Projector). The RealSense library provides access to the thermal
sensor but it is not intended to be used by applications outside of development
environments.

3.6.8 Other Stereo Depth Module Components

Table 3-21. Other Stereo Depth Module Components

Component Description

Laser (IR The depth module implements a laser driver which controls the infrared
Projector) Driver laser within the infrared projector system.

Laser (IR The depth module implements a laser safety control circuit that adjusts
projector) laser drive output. When laser power and depth streaming is enabled and if
Thermal Control stereo depth module temperature is >60°, laser power is halved. If
temperature is not lowered below temperature limit within a certain
interval, the laser is shut off.

EEPROM The depth module implements flash memory for storing the calibration data.

Fork/Screw Mount Secure placement and mounting to system/chassis/heat sink

Voltage The stereo depth module implements DC to DC voltage converters

Regulators

38 337029-005
Component Specification

3.6.9 Mechanical Dimensions

Table 3-22. Intel® RealSense™ Depth Module D400 Mechanical Dimensions

Dimension Min Nominal Max Unit

Width 74.5 74.7 74.9 mm

Height 9.8 10 10.2 mm

Depth 4.5 4.7 4.9 mm

Flatness Tolerance - 0.2 - mm

Weight 6.5 7.2 8 gr

Table 3-23. Intel® RealSense™ Depth Module D410 Mechanical Dimensions

Dimension Min Nominal Max Unit

Width 74.5 74.7 74.9 mm

Height 9.8 10 10.2 mm

Depth 4.5 4.7 4.9 mm

Flatness Tolerance - 0.2 - mm

Weight 7.3 8.1 8.9 gr

Table 3-24. Intel® RealSense™ Depth Module D415 Mechanical Dimensions

Dimension Min Nominal Max Unit

Width 89.5 89.7 89.9 mm

Height 9.8 10 10.2 mm

Depth 4.5 4.7 4.9 mm

Flatness Tolerance TBD mm

Weight TBD gr

Table 3-25. Intel® RealSense™ Depth Module D420 Mechanical Dimensions

Dimension Min Nominal Max Unit

Width 70.5 70.7 70.9 mm

Height 13.8 14 14.2 mm

Depth 10.33 10.53 10.73 mm

Flatness Tolerance - 0.2 - mm

Weight TBD gr

337029-005 39
 Component Specification

Table 3-26. Intel® RealSense™ Depth Module D430 Mechanical Dimensions

Dimension Min Nominal Max Unit

Width 70.5 70.7 70.9 mm

Height 13.8 14 14.2 mm

Depth 10.33 10.53 10.73 mm

Flatness Tolerance - 0.2 - mm

Weight 13 14.5 16 gr

3.6.10 Stereo Depth Module Power Sequence

Figure 3-6. Stereo Depth Module Power Sequence

3.3V

1.8V

3.6.11 Stereo Depth Module Storage and Operating Conditions

Table 3-27. Stereo Depth Module Storage and Operating Conditions

Condition Description Min Max Unit

Storage (Ambient), Not Temperature (Sustained, oC

0 40
Operating Controlled)(1)

Temperature (Short oC
-40 70
Exposure)(2)

Humidity Temperature/ RH: 40oC / 90%

(3)(4)(5) oC
Case Temperature Temperature 0 50

NOTE:
(1) Controlled conditions should be used for long term storage of product.
(2) Short exposure represents temporary max limits acceptable for transportation conditions.
(3) Case temperature limits must be met for all operating temperatures.
(4) Case temperature is specified for the overall depth module
(5) Case temperature 0° minimum and lower temperatures is non-condensing

40 337029-005
Component Specification

3.7 Intel® RealSense™ Vision Processor D4 Board

The Vision Processor D4 Board enables an easy and quick option for system
integrators to integrate Vision Processor D4 into a system.

Table 3-28. Vision Processor D4 Board

Type Description

USB Peripheral Connects to Host USB 3.1 Gen 1 port through USB Type-C connector and
Type-C cable

Table 3-29. Vision Processor D4 Board Components

Components Description

Vision Processor D4 Stereo Depth Processing ASIC

16Mb Serial Flash Vision Processor D4 firmware storage

24MHz Crystal Clock source for Vision Processor D4

Realtek* ISP with external serial flash Color image signal processor

50 pin receptacle for connection to Stereo Depth

Depth Module Receptacle
Module

USB peripheral connector for connection to Host

USB Type-C
USB 2.0/USB 3.1 Gen 1 port

External Sensor Sync Connector Interface to external sensor interrupts/sync signals

DC to DC converters powering Vision Processor D4

Voltage Regulators
Board and stereo depth module.

Mounting holes Vision Processor D4 Board secure mounting

Figure 3-7. Vision Processor D4 Board (USB Peripheral Type-C)

Depth Module
Vision Processor D4
Receptacle

USB Type-C External Sensor

Connector Sync Connector

337029-005 41
 Component Specification

3.7.1 Mechanical Dimensions

Table 3-30. Vision Processor D4 USB Type-C Board Mechanical Dimensions

Dimension Min Nominal Max Unit

Width 72.2 72.4 72.6 mm

Height 15.8 16 16.2 mm

Depth 3.74 3.94 4.14 mm

Weight 3.56 3.96 4.36 gr

3.7.2 Depth Module Receptacle

The Vision Processor D4 Board interface to stereo depth module is through 50 pin
receptacle on the board.

Table 3-31. Depth Module Receptacle Details

Parameter Description Diagram

Number of Contacts 50

NOVASTACK* 35-P
Product Name
Receptacle Assembly

Part Number 20709-050E

Manufacturer Website www.i-pex.com

3.7.3 Flex and Rigid Interposer Interconnect

The high speed interposer at one end has the 50 pin depth module receptacle to
connect into 50 pin depth module plug on stereo depth module and at the other end
has the 50 pin depth module plug to connect into 50 pin depth module receptacle on
Vision Processor D4 Board. The high speed flex Interposer is custom developed and
procured by system integrator.

42 337029-005
Component Specification

Figure 3-8. Flex Interposer (Illustration)

Figure 3-9. Rigid Interposer (Illustration)

337029-005 43
 Component Specification

Figure 3-10. Depth Module Receptacle and Plug Connector Pin Position

Table 3-32. Interposer Interconnect Signal Description

ASIC Board/
Position Motherboard Depth Module Interconnect Description

1 RGB_RSTN_N RGB_RSTN_N RGB Sensor Reset

2 GND GND Ground

3 RGB_XCL RGB_XCL RGB Sensor Clock

4 RGB_MDP0 RGB_MDP0 RGB Sensor MIPI Data Lane 0 differential pair positive

5 GND GND Ground

RGB_MDN0 RGB_MDN0 RGB Sensor MIPI Data Lane 0 differential pair

6
negative

44 337029-005
Component Specification

Position ASIC Board/ Depth Module Interconnect Description

Motherboard

7 RGB_FSYNC RGB_FSYNC RGB Sensor Sync

8 GND GND Ground

9 RGB_STROBE RGB_STROBE RGB Sensor Strobe

10 RGB_MCP RGB_MCP RGB Sensor MIPI Clock differential pair positive

11 RGB_SDA RGB_SDA RGB Sensor I2C Bus Data

12 RGB_MCN RGB_MCN RGB Sensor MIPI Clock differential pair negative

13 RGB_SCL RGB_SCL RGB Sensor I2C Bus Clock

14 GND GND Ground

15 GND GND Ground

16 MDP0_L MDP0_L Left Imager MIPI Data Lane 0 differential pair positive

17 VDD18V VDD18V 1.8V Power

MDN0_L MDN0_L Left Imager MIPI Data Lane 0 differential pair

18
negative

19 VDD18V VDD18V 1.8V Power

20 GND GND Ground

21 LED_PSY LED_PSY Privacy LED control signal

22 MCP_L MCP_L Left Imager MIPI Clock differential pair positive

23 DVSYNC DVSYNC VSYNC

24 MCN_L MCN_L Left Imager MIPI Clock differential pair negative

25 NC NC No Connect

26 GND GND Ground

27 XVCLK_L XVCLK_L Clock to Left Imager

28 MDP1_L MDP1_L Left Imager MIPI Data Lane 1 differential pair positive

29 GND GND Ground

MDN1_L MDN1_L Left Imager MIPI Data Lane 1 differential pair

30
negative

31 ST_RST_N ST_RST_N Reset signal to Left and Right Imager

32 GND GND Ground

33 FF_RSTn FF_RSTn Laser Error

Right Imager MIPI Data Lane 0 differential pair

34 MDP0_R MDP0_R
positive

35 GND GND Ground

Right Imager MIPI Data Lane 0 differential pair

36 MDN0_R MDN0_R
negative

37 XVCLK_R XVCLK_R Clock to Right Imager

38 GND GND Ground

337029-005 45
 Component Specification

Position ASIC Board/ Depth Module Interconnect Description

Motherboard

39 I2C_SCL I2C_SCL I2C Bus Clock

40 MCP_R MCP_R Right Imager MIPI Clock differential pair positive

41 I2C_SDA I2C_SDA I2C Bus Data

42 MCN_R MCN_R Right Imager MIPI Clock differential pair negative

43 LASER_PWM LASER_PWM IR Projector Control Signal

44 GND GND Ground

45 LASER_PWRDN LASER_PWRDN IR Projector Power Down

Right Imager MIPI Data Lane 1 differential pair

46 MDP1_R MDP1_R
positive

47 LASER_PWM1 LASER_PWM1 IR Projector Control Signal

Right Imager MIPI Data Lane 1 differential pair

48 MDN1_R MDN1_R
negative

49 FLAGB FLAGB IR Projector Fault Detect

50 GND GND Ground

51 GND GND Ground

52 VDD33V VDD33V 3.3V power

Figure 3-11. Depth Module Connector Orientation and Pin Position

Stereo Depth Module Pin Position 1

Pin Position 50 P/N 20708-050E

Vision Processor D4 Card Pin Position 50 P/N 20709-050E Pin Position 1

-

Table 3-33. Custom Flex Interposer Ordering Logistics

Vendor Sales Contact

COCOM CONSUMER Janine Langdale

ELECTRONICS LTD. email: [email protected]

46 337029-005
Component Specification

(O) +44 (0) 1444 461620

(M) +44 (0) 7905 692131

3.7.4 External Sensor Sync Connector

The external sensor connector provides the interface for external sensors to
synchronize to depth output.

Table 3-34. External Sensor Connector Details

Parameter Description Diagram

Number of Contacts 9

9 Positions Header,
Product Name
Shrouded Connector

SM09B-SRSS-
Part Number
TB(LF)(SN)

Manufacturer Website www.jst-mfg.com

Table 3-35. External Sensor Sync Connector Pin List

Pin Signal Function Description

1 GPIO3 GVSYNC0 Not Defined

2 GPIO4 GVSYNC1 IR Projector Power Down signal

3 GVSYNC2 External IR Projector Fault Detect

GPIO5

4 GVSYNC3 External IR Projector

GPIO6

5 Z_VSYNC VSYNC Depth VSYNC

6 LASER_PWM0 LASER PWM0 Laser control signal

7 LASER_PWM1 LASER PWM1 Laser control signal

8 VDD33V Power 3.3V

9 GND Ground Ground

3.7.5 USB Peripheral Connector – Type-C

USB Type-C connector consists of 24 signal pins designed in a symmetrical way. The
connector z height is as low as 3mm and enables enhanced user experience by
allowing the USB Type-C plug to be plugged into a receptacle either right side up or
upside down. Interoperability between USB Type-C and legacy USB is possible through
standard legacy cable assemblies defined in USB Type-C Cable and Connector
specification.

337029-005 47
 Component Specification

Figure 3-12. USB Type-C Receptacle Pin Map

Table 3-36. USB Peripheral Connector Pin List

Pin Signal Function Description

A1 GND Power Delivery Ground

A2 TX1+ USB 3.1 Gen 1 Data First SuperSpeed TX Differential Pair Positive

A3 TX1- USB 3.1 Gen 1 Data First SuperSpeed TX Differential Pair Negative

A4 VBUS Power Delivery 5V

A5 CC1 Control Configuration Channel 1

A6 D+ USB2.0 Data ke
USB 2.0 differential pair positive

A7 D- USB2.0 Data USB 2.0 differential pair negative

orientation detection
A8 SBU1 Sideband Sideband Use Signal 1

A9 VBUS Power Delivery 5V

A10 RX2- USB 3.1 Gen 1 Data Second SuperSpeed RX Differential Pair Negative

A11 RX2+ USB 3.1 Gen 1 Data Second SuperSpeed RX Differential Pair Positive

A12 GND Power Delivery Ground

B1 GND Power Delivery Ground

B2 TX2+ USB 3.1 Gen 1 Data Second SuperSpeed TX Differential Pair Positive

B3 TX2- USB 3.1 Gen 1 Data Second SuperSpeed TX Differential Pair Negative

B4 VBUS Power Delivery 5V

B5 CC2 Control Configuration Channel 2

B6 D+ USB 2.0 Data USB 2.0 differential pair positive

B7 D- USB 2.0 Data USB 2.0 differential pair negative

B8 SBU2 Sideband Sideband Use Signal 2

B9 VBUS Power Delivery 5V

B10 RX1- USB 3.1 Gen 1.0 Data First SuperSpeed RX Differential Pair Negative

B11 RX1+ USB 3.1 Gen 1.0 Data First SuperSpeed RX Differential Pair Positive

B12 GND Power Delivery Ground

48 337029-005
Component Specification

Table 3-37. Custom USB Type C cable Assemblies Ordering Logistics

Vendor Website

Newnex Technology Corp. http://www.newnex.com/realsense-3d-camera-connectivity.php

3.7.6 Color Image Signal Processor (ISP)

The color sensor data is sent to discrete Image Signal Processor (ISP) on the Vision
processor D4 Board for image adjustments, image scaling and processing functions to
help compensate for inherent inaccuracy in lens and sensor in providing a better
image quality. The processed color image is sent to the Vision Processor D4.

Table 3-38. ISP Properties

Parameter ISP Properties

ISP Part Number on Vision Processor D4 Board RTS5845

1M-bit Serial Flash for ISP Winbond* W25X10CL or equivalent

Interface To Vision Processor D4 MIPI CSI-2, 2X Lanes

Interface To RGB Sensor MIPI CSI-2, 1X Lane

3.7.7 Vision Processor D4 Board Power Requirements

The Vision Processor D4 Board is powered through VBUS power of the USB connector.
The Vision Processor D4 Board in turn power sources the stereo depth module.

Table 3-39. Vision Processor D4 Board Power Requirements

Parameter Min Nom Max Unit

VCC Supply Voltage 4.75 5V 5.25V V

ICC Supply Current 700 mA

Supply Voltage Ramp Rate 0.5 5 ms

3.7.8 Vision Processor D4 Board Thermals

The Vision Processor D4 Board should be screw mounted on to a heat sink or a heat
dissipating structure element using screw forks on Board. Thermal conductive tape
(electrically non-conductive) should cover the entire back side area (non-component
side) of the ASIC Board for thermal transfer onto heat sink or heat dissipating
structure element.

337029-005 49
 Component Specification

3.7.9 Vision Processor D4 Board Storage and Operating

Conditions
Table 3-40. Vision Processor D4 Board Storage and Operating Conditions

Condition Description Min Max Unit

Storage (Still Air), Not Operating Temperature

oC
(Sustained, 0 40
Controlled)(1)

Temperature
oC
(Short -40 70
Exposure)(2)

Humidity Temperature/ RH: 40oC / 90%

(3)(4)(5) oC
Case Temperature Temperature 0 50

NOTE:
(1) Controlled conditions should be used for long term storage of product.
(2) Short exposure represents temporary max limits acceptable for transportation conditions.
(3) Case temperature limits must be met for all operating temperatures.
(4) Case temperature is specified for the overall Vision Processor D4 Board
(5) Case temperature 0° minimum and lower temperatures is non-condensing

3.7.10 Intel® RealSense™ Vision Processor D4 Board Product

Identifier and Material Code
Table 3-41. Vision Processor D4 Board Product Identifier and Material Code

Production Product Identifier Product Material Code

Code-Manufacture
Configuration Code

Vision Processor D4 Board J32139-120 952019

3.8 Intel® RealSense™ Depth Camera D400 Series

Figure 3-13. Intel® RealSenseTM Depth Camera D415

50 337029-005
Component Specification

Figure 3-14. Intel® RealSense™ Depth Camera D435/D435i

Table 3-42. Depth Camera SKU properties

D400 series Depth Intel® RealSense™ Intel® RealSense™ Intel® RealSense™

Cameras Depth Camera Depth Camera Depth Camera
D415 D435 D435i

Depth module Intel® RealSense™ Intel® RealSense™ Intel® RealSense™

Depth module D415 Depth module D430 Depth module D430

Baseline 55mm 50mm 50mm

Left/Right Imagers Standard Wide Wide

Type

Depth FOV HD H:65±2 / V:40±1 / H:87±3 / V:58±1 / H:87±3 / V:58±1 /

(degrees) D:72±2 D:95±3 D:95±3

Depth FOV VGA H:50±2 / V:40±1 / H:75±3 / V:62±1 / H:75±3 / V:62±1 /

(degrees) D:61±2 D:89±3 D:89±3

IR Projector Standard Wide Wide

IR Projector FOV H:67 / V:41 / D:75 H:90 / V:63 / D:99 H:90 / V:63 / D:99

Color Sensor OV2740 OV2740 OV2740

Color Camera FOV H:69±1 /V:42±1 H:69±1 /V:42±1 H:69±1 /V:42±1

/D:77±1 /D:77±1 /D:77±1

IMU NA NA 6DoF

NOTE: H – Horizontal FOV, V – Vertical FOV, D – Diagonal FOV, X – Length, Y – Breadth, Z –

Thickness

3.8.1 Depth Camera D400 Series Mechanical Dimensions

Table 3-43. Intel® RealSense™ Depth Camera D415 Mechanical Dimensions

Dimension Min Nominal Max Unit

Width - 99 - mm

Height - 23 - mm

Depth - 20 - mm

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 Component Specification

Weight - 72 - gr

Table 3-44. Intel® RealSense™ Depth Camera D435, D435i Mechanical Dimensions

Dimension Min Nominal Max Unit

Width - 90 - mm

Height - 25 - mm

Depth - 25 - mm

Weight - 72 - gr

3.8.2 Depth Camera D400 Series Thermals

Table 3-45. Max Skin Temperature

D400-Series Depth Max Skin Temperature

Cameras (25 degree C Ambient in Open Environment)

D415 44 oC

D435 44 oC

D435i 44 oC

3.8.3 Depth Camera D400 Series Storage and Operating

Conditions
Table 3-46. Depth Camera D400 Series Storage and Operating Conditions

Condition Description Min Max Unit

Storage (Still Air), Not Temperature (Sustained, oC

0 40
Operating Controlled)(1)

Temperature (Short oC
-40 70
Exposure)(2)

Humidity Temperature/ RH: 40oC / 90%

oC
Operating (Still Air) Temperature 0 35

NOTE:

52 337029-005
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(1) Controlled conditions should be used for long term storage of product.
(2) Short exposure represents temporary max limits acceptable for transportation conditions.

3.8.4 Depth Camera D400 Series Product Identifier and Material

Code
Table 3-47. Depth Camera D400 Series Product Identifier and Material Code

Production Product Identifier Code- Product Material

Manufacture Configuration Code
Code

Depth Camera D415 J72476-100 961443

Depth Camera D415 (Multi Pack) J72476-100 962304

Depth Camera D435 J72479-100 961448

Depth Camera D435 (Multi Pack) J72479-100 962305

Depth Camera D435i K38179-100 999AFR

Depth Camera D435i (Multi Pack) K38179-100 999AXG

3.8.5 Camera Lens Cleaning Procedure

1. Do not use any chemical or water on the camera lens
2. Remove dust and dirt as much as possible from the lens with a lens blower
brush.
3. Wipe with soft cloth or eyeglass lens wiper.

§§

337029-005 53
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4 Functional Specification

4.1 Vendor Identification (VID) and Device

Identification (DID)
Table 4-1. Vendor ID and Device ID Table

Depth Module/Depth Camera Vendor ID Device ID

Intel® RealSense™ Depth Module D400 8086 0x0AD1

Intel® RealSense™ Depth Module D410 8086 0x0AD2

Intel® RealSense™ Depth Module D415 8086 0x0AD3

Intel® RealSense™ Depth Camera D415 8086 0x0AD3

Intel® RealSense™ Depth Module D420 8086 0x0AF6

Intel® RealSense™ Depth Module D430 8086 0x0AD4

Intel® RealSense™ Depth Camera D435 8086 0x0B07

Intel® RealSense™ Depth Camera D435i 8086 0x0B3A

4.2 Vision Processor D4 Data Streams

Intel® RealSense™ Vision Processor D4 Depth imaging system provides high quality
depth data to a host system. The depth data is generated with stereo vision
technology that is optionally assisted by an infrared projector. The imaging system
has the ability to syncronize with color stream.

Table 4-2. Image Formats (USB 3.1 Gen1)

Format Resolution Frame Rate Comment

(FPS)

1280x720 6,15,30

848X480 6,15,30,60,90

640x480 6,15,30,60,90 Depth

Z [16 bits]
640x360 6,15,30,60,90

480x270 6,15,30,60,90

424x240 6,15,30,60,90

1280x720 6,15,30 Luminance

Y8 [8 bits]
848X480 6,15,30,60,90 Left and Right Imager

54 337029-005
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Format Resolution Frame Rate Comment

(FPS)

640x480 6,15,30,60,90

640x360 6,15,30,60,90

480x270 6,15,30,60,90

424x240 6,15,30,60,90

1280x720 6,15,30

848X480 6,15,30,60,90

640x480 6,15,30,60,90 Color Stream from Left Imager

UYVY [16 bits]
640x360 6,15,30,60,90 (D400, D410 & D415)

480x270 6,15,30,60,90

424x240 6,15,30,60,90

1920x1080 6,15,30

1280x720 6,15,30

960x540 6,15,30,60

848x480 6,15,30,60
Color Stream from RGB camera
YUY2 [16 bits] 640x480 6,15,30,60 (Camera D415 & D435/D435i)

640x360 6,15,30,60

424x240 6,15,30,60

320x240 6,30,60

320x180 6,30,60

1920x1080 15,25 D400/D410/D415

Calibration [24 bits]
1280x800 15,25 D420/D430/D435/D435i

NOTE:

Depth and Color are mapped as separated interfaces. Each one of the interfaces is working
independent with the other interface (Virtual channel in MIPI and End Point in USB).

Table 4-3. Image Formats (USB 2.0)

Format Resolution Frame Rate Comment

1280x720 6
Depth
Z [16 bits] 640x480 6,15,30

480x270 6,15,30,60

1280x720 6
Luminance
Y8 [8 bits] 640x480 6,15,30
Left and Right Imager
480x270 6,15,30,60

1280x720 6 Color Stream from Left Imager

UYVY [16 bits]
640x480 6,15,30 (D410 & D415)

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 Functional Specification

Format Resolution Frame Rate Comment

480x270 6,15,30,60

1280x720 6
Color Stream from RGB camera
YUY2 [16 bits] 640x480 6,15,30 (Camera D415 & D435/D435i)

424x240 6,15,30,60

NOTE:

Depth and Color are mapped as separated interfaces. Each one of the interfaces is working
independent with the other interface (Virtual channel in MIPI and End Point in USB).

Table 4-4. Simultaneous Image Streams (USB 3.1 Gen1 & USB2.0)

Color Color IMU

(Left (RGB D435i

Depth Imager Imager) Comment
Camera)
D400/D410 D415/D435/D435i

Y8 Gyro &
Z16
Accelerometer

Gyro &
Z16 UYVY
Accelerometer

Y8 YUV2 Gyro &

Z16
Accelerometer

YUV2 Gyro &

Z16
Accelerometer

NOTE:
1. RGB to depth hardware sync is only supported with the same frame rate for all streams.
2. For Depth and RGB camera simultaneous streaming, it is recommended to have color
resolution to be the same or higher than depth resolution.
3. USB 3.1 Gen1 supports all resolution/frame rate combinations in a typical dedicated USB port
configuration. On a USB hub with other devices (e.g. other RealSense cameras),
considerations regarding bandwidth requirements have to be taken.
4. USB 2.0 supports a subset of the resolution/frame rate combinations given the bandwidth
requirements.
 Max. Depth Resolution Simultaneous Stream Configuration with Depth at 640X480,
15 FPS, Left Imager at 640X480, 15 FPS and RGB Camera at 640X480, 30 FPS.
 Max. Depth Frame Rate Simultaneous Stream Configuration with Depth at 480X270,
60 FPS, Left Imager at 480X270, 60 FPS and RGB Camera at 424x240, 30 FPS

56 337029-005
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4.3 Depth Field of View (FOV)

The depth field of view is the common overlap of the individual left and right Imager
field of view for which Vision Processor D4 provides depth data

Table 4-5. Depth Field of View

Format D400/D410/D415 D420/D430/D435/D435i

Horizontal FOV (VGA 4:3) 48 74

Vertical FOV (VGA 4:3) 40 62

Diagonal FOV (4:3) 60 88

Horizontal FOV (HD 16:9) 64 86

Vertical FOV (HD 16:9) 41 57

Diagonal FOV (HD 16:9) 72 94

NOTE:
 Due to mechanical tolerances of +/-5%, Max and Min FOV values can vary from lens to
lens and module to module by ~ +/- 3 degrees.
 The Depth FOV specified is at 2 meters distance.

4.4 Depth Field of View at Distance (Z)

Depth Field of View (Depth FOV) at any distance (Z) can be calculated using the
equation

𝐻𝐹𝑂𝑉 𝐻𝐹𝑂𝑉
𝐷𝑒𝑝𝑡ℎ 𝐹𝑂𝑉 = + tan−1 {tan ( ) − 𝐵/𝑍}
2 2
Depth FOV = Depth Field of View

HFOV = Horizontal Field of View of Left Imager on Depth Module

B = Baseline

Z = Distance of Scene from Depth Module

337029-005 57
 Functional Specification

Figure 4-1. Depth Field of View to Depth Map illustration

Invalid Depth Band Depth Map

Distance
(Z)

HFOV Depth FOV

Left Imager Right Imager

Baseline (B)

NOTES:
 As the scene distance from the depth module increases, the invalid depth band decreases
in the overall depth image. Overall depth image is invalid depth band plus valid depth
map.

4.5 Invalid Depth Band

The depth data generated with stereo vision uses the left imager as the reference for
stereo matching resulting in a non-overlap region in the field of view of left and right
imagers where we will not have depth data at the left edge of the frame. Closer
scenes result in a wider invalid depth band than scenes at larger distances.

58 337029-005
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Figure 4-2. Left Invalid Depth Band

The width of the invalid depth band can be calculated using the following equations:

In terms of horizontal FOV

𝐷𝐵𝑅 (𝑅𝑎𝑡𝑖𝑜 𝑜𝑓 𝐼𝑛𝑣𝑎𝑙𝑖𝑑 𝐷𝑒𝑝𝑡ℎ 𝐵𝑎𝑛𝑑 𝑡𝑜 𝑇𝑜𝑡𝑎𝑙 𝐻𝑜𝑟𝑖𝑧𝑜𝑛𝑡𝑎𝑙 𝐼𝑚𝑎𝑔𝑒)

𝐻𝐹𝑂𝑉
= 𝐵/(2 ∗ 𝑍 ∗ tan( ))
2

𝐼𝑛𝑣𝑎𝑙𝑖𝑑 𝐷𝑒𝑝𝑡ℎ 𝐵𝑎𝑛𝑑 (𝑖𝑛 𝑃𝑖𝑥𝑒𝑙𝑠) = 𝐻𝑅𝐸𝑆 ∗ 𝐷𝐵𝑅

In terms of focal length

𝐷𝐵𝑅 (𝑅𝑎𝑡𝑖𝑜 𝑜𝑓 𝐼𝑛𝑣𝑎𝑙𝑖𝑑 𝐷𝑒𝑝𝑡ℎ 𝐵𝑎𝑛𝑑 𝑡𝑜 𝑇𝑜𝑡𝑎𝑙 𝐻𝑜𝑟𝑖𝑧𝑜𝑛𝑡𝑎𝑙 𝐼𝑚𝑎𝑔𝑒)

= 𝐵 ∗ 𝐹/(𝑍 ∗ 𝐻𝑅𝐸𝑆)

𝐼𝑛𝑣𝑎𝑙𝑖𝑑 𝐷𝑒𝑝𝑡ℎ 𝐵𝑎𝑛𝑑 (𝑖𝑛 𝑃𝑖𝑥𝑒𝑙𝑠) = 𝐵 ∗ 𝐹/𝑍

B= Baseline

Z= Distance of Scene from Depth Module

F= Focal length

HFOV= Horizontal Field of View of Left Imager on Depth Module

HRES= Horizontal Resolution

The equations stand valid for a base configuration of camera settings. Default camera
configuration in firmware may have settings optimized for depth performance that
may impact the actual width of invalid depth band when compared to the calculated
width of the invalid depth band from equations.

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4.6 Minimum-Z Depth

The Minimum-Z Depth is the minimum distance from depth camera to scene for which
Vision Processor D4 provides depth data.

Table 4-6. Minimum-Z Depth

D400/D410/D415 D420/D430
Resolution
Min-Z (mm) Min-Z (mm)

1280x720 450 280

848X480 310 195

640x480 310 175

640x360 240 150

480x270 180 120

424x240 160 105

4.7 Depth Quality Specification

There are a set of standard metrics based on accuracy, data validity, and temporal
stability are used to quantify depth quality.

Although the module is designed for a certain depth FOV, the measurements are
taken within 80% of this FOV, defined as region of interest (ROI). This ROI will best
align with intended usage area and the optical parameters qualification field.

Table 4-7: Depth Quality Metric

METRIC DEFINITION(1)

Depth Accuracy Measure the difference for valid pixels relative to a ground truth surface.

Fill Rate Percentage of pixels that have a valid depth value.

Depth Standard Deviation Measures the total spatial noise for each valid pixel relative to a best fit plane.

Pixel Temporal Noise Measures the total temporal noise for each valid pixel relative to a best fit plane.

NOTES:
(1) Each measurement is taken from a predefined region of interest (ROI) which is within 80% of the depth
field of view (FOV).

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Table 4-8: Depth Quality Metric Illustration

DEPTH ACCURACY AND DEPTH RMS ERROR FILL RATE

Table 4-9. Depth Quality Specification

D400/D410/D415 D420/D430/D435/D435i
Metric (up to 2 Meters and 80% (up to 2 Meters and 80%
FOV) FOV)

Z-accuracy (or absolute error) ≤ 2% ≤ 2%

Fill rate ≥ 99% ≥ 99%

RMS Error (or Spatial Noise) ≤ 2% ≤ 2%

Temporal Noise (Pixel) ≤ 1% ≤ 1%

NOTES:

1) The Depth Quality spec applies to calibrated depth modules and depth cameras.

2) For Depth Quality metric definitions and test methodology, refer to white paper
“Intel® RealSense™ Camera Depth Testing Methodology”

3) Laser Power: 150mW, Exposure: Auto Exposure

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4.8 Measured Power

Table 4-10. Power- Ubuntu 16.04

Normal Power (W) Maximum Power (W)

Model Idle (W) Typical Usage Worst Case
Configuration Configuration

D400 0.04 1.44 1.44

D410 0.05 1.71 2.21

D420 0.04 1.12

D430 0.04 2.68

Table 4-11. Power – Windows 10 (RS4)

Normal Power (W) Maximum Power (W)

Model Idle (W) Typical Usage Worst Case
Configuration Configuration

D400 0.04 1.44 1.44

D410 0.04 1.84 2.51

D420 0.04 1.08

D430 0.04 2.85

NOTES:

1) Power Configuration:

(C) – Color Resolution

Laser (IR)
Model Configuration Resolution Frame Rate Comments
Power Setting

Typical 1280X720 30FPS 0mW

D400
Worst Case 1280X720 30FPS 0mW

Typical 1280X720 30FPS 150mW

D410
Worst Case 1280X720 30FPS 330mW

Typical 1280X720/ 30FPS 150mW

1280X720 (C)
D415
Worst Case 1280X720/ 30FPS 330mW
1920X1080 (C)

Typical 848X480 30FPS 0mW

D420
Worst Case 1280X720 30FPS 0mW

Typical 848X480 30FPS 150mW

D430
Worst Case 1280X720 30FPS 330mW

Typical 848X480/ 30FPS 150mW

D435/D435i
1280X720 (C)

62 337029-005
Functional Specification

Worst Case 1280X720/ 30FPS 330mW

1920x1080 (C)

4.9 Depth Start Point (Ground Zero Reference)

The depth start point or the ground zero reference can be described as the starting
point or plane where depth = 0. For depth modules (D400, D410 & D415), this point
is referenced from front of lens or from backside of module. For depth cameras (D415
and D435/D435i), this point is referenced from front of camera cover glass

Figure 4-3. Depth Module Depth Start Point Reference

Depth Start
Depth (Z) Scene
Point
Z’
Z”

Back of Front of Lens

Module

D410 (Depth Module Side View)

Table 4-12. Depth Module Depth Start Point

Depth Module Front of Lens (Z’) Back of Module (Z”)

D400/D410/D415 -0.1mm 4.3mm

D420/D430 -3.2mm 7.5mm

NOTES:

If depth measurement reference is front of lens, then |Z’| should be added to measured
value to determine Ground Truth. If depth measurement reference is back of module, then
|Z”| should be subtracted to determine Ground Truth.

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 Functional Specification

Figure 4-4. Depth Camera Depth Start Point Reference

Depth Start
Depth (Z) Scene
Point

Z’

Front Cover
Glass

D435 (Depth Camera Side View)

Table 4-13. Depth Cameras Depth Start Point

Depth Camera Camera Front Glass (Z’)

D415 -1.1mm

D435/D435i -4.2mm

NOTES:

If depth measurement reference is front cover glass, then |Z’| should be added to measured
value to determine Ground Truth.

64 337029-005
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4.9.1 Depth Origin X-Y Coordinates

The depth origin X-Y coordinates is the X-Y center of left imager.

Figure 4-5. Depth Module X-Y Depth Origin Reference

Table 4-14. Depth Module X-Y Depth Origin Coordinates

Depth Module Left Alignment hole1 to Left imager Center

D400 8mm

D410 8mm

D415 8mm

D420 8mm

D430 8mm

NOTES:

1. Left alignment hole on bottom stiffener of depth module

2. Left alignment hole and left imager center is on depth module centerline.

337029-005 65
 Functional Specification

Figure 4-6. Depth Camera X-Y Depth Origin Reference

Table 4-15. Depth Camera X-Y Depth Origin Coordinates

Depth Camera From Centerline of ¼-201 To Left Imager

D415 20mm

D435/D435i 17.5mm

NOTES:
1. Center of tripod mounting hole (1/4-20)

4.10 Depth Camera Functions

D4 exposes the following Depth image settings.

Table 4-16. Depth Camera Controls

Control Description Min Max

Manual Exposure(1) (ms) Control sensor exposure period 1 166

(400/410)

Manual Exposure(1) (ms) Control sensor exposure period (430) 1 166

Manual gain (1)

Control sensor digital gain. 16 248
(Gain 1.0 = 16)

Laser Power (on/off) Power to IR Projector 0 1

(On = 1)

Manual Laser Power (mW) Laser Power setting (30mW steps) 0 360

66 337029-005
Functional Specification

Control Description Min Max

Auto Exposure Mode Auto Exposure Mode. When Auto 0 1

(Enable = 1) Exposure is enabled, Exposure and
Gain are set based on the environment
condition

Auto Exposure ROI Perform Auto Exposure on a selected T-0 T-719

ROI L-0 L-1279
B-1 B-720
R-1 R-1280

Preset Set Controls parameters based on

Camera Usage

Meta Data Control Enable/Disable Metadata 0 1

NOTES:

(1) – Not supported in Auto Exposure Mode

T - Top, L – Left, B - Bottom, R – Right

4.11 Color Camera Functions

Table 4-17. RGB Exposed Controls

Control Description Min Max

Auto-Exposure Mode Automatically sets the exposure 0x1 0x8

time and gain for the frame.

Manual Exposure Time Sets the absolute exposure time 41 10000

when auto-exposure is disabled.

Brightness Sets the amount of brightness -64 64

applied when auto-exposure is
enabled.

Contrast Sets the amount of contrast based 0 100

on the brightness of the scene.

Gain Sets the amount of gain applied to

the frame if auto-exposure is 0 128
disabled.

Hue Sets the amount of hue adjustment

-180 180
applied to the frame.

Saturation Sets the amount of saturation

0 100
adjustment applied to the frame.

Sharpness Sets the amount of sharpening

0 100
adjustment applied to the frame.

Gamma Sets amount of gamma correction

100 500
applied to the frame.

White Balance Sets the white balance when AWB is

2800 6500
Temperature Control disabled.

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 Functional Specification

Control Description Min Max

White Balance Enables or disables the AWB

Temperature Auto algorithm. 0 1
(AWB)

Power Line Frequency Specified based on the local power

0 3
line frequency for flicker avoidance.

Backlight Sets a weighting amount based on

0 1
Compensation brightness to the frame.

Low Light Comp Low Light Compensation 0 1

4.12 IMU Specifications

Table 4-18. IMU Specifications

Camera Parameter Properties

Intel® RealSense™ Degrees of Freedom 6

Depth Camera
D435i (D435 + Acceleration Range ±4g
BMI055) Accelerometer Sample Rate1 62.5, 250 (Hz)

Gyroscope Range ±1000 deg/s

Gyroscope Sample Rate 2

200, 400 (Hz)

Sample Timestamp Accuracy 50 usec

NOTES:
1. The sample rate may differ from the absolute specified sample rate by ±5%.
It is advised to rely on the sample timestamp.
2. The sample rate may differ from the absolute specified sample rate by ±0.3%.

§§

68 337029-005
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5 Firmware
The firmware contains the operation instructions. Upon runtime, Vision Processor D4
loads the firmware and programs the component registers. If the Vision Processor D4
is configured for update or recovery, the unlocked R/W region of the firmware can be
changed.

5.1 Update
During a firmware update, the firmware utility will issue a device firmware update
command to the Vision Processor D4. The Vision Processor D4 will then reset into
firmware update mode. The firmware utility uses a single binary file to maintain the
firmware image. The firmware utility compares the firmware version installed on the
camera to the firmware version file to be updated. Based on the comparison, the
firmware utility will downgrade, upgrade, or skip if the versions match.

5.1.1 Update Limits

The firmware update engine does not allow infinite update cycles between older and
current versions of firmware. The engine will establish a baseline version of firmware
based on the latest firmware version installed. The engine will allow a return to a
previous version or baseline version of firmware up to 20 times. After the 20th
update, the engine will only allow an update to a firmware revision higher than the
baseline version.

5.2 Recovery
A read only boot sector is built into firmware which enables basic operation regardless
of the integrity of the operation instructions region. This ensures the imaging system
can function in the case of firmware not be written properly. When a firmware
recovery is required, the firmware utility will communicate with the recovery driver to
set the DFU pin low and reset the imaging system in recovery mode.

Firmware Recovery can also be externally triggered by having controllable interrupt

connected to the Vision Processor D4 DFU (Device Firmware Update) pin.

The firmware recovery sequence will be triggered by the firmware client utility. This
client utility will communicate through ACPI _DSM to trigger the controllable interrupt
(GPIO) at the appropriate times. The firmware recovery requires an ACPI _DSM
interface to control the interrupt GPIO in configuring to firmware recovery state. The
_DSM methods and BIOS use the Write to GPIO functions to set the controllable
interrupt.

§§

337029-005 69
 Software

6 Software

6.1 Intel® RealSense™ Software Development Kit 2.0

Intel® RealSense™ SDK 2.0 is a cross-platform library for working with Intel®
RealSense™ D400 Series. It is open source and available on
https://github.com/IntelRealSense/librealsense

The SDK at a minimum includes:

 Intel® RealSense™ Viewer - This application can be used view, record and
playback depth streams, set camera configurations and other controls.
 Depth Quality Tool - This application can be used to test depth quality,
including: distance to plane accuracy, Z accuracy, standard deviation of the Z
accuracy and fill rate.
 Debug Tools - These command line tools gather data and generate logs to
assist in debug of camera.
 Code Examples - Examples to demonstrate the use of SDK to include D400
Series camera code snippets into applications.
 Wrappers -Software wrappers supporting common programming languages
and environments such as ROS, Python, Matlab, node.js, LabVIEW, OpenCV,
PCL, .NET and more

§§

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7 System Integration
The small size of the stereo depth module and the separate placement of Vision
Processor D4 provides system integrators flexibility to design into a wide range of
products. Because the camera uses stereo vision technology, it is crucial that the
stereo depth module does not flex throughout its service life. This creates unique
mechanical and thermal implementation guidance. This section explains how to
correctly integrate D4 depth camera into a system

7.1 System Level Block Diagram

Figure 7-1. System Block Diagram

7.2 Vision Processor D4 System Integration

There are two options to integrate Vision Processor D4 into a system, either by
integration of Vision Processor D4 Board or having the Vision Processor D4 and
support components directly on the host processor motherboard. Vision Processor D4
Board simplifies system design and integration of the D4 depth camera system and
Vision Processor D4 on Motherboard allows for a space optimized implementation of
the D4 depth camera system.

7.2.1 Vision Processor D4 Board

The Vision Processor D4 Board has a standard USB Type-C connector and requires an
appropriate USB Type-C cable to connect to a standard USB 2.0/USB 3.1 Gen 1
external port.

337029-005 71
 System Integration

Figure 7-2. Intel® RealSense™ Vision Processor D4 Board

USB3 Type-C
Connector

7.2.2 Vision Processor D4 on Motherboard

In the Vision Processor D4 on Motherboard option, Vision Processor D4 and support
components are directly placed on the host processor motherboard. The depth module
receptacle is on the host processor motherboard for connection to the stereo depth
module.

Figure 7-3. Vision Processor D4 on Motherboard (Illustration)

Stereo Depth Module

Flex Interposer
Host Processor SOC
Motherboard

D4

7.2.2.1 Firmware Update

SPI flash chip assembled onto the motherboard requires a bootable firmware image
for Vision Processor D4 to boot or to run the firmware update utility provided by Intel.

There are two options program flash with firmware image or to recover a corrupt
firmware image.

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System Integration

1. Pre-program SPI flash chip with firmware before assembly on to motherboard

or replace corrupt image with a good image SPI flash chip. The blank SPI flash
chip can pre-programmed using a compatible adapter (i.e. PA8QFN8D) and
supporting flash programmer.
2. A header or test points is connected in parallel to the SPI flash chip, then
programmed directly with an SPI flash programmer. Vision Processor D4 SPI
interface is put in high Z state by strapping EPGPIO4 pin to Ground when
programmed directly with an SPI flash programmer.

7.3 D4 Camera System Power Delivery

D4 camera system MUST keep stereo depth module and the Vision Processor D4 on
the same power rails. The stereo depth module holds a safety region in EEPROM that
is configured by firmware protected region. Keeping all components on the same rail
prevents malicious software reset of the stereo depth module without causing a reset
to the ASIC. By this protection we make sure that all the safety logic is kept locked as
long as the device is active. Ensure power delivery implementation recommendation in
Chapter 12 are followed in the design of D4 camera system.

Figure 7-4. D4 Camera System Power Scheme

3.3V 3.3V

1.8V 1.8V

VBUS0 V 330 Stereo

Depth
*AVDD Connector
VDDTS VDDPST
Vision
VDDPLL
Processor
0.9V VP VPTX0 DVDD D4
VDD

PMU_EN

FET VDDPG

3.3V
ISP
1.8V

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7.4 Vision Processor D4 Board for Integrated

Peripheral
In design of custom host processor motherboard with custom Vision Processor D4
Board for embedded applications, a low mechanical profile 10 pin USB 3.1 Gen 1
receptacle can be implemented on motherboard and Vision Processor D4 Board.

7.4.1 USB 3.1 Gen 1 Receptacle

Table 7-1. USB 3.1 Gen 1 Receptacle Characteristics

PROPERTY DESCRIPTION DIAGRAM

Shell Finish Tin (Sn)

Lock Yes

Ground Bar Yes

Alignment Boss No

Part Number IPEX 20347-310E-12R

Table 7-2. USB 3.1 Gen 1 Receptacle Pin Out

POSITION NAME TYPE DESCRIPTION

1 GND - Ground

2 USB3_SSTX- OUT USB 3.1 Gen 1 Transmitter Negative

3 USB3_SSTX+ OUT USB 3.1 Gen 1 Transmitter Positive

4 GND - Ground

5 USB3_SSRX- IN USB 3.1 Gen 1 Receiver Negative

6 USB3_SSRX+ IN USB 3.1 Gen 1 Receiver Positive

7 GND - Ground

8 DFU IN Device Firmware Update

9 3.3V - Supply Voltage, Connect to 3.3V

10 3.3V - Supply Voltage, Connect to 3.3V

7.4.2 USB 3.1 Gen 1 High Speed Cable Assembly

The high speed cable assembly is developed and procured by the system integrator.
The cable assembly design is specific to the system definition and must meet cable
assembly design specification.

Table 7-3. USB 3.1 Gen 1 Plug Characteristics

PROPERTY DESCRIPTION DIAGRAM

Shell Finish Tin (Sn)

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Friction Lock Yes

Ground Bar Yes

Plug Part Number IPEX 2047-0103

Housing Part Number IPEX 20346-010T-31

Table 7-4. Cable Assembly Specification

PROPERTY DESCRIPTION

Cable Length 15 inches (max)

Controlled Impedance 85 Ohms with a tolerance of ± 10%.

Max Insertion Loss <= 7.5 dB @2.5GHz

Cable Shielding Each plug connected to the receptacle shield and GND bar.

The Transmit to receive pair crossover is expected on the Motherboard and not the
cable assembly. This is done to allow for flat cable assemblies.

7.4.3 Transmit to Receive Crossover

The host USB 3.1 Gen 1 transmit signals must be connected to the Vision Processor
D4 USB 3.1 Gen 1 receive signals. The host USB 3.1 Gen 1 receive signals must be
connected to the Vision Processor D4 USB 3.1 Gen 1 transmit signals. It is
recommended not to cross over the signals in the cable to allow cable wiring to be flat
and as thin as possible.

Figure 7-5. Host Motherboard USB 3.1 Gen 1 Routing

HOST PROCESSOR MOTHERBOARD D4 Card

Receptacle Receptacle
USB3

Note: Crossover happens on Host

Processor Motheboard

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7.4.4 Motherboard Receptacle

Table 7-5. Motherboard Receptacle Properties

PIN WIRE DESCRIPTION

Shielding Metal shielding, connected to GND plane.

Grounding Two ground bar connections in addition to the connector GND.

It is recommended that the motherboard receptacle be grounded as well as ground

bar pads implemented.

Figure 7-6. Receptacle Ground Bar Motherboard Connections

7.4.5 Vision Processor D4 Board for Integrated Peripheral

Power Requirements
The Vision Processor D4 Board is powered by 5V from host processor motherboard
through USB 3.1 Gen 1 receptacle pins 9 and 10

Table 7-6. Vision Processor D4 Board as Embedded Peripheral Power Requirements

Parameter Min Nom Max Unit

VCC Supply Voltage +/-5% 5V V

ICC Supply Current 700 mA

7.5 Thermals
The system thermal design must ensure the component case temperature are not
exceeded. Thermal models for Vision Processor D4 board and Depth modules are
available to conduct a thermal evaluation and validate the system thermal design.

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Table 7-7. Vision Processor D4 Board – Component Power and TDP at Max Operating
Mode(1)

Component Power TDP Unit

Vision Processor D4 618 618 mW

Color Camera ISP 196.83 196.83 mW

Voltage Regulators/Other 491.64 491.64 mW

All Components 1306.47 1306.47 mW

Table 7-8. Stereo Depth Module (Standard) – Component Power and TDP at Max
Operating Mode(1)

Component Power TDP Unit

Left Imager 118.5 118.5 mW

Right Imager 118.5 118.5 mW

IR Projector 1296 946 (2)

mW

Color Sensor 118.5 118.5 mW

EEPROM + Thermal Sensor 4 4 mW

All Components 1655.5 1305.5 mW

Table 7-9. Stereo Depth Module (Wide) – Component Power and TDP at Max Operating
Mode(1)

Component Power TDP Unit

Left Imager 177 177 mW

Right Imager 177 177 mW

IR Projector 1620 1260 (2)

mW

EEPROM + Thermal Sensor 4 4 mW

All Components 1978 1618 mW

1. Max. Operating Mode – Depth Resolution 1280X720 30FPS, Color Resolution -

1920X1080p 30FPS
2. The IR projector TDP is lower than power due to a percentage of energy dissipated as
photonic emissions rather than heat.
3. Voltage Regulator power is included as part of the individual component power

Table 7-10. Vision Processor D4 Board Components – Case Temperature Limits (Still
Air)

Component Min Max(1) Unit

Vision Processor D4 0 110 ◦C

Color Camera ISP 0 70 ◦C

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For the Depth Modules, case temperature is specified for the overall depth module and
the thermocouple test location is any point on bottom metal stiffener

Figure 7-7. Bottom Stiffener Depth Module D410

Figure 7-8. Bottom Stiffener Depth Module D430

7.6 Stereo Depth Module Flex

It is critical that stereo depth module does not experience flex during system
integration or during use after integration. Micron level flexing of the module can
render the calibration incorrect and will result in poor performance or nonfunctional
depth data. It is important for system designers to isolate the module from any
chassis flex the system may encounter. While the module has a reinforcement
housing, the housing is not intended to counter loads from chassis flex. The primary
function of the housing is to prevent loss of calibration from handling and operating
environments.

It is possible for the module to recover depth performance after experiencing

permanent deformation. However, the module’s ability to recover is dependent on the
amount of deformation experienced.

7.7 Stereo Depth Module Mounting Guidance

7.7.1 Screw Mount

The stereo depth module incorporates a screw hole and a screw fork for module
mounting. The stereo depth module should be mounted on a large heat sink or a heat
dissipating structure element using M1.6 screw at the screw hole and fork. The
recommended torque for both screws is 1.6Kgf*cm. Thermal interface material should
be used on backside region of IR projector and two stereo imagers between camera
module and heat sink or heat dissipating structure element for thermal transfer.

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Figure 7-9. Stereo Depth Module Screw Mount

Screw Fork Screw Hole

7.7.2 Bracket Mount

The Stereo Depth module should be mounted on large heat sink or a heat dissipating
structure element using the bracket placed at the center of module. The bracket is
made up of 0.35mm thickness stainless steel. The bracket is secured to the heat sink
or structure element using two M1.6 screws with recommended torque of 1.6Kgf*cm.
The rectangular (400/410 bracket) or circular (430 bracket) cutout is for thermal
interface filler or as IR Projector opening when reversing bracket to mount. Thermal
interface material should be used on backside region of IR projector and two stereo
imagers between camera module and heat sink or heat dissipating structure element
for thermal transfer. The camera module should have a minimum of 0.2mm clearance
from all sides except for the area around bracket. It is not required to have screws at
the screw hole and screw fork at both ends of module when mounting camera module
using bracket.

Figure 7-10. Stereo Depth Module Bracket

400/410 Bracket 430 Bracket

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Figure 7-11. Stereo Depth Module Bracket Mount

Figure 7-12. Stereo Depth Module Bracket Install

Bracket slides in from either length

side of stereo camera module

Table 7-11. Bracket Ordering Logistics

Vendor Sales Contact

FASPRO Technologies, INC. Chuck Drews

[email protected]
www.fasprotech.com
(M) 847-612-2350
(O) 224-848-4131

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7.7.3 Stereo Depth Module Air gap

A minimum 0.3mm air gap is recommended between highest components on the
stereo depth module to the cover window

Figure 7-13. Stereo Depth Module Air Gap

7.8 Thermal Interface Material

Thermal interface material, specifically thermal paste/grease is recommended to be
inserted between the stereo depth module and the heat dissipating structure (heat
sink) to improve the thermal coupling between these two components. A thermal
paste with thermal conductivity in the 3-4W/mK range is recommended. This paste
must be applied in a thin layer on the back side of the IR projector and also under the
left and right imagers filling up the air gap under the Imagers.

7.9 Heat Sink

The heat sink or heat dissipating structure element used to mount stereo depth
module and ASIC Board should be a minimum of 2-3mm in thickness. It is advisable
to extend the heat sink by a few mm beyond the edges of the stereo depth module. It
is also recommended to have thermal fins on the back side of the heat dissipating
structure. In applications where weight is a concern, high thermal conductivity
graphite tape can be attached to the back side of the heat sink. This graphite tape
must be at least as big as the metal heat sink and extended out beyond the metal as
much as possible for optimal cooling. Heat sink metal must be a high conductivity
aluminum alloy or copper.
In cases where the module is expected to operate at high ambient temperatures,
additional airflow may be required to ensure temperature limits are not exceeded.
These are guidelines for thermal integration of the D4 camera in the system, however
actual testing or system level thermal modeling is recommended before finalizing
solution.

7.10 Cover Design and Material Guidance

The stereo depth module components must be covered to minimize dust and
humidity. The transparent cover material stack-up used must provide acceptable
transmission based on the component wavelengths. Anti-reflective coatings can help
increase the transmission of cover material. Cover material that reduces light
transmission can result in poor depth performance and will decrease the working

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range of the camera. Nominally flat, non-distorting and low scattering cover material
should be used.

Table 7-12. Component Transmission

Component Wavelength Unit

Left and Right Imager (Intel® 400 to 865 (Visible and Infrared) @ 98% transmission nm
RealSense™ D410/D430) rate or higher at all viewing and transmitting angles

Left and Right Imager (Intel® Visible spectrum @ 98% transmission rate or higher at nm
RealSense™ D400/D420) all viewing and transmitting angles

IR Projector 850nm ± 15 nm @ 98% transmission rate or higher at nm

all viewing and transmitting angles

NOTES:
1. Higher transmissions @ 98% transmission rate or higher is recommended and not a
requirement.
2. Intel RealSense Camera 400-Series provides control over laser power and sensor
exposure. Minor loss of transmission due to cover material transmissivity might be
compensated by increasing exposure when less light is able to reach the sensors and by
increasing laser power for IR projector pattern projection loss.
3. Uncoated clear acrylic (plexiglass) plastic cover is an example for cover material
4. Anti-reflective coatings can help increase the transmission of cover material.

If different cover material is used in front of the cameras and the IR projector to
maximize transmission based on component wavelengths, cover design considerations
should ensure that the FOV of the cameras and FOP of the IR projector are not
impacted.

7.11 Gaskets
Gaskets are recommended for providing optical isolation and dust protection.
However, gaskets can impede FOV and place unwanted stress on the module or the
individual sensor lens holders.

Gasket static force can deform the cosmetic baffle/lens holder resulting in poor image
quality and permanent damage to the camera. Gaskets placed on the module stiffener
can transfer chassis flex into the camera module causing loss of depth data. Gasket
thickness has a large effect on the static force applied to the module surface. The
thinner the seal, the greater the static force applied. Once the gasket is compressed,
the static force will increase exponentially.

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Figure 7-14. Illustration of Gasket Placement and Cover Material

7.11.1 Optical Isolation

It is recommended to isolate the left/right imagers and IR projector from each other
to prevent reflections off the cover material. Not properly isolating the cameras can
result in leakage light as shown in Figure 7-15. Example of Light Leakage Effects

To prevent light leakage, it is recommended to use a gasket material in between the

cover holes and the module. The gasket material needs to be compliant so that it does
not transmit chassis flex forces to the module.

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Figure 7-15. Example of Light Leakage Effects

7.11.2 Dust Protection

Dust particles can accumulate over the camera lenses which can be visually
unappealing and degrade image quality.

7.12 Firmware Recovery

To support firmware recovery, a 3.3V controllable interrupt must be connected to the
Vision Processor D4 DFU (Device Firmware Update) pin

The ability to recovery the image system if the firmware becomes corrupted requires
D4 reset and DFU pin driven high for 160ms. The DFU pin should remain high when
D4 is out of reset for D4 to boot in DFU mode. The 160ms ensures that the DFU pin is
held high through the reset sequence.

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Figure 7-16. Firmware Recovery Sequence

Sequence Timing Diagram

Firmware
Recovery

Reset (PRSTN Pin)

DFU Pin

7.13 Calibration Support

It is required to have an accessible USB port to access the host system. The accessible
USB port would allow to stream images reliably to an external PC to determine
calibration parameters and to write back camera calibration parameters via the host
system

The USB port should be able to be configured in a mode where the USB port can
access the host. The access to USB port is required at manufacturing and not intended
to be available on shipped product or to end user.

7.14 Multi-Camera Hardware Sync

Intel® RealSense™ D400 Series supports hardware sync signal for multi-camera
configuration. For multiple cameras to be hardware synchronized as to capture at
identical times and frame rates, pins 5 (SYNC) and pins 9 (Ground) on external sensor
sync connector will need to be connected. The external sensor sync connector is on
Vision Processor D4 board and is accessible on Depth Cameras.

Figure 7-17. External Sensor Sync Connector Location on D4 Vision Processor D4 Board

External Sensor
Sync Connector

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 System Integration

Figure 7-18. External Sensor Sync Connector Location on Depth Camera D435/D435i

External Sensor Sync Connector

For additional details on how to implement the multi-camera hardware sync feature,
please refer to multi-camera white paper at https://realsense.intel.com/intel-
realsense-downloads/#whitepaper.

7.15 Handling Conditions

Table 7-13. Electrostatic Discharge Caution

To provide a consistent ESD protection level during D4 system

assembly and rework, it is recommended that the JEDEC
JESD625-A requirements standard be incorporated into the ESD
environment controls.

§§

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8 Platform Design Guidelines

The Platform Design Guidelines has been developed to ensure maximum flexibility for
board designers while reducing the risk of board related issues. Design
recommendations are based on Intel's simulations and are strongly recommended.

8.1 Vision Processor D4 on Motherboard

This Design Guidelines provides Vision Processor D4 on motherboard implementation
recommendations for the Kaby Lake U/Y (7th Generation Intel® Core™ Processors)
and Cherry Trail T4 (Intel® Atom™ Z8000 Processor Series) platforms with 8/10 layer
Type 4 PCB.

Supported platform topologies are:

1. Vision Processor D4 with USB Host Interface
2. Vision Processor D4 with MIPI Host Interface
3. Vision Processor D4 on Board for USB Integrated Peripheral

Figure 8-1. Vision Processor D4 with USB Host Interface

MOTHERBOARD DEPTH MODULE

Connector

D4 Vision Connector
Host SOC
Processor
USB 3.1 Gen1
(2 sets of X2 MIPI)
(SL/MS)
Flex PCB
(2 sets of X2 MIPI)

Figure 8-2. Vision Processor D4 with MIPI Host Interface

MOTHERBOARD DEPTH MODULE

Connector

Connector

D4 Vision
Host SOC
Processor
X4 MIPI
(SL/MS)
(2 sets of X2 MIPI)
(SL/MS)
Flex PCB
(2 sets of X2 MIPI)

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 Platform Design Guidelines

Figure 8-3. Vision Processor D4 on Board for USB Integrated Peripheral

MOTHERBOARD D4 Board DEPTH MODULE

Flex PCB
(2 sets of X2 MIPI)
IPEX IPEX

Connector

Connector
D4 Vision
HOST SOC
Processor
2 sets of X2 MIPI
USB 3.1 (SL/MS)
Gen 1

8.2 Kaby Lake U and Kaby Lake Y platforms

8.2.1 Kaby Lake Platform Introduction

The Kaby Lake U platform consists of a Kaby Lake U processor plus a Kaby Lake
Platform Controller Hub (PCH) in the same Multi Chip Package (MCP). Similarly the
Kaby Lake Y platform consists of a Kaby Lake Y processor plus a Kaby Lake PCH in the
same Multi Chip Package (MCP).

Note: For Kaby Lake U/Y platform design guidelines, refer Kaby Lake U and Y
Platform Design Guide. (Doc# 561280)

8.2.2 Supported PCB Stack-Up and Routing Geometries

Refer to Kaby Lake U/Y Platform Design Guide for type 4 PCB stack up,
Breakout/Breakin geometries, Main Route stripline/microstrip geometries and Via
recommendations. It is strongly recommended to follow the given impedance criteria
in the design guide for the given interface.

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8.2.3 Vision Processor D4 on Motherboard with USB Host

Interface

8.2.3.1 USB 3.1 Gen 1 Motherboard Routing

Figure 8-4. Host Processor - Vision Processor D4

D4

Table 8-1. Host Transmit – Vision Processor D4 Receive Routing Guidelines

Parameter Breakout Main Breakin Total Allowed Length

(BO) Route (BI) (L_BO + L_MR + L_BI)
(MR)

Maximum
Segment Length 0.25 15-BO-BI 0.25 15
(Inches)

Maximum Allowed
Channel Insertion <=15 dB @2.5MHz
loss (dB)

Table 8-2. Vision Processor D4 Transmit - Host Receive Routing Guidelines

Parameter Breakout Main Breakin Total Allowed Length

(BO) Route (BI) (L_BO + L_MR + L_BI)
(MR)

Maximum
Segment Length 0.25 15-BO-BI 0.25 15
(Inches)

Maximum Allowed
Channel Insertion <=15 dB @2.5MHz
loss (dB)

NOTES:
 Simulation results shows that overall 15 inch channel routing is good for USB 3.1 Gen 1
Vision Processor D4 to Host connection motherboard. This connection does not include any
connector or cable.
 All routing is recommended to be 85 ohm impedance.

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 Platform Design Guidelines

 Breakout/Breakin should be maximum length of 250 mil for 85 ohm routing, if there is any
impedance variation due to narrow escape BGA breakout, the maximum routing length
should be 150mil.
 Maximum number of via count:4 (including package microvia)
 It is strongly recommended that overall channel loss is within -15dB for satisfactory
performance.

8.2.4 Vision Processor D4 on Motherboard with MIPI Host

Interface

8.2.4.1 MIPI Motherboard Routing

Figure 8-5. Vision Processor D4 Transmit - Host Receive

D4

Table 8-3. Vision Processor D4 Transmit – Host Receive Routing Guidelines

Parameter Breakout Main Breakin Total Allowed Length

(BO) Route (BI) (L_BO + L_MR + L_BI)
(MR)

Maximum
Segment Length 0.25 15-BO-BI 0.25 15
(Inches)

Maximum Allowed
Channel Insertion <=5.5 dB @750MHz
loss (dB)

NOTES:
 Maximum via count = 4 vias including the first micro-via from package ball.
 Minimum stripline breakout pair-to-pair spacing of 2.36 mils is allowed near package ball
out region with maximum length of 250 mils.
 Main route and Break-in nominal impedance is required to be consistent. Example: 85 ohm
main route and 85 ohm break-in. Mixture of nominal impedance is not recommended.
 Length matching within a differential pair is +/- 5 mils maximum.

90 337029-005
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 The maximum allowed channel insertion loss budget dictates the total allowed length. The
total insertion loss allowed for interconnect from the D4 package die bump to Kaby Lake
SoC package die bump is about 5.5dB at 750 MHz. It should be noted that though only the
insertion loss value at the fundamental frequency (750 MHz) is specified, the insertion loss
curve up to about 1.5 GHz should be well behaved with no strong resonance or ripple.

8.2.4.2 MIPI Motherboard Routing (Stereo Depth Module Transmit to

Vision Processor D4 Receive)

Figure 8-6. Stereo Depth Transmit - Vision Processor D4 Receive

Depth
Module
D4

Board Routing

Table 8-4. Stereo Depth Module Transmit - Vision Processor D4 Receive Routing
Guidelines

Parameter Breakout Main Route Breakin Flex Camera Total Allowed Length
(BO) (MR) (BI) Interposer Board (L_MB + L_Cable +
Length Length L_Camera)
(L_Camera)
(L_Cable)

15 –
Maximum L_Camera
L_Cable - 15-L_MB-
Segment Length 0.25 0.25 15
L_Camera – L_camera (max ~2
(Inches)
BO - BI inches)

Maximum
Allowed Channel
<=5.5 dB @750MHz
Insertion loss
(dB)

NOTES:
 Stereo depth module MIPI routing length are assumed to be 2 inches (max)
 Maximum via count = 3 vias including the first micro-via from package ball.

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 Minimum stripline breakout pair-to-pair spacing of 2.36 mils is allowed near package ball
out region with maximum length of 250 mils.
 Main route and Break-in nominal impedance is required to be consistent. Example: 85 ohm
main route and 85 ohm break-in. Mixture of nominal impedance is not recommended.
 Length matching within a differential pair is +/- 5 mils maximum.
 No length match requirements for signals routed to different camera modules.
 The maximum allowed channel insertion loss budget dictates the total allowed length. The
total insertion loss allowed for interconnect from the package die bump to the connector on
the camera module is about 5.5dB at 750 MHz as shown in the table. This recommendation
allows the use of any cable type as long as the maximum allowed insertion loss is met. It
should be noted that though only the insertion loss value at the fundamental frequency
(750 MHz) is specified, the insertion loss curve up to about 1.5 GHz should be well behaved
with no strong resonance or ripple.
 Flex Interposer recommendation: 85-100ohm impedance with maximum length of 4-6
inches. The recommended interposer should be Flex PCB based design.

Figure 8-7. Flex Interposer PCB Stack-Up

8.2.5 Vision Processor D4 Board for Integrated Peripheral (USB

3.1 Gen 1 Host to Vision Processor D4 Routing)
Figure 8-8. USB 3.1 Gen 1 Host to Vision Processor D4 Topology

D4

92 337029-005
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Table 8-5. USB 3.1 Gen 1 Host to Vision Processor D4 Routing Guidelines

Vision Processor D4 Board USB 3.1 Host Motherboard

Gen 1
Cable

Cable
Breakout Main Route Breakin Breakout Main Route Breakin
Parameter Length
(BO) (MR) (BI) (BO) (MR) (BI)
(L_Cable)

Maximum
Segment
0.25 2 0.25 15 (max) 0.25 5 0.25
Length
(Inches)

Maximum
Allowed <= 15 dB @ 2.5GHz
Channel
Insertion loss Max recommended USB 3.1 Gen 1 cable loss <= 7.5 dB @2.5GHz
(dB)

NOTES:
 The maximum allowable motherboard routing of USB 3.1 Gen 1 signals on Host PCB should
be 5-6inch inch and routing on Vision Processor D4 Board should be 2-3inch.
 It is recommended that an 85 ohm common mode choke (CMC) be designed in line with
both the USB 3.1 Gen 1 signals. The CMC should be placed as close to the connector as
possible.
 It is required that a 0.1μF AC coupling capacitor is designed in series with both the USB 3.1
Gen 1 signals.
 The USB 3.1 Gen 1 cable assembly should have a differential impedance of 85 Ohms with a
tolerance of ± 10%.
 The max cable length should not exceed 15 inch with target loss of [email protected]
 Overall channel loss including cable should not exceed 15dB @2.5GHz

8.2.6 USB2.0 Design Guidelines (USB2 Host to Vision Processor

D4 Routing)
Figure 8-9. USB2.0 Host to Vision Processor D4

D4

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 Platform Design Guidelines

Parameter Breakout Main Breakin Total Allowed Length

(BO) Route (BI) (L_BO + L_MR + L_BI)
(MR)

Maximum
Segment Length 0.25 15-BO-BI 0.25 15
(Inches)

Maximum Allowed
Channel Insertion
loss (dB)

NOTES:
 Simulation results shows that overall 15 inch channel routing is good for USB2.0 D4 to Host
topology on motherboard. This topology does not include any connector or cable.
 All routing is recommended to be 85 ohm
 Breakout/breakin should be max of 250mil for 85ohm routing, if there is any impedance
variation due to narrow escape BGA breakout, the max routing should be 150mil.
 Maximum number of via count:4 (including package microvia)

 It is strongly recommended that overall channel loss to be within -15dB for

satisfactory performance

8.3 Cherry Trail T4 Platform

8.3.1 Cherry Trail T4 Platform Introduction

The Cherry Trail T4 is the Intel Architecture (IA) SoC that integrates the Intel ®
processor core, Graphics, Memory Controller, and I/O interfaces into a single system-
on-chip solution.

Note: For Cherry Trail T4 platform design guidelines, refer Cherry Trail T4 Platform
Design Guide. (Doc# 537901)

Note: Cherry Trail platform supports 2 SoC skus, T3 and T4. The Vision Processor D4
platform design guidelines discussed in this chapter are only applicable to T4 based
Cherry Trail platform. For information on Cherry Trail T4 SoC, refer to Intel® Atom™
Z8000 Processor Series - External Design Specification (EDS) (Doc# 539071)

8.3.2 Vision Processor D4 Platform Design Guidelines

The Vision Processor D4 platform design guidelines on Cherry Trail T4 platform would
follow the same guidelines specified for Kaby Lake U and Y platforms.

8.3.2.1 Supported PCB Stack-Up and Routing Geometries

Refer to Cherry Trail T4 Platform Design Guide for Type 4 PCB stack up,
Breakout/Breakin routing geometry, Main Route stripline/microstrip geometry and Via
recommendations. It is strongly recommend to follow the given impedance criteria in
the design guide for the given interface.
§§

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9 Regulatory Compliance

9.1 System Laser Compliance

The Intel® RealSense™ D400 series certification is transferable to the system and no
system recertification is required. However, the following statements and labels must
be included in the user manual of the end product

9.1.1 Certification Statement

This product is classified as a Class 1 Laser Product under the EN/IEC 60825-1, Edition
3 (2014) internationally and IEC60825-1, Edition 2 (2007) in the US.

This product complies with US FDA performance standards under 21 CFR 1040.10 for
laser products except for deviations pursuant to Laser Notice No. 50 dated June 24,
2007.

9.1.2 Explanatory Label

CLASS 1 LASER PRODUCT

EN/IEC 60825-1, 2014 (EU & other)
IEC 60825-1, 2007 (US)

This device complies with US FDA performance standards for laser products
except for deviations pursuant to Laser Notice No. 50 dated June24, 2007.

9.1.3 Cautionary Statements

System integrators should refer to their respective regulatory and
compliance owner to finalize regulatory requirements for a specific
geography.

Caution - Use of controls or adjustments or performance of procedures

other than those specified herein may result in hazardous radiation
exposure.

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 Regulatory Compliance

Do not power on the product if any external damage was observed.

There are no service/maintenance, modification, or disassembly
procedures for the stereo module and infrared projector. The system
integrator must either notify Intel or return modules before any failure
analysis is performed.
Do not attempt to open any portion of this laser product.
Invisible laser radiation when opened. Avoid direct exposure to beam.
There are no user serviceable parts with this laser product.
Modification or service of the stereo module, specifically the infrared
projector, may cause the emissions to exceed Class 1.
No magnifying optical elements, such as eye loupes and magnifiers, are
allowed.
Do not try to update camera firmware that is not officially released for
specific camera module SKU and revision.

9.1.4 Manufacturer’s Information

Manufactured by Intel Corporation
2200 Mission College Blvd., Santa Clara, CA 95054 USA

9.1.5 US FDA Accession Number

Table 9-1. U.S. FDA Accession Number

Component U.S. FDA accession numbers

Intel® RealSense™ Depth Module D410/D415 1420260-006

Intel RealSense™ Depth Module D430

®
1420260-007

This accession number should be entered into Box B.1 of the Food and Drug
Administration (FDA) 2877 Declaration for Imported Electronic Products Subject to
Radiation Control Standards.

9.1.6 NRTL Statement

For the US and Canada market, this product has been tested and certified by UL and
Nemko, and found to be compliant with all applicable requirements of the
specifications below.

UL 60950-1 2nd Edition, CAN/CSA C22.2 No. 60950-1-07, Information Technology

Equipment – Safety – Part 1: General Requirements

Both UL and Nemko are Nationally Recognized Testing Laboratories (NRTLs),

recognized by US Occupational Safety and Health Administration (OSHA) as qualified
to perform safety testing and certifications covered within its scope of recognition.

96 337029-005
Regulatory Compliance

Figure 9-1. NRTL Certifications

9.2 Ecology Compliance

9.2.1 China RoHS Declaration

China RoHS Declaration

产品中有毒有害物质的名称及含量

Hazardous Substances Table

部件名称 有毒有害物质或元素 Hazardous Substance

Component Name 铅 汞 镉 六价铬 多溴联苯 多溴二苯醚

Pb Hg Cd Cr (VI) PBB PBDE

相机
X ○ ○ ○ ○ ○
Camera

印刷电路板组件
X ○ ○ ○ ○ ○
Printed Board Assemblies

○：表示该有毒有害物质在该部件所有均质材料中的含量均在GB/T 26572标准规定的限量要求以下。

○：Indicates that this hazardous substance contained in all homogeneous materials of such component is
within the limits specified in GB/T 26572.

×：表示该有毒有害物质至少在该部件的某一均质材料中的含量超出GB/T 26572标准规定的限量要求。

337029-005 97
 Regulatory Compliance

×： Indicates that the content of such hazardous substance in at least a homogeneous material of such
component exceeds the limits specified in GB/T 26572.

对销售之日的所售产品,本表显示我公司供应链的电子信息产品可能包含这些物质。注意：在所售产品中可能会也可
能不会含有所有所列的部件。

This table shows where these substances may be found in the supply chain of our electronic information
products, as of the date of sale of the enclosed product. Note that some of the component types listed
above may or may not be a part of the enclosed product.

除非另外特别的标注,此标志为针对所涉及产品的环保使用期限标志. 某些可更换的零部件可能会有一个不同的环保
使用期限(例如,电池单元模块).

此环保使用期限只适用于产品在产品手册中所规定的条件下工作.

The Environment-Friendly Use Period (EFUP) for all enclosed products and their parts are per the symbol
shown here, unless otherwise marked. Certain field-replaceable parts may have a different EFUP (for
example, battery modules) number. The Environment-Friendly Use Period is valid only when the product is
operated under the conditions defined in the product manual.

9.2.2 Waste Electrical and Electronic Equipment (WEEE)

“In the EU, this symbol means that this product must not be disposed of
with household waste. It is your responsibility to bring it to a designated
collection point for the recycling of waste electrical and electronic equipment.
For more information, contact the local waste collection center or your point
of purchase of this product.”

§§

98 337029-005
Mechanical Drawings

10 Mechanical Drawings
Figure 10-1. Intel® RealSense™ Depth Module D400

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 Mechanical Drawings

Figure 10-2. Intel® RealSense™ Depth Module D410

100 337029-005
Mechanical Drawings

Figure 10-3. Intel® RealSense™ Depth Module D415

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 Mechanical Drawings

Figure 10-4. Intel® RealSense™ Depth Module D420

102 337029-005
Mechanical Drawings

Figure 10-5. Intel® RealSense™ Depth Module D430

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 Mechanical Drawings

Figure 10-6. Vision Processor D4 Board USB Type-C (Intel® RealSense™ Vision
Processor D4 Board)

104 337029-005
Mechanical Drawings

Figure 10-7. Intel® RealSense™ Depth Camera D415

337029-005 105
 Mechanical Drawings

Figure 10-8. Intel® RealSense™ Depth Camera D435/D435i

§§

106 337029-005
Connector Drawings

11 Connector Drawings
Figure 11-1. Receptacle Mechanical Drawing (50 Pin Depth Module Receptacle)

337029-005 107
 Connector Drawings

Figure 11-2. Plug Mechanical Drawing (50 pin Depth Module Plug)

§§

108 337029-005
Appendix A – Vision Processor D4 on Motherboard Schematic Checklist

12 Appendix A – Vision Processor

D4 on Motherboard Schematic
Checklist
The following checklist should be compared to the D4 on motherboard design.

Table 12-1. Vision Processor D4 on Motherboard Schematic Checklist

Note: Vision Processor D4 Ball Out and Signal Listing lists additional interfaces and
signal pins that are not supported in current D4 camera system. These pins are called
out as RESERVED

Stuff - Component is populated

No Stuff – Component is not populated

Signal Name Pad Connection √

HOST MIPI
H_DATAP0 B04 No Connect
H_DATAN0 A05 No Connect
H_DATAP1 B05 No Connect
H_DATAN1 A06 No Connect
H_DATAP2 B07 No Connect
H_DATAN2 A08 No Connect
H_DATAP3 B08 No Connect
H_DATAN3 A09 No Connect
H_CLKP B06 No Connect
H_CLKN A07 No Connect
H_SDA B03 No Connect
H_SCL A04 No Connect
H_REXT C05 6.04K 1% resistor pull down to GND. (This resistor
should be placed as close to ASIC as possible)
IMAGER A MIPI (Stereo Depth Left Imager Interface)
A_DATAP0 P03 Routed to Stereo Depth Receptacle Pin 16

A_DATAN0 R02 Routed to Stereo Depth Receptacle Pin 18

A_DATAP1 P05 Routed to Stereo Depth Receptacle Pin 28

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 Appendix A – Vision Processor D4 on Motherboard Schematic Checklist

Signal Name Pad Connection √

A_DATAN1 R04 Routed to Stereo Depth Receptacle Pin 30

A_CLKP P04 Routed to Stereo Depth Receptacle Pin 22

A_CKLN R03 Routed to Stereo Depth Receptacle Pin 24

A_SDA N01 Routed to Stereo Depth Receptacle Pin 41 with 2.2K

pull up to 1.8V
A_SCL N02 Routed to Stereo Depth Receptacle Pin 39 with 2.2K
pull up to 1.8V
A_RCLK P02 Routed to Stereo Depth Receptacle Pin 27

A_PDOWN N03 No Connect

A_VSYNC M01 Routed to Stereo Depth Receptacle Pin 23

A_RESETN P01 Routed to Stereo Depth Receptacle Pin 31

A_REXT N04 6.04K 1% resistor pull down to GND. (This resistor

should be placed as close to ASIC as possible)
IMAGER B MIPI (Reserved)
B_DATAP0 B11 No Connect

B_DATAN0 A12 No Connect

B_DATAP1 B09 No Connect

B_DATAN1 A10 No Connect

B_CLKP B10 No Connect

B_CKLN A11 No Connect

B_SDA C12 No Connect

B_SCL B12 No Connect

B_RCLK C07 No Connect

B_PDOWN C09 No Connect

B_VSYNC C08 No Connect

B_RESETN C10 No Connect

B_REXT C11 6.04K 1% resistor pull down to GND. (This resistor

should be placed as close to ASIC as possible)
IMAGER M MIPI (Stereo Depth Right Imager)
M_DATAP0 P08 Routed to Stereo Depth Receptacle Pin 34

110 337029-005
Appendix A – Vision Processor D4 on Motherboard Schematic Checklist

Signal Name Pad Connection √

M_DATAN0 R07 Routed to Stereo Depth Receptacle Pin 36

M_DATAP1 P10 Routed to Stereo Depth Receptacle Pin 46

M_DATAN1 R09 Routed to Stereo Depth Connector Pin 48

M_CLKP P09 Routed to Stereo Depth Receptacle Pin 40

M_CKLN R08 Routed to Stereo Depth Receptacle Pin 42

M_SDA P06 Routed to External Sensor Sync Connector Pin 6

through 2.2K pull up to 1.8V
M_SCL R05 Routed to External Sensor Sync Connector Pin 7
through 2.2K pull up to 1.8V
M_RCLK R06 Routed to Stereo Depth Receptacle Pin 37

M_PDOWN P07 No Connect

M_VSYNC N06 No Connect

M_RESETN N07 No Connect

M_REXT M06 6.04K 1% resistor pull down to GND. (This resistor

should be placed as close to ASIC as possible)
IMAGER Y MIPI (Color ISP)
Y_DATAP0 C14 Routed to Color ISP (Intel®Vision Processor D4
Board) or No Connect
Y_DATAN0 B15 Routed to Color ISP (Intel®Vision Processor D4
Board) or No Connect
Y_DATAP1 B13 Routed to Color ISP (Intel®Vision Processor D4
Board) or No Connect
Y_DATAN1 A13 Routed to Color ISP (Intel®Vision Processor D4
Board) or No Connect
Y_CLKP B14 Routed to Color ISP (Intel®Vision Processor D4
Board) or No Connect
Y_CKLN A14 Routed to Color ISP (Intel®Vision Processor D4
Board) or No Connect
Y_SDA E14 Routed to Color ISP (Intel®Vision Processor D4
Board) or No Connect
Y_SCL D15 Routed to Color ISP (Intel®Vision Processor D4
Board) or No Connect
Y_RCLK D14 Routed to Color ISP (Intel®Vision Processor D4
Board) or No Connect
Y_PDOWN E13 No Connect

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 Appendix A – Vision Processor D4 on Motherboard Schematic Checklist

Signal Name Pad Connection √

Y_VSYNC F13 Routed as RGB_FSYNC to Stereo Depth Receptacle

Pin 7 through 0 ohm stuff resistor. Alternately also
as routed as RGB_STROBE to Stereo Depth
Receptacle Pin 9 through 0 ohm no stuff resistor.
Y_RESETN F14 Routed to Color ISP (Intel®Vision Processor D4
Board) or No Connect
Y_REXT C15 6.04K 1% resistor pull down to GND. (This resistor
should be placed as close to ASIC as possible)
IMAGER Z MIPI (Reserved)
Z_DATAP0 P13 No Connect

Z_DATAN0 R12 No Connect

Z_DATAP1 P11 No Connect

Z_DATAN1 R10 No Connect

Z_CLKP P12 No Connect

Z_CKLN R11 No Connect

Z_SDA N13 No Connect

Z_SCL N12 No Connect

Z_RCLK R13 No Connect

Z_PDOWN N11 No Connect

Z_VSYNC R14 Depth VSYNC - Routed to External Sensor Sync

Connector Pin 5
Z_RESETN P14 No Connect

Z_REXT N10 6.04K 1% resistor pull down to GND. (This resistor

should be placed as close to ASIC as possible)
SPI (SERIAL FLASH MEMORY)
SPI_DI N14 Routed to 16Mbit SERIAL FLASH MEMORY
(IS25WP016 pin 5 or equivalent)
SPI_DO N15 Routed to 16Mbit SERIAL FLASH MEMORY
(IS25WP016 pin 2 or equivalent)
SPI_CLK M14 Routed to 16Mbit SERIAL FLASH MEMORY
(IS25WP016 pin 6 or equivalent)
SPI_CS M13 Routed to 16Mbit SERIAL FLASH MEMORY
(IS25WP016 pin 1 or equivalent)
SPI_WP M15 Routed to 16Mbit SERIAL FLASH MEMORY
(IS25WP016 pin 3 or equivalent
GPIO

112 337029-005
Appendix A – Vision Processor D4 on Motherboard Schematic Checklist

Signal Name Pad Connection √

GPIO[0] E15 No Connect if not used.

GPIO[1] F15 No Connect if not used.

G14 LASER_PWM - Routed to Stereo Depth Receptacle

pin 43 with 0 ohm no stuff resistor. Refer to
LASER_PWM platform implementation schematic in
GPIO[2] Figure 10-1. Laser PWM0 is routed to Stereo Depth
Receptacle Pin 43 through 0 ohm stuff resistor.
Laser PWM1 is routed to Stereo Depth Receptacle
Pin 47
H14 GVSYNC0 - Routed to External Sensor Sync
GPIO[3]
Connector Pin 1
G13 GVSYNC1 - Routed to External Sensor Sync
Connector pin 2 through 0 ohm stuff resistor with
GPIO[4]
optional LASER_PWRDN through 0 ohm no stuff
resistor or No Connect if not used.
G15 GVSYNC2 - Routed to External Sensor Sync
Connector pin 3 through 0 ohm stuff resistor with
GPIO[5]
optional FLAGB through 0 ohm no stuff resistor or
No Connect if not used.
H15 GVSYNC3 - Routed to External Sensor Sync
Connector pin 4 through 0 ohm stuff resistor with
GPIO[6]
optional LASER_PWM through 0 ohm no stuff
resistor or No Connect if not used.
H13 Routed to Stereo Depth Receptacle Pin 21 or No
GPIO[7]
Connect if not used.
L01 FLAGB - Routed to Stereo Depth Connector
EGPIO[0] Receptacle Pin 49 with pull up option to 1.8V with 0
ohm no stuff resistor

EGPIO[1] E03 Pull up option to 1.8V with 0 ohm no stuff resistor

EGPIO[2] K01 Pull up option to 1.8V with 0 ohm no stuff resistor

L02 LASER_PWRDN - Routed to Stereo Depth Connector

EGPIO[3] Receptacle Pin 45 with pull up option to 1.8V with 0
ohm no stuff resistor

EGPIO[4] M02 Pull up to 1.8V with 4.99K resistor

J02 Pull down option to GND with 0 Ohms no stuff

EGPIO[5]
resistor

EGPIO[6] D01 Pull up option to 1.8V with 0 ohm no stuff resistor

EGPIO[7] E01 Pull down to GND with 4.99K resistor

F01 ISP_FCS – Color ISP EEPROM Chip Select. Also

EGPIO[8]
pulled up to 1.8V with 4.99K resistor

EGPIO[9] E02
Pull up option to 1.8V with 0 ohm no stuff resistor

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 Appendix A – Vision Processor D4 on Motherboard Schematic Checklist

Signal Name Pad Connection √

EGPIO[10] J01
Pull up option to 1.8V with 4.99K no stuff resistor
EGPIO[11] F03
Pull up option to 1.8V with 4.99K no stuff resistor
EGPIO[12] K02
Pull up option to 1.8V with 4.99K no stuff resistor
EGPIO[13] F02
Pull up option to 1.8V with 0 ohm no stuff resistor
USB
USB_RXP B02 Intel®Vision Processor D4 Board supports USB
Type-C connection to Host USB. Route as
appropriate connection to Host USB
USB_RXN A03 Intel®Vision Processor D4 Board supports USB
Type-C connection to Host USB. Route as
appropriate connection to Host USB.
USB_TXP B01 Intel®Vision Processor D4 Board supports USB
Type-C connection to Host USB. Route as
appropriate connection to Host USB.
USB_TXN A02 Intel®Vision Processor D4 Board supports USB
Type-C connection to Host USB. Route as
appropriate connection to Host USB.
USB_DP D03 Intel®Vision Processor D4 Board supports USB
Type-C connection to Host USB. Route as
appropriate connection to Host USB.
USB_DN D02 Intel®Vision Processor D4 Board supports USB
Type-C connection to Host USB. Route as
appropriate connection to Host USB.
USB_ID E05 Intel®Vision Processor D4 Board supports USB
Type-C connection to Host USB. Route as
appropriate connection to Host USB.
USB_RESREF E04 200 ohm pull down to GND. (This resistor should be
placed as close to ASIC as possible)
MISCELLANIOUS
LD_ON_OUT_XX K13 (RESERVED) No Connect
MODSTROB J15 (RESERVED) No Connect
MODSIGN J14 (RESERVED) No Connect
LD_ERR J13 Connected to FF_RSTn (schematic)
G1 24MHz XTAL. Refer to platform implementation
CLKXI
schematic in Figure 10-2.
H1 24MHz XTAL. Refer to platform implementation
CLKXO
schematic in Figure 10-2.
PRSTN C3 Platform implementation specific
CW_CSR_PRSTN P15 No Connect
PMU_PWR_EN K3 Enables VDD_PG voltage rail.

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Appendix A – Vision Processor D4 on Motherboard Schematic Checklist

Signal Name Pad Connection √

DFU C2 Platform implementation specific

ISP_SCL M10 (RESERVED) No Connect
ISP_SDA N9 (RESERVED) No Connect
VQPSQ L3 (RESERVED) No Connect
VQPSM M3 (RESERVED) No Connect
REFPADCLKP D6 (RESERVED) No Connect
REFPADCLKM E6 (RESERVED) No Connect
JTAG
TDI L13 Routed to Test Point or pulldown resistor of 4.7-
10KOhm if JTAG is not used.
TDO L14 Routed to Test Point
TCLK K14 Routed to Test Point or pulldown resistor of 4.7-
10KOhm if JTAG is not used.
TMS K15 Routed to Test Point or pulldown resistor of 4.7-
10KOhm if JTAG is not used.
TRSTN L15 Routed to Test Point
POWER AND GROUND
VDD 0.9V
VDD_PG 0.9V
USB_DVDD 0.9V
VPTX0 0.9V
VP 0.9V
*_AVDD 1.8V
VDDPLL 0.9V
VDDTS 1.8V
VDDPST18 1.8V
USB_VDD330 3.3V
VBUS0 VBUS Power Monitor Signal. VBUS0 signal level is at
VBUS*(200k/(200k+30k)) using external voltage
divider
VSS Ground
*_AGND Ground

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 Appendix A – Vision Processor D4 on Motherboard Schematic Checklist

Figure 12-1. Vision Processor D4 Laser PWM Reference Platform Schematic

Figure 12-2. Vision Processor D4 24MHz Crystal Clock Reference Platform Schematic

12.1 Power Delivery

The DC–DC power circuity discussed in this section must be followed for Vision
Processor D4 on Motherboard designs. TPS62085R DC-DC converter (www.ti.com)
generates 0.9V and SC21150 (www.semtech.com) generates 1.8V and 3.3V voltage
rails from 5V to power Vision Processor D4, Stereo Depth Module.

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Appendix A – Vision Processor D4 on Motherboard Schematic Checklist

Figure 12-3. DC-DC Reference Platform Schematic (3.3V, 1.8V, 0.9V)

0.9V

1.8V

3.3V

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 Appendix A – Vision Processor D4 on Motherboard Schematic Checklist

Figure 12-4. Vision Processor D4 VDD_PG and AVDD Reference Platform Schematic

VDD_PG

Enable
1.8V

Table 12-2. Vision Processor D4 Decoupling and Filter Requirements

Voltage Ball
Name Decoupling Filter Notes

VDD 4X 100nF

VDD_PG 8X 100nF

USB_DVDD
1X 100nF
VPTX0 2X 100nF 1X FERRITE BEAD
120 OHM
VP

*AVDD 1X 100nF

1X 100nF
VDDPLL 1X 100nF 1X FERRITE BEAD
120 OHM

VDDTS 1X 100nF

VDDPST18
(Left and 1X 100nF
Right)

USB_VDD330 1X 100nF

VBUS0

118 337029-005
Appendix B- Cover Material

13 Appendix B- Cover Material

Cover materials placed over the camera sensor must be carefully selected to avoid
impacting software performance. The following parameters are an example of a
suitable cover material. Other solutions are also acceptable but careful design and
validation work should be done to verify a solution will perform adequately.

Table 13-1. Example: Cover Material Parameters

Specification Recommendation Notes

Hardness 6H Prevent Scratches

Flatness 0.005mm Minimize Distortion

Less than 8mm (D410/D415) Cover Material

Distance From Lens to Cover
Less than 2mm (D430) thickness of 1mm

Thickness of Cover 0.55mm ± 0.03mm

Coatings AR inside and outside Avoid Reflections

400 to 865 (Visible and Infrared)

Transmission Wavelength @ 98% transmission rate or
Range higher at all viewing and
transmitting angles

Cover Tilt Tolerance ± 1.0˚

§§

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