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Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER

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 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

Freescale Semiconductor, Inc. Quarter 3, 2015

SG187 Rev. 59

Automotive Selector Guide

Making embedded systems better

with robust reliable performance
 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

Contents
PRODUCTS Sub category
Analog and Mixed Signal Power Actuation - Low-side Switches Page 4
Power Actuation - High-side Switches Page 5
Power Actuation - H-Bridge and Motors Drivers Page 7
Power Actuation - H-Bridge Stepper Motors Page 8
Power Actuation - Pre-Drivers (High-side MOSFET Gate Drivers) Page 8
Power Actuation - Squib Drivers Page 8
Power Actuation - Powertrain Control and Engine Management Page 8
Communication Transceivers - CAN Physical Interface Components Page 11
Communication Transceivers - LIN, ISO-9141, J-1850 Physical Interface Components Page 11
Communication Transceiver - Distributed Systems Interface (DSI) Components Page 12
Millimeter Wave and Radar Page 12
Anti-Lock Braking System Page 13
Drivers and Switches - Configurable I/O Page 13
System Basis Chip Page 13
Battery Management - Battery Cell Controller Page 15
Embedded MCU plus Power - S12 Mixed-Signal Analog MCUs Page 15
S12 Mixed-Signal Analog MCUs Page 16
8-bit Intelligent Distributed Controllers Page 16

Power Management Power Management - Linear Regulators Page 17

Power Management - Switching Regulators Page 17
Automotive Alternator Voltage Regulators Page 17

Sensors Pressure Sensors Page 18

Barometric Absolute Pressure (BAP) and Manifold Absolute Pressure (MAP) Sensors Page 18
Inertial Sensors Page 19
Tire Pressure Monitoring Systems Page 21

Access and Remote Control GPS Downconverter Page 22

Local Interconnect Network (LIN) LIN Software Products Page 23

LIN Physical Layer Transceivers Page 23
Solutions

SG187 (Selector Guide) (3Q2015) – 2

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
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PRODUCTS Sub category

MCU 8-bit S08 MCUs Page 25
S12 and S12X Families Page 27
S12 MagniV Mixed-signal MCUs Page 30
56F8xxx Family Page 32
Kinetis MCUs based on ARM® Technology Page 32
MAC57Dxxx 32-bit ARM®-Based MCUs Page 33
64-bit S32V MCUs Based on ARM® Technology Page 35
32-bit MPC56xx and MPC57xx MCUs Built on Power Architecture® Technology Page 35
Image Cognition Processors Page 40
i.MX Applications Processors Page 41
32-bit Vybrid Controller Solutions Page 42

SG187 (Selector Guide) (3Q2015) – 3

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Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
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Freescale Semiconductor Analog and Mixed-Signal Products

The product categories range from Power Actuation and Communication Benefits—Freescale Semiconductor SMARTMOS technology brings a wide range of
Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation benefits to today’s designs, including component reductions, power capability,
covers a broad range of load control and drivers, including motor control. durability, efficiency, precision, high-performance analog, and robustness.
SMARTMOS—Freescale Semiconductor SMARTMOS technology allows designers Packaging - Freescale device may be offered in EPP and RoHS compliant packages;
to interface high-precision components with the harsh automotive environment. view the external web for specifics.
Cost-Effective—Ideally suited for rug automotive applications, SMARTMOS solutions For additional information, visit:
offer a cost-effective blend of analog, digital, and robust power silicon that enables Documentation, Tool, and Product Libraries 
integrated, mixed signal, power control ICs. www.freescale.com
Functionality—SMARTMOS solutions implement traditional analog functions with www.freescale.com/analog
smaller die size, and a modular process produces components with the minimum www.freescale.com/powermanagement
number of process steps for each circuit, minimizing overhead. www.freescale.com/productlongevity
www.freescale.com/files/shared/doc/ prod_num_scheme/ANALOGPN.pdf

Power Actuation — Low-side Switches (Solid State Intelligent Switches)

Product Description No of High-side Continuous RDS(on) (m) Current Current Control1 Status/ Protection Features Packaging Status
Output or Low- Current Each of Each Limitation Limitation Fault
s side Output (A) Output (A) Standby Max Reporting
(A)
MC33800 Engine Control IC, with Eight Low-side Switches, 8 L 8 @ 0.35 2 @ 700 2 @ 6.0 30 SPI, SPI Open Load detect, 54-pin SOICW Production
Two Constant Current Low-side Switches and 6 @ 1000 6 @ 2.0 Parallel Overcurrent protect, Exposed Pad EVB
Six MOSFET gate pre-drivers Overvoltage protect,
Shorted Load detect,
Undervoltage protect,
Thermal protect
MC33810 Engine Control Integrated Circuit capable of 4 L 1.0 100 6.0 30 SPI, SPI Status Shorted Load detect, 32-pin SOICW Production
driving a combination of four Low-side loads and Parallel Flags Thermal protect Exposed Pad EVB
four MOSFETs or IGBT gates
MC33812 Engine control power IC, with 3 Low-side drivers, 3 L 2 @ 4.0 2 @ 200 2 @ 6.0 2 @ 1000 Parallel Parallel Overcurrent, 32-pin SOICW Production
one pre-driver, +5V pre-regulator, ISO-9141 1 @ 1.5 1 @ 1000 1 @ 2.0 1 @ 20 Outputs Short to Battery, Exposed Pad EVB
physical interface and MCU watchdog circuit. Overtemperature Protect Ref.Design
MC33879 (1.0 RDS(on)) Configurable Eight Output SPI 8 H/L 0.35 550 1.2 25 SPI w/ SPI Short-circuit, Current 32-pin SOICW Production
Controlled Switch 2 PWM Limit, Temp Sense Exposed Pad EVB
MC33882 (0.8 RDS(on) Smart Six Output Switch with SPI 8 L 1.0 375 3.0 10 SPI SPI Short-circuit, Current 30-pin HSOP, Production
and Parallel Input Control Limit, Temp Sense 32-pin SOICW
Exposed Pad,
32-pin QFN
Exposed Pad
MC33996 16 Output Hardware Low-side Switch with 24-bit 16 L 0.5 450 1.0 to 2.5 50 SPI SPI Short-circuit, Current 32-pin SOICW Production
Serial Input Control Limit, Temp Sense, Open EVB
Load
MC33999 16 Output Hardware Low-side Switch with 24-bit 16 L 0.5 450 1.0 to 2.5 50 SPI. SPI Short-circuit, Current 54-pin SOICW Production
Serial Input Control and 8 Parallel Control Parallel Limit, Temp Sense, Open EVB
Load
1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards.

SG187 (Selector Guide) (3Q2015) – 4

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Power Actuation — High-side Switches (Solid State Intelligent Switches)

Product Description No of High-side Maximum Current RDS(on) (m) Current Current Control Status/Fault Protection Features Packaging Status
1
Outputs or Low- Each Output (A) of Each Limitation Limitation Reporting
side Output (A) Standby Max (A)
MC33879 (1.0 RDS(on)) Configurable Eight 8 H/L 1.2 550 1.2 25 SPI w/ SPI Short-circuit, Current Limit, 32-pin SOICW Production
Output SPI Controlled Switch 2 PWM Temp Sense Exposed Pad EVB

MC12XS2 12 V Multipurpose Low RDS(on) eXtreme Switches

MC33981 Single High-side Switch (4.0 m), with 1 H 40 4 100 5.0 Parallel Status Pin, Over-current, Over- 16-pin PQFN Production
PWM, Protection and Diagnostics Current Monitor, temperature, Short-circuit,
Temperature Under-voltage Lock Out
MC33982 Self Protected 2.0 m Switch with 1 H 60 2 150 5.0 SPI and SPI Temp Sense, Over/Under- 16-pin PQFN Production
Diagnostic and Protection Parallel voltage, Shutdown, Over- EVB
current, Reverse Polarity,
Current Recopy
MC33984 Self Protected 4.0 m Switch with 2 H 30 4 100 5.0 SPI and SPI Temp Sense, Over/Under- 16-pin PQFN Production
Diagnostic and Protection Parallel voltage, Shutdown, Over- EVB
current, Reverse Polarity,
Current Recopy
MC33988 Self Protected 8.0 m Switch with 2 H 30 8 60 5.0 SPI and SPI Temp Sense, Over/Under- 16-pin PQFN Production
Diagnostic and Protection Parallel voltage, Shutdown, Over- EVB
current, Reverse Polarity,
Current Recopy
MC12XS3 12V Automotive Exterior Lighting Multichannel eXtreme Switches
MC06XS3517 Penta High-side Switch (3 x 6m,  5+1 H 2.8, 5.5 3 X 6, 2 X 17 48, 96 5.0 SPI and SPI Overcurrent, Overtemperature, 24-pin PQFN Production
2 x 17 m), with PWM, Protection, Parallel Overvoltage, Undervoltage & EVB
Diagnostics and SPI Control. Also, 1 Short-circuit protect
logic level output driver.
MC07XS3200 Dual High-side Switch (2 x 7m), with 2 H 6.0 2X7 93 5.0 SPI and SPI Fail-safe Mode, Overcurrent 32-pin SOICW Production
PWM, Protection, Diagnostics and SPI Parallel Shutdown, Overtemperature, Exposed Pad
Control Short-circuit
MC09XS3400 Quad High-side Switch (4 x 9m), with 4 H 6.0 4X9 89 5.0 SPI and SPI Fail-safe Mode, Overcurrent 24-pin PQFN Production
PWM, Protection, Diagnostics and SPI Parallel Shutdown, Overtemperature, EVB
Control Short-circuit
MC10XS3412 Quad High-side Switch (2 x 10 m,  4 H 6.0 2 x 10, 2 x 12 78 5.0 SPI and SPI Fail-safe Mode, Overcurrent 24-pin PQFN Production
2 x 12 m), with PWM, Protection, Parallel Shutdown, Overtemperature, EVB
Diagnostics and SPI Control Short-circuit
MC10XS3425 Quad High-side Switch (2 x 10 m,  4 H 6.0 2 X 10, 2 X 25 39, 78 5.0 SPI and SPI Fail-safe Mode, Overcurrent 32-pin SOICW Production
2 x 25m), with PWM, Protection, Parallel Shutdown, Overtemperature, Exposed Pad EVB
Diagnostics and SPI Control Short-circuit
MC10XS3435 Quad High-side Switch (2 x 12 m, 4 H 6.0 2 x 10, 2 x 35 78 5.0 SPI and SPI Fail-safe Mode, Overcurrent 24-pin PQFN Production
2 x 35 m), with PWM, Protection, Parallel Shutdown, Overtemperature, EVB
Diagnostics and SPI Control Short-circuit
MC10XS3535 Penta High-side Switch (3 x 10 m, 5+1 H 2.8, 5.5 3x10, 2x35 44, 88 2.0 SPI and SPI Fail-safe Mode, Overcurrent 24-pin PQFN Production
2 x 35 m), with PWM, Protection, Parallel Shutdown, Overtemperature, EVB
Diagnostics and SPI Control. Also, 1 Short-circuit
logic level output driver.
MC15XS3400 Quad High-side Switch (4 x 15 m), 4 H 6.0 15 78 5.0 SPI and SPI Fail-safe Mode, Overcurrent 24-pin PQFN Production
with PWM, Protection, Diagnostics and Parallel Shutdown, Overtemperature, EVB
SPI Control Short-circuit
MC35XS3400 Quad High-side Switch (4 x 35 m), 4 H 6.0 35 39 5.0 SPI and SPI Fail-safe Mode, Overcurrent 24-pin PQFN Production
with PWM, Protection, Diagnostics and Parallel Shutdown, Overtemperature, EVB
SPI Control Short-circuit
MC35XS3500 Penta High-side Switch (5 x 35 m), 5+1 H 2.8 35 39.5 2.0 SPI and SPI Fail-safe Mode, Overcurrent 24-pin PQFN Production
with PWM, Protection, Diagnostics and Parallel Shutdown, Overtemperature, EVB
SPI Control. Also, 1 logic level output Short-circuit
driver.
MC12XS6 External Automotive Lighting Multichannel Scalable eXtreme Switches

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Power Actuation — High-side Switches (Solid State Intelligent Switches) (continued)

Product Description No of High-side Maximum Current RDS(on) (m) Current Current Control Status/Fault Protection Features Packaging Status
1
Outputs or Low- Each Output (A) of Each Limitation Limitation Reporting
side Output (A) Standby Max (A)
MC07XS6517 Penta High-side Switch (3 x 7 m2x 5+1 H 11, 5.5 3 x 17 100, 50 20 SPI SPI Fail-safe Mode, Overcurrent 54-pin SOICW Production
17 m), with PWM, Protection, 2x7 Parallel Shutdown, Overtemperature, Exposed Pad EVB
Diagnostics and SPI Control. Also, 1 Short-circuit
logic level output driver.
MC08XS6421 Quad High-side Switch (2 x 8 m2x 4+1 H 11, 5.5 2 x 8.0 100, 50 20 SPI SPI Fail-safe Mode, Overcurrent 32-pin SOICW Production
21 m), with PWM, Protection, 2 x 21.0 Parallel Shutdown, Overtemperature, Exposed PAD EVB
Diagnostics and SPI Control. Also, 1 Short-circuit
logic level output driver
MC17XS6400 Quad High-side Switch (4 x 17 m), 4+1 H 5.5 4 x 17 50 20 SPI SPI Fail-safe Mode, Overcurrent 32-pin SOICW Production
with PWM, Protection, Diagnostics and Parallel Shutdown, Overtemperature, Exposed PAD EVB
SPI Control. Also, 1 logic level output Short-circuit
driver
MC17XS6500 Penta High-side Switch (5 x 17 m), 5+1 H 5.5 5 x 17 50 20 SPI SPI Fail-safe Mode, Overcurrent 32-pin SOICW Production
with PWM, Protection, Diagnostics and Parallel Shutdown, Overtemperature, Exposed Pad EVB
SPI Control. Also, 1 logic level output Short-circuit
driver.
MC10XS6200 Dual High-side Switch (2 x 10 m), 2+1 H 9 2 x 10 85 20 SPI SPI Fail-safe Mode, Overcurrent 32-pin SOICW Production
with PWM, Protection, Diagnostics and Parallel Shutdown, Overtemperature, Exposed Pad EVB
SPI Control. Also, 1 logic level output Short-circuit
driver
MC10XS6225 Dual High-side Switch (1 x 10 m1 x 2+1 H 9, 4.5 1 x 10 85, 40 20 SPI SPI Fail-safe Mode, Overcurrent 32-pin SOICW Production
25 m), with PWM, Protection, 1 x 25 Parallel Shutdown, Overtemperature, Exposed Pad EVB
Diagnostics and SPI Control. Also, 1 Short-circuit
logic level output driver
MC10XS6325 Triple High-side Switch (2 x 10 m, 3+1 H 9, 4.5 2 x 10 85, 40 20 SPI SPI Fail-safe Mode, Overcurrent 32-pin SOICW Production
1 x 25 m), with PWM, Protection, 1 x 25 Parallel Shutdown, Overtemperature, Exposed Pad EVB
Diagnostics and SPI Control. Also, 1 Short-circuit
logic level output driver
MC25XS6300 Triple High-side Switch (3 x 25 m), 3+1 H 4.5 3 x 25 40 20 SPI SPI Fail-safe Mode, Overcurrent 32-pin SOICW Production
with PWM, Protection, Diagnostics and Parallel Shutdown, Overtemperature, Exposed Pad EVB
SPI Control. Also, 1 logic level output Short-circuit
driver
MC40XS6500 Penta High-side Switch (5 x 40 m), 5+1 H 3.9 5 x 40 35 20 SPI SPI Fail-safe Mode, Overcurrent 32-pin SOICW Production
with PWM, Protection, Diagnostics and Parallel Shutdown, Overtemperature, Exposed Pad EVB
SPI Control. Also, 1 logic level output Short-circuit
driver
MC24XS4 External Automotive Lighting Multichannel Scalable eXtreme Switches
MC06XS4200 Dual High-side Switch (2 x 6 m), with 2 H 9.0 2X6 30, 90 10 SPI and SPI Fail-safe Mode, Overcurrent 24-pin PQFN Production
PWM, Protection, Diagnostics and SPI Parallel Shutdown, Overtemperature, EVB
Control (24 V) Short-circuit, Parallel operation
MC10XS4200 Dual High-side Switch (2 x 10 m), 2 H 6.0 2 X 10 18, 55 10 SPI and SPI Fail-safe Mode, Overcurrent 24-pin PQFN Production
with PWM, Protection, Diagnostics and Parallel Shutdown, Overtemperature, EVB
SPI Control (24 V) Short-circuit, Parallel operation
MC20XS4200 Dual High-side Switch (2 x 20 m), 2 H 3.0 2 X 20 9.0, 27 10 SPI and SPI Fail-safe Mode, Overcurrent 24-pin PQFN Production
with PWM, Protection, Diagnostics and Parallel Shutdown, Overtemperature, EVB
SPI Control (24 V) Short-circuit, Parallel operation
MC22XS4200 Dual High-side Switch (2 x 22 m), 2 H 3.0 2 X 22 9.0, 27 10 SPI and SPI Fail-safe Mode, Overcurrent 32-pin SOIC Production
with PWM, Protection, Diagnostics, Parallel Shutdown, Overtemperature, Exposed Pad EVB
and SPI Control (24 V) Short-circuit, Parallel operation
MC50XS4200 Dual High-side Switch (2 x 50 m), 2 H 1.2 2 x 50 3.5, 11 10 SPI and SPI Fail-safe Mode, Overcurrent 32-Pin SOIC Production
with PWM, Protection, Diagnostics, Parallel Shutdown, Overtemperature, Exposed Pad EVB
and SPI Control (24 V) Short-circuit, Parallel operation
1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards.

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Power Actuation — H-Bridge and Motors Drivers

Product Description Main Characteristics No of RDS(on) (m) of Current Limit Sleep Current Max Control1 Status/Fault Protection Features Packaging Status
Outputs Each Output Threshold Reporting
Typical at 25 C Max (A)
MC33186 H-Bridge Driver (5.0 A) Monolithic H-Bridge ideal for 2 150 7.8 — Parallel Status Flag Short-circuit, 20-pin HSOP Production
fractional horsepower DC- Current Limit,
motor and bi-directional thrust Overtemperature,
solenoid control. Load can be Undervoltage
PWM'ed up to 10 kHz
MC33879 (1.0 RDS(on)) Configurable 8-output hardware 8 750 1.2 5 µA SPI w/2 SPI Short-circuit, Current Limit, 32-pin SOICW Production
Eight Output SPI Controlled configurable, high-side/ low- PWM Overtemperature, Open load Exposed Pad EVB
Switch side switch with 16-bit serial detection, Overvoltage
input control using SPI with up
to 1.2 A current driving
capability
MC33880 Configurable Eight Output SPI 8-output hardware 8 550 2.0 5 µA SPI w/2 SPI Short-circuit, Current Limit, 32-pin SOICW Production
Controlled Switch configurable, high-side/ low- PWM Overtemperature, Open load EVB
side switch with 16-bit serial detection, Overvoltage
input control using SPI with up
to 2.0 A current driving
capability
MC33886 H-Bridge Driver (5.2 A) Monolithic H-Bridge ideal for 2 120 7.8 — Parallel Status Flag Short-circuit, 20-pin HSOP Production
fractional horsepower DC- Current Limit, EVB
motor and bi-directional thrust Overtemperature,
solenoid control. Load can be Undervoltage
PWM'ed up to 10 kHz
MC33887 H-Bridge Driver with Sleep Mode Monolithic H-Bridge ideal for 2 120 7.8 50 A Parallel Status Flag Short-circuit, 20-pin HSOP, Production
and current feedback (5.0 A) fractional horsepower DC- Current Limit, 36-pin PQFN, EVB
motor and bi-directional thrust Overtemperature, 54-pin SOICW
solenoid control. Load can be Undervoltage Exposed Pad
PWM'ed up to 10 kHz
MC33899 Programmable H-Bridge Power H-Bridge with SPI based 2 — 10.6 145 A SPI and SPI Open Circuit detect, Undervoltage, 30-pin HSOP Production
IC diagnostics and configurability Parallel Overtemperature Shutdown,
designed to drive a DC motor Output Short-circuit Current Limit
in both forward and reverse
shaft rotation under Pulse
Width Modulation (PWM) of
speed and torque
MC33926 5.0 A Throttle Control H-Bridge H-Bridge power IC for DC 2 120 8.0 50 A Parallel Status Flag Output Short-circuit Protect, 32-pin PQFN Production
servo motor control like Overcurrent Limit, Overtemperature EVB
engine throttle control. Load
can be PWM’ed up to 20 kHz.
MC33931 5.0 A Throttle Control H-Bridge H-Bridge power IC for DC 2 120 8.0 50 A Parallel Status Flag Output Short-circuit Protect, 44-pin HSOP, Production
servo motor control like Overcurrent Limit, Overtemperature 32-pin SOICW EVB
engine throttle control. Load with Exposed
can be PWM'ed up to 11 kHz Pad
MC33932 5.0 A Throttle Control Dual H- H-Bridge power IC for DC 4 120 8.0 50 A Parallel Status Flag Output Short-circuit Protect, 44-pin HSOP, Production
Bridge servo motor control like Overcurrent Limit, Overtemperature 54-pin SOICW EVB
engine throttle control. Load with Exposed
can be PWM'ed up to 11 kHz Pad
HB2000 10 A H-Bridge, Programmable H-Bridge power IC for brushed 2 — SPI selectable 50 A SPI, SPI, Charge pump undervoltage, 32-pin PQFN 4Q 2015
Brushed DC Motor Driver DC motor control. Load can 5.1/6.7/8.4/ Parallel Status Flag overvoltage, and undervoltage on FRDM
be controlled via parallel 10.3 VPWR, short to ground and short to EVB
inputs as well as SPI with VPWR for each output, open load, Planned
advanced diagnostic to meet temperature warning, and
ISO26262 functional safety overtemperature shutdown
standards
HB2001 10 A H-Bridge, Programmable H-Bridge power IC for brushed 2 — SPI selectable 50 A SPI, SPI, Charge pump undervoltage, 32-pin PQFN 4Q 2015
Brushed DC Motor Driver DC motor control. Load can 5.1/6.7/8.4/ Parallel Status Flag overvoltage, and undervoltage on FRDM
be controlled via parallel 10.3 VPWR, short to ground and short to EVB
inputs as well as SPI with VPWR for each output, open load, Planned
advanced diagnostic to meet temperature warning, and
ISO26262 functional safety overtemperature shutdown
standards
1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards.

SG187 (Selector Guide) (3Q2015) – 7

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
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Power Actuation — H-Bridge Stepper Motors

Product Description Main Characteristics Operating Voltage (V) Packaging Status
MM908E626 Stepper Motor Control, Quad Half-Bridge with Embedded MCU Voltage Regulator 5.0 V/60 mA, LIN Physical Layer with Selectable 5.0 to 28 54-pin SOICW Production
and LIN for High Temperature TJ = 135 C Slewrates Exposed EVB (‘625)
Pad

Power Actuation — Pre-Drivers (High-side MOSFET Gate Drivers)

Product Description Main Characteristics Operating Control1 Output Drives Status Protection Features Packaging Status
Voltage (V) High/Low-side, Reporting
Drive Current
MC33800 Engine Control Integrated Circuit Engine control IC, with six MOSFET gate pre-drivers, eight 5.0 to 36 Parallel, SPI 6 H, 2 mA (typ.) SPI Open Load detect, 54-pin SOICW Production
low-side Switches, and two constant current low-side Overcurrent, Overvoltage, Exposed Pad EVB
switches Shorted Load detect,
Undervoltage, Thermal
MC33810 Automotive Engine Control IC Engine control IC with four MOSFET/IGBT gate drivers 4.5 to 36 Parallel, SPI 4 L, 780 A (typ.) SPI, Status Shorted Load detect, 32-pin SOICW Production
and four low-side switches Flags Thermal Exposed Pad EVB
MC33812 Single cylinder Engine control IC. Engine control power IC, with 3 Low-side drivers, one pre- 4.5 to 36 Parallel 2L, 4.0 A (typ.) Parallel Overcurrent, 32-pin SOICW Production
driver, +5.0 V pre-regulator, ISO-9141 physical interface 1L, 1.5 A (typ.) Outputs Short to Battery, Exposed Pad EVB
and MCU watchdog circuit. Overtemperature Protect Ref.Design
MC33883 Quad TMOS driver, for fuel injector Quad TMOS driver, in H-Bridge configuration 5.5 to 28/55 4 non-invert n/a None Overvoltage, Undervoltage 20-pin SOICW Production
CMOS, LSTTL EVB
logic
MC33937 Three-Phase Field Effect Transistor Pre- Triple High-side and Low-side FET pre-drivers, with 8.0 to 58 Parallel, SPI 3 H, 3 L, 1.0 A SPI Programmable Deadtime, 54-pin SOICW Production
driver parallel & SPI control and programmable deadtime (shoot- (typ.) Reverse Charge Injection Exposed Pad EVB
through protect).
GD3000 Three Phase Field Effect Transistor Pre- Triple High-side and Low-side FET pre-drivers, with 8.0 to 58 Parallel, SPI 3 H, 3 L, 1.0 A SPI Programmable Deadtime, 56-pin QFN Production
driver parallel & SPI control and programmable deadtime (shoot- (typ.) Reverse Charge Injection EVB
through protect)
1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Board.

Power Actuation — Squib Drivers

Product Description Main Characteristics Regulation Voltage Operating Voltage Packaging Status
(V)
MC33797 Four Channel Squib Driver IC Four-Channel High-side and Low-side 2.0 A FET Switches, Externally Adjustable FET Current Limiting, 7.0 to 35 4.75 to 5.25 32-pin Production
Adjustable Current Limit Range: 0.8 A to 2.0 A, 8-bit SPI for Diagnostics and FET Switch Activation, SOICW Ref. Design
Diagnostics for High-side Safing Sensor Status

Power Actuation — Powertrain Control and Engine Management

Product Description Main Characteristics Peak Current Limit RDS(on) Control1 Operating Voltage (V) Packaging Status
(A) (m)
MC33800 Engine Control Integrated Circuit Engine control IC, with six MOSFET gate pre-drivers, 2 @ 6.0 2 @ 700 SPI, 5.0 to 36 54-pin Production
eight Low-side Switches, and two constant current Low- 6 @ 2.0 6 @ 1000 Parallel SOICW EVB
side Switches. 1 @ 2.8 1 @ 250 Exposed Pad
1 @ 1.0 1 @ 1000
MC33810 Automotive Engine Control IC Engine control IC with four MOSFET/IGBT gate drivers 6.0 100 SPI, 4.5 to 36 32-pin Production
and four Low-side Switches. Parallel SOICW EVB
Exposed Pad
MC33811 Solenoid Monitor Integrated Circuit 5 input solenoid monitoring to verify proper electrical — — SPI 10.5 to 15.5 16-pin SOICW Production
See Signal Conditioning and mechanical solenoid operation. EVB
MC33812 Single cylinder Engine control IC Engine control power IC, with 3 Low-side drivers, one 2 @ 6.0 2@200 Parallel 4.5 to 36 32-pin Production
pre-driver, +5V pre-regulator, ISO-9141 physical 1 @ 2.0 1@1000 SOICW EVB
interface and MCU watchdog circuit. Exposed Pad Ref.Design
MC33813 One Cylinder Small Engine Control IC Engine control analog power IC intended for one 1 @ 3.0 1 @ 400 SPI, 6.0 to 18 48-pin Production
cylinder motorcycle and other small engine control 1 @ 6.0 1 @ 300 Parallel LFQP, EVB
applications. Includes ISO9141 communication 2 @ 2.4 2 @ 1500 Exposed Pad
interface. 1 @ .110 1 @ 20000

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 Distributor of NXP Semiconductors: Excellent Integrated System Limited
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Product Description Main Characteristics Peak Current Limit RDS(on) Control1 Operating Voltage (V) Packaging Status
(A) (m)
MC33814 Two Cylinder Small Engine Control IC Engine control analog power IC intended for two 2 @ 3.0 2 @ 400 SPI, 6.0 to 18 48-pin Production
cylinder motorcycle and other small engine control 1 @ 6.0 1 @ 300 Parallel LFQP, EVB
applications. Includes ISO9141 communication 2 @ 2.4 2 @ 1500 Exposed Pad
interface. 1 @ .110 1 @ 20000
MC33816 Engine Control IC with Smart Gate Control A 12-channel gate driver IC for automotive engine SPI 9.0 to 16 64-pin Production
control applications. The IC consist of five external Parallel LQFP EVB
MOSFET high-side pre-drivers and seven external Exposed Pad
MOSFET low side pre-drivers. Also contains four - -
independent and concurrent digital microcores
PT2000 Programmable Solenoid Controller for The PT2000 is a programmable gate driver IC for - - SPI 5.0 to 36 80-pin LQFP 4Q 2015
Automotive/Truck Engine (Direct Injection) precision solenoid control applications. The chip Parallel EVB
Control integrates six microcores used to control, seven external
MOSFET high-side pre-drivers, eight external MOSFET
low-side pre-drivers (two of them with higher switching
frequency can be used for DC/DC converters), integrated
end of injection detection, current measurement, and
diagnostics and protection for both high-side and low-side.
MC33899 Programmable H-Bridge Power IC Designed to drive a DC motor in both forward and 15.0 90 SPI, 6.0 to 26.5 30-pin Production
reverse shaft rotation under pulse-width modulation Parallel HSOP
(PWM) of speed and torque. Can be controlled by SPI
or parallel control lines.
MC33926 5.0 A Throttle Control H-Bridge H-Bridge power IC for DC servo motor control like engine 8.0 120 Parallel 8.0 to 28 32-pin Production
throttle control. Load can be PWM’ed up to 20 KHz PQFN EVB
MC33937 Three-Phase Field Effect Transistor Pre- Triple High-side and Low-side FET pre-drivers, with — — SPI, 8.0 to 58 54-pin Production
Driver parallel & SPI control and programmable deadtime Parallel SOICW EVB
(shoot-through protect). Exposed Pad
MC33975 22 input Multiple Switch Detect Interface 22 inputs contact monitoring (14 GND, 8 configurable),  — — SPI 5.5 to 26.5 32-pin Production
with 32 mA Wetting Current and Wake-up 4.0 mA or 32 mA pulse wetting current, low-power SOICW EVB
See Signal Conditioning mode interrupt capability, wake-up. Can supply current Exposed Pad
to external sensors.
1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards.

SG187 (Selector Guide) (3Q2015) – 9

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

Communication Transceivers — CAN Physical Interface Components

Product Description Main Characteristics Bus Type and Operating Current Other Features Control and Protection Packaging Status
Standard Voltage Limitation Standby Status Features
(V) (A) Reporting1
Typ. Max.
CM0902 Dual High-Speed CAN Transceiver The CM0902 is a dual high-speed CAN Dual CAN HS dual 4.5 to 5.5 - 15 CAN bus wake-up, 3.3 or 5.0 V Parallel High system ESD 14-pin SOICN Production
transceiver device, providing the physical wire MCU I/O, TXD dominant time- spec. EVB
interface between the CAN protocol out
controller of an MCU and the physical dual
wire CAN bus. Both channels are
completely independent, featuring CAN
bus wake-up on each CAN interface, and
TXD dominant timeout functionality
MC33897 Single-wire CAN Low or high (33.3 kbps or 83.3) kbps Single-wire CAN 6.0 to 27 45 60 Regulator Control Output 2 Mode Thermal 14-pin SOICN Production
data rates, wake-up capability Waveshaping, Undervoltage Control Pins shutdown, current
(GMW3089 v2.3 compatible) lockout detect and loss limit
of GND
MC33901 High-Speed CAN Transceiver Single CAN high-speed physical layer CAN HS dual 4.5 to 5.5 - 5.0 CAN bus wake-up. TXD Parallel High system ESD 8-pin SOICN Production
provides operation up to 2 Mbps and the wire dominant timeout, 3.3 or 5.0 spec. EVB
physical interface between an MCU and V MCU I/O
the physical dual wires of the CAN bus.
1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards.

SG187 (Selector Guide) (3Q2015) – 10

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

Communication Transceivers — LIN, ISO-9141, J-1850 Physical Interface Components

Product Description Main Characteristics Bus Type Operating Current Other Control and Protection Packaging Status
and Standard Voltage Limitation Standby Features Status Features
(V) (A) Reporting1
Typ. Max.
MC33399 Local Interconnect Network (LIN) Offers speed communication from 1.0 LIN Single-wire 7.0 to 18 20 50 Wake-up input pin, control Parallel Current 8-pin SOICN Production
Physical Layer kbps to 20 kbps, and up to 60 kbps for of external voltage limitation, EVB
Programming Mode. It supports LIN regulator Thermal
Protocol Specification 1.3. protection
MC33660 ISO K Line Serial Link Interface ISO9141 physical interface device ISO9141 8.0 to 18 — 50 Data rates up to 50 Kbps Serial Output short- 8-pin SOICN Production
circuit EVB
Thermal
protection
MC33661 eLIN – Enhanced LIN Physical Layer Selectable slew rate for operations at LIN Single-wire 7.0 to 18 8.0 12 Compatibility with 5.0 V Parallel Current 8-pin SOICN Production
(Local Interconnect Network) 10, 20, 100 kbps; bus short to ground and 3.3 V micros, wake-up limitation, EVB
fail-safe; excellent EMC behavior. input control of external Thermal
regulator protection
MC33662 LIN 2.1/SAE J2602-2 LIN Physical Single wire LIN supports normal baud LIN single wire, 7.0 to 18 6.0 11 Active bus waveshaping, Parallel Current 8-pin SOICN Production
Layer Transceiver rates of 10 kbps (J) or 20 kbps (L) and SAE J2602- EMI immunity, Local & limitation, EVB
fast rate of 100 kbps Remote wakeup Thermal
protection
MC33663 LIN 2.1 / SAEJ2602-2 Dual LIN Integrates two physical layer LIN bus LIN Single-wire, 7.0 to 18 12 36 Active bus waveshaping, Parallel Over- 14-pin SOICN Production
Physical Layer Transceivers transceivers. The devices offer baud SAE J2602-2 EMI immunity, 2 wake-up temperature
rates of 10 and 20 kbps as well as input pins, Compatibility protection,
100 kbps for test/programming modes. with 5.0 V and 3.3 V micros Output short-
circuit
MC33664 Isolated Network High Speed 2.0 Mbps isolated network Dual wires 4.75 to 5.5 30 50 3.0 V and 5.0 V compatible, SPI Current 16-pin SOICN 1Q 2016
Transceiver communication rate, Dual SPI (VCC5) low sleep mode current limitation on EVB
architecture for message confirmation, 3.1 to 5.5 with automatic bus wake RDTX+ and
Robust conducted and radiated (VIO) up, current limit protection RDTX-
immunity with wake-up, 3.3 V and 5.0 V Termination
compatible logic thresholds, Engineered and
for 5.0 meter, 15 node system, Low Termination
sleep mode current with automatic bus verification of
wake-up, Ultra-low radiated emissions CSB_TX,
SCLK_TX,
DATA_TX,
and CSB_RX,
SCLK_RX,
DATA_RX
MC33812 Single cylinder Engine control IC Engine control power IC, with 3 Low- ISO-9141 4.5 to 36 — — MCU watchdog timer, +5V Parallel Overcurrent 32-pin SOICW Production
side drivers, one pre-driver, +5V pre- pre-regulator for MCU, Outputs Short EVB
regulator, ISO-9141 physical interface MCU power on RESET to Battery, Ref.Design
and MCU watchdog circuit. Overtemperat
ure Protect
1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards.

SG187 (Selector Guide) (3Q2015) – 11

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

Communication Transceiver — Distributed Systems Interface (DSI) Components

Product Description Main Characteristics Max Data Rate Operating Bus Sw. Resistance, Packaging Status
Temp Range typ/max ()
(°C)
MC33780 Dual DSI Master with Differential Bus controller for two differential DSI channels. SPI port for uC interface. Variable 150 kbps -40 to +85 n/a 16-pin Production
Drive CRC generation and detection, thermal protection, frequency spreading. SOICW
MC33781 Quad DSI Master with Differential Bus controller for four differential DSI channels. Dual SPI ports for uC and safing 200 kbps -40 to +90 n/an/a 32-pin Production
Drive interfaces. Variable CRC generation and detection, comprehensive fault detection, SOICW
thermal protection, frequency spreading Exposed Pad
MC33784 DSI Sensor Interface DSI slave device optimized as a sensor interface. Differential bus capability & dual n/a -40 to +150 3.0/6.0 16-pin Production
bus switches for improved EMC performance, 2-channel 10-bit ADC, 5.0V SOICN
regulated output, 3 configurable logic pins, CRC generation and checking.
MC33789 Airbag System Basis Chip (IC) Air bag control module which monitors battery voltage, sensor status and supplies 125 kbps -40 to +125 n/a 64-pin Production
(SBC) various voltages to the air bag system. Uses SPI for MCU communication. Uses LQFP EVB
PSI5 for satellite sensors communication. Exposed Pad (contact
sales)
MC33790 Distributed System Interface (DSI) Dual current-limited waveshaped outputs, current sensing inputs, 3.3 V and 5.0 V 5 - 150 kbps -40 to +85 6.0 16-pin Production
Physical Interface (DSIP) SOICW
MC33793 DSI Sensor Interface DSI slave device. 5.0 V regulated output, 4 configurable I/O pins (logic I/O or 8-bit n/a -40 to +125 4.0/8.0 16-pin SOICN Production
ADC), fault tolerant, logic output high current buffer.

Millimeter Wave and Radar

Product Description Main Characteristics Operating Temp Range (°C) Packaging Status
TA= Ambient Temp
TB= Backside of Die Temp
TA TB
MR2001 Multi-channel 77 GHz Radar Scalable number of transmitter and receiver channels -40 to +125 -— 6x6 mm BGA Production
Transceiver Chipset KITRADAR
2001EVM

Anti-Lock Braking System

Product Description Main Characteristics Load Supply Voltage (V) Other Features Interface and Input Protection Features Packaging Status
Min. Max. Control
SB0400 Two Channels Motorcycle and Integrates Safe switch, Valve Drivers, Wheel 5.3 30 Low RDS(on) (160 mOhms), SPI Overcurrent, Open 48-pin 4Q 2015
Scooter ABS in the smallest ABS Speed Sensor Interface, Motor Pump predriver, PWM up to 5 KHz, Low-side Load, QFN-EP
Package and a warning lamp driver inside a small package Drivers up to 5.0 A, Vehicle Overtemperature,
7x7 size, Low RDS(on) (160 mOhms) allowing Speed Output, Diagnostic line, VDS monitoring,
heatsink removal Supervision Overvoltage,
Undervoltage, Clock
Failure, Watchdog
SB0401 One Channel Motorcycle and Integrates Safe switch, Valve Drivers, Wheel 5.3 30 Low RDS(on) (160 mOhms), SPI Overcurrent, Open 48-pin 4Q 2015
Scooter ABS in the smallest ABS Speed Sensor Interface, Motor Pump predriver, PWM up to 5 KHz, Low-side Load, QFN-EP
Package and a warning lamp driver inside a small package Drivers up to 5.0 A, Vehicle Overtemperature,
7x7 size, Low RDS(on) (160 mOhms) allowing Speed Output, Diagnostic line, VDS monitoring,
heatsink removal Supervision Overvoltage,
Undervoltage, Clock
Failure, Watchdog

SG187 (Selector Guide) (3Q2015) – 12

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

Drivers and Switches — Configurable I/O

Product Description Main Characteristics Switch Operating Packaging Status
Monitor Voltage (V)
Voltage (V)
MC33811 Solenoid Monitor Integrated Circuit 5 input solenoid monitoring to verify proper electrical and mechanical solenoid operation. 0 to 64 10.5 to 15.5 16-pin SOICW Production
EVB

MC33972 22 input Multiple Switch Detect Multiple switch detection interface with suppressed wake-up designed to detect closing and opening of up to -14 to 38 5.5 to 26 32-pin SOICW, Production
Interface with 16 mA Wetting 22 switch contacts (14 GND, 8 configurable), wetting current of 2.0 mA or 16 mA. 32-pin SOICW EVB
Current and Suppressed Wake-up -14 to 40 Exposed Pad
MC33975 22 input Multiple Switch Detect 22 inputs contact monitoring (14 GND, 8 configurable), 4.0 mA or 32 mA pulse wetting current, low-power -14 to 38/40 5.5 to 26.5 32-pin SOICW Production
Interface with 32 mA Wetting mode interrupt capability, wake-up. Can supply current to external sensors. Exposed Pad EVB
Current and Wake-up
MC33978 22 input Multiple Switch Detect Multiple switch detection interface designed to detect closing and opening of up to 22 switch contacts (14 GND, 8 -14 to 38 V 4.5 to 36 32-pin SOICW Production
Interface with programmable Wetting configurable), programmable wetting current from 2.0 to 20 mA. 24 to 1 Analog Multiplexer. Exposed Pad EVB
Current
CD1030 33 Channel Multiple Switch Multiple switch detection interface designed to detect closing and opening of up to 33 switch contacts (21 -14 to 38 V 4.5 to 36 48-PIN LQFP-EP 1Q 2016
Detection Interface with GND, 11 configurable), programmable wetting current from 2.0 to 20 mA, 35 to 1 Analog Multiplexer EVB
Programmable Wetting Current Planned

System Basis Chip

Product Description Main Characteristics Bus Type Operating Current Other Features Control Protection Features Packaging Status
and Standard Voltage Limitation and
(V) Standby Status
(A) Reporting1
Typ Max
MC33742 System Basis Chip with Enhanced SBC, Dual VREG, Enhance HS CAN with CAN High-Speed 5.5 to 27 60 150 Low power SPI Current and thermal protection for 28-pin SOICW, Production
High-Speed CAN (250K to 1Mbps) Bus failure diagnostic capability, 4 wake- dual wires modes, remote CAN and regulator 48-pin QFN EVB
up inputs. and local wake-
up capabilities
MC33789 Airbag System Basis Chip (SBC) with Air bag control module which monitors PSI5 5.2 to 20 - - Safing state SPI Safing state machine, Scrap 64-pin LQFP Production
Power Supply and PSI5 Sensor battery voltage, sensor status and machine, 9 mode Exposed Pad EVB
Interface supplies various voltages to the air bag switch input (contact
system. Uses SPI for MCU monitors, 2 sales)
communication. Uses PSI5 for satellite config. high/low
sensors communication. side drivers,
Power-on-reset,
watchdog timer,
Squib energy
reserve
MC33889 System Basis Chip with Low-Speed Dual 5.0 V regulators LS CAN, CAN Low- 5.5 to 27 60 100 Dual voltage SPI Fault tolerant 28-pin SOICW Production
Fault Tolerant CAN 2 wake-up inputs Speed, regulator, EVB
dual wires Watchdog, wake-
up input, sleep
and stop modes
MC33903 System Basis Chip (SBC)-Gen 2-with High speed CAN and 1 or 2 LIN physical CAN high- 5.5 to 27 15 35 Fail-safe state “Secured” Overcurrent, Overtemperature, 32-pin SOICW Production
High Speed CAN & LIN Interfaces interface. 5.0 or 3.3 V VDD regulator. speed, dual machine, SPI Short-circuit, protect Exposed Pad EVB
wires, Configurable I/O,
LIN single wire MUX - out, pin
compatible with
MC33905
MC33904 System Basis Chip (SBC)-Gen 2-with High speed CAN physical interface. 5.0 CAN high- 5.5 to 27 15 35 Fail-safe state “Secured” Overcurrent, Overtemperature, 32-pin SOICW Production
High Speed CAN Interface or  speed, dual machine, SPI Short -circuit and undervoltage Exposed Pad EVB(‘905)
3.3 VDD and VAux regulators, w/current wires Configurable I/O, detect
sharing MUX - out, pin
compatible with
MC33905
MC33905 System Basis Chip (SBC)-Gen 2-with High speed CAN & 1 or 2 LIN physical CAN high- 5.5 to 27 15 35 Fail-safe state “Secured” Overcurrent, Overtemperature, 32-pin SOICW Production
High Speed CAN & LIN Interfaces interfaces. 5.0 or 3.3 VDD and VAux speed, dual machine, SPI Short -circuit and undervoltage Exposed Pad, EVB
regulators, w/current sharing. wires. Configurable I/O, detect 54-pin SOICW
LIN single wire MUX - out, SAFE Exposed Pad
output, Low
power modes w/
INT and RST
capability.
MC33907 Safe System Basis Chip with Buck Multiple switching and linear voltage CAN high- 5.6 to 40 32 60 Safe Assure “Secured” Overcurrent, Overtemperature, 48-pin LQFP Production
and Boost DC/DC up to 800 mA regulators, built-in enhanced high speed speed, dual product SPI Over & Undervoltage detect Exposed Pad EVB
CAN interface fulfills the ISO11898-2 and wires.
-5 standards.

SG187 (Selector Guide) (3Q2015) – 13

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

Product Description Main Characteristics Bus Type Operating Current Other Features Control Protection Features Packaging Status
and Standard Voltage Limitation and
(V) Standby Status
(A) Reporting1
Typ Max
MC33908 Safe System Basis Chip with Buck Multiple switching and linear voltage CAN high- 5.6 to 40 32 60 Safe Assure “Secured” Overcurrent, Overtemperature, 48-pin LQFP Production
and Boost DC/DC up to 1.5 A regulators, built-in enhanced high speed speed, dual product SPI Over & Undervoltage detect Exposed Pad EVB
CAN interface fulfills the ISO11898-2 and wires.
-5 standards.
MC33909 System Basis Chip with CAN, LIN Two high speed CAN interfaces plus four CAN high- 3.5 to 27 125 - Watchdog timer, SPI Overvoltage 64-pin LQFP Production
Multiple Switch-to-Ground Interface LINs, compatible with specification 2.1 speed, dual Switched inputs Exposed Pad EVB
and SAEJ2602-2. Also contains 17 switch wires. wake-up, Fail-
to ground inputs for switch detection. LIN single wire safe mode

MC33910 System Basis Chip with High-side LIN 2.0 compatible, 5.0 V/60 mA LDO,  LIN Single-wire 5.5 to 18 48 80 Hall Sensor SPI Multiple wake-up sources, LDO 32-pin LQFP Production
Drivers and LIN Physical Interface 2 High-side drivers w/PWM, 1 analog/ supply, Fault Detect, EVB (‘912)
digital input Configurable Low Voltage Reset
Window
Watchdog
MC33911 System Basis Chip with DC Motor LIN 2.0 compatible, 5.0 V/60 mA LDO,  LIN Single-wire 5.5 to 18 48 80 Configurable SPI Multiple wake-up sources, LDO 32-pin LQFP Production
Pre-driver and LIN Physical Interface 1 High-side driver & 2 Low-side drivers Window Fault Detect, EVB (‘912)
w/PWM, 2 analog/digital inputs Watchdog Low Voltage Reset
MC33912 System Basis Chip with DC Motor LIN 2.0 compatible, 5.0 V/60 mA LDO,  LIN Single-wire 5.5 to 18 48 80 Hall Sensor SPI Multiple wake-up sources, LDO 32-pin LQFP Production
Pre-driver and Current Sense and LIN 2 High-side drives & 2 Low-side drivers  supply, Fault Detect, EVB
Physical Interface. w/PWM, 4 analog/digital inputs Configurable Low Voltage Reset
Window
Watchdog,
Current Sense
MC33989 System Basis Chip with High-Speed Dual 5.0 V regulators HS CAN,  CAN High-Speed, 5.5 to 27 80 150 Dual voltage SPI Current limitation, thermal 28-pin SOICW Production
CAN 4 wake-up inputs dual wires regulator, EVB
Watchdog, wake-
up input, sleep
and stop modes
1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards.

SG187 (Selector Guide) (3Q2015) – 14

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

Battery Management — Battery Cell Controller

Product Description Main Characteristics Operating Output Voltages Protection Packaging Status
Voltage (V) Features
MC33771 Battery Cell Controller IC 4.0 Mbps SPI or 2.0 Mbps Isolated 9.6 to 61.6 Cell balancing: 10 V Single chip ASIL C capable, Diagnostics 64-pin LQFP- 1Q 2016
Differential Communication, 14 cell Fault pin: 5.0 V of internal and external faults as open EP EVB
voltage input channels, One current GPIO: 5.0 V lines, shorted lines, and leakage currents,
channel with Auto PGA and Coulomb Diagnostic state routable to the Fault
Counter, 7 GPIO configurable as Output pin, Die overtemperature
Temperature Sensor Inputs,14 onboard detection and protection
300 mA balancing switches, 5.0 V @ 5.0
mA Output Reference Supply, Low power
mode with monitoring and cell balance
capability, I2C interface for external
EEPROM, Automatic cell over/under
voltage and over/under temperature
detection routable to Fault Output pin,
Hot plug capable, Fully compatible with
the MC33772 for 6 cells
MC33772 Battery Cell Controller IC 4.0 Mbps SPI or 2.0 Mbps Isolated 5.0 to 30 (SPI Cell balancing: 10 V Single chip ASIL C capable, Diagnostics 48-PIN LQFP- 2Q 2016
Differential Communication, 6 cell voltage type) Fault pin: 5.0 V of internal and external faults as open EP EVB
input channels, one current channel with 7.0 to 30 (TPL GPIO: 5.0 V lines, shorted lines, and leakage currents,
Auto PGA and Coulomb Counter, type) Diagnostic state routable to the Fault
7 GPIO configurable as Temperature Output pin, Die overtemperature
Sensor Inputs, 6 onboard 300 mA detection and protection
balancing switches, 5.0 V @ 5.0 mA
Output Reference Supply, Low power
mode with monitoring and cell balance
capability, I2C interface for external
EEPROM, Automatic cell over/under
voltage and over/undertemperature
detection routable to Fault Output pin,
Hot plug capable, Fully compatible with
the MC33771 for 14 cells

Embedded MCU plus Power — S12 Mixed-Signal Analog MCUs

Product Description Main Characteristics MCU References MCU Details Additional Information Packaging Status
MM912_637 Battery Sensor with LIN for 12 V Simultaneous Battery voltage & current 16-bit MCU S12 16-bit core, 128 K/96 KBytes Flash, 6 KBytes RAM, Selectable Internal or external temp 48-pin QFN, Production
Lead-acid Batteries measurement with 16-bit sigma-delta CPU12_V1 4 K Bytes data Flash, ESCI, 16-bit 4 Channel Timer, sense, GPIO, including SPI functionality, Exposed Pad EVB
ADC & IIR filter. Voltage Regulators: 2.5 Internal Clock Generator, BDM internal or external oscillator. Window
V/10mA & 60mA, 5.0 V/80 mA. LIN 2.1 Watchdog with Selectable Timing,
Physical Layer w/Selectable Slew rates Normal/Stop/Sleep/Crank Mode Ctrl.
and triggered wake-up, High Voltage Wake-up Inputs,
MM9Z1_638 Battery Sensor with CAN and LIN This is a fully integrated battery 16-bit MCU S12Z MCU with 128 KB Flash, 8 KB RAM, 4 KB Four battery voltage measurements with 48-pin QFN Production
monitoring device. The device supports S12Z EEPROM internal resistor dividers, and up to five Exposed Pad EVB
precise current measurement via an direct voltage measurements for use with Ref. Design
external shunt resistor. The MM9Z1_638 an external resistor divider. Measurement
includes LIN 2.2 protocol and physical synchronization between voltage
interface, and an MSCAN protocol channels and current channels.
controller,
MM912_P812 S12P MCU and Multifunctional An engine control IC combining an MCU 16-bit MCU The MCU S12P has 6 KB RAM, and flash memory size Analog functions consists of three 100 lead LQFP, Production
Ignition and Injector Driver System (S12P) and analog control die S12P of 96 KB or 128 KB. The S12P family uses many of the integrated low side drivers, one pre- Exposed Pad Ref.Design
In Package (SiP) (MC33812) intended for motorcycle and same features found on the S12XS family, including driver, a +5.0 V, voltage pre-regulator, an
other single/dual cylinder small engine error correction code (ECC) on flash memory, a MCU watchdog circuit, an ISO 9141 K-
control applications. separate data-flash module for diagnostic or data Line interface, and a parallel interface for
storage, a fast analog-to-digital converter (ATD), and aMCU communication. The three low side
frequency modulated phase locked loop (IPLL) that drivers are provided for driving a fuel
improves electromagnetic compatibility (EMC). injector, a lamp or LED, and a relay,
another injector or fuel pump.
MM912_S812 S12XS MCU and Multifunctional An engine control IC combining an MCU 16-bit MCU The MCU S12XS has 8 KB or 12 KB RAM, and flash Analog functions consists of three 100 lead LQFP, Production
Ignition and Injector Driver System In (S12XS) and analog control die S12XS memory size of 128 KB or 256 KB. The S12XS family integrated low side drivers, one pre- Exposed Pad Ref. Design
Package (SiP) (MC33812) intended for motorcycle and uses many of the same features found on the S12P driver, a +5.0 V, voltage pre-regulator, an
other single/dual cylinder small engine family, including error correction code (ECC) on flash MCU watchdog circuit, an ISO 9141 K-
control applications. memory, a separate data-flash module for diagnostic or Line interface, and a parallel interface for
data storage, a fast analog-to-digital converter (ATD), MCU communication. The three low side
and a frequency modulated phase locked loop (IPLL) drivers are provided for driving a fuel
that improves the electromagnetic compatibility (EMC) injector, a lamp or LED, and a relay,
performance. another injector or fuel pump.

SG187 (Selector Guide) (3Q2015) – 15

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

S12 Mixed-Signal Analog MCUs

Product Description Main Characteristics Power Features MCU Reference MCU Detail Additional Information Packaging Status
MM912_634 Integrated S12 MagniV Based Relay Cascaded dual Voltage Regulator 2.5 V/ 7  High-side Switches, 16-bit MCU S12 16-bit Core, 32KB High Voltage Wake-up Inputs, 48-pin LQFP Production
Drivers with LIN 50 mA and 5.0 V/80 mA, LIN Physical 2.5  Low-side Switches for Flash, 2KB RAM, ESCI, Selectable Gain I-Sense, Exposed Pad EVB
Layer with Selectable Slew rates, relay drivel Multi channel 10-bit ADC, Battery Voltage Sense. Timing,
Window Watchdog with Selectable Dual 16-bit 4 Channel Timer, Normal/Stop/Sleep Mode
High-side and Dual Low Side Switches Internal Clock Generator Control, Hall Supply of 18 V/30
with Embedded S12 MCU + Power + LIN mA

8-bit Intelligent Distributed Controllers

Product Description Main Characteristics Power Features MCU Reference MCU Detail Additional Information Packaging Status
MM908E621 DC Motor/Mirror Control and LIN Voltage Regulator 5.0 V/60 mA, LIN 2 x 275 m Half-Bridges; 2/3 Pin Hall Sensor Input, 54-pin SOICW Production
Mirror Control, Integrated Quad Half- Physical Layer with Selectable Slew 2 x 750 m Half-Bridges; Analog Input with Current Exposed Pad
Bridge and Triple High-side with rates, Window Watchdog, “Normal/Stop/ 1 x 185 m High-side; Source, 40 V Rated Wake-up
Embedded MCU and LIN Sleep Mode “Control 2 x 440 m High-side; Input, Vsup, Chip Temp. and
Switched 5.0 V Output (25 mA) Current Sensing
MM908E622 DC Motor/Mirror Control and LIN Voltage Regulator 5.0 V/60 mA, LIN 2 x 275 m Half-Bridges; 2/3 Pin Hall Sensor Input, 54-pin SOICW Production
Mirror Control, Integrated Quad Half- Physical Layer with Selectable Slew 2 x 750 m Half-Bridges; Analog Input with Exposed Pad
Bridge, Triple High-side and EC rates, Window Watchdog, “Normal/Stop/ 1 x 185 m High-side; Current Source, 40 V Rated
Glass Driver with Embedded MCU Sleep Mode “Control 2 x 440 m High-side; Wake-up Input, Vsup, Chip
and LIN Switched 5.0 V Output (25 mA) HC08 Core, 16K Flash,  Temp. and Current Sensing
EC Glass Driver 512 Bytes RAM, ESCI,
MM908E624 DC Motor Control Using Relays (for Voltage Regulator 5.0 V/50 mA, LIN 1 x 7  High-side, 8-bit MCU 8-Channel 10-bit ADC,  Operational Amplifier, 2 x 40 V 54-pin SOICW Production
example, Window Lift, Sun Roof, and Physical Layer with Selectable Slew 2 x 2.5  High-side Switches for HC908EY16 Two 16-bit 2 Channel Rated Wake-up Inputs EVB
Power Seats), Triple High-side rates, Window Watchdog with Selectable Relay Control Timers, Internal Clock
Switch with Embedded MCU + Timing, Normal/Stop/Sleep Mode Control Generator
Power + LIN
MM908E625 Mirror Control, Stepper Motor Voltage Regulator 5.0 V/60 mA, LIN 4 x 400 m Half-Bridges with 3 x 2 Pin Hall Sensor Inputs with 54-pin SOICW Production
Control, Door Lock Quad Half-Bridge Physical Layer with Selectable Slew Current Control; Cyclic Wake-up Feature, Analog Exposed Pad EVB
and Single High-side with Embedded rates, Timeout Watchdog with Periodic 1 x 600 m High-side; Input with Current Source, Vsup,
MCU and LIN Wake-up Feature, Normal/Stop Modes Switched 5.0 V Output (25 mA) Chip Temp. and Current Sensing
MM908E626 Stepper Motor Control, Quad Half- Voltage Regulator 5.0 V/60 mA, LIN 4 x 400 m Half-Bridges with Vsup, Chip Temperature and 54-pin SOICW Production
Bridge with Embedded MCU and LIN Physical Layer with Selectable Slew Current Control; Current Sensing Exposed Pad EVB (‘625)
rates. High Temperature use, TJ = 135×C Switched 5.0 V Output (24 mA)

SG187 (Selector Guide) (3Q2015) – 16

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

FREESCALE SEMICONDUCTOR POWER MANAGEMENT PRODUCTS

The Power Management products portfolio provides solutions for Linear and Switching For additional information, visit:
voltage regulators. Hot Swap control and Power over Ethernet devices for use in Documentation, Tool, and Product Libraries 
applications ranging from Consumer and Industrial to Automotive. www.freescale.com
SMARTMOS — Freescale Semiconductor SMARTMOS technology allows designers to www.freescale.com/analog
interface high-precision components with the harsh automotive environment. www.freescale.com/powermanagement
www.freescale.com/productlongevity

Power Management — Linear Regulators

Product Description Main Characteristics Bus Type and Operating Current Other Features Diagnostics1 Protection Features Packaging Status
Standard Voltage Limitation
(V) Standby
(A)
Typ Max
MC33730 Switch Mode Power Supply Step-down Switching regulator (2.0 A), n/a 4.5 to 28 150 — Programmable voltage None Reverse Battery 32-pin SOICW Production
with Multiple Linear with 3 Programmable Linear Regulators regulator, power sequencing, Protect, Undervoltage EVB
Regulators and Power (15 mA, 15 mA, 15 mA) and two 5.0 V adjustable OSC - Switcher and Overvoltage
Sequencing Sensor supplies (100 mA, 100 mA). Lockout, Reset
monitor signals for
regulators (4)
1. Products available with SPI Control work with the KITUSBSPIEVME and the KITUSBSPIDGLEVME USB-SPI Interface Boards.

Power Management — Switching Regulators

Product Description Main Characteristics Operating Voltage (V) Output Voltages Protection Features Packaging Status
MC33730 Switch Mode Power Supply Step-down Switching regulator (2.0 A), 4.5 to 28 4.9 to 5.1 V, Reverse Battery Protect, 32-pin SOICW Production
with Multiple Linear with 3 Programmable Linear Regulators 2.0 to 3.3 V, Undervoltage and Overvoltage EVB
Regulators and Power (15 mA, 15 mA, 15 mA) and 2 x 5.0 V 1.5 to 3.3 V, Lockout, Reset monitor signals for
Sequencing sensor supply (100 mA, 100 mA) 1.0 to 5.0 V, regulators (4)
5.0 V

Automotive Alternator Voltage Regulators

Product Description Main Characteristics Bus Type Operating Regulation Other Features Diagnostics Protection Features Packaging Status
Voltage Voltage
TC80310 An integrated circuit intended to High-side field driver, Internal LIN 1.3 8 to 27 150 Factory Selectable Features: LRC LIN communication Load Dump Protection, Die Production
regulate the output voltage of an freewheeling diode, Up to 8.0 A Rate, LRC disable RPM, Self start, used for Electrical, Thermal protection,
automotive alternator. It supplies a rotor current (excitation coil), Self start threshold, Alternator Pole Mechanical and Thermal compensation
current via a high-side MOSFET to Load response control (LRC), pairs, Thermal Fault Threshold, Thermal fault reporting
the excitation coil of the alternator LIN interface, Set point voltage Thermal Compensation Threshold,
and provides an internal free- selectable Phase Sensitivity, Phase Start
wheeling diode. Regulating RPM, Phase Stop
Regulating RPM

Note: Choice of 16 parametric fields may be specified by the customer. Contact sales for specific parameter combinations and part numbering.

SG187 (Selector Guide) (3Q2015) – 17

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
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FREESCALE SEMICONDUCTOR AUTOMOTIVE SENSORS

Freescale is a leading sensor supplier for automotive safety for airbags, Tire Pressure Applications — Freescale Semiconductor automotive sensors are designed for a variety
Monitoring Systems (TPMS), Electronic Stability Control (ESC) and for engine of applications ranging from safety and performance to comfort and control. Our sensors
management with barometric absolute pressure (BAP) and manifold absolute pressure are used in under-hood and in-cabin applications, and are compatible with Freescale
(MAP) applications.. analog product, power management and microcontroller families.
Our Zero Defects process, Automotive Electronics Council (AEC) membership and For additional information, visit www.freescale.com/automotive
functional safety with Safe Assure are critical in providing world-class quality solutions
from entry-level to the high end.

Pressure Sensors
Product Maximum Full Scale Span Voltage Sensitivity Accuracy 0 C to 85 C Packaging Status
Pressure Rating (kPa) (Typical) (Vdc) (mV/kPa) (% of VFSS)
MPX4115A 115 4.6 46 ±1.5 Super-Small Outline Package (SSOP) Available
115 4.4 38 ±1.5 SSOP Available
MPX4250A 250 4.7 20 ±1.5 SSOP Available
250 4.7 19 ±1.4 SSOP Available
MPXV5004 4 3.9 1000 ±2.5 SOP Available
MPXV5010 10 4.5 450 ±5.0 SOP Available
MPX5100 100 4.5 45 ±2.5 6-pin unibody package Available
MPX5700 700 4.5 6.4 ±2.5 6-pin unibody package Available
MPX5999 1000 4.5 4.5 ±2.5 6-pin unibody package Available
MPXH6101 102 4.6 54 ±1.8 SSOP Available
MPXV7007 7 4.0 286 ±5.0 SOP Available
MPXV7025 25 4.5 90 ±5.0 SOP Available

Barometric Absolute Pressure (BAP) and Manifold Absolute Pressure (MAP) Sensors
Product Maximum Full Scale Span Voltage Sensitivity Accuracy 0 C to 85 C Packaging Status
Pressure Rating (kPa) (Typical) (Vdc) (mV/kPa) (% of VFSS)
MPXH6101 102 4.6 54 ±1.8 Super-Small Outline Package (SSOP) Available
MPXA6115 115 4.6 45.9 ±1.5 SOP Available
MPXAZ6115A 115 4.5 45.9 ±1.5 SOP Available
MPXHZ6115A 115 4.5 45.9 ±1.5 SSOP Available
MPXH6250A 250 4.7 20 ±1.5 SSOP Available
MPXHZ6250 250 4.7 20 ±1.5 SSOP Available
MPXH6300 300 4.7 16 ±1.8 SSOP Available
MPXH6400 400 4.7 12 ±1.5 SSOP Available
MPXHZ6400 400 4.7 12 ±1.5 SSOP Available

SG187 (Selector Guide) (3Q2015) – 18

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
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Inertial Sensors1
Product Sensing Acceleration (±g) Sensitivity Sensitivity Temperature Roll-Off Analog Digital Communication Packaging Status
Direction (mV/V/g) (count/g) Range Frequency
Analog Sensors:
MMA1270KEG Z 2.5 g 150 — -40 C to +105 C 50 Hz Yes — — 16-pin SOIC Available
MMA1250KEG Z 5g 80 — -40 C to +105 C 50 Hz Yes — — 16-pin SOIC Available
MMA1220KEG Z 8g 50 — -40 C to +85 C 250 Hz Yes — — 16-pin SOIC Available
MMA2240KEG X 7g 300 — -40 C to +125 C 50 Hz Yes — — 16-pin SOIC Available
MMA2244KEG X 20 g 100 — -40 C to +125 C 400 Hz Yes — — 16-pin SOIC Available
MMA2201KEG X 40 g 10 — -40C to +125 C 400 Hz Yes — — 16-pin SOIC Available
MMA2202KEG X 50 g 8 — -40 C to +125 C 400 Hz Yes — — 16-pin SOIC Available
MMA2204KEG X 100 g 4 — -40 C to +125 C 400 Hz Yes — — 16-pin SOIC Available
MMA2300KEG X 250 g 1.6 — -40 C to +125 C 400 Hz Yes — — 16-pin SOIC Available
MMA2301KEG X 200 g 2 — -40 C to +125 C 400 Hz Yes — — 16-pin SOIC Available
MMA3201KEG XY 40 g 10 — -40 C to +125 C 400 Hz Yes — — 20-pin SOIC Available
MMA3221KEG XY 50/20 g 40/100 — -40 C to +125 C 400 Hz Yes — — 20-pin SOIC Available
MMA3204KEG XY 100/30 g 4/13 — -40 C to +125 C 400 Hz Yes — — 20-pin SOIC Available
MMA3202KEG XY 100/50 g 4/8 — -40 C to +125 C 400 Hz Yes — — 20-pin SOIC Available
Digital Sensors:
MMA5106KW Z 60 g — 8 -40 C to +125 C 400 Hz — Yes PSI5 16-pin QFN Available
MMA5112KW Z 120 g — 4 -40 C to +125 C 400 Hz — Yes PSI5 16-pin QFN Available
MMA5124KW Z 240 g — 2 -40 C to +125 C 400 Hz — Yes PSI5 16-pin QFN Available
MMA5148KW Z 480 g — 1 -40 C to +125 C 400 Hz — Yes PSI5 16-pin QFN Available
MMA5206KW X 60 g — 8 -40 C to +125 C 400 Hz — Yes PSI5 16-pin QFN Available
MMA5212KW X 120 g — 4 -40 C to +125 C 400 Hz — Yes PSI5 16-pin QFN Available
MMA5224KW X 240 g — 2 -40 C to +125 C 400 Hz — Yes PSI5 16-pin QFN Available
MMA5248KW X 480 g — 1 -40 C to +125 C 400 Hz — Yes PSI5 16-pin QFN Available
MMA2612KW X 125 g — 4.096 -40 C to +125 C 400 Hz — Yes DSI 16-pin QFN Available
MMA1618KW Z 187 g — 2.731 -40 C to +125 C 400 Hz — Yes DSI 16-pin QFN Available
MMA2725W X 250 g — 2 -40 C to +125 C 400 Hz — Yes DSI3 QFN 6x6 mm 16-pin Available
MMA2712W X 125 g — 4 -40 C to +125 C 400 Hz — Yes DSI3 Self Test Available
MMA2737W X 375 g — 1.3 -40 C to +125 C 400 Hz — Yes DSI3 Self Test Available
MMA2718W X 187 g — 2.7 -40 C to +125 C 400 Hz — Yes DSI3 Self Test Available
MMA2702W X 25 g — 20.4 -40 C to +125 C 400 Hz — Yes DSI3 Self Test Available
MMA1725W Z 250 g — 2 -40 C to +125 C 400 Hz — Yes DSI3 Self Test Available
1. Freescale Semiconductor reserves the right to modify product specifications and/or introduction dates without any further notice. The product parameters are typical values at VDD = 5.0 V and T = 25 C, unless otherwise specified.
Additional sensitivity and expanded temperature ranges are available upon request. Consult your Freescale Semiconductor sales representative

SG187 (Selector Guide) (3Q2015) – 19

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
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Inertial Sensors1 (continued)

Product Sensing Acceleration (±g) Sensitivity Sensitivity Temperature Roll-Off Analog Digital Communication Packaging Status
Direction (mV/V/g) (count/g) Range Frequency
MMA6255KEG XY 50/50 g — 9.76 -40C to +125 C 400 Hz — Yes SPI 16-pin QFN Available
MMA6852KW X 35 g — 13.947 -40C to +105 C 400 Hz — Yes SPI 16-pin QFN Available
MMA6854KW X 75 g — 6.51 -40C to +105 C 400 Hz — Yes SPI 16-pin QFN Available
MMA6811KW XY 60/25 g — 8.192/20.479 -40C to +105 C 400 Hz — Yes SPI 16-pin QFN Available
MMA6813KW XY 50/50 g — 9.766/9.766 -40C to +105 C 400 Hz — Yes SPI 16-pin QFN Available
MMA6821KW XY 120/25 g — 4.096/20.479 -40C to +105 C 400 Hz — Yes SPI 16-pin QFN Available
MMA6823KW XY 120/60 g — 4.096/8.192 -40C to +105 C 400 Hz — Yes SPI 16-pin QFN Available
MMA6826KW XY 60/60 g — 8.192/8.192 -40C to +105 C 400 Hz — Yes SPI 16-pin QFN Available
MMA6852KW XY 120/120 g — 4.096/4.096 -40C to +105 C 400 Hz — Yes SPI 16-pin QFN Available
MMA6900KQ XY 3.5 g — 291.5 -40C to +105 C 50 Hz — Yes SPI 16-pin QFN Available
MMA6901KQ XY 5g — 203.6 -40C to +105 C 50 Hz — Yes SPI 16-pin QFN Available
1. Freescale Semiconductor reserves the right to modify product specifications and/or introduction dates without any further notice. The product parameters are typical values at VDD = 5.0 V and T = 25 C, unless otherwise specified.
Additional sensitivity and expanded temperature ranges are available upon request. Consult your Freescale Semiconductor sales representative.

SG187 (Selector Guide) (3Q2015) – 20

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
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Tire Pressure Monitoring Systems

Product Product RF Transmitter Protocols Clock Timer Pressure Range Pressure Z-axis Offset X-axis Offset Package Temperature Status Description
Flash Frequency Supported Type Pressure Sensor Offset Accuracy Accuracy Range
Accuracy (0 °C <=TA<=70 (0 °C <=TA<=70
(0 °C <=TA<=70 °C) °C)
°C)
FXTH870502DT1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 450 kPA +/-7 kPa ±6g NA 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure
Monitoring Sensor (with Z-
Axis Accelerometer)
FXTH870511DT1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 450 kPA +/-7 kPa ±6g ±4g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure
Monitoring Sensor (with
XZ-Axis Accelerometer)
FXTH8705116T1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 450 kPA +/-7 kPa ±3g ±3g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure
Monitoring Sensor (with
XZ-Axis Accelerometer)
FXTH870902DT1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 900 kPA +/-10 kPa ±6g NA 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure
Monitoring Sensor (with Z-
Axis Accelerometer)
FXTH8709026T1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 900 kPA +/-10 kPa ±3g NA 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure
Monitoring Sensor (with Z-
Axis Accelerometer)
FXTH870911DT1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 900 kPA +/-10 kPa ±5g ±4g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure
Monitoring Sensor (with
XZ-Axis Accelerometer)
FXTH8709126T1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 900 kPA +/-10 kPa ±3g ±3g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure
Monitoring Sensor (with
XZ-Axis Accelerometer)
FXTH870912DT1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 900 kPA +/-10 kPa ±6g ±4g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure
Monitoring Sensor (with
XZ-Axis Accelerometer)
FXTH8709226T1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 900 kPA +/-10 kPa ±3g ±3g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure
Monitoring Sensor (with
XZ-Axis Accelerometer)
FXTH871502DT1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 1500 kPA +/-20 kPa ±6g NA 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure
Monitoring Sensor (with Z-
Axis Accelerometer)
FXTH8715026T1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 1500 kPA +/-20 kPa ±3g ±3g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure
Monitoring Sensor (with Z-
Axis Accelerometer)
FXTH8715027T1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 1500 kPA +/-17 kPa ±3g NA 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure
Monitoring Sensor (with Z-
Axis Accelerometer)
FXTH871511DT1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 1500 kPA +/-20 kPa ±5g ±4g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure
Monitoring Sensor (with
XZ-Axis Accelerometer)
FXTH8715116T1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 1500 kPA +/-20 kPa ±3g ±3g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure
Monitoring Sensor (with
XZ-Axis Accelerometer)
FXTH8715117T1 16 kB 315/434 MHz ASK and FSK Modulation OSC 2-CH, 16-bit PWM 100 - 1500 kPA +/-17 kPa ±3g ±3g 7x7 QFN FAM -40 to 125 °C In production Automotive Tire Pressure
Monitoring Sensor (with
XZ-Axis Accelerometer)

SG187 (Selector Guide) (3Q2015) – 21

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

FREESCALE SEMICONDUCTOR ACCESS AND REMOTE CONTROL PRODUCTS

For additional information, visit:
Documentation, Tool, and Product Libraries  Automotive Home Page
www.freescale.com www.freescale.com/automotive

GPS Downconverter
Product RF Freq (MHz) Supply Voltage Supply Current (Typ) Standby Current Conversion Gain Packaging System Documentation
Range (Vdc) (mA) (mA) (typ) (dB) Applicability
MRFIC1505A 1575.42 2.7 to 3.3 28 3 105 48-pin LQFP GPS MRFIC1505
(Case No 932)

SG187 (Selector Guide) (3Q2015) – 22

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
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FREESCALE SEMICONDUCTOR LOCAL INTERCONNECT NETWORK (LIN) SOLUTIONS

Freescale Semiconductor and LIN—As the only semiconductor member of the LIN Advanced Integration with LIN—Microcontrollers will evolve in the LIN environment to
consortium, Freescale Semiconductor has the industry’s most advanced range of integrate the voltage regulator, physical interface, and high-voltage I/O to provide space,
components, software, tools, and support available. cost, and reliability benefits. Freescale Semiconductor solutions provide this capability
Cost Benefits from LIN—A LIN sub-bus system uses a single-wire implementation and today.
self-synchronization, without a crystal or ceramic resonator, in the slave node. With these Software for LIN—Freescale Semiconductor is working closely with the leading LIN tool
cost benefits, high-end comfort and convenience features no longer need to be limited supplier to ensure a first class, seamless development and debug environment for
only to top-of-the-line cars. Freescale Semiconductor LIN products.
Embedded Controllers—Since the LIN sub-bus is based on common UART/SCI interface For additional information, visit:
hardware, the 8-bit 68HC08, and 16-bit S12 and S12X Families provide the industry’s Local Interconnect Network (LIN) Home Page
broadest range of performance and features, affording designers the freedom to choose www.lin-subbus.org
parts ideally suited to their needs.
Automotive Home Page

LIN Software Products

Product 68HC05 68HC08 S08 S12 S12X
LIN master n/a Available Available Available Available
LIN slave Available Available Available Available Available
Operating system n/a Available Available Available Available

LIN Physical Layer Transceivers

Product Description Main Characteristics Bus Type Protection Operating Current Limitation Other Control and Packaging Status
and Stan- Features Voltage Standby Features Status
dard (V) (A) Reporting
Typ Max
MC33399 See Network Transceivers — LIN, ISO-9141, J-1850 Physical Interface Components
MC33661 See Network Transceivers — LIN, ISO-9141, J-1850 Physical Interface Components
MC33662 See Network Transceivers — LIN, ISO-9141, J-1850 Physical Interface Components

SG187 (Selector Guide) (3Q2015) – 23

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MCU CHOICES BY APPLICATION

Application Microcontroller
Transmission, Engine Control and Management Interfaces MPC5674F, MPC5673F, MPC563xM, MPC5644A, MPC5643A, MPC5642A, MPC5746M, MPC5777M, S12XE, S12P, S12G
Hybrid and Electric Auxiliaries MPC5674F, MPC5673F, MPC563xM, MPC5644A, MPC5643A, MPC5642A, MPC5744P, MPC5746G, MPC5747C, MPC5747G, MPC5748C, MPC55748G,
MPC5746M, S12G
Watchdog S12G, S12P, S08QD4, S08SG, S08AW, S08SC4, S08RN
High Temperature MPC5744P, S12G, S08SG
Body Control Module and Gateway MPC5668x, MPC560xB, MPC560xD, MPC564xB/C, MPC5746G, MPC5747C, MPC5747G, MPC5748C, MPC5748G, S12G, S12XE, KEA
HVAC, Lighting, Seats, Window Lift, Doors, Sun Roof MPC560xB, MPC560xD, S12XS, S12P, S12G, S12VR, S12ZVFP, S08D, S08AW, S08EL, S08SG, S08SL, S08MP16, S08SC4, S08RN, KEA
Body Motor Control S12G, S12VR, S08MP16, S08RN, KEA
Infotainment all i.MX, SVFxxxR, MAC57D5xx, KEA
Telematics i.MX251, i.MX281, i.MX53, i.MX351, i.MX 6S1, i.MX 6U1, MAC57D5xx
Instrument Cluster MPC560xS, i.MX534, i.MX 6S1, i.MX 6U1, SVFxxxR, S12H, S12XH, S12XHY, S12ZVFP, S12ZVH, S12ZVY S08LG, MAC57D5xx
Head-Up-Display MAC57D5xx
Multi-function Display MAC57D5xx
Braking Systems MPC564xL, MPC560xP, MPC5744P, S12XE, S12XS, KEA
Electronic Power Steering MPC564xL, MPC560xP, MPC5744P, S12G
Tire Pressure Monitoring System MPC560xB, MPC5668G, S12XE, S12XS, S08D, S08RN
Semi-Active Suspension MPC564xL, MPC5744P
Airbag MPC560xP, MPC5744P, S12XF, S12XE, S12XS, S08SG, KEA
Electronic Stability Control MPC564xL, MPC560xP, MPC5744P
Lane Departure i.MX534, MPC567xK, i.MX 6S4, i.MX 6U4, i.MX 6D4, i.MX 6Q4, MPC577xK
Advanced Cruise Control MPC564xL, MPC567xK, MPC5744P, MPC577xK, SCP2201, SCP2207
Precrash, Blindspot Detection, Backup Warning MPC564xL, MPC567xK, MPC5744P, MPC5604E, MPC577xK, S12ZVFP, S08RN
Ethernet MPC560xS, MPC5668x, MPC5746G, MPC5747C, MPC5747G, MPC5748C, MPC5748G, MPC5746M, MPC577xK, all i.MX
FlexRay (tm) MPC5668x, MPC564xL, MPC560xP, MPC5674F, MPC5673F, MPC5644A, MPC5643A, MPC5642A, MPC5744P, MPC5748G, MPC5747C, MPC5747G,
MPC5748C, MPC5748G, MPC5746M MPC5642A, MPC577xK, S12XF
CAN MPC5644A, MPC5643A, MPC5642A, MPC5744P, MPC5746G, MPC5747C, MPC5747G, MPC5748C, MPC5748G, MPC5746M, MPC577xK all S12(X), S08D,
KEA
LIN MPC5644P, MPC5746G, MPC5747C, MPC5747G, MPC5748C, MPC5748G, MPC577xK, S12P, S12XS, S12XE, S12G, S12X, S12VR64, S08SG, S08EL, S08AW,
S08D, S08SL,S08SC4, S08RN, KEA
NOTE: 32-bit in plain, 16-bit in bold, 8-bit in italics

SG187 (Selector Guide) (3Q2015) – 24

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S08 8 - BIT MICROCONTROLLERS

S08 Core Technology — Optimized for extreme operating economy with a number of low- S08 Family Benefits — Freescale’s S08 families help save cost, reduce board space,
power options, Freescale’s S08 core is particularly attractive for automotive applications. increase performance and improve quality through extensive on-chip integration. No lon-
Multiple stop modes, along with wait and standby modes, will help achieve new thresholds ger are external components required, such as an external crystal, LVI circuit, voltage reg-
in low-power performance under a variety of operating conditions. The S08 core allows ulator, I/O mux, watchdog circuit or EEPROM. With on-chip emulation and debug, changes
efficient, compact, modular coding with full 16-bit stack-pointer and stack-relative address- can be made in application and in real-time, reducing development time. Also, with the
ing, which permit various instruction sizes and enable memory interface in multiple mecha- S08 CPU running at 40 MHz, MCUs are able to quickly accomplish a task and go back to
nisms and addressing modes. The object code is also compatible with Freescale’s legacy sleep. Quick execution translates into power savings, which allows customers to add more
HC05 and HC08 cores. embedded content while staying within their power budgets.

8-bit S08 MCUs

Device Bus Flash RAM EEPRO CAN UART SPI I2C SLIC Analog (ADC) Timer Clock Additional Features Operating Temp. Package In
Frequency M Voltage Range1 Options Produc-
tion
S08DZ 200 MHz Up to Up to 8 Up to 1 2xSCI Up to Up to — Up to 24-CH, 12-bit, Up to 12-CH MCG Watchdog OSC/Timer, COP, 2.7 to 5.5 C, V, M 32 LQFP, 
128 KB KB 2 KB 2 2 2 com BDM, Temp Sensor 48 LQFP,
64 LQFP,
100 LQFP
S08DV 200 MHz Up to Up to 6 — 1 2xSCI Up to Up to — Up to 24-CH, 12-bit, Up to 12-CH MCG Watchdog OSC/Timer, COP, 2.7 to 5.5 C, V, M 32 LQFP, 
128 KB KB 2 2 2 com BDM, Temp Sensor 48 LQFP,
64 LQFP,
100 LQFP
S08DN 200 MHz Up to Up to 2 Up to 1xSCI 1 1 — Up to 16-CH, 12-bit, Up to 6-CH + 2- MCG Watchdog OSC/Timer, COP, 2.7 to 5.5 C, V, M 32 LQFP, 
60 KB KB 2 KB 2 com CH BDM, Temp Sensor 48 LQFP,
64 LQFP
S08AW 200 MHz Up to Up to 2 — 2xSCI 1 1 — Up to 16-CH, 10-bit Up to 8-CH ICG KBI, ICE, BDM, Temp Sensor 2.7 to 5.5 C, V, M 48 QFN, 44 
60 KB KB QFP, 32
LQFP, 64
QFP, 64
LQFP, 44
LQFP
S08EL 200 MHz Up to 1 KB Up to 1xSCI 1 1 1 Up to 16-CH, 10-bit, 4-CH + 2-CH ICS LIN Auto-Baud/Synch, 2.7 to 5.5 C, V, M 28 TSSOP, 
32 KB 512 B 2 com Watchdog OSC/Timer, BDM, 20 TSSOP
Temp Sensor
S08SL 200 MHz Up to 512 B Up to 1xSCI 1 1 1 Up to 16-CH, 10-bit, 2-CH + 2-CH ICS LIN Auto-Baud/Synch, 2.7 to 5.5 C, V, M 28 TSSOP, 
16 KB 256 B 1 com Watchdog OSC/Timer, BDM, 20 TSSOP
Temp Sensor
S08SG 200 MHz Up to Up to 1 — 1xSCI 1 1 — Up to 16-CH, 10-bit, Up to 2-CH + 2- ICS Watchdog OSC/Timer, COP, 2.7 to 5.5 C, V, M, W 28 TSSOP, 
32 KB KB 1 com CH BDM, POR, KBI, Temp Sensor 20 TSSOP,
16 TSSOP,
8 SOIC
S08SC4 200 MHz 4 KB 256 B — 1xSCI 1 1 — Up to 8-CH, 10-bit Up to 2-CH + 2- ICS Watchdog OSC/Timer, COP, 4.5 to 5.5 C, V, M 16 TSSOP 
CH BDM, Temp Sensor
S08LG 200 MHz Up to 2 KB — 1xSCI 1 1 — Up to 16-CH, 12-bit Up to 2-CH + 6- ICS Up to 37x8/41x4 LCD Driver, 2.7 to 5.5 C, V 80 LQFP, 
32 KB CH Watchdog OSC/Timer, RTC, 64 LQFP,
BDM, Temp Sensor 48 LQFP
S08MP 200 MHz 16 KB 1 KB — 2xSCI 1 1 — 13-CH, 12-bit, 3 com 6-CH + 2-CH, ICS MTIM, RTC, COP, CRC, BDM, 2.7 to 5.5 C, V, M 48 LQFP 
16-bit Flex 5-bit DAC (3x), Temp Sensor
Timer w/PWM
Functions

SG187 (Selector Guide) (3Q2015) – 25

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

8-bit S08 MCUs (continued)

Device Bus Flash RAM EEPRO CAN UART SPI I2C SLIC Analog (ADC) Timer Clock Additional Features Operating Temp. Package In
Frequency M Voltage Range1 Options Produc-
tion
S08RN 200 MHz Up to Up to 4 Up to 1xSCI 1 1 — Up to 16-CH, 12-bit Up to 6-CH + 2- ICS TSI, Watchdog, BDM, RTC 2.7 to 5.5 C, V, M 64, 48, 32 
60 KB KB 256 B CH + 2-CH Analog Comparator LQFP
20, 16
TSSOP
S08QD 8 MHz Up to 4 Up to — Up to Up to Up to — 4-CH, 10-bit 2-CH + 1-CH ICS Watchdog OSC/Timer, BDM, 2.7 to 5.5 C, V, M 8 SOIC 
KB 256 B 3 2 1 Temp Sensor
1. C = -40 °C to +85 °C, V = -40 °C to +105 °C, M = -40 °C to +125 °C, J = -40°C to +140 °C, W = -40 °C to +150 °C

SG187 (Selector Guide) (3Q2015) – 26

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

S12 AND S12X 16-BIT MICROCONTROLLERS

Freescale has a wide range of 16-bit products to offer automotive designers. S12 and For additional information, visit:
S12X MCUs provide high-performance 16-bit control functionality. The S12X MCUs Freescale Semiconductor Documentation, Tool, and Product Libraries 
feature the innovative XGATE module, designed specifically to handle interrupt events www.freescale.com
without CPU intervention. As a result, the S12X controller has the high-performance
capabilities you would normally expect of a 32-bit controller. S12 MagniV mixed-signal Automotive Home Page
MCUs extend the S12 portfolio and offer the right blend of digital programmability and www.freescale.com/automotive
high precision analog in highly-integrated packages. 16-bit Microcontrollers Home Page
www.freescale.com/16BIT

S12 and S12X Families

Device Bus Flash RAM Data EEPROM XGATE MPU ECC FlexRa CAN SCI SPI I2C Analog (ADC) PWM Motor SSD ECT Timer PIT LCD KWU EBI Operat- Temp. Package In
Fre- Flash y ing Range1 Options Produc-
quency Voltage tion
S12XEP100 50 MHz 1 MB 64 KB — 4 KB    5 8 3 2 2x16-CH, 8-CH, — — 8-CH, 8-CH, 8-CH — 25  3.13 to 5.5 C, V, M 112 LQFP, 
12-bit 8-bit 16-bit 16-bit 144 LQFP,
208 MAPBGA
S12XEP768 50 MHz 768 KB 48 KB — 4 KB    5 8 3 2 2x16-CH, 8-CH, — — 8-CH, 8-CH, 8-CH — 25  3.13 to 5.5 C, V, M 112 LQFP, 
12-bit 8-bit 16-bit 16 -bit 144 LQFP,
208 MAPBGA
S12XEQ512 50 MHz 512 KB 32 KB — 4 KB    4 6 3 2 2x12-CH, 8-CH, — — 8-CH, 8-CH, 8-CH — 25  3.13 to 5.5 C, V, M 80 LQFP, 
12-bit 8-bit 16-bit 16-bit 112 LQFP,
144 LQFP
S12XEQ384 50 MHz 384 KB 24 KB — 4 KB    4 4 3 1 2x12-CH, 8-CH, — — 8-CH, — 4-CH — 25  3.13 to 5.5 C, V, M 80 LQFP, 
12-bit 8-bit 16-bit 112 LQFP,
144 LQFP
S12XET512 50 MHz 512 KB 32 KB — 4 KB    3 6 3 2 24-CH, 8-CH, — — 8-CH, — Up to — 25  3.13 to 5.5 C, V, M 80 QFP, 
12-bit 8-bit 16-bit 4-CH 112 LQFP,
144 LQFP
S12XET384 50 MHz 384 KB 24 KB — 4 KB    3 6 3 2 24-CH, 8-CH, — — 8-CH, — Up to — 25  3.13 to 5.5 C, V, M 80 QFP, 
12-bit 8-bit 16-bit 4-CH 112 LQFP,
144 LQFP
S12XET256 50 MHz 256 KB 16 KB — 4 KB    3 4 3 1 2x12-CH, 8-CH, — — 8-CH, — 4-CH — 25  3.13 to 5.5 C, V, M 80 LQFP, 
12-bit 8-bit 16-bit 112 LQFP,
144 LQFP
S12XEG384 50 MHz 384 KB 24 KB — 4 KB    2 6 3 2 24-CH, 8-CH, — — 8-CH, — Up to — 25  3.13 to 5.5 C, V, M 80 QFP, 
12-bit 8-bit 16-bit 4-CH 112 LQFP,
144 LQFP
S12XEG256 50 MHz 256 KB 16 KB — 4 KB    2 4 3 1 16-CH, 8-CH, — — 8-CH, — Up to — 25  3.13 to 5.5 C, V, M 112 LQFP 
12-bit 8-bit 16-bit 4-CH
S12XEG128 50 MHz 128 KB 12 KB — 2 KB    2 2 2 1 16-CH, 8-CH, — — 8-CH, — Up to — 25  3.13 to 5.5 C, V, M 80 QFP, 
12-bit 8-bit 16-bit 2-CH 112 LQFP
S12XEA256 54 MHz 256 KB 16 KB — 4 KB    3 2 3 1 8-CH, 8-CH, — — 8-CH, — Up to — 25  3.13 to 5.5 C, V, M 80 QFP 
12-bit 8-bit 16-bit 8-CH
S12XEA128 50 MHz 128 KB 12 KB — 2 KB    2 2 2 1 12-CH, 8-CH, — — 8-CH, — Up to — 25  3.13 to 5.5 C, V, M 80 QFP 
12-bit 8-bit 16-bit 8-CH
S12XES384 55 MHz 384 KB 24 KB — 4 KB    1 2 1 1 16-CH, 8-CH, — — 8-CH, — Up to — 25  3.13 to 5.5 C, V, M 80 QFP, 
12-bit 8-bit 16-bit 8-CH 112 LQFP,
144 LQFP
S12GA128 25 mhZ 128 KB 8 KB — 4 KB — —  — 1 3 3 — 12-CH, 12-bit 8-CH, 8- — — — 8-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, M 48 LQFP, 
bit 64 LQFP, 100
LQFP,
S12GA96 25 mhZ 96 KB 8 KB — 4 KB — —  — 1 3 3 — 12-CH, 12-bit 8-CH, 8- — — — 8-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, M 48 LQFP, 
bit 64 LQFP, 100
LQFP,
S12GA64 25 mhZ 64 KB 4 KB — 2 KB — —  — 1 2 2 — 12-CH, 12-bit 6-CH, 8- — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, 48 LQFP, 
bit M, W 64 LQFP
S12G64 25 mhZ 64 KB 4 KB — 2 KB — —  — 1 2 2 — 12-CH, 10-bit 6-CH, 8- — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, 32 LQFP, 48 
bit M, W LQFP,
64 LQFP

SG187 (Selector Guide) (3Q2015) – 27

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
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S12 and S12X Families (continued)

Device Bus Flash RAM Data EEPROM XGATE MPU ECC FlexRa CAN SCI SPI I2C Analog (ADC) PWM Motor SSD ECT Timer PIT LCD KWU EBI Operat- Temp. Package In
Fre- Flash y ing Range1 Options Produc-
quency Voltage tion
S12GA48 25 mhZ 48 KB 4 KB — 1.5 KB — —  — 1 2 2 — 12-CH, 12-bit 6-CH, 8- — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, 48 LQFP, 
bit M, W 64 LQFP
S12G48 25 mhZ 48 KB 4 KB — 1.5 KB — —  — 1 2 2 — 12-CH, 10-bit 6-CH, 8- — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, 32 LQFP, 48 
bit M, W LQFP,
64 LQFP
S12GNA48 25 mhZ 48 KB 4 KB — 1.5 KB — —  — — 2 2 — 12-CH, 12-bit 6-CH, 8- — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, 48 LQFP, 
bit M, W 64 LQFP
S12GN48 25 mhZ 48 KB 4 KB — 1.5 KB — —  — — 2 2 — 12-CH, 10-bit 6-CH, 8- — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, 32 LQFP, 48 
bit M, W LQFP,
64 LQFP
S12GNA32 25 mhZ 32 KB 2 KB — 1 KB — —  — — 1 1 — 8-CH, 12-bit 6-CH, 8- — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, 48 LQFP 
bit M, W
S12GN32 25 mhZ 32 KB 2 KB — 1 KB — —  — — 1 1 — 8-CH, 12-bit 6-CH, 8- — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, 20 TSSOP, 
bit M, W 32 LQFP,
48 LQFP,
48 QFN
S12GNA16 25 mhZ 16 KB 1 KB — 512 B — — — — — 1 1 — 8-CH, 12-bit 6-CH, 8- — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, 48 LQFP 
bit M, W
S12GN16 25 mhZ 16 KB 1 KB — 512 B — —  — — 1 1 — 8-CH, 10-bit 6-CH, 8- — — — 6-CH, 16-bit — — 16 — 3.13 to 5.5 C, V, 20 TSSOP, 32 
bit M, W LQFP, 48
LQFP, 48 QFP
S12G192 25 MHz 192 KB 11 KB — 4 KB — —  — 1 3 3 — 16-CH, 10-bit 8-CH, — — — 8-CH, — — — — 3.13 to 5.5 M 20 TSSOP, 
8-bit 16-bit 32 LQFP,
48 LQFP,
48 QFN,
64 LQFP,
100 LQFP
S12G240 25 MHz 240 KB 11 KB — 4 KB — —  — 1 3 3 — 16-CH, 10-bit 8-CH, — — — 8-CH, — — — — 3.13 to 5.5 M 20 TSSOP, 
8-bit 16 -bit 32 LQFP,
48 LQFP,
48 QFN,
64 LQFP,
100 LQFP
S12GN32 25 MHz 32 KB 2 KB — 1 KB — —  — — 1 1 — 8-CH, 10-bit 6-CH, — — — 6-CH, — — — — 3.13 to 5.5 M 20 TSSOP, 
8-bit 16-bit 32 LQFP,
48 LQFP,
48 QFN,
64 LQFP,
100 LQFP
S12G128 25 MHz 128 KB 8 KB — 4 KB — — — — 1 3 3 — 12-CH, 10-bit 8-CH, — — — 8-CH, — — — — 3.13 to 5.5 M 48 LQFP, 
8-bit 16-bit 64 LQFP,
100 LQFP
S12G96 25 MHz 96 KB 8 KB — 3 KB — — — — 1 3 3 — 12-CH, 10-bit 8-CH, — — — 8-CH, — — — — 3.13 to 5.5 M 48 LQFP, 
8-bit 16-bit 64 LQFP,
100 LQFP
S12XS256 40 MHz 256 KB 12 KB 8 KB —  1 2 1 — 16-CH, 8-CH, — — — 8-CH, 4-CH — 18 3.13 to 5.5 C, V, 64 LQFP, 
12-bit 8-bit 16-bit M, J 80 QFP,
112 LQFP,
KGD
S12XS128 40 MHz 128 KB 8 KB 8 KB —  1 2 1 — 16-CH, 8-CH, — — — 8-CH, 4-CH — 18 3.13 to 5.5 C, V, 64 LQFP, 
12-bit 8-bit 16-bit M, J 80 QFP,
112 LQFP,
KGD
S12XS64 40 MHz 64 KB 4 KB 4 KB —  1 2 1 — 16-CH, 8-CH, — — — 8-CH, 4-CH — 18 3.13 to 5.5 C, V, 64 LQP, 
12-bit 8-bit 16-bit M, J 80 QFP,
112 LQFP,
KGD
S12XF512 50 MHz 512 KB 32 KB — 4KB    1 2 2 — 16-CH, 6-CH, — — — 8-CH, 4-CH — 11 3.13 to 5.5 C, V, M 112 LQFP, 
12-bit 15-bit 16-bit 64 LQFP
S12XF384 50 MHz 384 KB 24 KB — 4KB    1 2 2 — 16-CH, 6-CH, — — — 8-CH, 4-CH — 11 3.13 to 5.5 C, V, M 112 LQFP, 
12-bit 15-bit 16-bit 64 LQFP
S12XF256 50 MHz 256 KB 20 KB — 2 KB    1 2 2 — 16-CH, 6-CH, — — — 8-CH, 4-CH — 11 3.13 to 5.5 C, V, M 112 LQFP, 
12-bit 15-bit 16-bit 64 LQFP

SG187 (Selector Guide) (3Q2015) – 28

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

S12 and S12X Families (continued)

Device Bus Flash RAM Data EEPROM XGATE MPU ECC FlexRa CAN SCI SPI I2C Analog (ADC) PWM Motor SSD ECT Timer PIT LCD KWU EBI Operat- Temp. Package In
Fre- Flash y ing Range1 Options Produc-
quency Voltage tion
S12XF128 50 MHz 128 KB 16 KB — 2 KB    1 2 2 — 16-CH, 6-CH, — — — 8-CH, 4-CH — 11 3.13 to 5.5 C, V, M 112 LQFP, 
12-bit 15-bit 16 -bit 64 LQFP
S12XHZ512 40 MHz 512 KB 32 KB — 4 KB  2 2 1 2 16-CH, 8-CH, 24/6 6 8-CH, 4-CH 32x4 8  4.5 to 5.5 C, V, M 112 LQFP, 
10-bit 8-bit 16-bit 144 LQFP
S12XHZ384 40 MHz 384 KB 28 KB — 4 KB  2 2 1 2 16-CH, 8-CH, 24/6 6 8-CH, 4-CH 32x4 8  4.5 to 5.5 C, V, M 112 LQFP, 
10-bit 8-bit 16-bit 144 LQFP
S12XHZ256 40 MHz 256 KB 16 KB — 4 KB  2 2 1 2 16-CH, 8-CH, 24/6 6 8-CH, — 4-CH 32x4 8  4.5 to 5.5 C, V, M 112 LQFP, 
10-bit 8-bit 16-bit 144 LQFP
S12XHY256 40 MHz 256 KB 12 KB 8 KB -  -   2 2 1 - 12-ch., 8-CH, 16/4 4 - - 16- 40 x 25 - 4.5 to 5.5 C, V, M 100 LQFP, 
10-bit 8-bit/ CH., 4 112 LQFP
4-CH, 16-bit
16-bit
S12XHY128 40 MHz 128 KB 8KB 8 KB -  -   2 2 1 - 12-ch., 8-CH, 16/4 4 - - 16- 40 x 25 - 4.5 to 5.5 C, V, M 100 LQFP, 
10-bit 8-bit/ CH., 4 112 LQFP
4-CH, 16-bit
16-bit
S12P128 32 MHz 128 KB 6 KB 4 KB —  1 1 1 — 10-CH, 6-CH, — — — 8-CH, — — 12 3.13 to 5.5 C, V, M 80 QFP, 
12-bit 8-bit 16 -bit 64 LQFP,
48 QFN
S12P96 32 MHz 96 KB 6 KB 4 KB —  1 1 1 — 10-CH, 6-CH, — — — 8-CH, — — 12 3.13 to 5.5 C, V, M 80 QFP, 
12-bit 8-bit 16 -bit 64 LQFP,
48 QFN
S12P64 32 MHz 64 KB 4 KB 4 KB —  1 1 1 — 10-CH, 6-CH, — — — 8-CH, — — 12 3.13 to 5.5 C, V, M 80 QFP, 
12-bit 8-bit 16-bit 64 LQFP,
48 QFN
S12P32 32 MHz 32 KB 2 KB 4 KB —  1 1 1 — 10-CH, 6-CH, — — — 8-CH, — — 12 3.13 to 5.5 C, V, M 80 QFP, 
12-bit 8-bit 16-bit 64 LQFP,
48 QFN
S12HZ128 25 MHz 128 KB 6 KB — 2 KB 2 2 1 1 16-CH, 6-CH, 16/4 4 — 8-CH, — 32x4 8 4.5 to 5.5 C, V, M 112 LQFP 
10-bit 8-bit 8-bit
S12HZ64 25 MHz 64 KB 4 KB — 1 KB 1 1 1 — 8-CH, 4-CH, 16/4 4 — 8-CH, — 24x4 8 4.5 to 5.5 C, V, M 80 QFP, 
10-bit 8-bit 8-bit 112 LQFP
S12HN64 25 MHz 64 KB 4 KB — 1 KB 1 1 — 8-CH, 4-CH, 16/4 4 — 8-CH, — 24x4 8 4.5 to 5.5 C, V, M 80 QFP, 
10-bit 8-bit 8-bit 112 LQFP
S12HY64 32 MHz 64 KB 4 KB 4 KB — 1 1 1 1 8-CH, 8-CH, 16/4 Support — 8-CH+8-CH — 40x4 22 3.13 to 5.5 C, V, M 64 LQFP, 
10-bit 8-bit 16-bit 100 LQFP
S12HA64 32 MHz 64 KB 4 KB 4 KB — 1 1 1 8-CH, 8-CH, 16/4 Support — 8-CH+8-CH — 40x4 22 3.13 to 5.5 C, V, M 64 LQFP, 
10-bit 8-bit 16-bit 100 LQFP
S12HY48 32 MHz 48 KB 4 KB 4 KB — 1 1 1 1 8-CH, 8-CH, 16/4 Support — 8-CH+8-CH — 40x4 22 3.13 to 5.5 C, V, M 64 LQFP, 
10-bit 8-bit 16-bit 100 LQFP
S12HA48 32 MHz 48 KB 4 KB 4 KB — 1 1 1 8-CH, 8-CH, 16/4 Support — 8-CH+8-CH — 40x4 22 3.13 to 5.5 C, V, M 64 LQFP, 
10-bit 8-bit 16-bit 100 LQFP
S12HY32 32 MHz 32 KB 2 KB 4 KB — 1 1 1 1 8-CH, 8-CH, 16/4 Support — 8-CH+8-CH — 40x4 22 3.13 to 5.5 C, V, M 64 LQFP, 
10-bit 8-bit 16-bit 100 LQFP
S12HA32 32 MHz 32 KB 2 KB 4 KB — 1 1 1 8-CH, 8-CH, 16/4 Support — 8-CH+8-CH — 40x4 22 3.13 to 5.5 C, V, M 64 LQFP, 
10-bit 8-bit 16-bit 100 LQFP
1. C = -40 °C to +85 °C, V = -40 °C to +105 °C, M = -40 °C to +125 °C, J = -40 °C to +140 °C, W = -40 °C to +150 °C

SG187 (Selector Guide) (3Q2015) – 29

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

S12 MagniV Mixed-signal MCUs

Device Bus Flash RAM EEPROM ECC CAN CAN- SCI LIN- SPI I2C Ext. Ana- Int. Ana- PWM Timer LCD KWU Motor High Volt- Other Vreg Ext. Operating Temp. Package In
Fre- PHY PHY log (ADC) log (ADC) age Input Analog Supply Voltage Range1 Options Produc-
quency tion
S12ZVCA192 32 MHz 192 KB 12 KB 2 KB  1 1 2 — 2 1 16-CH, 12- 4+4-CH, 8+4-CH, — 34 — 2-CH HVI, 2-CH 2 5.0 V/20 C, M, V, 64 LQFP-
bit 16-bit 16-bit Vsup Sense ACMP, mA W EP, 48
DAC LQFP
S12ZVCA128 32 MHz 128 KB 12 KB 2 KB  1 1 2 — 2 1 16-CH, 12- 4+4-CH, 8+4-CH, — 34 — 2-CH HVI, 2-CH 2 5.0 V/20 C, M, V, 64 LQFP-
bit 16-bit 16-bit Vsup Sense ACMP, mA W EP, 48
DAC LQFP
S12ZVCA96 32 MHz 96 KB 12 KB 2 KB  1 1 2 — 2 1 16-CH, 12- 4+4-CH, 8+4-CH, — 34 — 2-CH HVI, 2-CH 2 5.0 V/20 C, M, V, 64 LQFP-
bit 16-bit 16-bit Vsup Sense ACMP, mA W EP, 48
DAC LQFP
S12ZVCA64 32 MHz 64 KB 4 KB 1 KB  1 1 2 — 2 1 16-CH, 12- 4+4-CH, 8+4-CH, — 34 — 2-CH HVI, 2-CH 2 5.0 V/20 C, M, V, 64 LQFP-
bit 16-bit 16-bit Vsup Sense ACMP, mA W EP, 48
DAC LQFP
S12ZVC192 32 MHz 192 KB 12 KB 2 KB  1 1 2 — 2 1 16-CH, 10- 4+4-CH, 8+4-CH, — 34 — 2-CH HVI, — 2 5.0 V/20 C, M, V, 64 LQFP-
bit 16-bit 16-bit Vsup Sense mA W EP, 48
LQFP
S12ZVC128 32 MHz 128 KB 12 KB 2 KB  1 1 2 — 2 1 16-CH, 10- 4+4-CH, 8+4-CH, — 34 — 2-CH HVI, — 2 5.0 V/20 C, M, V, 64 LQFP-
bit 16-bit 16-bit Vsup Sense mA W EP, 48
LQFP
S12ZVC96 32 MHz 96 KB 12 KB 2 KB  1 1 2 — 2 1 16-CH, 10- 4+4-CH, 8+4-CH, — 34 — 2-CH HVI, — 2 5.0 V/20 C, M, V, 64 LQFP-
bit 16-bit 16-bit Vsup Sense mA W EP, 48
LQFP
S12ZVC64 32 MHz 64 KB 4 KB 1 KB  1 1 2 — 2 1 16-CH, 10- 4+4-CH, 8+4-CH, — 34 — 2-CH HVI, — 2 5.0 V/20 C, M, V, 64 LQFP-
bit 16-bit 16-bit Vsup Sense mA W EP, 48
LQFP
S12ZVL32 32 MHz 32 KB 1 KB 128 B  — — 2 1 1 1 10-CH, 10- 8-CH, 8- 6+2-CH, — 23 — 1-CH HVI, 3-CH 1 5.0 V/20 C, V, M 48 LQFP,
bit bit or 4- 16-bit Vsup Sense NGPIO mA 32-LQFP
CH, 16- (5.0 V/25
bit mA)
S12ZVL16 32 MHz 16 KB 1 KB 128 B  — — 2 1 1 1 10-CH, 10- 8-CH, 8- 6+2-CH, — 23 — 1-CH HVI, 3-CH 1 5.0 V/20 C, V, M 48 LQFP,
bit bit or 4- 16-bit Vsup Sense NGPIO mA 32-LQFP
CH, 16- (5.0 V/25
bit mA)
S12ZVL8 32 MHz 8 KB 1 KB 128 B  — — 2 1 1 1 10-CH, 10- 8-CH, 8- 6+2-CH, — 23 — 1-CH HVI, 3-CH 1 5.0 V/20 C, V, M 48 LQFP,
bit bit or 4- 16-bit Vsup Sense NGPIO mA 32-LQFP
CH, 16- (5.0 V/25
bit mA)
S12ZVLS32 32 MHz 32 KB 1 KB 128 B  — — 2 1 1 1 10-CH, 10- 8-CH, 8- 6+2-CH, — 23 — 1-CH HVI, 3-CH 1 5.0 V/20 C, V, M 32 QFN
bit bit or 4- 16-bit Vsup Sense NGPIO mA
CH, 16- (5.0 V/25
bit mA)
S12ZVLS16 32 MHz 16 KB 1 KB 128 B  — — 2 1 1 1 10-CH, 10- 8-CH, 8- 6+2-CH, — 23 — 1-CH HVI, 3-CH 1 5.0 V/20 C, V, M 32 QFN
bit bit or 4- 16-bit Vsup Sense NGPIO mA
CH, 16- (5.0 V/25
bit mA)
S12VR64 25 MHz 64 KB 2 KB 512 B  — — 2 1 1 — 6-CH, 10-bit 4-CH, 10- 4-CH, 8- 4-CH, — 6 2-CH 4-CH HVI, 2-CH, 2 5.0 V, 20 6.0 to 18 C, V 32 LQFP, 
bit bit 16 -bit Relay, LS Vbat-Sense, HS mA 48 LQFP
Driver Vsup Sense Driver
S12VR48 25 MHz 48 KB 2 KB 512 B  — — 2 1 1 — 6-CH, 10-bit 4-CH, 10- 4-CH, 8- 4-CH, — 6 2-CH 4-CH HVI, 2-CH, 2 5.0 V, 20 6.0 to 18 C, V 32 LQFP, 
bit bit 16 -bit Relay, LS Vbat-Sense, HS mA 48 LQFP
Driver Vsup Sense Driver
S12ZVH128 32 MHz 128KB 8 KB 4 KB  1 1 2 — 1 1 8-CH, 10-bit 8-CH, 10- 8-CH(8- Two 8- 4x40 24 4 Stepper Vbat-Sense, — 2 5.5 V to 18 C, V 100 LQFP, 
bit bit), 4- CH x16- Vsup-Sense V 144 LQFP
CH(16- bit
bit)
S12ZVH64 32 MHz 64 KB 4 KB 4 KB  1 1 2 — 1 1 8-CH, 10-bit 8-CH, 10- 8-CH(8- Two 8- 4x40 24 4 Stepper Vbat-Sense, — 2 5.5 V to 18 C, V 144 LQFP 
bit bit), 4- CH x16- Vsup-Sense V
CH(16- bit
bit)
S12ZVHY64 32 MHz 64 KB 4 KB 2 KB  1 — 2 — 1 1 8-CH, 10-bit 8-CH, 10- 8-CH(8- Two 8- 4x40 24 2 Stepper Vbat-Sense, — 1 5.5 V to 18 C, V 100 LQFP, 
bit bit), 4- CH x16- Vsup-Sense V 144 LQFP
CH(16- bit
bit)

SG187 (Selector Guide) (3Q2015) – 30

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S12 MagniV Mixed-signal MCUs (continued)

Device Bus Flash RAM EEPROM ECC CAN CAN- SCI LIN- SPI I2C Ext. Ana- Int. Ana- PWM Timer LCD KWU Motor High Volt- Other Vreg Ext. Operating Temp. Package In
Fre- PHY PHY log (ADC) log (ADC) age Input Analog Supply Voltage Range1 Options Produc-
quency tion
S12ZVHY32 32 MHz 32 2 KB 2 KB  1 — 2 — 1 1 8-CH, 10-bit 8-CH, 10- 8-CH (8- Two 8- 4x40 24 2 Stepper Vbat-Sense, — 1 5.5 V to 18 C, V 100 LQFP, 
MHz bit bit), 4- CH x 16- Vsup-Sense V 144 LQFP
CH (16- bit
bit)
S12ZVHL64 32 MHz 64 KB 4 KB 2 KB  1 — 2 1 1 1 8-CH, 10-bit 8-CH, 10- 8-CH (8- Two 8- 4x40 24 2 Stepper Vbat-Sense, — 1 5.5 V to 18 C, V 100 LQFP, 
bit bit), 4- CH x 16- Vsup-Sense V 144 LQFP
CH (16- bit
bit)
S12ZVFP64 32 MHz 64 KB 4 KB 2 KB  1 — 2 1 1 1 8-CH, 10-bit 8-CH, 10- 8-CH (8- Two 8- 4x40 24 — Vbat-Sense, — 1 5.5 V to 18 C, V 100 LQFP, 
bit bit), 4- CH x 16- Vsup-Sense V 144 LQFP
CH (16- bit
bit)
S12ZVML128 50 MHz 128 KB 8 KB 512 B  1 — 2 1 1 — 4+5-CH, 12- 8-CH, 12- 6-CH, 4-CH, 16- — 6 BLDC/ Vsup-Sense 6-CH 2 — 3.5 V to 20 V, M, W 64 LQFP- 
bit bit 15-bit bit PMSM Gate V EP
Drive
Unit
S12ZVMC128 50 MHz 128 KB 8 KB 512 B  1 — 2 — 1 — 4+5-CH, 12- 8-CH, 12- 6-CH, 4-CH, 16- — 6 BLDC/ Vsup-Sense 6-CH 2 — 3.5 V to 20 V, M, W 64 LQFP- 
bit bit 15-bit bit PMSM Gate V EP
Drive
Unit
S12ZVML64 51 MHz 64 KB 4 KB 512 B  1 — 2 1 1 — 4+5-CH, 12- 8-CH, 12- 6-CH, 4-CH, 16- — 6 BLDC/ Vsup-Sense 6-CH 1 — 3.5 V to 20 V, M, W 64 LQFP- 
bit bit 15-bit bit PMSM Gate V EP
Drive
Unit
S12ZVMC64 52 MHz 64 KB 4 KB 512 B  1 — 2 — 1 — 4+5-CH, 12- 8-CH, 12- 6-CH, 4-CH, 16- — 6 BLDC/ Vsup-Sense 6-CH 2 — 3.5 V to 20 V, M, W 64 LQFP- 
bit bit 15-bit bit PMSM Gate V EP
Drive
Unit
S12ZVML32 50 MHz 32 KB 4 KB 512 B  1 — 2 1 1 4+5-CH, 12- 8-CH, 12- 6-CH, 4-CH, 16- 6 BLDC/ Vsup-Sense 1 5.0 V, 20 3.5 V to 20 V, M, W 64 LQFP- 
bit bit 15-bit bit PMSM mA V EP
S12ZVM32 50 MHz 32 KB 4 KB 128 B  — 2 1 4+5-CH, 12- 8-CH, 12- 6-CH, 4-CH, 16- 6 BLDC/ Vsup-Sense HV-PHY, 1 5.0 V, 20 3.5 V to 20 V, M, W 64 LQFP-
bit bit 15-bit bit PMSM 6-CH mA V EP, 48
Gate LQFP-EP
Drive
Unit
S12ZVM31 50 MHz 32 KB 2 KB  1 1 1 4+5-CH, 12- 8-CH, 12- 6-CH, 4-CH, 16- 6 BLDC/ Vsup-Sense 6-CH 1 3.5 V to 20 V, M, W 64 LQFP-
bit bit 15-bit bit PMSM Gate V EP
Drive
Unit
S12ZVM16 50 MHz 16 KB 2 KB 128 B  2 1 4+5-CH, 12- 8-CH, 12- 6-CH, 4-CH, 16- 6 BLDC/ Vsup-Sense HV-PHY, 1 5.0 V, 20 3.5 V to 20 V, M, W 64 LQFP-
bit bit 15-bit bit PMSM 6-CH mA V EP, 48
Gate LQFP-EP
Drive
Unit

1. C = -40 °C to +85 °C, V = -40 °C to +105 °C, M = -40 °C to +125 °C, J = -40 °C to +140 °C, W = -40 to +150 °C

SG187 (Selector Guide) (3Q2015) – 31

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DIGITAL SIGNAL CONTROLLERS

56800E Core—The 56800E MCU+DSP core was architected specifically to provide users Memory—On-board memory includes program flash and RAM, data flash and RAM, and
the ease of use of an MCU together with the performance of a DSP in a single core. BootFlash with EEPROM emulation capability. The modified Harvard architecture enables
56F8300 High-Performance Flash Series—The MC56F8300 series of controllers users to perform up to three simultaneous memory accesses.
combines the 56800E core with flash memory, motor control peripherals, and built-in Service—A full-range of services is offered for the controller devices including software,
safety features targeted specifically for automotive applications to provide 60 MIPS of support, training, and internal and third-party development tools.
performance over the full -40°C to 125°C temperature range. For additional information, visit:
Documentation, Tool, and Product Libraries:
www.freescale.com

56F8xxx Family
Product ROM RAM Flash Timer Serial GPIO A/D PWM Operating Operating Temperature Packaging Additional Information
(KB) (pins) Voltage Frequency
(V) (MHZ)
56F8013 0 4K 16K 4 x 16-bit 1 SCI/LIN + 1 SPI + 1 I2C 26 1 x 4-CH 1 x 6-CH 3.3 32 C, M 32-pin LQFP mcPWM with center alignment,
12-bit 1 x 4 channel Quad Decoder
56F8355 n/a 20K 280K 16 x 16-bit 2 SCI/LIN + 2 SPI + 1 CAN + 1 I2C 49 4 x 4-CH 2 x 6-CH 3.3 60 C, M 128-pin LQFP mcPWM with center alignment,
12-bit 2 x 4 channel Quad Decoder

KINETIS MCUS BASED ON ARM® TECHNOLOGY

Kinetis MCU families for automotive are based on ARM® Cortex Technology and For additional information, visit:
provide high scalability, cost-effective automotive-grade 32-bit portfolio for a wide range Documentation, Tool, and Product Libraries
of automotive applications. www.freescale.com
Designers will be benefited from the granted third party support for ARM technology and Automotive Home Page
they will maximize hardware and software reuse. www.freescale.com/automotive

Kinetis MCUs based on ARM® Technology

Device Core Program RAM EEPROM SCI SPI CAN I2C Other Timer Analog KBI Additional Operating Temp Debug Package In
Platform Flash Commu- (ADC) Features Voltage Range Options Produc-
nications tion

KEAZN8 48 MHz 8 KB 1 KB Emulate 1 1 0 1 - FTM, PIT, PWT, 12-CH, 12-bit 2x 8-bit LVD, BME, 2.7 to 5.5 C, V, M SWD 16 TSSOP, 24 
RTC ACMP, PMC, QFN
CRC
KEAZN16 40 MHz 16 KB 2 KB 256 B 3 2 0 2 - FTM, PIT, RTC 16-CH, 12-bit 2x 8-bit LVD, BME, 2.7 to 5.5 C, V, M SWD 32 LQFP, 64 
ACMP, PMC, LQFP
CRC
KEAZN32 40 MHz 32 KB 4 KB 256 B 3 1 0 2 - FTM, PIT, RTC 16-CH, 12-bit 2x 8-bit LVD, BME, 2.7 to 5.5 C, V, M SWD 32 LQFP, 64 
ACMP, PMC, LQFP
CRC
KEAZN64 40 MHz 64 KB 4 KB 256 B 3 1 0 2 - FTM, PIT, RTC 16-CH, 12-bit 2x 8-bit LVD, BME, 2.7 to 5.5 C, V, M SWD 32 LQFP, 64 
ACMP, PMC, LQFP
CRC
KEAZ64 48 MHz 64 KB 8 KB Emulate 3 1 1 2 - FTM, PIT, PWT, 16-CH, 12-bit 2x 32-bit LVD, BME, 2.7 to 5.5 C, V, M SWD 64 LQFP, 80 
RTC ACMP, PMC, LQFP
CRC
KEAZ128 48 MHz 128 KB 16 KB Emulate 3 2 1 2 - FTM, PIT, PWT, 16-CH, 12-bit 2x 32-bit LVD, BME, 2.7 to 5.5 C, V, M SWD 64 LQFP, 80 
RTC ACMP, PMC, LQFP
CRC

SG187 (Selector Guide) (3Q2015) – 32

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MAC57DXXX 32-BIT ARM®-BASED MCUS

The MAC57Dxxx family is the next-generation platform of devices specifically targeted For additional information, visit:
at driver information systems (DIS) market using single and dual high resolution Documentation, Tool, and Product Libraries
displays. www.freescale.com
Automotive Home Page
Leveraging the highly successful MPC56xxS product families, our next generation www.freescale.com/automotive
product families powered by ARM® processors, coupled with 2D graphics accelerators,
Head Up Display (HUD) warping engines, high resolution displays, integrated stepper
motor drivers with patented stepper stall detect offering leading-edge performance and
scalability for cost-effective applications.

MAC57Dxxx 32-bit ARM®-Based MCUs

Device Multi Core Pro- SRA Graph- eDMA EEPROM Display Dis- Seg- Graph- Digital Step- I/O MLB UART SPI CA I2C Ether- Sound DRAM Flash Oper- Temp Debug Secu- Func- Pack- In
Core Fre- gram M ics Resolu- play ment ics Video per Pro- /LIN N net Genera- Sup- Sup- ating Range rity tional age Pro-
Plat- quency Flash RAM tion Inter- LCD Acceler- Input Motor ces- (FD) tor port port volt- Safety Optio duc-
form faces ator Driver sor age ns tion

MAC57D54H ARM (A5)320 4 MB 2x 1.3 MB 2 x 16 Emulated Up to 2 x 2x 4x40 OpenVG Yes 6 Yes MLB 3 5 3 2 10/100 Yes 16-bit 2x 3.3, 5 V JTAG, CSE2
Cortex MHz, 512 (1 MB Ch : 2 x (4 x WVGA dRGB, 1.1 50 +AVB SDR, Dual Trace
-A5, (M4)160 KB Flex 16 kB + 1x 16/32- DDR
ARM MHz, ECC 64 kB) RSDS, bit Quad
Cortex (M0+)80 option) 1x DDR2 SPI
-M4, MHz LVDS
ARM
Cortex
-M0+
MAC57D53M ARM (A5)320 3 MB 2x 1.3 MB 2 x 16 Emulated Up to 2 x 2x 4x40 OpenVG Yes 6 Yes MLB 3 5 3 2 10/100 Yes 16-bit 2x 3.3, 5 V JTAG, CSE2
Cortex MHz, 512 (1 MB Ch : 2 x (4 x WVGA dRGB, 1.1 50 +AVB SDR, Dual Trace
-A5, (M4)160 KB Flex 16 kB + 1x 16/32- DDR
ARM MHz, ECC 64 kB) RSDS, bit Quad
Cortex (M0+)80 option) 1x DDR2 SPI
-M4, MHz LVDS
ARM
Cortex
-M0+
MAC57D52L ARM (A5)320 2 MB 2x 1.3 MB 2 x 16 Emulated Up to 2 x 2x 4x40 OpenVG Yes 6 Yes MLB 3 5 3 2 10/100 Yes 16-bit 2x 3.3, 5 V JTAG, CSE2
Cortex MHz, 512 (1 MB Ch : 2 x (4 x WVGA dRGB, 1.1 50 +AVB SDR, Dual Trace
-A5, (M4)160 KB Flex 16 kB + 1x 16/32- DDR
ARM MHz, ECC 64 kB) RSDS, bit Quad
Cortex (M0+)80 option) 1x DDR2 SPI
-M4, MHz LVDS
ARM
Cortex
-M0+

SG187 (Selector Guide) (3Q2015) – 33

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64-BIT S32V MCUS BASED ON ARM® TECHNOLOGY

The S32V200 family of processors are robust, efficient, flexible solutions for Automotive For additional information, visit:
Advanced Driver Assistance Systems (ADAS) including applications like pedestrian Documentation, Tool, and Product Libraries
detection, object detection, lane departure warning, smart head beam control and traffic www.freescale.com
sign recognition, amongst others.
Automotive Home Page
www.freescale.com/automotive

64-bit S32V MCUs Based on ARM® Technology

Device Core Core Cache SRAM DMA Video Graph- Image Cam- Display DRAM Flash USB CAN MLB SD/ I2C SPI UART Ether- HDD SSI/ Sam- SPDIF PIT 3.3 V Oper- Temp. Pack- In
Plat- Fre- Acceler- ics Proces- era Interface Sup- Sup- (2.0) MMC net Inter- I2S ple I/O GPIO ating Range age Pro-
form quency ator Acceler- sor Input port port SDIO face Rate Volt- Option duc-
ator age s tion
S32V234 Quad 1 GHz L1: 32 4 MB 32 - H.264 OpenGL Image MIPI- TFT, up to x64 Quad x 2x x 1 3 4 2 1 GB x x x x 2  1.0 V ± V 621 x
ARM KB/ 32 CH and ES3.0 3D Signal CSI, 150 LPDDR Serial CAN- with 5% for Flip
Cortex™ KB I/D MJPEG Processor VIU-Lite MPixels/ 2, Flash FD IEEE® digital Chip
-A53 per encode (ISP) + sec (e.g. DDR3 Controll 1588 core BGA,
core and Dual 1920 and er input 17x17
L2: 256 decode APEX2- x1080 60 DDR3L (QuadS supply mm
KB CL Image Hz) PI) voltage
Unified Cognition
per Processor
cluster

SG187 (Selector Guide) (3Q2015) – 34

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32-BIT MCUS BASED ON POWER ARCHITECTURE® TECHNOLOGY

Power Architecture is the world's leading architecture for automotive powertrain control, For additional information, visit:
body electronics, safety and chassis, and instrument cluster applications. Our Documentation, Tool, and Product Libraries
automotive qualified 32-bit processors built on Power Architecture technology deliver www.freescale.com
highly integrated single and multicore solutions for many automotive design needs. With
32-bit MCUs microcontrollers based on Power Architecture® Technology, you get a full Automotive Home Page
range of performance and memory options so you can design scalable applications for www.freescale.com/automotive
more fuel-efficient, safer and secure automobiles.The 32-bit MCUs MPC56xx portfolio 32-Bit MCUS Based On Power Architecture® Technology Home Page
will continue to grow with devices that offer expanded sets of memory, connectivity and www.freescale.com/32bitMCUS
performance options.

32-bit MPC56xx and MPC57xx MCUs Built on Power Architecture® Technology

Device Core Bus Pro- SRAM DMA EEPROM MPU/ CTU CSE/ SCI DSPI CAN I2C FlexRay™ Ethernet MLB Other Peripher- eTPU eMIOS Motor PIT Analog Operat- Temp. Debug Package In
Plat- Fre- gram MMU HSM (LIN- (100BaseT) als Control (ADC, ing Range Options Pro-
form quency Flash Flex) Timers DAC) Voltage 1 duction

MPC5775K Dual Z7 Z7 4 MB 1.5 MB Safe No No No 4 4 4 of 3 128 msg 1 No SPT (Signal No No 2xPWM No 8xDelta 3.3 V I/ -40 to Nexus 3+ 17x17
Process cores at with with DMA which Processing Unit) Sigma O, 1.2 V 150 Tj 356
or, 266 ECC ECC 1 is FD for Radar @ 10 Core PBGA
lockstep Mhz, Algorithms, MHz;
Z4 Z4 2xCross Trig 4x12bit
cores at Unit, 3xeTimers, SAR @
133 2xSENT, Temp 1Mz;
MHz Sensor 2M/s 8-
bit DAC
MPC5774K Dual Z7 Z7 3 MB 1.0 MB Safe No No No 4 4 4 of 3 128 msg 1 No SPT (Signal No No 2xPWM No 8xDelta 3.3 V I/ -40 to Nexus 3+ 17x17
Process cores at with with DMA which Processing Unit) Sigma O, 1.2 V 150 Tj 356
or, 266 ECC ECC 1 is FD for Radar @ 10 Core PBGA
lockstep Mhz, Algorithms, MHz;
Z4 Z4 2xCross Trig 4x12bit
cores at Unit, 3xeTimers, SAR @
133 2xSENT, Temp 1Mz;
MHz Sensor 2M/s 8-
bit DAC
MPC5744P 2x 180 2.5 MB 384 KB 32- Emulated 32 Entry  2 4 3  (3 x 6- 4- Quad, 3.3 C, V, M Nexus 3+, 144
e200z4 MHz CH in ch., E- CH 25-ch. MDO and LQFP,
Program Timer), External Aurora 257
Flash (2 x 12- , 12-bit interface MAPBGA
ch,
PWM)
MPC5746G Dual 2x180 6 MB 384 KB 96- 64 KB 32 entry  3 10 8 4    Up to 16 Up to 3.3 V, C, V, M Nexus 3+ 176
e200z7 MHz CH Data 96-CH, 32-CH, 5.0 V LQFP,
Flash 16-bit 12-bit, 256
48-CH, MAPBGA
10-bit ,
324
MAPBGA
MPC5747C e200x4, 180 4 MB 512 KB 32- Emulated 24-CH  Up to 10 8 4   Up to 16 Up to 3.3 V, C, V, M Nexus 3+ 176
e200x2 MHz, CH MPU 16 96-CH, 32-CH, 5.0 V LQFP,
80 MHz 16-bit 12-bit, 256
48-CH, MAPBGA
10-bi ,
324
MAPBGA

MPC5746R 3x 3 x 200 4 MB 320 KB 64- 256 KB 24 Entry  6 7 4 \   Zipwire, SENT 64-CH 32-CH 8 4x 3.3, 5 M Nexus 3+, 176
e200z4 MHz CH SAR, 3 JTAG LQFP-EP
x SD 252
MAPBGA
MPC5745R e200z4x 3 x 200 3 MB 256 KB 64- 256 KB 24 entry  6 7 4  Zipwire, SENT 64-CH 32-CH 8 4x 3.3 V, M Nexus 3+, 176
3 MHz CH SAR, 3 5.0 V JTAG LQFP,
x SD 252
MAPBGA
MPC5743R e200z4x 2 x 200 2 MB 160 KB 64- 256 KB 24 entry  5 5 4  Zipwire, SENT 64-CH 32-CH 8 4x 3.3 V, M Nexus 3+, 144
2 MHz CH SAR, 3 5.0 V JTAG LQFP,
x SD 176 LQFP
MPC5777C e200z7x 3 x 264 8 MB 512 KB 2x Emulated 32 entry CSE 5 5 6  Zipwire, SENT 96-CH 32-CH 4 2x 3.3 V, M Nexus 3+, 416
3 MHz 64- in eQADC, 5.0 V JTAG PBGA,
CH Program 3 x SD 516
Flash PBGA

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32-bit MPC56xx and MPC57xx MCUs Built on Power Architecture® Technology (continued)
Device Core Bus Pro- SRAM DMA EEPROM MPU/ CTU CSE/ SCI DSPI CAN I2C FlexRay™ Ethernet MLB Other Peripher- eTPU eMIOS Motor PIT Analog Operat- Temp. Debug Package In
Plat- Fre- gram MMU HSM (LIN- (100BaseT) als Control (ADC, ing Range Options Pro-
form quency Flash Flex) Timers DAC) Voltage 1 duction

MPC5747G Dual 180 4 MB 768 KB 32- Emulated 32-CH  Up to 10 8 4    USB Up to 16 Up to 3.3 V, C, V, M Nexus 3+ 176
e200x4, MHz, CH MPU 18 96-CH, 32-CH, 5.0 V LQFP,
e200x2 80 MH 16-bit 12-bit, 256
48-CH, MAPBGA
10-bi ,
324
MAPBGA

MPC5748C e200x4, 180 6 MB 768 KB 32- Emulated 24-CH  Up to 10 8 4   Up to 16 Up to 3.3 V, 5 C, V, M Nexus 3+ 176
e200x2 MHz, CH MPU 16 96-CH, 32-CH, V LQFP,
80 MH 16-bit 12-bit, 256
48-CH, MAPBGA
10-bi ,
324
MAPBGA

MPC5748G Dual 180 6 MB 768 KB 32- Emulated 32-CH Up to 10 8 4    USB Up to 16 Up to 3.3V, 5V C, V, M Nexus 3+ 176
e200x4, MHz, CH MPU 18 96-CH, 32-CH, LQFP,
e200x2 80 MH 16-bit 12-bit, 256
48-CH, MAPBGA
10-bi ,
324
MAPBGA

MPC5777M 3x 3 x 300 8 MB 596 KB 128- 8 x 64 KB Yes, No 6 8 4/1 2   248-CH 12 x 3.3, 5 M Nexus 3+, 416
e200z7 MHz + CH SAR, 10 Zipwire PBGA,
+1x 1x x SD Aurora, 512
e200z4 200MH JTAG PBGA
z
MPC5676R Dual 2x180 6 MB 384 KB 96- 64 KB 32 entry 3 5 4  96-CH Up to Up to 3.3V, 5V M Nexus 3+ 416 BGA,
e200z7 MHz CH Data 32-CH, 64-CH, 516 BGA
Flash 16-bit 12-bit
12
xDEC
Filters
MPC5674F e200z7 150, 4 MB 256 KB 64- Emulated MPU+  3 4 4  2x32- 32-CH Quad 3.3 V, M Nexus 3+ 324 BGA, 
200, CH + in 64 (MS CH 64-CH 5.0 V 416 BGA,
264 32- Program Entry B) 516 BGA
MHz CH Flash MMU
MPC5673F e200z7 150, 3 MB 192 KB 64- Emulated MPU+  3 4 4  2x32- 32-CH Quad 3.3 V, 5 M Nexus 3+ 324 BGA, 
200, CH + in 64 (MS CH 64-CH V 416 BGA,
264 32- Program Entry B) 516 BGA
MHz CH Flash MMU
MPC5673K Dual 2x180 1 MB 256 KB 2x 32- 64 KB   3 2 4 2   3x 1 4 x 12- 3.3 V, C, V, M Nexus 3+ 257 
e200z7 MHz CH PWM; bit,,34- 1.2 V MAPBGA
3x CH ,
ETIME 473
R MAPBGA
MPC5675K Dual 45 MHz 2 MB 512 KB 32- Emulated 64 entry  4 3 4 3 opt.  4- 4-CH, 3.3 V, 5 M, V Nexus 3+ 473 
e200z7 CH in CH 12-bit V MAPBGA
d Program ,
Flash 275
MAPBGA
MPC5674K Dual 180 1.5 MB 384 KB 2x 64KB  2 4 3 4 3   3x 4- 4 x 12- 3.3 V, C, V, M Nexus 3+ 257 
e200z7 MHz 32- PWM; CH bit, 34- 5.0 V MAPBGA
d CH 3x CH ,
ETIME 473
R MAPBGA
MPC5668G e200z6 116 2 MB 592KB 16- 64 KB 6 4 6 4    16-CH, 8- 36-CH, 3.3 V, V Nexus3 on 208 
+ MHz CH 24-bit CH 10-bit 5.0 V z6 and MAPBGA
e200z0 Nexus 2+
MPC5668E e200z0 116 2 MB 128 KB 32- Emulated 16 entry  12 4 5 4 32-CH, 8- 64-CH, 3.3 V, V, M JTAG, 208 
+ MHz CH in 16-bit CH 10-bit 5.0 V Nexus3 MAPBG,
e200z0 Program onz6 and 256
Flash Nexus2+ MAPBGA
only for
devt.
MPC5604E e200z0 64 MHz 512 KB 96 KB 16- 64 KB yes 2 3 1 3  1 x E- 1 8-CH, 3.0 V, C, V, M Nexus 2+ 64 LQFP 
h CH Timer 10-bit 1.2 V

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32-bit MPC56xx and MPC57xx MCUs Built on Power Architecture® Technology (continued)
Device Core Bus Pro- SRAM DMA EEPROM MPU/ CTU CSE/ SCI DSPI CAN I2C FlexRay™ Ethernet MLB Other Peripher- eTPU eMIOS Motor PIT Analog Operat- Temp. Debug Package In
Plat- Fre- gram MMU HSM (LIN- (100BaseT) als Control (ADC, ing Range Options Pro-
form quency Flash Flex) Timers DAC) Voltage 1 duction

MPC5634M e200z3 60, 80 1.5M 94 KB 32- Emulated 8 Entry 2 2 2 0 32-CH 16-CH, 5- Dual 5.0 V M Nexus 2+ 144 
MHz CH in 24-bit CH 34-CH, Wide trace LQFP,
Program 12-bit port in 176
Flash Vertical LQFP,
Calibratio 208
n System MAPBGA
MPC5633M e200z3 40, 60, 1M 64 KB 32- Emulated 8 Entry 2 2 2 0 32-CH 16-CH, 5- Dual 5.0 V M Nexus 2+ 100 
80 MHz CH in 24-bit CH 34-CH, Wide trace LQFP,
Program 12-bit port in 144
Flash Vertical LQFP,
Calibratio 176
n System LQFP,
208
MAPBGA
MPC5632M e200z3 40, 60 768 KB 48 KB 32- Emulated 8 Entry 2 2 2 0 32-CH 8-CH, 5- Dual 5.0 V M Nexus 2+ 100 
MHz CH in 24-bit CH 32-CH, Wide trace LQFP,
Program 12-bit port in 144 LQFP
Flash Vertical
Calibratio
n System
MPC5643L e200z4x 80/120 1 MB 128 KB 16- 64 KB 16 Entry  2 3 2 0  46-Ch. 4- Dual 16- 3.3 V M Nexus 3+ 144 
2 MHz CH Data eTimer/ Ch. Ch., 12- LQFP,
Flash PWM/ bit 257
STM MAPBGA
MPC5646C e200z4 120 3 MB 256 KB 16- 64 KB 16 Entry  10 8 6 1   64-CH, Up Up to 3.3 V, C, V, M Nexus 3+ 256 BGA, 
+ MHz, CH Data 16-bit to 8- 29-CH, 5.0 V 208
e200z0 60 MHz Flash CH 12-bit, LQFP,
Up to 176 LQFP
33-CH,
10-bit
MPC5646B e200z4 120 3 MB 192 KB 16- 64 KB 16 Entry  10 8 6 1  64-CH, Up Up to 3.3 V, C, V, M Nexus 3+ 256 BGA, 
MHz CH Data 16-bit to 8- 29-CH, 5.0 V 208
Flash CH 12-bit, LQFP,
Up to 176 LQFP
33-CH,
10-bit
MPC5645C e200z4 120 2 MB 256 KB 16- 64 KB 16 Entry  10 8 6 1   64-CH, Up Up to 3.3 V, C, V, M Nexus 3+ 256 BGA, 
+ MHz, CH Data 16-bit to 8- 29-CH, 5.0 V 208
e200z0 60 MHz Flash CH 12-bit, LQFP,
Up to 176 LQFP
33-CH,
10-bit
MPC5645B e200z4 120 2 MB 160 KB 16- 64 KB 16 Entry  10 8 6 1  64-CH, Up Up to 3.3 V, C, V, M Nexus 3+ 256 BGA, 
MHz CH Data 16-bit to 8- 29-CH, 5.0 V 208
Flash CH 12-bit, LQFP,
Up to 176 LQFP
33-CH,
10-bit
MPC5644C e200z4 120 1.5 MB 192 KB 16- 64 KB 16 Entry  10 8 6 1   64-CH, Up Up to 3.3 V, C, V, M Nexus 3+ 256 BGA, 
+ MHz, CH Data 16-bit to 8- 29-CH, 5.0 V 208
e200z0 60 MHz Flash CH 12-bit, LQFP,
Up to 176 LQFP
33-CH,
10-bit
MPC5644B e200z4 120 1.5 MB 128 KB 16- 64 KB 16 Entry  10 8 6 1  64-CH, Up Up to 3.3 V, C, V, M Nexus 3+ 256 BGA, 
MHz CH Data 16-bit to 8- 29-CH, 5.0 V 208
Flash CH 12-bit, LQFP,
Up to 176 LQFP
33-CH,
10-bit
MPC5607B e200z0 64 MHz 1.5 MB 96 KB 16- 64 KB 8 Entry  Up to 6 6 1 64-CH, 16-CH, 3.3 V, C, V, M Nexus 2+ 100 
CH Data 10 16-bit 10/12- 5.0 V (208MAP LQFP,
Flash bit & up BGA 144
to 32- Emul. LQFP,
Ch., 10- Only 176 LQFP
bit Package)
JTAG
MPC5606B e200z0 64 MHz 1 MB 80KB 16- 64 KB 8 Entry  Up to Up to 6 1 64-CH, 16-CH, 3.3 V, C, V, M Nexus 2+ 100 
CH Data 8 6 16-bit 10/12- 5.0 V (208MAP LQFP,
Flash bit & up BGA 144
to 32- Emul. LQFP,
Ch., 10- Only 176 LQFP
bit Package)
JTAG

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32-bit MPC56xx and MPC57xx MCUs Built on Power Architecture® Technology (continued)
Device Core Bus Pro- SRAM DMA EEPROM MPU/ CTU CSE/ SCI DSPI CAN I2C FlexRay™ Ethernet MLB Other Peripher- eTPU eMIOS Motor PIT Analog Operat- Temp. Debug Package In
Plat- Fre- gram MMU HSM (LIN- (100BaseT) als Control (ADC, ing Range Options Pro-
form quency Flash Flex) Timers DAC) Voltage 1 duction

MPC5605B e200z0 64 MHz 768 KB 64KB 16- 64 KB 8 Entry  Up to Up to 6 1 64-CH, 16-CH, 3.3 V, C, V, M Nexus 2+ 100 
CH Data 8 6 16-bit 10/12- 5.0 V (208MAP LQFP,
Flash bit & up BGA 144
to 32- Emul. LQFP,
Ch., 10- Only 176 LQFP
bit Package)
JTAG
MPC5604B e200z0 64 MHz 512 KB 32KB 64 KB 8 Entry  4 3 3 1 56-CH, up to up to 3.3V, C, V, M Nexus 2+ 100 
Data 16-bit 6- 36-CH, 5.0 V (208MAP LQFP,
Flash CH 10-bit BGA 144
Emul. LQFP,
Only
Package)
JTAG
MPC5603B e200z0 64 MHz 384 KB 28KB 64 KB 8 Entry  4 3 3 1 56-CH, up to up to 3.3 V, C, V, M Nexus 2+ 100 
Data 16-bit 6- 36-CH, 5.0 V (208 MAP LQFP,
Flash CH 10-bit BGA 144 LQFP
Emul.
Only
Package)
JTAG
MPC5602B e200z0 64 MHz 256 KB 24KB 64 KB 8 Entry  3 3 2 1 56-CH, up to up to 3.3 V, C, V, M Nexus 2+ 100 
Data 16-bit 6- 36-CH, 5.0 V (208 MAP LQFP,
Flash CH 10-bit BGA 144 LQFP
Emul.
Only
Package)
JTAG
MPC5604C e200z0 64 MHz 512 KB 48 KB 64 KB 8 Entry  4 3 6 1 28-CH, 3- 28-CH, 3.3 V, C, V, M Nexus 2+ 100 LQFP 
Data 16-bit CH 10-bit 5.0 V (208 MAP
Flash BGA
Emul.
Only
Package)
JTAG
MPC5603C e200z0 64 MHz 384 KB 40 KB 64 KB 8 Entry  4 3 6 1 28-CH, 3- 28-CH, 3.3 V, C, V, M Nexus 2+ 100 LQFP 
Data 16-bit CH 10-bit 5.0 V (208 MAP
Flash BGA
Emul.
Only
Package)
JTAG
MPC5602C e200z0 64 MHz 256 KB 32 KB 64 KB 8 Entry  4 3 6 1 28-CH, 3- 28-CH, 3.3 V, C, V, M Nexus 2+ 100 LQFP 
Data 16-bit CH 10-bit 5.0 V (208 MAP
Flash BGA
Emul.
Only
Package)
JTAG
MPC5601D e200z0 48 MHz 128 KB 12 KB 16- 64 KB  3 2 1 Up to Up Up to 3.3 V, C, V, M JTAG 100 
CH Data 28-CH, to 4- 33-CH, 5.0 V LQFP,
Flash 16-bit CH 12-bit 64 LQFP
MPC5602D e200z0 48 MHz 256 KB 16 KB 16- 64 KB  3 2 1 Up to Up Up to 3.3 V, C, V, M JTAG 100 
CH Data 28-CH, to 4- 33-CH, 5.0 V LQFP,
Flash 16-bit CH 12-bit 64 LQFP
MPC5604P e200z0 40/64 512 KB 40 KB 16- 64 KB  2 4 2 0  20-CH 4- Dual 3.3 V, M Nexus 2+ 100 
MHz CH Data eTimer/ CH 13-CH, 5.0 V LQFP,
Flash PWM 10-bit 144 LQFP
MPC5603P e200z0 40/64 384 KB 36 KB 16- 64 KB  2 4 2 0  20-CH 4- Dual 3.3 V, M Nexus 2+ 100 
MHz CH Data eTimer/ CH 13-CH, 5.0 V LQFP,
Flash PWM 10-bit 144 LQFP
MPC5602P e200z0 40/64 256 KB 20 KB 16- 64 KB  2 3 2 0 14-CH 4- 16-CH, 3.3 V, M Nexus 1 64 LQFP, 
MHz CH Data eTimer/ CH 10-bit 5V (Emulatio 100 LQFP
Flash PWM n with
MPC5604
P)
MPC5601P e200z0 40/64 192 KB 12 KB 16- 64 KB 1 1 1 0 6-CH 4- 11-CH, 3.3 V, M Nexus 1 64 LQFP, 
MHz CH Data eTimer CH 10-bit 5V (Emulatio 100 LQFP
Flash n with
MPC5604
P)

SG187 (Selector Guide) (3Q2015) – 38

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32-bit MPC56xx and MPC57xx MCUs Built on Power Architecture® Technology (continued)
Device Core Bus Pro- SRAM DMA EEPROM MPU/ CTU CSE/ SCI DSPI CAN I2C FlexRay™ Ethernet MLB Other Peripher- eTPU eMIOS Motor PIT Analog Operat- Temp. Debug Package In
Plat- Fre- gram MMU HSM (LIN- (100BaseT) als Control (ADC, ing Range Options Pro-
form quency Flash Flex) Timers DAC) Voltage 1 duction

MPC5644A e200z4 120, 4 MB 192 KB 64- Emulated 24 entry 3 3(MS 3  32-CH 24-bit 5- Dual 40- 3.3 V, M Nexus3+ 176 QFP, 
132, CH in MMU B) CH CH, + 2 5V Vertical 208
150 Program DECFIL Calibratio MAPBGA
MHz Flash n system , 324
MAPBGA
MPC5643A e200z4 120, 3 MB 192 KB 64- Emulated 24 entry 3 3(MS 3  32-CH 24-bit 5- Dual 40- 3.3 V, M Nexus3+ 176 QFP, 
132, CH in MMU B) CH CH, + 2 5.0 V Vertical 208
150 Program DECFIL Calibratio MAPBGA
MHz Flash n system , 324
MAPBGA
MPC5642A e200z4 120, 2 MB 192 KB 64- Emulated 24 entry 3 3(MS 3  32-CH 24-bit 5- Dual 40- 3.3 V, M Nexus3+ 176 QFP, 
132, CH in MMU B) CH CH, + 2 5.0 V Vertical 208
150 Program DECFIL Calibratio MAPBGA
MHz Flash n system , 324
MAPBGA
MPC5645S e200z4 125 2 MB 64 KB 16- 4 x 16 KB Up to 2 Up to Up to Up to 3 4  Quad 16 RTC, API, 8- Up to 3.3 V C, V Nexus 3+ 176 
d MHz CH Display 6 6 3 SPI Entry ch, 32-bit PIT 20-CH, and 5.0 LQFP,
Control gaug and S/W 10-bit V 208
Unit es w/ Watchdog LQFP,
(DCU) Step Timer 416
with per TEPBGA
Parallel Stall
Data Dete
Interface ct
(PDI) (SSD
)
MPC5606S e200z0 64 MHz 1 MB 48 KB 16- 4x16 KB Display 6 2 3 2 4 40x4 Yes QuadS 12 2-CH Real Time 16-CH, 3.3 V C, V, M Nexus 2+ 144 
h + 160 CH Control gaug (using PI entry Counter 10-bit and 5.0 LQFP,
KB Unit es w/ eMIOS) (RTC), V 176 LQFP
Graphi (DCU) Step Autonomous
cs with per Periodic
RAM Parallel Stall Interrupt (API),
Data Dete 4-CH 32-bit
Interface ct PIT and S/W
(PDI) (SSD watchdog
) timer.
MPC5604S e200z0 64 MHz 512 KB 48 KB 16- 4x16 KB No 6 2 2 2 2 64x6  12 2-CH Real Time 16-CH, 3.3 V C, V, M Nexus 1 100 
h CH gaug entry Counter 10-bit and 5.0 LQFP,
es w/ (RTC), V 144 LQFP
Step Autonomous
per Periodic
Stall Interrupt (API),
Dete 4-CH 32-bit
ct PIT and S/W
(SSD watchdog
) timer.
MPC5602S e200z0 64 MHz 256 KB 24 KB 16- 4x16 KB No 6 2 3 1 2 64x6  12 2-CH Real Time 16-CH, 3.3 V C, V, M Nexus 1 100 
h CH gaug entry Counter 10-bit and 5.0 LQFP,
es w/ (RTC), V 144 LQFP
Step Autonomous
per Periodic
Stall Interrupt (API),
Dete 4-CH 32-bit
ct PIT and S/W
(SSD watchdog
) timer.
1. C = -40 °C to +85 °C, V = -40 °C to +105 °C, M = -40 °C to +125 °C, J = -40 °C to +140°C, W = -40 °C to +150 °C

SG187 (Selector Guide) (3Q2015) – 39

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Image Cognition Processors

Device Primary Core Secondary SRAM DM Video Graphics Image Camera Display DRAM Flash USB PCi I2S I2 C SPI UART Timers ADC PIT 3.3 V Voltage Temp. Package In
Core Plat- Fre- Core Plat- A Accelera- Accelera- Proces- Input Inter- Support Support 2.0 Express GPIO Range1 Options Produc-
form quenc form tor tor sor face tion
y
SCP2201 ARM926 350 APEX - SMD 16 MB PDI LCD/ NAND, HS 1 2 1 4  1 C 236 BGA 
MHz Array, Slave DRAM WVGA Serial OTG +
ARM926 NOR flash HS Phy
SCP2207 ARM926 350 APEX - SMD 64 MB PDI LCD/ NAND, HS 1 2 1 4  1 C 236 BGA 
MHz Array, Slave DRAM WVGA Serial OTG +
ARM926 NOR flash HS Phy
1. C = -40 °C to +85 °C, V = -40 °C to +105 °C, M = -40 °C to +125 °C, J = -40 °C to +140 °C, W = -40 °C to +150 °

SG187 (Selector Guide) (3Q2015) – 40

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I.MX 32-BIT APPLICATIONS PROCESSORS

The AEC-Q100 automotive-qualified i.MX applications processors are based on For additional information, visit:
ARM9 and ARM11 CPU cores coupled with a wide rage of connectivity peripherals Freescale Semiconductor Documentation, Tool, and Product Libraries 
and hardware accelerators. Target automotive applications include infotainment, www.freescale.com
navigation, hands-free calling, telematics and fully configurable Instrumentation
clusters. Automotive Home Page
www.freescale.com/automotive

i.MX Applications Processors

Device Core CPU Cache SRAM DMA Video Graphics Image Camera Display DRAM Flash USB (2.0) CAN MLB SD/ I2C SPI UART Ethernet HDD SSI/ Sample SP PIT 3.3V Voltage Temp. Package In
Platform Fre- Accelera- Accelerator Proces- Input Interface Support Support MMC (100BaseT Inter- I2S Rate DIF GPIO Range Options Produc-
quency tor sor SDIO ) face Con- I/O 1 tion
verter
i.MX 6Q Quad ARM 852 MHz L1: 32 KB/ 256 32-Ch. Multi- OpenVG 1.1  MIPI, Up to 4x x64 x16 HS OTG+HS 2 25/ 4 4 5 5 1 GB with SATA 3+ Yes, Yes 3  1.275 to C 625 Flip 
Cortex®-A9 1 GHz 32 KB I/D KB Format (3D Core) CCIR656 WXGA DDR3, NOR PHY 50/ IEEE® ESAI Asynchr 1.50 Chip
L2: 512 KB 1080p OpenGLES LV- x8 SLC/ HS Host+HS 150 1588 onous BGA
Unified Encode 2.0, 3.0 DDR3 MLC PHY
and Display LP- NAND x2 HSIC
Decode Composition DDR2
(only on
i.MX6Q6)
i.MX 6D Dual ARM 852 MHz L1: 32 KB/ 256 32-Ch. Multi- OpenVG 1.1  MIPI, Up to 4x x64 x16 HS OTG+HS 2 25/ 4 4 5 5 1 GB SATA 3+ Yes, Yes 3  1.275 to C 625 Flip 
Cortex-A9 1 GHz 32 KB I/D KB Format (3D Core) CCIR656 WXGA DDR3, NOR PHY 50/ with IEEE ESAI Asynchr 1.50 Chip
L2: 512 KB 1080p OpenGLES LV- x8 SLC/ HS Host+HS 150 1588 onous BGA
Unified Encode 2.0, 3.0 DDR3 MLC PHY
and Display LP- NAND x2 HSIC
Decode Composition DDR2
(only on
i.MX6D6)
i.MX 6U Dual ARM 800 MHz L1: 32 KB/ 128 32-Ch. Multi- OpenVG 1.1 on MIPI, Up to 2x x64 x16 HS OTG+HS 2 25/ 4 4 4 5 1 GB 3+ Yes, Yes 3  1.275 to C 625 Flip 
Cortex-A9 32 KB I/D KB Format (3D Core) i.MX6U6 CCIR656 WXGA DDR3, NOR PHY 50/ with IEEE ESAI Asynchr 1.50 Chip
L2: 512 KB 1080p OpenGLES only (not in LV- x8 SLC/ HS Host+HS 150 1588 onous BGA
Unified Encode 2.0, 3.0 i.MX DDR3 MLC PHY
and Display 6U1) LP- NAND x2 HSIC
Decode Composition DDR2
(only on
i.MX6U6)
i.MX 6S ARM Cortex- 800 MHz L1: 32 KB/ 128 32-Ch. Multi- OpenVG 1.1  MIPI, Up to 2x x32 x16 HS OTG+HS 2 25/ 4 4 4 5 1 GB 3+ Yes, Yes 3  1.275 to C 625 Flip 
A9 32 KB I/D KB Format (3D Core) (not in CCIR656 WXGA DDR3, NOR PHY 50/ with IEEE ESAI Asynchr 1.50 Chip
L2: 512 KB 1080p OpenGLES i.MX 6S1) (not in (not in LV- x8 SLC/ HS Host+HS 150 1588 onous BGA
Unified Encode 2.0, 3.0 i.MX i.MX 6S1) DDR3 MLC PHY
and Display 6S1) LP- NAND x2 HSIC
Decode Composition DDR2
(not in i.MX
6S1)
i.MX53 ARM 800 MHz L1: 32 KB/ 128 32-Ch. HD720 OpenVG  MIPI, UXGA, DDR2 NOR, HS OTG+HS 2 25/ 4 3 3 5 10/100 SATA, 3+ Yes, Yes 3  0.95 to C 529 
Cortex®- 32 KB I/D, L2: KB Encode, 1.1, CCIR656 Dual TFT DDR3 SLC PHY 50/ with IEEE PATA ESAI Asynchr 1.1 MAP-
A8 with VPU 256 KB Unified HD1080 OpenGL LP- NAND HS Host+FS 1588 I onous BGA
and NEON Decode ES2.0 DDR2 MLC PHY
(not in NAND and 2x HS Host
i.MX534)
i.MX35 ARM1136™ 532MHz L1: 16 KB/ 128 32-Ch. OpenVG 1.1  MIPI, TFT up SDRAM, NOR, HS OTG+HS 2 25/ 3 3 2 3 10/100 ATA-6 2+ Yes, Yes 3  1.22 to C 400 
with 16 KB I/D, L2: KB (only in (not in CCIR656 to SVGA mDDR, SLC PHY 50/ ESAI Asynchr 1.47 MAP-
Vector 128 KB Unified i.MX356) i.MX351) (not in (not in DDR2 NAND HS Host+FS onous BGA
Floating i.MX351) i.MX351) MLC PHY or
Point NAND Ext. HS PHY
i.MX28 ARM926™ 454 MHz L1: 16 KB/ 128 32-Ch. TFT up to mDDR, SLC HS OTG+HS 2 x3 x2 x3 x6 10/100 x1 x3 Tx 8  Internall C 289 
32 KB I/D KB WVGA DDR2 NAND, PHY GMII or x2 y MAP-
(not in MLC HS Host+HS RMII with Generat BGA
i.MX281) NAND, PHY IEEE 1588 ed
QSPI or Ext. HS PHY
Flash
I.MX25 ARM926 400 MHz L1: 16 KB/ 128 32 Ch MIPI, Up to SDRAM, NOR, HS OTG+HS 2 2 3 3 5 10/100 ATA-6 2+ 4  1.38 to C 400 
16 KB I/D KB CCIR656 VGA (640 mDDR, SLC PHY ESAI 1.52 MAP-
(not in x 480) DDR2 NAND HS Host+HS BGA
i.MX251) (not in MLC PHY or
i.MX251) NAND Ext. HS PHY

1. C = -40 °C to +85 °C, V = -40 °C to +105 °C, M = -40 °C to +125 °C, J = -40 °C to +140 °C, W = -40 °C to +150 °C

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32-bit Vybrid Controller Solutions

Device Core CPU Cache SRAM DMA Video Graphics Image Camera Display DRAM Flash USB (2.0) CAN MLB SD/ I2C SPI UART Ethernet HDD I2S Sample SP PIT 3.3V Voltage Temp. Package In
Platform Fre- Accelera- Accelera- Proces- Input Interface Sup- Support MMC (100BaseT Inter- Rate DIF GPIO Range Options Produc-
quency tor tor sor port SDIO ) face Con- I/O 1 tion
verter
Vybrid ARM® 400 L1: 32 KB/ Up to . OpenVG 18-bit 2 (Up to DDR3 Dual 2x USB OTG 50  2 4 4 6 2x  4x yes yes 3.0 V to C 176 
SVFxxxR Cortex®- MHz 32 KB I/D 1.5 1.1 Composi WVGA) + LP- Quad HS + Phy SAI 3.6 V LQFP
A5/M4 L2: 512 KB MB te Segment DDR2 SPI, 1x 364 BGA
Up to 1.5 MB (4 to 1) + Display NAND, ESAI
VADC (40 x 4) FlexBus

1. C = -40 °C to +85 °C, V = -40 °C to +105 °C, M = -40 °C to +125 °C, J = -40 °C to +140 °C, W = -40 °C to +150 °C

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QFP — Quad Flat Package

— Definitions — QSM — Queued Serial Module (SCI + QSPI)
ADC — Analog-to-Digital Converter QSPI — Queued SPI
ASK — Amplitude Shift Keying Modulation RTI — Real-Time Interrupt
BDM — Background Debug Mode
SCI — Serial Communication Interface
CAN — Controller Area Network
SCIE — Enhanced SCI
CDIP — Ceramic Dual In-Line Package SCIM — Single-Chip Integration Module
CLCC — Ceramic Leaded Chip Carrier
SDIP — Shrink Dual In-line Package
COP — Computer Operating Properly (Watchdog Timer)
SIM — System Integration Module
CPU16 — 16-bit Central Processor Unit (HC11 Compatible) SIML — Low-Power System Integration Module
CPU32 — 32-bit Central Processor Unit (68000 Compatible)
SIOP — Simple Serial I/O Port
CTM — Configurable Timer Module (Various Hardware Options)
SOICN — Small Outline Package Narrow Body
DAB — Digital Audio Broadcasting SOICW — Small Outline Package Wide Body
DIP — Dual In-line Package
SPI — Serial Peripheral Interface
DSPI — Deserial Peripheral Interface
ESPI — Enhanced SPI
EBI — External Bus Interface SRAM — Standby RAM Module
ECT — Enhanced Capture Timer
SSOP — Shrink Small Outline Package
eDMA — Enhanced Direct Memory Access Controller
TPU — Time Processor Unit (16 Programmable Channels)
eTPU — Enhanced Timing Processor Unit
TPURAM — Standby RAM Module with TPU Emulation Capability
eMIOS — Enhanced Modular Input Output System
TQFP — Thin Quad Flat Package (1.0mm thick)
eQADC — Enhanced Queued Analog-to-Digital Converter TSSOP — Thin Shrink Small Outline Package
eSCI — Enhanced Serial Communications Interface
UART — Universal AsynchroNous Receiver/Transmitter
FSK — Frequency Shift Keying Modulation
UDFN— Ultra-thin dual flat no-lead package
GPT — General-Purpose Timer Module (4 IC, 5 OC, 2 PWM) USB — Universal Serial Bus
HQFP — Heatsink Quad Flat Package
HSOP — Heatsink Small Outline Package
— Package Designators —
i — Input-Only Port Pins B — Shrink DIP (70 mil spacing)
i/o — Bidirectional Input and Output Port Pins DW — Small Outline (Wide-Body SOIC)
DWB — Small Outline (Wide body SDIB) 0.65 pitch
I2C — Inter-Integrated Circuit
FA — 7 x 7 mm Quad Flat Pack (QFP)
IC — Input Capture
FB — 10 x 10 mm Quad Flat Pack (QFP)
ISPI — Interval Serial Peripheral Interface
FC — QFN Quad Flat Pack
LQFP — Low-Profile Quad Flat Package (1.4mm thick)
FE — CQFP (windowed) — Samples Only
LVI — Low-Voltage Interrupt
FN — Plastic Quad (PLCC)
LVR — Low-Voltage Reset
FS — CLCC (windowed) — Samples Only
MCCI — Multi-Channel Communication Interface (2 SCI, SPI)
FT — 28 x 28 mm Quad Flat Pack (QFP)
MFT — Multi-Function Timer
FU — 14 x 14 mm Quad Flat Pack (QFP)
MUX — Multiplexed
FZ — CQFP (windowed) — Samples Only
OC — Output Compare
K — Cerdip (windowed) — Samples Only
OOK — On-Off Keying
L — Ceramic Sidebraze
PBGA — Plastic Ball Grid Array
P — Dual in-Line Plastic
PDIP — Plastic Dual In-Line Package
PNA — PQFN Power QFN
PEEP — Personality EEPROM
PNB — PQFN Power QFN
PEP — Personality EPROM
PNC — PQFN Power QFN
PLCC — Plastic Leaded Chip Carrier
PU — 14 x 14 mm Low-Profile Quad Flat Pack (LQFP)
PLL — Phase-Locked Loop
PV — 20 x 20 mm Low-Profile Quad Flat Pack (LQFP)
PQFP — Plastic Quad Flat Pack
S — Cerdip (windowed) — Samples Only
PWM — Pulse-Width Modulation
TM — Mechatronics Connector
QADC — Queued Analog-to-Digital Converter (10-bit)
VR — Plastic Ball Grid Array (PBGA) with PB-free solder balls
PQFN — Quad Flat No-Lead Package
ZP — 27 x 27 mm Plastic Ball Grid Array (PBGA)
QFN — Quad Flat No-Lead Package

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— Pb-free —
AA — Pb-free 44 to 100 pin QFP
AB — Pb-free 112 to 288 pin QFP
AC — Pb-free 16 to 44 pin LQFP
AE — Pb-free 48 to 64 pin LQFP
AF — Pb-free 68 to 100 pin LQFP
AG — Pb-free 108 to 144 pin LQFb
AH — Pb-free 80 to 100 pin TQFP
AI — Pb-free FQFP
AJ — Pb-free CQFP
AE — Pb-free 22 to 64 pin PDIP
ED — Pb-free 6 yo 20 pin PDIP
EE — Pb-free PSDIP
EF — Pb-free 8 to 16 in SOIC
EG — Pb-free 16 to 28 pin SOIC WIDE
EH — Pb-free 132 pin PQFP
EI — Pb-free PLCC
EJ — Pb-free 8 to 24 pin TSSOP
EK — Pb-free 32 to 54 pin SOIC WIDE
EL — Pb-free 26 to 56 pin TSSOP
EN — Pb-free 8 to 24 pin SSOP
EO — Pb-free 26 to 56 pin SSOP
EP — Pb-free QFN & MLF (Exposed Pad)
ER — Pb-free CATV
ES — Pb-free SENSOR
ET — Pb-free RF (POWER CHIPS)
EU — Pb-free MAC PAAC
EV — Pb-free MFP (SOEIAJ)
FC — Pb-free QFN & MLF (Regular)
FE — Pb-free CerQuads
VK — Pb-free MAPBGA <=1.3mm (THINMAP) <.7mm Pitch
VL — Pb-free MAPBGA <=1.3mm (THINMAP) >.7mm Pitch
VM — Pb-free MAPBGA 1.6mm > .7mm Pitch
VN — Pb-free MAPBGA 1.6mm < .7mm Pitch
VO — Pb-free MAPBGA 1.35mm < .7mm Pitch
VP — Pb-free MAPBGA 1.36mm > .7mm Pitch
VR — Pb-free PBGA
VS — Pb-free FC-HiTCE LGA (without C5 sphere)
VT — Pb-free FC PBGA
VU — Pb-free FC-HiTCE
VV — Pb-free TBGA
VW — Pb-free HSOP
VX — Pb-free SMT
VY — Pb-free UNIBODY

SG187 (Selector Guide) (3Q2015) – 44

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

Product Numbering System for MC56F8300 Digital Signal Controllers

MC 56F83 XX M XX 60

QUALIFICATION STATUS BUS SPEED

PC PRE-QUALIFICATION,
ENGINEERING SAMPLES PACKAGE TYPE
MC FULLY QUALIFIED
TEMPERATURE RANGE
PRODUCT DESIGNATOR V -40C TO 105C
AUTOMOTIVE CONTROLLER M -40C TO 125C
SERIES WITH FLASH

SG187 (Selector Guide) (3Q2015) – 45

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

Product Numbering System for Pressure Sensors

M PX A 2 XXX A P X T1
PRODUCT CATEGORY SHIPPING METHOD
M QUALIFIED STANDARD NONE TRAYS
S CUSTOM PRODUCT T1 TAPE AND REEL
PRESSURE SENSORS LEADFORM OPTION
P, X PROTOTYPE PRODUCT U RAIL
0 OPEN
PACKAGING TYPE 1–2 CONSULT FACTORY
NONE UNIBODY 3–5 OPEN
A/V SMALL OUTLINE PACKAGE 6–7 SOP* ONLY
AZ/VZ SMALL OUTLINE
MEDIA RESISTANT PACKAGE
PORTING STYLE
H SUPER SMALL OUTLINE PACKAGE
HZ SUPER SMALL OUTLINE
MEDIA RESISTANT PACKAGE C AXIAL PORT (SMALL OUTLINE PACKAGE)
M M-PAK P PORTED (UNIBODY)
PRODUCT TYPE
Y SUPER SMALL OUTLINE PACKAGE (TPM) P SINGLE PORT
A ABSOLUTE
PRODUCT FEATURES G GAUGE Dp DIFFERENTIAL PORT
D DIFFERENTIAL S STOVEPIPE PORT (UNIBODY)
NONE UNCOMPENSATED
V VACUUM/GAUGE SXW AXIAL PORT
ROBUST (UNIBODY)
AXIAL PORT
2 TEMPERATURE COMPENSATED/CALIBRATED
3 OPEN
4 TEMPERATURE COMPENSATED/CALIBRATED/ MAXIMUM PRESSURE IN kPa
SIGNAL CONDITIONED AUTOMOTIVE ACCURACY EXCEPT FOR MPX2300
EXPRESSED IN mmHg
5 TEMPERATURE COMPENSATED/CALIBRATED/
SIGNAL CONDITIONED
6 HIGH TEMPERATURE
7 POSITIVE/NEGATIVE PRESSURE
8 CMOS

Product Numbering System for ARM Devices

MAC 7 1 x x C FV 50 xx
STATUS OF PRODUCT:
MAC FULLY QUALIFIED EXTRA PACKAGE
SAC FULLY QUALIFIED AVAIL EIGNATORS
FOR AUTO CUSTOMERS
PAC PRODUCT ENGINEERING BUS SPEED

CORE AKAGE TYPE

GENERATION (FAMILY) U 100 LQFP
V 112/144 LQFP
PINOUT/PACKAGE F 208 MAP BGA
OPTION DESIGNATOR TEMPERATURE RANGE
SEQUENTIAL DEVICE C -40 C TO 85 C
NUMBER V -40C TO 105 C
M -40 C TO 125 C

SG187 (Selector Guide) (3Q2015) – 46

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

Product Numbering — Analog Auto and Power Management Devices

MC mm FF PP
xxxx r v RR

FAMILY/ROADMAP
PRODUCT CATEGORY PACKAGING
AR - Alternator Regulators SILICON REVISION
MC - Qualified Standard (default blank) DESIGNATOR
SC - Custom Device BC - Battery Chargers TAPE AND REEL
PC - Prototype Device BM - Battery Management CORE INDICATOR
CD - Configurable Detection 0000
MARKET VARIATION
CM - Communication (default blank)
32 - Consumer FS - System Basis Chips (Defined by BU)
33 - Automotive GD - Gate Drivers
34 - Industrial HB - H-Bridge
35 - Medical/Military MM - Millimeter wave
MR - MMIC Radar
PF - Power Fusion
SA - Safety Airbag
SB - Safety Braking
SD - Smoke Detection
VR - Voltage Regulator
XS - eXtreme switch

Legacy product numbering is available in ANALOGPN on www.freescale.com

SG187 (Selector Guide) (3Q2015) – 47

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

8-Bit Automotive Microcontroller Part Numbering System*

EXAMPLES: S 9 S08 SL 16 F 1 M TJ
S 9 S08 DZ 128 F 2 M LF S
QUALIFICATION STATUS SHIPPING METHOD
PC = ENGINEERING SAMPLES BLANK = TRAY
S = AUTOMOTIVE QUALIFIED R = TAPE AND REEL
MC = GENERAL MARKET QUALIFIED PACKAGE OPTION
SC = CUSTOM BUILD
TEMPERATURE OPTIONS
MEMORY TYPE C = -40C TO +85C
9 = FLASH V = -40C TO +105C
3 = ROM (IF AVAILABLE) M = -40C TO +125C
CORE J = -40C TO +140C
W = -40C TO +150C
DEVICE FAMILY
PRODUCT REVISION
FLASH SIZE
MANUFACTURING SITE
*NOTE: Freescale’s automotive part numbering system has evolved over time, so the decoder scheme shown above may not be relevant for the prior generations.

16-Bit Automotive Microcontroller Part Numbering System*

EXAMPLES: S 9 S12 HZ 256 J 3 C AL
S 9 S12 EG 128 J 2 C AA R
QUALIFICATION STATUS SHIPPING METHOD
PC = ENGINEERING SAMPLES BLANK = TRAY
S = AUTOMOTIVE QUALIFIED R = TAPE AND REEL
MC = GENERAL MARKET QUALIFIED PACKAGE OPTION
SC = CUSTOM BUILD
TEMPERATURE OPTIONS
MEMORY TYPE C = -40C TO +85C
9 = FLASH V = -40C TO +105C
3 = ROM (IF AVAILABLE) M = -40C TO +125C
CORE J = -40C TO +140C
DEVICE FAMILY PRODUCT REVISION
FLASH SIZE MANUFACTURING SITE
*NOTE: Freescale’s automotive part numbering system has evolved over time, so the decoder scheme shown above may not be relevant for the prior generations.

SG187 (Selector Guide) (3Q2015) – 48

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

32-Bit Automotive Microcontroller Part Numbering System for MPC55xx Devices*

EXAMPLES: M PC 5554 M VR 132

S PC 5514E A C LQ 48 R
SHIPPING METHOD
QUALIFICATION STATUS
PC = ENGINEERING SAMPLES BLANK = TRAY
S = AUTOMOTIVE R = TAPE AND REEL
MC = GENERAL MARKET QUALIFIED
BUS SPEED

POWER ARCHITECTURE CORE PACKAGE OPTION

PRODUCT NAME TEMPERATURE OPTIONS

A = -55C TO +125C
C = -40C TO +85C
RESERVED/OPTIONAL FIELD V = -40C TO +105C
M = -40C TO +125C

*NOTE: Freescale’s automotive part numbering system has evolved over time, so the decoder scheme shown above may not be relevant for the prior generations.

32-Bit Automotive Microcontroller Part Numbering System for MPC56xx Devices*

EXAMPLES: P PC 5604B E M VR
S PC 5604S E M LQ R
SHIPPING METHOD
QUALIFICATION STATUS
BLANK = TRAY
PC = ENGINEERING SAMPLES
R = TAPE AND REEL
S = AUTOMOTIVE
MC = GENERAL MARKET QUALIFIED
PACKAGE OPTION
POWER ARCHITECTURE CORE

PRODUCT NAME TEMPERATURE OPTIONS

C = -40C TO +85C
RESERVED/OPTIONAL FIELD V = -40C TO +105C
M = -40C TO +125C

*NOTE: Freescale’s automotive part numbering system has evolved over time, so the decoder scheme shown above may not be relevant for the prior generations.

SG187 (Selector Guide) (3Q2015) – 49

 Distributor of NXP Semiconductors: Excellent Integrated System Limited
Datasheet of KITPT2000FRDM3C - FREEDOM PLATFORM PT2000 DRIVER
Contact us: [email protected] Website: www.integrated-circuit.com

How to Reach Us:

Home Page:
www.freescale.com

Web Support:
http://www.freescale.com/support

For current information, please visit freescale.com/analog

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. SMARTMOS is a trademark of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners.

© 2015 Freescale Semiconductor, Inc.

SG187 Q3 2015, Rev 59

8/2015

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