External Gate Resistor Design Guide For Gate Drivers: Mateo Begue, High Power Drivers
External Gate Resistor Design Guide For Gate Drivers: Mateo Begue, High Power Drivers
External gate drive resistors play a crucial part in These parasitics cause oscillations in the gate drive
limiting noise and ringing in the gate drive path. loop and are modeled by resonant circuits.
Parasitic inductances and capacitances, high dV/dt Fortunately, the otherwise very high Q resonance
and di/dt, and body-diode reverse recovery can cause between the input capacitance, CISS (CGD + CGS) and
unwanted behavior without an appropriately sized gate the source inductance, LS can be damped by the
resistor. series resistive components of the loop, RG
(RG = RHI or LO+RGATE+RG,I).
RG LS
VDRV CISS
SLLA385A – May 2018 – Revised March 2020 External Gate Resistor Design Guide for Gate Drivers Mateo Begue, High Power Drivers 1
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This TI TechNote uses two isolated single-channel Using 3.57MHz as the ring frequency and 9250-pF as
gate drivers in a half-bridge configuration to provide the input capacitance, a critically damped resistor
proof of concept. In the following figures, two value is determined using Equation 1 and Equation 2.
UCC5310MC driven from a 15-V supply are used to Don't forget to subtract the series resistive elements
drive two 100V MOSFETs CSD19536KCS with a RG,I and RHI or LO from this calculated value. Figure 5
typical internal gate resistance, RG,I of 1.4-Ω. demonstrates the effects of adding a 7-Ω resistor to
the gate drive path which makes the waveform
The CSD19536KCS MOSFET was selected due to its
critically damped.
relatively small internal gate resistance in order to
show the effects of adding external gate resistors. The selection of the external gate resistor will affect
External gate resistors may not be required if a three things: drive current, gate-driver power
MOSFET or IGBT's internal gate resistance is large dissipation, and rise and fall times. Figure 4 and
enough. Figure 5 show the gate resistor's dampening effect and
its effect on rise and fall times.
If the rise and fall times are too slow after adding an
optimized gate resistor, another option is to calculate
your gate resistor with a Q-factor set to 1. This will
promote an under damped solution and caution should
be used to prevent overshoot or undershoot. If this
doesn't work, look at the source and sink current of
your gate driver and find a device with greater peak
currents to replace it with. This will charge and
discharge your FET at a faster rate but will need a new
optimized gate resistor to prevent overshooting.
Generally, another way to decrease the ringing from
the series RLC circuit shown in Figure 3 is to minimize
loop inductance between the source of the high-side
Figure 4. External Gate Resistor RGATE = 0-Ω transistor to the source of the low-side transistor.
Confining the high peak currents that charge and
At 0-Ω, there is unwanted ringing on the gate-source discharge the transistor gates to a minimum physical
waveform. The internal gate resistance of the area is essential. The gate driver must be placed as
CSD19536KCS MOSFET is not enough to dampen close as possible to the transistors to reduce these
the oscillations found in Figure 4. parasitics.
The trade-off between fast rise and fall times vs
oscillations is why the external gate resistor element of
the gate-drive design is so valuable.
2 External Gate Resistor Design Guide for Gate Drivers Mateo Begue, High Power Drivers SLLA385A – May 2018 – Revised March 2020
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