AirPrime HL7518

Product Technical Specification

4115834
14.0
June 11, 2019
 Product Technical Specification

Important Notice
Due to the nature of wireless communications, transmission and reception of data can never be
guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant
delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used
in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used
in situations where failure to transmit or receive data could result in damage of any kind to the user or
any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless
accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or
received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or
receive such data.

Safety and Hazards

Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without
proper device certifications. These areas include environments where cellular radio can interfere such
as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to
any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere
with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is
on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When
operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard
systems.
Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door
is open. Sierra Wireless modems may be used at this time.

The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of
a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In
some states and provinces, operating such communications devices while in control of a vehicle is an
offence.

Limitations of Liability
This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or
implied, including any implied warranties of merchantability, fitness for a particular purpose, or
noninfringement. The recipient of the manual shall endorse all risks arising from its use.
The information in this manual is subject to change without notice and does not represent a
commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES
SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL,
GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING,
BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR
REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS
PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY
THIRD PARTY.
Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability
arising under or in connection with the Sierra Wireless product, regardless of the number of events,
occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the
Sierra Wireless product.

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 Product Technical Specification

Patents
This product may contain technology developed by or for Sierra Wireless Inc.
This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents
licensed from MMP Portfolio Licensing.

Copyright
© 2019 Sierra Wireless. All rights reserved.

Trademarks
Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and
Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries.
Watcher® is a registered trademark of NETGEAR, Inc., used under license.
Windows® and Windows Vista® are registered trademarks of Microsoft Corporation.
Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other
countries.
QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license.
Other trademarks are the property of their respective owners.

Contact Information
Sales information and technical support, including Web: sierrawireless.com/company/contact-us/
warranty and returns Global toll-free number: 1-877-687-7795
6:00 am to 5:00 pm PST

Corporate and product information Web: sierrawireless.com

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 Product Technical Specification

Document History
Version Date Updates

May 30, 2014 Creation

• Indicated that PCM pads are not available in Table 6 Pad
Definition
• Updated:
 Table 6 Pad Definition
 Figure 3 Pad Configuration
June 05, 2014  Table 20 Trace Debug Pad Description
 Section 5.8 ESD Guidelines for USB
Removed:
• ADC
• section 5.6 Antenna Integration with Detection Circuit (due to the
removal of ADC)
Updated:
• 1.8.2 Regulatory
1.0 • 3.10 POWER-ON Signal (PWR_ON_N)
June 16, 2014 • 5.1 Power-Up Sequence
• 5.2 Module Switch-Off
• 7 FCC Legal Information
Added 5.3 Emergency Power OFF
Updated:
• 3.10 POWER-ON Signal (PWR_ON_N)
September 16, 2014 • 3.11 Reset Signal (RESET_IN_N)
• 5.1 Power-Up Sequence
• 5.2 Module Switch-Off
Updated:
• 2 Pad Definition
September 26, 2014
• 3.5 SIM Interface
• 3.13.1 Trace Debug
Removed unsupported AT commands throughout the document.
1.1 October 06, 2014
Updated Table 8 Current Consumption
Updated:
November 10, 2014 • Table 2 General Features
• Table 8 Current Consumption
Updated:
1.2
• 2 Pad Definition
December 01, 2014 • Table 9 VGPIO Electrical Characteristics
• Figure 10 EMC and ESD Components Close to the SIM
Deleted section 6 X-Ray Exposure
1.3 December 05, 2014 Updated Figure 3 Pad Configuration
Updated:
1.4 January 08, 2015 • 1.7 ESD
• The note in section 3.2 Current Consumption

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 Product Technical Specification

Version Date Updates

Updated:
• Signal names from PWR_ON to PWR_ON_N, and RESET_IN to
RESET_IN_N
2.0 July 09, 2015
• Figure 2 Mechanical Overview
• Table 6 Pad Definition
• Figure 7 PWR_ON_N Sequence with VGPIO Information
Updated:
2.1 July 20, 2015 • Table 6 Pad Definition
• Signal name from MIPI2_TRACE_CLK to TRACE_CLK
Updated:
• Table 6 Pad Definition
2.2 August 06, 2015
• 3.2 Current Consumption
• Figure 7 PWR_ON_N Sequence with VGPIO Information
2.3 August 21, 2015 Updated AT command to use from +CPOF to +CPWROFF
Updated:
3.0 November 19, 2015 • Note in section 3 Detailed Interface Specifications
• Table 7 Power Supply
4.0 December 24, 2015 Added 6 Reliability Specification
Added:
• In-rush current in 5.1 Power-Up Sequence
• 5.5 Power Supply Design
5.0 July 25, 2016 Updated:
• Figure 2 Mechanical Overview
• 4 Mechanical Drawings
• Table 32 Ordering Information
Added a note after Table 16 UART1 Pad Description
6.0 October 03, 2016
Updated PWR_ON_N pull up resistor value from 47kΩ to 100kΩ
7.0 February 14, 2017 Updated Protocol Stack row in Table 2 General Features
Updated:
8.0 July 07, 2017 • Table 1 Supported Bands/Connectivity
• Table 14 Digital I/O Electrical Characteristics
Updated note below Table 13 USB Pad Description
9.0 August 28, 2017
Deleted HSIC
10.0 November 14, 2017 Added 5.4 Sleep Mode Management
11.0 February 09, 2018 Added 5.6 Power Cycle
Added 3.13.3 USB
Updated:
12.0 July 03, 2018 • 1.8.3 RoHS Directive Compliance
• Table 6 Pad Definition
• 3.14 RF Interface
12.1 July 19, 2018 Removed unavailable UIM2 pins.
Updated:
13.0 January 02, 2019 • Table 2 General Features
• 3.13 Debug Interfaces
14.0 June 11, 2019 Updated 3.13.2 JTAG

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 Contents
1. INTRODUCTION ................................................................................................ 10
1.1. Common Flexible Form Factor (CF3) ................................................................................ 10
1.2. Physical Dimensions ......................................................................................................... 10
1.3. General Features ............................................................................................................... 11
1.4. Architecture........................................................................................................................ 12
1.5. Interfaces ........................................................................................................................... 13
1.6. Connection Interface ......................................................................................................... 13
1.7. ESD ................................................................................................................................... 14
1.8. Environmental and Certifications ....................................................................................... 14
1.8.1. Environmental Specifications................................................................................... 14
1.8.2. Regulatory................................................................................................................ 15
1.8.3. RoHS Directive Compliance .................................................................................... 15
1.8.4. Disposing of the Product .......................................................................................... 15
1.9. References ........................................................................................................................ 15

2. PAD DEFINITION ............................................................................................... 16

2.1. Pad Configuration (Top View, Through Module) ............................................................... 21

3. DETAILED INTERFACE SPECIFICATIONS ..................................................... 22

3.1. Power Supply..................................................................................................................... 22
3.2. Current Consumption ........................................................................................................ 22
3.3. VGPIO ............................................................................................................................... 23
3.4. BAT_RTC .......................................................................................................................... 23
3.5. SIM Interface ..................................................................................................................... 24
3.5.1. UIM1_DET ............................................................................................................... 24
3.6. USB ................................................................................................................................... 25
3.7. Electrical Information for Digital I/O ................................................................................... 25
3.8. General Purpose Input/Output (GPIO) .............................................................................. 26
3.9. Main Serial Link (UART1) .................................................................................................. 26
3.10. POWER-ON Signal (PWR_ON_N).................................................................................... 27
3.11. Reset Signal (RESET_IN_N)............................................................................................. 28
3.12. Clock Interface ................................................................................................................... 28
3.13. Debug Interfaces ............................................................................................................... 29
3.13.1. USB .......................................................................................................................... 29
3.13.2. JTAG ........................................................................................................................ 29
3.13.3. Trace Debug ............................................................................................................ 30
3.14. RF Interface ....................................................................................................................... 30
3.14.1. RF Connection ......................................................................................................... 30
3.14.2. RF Performances ..................................................................................................... 31

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4. MECHANICAL DRAWINGS ............................................................................... 32

5. DESIGN GUIDELINES ....................................................................................... 35
5.1. Power-Up Sequence ......................................................................................................... 35
5.2. Module Switch-Off ............................................................................................................. 36
5.3. Emergency Power OFF ..................................................................................................... 36
5.4. Sleep Mode Management ................................................................................................. 36
5.4.1. Using UART1 ........................................................................................................... 36
5.4.2. Using USB ............................................................................................................... 37
5.5. Power Supply Design ........................................................................................................ 37
5.6. Power Cycle....................................................................................................................... 37
5.7. ESD Guidelines for SIM Card ............................................................................................ 37
5.8. ESD Guidelines for USB .................................................................................................... 38

6. RELIABILITY SPECIFICATION ......................................................................... 39

6.1. Reliability Compliance ....................................................................................................... 39
6.2. Reliability Prediction Model ............................................................................................... 39
6.2.1. Life Stress Test ........................................................................................................ 39
6.2.2. Environmental Resistance Stress Tests .................................................................. 40
6.2.3. Corrosive Resistance Stress Tests ......................................................................... 40
6.2.4. Thermal Resistance Cycle Stress Tests .................................................................. 41
6.2.5. Mechanical Resistance Stress Tests ....................................................................... 42
6.2.6. Handling Resistance Stress Tests ........................................................................... 43

7. FCC LEGAL INFORMATION ............................................................................. 44

8. ORDERING INFORMATION .............................................................................. 46
9. TERMS AND ABBREVIATIONS ........................................................................ 47

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 List of Figures
Figure 1. Architecture Overview ..................................................................................................... 12
Figure 2. Mechanical Overview ...................................................................................................... 13
Figure 3. Pad Configuration ............................................................................................................ 21
Figure 4. Mechanical Drawing ........................................................................................................ 32
Figure 5. Dimensions Drawing ....................................................................................................... 33
Figure 6. Footprint .......................................................................................................................... 34
Figure 7. PWR_ON_N Sequence with VGPIO Information ............................................................ 35
Figure 8. Power OFF Sequence for PWR_ON_N, VGPIO ............................................................. 36
Figure 9. Voltage Limiter Example ................................................................................................. 37
Figure 10. EMC and ESD Components Close to the SIM ................................................................ 38
Figure 11. ESD Protection for USB .................................................................................................. 38

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 List of Tables
Table 1. Supported Bands/Connectivity ........................................................................................ 10
Table 2. General Features ............................................................................................................ 11
Table 3. ESD Specifications .......................................................................................................... 14
Table 4. Environmental Specifications .......................................................................................... 14
Table 5. Regulation Compliance ................................................................................................... 15
Table 6. Pad Definition .................................................................................................................. 16
Table 7. Power Supply .................................................................................................................. 22
Table 8. Current Consumption ...................................................................................................... 22
Table 9. VGPIO Electrical Characteristics..................................................................................... 23
Table 10. BAT_RTC Electrical Characteristics................................................................................ 23
Table 11. UIM1 Pad Description ..................................................................................................... 24
Table 12. Electrical Characteristics of UIM1 ................................................................................... 24
Table 13. USB Pad Description ....................................................................................................... 25
Table 14. Digital I/O Electrical Characteristics ................................................................................ 25
Table 15. GPIO Pad Description ..................................................................................................... 26
Table 16. UART1 Pad Description .................................................................................................. 27
Table 17. PWR_ON_N Electrical Characteristics ........................................................................... 27
Table 18. RESET_IN_N Electrical Characteristics .......................................................................... 28
Table 19. Clock Interface Pad Description ...................................................................................... 28
Table 20. USB Pad Description ....................................................................................................... 29
Table 21. JTAG Pad Description ..................................................................................................... 29
Table 22. Trace Debug Pad Description ......................................................................................... 30
Table 23. RF Main Connection ........................................................................................................ 30
Table 24. RF Diversity Connection .................................................................................................. 30
Table 25. Conducted RX Sensitivity (dBm) ..................................................................................... 31
Table 26. Standards Conformity...................................................................................................... 39
Table 27. Life Stress Test................................................................................................................ 39
Table 28. Environmental Resistance Stress Tests ......................................................................... 40
Table 29. Corrosive Resistance Stress Tests ................................................................................. 40
Table 30. Thermal Resistance Cycle Stress Tests ......................................................................... 41
Table 31. Mechanical Resistance Stress Tests .............................................................................. 42
Table 32. Handling Resistance Stress Tests .................................................................................. 43
Table 33. Ordering Information ....................................................................................................... 46

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 1. Introduction
This document is the Product Technical Specification for the AirPrime HL7518 Embedded Module. It
defines the high-level product features and illustrates the interfaces for these features. This document
is intended to cover the hardware aspects of the product, including electrical and mechanical.
The AirPrime HL7518 belongs to the AirPrime HL Series from Essential Connectivity Module family.
These are industrial grade Embedded Wireless Modules that provides data connectivity on LTE
networks (as listed in Table 1 Supported Bands/Connectivity).
The HL7518 supports a large variety of interfaces such as USB 2.0, UART and GPIOs to provide
customers with the highest level of flexibility in implementing high-end solutions.

Table 1. Supported Bands/Connectivity

RF Band Transmit Band (Tx) Receive Band (Rx) Maximum Output Power

LTE B4 1710 to 1755 MHz 2110 to 2155 MHz 23 dBm (± 2 dBm) Class 3bis
LTE B13 777 to 787 MHz 746 to 756 MHz 23 dBm (± 2 dBm) Class 3bis

1.1. Common Flexible Form Factor (CF3)

The AirPrime HL7518 belongs to the Common Flexible Form Factor (CF3) family of modules. This
family consists of a series of WWAN modules that share the same mechanical dimensions (same
width and length with varying thicknesses) and footprint. The CF3 form factor provides a unique
solution to a series of problems faced commonly in the WWAN module space as it:
• Accommodates multiple radio technologies (from 2G to LTE advanced) and band groupings
• Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions
• Offers electrical and functional compatibility
• Provides Direct Mount as well as Socketability depending on customer needs

1.2. Physical Dimensions

AirPrime HL7518 modules are compact, robust, fully shielded modules with the following dimensions:
• Length: 23 mm
• Width: 22 mm
• Thickness: 2.5 mm
• Weight: 3.5 g

Note: Dimensions specified above are typical values.

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 Product Technical Specification Introduction

1.3. General Features

The table below summarizes the AirPrime HL7518 features.

Table 2. General Features

Feature Description

• Small form factor (146-pad solderable LGA pad) – 23mm x 22mm x

2.5mm (nominal)
Physical • Complete body shielding
• RF connection pads (RF main interface)
• Baseband signals connection
Electrical Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V
RF Dual-band LTE (AWS (B4), 700 MHz (B13))
• Single SIM
• 1.8V/3V support
• SIM extraction / hot plug detection
SIM interface
• SIM/USIM support
• Conforms with ETSI UICC Specifications.
• Supports SIM application tool kit with proactive SIM commands
• NDIS NIC interface support (Windows XP, Windows 7, Windows 8,
Windows CE, Linux)
• Multiple non-multiplexed USB channel support
• Dial-up networking
Application interface
• USB selective suspend to maximize power savings
• CMUX multiplexing over UART
• AT command interface – 3GPP 27.007 standard, plus proprietary
extended AT commands
Single mode LTE operation:
• LTE FDD, bandwidth 1.4-20 MHz
• System Release: 3GPP Rel. 9
• Category 4 (up to 150 MBit/s in downlink, 50 MBit/s in uplink)
• MIMO DL 2x2
Protocol Stack
• Max modulation 64 QAM DL, 16 QAM UL
• Intra-frequency and inter-frequency mobility
• SMS over SGs
• SON ANR
• Public Warning System PWS
• SMS over SGs and IMS
• SMS MO and MT
• SMS saving to SIM card or ME storage
• SMS reading from SIM card or ME storage
SMS • SMS sorting
• SMS concatenation
• SMS Status Report
• SMS replacement support
• SMS storing rules (support of AT+CNMI, AT+CNMA)

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 Product Technical Specification Introduction

Feature Description

• Multiple (up to 20) cellular packet data profiles

• Sleep mode for minimum idle power draw
• Mobile-originated PDP context activation / deactivation
• Support QoS profile
 Release 97 – Precedence Class, Reliability Class, Delay Class, Peak
Throughput, Mean Throughput
Connectivity  Release 99 QoS negotiation – Background, Interactive, and
Streaming
• Static and Dynamic IP address. The network may assign a fixed IP
address or dynamically assign one using DHCP (Dynamic Host
Configuration Protocol).
• Supports PAP and CHAP authentication protocols
• PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context
• RFC1144 TCP/IP header compression
Operating temperature ranges (industrial grade):
Environmental • Class A: -30°C to +70°C
• Class B: -40°C to +85°C
RTC Real Time Clock (RTC) with calendar

1.4. Architecture
The figure below presents an overview of the AirPrime HL7518 internal architecture and external
interfaces.

Memory
(Flash + RAM) AirPrime HL7518

VBATT
GND
Baseband Dulpexer Antenna
VGPIO
Switch
BAT_RTC
GPIO x 14
UART1 (8 pins) MCU DSP
PA
LGA- Trace Debug (5 pins)
LGA-
146 JTAG
PMU RF
146
32K_CLKOUT
SIM1
Analog Baseband
RESET_IN
SAW Antenna
PWR_ON Peripherals Filters Switch
USB

26MHz 32.768KHz

Figure 1. Architecture Overview

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1.5. Interfaces
The AirPrime HL7518 module provides the following interfaces and peripheral connectivity:
• 1x - 8-wire UART
• 1x - Active Low RESET
• 1x - USB 2.0
• 1x - Backup Battery Interface
• 2x - System Clock Out
• 1x - Active Low POWER-ON
• 1x - 1.8V/3V SIM
• 1x - JTAG Interface
• 14x - GPIOs (2 of which have multiplexes)
• 1x - Main Antenna
• 1x - RX Diversity
• 1x - VGPIO

1.6. Connection Interface

The AirPrime HL7518 module is an LGA form factor device. All electrical and mechanical connections
are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB.

Figure 2. Mechanical Overview

The 146 pads have the following distribution:

• 66 inner signal pads, 1x0.5mm, pitch 0.8mm
• 1 reserved test point (do not connect), 1.0mm diameter
• 7 test point (JTAG), 0.8mm diameter, 1.20mm pitch
• 64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm
• 4 inner corner ground pads, 1x1mm
• 4 outer corner ground pads, 1x0.9mm

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 Product Technical Specification Introduction

1.7. ESD
Refer to the following table for ESD Specifications.

Table 3. ESD Specifications

Category Connection Specification

Operational RF ports IEC-61000-4-2 — Level (Electrostatic Discharge Immunity Test)

Unless otherwise specified:
Host connector • JESD22-A114 ± 2kV Human Body Model
Non-operational
interface • JESD22-A115 ± 200V Machine Model
• JESD22-C101C ± 250V Charged Device Model
SIM connector Adding ESD protection is highly recommended at the point where
Signals the USIM contacts are exposed, and for any other signals that
Other host signals would be subjected to ESD by the user.

1.8. Environmental and Certifications

1.8.1. Environmental Specifications

The environmental specification for both operating and storage conditions are defined in the table
below.

Table 4. Environmental Specifications

Conditions Range

Operating Class A -30°C to +70°C

Operating Class B -40°C to +85°C
Storage -40°C to +85°C

Class A is defined as the operating temperature ranges that the device:

• Shall exhibit normal function during and after environmental exposure.
• Shall meet the minimum requirements of 3GPP or appropriate wireless standards.

Class B is defined as the operating temperature ranges that the device:

• Shall remain fully functional during and after environmental exposure
• Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even
when one or more environmental constraint exceeds the specified tolerance.
• Unless otherwise stated, full performance should return to normal after the excessive
constraint(s) have been removed.

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 Product Technical Specification Introduction

1.8.2. Regulatory
The AirPrime HL7518 is compliant with FCC regulations.
FCC compliance is reflected on the AirPrime HL7518 label.

Table 5. Regulation Compliance

Document Version Title

GCF-CC v3.51.1 or later GCF Conformance Certification Criteria

FCC Part 27 NA Miscellaneous wireless communication services

1.8.3. RoHS Directive Compliance

AirPrime HL7518 modules are compliant with RoHS Directive 2011/65/EU, including directive
2015/863 amending annex II, which sets limits for the use of certain restricted hazardous substances.
This directive states that electrical and electronic equipment put on the market does not contain lead,
mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB), polybrominated diphenyl
ethers (PBDE), Bis (2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate
(DBP) or Diisobutyl phthalate (DIBP) above threshold limits.

1.8.4. Disposing of the Product

This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical
and Electronic Equipment (WEEE). As such, this product must not be disposed of at a
municipal waste collection point. Please refer to local regulations for directions on how
to dispose of this product in an environmental friendly manner.

1.9. References
[1] AirPrime HL Series Customer Process Guidelines
Reference Number: 4114330
[2] AirPrime HL7518 and HL7548 AT Commands Interface Guide
Reference Number: 4116303
[3] AirPrime HL Series Development Kit User Guide
Reference Number: 4114877

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 2. Pad Definition
AirPrime HL7518 pads are divided into 2 functional categories.
• Core functions and associated pads cover all the mandatory features for M2M connectivity and will be available by default across all CF3 family of
modules. These Core functions are always available and always at the same physical pad locations. A customer platform using only these functions
and associated pads is guaranteed to be forward and/or backward compatible with the next generation of CF3 modules.
• Extension functions and associated pads bring additional capabilities to the customer. Whenever an Extension function is available on a module, it
is always at the same pad location.

Other pads marked as “not connected” or “reserved” should not be used.

Table 6. Pad Definition

Active Power
Reset Recommendation
Pad # Signal Name Function I/O Low/ Supply Type
State* for Unused Pads
High Domain

1 GPIO1 General purpose input/output I/O T 1.8V Left Open Extension

UART1_RI /
2 UART1 Ring indicator / Trace data 3 O L 1.8V Connect to test point Core
TRACE_DATA3
3 UART1_RTS UART1 Request to send I L T/PU 1.8V Connect to test point Core
4 UART1_CTS UART1 Clear to send O L T/PU 1.8V Connect to test point Core
5 UART1_TX UART1 Transmit data I T/PD 1.8V Connect to test point Core
6 UART1_RX UART1 Receive data O T/PU 1.8V Connect to test point Core
7 UART1_DTR UART1 Data terminal ready I L T/PD 1.8V Connect to test point Core
UART1_DCD /
8 UART1 Data carrier detect / Trace data 1 O L L 1.8V Connect to test point Core
TRACE_DATA1
UART1_DSR /
9 UART1 Data set ready / Trace data 0 O L H 1.8V Connect to test point Core
TRACE_DATA0

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 Product Technical Specification Pad Definition

Active Power
Reset Recommendation
Pad # Signal Name Function I/O Low/ Supply Type
State* for Unused Pads
High Domain

GPIO2 /
10 General purpose input/output / Trace data 2 I/O L 1.8V Connect to test point Core
TRACE_DATA2
11 RESET_IN_N Input reset signal I L N/A 1.8V Left Open Core
USB Data Negative (Low / Full Speed) 3.3V
12 USB_D- I/O T Connect to test point Extension
USB Data Negative (High Speed) 0.38V
USB Data Positive (Low / Full Speed) 3.3V
13 USB_D+ I/O T Connect to test point Extension
USB Data Positive (High Speed) 0.38V
14 NC Not Connected N/A Not connected
15 NC Not Connected N/A Not connected
16 USB_VBUS USB VBUS I N/A 3.3V – 5.5V Connect to test point Extension
17 NC Not Connected (Reserved for future use) Left Open Not connected
18 NC Not Connected (Reserved for future use) Left Open Not connected
19 NC Not Connected (Reserved for future use) Left Open Not connected
20 NC Not Connected (Reserved for future use) Left Open Not connected
21 BAT_RTC Power supply for RTC backup I/O N/A 1.8V Left Open Extension
22 26M_CLKOUT 26MHz System Clock Output O T/PD 1.8V Left Open Extension
23 32K_CLKOUT 32.768kHz System Clock Output O T/PD 1.8V Left Open Extension
24 NC Not Connected (Reserved for future use) Left Open Not connected
25 NC Not Connected (Reserved for future use) Left Open Not connected
26 UIM1_VCC 1.8V/3V SIM1 Power supply O N/A 1.8V/3V Mandatory connection Core
27 UIM1_CLK 1.8V/3V SIM1 Clock O L 1.8V/3V Mandatory connection Core
28 UIM1_DATA 1.8V/3V SIM1 Data I/O L 1.8V/3V Mandatory connection Core
29 UIM1_RESET 1.8V/3V SIM1 Reset O L L 1.8V/3V Mandatory connection Core
30 GND Ground 0V N/A 0V Mandatory connection Extension
31 RF_DIV RF Input - Diversity N/A Mandatory connection Extension

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 Product Technical Specification Pad Definition

Active Power
Reset Recommendation
Pad # Signal Name Function I/O Low/ Supply Type
State* for Unused Pads
High Domain

32 GND Ground 0V N/A 0V Mandatory connection Extension

33 PCM_OUT* PCM data out O T/PD 1.8V Left Open Extension
34 PCM_IN* PCM data in I T/PD 1.8V Left Open Extension
35 PCM_SYNC* PCM sync out I/O T/PD 1.8V Left Open Extension
36 PCM_CLK* PCM clock I/O T/PD 1.8V Left Open Extension
37 GND Ground 0V N/A 0V Mandatory connection Core
38 NC Not Connected (Reserved for future use) Left Open Not connected
39 GND Ground 0V N/A 0V Mandatory connection Core
40 GPIO7 General purpose input/output I/O T/PD 1.8V Left Open Core
GPIO8 /
41 General purpose input/output / Trace clock I/O L 1.8V Connect to test point Core
TRACE_CLK
42 NC Not Connected (Reserved for future use) Left Open Not connected
43 NC Not Connected (Reserved for future use) Left Open Not connected
44 GPIO13 General purpose input/output O T/PU 1.8V Left Open Extension
45 VGPIO GPIO voltage output O N/A 1.8V Left Open Core
46 GPIO6 General purpose input/output I/O T/PD 1.8V Left Open Core
47 NC Not Connected (Reserved for future use) Left Open Not connected
48 GND Ground 0V N/A 0V Mandatory connection Core
49 RF_MAIN RF Input/output N/A Mandatory connection Core
50 GND Ground 0V N/A 0V Mandatory connection Core
51 GPIO14 General purpose input/output I T/PU 1.8V Left Open Extension
52 GPIO10 General purpose input/output I/O T/PD 1.8V Left Open Extension
53 GPIO11 General purpose input/output I/O T/PD 1.8V Left Open Extension
54 GPIO15 General purpose input/output I/O T/PU 1.8V Left Open Extension

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 Product Technical Specification Pad Definition

Active Power
Reset Recommendation
Pad # Signal Name Function I/O Low/ Supply Type
State* for Unused Pads
High Domain

55 NC Not Connected (Reserved for future use) Left Open Not connected
56 NC Not Connected (Reserved for future use) Left Open Not connected
57 NC Not Connected (Reserved for future use) Left Open Not connected
58 GPIO12 General purpose input/output I/O L 1.8V Left Open Extension
59 PWR_ON_N Active Low Power On control signal I L N/A 1.8V Mandatory connection Core
60 NC Not Connected (Reserved for future use) Left Open Not connected
3.2V (min)
Power supply (refer to section 3.1 Power
61 VBATT_PA I N/A 3.7V (typ) Mandatory connection Core
Supply for more information)
4.5V (max)
3.2V (min)
Power supply (refer to section 3.1 Power
62 VBATT_PA I N/A 3.7V (typ) Mandatory connection Core
Supply for more information)
4.5V (max)
3.2V (min)
63 VBATT Power supply I N/A 3.7V (typ) Mandatory connection Core
4.5V (max)
UIM1 Detection / General purpose
64 UIM1_DET / GPIO3 I/O H T/PD 1.8V Left Open Core
input/output
65 GPIO4 General purpose input/output I/O H T/PD 1.8V Left Open Extension
66 GPIO5 General purpose input/output I/O T 1.8V Left Open Extension
67-70 GND Ground GND N/A 0V Core

71 - 166 Note: These pads are not available on the AirPrime HL7518 module.

167 -
GND Ground GND N/A 0V Core
234
236 JTAG_RESET JTAG RESET I L N/A 1.8V Left Open Extension
237 JTAG_TCK JTAG Test Clock I PD 1.8V Left Open Extension
238 JTAG_TDO JTAG Test Data Output O T 1.8V Left Open Extension
239 JTAG_TMS JTAG Test Mode Select I PU 1.8V Left Open Extension

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 Product Technical Specification Pad Definition

Active Power
Reset Recommendation
Pad # Signal Name Function I/O Low/ Supply Type
State* for Unused Pads
High Domain

240 JTAG_TRST JTAG Test Reset I L PD 1.8V Left Open Extension

241 JTAG_TDI JTAG Test Data Input I PU 1.8V Left Open Extension
242 JTAG_RTCK JTAG Returned Test Clock O PD 1.8V Left Open Extension

* PU = Pull up, PD = Pull down, H = High, L = Low, T = High impedance, N/A = Not applicable.

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 Product Technical Specification Pad Definition

2.1. Pad Configuration (Top View, Through Module)

UART1_DCD / TRACE_DATA1
UART1_DSR / TRACE_DATA0

UART1_RI / TRACE_DATA3
GPIO2 / TRACE_DATA2

UART1_DTR

UART1_CTS
UART1_RTS
USB_VBUS

UART1_RX
UART1_TX
RESET_IN
USB_D+
USB_D-

GPIO1
NC
NC

NC
NC

JTAG_RESET
JTAG_TRST
JTAG_RTCK

JTAG_TMS

JTAG_TDO

JTAG_TCK
JTAG_TDI
168 167

242 241 240 239 238 237 236

242 241 240 239 238 237 236

GND 68 67 GND
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
NC 19 66 GPIO5
NC 20 192 193 194 195 196 197 198 171 65 GPIO4 Core pin
BAT_RTC 21 64 UIM1_DET / GPIO3 Extension pin
26M_CLKOUT 22 191 214 215 216 217 218 199 172 63 VBATT
32K_CLKOUT 23 62 VBATT_PA
190 213 228 229 230 219 200 173
NC 24 61 VBATT_PA
NC 25 189 212 227 234 231 220 201 174 60 NC
UIM1_VCC 26 59 PWR_ON
UIM1_CLK 27 188 211 226 233 232 221 202 175 58 GPIO12
UIM1_DATA 28 57 NC
UIM1_RESET 29 187 210 225 224 223 222 203 176 56 NC
GND 30 55 NC
186 209 208 207 206 205 204 177
RF_DIV 31 54 GPIO15
GND 32 53 GPIO11
185 184 183 182 181 180 179 178
PCM_OUT 33 52 GPIO10

GND 69 70 GND
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51

169 170
NC

GPIO8 / TRACE_CLK
NC
NC

NC

RF_MAIN
GPIO13
PCM_IN

VGPIO

GPIO14
PCM_CLK

GPIO7

GPIO6
GND

GND

GND
PCM_SYNC

GND

Figure 3. Pad Configuration

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 3. Detailed Interface Specifications
Note: If not specified, all electrical values are given for VBATT=3.7V and an operating temperature of
25°C.

VBATT and VBATT_PA must be tied externally to the same power supply.

3.1. Power Supply

The AirPrime HL7518 module is supplied through the VBATT signal with the following characteristics.

Table 7. Power Supply

Supply Minimum Typical Maximum

VBATT voltage (V) 3.2* 3.7 4.5

VBATT_PA voltage (V) Full Specification 3.2* 3.7 4.5

* This value must be guaranteed during the burst.

Note: Load capacitance for VBATT is around 32µF ± 20% embedded inside the module.
Load capacitance for VBATT_PA is around 10µF ± 20% embedded inside the module.

3.2. Current Consumption

The following table lists the current consumption of the AirPrime HL7518 at different conditions.

Note: Typical values are defined for VBATT/VBATT_PA at 3.7V and 25°C, for 50Ω impedance at all RF
ports. Maximum values are provided for VSWR 3:1 with worst conditions among supported ranges
of voltages and temperature.

Table 8. Current Consumption

Parameter Minimum Typical Maximum Unit

Off mode 95.0 110 202.0 µA

Sleep mode – LTE Band 4 1.2 1.4 6.2 mA
DRX = 1.28s
Band 13 1.2 1.4 6.2 mA
USB = suspended

LTE in communication Band 4 510.0 610.0 945.0 mA

mode (TX Max) Band 13 460.0 548.0 720.0 mA

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 Product Technical Specification Detailed Interface Specifications

3.3. VGPIO
The VGPIO output can be used to:
• Pull-up signals such as I/Os
• Supply the digital transistors driving LEDs

The VGPIO output is available when the AirPrime HL7518 module is switched ON.

Table 9. VGPIO Electrical Characteristics

Parameter Minimum Typical Maximum Remarks

Voltage level (V) 1.7 1.8 1.9 Both active mode and sleep mode
Current capability Power management support up to 50mA
- - 50
Active Mode (mA) output in Active mode
Current capability Power management support up to 3mA
- - 3
Sleep Mode (mA) output in Sleep mode
Rise Time (ms) - - 1.5 Start-Up time from 0V

3.4. BAT_RTC
The AirPrime HL7518 module provides an input/output to connect a Real Time Clock power supply.
This pad is used as a back-up power supply for the internal Real Time Clock. The RTC is supported
when VBATT is available but a back-up power supply is needed to save date and hour when VBATT
is switched off.
If VBATT is available, the back-up battery can be charged by the internal 1.8V power supply regulator.

Table 10. BAT_RTC Electrical Characteristics

Parameter Minimum Typical Maximum Unit

Input voltage - 1.8 - V

Input current consumption - 2.5 - µA
Output voltage -5% 1.8 +5% V
Max charging current (@VBATT=3.7V) - 25 - mA

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 Product Technical Specification Detailed Interface Specifications

3.5. SIM Interface

The AirPrime HL7518 has one physical SIM interface, UIM1.
It allows control of a 1.8V/3V SIM and is fully compliant with GSM 11.11 recommendations concerning
SIM functions.
The five signals used by UIM1 are as follows:
• UIM1_VCC: power supply
• UIM1_CLK: clock
• UIM1_DATA: I/O port
• UIM1_RESET: reset
• UIM1_DET: SIM detection

Table 11. UIM1 Pad Description

Pad # Signal Name Description Multiplex

26 UIM1_VCC 1.8V/3V SIM1 Power supply

27 UIM1_CLK 1.8V/3V SIM1 Clock
28 UIM1_DATA 1.8V/3V SIM1 Data
29 UIM1_RESET 1.8V/3V SIM1 Reset
64 UIM1_DET UIM1 Detection GPIO3

Table 12. Electrical Characteristics of UIM1

Parameter Minimum Typical Maximum Remarks

UIM1 Interface Voltage (V) - 2.9 - The appropriate output

voltage is auto detected and
(VCC, CLK, IO, RST) - 1.80 - selected by software.
UIM1 Detect - 1.80 - High active
Max output current in sleep
UIM1_VCC Current (mA) - - 10
mode = 3 mA
UIM1_VCC Line Regulation (mV/V) - - 50 At Iout_Max
UIM1_VCC Power-up Setting Time
- 10 -
(µs) from power down

3.5.1. UIM1_DET
UIM1_DET is used to detect and notify the application about the insertion and removal of a SIM
device in the SIM socket connected to the SIM interface. When a SIM is inserted, the state of
UIM1_DET transitions from logic 0 to logic 1. Inversely, when a SIM is removed, the state of
UIM1_DET transitions from logic 1 to logic 0.

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 Product Technical Specification Detailed Interface Specifications

3.6. USB
The AirPrime HL7518 has one USB interface.

Table 13. USB Pad Description

Pad Number Signal Name I/O Function

12 USB_D- I/O USB Data Negative

13 USB_D+ I/O USB Data Positive
16 USB_VBUS I USB VBUS

Note: When a USB supply is not available, connect USB_VBUS to VBATT to supply the USB interface.
USB_VBUS will have a voltage range of 3.3V to 4.5V when connected to VBATT.

3.7. Electrical Information for Digital I/O

The table below enumerates the electrical characteristics of the following digital interfaces:
• UART
• GPIOs
• JTAG
• RESET

Table 14. Digital I/O Electrical Characteristics

Parameter Symbol Minimum Maximum

Input Current-High (µA) IIH - -240

Input Current-Low (µA) IIL - 240
DC Output Current-High (mA) IOH - 6
DC Output Current-Low (mA) IOL -6 -
Input Voltage-High (V) VIH 1.33 1.90
Input Voltage-Low (V) VIL -0.20 0.34
Output Voltage-High (V) VOH 1.45 -
Output Voltage-Low (V) VOL - 0.35

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 Product Technical Specification Detailed Interface Specifications

3.8. General Purpose Input/Output (GPIO)

The AirPrime HL7518 modules provide 14 GPIOs, 2 of which have multiplexes.

Table 15. GPIO Pad Description

Pad # Signal Name Multiplex I/O Power Supply Domain

1 GPIO1 I/O 1.8V

10 GPIO2 TRACE_DATA2 I/O 1.8V
40 GPIO7 I/O 1.8V
41 GPIO8 TRACE_CLK I/O 1.8V
44 GPIO13 I/O 1.8V
46 GPIO6 I/O 1.8V
51 GPIO14 I/O 1.8V
52 GPIO10 I/O 1.8V
53 GPIO11 I/O 1.8V
54 GPIO15 I/O 1.8V
58 GPIO12 I/O 1.8V
64 GPIO3 I/O 1.8V
65 GPIO4 I/O 1.8V
66 GPIO5 I/O 1.8V

3.9. Main Serial Link (UART1)

The main serial link (UART1) is used for communication between the AirPrime HL7518 module and a
PC or host processor. It consists of a flexible 8-wire serial interface that complies with RS-232
interface.
The supported baud rates of the UART1 are 300, 1200, 2400, 4800, 9600, 19200, 38400, 57600,
115200, 230400, 460800, 500000, 750000, 921600, 1843200, 3000000 and 3250000 bit/s.
The signals used by UART1 are as follows:
• TX data (UART1_TX)
• RX data (UART1_RX)
• Request To Send (UART1_RTS)
• Clear To Send (UART1_CTS)
• Data Terminal Ready (UART1_DTR)
• Data Set Ready (UART1_DSR)
• Data Carrier Detect (UART1_DCD)
• Ring Indicator (UART1_RI)

Note: Signal names are according to PC view.

UART1 pad description is summarized in the table below.

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 Product Technical Specification Detailed Interface Specifications

Table 16. UART1 Pad Description

Pad # Signal Name* I/O* Description

2 UART1_RI O Signal incoming calls (data only), SMS, etc.

3 UART1_RTS I Wakes the module up
4 UART1_CTS O AirPrime HL7518 is ready to receive AT commands
5 UART1_TX I Transmit data
6 UART1_RX O Receive data
Prevents the AirPrime HL7518 from entering sleep mode,
7 UART1_DTR I (active low) switches between data mode and command mode, and
wakes the module up.
8 UART1_DCD O Signal data connection in progress
9 UART1_DSR O Signal UART interface is ON

* According to PC view.

Note: UART1 input signal pins (UART1_RTS, UART1_TX and UART1_DTR) are internally pulled up by
an 8kΩ resistor when the module is ON.

3.10. POWER-ON Signal (PWR_ON_N)

A low-level signal must be provided to switch the AirPrime HL7518 module ON.
It is internally connected to the permanent 1.8V supply regulator inside the HL7518 via a pull-up
resistor. Once VBAT is supplied to the HL7518 module, this 1.8V supply regulator will be enabled and
so the PWR_ON_N signal is by default at high level.
The PWR_ON_N signal’s characteristics are listed in the table below.

Table 17. PWR_ON_N Electrical Characteristics

Parameter Minimum Typical Maximum

Input Voltage-Low (V) - 0.51

Input Voltage-High (V) 1.33 - 2.2
Power-up period (ms) from PWR_ON_N falling edge 2000 - -
PWR_ON_N assertion time (ms) 25

Note: As PWR_ON_N is internally pulled up with 100kΩ, an open collector or open drain transistor must
be used for ignition.

VGPIO is an output from the module that can be used to check if the module is active.
• When VGPIO = 0V, the module is OFF
• When VGPIO = 1.8V, the module is ON (it can be in idle, communication or sleep mode)

Note: PWR_ON_N signal cannot be used to power the module off. To power the module off, use AT
command AT+CPWROFF.

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 Product Technical Specification Detailed Interface Specifications

3.11. Reset Signal (RESET_IN_N)

To reset the module, a low-level pulse must be sent on the RESET_IN_N pad for 20ms. This action
will immediately restart the AirPrime HL7518 module with the PWR_ON_N signal at low level. (If the
PWR_ON_N signal is at high level, the module will be powered off.) As RESET_IN_N is internally
pulled up, an open collector or open drain transistor should be used to control this signal.
The RESET_IN_N signal will reset the registers of the CPU and reset the RAM memory as well, for
the next power on.
Note: As RESET_IN_N is referenced to the VRTC (200kΩ pull-up resistor to VRTC 1.8V) an open
collector or open drain transistor has to be used to control this signal.

Table 18. RESET_IN_N Electrical Characteristics

Parameter Minimum Typical Maximum

Input Voltage-Low (V) - 0.51

Input Voltage-High (V) 1.33 - 2.2
Reset assertion time (ms) 20 - -
Power-up period (ms) from RESET_IN_N falling edge* 2000 - -

* With the PWR_ON_N Signal at low level

3.12. Clock Interface

The AirPrime HL7518 modules support two digital clock interfaces.
The following table describes the pad description of the clock out interfaces.

Table 19. Clock Interface Pad Description

Pad Number Signal Name I/O I/O Type Description

22 26M_CLKOUT O 1.8V 26MHz Digital Clock output

23 32K_CLKOUT O 1.8V 32.768kHz Digital Clock output

Enabling or disabling the clock out feature can be done using AT commands. For more information
about AT commands, refer to document [2] AirPrime HL7518 and HL7548 AT Commands Interface
Guide.

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 Product Technical Specification Detailed Interface Specifications

3.13. Debug Interfaces

The AirPrime HL7518 module provides 3 interfaces for a powerful debug system.

3.13.1. USB
The USB interface is the primary debug interface for customers to collect traces.

Table 20. USB Pad Description

Pad Number Signal Name I/O Function

12 USB_D- I/O USB Data Negative

13 USB_D+ I/O USB Data Positive
16 USB_VBUS I USB VBUS

Note: It is strongly recommended to reserve test points to collect traces in case USB is not used.

3.13.2. JTAG
Note: This interface is reserved for Sierra Wireless’ internal debug use (for customer support).

The JTAG interface provides debug access to the core of the HL7518. These JTAG signals are
accessible through solder-able test points.

Table 21. JTAG Pad Description

Pad Number Signal Name Function

236 JTAG_RESET JTAG RESET

237 JTAG_TCK JTAG Test Clock
238 JTAG_TDO JTAG Test Data Output
239 JTAG_TMS JTAG Test Mode Select
240 JTAG_TRST JTAG Test Reset
241 JTAG_TDI JTAG Test Data Input
242 JTAG_RTCK JTAG Returned Test Clock

Note: It is recommended to provide access through Test Points to this interface (for Failure Analysis
debugging). All signals listed in the table above should be outputs on the customer board to allow
JTAG debugging.

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 Product Technical Specification Detailed Interface Specifications

3.13.3. Trace Debug

In addition to the USB and JTAG interfaces, the AirPrime HL7518 module provides a Trace Debug
interface, providing real-time instruction and data trace of the modem core.

Table 22. Trace Debug Pad Description

Pad Number Signal Name Function

2 TRACE_DATA3 Trace data 3

8 TRACE_DATA1 Trace data 1
9 TRACE_DATA0 Trace data 0
10 TRACE_DATA2 Trace data 2
41 TRACE_CLK Trace clock

Note: It is strongly recommended to provide access to this interface through Test Points for Sierra
Wireless’ internal debug use (for customer support). Access to the USB debug interface described
in section 3.13.1 USB should also always be provided when using this interface.

3.14. RF Interface
The RF interface of the HL7518 module allows the transmission of RF signals. This interface has a
50Ω nominal impedance.
Contact Sierra Wireless technical support for assistance in integrating the AirPrime HL7518 on
applications with embedded antennas.

3.14.1. RF Connection
A 50Ω stripline can be used to connect to standard RF connectors such as SMA, UFL, etc. for
antenna connection.

Table 23. RF Main Connection

Pad Number RF Signal Impedance VSWR Rx (max) VSWR Tx (max)

49 RF_MAIN 50Ω 1.5:1 1.5:1

Table 24. RF Diversity Connection

Pad Number RF Signal Impedance VSWR Rx (max) VSWR Tx (max)

31 RF_DIV 50Ω 1.5:1 -

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 Product Technical Specification Detailed Interface Specifications

3.14.2. RF Performances
RF performances are compliant with 3GPP recommendation TS 36.101.

Table 25. Conducted RX Sensitivity (dBm)

Frequency Band Primary (Typical) Secondary (Typical) SIMO (Typical)

LTE B4 Full RB; BW: 20 MHz* -95 -95 -99

LTE B13 Full RB; BW: 10 MHz* -98 -99 -102

* Sensitivity values scale with bandwidth: x_MHz_Sensitivity = 10 MHz_Sensitivity – 10*log (10 MHz/x_MHz)

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 4. Mechanical Drawings

Figure 4. Mechanical Drawing

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 Product Technical Specification Mechanical Drawings

Figure 5. Dimensions Drawing

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 Product Technical Specification Mechanical Drawings

Figure 6. Footprint

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 5. Design Guidelines

5.1. Power-Up Sequence

Apply a low-level logic to the PWR_ON_N pad (pad 59); within approximately 25ms, VGPIO will
appear to be at 1.8V. Either UART1 or the USB interface could be used to send AT commands. The
AT command interface is available in about 7 seconds after PWR_ON_N for either UART or USB.
When using UART, the AT command interface is available after the transition of UART1_CTS from
high to low level.
When using a USB connection, the HL7518 will start communicating with the host after USB
enumeration. The time when AT commands can be sent will depend on the initialization time on the
USB host.
Module is OFF Module is ON

PWR_ON_N 2000 ms

< 25 ms
VGPIO

Module is ready to receive

AT commands via UART1

7 seconds Signal level depends on

UART1_CTS Hardware Flow Control settings

Figure 7. PWR_ON_N Sequence with VGPIO Information

Note: As PWR_ON_N is internally pulled up with 100kΩ, an open collector or open drain transistor must
be used for ignition.

The PWR_ON_N pad has the minimum assertion time requirement of 25ms, with LOW active. Once
the valid power on trigger is detected, the PWR_ON_N pad status can be left open.
The maximum inrush current is 1.3 A and lasts less than 1.5 ms.

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 Product Technical Specification Design Guidelines

5.2. Module Switch-Off

AT command AT+CPWROFF enables the user to properly switch the AirPrime HL7518 module off.

AT+CPWROFF PWR_ON_N
Internal pull-up to
Module is ON 1V8 Module is OFF

2 seconds

VGPIO

Figure 8. Power OFF Sequence for PWR_ON_N, VGPIO

Note: PWR_ON_N is internally pulled up by 100kΩ to 1.8V.

5.3. Emergency Power OFF

If required, the module can be switched off by controlling the RESET_IN_N pad (pad 11). This must
only be used in emergency situations if the system freezes (not responding to AT commands).
To perform an emergency power off, a low-level pulse must be sent on the RESET_IN_N pad for
20ms while the PWR_ON_N signal is inactive (high level). This action will immediately shut the
HL7518 module down and the registers of the CPU and RAM memory will be reset for the next power
on.

5.4. Sleep Mode Management

5.4.1. Using UART1

AT command AT+KSLEEP enables sleep mode configuration.
AT+KSLEEP=0:
• The module is active when DTR signal is active (low electrical level).
• When DTR is deactivated (high electrical level), module enters sleep mode after a while.
• On DTR activation (low electrical level), the module wakes up.

AT+KSLEEP=1:
• The module determines when it enters sleep mode (when no more tasks are running).
• “0x00” character on the serial link wakes the module up.

AT+KSLEEP=2: The module never enters sleep mode.

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 Product Technical Specification Design Guidelines

5.4.2. Using USB

Use AT+KSLEEP=1 to allows the module to automatically enter sleep mode while the USB interface is
in use.

5.5. Power Supply Design

The AirPrime HL7518 module should not be supplied with voltage over 4.5V even temporarily or
however briefly.
If the system’s main board power supply unit is unstable or if the system’s main board is supplied with
over 4.5V, even in the case of transient voltage presence on the circuit, the module’s power amplifier
may be severely damaged.
To avoid such issues, add a voltage limiter to the module’s power supply lines so that VBATT and
VBATT_PA signal pads will never receive a voltage surge over 4.5V. The voltage limiter can be as
simple as a Zener diode with decoupling capacitors as shown in the diagram below.

Power Supply VBATT/VBATT_PA

+

+
D405
0.5 pF

100 nF
D404

1.5 mF

150 µF

C407
C404

C405

Figure 9. Voltage Limiter Example

5.6. Power Cycle

In addition to Sierra Wireless’ reliable recovery mechanisms, it is highly recommended that the ability
for a power cycle to reboot the module be included in the design in case the module becomes blocked
and stops responding to reset commands.

5.7. ESD Guidelines for SIM Card

Decoupling capacitors must be added according to the drawings below as close as possible to the
SIM card connectors on UIM1_CLK, UIM1_RST, UIM1_VCC, UIM1_DATA and UIM1_DET signals to
avoid EMC issues and to comply with the requirements of ETSI and 3GPP standards covering the
SIM electrical interface.
A typical schematic including SIM detection is provided below.

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 Product Technical Specification Design Guidelines

Figure 10. EMC and ESD Components Close to the SIM

5.8. ESD Guidelines for USB

When the USB interface is externally accessible, it is required to have ESD protection on the
USB_VBUS, USB_D+ and USB_D- signals.

Figure 11. ESD Protection for USB

Note: It is not recommended to have an ESD diode with feedback path from USB_VBUS to either
USB_D+ or USB_D-.

Sierra Wireless recommends using a 90Ω DLP0NSN900HL2L EMC filter and an RCLAMP0503N or
ESD5V3U2U-03LRH ESD diode.

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 6. Reliability Specification
AirPrime HL7518 modules are tested against the Sierra Wireless Industrial Reliability Specification
defined below.

6.1. Reliability Compliance

The AirPrime HL7518 module connected on a development kit board application is compliant with the
following requirements.

Table 26. Standards Conformity

Abbreviation Definition

IEC International Electro technical Commission

ISO International Organization for Standardization

6.2. Reliability Prediction Model

6.2.1. Life Stress Test

The following tests the AirPrime HL7518 module’s product performance.

Table 27. Life Stress Test

Designation Condition

Performance Test Standard: N/A

PT3T & PTRT Special conditions:
• Temperature:
 Class A: -30°C to +70°C
 Class B: -40°C to +85°C
• Rate of temperature change: ± 3°C/min
• Recovery time: 3 hours
Operating conditions: Powered
Duration: 14 days

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 Product Technical Specification Reliability Specification

6.2.2. Environmental Resistance Stress Tests

The following tests the AirPrime HL7518 module’s resistance to extreme temperature.

Table 28. Environmental Resistance Stress Tests

Designation Condition

Cold Test Active Standard: IEC 680068-2-1, Test Ad

COTA Special conditions:
• Temperature: -40°C
• Temperature variation: 1°C/min
Operating conditions: Powered ON with a power cycle of 1 minute ON and
2 minutes OFF
Duration: 3 days
Resistance to Heat Test Standard: IEC 680068-2-2, Test Bb
RH Special conditions:
• Temperature: +85°C
• Temperature variation: 1°C/min
Operating conditions: Powered ON with a power cycle of 15 minutes ON
and 15 minutes OFF

Duration: 50 days

6.2.3. Corrosive Resistance Stress Tests

The following tests the AirPrime HL7518 module’s resistance to corrosive atmosphere.

Table 29. Corrosive Resistance Stress Tests

Designation Condition

Humidity Test Standard: IEC 60068-2-3, Test Ca

HUT Special conditions:
• Temperature: +65°C
• RH: 95%
• Temperature variation: 3 ± 0.6°C/min
Operating conditions: Powered on, DUT is powered up for 15 minutes and
OFF for 15 minutes

Duration: 10 days

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 Product Technical Specification Reliability Specification

Designation Condition

Component Solder Wettability Standard: JESD22 – B102, Method 1/Condition C, Solderability Test
CSW Method
Special conditions: Test method: Dip and Look Test with Steam
preconditioning 8 h ± 15min. dip for 5 +0/-0.5 seconds
Operating conditions: Un-powered

Duration: 1 day

Moist Heat Cyclic Test Standard: IEC 60068-2-30, Test Db

MHCT Special conditions:
• Upper temperature: +40 ± 2°C
• Lower temperature: +25 ± 5°C
• RH:
 Upper temperature: 93%
 Lower temperature: 95%
• Number of cycles: 21 (1 cycle/24 hours)
• Temperature Variation: 3 ± 0.6°C/min
Operating conditions: Powered ON for 15 minutes during each 3 hours
ramp up and 3 hours ramp down (in middle) for every cycle
Duration: 21 days

6.2.4. Thermal Resistance Cycle Stress Tests

The following tests the AirPrime HL7518 module’s resistance to extreme temperature cycling.

Table 30. Thermal Resistance Cycle Stress Tests

Designation Condition

Standard: IEC 60068-2-14, Test Na

Thermal Shock Test
TSKT Special conditions:
• Temperature: -30°C to +80°C
• Temperature Variation: less than 30s
• Number of cycles: 600
• Dwell Time: 10 minutes
Operating conditions: Un-powered
Duration: 9 days
Standard: IEC 60068-2-14, Test Nb
Temperature Change
TCH Special conditions:
• Temperature: -40°C to +90°C
• Temperature Variation: 3 ± 0.6°C/min
• Number of cycles: 400
• Dwell Time: 10 minutes
Operating conditions: Un-powered
Duration: 29 days

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 Product Technical Specification Reliability Specification

6.2.5. Mechanical Resistance Stress Tests

The following tests the AirPrime HL7518 module’s resistance to vibrations and mechanical shocks.

Table 31. Mechanical Resistance Stress Tests

Designation Condition

Standard: IEC 60068-2-6, Test Fc

Special conditions:
Sinusoidal Vibration Test • Frequency range: 16 Hz to 1000 Hz
SVT • Displacement: 0.35mm (peak-peak)
• Acceleration:
 5G from 16 to 62 Hz
 3G from 62 to 200 Hz
 1G from 200 to 1000 Hz
• Sweep rate: 1 octave / cycle
• Number of Sweep: 20 sweeps/axis
• Sweep direction: ±X, ±Y, ±Z
Operating conditions: Un-powered
Duration: 2 days
Standard: IEC 60068-2-64, Test Fh

Random Vibration Test Special conditions:

RVT • Frequency range: 10 Hz – 2000 Hz
• Power Spectral Density in [(m/s²)²/Hz]
 0.1 g2/Hz at 10Hz
 0.01 g2/Hz at 250Hz
 0.005 g2/Hz at 1000Hz
 0.005 g2/Hz at 2000Hz
• Peak factor: 3
• Duration per Axis: 1 hr / axis
Operating conditions: Un-powered
Duration: 1 day
Standard: IEC 60068-2-27, Test Ea
Special conditions:
• Shock Test 1:
Mechanical Shock Test
 Wave form: Half sine
MST
 Peak acceleration: 30g
 Duration: 11ms
 Number of shocks: 8
 Direction: ±X, ±Y, ±Z
• Shock Test 2:
 Wave form: Half sine
 Peak acceleration: 100g
 Duration: 6ms
 Number of shocks: 3
 Direction: ±X, ±Y, ±Z
Operating conditions: Un-powered
Duration: 72 hours

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 Product Technical Specification Reliability Specification

6.2.6. Handling Resistance Stress Tests

The following tests the AirPrime HL7518 module’s resistance to handling malfunctions and damage.

Table 32. Handling Resistance Stress Tests

Designation Condition

Standard: JESD22-A114, JESD22-A115, JESD22-C101

ESDC Test
Special conditions:
• HBM (Human Body Model): 1KV (Class 1C)
• MM (Machine Model): 200V
• CDM (Charged Device Model): 250V (Class II)
Operating conditions: Powered
Duration: 3 days
ESD Test Standard: IEC 61000-4-2
Special conditions:
• Contact Voltage: ±2kV, ±4kV, ±6kV
• Air Voltage: ±2kV, ±4kV, ±8kV
Operating conditions: Powered

Duration: 3 days

Free Fall Test Standard: IEC 60068-2-32, Test Ed

FFT 1 Special conditions:
• Number of drops: 2 drops per unit
• Height: 1m
Operating conditions: Un-powered

Duration: 6 hours

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 7. FCC Legal Information
The HL7518 module has been granted modular approval for mobile applications. Integrators may use
the HL7518 module in their final products without additional FCC certification if they meet the
following conditions. Otherwise, additional FCC approvals must be obtained.
1. At least 20 cm separation distance between the antenna and the user’s body must be
maintained at all times.
2. To comply with FCC regulations limiting both maximum RF output power and human
exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only
exposure condition must not exceed:
 6 dBi in LTE Band 4
 9 dBi in LTE Band 13
3. The HL7518 module must not transmit simultaneously with other collocated radio transmitters
within a host device.
4. The RF signal must be routed on the application board using tracks with a 50Ω characteristic
impedance. Basically, the characteristic impedance depends on the dielectric, the track width
and the ground plane spacing. In order to respect this constraint, Sierra Wireless
recommends using MicroStrip or StripLine structure and computing the Tracks width with a
simulation tool (like AppCad shown in the figure below and that is available free of charge at
http://www.agilent.com).

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 Product Technical Specification FCC Legal Information

If a multi-layered PCB is used, the RF path on the board must not cross any signal (digital,
analog or supply).
If necessary, use StripLine structure and route the digital line(s) "outside" the RF structure. An
example of proper routing is shown in the figure below.

Stripline and Coplanar design requires having a correct ground plane at both sides.
Consequently, it is necessary to add some vias along the RF path. It is recommended to use
Stripline design if the RF path is fairly long (more than 3cm), since MicroStrip design is not
shielded. Consequently, the RF signal (when transmitting) may interfere with neighbouring
electronics (AF amplifier, etc.). In the same way, the neighbouring electronics (micro-
controllers, etc.) may degrade the reception performances. The GSM/GPRS connector is
intended to be directly connected to a 50Ω antenna and no matching is needed.
5. A label must be affixed to the outside of the end product into which the HL7518 module is
incorporated, with a statement similar to the following:
This device contains FCC ID: N7NHL7518
6. A user manual with the end product must clearly indicate the operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure
guidelines.

The end product with an embedded HL7518 module may also need to pass the FCC Part 15
unintentional emission testing requirements and be properly authorized per FCC Part 15.
Note: If this module is intended for use in a portable device, you are responsible for separate approval to
satisfy the SAR requirements of FCC Part 2.1093.

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 8. Ordering Information
Table 33. Ordering Information

Model Name Description Part Number

HL7518 HL7518 embedded module Contact Sierra Wireless for the latest SKU
DEV-KIT HL Series Development Kit 6000620

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 9. Terms and Abbreviations
Abbreviation Definition

ADC Analog to Digital Converter

AGC Automatic Gain Control
AT Attention (prefix for modem commands)
CDMA Code Division Multiple Access
CF3 Common Flexible Form Factor
CLK Clock
CODEC Coder Decoder
CPU Central Processing Unit
DAC Digital to Analog Converter
DTR Data Terminal Ready
EGNOS European Geostationary Navigation Overlay Service
EMC Electromagnetic Compatibility
EMI Electromagnetic Interference
EN Enable
ESD Electrostatic Discharges
ETSI European Telecommunications Standards Institute
FDMA Frequency-division multiple access
GAGAN GPS aided geo augmented navigation
GLONASS Global Navigation Satellite System
GND Ground
GNSS Global Navigation Satellite System
GPIO General Purpose Input Output
GPRS General Packet Radio Service
GSM Global System for Mobile communications
Hi Z High impedance (Z)
IC Integrated Circuit
IMEI International Mobile Equipment Identification
I/O Input / Output
LED Light Emitting Diode
LNA Low Noise Amplifier
MAX Maximum
MIN Minimum
MSAS Multi-functional Satellite Augmentation System
N/A Not Applicable
PA Power Amplifier
PC Personal Computer
PCB Printed Circuit Board
PCL Power Control Level
PLL Phase Lock Loop
PWM Pulse Width Modulation
QZSS Quasi-Zenith Satellite System

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 Product Technical Specification Terms and Abbreviations

Abbreviation Definition

RF Radio Frequency
RFI Radio Frequency Interference
RMS Root Mean Square
RST Reset
RTC Real Time Clock
RX Receive
SCL Serial Clock
SDA Serial Data
SIM Subscriber Identification Module
SMD Surface Mounted Device/Design
SPI Serial Peripheral Interface
SW Software
PSRAM Pseudo Static RAM
TBC To Be Confirmed
TBD To Be Defined
TP Test Point
TX Transmit
TYP Typical
UART Universal Asynchronous Receiver-Transmitter
UICC Universal Integrated Circuit Card
USB Universal Serial Bus
UIM User Identity Module
VBATT Main Supply Voltage from Battery or DC adapter
VSWR Voltage Standing Wave Ratio
WAAS Wide Area Augmentation System

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