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APDL Code For Thermal Analysis of PCB

This document defines a thermomechanical analysis simulation in ANSYS. It specifies the geometry, assigns material properties to different regions, applies boundary conditions and a temperature load, performs the analysis, and post-processes results including stress along defined paths. Rectangular areas made of four materials are modeled. Elastic properties, thermal expansion coefficients and regions are defined. Symmetry and fixed boundary conditions are applied. Temperature is increased and stresses are plotted on paths.

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ASIM RIAZ
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© © All Rights Reserved
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Download as PDF, TXT or read online on Scribd
124 views

APDL Code For Thermal Analysis of PCB

This document defines a thermomechanical analysis simulation in ANSYS. It specifies the geometry, assigns material properties to different regions, applies boundary conditions and a temperature load, performs the analysis, and post-processes results including stress along defined paths. Rectangular areas made of four materials are modeled. Elastic properties, thermal expansion coefficients and regions are defined. Symmetry and fixed boundary conditions are applied. Temperature is increased and stresses are plotted on paths.

Uploaded by

ASIM RIAZ
Copyright
© © All Rights Reserved
Available Formats
Download as PDF, TXT or read online on Scribd
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!!! Reverse Video !!!

/RGB,INDEX,100,100,100, 0
/RGB,INDEX, 80, 80, 80,13
/RGB,INDEX, 60, 60, 60,14
/RGB,INDEX, 0, 0, 0,15
/REPLOT

FINISH
/CLEAR
/FILNAME,Tutorial 8.3
/TITLE, Thermomechanical Analysis
/PREP7

!!! Element properties !!!


! Set element type to PLANE182
! Set element behavior to plane strain

!!! Material properties !!!


! Material 1 - Substrate
MP, EX, 1, 22E9 ! Elastic modulus of material #1 is 22e9
MP, PRXY, 1, 0.39 ! Poisson's ratio of material #1 is 0.39
MP, ALPX, 1, 18E-6 ! Coeff. thermal expansion of mat #1 is 18e-6

! Material 2 - Die-attach
MP, EX, 2, 7.4E9 ! Elastic modulus of material #2 is 7.4e9
MP, PRXY, 2, 0.4 ! Poisson's ratio of material #2 is 0.4
MP, ALPX, 2, 52E-6 ! Coeff. thermal expansion of mat #2 is 52e-6

! Material 3 - Silicon
MP, EX, 3, 163E9 ! Elastic modulus of material #3 is 163e9
MP, PRXY, 3, 0.278 ! Poisson's ratio of material #3 is 0.278
MP, ALPX, 3, 2.6E-6 ! Coeff. thermal expansion of mat #3 is 2.6e-6

! Material 4 - Molding Compound


MP, EX, 4, 15E9 ! Elastic modulus of material #4 is 15e9
MP, PRXY, 4, 0.25 ! Poisson's ratio of material #4 is 0.25
MP, ALPX, 4, 16E-6 ! Coeff. thermal expansion of mat #4 is 16e-6

!!! Geometry !!!


RECTNG, 0, 5e-3, 0, 2E-3 ! Area #1
RECTNG, 5e-3, 7.5e-3, 0, 2E-3 ! #2
RECTNG, 7.5e-3, 10e-3, 0, 2E-3 ! #3
RECTNG, 0, 5e-3, 2E-3, 2.1E-3 ! #4
RECTNG, 5e-3, 7.5e-3, 2E-3, 2.1E-3 ! #5
RECTNG, 0, 5e-3, 2.1E-3, 3.1E-3 ! #6
RECTNG, 5e-3, 7.5e-3, 2.1E-3, 3.1E-3 ! #7
RECTNG, 0, 5e-3, 3.1E-3, 4.1E-3 ! #8
RECTNG, 5e-3, 7.5e-3, 3.1E-3, 4.1E-3 ! #9

! Glue all areas

!!! Meshing !!!


! Specify mapped meshing to be used
! Mesh all areas

!!! Define Material Regions !!!


/PNUM,AREAS,1 ! Turn on area numbering
APLOT ! Plot areas
! Select areas associated with molding compound (Areas #14-
17)
ESLA,S ! Select elements associated with selected areas
EMODIF,[...] ! Modify attributes of all selected elements, assigning
material #4

! Select area associated with die-attach (Area #11)


ESLA,S ! Select elements associated with selected area
EMODIF,[...] ! Modify attributes of all selected elements, assigning
material #2

! Select area associated with silicon (Area #13)


ESLA,S ! Select elements associated with selected area
EMODIF,[...] ! Modify attributes of all selected elements, assigning
material #3

! Select everything

!!! Boundary conditions !!!


! Select nodes at line of symmetry (x=0)
! Apply DOF constraint on all selected nodes in x-
displacement

! Reduce selection to bottom-left node (y=0)


! Apply DOF constraint on all selected nodes in y-
displacement

TUNIF,[...] ! Apply a uniform temperature of 30 (degrees C)

! Select everything

!!! Solution !!!


! Enter solution processor
! Solve
! Exit solution processor

!!! Postprocessing !!!


! Enter postprocessor

! Plot Deformed and Undeformed edge


! Plot nodal stress in y-direction
! Plot nodal stress in xy-plane (shear stress)

!!! PATHS SECTION (EXTRA CREDIT) !!!


/EOF ! REMOVE THIS LINE ONCE YOU REACH THIS POINT !
PATH,V1,[...] ! Create path V1
PPATH,[...] ! Define point 1 at location (x,y) = (5e-3,4.1e-3)
PPATH,[...] ! Define point 2 at location (x,y) = (5e-3,0)

PATH,V2,[...] ! Create path V2


PPATH,[...] ! Define point 1 at location (x,y) = (2.67e-3,4.1e-3)
PPATH,[...] ! Define point 2 at location (x,y) = (2.67e-3,0.0)

PATH,V2 ! Activate (recall) Path V2


PDEF,SY_V2,[...] ! Map onto path V2 - y-component of stress
PDEF,SXY_V2,[...] ! Map onto path V2 - xy-component of stress
PDEF,SEQV_V2,[...] ! Map onto path v2 - von mises (equivalent) stress

PLPATH,[...] !Plot path v2 items (y-stress, xy-stress, von mises stress)


! Repeat for PATH V1
PATH,V1 ! Activate (recall) Path V1
PDEF,SY_V1,[...] ! Map onto path V1 - y-component of stress
PDEF,SXY_V1,[...] ! Map onto path V1 - xy-component of stress
PDEF,SEQV_V1,[...] ! Map onto path v1 - von mises (equivalent) stress

PLPATH,[...] !Plot path v1 items (y-stress, xy-stress, von mises stress)

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