MLCC - Tantalum Chip Substitution Common Footprints: © 2018 AVX Confidential
MLCC - Tantalum Chip Substitution Common Footprints: © 2018 AVX Confidential
Common Footprints
Many years ago, IPC set a standard of recommended footprints for most classes of surface mount
electronic components, including resistors, capacitors and inductors.
Although many companies develop their own internal footprint guidelines, IPC standards for MLCC
and tantalum chip are the starting point. At the time they were developed, there was only one
common footprint between MLCC & Ta chip – the 1206 size, which is common to both series.
Since that time tantalum chip has added smaller case sizes, designed for compatibility with IPC
MLCC footprints. This guide shows, by case size, which tantalum chip series and case sizes fit a
common IPC footprint.
As tantalum capacitance / voltage ratings overlap with most Class II ratings (X7R, X5R, X7S etc.),
when looking for a substitute first use this guide to establish a footprint compatible tantalum chip
series then contact AVX to establish compatible electrical ratings.
Component Outline:
All dims mm L S W T H
Metric EIA min max min max min max min max max
1005 0402 0.9 1.1 0.3 0.65 0.4 0.6 0.1 0.3 0.6
Footprint:
Y (mm) C (mm)
Metric EIA Z (mm) G (mm) X (mm) RLP
ref ref
1005 0402 2.2 0.4 0.7 0.9 1.3 130A
Component Outline:
All dims mm L S W T H
Metric EIA min max min max min max min max max
1608 [0603] 1.45 1.75 0.45 0.97 0.65 0.95 0.2 0.5 0.85
Footprint:
Y (mm) C (mm)
Metric EIA Z (mm) G (mm) X (mm) RLP
ref ref
1608 [0603] 2.8 0.6 1 1.1 1.7 132A
3.3.3.4 Land Pattern Registration Each land pattern has received a registration number. The RLP (Registered Land
Pattern) number is a three digit number with a set of numbers assigned to land patterns for a particular family of
components. The original number assigned to a particular component, uses that analysis shown for the specific section
(sections 8 through 16). The analyses assume certain tolerances for board fabrication, placement machine accuracy
and minimum desired solder joint. Changes in the assumptions will result in a revision letter to the number.
Thus the first change to RLP 106 would be identified as RLP 106A, the second change would be RLP 106B etc.
The letters x, y & z are reserved for user modifications to the standard land pattern. If a company wishes to change
the approved standard land pattern the user would identify his customized version as RLP 106X, RLP 106Y or RLP
106Z. It should be recognized that X, Y & Z type RLP’s reflect unique land patterns and will differ company to company.
Component: L S W T H
Metric EIA min max min max min max min max max
1005 [0402] 0.9 1.1 0.3 0.65 0.4 0.6 0.1 0.3 0.6
1310 [0504] 1.02 1.32 0.26 0.72 0.77 1.27 0.13 0.38 1.02
1608 [0603] 1.45 1.75 0.45 0.97 0.65 0.95 0.2 0.5 0.85
2012 [0805] 1.8 2.2 0.3 1.11 1.05 1.45 0.25 0.75 1.1
3216 [1206] 3.0 3.4 1.5 2.31 1.4 1.8 0.25 0.75 1.35
3225 [1210] 3.0 3.4 1.5 2.31 2.3 2.7 0.25 0.75 1.35
4532 [1812] 4.2 4.8 2.3 3.46 3.0 3.4 0.25 0.95 1.35
4564 [1825] 4.2 4.8 2.3 3.46 6.0 6.8 0.25 0.95 1.1
Footprint:
Metric EIA Z (mm) G (mm) X (mm) Y (mm) ref C (mm) ref RLP*
1005 [0402] 2.2 0.4 0.7 0.9 1.3 130A
1310 [0504] 2.4 0.4 1.3 1.0 1.4 131A
1608 [0603] 2.8 0.6 1.0 1.1 1.7 132A
2012 [0805] 3.2 0.6 1.5 1.3 1.9 133A
3216 [1206] 4.4 1.2 1.8 1.6 2.8 134A
3225 [1210] 4.4 1.2 2.7 1.6 2.8 135A
4532 [1812] 5.8 2.0 3.4 1.9 3.9 136A
4564 [1825] 5.8 2.0 6.8 1.9 3.9 137A