Chemical Resistance for

Ambient Cure Epoxy Formulations

 CURING AGENT SELECTION
Epoxy formulations are
The selection of a curing agent to be used in a chemically resistant epoxy formulation
frequently chosen over other can be difficult and time consuming. Amine curing agents for chemically resistant
systems when chemical epoxy systems can be separated into three basic categories:
resistance is an important
attribute. The resistance of • Aliphatic amine curing agents
• Cycloaliphatic amine curing agents
the cured epoxy system will
• Aromatic amine curing agents
depend on the curing agent,
resin, diluent, and additives Historically, aromatic amine curing agents, specifically those based on methylene-
chosen. Formulators usually dianiline (MDA), were used in epoxy formulations to achieve excellent resistance to
solvents, mineral acids and organic acids. However, regulation of aromatic amines,
need to develop products
such as MDA, has prompted formulators to consider alternative curing agents.
where attributes in addition
to chemical resistance are Cycloaliphatic amine-cured systems can offer handling, resistance to aqueous
important, so understanding solutions, resistance to solvents, and resistance to mineral acids comparable to
aromatic amine-cured systems. Therefore, cycloaliphatic amine curing agents are
the trade off and choices
now commonly used in chemically resistant epoxy systems.
involved is critical.

Evonik offers numerous

Key Factors
products to help epoxy
In selecting an epoxy curing agent for a chemically resistant formulation,
formulators achieve the desired a number of factors must be taken into consideration, including:
results. This bulletin reviews
choices in both epoxy curing • Classes of chemicals to which resistance is required
• Degree of resistance required
agents and resins, and includes
(i.e., impervious versus minimum penetration)
recommendations to provide • Duration of resistance required
specific chemical resistance • Processing and application requirements
while addressing the • Appearance, color and weatherability
influence on other key
attributes. Some application
areas where this information
and these products will be
most useful are tank linings,
flooring, secondary
containment, maintenance
coatings, marine coatings,
mortars, and grouts.

The format includes

summary sections on curing
agent and resin selection,
and the appendices include
detailed data for the curing
agent and resin combinations
evaluated.
 AMINE CURING AGENTS FOR CHEMICALLY RESISTANT SYSTEMS
Evonik offers a range of modified cycloaliphatic amines and (such as Ancamine 2432, 1608, or 1638) can give improved
modified aliphatic amines for use as curing agents in ambient performance compared to Ancamine 2280 curing agent alone.
cure epoxy formulations. Curing agents designed specifically
for use in ambient cure chemically resistant systems are: For organic acid (such as lactic and acetic acid), Ancamine
2423 and Ancamine 2432 curing agents give better resistance
• Ancamine® 2280 • Ancamine® 1618 • Ancamine® 2432 than Ancamine 2280. Improved resistance to alcohols can be
• Ancamine® 2422 • Ancamine® 2143 • Ancamine® 1693 obtained with Ancamine 2432 or Ancamine 1693 curing agent.
• Ancamine® 2423 • Ancamine® 2286
For improved MEK (methyl ethyl ketone) resistance, Ancamine
Each of these curing agents offers distinct handling or performance 2432 or Ancamine 1693 are recommended. In ambient cure
advantages over the others. In some cases, additional performance systems exposed to chemicals at elevated temperatures, Ancamine
advantages can be obtained by modifying or blending the curing 2280 can be modified with Ancamine 2432 curing agent for
agents. For example, a cycloaliphatic amine can be modified improved resistance. For the best resistance to chemicals at
with 10% to 30% by weight of a modified aliphatic amine, such elevated temperatures with an ambient cure system, we
as Ancamine 2432 curing agent, for faster cure and improved recommend Ancamine 2422 curing agent with multifunctional
solvent resistance. epoxy novolac resins. Refer to the Ancamine 2422 technical data
sheet for specific performance data and formulating guidelines.
Ancamine 2280 curing agent is the standard for chemically resistant
epoxy formulations; it imparts very good resistance to a wide range For the best resistance to chlorinated solvents (such as methylene
of acids, solvents and alcohols. However, an Ancamine 2280 cured chloride), Ancamine 2422 curing agent with multifunctional
system may not offer sufficient resistance to specific chemicals for epoxy novolac resins is recommended. The Ancamine 2422
specialty applications. Ancamine 2432 curing agent offers the systems also have good resistance to other very aggressive
highest overall chemical resistance. Figure 1 illustrates how reagents such as 30% nitric acid and phenol. Refer to the
other curing agents can be chosen as alternatives to Ancamine Ancamine 2422 technical data sheet for specific performance
2280 to impart improved resistance to specific chemicals. data and formulating guidelines.

In applications requiring better solvent resistance, Ancamine Appendix A shows detailed immersion test data for the curing
2432 or an 8:2 blend of Ancamine 2280 with an aliphatic amine agents with various epoxy resins in a wide range of chemicals.

FIGURE 1: CURING AGENT SELECTION FOR BEST CHEMICAL RESISTANCE IN AMBIENT CURE FORMULATIONS

ANCAMINE® 2432, or 8:2 2280:1608/1638

ANCAMINE® 2423 or 2432 Improved Solvent Resistance ANCAMINE® 2432 or 1693

Improved Organic Acid Resistance Improved Alcohol Resistance

ANCAMINE® 2280

Very good overall chemical resistance

ANCAMINE® 2422 with ANCAMINE® 2432 or 1693
MULTIFUNCTIONAL RESIN

Improved MEK Resistance

Best Chlorinated Solvent Resistance ANCAMINE® 2280 with 2432

Improved Elevated Temperature Resistance

ANCAMINE® 2422 with MULTIFUNCTIONAL RESIN

Improved Elevated Temperature Resistance

TABLE 1: HANDLING OF CURING AGENTS WITH BISPHENOL-A BASED (EEW=190) EPOXY RESIN

Curing Agent Mixed Viscosity1 Gel Time2, min. Thin Film Set Time,3
Curing Agent Viscosity (cP)
1
(cP) (150 g mass) tack free (h) 60° Film Gloss4
Ancamine 2280 450 3,300 50 6.0 105
Ancamine 2432 300 2,100 27 2.0 109
Ancamine 2143 600 1,600 42 7.0 103
Ancamine 1618 400 2,400 50 5.5 118
Ancamine 2423 1,200 4,300 17 3.5 120
Ancamine 1693 100 1,700 52 9.0 18
Ancamine 2286 60 1,700 40 6.0 79

Note: All data at 77°F (25°C). Please see last page for footnotes.

CHEMICAL RESISTANCE IN CONJUNCTION WITH OTHER ATTRIBUTES

In many applications, an epoxy system must have good chemical 2089M, 1856, 2205, 1608, or 1638) while maintaining good
resistance in addition to other attributes such as waterspot chemical resistance. Ancamine 2432 should be used as the
resistance, low color, rapid development of hardness, or low accelerator for maximum chemical resistance. Appendix C provides
temperature cure. Table 1 shows the handling and reactivity additional data on acceleration and hardness development.
characteristics of the curing agents formulated with standard
bisphenol-A based (DGEBA) liquid epoxy resin. Data describing All of the curing agents shown in Figure 2 provide good
handling of the curing agents with alternative epoxy resins are chemical resistance. However, selecting a curing agent for
shown in Appendix B. improved properties can result in lower resistance to certain
chemicals compared with Ancamine 2280. Resistance to acids
Ancamine 2280 offers the best resistance to amine blush and and alcohols may be lower with Ancamine 2143, 1618, or
waterspotting; it also gives very good through cure at low 2286 than with Ancamine 2280. Ancamine 2423 curing agent
temperatures. The selection chart shown in Figure 2 offers may show lower solvent and alcohol resistance than Ancamine
guidelines in choosing a chemically resistant curing agent when 2280. In some applications, the reduction in chemical
specific improvements in performance relative to Ancamine resistance can be minimized with proper epoxy resin selection
2280 are required. (see “Epoxy Resin Selection,” page 4, and data in Appendix A).
Ancamine 2432 curing agent offers comparable or better
For improved cure speed, curing agents can be accelerated resistance to most chemicals than Ancamine 2280.
with modified aliphatic amines (such as Ancamine 2432,
FIGURE 2: CHEMICALLY RESISTANT CURING AGENT SELECTION: ADDITIONAL PERFORMANCE CHARACTERISTICS

ANCAMINE® 2280 ANCAMINE® 2143, 1618, or 2432

Excellent resistance to blush and water spotting Improved Color Good Overall Chemical Resistance

ANCAMINE® 2423 or 2432

Rapid Development of Hardness

Improved
Cure Speed

ANCAMINE® 2286 or 1693

Reduced Viscosity

Accelerate with
ANCAMINE® 2423 ANCAMINE® 2432 Aliphatics ANCAMINE® 2143
(2432, 2089M,
Improved Color Better Chemical Resistance 1856, etc.) Very Good Waterspot Resistance

EPOXY RESIN SELECTION

Once the curing agent has been selected, the next step in difficult to use without modification in epoxy formulations.
formulating a chemically resistant epoxy system is to select the However, mixing a typical multifunctional novolac epoxy resin
epoxy resin that best meets both handling and performance (EEW~176) with a low viscosity bisphenol-F epoxy resin
requirements. The most commonly used epoxy resins are (EEW~172) can result in an epoxy resin equivalent in viscosity to
diglycidyl ether of bisphenol-A (DGEBA) liquid epoxy resins. standard bisphenol-A epoxy resin.
Bisphenol-A based epoxy resins are available in a wide range
of molecular weights. The standard bisphenol-A epoxy resin Finally, using a cresyl glycidyl ether (CGE-Epodil® 742) diluted
is a moderate viscosity liquid with an epoxide equivalent bisphenol-A epoxy resin improves handling and film appearance
weight of approximately 190 and a functionality of ~2. When compared to unmodified bisphenol-A epoxy resins while limiting
cured, bisphenol-A epoxy resins exhibit resistance to a wide the detrimental effect monofunctional diluents can have on che-
range of chemicals. mical resistance.

In specialty applications, the bisphenol-A epoxy resins may Thus, bisphenol-A, bisphenol-F, multifunctional novolac, and CGE
not offer sufficient resistance to solvents or to concentrated diluted epoxy resins can all be used in formulating chemically
mineral acids. In these applications, either diglycidyl ether resistant systems. Identifying specific handling and performance
of bisphenol-F (DGEBF) liquid epoxy resin or a blend of requirements will help to determine which epoxy resin is best
bisphenol-F epoxy resin and a multifunctional novolac epoxy suited for a given application. Figure 3 offers guidelines for
resin can be used. Difunctional bisphenol-F epoxy resin is choosing the right resin. Detailed data describing the chemical
typically a low viscosity liquid with an epoxide equivalent resistance of the amine-cured formulations with alternative epoxy
weight of approximately 172. Multifunctional novolac epoxy resins are included in Appendix A, and data describing formulation
resins are typically high viscosity epoxy resins that can be handling with alternative epoxy resins are described in Appendix B.
FIGURE 3: EPOXY RESIN SELECTION

10% CGE DILUTED

BISPHENOL-A BASED
EPOXY RESIN EEW=188

Improved film appearance

BISPHENOL-F BASED Reduced viscosity
EPOXY RESIN EEW=172 BISPHENOL-A BASED
EPOXY RESIN EEW=190 Maintained chemical resistance
Increased gel times
Improved solvent resistance
Industry standard Increased thin film set times
Improved 98% H2SO4 resistance
Good reactivity
Reduced viscosity
Good organic acid resistance
Increased gel times
Rapid development of hardness BISPHENOL-F/MULTIFUNCTIONAL
Increased thin film set times
EPOXY RESIN BLEND

Excellent 98% H2SO4 resistance

Improved solvent resistance
Reduced organic acid resistance

TABLE 2: CHEMICAL RESISTANCE FOR AMBIENT CURED FORMULATIONS

WITH BISPHENOL-A BASED (EEW=190) EPOXY RESIN

% Weight Change as a Function of Time

Reagent Ancamine 2280 Ancamine 2432 Ancamine 2143 Ancamine 1618 Ancamine 2423
3 days 28 days 3 days 28 days 3 days 28 days 3 days 28 days 3 days 28 days
Deionized Water 0.52 1.55 0.33 1.11 0.41 1.39 0.49 1.50 0.31 1.12
Methanol 9.38 7.16 6.38 9.55 10.20 8.07 7.93 -2.41 D@3 D@3
Ethanol 2.41 6.92 1.55 4.68 2.95 7.96 3.98 10.28 6.57 D@14
Toluene 0.05 2.26 0.17 0.99 0.53 2.79 0.40 2.86 1.32 19.20
Xylene 0.02 0.20 0.25 0.69 0.01 0.17 0.04 0.19 0.08 1.52
Butyl Cellosolve 0.56 2.41 0.31 1.18 0.79 3.15 1.65 5.31 4.12 13.78
Methyl Ethyl Ketone (MEK) 17.17 D@28 9.35 11.19 21.48 D@5 D@3 D@3 D@1 D@1
10% Lactic Acid 0.76 2.99 1.10 3.24 3.08 9.52 1.81 5.42 0.50 1.70
10% Acetic Acid 1.70 5.64 1.23 3.85 5.29 14.85 2.92 8.23 0.90 2.85
70% Sulfuric Acid 0.01 0.36 0.10 0.13 0.20 0.37 0.08 0.14 0.04 0.11
98% Sulfuric Acid D@1 D@1 NT NT D@1 D@1 D@1 D@1 D@1 D@1
50% Sodium Hydroxide -0.05 -0.09 0.04 0.09 0.04 0.00 -0.01 -0.04 -0.04 -0.02
10% Sodium Hypochlorite 0.49 1.16 0.27 0.93 0.42 1.08 0.51 1.36 0.11 0.78
1,1,1 Trichloroethane -0.02 0.64 0.18 0.43 0.02 0.20 0.02 -0.02 0.59 5.74

Note: Samples cured for 7 days at 77°F (25°C) before testing. Tested in accordance with ASTM D543-84.
 APPENDIX A: CHEMICAL FIGURE 4: WEIGHT CHANGE AS A FUNCTION OF TIME
RESISTANCE FOR AMBIENT
CURE EPOXY FORMULATIONS:
IMMERSION DATA

Chemical immersion studies, in accordance

with ASTM D543, were conducted using
formulations cured 7 days at 77°F (25°C).
One inch by three inch (1” x 3”) samples
of 1/8” thick castings were prepared and
fully immersed in the reagents. Three
samples of each formulation were
immersed in each reagent. Chemical
resistance is reported as the average
percentage weight change as a function
of time for 77°F (25°C) immersion.

For comparative chemical resistance

immersion data to be useful, both the
mechanism of chemical attack (swelling,
sample degradation, etc.) and the weight
change of the samples as a function of time
must be considered. For example, consider methanol. Weight change as a function of time is shown in Figure 4 for both of these
Ancamine 2280 cured formulations with formulations. Simply comparing the 28 day immersion data, the Ancamine 2280 cured
bisphenol-A epoxy resin and CGE diluted CGE diluted bisphenol-A epoxy resin may appear more resistant to methanol than
bisphenol-A epoxy resin immersed in Ancamine 2280 cured bisphenol-A epoxy resin. However, the CGE diluted bisphenol-A
epoxy resin formulation actually exhibits a higher maximum weight gain followed by
sample degradation in the form of weight loss. In addition, the CGE diluted bisphenol-A
epoxy resin formulation swells much more rapidly than the bisphenol-A epoxy resin
formulation. Thus, in cases involving aggressive chemical attack, examining both the
short term and long term immersion data gives a better picture of comparative chemical
Ancamine 1693 Ancamine 2286 resistance. When comparing data for formulations immersed in reagents such as
3 days 28 days 3 days 28 days
methanol, MEK, and 98% sulfuric acid, weight gain as a function of time must be
0.53 1.59 0.52 1.51
examined to more fully understand the resistance exhibited by the formulation and
8.46 8.21 11.74 5.07
the type of chemical attack that occurs. In compiling the immersion data, we have
1.97 5.57 3.76 10.35
included 3-day and 28-day weight change data for each formulation. Tables 2
1.37 ­— 0.44 2.12
0.11 1.67 0.04 0.18
through 5 detail the 3-day and 28- day chemical resistance results of various Ancamine
0.98 3.61 2.02 5.86 curing agents, with each resin, immersed in key reagents. Table 6 includes the chemical
15.62 11.88 D@3 D@3 resistance results for aliphatic amine-modified Ancamine 2280 and 2143 with
0.65 2.38 2.20 6.55 bisphenol-A epoxy resin, EEW=190.
1.68 5.62 3.32 9.27
0.06 -0.05 0.11 0.05 To simplify interpretation of the data, 3-day results for the best recommendations
D@1 D@1 D@1 D@1 with the most aggressive reagents for each resin are listed in bold. All of the curing
0.01 -0.04 0.64 0.54 agents give excellent resistance to water, 70% sulfuric acid, 50% sodium hydroxide,
0.54 1.26 0.47 1.22
and 10% sodium hypochlorite.
3.02 15.91 0.02 0.23

Ancamine 2422 curing agent formulated with multifunctional epoxy novolac resins
NT= not tested. D@X – Destroyed at X days. offers the best resistance to very aggressive reagents. Please refer to the Ancamine
2422 data sheet for immersion test results with these formulations.
TABLE 3: CHEMICAL RESISTANCE FOR AMBIENT CURED FORMULATIONS
WITH BISPHENOL-F BASED (EEW=172) EPOXY RESIN

% Weight Change as a Function of Time

Reagent Ancamine 2280 Ancamine 2432 Ancamine 2143 Ancamine 1618 Ancamine 2423
3 days 28 days 3 days 28 days 3 days 28 days 3 days 28 days 3 days 28 days
Deionized Water 0.68 1.73 0.43 1.30 0.35 1.39 0.58 1.74 0.35 1.30
Methanol 8.85 1.91 6.79 4.15 9.00 6.44 13.01 D@5 14.26 D@7
Ethanol 1.97 6.02 1.26 3.47 2.16 6.91 3.61 9.58 18.48 D@7
Toluene 0.00 0.72 0.12 0.37 0.05 1.82 0.05 0.78 0.02 3.17
Xylene 0.02 0.02 NT NT -0.01 0.32 0.11 0.09 NT NT
Butyl Cellosolve 0.30 1.08 NT NT 0.33 1.46 1.03 3.62 NT NT
Methyl Ethyl Ketone (MEK) D@3 D@3 7.29 7.87 15.34 9.70 16.63 D@5 D@1 D@1
10% Lactic Acid 0.92 3.35 NT NT 2.92 7.03 1.51 4.80 0.99 3.20
10% Acetic Acid 2.29 6.77 1.36 3.71 5.05 14.13 2.29 6.95 1.68 5.31
70% Sulfuric Acid 0.10 0.18 NT NT — 0.17 0.11 0.45 NT NT
98% Sulfuric Acid 1.17 -1.42 0.62 -0.01 1.57 — 0.77 -9.32 4.63 -15.57
50% Sodium Hydroxide 0.01 -0.02 NT NT -0.09 -0.15 -0.01 -0.01 NT NT
10% Sodium Hypochlorite 0.57 1.24 NT NT 0.29 0.94 0.54 1.48 NT NT
1,1,1 Trichloroethane 0.04 0.36 NT NT 0.02 0.36 0.02 0.29 NT NT

Note: Samples cured for 7 days at 77°F (25°C) before testing. Tested in accordance with ASTM D543-84.

TABLE 4: CHEMICAL RESISTANCE FOR AMBIENT CURED FORMULATIONS

WITH BISPHENOL-F/NOVOLAC RESIN BLEND*

% Weight Change as a Function of Time

Reagent Ancamine 2280 Ancamine 2432 Ancamine 2143 Ancamine 1618 Ancamine 2423
3 days 28 days 3 days 28 days 3 days 28 days 3 days 28 days 3 days 28 days
Deionized Water 0.55 1.61 0.48 1.43 0.48 1.36 0.59 1.68 0.36 1.33
Methanol 8.94 8.76 6.82 7.07 9.05 10.50 11.88 1.26 D@3 D@3
Ethanol 1.92 5.19 1.24 3.45 2.09 6.10 2.98 8.58 17.02 D@7
Toluene 0.05 0.56 0.15 0.36 5.07 5.63 4.99 0.68 0.13 4.35
Xylene 0.00 0.09 NT NT 0.01 0.24 -0.03 0.05 NT NT
Butyl Cellosolve 0.25 0.97 NT NT 0.32 1.24 0.75 2.80 NT NT
Methyl Ethyl Ketone (MEK) 15.70 D@5 6.40 6.74 12.75 9.00 18.25 13.20 D@1 D@1
10% Lactic Acid 1.06 3.35 NT NT 3.31 9.56 1.75 5.09 0.87 2.78
10% Acetic Acid 2.25 6.64 1.57 4.19 5.88 16.57 2.83 7.68 1.46 4.55
70% Sulfuric Acid 0.03 0.08 NT NT 0.08 0.30 0.22 0.35 NT NT
98% Sulfuric Acid 0.46 -1.63 0.72 0.45 0.67 -3.32 0.36 -6.10 7.51 -24.29
50% Sodium Hydroxide -0.01 -0.04 NT NT -0.01 -0.01 -0.04 -0.05 NT NT
10% Sodium Hypochlorite 0.55 1.24 NT NT 0.44 1.17 0.51 1.31 NT NT
1,1,1 Trichloroethane 0.07 0.35 NT NT 0.04 0.22 0.05 0.34 NT NT

*60% by weight bisphenol-F based epoxy resin, EEW=172, and 40% by weight epoxy novolac resin, EEW=176.
Note: Samples cured for 7 days at 77 °F (25 °C) before testing. Tested in accordance with ASTM D543-84.
 Ancamine 1693 Ancamine 2286
3 days 28 days 3 days 28 days
0.55 1.62 0.48 1.63
7.29 7.28 12.26 D@5
1.42 4.25 3.37 9.22
0.13 1.98 0.07 0.37
-0.03 0.10 0.04 0.09
0.28 0.98 1.05 3.30
14.30 5.33 19.28 D@5
0.84 2.94 2.84 8.05
1.92 6.58 3.85 10.77
0.03 -4.32 0.17 0.44
1.86 -3.20 1.53 -9.75
-0.04 -0.12 0.03 0.02
0.46 1.14 0.50 1.27
0.01 0.20 -0.01 0.12

NT= not tested. D@X – Destroyed at X days.

Ancamine 1693 Ancamine 2286

3 days 28 days 3 days 28 days
0.62 1.71 0.53 1.69
8.25 9.69 11.97 2.50
1.62 4.59 3.03 8.70
0.06 1.32 0.07 0.61
0.02 0.05 -0.01 0.09
0.35 1.11 0.84 2.92
14.63 4.54 20.00 11.75
1.12 3.46 3.24 8.70
2.50 7.51 4.50 12.69
0.04 0.11 0.18 0.65
0.65 0.27 0.58 -4.46
-0.11 -0.25 -0.02 -0.04
0.43 0.94 0.56 1.48
0.05 1.07 0.04 0.24

NT = not tested. D@X – Destroyed at X days.

TABLE 5: CHEMICAL RESISTANCE FOR AMBIENT CURED FORMULATIONS
WITH 10% CGE DILUTED BISPHENOL-A BASED EPOXY RESIN, EEW=188

% Weight Change as a Function of Time

Reagent Ancamine 2280 Ancamine 2143 Ancamine 1618 Ancamine 1693 Ancamine 2286
3 days 28 days 3 days 28 days 3 days 28 days 3 days 28 days 3 days 28 days
Deionized Water 0.57 1.55 0.43 1.32 0.53 1.53 0.47 1.39 0.45 1.51
Methanol 11.22 1.11 10.85 2.50 12.90 2.52 9.09 6.25 14.29 5.90
Ethanol 3.11 7.38 3.14 8.94 4.26 10.01 2.25 5.81 4.62 12.08
Toluene 0.23 3.24 0.44 3.81 0.46 5.64 2.62 22.15 0.29 2.75
Xylene 0.02 0.12 0.04 0.27 0.04 0.58 0.40 2.87 0.03 0.19
Butyl Cellosolve 0.99 3.17 1.07 4.30 1.97 7.74 1.37 4.48 2.36 8.92
Methyl Ethyl Ketone (MEK) 16.17 D@5 21.38 14.97 D@1 D@1 16.12 11.45 D@1 D@1
10% Lactic Acid 0.97 3.03 2.43 7.40 0.92 3.04 0.72 2.39 1.87 6.01
10% Acetic Acid 2.14 6.30 4.31 12.46 1.95 5.95 1.69 5.25 2.90 8.68
70% Sulfuric Acid 0.06 0.13 0.05 0.09 0.02 0.10 -0.05 -0.17 0.16 0.16
98% Sulfuric Acid D@1 D@1 D@1 D@1 D@1 D@1 D@1 D@1 D@1 D@1
50% Sodium Hydroxide -0.02 -0.09 0.04 -0.05 -0.03 -0.09 -0.21 -0.33 0.00 -0.03
10% Sodium Hypochlorite 0.59 1.24 0.40 1.19 0.51 1.33 0.48 1.23 0.39 1.25
1,1,1 Trichloroethane 0.03 0.24 0.03 0.27 0.05 0.32 0.01 0.40 0.03 0.47

Note: Samples cured for 7 days at 77 °F (25 °C) before testing. Tested in accordance with ASTM D543-84.
NT= not tested. D@X – Destroyed at X days.

TABLE 6: CHEMICAL RESISTANCE FOR ALIPHATIC AMINE MODIFIED FORMULATIONS

WITH BISPHENOL-A EPOXY RESIN, EEW=190

% Weight Change as a Function of Time

Reagent 8:2 2280:1608 8:2 2280:1638 8:2 2280:TETA 9:1 2280:TETA 8:2 2143:TETA 9:1 2143:TETA

3 28 3 28 3 28 3 28 3 28 3 28
days days days days days days days days days days days days
Deionized
0.44 1.29 0.40 1.25 0.36 1.20 0.47 1.26 0.32 1.16 0.32 1.08
Water
Methanol 8.55 10.83 7.91 10.11 7.44 12.07 8.36 14.15 7.21 14.06 7.95 16.54
Methyl Ethyl
D@1 D@1 25.69 D@7 D@3 D@3 D@1 D@1 25.91 17.54 D@1 D@1
Ketone (MEK)
10% Acetic
2.21 5.90 2.67 6.76 4.16 10.52 1.54 5.13 10.73 25.84 2.95 9.51
Acid
98% Sulfuric
D@1 D@1 D@1 D@1 D@1 D@1 D@1 D@1 D@1 D@1 D@1 D@1
Acid

Note: Samples cured for 7 days at 77°F (25°C) before testing. Tested in accordance with ASTM D543-84.
NT= not tested. D@X – Destroyed at X days.
APPENDIX B: TABLE 7: HANDLING OF CURING AGENTS WITH
HANDLING OF FORMULATIONS BISPHENOL-F BASED EPOXY RESIN, EEW=172
WITH ALTERNATIVE EPOXY RESINS
AND HANDLING OF ALIPHATIC
AMINE MODIFIED FORMULATIONS
Curing
Mixed 150 g mass Thin Film
Handling and appearance of some of the Curing Agent
Agent
Viscosity Gel Time Set Time,3
60° Film
Viscosity Gloss4
curing agents in stoichiometric formulations (cP)1
(cP)1 (min)2 tack free (h)

with alternative epoxy resins were

characterized. Brookfield viscosity of the Ancamine 2280 450 1,640 63 7.5 125
curing agent, Brookfield viscosity of the Ancamine 2143 600 1,450 59 6.5 113

formulation 4 minutes after mixing, gel Ancamine 1618 400 1,960 58 7.0 119
Ancamine 1693 100 864 63 9.5 16
time for 150 g mass, thin film set time for
Ancamine 2286 100 652 42 6.5 74
3 mil films on glass, and 60° film gloss of
10 mil films on cold rolled steel panels
Note: All data at 77°F (25°C). Please see last page for footnotes.
cured 7 days at 77°F (25°C)/50% relative
humidity were measured. Results are
shown in Tables 7 to 9. Table 10 shows
handling characteristics of formulations
TABLE 8: HANDLING OF CURING AGENTS WITH
with aliphatic amine modified curing agents.
BISPHENOL-F/MULTIFUNCTIONAL EPOXY RESIN BLEND*

Curing
Mixed Gel Time Thin Film
Agent 60° Film
Curing Agent Viscosity (min)2 Set Time,3
Viscosity Gloss4
(cP)1 150 g mass tack free (h)
(cP)1

Ancamine 2280 450 1,350 32 6.5 143

Ancamine 2143 600 2,340 41 5.0 141
Ancamine 1618 400 3,488 61 5.5 124
Ancamine 1693 100 1,330 57 8.5 17
Ancamine 2286 100 1,224 42 6.2 140

*60% bisphenol-F epoxy resin, EEW=172, and 40% epoxy novolac resin, EEW=176.
Note: All data at 77°F (25°C). Please see last page for footnotes.

TABLE 9: HANDLING OF CURING AGENTS WITH 10% CGE

DILUTED BISPHENOL-A BASED EPOXY RESIN, EEW=188

Curing
Mixed Gel Time Thin Film
Agent 60° Film
Curing Agent Viscosity (min)2 Set Time,3
Viscosity Gloss4
(cP)1 150 g mass tack free (h)
(cP)1

Ancamine 2280 450 2,084 69 7.0 131

Ancamine 2143 600 910 74 6.0 137
Ancamine 1618 400 1,880 63 6.0 132
Ancamine 1693 100 730 77 9.0 128
Ancamine 2286 100 780 53 6.0 124

Note: All data at 77°F (25°C). Please see last page for footnotes.
TABLE 10: HANDLING OF ALIPHATIC AMINE MODIFIED CYCLOALIPHATIC APPENDIX C:
CURING AGENTS WITH BISPHENOL-A BASED EPOXY RESIN, EEW=190 CURE SPEED FOR CHEMICALLY
RESISTANT EPOXY FORMULATIONS

Accelerated Curing Agents

Some applications requiring chemical
Curing
Mixed Gel Time Thin Film
Curing Agent
Agent
Viscosity (min)2 Set Time,3
60° Film resistance, such as flooring or secondary
Viscosity Gloss4
(cP)1
(cP)1 150 g mass tack free (h) containment, may also require rapid cure
speed so that the application area can be
8:2 quickly returned to service. To obtain
Ancamine 2280: NT 2,200 37 4.5 110
Ancamine 2432 faster cure, the curing agents can be
8:2 accelerated with modified aliphatic
Ancamine 2280: 1,240 4,740 42 5.0 107
Ancamine 1608 amines such as Ancamine 2432, 2089M,
8:2 1856, 2205, 1608, or 1638 curing
Ancamine 2280: 480 4,140 29 5.5 87
agents. Figure 5 shows the effect
Ancamine 1638
8:2
of selected curing agents used as
Ancamine 2280: 276 3,390 42 6.0 87 accelerators with Ancamine 2280.
TETA
The figure shows that at 20% addition
9:1
Ancamine 2280: 470 6,940 62 8.0 111 levels, the modified aliphatic amines
TETA
can significantly improve cure speed,
8:2
Ancamine 2143: NT 2,500 40 4.5 110 especially at low temperatures.
Ancamine 2432
8:2
Ancamine 2143: 332 4,720 48 5.5 114 Ancamine 2432 should be used as the
TETA accelerator for maximum chemical
9:1 resistance. Table 11 shows the effect of
Ancamine 2143: 688 7,580 66 8.0 123
TETA accelerating Ancamine 2280, 2143, and
8:2 1618 curing agents with 20% Ancamine
Ancamine 1618: NT 2,200 35 4.6 109
Ancamine 2432 2432. Formulations accelerated with
2432 have reduced cure times while
Note: All data at 77°F (25°C). Please see last page for footnotes. maintaining good working life (gel time)
and high gloss in the cured film.

FIGURE 5: CURE SPEEDS OF ACCELERATED ANCAMINE 2280 SYSTEMS

TABLE 11: PERFORMANCE OF FORMULATIONS ACCELERATED WITH ANCAMINE 2432

20% 2432/ 20% 2432/ 20% 2432/

100% 2280 100% 2143 100% 1618
80% 2280 80% 2143 80% 1618

77°F (25°C) TFST (h)3 6.0 4.5 7.0 4.5 5.5 4.6
40°F (4°C) TFST (h)3 29 15.3 21 13.8 21 14.5
77°F (25°C) Gel Time (min.)2 55 37 45 40 50 35
60° Gloss (7 days at 77°F)4 105 110 103 110 118 109

Note: Curing agent blends formulated with standard bisphenol-A (DGEBA, EEW=190) resin.
Hardness Development FIGURE 6: 7 DAY DEVELOPMENT OF PENDULUM HARDNESS
Although gel time and thin film set time
define well the development of cure, they
may not accurately predict development
of hardness. Therefore, development
of König pendulum hardness has been
characterized for the epoxy formulations
as a function of 77°F (25°C)/50%
relative humidity cure time for 10 mil
coatings on cold rolled steel panels.
Figure 6 shows the results.

The data show that Ancamine 2280

and 1693 cured formulations develop
hardness more slowly than the other
curing agent formulations. The data also
show that Ancamine 2423, 2143, 1618,
and 2286 curing agents impart similar
hardness development at ambient
temperatures. At low temperatures,
however, hardness development is faster
with Ancamine 2423 curing agent.

Data in Figure 7 demonstrate the effect FIGURE 7: 14 DAY DEVELOPMENT OF PENDULUM HARDNESS
of formulating with alternative resins on FOR ANCAMINE 2280-CURED EPOXY RESINS
the development of coating hardness.
Formulating with bisphenol-F resin or
10% CGE diluted bisphenol-A epoxy
resin reduces the rate of hardness
development relative to Bis-A based resin.

Footnotes:
(1) ASTM D-445-83, Brookfield
(2) Techne GT-4 Gelation Timer
(3) BK Drying Recorder
(4) ASTM D 523-85
 EVONIK CORPORATION
Allentown, PA 18195
1 800 345-3148
Outside U.S. and Canada 1 610 481-6799

For Technical Information and Support:

Americas: [email protected]
EMEA: [email protected]

For Samples:
Americas: [email protected]
Asia: [email protected]
EMEA: [email protected]

For Customer Service:

US / Canada
[email protected]

LASA
[email protected]

Japan
[email protected]

Asia
PMD-Asia Customer Service:
[email protected]
APCS PMGP (Korea):
[email protected]

EMEA:
[email protected]

The information contained herein is offered

without charge for use by technically
qualified personnel at their discretion and
risk. All statements, technical information
and recommendations contained herein are
based on tests and data which we believe to
be reliable, but the accuracy or completeness
thereof is not guaranteed and no warranty
of any kind is made with respect thereto.

©Evonik Corporation, 2018 125-9326 Feb18