Datasheet - Apr. 2013 - V1.0: Color Light-To-Digital Converter With IR Filter
Datasheet - Apr. 2013 - V1.0: Color Light-To-Digital Converter With IR Filter
Figure TCS3472 – 1:
Key Benefits and Features
Benefits Features
Power Management
Enabling a low-power wait-state between RGBC
• Low Power — 2.5-μA Sleep State
measurements to reduce average power
• 65-μA Wait State with Programmable Wait State Time
consumption.
from 2.4 ms to > 7 Seconds
Backward compatibility enables Register Set and Pin Compatible with the
interchangeability and re-usability in systems. TCS3x71 Series
Reduces PCB space requirements while Small 2 mm 2.4 mm Dual Flat No-Lead
simplifying designs. (FN) Package
Figure TCS3472 – 2:
Functional Block Diagram
Figure TCS3472 – 3:
Pin Diagram
VDD 1 6 SDA
SCL 2 5 INT
GND 3 4 NC
Figure TCS3472 – 4:
Pin Description
2 SCL Input I²C serial clock input terminal – clock signal for I²C serial data.
6 SDA Input/Output I²C serial data I/O terminal — serial data I/O for I²C.
Figure TCS3472 – 5:
Ordering Information
Notes:
1. All products are RoHS compliant and ams green.
2. Buy our products or get free samples online at www.ams.com/ICdirect
3. Technical Support is available at www.ams.com/Technical-Support
4. For further information and requests, email us at [email protected]
5. (or) find your local distributor at www.ams.com/distributor
Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. These are
stress ratings only. Functional operation of the device at these
or any other conditions beyond those indicated under
“Recommended Operating Conditions” is not implied. Exposure
to absolute maximum rated conditions for extended periods
may affect device reliability.
Figure TCS3472 – 6:
Absolute Maximum Ratings over Operating Free-air Temperature Range (unless otherwise noted)
Supply voltage, VDD 3.8 V All voltages are with respect to GND
Figure TCS3472 – 7:
Recommended Operating Conditions
Figure TCS3472 – 8:
Operating Characteristics, VDD = 3 V, TA = 25ºC (unless otherwise noted)
λD = 465 nm
0% 15% 10% 42% 65% 88% 11.0 13.8 16.6
Note 2
Re counts
λD = 525 nm
Irradiance 4% 25% 60% 85% 10% 45% 13.2 16.6 20.0 /μW
Note 3
responsivity /cm2
λD = 615 nm
80% 110% 0% 14% 5% 24% 15.6 19.5 23.4
Note 4
Notes:
1. The percentage shown represents the ratio of the respective red, green, or blue channel value to the clear channel value.
2. The 465 nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics: dominant
wavelength λ D = 465 nm, spectral halfwidth Δλ½ = 22 nm.
3. The 525 nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics: dominant
wavelength λ D = 525 nm, spectral halfwidth Δλ½ = 35 nm.
4. The 615 nm input irradiance is supplied by a AlInGaP light-emitting diode with the following characteristics: dominant
wavelength λ D = 615 nm, spectral halfwidth Δλ½ = 15 nm.
ADC integration time step size ATIME = 0xFF 2.27 2.4 2.56 ms
ADC count value (see Note below) ATIME = 0xC0 (153.6 ms) 0 65535 counts
4X 3.8 4 4.2
Gain scaling, relative to 1X gain
16X 15 16 16.8 X
setting
60X 58 60 63
t(BUF) Bus free time between start and stop condition 1.3 μs
Timing Diagrams
Relative Responsivity
λ - Wavelength - nm
θ - Angular Displacement - º
VDD – V
λ - Wavelength - nm
System States
An internal state machine provides system control of the RGBC
and power management features of the device. At power up,
an internal power-on-reset initializes the device and puts it in
a low-power Sleep state.
When a start condition is detected on the I²C bus, the device
transitions to the Idle state where it checks the Enable Register
(0x00) PON bit. If PON is disabled, the device will return to the
Sleep state to save power. Otherwise, the device will remain in
the Idle state until the RGBC function is enabled (AEN). Once
enabled, the device will execute the Wait and RGBC states in
sequence as indicated in Figure TCS3472 - 17. Upon completion
and return to Idle, the device will automatically begin a new
Wait-RGBC cycle as long as PON and AEN remain enabled.
Note: In this document, the nomenclature uses the bit field name in italics followed by the register address and bit number to
allow the user to easily identify the register and bit that controls the function. For example, the power on (PON) is in
register 0x00, bit 0. This is represented as PON (r0x00:b0).
Notes:
1. There is a 2.4 ms warm-up delay if PON is enabled. If PON is not enabled, the device will return to the Sleep state as shown.
2. PON, WEN, and AEN are fields in the Enable register (0x00).
WTIME 0xEE
Wait 43.2 ms 0.065 mA
WLONG 0
1 0x00 0 614 ms 82 μA
1 0x00 1 7.37 s 67 μA
0x04 AILTL R/W Clear interrupt low threshold low byte 0x00
0x05 AILTH R/W Clear interrupt low threshold high byte 0x00
0x06 AIHTL R/W Clear interrupt high threshold low byte 0x00
0x07 AIHTH R/W Clear interrupt high threshold high byte 0x00
0x12 ID R Device ID ID
7 6 5 4 3 2 1 0
CMD 7 Select Command Register. Must write as 1 when addressing COMMAND register.
Byte protocol will repeatedly read the same register with each data access. Block
protocol will provide auto-increment function to read successive bytes.
Address field/special function field. Depending on the transaction type, see above,
this field either specifies a special function command or selects the specific
control-status-data register for subsequent read and write transactions. The field
values listed below only apply to special function commands:
The Clear channel interrupt clear special function clears any pending interrupt and
is self-clearing.
7 6 5 4 3 2 1 0
Wait enable. This bit activates the wait feature. Writing a 1 activates the wait
WEN 3
timer. Writing a 0 disables the wait timer.
RGBC enable. This bit actives the two-channel ADC. Writing a 1 activates the
AEN 1
RGBC. Writing a 0 disables the RGBC.
Power ON. This bit activates the internal oscillator to permit the timers and
PON
0 ADC channels to operate. Writing a 1 activates the oscillator. Writing a 0
(Notes 1, 2)
disables the oscillator.
Notes:
1. See Power Management section for more information.
2. A minimum interval of 2.4 ms must pass after PON is asserted before an RGBC can be initiated.
0xF6 10 24 ms 10240
ATIME 7:0
0xD5 42 101 ms 43008
Wait Time Register (0x03) Wait time is set 2.4 ms increments unless the WLONG bit is
asserted, in which case the wait times are 12× longer. WTIME is
programmed as a 2’s complement number.
RGBC Interrupt Threshold Registers The RGBC interrupt threshold registers provides the values to
(0x04 − 0x07) be used as the high and low trigger points for the comparison
function for interrupt generation. If the value generated by the
clear channel crosses below the lower threshold specified, or
above the higher threshold, an interrupt is asserted on the
interrupt pin.
AILTL 0x04 7:0 RGBC clear channel low threshold lower byte
AILTH 0x05 7:0 RGBC clear channel low threshold upper byte
AIHTL 0x06 7:0 RGBC clear channel high threshold lower byte
AIHTH 0x07 7:0 RGBC clear channel high threshold upper byte
7 6 5 4 3 2 1 0
Reserved APERS
7 6 5 4 3 2 1 0
Wait Long. When asserted, the wait cycles are increased by a factor 12× from
WLONG 1
that programmed in the WTIME register.
Control Register (0x0F) The Control register provides eight bits of miscellaneous
control to the analog block. These bits typically control
functions such as gain settings and/or diode selection.
7 6 5 4 3 2 1 0
Reserved AGAIN
00 1X gain
AGAIN 1:0
01 4X gain
10 16X gain
11 60X gain
7 6 5 4 3 2 1 0
ID
Status Register (0x13) The Status Register provides the internal status of the device.
This register is read only.
7 6 5 4 3 2 1 0
AVALID 0 RGBC Valid. Indicates that the RGBC channels have completed an integration cycle.
Notes:
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.
Notes:
1. All linear dimensions are in micrometers. Dimension tolerance is ±20 μm unless otherwise noted.
2. The die is centered within the package within a tolerance of ± 3 mils.
3. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
4. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
5. This package contains no lead (Pb).
6. This drawing is subject to change without notice.
Notes:
1. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing A0, B 0, and K 0 are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 178 millimeters in diameter and contains 3500 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B.
6. In accordance with EIA standard, device pin 1 is located next to sprocket holes in the tape.
7. This drawing is subject to change without notice.
Soldering Information
The FN package has been tested and has demonstrated an
ability to be reflow soldered to a PCB substrate. The process,
equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is dry-baked prior to
being packed for shipping. Devices are packed in a sealed
aluminized envelope called a moisture barrier bag with silica
gel to protect them from ambient moisture during shipping,
handling, and storage before use.
The Moisture Barrier Bags should be stored under the following
conditions:
• Temperature Range < 40°C
• Relative Humidity < 90%
• Total Time - No longer than 12 months from the date code
on the aluminized envelope if unopened.
Disclaimer Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its Term of Sale. ams
AG makes no warranty, express, statutory, implied, or by
description regarding the information set forth herein or
regarding the freedom of the described devices from patent
infringement. ams AG reserves the right to change
specifications and prices at any time and without notice.
Therefore, prior to designing this product into a system, it is
necessary to check with ams AG for current information. This
product is intended for use in normal commercial applications.
Applications requiring extended temperature range, unusual
environmental requirements, or high reliability applications,
such as military, medical life-support or life-sustaining
equipment are specifically not recommended without
additional processing by ams AG for each application. For
shipments of less than 100 parts the manufacturing flow might
show deviations from the standard production flow, such as test
flow or test location.
The information furnished here by ams AG is believed to be
correct and accurate. However, ams AG shall not be liable to
recipient or any third party for any damages, including but not
limited to personal injury, property damage, loss of profits, loss
of use, interruption of business or indirect, special, incidental
or consequential damages, of any kind, in connection with or
arising out of the furnishing, performance or use of the
technical data herein. No obligation or liability to recipient or
any third party shall arise or flow out of ams AG rendering of
technical or other services.