ESP32-S2-WROOM &

ESP32-S2-WROOM-I
Datasheet

Version 1.1
Espressif Systems
Copyright © 2020

www.espressif.com
About This Document
This document provides the specifications for the ESP32-S2-WROOM and ESP32-S2-WROOM-I module.

Document Updates
Please always refer to the latest version on https://www.espressif.com/en/support/download/documents.

Revision History
For revision history of this document, please refer to the last page.

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Disclaimer and Copyright Notice

Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS
PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABIL-
ITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE
ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information in this docu-
ment is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights
are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property of their respective
owners, and are hereby acknowledged.
Copyright © 2020 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.

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1. Module Overview

1. Module Overview

1.1 Features
MCU Hardware
• Interfaces: GPIO, SPI, LCD, UART, I2 C, I2 S, Cam-
• ESP32-S2 embedded, Xtensa® single-core 32-bit
era interface, IR, pulse counter, LED PWM, USB
LX7 microprocessor, up to 240 MHz
OTG 1.1, ADC, DAC, touch sensor, temperature
• 128 KB ROM sensor

• 320 KB SRAM • 40 MHz crystal oscillator

• 4 MB SPI flash
• 16 KB SRAM in RTC
• Operating voltage/Power supply: 3.0 ~ 3.6 V

• Operating temperature range: –40 ~ 85 °C

Wi-Fi
• Dimensions: (18 × 31 × 3.3) mm
• 802.11 b/g/n
Certification
• Bit rate: 802.11n up to 150 Mbps
• Green certification: RoHS/REACH
• A-MPDU and A-MSDU aggregation
• RF certification: FCC/CE-RED/SRRC
• 0.4 µs guard interval support

• Center frequency range of operating channel: Test

2412 ~ 2484 MHz • HTOL/HTSL/uHAST/TCT/ESD

1.2 Description
ESP32-S2-WROOM and ESP32-S2-WROOM-I are two powerful, generic Wi-Fi MCU modules that have a rich set
of peripherals. They are an ideal choice for a wide variety of application scenarios relating to Internet of Things
(IoT), wearable electronics and smart home.

ESP32-S2-WROOM comes with a PCB antenna, and ESP32-S2-WROOM-I with an IPEX antenna. They both
feature a 4 MB external SPI flash. The information in this datasheet is applicable to both modules.

The ordering information of the two modules is listed as follows:

Table 1: Ordering Information

Module Chip embedded Flash Module dimensions (mm)

ESP32-S2-WROOM (PCB)
ESP32-S2 4 MB (18.00±0.15)×(31.00±0.15)×(3.30±0.15)
ESP32-S2-WROOM-I (IPEX)
Notes:
1. These modules can be shipped with different flash sizes.
2. Modules that operate at higher temperature (–40 °C ~+105 °C) are available for order, embedded with 4 MB flash.
3. For dimensions of the IPEX connector, please see Section 7.3.

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1. Module Overview

At the core of this module is ESP32-S2 *, an Xtensa® 32-bit LX7 CPU that operates at up to 240 MHz. The
chip has a low-power co-processor that can be used instead of the CPU to save power while performing tasks
that do not require much computing power, such as monitoring of peripherals. ESP32-S2 integrates a rich set
of peripherals, ranging from SPI, I²S, UART, I²C, LED PWM, LCD, Camera interface, ADC, DAC, touch sensor,
temperature sensor, as well as up to 43 GPIOs. It also includes a full-speed USB On-The-Go (OTG) interface to
enable USB communication.

Note:
* For more information on ESP32-S2, please refer to ESP32-S2 Datasheet.

1.3 Applications
• Generic Low-power IoT Sensor Hub • Smart Building

• Generic Low-power IoT Data Loggers • Industrial Automation

• Cameras for Video Streaming
• Smart Agriculture
• Over-the-top (OTT) Devices
• Audio Applications
• USB Devices
• Health Care Applications
• Speech Recognition
• Wi-Fi-enabled Toys
• Image Recognition
• Wearable Electronics
• Mesh Network

• Home Automation • Retail & Catering Applications

• Smart Home Control Panel • Smart POS Machines

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CONTENTS

Contents

1 Module Overview 3
1.1 Features 3
1.2 Description 3
1.3 Applications 4

2 Block Diagram 8

3 Pin Definitions 9
3.1 Pin Layout 9
3.2 Pin Description 10
3.3 Strapping Pins 11

4 Electrical Characteristics 13
4.1 Absolute Maximum Ratings 13
4.2 Recommended Operating Conditions 13
4.3 DC Characteristics (3.3 V, 25 °C) 13
4.4 Current Consumption Characteristics 14
4.5 Wi-Fi RF Characteristics 15
4.5.1 Wi-Fi RF Standards 15
4.5.2 Transmitter Characteristics 15
4.5.3 Receiver Characteristics 16

5 Schematics 18

6 Peripheral Schematics 20

7 Physical Dimensions and PCB Land Pattern 21

7.1 Physical Dimensions 21
7.2 Recommended PCB Land Pattern 22
7.3 U.FL Connector Dimensions 23

8 Product Handling 24
8.1 Storage Condition 24
8.2 ESD 24
8.3 Reflow Profile 24

9 MAC Addresses and eFuse 25

10Learning Resources 26
10.1 Must-Read Documents 26
10.2 Must-Have Resources 26

Revision History 27

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LIST OF TABLES

List of Tables
1 Ordering Information 3
2 Pin Definitions 10
3 Strapping Pins 11
4 Absolute Maximum Ratings 13
5 Recommended Operating Conditions 13
6 DC Characteristics (3.3 V, 25 °C) 13
7 Current Consumption Depending on RF Modes 14
8 Current Consumption Depending on Work Modes 14
9 Wi-Fi RF Standards 15
10 Transmitter Characteristics 15
11 Receiver Characteristics 16

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LIST OF FIGURES

List of Figures
1 ESP32-S2-WROOM Block Diagram 8
2 ESP32-S2-WROOM-I Block Diagram 8
3 Module Pin Layout (Top View) 9
4 ESP32-S2-WROOM Schematics 18
5 ESP32-S2-WROOM-I Schematics 19
6 Peripheral Schematics 20
7 Physical Dimensions 21
8 Recommended PCB Land Pattern 22
9 U.FL Connector Dimensions 23
10 Reflow Profile 24

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2. Block Diagram

2. Block Diagram

40 MHz
3V3 Crystal Antenna

RF Matching
ESP32-S2
EN GPIOs

VDD_SPI
SPICLK
SPICS

SPIDI
SPIDO
SPIHD
SPIWP
ESP32-S2-WROOM
SPI Flash

Figure 1: ESP32-S2-WROOM Block Diagram

40 MHz
3V3 Crystal Antenna

RF Matching
ESP32-S2
EN GPIOs
VDD_SPI
SPICLK
SPICS

SPIDI
SPIDO
SPIHD
SPIWP

ESP32-S2-WROOM-I
SPI Flash

Figure 2: ESP32-S2-WROOM-I Block Diagram

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3. Pin Definitions

3. Pin Definitions

3.1 Pin Layout

Keepout Zone

1 GND GND 42

2 3V3 EN 41

3 IO0 IO46 40

4 IO1 IO45 39

5 IO2 RXD0 38
GND GND GND

6 IO3 TXD0 37
Pin 43
GND GND
GND

7 IO4 IO42 36
GND GND GND

8 IO5 IO41 35

9 IO6 IO40 34

10 IO7 IO39 33

11 IO8 IO38 32

12 IO9 IO37 31

13 IO10 IO36 30

14 IO11 IO35 29

15 IO12 IO34 28

16 IO13 IO33 27
GND
IO14

IO15

IO16

IO17

IO18

IO19

IO20

IO21

IO26
21
20

22

23

24

25

26
17

18

19

Figure 3: Module Pin Layout (Top View)

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3. Pin Definitions

Note:
The pin diagram shows the approximate location of pins on the module. For the actual mechanical diagram, please refer
to Figure 7.1 Physical Dimensions.

3.2 Pin Description

The module has 42 pins. See pin definitions in Table 2.

Table 2: Pin Definitions

Name No. Type Function

GND 1 P Ground
3V3 2 P Power supply
IO0 3 I/O/T RTC_GPIO0, GPIO0
IO1 4 I/O/T RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0
IO2 5 I/O/T RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1
IO3 6 I/O/T RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2
IO4 7 I/O/T RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3
IO5 8 I/O/T RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4
IO6 9 I/O/T RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5
IO7 10 I/O/T RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6
IO8 11 I/O/T RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7
IO9 12 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD
IO10 13 I/O/T RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4
IO11 14 I/O/T RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5
IO12 15 I/O/T RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6
IO13 16 I/O/T RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7
IO14 17 I/O/T RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS
IO15 18 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P
IO16 19 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N
IO17 20 I/O/T RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6, DAC_1
IO18 21 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, DAC_2, CLK_OUT3
IO19 22 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D-
IO20 23 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+
IO21 24 I/O/T RTC_GPIO21, GPIO21
IO26 25 I/O/T SPICS1, GPIO26
GND 26 P Ground
IO33 27 I/O/T SPIIO4, GPIO33, FSPIHD
IO34 28 I/O/T SPIIO5, GPIO34, FSPICS0
IO35 29 I/O/T SPIIO6, GPIO35, FSPID
IO36 30 I/O/T SPIIO7, GPIO36, FSPICLK
IO37 31 I/O/T SPIDQS, GPIO37, FSPIQ
IO38 32 I/O/T GPIO38, FSPIWP
IO39 33 I/O/T MTCK, GPIO39, CLK_OUT3

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3. Pin Definitions

Name No. Type Function

IO40 34 I/O/T MTDO, GPIO40, CLK_OUT2
IO41 35 I/O/T MTDI, GPIO41, CLK_OUT1
IO42 36 I/O/T MTMS, GPIO42
TXD0 37 I/O/T U0TXD, GPIO43, CLK_OUT1
RXD0 38 I/O/T U0RXD, GPIO44, CLK_OUT2
IO45 39 I/O/T GPIO45
IO46 40 I GPIO46
High: on, enables the chip.
EN 41 I Low: off, the chip powers off.
Note: Do not leave the EN pin floating.
GND 42 P Ground

Notice:

For peripheral pin configurations, please refer to ESP32-S2 Datasheet.

3.3 Strapping Pins

ESP32-S2 has three strapping pins: GPIO0, GPIO45, GPIO46. The pin-pin mapping between ESP32-S2 and the
module is as follows, which can be seen in Chapter 5 Schematics:
• GPIO0 = IO0
• GPIO45 = IO45
• GPIO46 = IO46
Software can read the values of corresponding bits from register ”GPIO_STRAPPING”.

During the chip’s system reset (power-on-reset, RTC watchdog reset, brownout reset, analog super watchdog
reset, and crystal clock glitch detection reset), the latches of the strapping pins sample the voltage level as strapping
bits of ”0” or ”1”, and hold these bits until the chip is powered down or shut down.

IO0, IO45 and IO46 are connected to the internal pull-up/pull-down. If they are unconnected or the connected
external circuit is high-impedance, the internal weak pull-up/pull-down will determine the default input level of these
strapping pins.

To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-S2.

After reset, the strapping pins work as normal-function pins.

Refer to Table 3 for a detailed boot-mode configuration of the strapping pins.

Table 3: Strapping Pins

VDD_SPI Voltage 1
Pin Default 3.3 V 1.8 V
2
IO45 Pull-down 0 1

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3. Pin Definitions

Booting Mode
Pin Default SPI Boot Download Boot
IO0 Pull-up 1 0
IO46 Pull-down Don’t-care 0
3 4
Enabling/Disabling ROM Code Print During Booting
Pin Default Enabled Disabled
IO46 Pull-down See the fourth note See the fourth note

Note:

1. Firmware can configure register bits to change the settings of ”VDD_SPI Voltage”.

2. The strapping combination of GPIO46 = 1 and GPIO0 = 0 is invalid and will trigger unexpected behavior.

3. Internal pull-up resistor (R1) for IO45 is not populated in the module, as the flash in the module works at 3.3 V by
default (output by VDD_SPI). Please make sure IO45 will not be pulled high when the module is powered up by
external circuit.

4. ROM code can be printed over TXD0 (by default) or DAC_1 (IO17), depending on the eFuse bit.

5. When eFuse UART_PRINT_CONTROL value is:

0, print is normal during boot and not controlled by IO46.
1 and IO46 is 0, print is normal during boot; but if IO46 is 1, print is disabled.
2 and IO46 is 0, print is disabled; but if IO46 is 1, print is normal.
3, print is disabled and not controlled by IO46.

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4. Electrical Characteristics

4. Electrical Characteristics

4.1 Absolute Maximum Ratings

Table 4: Absolute Maximum Ratings

Symbol Parameter Min Max Unit

VDD33 Power supply voltage –0.3 3.6 V
TST ORE Storage temperature –40 85 °C

4.2 Recommended Operating Conditions

Table 5: Recommended Operating Conditions

Symbol Parameter Min Typ Max Unit

VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 — — A
T Operating temperature –40 — 85 °C
Humidity Humidity condition — 85 — %RH

4.3 DC Characteristics (3.3 V, 25 °C)

Table 6: DC Characteristics (3.3 V, 25 °C)

Symbol Parameter Min Typ Max Unit

CIN Pin capacitance — 2 — pF
VIH High-level input voltage 0.75 × VDD — VDD + 0.3 V
VIL Low-level input voltage –0.3 — 0.25 × VDD V
IIH High-level input current — — 50 nA
IIL Low-level input current — — 50 nA
2 0.8 × VDD — —
VOH High-level output voltage V
2 — — 0.1 × VDD
VOL Low-level output voltage V
High-level source current (VDD = 3.3 V, VOH >=
IOH — 40 — mA
2.64 V, PAD_DRIVER = 3)
Low-level sink current (VDD = 3.3 V, VOL =
IOL — 28 — mA
0.495 V, PAD_DRIVER = 3)
RP U Pull-up resistor — 45 — kΩ
RP D Pull-down resistor — 45 — kΩ
VIH_nRST Chip reset release voltage 0.75 × VDD — VDD + 0.3 V
VIL_nRST Chip reset voltage –0.3 — 0.25 × VDD V

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4. Electrical Characteristics

Note:

1. VDD is the I/O voltage for a particular power domain of pins.

2. VOH and VOL are measured using high-impedance load.

4.4 Current Consumption Characteristics

With the use of advanced power-management technologies, the module can switch between different power
modes. For details on different power modes, please refer to Section RTC and Low-Power Management in ESP32-
S2 Datasheet.

Table 7: Current Consumption Depending on RF Modes

Work mode Description Average Peak

802.11b, 20 MHz, 1 Mbps, @19.5 dBm 190 mA 310 mA
802.11g, 20 MHz, 54 Mbps, @15 dBm 145 mA 220 mA
TX
802.11n, 20 MHz, MCS7, @13 dBm 135 mA 200 mA
Active (RF working)
802.11n, 40 MHz, MCS7, @13 dBm 120 mA 160 mA
802.11b/g/n, 20 MHz 63 mA 63 mA
RX
802.11n, 40 MHz 68 mA 68 mA

Note:

• The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF
port. All transmitters’ measurements are based on a 50% duty cycle.

• The current consumption figures for in RX mode are for cases when the peripherals are disabled and the CPU idle.

Table 8: Current Consumption Depending on Work Modes

Work mode Description Current consumption (Typ)

240 MHz 22 mA
The CPU is
Modem-sleep 160 MHz 17 mA
powered on
Normal speed: 80 MHz 14 mA
Light-sleep — 550 µA
The ULP co-processor is powered on. 235 µA
ULP sensor-monitored pattern 22 µA @1% duty
Deep-sleep
RTC timer + RTC memory 25 µA
RTC timer only 20 µA
Power off CHIP_PU is set to low level, the chip is powered off. 1 µA

Note:

• The current consumption figures in Modem-sleep mode are for cases where the CPU is powered on and the cache
idle.

• When Wi-Fi is enabled, the chip switches between Active and Modem-sleep modes. Therefore, current consump-

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4. Electrical Characteristics

tion changes accordingly.

• In Modem-sleep mode, the CPU frequency changes automatically. The frequency depends on the CPU load and
the peripherals used.

• During Deep-sleep, when the ULP co-processor is powered on, peripherals such as GPIO and I²C are able to
operate.

• The ”ULP sensor-monitored pattern” refers to the mode where the ULP coprocessor or the sensor works periodi-
cally. When touch sensors work with a duty cycle of 1%, the typical current consumption is 22 µA.

4.5 Wi-Fi RF Characteristics

4.5.1 Wi-Fi RF Standards

Table 9: Wi-Fi RF Standards

Name Description
note1
Center frequency range of operating channel 2412 ~ 2484 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n
11b: 1, 2, 5.5 and 11 Mbps
20 MHz 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
Data rate
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz 11n: MCS0-7, 150 Mbps (Max)
Antenna type PCB antenna, IPEX antenna

1. Device should operate in the center frequency range allocated by regional regulatory authorities. Target center frequency
range is configurable by software.
2. For the modules that use IPEX antennas, the output impedance is 50 Ω. For other modules without IPEX antennas,
users do not need to concern about the output impedance.

4.5.2 Transmitter Characteristics

Table 10: Transmitter Characteristics

Parameter Rate Typ Unit

11b, 1 Mbps 19.5
11b, 11 Mbps 19.5
11g, 6 Mbps 18
11g, 54 Mbps 15
TX Power note1 dBm
11n, HT20, MCS0 18
11n, HT20, MCS7 13.5
11n, HT40, MCS0 18
11n, HT40, MCS7 13.5

1. Target TX power is configurable based on device or certification requirements.

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4. Electrical Characteristics

4.5.3 Receiver Characteristics

Table 11: Receiver Characteristics

Parameter Rate Typ Unit

1 Mbps –97
2 Mbps –95
5.5 Mbps –93
11 Mbps –88
6 Mbps –92
9 Mbps –91
12 Mbps –89
18 Mbps –86
24 Mbps –83
36 Mbps –80
48 Mbps –76
54 Mbps –74
11n, HT20, MCS0 –92
11n, HT20, MCS1 –88
RX Sensitivity dBm
11n, HT20, MCS2 –85
11n, HT20, MCS3 –82
11n, HT20, MCS4 –79
11n, HT20, MCS5 –75
11n, HT20, MCS6 –73
11n, HT20, MCS7 –72
11n, HT40, MCS0 –89
11n, HT40, MCS1 –85
11n, HT40, MCS2 –83
11n, HT40, MCS3 –79
11n, HT40, MCS4 –76
11n, HT40, MCS5 –72
11n, HT40, MCS6 –70
11n, HT40, MCS7 –68
11b, 1 Mbps 5
11b, 11 Mbps 5
11g, 6 Mbps 5
11g, 54 Mbps 0
RX Maximum Input Level dBm
11n, HT20, MCS0 5
11n, HT20, MCS7 0
11n, HT40, MCS0 5
11n, HT40, MCS7 0
11b, 11 Mbps 35
11g, 6 Mbps 31
11g, 54 Mbps 14
Adjacent Channel Rejection 11n, HT20, MCS0 31 dB
11n, HT20, MCS7 13

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4. Electrical Characteristics

Parameter Rate Typ Unit

11n, HT40, MCS0 19
11n, HT40, MCS7 8

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 5 4 3 2 1

Espressif Systems

5. Schematics
5. Schematics

D GND D

The values of C1 and C4 vary with

3
GND Y1 GND
the selection of the crystal.

GND XOUT
GND
The value of R4 varies with the actual C1 C4
VDD33 PCB board.

XIN
TBD TBD

2
C2 C3
VDD33
100pF 1uF
VDD33
GND
GND GND R4 R1
0 40MHz(±10ppm) 10K(NC)
C5

0.1uF CHIP_PU
GPIO46
VDD33 GPIO45
GND R2 0 U0RXD
L1 2.0nH R3 499 U0TXD
PCB ANTENNA
GPIO42
C6 C7 C8 C9 GPIO41
GPIO40
10uF 1uF 0.1uF 0.1uF GND GPIO39
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GND GND GND GND

ANT1 C10 VDD33 VDD33 1 1
Pin.1 Pin.42

57

56
55
54
53
52
51
50
49
48
47
46
45
44
43
GND GND
1 ANT2 R6 0(NC)
0.1uF
GND GND

VDDA
XTAL_P

VDDA

MTMS
MTDI

MTCK
GPIO46

GPIO45

MTDO
GND

CHIP_PU

XTAL_N

U0RXD
U0TXD

VDD3P3_CPU
IPEX 1 VDD33 CHIP_PU 1
Pin.2 Pin.41
2

C D1 C
GND
3V3 EN
GND LESD8D3.3CAT5G Pin.3 1 GPIO0 GPIO46 1 Pin.40
ANT2 1 42 GPIO38
1 ANT1 R7 0 RF_ANT L2 TBD LAN_IN 2 VDDA GPIO38 41 GPIO37 IO0 IO46
2 3 LNA_IN GPIO37 40 GPIO36 1 GPIO1 GPIO45 1
VDD3P3 GPIO36 Pin.4 Pin.39
C11 C12 4 39 GPIO35
PCB_ANT GPIO0 5 VDD3P3 GPIO35 38 GPIO34 GND IO1 IO45
18

TBD TBD GPIO1 6 GPIO0 GPIO34 37 GPIO33 1 GPIO2 U0RXD 1

GPIO1 GPIO33 Pin.5 Pin.38
GPIO2 7 36 SPID
GPIO3 8 GPIO2 SPID 35 SPIQ
IO2 RXD0
GPIO4 9 GPIO3 SPIQ 34 R10 0 SPICLK 1 GPIO3 U0TXD 1
GND GND GND
GPIO4 SPICLK Pin.6 Pin.37
GPIO5 10 33 SPICS0
GPIO6 11 GPIO5 SPICS0 32 SPIWP IO3 TXD0
The values of C11, L2 and C12 GPIO6 SPIWP
GPIO7 12 31 SPIHD Pin.7 1 GPIO4 GPIO42 1 Pin.36
vary with the actual PCB board. GPIO7 SPIHD
VDD3P3_RTC_IO
GPIO8 13 30
GPIO9 14 GPIO8 VDD_SPI 29 GPIO26 SPICS1 IO4 IO42
VDD3P3_RTC

GPIO9 SPICS1
ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.1

XTAL_32K_N
XTAL_32K_P

NC: No component. Pin.8 1 GPIO5 GPIO41 1 Pin.35

VDD_SPI
IO5 EPAD IO41
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14

GPIO19
GPIO20

GPIO21
DAC_1
DAC_2

Pin.9 1 GPIO6 GPIO40 1 Pin.34

C13 C14
IO6 IO40
U1 ESP32-S2 0.1uF 1uF Pin.10 1 GPIO7 GPIO39 1 Pin.33
15
16
17
18
19
20
21
22
23
24
25
26
27
28

IO7 IO39
GND GND Pin.11 1 GPIO8 GPIO38 1 Pin.32
VDD33 VDD33
IO8 IO38
Pin.12 1 GPIO9 GPIO37 1 Pin.31
C15 C16
IO9 IO37
Pin.13 1 GPIO10 GPIO36 1 Pin.30
0.1uF 0.1uF
IO10 IO36
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14

GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20

GPIO21

Pin.14 1 GPIO11 GPIO35 1 Pin.29

GND GND
IO11 IO35
B B
Pin.15 1 GPIO12 GPIO34 1 Pin.28
VDD_SPI Flash and PSRAM VDD_SPI IO12 IO34
Pin.16 1 GPIO13 GPIO33 1 Pin.27
GND
IO13 IO33

GPIO14

GPIO15

GPIO16

GPIO17

GPIO18

GPIO19

GPIO20

GPIO21

GPIO26
R8 R9
10K(NC) 10K(NC)
8

U2 U3

1
VCC

VDD

SPICS0 1 5 SPID SPICS1 1 5 SPID

/CS DI CS SI/SIO0
SPICLK 6 2 SPIQ SPICLK 6 2 SPIQ
CLK DO SCLK SO/SIO1
SPIHD 7 3 SPIWP SPIHD 7 3 SPIWP

Pin.17

Pin.18

Pin.19

Pin.20

Pin.21

Pin.22

Pin.23

Pin.24

Pin.25

Pin.26
GND

VSS

/HOLD /WP SIO3 SIO2

IO14

IO15

IO16

IO17

IO18

IO19

IO20

IO21

IO26

GND
FLASH-3V3 PSRAM-3V3(NC)
4

GND GND

Figure 4: ESP32-S2-WROOM Schematics

A A
 5 4 3 2 1

Espressif Systems

5. Schematics
D GND D

The values of C1 and C4 vary with

3
GND Y1 GND
the selection of the crystal.

GND XOUT
GND
The value of R4 varies with the actual C1 C4
VDD33 PCB board.

XIN
TBD TBD

2
C2 C3
VDD33
100pF 1uF
VDD33
GND
GND GND R4 R1
0 40MHz(±10ppm) 10K(NC)
C5

0.1uF CHIP_PU
GPIO46
VDD33 GPIO45
GND R2 0 U0RXD
L1 2.0nH R3 499 U0TXD
PCB ANTENNA
GPIO42
C6 C7 C8 C9 GPIO41
GPIO40
10uF 1uF 0.1uF 0.1uF GND GPIO39

GND GND GND GND

ANT1 C10 VDD33 VDD33 1 1
Pin.1 Pin.42

57

56
55
54
53
52
51
50
49
48
47
46
45
44
43
GND GND
1 ANT2 R6 0
0.1uF
GND GND
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VDDA
XTAL_P

VDDA

MTMS
MTDI

MTCK
GPIO46

GPIO45

MTDO
GND

CHIP_PU

XTAL_N

U0RXD
U0TXD

VDD3P3_CPU
IPEX Pin.2 1 VDD33 CHIP_PU 1 Pin.41
2

C D1 C
GND
3V3 EN
GND LESD8D3.3CAT5G Pin.3 1 GPIO0 GPIO46 1 Pin.40
ANT2 1 42 GPIO38
1 ANT1 R7 0(NC) RF_ANT L2 TBD LAN_IN 2 VDDA GPIO38 41 GPIO37 IO0 IO46
2 3 LNA_IN GPIO37 40 GPIO36 1 GPIO1 GPIO45 1
VDD3P3 GPIO36 Pin.4 Pin.39
C11 C12 4 39 GPIO35
PCB_ANT GPIO0 5 VDD3P3 GPIO35 38 GPIO34 GND IO1 IO45
TBD TBD GPIO1 6 GPIO0 GPIO34 37 GPIO33 1 GPIO2 U0RXD 1
GPIO1 GPIO33 Pin.5 Pin.38
GPIO2 7 36 SPID
GPIO3 8 GPIO2 SPID 35 SPIQ IO2 RXD0
GPIO4 9 GPIO3 SPIQ 34 R10 0 SPICLK 1 GPIO3 U0TXD 1
GND GND GND
GPIO4 SPICLK Pin.6 Pin.37
GPIO5 10 33 SPICS0
GPIO5 SPICS0 IO3 TXD0
19

The values of C11, L2 and C12 GPIO6 11 32 SPIWP

GPIO7 12 GPIO6 SPIWP 31 SPIHD 1 GPIO4 GPIO42 1
vary with the actual PCB board. GPIO7 SPIHD Pin.7 Pin.36

VDD3P3_RTC_IO
GPIO8 13 30
GPIO9 14 GPIO8 VDD_SPI 29 GPIO26 SPICS1 IO4 IO42
VDD3P3_RTC

GPIO9 XTAL_32K_N SPICS1

XTAL_32K_P

NC: No component. Pin.8 1 GPIO5 GPIO41 1 Pin.35

VDD_SPI
IO5 EPAD IO41
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14

GPIO19
GPIO20

GPIO21
DAC_1
DAC_2

Pin.9 1 GPIO6 GPIO40 1 Pin.34

C13 C14
IO6 IO40
ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.1

U1 ESP32-S2 0.1uF 1uF Pin.10 1 GPIO7 GPIO39 1 Pin.33

15
16
17
18
19
20
21
22
23
24
25
26
27
28

IO7 IO39
GND GND Pin.11 1 GPIO8 GPIO38 1 Pin.32
VDD33 VDD33
IO8 IO38
Pin.12 1 GPIO9 GPIO37 1 Pin.31
C15 C16
IO9 IO37
Pin.13 1 GPIO10 GPIO36 1 Pin.30
0.1uF 0.1uF
IO10 IO36
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14

GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20

GPIO21

Pin.14 1 GPIO11 GPIO35 1 Pin.29

GND GND
IO11 IO35
B B
Pin.15 1 GPIO12 GPIO34 1 Pin.28
VDD_SPI Flash and PSRAM VDD_SPI IO12 IO34
Pin.16 1 GPIO13 GPIO33 1 Pin.27
GND
IO13 IO33

GPIO14

GPIO15

GPIO16

GPIO17

GPIO18

GPIO19

GPIO20

GPIO21

GPIO26
R8 R9
10K(NC) 10K(NC)
8

U2 U3

1
VCC

VDD

SPICS0 1 5 SPID SPICS1 1 5 SPID

/CS DI CS SI/SIO0
SPICLK 6 2 SPIQ SPICLK 6 2 SPIQ
CLK DO SCLK SO/SIO1
SPIHD 7 3 SPIWP SPIHD 7 3 SPIWP

Pin.17

Pin.18

Pin.19

Pin.20

Pin.21

Pin.22

Pin.23

Pin.24

Pin.25

Pin.26
GND

VSS

/HOLD /WP SIO3 SIO2

IO14

IO15

IO16

IO17

IO18

IO19

IO20

IO21

IO26

GND
FLASH-3V3 PSRAM-3V3(NC)
4

GND GND

Figure 5: ESP32-S2-WROOM-I Schematics

A A
6. Peripheral Schematics
4 3 2

6. Peripheral Schematics

GND GND GND

ESP32-S2-WROOM/ESP32-S2-WROOM-I C2
VDD33 43 VDD33
1 EPAD 42 TBD
2 GND GND 41 EN R1 TBD
IO0 3 3V3 EN 40 IO46 JP1
C1 C3 IO1 4 IO0 IO46 39 IO45 1
IO2 5 IO1 IO45 38 RXD0 2 1
22uF 0.1uF IO3 6 IO2 RXD0 37 TXD0 3 2
IO4 7 IO3 TXD0 36 IO42 4 3
IO5 8 IO4 IO42 35 IO41 4
IO6 9 IO5 IO41 34 IO40 UART
GND GND
IO7 10 IO6 IO40 33 IO39 GND
IO8 11 IO7 IO39 32 IO38
IO9 12 IO8 IO38 31 IO37 JP2
IO10 13 IO9 IO37 30 IO36 TMS 1
IO11 14 IO10 IO36 29 IO35 TDI 2 1
IO12 15 IO11 IO35 28 IO34 TDO 3 2
IO13 16 IO12 IO34 27 IO33 TCK 4 3

GND
IO14
IO15
IO16
IO17
IO18
IO19
IO20
IO21
IO26
IO13 IO33 4
JTAG
U1
17
18
19
20
21
22
23
24
25
26
VDD33

R8 10K JP3
USB_D+ 1
1
IO14
IO15
IO16
IO17
IO18
IO19
IO20
IO21
IO26

USB_D- 2
GND 2
GND C4 12pF(NC)
USB OTG
R2
1

X1 R3 0(NC) R4 0
32.768KHz(NC) R6 0
R5 0(NC)
NC
2

GND C5 C6
C7 12pF(NC)
20pF(NC) 20pF(NC)
X1: ESR = Max. 70 KΩ
NC: No component.
GND GND
SW1
IO0 R7 0 EN

C8 0.1uF
1
2

JP4
1
2

Boot Option GND GND

Figure 6: Peripheral Schematics

Note:

• Soldering the EPAD to the ground of the base board is not a must, though doing so can get optimized thermal
performance. If users do want to solder it, they need to ensure that the correct quantity of soldering paste is applied.

• To ensure the power supply to the ESP32-S2 chip during power-up, it is advised to add an RC delay circuit at the
EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 0.1 µF. However, specific
parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence
timing of the chip. For ESP32-S2’s power-up and reset sequence timing diagram, please refer to Section Power
Scheme in ESP32-S2 Datasheet.

• GPIO18 works as U1RXD and is in an uncertain state when the chip is powered on, which may affect the chip’s
entry into download boot mode. To solve this issue, add an external pull-up resistor.

4 3 2

Espressif Systems 20 ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.1

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7. Physical Dimensions and PCB Land Pattern

7. Physical Dimensions and PCB Land Pattern

7.1 Physical Dimensions

Unit: mm
3.30±0.15
Tolerance: +/-0.1 mm
18.00±0.15 0.80
6.30

8.35
10.19

10.44

1.00
2,25 4.00

0.1
31.00±0.15

4.00
23.10

0.50
1.00
19.30

0.50

15.45
1.50

0.90
15.84 0.90

1.50
0.85
0.9

0.45

0.85
1

2.25
0.45

Top View Side View Bottom View

Figure 7: Physical Dimensions

Espressif Systems 21 ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.1

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7. Physical Dimensions and PCB Land Pattern

7.2 Recommended PCB Land Pattern

Unit: mm
Via for thermal pad
Copper

18.00

6.30
42x1.50 Antenna Area

1 42

4.10
42x0.90

1.10 0.40

31.00
4.10

0.40
1.10

7.81
1.50
15.45

0.50
1.00

0.50

17 26

2.25 1.50

Figure 8: Recommended PCB Land Pattern

Espressif Systems 22 ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.1

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7. Physical Dimensions and PCB Land Pattern

7.3 U.FL Connector Dimensions

Unit: mm

Figure 9: U.FL Connector Dimensions

Espressif Systems 23 ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.1

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8. Product Handling

8. Product Handling
8.1 Storage Condition
The products sealed in Moisture Barrier Bag (MBB) should be stored in a noncondensing atmospheric environment
of < 40 °C/90%RH.

The module is rated at moisture sensitivity level (MSL) 3.

After unpacking, the module must be soldered within 168 hours with factory conditions 25±5 °C and /60%RH.
The module needs to be baked if the above conditions are not met.

8.2 ESD
• Human body model (HBM): 2000 V

• Charged-device model (CDM): 500 V

• Air discharge: 6000 V

• Contact discharge: 4000 V

8.3 Reflow Profile

Temperature (℃)

Peak Temp.
235 ~ 250 ℃
250
Preheating zone Reflow zone Cooling zone
150 ~ 200 ℃ 60 ~ 120 s 217 ℃ 60 ~ 90 s –1 ~ –5 ℃/s
217
200
Soldering time
> 30 s

Ramp-up zone
1 ~ 3 ℃/s
100

50

25
Time (sec.)
0
0 50 100 150 200 250

Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s

Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy

Figure 10: Reflow Profile

Note:
Solder the module in a single reflow. If the PCBA requires multiple reflows, place the module on the PCB during the final
reflow.

Espressif Systems 24 ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.1

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9. MAC Addresses and eFuse

9. MAC Addresses and eFuse

The eFuse in ESP32-S2 has been burnt into 48-bit mac_address. The actual addresses the chip uses in station
or AP modes correspond to mac_address in the following way:

• Station mode: mac_address

• AP mode: mac_address + 1

There are seven blocks in eFuse for users to use. Each block is 256 bits in size and has independent write/read
disable controller. Six of them can be used to store encrypted key or user data, and the remaining one is only used
to store user data.

Espressif Systems 25 ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.1

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10. Learning Resources

10. Learning Resources

10.1 Must-Read Documents

The following link provides documents related to ESP32-S2.

• ESP32-S2 Datasheet
This document provides an introduction to the specifications of the ESP32-S2 hardware, including overview,
pin definitions, functional description, peripheral interface, electrical characteristics, etc.

• ESP-IDF Programming Guide

It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference.

• ESP32-S2 Technical Reference Manual

The manual provides detailed information on how to use the ESP32-S2 memory and peripherals.

• Espressif Products Ordering Information

10.2 Must-Have Resources

Here are the ESP32-S2-related must-have resources.

• ESP32-S2 BBS
This is an Engineer-to-Engineer (E2E) Community for ESP32-S2 where you can post questions, share knowl-
edge, explore ideas, and help solve problems with fellow engineers.

Espressif Systems 26 ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.1

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Revision History

Revision History

Date Version Release notes

2020-07-31 V1.1 Updated notes in table 1.
2020-06-01 V1.0 Official release.
2020-03-10 V0.5 Preliminary release.

Espressif Systems 27 ESP32-S2-WROOM & ESP32-S2-WROOM-I Datasheet V1.1

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