Part Supplier/Pt # Leadframe Base Material

(e.g., ON Semi/BS170) Part Package Size/Mass Encapsulation/Housing Material Part CTE PCB CTE (e.g., copper)
Part Name/type
(e.g., Reason for change
Capacitor/SMD) (e.g., new supplier, same
Separate File for supplier location change,
each etc.) Give as much detail as
component(GM possible.
part #) OLD NEW OLD NEW OLD NEW OLD NEW X Y Z OLD
 Part Substitution Data Matrix
Plating Materials & Thicknesses
adframe Base Material (inner layer(by%)/outer layer(by%)) Wire Bond Material
(e.g., copper) [e.g., Ni 0.001-0.002µm/(98%Sn- (e.g., gold, copper, alloy) Industry test Soldering Details
2%Bi) 0.010-0.20µm] standard used to
test new part
(e.g., AEC-Q100) Function of part,
results identify in
required/automo schematic
If Copper wire bond is tive rated? (add What solder method is Solder alloy Solder Reflow
the part AECQ006 used? (e.g., reflow, Are there changes to the composition on the
NEW OLD NEW OLD NEW results to a tab) profile,
Qualified wave (single or multi), soldering process? (yes/no) circuit board
if lead-free solder
Y/N selective) (% breakdown)
 Part Ratings Similar Parts

Are there any PCB

layout changes, Date samples
including pad size? If ready to test?
yes, provide details. Is the new part used Is the new part used on
Soldering profile part max power elsewhere on this another GM component
rating (max temp and max voltage rating max operating temp component? (Also validated to GMW3172?
rating
time at max temp (old/new) (old/new) identical part from same (Also identical part from
(old/new)
ratings) supplier with different same supplier with
value only?) different value only?)
 Reason for change
Part Name/Type (e.g., new supplier, same Part Supplier/Part #
(e.g., Capacitor/SMD) Electrolytic (or leaded) cap TVS (Zener/varistor/MOV) Chokes
supplier location change, (e.g., ON Semi/BS170)
Separate File for each etc.) Give as much detail as
component (GM part #) possible.

ESR
Value (Equivalent Series Breakdown Voltage Power Rating Value Core Material Winding Style Insertion Loss
Resistance)

OLD NEW OLD NEW OLD NEW OLD NEW OLD NEW OLD NEW OLD NEW OLD NEW OLD NEW
 Part Substitution Data Matrix

Is a scheduled time available and

PCB Layout Function of part Testing at a reserved at AEMCLRP recognized
SMD Capacitors (Surface Mount ) ICs Diodes on switching power supplies Ferrite beads changes in circuit, identify AEMCLRP lab for EMC validation (if needed)?
required in schematic recognized lab Provide date range below if yes,
(Y/N)? (Y/N)? provide justification for not
requiring EMC re-validation if no.
Frequency and Frequency and
Impedance at Located at Reverse Recovery Impedance at
Pin for Pin Same Micron
maximum connector pin compatible? technology? Provide data sheet Junction Capacitance maximum
(attenuation curve of I/O? Time (attenuation curve
preferred) preferred)

OLD NEW Y/N Y/N Y/N OLD NEW OLD NEW OLD NEW OLD NEW
 Was any follow Was the
Who was the GM up EMC testing If continuous continuous Hardware designer at supplier company for GM part:
Date When was last What was the EMC component What was the improvement
samples Full component EMC testplan required improvement please provide a name, a phone number, and email
engineer who EMC data (continuous was required, implemented? address so we can ask technical follow up questions.
ready to EMC testing approval approved the approval #? what was it?
test? performed? number? improvement)? Why or why not?
data?

(Y/N) name phone number email address

Name of Component
Lead program
Associated program(s)
Tier 1 Supplier company name
Tier 1 Supplier primary contact (name, phone, email)
Tier 1 Supplier alternate contact (name, phone, email)
Tier 1 Supplier GM Resident contact (name, phone, email)
GM Lead DRE
GM CVE
GM 3172 Engineer
GM EMC Engineer
 Part Supplier/Pt # Part Package Size/Mass Encapsulation/Housing Material Part CTE PCB CTE
Part Name/type (e.g., ON Semi/BS170)
(e.g., Reason for change
Capacitor/SMD) (e.g., new supplier, same
Separate File for supplier location change,
each etc.) Give as much detail as
component(GM possible.
part #)
OLD NEW OLD NEW OLD NEW OLD NEW X

Capacitor shortage NEC 123456 NEC 654321 3mmX2mm/4.1g 3mmX2mm/4.1g Aluminum Aluminum 10 PPM/C 12PPM/C 14PPM/C
 Part Substitution Data Matrix
Plating Materials & Thicknesses
PCB CTE Leadframe Base Material (inner layer(by%)/outer layer(by%)) Soldering Details
(e.g., copper) [e.g., Ni 0.001-0.002µm/(98%Sn- Industry test standard
2%Bi) 0.010-0.20µm] used to test new part
(e.g., AEC-Q100) Function of part,
results identify in
required/automotive schematic
rated? (add results to What solder method is
a tab) used? (e.g., reflow, Are there changes to the
Y Z OLD NEW OLD NEW
wave (single or multi), soldering process? (yes/no)
selective)

Ni 0.005/(99%Sn-1%Bi) Reflow no
15PPM/C 56PPM/C Cu Cu Ni 0.005/Sn 0.01 0.01 AEC Q200/yes Battery input filter
Soldering Details Part Ratings Simular Parts
Are there any PCB
layout changes,
including pad size? If
yes, provide details.
(add tab to cove Is the new part used Is the new part used on
Solder alloy
Solder Reflow
Soldering profile part
max power details) elsewhere on this another GM component
composition on the rating (max temp and max voltage rating max operating temp component? (Also validated to GMW3172?
profile, rating
circuit board time at max temp (old/new) (old/new) identical part from same (Also identical part from
if lead-free solder (old/new)
(% breakdown) ratings) supplier with different same supplier with
value only?) different value only?)

96.5Sn+3.0Ag+0.5Cu See attached tab 260ºC±5 for 10s -40 ~ 85 ºC/-40 ~ 125 ºC
36V/36V 5W/5W no no no
Date samples
ready to test?

15-Apr-11
This Data is only needed for tall parts
compare mate
Part Supplier/Pt #
Reason for change (e.g., ON Semi/BS170)
(e.g., new supplier,
Part Name/type same supplier
(e.g.,
Capacitor/SMD) location change, etc.)
Give as much detail as
possible.
OLD NEW
or tall parts.(E.g. Electrolytic Capacitors) I
pare materials to avoid vibration testing.
What is the specific
copper(other material) alloy What is the temper of the What is the size of the lead
used for the lead(s)?
(examples; C11000 alloy? (examples; H02, H06) (cross-sectional area)?
copper, C26000 brass, ...)

OLD NEW OLD NEW OLD

apacitors) It is intended to use to
on testing.
Plating Materials & Thicknesses What is the mass of the
t is the size of the lead (inner layer/outer layer) component, and how far is it
oss-sectional area)? (e.g., Ni 0.001-0.002µm/Sn from the board (i.e.,
0.010-0.20µm) moment of inertia)?

NEW OLD NEW OLD NEW

Note: This Tab is for PCB material and
Laminate Supplier Name and part # (Attach PCB Manufacturer & Location (e.g. ABC
both datasheets below) Company/Bangkok

Old New Old

CB material and/or supplier changes.
facturer & Location (e.g. ABC
Company/Bangkok Glass Transition Temperature (Tg)

New Old New

r changes.
Decomposition Temperature(Td5%) 5% (e.g.
320C, include Td2% if availiable) Time to Delamination, T260/T268

Old New Old

 Cleanliness Standard and Criteria Used (e,g.,
Delamination, T260/T268 ROSE - 5 µg/in2)

New Old New

Curing Agent used (i.e., Dicy or Phenolic) Coefficient of Thermal Expansion, X

Old New Old

nt of Thermal Expansion, X Coefficient of Thermal Expansion, Y

New Old New

Coefficient of Thermal Expansion, Z Laminate Weave Style

Old New Old

minate Weave Style Conductive Adonic Fiber qualified? Yes/No

New Old New

Minimum Average VIA/Through Hole plating Minimum Thin Area VIA/Through Hole plating
thickness(e.g. 25um) thickness(e.g. 20um)

Old New Old

n Area VIA/Through Hole plating
hickness(e.g. 20um) Trace Material & thickness (e.g., cu/1 oz/ft2)

New Old New

Trace Surface Finish & thickness (e.g.,
ENIG/8um, ImAg/10um, etc.)

Old New
Has the new (PCB manufacturer and/or laminate) supplier
been used by the PCB assembler and on the same soldering
line? If so, were they supplied to GM, and if so, what was PCB Drill Chart
the GMW3172 code letters? (attach)
PCB Layout (attach)