SCAS522G − AUGUST 1995 − REVISED AUGUST 2008

D 2-V to 6-V VCC Operation

D Inputs Accept Voltages to 6 V
D Max tpd of 9.5 ns at 5 V
SN54AC14 . . . J OR W PACKAGE SN54AC14 . . . FK PACKAGE
SN74AC14 . . . D, DB, N, NS, OR PW PACKAGE (TOP VIEW)
(TOP VIEW)

VCC
NC
1Y
A1

6A
1A 1 14 VCC
1Y 2 13 6A 3 2 1 20 19
2A 4 18 6Y
2A 3 12 6Y
NC 5 17 NC
2Y 4 11 5A
2Y 6 16 5A
3A 5 10 5Y
NC 7 15 NC
3Y 6 9 4A
3A 8 14 5Y
GND 7 8 4Y 9 10 11 12 13

3Y

4Y
4A
GND
NC
NC − No internal connection

description/ordering information
These Schmitt-trigger devices contain six independent inverters. They perform the Boolean function Y = A.
Because of the Schmitt action, they have different input threshold levels for positive-going (VT+) and for
negative-going (VT−) signals.
These circuits are temperature compensated and can be triggered from the slowest of input ramps and still give
clean, jitter-free output signals. They also have a greater noise margin than conventional inverters.

ORDERING INFORMATION
ORDERABLE TOP-SIDE
TA PACKAGE†
PART NUMBER MARKING
PDIP − N Tube SN74AC14N SN74AC14N
Tube SN74AC14D
SOIC − D AC14
Tape and reel SN74AC14DR
−40°C
−40 C to 85
85°C
C SOP − NS Tape and reel SN74AC14NSR AC14
SSOP − DB Tape and reel SN74AC14DBR AC14
Tube SN74AC14PW
TSSOP − PW AC14
Tape and reel SN74AC14PWR
CDIP − J Tube SNJ54AC14J SNJ54AC14J
−55°C
−55 C to 125
125°C
C CFP − W Tube SNJ54AC14W SNJ54AC14W
LCCC − FK Tube SNJ54AC14FK SNJ54AC14FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

   ! "#$ !  %#&'" ($) Copyright  2008, Texas Instruments Incorporated
(#"! "  !%$""! %$ *$ $!  $+! !#$!  %(#"! "%'  /0121 '' %$$! $ $!$(
!(( ,-) (#" %"$!!. ($!  $"$!!'- "'#($ #'$!! *$,!$ $()  '' *$ %(#"! %(#"
$!.  '' %$$!) %"$!!. ($!  $"$!!'- "'#($ $!.  '' %$$!)

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1



 



 

SCAS522G − AUGUST 1995 − REVISED AUGUST 2008

FUNCTION TABLE
(each inverter)
INPUT OUTPUT
A Y
H L
L H

logic diagram, each inverter (positive logic)

A Y

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.

recommended operating conditions (see Note 3)

SN54AC14 SN74AC14
UNIT
MIN MAX MIN MAX
VCC Supply voltage 2 6 2 6 V
VI Input voltage 0 VCC 0 VCC V
VO Output voltage 0 VCC 0 VCC V
VCC = 3 V −12 −12
IOH High-level output current VCC = 4.5 V −24 −24 mA
VCC = 5.5 V −24 −24
VCC = 3 V 12 12
IOL Low-level output current VCC = 4.5 V 24 24 mA
VCC = 5.5 V 24 24
TA Operating free-air temperature −55 125 −40 85 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265



 



 

SCAS522G − AUGUST 1995 − REVISED AUGUST 2008

electrical characteristics over recommended operating free-air temperature range (unless

otherwise noted)
TA = 25°C SN54AC14 SN74AC14
PARAMETER TEST CONDITIONS VCC UNIT
MIN TYP MAX MIN MAX MIN MAX

VT+ 3V 0.8 1.8 2.2 0.8 2.2 0.8 2.2

Positive-going 4.5 V 1.5 2.6 3.2 1.5 3.2 1.5 3.2 V
threshold 5.5 V 1.6 3.2 3.9 1.6 3.9 1.6 3.9

VT− 3V 0.5 0.8 1 0.5 1.2 0.5 1

Negative-going 4.5 V 0.9 1.4 1.8 0.9 1.8 0.9 1.8 V
threshold 5.5 V 1.1 1.8 2.3 1.1 2.3 1.1 2.3

∆VT 3V 0.3 1 1.2 0.3 1.2 0.3 1.2

Hysteresis 4.5 V 0.4 1.2 1.4 0.4 1.4 0.4 1.4 V
(VT+ − VT−) 5.5 V 0.5 1.4 1.6 0.5 1.6 0.5 1.6
3V 2.9 2.9 2.9
IOH = −50 µA 4.5 V 4.4 4.4 4.4
5.5 V 5.4 5.4 5.4
IOH = −12 mA 3V 2.56 2.4 2.48
VOH V
4.5 V 3.86 3.7 3.8
IOH = −24 mA
5.5 V 4.86 4.7 4.8
IOH = −50 mA† 5.5 V 3.85
IOH = −75 mA† 5.5 V 3.85
3V 0.002 0.1 0.1 0.1
IOL = 50 µA 4.5 V 0.001 0.1 0.1 0.1
5.5 V 0.001 0.1 0.1 0.1
IOL = 12 mA 3V 0.36 0.5 0.44
VOL V
4.5 V 0.36 0.5 0.44
IOL = 24 mA
5.5 V 0.36 0.5 0.44
IOL = 50 mA† 5.5 V 1.65
IOL = 75 mA† 5.5 V 1.65
II VI = VCC or GND 5.5 V ±0.1 ±1 ±1 µA
ICC VI = VCC or GND, IO = 0 5.5 V 2 40 20 µA
Ci VI = VCC or GND 5V 4.5 pF
† Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.

switching characteristics over recommended operating free-air temperature range,

VCC = 3.3 V " 0.3 V (unless otherwise noted) (see Figure 1)
FROM TO TA = 25°C SN54AC14 SN74AC14
PARAMETER UNIT
(INPUT) (OUTPUT) MIN TYP MAX MIN MAX MIN MAX
tPLH 1.5 6 13.5 1 16 1.5 15
A Y ns
tPHL 1.5 6 11.5 1 14 1.5 13

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3



 



 

SCAS522G − AUGUST 1995 − REVISED AUGUST 2008

switching characteristics over recommended operating free-air temperature range,

VCC = 5 V " 0.5 V (unless otherwise noted) (see Figure 1)
FROM TO TA = 25°C SN54AC14 SN74AC14
PARAMETER UNIT
(INPUT) (OUTPUT) MIN TYP MAX MIN MAX MIN MAX
tPLH 1.5 5 10 1.5 12 1.5 11
A Y ns
tPHL 1.5 5 8.5 1.5 10 1.5 9.5

operating characteristics, VCC = 5 V, TA = 25°C

PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance CL = 50 pF, f = 1 MHz 25 pF

PARAMETER MEASUREMENT INFORMATION

TEST S1 VCC
Input
tPLH/tPHL Open (see Note B) 50% VCC 50% VCC
0V

tPLH tPHL
2 × VCC
VOH
500 Ω S1 In-Phase
OPEN 50% VCC 50% VCC
From Output Output
VOL
Under Test
CL = 50 pF tPHL tPLH
500 Ω
(see Note A) VOH
Out-of-Phase
50% VCC 50% VCC
Output
VOL

LOAD CIRCUIT VOLTAGE WAVEFORMS

NOTES: A. CL includes probe and jig capacitance.

B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr v 2.5 ns, tf v 2.5 ns.
C. The outputs are measured one at a time with one input transition per measurement.

Figure 1. Load Circuit and Voltage Waveforms

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 PACKAGE OPTION ADDENDUM

www.ti.com 24-Aug-2018

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

5962-87624012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87624012A
SNJ54AC
14FK
5962-8762401CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762401CA
SNJ54AC14J
5962-8762401DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762401DA
SNJ54AC14W
5962-8762401VCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762401VC
A
SNV54AC14J
5962-8762401VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762401VD
A
SNV54AC14W
5962-8762402VCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762402VC
A
SNV54AC14J
5962-8762402VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762402VD
A
SNV54AC14W
SN74AC14D ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 AC14
& no Sb/Br)
SN74AC14DBR ACTIVE SSOP DB 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 AC14
& no Sb/Br)
SN74AC14DE4 ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 AC14
& no Sb/Br)
SN74AC14DR ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 AC14
& no Sb/Br)
SN74AC14DRG4 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 AC14
& no Sb/Br)
SN74AC14N ACTIVE PDIP N 14 25 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 SN74AC14N
& no Sb/Br)
SN74AC14NSR ACTIVE SO NS 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 AC14
& no Sb/Br)

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 24-Aug-2018

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

SN74AC14NSRG4 ACTIVE SO NS 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 AC14

& no Sb/Br)
SN74AC14PW ACTIVE TSSOP PW 14 90 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 AC14
& no Sb/Br)
SN74AC14PWR ACTIVE TSSOP PW 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 AC14
& no Sb/Br)
SN74AC14PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 AC14
& no Sb/Br)
SN74AC14PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 AC14
& no Sb/Br)
SNJ54AC14FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87624012A
SNJ54AC
14FK
SNJ54AC14J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762401CA
SNJ54AC14J
SNJ54AC14W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8762401DA
SNJ54AC14W

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

Addendum-Page 2
 PACKAGE OPTION ADDENDUM

www.ti.com 24-Aug-2018

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN54AC14, SN54AC14-SP, SN74AC14 :

• Catalog: SN74AC14, SN54AC14

• Automotive: SN74AC14-Q1, SN74AC14-Q1
• Military: SN54AC14
• Space: SN54AC14-SP

NOTE: Qualified Version Definitions:

• Catalog - TI's standard catalog product

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

Addendum-Page 3
 PACKAGE MATERIALS INFORMATION

www.ti.com 17-Jan-2014

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74AC14DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74AC14DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74AC14DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74AC14NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74AC14PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 17-Jan-2014

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74AC14DBR SSOP DB 14 2000 367.0 367.0 38.0
SN74AC14DR SOIC D 14 2500 333.2 345.9 28.6
SN74AC14DR SOIC D 14 2500 367.0 367.0 38.0
SN74AC14NSR SO NS 14 2000 367.0 367.0 38.0
SN74AC14PWR TSSOP PW 14 2000 367.0 367.0 35.0

Pack Materials-Page 2
 PACKAGE OUTLINE
J0014A SCALE 0.900
CDIP - 5.08 mm max height
CERAMIC DUAL IN LINE PACKAGE

PIN 1 ID A 4X .005 MIN

(OPTIONAL) [0.13] .015-.060 TYP
[0.38-1.52]

1
14
12X .100
[2.54] 14X .014-.026
14X .045-.065 [0.36-0.66]
[1.15-1.65]
.010 [0.25] C A B

.754-.785
[19.15-19.94]

7 8

B .245-.283 .2 MAX TYP .13 MIN TYP

[6.22-7.19] [5.08] [3.3]

C SEATING PLANE

.308-.314
[7.83-7.97]
AT GAGE PLANE

.015 GAGE PLANE

[0.38]

0 -15 14X .008-.014

TYP [0.2-0.36]

4214771/A 05/2017

NOTES:

1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.

www.ti.com
 EXAMPLE BOARD LAYOUT
J0014A CDIP - 5.08 mm max height
CERAMIC DUAL IN LINE PACKAGE

(.300 ) TYP
[7.62] SEE DETAIL B
SEE DETAIL A

1 14

12X (.100 )
[2.54]

SYMM

14X ( .039)
[1]

7 8

SYMM

LAND PATTERN EXAMPLE

NON-SOLDER MASK DEFINED
SCALE: 5X

.002 MAX (.063)

[0.05] [1.6]
ALL AROUND METAL
( .063)
SOLDER MASK [1.6]
OPENING

METAL

SOLDER MASK .002 MAX

(R.002 ) TYP [0.05]
OPENING
[0.05] ALL AROUND
DETAIL A DETAIL B
SCALE: 15X 13X, SCALE: 15X

4214771/A 05/2017

www.ti.com
 MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,38
0,65 0,15 M
0,22
28 15

0,25
0,09
5,60 8,20
5,00 7,40

Gage Plane

1 14 0,25

A 0°–ā8° 0,95
0,55

Seating Plane

2,00 MAX 0,05 MIN 0,10

PINS **
14 16 20 24 28 30 38
DIM

A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90

A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30

4040065 /E 12/01

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.

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