Scribd
Upload
111 views

Assignment 9: WW WW

This document discusses quality control processes in semiconductor wafer fabrication. It presents several scenarios and asks questions about: 1) Estimating sources of variation from single wafer measurements or multiple locations per wafer 2) Using control charts to evaluate within-wafer, between-wafer, and lot-to-lot variability from test data on wafer dimensions 3) Analyzing process capability and control from sample data on critical dimensions

Uploaded by

正鵠
Copyright
© © All Rights Reserved
Available Formats
Download as PDF, TXT or read online on Scribd
111 views

Assignment 9: WW WW

This document discusses quality control processes in semiconductor wafer fabrication. It presents several scenarios and asks questions about: 1) Estimating sources of variation from single wafer measurements or multiple locations per wafer 2) Using control charts to evaluate within-wafer, between-wafer, and lot-to-lot variability from test data on wafer dimensions 3) Analyzing process capability and control from sample data on critical dimensions

Uploaded by

正鵠
Copyright
© © All Rights Reserved
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 2

Assignment 9

6.55 In the semiconductor industry, the production of microcircuits involves


many steps. The wafer fabrication process typically builds these micro-
circuits on silicon wafers, and there are many microcircuits per wafer.
Each production lot consists of between 16 and 48 wafers. Some pro-
cessing steps treat each wafer separately, so that the batch size for that
step is one wafer. It is usually necessary to estimate several compo-
nents of variation: within-wafer, between-wafer, between-lot, and the
total variation.

(a) Suppose that one wafer is randomly selected from each lot and
that a single measurement on a critical dimension of interest is
taken. Which components of variation could be estimated with
these data? What type of control charts would you recommend?
(b) Suppose that each wafer is tested at five fixed locations (say, the
center and four points at the circumference). The average and
range of these within-wafer measurements are x̄ww and Rww , re-
spectively. What components of variability are estimated using
control charts based on these data?
(c) Suppose that one measurement point on each wafer is selected
and that this measurement is recorded for five consecutive wafers.
The average and range of these between-wafer measurements are
x̄BW and RBW , respectively. What components of variability are
estimated using control charts based on these data? Would it be
necessary to run separate and R charts for all five locations on the
wafer?
(d) Consider the question in part (c). How would your answer change
if the test sites on each wafer were randomly selected and varied
from wafer to wafer?
(e) What type of control charts and rational subgroup scheme would
you recommend to control the batch-to-batch variability?

6.56 Consider the situation described in Exercise 6.55. A critical dimension


(measured in mm) is of interest to the process engineer. Suppose that
five fixed positions are used on each wafer (position 1 is the center)
and that two consecutive wafers are selected from each batch. The
data that result from several batches are shown in Table 6E.24.

(a) What can you say about overall process capability?

1
(b) Can you construct control charts that allow within-wafer variabil-
ity to be evaluated?
(c) What control charts would you establish to evaluate variability
between wafers? Set up these charts and use them to draw con-
clusions about the process.
(d) What control charts would you use to evaluate lot-to-lot variabil-
ity? Set up these charts and use them to draw conclusions about
lot-to-lot variability.

7.3 Table 7E.1 Contains data on examination of medical insurance claims.


Every day 50 claims were examined.

(a) Set up the fraction nonconforming control chart for this process.
Plot the preliminary data in Table 7E.1 on the chart. Is the pro-
cess in statistical control?
(b) Assume that assignable causes can be found for any out-of-control
points on this chart. What center line and control limits should
be used for process monitoring in the next period?

7.8 The number of nonconforming switches in samples of size 150 are shown
in Table 7E.4. Construct a fraction nonconforming control chart for
these data. Does the process appear to be in control? If not, assume
that assignable causes can be found for all points outside the control
limits and calculate the revised control limits.

7.15 A process is being monitored with a fraction nonconforming control


chart. The process average has been shown to be 0.07. Three-sigma
control limits are used, and the procedure calls for taking daily samples
of 400 items.

(a) Calculate the upper and lower control limits.


(b) If the process average should suddenly shift to 0.10, what is the
probability that the shift would be detected on the first subsequent
sample?
(c) What is the probability that the shift in part (b) would be detected
on the first or second sample taken after the shift?

You might also like