Kingdom of Saudi Arabia ‫اململكة العربية الصعودية‬

Ministry of Education ‫وزارة التعليم‬

Prince Sattam Bin Abdulaziz University
College of Computer Engineering & Sciences ‫جامعة األمري شطام بن عبدالعسيس‬
Department of Computer Engineering ‫كلية هندشة وعلوم احلاش‬
‫قصم هندشة احلاش‬

CE2131

COMPUTER MAINTENANCE LAB

Laboratory Safety :

Please read these Safety Guidelines, Safety is a priority at Prince Sattam Bin Abdulaziz
University .While it may seem unlikely that an accident could happen to you, you should know
the accident rate in universities is 10 to 100 times greater than in the chemical industry. To help
prevent accidents, safety notes are included in the lab manual. In addition, any relevant
Material Safety Data Sheets (MSDS) are posted in a laboratory binder and guidelines.

Pay close attention to this information – our goals are:

1. To avoid accidents in the lab, and
2. To respond promptly and appropriately should an accident occur.

Safety depends on you!

It is your responsibility to follow the instructions in the lab
manual and any additional guidelines provided by your
instructor. It is also your responsibility to be familiar with the
location and operation of safety equipment.
 General Laboratory Safety Guidelines

• Wear appropriate protective clothing. Do not wear open-toed shoes, sandals, shorts or shirts
with dangling sleeves. Tie back long hair and avoid dangling jewelry.
• Clean your workstation after each lab period, and return all equipment and
materials to appropriate stations before leaving the lab.
• Always turn off the power before working on any electric circuit or electronic device.
• When operating with electric circuits and electronic devices other than just a computer, you
must work in pairs or teams.
• When in doubt about the operation of any circuit or device in lab, always have an instructor
check your work before connecting power to your system.
• Report any safety issues or violations that you are aware of as soon as possible to your
course instructor and program director.
• Ensure that you have a safe buffer area around you and that you are working on an
appropriate surface when using soldering irons in the lab.
• Always make sure that all lab equipment, soldering irons, project circuits are powered
down before leaving your lab area.
• Ensure that your work environment is clear and free of debris before starting your work AND
after finishing your project.
• Never block walkways in the laboratory with lab equipment, cables, and electrical power
cords.

• Do not eat, drink, smoke, or apply cosmetics in the laboratory.

• Avoid all horseplay in the laboratory.

• Dispose of sharps waste properly — place broken glass in the glass discard container, metal
in the metal waste container, and place other waste materials in the designated container(s).
Secure all sharps, including needles, blades, probes, knives, etc.
List of Experiments :

Experiments TITLE PAGE

NO
Experiment 1 Identification of Components of Desktop PC 1

Experiment 2 Motherboard Configuration 9

Experiment 3 Assemble and Disassemble 21

Experiment 4 Understanding specifications of Micro Processor, 29

selection, Assemble and Disassemble.
Experiment 5 Boot Process Diagnosis and Options 34

Experiment 6 BIOS/CMOS Setup 38

Experiment 7 Hard Disk Drive Partition and Format using Disk Manager. 46

Experiment 8 Understanding Specifications of RAM, Selection, 56

Assemble and Disassemble.
Experiment 9 Update BIOS 66

Experiment 10 Setup and Installation of Windows Operating System XP 70

Experiment 11 Setup and Installation of Operating System Windows 7 75

Experiment 12 Setup and Installation of Operating System Ubuntu 86

Experiment 13 Setup and Installation of Dual Operating Systems 96

Experiment 1
Identifying the Components of Desktop PC

Objectives
 Understand the functions of computer
 Identify types of computers
 Identify components of Desktop Computer
Computer

Computer is an electronic and digital device, it take data as input, process it and gives
information as output and save it. Computer is used because it is more efficient1 and effective2.
Computer hardware is accessed through Software (operating System) computer is Extensible3:
means we can add any number of application software to this and extend its functionality.
Versatile4: means it is used in almost all places like hospitals, business, education, Research etc.
Computer is not similar to any other electronic and digital machine but its Versatile and
Extensible. Block Diagram of modern Computer.

Figure 1.1 Block Diagram of Computer

Types of Computers

Super Computers: Supercomputers are High performance Computers with multi-tasking high-
throughput. Build with thousands of Processor. Supercomputers are used for highly calculation-
intensive tasks such as problems including quantum physics, weather forecasting, climate
research, oil and gas exploration, molecular modeling and physical simulations such as nuclear
fusion.
First Supercomputer was first designed by Seymour Cray in 1960’s. As of the 2012 world’s
fastest super computer is IBM Sequoia with 16.32 PFLOPS followed by Fujitsu K-Computer
with capacity of 10.51 PLFOPS.
Figure 1.2 IBM Sequoia

Mainframes: Mainframe computers are powerful computers used primarily by corporate and
governmental organizations for critical applications, bulk data processing such as census,
industry and consumer statistics, enterprise resource planning, and transaction processing.
Mainframes are designed to handle very high volume input and output (I/O) and emphasize
throughput computing. Mainframes are measured in millions of instructions per second (MIPS).

Figure 1.3 IBM System Z

Desktop Computers: Desktop Computers are Personal Computers for single users with Speed
of 3 to 4 GHz of processing speed.

Figure 1.4 Desktop Computer

Laptop Computers: Laptop is a personal computer and it is portable and all in one layout in
which the keyboard, pointing device, are integrated into computer chassis and an LCD display is
in a hinged lid. Additionally laptop has a built in battery which supports up to 5 to 6 hours. It is
often referred as Notebook.

Figure 1.5 Laptop Computer

Personal Digital Assistant (PDA): is a portable computer small enough to fit in your hand
and it is also referred to as palmtop computer. It allows you to perform only a small number of
functions.

Figure 1.6 HP PDA

Tablet Computer: is a portable computer larger than PDA with Touch screen for input and
with many functionalities different variants are available in the market like Apple ipad, HTC
Pad, Samsung, HP, Archos, and Microsoft etc.

Figure 1.7 Apple ipad

Components of a Personal Computer

1. System Case: The system case or System Unit, sometimes called the chassis or enclosure, is
the metal and plastic box that houses the main components of the computer.
2. Monitor - Your monitor is the component that displays the visual output from your computer
as generated by the video card.
3. Keyboard - This is the input device to enter the text data in to the computer.
4. Mouse - A point and click interface for entering commands which works well in graphical
environments.

Figure 1.8 Components of Personal Computer

Components inside the System Case

1. Power Supply (SMPS) it’s a Switch Mode Power Supply, which takes 220 V/ 110 V AC
current as input and converts that in to multiple DC voltages.

2. Hard disk drive(s) this is where your files are permanently stored on your computer. Also,
normally, your operating system is installed here.

3. CD/DVD drive(s) This is normally a read only drive where files are permanently stored.
There are now read/write CD/DVD drives that use special software to allow users to read from
and write to these drives.

4. Motherboard motherboard is the central printed circuit board (PCB) holds many of the
crucial components of the system, while providing connectors for other peripherals. It is also
known as Main Board.

Components on a Motherboard
Processor Socket: processor is installed in this socket.
Memory Slots: Primary memory RAM is installed in this slot
IDE Connectors: Hard Disk Drive, CD/DVD Drive, Floppy drive connected here.
PCI Slot: Adapter cards are installed in this slot like Display card, Sound card, Network
Interface card, etc
AGP or PCI-Ex Slot: it is used to connect Advanced Graphics cards.
Power Connectors: power supply is connected to this.
Chipset: Group of specialized chips on the mother board
Back Panel Connectors: External devices are connected to motherboard or system
through this back panel.
Back-Panel9 Display Connector (VGA) PS/2 Mouse and Keyboard RJ 45 Network
Connector Audio Connectors USB Others ( HDMI, LPT, COM1, Mini USB, SATA
connector etc)

Back Panel

Safety
Check for Static Electricity before you touch system case
Turn-off power supply or unplug power cable before system inspection

Terminologies
1. Efficient ‫فعال‬
2. Effective
3. Extensible ‫عقد قابل للتجديد‬
4. Versatile ‫متعدد اإلستعماالت‬
5. Processing
6. Storage ‫تخزين‬
7. North bridge ‫الجسر الشمالي‬
8. South bridge ‫الجسر الجنوبي‬
9. Back-Panel
Experiment 2
Motherboard Configuration.

Objectives
 Understand functionality and Architecture of Motherboard

 Identify components on Motherboard

 Practice Connecting components on Motherboard

The PC Case or System Case

Case Form Factors: Form factors1 refer to physical dimensions (Length, width).
PC Case comes in Form Factors to match motherboard form factors such as ATX, BTX.
Full Tower is 3 to 4 feet tall
Mid Tower is slightly smaller than Full tower cases
Mini tower is 14 to 15 inches tall
Desktop is classical horizontally oriented desktop case 14 inches wide and 5 inches tall.
Low Profile case is scaled down version of the desktop case, also called ―slimline‖

Figure 2.1 PC Case Tower PC Case Desktop or Low Profile

Motherboard
Motherboard3 is the Printed circuit board and it is the main component of the system,
every component internal or external connects directly or indirectly to motherboard. It is
also known as mainboard or printed circuit board, system board. It is made of fiberglass
brown or green typically with a meshwork of copper lines these lines are electronic
circuits through which power, data, and control signals travel. Group of these lines
assigned a set of functions, is collectively called a ―bus‖.
There are ways in which components are connected4 to the motherboard.
1. Integrated in to the circuit board of the motherboard (in build video, audio, NIC
controllers)
2. Attcahed through connectors, sockets, slots on board (processor, RAM, HDD,
CD/DVD)
3 Attached through external back panel or front panel (Keyboard, Mouse, Speakers, USB
drive)
Form Factors of Motherboard
The form factor refers to the physical dimensions (size and shape) as well as certain
connector, screw hole, and other positions that dictate into which type of case the board
will fit.
BTX New-generation tower and desktop systems; likely to be the most common form
factor from 2007 and beyond; supports high-end systems
microBTX Smaller version of BTX; used in new-generation mid-range systems; fits the
microBTX or BTX chassis
picoBTX Smallest version of BTX; used in low-end small form factor, entertainment, or
appliance systems; fits the picoBTX, microBTX, or BTX chassis
ATX Standard tower and desktop systems; most common form factor from mid-1996
through the present; supports high-end systems
Mini-ATX A slightly smaller version of ATX that fits the ATX chassis; many ATX
motherboards are sold as Mini-ATX motherboards
microATX Smaller version of ATX; used in mid-range systems; fits the microATX or ATX
chassis
Mini-ITX Minimum-size FlexATX version; used in set-top boxes and compact/small form
factor systems; highly integrated with one PCI expansion slot; fits in the Mini-ITX,
FlexATX, microATX, or ATX chassis
NLX Corporate slim desktop or mini-tower systems; fast and easy serviceability; slots on
riser card; largely replaced in recent systems by microATX, FlexATX, and Mini-
ITX designs

Processor Socket
Processor is mounted on the motherboard in a socket.
Types of Socket
 Pin Grid Array (PGA)

 Land Grid Array (LGA) (socket T)

 Ball Grid Array (BGA)

 Flip Chip PGA

Figure 2.2 Processor Sockets

Primary Memory Slots

 172-pin MicroDIMM, used for DDR SDRAM

 184-pin DIMM, used for DDR SDRAM
 200-pin SO-DIMM, used for DDR SDRAM and DDR2 SDRAM
 204-pin SO-DIMM, used for DDR3 SDRAM
 214-pin MicroDIMM, used for DDR2 SDRAM
 240-pin DIMM, used for DDR2 SDRAM, DDR3 SDRAM and FB-DIMM DRAM
Figure 2.3 Memory Slot

Chipset
Chipset refers to a group of integrated circuits, or chips, that are designed to work
together. A chipset controls the system bus structures and facilitates the movement of
data and instructions between the Processor, cache memory and internal and external
peripheral devices.
Two main chips in chipset are Memory Control Hub (Northbridge) and Input Output
Control Hub (Southbridge). The Northbridge links the CPU to very high-speed devices,
especially main memory and graphics controllers, and the Southbridge connects to lower-
speed peripheral buses (such as PCI )..
Every chipset has a specific model number and its two main chips North Bridge and
South Bridge model numbers. We can identify them in following ways
1. Using Chipset Identification Utility: download a tool from Intel or third party
website and install the tool to indentify the chipset model.

2. Through Device manager: click Start » click Control Panel » double-click

the System icon » click the Hardware tab » click Device Manager Click the sign to
expand the System devices entry. Look for the chipset name in a string similar to
the following: "Intel® 955X Memory Controller Hub - 2774". In this example, the
chipset is an Intel® 955X Express Chipset.
 3. Product Documentation

4. Chipset Marking: Open the System case and on the motherboard find the chipset
marking or chipset model number.

Figure 2.4 Chipset Model

Given below is the list of few chipset models and processor compatible with them.
Chipset Part numbers South Bridge Processors FSB Memory type

945GC 82945GC (MCH) ICH7/ICH7R/ICH7- Pentium 4, Pentium 533/800 MHz DDR2 533/667
DH D, Celeron D, Core
2 Duo, Pentium
Dual-Core, Atom

P965 82P965 (MCH) ICH8/ICH8R/ICH8- Pentium Dual- 533/800/1066 MHz DDR2

DH Core/Core 2 533/667/800
Quad/Core 2 Duo

Q35 82Q35 (MCH) ICH9/ICH9R/ICH9- Pentium Dual- 800/1066/1333 MHz DDR2 667/800
DO Core/Core 2
Quad/Core 2 Duo

H55 BD82H55 (PCH) SLGZX(B3) Core i3/i5/i7 2 GB/s DMI

Mobile

QS77 BD82QS77 SLJ8B(C1) Core i3/i5/i7 4 GB/s DMI

(PCH) Mobile

CMOS
Complementary Metal Oxide Semiconductor is another type of firmware, which stores
settings such as data and time, keyboard settings, boot sequence. Interrupt Request line
and I/O resources that BIOS uses. It is also referred as RTC/NVRAM (Real Time Clock
Non Volatile RAM), this chip is volatile7 but it is supplied with power from Lithium
Battery as show in the given below figure 2.8.
You can enter and edit the settings by entering the computer’s Setup Program during boot
up process. This is also referred as BIOS Setup.
Note: BIOS and CMOS not to be confused they are two separate components.
Figure 2.8 CMOS Battery
Mother Board Connectors
All of the components of a computer directly8 or indirectly9 connect to motherboard and
some are in-built10. In many ways connection is established they are as follows.
 On Board Connection: here component is fixed on to board using Slots and
Sockets on mother board. Example Processor, RAM, Network card, AGP card etc

 Internal Connection: Components inside the System case connects to mother board
using connectors. Example Hard Disk Drive, CD/DVD Drive, etc

 External Connection: Components external to the system case are connected

through back-panel.

SLOTS: slot is an narrow opening through which an object can pass. Here on
motherboard a slot is used to fix a adapter card in to it. There are different types of slot
available but most common which are seen on most of the motherboards are given below.
PCI Slots (Peripheral Component Interconnect): PCI is bus to connect the expansion
cards like network card, modem card, video card etc. There are many variants of PCI bus
as follows
133 MB/s (32-bit at 33
MHz)
266 MB/s (32-bit at 66
MHz or 64-bit at 33 MHz)
533 MB/s (64-bit at 66
MHz)
Figure 2.9 PCI Slot
PCI Slot is the most common slot found on almost all of the mother boards.
PCI Express (PCIe): this slot is as PCI but with numerous improvements such as
maximum system bus throughput, high speed, and low pin count.
Figure 2.10 PCI E Slots

AGP Slot (Accelerated Graphics Port) is a high-speed point-to-point channel for

attaching a video card to a computer's motherboard, primarily to assist in the acceleration
of 3D computer graphics. It is more a high performance point-to-point connection used
only by video cards. But now AGP Cards are connected in to PCIe Slots.

On the chart below we compared the transfer rates of the PCI, AGP and PCI Express
busses.

Bus Maximum Transfer Rate

PCI 133 MB/s
AGP 2x 533 MB/s
AGP 4x 1,066 MB/s
AGP 8x 2,133 MB/s
PCI Express x1 250 MB/s
PCI Express x2 500 MB/s
PCI Express x4 1,000 MB/s
PCI Express x16 4,000 MB/s
PCI Express x32 8,000 MB/s

The PCI Express bus is hot plug, i.e., it’s possible to install and remove PCI Express
boards even when the PC is on. PCI Express slot is connected to the motherboard chipset
using a dedicated lane, not sharing this lane (data path) with other PCI Express slots.

The PCI Express x16 slot was developed to be used by video cards. PCI Express has
replaced AGP as the default interface for graphics cards on new systems. With a few
exceptions, all graphics cards being released as of 2009 from ATI and NVIDIA use PCI
Express. NVIDIA uses the high bandwidth data transfer of PCIe for its Scalable Link
Interface (SLI) technology, which allows multiple graphics cards of the same chipset and
model number to be run in tandem, allowing increased performance.
Figure 2.11 cards for different slots.

AMR, CNR, ACR Slots: AMR (Audio Modem Riser), CNR (Communications and
Network Riser) and ACR (Advanced Communications Riser) are slots that you can find
on your motherboard that have the same goal: to install HSP (Host Signal Processing)
devices to your PC. These devices can be modems, sound cards and network cards.

Figure 2.12 AMR,CNR,ACR Slots.

Memory Slots: Memory slots like SIMM and DIMM will be discussed in memory
chapter.
Sockets: Sockets will be disused in detail in Processor chapter.
Power Connectors: Power Supply (SMPS) supplies power to mother board. Different
Form factors of power supply are available for desktop computers, such as ATX, BTX,
LPX, microATX , Flex ITX.
ATX (Advanced Technology Extension) is widely used. The ATX specification requires
the power supply to produce three main outputs, +3.3 V, +5 V and +12 V.
The power supply connectors
 4 Pin Molex Connector This is used to power various
components, including hard drives and CD/DVD drives.
available in: AT, ATX & ATX-2

20 Pin Molex ATX Power Connector This is used to power

the motherboard in ATX systems. available in: ATX( ATX-2
have four extra pins)
4 Pin Molex P4 12V Power Connector
Used specifically for Pentium 4 Processor Motherboards.

6 Pin AUX Connector Provides +5V DC, and two

connections of +3.3V. available in: ATX/ATX-2

15 pin SATA Connector

Provides + 3.3 DC available in ATX-2
Used for Hard disk and CD/DVD drive

Figure 2.13 Power Connectors.

Parallel ATA Connector (PATA): It is 40 Pin connector. A ribbon cable11 connects the
Hard disk drive and CD/DVD Drive to the interface, as shown in the figure below.

Figure 2.14 PATA Connectors.

Serial ATA (SATA): SATA is the High Speed Interface with seven conductors, SATA
ribbon cable can be of 1 meter, it enables Hot-plugging. Figure below show cable and
connector on motherboard.

Figure 2.15 SATA Connector

Back Panel Connectors

ATX boards have a unique double-high connector area for all the built-in connectors on
the motherboard. When the computer is mounted, those motherboard parts show up at the
computer case back panel. They are used to plug the mouse, keyboard, monitor, printer,
sound and any other peripherals you may have.

Safety
Use anti-static electric discharge pad or wear shoes before touching motherboard

Do not touch pins inside Processor Socket

Terminologies
10. Form-Factors
11. Tower ‫برج‬
12. Motherboard ‫اللوحات الرئيسية‬
13. Connected ‫متصل‬
14. Firmware ‫البرامج الثابتة‬
15. Layers ‫طبق ات‬
16. Volatile ‫متطاير‬
17. Directly ‫مباشره‬
18. Indirectly ‫على نحو غير مباشر‬
19. In-built ‫يحمل في ثناياه عوامل‬
20. Ribbon-Cable ‫الشريط الكابل‬
Experiment 3
Assemble and Disassemble the Desktop PC

Objectives
 Assemble and Disassemble the whole Desktop computer

 Identity and use tools

 Troubleshoot connection problems

The components used in building a typical PC are as follows:

 Case and power supply

 Motherboard
 Processor with heat-sink1 and fan2
  Memory
 Floppy drive (optional)
 Hard disk drive
 Optical drive(s) (CD and/or DVD)
 Keyboard and pointing device (mouse)
 Video card and display
 Sound card (optional) and speakers
 Modem (optional) or network interface card (optional)
 Cables
 Hardware (nuts, bolts, screws, and brackets)
 Operating system software

Tools used to Assemble and Disassemble

Phillips/square screw driver3, also known as the Quadrex screw

Frearson screw drive.

Figure 3.0 Quadrex bits Figure 3.1 Tweezers

Figure 3.2 Cable Cutter

Figure 3.3 Claw Tool

The following sections cover the assembly and disassembly procedure:

1. System Case and Power Supply

2. Motherboard, Processor, Heat sink, RAM.
3. Adapter cards
4. Disk Drives
5. External Devices
System Case and Power supply (SMPS)
System Case and Power Supply are available as single unit pre-attached, if not, assemble
the power supply as fallows.

Figure 3.3 SMPS Figure 3.4 System Case

Note: SMPS should be set to proper Input Voltage Level 220 or 110.

Motherboard
Motherboard should be prepared as follows
Processor: While inserting Processor, in to processor socket. One should follow the
marking on the processor and processor socket they should be on same side.

Figure 3.5 Processor and Processor Socket direction for assembling

Heat sink and Processor Fan: heat sink is the metal peace made of Aluminum Alloy
which acts as heat exchanger, it disperses the heat in to surrounding air, and heat-sink is
used to cool the high power semiconductor devices. On computer motherboard it used on
processor, memory control hub and Input Output Control hub. Before placing heating on
any chip heat sink compound is used it is a viscous fluid it is also known as thermal
grease4 it increases thermal conductivity.

Figure 3.6 Heat sink Figure3.7 Thermal grease

Heat sink Fan: a fan is attached on the top of processor heat sink and other heat sink is
left without fan or it is not required. This fan will exhort the hot air from heat sink.

Figure 3.8 Heat sink with fan

Insert RAM in to DIMM Slots

Figure 3.9 RAM Placement

Disk Drives: Disk drives (Hard Disk Drives, CD/DVD Drives) should be mounted in to
racks of the system case and alignment should be proper.
Figure 3.10 Disk Racks in system case
Motherboard should be placed in to the system case here two things should be taken in to
account.
1. Position of the screw holes and standoffs
2. Back panel alignment

After motherboard is placed in to system case and screws and standoffs are fixed
carefully next step is to connect all the cables.
Connect Power cable to motherboard
Hard Disk Drive CD/DVD power cable and Data cable (SATA/PATA)
Connect Front panel cables for Power Switch, Restart, USB, LEDs, and Audio Jacks.
Refer motherboard manual for connections or follow the labels of connectors and
motherboard or in few motherboards pin pattern act as guide.

Figure 3.11 Front Panel Connectors

Adapter cards: like Network interface cards, Display cards, Modem cards. Etc are
installed in to system on Slots like PCI AGP PCIe and others. To install a adapter card
first identify the card and slot required for it. If available place the card in to slot carefully
insert with little force and ensure complete connect.

Figure 3.12 Expansion Slots

External Devices: External Device like Monitor Keyboard, mouse, Speakers, Printers etc
are connected through back panel and USB devices and audio devices can be connected
through front panel5 also
Monitor requires power and data through separate connections. Power is given directly
or even through SMPS, Data cable is connected to the back –panel of the system
(motherboard). There are different types of connectors, but VGA is the standard
connector. Other than VGA there are HDMI and DVI as shown in the figure given

below.
Figure 3.13 Monitor Connectors
Keyboard and Mouse are connected to the system in two ways
1. PS/2 (green for Mouse, blue for keyboard)
2. USB

Figure 3.14 PS/2 and USB connector

Audio System and Head Phones are connected through Audio jack and USB also.

Figure 3.15 Audio Jack

Safety
Turn of power supply and disconnect power cable

Use anti-static electric discharge pads

Handle HDD very carefully

Remove the components and place them on safe area

Installed Processor with due care

Terminologies
21. Heat-sink ‫المعادن التبريد‬
22. Fan ‫مروحة‬
23. Screw driver ‫مفك‬
24. Thermal grease ‫الشحوم الحرارية‬
25. Front panel ‫اللوحة األمامية‬
Chapter 4
MicroProcessor

Objectives
 Understand Processor and its supporting components
 Understand bus Architecture
 Identify processor and its configuration
 Installation of Processor on Motherboard

Processor or Microprocessor
The brain or engine of the PC is the processor also called as microprocessor, or central
processing unit (CPU). The CPU performs the system's calculating and processing. The
processor is often the most expensive single component in the system.

Processors can be identified by three main parameters

 Speed of the Processor (Clock Speed) which is measured in MHz and GHz
  Speed of the Front Side Bus measured in MHz and GHz
 Internal Cache Memory measured in MBs

Intel introduced Dual core with Pentium D line of processor. The Pentium D is simply two late-
generation
Pentium 4s molded onto the same chip with each CPU using its own cache although they do
share the same front side bus. There are two codenames for Pentium D processors: the
―Smithfield‖ (model numbers 8xx), using a 90-nmprocess, and the ―Presler‖ (model numbers
9xx), using a 65-nm process. Pentium Ds use the LGA (Land Grid Array) 775 socket.

Figure 4.1 Core Processor design

Intel Core Processor Family Brand Names
Core solo
Core Duo
Core2 Solo
Core2 Duo
Core2 Quad
Core2 Extreme
Core i3, Core i5, Core i7,

Intel Core 2
In Year 2006 With the Core 2 line of processors, Intel released radically revised processor
architecture, called Core Architecture. Redesigned to maximize efficiency, and low power
consumption.
Some of the models of Core2 Processors are given below for complete list Refer to Intel
Processor List

Model Spec Frequency L2 Cache FSB Multiplier Socket Release

Number Number Date

Core 2 SL9TB (L2) 1800 MHz 2 MB 800 9× LGA January

Duo SLA99 (M0) MT/s 775 21,
E4300 2007

Core 2 SLA3F (L2) 2000 MHz 2 MB 800 10× LGA April

Duo SLA98 (M0) MT/s 775 22,
E4400 2007
Core 2 SLA95 (M0) 2200 MHz 2 MB 800 11× LGA July 22,
Duo MT/s 775 2007
E4500

Core2 Duo SL9SA(B2) 1867 MHz 2MB 1066 7x LGA July 27

E6300 MT/s 775 2006
SL9TA(L2)

Core 2 SLGTD 3067 MHz 3MB 1066 11.5x LGA May 31

Duo MT/s 775 2009
E7600

Core 2 SL9S5 (B2) 2933 MHz 4MB 1066 11x LGA July 27
Extreme MT/s 775 2006
X6800

Core i3 , i5 , i7 are the based on Intel Nehalem architecture, Nehalem Processor are more energy
efficient than other core processors and Hyper Threading is reintroduced here along with L3
cache.

Model Spec Frequency L2 Cache L3 Cores Socket Memory Release

Number Number Cache Date

Core i3 SLBLR (C2) 2933 MHz 2 *256 4 MB 2 LGA 2*DDR3 January 7,

530 KB 1156 1333 2010

Core i3 SLBQC (C2) 2133 MHz 2*256 KB 3 MB 2 BGA 2*DDR3 January 7

330E 1288 1066 2010

Core i5 SR0QH (D2) 3.4 GHz 4 × 256 6 MB 4 LGA 2 × January

2550 K KB 1155 DDR3- 2012
1333

Core i7- SR0PQ (E1 2.5 GHz 4 × 256 8 MB 4 LGA 4* DDR3- April 2012
3770T KB 1155 1600

Other Features of Core Processors

GPU: Graphics Processing Unit is a specialized processor that offloads 3D or 2D graphics
rendering from the microprocessor. In a personal computer, a GPU can be present on a video
card, or it can be on the motherboard, core processor of Intel has GPU inside the processor.
Example Core i7 3770T have GPU of 650 -1150 MHz
BGA: Ball Grid Array is the socket with contact balls on the socket.
Thermal design power (TDP), sometimes called thermal design point, refers to the maximum
amount of power the cooling system in a computer is required to dissipate. Example Core i7
3770T require 45 Watts.
Intel Turbo Boost is a technology implemented by Intel in certain models of Core i5 and Core
i7 that enables the processor to run above its base operating frequency via dynamic control of the
CPU's "clock rate". It is activated when the operating system requests the highest performance
state of the processor.
Advanced Encryption Standard (AES) Instruction Set is an extension to the x86 instruction
set architecture for microprocessors from Intel and AMD. The purpose of the instruction set is to
improve the speed of applications performing encryption and decryption using the Advanced
Encryption Standard (AES).
Intel virtualization (VT-x). is the Virtualization Technology from Intel.

How to identify the model and Specifications of the Processor

Information on the Chip
Intel Core2 Duo [Brand Name]
4300 SL9TB [Model]
MALAY [Country where Manufactured]
1.80 GHz/2M/800/06 [Speed=1.80, Cache=2MB, FSB=800
MHz, Year of manufacturing=2006]
Q641A179 [Part Number]

Figure 4.2 Intel Processor

Advanced Micro Devices (AMD) Processors

AMD is another manufacturer of micro processor which is having respectable share in the
market.
Model Clock rate Cache Memory Socket Release
2.2 GHz
Opteron June 23,
(4122), L3-Cache 6 DDR3
Quad-core Socket C32 2010
2.6 GHz MB 1333 MHz
Lisbon
(4130)

Opteron 8 core DDR3 March

2.4 GHz L3 8MB Socket AM3+
Zurich (3280) 1866 MHz 20, 2012
Athnol II
L2 512 kB DDR3
Propus 3.1 GHz Socket AM3 Sep 2009
per core 1333 MHz

Terminologies
26. Cycles ‫دورات‬
27. Virtualization ‫االفتراضية‬
28. Architecture ‫أسلوب بناء‬
Experiment 5
Boot Process Diagnosis and Options

Objectives
 Understand the Boot Process

 Perform Diagnosis, and explore other Boot options.

 Troubleshoot with Beep Codes.

Boot Process
Process which occurs in the time frame of Switch on Power button till you access the Desktop
Screen is known as boot process. Boot process has two stages as follows.
1. POST (Power on Self-Test)

2. Loading Operating System.

Power On Self-Test
 After you turn on the power it start the POST program in BIOS to make sure the necessary
parts of the computer are present and functioning properly. It's while the POST is being
administered that you may hear various churnings from your drives and see some LEDs
flash, but the screen, at first, remains black, POST checks all the components step by step.
Such as CPU, CMOS, RAM, Video Controller, HDD, FDD, CDD, Keyboard Mouse etc.

If POST is completed successfully system enters in to stage two of loading OS. if else it
encounters and error then it does as follows.

POST errors can be displayed in the following three ways:

■ Beep codes—Heard through the speaker attached to the motherboard. Note that some
recent systems do not include a speaker.

■ POST checkpoint codes—Hexadecimal checkpoint codes sent to an I/O port address. A

special card plugged into either an Industry Standard Architecture (ISA) or a Peripheral
Component Interconnect (PCI) card slot is required to view these codes.

■ Onscreen messages—Error messages displayed onscreen after the video adapter is

initialized. Systems that use UEFI firmware might use beep and checkpoint codes, but also
store error messages in event logs.

AMI POST Beep Codes

Beep Code Descriptions

1 short DRAM refresh failure

2 short Parity circuit failure

3 short Base 64K RAM failure

4 short System timer failure

5 short Process failure

6 short Keyboard controller Gate A20 error

7 short Virtual mode exception error

8 short Display memory Read/Write test failure

9 short ROM BIOS checksum failure

10 short CMOS shutdown Read/Write error

11 short Cache Memory error

1 long, 3 short Conventional/Extended memory failure

1 long, 8 short Display/Retrace test failed

Note: Further Beep codes can be found on online resources from BIOS manufacturer.

Boot Screen Options During POST.

1. Press Setup key as shown on first screen to enter BIOS/CMOS setup.

2. Press F8 or F12 to enter Boot Menu. Where user can select the Boot Device.
3. Boot from Network.

Loading Operating System

After POST is completed BIOS loads the Boot Loader program, it includes the instructions to
load the operating system from disk to primary memory of the system. Boot process starts with
loading a file on Disk called Master Boot Record. MBR will provide the information about
number of active partitions after that remaining load process and files to be loaded depends on
Operating System available.
The partition boot sector loads Ntldr (NT Loader). It then switches the processor to
protected
mode, starts the file system, and reads the contents of Boot.ini. The information in
Boot.ini determines the startup options and initial boot menu selections
Ntdetect.com gathers hardware configuration data and passes this information to
Ntldr. If more than one hardware profile exists, Windows uses the correct one for the
current configuration.
The kernel loads. Ntldr passes information collected by Ntdetect.com to Ntoskrnl.exe.
Ntoskrnl then loads the kernel, Hardware Abstraction Layer (Hal.dll), and Registry
information.
Drivers load and the user logs on. Networking-related components (for example,
TCP/IP) load simultaneously with other services and the Begin Logon prompt appears
onscreen. After a user logs on successfully, Windows updates the Last Known Good
Configuration information to reflect the current configuration state.

PnP detects and configures new devices. If new devices are detected, they are assigned
resources. Windows extracts the necessary driver files from Driver.cab. If the driver files
are not found, the user is prompted to provide them. Device detection occurs
imultaneously with the operating system logon process.

The following files are processed during startup:

■ Ntldr
■ Boot.ini
■ Bootsect.dos (multiple-boot systems only)
■ Ntbootdd.sys (loaded only for SCSI drives)
■ Ntdetect.com
■ Ntoskrnl.exe
■ Hal.dll
■ Files in systemroot\System32\Config (Registry)
■ Files in systemroot\System32\Drivers (drivers)
Windows Vista/7 use three different components to replace Ntldr:
■ bootmgr.exe—Windows Boot Manager
■ winload.exe—Windows operating system loader
■ winresume.exe—Windows resume loader
Experiment 6
BIOS/CMOS Setup

Objectives
 Access System Information from BIOS setup.

 Setup BOOT sequence, and Advance settings to trouble shoot and maintenance

 Implement Security at setup and system level.

 Test and Troubleshoot Disk Drives.

Enter BIOS Setup

To enter BIOS setup option varies from manufacture to manufacturer.
Acer - Aspire, Power, Veriton, Extensa, Del or F2
Ferrari, TravelMate, Altos

Compaq - Presario, Prolinea, Deskpro, F10

Systempro, Portable
Dell - XPS, Dimension, Inspiron, Latitude. F2
OptiPlex, Precision, Vostro
Fujitsu - LifeBook, Esprimo, Amilo, Tablet, F2
DeskPower
Hewlett-Packard (HP) - Pavilion, F10
TouchSmart, Vectra, OmniBook, Tablet
Lenovo (formerly IBM) - ThinkPad, IdeaPad, F1 or F2 or Fn+F1
3000 Series, ThinkCentre, ThinkStation
Sony - VAIO, PCG-Series, VGN-Series F1 or F2
Toshiba - Portégé, Satellite, Tecra, Equium F1 or Esc

Note: Function key for BIOS Setup will be displayed on first screen on top or bottom of the screen.

BIOS setup is a utility program store in CMOS memory, main purpose of this utility is to
give user access to hardware information, and ability to configure the hardware
components. Level of details, configuration and setting of hardware, various among
different computers. In general following things are available for the users:
1. System Information

2. Date and Time Configuration

3. Boot Sequence configuration

4. Advanced settings to enable or disable some of the features of components.

5. Security options

6. Safety and temperature information

7. Default Settings

8. Save and exit options.

Given below BIOS setup is Phoenix Award BIOS

 CMOS /BIOS Password Clean
There are two methods to clean the password in case of lost password.
1. Use Master Passcode from manufacturer to login in to CMOS.

2. Jumper Clean on Motherbaord.

CMOS clean with jumper settings on motherboard

This will clean the password as well bring the previous setting to default settings.
First locate the jumper on motherboard
a. Generally its located near CMOS battery

b. Labeled as clean

c. Read the motherboard manual

Method
There are two types of jumper 3 pin and 2 pin
For three pin switch the jumper form position 1-2 to 2-3 and return it back to 1-2
For two pin short circuit the two pins to clean bios.

3-pin Jumper 2-pin Jumper

Experiment 7
Hard Disk Drive Partition and Format with Disk
Manger Tool.

Objectives
 Understand the Structure of HDD.

 Understand Disk Partition and Format.

 Partition and Format using HDD maintenance Tools.

Requirements

1. Bootable CD with Disk manager Programs or Operating System Installation Disc.

2. Set First boot option in BIOS setup to CD/DVD or boot from CD using boot menu key.
3. Identify the HDD manufacturer.

Bootable CD

A CD/DVD with an operating System in it so that we can start our computer, here we
generally use MS-DOS operating system and Linux based also which occupies few MBs of
space. And in the same disc we have many tools and utility programs to perform various
operations on hard disk and motherboard, antivirus, backup and recovery etc, including
Disk Manager Program.

Example: Ultimate BootCD, Hirens BootCd. etc

Experiment 8
Understanding Specifications of RAM, Selection,
Assemble and Disassemble.

Objectives
 Understand Primary Memory
 Identify Different Memories and their Specifications
 Install and Upgrade Memories
 Troubleshoot Memories

Memory1 of computer is a storage area and there are many types of memories with different
purpose. Basically we can categorize memory in to Main memory and Secondary memory.
Main Memories2
 RAM
  ROM
 Cache
Secondary Memories3 (Secondary Storages)
 Hard disk
 CD/DVD disk
 Floppy
 USB Drive (pen drive, flash drive)
 Tape Drive

Main Memory: is the workspace for the computer's processor where the programs and data being
operated on by the processor must reside. Main memory can also be referred as Primary
Memory.
Secondary Memory: is the storage area, where we store the data for a long time.
Why we need different types of memories in our computer?
When processor wants to perform any job it needs program (instructions) and Data, programs
like windows operating system, Microsoft word etc. Data like files and folders. All of the
programs and Data reside in the permanent secondary storage device (Hard disk) transferring
data between hard disk and processor is logical because processor bus and hard disk data transfer
rates are quite different.
For example Pentium 4 processor with bus speed 800 MHz means transfers 6400 MBps and a
Hard disk 133 MBps .RAM and Cache are used to improve the performance. Speed of RAM is
nearly equal to processor bus speed and cache runs at the same speed of processor bus.
Figure given below illustrate you the concept of data path4.

Figure 6.1 Datapath

RAM means Random Access Memory it is also known as Primary memory or main memory all
the programs and data reside here in this memory while your computer is running.
RAM Technologies
Dynamic RAM (DRAM) is the type of memory chip used for most of the main memory in a
modern PC. The main advantages of DRAM are that it is very dense, meaning you can pack a lot
of bits into a very small chip, and it is inexpensive, which makes purchasing large amounts of
memory affordable.
The memory cells in a DRAM chip are tiny capacitors that retain a charge to indicate a bit. The
problem with DRAM is that it is dynamic. Also, because of the design, it must be constantly
refreshed; otherwise, the electrical charges in the individual memory capacitors will drain and
the data will be lost. Refresh time is 15ms (milliseconds).

Static RAM (SRAM) it is significantly faster than most types of DRAM. SRAM stands for static
RAM, which is so named because it does not need the periodic refresh rates like DRAM.
Because of how SRAMs are designed, not only are refresh rates unnecessary, but SRAM is much
faster than DRAM and much more capable of keeping pace with modern processors.
Fast Page Mode RAM (FPM RAM) it uses Paging which enables faster access to all the data
within a given row of memory by keeping the row address the same and changing only the
column. Memory that uses this technique is called Page Mode or Fast Page Mode memory.

Extended Data Out RAM a modified form of FPM memory,

SDRAM
SDRAM is short for synchronous DRAM, a type of DRAM that runs in synchronization with the
memory bus. SDRAM delivers information in very high-speed bursts using a high-speed,
clocked interface. SDRAM removes most of the latency involved in asynchronous DRAM
because the signals are already in synchronization with the motherboard clock.

DDR SDRAM
Double Data Rate (DDR) SDRAM memory is the upgrade of standard SDRAM in which data is
transferred twice as quickly. Instead of doubling the actual clock rate, DDR memory achieves the
doubling in performance by transferring twice per transfer cycle, Once at the leading (falling)
edge and once at the trailing (rising) edge of the cycle.

Figure 6.2 SDR DDR cycling

DDR SDRAM uses a DIMM (Dual inline Memory module) module design with 184 pins.

Types of standard DDR SDRAM modules

Module Chip Clock Cycles Bus Speed Bus Width Transfer

Standard Type Speed per Clock (MT/s) (Bytes) Rate (MBps)
(MHz)
PC1600 DDR200 100 2 200 8 1,600
PC2100 DDR266 133 2 266 8 2,133
PC2400 DDR300 150 2 300 8 2,400
PC2700 DDR333 166 2 333 8 2,667
PC3000 DDR366 183 2 366 8 2,933
PC3200 DDR400 200 2 400 8 3,200
PC3500 DDR433 216 2 433 8 3,466
PC3700 DDR466 233 2 466 8 3,733
PC4000 DDR500 250 2 500 8 4,000
PC4200 DDR533 266 2 533 8 4,266
MT/s = Megatransfers per second
MBps = Megabytes per second
DIMM = Dual inline memory module
DDR = Double data rate

DDR2 SDRAM

DDR2 SDRAM is simply a faster version of conventional DDR-SDRAM memory: It achieves

higher throughput by using differential pairs of signal wires to allow faster signaling without
noise and interference problems. DDR2 is still double data rate just as with DDR, but the
modified signaling method enables higher speeds to be achieved with more immunity to noise
and cross-talk between the signals. It uses lower voltage than conventional DDR.

DDR2 memory module designs incorporate 240 pins, significantly more than conventional DDR
or standard SDRAM DIMMs.

Module Chip Type Clock Cycles Bus Speed Bus Width Transfer Rate
Standard Speed per (MT/s) (Bytes) (MBps)
(MHz) Clock
PC2-3200 DDR2-400 200 2 400 8 3,200
PC2-4200 DDR2-533 266 2 533 8 4,266
PC2-5300 DDR2-667 333 2 667 8 5,333
PC2-6000 DDR2-750 375 2 750 8 6,000
PC2-6400 DDR2-800 400 2 800 8 6,400
PC2-7200 DDR2-900 450 2 900 8 7,200
PC2-8000 DDR2-1000 500 2 1000 8 8,000

DDR3 SDRAM is an improvement over its predecessor, DDR2 SDRAM, and the two are not
compatible. DDR3 memory provides a reduction in power consumption of 30% compared
to DDR2 modules. DDR3 DIMMS have 240 pins as DDR2 but with different key notch location.

Module Chip Type Clock Cycles Bus Speed Bus Width Transfer Rate
Standard Speed per (MT/s) (Bytes) (MBps)
(MHz) Clock
PC3-6400 DDR3-800 400 2 800 8 6400
PC3-8500 DDR3-1066 533 2 1066 8 8533
PC3-10600 DDR3-1333 667 2 1333 8 10667
PC3-12800 DDR3-1600 800 2 1600 8 12800
Typically DDR memory modules operate at different voltages, and have different number
of pins.
DDR 2.5 V Memory Module Number of Pins
DDR2 1.8 V DDR 184
DDR3 1.5 V DDR2 240
RDRAM 2.5 V DDR3 240
RDRAM 168
Figure 6.3 Key notch locations for DDR memories

The speed and performance issue with memory is confusing to some because memory speed is
usually expressed in ns (nanoseconds) and processor speed has always been expressed in MHz
(megahertz). Recently, however, some newer and faster types of memory have speeds expressed
in MHz, adding to the confusion. Fortunately, you can translate one to the other.

A nanosecond is defined as one billionth of a second.

Megahertz (MHz) which is millions of cycles per second, and gigahertz (GHz) which is billions
of cycles per second.
To convert access time in nanoseconds to MHz, use the following formula:
1 / nanoseconds x 1000 = MHz
Likewise, to convert from MHz to nanoseconds, use the following inverse formula:
1 / MHz x 1000 = nanoseconds

RDRAM

Rambus DRAM (RDRAM) on the other hand, are narrow-channel devices. They transfer data
only 16 bits (2 bytes) at a time (plus 2 optional parity bits), but at much faster speeds. This is a
shift away from a more parallel to a more serial design and is similar to what is happening with
other evolving buses in the PC.

RDRAM DIMMS have 168 pins, RDRAM runs on only 2.5 volts.
Figure 6.4 RDRAM key Notches

The design of many common Rambus memory controllers dictated that memory sticks be
installed in sets of two. Any remaining open memory slots must be filled with CRIMMs
(Continuity Rambus Inline Memory Module). These sticks provide no extra memory, and only
served to propagate the signal to termination resistors on the motherboard instead of providing a
dead end where signals would reflect.

Figure 6.5 Rambus DRAM

Module Chip Clock Cycles Bus Speed Bus Width Transfer

Standard Type Speed per Clock (MT/s) (Bytes) Rate (MBps)
(MHz)
RIMM1200 PC600 300 2 600 2 1,200
RIMM1400 PC700 350 2 700 2 1,400
RIMM1600 PC800 400 2 800 2 1,600
RIMM2100 PC1066 533 2 1,066 2 2,133
RIMM2400 PC1200 600 2 1,200 2 2,400
RIMM3200 PC800 400 2 800 4 3,200
RIMM4200 PC1066 533 2 1,066 4 4,266
RIMM4800 PC1200 600 2 1,200 4 4,800

CAS Latency (Column Address Strobe)

Latency is the time the memory controller must wait between requesting a data and the actual
delivery of them. It is also known as CAS (Column Address Strobe) Latency or simply CL. This
number is expressed in terms of clock cycles.
For example, a memory with CL3 means that the memory controller must wait three clock cycles
until data is delivered after a request is made. With a memory with CL5 the memory controller
will have to wait more: five clock cycles. So you always should look for the memory modules
with the lowest latency possible.

Technology Typical Latency Other Common Latencies Available

DDR 3 2, 2.5
 DDR2 5 3, 4
DDR3 7 6, 8, 9

Cache Memory
A CPU cache is a cache used by the central processing unit of a computer to reduce the average
time to access memory. The cache is a smaller, faster memory which stores copies of the data
from the most frequently used main memory locations. As long as most memory accesses are
cached memory locations, the average latency of memory accesses will be closer to the cache
latency than to the latency of main memory.

To minimize the processor being forced to read data from the slow main memory, two or three
stages of cache usually exist in a modern system, called Level 1 (L1), Level 2 (L2), and Level 3
(L3). The L1 cache is also called integral or internal cache because it has always been built
directly into the processor as part of the processor die (the raw chip). Because of this, L1 cache
always runs at the full speed of the processor core and is the fastest cache in any system. All 486
and higher processors incorporate integral L1 cache, making them significantly faster than their
predecessors. L2 cache was originally called external cache because it was external to the
processor chip when it first appeared. Originally, this meant it was installed on the motherboard,
as was the case with all 386, 486, and Pentium systems. In those systems, the L2 cache runs at
motherboard and CPU bus speed because it is installed on the motherboard and is connected to
the CPU bus. You typically find the L2 cache directly next to the processor socket in Pentium
and earlier systems.

L3 cache has been present in high-end workstation and server processors such as the Xeon and
Itanium families since 2001. The first desktop PC processor with L3 cache was the Pentium 4
Extreme Edition, a high-end chip introduced in late 2003 with 2MB of on-die L3 cache.

Read Only Memory (ROM)

Read-only memory, or ROM, is a type of memory that can permanently or semi permanently
store data. It is called read-only because it is either impossible or difficult to write to. ROM also
is often referred to as nonvolatile memory because any data stored in ROM remains there, even
if the power is turned off.

ROM chip contains the following programs

 BIOS
 POST Program
 BootStrap Loader

BIOS is a term that stands for basic input/output system, which consists of low-level software
that controls the system hardware and acts as an interface between the operating system and the
hardware. Most people know the term BIOS by another name device drivers, or just drivers. In
other words, the BIOS is drivers, meaning all of them. BIOS is essentially the link between
hardware and software in a system.

POST is a term that stands for Power On Self Test it checks out the system every time system
boots. If there is a problem in any of the components of the system POST Conveys information
about the problem in two ways one is Beep codes and Second through text messages. (beep
codes are available in beep code sheet)

BootStrap Loader program was designed to initiate the loading of an OS from the Hard disc or
CD/DVD disc or any other device.

ROM Chip Types

The four main types of ROM chips that have been used in PCs are as follows:

 ROM. Read-only memory

 PROM. Programmable ROM
 EPROM. Erasable PROM
 EEPROM. Electrically erasable PROM, also sometimes called a flash ROM

Figure 6.6 ROM

Upgrade5 BIOS
Update the BIOS to fix bugs, add compatibility with new devices, improve caching functions,
and make several other hardware tweaks that can speed up your boot time and fix annoying
issues. These updates are available at the motherboard manufacturer's site. But if you
make a mistake in the update process, your PC will be unbootable.
Step 1: identify the BIOS version in BIOS setting or type msinfo32 in windows Run window,
identify the motherboard model and BIOS model.
Step 2: Download Updated version of BIOS from manufacturer’s website. While
downloading, be sure about model and type of motherboard. It will be an .exe file
Step 3: close all of the applications
Step 4: Run the Installer .exe file.
Figure 6.7 msinfo32
Note: Follow the instructions by manufacturer during BIOS update.

Primary Memories for Laptop/Notebook Computer

Laptop memories are similar in capacity and other specifications as Desktop memory. difference
is in form-factor. It is 200 pin Small Outline DIMM.

Figure 6.8 SO-DIMM DDR2 Memory

Safety
Turn-off power supply

Install the memory such that memory module is completely inserted in to DIMM
slot.
 If more than one module of memory is their make sure both are of same speed.

Do not apply physical force while inserting memory module in to DIMM

Terminologies
1. Memory ‫ذاكرة‬
2. Main memory ‫الذاكرة الرئيسية‬
3. Secondary memory ‫الذاكرة الثانوية‬
4. Data path ‫مسار البيانات‬
5. Upgrade ‫ترقية‬
Experiment 9
Updating BIOS

Objectives
 Understand BIOS Firmware
 Identify Current BIOS Version
 Upgrade BIOS

BIOS
Basic Input Output System is the program permanently stored on motherboard Flash ROM
chip. it contains Services or Device Drivers which enable CPU to communicate with other
Devices like Keyboard, mouse, Video adapter, USB Controller, Network Controller. It cloud
be on single ROM or Multiple ROM chips.
ROM chip Contains other programs also. Most of the systems ROM chip contains the
following programs.
1. POST program
2. Boot Strap Loader
 3. BIOS
4. Setup

BIOS is specific to motherboard, means a motherboard with specific model and

version will have its own BIOS program. BIOS of one motherboard will not work
with other, if BIOS is corrupter your system will not boot.

BIOS program is written by three major Companies

1. American Megatrends, Inc.
2. Phoenix Technologies.
3. Award Software(now owned by Phoenix)

Why to Upgrade BIOS

Although most BIOS upgrades are done to fix bugs or problems, you must often upgrade the
BIOS to take advantage of some other upgrade. For example, a BIOS upgrade often adds
support for newer processors, larger internal hard drives, bootable optical and USB drives,
faster booting, and more.
BIOS can be downloaded from motherboard manufacturer’s website or other resources.

Before updating the BIOS we need to note the following information about BIOS.
1. Motherboard Model Number, Version
2. BIOS Model number
3. BIOS Current Version and its date
Methods to access this Information
1. CMOS/BIOS setup system information Page.

2. Use some Hardware Information Tool. (HWiNFO)

3. Run System Information Utility of windows (type msinfo32 in Run window)

4. Run DEBUG command on DOS terminal and type D FFFF:5 L 8 on Debug prompt.

Steps to Upgrade BIOS

1. Download Specific BIOS version
2. RUN the BIOS utility to upgrade
3. Restart the Computer.
Experiment 10
Operating System Setup and Installations.

Objectives
 Understand Bootable Media

 Setup and Install Single Operating System, Win XP, Win 7, Ubuntu

 Dual Operating Systems Setup and Installation.

 Device Derivers Installation and Configuration.

Windows XP Setup and Installation

Insert windows XP disc in to the Drive and set first boot device to CD/DVD.

Follow the given below steps.

Step 1 Click Enter to boot from CD

Step 2 wait until the Partition options are displayed.

Step 3 Press F8 (function Key) to continue.

Step 4 Hard drive partition information is now displayed. This varies with each systems
hardware configuration. Options here

a. If Partition are there use them by selecting one of them for installation.

b. If Partitions are there delete all of them or some of them as your requirement.

c. If partitions do not exist create new partition or partitions in un partitioned space.

d. If partitions are there with some un partitioned space use existing are create new from
empty space.

This example already has a partition defined. I will choose not to use this and create a new one
by pressing D I will delete this. At this point, the options include pressing ENTER to install
on the selected partition, D to Delete the selected partition, or F3 to Quit and reboot the system.
Step 5 Create new partitions from un-partitioned space by pressing key ―C‖

Step 6. Specify the partition size. It should be in MB or percentage.

Step 7 Format partitions
Experiment 11
Operating System Setup and Installations.

Objectives
 Understand Bootable Media

 Setup and Install Single Operating System, Win XP, Win 7, Ubuntu

 Dual Operating Systems Setup and Installation.

 Device Derivers Installation and Configuration.

Windows 7 Setup and Installation

Experiment 12
Operating System Setup and Installations.

Objectives
 Understand Bootable Media

 Setup and Install Single Operating System, Win XP, Win 7, Ubuntu

 Dual Operating Systems Setup and Installation.

 Device Derivers Installation and Configuration.

Setup and Installation Ubuntu 12.04

Experiment 13
Multiple Operating System Setup and Installations.

Objectives
 Setup and Install Multiple Operating Systems in the System

 Understand Compatibility issues among different platforms

Dual Boot Windows XP and Ubuntu.

Step 1. Install Windows XP or Windows 7 with one Empty Partition or un Partition Space more than or
equal to 5GB.
Step2. Boot from Ubuntu CD/DVD and follow the steps as above except the given below.
Step3. Select something else.
Step 4. Select the Empty partition or delete extra partition except NTFS and prepare partition.