Scribd
Upload
5K views497 pages

N.P. Mahalik - Mems (2013)

MEMS Book NP Malik

Uploaded by

Swarubini PJ
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF or read online on Scribd
5K views497 pages

N.P. Mahalik - Mems (2013)

MEMS Book NP Malik

Uploaded by

Swarubini PJ
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF or read online on Scribd
You are on page 1/ 497
About the Author Dr. Nitaigour Premchand Mahalik received his B.Sc. (Engg.) in Electronics and Telecommunication Engineering in the year 1989 and Master of Engineering in Electronic Systems and Communication in December 1993 from the University College of Engineering (UCE), Burla. He did his Ph.D. in Mechatronics in June 1998 from the De Montfort University (DMU), U.K. and Postdoctoral research in June 2002 from Gwangju Institute of Science and Technology (GIST), South Korea, He joined in UCE, Burla functioning under Biju Patnaik University of Technology (BPUT), Orissa, as a lecturer in the Department of Electronics and Telecommunication Engineering in December 1990, then got promoted to the post of Senior Lecturer in 1994 and is presently continuing as Assistant Professor in the same Institute. He also worked as Controller of Examination at UCE, Burla Dr. Mahalik has academic interests in interdisciplinary engineering. The studies, teaching and rescarches in different departments and arcas are the key to completing this interdisciplinary book. His teaching, research and development areas are mechatronics, robotics, automation, microinstru- mentation, DCS and SCADA, micromanufacturing, industrial control and communications, augmented reality and simulation, rapid control prototyping and standardization He is the recipient of the prestigious National Overseas Scholarship from the Government of India for Ph.D. study abroad in the field of Mechatronics at DMU and Brain Korea - 21 Fellowship from the Government of South Korea for Postdoctoral research in the field of “Real-time Intelligent Distributed Machine Control Systems” in the Department of Mechatronics at GIST. He was invited Visiting Professor to Moscow State Technological University, Russia, and GIST South Korea in the year 2001 and 2004. He has aso visited University of Westem Australia, Perth during 2003. Currently he is working as a Guest Professor in the department of Mechatronics, GIST, S. Korea. Dr. Mahalik has completed writing and editing two books, “Mechatronics: Principles, Concepts and Applications” through McGraw-Hill, India and “Fieldbus Technology” through Springer-Verlag, Germany. Recently, he has completed editing a book “Micromanufacturing and Nanotechnology” through the Springer-Verlag, Germany. He is the author of more than 70 academic research papers that have already been published at the National and International levels. He is a member and associated member of the various professional bodies such as ISTE (I), MMF (UK), AMIEE (UK), MMF (D, MISA (USA). He is the reviewer of the International Journal of American Society of Nuclear Energy, USA; Intemational Association for Science and Technology Development, Canada; International Journal of Thermal Sciences, Netherland; International Journal of Computational Intelligence, Turkey; International Journal of Computer Applications in technology, Germany; and IEEE journal of Evolutionary Computation, USA. Dr. Mahalik is the Editors-in-Chief of the International Joumal of Automation and Control (Inderscience), International Journal of Engineering Studies (RIP) ‘and Guest editor of International Journal of Computer Applications in Technology and Intemational Journal of Technology Management. Dr. Mahalik is also involved with the National Research Foundation, South Africa in their evaluation process. Nitaigour Premchand Mahalik Department of Industrial Technology California State University California, USA M ES) Tata McGraw-Hill Publis! NEW DELHI ig Company Limited McGraw-Hill Offices New Delhi New York St Louis San Francisco Auckland Bogoté Caracas Kuala Lumpur Lisbon London Madrid Mexico City Milan Montreal San Juan Santiago Singapore Sydney Tokyo Toronto ‘Tata McGraw-Hill Published by the Tata McGraw-Hill Publishing Company Limited, 17 West Patel Nagar, New Delhi 110 008, ‘Copyright © 2007, by Tata McGraw-Hill Publishing Company Limited. No part ofthis publication may be reproduced or ReMeMs >) Mio. (yan) QQ Nanotechnology | “simulation and Microfluidic Performance smultiseae MEMS: nign indices approach Fig.1.10 Scope of the book HB 12 summary ‘This chapter is the introduction to Microelectromechanical Systems (MEMS). MEMS is an advanced technology that integrates complex electromechanical components and signal processing circuitry on a single wafer substrate similar to IC (Integrated Circuit) technology. These systems include both electrical and mechanical components. The major difference between the IC technology and MEMS, technology is that, in the latter system the 3D mechanical components such as plate, beam, cantilever, diaphragm, gear, etc, as well as the electrical components such as inductors and capacitors, which were impossible to fabricate, are now fabricated by using dedicated design methods. MEMS is undoubtedly a class of sensor and actuator systems that are physically small, nominally in the order of micrometers. MEMS originally used modified IC fabrication techniques and materials to create these very small electromechanical components and devices. However, the advanced fabrication method significantly differs from the traditional modified technique and by virtue of that the new method had established itself as what is known as micromachining. Micromachining process makes stationary and/or moving 3D structures on a silicon wafer. Micromachining is categorized under two processes: Bulk micromachining and surface micromachining. The categorization is based on the way the 3D structures are created, i.e. whether from a bulk of material or from thin films. ‘The term micromachining has been derived from the conventional term machining which is defined as a process for the design of 3D structures and shapes for macro-level mechanical components and machine systems, such as crane, robots, engines, parts, and so on, Two important machining processes are micromilling and microdrilling. Since micromachining manufactures products whose dimension is in the order of micrometer it is justified to define the process as micromachining process. 30 Introduction to Microelectromechanical Systems (MEMS) At the beginning, the chapter reviews the scope of production engineering due to the reason that MEMS class of products are manufactured based on the concept of micromanufacturing. In fact, the ‘scope of production engincering broadly includes three main sub-domains: Precision engineering and ultra-precision engineering, Gi) Micromanufacturing, and ii) Nanotechnology. Micromanufacturing, a sister discipline of Manufacturing, accommodates two important design methods such as Microelectronics and MEMS. A brief description in this respect is presented in this chapter. MEMS classes of products are categorized as under: (@ Mechanical MEMS, (i) Thermal MEMS, (ii) Magnetic MEMS, (iv) MOEMS, (v) RF MEMS, (vi) Microffuidic systems, and (vii) BioMEMS, Under all these categories two important devices such as microsensor and microactuators are ‘common. This chapter briefly introduces the principle of operations of various types of sensors and actuators. Further, the chapter also highlights the application domains of each category. A road map 10 the following chapters is presented in the latter part of the chapter. Points to Remember + A technology that considers manufacturing of microscale, transducers, probes, capacitor, inductors, ‘actuators, valves, gears, pumps, gyroscope, mirrors, switches, and soon, similar to semiconductor chips are referred to as microelectromechanical systems (MEMS). ‘+ MEMS are highly complex, multiphysies and interinterdiseiplinary in nature entailing synergistic integration of many aspects of fundamental knowledge base, pursuance of unified understanding on related sub-domains is of paramount importance. + NEMS is viewed as an interdisciplinary domain accommodating several disciplines, including general Science! NEMS groups of products and systems fll under well-knowa technology called nanotechnology + Mechatronics is defined as the synergistic integration of mechanical engineering with electronics and intelligent contol algorithms inthe design and manufacture of products, ‘+ Manufacturing isthe basis of production engineering. + The precision engineering is dedicated tothe continual pursuit ofthe next decimal place. + Precision engineering includes design methodology, uncertainty analysis, calibration compensation, error ‘compensation and controls ‘+ Mieromiing and microdriling are the wo important processes, ‘+ Micromilling suggests two diferent approaches: cutting tol based approach and focused ion beam (FIB) based approach, ‘+ Microdrilling is characterized by drilling of ultrafine holes. + Passive Electronic Systems are signal-conditioning eiruits such as amplifier, ADC, filter, isolators, et and Passive Mechanical Systems (PMS) are gear, rank, bearing te + PES, the microelectronic integrated circuits, can be thought of as the nervous system with sensors and actuators as the eyes and arms, respectively. Introduction ‘The density of MEMS chip is measured in terms of number of components required to make up a particular device, Quite large numbers of sensors can be micromachined ina single platform as asensor fusion device (SFD) ‘The sensors are used for measuring physical parameters. The basic building block of a sensor is the transducer ‘The important transduction principles are thermoelectric, photoelectric, electromagnetic, magnetoelectric, thermoelastic, pyroelectric, and thermomagnetic. ‘One good way to 1ook ata sensor isto consider the important attributes such as stimulus, specifications, physical phenomena, conversion mechanism, material, response, ruggedness, sifness, range, ability measure physical parameters, and application field ‘An actuator is a control device that makes something move. The process of micromovement is called microactuation, Two ways of aetuations such as translational and rotational are possible ‘The basis of actuation isthe method of energy transduction, Principal energy transduction methods, called driving methods, are mechanical, thermal, electrical and magnetic method. ‘The method of micromanufacturing of microelectronic devices is called fabrication. Fabrication is a Sequential procedure. The important fabrication sequences are film growth, doping, lithography, etching, dicing and packaging ‘The term micromachining refers to the fabrication of 3D MEMS structures with the aid of advanced lithography followed by etching. Broadly, the micromachining falls into two categories such as Bulk micromachining and Surface micromachining. Mechanical MEMS mostly emphasizes on two classes of devices; mechanical structure based device and piezoelectric material based device. ‘Thermal MEMS work on thermal phenomena. Thermal phenomena are basically described in terms of thermoelectric effect, Peltier effect, thermoresistvity, pyroelectrcity and shape memory effect. Micro Opto Electromechsnical Systems is abbreviated as MOEMS. MOEMS are MEMS but they handle ‘optical signals ‘One very important combined process that s being used isthe LIGA process. LIGA is a German aeronym forlthography, electroplating, and molding. ‘A Spatial Light Modulator (SLM) isa device that modulates light according toa fixed spatial pixel patter. Soft ferromagnetic materials have Found the mos lity in microsensors, microactuators, and microsystems. ard magnetic materials have several applications inluding storage devices, Magnetoresistive (MR) materials are used for sensing applications. Permalloy has good soft magnetic properties, high permeability, high magnetoresistve effect, low ‘magnetostrction, stable high frequency operation, and excellent mechanical properties. RF-MEMS is an emerging technology that plays a major role in accelerating the current growth in wireless ‘communication, RF MEMS can be used for achieving (i) Transmission and reception, (i) VCO tuning, (ii) RF band select filters, (iv) Intermediate Frequency (IF) filtering, (v) Time delay for phased-arrays, (vi) Variable Delay Lines (VDL), and (vi) Reconfigurable antennas desig. ‘The study of transportation of fluids and their mixtures ata microscale level is known as microfluides.. Microdevices used for analysis and detection of biomedical and industrial reagents are called bio- and chemodevices. ‘The development of DNA sensors is considered as the most innovative molecular biology technology. The basic element ofthe DNA analysis system is the DNA probe(s). The process of DNA recognition is called hybridization ‘The hybridization can be achieved in many ways such as optical method, surface stress and electrical detection. "The nanoscale devices and equipments can give added benefits in terms of further miniaturization, efficiency and resource consciousness. ‘Carbon is suitable forthe nanotechnology-based products. 32 Introduction to Microelectromechanical Systems (MEMS) ‘A uel cell is an electrochemical system that generates electricity by converting chemical energy into ‘electical energy ‘+ MEMS devices are designed using micromachining technique. Prior to their desig, itis desirable to study the behavior of the systems, + The formulation of model equation is simply called modeling. By using lumped parameters the model can be represented pictorially + The method of calculation, observation, analysis, prediction and optimization using modeling formulae are known as simulation + Microinsteumentation equipment is essentially useful where higher sensitivity, resolution, selectivity, fidelity and repeatability are desired + Miniaturization improves portability and speed of operation, Exercises 1, Name the scientist who proposed the possibility of manufacturing the ultraminiaturize system. 2. Expand the abbreviations MEMS and NEMS and define them. 3. Discuss the scope of production engineering discipline. 4 5 Distinguish between the terms mechatronics, micromechatronics and microinstrumentation. Briefly outline the origin of precision engineering. Mention its application domains. What are the two important processes of precision engineering? With examples discuss the features and characteristics of micromilling and microdrilling process. Enlist some of the applications of microdrilling process that you know. 7. Why is the acceptance of Integrated Circuit (IC) platforms more than the discrete component based solution? Name some IC chips available in the technology marketplace. 8, With suitable diagram discuss the multi-engineering design scenario of MEMS devices. 9. What do you mean by System-in-a-Chip (SOC) technology? Is it applicable to IC-based system? ‘Suggest some examples, which could implement SOC concept. 10, What does the scale of integration mean? Draw the scale of integration plot of some of the important SOC devices. Plot the horizontal and vertical axes as the number of mechanical and electronic components, respectively. 11, What do you mean by next-generation MEMS? What additional features should a typical next generation MEMS have? 12, Briefly discuss the scope of MEMS discipline 13, Write short notes on the following. (a) Microsensors (>) Microactuators 14, What important process sequences are followed in fabricating microelectronic devices? 15. Prepare a table to show some of the major wet enchants and their features. 16, Define machining and micromachining processes. How do they differ from each other? Define bulk micromachining and surface micromachining. Which micromachining process is better and why? Introduction 33 17, 18, 19, 20. Write short notes on the following. (a) Mechanical MEMS (b) Thermal MEMS: (©) MOEMS (@) Spatial Light Modulator (e) Magnetic MEMS () RFMEMS (g) Microfluidie systems (hy BioMEMS (@ Chemo-deviees () Nanotechnology Why is the study of modeling and simulation important for system design, particularly for MEMS design? What are the specifications of requirement as far as modeling is concerned? Give an example of how a parallel plate actuator system can be modeled. Represent the above system in pictorial form and describe each element. ‘What design considerations are involved in the packaging of MEMS systems? ‘Summarize the scope of MEMS topical subjects in pictorial form. Chapter Micromachining Objectives ‘The obiectve of this chaoter isto stud the fllowina. + Machining and micromachinina oroceses + Litharaohy methods such as UV ohotoithosrachy, Xray ohotolithoaraohv, electron-beam \thoaraohv,soft-lithosrabhy and their comparisons + Various twoes of photoresist materials and their aliabilitv + Characteristics of thin film and devostion methods: LPCVD, PECVD. e-beam evaporation and soutterin ‘+ Role of doving and dovina methods (diffusion and ion-imolantation) Vrioustvoes of etchina orocess, Drv etchind and wet etchind methods with examolesofetchants and their comoarison Clarification on fotrovic and anisotroicetchina Surface micromachining Bulk versus surface micromachining Surface micromachinin orocess parameters Comparison, relative merits, and discussion on micromachining Wafer bondina method HB 21 yrropuction Machining is defined as the process of removing material from a work piece in the form of chips in order to obtain the exact shape and size of the work piece required. Machining is a well-defined process in ‘machine design and tooling’. It includes several processing methods, which are usually divided into three main classes such as cutting—generally involving single-point or multipoint cutting tools, each with a clearly defined geometry; abrasive processes—such as grinding; and NTM (nontraditional machining)—utilizing electrical, chemical, and optimal sources of energy. Machining process handles macro components and machine systems. Micromachining bears the similar definition but the process handles microsystems. Micromachining has become a new technology, as there has been significant ‘growth for the manufacture of components having dimensions less than 10 mm, upon which micro Micromachining 35, features in the range of 1-500 pm are built. In particular, micromachining deals with microelectronic, micromechanical, micro-opto-clectrical and micro-opto-mechanical systems. When these are collectively integrated in one platform then the system is known as MEMS systems. This chapter describes fundamental of the micromachining process. Micromachining is classified ‘under two different process technique such as bulk micromachining and surface micromachining. chapter deals with both the techniques. 2.1.1 Micromachining Micromachining is considered as a process as well as a technology that is utilized to structure wafer materials or thin films in order to fabricate miniature devices such as microsensors, microactuators and passive components (electronic amplifier, bridge circuits, post, gear, hinges, flexure, etc.) for microsystems functioning as electromechanical, optoelectronic and optomechanical systems. Micromachining process manufactures microdevices in terms of designing ot implementing the features in the bulk of materials such as silicon, quartz, SiC, GaAs, InP, Ge and glass. The features are implemented through several processes, which will be described in detail. However, it should be noted that one of the important sub-processes in the micromachining is etching. Etching is simply considered as removal of material. The etching is performed either on the substrate itself or on a preferred material layer deposited on the substrate, The very meaning of substrate is the material upon or within which a plant or animal lives or grows however; in the context of MEMS, instead of using the phrase ‘plant and animal’ we have to use ‘MEMS components (also sometimes called features) and circuitry". In essence, ‘a substrate (also called wafer) is a bulk of base material without any interconnection pattern, over oF within which discrete mechanical and electronic components and integrated circuits (IC) are built by micromachining process, which includes etching. Etching process is primarily used to remove a defined portion of the substrate in a particular manner so that the desirable shape can be obtained. Etching thus selectively removes material from the substrate. The specific material to be removed is determined by the etching solution, called etchant, Without loss of generality, Fig. 2.1 can provide an insight into the etching process. Some typical basic features (or structures) such as plates, steps, grooves, cantilever, diaphragm and post can be implemented through etching process. PivPlate Step Hole/groove LIL — ‘Tongue/cantilever Bridge/diaphragm Postiprobe Fig.2.1 Typical basic MEMS structures can be created by etching the substrate Manufacturing of microdevices is referred to as fabrication. We will also use the word ‘fabrication’ as the synonym to micromachining throughout the book, but the term fabrication is more frequently used for IC (integrated circuit) manufacturing. As MEMS design approach is very compatible to the IC design method, we prefer to use them interchangeably for the same meaning, If structuring is performed on wafer materials, the process is called bulk micromachining process and if itis performed on the thin film, the process is called surface micromachining process. There are considerable differences in the processing technologies of the two techniques mentioned above, leading 36 Introduction to Microelectromechanical Systems (MEMS) to differences in the fabricated structures. Comparison between the bulk and surface micro-manufac- turing process is presented at the latter part of the chapter. However, a brief comparison can be found in Table 2.1 Table21 Comparison between bulk and surface micromachining Property Bulk Surface Processing complexity 0 oF Lateral dimensions 3.5mm 100-S00um Vertical dimensions 100-500um 0.5-2um ‘Source: J. Micromechanics and Microengineering 8 (1998) Both technologies are widely used and are being developed further. In some applications the technologies are in direct competition, whereas one dominates its counterpart. But they have many ‘common approaches such as they heavily rely on the following methods, principles and processes. + Wafer cleaning and deposition + Photolithography and pattern transformation + Doping—diffusion and ion implantation * Etching + Metallization (with Al, Au, Ti, Pt, Cr and Ni * Packaging 1g sputtering, evaporation or electroplating) In the sequel the above methods, principles and processes are described in more details. BB 22 PHoTotiTHOGRAPHY Its already mentioned that the microcomponents/microfeatures are created either from the substrates or from the thin layer(s) of some specific material, say a silicon dioxide layer. Assume that we are interested in fabricating several simple microstructures such as steps, as shown in the Fig. 2.1. First, the oxide layer is deposited on the entire substrate. Note that the layer is not entirely used to create the desired components such as steps. This is due to the reason that a typical MEMS device might contain many components, which could be built from the same layer. Justifiably, several components are derived from the single layer(s). Therefore, the deposited layer has to be segmented and subsequently the selective portions be removed or etched away properly so that many desirable components (c.g. steps) can be created in respective segments. Depending on what type of components and what kind of MEMS structure is to be produced the layer at hand is segmented and subsequently etched. The entire process is usually achieved by a technique called photolithography. Photolithography is thus an essential as well as one of the starting sub-processes used to delineate the shape of MEMS structure in first place. Simply speaking, segmentation characterizes the removal of some portion from the layer, leaving the rest over the substrate, So the portions of the layer which need not be removed are to be protected by some means, and this is achieved by the use of a mask, which is prepared in advance, The foremost phase of the photolithography is therefore the preparation of a photomask. Once prepared, it is then transferred onto the layer. Lithography is a Latin word which means stone-writing. Stone-writing is a process of printing that utilizes flat inked surfaces to create the printed images. Although, the principle is not utilized here in the context of MEMS design but the very meaning is similar. Photolithography is the process of using light, Micromachining 37 to create a pattern, i.e. mask, and subsequently transfer it onto the substrate (wafer). Photolithography is an optical means of transferring patterns into the substrate. In the meanwhile, the substrate is chemically cleaned to remove particulate matter as well as any traces of organic, ionic, and metallic impurities on the surface. Sometimes it is necessary to pre-process the substrates by heating them in a chamber maintained at temperature ranging from 950-1100 °C (depending upon the material and applicability) in order to facilitate @ uniform etch rate. The wafer cleaning process and photomask preparation can go alongside. Figure 2.2(a) shows a thin film of some selective material (say, silicon dioxide; depending upon the design requirement, however, other materials such as metals, alloys, etc, can also be used) deposited on a substrate of some other material (say, silicon). Itis required that some of the silicon dioxide is to be selectively removed so that it only remains in particular areas on the substrate 87 roia om a SS EEE Gspitc | I Photoresist (PR) WT Suc Ss | WH, rete Cy » © @ WWI =—— —— 4 / Wddduilth Witt Wildl © © oe ee me Sid, dda oe HT. +=» WUT ® @ @ © Fig.22 Photolithography; (a) A substrate with SiO, layer, (b) Additional photoresist layer (c) The mask— ‘glass plate with chromium pattern, (d) The masks on the top ofthe photoresist-SiO,-coafer layers, (e) LUV light falling on the photoresist, (P After exposed to UV light (positive PR), (g) Third phase of photolithography in which the opening portion of the SiO layer is removed (positive PR case), (h) Final phase of photolithography in which the PR is removed (positive photoresist, (i) After exposed to UV light (negative PR), (j) Third phase of photolithography in which the opening portion of the SiO, layer is removed (negative PR case) (k) Final phase of photolithography in which the PR is removed (negatioe PR) For this we need to produce a mask in first place. As mentioned, the photomask used in the photolithographic phase is a key component in the process. The mask is typically a glass plate that is transparent to ultraviolet (UV) light. The patter of interest is generated on the glass by depositing avery thin layer of metal, usually chromium or gold. These masks are capable of producing very high quality images of micron and even sub-micron features (Fig. 2.2()). Typical width of the mask may vary from 3-50 jum. Photomasks are normally prepared by the help of computer-assisted software platform (Fig. 2.3), The next phase of the process is the coating ofa typical material on the wafer. The material should be sensitive to UV light, Usually organic polymers are chosen. This UV light sensitive polymer material is called photoresist. Once the photoresist coating is over, the photomask is placed over the coating as 38 Introduction to Microclectromechanical Systems (MEMS) shown in Fig. 2.2(d). Then the UV light is allowed to fall on the mask. When UV light falls on the photoresist (Fig. 2.2(e)) through the mask, a similar pattem is developed on the photoresist layer. This phenomenon is called mask transformation or patter transformation, as a similar mask or pattern is developed on the imagable photoresist layer. The transformation is achieved by the combined effect of UV light and the composition of the photoresist. Photoresist can be either soluble or insoluble after being exposed to UV light (Fig. 2.2 (f) & (i)). Accordingly, there exist two types of photoresist; positive and negative photoresist, respectively. The soluble photoresist becomes weaker when exposed to UV light, ‘on the other hand the opposite occurs to insoluble photoresist (negative type). In practice, the photore- sist is washed away in the portion where the light was struck; conversely, the negative photoresist is not. This assures that resist which was not exposed to UV light is washed away forming a negative image of the mask. The process of washing away the material is called etching (more details later). ‘The photoresist is coated on the surface of the SiO, layer (in this typical example) by a process called spin coating which is described in Section 2.5 In the third phase, the portion of the oxide layer that is now exposed through the openings of the photoresist is removed by some chemical processes (Fig. 2.2 (g) & (j)). Finally the photoresist is removed leaving the desired segmented oxide layer (Fig. 2.2 (h) & (k)). The result of Fig. 2.2 (f), (g) & (h) has undergone the process in which the positive photoresist is used and that of Fig. 2.2 (i), (j) & (K) undergone the process in which the negative photoresist is used. Figure 2.3 summarizes the photolithography process described above. Figure 2.2(h & k) shows steps, which are built using photolithography process. Constraints on Exposing Energy UV light is known as the exposing energy. The source for UV light is a mercury arc lamp, called radiator, which has an output with spectral energy peaks at particular wavelengths. Depending upon the feature complexity, the thickness and the property photoresist water : SCANNING 1777 BEARWNINGERPOSIRE” 7} i (uring mask ma 4 (pate treet oration ; j (ening a i Mercuy lam | ——— Electron gererator || rc la | i [e- 2 ; H i =) i i Pea | fs) i { cohware | a Focusing sem i catecingnts ? | TP dd | i > i Mak | _————— | vee oe x (hain PRevating Water Layer Photomask Washing LI (Sein costing) UV Tight || || etching clearing || deposition [| Ceesea oy |“) placement of PRlayer Fig.2.3 More details on photolithography Micromachining 39 ‘materials, the exposing may be performed once or several times; accordingly we have single-exposure fabrication and multi-exposure fabrication process. The feature size of the bottom of the structure ‘becomes smaller than that of its top after the development. This may cause the features to break near their bottom. Therefore, accurate dose of UV light is of paramount importance. Sometimes the additional exposure may cause large internal stress in the resist layer leading to a poor adhesion between the resist layer and the substrate. The internal stress may lift-off the structures from the substrate uring the subsequent processes. Therefore, a compromise is sought. Light may fall on the entire area Of the photoresist in one go or in sequence by employing scanning technique. Scanning is achieved by moving a small spot of light over the desired area of photoresist. H§§_23 STRUCTURAL AND SACRIFICIAL MATERIALS MEMS components and structures are manufactured through micromachining. The materials from which the microcomponents are built are called structural materials. The components and structures are micromachined in two ways; indirect and direct ways. When a microcomponent or structure is built from a previously micromachined micromold then the method is called indirect method (see soft lithography section). A mold is a 3D geometrical structure used for making its 3D image using other ‘molten material, The process of shaping the material using a mold is called molding. On the other hand, when the structures are created without using the molds, the micromachining process is called direct method. Whatever may be the ways, the structures are built from the selective ‘materials called structural material. There exist several types of structural materials. Depending upon the application, e.g. whether the MEMS structure is for RF (radio frequency) application, biomedical application, fluidic application and so on, the structural materials are chosen, Some structural materials are SiO;, SiN and Polysilicon, Sacrificial layer is a layer, which is deposited on a specific region and later on is removed so that microstructures or features can be created. In Fig. 2.4, SiN is used as the structural material for sin sin Sacrificial layer = IN ayer (structural material) ur sin Fig.24 A microstructure showing the role of structural material and sacrificial material) Before etching () After etching. 40 Introduction to Microelectromechanical Systems (MEMS) micromachining two bridge structures could be used as resonator in RF MEMS applications and Acrogel as the sacrificial Characteristic Value material, which is etched away at a latter yble 2.2 Physical properties of the SUL8 photoresist wd ne the f di Absorption coefficient 2-40 cm™ cau ana ego ve 111m materials SU-8 and Aerogel inherit good Coefficient of thermal expansion 20-50 ppmv"K physical, chemical and mechanical Degradation temperature =384.5°C properties for which they are very popular. Density 1.2g/em* ‘itovgh the primary appicaonsorSU.S Flim sess 15-16 Mea tod. Aetopel re oo a ecrilicil Glan tperne 3°C-250°C materia they canalso bewsedassuuctral Lone tanga voor matralfor micromolding aplicaons eee oe 2.3.1 SU-8 Max stress. 34 Mpa ‘SU-8 is an epoxy-resin negative photoresist points ot clasticdy 402-495 GPa widely used for fabricating MEMS struc- Poisson ratio 022 tues, Figue 25 shows combi and Refretiveindx 175.18 tearie stature developed bythe po- Relive dice constant 3.48 cess of photolithography, in which SU-8 is Shrinkage 15% used as structural material in Fig. 2.5(a) ‘Thermal conductivity 0.2 WimK and as the sacrificial material in Fig. 2.5(b), Viscosity 06-15 pas. respectively. The advantage of using SU-8 photoresist is that high aspect ratio of approximately 20:1 3D micro- structures can be built. Aspect ratio is a measure of geometry of 3D structure, quantified as a ratio of width to height. Inherited with excellent chemical and mechanical properties this polymerized resist has ‘opened up wide number of novel applications in the field of MEMS. Structures fabricated with SU-8 resist can normally have a thickness of several hundred micrometers. Recently the SU-8 2000 series, which ate formulated in eyclopentanone solvent have been introduced, These new series have improved coating and adhesion properties. In order to use SU-8 as the structural material it should be cured beforehand. Some important physical parameters of SU-8 photoresist is presented in Table 2.2. 2.3.2 Aerogel Acrogel, a new class of material, invented in the 1930s but recently refined by NASA, can be used for fabrication of thin films in MEMS applications. Aerogels are highly porous nanostructured materials typically prepared by sol-gel processing. They possess the following unique characteristics. + Lightweight + Low dielectric constant + High relative surface area + Low thermal conductivity Acrogel is virtually weightless solid measuring 0.00011 Ibs per cubic inch. Note that thin air weighs about 0.00004 Ibs per cubic inch. Chemically similar to glass, the mass of a micromirror can be reduced by 70-90%, increasing the resonant frequency and shock resistance, while preserving the optical surface area. Low density makes it useful asa lightweight structural material, and its super-high internal surface area makes it a super-insulating solid material. Further, aerogel has high etch selectivity for ‘which it requires small etch-time as compared to other non-porous materials. Because of this property

You might also like