Manipal University Jaipur: Department of Mechanical Engineering
This document provides details about an introductory course on Micro Electro Mechanical Systems (MEMS) including the course code, semester, faculty, topics to be covered, and lecture plan. Over the course of 55 lectures, students will learn about the basic concepts, design, fabrication processes, and applications of MEMS. Key topics include scaling laws, microfabrication techniques like lithography and etching, electronics and sensors in MEMS, microactuation methods, metrology tools, microrobotics, microfluidics, and hands-on software exercises using Comsol. The goal is to introduce students to the multidisciplinary field of MEMS.
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Manipal University Jaipur: Department of Mechanical Engineering
This document provides details about an introductory course on Micro Electro Mechanical Systems (MEMS) including the course code, semester, faculty, topics to be covered, and lecture plan. Over the course of 55 lectures, students will learn about the basic concepts, design, fabrication processes, and applications of MEMS. Key topics include scaling laws, microfabrication techniques like lithography and etching, electronics and sensors in MEMS, microactuation methods, metrology tools, microrobotics, microfluidics, and hands-on software exercises using Comsol. The goal is to introduce students to the multidisciplinary field of MEMS.
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MANIPAL UNIVERSITY JAIPUR
School of Automobile, Mechanical and Mechatronics
DEPARTMENT OF MECHANICAL ENGINEERING
Course Name: Introduction to Micro Electro Mechanical Systems Course Code: ME1552 Program & Semester: Mechanical Engineering III year/ V semester Number of Contact Hours: 4/week Faculty (s): Dr. (Prof.) N.N. Sharma Ms. Priyanshu Sharma Course Coordinator: Dr. (Prof.) N.N. Sharma Lecture Plan: Topics to be covered S. No.
Introduction: Need of MEMS, Historical developments, Advantages of miniaturization,
L1-L2 Examples and their explanations, difference between VLSI and MEMS, Basic Concepts of MEMS Design and Fabrication: Example of Dielectrophrosis, system on L3-L6 a chip, next generation MEMS, Top to Down technology, Micromachining- surface, bulk and LIGA (introduction), Material in MEMS Scaling Laws: Scaling in Geometry, Rigid body dynamics, Electrostatic forces, Paschen L7-L9 Effect, Electromagnetic forces, Fluid Mechanics and in Heat transfer L10 QUIZ NO 1 Microfabrication Processes I: Sand to wafer, Ckralski method, Float Zone method, Polishing L11-L13 and finishing of wafer, Heat balance in CZ method. Microfabrication Processes II: Wafer level processing: RCA cleaning, Wafer identification, Silicon crystallography, Material in MEMS, Wafer level processing, oxidation(wet and dry), L14-L24 DG model, doping, ion implantation, thin film deposition, PVD, CVD, Epitxy, thick film deposition, lithography, itching, DRIE, Hstops, LIGA CASE STUDIES, L25 QUIZ NO 2 L26-L28 Electronics in MEMS: diodes and transistors Microactuatars: Electrostatic, piezoelectric, thermal(shape memory alloys) chemical L29-L35 Microsensors: Methods in mechanical microsensors, microaccelerometer, micropressure sensors , microgyroscope, Metrology in MEMS: Scanning electron microscopy, scanning tunnel microscopy, atomic L36-L38 force microscopy Microrobots: Introduction, definition, classification, drive principles, piezo-impact drive L39-L41 actuation, piezo and electromagnetic based actuation Microfluidics: Definition, Advantages, Dimensionless numbers, Models, Micro fluidic L42-L48 pumping, Electrokinetic driven flows, electroosmosis, electrophoresis, Dielectrophrosis L49-L55 Software: Comsol- learning and hands-on exercise.