Dow Corning INTERNAL

Silicone Grease Solutions For Your

Thermal Interface Needs

Dow Corning
Electronics and Advanced Technologies

1
Contents
• Why Use A Silicone Grease?
• Why Choose Dow Corning?
• Thermal Interface Material (TIM) Application
• Product Overview
• Testing Methodology
• Product Processing
• Frequently Asked Questions

2
 Why Use A Silicone Grease?
Lower contact resistance
Flowable matrix fills micro gaps and reduces contact resistance better than pads,
films and phase change materials. This results in lower thermal resistance

Extremely thin bond lines

Very thin bond lines, ~ 8 microns, can be achieved, which also lowers thermal
resistance

Application versatility
There are many ways to apply grease making it great for the factory or field-work
Easy re-workability

Lower cost
Greases lack the extra manufacturing steps of pads, preforms, etc. giving them lower
cost structure

High Reliability
Silicones withstand heat & stresses better than organic greases

3
 Why Choose Dow Corning?
Leader in silicone formulation & technology
60 years ago Dow Corning pioneered the use of silicones and today remains a
global leader in silicone technology and manufacturing

Prevent “pump out” during thermal cycles

Dow Corning’s next generation greases with advances silicone fluids reduce
“pump-out”. Once you apply the grease it stays in place. In most cases, it
doesn’t run from the substrate during power cycling

Thermal Compound Innovation

Continual advancements in thermal grease formulation such as DOW
CORNING® TC-5026 solvent-free high performance grease launched in 2007
and new DOW CORNING® TC-5600 extreme performance grease.

One stop shop & service

Choose from a broad line of thermally conductive compounds, adhesives,
gels and encapsulants complimented by an array of device packaging
adhesives and coatings all backed by global applications support

4
 Void Fill Advantage Of Grease
No surface is perfectly smooth. These microscopic blemishes increase contact
resistance and reduce heat flow between surfaces.

No Thermal Interface Material (TIM) Thermal Pad Dow Corning Silicone Grease

Heat Sink Heat Sink Heat Sink

Heat Source Heat Source Heat Source

Micro-gaps or surface Non-flowable TIMs such as Grease matrices more completely fill
roughness prevent thermal pads may leave voids micro-gaps to ensure heat flow away
effective heat transfer that inhibit heat transfer from vital parts.
potentially leading to
Greases enable thinner bond lines,
device failure.
further reducing thermal resistance.

5
 TIM Applications
Use Dow
Corning TIMs TIM
Heat Sink
at any junction
between a heat
Heat Source
source and
cooling source
to overcome TIM 2
Heat Sink
contact
Heat Spreader or Casing
resistance and
improve heat TIM 1 Heat Source
dissipation
away from vital Casing
components
TIM – Potting Heat Source
Application Thermally conductive grease,
gel or encapsulant

6
Example Of Possible
Thermal Grease Application

Flip Chip BGA Heat Spreader Attach TIM 1.5 or 2

Heat Source – TIM - Heat Sink Direct

TIM 2
or TIM 1.5
Heat Spreader
Flip Chip Or Other Heat Source

Substrate

Flip Chip BGA

7
Example Of Possible Thermal
Grease Application

Flip Chip BGA Application TIM 1, TIM 2

Multi Layer: Heat Source – TIM1 - Intermediate (Lid) -
TIM2 - To Heat Sink

TIM 2 Heat Sink

TIM 1 Lid
Flip Chip Or Other Heat Source

Substrate

Flip Chip BGA

8
Key Attributes – TIM 1, 1.5, 2

1. Thermal Resistance
2. Bond Line Thickness
3. Cost
4. Processing/Printability
5. Re-workability

Prioritization is Application Driven

9
 Critical TIM Properties
Effective thermal resistance of a device, RTIM.
BLT
RTIM = + Rc 1 + Rc 2 Higher TR
kTIM
• BLT = Bond Line Thickness
• kTIM = Thermal Conductivity
+Rc2
• Rc = Contact Resistance between
the TIM and the two surfaces. Lower TR

Key GoalÆ Minimize RTIM c2

• Increase TIM thermal conductivity

(kTIM). Bulk conductivity and contact resistance

•
being equal, a thinner bond line will result
Reduce Bond Line Thickness (BLT). in lower thermal resistance.

• Reduce contact resistances (Rc) .

10
Dow Corning
Thermally Conductive Grease Line Up
Thermal
Thermal Conductivity Resistance
Product
(W/m-K)
(C-cm2/W)
P
DOW CORNING® TC-5026 2.89 0.032
e
r
DOW CORNING® TC-5022 4.0 0.061
f
o
r DOW CORNING® TC-5121 2.5 0.096
m
a DOW CORNING® SE4490CV 1.7 0.32
n DOW CORNING® SC 102
c 0.8 0.62
Compound
e
DOW CORNING® 340 Heat Sink
Compound
0.54 0.162

11
 Thermal Resistance Comparison
This graph shows the thermal resistance of various DCC greases benchmarked against competitor
greases at various pressure loads. It demonstrates that DCC greases are able to reach minimum
bond line and optimal performance even under low pressure Test method is (ASTM # D5470).

Thermal Resistance Benchmarking

Shin-Etsu MicroSi® X23-7762D
0.30
Shin-Etsu MicroSi® G751
DC TC-5121
Shin-Etsu MicroSi® X23-7783D
Thermal Resistance ( oC-cm2/W)

0.25
DC TC-5022
DC TC-5026
0.20

0.15

0.10

0.05

0.00
0 20 40 60 80 100 120
Pressure Load (PSI)

12
Desktop TTV Tester
This graph shows the thermal resistance of various DCC greases on a tester that is intended to
replicate a desktop computer. Takes into account lower co-planarity encountered in real systems.
The units of measure represented here are different than the guarded hotplate on the previous
slide. These units are °C/w instead of °C-cm2/w.

TIMs on Desktop TTV @ ~110 Watts

0.07 0.068

ΘCS=(TC-TS)/Power
0.06
Thermal Resistance (Lid to Sink)

0.057
0.054

0.049
0.05
0.045 0.045

0.04
0.035

0.03

0.02

0.01

0
TC-5026 TC-5022 Shin-Etsu Shin-Etsu TC-5121 Shin-Etsu Shin-Etsu
MicroSi® X23- MicroSi® X23- MicroSi® G751 MicroSi® X23-
7853-W1 7783D 7762D
TIM Material

13
 340 Heat Sink Compound
Description Non-curing, thermally conductive compound

Features Good performance and economical

Potential Uses Thermal interface or encapsulant in a wide array of industrial applications.

Application Methods Screen print, stencil print, dispense .

Form: Non-curing compound Color: White Mix Ratio: One Part
Thermal Conductivity (W/m-K): 0.54 Thermal Resistance: 0.162 Bond Line Thickness (microns): 100
Viscosity /Flowability, average NVC % (120C): 70.4 Volatile Content (120C)%: 29.58
centipoise : 542,000
Dielectric Constant at 1 kHz: 5 Dielectric Dissipation factor at 1 kHz: Volume Resitivity, ohm-cm: 2.0 x 1015
0.02
Dielectric Strength (volts/mil): 210 Specific Gravity: 2.14

340 Heat Sink Compound Additional Information

Part of our product line since 1968, 340 compound is a Can be used as a thin interface or encapsulant. For interface,
proven and economical thermally conductive solution for apply grease with a squeegee through a stencil or screen to
low power applications. This grease can be used in a wide print a grease pad or spread out bulk material with a spatula.
array of industrial applications including power
components/power supply for Audio; Video (DVDs, TV Sets,
etc.); broadcasting equipment; car-audio, frequency drivers
(or frequency inverters) on automation equipment and some
minor applications on temperature sensor for auto.

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 Dow Corning SC 102
Description Non-curing, thermally conductive compound

Features Low cost and good performance. Thin bond lines

Potential Uses Thermal interface or encapsulation applications

Application Methods Screen print, stencil print, dispense .

Form: Non-curing compound Color: White Mix Ratio: One Part
Thermal Conductivity (W/m-K): 0.8 Thermal Resistance: 0.62 Bond Line Thickness (microns): 50
Viscosity /Flowability, average centipoise : NVC % (120C): 99.68 Volatile Content (120C)%: 0.32
<100,000
Dielectric Constant at 50 Hz: 4.0 Dielectric Dissipation factor at 50 Volume Resistivity, ohm-cm: 2 x 1016
Hz: 0.02
Dielectric Strength (volts/mil): 53 Specific Gravity: 2.37 Shelf Life, Months from DOM: 24

Dow Corning SC 102 Additional Information

Good performance at low cost. Use for a thermal dissipation Dispense with syringe or apply grease with a squeegee
in a wide array of industrial applications such as power through a stencil or screen to print a grease pad or spread
supplies. Use in similar applications as 340 Heat Sink, but out bulk material with a spatula.
where a higher thermal conductivity is required. SC102 also
has the ability to spread to very thin bond lines. Therefore, if
the co-planarity of the substrate allows, much lower thermal
resistance values than those listed above can be achieved.

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 Dow Corning SE 4490CV
Description Non-curing, thermally conductive compound

Features Controlled volatility grade

Potential Uses Thermal interface material for a variety of low to mid-range applications

Application Methods Screen print, stencil print, dispense .

Form: Pre-cured compound Color: White Mix Ratio: One Part
Thermal Conductivity (W/m-K): 1.7 Thermal Resistance: .32 Bond Line Thickness (microns): 100
Viscosity /Flowability, average NVC % (120C): 99.96 Volatile Content (120C)%: 0.04
centipoise: 500,000
Dielectric Constant at 50 Hz: 4.8 Dielectric Dissipation factor at 50 Hz: Volume Resistivity, ohm-cm: 2 x 1014
0.001
Dielectric Strength (volts/mil): 102 Specific Gravity: 2.62 Shelf Life, Months from DOM: 11

Dow Corning SE 4490CV Additional Information

Controlled volatility and good thermal performance at an Dispense with syringe or apply grease with a squeegee
economical price point for mid-range applications. This through a stencil or screen to print a grease pad or spread
compound uses a a pre-cured matrix to prevent bleeding out bulk material with a spatula.
(separation of liquids from thermally conductive fillers) and
to prevent contamination from high volatile silicones.
Excellent for applications in proximity to electric motors and
relays where migration of high volatility molecules are of
concern

16
 Dow Corning TC-5121
Non-curing, thermally conductive compound
Description

Features Good thermal performance at an economic price. Thin bond lines.

Potential Uses Thermal interface material for a variety of mid to high end devices.

Application Methods Screen print, stencil print, dispense .

Form: Non-curing compound Color: Gray Mix Ratio: One Part
Thermal Conductivity (W/m-K): 2.5 Thermal Resistance: 0.096 Bond Line Thickness (microns): 25
Viscosity /Flowability, average centipoise NVC % (120C): 99.93 Volatile Content (120C)%: <0.1
: 85,013
Dielectric Constant at 1 kHz: 19.61 Dielectric Dissipation factor at 1 kHz: Volume Resistivity, ohm-cm: 1.22 x 1012
0.04
Dielectric Strength (volts/mil): 71.67 Specific Gravity: 4.06 Shelf Life, Months from DOM: 24

Dow Corning TC-5121 Additional Information

Is an excellent economical thermally conductive solution for Dispense with syringe or apply grease with a squeegee
mid-range applications. Also uses advanced silicone fluid to through a stencil or screen to print a grease pad or spread
help prevent pump out. Because of the small filler particle out bulk material with a spatula. Allow the printed grease
size in this grease, it has been observed to reach even better pad to dry open to the air for 24 hours before assembling and
thermal performance in applications where high pressure testing. The dry time allows the small amount of carrier
clamping forces a thin bond line. See reliability data on fluid in the grease to evaporate and will improve thermal
following slide. performance.

17
 Power Cycle On TTV Tester
The results reported in this graph show that TC-5121 remains stable through 20,000 power cycles.
This test is often used as a method of demonstrating pump-out. TC-5121 has very low end of life
thermal resistance, indicating high reliability and stability. This graph is intended to illustrate
reliability or change in TR, not baseline TR. Lower TR can be realized than shown in graph.

TC-5121 Thermal Reliability, Power Cycle TTV

(Each Cycle : 8 minute powe r, 2 minute cool down, T(lid) ~ 92°C to r.t.)

0.5

0.45
Thermal Resistance (°C-cm /W)

0.4
2

0.35

0.3

0.25

0.2

0.15

0.1

0.05

0
0 5000 10000 15000 20000 25000

Cycles

18
 Dow Corning TC-5022
Non-curing, thermally conductive compound
Description

Excellent thermal performance. Thin bond lines, pressure independent. Reduced

Features
pump out during thermal cycling.

Potential Uses Thermal interface material for a variety of mid to high end devices.

Application Methods Screen print, stencil print, dispense .

Form: Non-curing compound Color: Gray Mix Ratio: One Part
Thermal Conductivity (W/m-K): 4.0 Thermal Resistance: 0.061 Bond Line Thickness (microns): 20
Viscosity /Flowability, average centipoise NVC % (120C): 99.9 Volatile Content (120C)%: <0.05
: 89,160
Dielectric Constant at 1 kHz: 18.05 Dielectric Dissipation factor at 1 kHz: Volume Resistivity, ohm-cm: 5.52 x 1010
0.128
Dielectric Strength (volts/mil): 115 Specific Gravity: 3.2 Shelf Life, Months from DOM: 24

Dow Corning TC-5022 Additional Information

Is an excellent high quality thermally conductive solution for Dispense with syringe or apply grease with a squeegee
mid-range to advanced applications. Another in our line of through a stencil or screen to print a grease pad or spread
next generation silicone greases that uses advanced silicone out bulk material with a spatula. Allow the printed grease
fluid to reduce pump out. Product spreads out to thin bond pad to dry open to the air for 24 hours before assembling and
lines. For situations where you cannot obtain high surface testing. The dry time allows the small amount of carrier
planarity or where you need to have thicker bond lines use fluid in the grease to evaporate and will improve thermal
this grease in place of high performance TC-5026. performance. ** Please see following slides for reliability
testing on this high performing grease.

19
Power Cycle On TTV Tester
The results reported in this graph show that TC-5022 remains stable through 20,000 power cycles.
This test is often used as a method of demonstrating pump-out. TC-5022 has very low end of life
thermal resistance, indicating high reliability and stability. This graph is intended to illustrate
reliability or change in TR, not baseline TR. Much lower TR can be realized than shown in graph.

T C - 5 0 2 2 T h e r m a l R e lia b ilit y , T T V - P o w e r c y c le T e s t
( E a c h c y c le : 8 m in u t e h e a t in g , 2 m in u t e c o o lin g , ~ 9 2 C t o r . t . )
0 .5

0 .4 5
Thermal Resistance ( C-cm /W @ PSI)

0 .4

0 .3 5
2

0 .3
o

0 .2 5

0 .2

0 .1 5

0 .1

0 .0 5

0
0 2500 5000 7500 10000 12500 15000 17500 20000 22500 25000
C y c le s

20
Vertical Slide – Thermal Shock Test
• Dow Corning® TC-5022 thermal grease used.
• Grease layer applied to aluminum test panels.
– 20 mil wires used to control bond line

21
Vertical Slide – Thermal Shock Test
• “Sandwich” created and clamped together

22
Vertical Slide – Thermal Shock Test
• Assemblies placed vertically in thermal shock chamber
• 400 cycles from 125 °C to 0 °C
– 15 minutes at each temperature with 2 minute transition

23
Vertical Slide – Thermal Shock Test
• Before and after pictures taken of 6 sample assemblies.
• Test indicates no vertical slide, running, oozing or flow of material

24
 Dow Corning TC-5026
Non-curing, thermally conductive compound
Description

Premium performance. Ultra thin bond lines, pressure independent. Pump-out

Features
resistant. Solvent free for better stability and storage. Engineered for reliability.

Potential Uses Thermal interface material for a variety of mid to high end devices.

Application Methods Screen print, stencil print, dispense .

Form: Non-curing compound Color: Gray Mix Ratio: One Part
Thermal Conductivity (W/m-K): 2.89 Thermal Resistance: 0.032 Bond Line Thickness (microns): 7
Viscosity /Flowability, average centipoise NVC % (120C): 99.92 Volatile Content (120C)%: <0.1
at 1 rpm : 76,194
Dielectric Constant at 1 kHz: 10.0 Dielectric Dissipation factor at 1 Volume Resistivity, ohm-cm: 2..0 x 1010
kHz: 0.31
Dielectric Strength (volts/mil): N/A Specific Gravity: 3.5 Shelf Life, Months from DOM: 24
Dow Corning TC-5026 Additional Information
One of the best performing and most reliable thermal greases Apply grease with a squeegee through a stencil or screen to
in the market. Validated by independent customer testing. print a grease pad or spread out bulk material with a spatula.
This material contains a high concentration of advanced Solvent free composition does not require drying.
silicone fluid to reduce pump out during thermal cycling. It
also features a small filler particle size that allows extremely * Please see additional test data in the following slides for
thin bond lines for optimal thermal performance. TC-5026’s our premier thermally conductive grease – TC-5026. ** For
solvent free solution ensures easy application even after non-planar mating surfaces and thicker bond lines please
storage. TC-5026 was engineered with reliability in mind. see TC-5022.

25
 Power Cycle On TTV Tester
The results reported in this graph show that TC-5026 remains stable through 20,000 power cycles.
This test is often used as a method of demonstrating pump-out. TC-5026 has very low end of life
thermal resistance, indicating high reliability and stability. This graph is intended to illustrate
reliability or change in TR, not baseline TR. Much lower TR can be realized than shown in graph.

TC-5026 Thermal Reliability, Power Cycle TTV

(Each Cycle : 8 minute powe r, 2 minute cool down, T(lid) ~ 92°C to r.t.)

0.5

0.45
Thermal Resistance ( C-cm /W)

0.4
2

0.35
o

0.3

0.25

0.2

0.15

0.1

0.05

0
0 5000 10000 15000 20000 25000
Cycles

26
TC-5026 Temperature Cycling
The results reported in this graph show that TC-5026 remains stable through thermal
cycling. The thermal resistance actually decreases over time.

0.200

0.180
0.160
TR on Hitachi, C-cm2/W

0.140

0.120

0.100

0.080

0.060

0.040

0.020

0.000
0 200 400 600 800 1000
Temp cycles -40C to +150C

27
 Spreadability Study
Multiple greases were applied between glass slides in 0.05 ml samples. The slides were then compressed together at
a force of 5 psi. The diameter of the resulting sample was measured revealing the ability of different greases to
spread under minimal pressure. TC-5026’s unique formulation exhibits continuous stability at room temperature and
allows it to reach minimal bond line thickness with minimal force even after aging. It’s unique spread-ability makes
TC-5026 appropriate for a variety of non-traditional applications.

Over Lap Comparison

TC-5026 X23-7783 Scale Illustration
Spread Ability of Thermal Greases

Dow Corning® TC-5026

35
Dow Corning® TC-5022
Fresh Sample Fresh Sample 30

S p re a d D ia m e t e r / M illim e t e rs
Dow Corning® TC-5121
Spreads to 28mm Spreads to 16mm
25 Shin-EtsuMicroSi® X23-7783D
Shin-EtsuMicroSi® X23-7762D

@ 5 p si
20
Shin-EtsuMicroSi® G751
15
Aged 1 day at
23 °C 50% RH 10
Spreads to 13mm
5

0
Fresh 1 day 7 days
Time (23°c 50% RH)
Aged 7 days at Aged 7 days at
23 °C 50% RH 23 °C 50% RH
Spreads to 28mm Spreads to 11mm TC – 5026
X23-7783

28
Grease Print Aging
In this test, a pad of grease is screen printed onto an aluminum substrate and then aged at various temperatures.
The grease is then removed and the viscosity re-tested. TC-5026 exhibits superior stability. This feature is useful
when the grease is applied to a heat sink and shipped prior to assembly. The stable viscosity would enable the
grease to compress to a thin bond line during assembly and properly wet the surface, thus optimizing thermal
performance.

16000 TC-5026 80C

TC-5022 80C
14000 Shin-Etsu MicroSi® X23-7783D 80C
TC-5026 50C
12000 TC-5022 50C
Viscosity at 0.5 rpm, P

Shin-Etsu MicroSi® X23-7783D 50C

10000 TC-5026 38C
TC-5022 38C
8000 Shin-Etsu MicroSi® X23-7783D 38C

6000

4000

2000

0
0 200 400 600 800 1000
Aging time, hr

29
Product Testing
Thermal Resistance
Hitachi Guarded Hotplate (ASTM # D5470).
– Measures thermal resistance through TIM at different bond
lines and pressure loads
Desktop TTV
– Measures thermal resistance in a “real world” application as the
TIM for a computer microprocessor
Power Cycling
Laptop TTV
– Simulates laptop microprocessor
– TIM is situated between heat sink and bare die
– Bare die flexes due to CTE mismatch creating an environment to
induce pump-out
– Test indicates long term reliability

30
 Guarded Hotplate System
For Thermal Testing (ASTM # D5470).

Thermal resistance testing critical for

TIM development:
• Steady state method
• Handles complex materials
• Load or Thickness can be controlled
• Measurable at 40~140C

Probe: precision-machined 1 cm X 1 cm Cu blocks.

31
Desktop TTV Tester Set-Up

Heat-sink:
Clamp pressure: 15 psi

Lid: 3.6cm x 3.6cm

Power: 120W

32
Product Processing

• Screen Printing
– High volume processing
– Applies a controlled amount of material to substrate
– Produces consistent bond lines and patterns

• Dispensing From Syringe

– High volume, low volume and rework
– Applies a controlled amount of material to substrate
– Apply minimal amount of material to cover substrate

33
 Screen Printing of Grease

Typical manual screen printing equipment.

Grease Prints

34
Screen Printing – Process Steps

35
Syringe Dispensing

• Ease of spreadability = reliable surface coverage

• Syringes are easy to carry for rework

.54 grams of TC-5026 dispensed in x-pattern on 37mm x 37mm substrate

36
 TC-5026 For Fieldwork
In this example, a small drop of grease is dispensed from a syringe onto a microprocessor located on a
computer motherboard. The heat sink is then clamped into place using the existing clamping system on
the motherboard. After a few minutes, the heat sink is removed. It is clearly visible that grease has
spread out to a thin bond line covering entire surface. Some thicker commercial greases can be
cumbersome to apply but Dow Corning greases are formulated with a target viscosity to enable versatile
processing.

1) Grease drop on microprocessor

3) Grease spread out over 4) Grease spread out onto heat

microprocessor sink

2) Heat sink mounted on motherboard

37
 Frequently Asked Questions
Question: I occasionally see greases and other TIMs that advertise thermal conductivity in the high teens, why
doesn’t Dow Corning make any materials like that?
Answer: In many applications, thermal resistance is more important that bulk conductivity. There are many factors
that affect thermal resistance, including: bulk conductivity, contact resistance, filler size, shape and distribution.
Dow Corning’s TC-XXXX greases have optimized formulations that out perform other greases on the market with
expensive exotic fillers and high bulk thermal conductivity. Before making a purchase based on thermal
conductivity, you should test the product performance in your particular application. You will be pleasantly
surprised by Dow Corning performance. Order a test sample today!
Question: I currently use a phase change pad. Much of our device failure is due to thermal issues so I would like to
use a grease to get better performance, but it is too messy for rework and its not realistic for us to train all of our
technicians how to use grease in the field. Do you have any alternatives?
Answer: It is surprising to many customers to learn how easy a modern grease can be to use. As far as the mess goes,
used grease can usually be wiped from the substrate quite easily. For extra cleaning a small amount of nontoxic Dow
Corning OS-XX solvent can be used to remove residue. A grease such as DOW CORNING® TC-5026 can easily be
used for rework situations. A technician merely dispenses a predetermined amount of grease from a syringe onto the
substrate. When the pieces are fastened together the grease easily spreads out to a thin bond line with minimal
pressure. Many customers believe this process to be just as simple as using a pad. Fewer device failures and the
lower cost of grease more than justify any switching costs.
Question: I have always heard that greases have problems with “pump-out” and degradation. How can I
confidently use a grease in an important application where reliability is key?
Answer: Dow Corning next generation greases are formulated with unique silicone fluids that interact with filler
particles and actually help bind the filler to the matrix. This prevents the separation and “pump-out” often
associated with greases. As for degradation, you can see from power cycling data that even after 20,000 power cycles
the performance is stable and in some situations even improved. For the highest stability, use solvent free DOW
CORNING® TC-5026

38