Numerical Simulation of Silicon Heterojunction Solar Cells Featuring Metal Oxides As Carrier-Selective Contacts
Numerical Simulation of Silicon Heterojunction Solar Cells Featuring Metal Oxides As Carrier-Selective Contacts
Abstract—The applicability of different high (low) work func- the Shockley equations
tion contact materials for the formation of alternative passivating
and hole (electron) selective contacts is currently re-explored for J = J gen − J 0 {exp [qV /(n kB T )] − 1} (1)
silicon solar cells. To assist the engineering of those contacts, which
is still in its infancy, numerical device simulations are used to im- where q is the elementary charge, n the ideality factor, and kB
prove knowledge regarding relevant heterojunction and thin film the Boltzmann constant. One important assumption for (1) is
properties with the focus on metal oxide based hole contacts. The that the voltage (V), which corresponds to the quasi-Fermi level
importance of 1) a high metal oxide work function for the induced splitting within the absorber at the edge of the pn-junction,
c-Si pn-junction is shown. It is elucidated that for an efficient hole equals the external voltage (Vexternal ) at the contacts. The
transport from this induced c-Si junction into the external elec-
trode, via the buffer and the metal oxide, 2) the metal oxide’s quasi-Fermi level splitting can also be expressed by the im-
conduction band must be below the valence band of the buffer (or plied voltage (Vim plied ). The assumption Vexternal = Vim plied
c-Si absorber) for direct band-to-band tunneling, or 3) bulk traps is typically fulfilled for a negligible gradient in the majority
near the valence band edge of the buffer (or c-Si absorber) are carrier quasi-Fermi level in the contact region. This means that
needed for trap-assisted tunneling. low-injection conditions in the contact region during operation
Index Terms—Amorphous silicon, band-to-band (B2B) tunnel- must be maintained [2], i.e., that the majority carrier density re-
ing, fundamentals, heterojunctions, inversion-layer, simulation, se- mains well above the minority carrier density (nm a j nm in ).
lectivity, trap-assisted tunneling (TAT). Or, in a more general expression, that the conductivity σ of
majority carrier remains well above those of the minority car-
I. INTRODUCTION riers (σm a j = q μm a j nm a j σm in = q μm in nm in , μ is the
mobility) [3]. Basically, we define contacts to be “selective” for
ASSIVATING and carrier-selective contacts [1] have the
P potential to overcome some of the intrinsic efficiency limi-
tations of the established homojunction contact schemes. For the
which Vexternal = Vim plied and hence the validity of the diode
equation is fulfilled. Accordingly, we define contacts to be “non-
selective” when having a significant voltage loss in the contact
latter, doping of the silicon surface region is applied to obtain region during operation leading to Vexternal < Vim plied .
carrier-selective device regions below the unpassivated metal Similar to classical homojunctions, for TOPCon [4] and poly-
electrodes. The high recombination in this region is linked to a Si [5] related contacts obtaining carrier selectivity is typically
high dark saturation current J0 and, therefore, results in mod- not the main design constraint. This is explained by the high
erate voltage at maximum power point (MPP) and open-circuit doping efficiency of the partly crystalline silicon thin films and
(OC) conditions. Both passivating and nonpassivating carrier- the c-Si wafer surface. It ensures that the majority carrier density
selective contacts typically obey the diode model described by in the contact region during equilibrium (nm a j,0 ) is already
much higher than the excess carrier density that will be added
Manuscript received October 13, 2017; revised December 13, 2017; accepted during operation (Δn = Δp). Accordingly
January 9, 2018. This work was supported in part by the European Project “Disc”
under the European Union’s Horizon 2020 Research and Innovation Program nm a j = nm a j,0 + Δp nm in = nm in,0 + Δn
under Grant agreement N°727529 and in part by the German Federal Min-
istry for Economic Affairs and Energy under contract N°0324141 “Selektiv.” with Δn nm in,0 , is typically fulfilled. For TOPCon and poly-
(Corresponding Author: Christoph Messmer.) Si related contacts, an intermediate passivating dielectric buffer
C. Messmer, M. Bivour, and M. Hermle are with the Fraunhofer Institute for (SiOx ) ensures that those contacts are not only selective but also
Solar Energy Systems, Freiburg 79110, Germany (e-mail: christoph.messmer@
ise.fraunhofer.de; [email protected]; martin.hermle@ise. passivating. Accordingly, J0 is low and the device characteristic
fraunhofer.de). and the limiting losses are well described by the diode equation.
J. Schön and S. W. Glunz are with the Fraunhofer Institute for Solar Energy The application of different high (low) work function thin
Systems, Freiburg 79110, Germany, and also with the Department of Sustain-
able Systems Engineering (INATECH), Albert-Ludwigs-Universität Freiburg, films for the formation of passivating and hole (electron) selec-
Freiburg im Breisgau 79110, Germany (e-mail: [email protected]. tive contacts is another currently explored approach for silicon
de; [email protected]). solar cells. So far, most promising candidates are transition
Color versions of one or more of the figures in this paper are available online
at http://ieeexplore.ieee.org. metal oxide (TMO) based heterojunctions leading to efficien-
Digital Object Identifier 10.1109/JPHOTOV.2018.2793762 cies up to 22% [6]–[10]. However, other materials are also under
2156-3381 © 2018 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission.
See http://www.ieee.org/publications standards/publications/rights/index.html for more information.
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A. Simulation Setup
Since the investigated devices have no lateral distinction sim-
ulations are carried out in (quasi-)1D. The silicon bulk is n-type
and the electron contact on the rear side is idealized and the same
for all structures featuring a layer of intrinsic amorphous silicon
a-Si(i):H and n-type a-Si(n) (parameters listed in the Appendix,
Table II). However, the focus will be on the p-contact at the front
side featuring a passivating buffer layer and a high work function
wide band gap metal oxide. We will approach this final contact
system step-by-step by analyzing the following structures:
a) The simplest contact is a metal–semiconductor (MS) con-
tact with an induced pn-junction described by the Schottky
model [14]. The equilibrium band diagram of such a con-
tact is shown in Fig. 1(a) and the highly hole populated and
inverted c-Si surface can be seen. There are two important
parameters to set for this simple contact: Fig. 1. Band diagrams of the three investigated p-contacts in the dark: (a)
i) The work function of the metal-like layer Φm etal MS—Metal-Silicon; (b) MIS—with additional intrinsic amorphous Si-layer;
(c) T-SHJ—Transition metal oxide Silicon hetero junction, B2B path (case C);
determining the built-in potential of the c-Si part of (d) T-SHJ for a lower work function with TAT. (case A, A∗ ) Four different TMO
the induced junction. The latter corresponds to the trap distributions (α-δ) are schematically shown.
band bending ϕcSi in the crystalline silicon. Note
that for this simulation study we do not speak of
vacuum work functions as listed in the literature but faces so that S0m etal is much higher. However, this
always of an “effective work function” after contact- MS contact with “artificially” lowered S0m etal is still
ing, which takes Fermi-level pinning into account. useful to distinguish between phenomena arising
Still, all the simulation results can be compared with from this simple induced junction and those from
experimental data by using ϕcSi as a figure of merit the more complex structures (b) and (c).
that can be easily measured by SPV measurements. b) The next step to approach a more realistic contact is to
ii) The surface recombination velocity S0m etal that in add a passivating buffer layer—in our case 5 nm thick
this case is set to 10 cm/s mimicking a good chem- undoped amorphous silicon. We get an MIS-like structure
ical surface passivation of the metal/c-Si. Note that [see Fig. 1(b)] where the buffer decouples S0m etal from
MS contacts in reality form highly defective inter- the junction recombination. S0m etal is set to 106 cm/s for
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MESSMER et al.: NUMERICAL SIMULATION OF SILICON HETEROJUNCTION SOLAR CELLS FEATURING METAL OXIDES 3
all the following structures. As can be seen, the induced energy level lies at E = ΦTM O + Ecut . (Note: The over-
band bending is shared by the buffer and the c-Si surface. all trap density is, therefore, getting smaller for higher
Hence, ϕcSi is reduced to some extent but the c-Si is still Ecut , whereas the trap density per energy is still equal to
highly inverted. We get a heterojunction between a-Si and that of (α)).
c-Si which usually has small defect concentrations at the (δ) Some further investigations are carried out by a single
interface, thus, we set the surface recombination velocity defect level. This level has an energy ELevel with respect
S0cSi to zero, unless stated otherwise. to the conduction band of the TMO and a density of
−3
c) Finally, we add a TMO like 10 nm thick layer with a high ρTM O 20
Level = 10 cm .
band gap of 3 eV and a variable work function ΦTM O
and bulk defect density [see Fig. 1(c)]. For simplicity and III. SIMULATION RESULTS
referring to the standard silicon hetero junction (SHJ) fea-
In this section, we aim to separate the different basic require-
turing p-type a-Si instead of the high work function TMO,
ments needed to build a hole-selective contact step-by-step. In
we will call this hole contact TMO-based SHJ (T-SHJ).
the first section, we will present a simple showcase to discuss the
The TMO/a-Si:H contact adds a second heterojunction
importance of the induced c-Si junction and to clarify what we
and in principle two tunneling paths that are essential for
mean by nonideal selectivity. We will show how it can be quan-
the contact to work: Path (I) is direct band-to-band (B2B)
tified and distinguished from other phenomena like classical
tunneling from the valence band of the buffer to the con-
losses as described by the diode model where ideal selectivity
duction band of the TMO [see Fig. 1(c)]. For path (II) traps
is linked to a proper rectifying, i.e., diode-like contact charac-
in the band gap of the TMO provide an additional trans-
teristic. Section III-B will compare the influence of the work
port path, i.e., trap-assisted tunneling [TAT, see Fig. 1(d)]
function on the structures presented in Section II-A, whereas
[14]. How we modeled the defect traps within the TMO
Section III-C will investigate the influence of the tunneling
is described in the next section.
transport for the T-SHJ structure.
B. Modeling of the Traps Within the TMO A. Importance of Induced c-Si Junction: Nonideal Selectivity
As will be shown the density and the energetic distribution Let us first consider the three different T-SHJ hole contacts
of the traps inside the TMO band gap greatly affect the TAT listed in Table I. Contact A has a sufficiently high work function
current. First some general notes on how the traps are modeled (Φ = 5.3 eV) exceeding the valance band energy of the c-Si
in this paper. absorber (5.19 eV) and no c-Si surface recombination (S0cSi =
The TMO has a thickness of 10 nm and is n-type doped in 0) and is, therefore, solely limited by Auger recombination
a way that its work function equals the TMO conduction band (ideal case). Furthermore, we constructed two cases A∗ and
energy ΦTM O = ECTM O as shown in Fig. 1(d) (n-doping con- B in a way that contact A∗ has the same high work function
centration: 1020 cm−3 ). The traps are implemented electrically but no surface passivation (i.e., high S0cSi )—Contact B is well-
neutrally (that means we put half donor traps and half accep- passivated (S0cSi = 0) but its work function is not sufficiently
tor traps in the TMO) in order to just influence the tunneling high (Φ = 5.0 eV). (For all of these three contacts tunneling is
current. Furthermore, the traps are in all cases implemented ideal, i.e., distribution (α) was used.)
spatially uniform throughout the TMO. If we look at the JVlight -curves (Fig. 2, solid line) for an
In this paper, we will consider four different distributions experimentally typical range and the external cell parameters
(α)–(δ) of the traps that we try to visualize in Fig. 1(d) and (see Table I) we notice no significant distinction of the two
describe in the following. curves of contact A∗ (blue) and B (red) although their power
(α) The energetic distribution of the traps is uniform through- losses arise from different phenomena. For a better loss analysis
out the whole bandgap with a very high density of we want to discuss three quantities, namely the implied OC
−3
ρTM O 20
Traps = 10 cm (which is equal to the n-doping con- voltage (iVo c ), the difference of the iVo c , and external Vo c (ΔV )
centration). Therefore, we will call this case “metallic” and the inversion of the c-Si surface during equilibrium that
or “metal-like” since the defect distribution within the is quantified by the induced c-Si band bending (ϕcSi ). These
TMO provides energy states through the whole band gap. “internal” cell parameters, given in Table I, are depicted in a
In this case, we can assume that the TAT is not limiting band diagram in Fig. 3(a) and can be extracted experimentally
the current of the cell. with little effort [15].
(β) This case is like (α), i.e., we still have a uniform en- Starting with ϕcSi : For contact A∗ the band bending ϕcSi
ergy distribution of the traps, but we lower the trap den- is the same as for contact A since the work function is the
sity ρTM O
Traps by orders of magnitude down to values like same (see Table I). However, the work function of contact B
−3
11
10 cm . is too low to form a proper pn-junction that results in a ϕcSi ,
(γ) To investigate the influence of the traps close to the con- which is 169 meV lower. Basically, ϕcSi increases the local hole
duction band of the TMO, starting from (α) we define density in the contact region with respect to the c-Si bulk as
additional cutoff energy Ecut [depicted in Fig. 1(d)]. Be- shown in Fig. 3(b) and (c) (pEQ , solid line) during equilibrium.
tween the conduction band of the TMO-like layer and this Accordingly, the asymmetry of the hole/electron conductivity
energy all traps are omitted, therefore, the first available in this device region is also increased that is the decisive pa-
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TABLE I
THREE DIFFERENT HOLE CONTACTS WITH THEIR EXTERNAL AND INTERNAL
CHARACTERISTICS: (A) INTRINSIC AUGER LIMIT (A∗ ) LIMITED BY HIGH
SURFACE RECOMBINATION Sc0 S i (B) LIMITED BY WORK FUNCTION Φ.
Fig. 2. JV-curves for the contacts listed in Table I. Solid lines show the charac-
teristics for one sun on an n-type bulk, dotted lines show the dark characteristics Fermi-level in the contact region and is significant for contact B
on a p-type bulk. (ΔV 0), whereas for contact A∗ it is negligible. The origin
of this voltage loss ΔV for contact B is due to p ∼ n [see
Fig. 3(c)] in the contact region that lowers the hole conductivity
rameter for obtaining the selective extraction of excess holes σh . According to jh = σh grad[EF,p ]/q [3], [16], to drive a
from the absorber [3], [16], i.e., a proper rectifying and diode- certain hole current density jh through the p-contact, a reduction
like carrier transport. Although ϕcSi describes this asymmetry of the hole conductivity σh has to come along with a higher
only in the dark it is directly related to the asymmetry dur- gradient in the hole quasi-Fermi level EF,p , i.e., a voltage loss
ing operation when excess electrons and holes are generated ΔV . In our example, this voltage loss of contact B is split
by the same amount (p/n = (p0 + Δp)/(n0 + Δn)) [3]. Ac- up into ΔV aSi = 67 mV within the amorphous silicon [visible
cordingly, the influence of ϕcSi can also be seen during oper- fermi level gradient in Fig. 3(a)] and ΔV IF = 66 mV at the
ation at MPP and OC conditions. For the latter this is shown TMO/a-Si interface (not directly visible).
in Fig. 3(b) and (c). For the high work function of contact A∗ Since voltage losses ΔV arise from nonideal selectivity, we
[see Fig. 3(b)] this asymmetry is maintained during operation will use ΔV as a figure of merit for selectivity losses. However,
since po c (dashed lines) is well above no c (dotted lines) in the it should be noted that besides ΔV another experimental method
contact region. For the low work function of contact B, this to probe insufficient selectivity of a contact is to measure the
asymmetry cannot be maintained during operation, i.e., p ∼ n dark JV-curve for the contact put on an absorber with inverse
in the contact region [see Fig. 3(c)]. The latter is accompa- doping (p-type) and a low resistive ohmic rear contact. In this
nied by a significant gradient in the majority carrier Fermi-level case, an identical and low-ohmic characteristic is obtained for
and voltage loss (ΔV) in the contact region as highlighted in high work function contacts A and A∗ , which is mainly limited
gray in Fig. 3(a). It violates one important boundary condition by the absorber resistivity (see Fig. 2, dotted JVdark ). For con-
of the standard pn-junction theory [2]. Accordingly, such con- tact B a poor hole selectivity is obtained for the p-type absorber,
tacts and their losses are not properly described by standard reflected in a diode-like characteristic.
diode equation. We conclude: While contact A∗ is limited due to classical re-
iVo c : Owing to the lack of chemical passivation the iVo c of combination losses, contact B is limited by an insufficient work
contact A∗ shows a significant drop to 578 mV, whereas the function Φ and hence insufficient asymmetry of the conductivi-
iVo c of contact B is above 700 mV. This difference can be ties leading to a selectivity loss ΔV in the contact region during
directly seen in the band diagram at OC where the iVo c equals operation. It should be noted that similar conditions are also
the splitting of the hole and electron quasi-Fermi levels in the obtained at MPP.
bulk of the absorber (see Fig. 3(a), right dashed lines). More generally, we have seen that a high iVo c is linked to
ΔVo c = iVo c − Vo c : This difference between internal and a good c-Si surface passivation and a low ΔV indicates ideal
external voltage results from the gradient in the majority carrier selectivity. For the latter, a high work function Φ is needed to get
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MESSMER et al.: NUMERICAL SIMULATION OF SILICON HETEROJUNCTION SOLAR CELLS FEATURING METAL OXIDES 5
of the c-Si mid-gap energy the efficiency drops and then de-
creases linearly until it reaches zero. Therefore, a sufficiently
high (low) work function is the first condition for building a good
hole (electron) selective contact since it modifies the asymmetry
of the conductivity as motived before.
To analyze where these power losses come from, we will have
a closer look at the OC voltage of the cell, as shown in Fig. 4(b).
For the hole contact with a work function above the valence band
energy of c-Si (Φ > EVcSi ) the curves of iVo c (dotted blue line)
and the Vo c (solid blue line) match, therefore, ΔV = 0 which
indicates an ideal selectivity of the contact. In this range, the Vo c
is solely limited by the intrinsic limit (Auger recombination)
comparable to the case of contact A in Section III-A.
If the work function is lower than the valence band energy
of c-Si (Φ < EVcSi ), the Vo c drops while the iVo c stays above
728 mV. The latter indicates that the mimicked “passivation”
at the metal/c-Si interface is very good (S0m etal = 10 cm/s).
However, the external voltage Vo c drops for decreasing work
functions in a linear fashion [17]–[19]. A similar behavior is
obtained for fill factor FF and jsc (not shown). The difference be-
tween iVo c and Vo c per definition leads to ΔV > 0 and indicates
that the losses in voltage (and efficiency) are due to nonideal
selectivity of the contact (similar to contact B in Section III-A).
2) Metal-iLayer-Silicon: When adding 5 nm of intrinsic
amorphous silicon between the metal and the c-Si bulk, which
for real devices is needed for a good surface passivation, we get
the MIS-like structure shown in Fig. 1(b) and the characteristic
shown in Fig. 4, green.
Both the efficiency η and the OC voltages Vo c and iVo c show
the same characteristic as for the MS structure, except that they
are shifted by 0.15 eV to higher work functions. Whereas the
MS curves were symmetric around the mid-gap energy of c-Si,
the green curves are centered about the mid-gap energy of a-Si
Fig. 4. (a) Efficiency η, (b) V o c and iV o c as a function of the metal/TMO
EmaSi
idgap ≈ 4.78 eV. This raises the demand on the TMO work
work function Φ for the three different p-contact systems of Fig. 1. For MS and function Φ in order to reach a high c-Si band bending ϕcSi ,
MIS, the light-colored curves show the mirrored n-contact. The p-contact for but still a work function Φ slightly greater than the c-Si valence
T-SHJ is shown for two different surface passivations Sc0 S i (orange and pink)
and the three cases A, A∗ , and B (of Section III-A) are highlighted. band energy EVcSi is sufficient to reach a high ϕcSi and, therefore,
maximum efficiency.
Like for the MS structure the Vo c around the mid-gap energy
a high c-Si band bending ϕcSi and, thus, to maintain the asym- shows the well-known linear behavior [17], [20] with a slope of
metric p/n conductivity in the contact region during operation. 1 V/eV, which indicates that for this range the work function Φ
shows a one-to-one relation with respect to the limiting built-in
voltage of the contact and, therefore, the c-Si band-bending ϕcSi
B. Influence of the Work Function
[3], [19].
This section discusses the influence of the work function for 3) TMO Silicon Hetero Junction: In this last step, we add
the p-contacts introduced in Section II (see Fig. 1) step-by-step. the high-band gap, n-type TMO layer with a high trap density
1) Metal-Silicon: The results for the MS interface are shown inside its band gap and hence another heterojunction to obtain
in Fig. 4 (in blue). The dark blue curve in Fig. 4(a) shows the the TMO/a-Si:H(i)/c-Si p-contact introduced in Fig. 1(c) and (d).
efficiency for the hole contact introduced in Fig. 1(a) (p-contact Let us first consider the results shown in orange (see Fig. 4).
on an n-type c-Si bulk) while the light blue curve shows the We see that the T-SHJ contact in this case shows a similar
efficiency for an electron contact (n-contact on a p-type c-Si behavior with respect to efficiency and voltage (also FF and
bulk), both as a function of the work function Φ of the metal. jsc ) as the MIS-like structure, despite its higher complexity due
The two curves are symmetric around the mid gap energy to tunneling at the TMO/a-Si interface. The reason for this is
of c-Si Em idgap ≈ 4.63 eV. For the hole (electron) contact, the
cSi
that we modeled the TMO in a way that it behaves “metal-
efficiency reaches a maximum of η = 28% for a work function like” (distribution (α) in Section II-B). This means that the hole
Φ greater (smaller) than the valence (conduction) band energy extraction from the inverted c-Si region toward the external
EVcSi ≈ 5.19 eV (ECcSi ≈ 4.07 eV). Getting closer to the region electrode is based on an efficient tunneling via the TMO gap
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Fig. 5. (a) OC voltage V o c , Additionally shows the c-Si band-bending ϕ c S i and iV o c (same for all curves) and selectivity losses ΔV Φ , ΔV TAT due to
insufficient work function (blue arrow) and insufficient TAT tunneling (red arrow), respectively. (b) Short-circuit current jsc , Additionally shows the TAT current
j TAT (dash-dotted). (c) FF; Additionally shows the cutoff energies in gray. (d) efficiency η as a function of the TMO work function Φ for different trap distributions
(α–γ introduced in Section II-B); highlights the cases A [see Fig. 1(d) and Section III-A) and B (see Section III-A) and C [see Fig. 1(c)]. The MIS-like structure
and the “metal-like” T-SHJ of Fig. 4 are plotted as references (in green and light orange). (β) Shows variation of the uniformly distributed trap density as solid
lines in different shades of orange. (γ) Shows variation of Ec u t as dotted lines in orange.
states. The influence of the distribution of these gap states will characteristics for different trap concentrations are shown as a
be discussed in the next section. function of ΦTM O .
For the sake of completeness, Fig. 4 shows a T-SHJ contact Let us first concentrate on the efficiency η [see Fig. 5(d)]. The
with poor chemical surface passivation (S0cSi = 5.3 · 106 cm/s, MIS-like structure (green), the T-SHJ structure of Fig. 4 (light
pink) resulting in a lower iVo c and hence lower efficiency. How- orange, solid line), and the former discussed cases A, B, and C
ever, for higher work functions ΔV = 0 indicates ideal selectiv- [see Fig. 1(c)] are plotted as references reflecting only the power
ity despite the poor chemical passivation. The iVo c stays above losses caused by an insufficient work function. The other data
531 mV for work functions around the mid-gap of a-Si while provide information on the TMO properties namely the traps
the Vo c drops further due to insufficient c-Si band-bending ϕcSi . and their distribution. An important TMO/a-Si heterojunction
Note that the three p-contacts A, A∗ , and B (discussed in property is the position of the TMO conduction band with re-
Section III–A) are highlighted in Fig. 4 to relate back to spect to the valence band of the a-Si:H buffer that we define as
Section III-A and emphasize once more the difference between EBarrier = EVaSi − ECTM O [see Fig. 1(d)]. We plot this as a sec-
power losses due to an insufficient work function (case B) and ond x-axis in Fig. 5. It should be highlighted again that for sim-
power losses due to a poor chemical passivation (case A∗ ). plicity reasons ECTM O ≡ ΦTM O for the TMO is assumed here.
We conclude that the T-SHJ structure behaves like a MIS- All curves match for EBarrier < 0 (ECTM O > EVaSi ). This is
like structure as long as the TMO electrically behaves like a because a TMO conduction band energy greater than the a-Si
metal. However, it is important to understand what happens if valance band energy allows an efficient transport at the TMO/a-
the tunneling at the TMO interface has a limiting influence. The Si:H contact by B2B tunneling independent of the TMO traps
next section will discuss some cases. [see Fig. 1(c)].
However, if EBarrier > 0 (ECTM O < EVaSi ) the TMO conduc-
C. Transport Limitations at the TMO/a-Si Interface tion band energy is lower than the valence band energy of the
a-Si layer [shown in Fig. 1(d)], an efficient TAT is needed. Thus,
In the last section, we assumed the transport via tunneling the efficiency crucially depends on the TMO traps. When low-
at the TMO/a-Si interface to be nonlimiting. However, for real ering the density ρTM O
Traps of the homogeneously distributed traps
cells there might be complex and nonmetal-like distributions of we see that the efficiency decreases [see β in Fig. 5(d), orange
the defect traps that are subject of this section. In Fig. 5, the cell to black lines]. This effect is less pronounced for higher work
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MESSMER et al.: NUMERICAL SIMULATION OF SILICON HETEROJUNCTION SOLAR CELLS FEATURING METAL OXIDES 7
MESSMER et al.: NUMERICAL SIMULATION OF SILICON HETEROJUNCTION SOLAR CELLS FEATURING METAL OXIDES 9
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