1 2 3 4 5 6

Jackman-L23 Schematic MODEM Schematic

31. RF Interface
1. Contents 32. RF PMU
A 2. Block Diagramm 33. RF Transceiver
3. SOC PWR1 34. RF FRONT END HB A

4. SOC PWR2 35. RF FRONT END B42

5. SOC PWR3 36. RF FRONT END MB
37. RF Front End LB
6. SOC HS Interface 38. RF Front End Switch /Main ANT
7. SOC GPIO Interface 39. RF Front End Diversity
8. SOC RF Interface 40. RF Front End Diversity
9. SOC GND 41. Reserved for CDMA Modem
10. PMU LDO 42. Reserved for CDMA Modem
B
11. PMU BUCK & HI6422-1 43. Reserved for CDMA Modem
B
44. Reserved for CDMA Modem
12. PMU MISC & BUCKBOOST 45. Reserved for CDMA Modem
13. HI6422-2 46. Reserved for CDMA Modem
14. UFS and LPDDR 47. Reserved for CDMA Modem
15. Battery & Fuel guage 48. Reserved for CDMA Modem
16. USB/Scharger V300/Switch 49. RESERVED
17. LCD Interface 50. RESERVED
18. Reserved 51. RF Front End M1
52. Hi1102 POWER
C
19. Flash LED 53. Hi1102 Interface
20. Camera Interface 54. Hi1102_RF_FrontEnd_2G C
21. ISP Reserved 55. Hi1102_RF_FrontEnd_5GHz
22. Codec HI6403 56. RF_FRONT_END_Diversity_M1
23. Audio/SPK/VIB 57. NFC
24. Headphone 58. RF Transceiver2
59. RFIC2 PA+PMU
25. Audio 60. ANT Tuner
The type and specification of the components refer to the BOM
26. X-Sensor1
D 27. X-Sensor2 NA
ECA NO
2018-07-13
DATE D
28. SIM/uSD Card DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
29. FPC Interface REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
1 Contents
60
30. Test Point/Shielding
E 03025JLU HUAWEI TECH CO.,LTD.
1 2 3 4 5 6
 1 2 3 4 5 6

2.Block Diagramm

A
A

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF Diagramm
2 Block 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

3.SOC PWR1

A
A
VDD_CPU_B
C301

C310

C311

C312

C313

C321

C322

1
1

1
U300 VDD_GPU
C304 C305 C306
2 2 4 4 2 2 4 4 2 2 4 4 CPU BIG GPU

C342

C341

C343
1

1
R18 VDD_CPU_B_1 VDD_GPU_1 AC17
R19 VDD_CPU_B_2 VDD_GPU_2 AC18

1
R20 AC19

3
VDD_CPU_B_3 VDD_GPU_3
C387 C386

PWR1 interface 1 of 10
R21 VDD_CPU_B_4 VDD_GPU_4 AC20
R22 AC21 2 2 4 4 2 2 4 4

3
VDD_CPU_B_5 VDD_GPU_5
R23 VDD_CPU_B_6 VDD_GPU_6 AC22
U19 VDD_CPU_B_7 VDD_GPU_7 AC23
U20 AE17

3
VDD_CPU_B_8 VDD_GPU_8
U21 VDD_CPU_B_9 VDD_GPU_9 AE18

1
U22 AE19

3
VDD_CPU_B_10 VDD_GPU_10
U23 VDD_CPU_B_11 VDD_GPU_11 AE21

1
W19 AE23
C307 C308 C309 W20
VDD_CPU_B_12
VDD_CPU_B_13
VDD_GPU_12
2 2 4 4 2 2 4 4 2 2 4 4 W21
B W22
VDD_CPU_B_14
VDD_CPU_B_15 VDD_GPU_T AB16 VDD_GPU_T
W23 TP305
AA18
VDD_CPU_B_16
AA17 VSS_GPU_T TP306 B
3

3
VDD_CPU_B_17 VSS_GPU_T
AA19 VDD_CPU_B_18
AA20 CPU LITTLE
3

3
VDD_CPU_B_19
AA21 VDD_CPU_B_20 VDD_CPU_L_1 N10 VDD_CPU_L
AA22 VDD_CPU_B_21 VDD_CPU_L_2 N11
AA23 VDD_CPU_B_22 VDD_CPU_L_3 N12

1
VDD_CPU_L_4 N13
VDD_CPU_B_T W18 R10

C302

C359

C357
TP302 VDD_CPU_B_T VDD_CPU_L_5

1
R11
TP301
VSS_CPU_B_T Y17 VSS_CPU_B_T
VDD_CPU_L_6
VDD_CPU_L_7 R12 C395 C373
R13 2 2 4 4 2 2 4 4
VDD_CPU_L_8
CPU_B PLL VDD_CPU_L_9 U10
VOUT5_1V8 U18 AVDD18_PLL_CPU VDD_CPU_L_10 U11
U12

3
SG307
VDD_CPU_L_11
V18 U13

C314
AVSS_PLL_CPU VDD_CPU_L_12

3
S

S
G

C
VDD_CPU_B SG301 VDD_CPU_B_REMOTE

G S

S G
GND SG302
S

S
VSS_CPU_B_REMOTE C
AP Temperature DET VDD_CPU_L SG303 VDD_CPU_L_REMOTE

G S

S G
S
GND SG304 S
VSS_CPU_L_REMOTE

VOUT27_1V8

VDD_GPU SG305 VDD_GPU_REMOTE

G S

S G
S
GND SG306 S
VSS_GPU_REMOTE
1%
R301

HKADC_IN7_AP_TEMP

The type and specification of the components refer to the BOM

D NA 2018-07-13
T

ECA NO DATE D
RT301

DESIGNED XUMENG 00322542

HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
3_SOC PWR1 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

4.SOC PWR2
ｲｼｾﾖﾈ郢釭ﾓｽ MUﾊ莎 22UFｿﾉﾉｾｵ 10UF

VBUCK1_1V12

C480

C402

C403

C404

C405

C406

C407
VOUT2_1V8
A

C437

C438

C439

C440

C441

C408
A

VOUT37_0V6

1
U300
C478

1
VBUCK1_1V12
C410 C411 DDRPHY DDR MEMORY CORE

C444

C445

C446

C447

C448

C449

C450

C451

C401
2 2 4 4 2 2 4 4 G10 A6
VDD11_DDR4A_1 VDD1_M_1
G14 VDD11_DDR4A_2 VDD1_M_2 A8
H12 VDD11_DDR4A_3 VDD1_M_3 A22
G16 A25

3
VDD11_DDR4B_1 VDD1_M_4
G20 VDD11_DDR4B_2 VDD1_M_5 B15
H18 J1

3
VDD11_DDR4B_3 VDD1_M_6
VDD1_M_7 J29
G11 VDD06_DDR4A_1
G12 VDD06_DDR4A_2 VDD2_M_1 A3
VOUT5_1V8 G13 VDD06_DDR4A_3 VDD2_M_2 A7
G17 A12
C420

C421 VDD06_DDR4B_1 VDD2_M_3

PWR2 interface 2 of 10
G18 VDD06_DDR4B_2 VDD2_M_4 A15
G19 VDD06_DDR4B_3 VDD2_M_5 A18
VDD2_M_6 A23 VOUT37_0V6
DDRPHY PLL A26
B J12
VDD2_M_7
E1

C456

C457

C458

C459

C460

C472
AVDD18_PLL_DDR4A VDD2_M_8
J18 E29
AVDD18_PLL_DDR4B VDD2_M_9
VDD2_M_10 K1 B
IO POWER VDD2_M_11 K29
VOUT2_1V8 G7 VDD18_IO_1
G23 DDR MEMORY IO
C424

C425

C426

C427

C428

C429

VDD18_IO_2
P24 VDD18_IO_3 VDDQ_M_1 A11
AA25 VDD18_IO_4 VDDQ_M_2 A19
AF9 VDD18_IO_5 VDDQ_M_3 C1
AF12 VDD18_IO_6 VDDQ_M_4 C29
AF19 VDD18_IO_7 VDDQ_M_5 G1
AF22 VDD18_IO_8 VDDQ_M_6 G29
AF24 VDD18_IO_9
UFS
SDCARD IO AVDD08_UFS_1 L22 VOUT0_0V8
VOUT9_SD_IO N5 VDD1830_SD AVDD08_UFS_2 M23

USIM IO AVDD18_VPH_UFS_1 L23 VOUT29_1V8

VOUT11_USIM0 P6 VDD1830_USIM0 AVDD18_VPH_UFS_2 M24

VOUT12_USIM1 R6 VDD1830_USIM1 VDD1812_UFS N24

USB EMMC
VOUT30_0V8 R7 VDD08_USB AVDD18_EMMC_1 H24 VOUT2_1V8
AVDD18_EMMC_2 J24
VOUT5_1V8 T7 AVDD18_USB
MIPI
VOUT23_3V2 T6 AVDD33_USB AVDD18_CSI_1 J7 VOUT5_1V8
AVDD18_CSI_2 K7
L7

C467

C473

C474

C475

C476
AVDD18_CSI_3
C AVDD18_DSI AD16

C
C432

C433

C434

C435

C436

C469

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM
REVIEWED ZHANGYOUJUN 00258580 03025JLU_SCHZH
VER PART_NUMBER SHEET
4_SOC PWR2OF 60

E HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

5.SOC PWR3

VBUCK4_0V8

C536

C532

C568
1

1
A

1
C523 C524
U300 2 2 4 4 2 2 4 4

PERI CORE MODEM

VBUCK0_0V8 H8 R9

3
VDD08_PERI_1 VDD08_MODEM_1
H23 VDD08_PERI_2 VDD08_MODEM_2 U9
J9 W9

3
C531

C544

C508

C507

C504

C501
VDD08_PERI_3 VDD08_MODEM_3

1
J21 VDD08_PERI_4 VDD08_MODEM_4 W11
J23 VDD08_PERI_5 VDD08_MODEM_5 W13

1
L9 W15
C541 C543 L11
VDD08_PERI_6
VDD08_PERI_7
VDD08_MODEM_6
VDD08_MODEM_7 W17
2 2 4 4 2 2 4 4 L13 AA9
VDD08_PERI_8 VDD08_MODEM_8
L15 VDD08_PERI_9 VDD08_MODEM_9 AA11
L17 VDD08_PERI_10 VDD08_MODEM_10 AA13
L19 AA15

3
VDD08_PERI_11 VDD08_MODEM_11

PWR3 interface 3 of 10
N7 VDD08_PERI_12 VDD08_MODEM_12 AC9
N9 AC11

3
VDD08_PERI_13 VDD08_MODEM_13
N15 VDD08_PERI_14 VDD08_MODEM_14 AC13
R15 VDD08_PERI_15 VDD08_MODEM_15 AC15
R17 VDD08_PERI_16 VDD08_MODEM_16 AD8
U15 VDD08_PERI_17 VDD08_MODEM_17 AD12 VOUT0_0V8
U17 VDD08_PERI_18 VDD08_MODEM_18 AE7
AE9 VDD08_PERI_19

1
AE11 SYS CORE

C539
VDD08_PERI_20
AE13 VDD08_PERI_21 VDD08_SYS_1 K22

1
L21
B DDR PHY CORE
VDD08_SYS_2
VDD08_SYS_3 M20 C566
H10 N20 2 2 4 4
H15
VDD08_PERI_22
VDD08_PERI_23
VDD08_SYS_4
VDD08_SYS_5 N21 B
H20 VDD08_PERI_24 VDD08_SYS_6 P14
J11 U25

3
VDD08_PERI_25 VDD08_SYS_7
J13 VDD08_PERI_26 VDD08_SYS_8 AC25
J15 AF20

3
VDD08_PERI_27 VDD08_SYS_9
J17 VDD08_PERI_28 VDD08_SYS_10 AF21
J19 VDD08_PERI_29
SYS PLL
PERI(FIXED CORE) AVDD08_PLL_SYS P19 VOUT0_0V8
H6 VDD08_PERI_FIX_1
VOUT30_0V8 P7 VDD08_PERI_FIX_2 AVDD18_PLL_SYS N19 VOUT29_1V8

PERI PLL ABB

VBUCK0_0V8 N17 AVDD08_PLL_PERI AVDD09_ABB_1 W7
AVDD09_ABB_2 AC7 VOUT6_0V9
VOUT5_1V8 M18 AVDD18_PLL_PERI
AVDD18_ABB_1 Y6
SWP AVDD18_ABB_2 AB6 VOUT5_1V8
F22 SWP_VREF AVDD18_REF_ABB V6 VOUT5_1V8 VOUT5:ｴﾓPMUｵﾄﾊ莎 ｶﾋｿｪﾊｼﾐﾇﾐﾎﾗﾟﾏﾟ
TP502
G22 OSC_VREF
TP501
EFUSE
VOUT33_1V8 H22 AVDD18_OTP VDD18_EFUSE_SYS G8 VOUT33_1V8
C519

C518

C521

C520

C506

C505

C503

C513

C515

C574

C575

C542

C502
C
C

The type and specification of the components refer to the BOM

D 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM
REVIEWED ZHANGYOUJUN 00258580 03025JLU_SCHZH
VER PART_NUMBER SHEET
5_SOC PWR3OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

NA 1 2 3 4 5 6
 1 2 3 4 5 6

6.SOC HS INTERFACE

A
A

U300

CSI DSI
CSI0_CLK_N C4 CSI0_CLK_N DSI0_CLK_N AJ21 DSI0_CLK_N
CSI0_CLK_P C3 CSI0_CLK_P DSI0_CLK_P AJ20 DSI0_CLK_P
CSI0_DATA0_N B3 CSI0_DATA0_N DSI0_DATA0_N AK22 DSI0_DATA0_N
CSI0_DATA0_P B2 CSI0_DATA0_P DSI0_DATA0_P AL22 DSI0_DATA0_P
CSI0_DATA1_N B5 CSI0_DATA1_N DSI0_DATA1_N AK20 DSI0_DATA1_N
CSI0_DATA1_P C5 CSI0_DATA1_P DSI0_DATA1_P AL20 DSI0_DATA1_P
CSI0_DATA2_N C2 CSI0_DATA2_N DSI0_DATA2_N AK19 DSI0_DATA2_N
CSI0_DATA2_P D2 CSI0_DATA2_P DSI0_DATA2_P AL19 DSI0_DATA2_P
CSI0_DATA3_N C6 CSI0_DATA3_N DSI0_DATA3_N AL23 DSI0_DATA3_N
CSI0_DATA3_P B6 AK23 DSI0_DATA3_P

HS interface 4 of 10
CSI0_DATA3_P DSI0_DATA3_P
CSI1_CLK_N M3 UFS
B CSI1_CLK_P M2
CSI1_CLK_N
CSI1_CLK_P UFS_RESREF F28
CSI1_DATA0_N N3 K25
CSI1_DATA0_P N2
CSI1_DATA0_N
CSI1_DATA0_P
UFS_REF_CLK/GPIO_153
UFS_RST_N/GPIO_154 L25 B
CSI1_DATA1_N L1 CSI1_DATA1_N UFS_RX0_M J28
CSI1_DATA1_P L2 CSI1_DATA1_P UFS_RX0_P J27
CSI1_DATA2_N N1 CSI1_DATA2_N UFS_RX1_M J26
CSI1_DATA2_P P1 CSI1_DATA2_P UFS_RX1_P J25
CSI1_DATA3_N L4 CSI1_DATA3_N UFS_TX0_M H27
CSI1_DATA3_P L5 CSI1_DATA3_P UFS_TX0_P H28
UFS_TX1_M H25
CSI2_CLK_N F2 CSI2_CLK_N UFS_TX1_P H26
CSI2_CLK_P G2 CSI2_CLK_P
CSI2_DATA0_N H2 CSI2_DATA0_N EMMC C601
CSI2_DATA0_P J2 CSI2_DATA0_P EMMC_CALIO B24 R602 1%
H4 CSI2_DATA1_N EMMC_CLK B27 SOC_EMMC_CLK
H3 CSI2_DATA1_P EMMC_STRB/EMMC_GPIO_08 C24 SOC_EMMC_STRB
K4 CSI2_DATA2_N EMMC_CMD/EMMC_GPIO_09 D24 SOC_EMMC_CMD
K3 CSI2_DATA2_P EMMC_DATA0/EMMC_GPIO_00 C27 SOC_EMMC_DATA0
J5 CSI2_DATA3_N EMMC_DATA1/EMMC_GPIO_01 C26 SOC_EMMC_DATA1
J4 CSI2_DATA3_P EMMC_DATA2/EMMC_GPIO_02 D28 SOC_EMMC_DATA2
EMMC_DATA3/EMMC_GPIO_03 D27 SOC_EMMC_DATA3
USB2.0 EMMC_DATA4/EMMC_GPIO_04 D26 SOC_EMMC_DATA4
W3 USB_ID EMMC_DATA5/EMMC_GPIO_05 D25 SOC_EMMC_DATA5
SOC_USB_DN W1 USB_DM EMMC_DATA6/EMMC_GPIO_06 C25 SOC_EMMC_DATA6
SOC_USB_DP W2 USB_DP EMMC_DATA7/EMMC_GPIO_07 B25 SOC_EMMC_DATA7
R604 USB_REXT V2 USB_REXT
1% DDR MEMORY
DDRPHY DDR_ZQ0_MEM B16 R605 1% VOUT37_0V6
VOUT37_0V6 R601 1% B17 DDR4_ZQ_SOC DDR_ZQ1_MEM A16 R607 1%

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET HS Interface
6_SOC OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6
7.SOC GPIO INTERFACE1
VOUT18_1V8 R719 I2C0_SCL

R718 I2C0_SDA

A VOUT18_1V8 R751 I2C3_SCL VOUT2_1V8 R708 I2C6_SCL

U300
R752 I2C3_SDA R709 I2C6_SDA A
ISP AO ISP PERI
AH19 GPIO_203/ISP_GPIO03_PRTRB ISP_GPIO00_FTRSTN C22
GPIO_205_ACR_INT AG18 GPIO_205/ISP_GPIO05_BKPWM GPIO_011/UART1_CTS_N
AC29 GPIO_208/ISP_GPIO09_ENC ISP_GPIO01_BKRSTN B22 GPIO_012_MCAM1_RST_N
GPIO_209_LCD_BL_EN AA28 GPIO_209/ISP_GPIO07_ENA GPIO_012/UART1_RTS_N
GPIO_210_TP_INT_N AG24 GPIO_210/ISP_GPIO08_ENB ISP_GPIO02_MNTRB B21
AC27 GPIO_219/ISP_GPIO11 GPIO_013/UART1_RXD
SPI2_CS2_N/SPI4_CS2_N ISP_GPIO06_FSYNC B20 GPIO_014_VBUS_MOS_CTRL
GPIO_220_SCAM1_RST_N AD28 GPIO_220/ISP_GPIO12 GPIO_014/UART1_TXD
SPI2_CS3_N/SPI4_CS3_N ISP_GPIO10_SBPWM AJ16 GPIO_015_LCD_TE0 C706
GPIO_015/LCD_TE0
IO AO ISP_CLK0/GPIO_016 D11 R722 MCAM0_ISP_CLK0
GPIO_177_PMU1_EN AA26 GPIO_177 ISP_CLK1/GPIO_017 B11 R723 SCAM0_ISP_CLK1 U300
AH22 GPIO_183/CLK_OUT0 ISP_CLK2/GPIO_018 C11 R716 MCAM1_ISP_CLK2
I3C_SCL ISP_SCL0/GPIO_019 C13 MCAM0_ISP_SCL0 I2C AO SPI PERI
GPIO_184_USB_OTG_INT_NAJ23 GPIO_184/CLK_OUT1 ISP_SDA0/GPIO_020 D14 MCAM0_ISP_SDA0 I2C0_SCL AK27 I2C0_SCL/GPIO_187/I3C_SCL SPI1_CLK/GPIO_007 L27 TP_SPI1_CLK
I3C_SDA ISP_SCL1/GPIO_021 E9 SCAM0_ISP_SCL1 C708 I2C0_SDA AK26 I2C0_SDA/GPIO_188/I3C_SDA UART2_CTS_N
GPIO_185_LCD_CABC_PWM AH24 BLPWM_CABC/GPIO_185 ISP_SDA1/GPIO_022 E10 SCAM0_ISP_SDA1 GPIO_189_CHARGER_EN AJ26 I2C1_SCL/GPIO_189 SPI1_DI/GPIO_008 M28 TP_SPI1_MISO
GPIO_186_LCD_BL_PWM AG23 BLPWM_BL/GPIO_186 ISP_SCL2/GPIO_023 E14 MCAM1_ISP_SCL2 C707 AJ25 I2C1_SDA/GPIO_190 UART2_RTS_N
PWM_OUT0 ISP_SDA2/GPIO_024 D13 MCAM1_ISP_SDA2 AF27 I2C2_SCL/GPIO_191 SPI1_DO/GPIO_009 L28 TP_SPI1_MOSI
GPIO_206_SIM_SD_DET AB28 GPIO_206/CLKIN_AUX I2C7_SCL UART2_RXD
GPIO_207_ANT_DET_0
R707 AC28 GPIO_207 SYS SIGNAL C704 AF26 I2C2_SDA/GPIO_192 SPI1_CS_N/GPIO_010 L26 TP_SPI1_CS
GPIO_211_WIFI_WAKEUP_AP
AB29 GPIO_211 CLK_SLEEP W26 SYS_CLK_32K I2C7_SDA UART2_TXD
GPIO_225_PMU0_IRQ_N U29 GPIO_225 CLK_SYSTEM M25 SYS_CLK_19M2 I2C6_SCL AG19 I2C6_SCL/GPIO_213
GPIO_144_KEY_UP AE26 W25 SYS_CLK_EN I2C6_SDA AJ24 SDIO
DS1 interface 5 of 10
GPIO_144/SPI0_CS1_N SYSCLK_EN I2C6_SDA/GPIO_212
GPIO_145_FP_INT AD25 C701 D7 WL_SDIO_CLK
B GPIO_146_AG_INT AK28
GPIO_145
GPIO_146 PMU IF I2C PERI
SDIO_CLK/GPIO_128
SDIO_CMD/GPIO_129 B8 WL_SDIO_CMD
AJ27 Y28 SPMI_CLK I2C3_SCL AG14 D8 WL_SDIO_DATA0
GPIO_148_ACR_EN AG22
GPIO_147/I2C2_SCL
GPIO_148/I2C2_SDA
SPMI_CLK/GPIO_227
SPMI_DATA/GPIO_226 W28 SPMI_DATA I2C3_SDA AH14
I2C3_SCL/GPIO_005
I2C3_SDA/GPIO_006
SDIO_DATA0/GPIO_130
SDIO_DATA1/GPIO_131 C8 WL_SDIO_DATA1 B
GPIO_149_PMU1_IRQ_N AG21 GPIO_149/PWM_OUT0 PMU0_SSI AK14 I2C4_SCL/GPIO_025 SDIO_DATA2/GPIO_132 C9 WL_SDIO_DATA2
CDMA_GPS_SYNC U28 GPIO_150/CDMA_GPS_SYNC PMU_AUXDAC0_SSI/GPIO_046 AH17 PMU_AUXDAC_SSI AL14 I2C4_SDA/GPIO_026 SDIO_DATA3/GPIO_133 B9 WL_SDIO_DATA3
TP756
Y27 PMU_PERI_EN

DS2 interface 6 of 10
LTE_GPS_SYNC PMU_PER_EN
SYS_RSTIN_N Y25 PMU_RST_OUT_N UART SD CARD
SPI AO PMU_RSTOUT_N Y26 SOC_RST_PMU_N GPIO_027_MCAM1_VCM_PWDN D18 UART2_CTS_N/GPIO_027 SD_CLK/GPIO_160 R3 SDC_CLK_R R701 SDC_CLK
U26 SPI0_CLK/GPIO_228/I3C_SCL GPIO_176 Y29 PMU_PWR_HOLD UART0_RXD SD_CMD/GPIO_161 T3 SDC_CMD_R R702 SDC_CMD
GPIO_229_BFGN_WAKEUP_APV26 SPI0_DI/GPIO_229/I3C_SDA GPIO_028_SCAM1_VCM_PWDN D21 UART2_RTS_N/GPIO_028 JTAG_TMS_SD
AG20 SPI0_DO/GPIO_230 PMU_CLKOUT/GPIO_002 AK17 PMU1_CLK_19M2 UART0_TXD SD_DATA0/GPIO_162 R2 SDC_DATA0_RR703 SDC_DATA0
GPIO_231_KEY_DOWN AE25 SPI0_CS0_N/GPIO_231 PMU1_SSI/GPIO_003 AH18 PMU1_SSI_DATA GPIO_030_Hi1102_PWRON D20 UART2_RXD/GPIO_030 JTAG_TCK_SD
FP_SPI2_CLK AC26 SPI2_CLK/GPIO_214 UART0_CTS_N SD_DATA1/GPIO_163 P4 SDC_DATA1_RR705 SDC_DATA1
SPI4_CLK BOOT CTRL D19 UART2_TXD/GPIO_029 JTAG_TDI_SD
FP_SPI2_MISO AB26 SPI2_DI/GPIO_215 BOOT_MODE AG17 BOOT_MODE UART0_RTS_N SD_DATA2/GPIO_164 R4 SDC_DATA2_RR714 SDC_DATA2
SPI4_DI BOOT_UFS AL16 HI1102_UART4_CTS_N N29 UART4_CTS_N/GPIO_041 JTAG_TDO_SD SDC_DATA3_R
FP_SPI2_MOSI AB25 SPI2_DO/GPIO_216 DFT_EN AK25 DFT_EN UART3_CTS_N SD_DATA3/GPIO_165 T4 R715 SDC_DATA3
TP703
SPI4_DO TEST_MODE/GPIO_001 AL17 HI1102_UART4_RTS_N N28 UART4_RTS_N/GPIO_042 JTAG_TRST_N_SD On CMD and DATA net,22 resistor need nearby SD
FP_SPI2_CS0 AD26 SPI2_CS0_N/GPIO_217 UART3_RTS_N/LCD_TE1 VDD_ODIO_BIAS_SD M6
LTE CTRL HI1102_UART4_RX P28 C702
SPI4_CS0_N UART4_RXD/GPIO_043
GPIO_218_BST_5V_EN AB27 SPI2_CS1_N/GPIO_218 LTE_INACTIVE/GPIO_047 P27 LTE_INACTIVE UART3_RXD AO JTAG
SPI4_CS1_N UART_RXD_BBP/UART_CTS_N_MHS HI1102_UART4_TX R28 UART4_TXD/GPIO_044 JTAG_MODE AL26 JTAG_MODE TP712
UART0_RXD/FRAME_SYNC UART3_TXD JTAG_SEL0 AL25 JTAG_SEL0 TP705
AO I2S LTE_RX_ACTIVE/GPIO_048 N27 GPIO_037_LCD_ID1 AJ14 UART5_CTS_N/GPIO_037 JTAG_SEL1 AL27 JTAG_SEL1 TP706
AG25 I2S1_DI/GPIO_195 UART_RXD_BBP/UART_RXD_MHS UART3_CTS_N JTAG_TCK_SWCLK/GPIO_178 AE27 SOC_JTAG_TCK_SWCLK TP707
AH26 I2S1_DO/GPIO_196 LTE_TX_ACTIVE/GPIO_049 P26 LTE_TX_ACTIVE GPIO_038_FP_RST_N AG16 UART5_RTS_N/GPIO_038 JTAG_TDI/GPIO_181 AG28 SOC_JTAG_TDI TP733
UART7_RXD UART_TXD_BBP/UART_TXD_MHS UART3_RTS_N JTAG_TDO/GPIO_182 AE28 SOC_JTAG_TDO TP749
AH27 I2S1_XCLK/GPIO_197 ISM_PRIORITY/GPIO_050 R26 GPIO_039_LCD_RST_N AH16 UART5_RXD/GPIO_039 JTAG_TMS_SWDIO/GPIO_179 AF29 SOC_JTAG_TMS_SWDIO TP710
UART7_TXD UART_RTS_N_MHS/UART0_TXD UART3_RXD JTAG_TRST_N/GPIO_180 AF28 GPIO_180_FLASH_STROBE TP711
AG26 I2S1_XFS/GPIO_198 GPIO_040_TP_RST_N AG15 UART5_TXD/GPIO_040
BTFM_I2S2_MISO R27 PERI IO USIM
C I2S2_DI/GPIO_199
UART8_CTS_N GPS_REF/GPIO_004 P25 AP_GPS_REF_CLK GPIO_031_SCAM0_RST_N C18
UART3_TXD
UART6_CTS_N/GPIO_031 USIM0_CLK/GPIO_166 T1 SIM0_CLK
BTFM_I2S2_MOSI U27 AK13 GPIO_045_LCD_VSN_EN
I2S2_DO/GPIO_200
UART8_RTS_N
PWM_OUT1/GPIO_045/ONEWIRE
GPIO_051/ONEWIRE C17 GPIO_032_MCAM0_RST_N B18
UART0_RXD
UART6_RTS_N/GPIO_032
JTAG_TDI_SD
USIM0_RST/GPIO_167 T2 SIM0_RST_N C
BTFM_I2S2_CLK T28 I2S2_XCLK/GPIO_201 GPIO_052/ISP_GPIO10_SBPWM B19 UART0_TXD JTAG_TDO_SD
UART8_RXD GPIO_093/PWM_OUT1/UART1_RXD N26 DBG_UART6_RX AK15 UART6_RXD/GPIO_033 USIM0_DATA/GPIO_168 U1 SIM0_DATA
BTFM_I2S2_SYNC T29 I2S2_XFS/GPIO_202 GPIO_094/UART1_TXD M27 FOR DEBUG UART0_RXD_M/UART_RXD_MHS JTAG_TRST_N_SD
UART8_TXD UART_RXD_UC USIM1_CLK/GPIO_169 U3 SIM1_CLK
GPIO_221_CHG_INT_N AJ28 I2S3_DI/GPIO_221 AO Codec IF C703 DBG_UART6_TX AG13 UART6_TXD/GPIO_034 JTAG_TCK_SD
AJ29 I2S3_DO/GPIO_222 SLIMBUS_CLK/GPIO_193/SIF_CLK T25 L702 SIF_CLK UART0_TXD_M/UART_TXD_MHS USIM1_RST/GPIO_170 U2 SIM1_RST_N
AH28 I2S3_XCLK/GPIO_223 SLIMBUS_DATA/GPIO_194/SIF_DO T26 SIF_DO UART_TXD_UC JTAG_TMS_SD
AF25 I2S3_XFS/GPIO_224 GPIO_204/CODEC_SSI V28 L701 SIF_SYNC GPIO_035_LCD_VSP_EN AJ13 UART_RXD_UC/GPIO_035 USIM1_DATA/GPIO_171 V3 SIM1_DATA
SIF_SYNC/ISP_GPIO04_FTPWM UART0_RXD
SIF_DI0/GPIO_151 V25 SIF_DI_0 GPIO_036_LCD_ID0 AH13 UART_TXD_UC/GPIO_036 NFC IO
SIF_DI1/GPIO_152 W27 SIF_DI_1 UART0_TXD SWP_IO F21

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEETGPIO Interface
7_SOC OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6
8.SOC RF INTERFACE

A
A

U300

RF IQ ANT SEL RF_GPIO05_CHO_APT_PDM_SOC R801 RF_GPIO05_CHO_APT_PDM

CH0_MRX_I AF1 ABB_CH0_MRX_I ANTPA_SEL00/GPIO_053 AJ17
CH0_MRX_Q AE1 ABB_CH0_MRX_Q GPS_BLANKING
ANTPA_SEL01/GPIO_054 AH15 RF_GPIO01_FLASH_MASK C803
CH0_RXA_I AD3 ABB_CH0_RXA_I FLASH_MASK
CH0_RXA_Q AD2 ABB_CH0_RXA_Q ANTPA_SEL02/GPIO_055 AK2
CH0_RXB_I AD4 ABB_CH0_RXB_I ANTPA_SEL03/GPIO_056 AG8
CH0_RXB_Q AC4 ABB_CH0_RXB_Q FE6_MIPI_CLK
ANTPA_SEL04/GPIO_057 AG9 RF_GPIO04_APT_EN
CH1_RXA_I AB4 ABB_CH1_RXA_I FE6_MIPI_DATA
CH1_RXA_Q AB3 ABB_CH1_RXA_Q ANTPA_SEL05/GPIO_058 AF6 RF_GPIO05_CHO_APT_PDM_SOC
CH1_RXB_I AB1 ABB_CH1_RXB_I CH0_APT_PDM
CH1_RXB_Q AB2 ABB_CH1_RXB_Q ANTPA_SEL06/GPIO_059 AG5 RF_GPIO06_APT_BP
B AA3 ABB_CH2_RXA_I
CH1_APT_PDM
ANTPA_SEL07/GPIO_060 AK3 RF_GPIO07_DPDT

RF interface 7 of 10
AA4 AJ3
Y4
ABB_CH2_RXA_Q
ABB_CH2_RXB_I
ANTPA_SEL08/GPIO_061
ANTPA_SEL09/GPIO_062 AF7 B
Y5 ABB_CH2_RXB_Q ANTPA_SEL10/GPIO_063 AH5
ANTPA_SEL11/GPIO_064 AK4
CH0_TX_I_N AH2 ABB_CH0_TX_I_N ANTPA_SEL12/GPIO_065 AL5
CH0_TX_I_P AG2 ABB_CH0_TX_I_P ANTPA_SEL13/GPIO_066 AJ5
CH0_TX_Q_N AH1 ABB_CH0_TX_Q_N ANTPA_SEL14/GPIO_067 AH6
CH0_TX_Q_P AJ1 ABB_CH0_TX_Q_P ANTPA_SEL15/GPIO_068 AK5
ANTPA_SEL16/GPIO_069 AG7
AF4 ABB_CH1_TX_I_N ANTPA_SEL17/GPIO_070 AK6
AG3 ABB_CH1_TX_I_P ANTPA_SEL18/GPIO_071 AH4
AE4 ABB_CH1_TX_Q_N ANTPA_SEL19/GPIO_072 AL3
AE3 ABB_CH1_TX_Q_P ANTPA_SEL20/GPIO_073 AH7
ANTPA_SEL21/GPIO_074 AJ7
RF CTRL FE5_MIPI_CLK
ABB_CLK_38M4 U5 ABB_TCXO_IN ANTPA_SEL22/GPIO_075 AK7
GMSK_PH0 AL10 GMSK_PH0/GPIO_092 FE5_MIPI_DATA
ANTPA_SEL23/GPIO_076 AK9
ET FE4_MIPI_CLK
AD5 ABB_CH0_ET_N ANTPA_SEL24/GPIO_077 AL8
AE5 ABB_CH0_ET_P FE4_MIPI_DATA/CH0_APT_PDM
ANTPA_SEL25/GPIO_078 AJ10
RF MIPI FE3_MIPI_CLK
FE0_MIPI_CLK AJ11 FE0_MIPI_CLK/GPIO_084 ANTPA_SEL26/GPIO_079 AH10
FE0_MIPI_DATA AK11 FE0_MIPI_DATA/GPIO_085 FE3_MIPI_DATA
FE1_MIPI_CLK AL11 FE1_MIPI_CLK/GPIO_086 ANTPA_SEL27/GPIO_080 AJ8
R802

FE1_MIPI_DATA AK12 FE1_MIPI_DATA/GPIO_087 FE4_MIPI_CLK

AG12 FE2_MIPI_CLK/GPIO_088 ANTPA_SEL28/GPIO_081 AK8
AH12 FE2_MIPI_DATA/GPIO_089 FE4_MIPI_DATA
RFIC0_MIPI_CLK AG10 AH8
C RFIC0_MIPI_DATA AG11
RFIC0_MIPI_CLK/GPIO_090
RFIC0_MIPI_DATA/GPIO_091
ANTPA_SEL29/GPIO_082
FE3_MIPI_CLK
AH9
RF OTHER
ANTPA_SEL30/GPIO_083
FE3_MIPI_DATA
C
R845+/-1% ABB_IBIAS AE2 ABB_IBIAS_EXT
ABB_TEST AC2 ABB_TEST
ABB_VREF AC1 ABB_VREF
C801

C802

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER 8_SOC
SHEET RF Interface
OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

9.SOC GND

A
A
U300 U300

P18 AVSS_PLL VSS_20 B23 F16 VSS_64 VSS_109 M5

VSS_21 B26 F17 VSS_65 VSS_110 M8
U4 AVSS_ABB_1 VSS_22 B28 F18 VSS_66 VSS_111 M10 U300
U6 AVSS_ABB_2 VSS_23 B29 F19 VSS_67 VSS_112 M12
V4 AVSS_ABB_3 VSS_24 C7 F20 VSS_68 VSS_113 M14 V12 VSS_154 VSS_193 AD17
V5 AVSS_ABB_4 VSS_25 C10 F29 VSS_69 VSS_114 M16 V14 VSS_155 VSS_194 AD18
V7 AVSS_ABB_5 VSS_26 C12 G4 VSS_70 VSS_115 M19 V16 VSS_156 VSS_195 AD19
W4 AVSS_ABB_6 VSS_27 C15 G6 VSS_71 VSS_116 M22 V19 VSS_157 VSS_196 AD20
W5 AVSS_ABB_7 VSS_28 C19 G9 VSS_72 VSS_117 N4 V20 VSS_158 VSS_197 AD21
Y3 AVSS_ABB_8 GND1 interface 8 of 10 VSS_29 C20 G15 VSS_73 VSS_118 N6 V21 VSS_159 VSS_198 AD22
Y7 AVSS_ABB_9 VSS_30 C23 G21 VSS_74 VSS_119 N23 V22 VSS_160 VSS_199 AD23

GND2 interface 9 of 10

GND3 interface 10 of 10
AA2 AVSS_ABB_10 VSS_31 C28 G24 VSS_75 VSS_120 N25 V23 VSS_161 VSS_200 AE6
AA5 AVSS_ABB_11 VSS_32 D1 G28 VSS_76 VSS_121 P2 W24 VSS_162 VSS_201 AE15
AA7 AVSS_ABB_12 VSS_33 D3 H1 VSS_77 VSS_122 P3 W29 VSS_163 VSS_202 AE24
AB5 AVSS_ABB_13 VSS_34 D5 H7 VSS_78 VSS_123 P5 Y1 VSS_164 VSS_203 AE29
AC3 AVSS_ABB_14 VSS_35 D6 H9 VSS_79 VSS_124 P8 Y2 VSS_165 VSS_204 AF8
AC5 AVSS_ABB_15 VSS_36 D10 H11 VSS_80 VSS_125 P10 Y8 VSS_166 VSS_205 AF10
AD6 AVSS_ABB_16 VSS_37 D12 H13 VSS_81 VSS_126 P11 Y10 VSS_167 VSS_206 AF11
AD7 AVSS_ABB_17 VSS_38 D16 H14 VSS_82 VSS_127 P12 Y12 VSS_168 VSS_207 AF13
AF2 AVSS_ABB_18 VSS_39 D17 H16 VSS_83 VSS_128 P13 Y14 VSS_169 VSS_208 AF14
AF5 AVSS_ABB_19 VSS_40 D29 H17 VSS_84 VSS_129 P16 Y16 VSS_170 VSS_209 AF16
AG4 AVSS_ABB_20 VSS_41 E2 H19 VSS_85 VSS_130 P20 Y18 VSS_171 VSS_210 AF17
AH3 E3 H21 P22 Y19 AF23
B AJ2
AVSS_ABB_21
AVSS_ABB_22
VSS_42
VSS_43 E11 H29
VSS_86
VSS_87
VSS_131
VSS_132 P29 Y20
VSS_172
VSS_173
VSS_211
VSS_212 AH21
E12 J6 R5 Y21 AH29
A1 VSS_1
VSS_44
VSS_45 E13 J10
VSS_88
VSS_89
VSS_133
VSS_134 R24 Y22
VSS_174
VSS_175
VSS_213
VSS_214 AJ4 B
A2 VSS_2 VSS_46 E15 J20 VSS_90 VSS_135 R25 Y23 VSS_176 VSS_215 AJ19
A4 VSS_3 VSS_47 E16 J22 VSS_91 VSS_136 T5 AA24 VSS_177 VSS_216 AJ22
A10 VSS_4 VSS_48 E17 K2 VSS_92 VSS_137 T8 AB8 VSS_178 VSS_217 AK1
A13 VSS_5 VSS_49 E18 K5 VSS_93 VSS_138 T10 AB10 VSS_179 VSS_218 AK10
A14 VSS_6 VSS_50 E19 K6 VSS_94 VSS_139 T11 AB12 VSS_180 VSS_219 AK16
A17 VSS_7 VSS_51 E20 K8 VSS_95 VSS_140 T12 AB14 VSS_181 VSS_220 AK18
A20 VSS_8 VSS_52 E21 K10 VSS_96 VSS_141 T13 AB17 VSS_182 VSS_221 AK21
A24 VSS_9 VSS_53 E22 K12 VSS_97 VSS_142 T14 AB18 VSS_183 VSS_222 AK24
A27 VSS_10 VSS_54 E27 K14 VSS_98 VSS_143 T16 AB19 VSS_184 VSS_223 AK29
A28 VSS_11 VSS_55 E28 K16 VSS_99 VSS_144 T18 AB20 VSS_185 VSS_224 AL1
A29 VSS_12 VSS_56 F3 K18 VSS_100 VSS_145 T19 AB21 VSS_186 VSS_225 AL2
B1 VSS_13 VSS_57 F8 K20 VSS_101 VSS_146 T20 AB22 VSS_187 VSS_226 AL4
B4 VSS_14 VSS_58 F9 K23 VSS_102 VSS_147 T21 AB23 VSS_188 VSS_227 AL7
B7 VSS_15 VSS_59 F11 K24 VSS_103 VSS_148 T22 AC16 VSS_189 VSS_228 AL13
B10 VSS_16 VSS_60 F12 K27 VSS_104 VSS_149 T23 AC24 VSS_190 VSS_229 AL28
B12 VSS_17 VSS_61 F13 K28 VSS_105 VSS_150 U7 AD10 VSS_191 VSS_230 AL29
B13 VSS_18 VSS_62 F14 L6 VSS_106 VSS_151 U24 AD14 VSS_192
B14 VSS_19 VSS_63 F15 L24 VSS_107 VSS_152 V8
L29 VSS_108 VSS_153 V10

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER 9_SOC GNDOF
SHEET 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

10.PMU LDO
A
A
Output defaultcurrentTYP voltage function
LDO1 OFF 350 1.09 RFIC0_AVDD
U1001 LDO2 ON 900 1.8 PMU dig/RFIC/SOC1V8IO/LPDDR4X VDD/UFS VCCQ2
LDO3 OFF 200 1.8 RFIC0 AVDD2

C1002
200mA VBAT_SYS M6 VSYS OUT_PMUA N6 30mA VOUT_PMUA C1001 LDO4 OFF 200 1.8 LCD1V8 IO/TP1V8 IO
OUT_PMUD K6 30mA VOUT_PMUD C1003 LDO5 ON 500 1.8 PHY ANA/ABB_AVDD1V8
VPP L6
VCOIN U3 VCOIN C1023
OUT34 L5 150mA VOUT34_3V45 LDO8 OFF 140 1.8 CLASSD1V8
LDO9 OFF 50 1.8/2.95 SD IO

MISC1 Interface 1 of 4
OUT9 F6 50mA VOUT9_SD_IO C1028
OUT11 A2 50mA VOUT11_USIM0 C1012 LDO11 OFF 50 1.8 SIM0
OUT12 A3 50mA VOUT12_USIM1 C1014 LDO12 OFF 50 1.8 SIM1
D10 VIN_LDO_H1_1 OUT13 A10 150mA VOUT13_2V8 C1011 LDO13 OFF 150 2.85 S camera analog
D11 VIN_LDO_H1_2 OUT14 H7 70mA VOUT14_2V85 C1016 LDO14 OFF 70 2.85 RF FEM/AUXDAC
2.5A VBAT_SYS D7 VIN_LDO_H2_1 OUT15 A6 800mA VOUT15_2V95 C1034 LDO15 ON 800 2.95 EMMC/UFS VDD
C1051

E7 VIN_LDO_H2_2 OUT16 A7 800mA VOUT16_2V95 C1035 LDO16 OFF 800 2.95 SD card
OUT17 G6 100mA VOUT17_2V8 LDO17 OFF 100 2.8 LCD TP VCI
OUT19 A12 150mA VOUT19_2V8 C1036 LDO18 ON 350 1.8 fp/SENSOR IO FP AVDD/CON IO
OUT22 B11 150mA VOUT22_2V8 C1007 LDO19 OFF 300 2.8 M camera anlog
OUT23 B4 150mA VOUT23_3V2 C1018 LDO20 OFF 400 1.11 M Camera Core
OUT24 B7 200mA VOUT24_2V8 C1019 LDO21 OFF 180 1.8 Camera io
OUT25 A9 400mA VOUT25_2V85 C1020 LDO22 OFF 150 2.8 Back Camera Analog
OUT27 C9 30mA VOUT27_1V8 C1013 LDO23 ON 150 3.2 HKADC
OUT31 A5 300mA VOUT31_3V0 C1031 LDO24 ON 200 2.8 X Sensor AVDD
G7 50mA C1008 LDO25 OFF 400 2.85 Camera VCM
B OUT_PMUH
LDO26 ON 30 1.35 38.4_AVDD
2.5A VBUCK3_1V95 D13 G18 900mA VOUT2_1V8 C1038 LDO27 ON 50 1.8 HKADC
E14
VIN_LDO_1P95_1
VIN_LDO_1P95_2
OUT2
OUT3 B14 200mA VOUT3_1V8 LDO28 OFF 50 1.8 RF MIPI I/O B
F15 VIN_LDO_1P95_3 OUT4 C14 200mA VOUT4_1V8 C1041 LDO29 ON 140 1.8 UFS PHY/SYS CLK_BUF
OUT5 A15 500mA VOUT5_1V8 C1040 LDO30
OUT8 F18 140mA VOUT8_1V8 C1042 LDO31 OFF 300 3.0 Vibrator
OUT18 G16 350mA VOUT18_1V8 C1009 LDO32 OFF 400 1.11 S Camera Core
OUT21 C12 180mA VOUT21_1V8 C1043 LDO33 OFF 120 1.8 EFUSE
OUT26 B15 30mA C1044 LDO34 ON 150 3.45 CODEC RCV/MICBIAS
OUT28 E13 50mA VOUT28_1V8 C1029
OUT29 D18 140mA VOUT29_1V8 C1045
OUT33 F14 120mA VOUT33_1V8 C1010
OUT36 D14 10mA VOUT36_1V2 C1006
LDO_BUFF B18 30mA C1015

P5 VIN_LDO_1P2_1 OUT1 U5 350mA VOUT1_1V09

1A VBUCK2_1V2 P6 VIN_LDO_1P2_2 OUT20 R4 700mA VOUT20_1V05 C1050
OUT32 U4 400mA VOUT32_1V05 C1048

VBUCK1_1V12 P7 VIN_LDO_1P1 OUT0 U8 300mA VOUT0_0V8 C1046

750mA OUT6 U6 320mA VOUT6_0V9 C1047
OUT30 R7 100mA VOUT30_0V8 C1033

300mA VBUCK0_0V8 M5 VIN_LDO_0P8 OUT37 M4 400mA VOUT37_0V6 C1022

DR1_LED_RED1 T1 DR1 VREF B13 C1004

T2 DR2 VREF_RF A13 VREF_RF C1021
DR3_LED_RED T8 DR3 VREF_LDO1 U7 C1032
DR4_LED_GREEN U9 DR4 AGND K5
DR5_LED_BLUE R8 DR5 AGND_BUCK J6
VOUT2_1V8 H16 B5
C L7
VDD_IO
PGND_DR
AGND_LDO_H
AGND_LDO_L T6
SG1001 AGND_OSC B16 E16 VOUT3_1V8 C1027 SG1005
S
AGND_OSC AGND_LDO_1P95 S
C
G G

S S

G
SG1002 E12 G8 SG1007
S
AGND_COUL AGND_ADDA S
C1049

S S

G G

F13 C17 AGND_BUFF SG1006

AGND_REF AGND_BUFF S
VOUT1_1V09 C1039 S
SG1004

G
The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET
10_PMU LDOOF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

11.PMU BUCK/CODEC ËùÓÐBUCK LX0/1/2/3/4_FBÐźŲ»ÔÊÐí´Óµç¸ÐÏ·½´©Ïß

U1001
VBAT_SYS K1 PVDD0_1 LX0_1 J1LX0 L1101 3.5A VBUCK0_0V8
K2 PVDD0_2 LX0_2 J2
600mA J3
A LX0_3
C1127

G
S
A

C1104
H1 PGND0_1 SG1109
H2 PGND0_2 VO0_PULL H6 Current=1A,DCR=100mohm
PGND0 H3 PGND0_3 VO0_FB J5

C1103
N1 PVDD12_1 LX1_1 M1LX1 L1102 2.3A VBUCK1_1V12
N2 PVDD12_2 LX1_2 M2

C1133
800mA N3 PVDD12_3 LX1_3 M3 C1126

MISC2 Interface 2 of 4
L1 C1125

G
PGND1_1 S
L2 PGND1_2 SG1110
PGND1 L3 PGND1_3 VO1_FB K4

R1 PGND2_1 LX2_1 P1LX2 L1103 2A VBUCK2_1V2

PGND2 R2 PGND2_2 LX2_2 P2
C1130

C1124

G
S
SG1111
VO2_FB L4

D1 PVDD3_1 LX3_1 C1LX3 L1104 3A VBUCK3_1V95

1.5A D2 PVDD3_2 LX3_2 C2
D3 PVDD3_3 LX3_3 C3

B1 C1123

G
PGND3_1 S

C1134
B2 PGND3_2 SG1112
PGND3 B3 C5
B PGND3_3 VO3_FB
E1 F1LX4 L1105 2A VBUCK4_0V8
600mA E2
PVDD4_1
PVDD4_2
LX4_1
LX4_2 F2 B
C1122

G
S

C1135
G1 PGND4_1 SG1113
PGND4 G2 PGND4_2 VO4_FB E4

A1 DGND_1 DGND_21 R5
A18 DGND_2 DGND_22 R18
B6 DGND_3 DGND_23 T5
B17 DGND_4 DGND_24 U1
C15 DGND_5 DGND_25 U18
D16 DGND_6 DGND_26 L8
F3 DGND_7 DGND_27 M8
F16 DGND_8 DGND_28 E3
G4 DGND_9 DGND_29 E17
H5 DGND_10 DGND_30 G10
J10 DGND_11 DGND_31 H8
K3 DGND_12 DGND_32 H10
HS_FB_L K16 HS_FB_L MCLK_49M H15 SIF_CLK K8 DGND_13 DGND_33 J4
C1119 R1102 HS_L K17 HS_L SDATA_FLAG H13 SIF_SYNC K9 DGND_14 DGND_34 J8
VOUT_CLASSD
C1120 R1101 HS_R SIF_DI_0
HS_FB_R
K18
L15
HS_R
HS_FB_R
U1001 ADC_SDATA0
ADC_SDATA1
J15
J14 SIF_DI_1
K10
K13
DGND_15
DGND_16
DGND_35
DGND_36
L11
L13
DAC_SDATA J16 SIF_DO L9 DGND_17 DGND_37 N9
M9 DGND_18 DGND_38 P4
HS_DET P12 HSD PVDD_SPK R9 M13 DGND_19 DGND_39 P10

C1131
MISC4 Interface 4 of 4

MBHC_IN R17 MBHC_IN P3 DGND_20 DGND_40 T4

P11 SG1103
PGND_SPK S

G
EAR_P P17
C EAR_N N17
EAR_P
EAR_N
U15 VOUT34_3V45
AVDD_MIC
MICBIAS1 N14 MICBIAS1 C
SPK_P_CODEC T11 SPKOUT_P MICBIAS2 R13 C1116
SPK_N_CODEC T10 SPKOUT_N HS_MICBIAS N15 HS_MICBIAS
AGND_MIC T14
MAINMIC_P C1117 T15 MAINMIC_P
MAINMIC_N C1102 U16 MAINMIC_N
P16 VOUT34_3V45 PGND0

S
AVDD_TX S
AUXMIC_P C1109 N13 AUXMIC_P AGND_TX P15 SG1104
AUXMIC_N C1110 M14 PGND1

S
AUXMIC_N S

AVDD_RX U13 VOUT8_1V8 SG1105

R15 T13 PGND2

S
MIC3_P AGND_RX S
R14 MIC3_N SG1106
AVDD_HP L16 VBUCK3_1V95
HS_MIC_P T16 M17 PGND3

S
HSMIC_P AVDD_CP S
HS_MIC_N U17 HSMIC_N Source star route SG1107
C1107

C1115

C1111

N18 C1128 PGND4

S
FLY_P S
T17 LINEOUT_P FLY_N P18 SG1108
T18 LINEOUT_N
CPOUTN M18 C1112
C1118 AVREF U14 AVREF AVSS_HP L17 The type and specification of the components refer to the BOM
AGND_CP M15

D L17/M18 must separate collect to C1112 NA 2018-07-13

S ECA NO DATE D
S

DESIGNED XUMENG 00322542

G
SG1102

HL1JKMM 03025JLU_SCHZH
SG1101 REVIEWED
S
ZHANGYOUJUN 00258580
S

VER PART_NUMBER 11_PMU

SHEET BUCK_CODEC
OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

12. PMU Digital HKADC·ÖÅä±í

BOARD ID HKADC_IN0 APU Board ID0(RF USE)

HKADC_IN1 APU Board ID1
VOUT27_1V8 HKADC_IN2 APU Board ID2
HKADC_IN3 RESERVERD
HKADC_IN4
A HKADC_IN5
PA TEMP DET0
Charge TEMP

1%

1%

1%
CHG_REGN PMU_PWR_HOLD HKADC_IN6
VOUT_PMUD HKADC_IN7
USB_TEMP_ADC
AP TEMP A
HKADC_IN8 USB_BOARD_ID
HKADC_IN9 RESERVERD

R1203

R1211

R1207
HKADC_IN10 BATT TEMP
HKADC_IN0_PCB_ID0 HKADC_IN11 BATT ID
1%

C1221
HKADC_IN12 USB_OTG_ADC

R1202
DEBUG HKADC_IN1_PCB_ID1 HKADC_IN13 RESERVERD

U1001 Main Board ID

R1215

C1222
HKADC_IN2_PCB_ID2
SOC_RST_PMU_N N12 HRESET_N SYS_RST_N J17 PMU_RST_OUT_N

1%

1%

1%
PMU_VBUS_SENSE T7 VBUS_SENSE Mode R1203 R1210 R1211 R1209 R1207 R1208
C1231

PWRON_N R3 PWRON_N PMU0_IRQ_N M11 GPIO_225_PMU0_IRQ_N

R1212

PMU_PWR_HOLD U2 PWR_HOLD 7690 JKM-AL00(6363)V1-V2 NC 0 150K NC 51K 100K

R1210

R1209
TP1205 PMU_PERI_EN B10 L10 GND

R1208
PERI_EN DFT_MODE
7698 JKM-AL00(6353)V2 20K 150K 150K NC 51K 100K
VBATT_VD E11 G11 SRP

MISC3 Interface 3 of 4
C1220 VBAT_SENSE SRP
SRN F12 SRN 7680 JKM-AL00(6353)V3-V3.1 NC 0 20K 150K 51K 100K
1%

7691 JKM-TL00 V1-V3.1 150K 22K 150K NC 51K 100K

HKADC_IN0 F8 HKADC_IN0_PCB_ID0
VOUT27_1V8 B8 ADC_REF HKADC_IN1 F10 HKADC_IN1_PCB_ID1 7692 JKM-AL00a V1-V3.1 100K 30K 150K NC 51K 100K
HKADC_IN2 K11 HKADC_IN2_PCB_ID2
HKADC_IN3 H9 7693 JKM-TL10 V1-MP 200K 100K 150K NC 51K 100K
HKADC_IN4 G9 HKADC_IN4_PA_TEMP_1
HKADC_IN5 J11 HKADC_IN5_CHG_TEMP 7694 JKM-LX1 V1-V3 150K 121K 150K NC 51K 100K
H11 HKADC_IN6_USB_TEMP
B HKADC_IN6
HKADC_IN7 J9 HKADC_IN7_AP_TEMP 7695 JKM-LX2 V1-V3 121K 150K 150K NC 51K 100K
B8 PINﾂﾋｲｨｹｲﾓﾃC1013 H4 HKADC_IN8_USB_BOARD_ID
HKADC_IN8
HKADC_IN9 D4 7696 JKM-LX3 V1-V3 51K 100K 150K NC 51K 100K B
HKADC_IN10 F4 HKADC_IN10_BAT_TEMP
HKADC_IN11 D5 HKADC_IN11_BAT_ID 7697 JKM-L4A V1-MP 30K 100K 150K NC 51K 100K
HKADC_IN12 J7 HKADC_IN12_OTG
HKADC_IN13 G5 7699 JKM-LX1C V1-V3 150K NC 150K NC 51K 100K
XOADC_IN J12 XOADC_IN
R1222,R1216,R1221 only botong use guonei NC
C1205
XIN_38M4_PMU A17 XIN_38M4 CODEC_CLK_19M2 F17
XOUT_38M4_PMU A16 XOUT_38M4 SYS_CLK_19M2 E15 R1201 SYS_CLK_19M2
TP1206 SYS_CLK_EN G15 SYS_CLK_EN RF_CLK_38M4 C16 RF0_CLK_38M4
T9 WIFI_CLK_EN ABB_CLK_38M4 D17 C1201 ABB_CLK_38M4 Mode R1203 R1210 R1211 R1209 R1207 R1208
G13 NFC_CLK_EN WIFI_CLK_38M4 C18
NFC_CLK_38M4 E18 7685 JKM-AL00(6353)VN1-MP 121K 150K 20K 150K 51K 100K

GPIO_206_SIM_SD_DET C11 SIM0_HPD CLK32_SYS N10 SYS_CLK_32K 7686 JKM-TL00 VN1-MP 51K 100K 20K 150K 51K 100K
GPIO_206_SIM_SD_DET B12 M12 CLK32_BFGN CLK 32K,ﾇｰｶﾋｼﾓR｣ｬｺ ｶﾋｼﾓC｡｣
SIM1_HPD CLK32_BT
R1214 SPMI_DATA J18 PMU_DATA CLK32_GPS N11 C1230 7687 JKM-AL00a V3-MP 30K 100K 20K 150K 51K 100K
R1213 SPMI_CLK H18 SPMI_CLK
PMU_AUXDAC_SSI H14 AUXDAC_SSI AUXDAC0 D6 C1230 near wifi/BT IC 7681 JKM-LX1 V3.1-MP 150K 22K 20K 150K 51K 100K
K14 XOADC_SSI SPMI_SSI_SEL T3
7682 JKM-LX2 V3.1-MP 100K 30K 20K 150K 51K 100K
G17 DGND_41 DGND_47 K12
P13 DGND_42 DGND_48 N16 7683 JKM-LX3 V3.1-MP 200K 100K 20K 150K 51K 100K
R12 P8
R6
DGND_43
DGND_44
DGND_49
DGND_50 F11 USB CON TEMP DET USB Board ID DET 7684 JKM-LX1C V3.1-MP 150K 121K 20K 150K 51K 100K
T12 DGND_45 DGND_51 G12
L12 DGND_46 DGND_52 K7
VOUT27_1V8 VOUT27_1V8
C Board ID Resistor Set Resistor Code

1%

1%
ID UP RES DOWN RES Value Code C
USB Board ID 0 NC 0K 0K 07090911

R1204

R1218
1 150K 22K 20K 07092448
R1218 Code Value 2 100K 30K 22K 07091172
VOUT27_1V8 HKADC_IN6_USB_TEMP HKADC_IN8_USB_BOARD_ID JKM-AL00/TL00 07091406 200k 3 200K 100K 30K 07091299
JKM-LX1/LX2/LX3 07092138 150k 4 150K 121K 51K 07091302
R1223

JKM-LX1C 07091246 100k 5 121K 150K 100K 07091246

JKM-AL00a 07091408 68k 6 51K 100K 121K 07091176
Reserved 07091302 51k 7 30K 100K 150K 07092138
Reserved 07091299 30k 8 20K 150K 200K 07091406
Reserved 07091172 22K 9 150K NC
Reserved TBD TBD
1%

XOADC_IN
C1204

X1201
The type and specification of the components refer to the BOM

4 3 XOUT_38M4_PMU
D SENSOR/RT1 HOT/X_TAL/XT2 NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
XIN_38M4_PMU AGND_OSC
1 HOT/X_TAL/XT1 GND/RT2 2
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
12_PMU Digital 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

13.Hi6422
A L1305
A

2
L1306

2
VDD_CPU_B

L1307

2
U1301

VBAT_SYS D6 VSYS LX0_1 B4 VDD_GPU

LX0_2 B5
A5 IN0_1 LX0_3 B6
A6 IN0_2 LX1_1 H4
LX1_2 H5
C4 PGND0_1 LX1_3 H6
C5 PGND0_2 LX2_1 H1
L1308
C1302

C1314

C1309 C6 H2
B PGND0_3 LX2_2

2
LX2_3 H3
J5 B1 VDD_CPU_L
J6
IN1_1
IN1_2
LX3_1
LX3_2 B2 B
LX3_3 B3
G4 PGND1_1
C1301 G5 PGND1_2 VFB0_P D5 VDD_CPU_B_REMOTE
G6 PGND1_3 VFB0_N D4 VSS_CPU_B_REMOTE
VFB1_P F1 VDD_GPU_REMOTE
J1 IN2_1 VFB1_N F2 VSS_GPU_REMOTE
J2 IN2_2 VFB2_P E3 VDD_CPU_L_REMOTE
VFB2_N D3 VSS_CPU_L_REMOTE
G1 PGND2_1 C1320
C1306 G2 PGND2_2 PHASE_CTRL_SET1 J4 C1321
G3 PGND2_3 PHASE_CTRL_SET0 A3
SSI_CLK D1 PMU1_CLK_19M2
SSI_PMU1 D2 PMU1_SSI_DATA
A1 IN3_1
A2 J3 GPIO_149_PMU1_IRQ_N R1302 VOUT2_1V8
IN3_2 PMU1_IRQ_N

PMU1_EN A4 GPIO_177_PMU1_EN
C1305 C1 PGND3_1 VDD_IO E2 VOUT_PMUD TP1304
C2 PGND3_2 VPP E1
C3 PGND3_3
AGND1 E4
AGND2 E5
F6 VREF AGND3 F4
E6 IREF AGND4 F5

C1317
SGND F3
C1313

1%

SG1301

SG1305
C S S
C

S
R1301

G G
SG1306

S
S

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET
13_Hi6422 OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

14. UFS/eMMC/DDR A1
A2
A8
A9
NC1
NC2
NC3
NC4
NC55
NC56
NC57
NC58
H2
H3
H12
H13
POP LPDDR 4X
A10 NC5 NC59 H14
A11 NC6 NC60 J1
A A12
A13
NC7 NC61 J2
J3
V12
V14
VSS_154 VSS_193 AD17
AD18
NC8 NC62 VSS_155 VSS_194
A14
B1
NC9 NC63 J12
J13
V16
V19
VSS_156 VSS_195 AD19
AD20
A
NC10 NC64 VSS_157 VSS_196
B7
B8
B9
NC11
NC12
NC65
NC66
J14
K1
K2
V20
V21
V22
VSS_158
VSS_159
U300_POP VSS_197
VSS_198
AD21
AD22
AD23
NC13 NC67 VSS_160 VSS_199

GND3 interface 10 of 10
B10
B11
NC14
NC15
U1402 NC68
NC69
K3
K12
V23
W24
VSS_161
VSS_162
VSS_200
VSS_201
AE6
AE15
B12 NC16 NC70 K13 W29 VSS_163 VSS_202 AE24
B13 NC17 NC71 K14 Y1 VSS_164 VSS_203 AE29
B14 NC18 NC72 L1 Y2 VSS_165 VSS_204 AF8
C1 NC19 NC73 L2 Y8 VSS_166 VSS_205 AF10
C3 NC20 NC74 L3 Y10 VSS_167 VSS_206 AF11
C5 NC21 NC75 L12 Y12 VSS_168 VSS_207 AF13

NC Interface 2 of 2
C7 NC22 NC76 L13 Y14 VSS_169 VSS_208 AF14
C8 NC23 NC77 L14 Y16 VSS_170 VSS_209 AF16
C9 NC24 NC78 M1 Y18 VSS_171 VSS_210 AF17
C10 NC25 NC79 M2 Y19 VSS_172 VSS_211 AF23
C11 NC26 NC80 M3 Y20 VSS_173 VSS_212 AH21
C12 NC27 NC81 M7 Y21 VSS_174 VSS_213 AH29
C13 NC28 NC82 M8 Y22 VSS_175 VSS_214 AJ4
C14 NC29 NC83 M9 Y23 VSS_176 VSS_215 AJ19
D1 NC30 NC84 M10 AA24 VSS_177 VSS_216 AJ22
D2 NC31 NC85 M11 AB8 VSS_178 VSS_217 AK1
D3 NC32 NC86 M12 AB10 VSS_179 VSS_218 AK10
D4 NC33 NC87 M13 AB12 VSS_180 VSS_219 AK16
D12 NC34 NC88 M14 AB14 VSS_181 VSS_220 AK18
D13 NC35 NC89 N1 AB17 VSS_182 VSS_221 AK21
B D14
E1
NC36 NC90 N3
N6
AB18
AB19
VSS_183 VSS_222 AK24
AK29
NC37 NC91 VSS_184 VSS_223
E2
E3
NC38 NC92 N7
N8
AB20
AB21
VSS_185 VSS_224 AL1
AL2
B
NC39 NC93 VSS_186 VSS_225
E12 NC40 NC94 N9 AB22 VSS_187 VSS_226 AL4
E13 NC41 NC95 N10 AB23 VSS_188 VSS_227 AL7
E14 NC42 NC96 N11 AC16 VSS_189 VSS_228 AL13
F1 NC43 NC97 N12 AC24 VSS_190 VSS_229 AL28
F2 NC44 NC98 N13 AD10 VSS_191 VSS_230 AL29
F3 NC45 NC99 N14 AD14 VSS_192
F12 NC46 NC100 P1
F13 NC47 NC101 P2
F14 NC48 NC102 P8
G1 NC49 NC103 P9
G2 NC50 NC104 P11
TP1402 G12 NC51 NC105 P12
G13 NC52 NC106 P13
G14 NC53 NC107 P14
SOC_EMMC_DATA0 A3 DAT0 NC/RFU1 A7 H1 NC54
SOC_EMMC_DATA1 A4 DAT1 NC/RFU2 E5
SOC_EMMC_DATA2 A5 DAT2 NC/RFU3 G3
SOC_EMMC_DATA3 B2 DAT3 NC/RFU4 K6
VOUT2_1V8 SOC_EMMC_DATA4 B3
SOC_EMMC_DATA5 B4
DAT4 U1402 NC/RFU5 K7
P7
R1401

DAT5 NC/RFU6
SOC_EMMC_DATA6 B5 DAT6
SOC_EMMC_DATA7 B6 DAT7 NC/RFU/VSF1 E8
TP1401 G10
MISC Interface 1 of 2

NC/RFU/VSF2
SOC_EMMC_STRB H5 RCLK/DS NC/RFU/VSF3 P10

SOC_EMMC_CLK M6 CLK RFU/VSF1 E9 TP1405

RFU/VSF2 E10 TP1406
C SOC_EMMC_CMD M5 CMD RFU/VSF3 F10
K10
TP1403
TP1404
RFU/VSF4
PMU_RST_OUT_N K5 RST_N C
A6 VSS1 VCC/VDDF1 E6 VOUT15_2V95
C1401 1 2 E7 VSS2 VCC/VDDF2 F5
G5 VSS3 VCC/VDDF3 J10
H10 VSS4 VCC/VDDF4 K9
J5 VSS5
K8 VSS6 VCCQ/VDD1 C6 VOUT2_1V8
VCCQ/VDD2 M4 Attention
C4 VSSQ/VSS1 VCCQ/VDD3 N4
N2 VSSQ/VSS2 VCCQ/VDD4 P3
N5 VSSQ/VSS3 VCCQ/VDD5 P5
P4 VSSQ/VSS4
P6 VSSQ/VSS5 VDDI C2
C1402

C1408

C1404

C1407
C1406

C1405

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET14_eMMC/DDR
OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

15. Battery & Fuel guage

A
A
SG1501

G
S

SG1502

G
S

SG1503

G
Battery Connector S

SRN SG1504

G
S

VBATT_VD J1501

1%
S
SG1506
VBATT 1 P1 P2 2 VBATT
BATT_TS 3 P3 P4 4 BATT_ID

R1501
5 P5 P6 6
VBATT- 7 P7 P8 8 VBATT-
9 P9 P10 10 SG1505
SRP VBATT-

G
11 P11 P12 12 S

13 P13 P14 14
15 P15 P16 16

B CAD note:1.Trace for 6A

B
C1507

2.Differential trace
D1502

Battery ACR
VOUT2_1V8 R1521

U1520

VOUT27_1V8 VBATT- C1520 V_ACR_N B4 VN SCL D2 I2C6_SCL

VOUT27_1V8 VBATT C1521 V_ACR_P C4 VP SDA D3 I2C6_SDA

TP1501 A1 ANA_TEST OUT1 A2 C1522

1%

1% GPIO_148_ACR_EN B1 EN DFT_MODE D1

GPIO_205_ACR_INT D4 IRQ_N DGND C3

C
R1505

SG1521
R1506

VOUT2_1V8 C2 A4

G
VDD18 PGND S

VBATT A3 VBAT AGND B2 C

BATT_TS R1508 HKADC_IN10_BAT_TEMP BATT_ID R1507 HKADC_IN11_BAT_ID
C1 VPP

C1524

C1523
Battery Temperature Battery ID

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET
15_Battery
OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

16. Charge Management

A
A

VOUT27_1V8
1%

B
Charger IC
R1601

I2C address=1101011b(0x6B) B
HKADC_IN5_CHG_TEMP
place close to U1601
VCHG_USB_CON

L1601 VBAT_SYS
T

C1607

C1608

C1609
C1603
RT1601

U1601

1 19

1
VBUS SW1
24 NC SW2 20

D1601
CHG_PGND
C1604 23 PMID
BTST 21 SG1602
22 CHG_REGN C1610 CHG_PGND

G
REGN S

2
4 STAT
3 PG
PGND1 17
PGND2 18 CHG_PGND

R1607
I2C6_SDA 6 SDA
I2C6_SCL 5 SCL SYS1 15
GPIO_221_CHG_INT_N 7 INT SYS2 16
8 OTG/IUSB
GPIO_189_CHARGER_EN 9 CE
BAT1 13 VBATT
14
C BAT2
10 R1609
CHG_REGN 2 PSEL
ILIM
I=355AR/681R=0.52A for RT9466
C

C1611
TS 11
CHG_PGND 25 SINK QON 12

R1610
SG1601
CHG_PGND
S

S
SG1603
S

SG1604
The type and specification of the components refer to the BOM
S

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET
16_Scharger
OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

17. LCD and TP INTERFACE

A
A
R1710

J1701 DSI0_DATA2_N DSI0_DATA2_N_BTB

4* 3
LCD_VSN 1 P1 P2 2 DSI0_DATA2_P_BTB T1705
3 P3 P4 4 DSI0_DATA2_N_BTB DSI0_DATA2_P 1* 2 DSI0_DATA2_P_BTB
LCD_VSP 5 P5 P6 6
GPIO_036_LCD_ID0 7 P7 P8 8 DSI0_DATA1_P_BTB R1711
VOUT4_1V8 9 P9 P10 10 DSI0_DATA1_N_BTB
GPIO_037_LCD_ID1 11 P11 P12 12
GPIO_039_LCD_RST_N 13 P13 P14 14 DSI0_CLK_P_BTB
VOUT4_1V8
GPIO_015_LCD_TE0 15 P15 P16 16 DSI0_CLK_N_BTB
GPIO_185_LCD_CABC_PWM 17 P17 P18 18
R1713 GPIO_210_TP_INT_N 19 P19 P20 20 DSI0_DATA0_P_BTB R1704
TP_SPI1_MOSI 21 P21 P22 22 DSI0_DATA0_N_BTB
TP_SPI1_MISO 23 P23 P24 24 DSI0_DATA1_N DSI0_DATA1_N_BTB
TP_SPI1_CLK 25 P25 P26 26 DSI0_DATA3_P_BTB 4 3
TP_SPI1_CS 27 28 DSI0_DATA3_N_BTB T1702*
P27 P28
GPIO_040_TP_RST_N 29 P29 P30 30 DSI0_DATA1_P 1* 2 DSI0_DATA1_P_BTB
LED1- 31 P31 P32 32 LED3-
LED2- 33 P33 P34 34 LEDA_BTB 1 2 LED+ R1703

35 S1 S2 36
LB1715
37 S3 S4 38

C1767
C1702

C1761

C1763

R1709
C1762

C1764

C1765

C1774

C1775

C1771

C1769
DSI0_CLK_N 4 DSI0_CLK_N_BTB B
3
T1701*
*
DSI0_CLK_P 1 DSI0_CLK_P_BTB
2
R1708

LCD_VSN

ﾗ鮠 ｻｯok
LCD_VSP

R1707
LCD POS/NEG Voltage Driver DSI0_DATA0_N DSI0_DATA0_N_BTB
4 3
T1703*

C1772

C1773
L1702 DSI0_DATA0_P 1* 2 DSI0_DATA0_P_BTB

R1712
U1702
VBAT_SYS C1 VIN SW D1

GPIO_035_LCD_VSP_EN B1 ENP REG1 D3 C1706

GPIO_045_LCD_VSN_EN A1 ENN REG2 E2 R1706

I2C3_SCL B2 SCL OUTP E3 LCD_VSP DSI0_DATA3_N DSI0_DATA3_N_BTB

I2C3_SDA C2 SDA OUTN A2 LCD_VSN 4 3
T1704 *
B3 C3 DSI0_DATA3_P 1* 2 DSI0_DATA3_P_BTB
C E1
PGND1
PGND2
CFLY1
CFLY2 A3
SG1701

R1705
D2 C
C1705

AGND
For 3P6S, R1715/1716 can DNI when 2P9S
C1707

C1708

C1709

LED1-
S

R1715
S

G
LED2-

R1716
VBAT_SYS
LCD BL DRIVER LED3-
1

D1701
LED+
L1703
C1716

L1701

2 1
R1718

The type and specification of the components refer to the BOM

2

1
R1714

U1701
D NA 2018-07-13
C1701
R1702

C2 C3
C1704

VIN SW
A2 LED2-
ECA NO DATE D
GPIO_209_LCD_BL_EN C1
IFB2
A3 LED1-
CAP tolerance above 50V
EN IFB1 DESIGNED XUMENG 00322542
GPIO_186_LCD_BL_PWM B1 A1 R1701
PWM ISET 2P9S 3P6S HL1JKMM 03025JLU_SCHZH
C1720

R1715 DNI R1715

C1727 B2 B3 REVIEWED
COMP GND R1716 DNI R1716 ZHANGYOUJUN 00258580
R1717 07091300 07091299
R1701 07091405 07091250 VER PART_NUMBER SHEET 17_LCDOF 60
R1717

L1701 SMT SMT

R1718 DNI DNI
E 03025JLU HUAWEI TECH CO.,LTD.
1 2 3 4 5 6
 1 2 3 4 5 6

18. Flash/front Camera

A 16M Sensor
A
Front SUB Camera R1816

Max Mated High=0.8mm CSI1_CLK_P 2 1 SCAM0_CLKP

16M Sub CAM T1807
*
*
CSI1_CLK_N 3 4 SCAM0_CLKN
J1801
R1821
25 S1 S2 26
R1814
AGND 1 P1 P2 2 AVDD VOUT13_2V8
XVS 3 P3 P4 4 DGND CSI1_DATA0_P 2 1 SCAM0_D0P
DGND 5 P5 P6 6 MCLK SCAM0_ISP_CLK1 *
SCAM0_D1N DATA1_N 7 P7 P8 8 DGND T1806 *
SCAM0_D1P DATA1_P 9 P9 P10 10 DATA3_N SCAM0_D3N CSI1_DATA0_N 3 4 SCAM0_D0N
SCAM0_CLKN CLK_N 11 P11 P12 12 DATA3_P SCAM0_D3P
SCAM0_CLKP CLK_P 13 P13 P14 14 DATA2_N SCAM0_D2N R1815
SCAM0_D0N DATA0_N 15 P15 P16 16 DATA2_P SCAM0_D2P
SCAM0_D0P DATA0_P 17 P17 P18 18 DGND R1812
DGND 19 P19 P20 20 RESET GPIO_031_SCAM0_RST_N
SCAM0_ISP_SDA1 SDA 21 P21 P22 22 DVDD VOUT32_1V05 CSI1_DATA1_P 2 1 SCAM0_D1P
SCAM0_ISP_SCL1 SCL 23 P23 P24 24 VDDIO VOUT21_1V8 *
T1805 *
27 S3 S4 28 CSI1_DATA1_N 3 4 SCAM0_D1N
B R1813

R1808 B
C1863

C1864

C1810

C1862

C1861

C1860

C1809

C1865

C1867
CSI1_DATA2_N 3
4 SCAM0_D2N
S
*
S

SG1802 T1804
*
CSI1_DATA2_P 2 1 SCAM0_D2P

R1811

R1806
2M Slave CAM CSI1_DATA3_N 3 4 SCAM0_D3N
*
J1802 T1803
*
CSI1_DATA3_P 2 SCAM0_D3P
25 S1 S2 26 1
R1807
AGND 1 2 GND
P1 P2
VOUT22_2V8 AVDD 3 4 MCLK R1801 MCAM1_ISP_CLK2
P3 P4
GND 5 6 GND
P5 P6
VOUT21_1V8 DOVDD 7 8 CLKN CSI2_CLK_N
P7 P8
DVDD 9 10 CLKP CSI2_CLK_P
P9 P10
ﾓﾃ1102ｵﾄｻｰﾓﾃGPIO028 GPIO_028_SCAM1_VCM_PWDN PWDN 11 12 GND
P11 P12
GPIO_220_SCAM1_RST_N RST 13 14 D0N CSI2_DATA0_N
P13 P14
STROBE 15 16 D0P CSI2_DATA0_P
P15 P16
ID 17 18 GND
P17 P18 D1N
MCAM1_ISP_SDA2 SDA 19 20
P19 P20 D1P
MCAM1_ISP_SCL2 SCL 21 22
P21 P22
VPP 23 24 GND
C P23 P24
C1872

27 28
S3 S4
C
C1868

C1869

C1870

C1871

C1804

C1813

S
S
SG1801

U1801
LED1801
B3 IN OUT A1 C1830
VBAT_SYS L1801 A2 SW The type and specification of the components refer to the BOM
LED B1 2 1
GPIO_180_FLASH_STROBE B2 STROBE 3
RF_GPIO01_FLASH_MASK C1 TX/TORCH GND A3
I2C3_SDA C2
D I2C3_SCL C3
SDA NA 2018-07-13
C1832

SCL
ECA NO DATE D
C1866

DESIGNED XUMENG 00322542

HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER 18_Flash/Front
SHEET OF Camera
60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

19. Main Camera

13M MAIN 2306XXXX
A
J1901
S
SG1902 ACTGND 2 P2 P1 1 ACTVDD VOUT25_2V85 R1909 A

S
DGND 4 P4 P3 3 PWDN_VCM
MCAM0_ISP_CLK0 MCLK 6 5 SCL MCAM0_ISP_SCL0 CSI0_CLK_P MCAM0_CSI0_CLKP_BTB
P6 P5
DGND 2 1
FLASH 8 P8 P7 7 *
DGND 10 9 DATA1_N MCAM0_CSI0_D1N_BTB T1961 *
P10 P9
MCAM0_CSI0_D3N_BTB DATA3_N 12 11 DATA1_P MCAM0_CSI0_D1P_BTB CSI0_CLK_N MCAM0_CSI0_CLKN_BTB
P12 P11
DGND 3 4
MCAM0_CSI0_D3P_BTB DATA3_P 14 P14 P13 13
DGND 16 15 CLK_N MCAM0_CSI0_CLKN_BTB R1912
P16 P15
CLK_P 2 1
MODULE_ID18 P18 P17 17 MCAM0_CSI0_CLKP_BTB
DGND 20 19 DGND R1907
P20 P19
DATA0_N 2 1
MCAM0_CSI0_D2N_BTB DATA2_N 22 P22 P21 21 MCAM0_CSI0_D0N_BTB
MCAM0_CSI0_D2P_BTB DATA2_P 24 23 DATA0_P MCAM0_CSI0_D0P_BTB CSI0_DATA0_P 2 1 MCAM0_CSI0_D0P_BTB
P24 P23
DGND 26 25 DGND *
P26 P25
GPIO_032_MCAM0_RST_N RESET 28 27 SDA MCAM0_ISP_SDA0 T1962 *
P28 P27
VOUT20_1V05 DVDD_1V2 30 29 VPP CSI0_DATA0_N 3 4 MCAM0_CSI0_D0N_BTB
P30 P29
VOUT21_1V8 DOVDD 32 31 DGND
P32 P31
VOUT19_2V8 AVDD 34 33 AGND R1908
P34 P33
36 S2 S1 35
2 R1905
1
38 S4 S3 37

C1961

C1972

C1971
CSI0_DATA1_P 2 1 MCAM0_CSI0_D1P_BTB
*
C1915

C1973

C1964

C1910

C1963

T1963 *
CSI0_DATA1_N 3 4 MCAM0_CSI0_D1N_BTB

2 R1906
1
B 2 R1903
1
S
B
G

SG1901 CSI0_DATA2_N 3 4 MCAM0_CSI0_D2N_BTB

*
T1964
*
CSI0_DATA2_P 2 1 MCAM0_CSI0_D2P_BTB
MCAM1_ISP_SCL2 R1917
MCAM1_ISP_SDA2 R1918 2 R1904
1
MCAM0_ISP_SCL0 R1910 VOUT21_1V8 2 R1901
1
MCAM0_ISP_SDA0 R1911
CSI0_DATA3_N 3 4 MCAM0_CSI0_D3N_BTB
SCAM0_ISP_SCL1 R1931
2M MAIN 2306XXXX SCAM0_ISP_SDA1 R1930
CSI0_DATA3_P
T1965 *
*
MCAM0_CSI0_D3P_BTB
2 1
R1902
Max Mated High=0.8mm J1902
2 1
25 S1 S2 26

AGND 1 P1 P2 2 DGND
VOUT22_2V8 AVDD 3 P3 P4 4 MCLK MCAM1_ISP_CLK2
DGND 5 P5 P6 6 DGND
VOUT21_1V8 DOVDD7 P7 P8 8 CLK_N CSI2_CLK_N
ﾈ郢鈹ｹﾓﾃ1102 ﾓﾃGPIO027 DVDD 9 P9 P10 10 CLK_P CSI2_CLK_P
GPIO_027_MCAM1_VCM_PWDN PWDN11 P11 P12 12 DGND
GPIO_012_MCAM1_RST_N RESET
13 P13 P14 14 DATA0_N CSI2_DATA0_N
PWSEQ_ID
15 P15 P16 16 DATA0_P CSI2_DATA0_P
MODULE_ID
17 P17 P18 18 DGND
SCAM0_ISP_SDA1 SDA 19 P19 P20 20 DATA1_N
SCAM0_ISP_SCL1 SCL 21 22 DATA1_P
C VPP 23
P21
P23
P22
P24 24 DGND

27 S3 S4 28 C
C1967
C1914

C1975

C1974

C1966

C1969

C1901

S
S

SG1903

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET
19_Main Camera
OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

20. USB
A
A

VOUT2_1V8

R2003
SOC_USB_DN R2004 USB_DN C2001
B SOC_USB_DP R2005 USB_DP
USB_ID R2002 GPIO_184_USB_OTG_INT_N
B
2

2
R2001 HKADC_IN12_OTG
D2001

D2002
1

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542

HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET20_USB OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

21. Main FPC

A
A

Main FPC BTB

J2101
VCHG_USB_CON 2 P2 P1 1
4 P4 P3 3
6 P6 P5 5
8 P8 P7 7 SPK_OUT_P
SPK_OUT_N 10 P10 P9 9
12 P12 P11 11 USB_DN
HKADC_IN6_USB_TEMP 14 P14 P13 13 USB_DP
GPIO_014_VBUS_MOS_CTRL 16 P16 P15 15
VOUT28_1V8 18 P18 P17 17 USB_ID
20 P20 P19 19
FE1_MIPI_CLK 22 P22 P21 21 HKADC_IN8_USB_BOARD_ID
FE1_MIPI_DATA 24 23 VOUT14_2V85
B 26
P24
P26
P23
P25 25 ANT_OUTB
MAINMIC_P 28 27 VOUT31_3V0
MAINMIC_N 30
P28
P30
P27
P29 29 B
MICBIAS1 32 P32 P31 31 HS_DET_CONN
HS_L_CONN 34 P34 P33 33 MBHC_IN
HS_FB_L_CON 36 P36 P35 35 AGND_MIC
HS_FB_R_CON 38 P38 P37 37
HS_R_CONN 40 P40 P39 39 FM_IN_SMB

42 S2 S1 41
44 S4 S3 43

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
21_Main FPC 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

22. NC
A
A

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 22_NCOF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

23. NC
A
A

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 23_NCOF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

24. SPK
A
A
SPK_P_CODEC LB24011 2 SPK_OUT_P

SPK_N_CODEC LB24021 2 SPK_OUT_N

C2401

C2402
B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 24_SPK
OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

RCV
A
25. MIC/RCV
Second MIC A
J2501
LB2501 MIC2501
EAR_P L2501 EAR_P_RCV_BTB 1 P1
MICBIAS1 1 2 1 VDD
AUXMIC_P LB25021 2 2 OUT
AUXMIC_N R2502 LB25031 2 3 GND
J2502

C2502
4 M1
EAR_N L2502 EAR_N_RCV_BTB 1 P1

2
R2503

C2509

C2510
C2501

C2506

R2501
C2512

D2501

D2502
C2525

C2526

1
CAD note: 1,MIC need differential trace
2, MIC GND pad need use cycle via to GND net.
B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542

HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET
25_MIC/RCVOF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

26. Headphone
A
A

FM_RF_IN L2601 C2617 C2618 FM_IN_SMB

M G R L
default

L2602
SG2602
LB2601 C2611

G
S

CLOSE TO 1102
HS_FB_L_CON 1 2 HS_FB_L

HS_FB_R_CON SG2601
LB2602 C2608

G
S

1 2 HS_FB_R
FM_IN_SMB LB2606
B HS_R_CONN 1 2 R2604 HS_R
HS_L_CONN
HS_DET_CONN B

C2607
C2620
SG2603

S S

G G
S

S
AGND_MIC C2621

C2606
SG2604

LB26051 2 R2603 HS_L

R2609 VOUT18_1V8

R2610 HS_DET

R2602 HS_MICBIAS

C2604
C2603

C MBHC_IN
C
C2605 HS_MIC_N
D2604

R2601

C2602 HS_MIC_P
C2601

C2619

The type and specification of the components refer to the BOM

SG2605

S
D NA 2018-07-13
S

G ECA NO DATE D
GND DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF 60
26_Headphone

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

27. X-Sensor
A
A

FingerPrint ZIF
U2705

2 NC/BYP J2702
INT1 11 GPIO_146_AG_INT 11S1 S212
I2C0_SCL 4 SCL/SPC/SCLK INT2 9
FP_SPI2_CS0 1P1 P22 GPIO_145_FP_INT
I2C0_SDA 6 SDA/SDI/SDO/SDIO ADC1/GND/NC 16 VOUT24_2V8 3P3 P44 VOUT18_1V8
ADC2/RESERVED/NC 15 5P5 P66 FP_SPI2_MISO
7 SDO/SA0/ALT_ADDRESS ADC3/GND/NC/TRIG 13 FP_SPI2_MOSI 7P7 P88 GPIO_038_FP_RST_N
ADDR 9P9 P1010 FP_SPI2_CLK
VOUT18_1V8 8 CS/CS/NC RES/GND/NC 10
13S3 S414
VOUT24_2V8 GND 12

B 1 VDD_IO GND/NC 5

C2734

C2766

C2708

C2768

C2769
14 VDD/VS NC 3

C2762

C2764
C2715

PROXIMITY&RGB AMBIENT Sensor

Compass
J2703
J2704 ﾗ鮠 ｻｯok
I2C0_SDA 1 P1 P1 1 VOUT24_2V8
U2703
1 P1 P1 1
I2C0_SCL VOUT24_2V8 A2 CAD VDD A1 VOUT24_2V8

J2705 A3 TST VID C1 VOUT18_1V8

J2706
C2702

C2701

VOUT18_1V8 C2 RSTN VSS B1

C2703

C2705

C I2C0_SDA C3 SDA
I2C0_SCL B3 SCL
C

C2767

C2772
U2702

Accelerometer and Gyroscope 6-AXIS SENSOR A2 SCL VDD B1

B2 SDA VSS A1
GND
U2701
TP2701
VDDIO 5 VOUT18_1V8
GPIO_146_AG_INT 4 INT1
9 INT2 VDD 8
I2C0_SDA 14 SDX/SDI/SDA OCSB/N/A/OCS 10
The type and specification of the components refer to the BOM
C2719

1 SDO/DNC/GND/SA0 OSDO/N/A/NC 11
I2C0_SCL 13 SCX/SCK/SCL ASDX/N/A/SDX 2
D VOUT18_1V8 12 CSB/DNC/CS ASCX/N/A/SCX 3
NA 2018-07-13
ECA NO DATE D
GNDIO/GND1 6
GND XUMENG 00322542
GND2 7 DESIGNED
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
27_X-Sensor 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

A
28.SIM/uSD Card VOUT11_USIM0 1
2
J2801

VCC_1
VCC_2
C2801 3 VCC_3
SIM0_RST_N R2807 SIM0_RST_N_R 4
A
RST_1
5 RST_2
6 RST_3
SIM0_CLK R2805 SIM0_CLK_R 7 CLK_1
8
9
CLK_2
CLK_3 SIM0
10 GND_1
11 GND_2
12 GND_3
13 VPP_1
VOUT11_USIM0 R2802 14 VPP_2
15 VPP_3
SIM0_DATA R2806 SIM0_DATA_R 16 I/O_1
17 I/O_2
18 I/O_3

J2802

VOUT12_USIM1 1 VCC_1
2 VCC_2
C2833 3 VCC_3
B SIM1_RST_N R2810 SIM1_RST_N_R 4 RST_1
5
6
RST_2 B
RST_3
SIM1_CLK R2808 SIM1_CLK_R 7 CLK_1
8 CLK_2
9 CLK_3

J2804
10
11
12
GND_1
GND_2
SIM1
1 GND_3
13 VPP_1
14 VPP_2
VOUT12_USIM1 R2801 15 VPP_3
SIM1_DATA R2809 SIM1_DATA_R16 I/O_1
17 I/O_2
18 I/O_3
J2803

Holder SDC_DATA2
1
9
DAT2_1
DAT2_2
F2801
2 CD/DAT3_1
SDC_DATA3 10 CD/DAT3_2
1 GND1 VOUT9_SD_IO R2811
2 GND2 3 CMD_1
3 GND3 SDC_CMD 11 CMD_2
4
C 5
GND4
GND5 4
6 VDD_1
7
GND6
GND7
VOUT16_2V95
C2830
12 VDD_2 C
8 GND8 5
9
10
11
GND9
GND10
SDC_CLK 13
CLK_1
CLK_2 Micro SD
GND11 C2805 6
12 VSS_1
GND12 14
13 VSS_2
GND13
7 DAT0_1
GPIO_206_SIM_SD_DET 14 DETECT_SWITCH_VCC SDC_DATA0 15 DAT0_2
15 M1 8 DAT1_1
SDC_DATA1 16 DAT1_2
C2835

Note: Pin14 is SW

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 28_SIM
OFSDcard
60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

29. LED/Key
A
A

RGB LED
DR1_LED_RED1 SG2901
B KEY BTB
S

S
LED2901
B
DR3_LED_RED 1 RED

DR4_LED_GREEN 2 GREEN A
4 VBAT_SYS
J2902 J2903
DR5_LED_BLUE 3 BLUE
KEY_DOWN_BTB 1 P1 P1 1 KEY_UP_BTB

C2964
J2905 J2904

C2961

C2962

C2963
1 P1 P1 1 KEY_POWER_BTB

KEY_UP_BTB R2911 GPIO_144_KEY_UP

KEY_POWER_BTB R2909 PWRON_N
KEY_DOWN_BTB R2910 GPIO_231_KEY_DOWN

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542

HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
29_LED/Key 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

30. Test Points/Shields

Shielding
A
CBT/PT BOOT MODE J3001 J3004
A
HSHIELD1-0404F HSHIELD1-3127F
P1 1 P1 1
TCXO Shielding
PMU shielding
TP3018
VBATT must route to D1502 BOOT_MODE R3001
TP3011 J3002 J3005
1
HSHIELD1-2631A HSHIELD1-1407C
P1 1 P1 1
SOC Shielding
VBATT TP3012 LCD IC Shielding
1
TP3017
1 J3003 J3006
TP3001
1 HSHIELD1-1926A HSHIELD1-3309A
WIFI_TEST 1 1
TP3064 RF Shielding P1 Charger Shielding P1
VCHG_USB_CON
TP3002

USB_ID 1
TP3005

USB_DP TP3003

USB_DN TP3004
B
HOLE B

M3001 M3003 M3005 M3007 M3009

HOLE67 HOLE67 HOLE67 HOLE67 HOLE63

M3002 M3004 M3006

HOLE67 HOLE67 HOLE67

BATT_TS 1 TP3013

1
TP3007 MARK POINT

FUNCTION TEST
ID3001 ID3002 ID3003

C LCD BL MICBIAS GND ID-BOARDA ID-BOARDA ID-BOARDA

LEDA_BTB 1
TP3008
ID3004 ID3005 ID3006 C
ID-BOARDA ID-BOARDA ID-BOARDA

TP3006

HEADPHONE KEY SPK

KEY_POWER_BTB1 TP3035
KEY_DOWN_BTB 1 TP3033
KEY_UP_BTB 1
TP3032 The type and specification of the components refer to the BOM

D TYPE CC VIBRATOR RCV NA 2018-07-13

ECA NO DATE D
DESIGNED XUMENG 00322542

HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEETPoints/Shields
30_Test OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

31.RF Interface
A
RFIC IQ POWER NC Interface A
CH0_RXA_I VBAT_SYS VOUT18_1V8
CH0_RXA_Q VBATT
CH1_RXA_I
CH1_RXA_Q VOUT2_1V8
VOUT3_1V8 BTFM_I2S2_CLK
VOUT1_1V09 BTFM_I2S2_MOSI
VREF_RF BTFM_I2S2_MISO
CH0_RXB_I BTFM_I2S2_SYNC
CH0_RXB_Q VOUT14_2V85
CH1_RXB_I VOUT28_1V8
CH1_RXB_Q GPIO_229_BFGN_WAKEUP_AP
VOUT27_1V8 HI1102_UART4_RTS_N
HI1102_UART4_CTS_N
VOUT23_3V2
HI1102_UART4_TX
CH0_TX_I_P HI1102_UART4_RX
CH0_TX_I_N CDMA_GPS_SYNC
CH0_TX_Q_P
CH0_TX_Q_N LTE_INACTIVE
CH0_MRX_I AP_GPS_REF_CLK
CH0_MRX_Q LTE_TX_ACTIVE
GPIO_030_Hi1102_PWRON
CLK32_BFGN
GPIO_211_WIFI_WAKEUP_AP

B
WL_SDIO_CLK
WL_SDIO_CMD
B
GPIO Interface MIPI Interface WL_SDIO_DATA0
WL_SDIO_DATA1
WL_SDIO_DATA2
RF_GPIO04_APT_EN RFIC0_MIPI_CLK
APT WL_SDIO_DATA3
RF_GPIO05_CHO_APT_PDM RFIC0_MIPI_DATA
RF_GPIO06_APT_BP
FE0_MIPI_CLK
RF_GPIO07_DPDT FE0_MIPI_DATA
DPDT
FE1_MIPI_CLK
FE1_MIPI_DATA

GPIO_207_ANT_DET_0
ANT_DETECT

ANT Interface GSM

GMSK_PH0
ANT_OUTB
C
C
CLK HKADC
RF0_CLK_38M4 HKADC_IN4_PA_TEMP_1

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 31 Interface
OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

32 APT_LM3243
A
A

C3205
U3201
TP3202
SW1 A2 L3251 RF_DCDC_MMBPA/TXM
RF_GPIO04_APT_EN C2 EN SW2 B2

RF_GPIO06_APT_BP C3 D4 C3201 C3208 C3209

BP FB D3200
B D3 MODE ACB1 A4
B4
RF_GPIO05_CHO_APT_PDM R3281 D2 VCON
ACB2
B
PGND1 A1
PGND2 B1
C3204 VBATT A3 PVIN1
B3 PVIN2 SGND C1
C3203C3202
D1 VDD BGND C4

SG3201
S

S
G

1.DCDCｵ酊ｷﾎｪPAｷﾀｻ､ｹ鰓ｻｻｯｵ酊ｷｵﾄﾗ魑ﾉｲｿｷﾖ
C 2.ｲｼﾏﾟﾊｱﾏﾈｾｭｹ ﾎﾈﾑｹｹﾜD3200｣ｬﾔﾙﾐﾇﾐﾍﾗﾟﾏﾟｸ PAｺﾍTXMｹｩｵ
3.ｲｼﾏﾟﾊｱｿｼﾂﾇﾏﾟｿ惞ｬDCDCｸ GSMｹｩｵ醋ｱ｣ｬﾐ雎｣ﾖ､ﾍｨﾁ ｴ ｵｽ3A C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
32 APT0 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

33.RFIC0_Hi6353

C3305

C3313

C3317

C3323
A
A

ｱ狡 ｣ｺ39200865 VOUT1_1V09
A4 GND1 VDD_1P0_ANA_RX1 F5

C3304
A8 GND2 VDD_1P0_ANA_RX2 A12 C3329
RX_1A_I D7 CH0_RXA_I A16 GND3 VDD_1P0_ANA_RXA A2
LB_DRX_LNA_OUT F15 C6 CH0_RXA_Q B3 A14 C3320
RXB_LB1 RX_1A_Q GND4 VDD_1P0_ANA_RXB Close to V13
MHB1_DRX_LNA_OUT E16 RXB_HB1 RX_2A_I B5 CH1_RXA_I C4 GND5 VDD_1P0_ANA_RXPLL E10
MHB2_DRX_LNA_OUT C16 A6 CH1_RXA_Q C8 N12 C3322
RXB_HB2 RX_2A_Q GND6 VDD_1P0_ANA_TX Close to W2
MHB3_DRX_Lis_LNA_OUT B15 C12 J14
RXB_HB3
C10 CH0_RXB_I C14
GND7 U3301 VDD_1P0_ANA_TXPLL
J16 C3319
U3301 RX_1B_I
D9 CH0_RXB_Q D1
GND8 VDD_1P0_FREF For RX1/2/3/B
RX_1B_Q GND9
LB_PRX_LNA_OUT B1 A10 CH1_RXB_I D3 C3316 Close to W14
RXA_LB1 RX_2B_I GND10
MHB1_PRX_LNA_OUT C2 B11 CH1_RXB_Q D11 H1 C3318
RXA_HB1 RX_2B_Q GND11 VDD_1P8_ANA_RXA For TX2 and TXIF
MHB2_PRX_LNA_OUT E2 RXA_HB2 D13 GND12 VDD_1P8_ANA_RXB B13
MHB3_PRX_Lis_LNA_OUT F1 RXA_HB3 TX1_I_P M3 CH0_TX_I_P D15 GND13 VDD_1P8_ANA_TX M11 VOUT3_1V8
K3 CH0_TX_I_N E4 J2 C3314 For RXA&RXB
TX1_I_N GND14 VDD_1P8_ANA_TXIF

C3330

C3332

C3303
H3 CH0_TX_Q_P E8 H13 C3312
TX1_Q_P GND15 VDD_1P8_IO
J4 CH0_TX_Q_N E14 VOUT2_1V8
MISC1 Interface 1 of 2

TX1_Q_N GND16
F3 GND17 For RXPLL

C3315
MRX_IF_I J6 CH0_MRX_I F7 GND18 GND33 K11
H5 CH0_MRX_Q F9 K13

MISC2 Interface 2 of 2
MRX_IF_Q GND19 GND34
F13 GND20 GND35 K15
LB1_TX1_RFIC0_OUT N10 TX1_LB1 RFFE_CLK G12 RFIC0_MIPI_CLK G2 GND21 GND36 L2
LB2_TX1_RFIC0_OUT M9 H11 RFIC0_MIPI_DATA G4 L4
B N8
TX1_LB2
TX1_LB3
RFFE_DATA
CHIP_ID F11 G6
GND22
GND23
GND37
GND38 L6
HB1_TX1_RFIC0_OUT M7 J12 GMSK_PH0 G8 L8
HB2_TX1_RFIC0_OUT N6
TX1_HB1
TX1_HB2
TX_GMSK_DATA
FREF_IN L16 L3353 C3328 RF0_CLK_38M4 G10
GND24
GND25
GND39
GND40 L10 B
HB3_TX1_RFIC0_OUT M5 TX1_HB3 REXT K1 R3382 G14 GND26 GND41 L12
REF_V E12 R3381 VREF_RF G16 GND27 GND42 L14
R3382 Need 37.4K , and 1% H15 GND28 GND43 M13

C3327
PLLTEST_P E6 J8 GND29 GND44 M15
C3302

PLLTEST_M D5 J10 GND30 GND45 N4

EXT_CPL_TO_RFIC0_MRX1 K9 MRX_1 ANATEST1 M1 K5 GND31 GND46 N14
ﾈ郢鉎ｰｶﾋﾓﾐﾖｱﾁ ｣ｬﾐ靨ｪｸ ﾖｱ ANATEST2 N2 K7 GND32 GND47 N16

GSM_LB_TX_PA_IN L3352 L3357 LB1_TX1_RFIC0_OUT LB_TX_PA_IN L3356 LB2_TX1_RFIC0_OUT

C3307

C3308

C3310

C3309

C
C

GSM_HB_TX_PA_IN L3351 HB3_TX1_RFIC0_OUT MB_TX_PA_IN L3354 HB2_TX1_RFIC0_OUT

C3306

C3301

C3325

C3324

The type and specification of the components refer to the BOM

HB_TX_PA_IN L3355 HB1_TX1_RFIC0_OUT

D RFIC_TX_OUTPUT_MATCHING NA 2018-07-13
C3311

C3326

ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
33 RFIC0_6353
60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

34 DPDT_Connector
A
J3401 A

G2

G1
C
A
J3402

1
2

3
MAIN_ANTC3407 C3400 C3406 1 2
47140300 change to SKY13699-21 To MAIN ANT
4 3
L3457
U3400 L3456

1 GND1 VDD 10 VOUT14_2V85

MAIN_SWITCH 2 RF3 CTL1 9 RF_GPIO07_DPDT

C3403
C3404
3 GND2 RF4 8 DIV_SWITCH
L3451
MAIN_ANT 4 RF1 GND4 7
C3405
5 GND3 RF2 6 DIV_ANT

B
GPIO_207_ANT_DET_0 B
ANT_DETECT

SKY13699-21 Truth Table J3400

CTRL1 State
0 RF1-RF3,RF2-RF4
1 RF1-RF4,RF2-RF3

G2

G1
C
A
4

1
2

3
DIV_ANT
L3454 ANT_DRX
To DIV ANT
L3453

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF 60
34 DPDT_Connector

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

35. TXM
A
A

HI6D21 47150693
TXM PROTECT GUI YI HUA U3500

GSM_HB_TX_PA_IN 3 MB_IN MH_TRX1 35 B38/B41_TRX_ANT

4 MB_SWOUT MH_TRX2 34 B40_TRX_ANT MAIN_SWITCH
L3550
33 B7_TRX_ANT_EXT

L3551

L3552
MH_TRX3
VBATT 10 VBATT MH_TRX4 32 B1_B3_CA_TRX+ANT
RF_DCDC_MMBPA/TXM 9 VCC MH_TRX5 31 B1_TRX_ANT_EXT
MH_TRX6 29 B34/B39_TX_ANT
HISI TXM DO NOT SUPPORT RAMP PA 8 VRAMP MH_TRX7 28 B2_TRX_ANT
VOUT28_1V8 7 27 G1800/1900_TRX_ANT
VIO MH_TRX8
FE1_MIPI_DATA 6 SDATA MH_TRX9 26 B34/39/41_PRX_ANT
FE1_MIPI_CLK 5
B SCLK
GSM_LB_TX_PA_IN 2
1
LB_IN
LB_SWOUT ANT 20 B
11 GND1
12 GND2 CPL 18 R3583
13 GND3
14 GND4
15
1

D3501 C3510 C3509 D3500 C3508 C3507 C3506 C3505 C3503 C3501 C3502 GND5
16 GND6 L_TRX1 43 B8_TRX_ANT
R3589 EXT_CPL_TO_RFIC0_MRX1
19 GND7 L_TRX2 42 R3582
21 GND8 L_TRX3 41 R3581
22 GND9 L_TRX4 40 R3592 R3590 R3591
2

23 GND10 L_TRX5 39 B12(17)_B20_B28H_TRX_ANT

25 GND11 L_TRX6 38 B28L_TRX_ANT
30 GND12 L_TRX7 37 B5_TRX_ANT
36 GND13
GND 44 17 R3584
GND14 NC1
45 GND15 NC2 24

C
C

The type and specification of the components refer to the BOM

D 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM NA 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
35 TXM 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

36 MMBPA VOUT23_3V2

A D3601

C3609 C3610 A
MMMBPA protect gui yi hua
Hi6D03_47150675
U3600

HB_TX_PA_IN 4 RFIN_H VBATT 11

MB_TX_PA_IN 5 RFIN_M RF_DCDC_MMBPA/TXM
VCC1 13
FE0_MIPI_CLK 9 SCLK VCC2 15
FE0_MIPI_DATA 8 SDATA

C3605

C3606
VIO 10 VOUT28_1V8
B38/B41_TRX_PA 22 HB1 C3612 C3602 C3604 C3601
R3684 24 HB2 GND1 6
B40_TRX_PA 26 HB3 GND2 7
B7_TX_PA_OUT 28 HB4 GND3 12
C3607
GND4 14
B40_PRX_PA_OUT 1 HBRX1 GND5 21
B38/41_PRX_PA_OUT 2 HBRX2 GND6 23
GND7 25
B2_TX_PA_OUT 16 MB1 GND8 27
B34/B39_TX_PA_OUT 17 29
6.8p share for U3600 and U3601 MB2 GND9
B3_TX_PA_OUT 18 MB3 GND10 30
B1_TX_PA_OUT 19 31
B R3682 20
MB4
MB5_B34/39
GND11
GND12 32
R3630 3 MBRX
B

Hi6D13_47150674
U3601
VOUT23_3V2 should come from D3601
LB_TX_PA_IN 4 RFIN_L1 LB1 11 R3681
VOUT23_3V2 3 RFIN_L2 LB2 12 R3685
5 RFIN_L3 LB3 13 R3686
LB4 14 B5_TX_PA_OUT
LB5 15 B12(17)_B20_B28H_TX_PA_OUT
22 VBATT LB6 16 B8_TX_PA_OUT
LB7 17 B28L_TX_PA_OUT
VOUT27_1V8
PA TEMP DECT VOUT28_1V8 23 2
VIO GND1
R3680 GND2 6
FE0_MIPI_CLK 24 SCLK GND3 7
GND4 8
FE0_MIPI_DATA 1 9
C 2 PAs share the caps
SDATA GND5
GND6 10
HKADC_IN4_PA_TEMP_1 19
RF_DCDC_MMBPA/TXM 20 VCC1
GND7
GND8 21 C
C3600

18 VCC2 GND9 25
RT3600

C3623 C3624 C3625

T

Place near to U3600

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 36 MMBPA
OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

37.TX_Loadpull
Co-Pad
A B5_TX_PA_OUT L3764 B5_TX_DUP B1_TX_PA_OUT L3768 C3717 B1_TX_DUP B7_TX_PA_OUT L3755 B7_TX_DUP
A

L3756
C3715

C3701
C3705

C3710
C3719
C3718 B1_TX_QUAD

B8_TX_PA_OUT L3765 B8_TX_DUP B2_TX_PA_OUT L3760 B2_TX_DUP B38/B41_TRX_PA L3751 B38/B41_TRX_SAW

L3759

C3706

L3752
C3720
C3716 C3713

GND
B
B
B12(17)_B20_B28H_TX_PA_OUT Co-Pad
L3763 B12(17)_B20_B28H_TX_DUP B3_TX_PA_OUT L3769 C3707 B3_TX_DUP B40_TRX_PA L3753 B40_TRX_SAW
1 2

C3700
C3714

L3754
C3709
L3766
C3708 B3_TX_QUAD

B28L_TX_PA_OUT L3762 B28L_TX_DUP HB_match

C3712 C3711

B34/B39_TX_ANT
C3723
C
B34/B39_TX_PA_OUT
C
Co-Pad

C3703
LB_match MB_match
The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
37 TX_Loadpull
60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

38 TRX_LB_1
A
A

Z3800
Z3802
B5_RX_DUP B12(17)_B20_B28H_TRX_ANT
B5_TRX_ANT L3856
C3807 6 ANT RX 1 C3802 6 ANT RX 1 B12(17)_B20_B28H_RX_DUP

TX 3 B5_TX_DUP TX 3 B12(17)_B20_B28H_TX_DUP
L3854 5 GND3 C3801 5 GND3
7 2 L3853 7 2
GND4 GND1 GND4 GND1
8 GND5 GND2 4 8 GND5 GND2 4

13080298 FOR B12(17): no package, use 0201H temporarily;check with DFX before product

B 13080283 FOR B20; 0201G;

13080349 FOR B28H;0201G;
B

Z3801
Z3803
B28L_TRX_ANT
B8_TRX_ANT C3805 6 ANT RX 1 B8_RX_DUP L3852 6 ANT RX 1 B28L_RX_DUP
C3804

TX 3 B8_TX_DUP C3800 L3851 TX 3 B28L_TX_DUP

5 GND3 5 GND3
L3855 7 2 7 2
GND4 GND1 GND4 GND1
8 GND5 GND2 4 8 GND5 GND2 4

13080348 FOR B28L- Package SFLT8-0201G

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF 60
38 TRX_LB_1

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

39 TRX_LB_2
A
A

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF 60
39 TRX_LB_2_Reserved

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

40 TRX_MB_1
A
B1_B3_CA_TRX+ANT
L4060
A
3 ANT_B1_B3 GND 6
L4061
B3_TX_QUAD B3_RX_QUAD
L4064 2 TX_B3 RX_B3 5
B1_TX_QUAD B1_RX_QUAD
1 TX_B1 RX_B1 4

U4000

Z4001

C4014 6 ANT RX 1 B3_RX_DUP

B CO-pad with L4060 TX 3 B3_TX_DUP
L4052 5
7
GND3
GND4 GND1 2 B
8 GND5 GND2 4

13080322 FOR B3£»package:SFLT8-0201G

Z4000 13080328 FOR B4; package:SFLT8-0201H;
B1_TRX_ANT_EXT
L4062 6 ANT RX 1 B1_RX_DUP

3 B1_TX_DUP
C4011

TX
5 GND3
L4063 7 GND4 GND1 2
8 GND5 GND2 4

L4057 co_pad with C3723

CO-PAD with C4013 Z4003
C B34/B39_TX_ANT
B2_TRX_ANT C4004 6 1 B2_RX_DUP
ANT RX
C

L4055
TX 3 B2_TX_DUP
5 GND3
L4053 L4054 7 2 GND
GND4 GND1
8 4 ﾈ･SAWﾊｱﾊｹﾓﾃ C4005
GND5 GND2

C4006

Z4006 The type and specification of the components refer to the BOM
G1800/1900_PRX_SAW
G1800/1900_TRX_ANT C4013 1 UNB_PORT1 UNB_PORT2 4

2
D GND1 NA 2018-07-13
L4066 3 GND2 GND3 5 ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
40 TRX_MB_1
60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

41 TRX_MB_2
A
A

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 41 TRX_MB_2_Reserved
OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

42 TRX_HB_1
A
A

Z4202
B7_TRX_ANT_EXT
L4255 6 ANT RX 1 B7_RX_DUP
L4256
TX 3 B7_TX_DUP
L4254
5 GND3
7 GND4 GND1 2
8 GND5 GND2 4

B
B

Z4201
B40_TRX_ANT
L4257 4 UNB_PORT2 UNB_PORT1 1 B40_TRX_SAW

GND1 2
L4253 Z4200
5 GND3 GND2 3
B34/39/41_PRX_ANT
L4252 7 IN OUT_LTE_B34 3 B34_PRX_TriSAW

2 GND1 OUT_TD-LTE_B39 1 B39_PRX_Tri_SAW

4 GND2
L4260 6 GND3 OUT_TD-LTE_B41 5 B38/B41_PRX_Tri_SAW
8
L4263

L4251 GND4

C4201

C
C

Z4203
B38/B41_TRX_ANT L4262
4 UNB_PORT2 UNB_PORT1 1 B38/B41_TRX_SAW

GND1 2
C4202 L4261
5 GND3 GND2 3

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 42 TRX_HB_1
OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

43. TRX_HB_2
A
A

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF 60
43 TRX_HB_2_Reserved

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

44. PRX_LNA_Module B8_RX_DUP

L4458 B8_PRX_LNA_IN

U4400
L4457
J6 ATEST
B5_RX_DUP L4456 B5_PRX_LNA_IN
E8 MHB1_PRX_LNA_OUT
A B7_PRX_LNA_IN C2 HB1_IN1
MHB1OUT
MHB2OUT F9 MHB2_PRX_LNA_OUT
L4455 D1 H9 MHB3_PRX_Lis_LNA_OUT
B38/B41_PRX_LNA_IN H1
HB1_IN2
HB2_IN1
MHB3OUT
A
J2 HB2_IN2 LBOUT D9 LB_PRX_LNA_OUT

B5_PRX_LNA_IN A4 LB_IN1 VDDIO E4 VOUT2_1V8

B28L_PRX_LNA_IN B5 LB_IN2
B28L_RX_DUP L4492 B28L_PRX_LNA_IN B8_PRX_LNA_IN A6 LB_IN3 VDD1P8 G6 VOUT3_1V8
B12(17)_B20_B28H_PRX_LNA_IN
B7 LB_IN4
A8 LB_IN5 GND1 B9
GND2 C4
L4491 B40_PRX_LNA_IN B3 MB1_IN1 GND3 C6
B3_PRX_LNA_IN A2 MB1_IN2 GND4 C8

C4407

C4408

C4412
B2(G1900)_PRX_LNA_IN B1 MB1_IN3 GND5 D3
GND6 D7
B12(17)_B20_B28H_PRX_LNA_IN B1_PRX_LNA_IN E2 MB2_IN1 GND7 F3
B12(17)_B20_B28H_RX_DUP
L4454 B39_PRX_LNA_IN F1 MB2_IN2 GND8 F7
B34_PRX_LNA_IN G2 MB2_IN3 GND9 G4
GND10 G8
L4490 J4 MUX_IN GND11 H3
FE1_MIPI_CLK D5 SCLK GND12 H5
GND13 H7
FE1_MIPI_DATA F5 SDATA GND14 J8

E6 USID0
C4409 G1800_PRX

B G1800/1900_PRX_SAW C4449

Co-Pad
B
B1_RX_DUP
CO-PAD The Inputport unused should be connected to GND!
C4403 L4460 B1_PRX_LNA_IN B2_RX_DUP L4452 L4462 B2(G1900)_PRX_LNA_IN

B1_RX_QUAD C4402 L4459 L4461

Co-Pad
B34_PRX_TriSAW
B3_RX_DUP C4410 L4464 B3_PRX_LNA_IN L4466 B34_PRX_LNA_IN

B3_RX_QUAD C4411 L4463 L4465

6H03 Frequency Range

LB_IN1 B5
LB_IN2 703-894MHz
LB_IN3 B8
C LB_IN4/5 717-821MHz
MB1_IN1 1805-2200MHz B40
C
B7_RX_DUP L4470 B7_PRX_LNA_IN B39_PRX_Tri_SAW L4468 B39_PRX_LNA_IN MB1_IN2/3£¬MB2_IN1/3 1805-2200MHz
HB1/2_IN1 B41/38/7
L4467 HB1/2_IN2 2300-2690MHz
L4469 L4471

G1800_PRX C4401

co-pad
B38/B41_PRX_Tri_SAW
C4420 L4476 B38/B41_PRX_LNA_IN B40_PRX_PA_OUT L4473 B40_PRX_LNA_IN
The type and specification of the components refer to the BOM

B38/41_PRX_PA_OUT
D C4421
L4472
L4474 NA 2018-07-13
L4475 L4477 ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF 60
44 PRX_LNA_Module

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

45.DRX_SWITCH
A
A

C4510

C4511
U4500
B DIV_SWITCH
C4500 8 2 FE1_MIPI_DATA
ANT DATA
B1_DRX_ANT 17 3 FE1_MIPI_CLK
B
B1 SCLK
L4551 B3_DRX_ANT 15 B3
B5_DRX_ANT 12 4 VOUT28_1V8
B5 VIO
B8_DRX_ANT 10 B8
B34_DRX_ANT 13 5 VOUT3_1V8
B34 VDD

C4504

C4502
B39_DRX_ANT 14 B39
B40_DRX_ANT 21 B40
B41_DRX_ANT 19 B41 GND1 1
GND2 6
B12(17)_B28_(B20)_DRX_ANT
11 AUX1 GND3 7
B2_DRX_ANT 18 AUX2 GND4 9
22 AUX4 GND5 16
B7_DRX_ANT 20 AUX3 GND6 23

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
45 DRX_Switch
60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

46. DRX_LB
A
A
Z4600

B12(17)_B28_(B20)_DRX_ANT
C4601 1IN OUT4 B12(17)_B28_(B20)_DRX_SAW

2GND1
L4654
5GND2 GND33

13010572 FOR B12(17)

13010655 FOR B28(FullBand)

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 46 DRX_LB
OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

47. DRX_MB
A
A

Z4702

B2_DRX_ANT C4703 1 UNB_PORT1 UNB_PORT2 4 B2_DRX_SAW

2 GND1
L4754
3 GND2 GND3 5

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
47 DRX_MB60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

48. DRX_HB
A
A

Z4800

B7_DRX_ANT
C4801 1IN OUT4 B7_DRX_SAW

2GND1
L4851
5GND2 GND33

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 48 DRX_HB
OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

The Inputport unused should be connected to GND!

49. DRX_LNA_Module U4900

B5_DRX_ANT J6 ATEST
L4952 B5_DRX_LNA_IN B8_DRX_ANT L4954 B8_DRX_LNA_IN
MHB1OUT E8 MHB1_DRX_LNA_OUT
B7_DRX_LNA_IN C2 F9 MHB2_DRX_LNA_OUT
A L4951 L4953 D1
HB1_IN1
HB1_IN2
MHB2OUT
MHB3OUT H9 MHB3_DRX_Lis_LNA_OUT
B38/B41_DRX_LNA_IN H1
J2
HB2_IN1
HB2_IN2 LBOUT D9 LB_DRX_LNA_OUT A
B5_DRX_LNA_IN A4 LB_IN1 VDDIO E4 VOUT2_1V8
B20_DRX_LNA_IN B5 LB_IN2
B8_DRX_LNA_IN A6 LB_IN3 VDD1P8 G6 VOUT3_1V8
B12(17)_B28_(B20)_DRX_LNA_IN
B7 LB_IN4
A8 LB_IN5 GND1 B9
GND2 C4
B40_DRX_LNA_IN B3 MB1_IN1 GND3 C6
B3_DRX_LNA_IN A2 MB1_IN2 GND4 C8

C4902

C4901

C4900
B2_DRX_LNA_IN B1 MB1_IN3 GND5 D3
B12(17)_B28_(B20)_DRX_SAW GND6 D7
L4956 B12(17)_B28_(B20)_DRX_LNA_IN
B1_DRX_LNA_IN E2 MB2_IN1 GND7 F3
B39_DRX_LNA_IN F1 MB2_IN2 GND8 F7
B34_DRX_LNA_IN G2 MB2_IN3 GND9 G4
L4955
GND10 G8
J4 MUX_IN GND11 H3
FE1_MIPI_CLK D5 SCLK GND12 H5
GND13 H7
FE1_MIPI_DATA F5 SDATA GND14 J8

VOUT2_1V8 E6 USID0

B
B
B1_DRX_ANT L4958 B1_DRX_LNA_IN B3_DRX_ANT L4960 B3_DRX_LNA_IN

L4957 L4959

L4950 B20_DRX_LNA_IN

Co-Pad
B2_DRX_SAW L4962 B2_DRX_LNA_IN B34_DRX_ANT L4964 B34_DRX_LNA_IN

L4963
L4961
C4907

C 6H03 Frequency Range

C4911
LB_IN1 B5
C
Co-Pad LB_IN2 703-894MHz
B40_DRX_ANT L4970 B40_DRX_LNA_IN B39_DRX_ANT L4966 B39_DRX_LNA_IN LB_IN3 B8
L4969
L4982
L4965 LB_IN4/5 717-821MHz
MB1_IN1 1805-2200MHz B40
MB1_IN2/3£¬MB2_IN1/3 1805-2200MHz
HB1/2_IN1 B41/38/7
HB1/2_IN2 2300-2690MHz

The type and specification of the components refer to the BOM

Co-Pad
B41_DRX_ANT L4972 B38/B41_DRX_LNA_IN B7_DRX_SAW L4968 B7_DRX_LNA_IN
D L4971
L4981 NA 2018-07-13
L4967
L4980 ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
49 DRX_LNA_Module
60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

50. Reserved
A
A

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
50 Reserved
60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

A
60 NC_POWER
A

VDD_PMU_1P4 P13 K3 SG6001

G
VDD_BUCK_1P4 VSS_CMU S

VDD_PMU_CLDO1 E18 VDD_CLDO1_1 VSS_FM_RF_RX C10

G12 VDD_CLDO1_2
K9 VDD_CLDO1_3
N6 VDD_CLDO1_4 VSS_GF_ADC F13

VDD_PMU_RFLDO1 M1 VDD_CMU_1P2
U6001 VSS_GF_RF_FMLO_VCO C12
VDD_CMU_LDO_TCXO L4 VDD_CMU_LDO_TCXO
VSS_GF_RF_GR F11
VDD_PMU_RFLDO1 A10 VDD_FM_RF_RX_1P2
VSS_GF_RF_PLL D11
C6021 B11 VDD_GF_RF_PLL_VCO_1P2
VSS_GLOBAL_RF1 H7
VDD_PMU_RFLDO1 A7 VDD_GNSS_RF_RX_1P2 VSS_GLOBAL_RF2 H9

C6046

C6020

C6023

C6025
VSS_GLOBAL_RF3 J2
N18 VDD_NFC_PMU_SE1
M17 VDD_NFC_PMU_SE2 VSS_GLOBAL1 E16
J12

PWR Interface 2 of 2
NO FM-->A10: GND VSS_GLOBAL2
M13 VDD_NFC_PMU_SWIO0 VSS_GLOBAL3 L10
N16 VDD_NFC_PMU_SWIO1 VSS_GLOBAL4 N4
M15 VDD_NFC_PMU_SWIO2 VSS_GLOBAL5 N10
B NO IR-->J16: NCJ16 C8 SG6002

G
VDD_NFC_RF_PA VSS_GNSS_RF_RX
VBAT_SYS
K15
H15
VDD_NFC_RF_REC
G16
S

B
VDD_NFC_VBAT VSS_IR NO IR--> Delete SG6005
VDD_PMU_1P4 A16 VDD_PMU_1P4 VSS_NFC_RF_ANA1 K13
VSS_NFC_RF_ANA2 L12
VDD_PMU_CLDO1 R14 VDD_PMU_CLDO1
C6026 N12 VDD_PMU_CLDO2 VSS_NFC_RF_GR H13
VSS_NFC_RF_PA L16
VDD_PMU_PALDO C14 VDD_PMU_PALDO
VSS_PMU_AGND1 A14
VDD_PMU_RFLDO1 B13 VDD_PMU_RFLDO1 VSS_PMU_AGND2 M11
VDD_PMU_RFLDO2 A12 VDD_PMU_RFLDO2 VSS_PMU_AGND3 E14

C6027 R12 P17 SG6003

G
VDD_PMU_SYSLDO VSS_PMU_PGND S

VSS_PMU_PGND_TEST R18
P15 VDD_PMU_VBAT2
VOUT18_1V8 D15 VDD_PMU_VDDIO VSS_SR1 A18
VSS_SR2 N2
VOUT18_1V8 P11 VDD_PMU_VDDIO2
VSS_WB_ABB_ADC_DAC H5
VBAT_SYS C16 VDD_PMU_VPH VSS_WB_RF_GR G6
VSS_WB_RF_LNA E4
VDD_PMU_RFLDO1 K5 VDD_WB_ADDA_1P2
VSS_WB_RF_MIX_UPC2G B5
VDD_PMU_RFLDO1 E2 VDD_WB_RF_LNA_1P2
VDD_PMU_RFLDO1 F5 VDD_WB_RF_LPF_1P2 VSS_WB_RF_PA2G_A D3
VSS_WB_RF_PA2G_B B3
VDD_PMU_PALDO A2 VDD_WB_RF_PA2G_3P3_1P4
VDD_PMU_PALDO H3 VDD_WB_RF_PPA5G_3P3 VSS_WB_RF_PA2G_BL1 B1
C VDD_PMU_RFLDO1 NO 5G WIFI-->H3: NC
F7
VSS_WB_RF_PA2G_BL2 C2
VDD_WB_RF_PLL_1P2
VDD_PMU_RFLDO1 A4
VSS_WB_RF_PLL E8
F3
C
VDD_WB_RF_UPC2G5G_1P2 VSS_WB_RF_PPA5G
VDD_PMU_RFLDO2 A5 VDD_WB_RF_VCO_LOGEN_1P2 VSS_WB_RF_PPA5G_BL G2
VSS_WB_RF_TRAP D5
VOUT18_1V8 R10 VDDIO
D6001
C6028

C6030

C6031

C6033

C6034

C6035

C6036

C6045

C6037

C6038

C6029

C6039

C6040

C6041

C6043

C6044
C6032
D6002

VSS_WB_RF_TX5G_MIXBUF G4
1

C6 SG6004

G
VSS_WB_RF_VCO_LOGEN S
2

NO 5G-->Delete D6002

Add by Hisilicon for debug The type and specification of the components refer to the BOM

VOUT18_1V8
D Boston,Miami: VOUT2->VOUT18_1V8 NA 2018-07-13
VBAT_SYS ECA NO DATE
Chicago,Dallas: VOUT2 D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
R6082¡¢R6083:ƽ̨Ê×ÏîÄ¿ÊÔÖƱ£Áô£¬×îÖչ鵵ʱɾµô,Ö±Á¬£»·Çƽ̨Ê×ÏîÄ¿Ö±Á¬ VER PART_NUMBER 60 NC_POWER
SHEET OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

 1 2 3 4 5 6

61 NC_BB
A
A

BTFM_I2S2_CLK R6 BF_PCM_CLK/FM_I2S_CLK NFC_RF_RX1_ANT1 K17

BTFM_I2S2_MOSI M5 BF_PCM_DI/JTAG_SEL NFC_RF_RX2_ANT2 L18
BTFM_I2S2_MISO
GPIO200->BTFM_I2S2_MOSI R6181 BTFM_I2S2_SYNC
P5
L6
BF_PCM_DO/FM_I2S_DO
BF_PCM_SYNC/FM_I2S_WS
U6001 NFC_RF_SWIO0 L14
GPIO201->BTFM_I2S2_CLK J14
GPIO199->BTFM_I2S2_MISO NFC_RF_SWIO1
GPIO_229_BFGN_WAKEUP_AP
G14 BFGN_HOST_WAKE_UP NFC_RF_SWIO2 N14
GPIO202->BTFM_I2S2_SYNC
HI1102_UART4_RTS_NH11 BFGN_UART_CTS NFC_RF_TX1 H17 L6151 ÓÅÑ¡10100713£¬¸ß¶ÈÊÜÏÞ¿ÉÒÔÑ¡Ôñ10100558
GPIO042->HI1102_UART4_RTS_N HI1102_UART4_CTS_N P3 J18
BFGN_UART_RTS NFC_RF_TX2
GPIO041->HI1102_UART4_CTS_N BUCK_LX

MISC Interface 1 of 2
GPIO044->HI1102_UART4_TXD HI1102_UART4_TX P1 R16 L6151 VDD_PMU_1P4
BFGN_UART_RX PMU_BUCK_LX
GPIO043->HI1102_UART4_RXD HI1102_UART4_RX R2 BFGN_UART_TX
E12 GPIO_030_Hi1102_PWRON TP6102
PMU_PWRON
J4 CLK_REQ_OUT PMU_REFBP D13PMU_REFBP C6103

NO 5G WIFI-->C18,B15,B17: NC FEM_5G_EX_LNA_EN C18 R4 CLK32_BFGN

FEM_5G_EX_LNA_EN RTC_CLK
if use NXP FEM-->B15: NC B15 H1 WB_RF_RFI_5G
FEM_5G_RX_EN WB_RF_RFI_5G
FEM_5G_TX_EN B17 FEM_5G_TX_EN WB_RF_RFO_2G D1 WB_RF_RFIO_2G NO 5G WiFi-->H1£¬F1: GND
WB_RF_RFO_5G F1 WB_RF_RFO_5G
FM_RF_IN B9
B GPIO150->CDMA_GPS_SYNC
NO FM-->B9: GND FM_RF_IN
WB_RF_TEST_0 E6 NO 5G WiFi-->D7: NC
J8 D7 RF_TEST_1
GNSS_LNA_EN D17
GNSS_BLK_EN/RF_TX_TEST_2
GNSS_LNA_EN
WB_RF_TEST_1
WB_RF_TEST_2 G8 GPIO_211_WIFI_WAKEUP_AP B
WB_RF_TEST_3 F9
GNSS_RF_RFI A8 GNSS_RF_RFI
G10
C6106
GPIO50->ISM_PRIORITY WL_HOST_WAKE_UP
CDMA_GPS_SYNC K7 GPIO0/RF_TX_TEST_1
GPIO47->LTE_INACTIVE J10 P7 WL_SDIO_CLK
GPIO48->LTE_RX_ACTIVE GPIO1/RF_TX_TEST_3 WL_SDIO_CLK
WL_SDIO_CMD M7 WL_SDIO_CMD
GPIO49->LTE_TX_ACTIVE G18
GPIO004->AP_GPS_REF_CLK NO IR-->G18: NC IR_TRX
WL_SDIO_D0 P9 WL_SDIO_DATA0 SDIO
J6 ISM_PRIORITY/RF_TX_TEST_0 WL_SDIO_D1 R8 WL_SDIO_DATA1
LTE_INACTIVE L8 LTE_INACT/COE_UART_TX/SSI_CLK WL_SDIO_D2 M9 WL_SDIO_DATA2
E10 LTE_RX_ACT/RBIAS WL_SDIO_D3 N8 WL_SDIO_DATA3
Bosto¡¢miamiƽ̨: AP_GPS_REF_CLK RCΪ¸ÉÈÅÔ¤Áô£¬²âÊÔûÎÊÌâ¹éµµÊ±É¾µô,Ö±Á¬
AP_GPS_REF_CLK F17 GNSS_REF_CLK/GNSS_PWM_SYNC XIN L2 XIN
NFC_RF_ATB0
F15 GNSS_PPS_INOUT/GNSS_CAL_REQ XOUT M3
NFC_RF_ATB1
NC_1 K1 GND
LTE_TX_ACTIVE K11 LTE_TX_ACT/COE_UART_RX NC_2 D9
SSI_DATA/XLDO_MODE

C
C

TCXO 38.4MHz
TCXO6101
G
VDD_CMU_LDO_TCXO
R6183 4 3 C6105 XIN
VCC OUT
C6104

1 GND1/NC GND2 2

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF 60
61 NC_BB_Miami

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

62 NC_2G/5G/GPS

1
3
5
7
GND1
GND2
GND3
GND4
A
A

MIDDLE_FREQ.PORT

HIGHER_FREQ.PORT
LOWER_FREQ.PORT

COMMON_PORT

J6201
C6213

Z6202

G2

G1
C
A
8

1
2

3
2G_RF

L6260
C6203
Z6203 ANT_WIFI_GPS
WB_RF_RFIO_2G
C6201 1 INPUT OUTPUT 4 C6202

2 GROUND1
3 GROUND2 GROUND3 5
2

R6283

L6257
L6261

B GND
B
GNSS
GNSS_RF

5G_RF

WIFI_5G

C
C
FOR PROTECT, DFX DEMAND
C6204

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
62 NC_2G/5G/GPS
60

E 03025JLU HUAWEI TECH CO.,LTD.

 1 2 3 4 5 6

63 NC_FE_WIFI_5G
A
A

R6385 RF_TEST_1
C6304 C6309

B
VBAT_SYS
B

C6318
9 VCC3 GND2 11
8 VCC2 GND1 7
FEM_5G_EX_LNA_EN R6387 FEM_5G_PIN3
3 VCC1
PDET 10
FEM_5G_TX_EN R6386 FEM_5G_PIN2
2 CTRL2
R6388 FEM_5G_PIN4 C6301 L6352 WIFI_5G
4 CTRL1 ANT 1

L6351

L6359
5 RX TX 6

U6301
FEMｼ貶ﾝｷｽｰｸ

C6316
C6317

C6310
FEM_5G_EX_LNA_EN R6389 FEM_5G_PIN2 U6301ﾊｵｼﾊﾑ｡ﾐﾍﾎｪ47150685｣ｬﾔﾝﾎﾞｷ籏ｰ

VBAT_SYS R6390 FEM_5G_PIN3

FEM_5G_TX_EN R6391 FEM_5G_PIN4

C6302 WB_RF_RFO_5G

C6315

C
C
WB_RF_RFI_5G R6382
R6383 R6384
5dB Att: V=30,W=180

GND

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 63 NC_FE_WIFI_5G_599
OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

64 NC_GPS
A
A

GNSS_LNA_EN
L6453
VDD_CMU_LDO_TCXO

C6404
C6419 GNSS_RF

GNSS Z6401
U6401 2
L6455 4
B 1 GND ENABLE 6
1 2 UNB_PORT2 UNB_PORT1 1
Z6410 2 5
GNSS_RF_RFI L6456 4 UNB_PORT2 UNB_PORT1
1 3
VCC
RF_OUT
RF_IN
GND_RF 4
GND1 2 B
5 GND3 GND2 3
2

L6462
GND1 1
5 GND3 GND2
3

GND
L6451

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
64 NC_GPS60

E 03025JLU HUAWEI TECH CO.,LTD.

 1 2 3 4 5 6

68. NFC_BB
A
A

B
B

C
C
ﾗ鮠 ｻｯok
L6801

U6801
VBAT_SYS A3 VIN SW1 B1
SW2 B2

GPIO_218_BST_5V_EN B3 EN VOUT1 A1 VOUT_CLASSD

VOUT2 A2
C6801

C1 GND1
C2 GND2 GND3 C3
C6818

The type and specification of the components refer to the BOM

GND
D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
68 NFC_BB60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

69. ANT_NFC
A
A

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
69 ANT_NFC
60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

70.ANT_DIV
L7019

L7013 U7003

C7050
9 RF1 VDD 3 VOUT14_2V85
LB7050 ANT_OUTC
1 2 8 RF2 VIO 4 C7096 VOUT28_1V8
A P1
1 L7014 7 RF3 CLCK 2 FE0_MIPI_CLK
DIV ANT 6 RF4 DATA 1 FE0_MIPI_DATA A
J7006
10 5

L7015
GND USID

C7057

C7095
J7005 U7001 L7018

C7055

C7056
A1 DC_BIAS
1

L7016
P1
P2 2 RF2 RF1 GND 1 1 1
B2 B1

2 2 2

L7003 ANT_DRX
L7054

L7002
L7001
B
B

USID Setting Table(Register:0X1F D3:D0)

USID
USID PIN BIAS ConditionD3 D2 D1 D0
GND 0 1 1 0
J7004 C7092 Open 0 1 1 1
VIO 1 0 0 1
P1 1
P2 2 L7012
HB-Ground

L7091

C
L7053
LB-Ground P1 1 C
J7002

C7069 C7068
LB-Ground-Open P1 1

J7003
The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
70 ANT_DIV
60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

71 ANT_GPS_WIFI
A
WIFI/GPS ANT A

L7106 L7105

2
WIFI_TEST
P1 C7103 C7106 ANT_WIFI_GPS
1 C7104

1
P1 1

C7105

C7101
J7101

L7102 L7104 J7102

2

P1 1

C7102
1 2 J7105

L7103

L7101
P1 1
1
J7106

B
P1 1 B
J7107

J7161
P1 1
CAM ground P1 GND
1

J7108

P1 GND
1

J7109

J7110
S1 1

S2 2
GND
S3 3

J7111
1
S1
C
S2 2
GND
S3 3

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 71 ANT_GPS_WIFI
OF 60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

72.ANT_Tuner_Controller
A
A

C7209

D7201

C7201
C7204
2 1

U7201
A3 VHV VREG A2 C7203
B VBAT_SYSR7201 L7201 B3 L_BOOST OUTA C1
B1 ANT_OUTB
OUTB
OUTC A1 ANT_OUTC B
VBAT_SYS C3 VDDA
CLK D3 FE0_MIPI_CLK
D1 VIO DATA D2 FE0_MIPI_DATA
VOUT18_1V8
C2 GND ATEST B2

C7205

C7208

C7206
C7207
C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL1JKMM 03025JLU_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
72 ANT_Tuner_Controlle
60

E 03025JLU HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

Baseband Schematic MODEM Schematic

31. RF Interface
1. Contents 32. RF PMU
A 2. Block Diagramm 33. RF Transceiver
3. SOC PWR1 34. RF FRONT END HB A

4. SOC PWR2 35. RF FRONT END B42

5. SOC PWR3 36. RF FRONT END MB
37. RF Front End LB
6. SOC HS Interface 38. RF Front End Switch /Main ANT
7. SOC GPIO Interface 39. RF Front End Diversity
8. SOC RF Interface 40. RF Front End Diversity
9. SOC GND 41. Reserved for CDMA Modem
10. PMU LDO 42. Reserved for CDMA Modem
B
11. PMU BUCK & HI6422-1 43. Reserved for CDMA Modem
B
44. Reserved for CDMA Modem
12. PMU MISC & BUCKBOOST 45. Reserved for CDMA Modem
13. HI6422-2 46. Reserved for CDMA Modem
14. UFS and LPDDR 47. Reserved for CDMA Modem
15. Battery & Fuel guage 48. Reserved for CDMA Modem
16. USB/Scharger V300/Switch 49. RESERVED
17. LCD Interface 50. RESERVED
18. Reserved 51. RF Front End M1
52. Hi1102 POWER
C
19. Flash LED 53. Hi1102 Interface
20. Camera Interface 54. Hi1102_RF_FrontEnd_2G C
21. ISP Reserved 55. Hi1102_RF_FrontEnd_5GHz
22. Codec HI6403 56. RF_FRONT_END_Diversity_M1
23. Audio/SPK/VIB 57. NFC
24. Headphone 58. RF Transceiver2
59. RFIC2 PA+PMU
25. Audio 60. ANT Tuner
The type and specification of the components refer to the BOM
26. X-Sensor1
D 27. X-Sensor2 NA
ECA NO
2018-07-13
DATE D
28. SIM/uSD Card DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
29. FPC Interface REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
1 Contents
60
30. Test Point/Shielding
E 03025HSD HUAWEI TECH CO.,LTD.
1 2 3 4 5 6
 1 2 3 4 5 6

2.Block Diagramm

A
A

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF Diagramm
2 Block 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

3.SOC PWR1

A
A
VDD_CPU_B
C301

C310

C311

C312

C313

C321

C322

1
1

1
U300 VDD_GPU
C304 C305 C306
2 2 4 4 2 2 4 4 2 2 4 4 CPU BIG GPU

C342

C341

C343
1

1
R18 VDD_CPU_B_1 VDD_GPU_1 AC17
R19 VDD_CPU_B_2 VDD_GPU_2 AC18

1
R20 AC19

3
VDD_CPU_B_3 VDD_GPU_3
C387 C386

PWR1 interface 1 of 10
R21 VDD_CPU_B_4 VDD_GPU_4 AC20
R22 AC21 2 2 4 4 2 2 4 4

3
VDD_CPU_B_5 VDD_GPU_5
R23 VDD_CPU_B_6 VDD_GPU_6 AC22
U19 VDD_CPU_B_7 VDD_GPU_7 AC23
U20 AE17

3
VDD_CPU_B_8 VDD_GPU_8
U21 VDD_CPU_B_9 VDD_GPU_9 AE18

1
U22 AE19

3
VDD_CPU_B_10 VDD_GPU_10
U23 VDD_CPU_B_11 VDD_GPU_11 AE21

1
W19 AE23
C307 C308 C309 W20
VDD_CPU_B_12
VDD_CPU_B_13
VDD_GPU_12
2 2 4 4 2 2 4 4 2 2 4 4 W21
B W22
VDD_CPU_B_14
VDD_CPU_B_15 VDD_GPU_T AB16 VDD_GPU_T
W23 TP305
AA18
VDD_CPU_B_16
AA17 VSS_GPU_T TP306 B
3

3
VDD_CPU_B_17 VSS_GPU_T
AA19 VDD_CPU_B_18
AA20 CPU LITTLE
3

3
VDD_CPU_B_19
AA21 VDD_CPU_B_20 VDD_CPU_L_1 N10 VDD_CPU_L
AA22 VDD_CPU_B_21 VDD_CPU_L_2 N11
AA23 VDD_CPU_B_22 VDD_CPU_L_3 N12

1
VDD_CPU_L_4 N13
VDD_CPU_B_T W18 R10

C302

C359

C357
TP302 VDD_CPU_B_T VDD_CPU_L_5

1
R11
TP301
VSS_CPU_B_T Y17 VSS_CPU_B_T
VDD_CPU_L_6
VDD_CPU_L_7 R12 C395 C373
R13 2 2 4 4 2 2 4 4
VDD_CPU_L_8
CPU_B PLL VDD_CPU_L_9 U10
VOUT5_1V8 U18 AVDD18_PLL_CPU VDD_CPU_L_10 U11
U12

3
SG307
VDD_CPU_L_11
V18 U13

C314
AVSS_PLL_CPU VDD_CPU_L_12

3
S

S
G

C
VDD_CPU_B SG301 VDD_CPU_B_REMOTE

G S

S G
GND SG302
S

S
VSS_CPU_B_REMOTE C
AP Temperature DET VDD_CPU_L SG303 VDD_CPU_L_REMOTE

G S

S G
S
GND SG304 S
VSS_CPU_L_REMOTE

VOUT27_1V8

VDD_GPU SG305 VDD_GPU_REMOTE

G S

S G
S
GND SG306 S
VSS_GPU_REMOTE
1%
R301

HKADC_IN7_AP_TEMP

The type and specification of the components refer to the BOM

D NA 2018-07-13
T

ECA NO DATE D
RT301

DESIGNED XUMENG 00322542

HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
3_SOC PWR1 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

4.SOC PWR2
ｲｼｾﾖﾈ郢釭ﾓｽ MUﾊ莎 22UFｿﾉﾉｾｵ 10UF

VBUCK1_1V12

C480

C402

C403

C404

C405

C406

C407
VOUT2_1V8
A

C437

C438

C439

C440

C441

C408
A

VOUT37_0V6

1
U300
C478

1
VBUCK1_1V12
C410 C411 DDRPHY DDR MEMORY CORE

C444

C445

C446

C447

C448

C449

C450

C451

C401
2 2 4 4 2 2 4 4 G10 A6
VDD11_DDR4A_1 VDD1_M_1
G14 VDD11_DDR4A_2 VDD1_M_2 A8
H12 VDD11_DDR4A_3 VDD1_M_3 A22
G16 A25

3
VDD11_DDR4B_1 VDD1_M_4
G20 VDD11_DDR4B_2 VDD1_M_5 B15
H18 J1

3
VDD11_DDR4B_3 VDD1_M_6
VDD1_M_7 J29
G11 VDD06_DDR4A_1
G12 VDD06_DDR4A_2 VDD2_M_1 A3
VOUT5_1V8 G13 VDD06_DDR4A_3 VDD2_M_2 A7
G17 A12
C420

C421 VDD06_DDR4B_1 VDD2_M_3

PWR2 interface 2 of 10
G18 VDD06_DDR4B_2 VDD2_M_4 A15
G19 VDD06_DDR4B_3 VDD2_M_5 A18
VDD2_M_6 A23 VOUT37_0V6
DDRPHY PLL A26
B J12
VDD2_M_7
E1

C456

C457

C458

C459

C460

C472
AVDD18_PLL_DDR4A VDD2_M_8
J18 E29
AVDD18_PLL_DDR4B VDD2_M_9
VDD2_M_10 K1 B
IO POWER VDD2_M_11 K29
VOUT2_1V8 G7 VDD18_IO_1
G23 DDR MEMORY IO
C424

C425

C426

C427

C428

C429

VDD18_IO_2
P24 VDD18_IO_3 VDDQ_M_1 A11
AA25 VDD18_IO_4 VDDQ_M_2 A19
AF9 VDD18_IO_5 VDDQ_M_3 C1
AF12 VDD18_IO_6 VDDQ_M_4 C29
AF19 VDD18_IO_7 VDDQ_M_5 G1
AF22 VDD18_IO_8 VDDQ_M_6 G29
AF24 VDD18_IO_9
UFS
SDCARD IO AVDD08_UFS_1 L22 VOUT0_0V8
VOUT9_SD_IO N5 VDD1830_SD AVDD08_UFS_2 M23

USIM IO AVDD18_VPH_UFS_1 L23 VOUT29_1V8

VOUT11_USIM0 P6 VDD1830_USIM0 AVDD18_VPH_UFS_2 M24

VOUT12_USIM1 R6 VDD1830_USIM1 VDD1812_UFS N24

USB EMMC
VOUT30_0V8 R7 VDD08_USB AVDD18_EMMC_1 H24 VOUT2_1V8
AVDD18_EMMC_2 J24
VOUT5_1V8 T7 AVDD18_USB
MIPI
VOUT23_3V2 T6 AVDD33_USB AVDD18_CSI_1 J7 VOUT5_1V8
AVDD18_CSI_2 K7
L7

C467

C473

C474

C475

C476
AVDD18_CSI_3
C AVDD18_DSI AD16

C
C432

C433

C434

C435

C436

C469

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM
REVIEWED ZHANGYOUJUN 00258580 03025HSD_SCHZH
VER PART_NUMBER SHEET
4_SOC PWR2OF 60

E HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

5.SOC PWR3

VBUCK4_0V8

C536

C532

C568
1

1
A

1
C523 C524
U300 2 2 4 4 2 2 4 4

PERI CORE MODEM

VBUCK0_0V8 H8 R9

3
VDD08_PERI_1 VDD08_MODEM_1
H23 VDD08_PERI_2 VDD08_MODEM_2 U9
J9 W9

3
C531

C544

C508

C507

C504

C501
VDD08_PERI_3 VDD08_MODEM_3

1
J21 VDD08_PERI_4 VDD08_MODEM_4 W11
J23 VDD08_PERI_5 VDD08_MODEM_5 W13

1
L9 W15
C541 C543 L11
VDD08_PERI_6
VDD08_PERI_7
VDD08_MODEM_6
VDD08_MODEM_7 W17
2 2 4 4 2 2 4 4 L13 AA9
VDD08_PERI_8 VDD08_MODEM_8
L15 VDD08_PERI_9 VDD08_MODEM_9 AA11
L17 VDD08_PERI_10 VDD08_MODEM_10 AA13
L19 AA15

3
VDD08_PERI_11 VDD08_MODEM_11

PWR3 interface 3 of 10
N7 VDD08_PERI_12 VDD08_MODEM_12 AC9
N9 AC11

3
VDD08_PERI_13 VDD08_MODEM_13
N15 VDD08_PERI_14 VDD08_MODEM_14 AC13
R15 VDD08_PERI_15 VDD08_MODEM_15 AC15
R17 VDD08_PERI_16 VDD08_MODEM_16 AD8
U15 VDD08_PERI_17 VDD08_MODEM_17 AD12 VOUT0_0V8
U17 VDD08_PERI_18 VDD08_MODEM_18 AE7
AE9 VDD08_PERI_19

1
AE11 SYS CORE

C539
VDD08_PERI_20
AE13 VDD08_PERI_21 VDD08_SYS_1 K22

1
L21
B DDR PHY CORE
VDD08_SYS_2
VDD08_SYS_3 M20 C566
H10 N20 2 2 4 4
H15
VDD08_PERI_22
VDD08_PERI_23
VDD08_SYS_4
VDD08_SYS_5 N21 B
H20 VDD08_PERI_24 VDD08_SYS_6 P14
J11 U25

3
VDD08_PERI_25 VDD08_SYS_7
J13 VDD08_PERI_26 VDD08_SYS_8 AC25
J15 AF20

3
VDD08_PERI_27 VDD08_SYS_9
J17 VDD08_PERI_28 VDD08_SYS_10 AF21
J19 VDD08_PERI_29
SYS PLL
PERI(FIXED CORE) AVDD08_PLL_SYS P19 VOUT0_0V8
H6 VDD08_PERI_FIX_1
VOUT30_0V8 P7 VDD08_PERI_FIX_2 AVDD18_PLL_SYS N19 VOUT29_1V8

PERI PLL ABB

VBUCK0_0V8 N17 AVDD08_PLL_PERI AVDD09_ABB_1 W7
AVDD09_ABB_2 AC7 VOUT6_0V9
VOUT5_1V8 M18 AVDD18_PLL_PERI
AVDD18_ABB_1 Y6
SWP AVDD18_ABB_2 AB6 VOUT5_1V8
F22 SWP_VREF AVDD18_REF_ABB V6 VOUT5_1V8 VOUT5:ｴﾓPMUｵﾄﾊ莎 ｶﾋｿｪﾊｼﾐﾇﾐﾎﾗﾟﾏﾟ
TP502
G22 OSC_VREF
TP501
EFUSE
VOUT33_1V8 H22 AVDD18_OTP VDD18_EFUSE_SYS G8 VOUT33_1V8
C519

C518

C521

C520

C506

C505

C503

C513

C515

C574

C575

C542

C502
C
C

The type and specification of the components refer to the BOM

D 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM
REVIEWED ZHANGYOUJUN 00258580 03025HSD_SCHZH
VER PART_NUMBER SHEET
5_SOC PWR3OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

NA 1 2 3 4 5 6
 1 2 3 4 5 6

6.SOC HS INTERFACE

A
A

U300

CSI DSI
CSI0_CLK_N C4 CSI0_CLK_N DSI0_CLK_N AJ21 DSI0_CLK_N
CSI0_CLK_P C3 CSI0_CLK_P DSI0_CLK_P AJ20 DSI0_CLK_P
CSI0_DATA0_N B3 CSI0_DATA0_N DSI0_DATA0_N AK22 DSI0_DATA0_N
CSI0_DATA0_P B2 CSI0_DATA0_P DSI0_DATA0_P AL22 DSI0_DATA0_P
CSI0_DATA1_N B5 CSI0_DATA1_N DSI0_DATA1_N AK20 DSI0_DATA1_N
CSI0_DATA1_P C5 CSI0_DATA1_P DSI0_DATA1_P AL20 DSI0_DATA1_P
CSI0_DATA2_N C2 CSI0_DATA2_N DSI0_DATA2_N AK19 DSI0_DATA2_N
CSI0_DATA2_P D2 CSI0_DATA2_P DSI0_DATA2_P AL19 DSI0_DATA2_P
CSI0_DATA3_N C6 CSI0_DATA3_N DSI0_DATA3_N AL23 DSI0_DATA3_N
CSI0_DATA3_P B6 AK23 DSI0_DATA3_P

HS interface 4 of 10
CSI0_DATA3_P DSI0_DATA3_P
CSI1_CLK_N M3 UFS
B CSI1_CLK_P M2
CSI1_CLK_N
CSI1_CLK_P UFS_RESREF F28
CSI1_DATA0_N N3 K25
CSI1_DATA0_P N2
CSI1_DATA0_N
CSI1_DATA0_P
UFS_REF_CLK/GPIO_153
UFS_RST_N/GPIO_154 L25 B
CSI1_DATA1_N L1 CSI1_DATA1_N UFS_RX0_M J28
CSI1_DATA1_P L2 CSI1_DATA1_P UFS_RX0_P J27
CSI1_DATA2_N N1 CSI1_DATA2_N UFS_RX1_M J26
CSI1_DATA2_P P1 CSI1_DATA2_P UFS_RX1_P J25
CSI1_DATA3_N L4 CSI1_DATA3_N UFS_TX0_M H27
CSI1_DATA3_P L5 CSI1_DATA3_P UFS_TX0_P H28
UFS_TX1_M H25
CSI2_CLK_N F2 CSI2_CLK_N UFS_TX1_P H26
CSI2_CLK_P G2 CSI2_CLK_P
CSI2_DATA0_N H2 CSI2_DATA0_N EMMC C601
CSI2_DATA0_P J2 CSI2_DATA0_P EMMC_CALIO B24 R602 1%
H4 CSI2_DATA1_N EMMC_CLK B27 SOC_EMMC_CLK
H3 CSI2_DATA1_P EMMC_STRB/EMMC_GPIO_08 C24 SOC_EMMC_STRB
K4 CSI2_DATA2_N EMMC_CMD/EMMC_GPIO_09 D24 SOC_EMMC_CMD
K3 CSI2_DATA2_P EMMC_DATA0/EMMC_GPIO_00 C27 SOC_EMMC_DATA0
J5 CSI2_DATA3_N EMMC_DATA1/EMMC_GPIO_01 C26 SOC_EMMC_DATA1
J4 CSI2_DATA3_P EMMC_DATA2/EMMC_GPIO_02 D28 SOC_EMMC_DATA2
EMMC_DATA3/EMMC_GPIO_03 D27 SOC_EMMC_DATA3
USB2.0 EMMC_DATA4/EMMC_GPIO_04 D26 SOC_EMMC_DATA4
W3 USB_ID EMMC_DATA5/EMMC_GPIO_05 D25 SOC_EMMC_DATA5
SOC_USB_DN W1 USB_DM EMMC_DATA6/EMMC_GPIO_06 C25 SOC_EMMC_DATA6
SOC_USB_DP W2 USB_DP EMMC_DATA7/EMMC_GPIO_07 B25 SOC_EMMC_DATA7
R604 USB_REXT V2 USB_REXT
1% DDR MEMORY
DDRPHY DDR_ZQ0_MEM B16 R605 1% VOUT37_0V6
VOUT37_0V6 R601 1% B17 DDR4_ZQ_SOC DDR_ZQ1_MEM A16 R607 1%

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET HS Interface
6_SOC OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6
7.SOC GPIO INTERFACE1
VOUT18_1V8 R719 I2C0_SCL VOUT18_1V8 R710 I2C4_SCL

R718 I2C0_SDA R711 I2C4_SDA

A VOUT18_1V8 R751 I2C3_SCL VOUT2_1V8 R708 I2C6_SCL

U300
R752 I2C3_SDA R709 I2C6_SDA A
ISP AO ISP PERI
AH19 GPIO_203/ISP_GPIO03_PRTRB ISP_GPIO00_FTRSTN C22
GPIO_205_ACR_INT AG18 GPIO_205/ISP_GPIO05_BKPWM GPIO_011/UART1_CTS_N
AC29 GPIO_208/ISP_GPIO09_ENC ISP_GPIO01_BKRSTN B22 GPIO_012_MCAM1_RST_N
GPIO_209_LCD_BL_EN AA28 GPIO_209/ISP_GPIO07_ENA GPIO_012/UART1_RTS_N
GPIO_210_TP_INT_N AG24 GPIO_210/ISP_GPIO08_ENB ISP_GPIO02_MNTRB B21
AC27 GPIO_219/ISP_GPIO11 GPIO_013/UART1_RXD
SPI2_CS2_N/SPI4_CS2_N ISP_GPIO06_FSYNC B20 GPIO_014_VBUS_MOS_CTRL
GPIO_220_SCAM1_RST_N AD28 GPIO_220/ISP_GPIO12 GPIO_014/UART1_TXD
SPI2_CS3_N/SPI4_CS3_N ISP_GPIO10_SBPWM AJ16 GPIO_015_LCD_TE0 C706
GPIO_015/LCD_TE0
IO AO ISP_CLK0/GPIO_016 D11 R722 MCAM0_ISP_CLK0
GPIO_177_PMU1_EN AA26 GPIO_177 ISP_CLK1/GPIO_017 B11 R723 SCAM0_ISP_CLK1 U300
AH22 GPIO_183/CLK_OUT0 ISP_CLK2/GPIO_018 C11 R716 MCAM1_ISP_CLK2
I3C_SCL ISP_SCL0/GPIO_019 C13 MCAM0_ISP_SCL0 I2C AO SPI PERI
GPIO_184_USB_OTG_INT_NAJ23 GPIO_184/CLK_OUT1 ISP_SDA0/GPIO_020 D14 MCAM0_ISP_SDA0 I2C0_SCL AK27 I2C0_SCL/GPIO_187/I3C_SCL SPI1_CLK/GPIO_007 L27 TP_SPI1_CLK
I3C_SDA ISP_SCL1/GPIO_021 E9 SCAM0_ISP_SCL1 C708 I2C0_SDA AK26 I2C0_SDA/GPIO_188/I3C_SDA UART2_CTS_N
GPIO_185_LCD_CABC_PWM AH24 BLPWM_CABC/GPIO_185 ISP_SDA1/GPIO_022 E10 SCAM0_ISP_SDA1 GPIO_189_CHARGER_EN AJ26 I2C1_SCL/GPIO_189 SPI1_DI/GPIO_008 M28 TP_SPI1_MISO
GPIO_186_LCD_BL_PWM AG23 BLPWM_BL/GPIO_186 ISP_SCL2/GPIO_023 E14 MCAM1_ISP_SCL2 C707 AJ25 I2C1_SDA/GPIO_190 UART2_RTS_N
PWM_OUT0 ISP_SDA2/GPIO_024 D13 MCAM1_ISP_SDA2 AF27 I2C2_SCL/GPIO_191 SPI1_DO/GPIO_009 L28 TP_SPI1_MOSI
GPIO_206_SIM_SD_DET AB28 GPIO_206/CLKIN_AUX I2C7_SCL UART2_RXD
GPIO_207_ANT_DET_0
R707 AC28 GPIO_207 SYS SIGNAL C704 AF26 I2C2_SDA/GPIO_192 SPI1_CS_N/GPIO_010 L26 TP_SPI1_CS
GPIO_211_WIFI_WAKEUP_AP
AB29 GPIO_211 CLK_SLEEP W26 SYS_CLK_32K I2C7_SDA UART2_TXD
GPIO_225_PMU0_IRQ_N U29 GPIO_225 CLK_SYSTEM M25 SYS_CLK_19M2 I2C6_SCL AG19 I2C6_SCL/GPIO_213
GPIO_144_KEY_UP AE26 W25 SYS_CLK_EN I2C6_SDA AJ24 SDIO
DS1 interface 5 of 10
GPIO_144/SPI0_CS1_N SYSCLK_EN I2C6_SDA/GPIO_212
GPIO_145_FP_INT AD25 C701 D7 WL_SDIO_CLK
B GPIO_146_AG_INT AK28
GPIO_145
GPIO_146 PMU IF I2C PERI
SDIO_CLK/GPIO_128
SDIO_CMD/GPIO_129 B8 WL_SDIO_CMD
GPIO_147_NFC_INT AJ27 Y28 SPMI_CLK I2C3_SCL AG14 D8 WL_SDIO_DATA0
GPIO_148_ACR_EN AG22
GPIO_147/I2C2_SCL
GPIO_148/I2C2_SDA
SPMI_CLK/GPIO_227
SPMI_DATA/GPIO_226 W28 SPMI_DATA I2C3_SDA AH14
I2C3_SCL/GPIO_005
I2C3_SDA/GPIO_006
SDIO_DATA0/GPIO_130
SDIO_DATA1/GPIO_131 C8 WL_SDIO_DATA1 B
GPIO_149_PMU1_IRQ_N AG21 GPIO_149/PWM_OUT0 PMU0_SSI I2C4_SCL AK14 I2C4_SCL/GPIO_025 SDIO_DATA2/GPIO_132 C9 WL_SDIO_DATA2
CDMA_GPS_SYNC U28 GPIO_150/CDMA_GPS_SYNC PMU_AUXDAC0_SSI/GPIO_046 AH17 PMU_AUXDAC_SSI I2C4_SDA AL14 I2C4_SDA/GPIO_026 SDIO_DATA3/GPIO_133 B9 WL_SDIO_DATA3
TP756
Y27 PMU_PERI_EN

DS2 interface 6 of 10
LTE_GPS_SYNC PMU_PER_EN
SYS_RSTIN_N Y25 PMU_RST_OUT_N UART SD CARD
SPI AO PMU_RSTOUT_N Y26 SOC_RST_PMU_N GPIO_027_MCAM1_VCM_PWDN D18 UART2_CTS_N/GPIO_027 SD_CLK/GPIO_160 R3 SDC_CLK_R R701 SDC_CLK
GPIO_228_NFC_DWL_REQ U26 SPI0_CLK/GPIO_228/I3C_SCL GPIO_176 Y29 PMU_PWR_HOLD UART0_RXD SD_CMD/GPIO_161 T3 SDC_CMD_R R702 SDC_CMD
GPIO_229_BFGN_WAKEUP_APV26 SPI0_DI/GPIO_229/I3C_SDA GPIO_028_SCAM1_VCM_PWDN D21 UART2_RTS_N/GPIO_028 JTAG_TMS_SD
AG20 SPI0_DO/GPIO_230 PMU_CLKOUT/GPIO_002 AK17 PMU1_CLK_19M2 UART0_TXD SD_DATA0/GPIO_162 R2 SDC_DATA0_RR703 SDC_DATA0
GPIO_231_KEY_DOWN AE25 SPI0_CS0_N/GPIO_231 PMU1_SSI/GPIO_003 AH18 PMU1_SSI_DATA GPIO_030_Hi1102_PWRON D20 UART2_RXD/GPIO_030 JTAG_TCK_SD
FP_SPI2_CLK AC26 SPI2_CLK/GPIO_214 UART0_CTS_N SD_DATA1/GPIO_163 P4 SDC_DATA1_RR705 SDC_DATA1
SPI4_CLK BOOT CTRL D19 UART2_TXD/GPIO_029 JTAG_TDI_SD
FP_SPI2_MISO AB26 SPI2_DI/GPIO_215 BOOT_MODE AG17 BOOT_MODE UART0_RTS_N SD_DATA2/GPIO_164 R4 SDC_DATA2_RR714 SDC_DATA2
SPI4_DI BOOT_UFS AL16 HI1102_UART4_CTS_N N29 UART4_CTS_N/GPIO_041 JTAG_TDO_SD SDC_DATA3_R
FP_SPI2_MOSI AB25 SPI2_DO/GPIO_216 DFT_EN AK25 DFT_EN UART3_CTS_N SD_DATA3/GPIO_165 T4 R715 SDC_DATA3
TP703
SPI4_DO TEST_MODE/GPIO_001 AL17 HI1102_UART4_RTS_N N28 UART4_RTS_N/GPIO_042 JTAG_TRST_N_SD On CMD and DATA net,22 resistor need nearby SD
FP_SPI2_CS0 AD26 SPI2_CS0_N/GPIO_217 UART3_RTS_N/LCD_TE1 VDD_ODIO_BIAS_SD M6
LTE CTRL HI1102_UART4_RX P28 C702
SPI4_CS0_N UART4_RXD/GPIO_043
GPIO_218_BST_5V_EN AB27 SPI2_CS1_N/GPIO_218 LTE_INACTIVE/GPIO_047 P27 LTE_INACTIVE UART3_RXD AO JTAG
SPI4_CS1_N UART_RXD_BBP/UART_CTS_N_MHS HI1102_UART4_TX R28 UART4_TXD/GPIO_044 JTAG_MODE AL26 JTAG_MODE TP712
UART0_RXD/FRAME_SYNC UART3_TXD JTAG_SEL0 AL25 JTAG_SEL0 TP705
AO I2S LTE_RX_ACTIVE/GPIO_048 N27 GPIO_037_LCD_ID1 AJ14 UART5_CTS_N/GPIO_037 JTAG_SEL1 AL27 JTAG_SEL1 TP706
AG25 I2S1_DI/GPIO_195 UART_RXD_BBP/UART_RXD_MHS UART3_CTS_N JTAG_TCK_SWCLK/GPIO_178 AE27 SOC_JTAG_TCK_SWCLK TP707
AH26 I2S1_DO/GPIO_196 LTE_TX_ACTIVE/GPIO_049 P26 LTE_TX_ACTIVE GPIO_038_FP_RST_N AG16 UART5_RTS_N/GPIO_038 JTAG_TDI/GPIO_181 AG28 SOC_JTAG_TDI TP733
UART7_RXD UART_TXD_BBP/UART_TXD_MHS UART3_RTS_N JTAG_TDO/GPIO_182 AE28 SOC_JTAG_TDO TP749
AH27 I2S1_XCLK/GPIO_197 ISM_PRIORITY/GPIO_050 R26 GPIO_039_LCD_RST_N AH16 UART5_RXD/GPIO_039 JTAG_TMS_SWDIO/GPIO_179 AF29 SOC_JTAG_TMS_SWDIO TP710
UART7_TXD UART_RTS_N_MHS/UART0_TXD UART3_RXD JTAG_TRST_N/GPIO_180 AF28 GPIO_180_FLASH_STROBE TP711
AG26 I2S1_XFS/GPIO_198 GPIO_040_TP_RST_N AG15 UART5_TXD/GPIO_040
BTFM_I2S2_MISO R27 PERI IO USIM
C I2S2_DI/GPIO_199
UART8_CTS_N GPS_REF/GPIO_004 P25 AP_GPS_REF_CLK GPIO_031_SCAM0_RST_N C18
UART3_TXD
UART6_CTS_N/GPIO_031 USIM0_CLK/GPIO_166 T1 SIM0_CLK
BTFM_I2S2_MOSI U27 AK13 GPIO_045_LCD_VSN_EN
I2S2_DO/GPIO_200
UART8_RTS_N
PWM_OUT1/GPIO_045/ONEWIRE
GPIO_051/ONEWIRE C17 GPIO_051_NFC_EN GPIO_032_MCAM0_RST_N B18
UART0_RXD
UART6_RTS_N/GPIO_032
JTAG_TDI_SD
USIM0_RST/GPIO_167 T2 SIM0_RST_N C
BTFM_I2S2_CLK T28 I2S2_XCLK/GPIO_201 GPIO_052/ISP_GPIO10_SBPWM B19 UART0_TXD JTAG_TDO_SD
UART8_RXD GPIO_093/PWM_OUT1/UART1_RXD N26 DBG_UART6_RX AK15 UART6_RXD/GPIO_033 USIM0_DATA/GPIO_168 U1 SIM0_DATA
BTFM_I2S2_SYNC T29 I2S2_XFS/GPIO_202 GPIO_094/UART1_TXD M27 FOR DEBUG UART0_RXD_M/UART_RXD_MHS JTAG_TRST_N_SD
UART8_TXD UART_RXD_UC USIM1_CLK/GPIO_169 U3 SIM1_CLK
GPIO_221_CHG_INT_N AJ28 I2S3_DI/GPIO_221 AO Codec IF C703 DBG_UART6_TX AG13 UART6_TXD/GPIO_034 JTAG_TCK_SD
AJ29 I2S3_DO/GPIO_222 SLIMBUS_CLK/GPIO_193/SIF_CLK T25 L702 SIF_CLK UART0_TXD_M/UART_TXD_MHS USIM1_RST/GPIO_170 U2 SIM1_RST_N
AH28 I2S3_XCLK/GPIO_223 SLIMBUS_DATA/GPIO_194/SIF_DO T26 SIF_DO UART_TXD_UC JTAG_TMS_SD
AF25 I2S3_XFS/GPIO_224 GPIO_204/CODEC_SSI V28 L701 SIF_SYNC GPIO_035_LCD_VSP_EN AJ13 UART_RXD_UC/GPIO_035 USIM1_DATA/GPIO_171 V3 SIM1_DATA
SIF_SYNC/ISP_GPIO04_FTPWM UART0_RXD
SIF_DI0/GPIO_151 V25 SIF_DI_0 GPIO_036_LCD_ID0 AH13 UART_TXD_UC/GPIO_036 NFC IO
SIF_DI1/GPIO_152 W27 SIF_DI_1 UART0_TXD SWP_IO F21 NFC_SWIO_SE R731

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEETGPIO Interface
7_SOC OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6
8.SOC RF INTERFACE

A
A

U300

RF IQ ANT SEL RF_GPIO05_CHO_APT_PDM_SOC R801 RF_GPIO05_CHO_APT_PDM

CH0_MRX_I AF1 ABB_CH0_MRX_I ANTPA_SEL00/GPIO_053 AJ17
CH0_MRX_Q AE1 ABB_CH0_MRX_Q GPS_BLANKING
ANTPA_SEL01/GPIO_054 AH15 RF_GPIO01_FLASH_MASK C803
CH0_RXA_I AD3 ABB_CH0_RXA_I FLASH_MASK
CH0_RXA_Q AD2 ABB_CH0_RXA_Q ANTPA_SEL02/GPIO_055 AK2
CH0_RXB_I AD4 ABB_CH0_RXB_I ANTPA_SEL03/GPIO_056 AG8
CH0_RXB_Q AC4 ABB_CH0_RXB_Q FE6_MIPI_CLK
ANTPA_SEL04/GPIO_057 AG9 RF_GPIO04_APT_EN
CH1_RXA_I AB4 ABB_CH1_RXA_I FE6_MIPI_DATA
CH1_RXA_Q AB3 ABB_CH1_RXA_Q ANTPA_SEL05/GPIO_058 AF6 RF_GPIO05_CHO_APT_PDM_SOC
CH1_RXB_I AB1 ABB_CH1_RXB_I CH0_APT_PDM
CH1_RXB_Q AB2 ABB_CH1_RXB_Q ANTPA_SEL06/GPIO_059 AG5 RF_GPIO06_APT_BP
B AA3 ABB_CH2_RXA_I
CH1_APT_PDM
ANTPA_SEL07/GPIO_060 AK3 RF_GPIO07_DPDT

RF interface 7 of 10
AA4 AJ3
Y4
ABB_CH2_RXA_Q
ABB_CH2_RXB_I
ANTPA_SEL08/GPIO_061
ANTPA_SEL09/GPIO_062 AF7 B
Y5 ABB_CH2_RXB_Q ANTPA_SEL10/GPIO_063 AH5
ANTPA_SEL11/GPIO_064 AK4
CH0_TX_I_N AH2 ABB_CH0_TX_I_N ANTPA_SEL12/GPIO_065 AL5
CH0_TX_I_P AG2 ABB_CH0_TX_I_P ANTPA_SEL13/GPIO_066 AJ5
CH0_TX_Q_N AH1 ABB_CH0_TX_Q_N ANTPA_SEL14/GPIO_067 AH6
CH0_TX_Q_P AJ1 ABB_CH0_TX_Q_P ANTPA_SEL15/GPIO_068 AK5
ANTPA_SEL16/GPIO_069 AG7
AF4 ABB_CH1_TX_I_N ANTPA_SEL17/GPIO_070 AK6
AG3 ABB_CH1_TX_I_P ANTPA_SEL18/GPIO_071 AH4
AE4 ABB_CH1_TX_Q_N ANTPA_SEL19/GPIO_072 AL3
AE3 ABB_CH1_TX_Q_P ANTPA_SEL20/GPIO_073 AH7 RF_GPIO20_SPDT_B1/B3
ANTPA_SEL21/GPIO_074 AJ7 RF_GPIO21_SPDT_B7
RF CTRL FE5_MIPI_CLK
ABB_CLK_38M4 U5 ABB_TCXO_IN ANTPA_SEL22/GPIO_075 AK7
GMSK_PH0 AL10 GMSK_PH0/GPIO_092 FE5_MIPI_DATA
ANTPA_SEL23/GPIO_076 AK9
ET FE4_MIPI_CLK
AD5 ABB_CH0_ET_N ANTPA_SEL24/GPIO_077 AL8
AE5 ABB_CH0_ET_P FE4_MIPI_DATA/CH0_APT_PDM
ANTPA_SEL25/GPIO_078 AJ10
RF MIPI FE3_MIPI_CLK
FE0_MIPI_CLK AJ11 FE0_MIPI_CLK/GPIO_084 ANTPA_SEL26/GPIO_079 AH10
FE0_MIPI_DATA AK11 FE0_MIPI_DATA/GPIO_085 FE3_MIPI_DATA
FE1_MIPI_CLK AL11 FE1_MIPI_CLK/GPIO_086 ANTPA_SEL27/GPIO_080 AJ8
FE1_MIPI_DATA AK12
R802

FE1_MIPI_DATA/GPIO_087 FE4_MIPI_CLK
AG12 FE2_MIPI_CLK/GPIO_088 ANTPA_SEL28/GPIO_081 AK8
AH12 FE2_MIPI_DATA/GPIO_089 FE4_MIPI_DATA
RFIC0_MIPI_CLK AG10 AH8
C RFIC0_MIPI_DATA AG11
RFIC0_MIPI_CLK/GPIO_090
RFIC0_MIPI_DATA/GPIO_091
ANTPA_SEL29/GPIO_082
FE3_MIPI_CLK
AH9
RF OTHER
ANTPA_SEL30/GPIO_083
FE3_MIPI_DATA
C
R845+/-1% ABB_IBIAS AE2 ABB_IBIAS_EXT
ABB_TEST AC2 ABB_TEST
ABB_VREF AC1 ABB_VREF
C801

C802

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER 8_SOC
SHEET RF Interface
OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

9.SOC GND

A
A
U300 U300

P18 AVSS_PLL VSS_20 B23 F16 VSS_64 VSS_109 M5

VSS_21 B26 F17 VSS_65 VSS_110 M8
U4 AVSS_ABB_1 VSS_22 B28 F18 VSS_66 VSS_111 M10 U300
U6 AVSS_ABB_2 VSS_23 B29 F19 VSS_67 VSS_112 M12
V4 AVSS_ABB_3 VSS_24 C7 F20 VSS_68 VSS_113 M14 V12 VSS_154 VSS_193 AD17
V5 AVSS_ABB_4 VSS_25 C10 F29 VSS_69 VSS_114 M16 V14 VSS_155 VSS_194 AD18
V7 AVSS_ABB_5 VSS_26 C12 G4 VSS_70 VSS_115 M19 V16 VSS_156 VSS_195 AD19
W4 AVSS_ABB_6 VSS_27 C15 G6 VSS_71 VSS_116 M22 V19 VSS_157 VSS_196 AD20
W5 AVSS_ABB_7 VSS_28 C19 G9 VSS_72 VSS_117 N4 V20 VSS_158 VSS_197 AD21
Y3 AVSS_ABB_8 GND1 interface 8 of 10 VSS_29 C20 G15 VSS_73 VSS_118 N6 V21 VSS_159 VSS_198 AD22
Y7 AVSS_ABB_9 VSS_30 C23 G21 VSS_74 VSS_119 N23 V22 VSS_160 VSS_199 AD23

GND2 interface 9 of 10

GND3 interface 10 of 10
AA2 AVSS_ABB_10 VSS_31 C28 G24 VSS_75 VSS_120 N25 V23 VSS_161 VSS_200 AE6
AA5 AVSS_ABB_11 VSS_32 D1 G28 VSS_76 VSS_121 P2 W24 VSS_162 VSS_201 AE15
AA7 AVSS_ABB_12 VSS_33 D3 H1 VSS_77 VSS_122 P3 W29 VSS_163 VSS_202 AE24
AB5 AVSS_ABB_13 VSS_34 D5 H7 VSS_78 VSS_123 P5 Y1 VSS_164 VSS_203 AE29
AC3 AVSS_ABB_14 VSS_35 D6 H9 VSS_79 VSS_124 P8 Y2 VSS_165 VSS_204 AF8
AC5 AVSS_ABB_15 VSS_36 D10 H11 VSS_80 VSS_125 P10 Y8 VSS_166 VSS_205 AF10
AD6 AVSS_ABB_16 VSS_37 D12 H13 VSS_81 VSS_126 P11 Y10 VSS_167 VSS_206 AF11
AD7 AVSS_ABB_17 VSS_38 D16 H14 VSS_82 VSS_127 P12 Y12 VSS_168 VSS_207 AF13
AF2 AVSS_ABB_18 VSS_39 D17 H16 VSS_83 VSS_128 P13 Y14 VSS_169 VSS_208 AF14
AF5 AVSS_ABB_19 VSS_40 D29 H17 VSS_84 VSS_129 P16 Y16 VSS_170 VSS_209 AF16
AG4 AVSS_ABB_20 VSS_41 E2 H19 VSS_85 VSS_130 P20 Y18 VSS_171 VSS_210 AF17
AH3 E3 H21 P22 Y19 AF23
B AJ2
AVSS_ABB_21
AVSS_ABB_22
VSS_42
VSS_43 E11 H29
VSS_86
VSS_87
VSS_131
VSS_132 P29 Y20
VSS_172
VSS_173
VSS_211
VSS_212 AH21
E12 J6 R5 Y21 AH29
A1 VSS_1
VSS_44
VSS_45 E13 J10
VSS_88
VSS_89
VSS_133
VSS_134 R24 Y22
VSS_174
VSS_175
VSS_213
VSS_214 AJ4 B
A2 VSS_2 VSS_46 E15 J20 VSS_90 VSS_135 R25 Y23 VSS_176 VSS_215 AJ19
A4 VSS_3 VSS_47 E16 J22 VSS_91 VSS_136 T5 AA24 VSS_177 VSS_216 AJ22
A10 VSS_4 VSS_48 E17 K2 VSS_92 VSS_137 T8 AB8 VSS_178 VSS_217 AK1
A13 VSS_5 VSS_49 E18 K5 VSS_93 VSS_138 T10 AB10 VSS_179 VSS_218 AK10
A14 VSS_6 VSS_50 E19 K6 VSS_94 VSS_139 T11 AB12 VSS_180 VSS_219 AK16
A17 VSS_7 VSS_51 E20 K8 VSS_95 VSS_140 T12 AB14 VSS_181 VSS_220 AK18
A20 VSS_8 VSS_52 E21 K10 VSS_96 VSS_141 T13 AB17 VSS_182 VSS_221 AK21
A24 VSS_9 VSS_53 E22 K12 VSS_97 VSS_142 T14 AB18 VSS_183 VSS_222 AK24
A27 VSS_10 VSS_54 E27 K14 VSS_98 VSS_143 T16 AB19 VSS_184 VSS_223 AK29
A28 VSS_11 VSS_55 E28 K16 VSS_99 VSS_144 T18 AB20 VSS_185 VSS_224 AL1
A29 VSS_12 VSS_56 F3 K18 VSS_100 VSS_145 T19 AB21 VSS_186 VSS_225 AL2
B1 VSS_13 VSS_57 F8 K20 VSS_101 VSS_146 T20 AB22 VSS_187 VSS_226 AL4
B4 VSS_14 VSS_58 F9 K23 VSS_102 VSS_147 T21 AB23 VSS_188 VSS_227 AL7
B7 VSS_15 VSS_59 F11 K24 VSS_103 VSS_148 T22 AC16 VSS_189 VSS_228 AL13
B10 VSS_16 VSS_60 F12 K27 VSS_104 VSS_149 T23 AC24 VSS_190 VSS_229 AL28
B12 VSS_17 VSS_61 F13 K28 VSS_105 VSS_150 U7 AD10 VSS_191 VSS_230 AL29
B13 VSS_18 VSS_62 F14 L6 VSS_106 VSS_151 U24 AD14 VSS_192
B14 VSS_19 VSS_63 F15 L24 VSS_107 VSS_152 V8
L29 VSS_108 VSS_153 V10

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER 9_SOC GNDOF
SHEET 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

10.PMU LDO
A
A
Output defaultcurrentTYP voltage function
LDO1 OFF 350 1.09 RFIC0_AVDD
U1001 LDO2 ON 900 1.8 PMU dig/RFIC/SOC1V8IO/LPDDR4X VDD/UFS VCCQ2
LDO3 OFF 200 1.8 RFIC0 AVDD2

C1002
200mA VBAT_SYS M6 VSYS OUT_PMUA N6 30mA VOUT_PMUA C1001 LDO4 OFF 200 1.8 LCD1V8 IO/TP1V8 IO
OUT_PMUD K6 30mA VOUT_PMUD C1003 LDO5 ON 500 1.8 PHY ANA/ABB_AVDD1V8
VPP L6
VCOIN U3 VCOIN C1023
OUT34 L5 150mA VOUT34_3V45 LDO8 OFF 140 1.8 CLASSD1V8
LDO9 OFF 50 1.8/2.95 SD IO

MISC1 Interface 1 of 4
OUT9 F6 50mA VOUT9_SD_IO C1028
OUT11 A2 50mA VOUT11_USIM0 C1012 LDO11 OFF 50 1.8 SIM0
OUT12 A3 50mA VOUT12_USIM1 C1014 LDO12 OFF 50 1.8 SIM1
D10 VIN_LDO_H1_1 OUT13 A10 150mA VOUT13_2V8 C1011 LDO13 OFF 150 2.85 S camera analog
D11 VIN_LDO_H1_2 OUT14 H7 70mA VOUT14_2V85 C1016 LDO14 OFF 70 2.85 RF FEM/AUXDAC
2.5A VBAT_SYS D7 VIN_LDO_H2_1 OUT15 A6 800mA VOUT15_2V95 C1034 LDO15 ON 800 2.95 EMMC/UFS VDD
C1051

E7 VIN_LDO_H2_2 OUT16 A7 800mA VOUT16_2V95 C1035 LDO16 OFF 800 2.95 SD card
OUT17 G6 100mA VOUT17_2V8 LDO17 OFF 100 2.8 LCD TP VCI
OUT19 A12 150mA VOUT19_2V8 C1036 LDO18 ON 350 1.8 fp/SENSOR IO FP AVDD/CON IO
OUT22 B11 150mA VOUT22_2V8 C1007 LDO19 OFF 300 2.8 M camera anlog
OUT23 B4 150mA VOUT23_3V2 C1018 LDO20 OFF 400 1.11 M Camera Core
OUT24 B7 200mA VOUT24_2V8 C1019 LDO21 OFF 180 1.8 Camera io
OUT25 A9 400mA VOUT25_2V85 C1020 LDO22 OFF 150 2.8 Back Camera Analog
OUT27 C9 30mA VOUT27_1V8 C1013 LDO23 ON 150 3.2 HKADC
OUT31 A5 300mA VOUT31_3V0 C1031 LDO24 ON 200 2.8 X Sensor AVDD
G7 50mA C1008 LDO25 OFF 400 2.85 Camera VCM
B OUT_PMUH
LDO26 ON 30 1.35 38.4_AVDD
2.5A VBUCK3_1V95 D13 G18 900mA VOUT2_1V8 C1038 LDO27 ON 50 1.8 HKADC
E14
VIN_LDO_1P95_1
VIN_LDO_1P95_2
OUT2
OUT3 B14 200mA VOUT3_1V8 LDO28 OFF 50 1.8 RF MIPI I/O B
F15 VIN_LDO_1P95_3 OUT4 C14 200mA VOUT4_1V8 C1041 LDO29 ON 140 1.8 UFS PHY/SYS CLK_BUF
OUT5 A15 500mA VOUT5_1V8 C1040 LDO30
OUT8 F18 140mA VOUT8_1V8 C1042 LDO31 OFF 300 3.0 Vibrator
OUT18 G16 350mA VOUT18_1V8 C1009 LDO32 OFF 400 1.11 S Camera Core
OUT21 C12 180mA VOUT21_1V8 C1043 LDO33 OFF 120 1.8 EFUSE
OUT26 B15 30mA C1044 LDO34 ON 150 3.45 CODEC RCV/MICBIAS
OUT28 E13 50mA VOUT28_1V8 C1029
OUT29 D18 140mA VOUT29_1V8 C1045
OUT33 F14 120mA VOUT33_1V8 C1010
OUT36 D14 10mA VOUT36_1V2 C1006
LDO_BUFF B18 30mA C1015

P5 VIN_LDO_1P2_1 OUT1 U5 350mA VOUT1_1V09

1A VBUCK2_1V2 P6 VIN_LDO_1P2_2 OUT20 R4 700mA VOUT20_1V05 C1050
OUT32 U4 400mA VOUT32_1V05 C1048

VBUCK1_1V12 P7 VIN_LDO_1P1 OUT0 U8 300mA VOUT0_0V8 C1046

750mA OUT6 U6 320mA VOUT6_0V9 C1047
OUT30 R7 100mA VOUT30_0V8 C1033

300mA VBUCK0_0V8 M5 VIN_LDO_0P8 OUT37 M4 400mA VOUT37_0V6 C1022

DR1_LED_RED1 T1 DR1 VREF B13 C1004

T2 DR2 VREF_RF A13 VREF_RF C1021
DR3_LED_RED T8 DR3 VREF_LDO1 U7 C1032
DR4_LED_GREEN U9 DR4 AGND K5
DR5_LED_BLUE R8 DR5 AGND_BUCK J6
VOUT2_1V8 H16 B5
C L7
VDD_IO
PGND_DR
AGND_LDO_H
AGND_LDO_L T6
SG1001 AGND_OSC B16 E16 VOUT3_1V8 C1027 SG1005
S
AGND_OSC AGND_LDO_1P95 S
C
G G

S S

G
SG1002 E12 G8 SG1007
S
AGND_COUL AGND_ADDA S
C1049

S S

G G

F13 C17 AGND_BUFF SG1006

AGND_REF AGND_BUFF S
VOUT1_1V09 C1039 S
SG1004

G
The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET
10_PMU LDOOF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

11.PMU BUCK/CODEC ËùÓÐBUCK LX0/1/2/3/4_FBÐźŲ»ÔÊÐí´Óµç¸ÐÏ·½´©Ïß

U1001
VBAT_SYS K1 PVDD0_1 LX0_1 J1LX0 L1101 3.5A VBUCK0_0V8
K2 PVDD0_2 LX0_2 J2
600mA J3
A LX0_3
C1127

G
S
A

C1104
H1 PGND0_1 SG1109
H2 PGND0_2 VO0_PULL H6 Current=1A,DCR=100mohm
PGND0 H3 PGND0_3 VO0_FB J5

C1103
N1 PVDD12_1 LX1_1 M1LX1 L1102 2.3A VBUCK1_1V12
N2 PVDD12_2 LX1_2 M2

C1133
800mA N3 PVDD12_3 LX1_3 M3 C1126

MISC2 Interface 2 of 4
L1 C1125

G
PGND1_1 S
L2 PGND1_2 SG1110
PGND1 L3 PGND1_3 VO1_FB K4

R1 PGND2_1 LX2_1 P1LX2 L1103 2A VBUCK2_1V2

PGND2 R2 PGND2_2 LX2_2 P2
C1130

C1124

G
S
SG1111
VO2_FB L4

D1 PVDD3_1 LX3_1 C1LX3 L1104 3A VBUCK3_1V95

1.5A D2 PVDD3_2 LX3_2 C2
D3 PVDD3_3 LX3_3 C3

B1 C1123

G
PGND3_1 S

C1134
B2 PGND3_2 SG1112
PGND3 B3 C5
B PGND3_3 VO3_FB
E1 F1LX4 L1105 2A VBUCK4_0V8
600mA E2
PVDD4_1
PVDD4_2
LX4_1
LX4_2 F2 B
C1122

G
S

C1135
G1 PGND4_1 SG1113
PGND4 G2 PGND4_2 VO4_FB E4

A1 DGND_1 DGND_21 R5
A18 DGND_2 DGND_22 R18
B6 DGND_3 DGND_23 T5
B17 DGND_4 DGND_24 U1
C15 DGND_5 DGND_25 U18
D16 DGND_6 DGND_26 L8
F3 DGND_7 DGND_27 M8
F16 DGND_8 DGND_28 E3
G4 DGND_9 DGND_29 E17
H5 DGND_10 DGND_30 G10
J10 DGND_11 DGND_31 H8
K3 DGND_12 DGND_32 H10
HS_FB_L K16 HS_FB_L MCLK_49M H15 SIF_CLK K8 DGND_13 DGND_33 J4
C1119 R1102 HS_L K17 HS_L SDATA_FLAG H13 SIF_SYNC K9 DGND_14 DGND_34 J8
VOUT_CLASSD
C1120 R1101 HS_R SIF_DI_0
HS_FB_R
K18
L15
HS_R
HS_FB_R
U1001 ADC_SDATA0
ADC_SDATA1
J15
J14 SIF_DI_1
K10
K13
DGND_15
DGND_16
DGND_35
DGND_36
L11
L13
DAC_SDATA J16 SIF_DO L9 DGND_17 DGND_37 N9
M9 DGND_18 DGND_38 P4
HS_DET P12 HSD PVDD_SPK R9 M13 DGND_19 DGND_39 P10

C1131
MISC4 Interface 4 of 4

MBHC_IN R17 MBHC_IN P3 DGND_20 DGND_40 T4

P11 SG1103
PGND_SPK S

G
EAR_P P17
C EAR_N N17
EAR_P
EAR_N
U15 VOUT34_3V45
AVDD_MIC
MICBIAS1 N14 MICBIAS1 C
SPK_P_CODEC T11 SPKOUT_P MICBIAS2 R13 C1116
SPK_N_CODEC T10 SPKOUT_N HS_MICBIAS N15 HS_MICBIAS
AGND_MIC T14
MAINMIC_P C1117 T15 MAINMIC_P
MAINMIC_N C1102 U16 MAINMIC_N
P16 VOUT34_3V45 PGND0

S
AVDD_TX S
AUXMIC_P C1109 N13 AUXMIC_P AGND_TX P15 SG1104
AUXMIC_N C1110 M14 PGND1

S
AUXMIC_N S

AVDD_RX U13 VOUT8_1V8 SG1105

R15 T13 PGND2

S
MIC3_P AGND_RX S
R14 MIC3_N SG1106
AVDD_HP L16 VBUCK3_1V95
HS_MIC_P T16 M17 PGND3

S
HSMIC_P AVDD_CP S
HS_MIC_N U17 HSMIC_N Source star route SG1107
C1107

C1115

C1111

N18 C1128 PGND4

S
FLY_P S
T17 LINEOUT_P FLY_N P18 SG1108
T18 LINEOUT_N
CPOUTN M18 C1112
C1118 AVREF U14 AVREF AVSS_HP L17 The type and specification of the components refer to the BOM
AGND_CP M15

D L17/M18 must separate collect to C1112 NA 2018-07-13

S ECA NO DATE D
S

DESIGNED XUMENG 00322542

G
SG1102

HL3JKMM 03025HSD_SCHZH
SG1101 REVIEWED
S
ZHANGYOUJUN 00258580
S

VER PART_NUMBER 11_PMU

SHEET BUCK_CODEC
OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6
HKADC·ÖÅä±í
12. PMU Digital HKADC_IN0
HKADC_IN1
APU Board ID0(RF USE)
APU Board ID1
HKADC_IN2
BOARD ID HKADC_IN3
APU Board ID2
RESERVERD
HKADC_IN4 PA TEMP DET0
VOUT27_1V8 HKADC_IN5 Charge TEMP
HKADC_IN6 USB_TEMP_ADC
HKADC_IN7
A HKADC_IN8
AP TEMP
USB_BOARD_ID

1%

1%

1%
CHG_REGN PMU_PWR_HOLD HKADC_IN9
VOUT_PMUD HKADC_IN10
RESERVERD
BATT TEMP A
HKADC_IN11 BATT ID

R1203
HKADC_IN12 USB_OTG_ADC

R1211

R1207
HKADC_IN13 RESERVERD
HKADC_IN0_PCB_ID0
1%

C1221
Main Board ID

R1202
DEBUG HKADC_IN1_PCB_ID1
U1001
R1215

C1222
HKADC_IN2_PCB_ID2
SOC_RST_PMU_N N12 HRESET_N SYS_RST_N J17 PMU_RST_OUT_N Mode R1203 R1210 R1211 R1209 R1207 R1208

1%

1%

1%
PMU_VBUS_SENSE T7 VBUS_SENSE 7690 JKM-AL00(6363)V1-V2 NC 0 150K NC 51K 100K
C1231

PWRON_N R3 PWRON_N PMU0_IRQ_N M11 GPIO_225_PMU0_IRQ_N

R1212

PMU_PWR_HOLD U2 PWR_HOLD 7698 JKM-AL00(6353)V2 20K 150K 150K NC 51K 100K

R1209
TP1205 PMU_PERI_EN B10 L10 GND

R1210

R1208
PERI_EN DFT_MODE
7680 JKM-AL00(6353)V3-V3.1 NC 0 20K 150K 51K 100K
VBATT_VD E11 G11 SRP

MISC3 Interface 3 of 4
C1220 VBAT_SENSE SRP
SRN F12 SRN 7691 JKM-TL00 V1-V3.1 150K 22K 150K NC 51K 100K
1%

7692 JKM-AL00a V1-V3.1 100K 30K 150K NC 51K 100K

HKADC_IN0 F8 HKADC_IN0_PCB_ID0
VOUT27_1V8 B8 ADC_REF HKADC_IN1 F10 HKADC_IN1_PCB_ID1 7693 JKM-TL10 V1-MP 200K 100K 150K NC 51K 100K
HKADC_IN2 K11 HKADC_IN2_PCB_ID2
HKADC_IN3 H9 7694 JKM-LX1 V1-V3 150K 121K 150K NC 51K 100K
HKADC_IN4 G9 HKADC_IN4_PA_TEMP_1
HKADC_IN5 J11 HKADC_IN5_CHG_TEMP 7695 JKM-LX2 V1-V3 121K 150K 150K NC 51K 100K
H11 HKADC_IN6_USB_TEMP
B HKADC_IN6
HKADC_IN7 J9 HKADC_IN7_AP_TEMP 7696 JKM-LX3 V1-V3 51K 100K 150K NC 51K 100K
B8 PINﾂﾋｲｨｹｲﾓﾃC1013 H4 HKADC_IN8_USB_BOARD_ID
HKADC_IN8
HKADC_IN9 D4 7697 JKM-L4A V1-MP 30K 100K 150K NC 51K 100K B
HKADC_IN10 F4 HKADC_IN10_BAT_TEMP
HKADC_IN11 D5 HKADC_IN11_BAT_ID 7699 JKM-LX1C V1-V3 150K NC 150K NC 51K 100K
HKADC_IN12 J7 HKADC_IN12_OTG
R1250:ﾈ郢鉸ﾞNFCｹｦﾄﾜ｣ｬﾐ靨ｪﾌ 10Kﾅｷﾄｷｵ釋 ｻ ﾕﾟﾖｱｽﾓｽﾓｵﾘ｡｣ HKADC_IN13 G5
XOADC_IN J12 XOADC_IN
R1222,R1216,R1221 only botong use guonei NC
C1205
XIN_38M4_PMU A17 XIN_38M4 CODEC_CLK_19M2 F17
XOUT_38M4_PMU A16 XOUT_38M4 SYS_CLK_19M2 E15 R1201 SYS_CLK_19M2 Mode R1203 R1210 R1211 R1209 R1207 R1208
TP1206 SYS_CLK_EN G15 SYS_CLK_EN RF_CLK_38M4 C16 RF0_CLK_38M4
T9 WIFI_CLK_EN ABB_CLK_38M4 D17 C1201 ABB_CLK_38M4 7685 JKM-AL00(6353)VN1-MP 121K 150K 20K 150K 51K 100K
NFC_CLK_REQ G13 NFC_CLK_EN WIFI_CLK_38M4 C18
R1250 E18 R1205 NFC_CLK_38M4 7686 JKM-TL00 VN1-MP 51K 100K 20K 150K 51K 100K
NFC_CLK_38M4
GPIO_206_SIM_SD_DET C11 SIM0_HPD CLK32_SYS N10 SYS_CLK_32K 7687 JKM-AL00a V3-MP 30K 100K 20K 150K 51K 100K
GPIO_206_SIM_SD_DET B12 M12 CLK32_BFGN CLK 32K,ﾇｰｶﾋｼﾓR｣ｬｺ ｶﾋｼﾓC｡｣
SIM1_HPD CLK32_BT
R1214 SPMI_DATA J18 PMU_DATA CLK32_GPS N11 C1230 7681 JKM-LX1 V3.1-MP 150K 22K 20K 150K 51K 100K
R1213 SPMI_CLK H18 SPMI_CLK
PMU_AUXDAC_SSI H14 AUXDAC_SSI AUXDAC0 D6 RF_AUXDAC0 C1230 near wifi/BT IC 7682 JKM-LX2 V3.1-MP 100K 30K 20K 150K 51K 100K
K14 XOADC_SSI SPMI_SSI_SEL T3
7683 JKM-LX3 V3.1-MP 200K 100K 20K 150K 51K 100K
G17 DGND_41 DGND_47 K12
P13 DGND_42 DGND_48 N16 7684 JKM-LX1C V3.1-MP 150K 121K 20K 150K 51K 100K
R12 P8
R6
DGND_43
DGND_44
DGND_49
DGND_50 F11 USB CON TEMP DET USB Board ID DET
T12 DGND_45 DGND_51 G12
L12 DGND_46 DGND_52 K7
VOUT27_1V8 VOUT27_1V8
C

1%

1%
Board ID Resistor Set Resistor Code
C

R1218
R1204
ID UP RES DOWN RES Value Code

VOUT27_1V8 HKADC_IN6_USB_TEMP HKADC_IN8_USB_BOARD_ID USB Board ID 0 NC 0K 0K 07090911

1 150K 22K 20K 07092448
R1223

R1218 Code Value 2 100K 30K 22K 07091172

JKM-AL00/TL00 07091406 200k 3 200K 100K 30K 07091299
JKM-LX1/LX2/LX3 07092138 150k 4 150K 121K 51K 07091302
JKM-LX1C 07091246 100k 5 121K 150K 100K 07091246
JKM-AL00a 07091408 68k 6 51K 100K 121K 07091176
Reserved 07091302 51k 7 30K 100K 150K 07092138
Reserved 07091299 30k 8 20K 150K 200K 07091406
1%

Reserved 07091172 22K 9 150K NC

Reserved TBD TBD
XOADC_IN
C1204

X1201
The type and specification of the components refer to the BOM

4 3 XOUT_38M4_PMU
D SENSOR/RT1 HOT/X_TAL/XT2 NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
XIN_38M4_PMU AGND_OSC
1 HOT/X_TAL/XT1 GND/RT2 2
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
12_PMU Digital 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

13.Hi6422
A L1305
A

2
L1306

2
VDD_CPU_B

L1307

2
U1301

VBAT_SYS D6 VSYS LX0_1 B4 VDD_GPU

LX0_2 B5
A5 IN0_1 LX0_3 B6
A6 IN0_2 LX1_1 H4
LX1_2 H5
C4 PGND0_1 LX1_3 H6
C5 PGND0_2 LX2_1 H1
L1308
C1302

C1314

C1309 C6 H2
B PGND0_3 LX2_2

2
LX2_3 H3
J5 B1 VDD_CPU_L
J6
IN1_1
IN1_2
LX3_1
LX3_2 B2 B
LX3_3 B3
G4 PGND1_1
C1301 G5 PGND1_2 VFB0_P D5 VDD_CPU_B_REMOTE
G6 PGND1_3 VFB0_N D4 VSS_CPU_B_REMOTE
VFB1_P F1 VDD_GPU_REMOTE
J1 IN2_1 VFB1_N F2 VSS_GPU_REMOTE
J2 IN2_2 VFB2_P E3 VDD_CPU_L_REMOTE
VFB2_N D3 VSS_CPU_L_REMOTE
G1 PGND2_1 C1320
C1306 G2 PGND2_2 PHASE_CTRL_SET1 J4 C1321
G3 PGND2_3 PHASE_CTRL_SET0 A3
SSI_CLK D1 PMU1_CLK_19M2
SSI_PMU1 D2 PMU1_SSI_DATA
A1 IN3_1
A2 J3 GPIO_149_PMU1_IRQ_N R1302 VOUT2_1V8
IN3_2 PMU1_IRQ_N

PMU1_EN A4 GPIO_177_PMU1_EN
C1305 C1 PGND3_1 VDD_IO E2 VOUT_PMUD TP1304
C2 PGND3_2 VPP E1
C3 PGND3_3
AGND1 E4
AGND2 E5
F6 VREF AGND3 F4
E6 IREF AGND4 F5

C1317
SGND F3
C1313

1%

SG1301

SG1305
C S S
C

S
R1301

G G
SG1306

S
S

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET
13_Hi6422 OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

14. UFS/eMMC/DDR A1
A2
A8
A9
NC1
NC2
NC3
NC4
NC55
NC56
NC57
NC58
H2
H3
H12
H13
POP LPDDR 4X
A10 NC5 NC59 H14
A11 NC6 NC60 J1
A A12
A13
NC7 NC61 J2
J3
V12
V14
VSS_154 VSS_193 AD17
AD18
NC8 NC62 VSS_155 VSS_194
A14
B1
NC9 NC63 J12
J13
V16
V19
VSS_156 VSS_195 AD19
AD20
A
NC10 NC64 VSS_157 VSS_196
B7
B8
B9
NC11
NC12
NC65
NC66
J14
K1
K2
V20
V21
V22
VSS_158
VSS_159
U300_POP VSS_197
VSS_198
AD21
AD22
AD23
NC13 NC67 VSS_160 VSS_199

GND3 interface 10 of 10
B10
B11
NC14
NC15
U1402 NC68
NC69
K3
K12
V23
W24
VSS_161
VSS_162
VSS_200
VSS_201
AE6
AE15
B12 NC16 NC70 K13 W29 VSS_163 VSS_202 AE24
B13 NC17 NC71 K14 Y1 VSS_164 VSS_203 AE29
B14 NC18 NC72 L1 Y2 VSS_165 VSS_204 AF8
C1 NC19 NC73 L2 Y8 VSS_166 VSS_205 AF10
C3 NC20 NC74 L3 Y10 VSS_167 VSS_206 AF11
C5 NC21 NC75 L12 Y12 VSS_168 VSS_207 AF13

NC Interface 2 of 2
C7 NC22 NC76 L13 Y14 VSS_169 VSS_208 AF14
C8 NC23 NC77 L14 Y16 VSS_170 VSS_209 AF16
C9 NC24 NC78 M1 Y18 VSS_171 VSS_210 AF17
C10 NC25 NC79 M2 Y19 VSS_172 VSS_211 AF23
C11 NC26 NC80 M3 Y20 VSS_173 VSS_212 AH21
C12 NC27 NC81 M7 Y21 VSS_174 VSS_213 AH29
C13 NC28 NC82 M8 Y22 VSS_175 VSS_214 AJ4
C14 NC29 NC83 M9 Y23 VSS_176 VSS_215 AJ19
D1 NC30 NC84 M10 AA24 VSS_177 VSS_216 AJ22
D2 NC31 NC85 M11 AB8 VSS_178 VSS_217 AK1
D3 NC32 NC86 M12 AB10 VSS_179 VSS_218 AK10
D4 NC33 NC87 M13 AB12 VSS_180 VSS_219 AK16
D12 NC34 NC88 M14 AB14 VSS_181 VSS_220 AK18
D13 NC35 NC89 N1 AB17 VSS_182 VSS_221 AK21
B D14
E1
NC36 NC90 N3
N6
AB18
AB19
VSS_183 VSS_222 AK24
AK29
NC37 NC91 VSS_184 VSS_223
E2
E3
NC38 NC92 N7
N8
AB20
AB21
VSS_185 VSS_224 AL1
AL2
B
NC39 NC93 VSS_186 VSS_225
E12 NC40 NC94 N9 AB22 VSS_187 VSS_226 AL4
E13 NC41 NC95 N10 AB23 VSS_188 VSS_227 AL7
E14 NC42 NC96 N11 AC16 VSS_189 VSS_228 AL13
F1 NC43 NC97 N12 AC24 VSS_190 VSS_229 AL28
F2 NC44 NC98 N13 AD10 VSS_191 VSS_230 AL29
F3 NC45 NC99 N14 AD14 VSS_192
F12 NC46 NC100 P1
F13 NC47 NC101 P2
F14 NC48 NC102 P8
G1 NC49 NC103 P9
G2 NC50 NC104 P11
TP1402 G12 NC51 NC105 P12
G13 NC52 NC106 P13
G14 NC53 NC107 P14
SOC_EMMC_DATA0 A3 DAT0 NC/RFU1 A7 H1 NC54
SOC_EMMC_DATA1 A4 DAT1 NC/RFU2 E5
SOC_EMMC_DATA2 A5 DAT2 NC/RFU3 G3
SOC_EMMC_DATA3 B2 DAT3 NC/RFU4 K6
VOUT2_1V8 SOC_EMMC_DATA4 B3
SOC_EMMC_DATA5 B4
DAT4 U1402 NC/RFU5 K7
P7
R1401

DAT5 NC/RFU6
SOC_EMMC_DATA6 B5 DAT6
SOC_EMMC_DATA7 B6 DAT7 NC/RFU/VSF1 E8
TP1401 G10
MISC Interface 1 of 2

NC/RFU/VSF2
SOC_EMMC_STRB H5 RCLK/DS NC/RFU/VSF3 P10

SOC_EMMC_CLK M6 CLK RFU/VSF1 E9 TP1405

RFU/VSF2 E10 TP1406
C SOC_EMMC_CMD M5 CMD RFU/VSF3 F10
K10
TP1403
TP1404
RFU/VSF4
PMU_RST_OUT_N K5 RST_N C
A6 VSS1 VCC/VDDF1 E6 VOUT15_2V95
C1401 1 2 E7 VSS2 VCC/VDDF2 F5
G5 VSS3 VCC/VDDF3 J10
H10 VSS4 VCC/VDDF4 K9
J5 VSS5
K8 VSS6 VCCQ/VDD1 C6 VOUT2_1V8
VCCQ/VDD2 M4 Attention
C4 VSSQ/VSS1 VCCQ/VDD3 N4
N2 VSSQ/VSS2 VCCQ/VDD4 P3
N5 VSSQ/VSS3 VCCQ/VDD5 P5
P4 VSSQ/VSS4
P6 VSSQ/VSS5 VDDI C2
C1402

C1408

C1404

C1407
C1406

C1405

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET14_eMMC/DDR
OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

15. Battery & Fuel guage

A
A
SG1501

G
S

SG1502

G
S

SG1503

G
Battery Connector S

SRN SG1504

G
S

VBATT_VD J1501

1%
S
SG1506
VBATT 1 P1 P2 2 VBATT
BATT_TS 3 P3 P4 4 BATT_ID

R1501
5 P5 P6 6
VBATT- 7 P7 P8 8 VBATT-
9 P9 P10 10 SG1505
SRP VBATT-

G
11 P11 P12 12 S

13 P13 P14 14
15 P15 P16 16

B CAD note:1.Trace for 6A

B
C1507

2.Differential trace
D1502

Battery ACR
VOUT2_1V8 R1521

U1520

VOUT27_1V8 VBATT- C1520 V_ACR_N B4 VN SCL D2 I2C6_SCL

VOUT27_1V8 VBATT C1521 V_ACR_P C4 VP SDA D3 I2C6_SDA

TP1501 A1 ANA_TEST OUT1 A2 C1522

1%

1% GPIO_148_ACR_EN B1 EN DFT_MODE D1

GPIO_205_ACR_INT D4 IRQ_N DGND C3

C
R1505

SG1521
R1506

VOUT2_1V8 C2 A4

G
VDD18 PGND S

VBATT A3 VBAT AGND B2 C

BATT_TS R1508 HKADC_IN10_BAT_TEMP BATT_ID R1507 HKADC_IN11_BAT_ID
C1 VPP

C1524

C1523
Battery Temperature Battery ID

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET
15_Battery
OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

16. Charge Management

A
A

VOUT27_1V8
1%

B
Charger IC
R1601

I2C address=1101011b(0x6B) B
HKADC_IN5_CHG_TEMP
place close to U1601
VCHG_USB_CON

L1601 VBAT_SYS
T

C1607

C1608

C1609
C1603
RT1601

U1601

1 19

1
VBUS SW1
24 NC SW2 20

D1601
CHG_PGND
C1604 23 PMID
BTST 21 SG1602
22 CHG_REGN C1610 CHG_PGND

G
REGN S

2
4 STAT
3 PG
PGND1 17
PGND2 18 CHG_PGND

R1607
I2C6_SDA 6 SDA
I2C6_SCL 5 SCL SYS1 15
GPIO_221_CHG_INT_N 7 INT SYS2 16
8 OTG/IUSB
GPIO_189_CHARGER_EN 9 CE
BAT1 13 VBATT
14
C BAT2
10 R1609
CHG_REGN 2 PSEL
ILIM
I=355AR/681R=0.52A for RT9466
C

C1611
TS 11
CHG_PGND 25 SINK QON 12

R1610
SG1601
CHG_PGND
S

S
SG1603
S

SG1604
The type and specification of the components refer to the BOM
S

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
16_Scharger 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

17. LCD and TP INTERFACE

A
A
R1710

J1701 DSI0_DATA2_N DSI0_DATA2_N_BTB

4* 3
LCD_VSN 1 P1 P2 2 DSI0_DATA2_P_BTB T1705
3 P3 P4 4 DSI0_DATA2_N_BTB DSI0_DATA2_P 1* 2 DSI0_DATA2_P_BTB
LCD_VSP 5 P5 P6 6
GPIO_036_LCD_ID0 7 P7 P8 8 DSI0_DATA1_P_BTB R1711
VOUT4_1V8 9 P9 P10 10 DSI0_DATA1_N_BTB
GPIO_037_LCD_ID1 11 P11 P12 12
GPIO_039_LCD_RST_N 13 P13 P14 14 DSI0_CLK_P_BTB
VOUT4_1V8
GPIO_015_LCD_TE0 15 P15 P16 16 DSI0_CLK_N_BTB
GPIO_185_LCD_CABC_PWM 17 P17 P18 18
R1713 GPIO_210_TP_INT_N 19 P19 P20 20 DSI0_DATA0_P_BTB R1704
TP_SPI1_MOSI 21 P21 P22 22 DSI0_DATA0_N_BTB
TP_SPI1_MISO 23 P23 P24 24 DSI0_DATA1_N DSI0_DATA1_N_BTB
TP_SPI1_CLK 25 P25 P26 26 DSI0_DATA3_P_BTB 4 3
TP_SPI1_CS 27 28 DSI0_DATA3_N_BTB T1702*
P27 P28
GPIO_040_TP_RST_N 29 P29 P30 30 DSI0_DATA1_P 1* 2 DSI0_DATA1_P_BTB
LED1- 31 P31 P32 32 LED3-
LED2- 33 P33 P34 34 LEDA_BTB 1 2 LED+ R1703

35 S1 S2 36
LB1715
37 S3 S4 38

C1767
C1702

C1761

C1763

R1709
C1762

C1764

C1765

C1774

C1775

C1771

C1769
DSI0_CLK_N 4 DSI0_CLK_N_BTB B
3
T1701*
*
DSI0_CLK_P 1 DSI0_CLK_P_BTB
2
R1708

LCD_VSN

ﾗ鮠 ｻｯok
LCD_VSP

R1707
LCD POS/NEG Voltage Driver DSI0_DATA0_N DSI0_DATA0_N_BTB
4 3
T1703*

C1772

C1773
L1702 DSI0_DATA0_P 1* 2 DSI0_DATA0_P_BTB

R1712
U1702
VBAT_SYS C1 VIN SW D1

GPIO_035_LCD_VSP_EN B1 ENP REG1 D3 C1706

GPIO_045_LCD_VSN_EN A1 ENN REG2 E2 R1706

I2C3_SCL B2 SCL OUTP E3 LCD_VSP DSI0_DATA3_N DSI0_DATA3_N_BTB

I2C3_SDA C2 SDA OUTN A2 LCD_VSN 4 3
T1704 *
B3 C3 DSI0_DATA3_P 1* 2 DSI0_DATA3_P_BTB
C E1
PGND1
PGND2
CFLY1
CFLY2 A3
SG1701

R1705
D2 C
C1705

AGND
For 3P6S, R1715/1716 can DNI when 2P9S
C1707

C1708

C1709

LED1-
S

R1715
S

G
LED2-

R1716
VBAT_SYS
LCD BL DRIVER LED3-
1

D1701
LED+
L1703
C1716

L1701

2 1
R1718

The type and specification of the components refer to the BOM

2

1
R1714

U1701
D NA 2018-07-13
C1701
R1702

C2 C3
C1704

VIN SW
A2 LED2-
ECA NO DATE D
GPIO_209_LCD_BL_EN C1
IFB2
A3 LED1-
CAP tolerance above 50V
EN IFB1 DESIGNED XUMENG 00322542
GPIO_186_LCD_BL_PWM B1 A1 R1701
PWM ISET 2P9S 3P6S HL3JKMM 03025HSD_SCHZH
C1720

R1715 DNI R1715

C1727 B2 B3 REVIEWED
COMP GND R1716 DNI R1716 ZHANGYOUJUN 00258580
R1717 07091300 07091299
R1701 07091405 07091250 VER PART_NUMBER SHEET 17_LCDOF 60
R1717

L1701 SMT SMT

R1718 DNI DNI
E 03025HSD HUAWEI TECH CO.,LTD.
1 2 3 4 5 6
 1 2 3 4 5 6

18. Flash/front Camera

A 16M Sensor
A
Front SUB Camera R1816

Max Mated High=0.8mm CSI1_CLK_P 2 1 SCAM0_CLKP

16M Sub CAM T1807
*
*
CSI1_CLK_N 3 4 SCAM0_CLKN
J1801
R1821
25 S1 S2 26
R1814
AGND 1 P1 P2 2 AVDD VOUT13_2V8
XVS 3 P3 P4 4 DGND CSI1_DATA0_P 2 1 SCAM0_D0P
DGND 5 P5 P6 6 MCLK SCAM0_ISP_CLK1 *
SCAM0_D1N DATA1_N 7 P7 P8 8 DGND T1806 *
SCAM0_D1P DATA1_P 9 P9 P10 10 DATA3_N SCAM0_D3N CSI1_DATA0_N 3 4 SCAM0_D0N
SCAM0_CLKN CLK_N 11 P11 P12 12 DATA3_P SCAM0_D3P
SCAM0_CLKP CLK_P 13 P13 P14 14 DATA2_N SCAM0_D2N R1815
SCAM0_D0N DATA0_N 15 P15 P16 16 DATA2_P SCAM0_D2P
SCAM0_D0P DATA0_P 17 P17 P18 18 DGND R1812
DGND 19 P19 P20 20 RESET GPIO_031_SCAM0_RST_N
SCAM0_ISP_SDA1 SDA 21 P21 P22 22 DVDD VOUT32_1V05 CSI1_DATA1_P 2 1 SCAM0_D1P
SCAM0_ISP_SCL1 SCL 23 P23 P24 24 VDDIO VOUT21_1V8 *
T1805 *
27 S3 S4 28 CSI1_DATA1_N 3 4 SCAM0_D1N
B R1813

R1808 B
C1863

C1864

C1810

C1862

C1861

C1860

C1809

C1865

C1867
CSI1_DATA2_N 3
4 SCAM0_D2N
S
*
S

SG1802 T1804
*
CSI1_DATA2_P 2 1 SCAM0_D2P

R1811

R1806
2M Slave CAM CSI1_DATA3_N 3 4 SCAM0_D3N
*
J1802 T1803
*
CSI1_DATA3_P 2 SCAM0_D3P
25 S1 S2 26 1
R1807
AGND 1 2 GND
P1 P2
VOUT22_2V8 AVDD 3 4 MCLK R1801 MCAM1_ISP_CLK2
P3 P4
GND 5 6 GND
P5 P6
VOUT21_1V8 DOVDD 7 8 CLKN CSI2_CLK_N
P7 P8
DVDD 9 10 CLKP CSI2_CLK_P
P9 P10
ﾓﾃ1102ｵﾄｻｰﾓﾃGPIO028 GPIO_028_SCAM1_VCM_PWDN PWDN 11 12 GND
P11 P12
GPIO_220_SCAM1_RST_N RST 13 14 D0N CSI2_DATA0_N
P13 P14
STROBE 15 16 D0P CSI2_DATA0_P
P15 P16
ID 17 18 GND
P17 P18 D1N
MCAM1_ISP_SDA2 SDA 19 20
P19 P20 D1P
MCAM1_ISP_SCL2 SCL 21 22
P21 P22
VPP 23 24 GND
C P23 P24
C1872

27 28
S3 S4
C
C1868

C1869

C1870

C1871

C1804

C1813

S
S
SG1801

U1801
LED1801
B3 IN OUT A1 C1830
VBAT_SYS L1801 A2 SW The type and specification of the components refer to the BOM
LED B1 2 1
GPIO_180_FLASH_STROBE B2 STROBE 3
RF_GPIO01_FLASH_MASK C1 TX/TORCH GND A3
I2C3_SDA C2
D I2C3_SCL C3
SDA NA 2018-07-13
C1832

SCL
ECA NO DATE D
C1866

DESIGNED XUMENG 00322542

HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER 18_Flash/Front
SHEET OF Camera
60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

19. Main Camera

13M MAIN 2306XXXX
A
J1901
S
SG1902 ACTGND 2 P2 P1 1 ACTVDD VOUT25_2V85 R1909 A

S
DGND 4 P4 P3 3 PWDN_VCM
MCAM0_ISP_CLK0 MCLK 6 5 SCL MCAM0_ISP_SCL0 CSI0_CLK_P MCAM0_CSI0_CLKP_BTB
P6 P5
DGND 2 1
FLASH 8 P8 P7 7 *
DGND 10 9 DATA1_N MCAM0_CSI0_D1N_BTB T1961 *
P10 P9
MCAM0_CSI0_D3N_BTB DATA3_N 12 11 DATA1_P MCAM0_CSI0_D1P_BTB CSI0_CLK_N MCAM0_CSI0_CLKN_BTB
P12 P11
DGND 3 4
MCAM0_CSI0_D3P_BTB DATA3_P 14 P14 P13 13
DGND 16 15 CLK_N MCAM0_CSI0_CLKN_BTB R1912
P16 P15
CLK_P 2 1
MODULE_ID18 P18 P17 17 MCAM0_CSI0_CLKP_BTB
DGND 20 19 DGND R1907
P20 P19
DATA0_N 2 1
MCAM0_CSI0_D2N_BTB DATA2_N 22 P22 P21 21 MCAM0_CSI0_D0N_BTB
MCAM0_CSI0_D2P_BTB DATA2_P 24 23 DATA0_P MCAM0_CSI0_D0P_BTB CSI0_DATA0_P 2 1 MCAM0_CSI0_D0P_BTB
P24 P23
DGND 26 25 DGND *
P26 P25
GPIO_032_MCAM0_RST_N RESET 28 27 SDA MCAM0_ISP_SDA0 T1962 *
P28 P27
VOUT20_1V05 DVDD_1V2 30 29 VPP CSI0_DATA0_N 3 4 MCAM0_CSI0_D0N_BTB
P30 P29
VOUT21_1V8 DOVDD 32 31 DGND
P32 P31
VOUT19_2V8 AVDD 34 33 AGND R1908
P34 P33
36 S2 S1 35
2 R1905
1
38 S4 S3 37

C1961

C1972

C1971
CSI0_DATA1_P 2 1 MCAM0_CSI0_D1P_BTB
*
C1915

C1973

C1964

C1910

C1963

T1963 *
CSI0_DATA1_N 3 4 MCAM0_CSI0_D1N_BTB

2 R1906
1
B 2 R1903
1
S
B
G

SG1901 CSI0_DATA2_N 3 4 MCAM0_CSI0_D2N_BTB

*
T1964
*
CSI0_DATA2_P 2 1 MCAM0_CSI0_D2P_BTB
MCAM1_ISP_SCL2 R1917
MCAM1_ISP_SDA2 R1918 2 R1904
1
MCAM0_ISP_SCL0 R1910 VOUT21_1V8 2 R1901
1
MCAM0_ISP_SDA0 R1911
CSI0_DATA3_N 3 4 MCAM0_CSI0_D3N_BTB
SCAM0_ISP_SCL1 R1931
2M MAIN 2306XXXX SCAM0_ISP_SDA1 R1930
CSI0_DATA3_P
T1965 *
*
MCAM0_CSI0_D3P_BTB
2 1
R1902
Max Mated High=0.8mm J1902
2 1
25 S1 S2 26

AGND 1 P1 P2 2 DGND
VOUT22_2V8 AVDD 3 P3 P4 4 MCLK MCAM1_ISP_CLK2
DGND 5 P5 P6 6 DGND
VOUT21_1V8 DOVDD 7 P7 P8 8 CLK_N CSI2_CLK_N
ﾈ郢鈹ｹﾓﾃ1102 ﾓﾃGPIO027 DVDD 9 P9 P10 10 CLK_P CSI2_CLK_P
GPIO_027_MCAM1_VCM_PWDN PWDN 11 P11 P12 12 DGND
GPIO_012_MCAM1_RST_N RESET 13 P13 P14 14 DATA0_N CSI2_DATA0_N
PWSEQ_ID 15 P15 P16 16 DATA0_P CSI2_DATA0_P
MODULE_ID17 P17 P18 18 DGND
SCAM0_ISP_SDA1 SDA 19 P19 P20 20 DATA1_N
SCAM0_ISP_SCL1 SCL 21 22 DATA1_P
C VPP 23
P21
P23
P22
P24 24 DGND

27 S3 S4 28 C
C1967
C1914

C1975

C1974

C1966

C1969

C1901

S
S

SG1903

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET
19_Main Camera
OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

20. USB
A
A

VOUT2_1V8

R2003
SOC_USB_DN R2004 USB_DN C2001
B SOC_USB_DP R2005 USB_DP
USB_ID R2002 GPIO_184_USB_OTG_INT_N
B
2

2
R2001 HKADC_IN12_OTG
D2001

D2002
1

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542

HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET20_USB OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

21. Main FPC

A
A

Main FPC BTB

J2101
VCHG_USB_CON 2 P2 P1 1
4 P4 P3 3
6 P6 P5 5
8 P8 P7 7 SPK_OUT_P
SPK_OUT_N 10 P10 P9 9
12 P12 P11 11 USB_DN
HKADC_IN6_USB_TEMP 14 P14 P13 13 USB_DP
GPIO_014_VBUS_MOS_CTRL 16 P16 P15 15
VOUT28_1V8 18 P18 P17 17 USB_ID
20 P20 P19 19
FE1_MIPI_CLK 22 P22 P21 21 HKADC_IN8_USB_BOARD_ID
FE1_MIPI_DATA 24 23 VOUT14_2V85
B 26
P24
P26
P23
P25 25 ANT_OUTB
MAINMIC_P 28 27 VOUT31_3V0
MAINMIC_N 30
P28
P30
P27
P29 29 B
MICBIAS1 32 P32 P31 31 HS_DET_CONN
HS_L_CONN 34 P34 P33 33 MBHC_IN
HS_FB_L_CON 36 P36 P35 35 AGND_MIC
HS_FB_R_CON 38 P38 P37 37
HS_R_CONN 40 P40 P39 39 FM_IN_SMB

42 S2 S1 41
44 S4 S3 43

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
21_Main FPC 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

22. NC
A
A

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 22_NCOF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

23. NC
A
A

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 23_NCOF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

24. SPK
A
A
SPK_P_CODEC LB24011 2 SPK_OUT_P

SPK_N_CODEC LB24021 2 SPK_OUT_N

C2401

C2402
B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 24_SPK
OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

RCV
A
25. MIC/RCV
Second MIC A
J2501
LB2501 MIC2501
EAR_P L2501 EAR_P_RCV_BTB 1 P1
MICBIAS1 1 2 1 VDD
AUXMIC_P LB25021 2 2 OUT
AUXMIC_N R2502 LB25031 2 3 GND
J2502

C2502
4 M1
EAR_N L2502 EAR_N_RCV_BTB 1 P1

2
R2503

C2509

C2510
C2501

C2506

R2501
C2512

D2501

D2502
C2525

C2526

1
CAD note: 1,MIC need differential trace
2, MIC GND pad need use cycle via to GND net.
B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542

HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET
25_MIC/RCVOF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

26. Headphone
A
A

FM_RF_IN L2601 C2617 C2618 FM_IN_SMB

M G R L
default

L2602
SG2602
LB2601 C2611

G
S

CLOSE TO 1102
HS_FB_L_CON 1 2 HS_FB_L

HS_FB_R_CON SG2601
LB2602 C2608

G
S

1 2 HS_FB_R
FM_IN_SMB LB2606
B HS_R_CONN 1 2 R2604 HS_R
HS_L_CONN
HS_DET_CONN B

C2607
C2620
SG2603

S S

G G
S

S
AGND_MIC C2621

C2606
SG2604

LB26051 2 R2603 HS_L

R2609 VOUT18_1V8

R2610 HS_DET

R2602 HS_MICBIAS

C2604
C2603

C MBHC_IN
C
C2605 HS_MIC_N
D2604

R2601

C2602 HS_MIC_P
C2601

C2619

The type and specification of the components refer to the BOM

SG2605

S
D NA 2018-07-13
S

G ECA NO DATE D
GND DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF 60
26_Headphone

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

27. X-Sensor
A
A

FingerPrint ZIF
U2705

2 NC/BYP J2702
INT1 11 GPIO_146_AG_INT 11S1 S212
I2C0_SCL 4 SCL/SPC/SCLK INT2 9
FP_SPI2_CS0 1P1 P22 GPIO_145_FP_INT
I2C0_SDA 6 SDA/SDI/SDO/SDIO ADC1/GND/NC 16 VOUT24_2V8 3P3 P44 VOUT18_1V8
ADC2/RESERVED/NC 15 5P5 P66 FP_SPI2_MISO
7 SDO/SA0/ALT_ADDRESS ADC3/GND/NC/TRIG 13 FP_SPI2_MOSI 7P7 P88 GPIO_038_FP_RST_N
ADDR 9P9 P1010 FP_SPI2_CLK
VOUT18_1V8 8 CS/CS/NC RES/GND/NC 10
13S3 S414
VOUT24_2V8 GND 12

B 1 VDD_IO GND/NC 5

C2734

C2766

C2708

C2768

C2769
14 VDD/VS NC 3

C2762

C2764
C2715

PROXIMITY&RGB AMBIENT Sensor

Compass
J2703
J2704 ﾗ鮠 ｻｯok
I2C0_SDA 1 P1 P1 1 VOUT24_2V8
U2703
1 P1 P1 1
I2C0_SCL VOUT24_2V8 A2 CAD VDD A1 VOUT24_2V8

J2705 A3 TST VID C1 VOUT18_1V8

J2706
C2702

C2701

VOUT18_1V8 C2 RSTN VSS B1

C2703

C2705

C I2C0_SDA C3 SDA
I2C0_SCL B3 SCL
C

C2767

C2772
U2702

Accelerometer and Gyroscope 6-AXIS SENSOR A2 SCL VDD B1

B2 SDA VSS A1
GND
U2701
TP2701
VDDIO 5 VOUT18_1V8
GPIO_146_AG_INT 4 INT1
9 INT2 VDD 8
I2C0_SDA 14 SDX/SDI/SDA OCSB/N/A/OCS 10
The type and specification of the components refer to the BOM
C2719

1 SDO/DNC/GND/SA0 OSDO/N/A/NC 11
I2C0_SCL 13 SCX/SCK/SCL ASDX/N/A/SDX 2
D VOUT18_1V8 12 CSB/DNC/CS ASCX/N/A/SCX 3
NA 2018-07-13
ECA NO DATE D
GNDIO/GND1 6
GND XUMENG 00322542
GND2 7 DESIGNED
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
27_X-Sensor 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

A
28.SIM/uSD Card NFC_SIM0_VDD_OUT 1
2
J2801

VCC_1
VCC_2
C2801 3 VCC_3
SIM0_RST_N R2807 SIM0_RST_N_R 4 RST_1
A
5 RST_2
6 RST_3
SIM0_CLK R2805 SIM0_CLK_R 7 CLK_1
8
9
CLK_2
CLK_3 SIM0
10 GND_1
11 GND_2
NFC_SWIO_SIM0 12 GND_3
13 VPP_1
NFC_SIM0_VDD_OUTR2802 14 VPP_2
15 VPP_3
SIM0_DATA R2806 SIM0_DATA_R 16 I/O_1
17 I/O_2
18 I/O_3

J2802

NFC_SIM1_VDD_OUT 1 VCC_1
2 VCC_2
C2833 3 VCC_3
B SIM1_RST_N R2810 SIM1_RST_N_R 4 RST_1
5
6
RST_2
RST_3
B
SIM1_CLK R2808 SIM1_CLK_R 7 CLK_1
8 CLK_2
9 CLK_3

J2804 NFC_SWIO_SIM1
10
11
12
GND_1
GND_2
SIM1
GND_3
1
13 VPP_1
14 VPP_2
NFC_SIM1_VDD_OUTR2801 15 VPP_3
SIM1_DATA R2809 SIM1_DATA_R16 I/O_1
17 I/O_2
18 I/O_3
J2803

Holder SDC_DATA2
1
9
DAT2_1
DAT2_2
F2801 2 CD/DAT3_1
SDC_DATA3 10 CD/DAT3_2
1 GND1 VOUT9_SD_IO R2811
2 GND2 3 CMD_1
3 GND3 SDC_CMD 11 CMD_2
4
C 5
GND4
GND5 4 VDD_1
6 VOUT16_2V95 12
7
GND6
GND7 C2830
VDD_2
C
8 5
9
10
GND8
GND9
GND10
SDC_CLK 13
CLK_1
CLK_2 Micro SD
11 GND11 C2805 6 VSS_1
12 GND12 14 VSS_2
13 GND13
7 DAT0_1
GPIO_206_SIM_SD_DET 14 DETECT_SWITCH_VCC SDC_DATA0 15 DAT0_2
15 M1 8 DAT1_1
SDC_DATA1 16 DAT1_2
C2835

Note: Pin14 is SW

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 28_SIM
OFSDcard
60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

29. LED/Key
A
A

RGB LED
DR1_LED_RED1 SG2901
B KEY BTB
S

S
LED2901
B
DR3_LED_RED 1 RED

DR4_LED_GREEN 2 GREEN A
4 VBAT_SYS
J2902 J2903
DR5_LED_BLUE 3 BLUE
KEY_DOWN_BTB 1 P1 P1 1 KEY_UP_BTB

C2964
J2905 J2904

C2961

C2962

C2963
1 P1 P1 1 KEY_POWER_BTB

KEY_UP_BTB R2911 GPIO_144_KEY_UP

KEY_POWER_BTB R2909 PWRON_N
KEY_DOWN_BTB R2910 GPIO_231_KEY_DOWN

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542

HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
29_LED/Key 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

30. Test Points/Shields

Shielding
A
CBT/PT BOOT MODE J3001 J3004
A
HSHIELD1-0404F HSHIELD1-3127F
P1 1 P1 1
TCXO Shielding
PMU shielding
TP3018
VBATT must route to D1502 BOOT_MODE R3001
TP3011 J3002 J3005
1
HSHIELD1-2631A HSHIELD1-1407C
P1 1 P1 1
SOC Shielding
VBATT TP3012 LCD IC Shielding
1
TP3017
1 J3003 J3006
TP3001
1 HSHIELD1-1926A HSHIELD1-3309A
WIFI_TEST 1 1
TP3064 RF Shielding P1 Charger Shielding P1
VCHG_USB_CON
TP3002

USB_ID 1
TP3005

USB_DP TP3003

USB_DN TP3004
B
HOLE B

M3001 M3003 M3005 M3007 M3009

HOLE67 HOLE67 HOLE67 HOLE67 HOLE63

M3002 M3004 M3006

HOLE67 HOLE67 HOLE67

BATT_TS 1 TP3013

1
TP3007 MARK POINT

FUNCTION TEST
ID3001 ID3002 ID3003

C LCD BL MICBIAS GND ID-BOARDA ID-BOARDA ID-BOARDA

LEDA_BTB 1
TP3008
ID3004 ID3005 ID3006 C
ID-BOARDA ID-BOARDA ID-BOARDA

TP3006

HEADPHONE KEY SPK

KEY_POWER_BTB1 TP3035
KEY_DOWN_BTB 1 TP3033
KEY_UP_BTB 1
TP3032 The type and specification of the components refer to the BOM

D TYPE CC VIBRATOR RCV NA 2018-07-13

ECA NO DATE D
DESIGNED XUMENG 00322542

HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEETPoints/Shields
30_Test OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

31.RF Interface
A
RFIC IQ POWER NC Interface A
CH0_RXA_I VBAT_SYS VOUT18_1V8
CH0_RXA_Q VBATT
CH1_RXA_I
CH1_RXA_Q VOUT2_1V8
VOUT3_1V8 BTFM_I2S2_CLK
VOUT1_1V09 BTFM_I2S2_MOSI
VREF_RF BTFM_I2S2_MISO
CH0_RXB_I BTFM_I2S2_SYNC
CH0_RXB_Q VOUT14_2V85
CH1_RXB_I VOUT28_1V8
CH1_RXB_Q GPIO_229_BFGN_WAKEUP_AP
VOUT27_1V8 HI1102_UART4_RTS_N
HI1102_UART4_CTS_N
VOUT23_3V2
HI1102_UART4_TX
CH0_TX_I_P HI1102_UART4_RX
CH0_TX_I_N CDMA_GPS_SYNC
CH0_TX_Q_P
CH0_TX_Q_N LTE_INACTIVE
CH0_MRX_I AP_GPS_REF_CLK
CH0_MRX_Q LTE_TX_ACTIVE
GPIO_030_Hi1102_PWRON
CLK32_BFGN
GPIO_211_WIFI_WAKEUP_AP

B
WL_SDIO_CLK
WL_SDIO_CMD
B
GPIO Interface MIPI Interface WL_SDIO_DATA0
WL_SDIO_DATA1
WL_SDIO_DATA2
RF_GPIO04_APT_EN RFIC0_MIPI_CLK
APT WL_SDIO_DATA3
RF_GPIO05_CHO_APT_PDM RFIC0_MIPI_DATA
RF_GPIO06_APT_BP
FE0_MIPI_CLK
RF_GPIO07_DPDT FE0_MIPI_DATA
DPDT
FE1_MIPI_CLK
FE1_MIPI_DATA

GPIO_207_ANT_DET_0
ANT_DETECT

ANT Interface GSM

RF_AUXDAC0

RF_GPIO20_SPDT_B1/B3 GMSK_PH0
RF_GPIO21_SPDT_B7
ANT_OUTB
C
C
CLK HKADC
RF0_CLK_38M4 HKADC_IN4_PA_TEMP_1

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 31 Interface
OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

32 APT_LM3243
A
A

C3205
U3201
TP3202
SW1 A2 L3251 RF_DCDC_MMBPA/TXM
RF_GPIO04_APT_EN C2 EN SW2 B2

RF_GPIO06_APT_BP C3 D4 C3201 C3208 C3209

BP FB D3200
B D3 MODE ACB1 A4
B4
RF_GPIO05_CHO_APT_PDM R3281 D2 VCON
ACB2
B
PGND1 A1
PGND2 B1
C3204 VBATT A3 PVIN1
B3 PVIN2 SGND C1
C3203C3202
D1 VDD BGND C4

SG3201
S

S
G

1.DCDCｵ酊ｷﾎｪPAｷﾀｻ､ｹ鰓ｻｻｯｵ酊ｷｵﾄﾗ魑ﾉｲｿｷﾖ
C 2.ｲｼﾏﾟﾊｱﾏﾈｾｭｹ ﾎﾈﾑｹｹﾜD3200｣ｬﾔﾙﾐﾇﾐﾍﾗﾟﾏﾟｸ PAｺﾍTXMｹｩｵ
3.ｲｼﾏﾟﾊｱｿｼﾂﾇﾏﾟｿ惞ｬDCDCｸ GSMｹｩｵ醋ｱ｣ｬﾐ雎｣ﾖ､ﾍｨﾁ ｴ ｵｽ3A C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 32 APT0
OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

33.RFIC0_Hi6353

C3305

C3313

C3317

C3323
A ｱ狡 ｣ｺ39200865 VOUT1_1V09
A4 F5
GND1 VDD_1P0_ANA_RX1
A

C3304
A8 GND2 VDD_1P0_ANA_RX2 A12 C3329
RX_1A_I D7 CH0_RXA_I A16 GND3 VDD_1P0_ANA_RXA A2
LB_DRX_LNA_OUT F15 C6 CH0_RXA_Q B3 A14 C3320
RXB_LB1 RX_1A_Q GND4 VDD_1P0_ANA_RXB
MHB1_DRX_LNA_OUT E16 RXB_HB1 RX_2A_I B5 CH1_RXA_I C4 GND5 VDD_1P0_ANA_RXPLL E10
MHB2_DRX_LNA_OUT C16 A6 CH1_RXA_Q C8 N12 C3322
RXB_HB2 RX_2A_Q GND6 VDD_1P0_ANA_TX
MHB3_DRX_Lis_LNA_OUT B15 C12 J14
RXB_HB3
C10 CH0_RXB_I C14
GND7 U3301 VDD_1P0_ANA_TXPLL
J16 C3319
U3301 RX_1B_I
D9 CH0_RXB_Q D1
GND8 VDD_1P0_FREF
RX_1B_Q GND9
LB_PRX_LNA_OUT B1 RXA_LB1 RX_2B_I A10 CH1_RXB_I D3 GND10
MHB1_PRX_LNA_OUT C2 B11 CH1_RXB_Q D11 H1 C3316
RXA_HB1 RX_2B_Q GND11 VDD_1P8_ANA_RXA
MHB2_PRX_LNA_OUT E2 RXA_HB2 D13 GND12 VDD_1P8_ANA_RXB B13 C3318
MHB3_PRX_Lis_LNA_OUT F1 M3 CH0_TX_I_P D15 M11 C3314
RXA_HB3 TX1_I_P GND13 VDD_1P8_ANA_TX
TX1_I_N K3 CH0_TX_I_N E4 GND14 VDD_1P8_ANA_TXIF J2 C3312

C3330

C3332
TX1_Q_P H3 CH0_TX_Q_P E8 GND15 VDD_1P8_IO H13 VOUT3_1V8
J4 CH0_TX_Q_N E14 VOUT2_1V8

MISC1 Interface 1 of 2
TX1_Q_N GND16
F3

C3303
GND17

C3315
MRX_IF_I J6 CH0_MRX_I F7 GND18 GND33 K11
H5 CH0_MRX_Q F9 K13

MISC2 Interface 2 of 2
MRX_IF_Q GND19 GND34
F13 GND20 GND35 K15
LB1_TX1_RFIC0_OUT N10 TX1_LB1 RFFE_CLK G12 RFIC0_MIPI_CLK G2 GND21 GND36 L2
LB2_TX1_RFIC0_OUT M9 TX1_LB2 RFFE_DATA H11 RFIC0_MIPI_DATA G4 GND22 GND37 L4
N8 TX1_LB3 CHIP_ID F11 G6 GND23 GND38 L6
HB1_TX1_RFIC0_OUT M7 TX1_HB1 TX_GMSK_DATA J12 GMSK_PH0 G8 GND24 GND39 L8
HB2_TX1_RFIC0_OUT N6 TX1_HB2 FREF_IN L16 L3353 C3328 RF0_CLK_38M4 G10 GND25 GND40 L10
HB3_TX1_RFIC0_OUT M5 TX1_HB3 REXT K1 R3382 G14 GND26 GND41 L12
REF_V E12 R3381 VREF_RF G16 GND27 GND42 L14
R3382 Need 37.4K , and 1% H15 M13
B GND28 GND43

C3327
PLLTEST_P E6 J8 GND29 GND44 M15

C3302
D5 J10 N4
EXT_CPL_TO_RFIC0_MRX1 K9 MRX_1
PLLTEST_M
ANATEST1 M1 K5
GND30
GND31
GND45
GND46 N14 B
ﾈ郢鉎ｰｶﾋﾓﾐﾖｱﾁ ｣ｬﾐ靨ｪｸ ﾖｱ ANATEST2 N2 K7 GND32 GND47 N16

GSM_LB_TX_PA_IN L3352 L3357 LB1_TX1_RFIC0_OUT LB_TX_PA_IN L3356 LB2_TX1_RFIC0_OUT

C3307

C3308

C3310

C C3309

C
GSM_HB_TX_PA_IN L3351 HB3_TX1_RFIC0_OUT MB_TX_PA_IN L3354 HB2_TX1_RFIC0_OUT
C3306

C3301

C3325

C3324

HB_TX_PA_IN L3355 HB1_TX1_RFIC0_OUT

RFIC_TX_OUTPUT_MATCHING
C3311

C3326

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 33 RFIC0_6353
OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

34 DPDT_Connector
A
J3401 A

G2

G1
C
A
J3402

1
2

3
U3400
C3406 1 2
RF_GPIO07_DPDT
9 CTL RF1 4 MAIN_ANT
MAIN_ANT C3407 C3400 To MAIN ANT
RF2 6 DIV_ANT
C3404 4 3
1 GND1 RF3 2 MAIN_SWITCH L3457
3 GND2 RF4 8 DIV_SWITCH L3456
5 GND3
7 GND4 VDD 10 VOUT14_2V85

C3403

GND
L3451

C3405

B
U3400 Truth Table GPIO_207_ANT_DET_0 B
CTRL1 State
ANT_DETECT
0 RF1-RF3,RF2-RF4
1 RF1-RF4,RF2-RF3
J3400

G2

G1
C
A
4

1
2

3
DIV_ANT ANT_DRX
L3454
To DIV ANT
L3453

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF 60
34 DPDT_Connector

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

35. TXM
A
A

U3500

B8_TRX_ANT 37 TRX1 GND1 11

B38/41_TRX_ANT 36 TRX2 GND2 12
B40_TRX_ANT 35 TRX3 GND3 13
B28L_B12_TRX_ANT 34 TRX4 GND4 14
B5_TRX_ANT 33 TRX5 GND5 15
B4_TRX_ANT 32 TRX6 GND6 16
B2_TRX_ANT 31 TRX7 GND7 20
B7_TRX_ANT 30 TRX8 GND8 21
C3507 C3506 C3505 B20_B28H_TRX_ANT 29 TRX9 GND9 18
B3/B7/B20_CA_ANT 28 TRX10 GND10 23
B3_TRX_ANT 27 TRX11 GND11 38
B1_TRX_ANT 26 TRX12 GND12 39
B38/41_PRX_ANT 25 TRX13 GND13 40
R3580 24 41
TRX14 GND14
GND15 42
RF_DCDC_MMBPA/TXM 9 VCC GND16 43
GND17 44
VBATT 10 VBATT GND18 45
46
B VOUT28_1V8 7 VIO
GND19
GND20 47

RF_AUXDAC0 R3586 8 5 FE1_MIPI_CLK B

1

D3501 C3510 C3509 D3500 C3508 VRAMP SCLK

SDATA 6 FE1_MIPI_DATA
22 ANT
C3504 C3503 GSM_HB_TX_PA_IN
RFIN_H 3
R3581 17 2 GSM_LB_TX_PA_IN
CPL_O RFIN_L
2

19 NC RFIN_H_OUT 4
RF_DCDC_MMBPA/TXMÎÈѹ¹Ü¹²Ó㬷ÅÔÚDCDCÊä³öÒ³
RFIN_L_OUT 1

GND L3554 Z3500 L3555

CO-pad
MAIN_SWITCH L3552 3 OUT IN 1 L3551

CO-pad 6 COUPLINGTERMINATION_PORT 4

5 GND2 GND1 2
R3592 C3500 L3553

C3511 R3589 EXT_CPL_TO_RFIC0_MRX1

Close 2 R3590 R3590 R3591

C
R3593
C

The type and specification of the components refer to the BOM

D 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM NA 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
35 TXM 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

36 MMBPA
VOUT28_1V8

VOUT23_3V2
A
A
D3601
C3609
C3607
C3610

U3600ﾊｵｼﾊﾑ｡ﾐﾍ47150676｣ｬﾔﾝﾎﾞｷ籏ｰ

U3600
HB_TX_PA_IN 3 RFIN_H VIO 7
MB_TX_PA_IN 12 RFIN_M
LB_TX_PA_IN 13 RFIN_L1 VBATT 8
14 RFIN_L2
29 RF_DCDC_MMBPA/TXM
VCC1
B38/B41_TX_PA_OUT 33 HB1
B7_TX_PA_OUT 35 HB2 VCC2 30
B40_TRX_PA 37 HB3 C3602
R3684 39 HB4 VCC2_2 28 C3612 C3604 C3601

B2_TX_PA_OUT 21 MB1
R3685 23 MB2 GND1 1
B3_TX_PA_OUT 25 MB3 GND2 2
B1_TX_PA_OUT 26 MB4 GND3 15
B4_TX_PA_OUT 32 MB5 GND4 22
GND5 24
B8_TX_PA_OUT 19 LB1 GND6 27
B28L_B12_TX_PA_OUT 18 31
B B20_B28H_TX_PA_OUT 17
LB2
LB3
GND7
GND8 34
R3681 16 36
B5_TX_PA_OUT 20
LB4
LB5
GND9
GND10 38 B
GND11 40
B40_PRX_PA_OUT 41 HBRX1 GND12 43
B38/41_PRX_PA_OUT 42 HBRX2 GND13 44
GND14 45
FE0_MIPI_CLK 6 SCLK GND15 46
FE0_MIPI_DATA 5 SDATA GND16 47
GND17 48
C3605 C3606 4 NC1 GND18 49
9 NC2 GND19 50
10 NC3 GND20 51
11 NC4 GND21 52

VOUT27_1V8
PA TEMP DECT R3680

C
HKADC_IN4_PA_TEMP_1
C
C3600 RT3600
T

Place near to U3600

1｡｢ﾈ郢鈹ｹﾓﾃｶ犧 PA｣ｬﾇﾒｲｼｾﾖｾ狢 ｺﾜﾔｶ｣ｬｻ ｲｼｾﾖﾔﾚPCBｵﾄﾒ ﾃ譽ｬｿﾉﾒﾔﾆﾀｹﾀﾔ ｼﾓPA_TEMP_DET2;

2｡｢ﾈ郢鋕 ｼﾓPA_TEMP_DET2,ﾐ靨ｪｾｭﾉ菷ｵSub-TMGﾆﾀﾉ ﾍｨｹ ｺ ﾁｬｽﾓｵｽHKADC_IN9.

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
36 MMBPA 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

37.TX_Loadpull µ÷ÊÔʱLOADPULL¾¡Á¿Ñ¡ÓõÍͨģʽ£¬±ÜÃâг²¨µ¼ÖµÄRSE¼°¹²´æÎÊÌâ

A B5_TX_PA_OUT L3764 B5_TX_DUP B1_TX_PA_OUT L3768 B1_TX_DUP B7_TX_PA_OUT L3755 B7_TX_DUP

C3715 L3772
A

2
L3756 C3701
C3705
C3710

1
C3719

B8_TX_PA_OUT L3765 B8_TX_DUP B2_TX_PA_OUT L3760 B2_TX_DUP

B38/B41_TX_PA_OUT
L3751 B38/B41_TX_SAW_IN
L3759 C3706
C3716 C3713

L3752 C3720

B
GND B
B20_B28H_TX_PA_OUT L3763 B20_B28H_TX_DUP B3_TX_PA_OUT L3769 B3_TX_DUP
1 2 B40_TRX_PA L3753 B40_TRX_SAW

C3714 L3766
C3704 C3709 L3754 C3700

B28L_B12_TX_PA_OUT L3762

C3712 C3711
B28L_B12_TX_DUP

B4_TX_PA_OUT L3767 B4_TX_DUP

HB_match
C3707
C3717
C
C

MB_match

LB_match The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
37 TX_Loadpull
60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

38 TRX_LB_1
A µ÷ÊÔʱÊÕÁ²¾¡Á¿Ñ¡ÓõÍͨģʽ£¬±ÜÃâг²¨µ¼ÖµÄRSE¼°¹²´æÎÊÌâ
A

B20_B28H_TRX_ANTC3803
Z3800 Z3802

B5_RX_DUP B20_CA_DIP C3810

B5_TRX_ANT L3856 6 ANT RX 1 C3802 6 ANT RX 1 B20_B28H_RX_DUP

TX 3 B5_TX_DUP C3803 C3810copad TX 3 B20_B28H_TX_DUP

L3854 5 GND3 5 GND3
C3807 L3853
7 GND4 GND1 2 C3801 7 GND4 GND1 2
8 GND5 GND2 4 8 GND5 GND2 4

13080434 FOR B20; 0201G;

B 13080349 FOR B28H;0201G;
B

Z3803

Z3801 B28L_B12_TRX_ANT
L3852 6 1 B28L_B12_RX_DUP
ANT RX
B8_TRX_ANT C3805 6 ANT RX 1 B8_RX_DUP 3
B28L_B12_TX_DUP
C3800 L3851 TX
5 GND3
TX 3 B8_TX_DUP 7 2
5 GND4 GND1
GND3 8 4
C3804 L3855 7 2 GND5 GND2
GND4 GND1
8 GND5 GND2 4

C B28L:13080348 B12:13080347
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF 60
38 TRX_LB_1

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

39 TRX_LB_2
A
A

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF 60
39 TRX_LB_2_Reserved

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

40 TRX_MB_1 C4018 C4017

L4067
A U4001 Z4002

B3_TRX_ANT
C4001
4 RF2 RF1 6 C4016 L4060 6 ANT RX 1 B3_RX_DUP A
B3_CA_TIP C4015 2 5 VOUT14_2V85 TX 3 B3_TX_DUP
RF3 VDD
5 GND3
RF_GPIO20_SPDT_B1/B3 L4061
3 GND VC 1 C4010 7 GND4 GND1 2 GND
8 GND5 GND2 4

C4003
C4015C4018copad

µ÷ÊÔʱÊÕÁ²¾¡Á¿Ñ¡ÓõÍͨģʽ£¬±ÜÃâг²¨µ¼ÖµÄRSE¼°¹²´æÎÊÌâ

B
B

Z4001 Z4004

B1_TRX_ANT C4008 6 ANT RX 1 B1_RX_DUP B4_TRX_ANT C4009 6 ANT RX 1 B4_RX_DUP

TX 3 B1_TX_DUP TX 3 B4_TX_DUP
L4059 5 GND3 L4058 5 GND3
7 GND4 GND1 2 GND 7 GND4 GND1 2 GND
8 GND5 GND2 4 8 GND5 GND2 4
C4019

C4020
Z4003

B2_TRX_ANT C4004 6 ANT RX 1 B2_RX_DUP

3 B2_TX_DUP
co-pad 5
TX
C L4053 L4054 7
GND3
GND4 GND1 2 GND
8 GND2 4
GND5
C

co-pad Z4006

C4013 1 UNB_PORT1 UNB_PORT2 4 G1900_PRX_SAW

2 GND1
3 GND2 GND3 5 The type and specification of the components refer to the BOM
L4066

D NA 2018-07-13
13010466 FOR G1900
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 40 TRX_MB_1
OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

41 TRX_MB_2
A
A

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 41 TRX_MB_2_Reserved
OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

42 TRX_HB_1 2
Z4204

HIGH-BAND 1
GND1
4 GND2 MIDDLE-BAND 3 B3_CA_TIP
6 GND3
8 GND4 LOW-BAND 5 B20_CA_DIP
GND
9
A GND5
COMMON 7

C4206
A
B3/B7/B20_CA_ANT C4204

L4264 L4265

VOUT14_2V85

RF_GPIO21_SPDT_B7

U4201 Z4202
L4255
4 RF2 RF1 6 6 ANT RX 1 B7_RX_DUP
B7_TRX_ANT
C4203 2 RF3 VDD 5 TX 3 B7_TX_DUP
Co-Pad 5 GND3
Co-Pad 3 GND VC 1
L4254 L4256 7 GND4 GND1 2
L4267 8 GND5 GND2 4
L4266

B
B

C4209 C4208

Z4200
Z4201
B38/41_PRX_ANT L4252 1 4 B38_B41_PRX_SAW
UNB_PORT1 UNB_PORT2
B40_TRX_ANT L4257 4 UNB_PORT2 UNB_PORT1 1 B40_TRX_SAW
2 GND1
GND1 2
L4253 3 5
GND2 GND3
5 3
C GND3 GND2 L4260
L4251
C
L4263

C4201

Z4203

B38/41_TRX_ANT L4262 1 UNB_PORT1 UNB_PORT2 4 B38/B41_TX_SAW_IN

2 GND1

L4261 3 GND2 GND3 5

C4202
The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 42 TRX_HB_1
OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

43. TRX_HB_2
A
A

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF 60
43 TRX_HB_2_Reserved

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

44. PRX_LNA_Module
U4400

J6 ATEST
B5_RX_DUP L4456 B5_PRX_LNA_IN B8_RX_DUP L4458 B8_PRX_LNA_IN
E8 MHB1_PRX_LNA_OUT
A B7_PRX_LNA_IN C2 HB1_IN1
MHB1OUT
MHB2OUT F9 MHB2_PRX_LNA_OUT
L4455 D1 H9 MHB3_PRX_Lis_LNA_OUT
L4457
B38/B41_PRX_LNA_IN H1
HB1_IN2
HB2_IN1
MHB3OUT
A
J2 HB2_IN2 LBOUT D9 LB_PRX_LNA_OUT

B5_PRX_LNA_IN A4 LB_IN1 VDDIO E4 VOUT2_1V8

B28L_B12_PRX_LNA_IN B5 LB_IN2
B8_PRX_LNA_IN A6 LB_IN3 VDD1P8 G6 VOUT3_1V8
B20_B28H_PRX_LNA_IN B7 LB_IN4
A8 LB_IN5 GND1 B9

C4407

C4408

C4406
GND2 C4
B40_PRX_LNA_IN B3 MB1_IN1 GND3 C6
B4_PRX_LNA_IN A2 MB1_IN2 GND4 C8
B2_G1900_PRX_LNA_IN B1 MB1_IN3 GND5 D3
GND6 D7
B3_PRX_LNA_IN E2 MB2_IN1 GND7 F3
B20_B28H_RX_DUP B28L_B12_RX_DUP L4492 B28L_B12_PRX_LNA_IN
L4454 B20_B28H_PRX_LNA_IN F1 MB2_IN2 GND8 F7
B1_PRX_LNA_IN G2 MB2_IN3 GND9 G4
GND10 G8
L4490 L4491 J4 MUX_IN GND11 H3
FE1_MIPI_CLK D5 H5
SCLK GND12
GND13 H7
FE1_MIPI_DATA
F5 SDATA GND14 J8

E6 USID0

C4404

C4405
B
B
The Inputport unused should be connected to GND!
B1_RX_DUP L4460 B1_PRX_LNA_IN
G1900_PRX_SAW L4453

L4459 CO-PAD

B2_RX_DUP L4452 L4462 B2_G1900_PRX_LNA_IN

L4461

B3_RX_DUP L4464 B3_PRX_LNA_IN 6H03 Frequency Range

LB_IN1 B5
L4463
LB_IN2 703-894MHz
LB_IN3 B8
LB_IN4/5 717-821MHz
MB1_IN1 1805-2200MHz B40
C B4_RX_DUP L4401 B4_PRX_LNA_IN
MB1_IN2/3,MB2_IN1/3 1805-2200MHz
MB2_IN2 1447-1559MHzB3/B39 C
L4402 HB1/2_IN1 B41/38/7
B7_RX_DUP L4470 B7_PRX_LNA_IN
HB1/2_IN2 2300-2690MHz
MUX_IN 1805-2690MHz
L4469 L4471

B38_B41_PRX_SAW
C4420
The type and specification of the components refer to the BOM
B40_PRX_PA_OUT L4473 B40_PRX_LNA_IN
B38/41_PRX_PA_OUT
C4421 L4476 B38/B41_PRX_LNA_IN
D NA 2018-07-13
C4420C4421copad L4472 L4474 ECA NO DATE D
L4475 L4477 DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF 60
44 PRX_LNA_Module

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

45.DRX_SWITCH
A
A

C4511 C4510
Use 47140291 package,Sourcing

U4500
B
DIV_SWITCH C4500 8 3 FE1_MIPI_CLK
ANT CLK
B
11 AUX1 DATA 2 FE1_MIPI_DATA
L4551 B2_B40_DRX_ANT 18 AUX2
B41_DRX_ANT 20 5 VOUT3_1V8
AUX3 VDD
B12_B28_DRX_ANT 22 AUX4
4 VOUT28_1V8
VIO

C4502

C4504
B1_DRX_ANT 17 B1
B3_DRX_ANT 15 B3 GND1 1
B5_DRX_ANT 12 B5/26 GND2 6
B8_DRX_ANT 10 B8 GND3 7
B20_DRX_ANT 13 B34 GND4 9
14 B39 GND5 16
21 B40
B7_DRX_ANT 19 B41 SINK 23

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
45 DRX_Switch
60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

46. DRX_LB
A
Z4600 A

B12_B28_DRX_ANT C4601 1IN OUT4 B12_B28_DRX_SAW

2GND1
L4654
5GND2 GND33

13010572 FOR B12(17)

13010655 FOR B28(FullBand)

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
46 DRX_LB60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

47. DRX_MB
A
A
Z4700

C4701C4702copad

B2_B40_DRX_ANT C4703 1 IN OUT 4 C4701 B2_DRX_SAW

2 GND1
L4754
5 GND2 GND3 3 C4702 B40_DRX_SAW

use13010574forB2
use13010562forB40

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 47 DRX_MB60
OF

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

48. DRX_HB
A
Z4801 A
B41_DRX_ANT L4851 1 INPUT OUTPUT 4 B41_DRX_SAW

2 GROUND1
3 GROUND2 GROUND3 5
L4852

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
48 DRX_HB60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

49. DRX_LNA_Module The Inputport unused should be connected to GND!

U4900 ﾆ ｼ ﾏ鍗ｿﾇｰﾆﾚﾌ 0 Ohmｵ釋陬ｬﾑ鰒､OKｺ ｿﾉﾒﾔﾈ･ｵ

B5_DRX_ANT L4952 B5_DRX_LNA_IN B8_DRX_ANT L4954 B8_DRX_LNA_IN J6 ATEST

MHB1OUT E8 MHB1_DRX_LNA_OUT
B7_DRX_LNA_IN C2 F9 MHB2_DRX_LNA_OUT
A L4953 D1
HB1_IN1
HB1_IN2
MHB2OUT
MHB3OUT H9 MHB3_DRX_Lis_LNA_OUT
L4951 B38/B41_DRX_LNA_IN H1
J2
HB2_IN1
HB2_IN2 LBOUT D9 LB_DRX_LNA_OUT A
B5_DRX_LNA_IN A4 LB_IN1 VDDIO E4 VOUT2_1V8
B12_B28_DRX_LNA_IN B5 LB_IN2
B8_DRX_LNA_IN A6 LB_IN3 VDD1P8 G6 VOUT3_1V8
B20_DRX_LNA_IN B7 LB_IN4
A8 LB_IN5 GND1 B9
GND2 C4
B40_DRX_LNA_IN B3 MB1_IN1 GND3 C6
B2_DRX_LNA_IN A2 MB1_IN2 GND4 C8

C4902

C4901

C4900
B1_DRX_LNA_IN B1 MB1_IN3 GND5 D3
GND6 D7
B12_B28_DRX_SAW L4956 B12_B28_DRX_LNA_IN B20_DRX_ANT L4984 B20_DRX_LNA_IN B3_DRX_LNA_IN E2 MB2_IN1 GND7 F3
F1 MB2_IN2 GND8 F7
G2 MB2_IN3 GND9 G4
L4955 L4983 GND10 G8
J4 MUX_IN GND11 H3
FE1_MIPI_CLK D5 SCLK GND12 H5
GND13 H7
FE1_MIPI_DATA F5 SDATA GND14 J8

VOUT2_1V8 E6 USID0

B
B
B3_DRX_ANT
B1_DRX_ANT L4958 B1_DRX_LNA_IN L4960 B3_DRX_LNA_IN

L4957 L4959

B7_DRX_ANT L4968 B7_DRX_LNA_IN

B2_DRX_SAW L4962 B2_DRX_LNA_IN

L4961 L4980
L4967

6H03 Frequency Range

C LB_IN1 B5
LB_IN2 703-894MHz C
LB_IN3 B8
LB_IN4/5 717-821MHz
B40_DRX_LNA_IN
B40_DRX_SAW L4970
MB1_IN1 1805-2200MHz B40
L4969
L4982
MB1_IN2/3,MB2_IN1/3 1805-2200MHz
MB2_IN2 1447-1559MHz,B3,B39
HB1/2_IN1 B41/38/7
HB1/2_IN2 2300-2690MHz
MUX_IN 1805-2690MHz

The type and specification of the components refer to the BOM

B41_DRX_SAW L4972 B38/B41_DRX_LNA_IN

L4981
D L4971 NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 49 DRX_LNA_Module
OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

50. Reserved
A
A

B
B

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 50 Reserved
OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

A
60 NC_POWER
A

VDD_PMU_1P4 P13 K3 SG6001

G
VDD_BUCK_1P4 VSS_CMU S

VDD_PMU_CLDO1 E18 VDD_CLDO1_1 VSS_FM_RF_RX C10

G12 VDD_CLDO1_2
K9 VDD_CLDO1_3
N6 VDD_CLDO1_4 VSS_GF_ADC F13

VDD_PMU_RFLDO1 M1 VDD_CMU_1P2
U6001 VSS_GF_RF_FMLO_VCO C12
VDD_CMU_LDO_TCXO L4 VDD_CMU_LDO_TCXO
VSS_GF_RF_GR F11
VDD_PMU_RFLDO1 A10 VDD_FM_RF_RX_1P2
VSS_GF_RF_PLL D11
C6021 B11 VDD_GF_RF_PLL_VCO_1P2
VSS_GLOBAL_RF1 H7
VDD_PMU_RFLDO1 A7 VDD_GNSS_RF_RX_1P2 VSS_GLOBAL_RF2 H9

C6046

C6020

C6023

C6025
VSS_GLOBAL_RF3 J2
N18 VDD_NFC_PMU_SE1
M17 VDD_NFC_PMU_SE2 VSS_GLOBAL1 E16
J12

PWR Interface 2 of 2
NO FM-->A10: GND VSS_GLOBAL2
M13 VDD_NFC_PMU_SWIO0 VSS_GLOBAL3 L10
N16 VDD_NFC_PMU_SWIO1 VSS_GLOBAL4 N4
M15 VDD_NFC_PMU_SWIO2 VSS_GLOBAL5 N10
B NO IR-->J16: NCJ16 C8 SG6002

G
VDD_NFC_RF_PA VSS_GNSS_RF_RX
VBAT_SYS
K15
H15
VDD_NFC_RF_REC
G16
S

B
VDD_NFC_VBAT VSS_IR NO IR--> Delete SG6005
VDD_PMU_1P4 A16 VDD_PMU_1P4 VSS_NFC_RF_ANA1 K13
VSS_NFC_RF_ANA2 L12
VDD_PMU_CLDO1 R14 VDD_PMU_CLDO1
C6026 N12 VDD_PMU_CLDO2 VSS_NFC_RF_GR H13
VSS_NFC_RF_PA L16
VDD_PMU_PALDO C14 VDD_PMU_PALDO
VSS_PMU_AGND1 A14
VDD_PMU_RFLDO1 B13 VDD_PMU_RFLDO1 VSS_PMU_AGND2 M11
VDD_PMU_RFLDO2 A12 VDD_PMU_RFLDO2 VSS_PMU_AGND3 E14

C6027 R12 P17 SG6003

G
VDD_PMU_SYSLDO VSS_PMU_PGND S

VSS_PMU_PGND_TEST R18
P15 VDD_PMU_VBAT2
VOUT18_1V8 D15 VDD_PMU_VDDIO VSS_SR1 A18
VSS_SR2 N2
VOUT18_1V8 P11 VDD_PMU_VDDIO2
VSS_WB_ABB_ADC_DAC H5
VBAT_SYS C16 VDD_PMU_VPH VSS_WB_RF_GR G6
VSS_WB_RF_LNA E4
VDD_PMU_RFLDO1 K5 VDD_WB_ADDA_1P2
VSS_WB_RF_MIX_UPC2G B5
VDD_PMU_RFLDO1 E2 VDD_WB_RF_LNA_1P2
VDD_PMU_RFLDO1 F5 VDD_WB_RF_LPF_1P2 VSS_WB_RF_PA2G_A D3
VSS_WB_RF_PA2G_B B3
VDD_PMU_PALDO A2 VDD_WB_RF_PA2G_3P3_1P4
VDD_PMU_PALDO H3 VDD_WB_RF_PPA5G_3P3 VSS_WB_RF_PA2G_BL1 B1
C VDD_PMU_RFLDO1 NO 5G WIFI-->H3: NC
F7
VSS_WB_RF_PA2G_BL2 C2
VDD_WB_RF_PLL_1P2
VDD_PMU_RFLDO1 A4
VSS_WB_RF_PLL E8
F3
C
VDD_WB_RF_UPC2G5G_1P2 VSS_WB_RF_PPA5G
VDD_PMU_RFLDO2 A5 VDD_WB_RF_VCO_LOGEN_1P2 VSS_WB_RF_PPA5G_BL G2
VSS_WB_RF_TRAP D5
VOUT18_1V8 R10 VDDIO
D6001
C6028

C6030

C6031

C6033

C6034

C6035

C6036

C6045

C6037

C6038

C6029

C6039

C6040

C6041

C6043

C6044
C6032
D6002

VSS_WB_RF_TX5G_MIXBUF G4
1

C6 SG6004

G
VSS_WB_RF_VCO_LOGEN S
2

NO 5G-->Delete D6002

Add by Hisilicon for debug The type and specification of the components refer to the BOM

VOUT18_1V8
D Boston,Miami: VOUT2->VOUT18_1V8 NA 2018-07-13
VBAT_SYS ECA NO DATE
Chicago,Dallas: VOUT2 D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
R6082¡¢R6083:ƽ̨Ê×ÏîÄ¿ÊÔÖƱ£Áô£¬×îÖչ鵵ʱɾµô,Ö±Á¬£»·Çƽ̨Ê×ÏîÄ¿Ö±Á¬ VER PART_NUMBER 60 NC_POWER
SHEET OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

 1 2 3 4 5 6

61 NC_BB
A
A

BTFM_I2S2_CLK R6 BF_PCM_CLK/FM_I2S_CLK NFC_RF_RX1_ANT1 K17

BTFM_I2S2_MOSI M5 BF_PCM_DI/JTAG_SEL NFC_RF_RX2_ANT2 L18
BTFM_I2S2_MISO
GPIO200->BTFM_I2S2_MOSI R6181 BTFM_I2S2_SYNC
P5
L6
BF_PCM_DO/FM_I2S_DO
BF_PCM_SYNC/FM_I2S_WS
U6001 NFC_RF_SWIO0 L14
GPIO201->BTFM_I2S2_CLK J14
GPIO199->BTFM_I2S2_MISO NFC_RF_SWIO1
GPIO_229_BFGN_WAKEUP_AP
G14 BFGN_HOST_WAKE_UP NFC_RF_SWIO2 N14
GPIO202->BTFM_I2S2_SYNC
HI1102_UART4_RTS_NH11 BFGN_UART_CTS NFC_RF_TX1 H17 L6151 ÓÅÑ¡10100713£¬¸ß¶ÈÊÜÏÞ¿ÉÒÔÑ¡Ôñ10100558
GPIO042->HI1102_UART4_RTS_N HI1102_UART4_CTS_N P3 J18
BFGN_UART_RTS NFC_RF_TX2
GPIO041->HI1102_UART4_CTS_N BUCK_LX

MISC Interface 1 of 2
GPIO044->HI1102_UART4_TXD HI1102_UART4_TX P1 R16 L6151 VDD_PMU_1P4
BFGN_UART_RX PMU_BUCK_LX
GPIO043->HI1102_UART4_RXD HI1102_UART4_RX R2 BFGN_UART_TX
E12 GPIO_030_Hi1102_PWRON TP6102
PMU_PWRON
J4 CLK_REQ_OUT PMU_REFBP D13PMU_REFBP C6103

NO 5G WIFI-->C18,B15,B17: NC FEM_5G_EX_LNA_EN C18 R4 CLK32_BFGN

FEM_5G_EX_LNA_EN RTC_CLK
if use NXP FEM-->B15: NC B15 H1 WB_RF_RFI_5G
FEM_5G_RX_EN WB_RF_RFI_5G
FEM_5G_TX_EN B17 FEM_5G_TX_EN WB_RF_RFO_2G D1 WB_RF_RFIO_2G NO 5G WiFi-->H1£¬F1: GND
WB_RF_RFO_5G F1 WB_RF_RFO_5G
FM_RF_IN B9
B GPIO150->CDMA_GPS_SYNC
NO FM-->B9: GND FM_RF_IN
WB_RF_TEST_0 E6 NO 5G WiFi-->D7: NC
J8 D7 RF_TEST_1
GNSS_LNA_EN D17
GNSS_BLK_EN/RF_TX_TEST_2
GNSS_LNA_EN
WB_RF_TEST_1
WB_RF_TEST_2 G8 GPIO_211_WIFI_WAKEUP_AP B
WB_RF_TEST_3 F9
GNSS_RF_RFI A8 GNSS_RF_RFI
G10
C6106
GPIO50->ISM_PRIORITY WL_HOST_WAKE_UP
CDMA_GPS_SYNC K7 GPIO0/RF_TX_TEST_1
GPIO47->LTE_INACTIVE J10 P7 WL_SDIO_CLK
GPIO48->LTE_RX_ACTIVE GPIO1/RF_TX_TEST_3 WL_SDIO_CLK
WL_SDIO_CMD M7 WL_SDIO_CMD
GPIO49->LTE_TX_ACTIVE G18
GPIO004->AP_GPS_REF_CLK NO IR-->G18: NC IR_TRX
WL_SDIO_D0 P9 WL_SDIO_DATA0 SDIO
J6 ISM_PRIORITY/RF_TX_TEST_0 WL_SDIO_D1 R8 WL_SDIO_DATA1
LTE_INACTIVE L8 LTE_INACT/COE_UART_TX/SSI_CLK WL_SDIO_D2 M9 WL_SDIO_DATA2
E10 LTE_RX_ACT/RBIAS WL_SDIO_D3 N8 WL_SDIO_DATA3
Bosto¡¢miamiƽ̨: AP_GPS_REF_CLK RCΪ¸ÉÈÅÔ¤Áô£¬²âÊÔûÎÊÌâ¹éµµÊ±É¾µô,Ö±Á¬
AP_GPS_REF_CLK F17 GNSS_REF_CLK/GNSS_PWM_SYNC XIN L2 XIN
NFC_RF_ATB0
F15 GNSS_PPS_INOUT/GNSS_CAL_REQ XOUT M3
NFC_RF_ATB1
NC_1 K1 GND
LTE_TX_ACTIVE K11 LTE_TX_ACT/COE_UART_RX NC_2 D9
SSI_DATA/XLDO_MODE

C
C

TCXO 38.4MHz
TCXO6101
G
VDD_CMU_LDO_TCXO
R6183 4 3 C6105 XIN
VCC OUT
C6104

1 GND1/NC GND2 2

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF 60
61 NC_BB_Miami

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

62 NC_2G/5G/GPS

1
3
5
7
GND1
GND2
GND3
GND4
A
A

MIDDLE_FREQ.PORT

HIGHER_FREQ.PORT
LOWER_FREQ.PORT

COMMON_PORT

J6201
C6213

Z6202

G2

G1
C
A
8

1
2

3
2G_RF

L6260
C6203
Z6203 ANT_WIFI_GPS
WB_RF_RFIO_2G
C6201 1 INPUT OUTPUT 4 C6202

2 GROUND1
3 GROUND2 GROUND3 5
2

R6283

L6257
L6261

B GND
B
GNSS
GNSS_RF

5G_RF

WIFI_5G

C
FOR PROTECT, DFX DEMAND C
C6204

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
62 NC_2G/5G/GPS
60

E 03025HSD HUAWEI TECH CO.,LTD.

 1 2 3 4 5 6

63 NC_FE_WIFI_5G
A
A

R6385 RF_TEST_1

C6304 C6309
B
VBAT_SYS
B

C6318
9 VCC3 GND2 11
8 VCC2 GND1 7
FEM_5G_EX_LNA_EN R6387 FEM_5G_PIN3
3 VCC1
PDET 10
FEM_5G_TX_EN R6386 FEM_5G_PIN2
2 CTRL2
R6388 FEM_5G_PIN4 C6301 L6352 WIFI_5G
4 CTRL1 ANT 1

L6351

L6359
5 RX TX 6

U6301
FEMｼ貶ﾝｷｽｰｸ

C6316
C6317

C6310
FEM_5G_EX_LNA_EN R6389 FEM_5G_PIN2 U6301ﾊｵｼﾊﾑ｡ﾐﾍﾎｪ47150685｣ｬﾔﾝﾎﾞｷ籏ｰ

VBAT_SYS R6390 FEM_5G_PIN3

FEM_5G_TX_EN R6391 FEM_5G_PIN4

C6302 WB_RF_RFO_5G

C6315

C
C
WB_RF_RFI_5G R6382
R6383 R6384
5dB Att: V=30,W=180

GND

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 63 NC_FE_WIFI_5G_599
OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

64 NC_GPS
A
A

GNSS_LNA_EN

L6453
VDD_CMU_LDO_TCXO

C6404
GNSS_RF
C6419

GNSS Z6401
U6401 2
L6455 4
B 1 GND ENABLE 6
1 2 UNB_PORT2 UNB_PORT1 1
GNSS_RF_RFI Z6410 2 5
L6456 4 UNB_PORT2 UNB_PORT1
1 3
VCC
RF_OUT
RF_IN
GND_RF 4
GND1 2 B
5 GND3 GND2 3
2

L6462
GND1 1
5 GND3 GND2
3

GND
L6451

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
64 NC_GPS60

E 03025HSD HUAWEI TECH CO.,LTD.

 1 2 3 4 5 6

68. NFC_BB
A ﾗ鮠 ｻｯok
U6802 A
GPIO_051_NFC_EN H1 VEN VDDO_SE/IC B8 SVDD_1V8 C6815
A1 WKUP_REQ VDDI_ESE/NC C5
GPIO_228_NFC_DWL_REQ D3 DWL_REQ
GPIO_147_NFC_INT E3 IRQ ESE_SPI_CS/NC E5
NFC_GPIO7_DEBUG GND I2C_ADD0 C3 SA0/NSS ESE_SPI_CLK/NC D5
TP6808
I2C_ADD1 D1 SA1/MOSI ESE_SPI_MOSI/NC F5
I2C4_SDA SDA E1 SDA/MISO ESE_SPI_MISO/NC C4
I2C4_SCL SCL E2 SCL/SCK ESE_SPI_IRQ/NC G4
TP6803 NFC_GPIO3_DEBUG NFC_TX_PWR_REQ F8 TX_PWR_REQ
ESE_ISO_RST/NC F6
NFC_CLK_REQ B1 CLK_REQ ESE_ISO_CLK/NC E6
TP6810 NFC_GPIO5_DEBUG NFC_CLK_38M4 C8 NFC_CLK_XTAL1 ESE_ISO_IO/NC F4
D8 XTAL2 ESE_GPIO1/NC B5
VOUT11_USIM0 A4 VDD_SIM_PMU_1 IC1/SWIO_DG B7 NFC_SWIO_SE
page With NFC No NFC
R6808
NFC_SIM0_VDD_OUT A5 VDD_SIM_1 NFC_GPIO_2 F3
R710 SMT DNI SIM0_DATA B3 SIM_IO_PULLDOWN_1 NFC_GPIO_3 F2 NFC_GPIO3_DEBUG
NFC_SWIO_SIM0 A3 SIM_SWIO_1 NFC_GPIO_4 H2
page7 R711 SMT DNI
NFC_GPIO_5 G2 NFC_GPIO5_DEBUG
R731 DNI SMT VOUT12_USIM1 A7 VDD_SIM_PMU_2 NFC_GPIO_6 F1
R6809 VDD_GPIO G1
R1250 DNI SMT
NFC_SIM1_VDD_OUT A8 VDD_SIM_2
page12
R1205 SMT DNI SIM1_DATA B6 SIM_IO_PULLDOWN_2 VDD_PAD D2 VOUT18_1V8
NFC_SWIO_SIM1 A6 VBAT E8 VBAT_SYS
B R6808 DNI SMT
C2
SIM_SWIO_2
NFC_GPIO_0 VDD_UP H3 NFC_VDD_UP
R6809 DNI SMT B2 VDD_TX G7
D6801 SMT DNI
NFC_GPIO7_DEBUG A2
NFC_GPIO_1
NFC_GPIO_7 VDDA D7 VDDD_NFC B
VDDD C7
D6802 SMT DNI F7 ANT1 VDD_MID H4
NFC_RXN H6 RXN VDD_HF D6
R6810 SMT DNI
NFC_TX1 G8 TX1 VSSA1 G3
page68
R6801 DNI SMT NFC_TX2 H7 TX2 VSSA2 G5
NFC_RXP H5 RXP VSSA3 G6
U6802 SMT DNI
E7 ANT2 VSSD C6

C6811

C6810
C6809
C6802,C6803 SMT DNI VSS_PAD C1

C6808

C6803
C6812

C6802
C6813

C6814

C6806
D4 IC1/NC VSS_ESE/NC B4
C6806,C6808 SMT DNI
E4 IC2/NC VSS_TX H8
C6809,C6810 SMT DNI
GND
C6811,C6812 SMT DNI
C6813,C6814,C6815 SMT DNI
write address:0x50 read address:0x51
U6801 39111034 39110908

C
C

ﾗ鮠 ｻｯok
L6801

U6801
VBAT_SYS A3 VIN SW1 B1
D6801 B2 SG6801 VOUT_CLASSD
G

SW2 S

NFC_TX_PWR_REQ 2 1 00 B3 EN VOUT1 A1 NFC_VDD_UP

VOUT2 A2
C6801

D6802
C1 GND1
GPIO_218_BST_5V_EN 2 1 C2 GND2 GND3 C3 The type and specification of the components refer to the BOM
C6818

R6801
R6810

D NA 2018-07-13
GND
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
68 NFC_BB60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

69. ANT_NFC
A
A

C6917

C6918

C6919
NFC_RXN

1
C6913

R6901
B

C6911
NFC_TX1 L6901 C6915

L6903 DIV_NFC

1
C6921

*
*
C6916

2 U6901
GND

3
C6922

C6912
NFC_TX2 L6902

R6903
NFC_RXP
2

C6914

C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET OF
69 ANT_NFC
60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2
H5 3 4 5 6
 1 2 3 4 5 6

70.ANT_DIV
L7019

L7013 U7003

C7050
9 RF1 VDD 3 VOUT14_2V85
LB7050 ANT_OUTC
1 2 8 RF2 VIO 4 C7096 VOUT28_1V8
A P1
1 C7006 L7014 7 RF3 CLCK 2 FE0_MIPI_CLK
DIV ANT 6 RF4 DATA 1 FE0_MIPI_DATA A
J7006
10 5

L7015
GND USID

C7057

C7095
J7005 U7001 L7018

C7055

C7056
A1 DC_BIAS
1

L7016
P1
P2 2 RF2 RF1 GND 1 1 1
B2 B1

2 2 2

L7003 ANT_DRX
L7054

L7002
L7001
USID Setting Table(Register:0X1F D3:D0)
USID
USID PIN BIAS ConditionD3 D2 D1 D0
DIV_NFC GND 0 1 1 0
B Open 0 1 1 1
VIO 1 0 0 1
B

J7004 C7092

P1 1
HB-Ground
P2 2 L7012
C7005

L7091

C
C7065 L7053
LB-Ground P1 1 C
J7002

The type and specification of the components refer to the BOM

D L7070 C7070 NA 2018-07-13

ECA NO DATE D
DESIGNED XUMENG 00322542
LB-Ground-Open P1 1
C7069 C7068
HL3JKMM 03025HSD_SCHZH
J7003
REVIEWED ZHANGYOUJUN 00258580
C7071 VER PART_NUMBER SHEET OF
70 ANT_DIV
60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

71 ANT_GPS_WIFI
A
WIFI/GPS ANT A

L7106 L7105

2
P1 WIFI_TEST
1
C7103 C7106 ANT_WIFI_GPS
C7104

1
P1 1

C7105

C7101
J7101

L7102 L7104 J7102

2

P1 1

C7102
1 2 J7105

L7103

L7101
P1 1
1
J7106

B
P1 1 B
J7107
J7161

P1 1
CAM ground P1 GND
1

J7108

P1 GND
1

J7109

J7110
S1 1

S2 2
GND
S3 3

J7111
1
S1
C
S2 2
GND
S3 3

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 71 ANT_GPS_WIFI
OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 1 2 3 4 5 6

72.ANT_Tuner_Controller
A
A

C7209

D7201

C7201
C7204
2 1

U7201
A3 VHV VREG A2 C7203
B VBAT_SYSR7201 L7201 B3 L_BOOST OUTA C1
B1 ANT_OUTB
OUTB
OUTC A1 ANT_OUTC B
VBAT_SYS C3 VDDA
CLK D3 FE0_MIPI_CLK
D1 VIO DATA D2 FE0_MIPI_DATA
VOUT18_1V8
C2 GND ATEST B2

C7205

C7208

C7206
C7207
C
C

The type and specification of the components refer to the BOM

D NA 2018-07-13
ECA NO DATE D
DESIGNED XUMENG 00322542
HL3JKMM 03025HSD_SCHZH
REVIEWED ZHANGYOUJUN 00258580
VER PART_NUMBER SHEET 72 ANT_Tuner_Controlle
OF 60

E 03025HSD HUAWEI TECH CO.,LTD.

1 2 3 4 5 6
 Jackman Advanced Maintenance Manual

Prepared By Yao Peng (employee ID: 00348433) Date 2018-07-20

Reviewed By Zhang Youjun (employee ID: 00258580) Date

Approved By Date

Huawei Technologies Co., Ltd.

All rights reserved
 Jackman Advanced Maintenance Manual INTERNAL

Change History

Date Version Change Reason Changed Section Change Description Prepared By

Tang Dong (employee ID:

2018-07-20 V1.0 Released the first version.
00323602)

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 Jackman Advanced Maintenance Manual INTERNAL

Contents

1 Introduction...................................................................................................................................................................................................................... 6
1.1 Applicable Scope ................................................................................................................................................................................................................................................ 6
1.2 Introduction ........................................................................................................................................................................................................................................................ 6
1.3 Obtaining Product and Maintenance Information .............................................................................................................................................................................................. 6

2 Product Introduction ...................................................................................................................................................................................................... 7

2.1 Product Appearance............................................................................................................................................................................................................................................ 7
2.2 Specifications ..................................................................................................................................................................................................................................................... 8

3 PCBA Working Principle ............................................................................................................................................................................................... 11

4 PCBA Components and BOM Information.................................................................................................................................................................. 17
4.1 Material BOM Information .............................................................................................................................................................................................................................. 22
4.2 Checking the PCBA Version Information ........................................................................................................................................................................................................ 25
4.2.1 Checking the Phone Version ................................................................................................................................................................................................................... 25
4.2.2 Checking the Memory Configuration Information ................................................................................................................................................................................. 27

5 Maintenance Tools........................................................................................................................................................................................................... 30
6 Software Maintenance Guide ......................................................................................................................................................................................... 32
6.1 Software Maintenance Guide (Including Tool Usage Instructions) ................................................................................................................................................................. 32
6.2 Maintenance Guide for Running Issues ........................................................................................................................................................................................................... 33
6.3 Description of Erasing Customer Data ............................................................................................................................................................................................................. 33
6.3.1 Object ...................................................................................................................................................................................................................................................... 33
6.3.2 Method .................................................................................................................................................................................................................................................... 33

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6.3.3 Verification .............................................................................................................................................................................................................................................. 35

6.3.4 Restoration of Non-customer Data.......................................................................................................................................................................................................... 35

7 7 Maintenance Guide ...................................................................................................................................................................................................... 35

7.1 Hardware & RF Maintenance Guide (Including Tool Instructions) ................................................................................................................................................................. 35
7.2 List of Thermal Resistance Values of Johnson Thermosensitive Components ................................................................................................................................................. 35

8 PCBA Maintenance Operation Guide ........................................................................................................................................................................... 37

8.1 Tool List ........................................................................................................................................................................................................................................................... 37
8.2 Maintenance and Verification Procedure.......................................................................................................................................................................................................... 39
8.2.1 Overall Procedure of Repairing a Component ........................................................................................................................................................................................ 39
8.3 Maintenance Specifications and Requirements ................................................................................................................................................................................................ 39
8.3.1 Temperature Parameters .......................................................................................................................................................................................................................... 39
8.3.2 Glue Removal Temperature Requirement ............................................................................................................................................................................................... 40
8.3.3 Digital Heat Gun Temperatures for Removing and Soldering Chips ...................................................................................................................................................... 40
8.4 Verification ....................................................................................................................................................................................................................................................... 40
8.4.1 Removing he Shielding Case .................................................................................................................................................................................................................. 40
8.4.2 Removing the Glue (for Glue Dispensed Components to be Verified) ................................................................................................................................................... 41
8.4.3 Removing the Glue Dispensed Chips ..................................................................................................................................................................................................... 41
8.4.4 Clearing the PCBA Pads ......................................................................................................................................................................................................................... 42
8.4.5 Aligning and Soldering the New Components ........................................................................................................................................................................................ 43
8.4.6 Cosmetic Inspection ................................................................................................................................................................................................................................ 43
8.4.7 X-ray Inspection...................................................................................................................................................................................................................................... 44

9 Assembly and Disassembly Guide ........................................................................................................................................................................... 44

9.1 Disassembly Guide........................................................................................................................................................................................................................................... 44
9.2 Requirements for Putting Repaired Defective Products into Production and Reusing Materials ..................................................................................................................... 44

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 Jackman Advanced Maintenance Manual INTERNAL

9.3 Assembly Guide ............................................................................................................................................................................................................................................... 44

10 Solder Joints on the PCB and BGA Chip ................................................................................................................................................................... 45

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 Jackman Advanced Maintenance Manual INTERNAL

1 Introduction
1.1 Applicable Scope
The Jackman Maintenance Manual is available in the simplified and advanced versions. The two versions are respectively applicable to common service centers
and high-level repair centers (HLRCs) authorized by Huawei. This document provides repair instructions for technicians at HLRCs to conduct maintenance
services of level 3. For maintenance services of level 1 and level 2, see the simplified maintenance manual. Being Huawei proprietary, this document is accessible
only to authorized services centers (ASCs). Although every effort was made to ensure the accuracy of the document, errors may still exist. If you find any errors or
have any suggestions, report them through Huawei service platform ComPartner.

1.2 Introduction
This document introduces the product's working principles, functions of PCBA components, maintenance workflow, and common troubleshooting methods.
You will be able to rectify difficult faults in the product after you learn this document.

1.3 Obtaining Product and Maintenance Information

To obtain product and maintenance information, visit Huawei's service website. You are recommended to install the ComPartner platform to download
maintenance-required tools and software.
To obtain the ComPartner installation package, log in to http://support.huaweidevice.com/service/, and search for ComPartner. You will then find the installation
package.

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 Jackman Advanced Maintenance Manual INTERNAL

2 Product Introduction
2.1 Product Appearance

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2.2 Specifications
Item Description
Dimensions (H x W x D) 162.4 mm x 77.1 mm x 8.05 mm
WCDMA/HSDPA/HSUPA: 3GPP and FDD Release 10
TD-LTE/FDD-LTE
Technical standards TDS-CDMA
CDMA 1X/EV-DO
GSM/GPRS/DEGE
TD-LTE: B38/B39/B40/B41 (2545–2655 MHz, supporting AXGP)
FDD-LTE: B1/B3/B5/B8 (for FDD-LTE with changed BOM: B7 and B26)
TD-SCDMA: B34/B39
Frequency band
WCDMA: B1/B5 (roaming)/B8
CDMA: 1X and EV-DO BC0
GSM: B2 (roaming)/B3/B8
Weight About 173g (with battery)
Appearance Bar type
Antenna Built-in antenna
SIM/USIM Standard 6-pin SIM card interface, supporting the 1.8/3 V USIM card
Charging 5 V and 2 A
Battery 4000 mAh
Cameras Rear camera CMOS 13 MP+2 MP

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 Jackman Advanced Maintenance Manual INTERNAL

Item Description
Front camera CMOS 16 MP
Resolution 1080 pixels x 2340 pixels
LCD type LTPS
Screen
Color level 16.7M
LCD size 6.5 inch
Charging port micro USB port
USB data cable port micro USB port
Ports
microSD card port Capacity: 256GB
Headset jack 3.5 mm binaural stereo headset
Bluetooth Bluetooth 4.2
AL00/LX1C:
802.11 a/b/g/n/ac 2.4 GHz/5 GHz
HT20, HT40, and HT80 supported
Wi-Fi
TL00/LX1/LX2/LX3:
802.11 b/g/n 2.4 GHz
HT20 and HT40 supported
USB USB 2.0, 480 Mbit/s
Radio Built-in radio
GPS GPS/GLONASS/BeiDou Navigation Satellite System (BDS)

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 Jackman Advanced Maintenance Manual INTERNAL

Item Description
Separation solution:
4 GB LPDDR4X+64 GB eMMC
4 GB LPDDR4X+128 GB eMMC
6 GB LPDDR4X+64 GB eMMC
Storage 4 GB LPDDR4X+32 GB eMMC
3 GB LPDDR4X+64 GB eMMC
Integration solution:
4 GB LPDDR4X+64 GB eMMCP
4 GB LPDDR4X+128 GB eMMCP
CDMA 2000 MHz: 23–26 dBm (Power Class 2)
TD-LTE Band 34/38/39/40/41: 19.5–25 dBm (Power Class 3)
FDD-LTE Band 1/3/5/7/8: 19.5–25 dBm (Power Class 3)
Maximum transmission power
WCDMA: 19.5–25 dBm (Power Class 3)
GSM 900 MHz: 33 dBm (Power Class 4)
DCS 1800/1900 MHz: 30 dBm (Power Class 1)
EGSM/DCS/PCS (GSM 900/1800/1900): higher than –102 dBm/200 kHz
CDMA2000 1X: higher than –104 dBm/1.23 MHz
CDMA2000 EV-DO Rev.A: higher than –105.5 dBm/1.23 MHz
Static sensitivity
FDD-LTE Band 1/3/5/7/8: higher than –100 dBm/5 MHz
TD-LTE Band 34/38/39/40/41: higher than –98 dBm/5 MHz
WCDMA Band 1/2/5/8: higher than –104 dBm/5 MHz
Operating temperature: –20ºC to +60ºC (not being charged)
Temperature
Storage temperature: –20ºC to +35ºC, shorter than six months

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 Jackman Advanced Maintenance Manual INTERNAL

Item Description
Humidity Operating humidity: 5% to 95% RH

Specifications vary by product version. For details, see the product overview document.

3 PCBA Working Principle

The conceptual block diagram is shown in the following figure.

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 Jackman Advanced Maintenance Manual INTERNAL

The Hi6260 is an SoC that supports photo taking, HD video codec, 3D games, and other multimedia applications, as well as communication service applications.
This chip includes the application processor ACPU, MCU, GPU, video codec, ISP, DSS, and other hardware acceleration modules, GUTCL Modem Baseband
used for communication service processing, DDR controller module, as well as other external on-chip components including I2C and UART.
The Hi6555 supplies power to the memory, Wi-Fi, GPS, RF, and other external components, and controls the power-on and power-off sequence of the entire
system and low power consumption. The Hi6555 also provides the overall reset signal output of the hardware subsystem, 32.768 kHz sleep clock, RTC, and the
HKADC module that detects the hardware subsystem status.

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 Jackman Advanced Maintenance Manual INTERNAL

The Hi6353 is the RF signal processing chip to realize the wireless data transmission and reception, with support for GSM (including EDGE), WCDMA, TDS,
CDMA, and LTE modes, and diversity reception.
Based on the logical functions, the board can be divided into four subsystems: baseband, RF, power supply, and user interfaces. The following table describes the
modules and units subordinated to each subsystem and their functions.

Subsystem Module Unit Function

Baseband Hi6260 Application unit 4 x Cortex A53 macrocore+4 x Cortex A53 microcore processor, communicates with the GPU module,
camera module, video module, communication module, and LPDDR3 module through the internal bus,
and connects to the SDIO, I2C, SPI, UART, USB, and other controllers, as well as the PHY through
the internal bus.
User interface The Hi6260 is an SoC that supports photo taking, HD video codec, 3D games, and other multimedia
processing unit applications, as well as communication service applications. This chip includes the application
processor ACPU, MCU, GPU, video codec, ISP, DSS, and other hardware acceleration modules,
GUTCL Modem Baseband used for communication service processing, DDR controller module,
as well as other external on-chip components including I2C and UART.
Multimedia and Provides the MPEG/JPEG hardware engine, game engine, JAVA accelerator, and MP3/MMS/MIDI
game engine functions.

Modem unit The protocol processor includes one Cortex A7 processor and two BBE16 DSPs. The baseband part
includes the ABB and DBB for analog and digital baseband processing respectively.

Hi6555 PMU The Hi6555 is an integrated chip of power management, audio codec management, and multiple
interfaces, supporting smartphones and tablets. It provides four BUCKs, thirty-two LDOs, one low
voltage switch, one 13-channel, 12-bit HKADC, analog signal that can detect thirteen external
channels, two 10-bit DACs, 32 kHz and 19.2 MHz clocks, five LED current-driven ports, SSI
high-speed bus interface, and abnormal terminal signal output.
Hi6422 Secondary PMU The Hi6422 is a four-phase BUCK power supply chip for the SoC's ACPU macrocores, ACPU
microcores, and GPU. It provides four BUCKs, SSI high-speed bus interface, abnormal terminal signal
output, undervoltage/overvoltage protection, overheat protection, and overcurrent protection.

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 Jackman Advanced Maintenance Manual INTERNAL

Subsystem Module Unit Function

eMMC eMMC features, This module stores programs and NV items. The storage is 64 or 128 GB.
power consumption,
and file system
support
LPDDR4 RAM for running applications, 4 GB/6 GB
RAM
Crystal 38.4M DCXO This module generates the highly accurate 38.4MHz local reference clock.
oscillator and
frequency
synthesizer
RF GSM This module performs the RF function of GSM signal transmission and reception. It includes the RF
transmission chip, PMU, and peripheral circuits.
and reception
GPS GPS signal This module receives and processes GPS signals, mainly including the Hi1102 chip and peripheral
reception unit circuits.
Bluetooth Bluetooth unit Implements the Bluetooth baseband function, and transmits and receives RF signals. The module
interface mainly includes the Hi1102 and its peripheral circuits.
Wi-Fi Wi-Fi unit This module implements the Wi-Fi baseband function, and transmits and receives RF signals. The
interface module mainly includes the Wi-Fi part of the Hi1102 and peripheral circuits.
Crystal 38.4 MHz TCXO This module generates the highly accurate 38.4 MHz TCXO.
oscillator and control circuit
Antenna External antenna, This unit provides built-in antennas for communication. It supports WCDMA high and low frequency
internal interface bands. EDGE+ phone's antennas include the main antenna, Wi-Fi/Bluetooth/GPS antenna, NFC
components, and antenna (supported on some editions), and GSM antenna for the secondary SIM card.
antenna protection

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 Jackman Advanced Maintenance Manual INTERNAL

Subsystem Module Unit Function

User interface UART UART3 is used for the Bluetooth, Wi-Fi, and FM chips.
interface
USB interface Drive, protective Includes the unit circuits, such as the peripheral USB interface circuits, protective circuits, and
circuits, and output interface connectors in the SoC and MHL subsystems. It is a main data service channel for engineering
interface prototypes and is also used for device commissioning and testing during the R&D process.
components
SIM card Power supply, Refers to the SIM card holder and connected circuits.
interface protective circuits,
and SIM card holder
Keypad and Keypad drive The volume buttons are monitored using the interruption monitoring method through the GPIO.
backlight circuit, external
keypad, and LED
backlight control
circuit
Color LCD LCD drive, interface The main LCD is of 1920 x 1080 pixels. The LCD backlight brightness adopts CABC.
and backlight mode, and backlight
control
Speaker Drive mode, Plays polyphonic ringtones for incoming calls. The maximum power of the speaker is 500 mW. This
connection mode, module features good frequency response to play 20 Hz to 20 kHz audio files and can also be used as a
and speaker mono speaker to play MP3 files.
components
Receiver Drive mode, The power of the receiver for calls must be less than 30 mW.
connection mode,
and receiver
components

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 Jackman Advanced Maintenance Manual INTERNAL

Subsystem Module Unit Function

Microphone Interface circuit, This module is a built-in microphone, with dual silicon microphone noise reduction.
connection mode,
and microphone
components
Headset Headset, headset The phone provides a headset jack for call output and MP3 output. The microphone is located on the
jack circuit, and headset wire to pick up sound.
microphone
interface circuit
Motor Drive mode, The motor vibrates when a call comes in.
interface connection mode,
and motor
Accelerometer I2C interface control Senses acceleration. It is an auxiliary module of the game engine.
Gyroscope I2C interface control Uses the 3-axis angular rate sensor.
Compass I2C interface control Uses the geomagnetic sensor.
Proximity I2C interface control Senses ambient light and proximity light.
sensor
(Optional) I2C interface control This module senses the barometric pressure.
barometer
Power supply Built-in Li-ion battery and Li-ion polymer battery with standard output of 4.4 V/4000 mAh. It is required that the
battery interface component charge/discharge lifecycle is greater than 500 times. The battery must meet the GB/T 18287 standard.
Power Power distribution Includes filtering networks and cables for the power supply.
distribution network
network and
power Backup battery PMIC charges the capacitor for maintaining the RTC current.
management

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 Jackman Advanced Maintenance Manual INTERNAL

Subsystem Module Unit Function

management Power management This unit indicates the LDO, which flexibly manages the power supply. The PCBA software manages
of PCBA circuits power supplies to circuits on the PCBA based on the service status, protocols, or power-saving
(power-on and analysis to reduce power consumption. The three-channel 32 kHz clock is provided.
power-off analysis)
Voltameter Supports management of built-in and removable batteries, I2C bus communication, battery detection,
and battery level inspection in different scenarios.
Charging IC Supports dynamic path management, charges the battery while providing power, and prioritizes power
supply.
RF PMIC Provides the RF core voltage.

4 PCBA Components and BOM Information

The layout of PCBA components is shown in the following figures.
PCBA components on the top side are shown in the following figure.

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 Jackman Advanced Maintenance Manual INTERNAL

PCBA components on the bottom side are shown in the following figure.

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 Jackman Advanced Maintenance Manual INTERNAL

Components on the top side of the PCBA for regions outside of China are shown in the following figure.

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 Jackman Advanced Maintenance Manual INTERNAL

Components on the bottom side of the PCBA for regions outside of China are shown in the following figure.

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 Jackman Advanced Maintenance Manual INTERNAL

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 Jackman Advanced Maintenance Manual INTERNAL

4.1 Material BOM Information

Table 4-1 BOM information about components the top side
No. Designator Item BOM Code
1 U300 Baseband processor Hi6260 39200881
2 U300-POP DDR 40020491 (3 GB)
40020492 (4 GB)
40020493 (6 GB)
3 U1601 Charging IC 39070313
4 U1520 ACR chip (only for the TL00) 39070381
5 U1702 LCD bias voltage drive IC 39111334
6 U2701 Accelerometer and gyroscope 38140273
7 J2801/J2802 Three-card SIM card holder 14241312
8 J2803 Three-card SD card holder 14241313
9 F2801 Three-card holder cover 14241314
10 U1402 eMMC 40061028(32G)
40061006(64G)
40061007(128G)
11 Tcxo6101 Temperature compensated oscillator 12070082
12 Led2901 Tri-color indicator 15020254
13 U6301 5 GHz Wi-Fi FEM(available only in the AL00/LX1C) 47150685

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No. Designator Item BOM Code

14 U6001 Hi1102 4-in-1 chip 35020892
15 U3201 DC-DC for PA 39110714
16 U6801 External boost power supply 39110908
17 U7201 Three-output passive tunable power drive IC 39070267
18 U6802 NFC (available only in the LX1C) 39210385

Table 4-2 BOM information about components the top side

No. Designator Item BOM Code
11 Mic2501 Secondary microphone 22050170
12 J1701 LCD connector 14241006
13 LED1801 Flash 15020336
14 J1901 Rear camera connector (13 MP) 14241006
15 J1902 Rear camera connector (2 MP) 14241008
16 U1801 Flash drive chip 39111181
17 U1701 Two-channel LCD backlight drive 39111417
18 J2702 Fingerprint sensor connector 14240692
19 J2101 Main FPC connector 14240375
20 J1501 Battery connector 14241048

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No. Designator Item BOM Code

21 U1001 PMU chip 39200882
22 U1301 Secondary PMU 35021065
23 U2305 Gravity sensor 38140099
24 J1801 Front camera connector (16 MP) 14241008
25 J1802 Front camera connector (2 MP) 14241008
26 U3301 Multi-mode multi-frequency band RF transceiver Hi6353 39200865
27 U4900 RF low noise amplifier (703 –2690 MHz) 47090164
28 U4500 RF switch-699–2690 MHz-DiFEM 47140301
29 U3500 RF multi-functional component (TXM, with SP16T) 47150488
30 U3600 RF multi-functional component -3 GHz 4 GHz MB+HB MMMB 47150675
(China) PA (5 MBs+4 HBs)-Phase 3
31 U3601 RF multi-functional component-APT 3 GHz 4 GHz LB MMMB PA 47150674
(China) (3-in-7-out)
32 U3600 RF multi-functional component-3 GHz 4 GHz (5 LBs, 5 MBs, 4 47150676
(Regions HBs w/o GSM) MMMB PA-Phase 5
outside
China)

Attachments: maintenance circuit and component layout diagrams (watermarks required)

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4.2 Checking the PCBA Version Information

4.2.1 Checking the Phone Version

Version Information on the PCBA

There is text similar to "HLXJKMM" on the PCBA of the phone, as shown in the following figure.
HL1JKMM (editions with the separation mode in China): AL00/TL00
HL2JKMM (eMCP 4 GB+64 GB edition in China): AL00a
HL3JKMM (editions with the separation mode for regions outside China): LX1/LX2/LX3
HL4JKMM (editions with the separation mode in Canada): L4CA
HL5JKMM (eMCP 4 GB+128 GB edition in China): AL00b

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Version Information on the USB sub-board

The USB sub-board of the Jackman has three resistors, which are in the red box in the following figure. Refer to the following table to identify the version
information on USB sub-board.

External Model Resistor 1 Resistor 2 Resistor 3

JKM-AL00/TL00 Not mounted Not mounted Not mounted

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External Model Resistor 1 Resistor 2 Resistor 3

JKM-LX1/LX2/LX3 Not mounted Not mounted Mounted
JKM-AL00a Mounted Not mounted Not mounted

4.2.2 Checking the Memory Configuration Information

The Jackman memory configurations are classified into the eMMC+DDR separation solution and the eMCP integrated solution.

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In eMCP integration mode, the memory is configured as 4+64, that is, 4 GB memory and 64 GB flash memory. The eMMC+DDR separation modes include 4+64,
4+128, 6+64, 3+64, and 4+32. On the PCBA, the eMCP, eMMC, and DDR vendor models are the unique identifiers for determining memory configuration
information. You can check their manufacturer identifiers of the eMCP, eMMC, and DDR to obtain the corresponding internal storage configuration information.
The following figure shows the position of the eMCP slave PCBA in eMCP integration mode.

eMMC

PoP, SoC,
and DDR

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To confirm the memory configuration information about an eMMC+DDR separation-type PCBA, confirm the manufacturer model of the eMMC and DDR. The
following figure shows the positions of the eMMC and DDR.

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5 Maintenance Tools
Name: GPIB card
Usage: RF calibration (CBT)

Name: GPIB cable

Usage: RF calibration (CBT)

Name: programmable power supply

(Keithley 2303/2306 or Agilent 66311B)
Usage: to supply power to the PCBA during RF
calibration (CBT)

Name: CMU200 (includes K47 and K48

options)
W2100/1900/850, GSM850/900/1800/1900
V4.3 or later
Usage: RF calibration (CBT)

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Name: Jackman TP removing fixture

BOM code: 02430MDC+02430JUK
Usage: to remove the TP (applicable to
HLRCs)

Name: Jackman TP press-fitting fixture

BOM code: 02430GTN
Usage: to install and press-fit the TP
(applicable to HLRCs)

Name: loading test fixture

BOM code: 44044GYX
Usage: JTAG loading and RF calibration
(applicable to HLRCs)

Name: physical number modification dongle

BOM code: GJ000078
Usage: to modify IMEIs and write SIMLOCK
information (applicable to HLRCs)

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Name: JTAG loading tool

BOM code: GJ000084
Usage: JTAG loading of the boot software
(applicable to HLRCs)

Name: JTAG tool dongle

BOM code: GJ000021
Usage: to authorize running of the JTAG
software (applicable to HLRCs)

6 Software Maintenance Guide

6.1 Software Maintenance Guide (Including Tool Usage Instructions)

Jackman Software
Maintenance Guide.docx

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6.2 Maintenance Guide for Running Issues

Reworking Guide
to Issues Found in the Jackman Running Test.doc

6.3 Description of Erasing Customer Data

According to the Huawei cyber security requirements, customer data from security-sensitive countries is forbidden from being sent to China without written
authorization from the customer. To ensure that, during manufacturing and maintenance, customer data has been erased in security-sensitive countries before the
materials are transferred to a third-party or out of areas allowed by the customer's country, for example, transferred to China, the R&D department is required to
provide a solution for erasing storage data.

6.3.1 Object
All the user data stored in the phone's data partition needs to be erased.

6.3.2 Method
Go to Settings > System > Reset > Factory data reset, select Erase internal storage, and touch RESET PHONE.

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6.3.3 Verification
After data is erased, a message indicating that the phone has been restored to factory settings is displayed on the screen.

6.3.4 Restoration of Non-customer Data

Low-level formatting is able to back up and recover non-customer data. Ensure that the phone is not powered off during low-level formatting.

7 7 Maintenance Guide
7.1 Hardware & RF Maintenance Guide (Including Tool Instructions)

Jackman Hardware RF Tool Use Jackman Power-on

Maintenance Guide.docx
Instructions.docx Sequence

7.2 List of Thermal Resistance Values of Johnson Thermosensitive Components

Project Designator BOM Code Maximum Thermal Resistance Value Description
Heating temperature: 255°C–260°C
Jackman J1901 14241006 Rear camera BTB connector
Heating duration: 30s–60s
Heating temperature: 255°C–260°C
Jackman J1902 14241008 Rear camera BTB connector
Heating duration: 30s–60s
Heating temperature: 255°C–260°C
Jackman J1801 14241008 Front camera BTB connector
Heating duration: 30s–60s

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Project Designator BOM Code Maximum Thermal Resistance Value Description

Heating temperature: 255°C–260°C
Jackman J1802 14241008 Front camera BTB connector
Heating duration: 30s–60s
Heating temperature: 260°C
Jackman J2101 14240375 Main FPC BTB connector
Heating duration: at most 10s
Heating temperature: 255°C–260°C
Jackman J1701 14241006 LCD BTB connector
Heating duration: 30s–60s
Heating temperature: 340°C
Jackman J1501 14241048 Battery BTB connector
Heating duration: at most 10s
Heating temperature: 250°C
Jackman J3402 14240433 Coaxial cable base
Heating duration: at most 10s

J3400 and Heating temperature: 260°C

Jackman 14240928 RF switch
J3401 Heating duration: at most 10s
Heating temperature: 260°C
Jackman J2702 14240692 Fingerprint sensor BTB connector
Heating duration: at most 10s
Heating temperature: 255°C–260°C
Jackman LED2901 15020254 Tri-color indicator
Heating duration: at most 30s
Heating temperature: 260°C
Jackman MIC2501 22050170 Microphone
Heating duration: at most 30s
Jackman U300 39200881 Heating temperature: 360°C Hi6260
Heating temperature: 260°C
Jackman U1301 35021065 Hi6422 V213
Heating duration: 10s–30s

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Project Designator BOM Code Maximum Thermal Resistance Value Description

Heating temperature: 260°C
Jackman U1001 39200882 Hi6555 V200
Heating duration: 10s–30s
Jackman U6201 35020892 Heating temperature: 360°C Hi1102

(The data is collected from the Huawei BOM system.)

8 PCBA Maintenance Operation Guide

8.1 Tool List
Tool Recommended Model Description Image
ESD tweezers Vetus ESD-11 Use tweezers whose tips are burnished to 0.1 mm in
thickness to remove and scrap glue. Use
unburnished tweezers to remove, clamp, and solder
chips.

Heat gun Digital heat gun NIC 855PG Two types of nozzles are used:
● Square nozzle: 15 mm x 15 mm
● Round nozzle (delivered with the equipment):
11.5 mm diameter

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Tool Recommended Model Description Image

Heat gun STEINEL Nozzle: 15 mm diameter

PCBA Fixture BOM code: 02430THE To fix the PCBA

HD electronic Optical M20x-HD 1080p To check the soldering position and appearance
microscope

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8.2 Maintenance and Verification Procedure

8.2.1 Overall Procedure of Repairing a Component
Removing the SoC shielding case > Removing the chip glue (thermal gel/UF glue) > Removing the glue dispensed chip > Clearing the residual adhesive and
cleaning the pads > Aligning the chip > Heating and soldering the chip > Inspecting the appearance > Inspecting the appearance using an X-ray machine >
Performing the DBC test, CT, and BT > Powering on the phone to check that it runs properly

8.3 Maintenance Specifications and Requirements

8.3.1 Temperature Parameters
Parameter Typical Value Recommended Value

Duration in the constant temperature zone (165°C to 60–100s 70–90s

217°C)
Minimum reflow peak temperature 230°C 240°C±5°C
Maximum reflow peak temperature 250°C Temperature difference between key components: below 10°C
Duration for the temperature to stay above the liquid state 35–90s 45–80s
line (217°C)
Duration for the temperature to stay above 230°C 25–50s
Temperature decrease slope in the cooling stage –2°C/s to –5°C/s
(temperature decreasing from 217°C to 120°C)
Note: For items not specified in this table, see section 3.4.3 "Temperature Curve Setting" of the Huawei Device PCBA Maintenance Specifications.

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8.3.2 Glue Removal Temperature Requirement

Use a STEINEL heat gun whose nozzle diameter is 15 mm, and set the temperature to 190°C±10°C.

8.3.3 Digital Heat Gun Temperatures for Removing and Soldering Chips

8.4 Verification
8.4.1 Removing he Shielding Case
Components circled by the red boxes in the following figure are glue dispensed components. Remove the shielding case and remove the thermal gel.

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8.4.2 Removing the Glue (for Glue Dispensed Components to be Verified)

Use a STEINEL heat gun, set the temperature to 190°C±10°C, and heat the glue at the edge of the chip. After the glue is softened, use the burnished tweezers to
remove the glue along the edge of the component. Move the tweezers slowly and slightly to remove glue for multiple times until the glue between the chip and
peripheral components are removed. Use a magnifier to check that the glue is completely removed and peripheral components are not damaged.

8.4.3 Removing the Glue Dispensed Chips

Removing the SoC

Place the PCBA in the corresponding fixture, attach two heat dissipation pads to the UFS chip, set the temperature phases of the digital heat gun NIC 855PG, and
use the heat gun to heat the SoC. The distance between the air nozzle and SoC is 3–5 mm. When the last 10s–12s of the fifth temperature phase arrives, use one tip
of the tweezers to insert into the bottom of the SoC to be repaired, clamp the SoC, and lift it vertically.

Removing the UFS Chip

Place the PCBA in the corresponding fixture, attach two heat dissipation pads to the SoC, set the temperature phases of the digital heat gun NIC 855PG, and use
the heat gun to heat the UFS chip. Remove the UFS chip in the same way of removing the SoC.

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Repairing Other Components

PMU U1001: Place the PCBA in the corresponding fixture and use the heat gun whose temperature reaches 340°C to heat the PCBA for 60s and vertically take out
the shielding frame.

8.4.4 Clearing the PCBA Pads

After the chip is removed, do not add solder flux. Heat the PCBA at 190°C±10°C, use tweezers to remove the glue from the pads and chip edges, add solder flux,
and use the soldering iron to clean the pads. Use a microscope to check whether the PCBA is clean. If no, clear the glue until the PCBA is clean. After the pads and
areas around the chip are cleaned, place a lint-free cloth on the pads. Dip an ESD brush in the board-cleaning solvent, move the brush back and forth on the
lint-free cloth to clear smudges from the pads, and use a microscope to check that the pads are clean.

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8.4.5 Aligning and Soldering the New Components

Use a 190°C heat gun to heat the pads for 15s, add solder paste to the pads, align the new component with the silkscreen based on the polarities, and use the heat
gun to heat and solder the component. The soldering conditions are the same as those in the procedure for removing components. Move away the heat gun when
the fifth phase of soldering enters the last 10s. Leave the PCBA for 20s until it cools down, and the chip soldering is complete.

8.4.6 Cosmetic Inspection

For components (such as chips and BTB connectors) whose pins can be inspected, use a magnifying device to perform a cosmetic inspection after repair and
check whether there are defects, such as misalignment and missing soldering.

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8.4.7 X-ray Inspection

For components (such as BGA and QFN components) whose pins cannot be inspected and components in the shielding case, use X-ray to inspect soldering joints
after repair and check whether there are defects, such as solder bridges, missing soldering, and misalignment.
Attachments: repair profiles

9 Assembly and Disassembly Guide

9.1 Disassembly Guide Comentado [g1]: 待粘贴英文版拆机指导

9.2 Requirements for Putting Repaired Defective Products into Production and Reusing Materials
⚫ Putting repaired defective products into production must comply with the Mobile Phone Repair Process General Guide (DKBA0.101.1891).
⚫ To determine whether removed materials can be reused, see sheet "Disassembly Material List" in the Jackman General Disassembly Guide. Other materials
not mentioned in the table cannot be reused if they have cosmetic or functional defects.

9.3 Assembly Guide Comentado [g2]: 待粘贴英文版拆机指导

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10 Solder Joints on the PCB and BGA Chip

Red (R: 255, G: 0, B: 0) : vacant point

Blue (R: 0, G: 0, B: 255) : signal

Attachment:

Board HL1:

BoardHL3:

USB sub-board:
Solder joints in detail:
The SoC solder joints are shown in the following figure.

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The eMMC solder joints are shown in the following figure.

The PMU solder joints are shown in the following figure.

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 Huawei Y9 2019 (Jackman) Quick Maintenance GuideV1.0.xlsx 文档密级

Huawei Y9 2019 (Jackman) Quick Maintenance Guide

V1.0

Version Date Applicable Area Application Scope Version Change Description

V1.0 12/10/2018 Global ASC New draft

Huawei Technologies Co.， Ltd.

All rights reserved

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 Huawei Y9 2019 (Jackman) Quick Maintenance GuideV1.0.xlsx 文档密级

Contents
ntenance Guide 1.Exploded View Document Preparation / Modification Record
2.PCBA Components Version
3.Startup Failure V1.0
4.Battary and Charging Failure
5.Signal Failure
6.Display and Touch Failure
rsion Change Description 7.System Software Failure
New draft 8.Connection&Device Interaction Failure
9.Audio Failure
10.Video and Camera Failure
11.Card Identification Failure
12.Auxiliary Function Failure
13.Others Failure

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 Huawei Y9 2019 (Jackman) Quick Maintenance GuideV1.0.xlsx 文档密级

Document Preparation / Modification Record

Prepared/Revised On Revised Contents and Reasons
12/10/2018 Initial release

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